WO2020090605A1 - 平行度調整装置、ピックアップ装置、実装装置、平行度調整方法、ピックアップ方法、及び実装方法 - Google Patents

平行度調整装置、ピックアップ装置、実装装置、平行度調整方法、ピックアップ方法、及び実装方法 Download PDF

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Publication number
WO2020090605A1
WO2020090605A1 PCT/JP2019/041642 JP2019041642W WO2020090605A1 WO 2020090605 A1 WO2020090605 A1 WO 2020090605A1 JP 2019041642 W JP2019041642 W JP 2019041642W WO 2020090605 A1 WO2020090605 A1 WO 2020090605A1
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Prior art keywords
light receiving
light
unit
linear laser
light emitting
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PCT/JP2019/041642
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English (en)
French (fr)
Japanese (ja)
Inventor
寺田　勝美
晴　孝志
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東レエンジニアリング株式会社
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Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Priority to KR1020217015928A priority Critical patent/KR20210080528A/ko
Priority to CN201980069132.0A priority patent/CN112868092B/zh
Publication of WO2020090605A1 publication Critical patent/WO2020090605A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

Definitions

  • the present invention is a parallelism adjusting device and a parallelism adjusting method for adjusting parallelism when picking up or mounting a plurality of micro components such as micro LEDs at the same time, and a pickup device and a mounting device using the parallelism adjusting device, and
  • the present invention relates to a pickup method and a mounting method.
  • ⁇ Semiconductor chips are becoming smaller to reduce costs, and efforts are being made to mount them at high speed and with high precision.
  • a micro LED for LEDs used in displays, it is required to mount an LED chip of 50 ⁇ m ⁇ 50 ⁇ m or less called a micro LED at high speed with an accuracy of several ⁇ m.
  • a plurality of micro LEDs are arranged in a matrix on a carrier substrate, and at least a part of them is picked up at the same time and mounted on a circuit board at the same time. At that time, it is necessary to accurately adjust the parallelism between the plurality of micro LEDs and the head surface for picking up, or the plurality of micro LEDs held by the head and the circuit board to be mounted. It is extremely important in securing the rate.
  • Patent Document 1 after the parallelism of the head itself is adjusted by a jig in advance, laser light is emitted from three laser displacement gauges mounted on the end of the head to a circuit board to be mounted to measure the distance, A configuration for adjusting the parallelism between the head and the circuit board is described.
  • Patent Document 1 Japanese Patent Laid-Open No. 2018-32740
  • An object of the present invention is to solve the above-mentioned problems and to accurately adjust the parallelism without any trouble.
  • the present invention is a parallelism adjusting device for adjusting the parallelism between a first target portion and a second target portion, A first light emitting portion and a second light emitting portion, which are arranged at intervals in the first direction and are capable of linearly emitting linear laser light toward the opposing second direction; A first light receiving portion, which is arranged at an interval in the second direction and is capable of receiving the linear laser light emitted from the first light emitting portion, and receives the linear laser light emitted from the second light emitting portion.
  • a possible second light receiver A drive unit that drives the first target unit or the second target unit to adjust the parallelism between the first target unit and the second target unit; A control unit that controls the drive unit based on a light receiving length in a linear direction in the linear laser light received by the first light receiving unit and the second light receiving unit, The first light emitting unit and the second light emitting unit are in a substantially facing state in which the first target unit and the second target unit are substantially facing each other, toward the first light receiving unit and the second light receiving unit, A parallelism adjusting device is provided which emits a linear laser beam in a direction intersecting with the substantially opposite direction.
  • a third light emitting unit and a fourth light emitting unit which are arranged at intervals in a third direction intersecting the first direction and the second direction and are capable of linearly emitting linear laser light toward the opposing fourth direction.
  • a third light receiving section which is arranged at an interval in the fourth direction and is capable of receiving the linear laser light emitted from the third light emitting section, and a linear laser emitted from the fourth light emitting section.
  • a fourth light receiving portion capable of receiving light, wherein the third light emitting portion and the fourth light emitting portion are in a substantially facing state in which the first target portion and the second target portion are substantially facing each other, and A linear laser beam in a direction intersecting the substantially opposite direction is emitted toward the third light receiving unit and the fourth light receiving unit, and the control unit further includes the third light receiving unit and the fourth light receiving unit. Based on the light receiving length of the received linear laser light in the linear direction, Gosuru may be configured.
  • the control unit has a light receiving length in a linear direction in the linear laser light in a direction intersecting the substantially opposed direction received by the first light receiving unit, and the light received by the second light receiving unit.
  • the drive unit is controlled so that the difference between the linear laser light in the direction intersecting the substantially opposite direction and the light receiving length in the linear direction is equal to or less than a predetermined value.
  • the light receiving length of the linear laser beam in the direction intersecting the substantially opposed direction received by the third light receiving portion and the substantially opposed direction received by the fourth light receiving portion intersect.
  • the drive unit may be controlled so that the difference between the linear laser light in the moving direction and the light receiving length in the linear direction is equal to or less than a predetermined value.
  • the first target portion is a group of minute components mounted on a substrate
  • the second target portion is a head portion capable of simultaneously picking up at least a part of the group of minute components on a pickup surface.
  • a pickup device using an adjusting device may be used.
  • the first target portion is a circuit board on which a micro component group including a plurality of micro components can be mounted, and the second target portion is the micro component group picked up by the pickup surface of the head portion.
  • a mounting device using a degree adjusting device may be used.
  • the present invention is a parallelism adjusting method for adjusting the parallelism between a first target portion and a second target portion, wherein a first parallelism adjusting method is arranged at intervals in the first direction.
  • First and second light emitting steps of linearly emitting linear laser light from the light emitting section and the second light emitting section toward the opposing second direction, and a first light receiving section arranged at an interval in the second direction.
  • the first light receiving section receives the linear linear laser light emitted from the first light emitting section, and the linear linear laser light emitted from the second light emitting section is received.
  • a parallelism adjusting method characterized in that linear laser light in a direction intersecting with the substantially opposite direction is emitted toward the first light receiving portion and the second light receiving portion.
  • the linear laser light is emitted from the third light emitting portion and the fourth light emitting portion toward the third light receiving portion and the fourth light receiving portion in a direction intersecting with the substantially opposite direction.
  • the third light receiving section and Note that the first target portion or the second target portion is driven based on the light receiving length of the laser light received by the fourth light receiving portion in the linear direction, and the first target portion and the second target portion are parallel to each other. It may be configured to adjust the degree.
  • the first target portion or the second target portion is driven such that the difference between the linear laser light in the direction intersecting the substantially facing direction and the light receiving length in the linear direction is equal to or less than a predetermined value, and the substantially facing In the state, the light receiving length in the linear direction of the linear laser light in the direction intersecting with the substantially opposite direction received by the third light receiving portion and the direction intersecting with the substantially opposite direction received by the fourth light receiving portion.
  • the first target portion or the second target portion may be driven such that the difference between the linear laser light and the light receiving length in the linear direction is equal to or less than a predetermined value.
  • the first target portion is a group of minute components mounted on a substrate
  • the second target portion is a head portion capable of simultaneously picking up at least a part of the group of minute components on a pickup surface.
  • a pickup method using an adjustment method may be used.
  • the first target portion is a circuit board on which a micro component group including a plurality of micro components can be mounted, and the second target portion is the micro component group picked up by the pickup surface of the head portion.
  • a mounting method using a degree adjusting method may be used.
  • the parallelism can be accurately adjusted without any trouble.
  • Example 1 of this invention It is a figure explaining the pick-up method in Example 1 of this invention. It is a figure explaining the parallelism adjusting method in Example 1 of this invention, (a) shows the state where parallelism was adjusted, (b) shows the state where parallelism is not adjusted. It is a side view explaining the parallelism adjusting device in Example 1 of the present invention. It is a top view explaining the parallelism adjusting device in Example 1 of the present invention. It is a figure explaining the mounting method in Example 2 of this invention.
  • FIG. 1 is a diagram illustrating a pickup method according to the first embodiment of the present invention.
  • 2A and 2B are views for explaining the parallelism adjusting method according to the first embodiment of the present invention.
  • FIG. 2A shows a state where the parallelism is adjusted
  • FIG. 2B shows a state where the parallelism is not adjusted.
  • FIG. 3 is a side view illustrating the parallelism adjusting device according to the first embodiment of the present invention.
  • FIG. 4 is a top view illustrating the parallelism adjusting device according to the first embodiment of the present invention.
  • the plurality of nozzles 12 (the depth of FIG. 1) in which the plurality of micro LEDs 1 (also mounted in the depth direction of FIG. 1) mounted in a matrix on the carrier substrate 2 are provided in the head 11 are provided.
  • a parallelism adjusting method and a parallelism adjusting device in the case of picking up in the direction (also provided in the direction) will be described. That is, in the first embodiment, the plurality of micro LEDs 1 are used as a minute component group.
  • Each nozzle provided in the head 11 is made of a polymer resin and has an adhesive property, and is provided so as to be picked up in an array at a pitch N times the array pitch in the XY direction of the micro LED 1.
  • each color of R, G, and B can be set as one pixel and can be mounted on the circuit board from each carrier board.
  • the micro LED 1 mounted on the carrier substrate 2 is picked up by each nozzle 12 having the adhesive property. That is, as shown in FIG. 1A, the head 11 is moved and positioned so that the nozzle 12 is located right above the micro LED 1, and then the head 12 is moved down toward the micro LED 1 which is a minute component group. As shown in FIG. 1B, when the tip of the nozzle 12 comes into contact with the upper part of the micro LED 1, the lowering of the head is stopped. The carrier substrate 2 and the micro LED 1 are adhered by an adhesive member, but since the degree of adhesion of the tip surface of the nozzle 12 is greater than the degree of adhesion of the carrier substrate 2, the nozzle 12 should be brought into contact with the nozzle 12 to raise it. Can pick up the micro LED 1 (FIG. 1C).
  • the parallelism between the nozzle 12 of the head 11 and the micro LED 1 on the carrier substrate 2 is adjusted and picked up. Further, as will be described later, when mounting the micro LED 1 picked up by the nozzle 12 of the head 11 on the circuit board 3, it is important to adjust the parallelism and mount the same.
  • the head 11 is held by a head holder (not shown) so as to be detachable by suction or other holding means
  • the carrier substrate 2 and the circuit board 3 are held by a holding table (not shown) so as to be detachable by suction or other holding means.
  • a method of adjusting the parallelism between the head holder and the mounting table may be used as long as the flatness of each of the head 11, the carrier substrate 2 and the circuit board 3 is ensured.
  • the nozzle 12 (second target portion) of the head 11 and a plurality of micro LEDs 1 (first target portion), which are minute component groups, are substantially opposed to each other with a gap, and It shows a state in which the parallelism with the plurality of micro LEDs 1 is adjusted.
  • LB21 and LB22 indicate linear laser light emitted from the first light emitting unit 21 and the second light emitting unit 22 in the front direction from the depth direction of FIG. 2 (first second light emitting step), and the tip of the nozzle 12 is shown. To the tip of the micro LED 1, but the linear laser light emitted to the nozzle 12 and the micro LED 1 is not transmitted.
  • the transmitted linear laser light LB21 and linear laser light LB22 are received by the first light receiving portion 31 and the second light receiving portion 32 (first second light receiving step).
  • the linear laser light LB21 and the linear laser light LB22 have the same length L0 in the linear direction (Z direction), and the difference between the lengths is zero.
  • the tip of the nozzle 12 of the head 11 and the plurality of micro LEDs 1 which are a minute component group are substantially opposed to each other with a gap, and the parallelism between the tip of the nozzle 12 and the plurality of micro LEDs 1 is adjusted. It is shown that it has not been moved and is tilted by ⁇ .
  • the linear laser light LB21 and the linear laser light LB22 indicate the linear laser light emitted in the first and second light emitting steps from the depth direction to the front direction of FIG. It penetrates to the tip.
  • the linear laser light LB21 and the linear laser light LB22 are received by the first light receiving unit 31 and the second light receiving unit 32 in the first second light receiving step.
  • the length L2 of the linear laser beam LB21 in the linear direction (Z direction) is longer than the length L1 of the linear laser beam LB22 in the linear direction (Z direction), and The difference is L2-L1.
  • the parallelism is adjusted by the difference between the light receiving length L2 of the linear laser light LB21 in the linear direction and the light receiving length L1 of the linear laser light LB22 in the linear direction. It is possible to know, based on the difference, a plurality of minute component groups (micro LEDs 1) mounted on the carrier substrate 2 which is the first target portion, and the head portion which is the second target portion (the nozzle 12 of the head 11). ) Is configured to adjust the parallelism with.
  • the head 11 is driven so that the difference between the light receiving length L2 of the linear laser light LB21 in the linear direction and the light receiving length L1 of the linear laser light LB22 in the linear direction is equal to or less than a predetermined value, and the parallelism is increased. And an adjustment step for adjusting.
  • the second target unit is driven to adjust the parallelism, but the present invention is not limited to this and can be changed as appropriate.
  • the first target section may be driven to adjust the parallelism, or both the first target section and the second target section may be driven to adjust the parallelism. Good.
  • FIG. 3 is a side view illustrating the parallelism adjusting device according to the first embodiment of the present invention.
  • FIG. 4 is a top view illustrating the parallelism adjusting device according to the first embodiment of the present invention.
  • the linear laser light LB21 can be linearly emitted in the + X direction (first direction) with a space therebetween and in the opposite ⁇ X direction (second direction).
  • a first light emitting unit 21 and a second light emitting unit capable of emitting the linear laser beam LB21 are provided.
  • the first light-receiving unit 31 and the second light-emitting unit 22 which are arranged at intervals in the ⁇ X direction (second direction) and can receive the linear laser light LB21 emitted from the first light-emitting unit 21 emit light.
  • a second light receiving section 32 capable of receiving the linear laser beam LB22 thus generated is provided.
  • the linear laser light LB23 is linearly arranged in the + Y direction (third direction) orthogonal to the first direction and the second direction, and is arranged in the opposite ⁇ Y direction (fourth direction).
  • a possible third light emitting portion 23 and a fourth light emitting portion 24 capable of emitting the linear laser beam LB24 are provided.
  • the third light receiving unit 33 which is arranged at an interval in the ⁇ Y direction (fourth direction) and can receive the linear laser light LB23 emitted from the third light emitting unit 23, and the fourth light emitting unit 24 emit light.
  • a fourth light receiving section 34 capable of receiving the linear laser light LB24 thus formed is provided.
  • the first light emitting unit 21, the second light emitting unit 22, the third light emitting unit 23, and the fourth light emitting unit 24 all have the same configuration and are configured by arranging semiconductor laser sources linearly. .. Further, the first light receiving unit 31, the second light receiving unit 32, the third light receiving unit 33, and the fourth light receiving unit 34 all have the same configuration and are composed of linearly arranged CCD sensors.
  • the distance between the first light emitting portion 21 and the second light emitting portion and the distance between the third light emitting portion and the fourth light emitting portion are as large as possible.
  • the vicinity of the nozzles 12 at both ends of the head 11 is most preferable.
  • the linear laser beam LB21 and the linear laser beam LB22 are irradiated to the place where the micro LED 1 is present, but it may be the place where the micro LED 1 is not present.
  • first light emitting portion 21 and the first light receiving portion 31, the second light emitting portion 22 and the second light receiving portion 32, the third light emitting portion 23 and the third light receiving portion 33, and the fourth light emitting portion 24 and the fourth light receiving portion 34 are arranged parallel to the X-axis or Y-axis direction and face each other, and are arranged in a direction orthogonal to the first light emitting unit 21 and the first light receiving unit 31, and the second light emitting unit 22 and the second light receiving unit 32.
  • the third light emitting unit 23 and the third light receiving unit 33, and the fourth light emitting unit 24 and the fourth light receiving unit 34 are arranged, the present invention is not necessarily limited to this and can be appropriately changed.
  • the first light emitting unit 21, the first light receiving unit 31, the second light emitting unit 22, the second light receiving unit 32, or the third light emitting unit 23, the third light receiving unit 33, and the fourth light emitting unit 24, the fourth light receiving unit. 34 may be opposed to each other at an angle with respect to the X axis or the Y axis, or only the first light emitting portion 21, the first light receiving portion 31, and the second light emitting portion 22 and the second light receiving portion 32 may be X. You may oppose in the state which has an angle with an axis or a Y-axis.
  • the four light receiving parts 34 may be arranged.
  • the nozzle 12 (second target portion) of the head 11 and the plurality of micro LEDs 1 (first target portion) are connected.
  • the first light receiving unit 31, the second light receiving unit 32, the third light receiving unit 33, and the fourth light receiving Light is emitted linearly toward the portion 34.
  • the emitted linear laser light travels straight, is blocked by an obstacle such as the nozzle 12 or the micro LED 1, and passes through only the space without the obstacle to reach the corresponding light receiving portion, as in LB21 shown in FIG. ..
  • the linear laser light emitted in the first and second light emitting steps is first received in the first and second light receiving steps.
  • the linear laser light emitted in the first and second light emitting steps is changed to the first in the first and second light receiving steps.
  • the length is not the same as the length L1, and the difference is L2-L1 and is not zero.
  • FIG. 2 shows the parallelism adjusting method in the first and second light emitting steps and the first and second light receiving steps
  • the third light emitting section 23 and the fourth light emitting section 24 emit a linear laser beam.
  • the parallelism adjusting apparatus drives a head portion (nozzle 12 of the head 11) that is a second target portion to mount a plurality of micro component groups (micro) mounted on the carrier substrate 2 that is the first target portion.
  • a drive unit that adjusts the parallelism with the LED 1) and a control unit that controls the drive unit based on the light receiving lengths L1 and L2 of the linear laser light in the linear direction are provided.
  • the control unit drives the driving unit so that the difference L2-L1 between the above-described light receiving lengths is equal to or less than a predetermined value, and executes the adjusting process for adjusting the parallelism.
  • the drive unit may be provided with means for changing the inclinations in the X direction and the Y direction, or may be provided with means for changing the inclinations in the X direction and the Y direction at the same time.
  • the predetermined value or less may be a value at which all of the plurality of micro LEDs 1 can be picked up by the plurality of nozzles 12 of the head 11, preferably 1 ⁇ m or less, and most preferably 0.5 ⁇ m or less. desirable.
  • the predetermined value for adjusting the parallelism based on the difference in height may be the same value or different values.
  • the first light emitting unit 21 and the second light emitting unit 22 are provided in the first direction and the second direction (X direction), and the third light emitting is performed in the third direction and the fourth direction (Y direction).
  • the portion 23 and the fourth light emitting portion 24 are provided, and the first light receiving portion 31, the second light receiving portion 32, the third light receiving portion 33, and the fourth light receiving portion 34, which are opposed to each other, are provided, but this is not always the case. It is not limited and can be changed as appropriate.
  • the parallelism in the third direction and the fourth direction (Y direction) is satisfied only by adjusting the parallelism in the first direction and the second direction (X direction), the first direction and the second direction (X direction) It is only necessary to provide the first light emitting portion 21 and the second light emitting portion 22 in the (direction) and to provide the first light receiving portion 31 and the second light receiving portion 32 facing each other.
  • the nozzle 12 (second target portion) of the head 11 and the plurality of micro LEDs 1 (first target portion) are substantially opposed to each other with a gap, and the first and second light emitting steps are performed.
  • the fourth light emitting step, the first second light receiving step, and the third fourth light receiving step are executed, the present invention is not necessarily limited to this, and can be appropriately changed. For example, you may perform a 1st 2nd light emission process, a 3rd 4th light emission process, a 1st 2nd light reception process, and a 3rd 4th light reception process by making it oppose substantially without a clearance gap.
  • the parallelism may be adjusted so that L2-L1 is equal to or less than the predetermined value.
  • a direction (a direction orthogonal to the substantially opposing direction in which the second target portion and the first target portion are substantially opposed to each other (although the linear laser light in the Z direction) is configured to be emitted linearly, the present invention is not necessarily limited to this and can be appropriately changed.
  • the linear laser light may be linearly emitted in a direction that is not orthogonal to the substantially opposite direction and has a predetermined angle.
  • the linear laser light may be emitted linearly at least in a direction intersecting the substantially opposite direction.
  • the parallelism adjusting device that adjusts the parallelism between the first target portion and the second target portion, A first light emitting portion and a second light emitting portion, which are arranged at intervals in the first direction and are capable of linearly emitting linear laser light toward the opposing second direction; A first light receiving portion, which is arranged at an interval in the second direction and is capable of receiving the linear laser light emitted from the first light emitting portion, and receives the linear laser light emitted from the second light emitting portion.
  • a possible second light receiver A drive unit that drives the first target unit or the second target unit to adjust the parallelism between the first target unit and the second target unit; A control unit that controls the drive unit based on a light receiving length in a linear direction in the linear laser light received by the first light receiving unit and the second light receiving unit, The first light emitting unit and the second light emitting unit are in a substantially facing state in which the first target unit and the second target unit are substantially facing each other, toward the first light receiving unit and the second light receiving unit, With the parallelism adjusting device characterized by emitting linear laser light in a direction intersecting with the substantially opposite direction, it is possible to accurately adjust the parallelism without a trouble.
  • a parallelism adjusting method for adjusting the parallelism between the first target portion and the second target portion A first second light emitting step of linearly emitting linear laser light from a first light emitting portion and a second light emitting portion arranged at intervals in the first direction toward a second direction facing each other, In the first light receiving portion and the second light receiving portion which are arranged at intervals in the second direction, the first light receiving portion receives the linear linear laser light emitted from the first light emitting portion, A first and second light receiving step in which the second light receiving portion receives the linear laser light emitted from the two light emitting portions, The first target portion or the second target portion is driven by driving the first target portion or the second target portion based on the light receiving length in the linear direction in the linear laser light received by the first light receiving portion and the second light receiving portion.
  • An adjusting step of adjusting parallelism with the second target portion In the first second light emitting step, the first light emitting portion and the second light emitting portion are moved from the first light receiving portion to the first light receiving portion in a substantially facing state in which the first target portion and the second target portion are substantially facing each other.
  • the parallelism adjusting method characterized in that the linear laser light is emitted toward the second light receiving portion in the direction intersecting with the substantially opposite direction, the parallelism can be adjusted accurately without a trouble. ..
  • the second embodiment of the present invention is different from the first embodiment in that the parallelism adjusting device is applied to the mounting device and the parallelism adjusting method is applied to the mounting method.
  • Example 2 will be described with reference to FIG.
  • FIG. 5 is a diagram illustrating a mounting method according to the second embodiment of the present invention.
  • the micro LED 1 is picked up in each of the plurality of nozzles 12 of the head 11. After positioning the circuit board 3 on which the micro LEDs 1 are mounted on a predetermined position, the micro LED 1 is lowered toward the circuit board 3. At that time, if the parallelism between the plurality of picked-up micro LEDs 1 (small component group) and the circuit board 3 is not adjusted, any one of the micro LEDs 1 cannot be mounted at a predetermined position on the circuit board 3 and the positional deviation occurs. There is a case where the micro LED 1 is raised or cannot be mounted due to a gap, or the micro LED 1 is destroyed by a shock of mounting.
  • the parallelism adjusting method is executed using the parallelism adjusting device described above.
  • the first target portion is the circuit board 3 on which a micro component group including a plurality of micro LEDs 1 (micro components) can be mounted
  • the second target portion is the head portion (nozzle 12 of the head 11). It is a micro component group including a plurality of micro LEDs 1 (micro components) picked up on the pickup surface.
  • the head 11 descends and stops descending when the mounting surfaces of the plurality of micro LEDs 1 picked up by the plurality of nozzles 12 all come into contact with the circuit board 3 (Fig. 5 (b)).
  • the head 11 is raised, all the micro LEDs 1 are held on the circuit board 3.
  • an adhesive layer (not shown) is also provided at the mounting position of the circuit board 3, and the adhesive degree of this adhesive layer is larger than that of the nozzle 12. That is, there is a relationship of the degree of adhesion of the carrier substrate 2 ⁇ the degree of adhesion of the nozzle 12 ⁇ the degree of adhesion of the circuit board.
  • the parallelism adjusting device As described above, in the second embodiment, by applying the parallelism adjusting device to the mounting device and executing the parallelism adjusting method, it is possible to realize a high success rate without transfer errors and highly accurate mounting.
  • the parallelism adjusting device, the pickup device, the mounting device, the parallelism adjusting method, the pickup method, and the mounting method according to the present invention are not limited to the micro LED, and are applicable to the field of reliably mounting a minute component such as a chip capacitor with high speed and high accuracy. It can be widely used.
  • Micro LED 2 Carrier board 3: Circuit board 11: Head 12: Nozzle 21: First light emitting part 22: Second light emitting part 23: Third light emitting part 24: Fourth light emitting part 31: First light receiving part 32: Second light receiving unit 33: Third light receiving unit 34: Fourth light receiving unit LB21: Linear laser light LB22: Linear laser light LB23: Linear laser light LB24: Linear laser light

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PCT/JP2019/041642 2018-10-29 2019-10-24 平行度調整装置、ピックアップ装置、実装装置、平行度調整方法、ピックアップ方法、及び実装方法 WO2020090605A1 (ja)

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KR1020217015928A KR20210080528A (ko) 2018-10-29 2019-10-24 평행도 조정 장치, 픽업 장치, 실장 장치, 평행도 조정 방법, 픽업 방법, 및 실장 방법
CN201980069132.0A CN112868092B (zh) 2018-10-29 2019-10-24 平行度调整装置、拾取装置、安装装置、平行度调整方法、拾取方法以及安装方法

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JP2018202718A JP6899364B2 (ja) 2018-10-29 2018-10-29 平行度調整装置、ピックアップ装置、実装装置、平行度調整方法、ピックアップ方法、及び実装方法
JP2018-202718 2018-10-29

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001274499A (ja) * 2000-03-27 2001-10-05 Toshiba Electronic Engineering Corp 半導体レーザ装置及び半導体レーザチップのマウント方法
JP2010147048A (ja) * 2008-12-16 2010-07-01 Adwelds:Kk 傾き調整方法および傾き調整装置並びにその傾き調整方法において調整されるデバイス
JP2018032740A (ja) * 2016-08-24 2018-03-01 東レエンジニアリング株式会社 実装方法および実装装置

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KR100441273B1 (ko) * 2001-08-10 2004-07-22 (주)디지탈옵틱 레이저 축 정렬 검출장치 및 방법
JP2004077202A (ja) * 2002-08-12 2004-03-11 Canon Inc 基板位置検出装置及び基板位置検出方法
WO2018061896A1 (ja) * 2016-09-29 2018-04-05 東レエンジニアリング株式会社 転写方法、実装方法、転写装置、及び実装装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001274499A (ja) * 2000-03-27 2001-10-05 Toshiba Electronic Engineering Corp 半導体レーザ装置及び半導体レーザチップのマウント方法
JP2010147048A (ja) * 2008-12-16 2010-07-01 Adwelds:Kk 傾き調整方法および傾き調整装置並びにその傾き調整方法において調整されるデバイス
JP2018032740A (ja) * 2016-08-24 2018-03-01 東レエンジニアリング株式会社 実装方法および実装装置

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CN112868092A (zh) 2021-05-28
JP6899364B2 (ja) 2021-07-07
KR20210080528A (ko) 2021-06-30
TWI814927B (zh) 2023-09-11

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