WO2020087816A1 - 显示面板、显示装置及显示面板的制造方法 - Google Patents

显示面板、显示装置及显示面板的制造方法 Download PDF

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Publication number
WO2020087816A1
WO2020087816A1 PCT/CN2019/076362 CN2019076362W WO2020087816A1 WO 2020087816 A1 WO2020087816 A1 WO 2020087816A1 CN 2019076362 W CN2019076362 W CN 2019076362W WO 2020087816 A1 WO2020087816 A1 WO 2020087816A1
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WIPO (PCT)
Prior art keywords
substrate
display panel
encapsulant
display
cover plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/076362
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English (en)
French (fr)
Inventor
刘明星
王徐亮
张玄
甘帅燕
高峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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Application filed by Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan Govisionox Optoelectronics Co Ltd
Publication of WO2020087816A1 publication Critical patent/WO2020087816A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Definitions

  • the present application relates to the field of display technology, and in particular, to a display panel, a display device, and a method of manufacturing a display panel.
  • the cover plate mother board is packaged with the substrate mother board, and then the mother board is cut to obtain a single display panel.
  • the display panel on the mother board develops towards the direction of zero layout, which means that the spacing between the display panels is zero or approaches zero. After cutting, there is no need to trim the edges, and the cut is the designed display panel.
  • the edge of the display panel will appear due to stress, and the encapsulant near the cutting edge will be affected, which will lead to packaging problems and reduce the production yield of the display panel.
  • the present application provides a display panel, a display device, and a method for manufacturing a display panel, to solve the problem that the conventional technology is likely to cause edge collapse when cutting to form a display panel, which in turn causes defective packaging.
  • the present application provides a display panel, including: a substrate, a cover plate and an encapsulant, a display area and a non-display area surrounding the display area are defined on the substrate;
  • the cover plate is provided on the substrate through the encapsulant; wherein, the edge of the substrate and / or the edge of the cover plate located outside the encapsulant surround is formed with a thinned portion.
  • the present application provides a display device including the above display panel.
  • the present application provides a method for manufacturing a display panel, including: providing a substrate motherboard, the substrate motherboard defines a plurality of display areas and a plurality of non-display areas, each non-display area is surrounded by A display area; providing a cover board mother board, which is provided with a plurality of encapsulants; the cover board mother board and the substrate mother board are covered, and each encapsulant is located in a non-display area and surrounds a display Area; wherein, the substrate mother board and / or the cover board mother board located outside the encapsulant surrounding ring form a thinned portion; the substrate mother board and the cover board mother board are cut along the position of the thinned portion to obtain a plurality of display panels.
  • the display panel of the present application includes a substrate, a cover plate, and an encapsulant disposed between the substrate and the cover plate; a display area and a non-display area surrounding the display area are defined on the substrate, and the encapsulant is located in the non-display area and surrounds the display area; A thinned portion is formed on the edge of the substrate and / or the edge of the cover plate outside the encapsulation ring.
  • a single display panel is obtained by cutting the motherboard.
  • the edge of the display panel and the edge of the cover plate are the cutting positions of the display panel motherboard. Setting thinned parts at the two edge positions, that is, the cutting position, can reduce the occurrence of cutting.
  • the stress of the edge avoids the problem of edge collapse caused by cutting stress, and then avoids the influence of edge collapse on the encapsulant to ensure the encapsulation effect, thereby ensuring a higher production yield of the display panel.
  • FIG. 1 is a schematic structural diagram of a display panel motherboard used for manufacturing the display panel of the present application
  • FIG. 2 is another schematic structural diagram of a display panel motherboard used for manufacturing the display panel of the present application
  • FIG. 3 is another schematic structural diagram of a display panel mother board used for manufacturing the display panel of the present application.
  • FIG. 4 is a schematic structural view of a cushion in the motherboard of the display panel shown in FIG. 3;
  • FIG. 5 is a distribution diagram of multiple cushions in the motherboard of the display panel shown in FIG. 3;
  • FIG. 6 is a schematic structural diagram of an embodiment of a display panel of the present application.
  • FIG. 7 is a schematic structural view of another embodiment of the display panel of the present application.
  • FIG. 8 is a schematic structural diagram of yet another embodiment of the display panel of the present application.
  • FIG. 9 is a schematic structural diagram of an embodiment of a display device of the present application.
  • FIG. 10 is a schematic flowchart of an embodiment of a method for manufacturing a display panel of the present application.
  • the display panel is cut from a huge mother board.
  • the design idea of this application is adapted to the mother board with zero layout, that is, the interval between each display panel is zero or close to zero.
  • the board may cause the problem of edge collapse of the resulting display panel, that is, the edge collapse of the display panel, and the encapsulant provided in the display panel is closer to the edge, so the edge collapse Will affect the adhesion between the encapsulant and the substrate, resulting in package failure.
  • the present application proposes a motherboard of a display panel. The cutting position is thinned to reduce the cutting stress and the adverse effects caused by cutting. Please refer to FIG. 1 for details.
  • FIG. 1 is a schematic structural diagram of a display panel motherboard used for manufacturing the display panel of the present application.
  • the display panel mother board 100 includes a substrate mother board 11, a cover board mother board 12 and an encapsulant 13; after the substrate mother board 11 and the cover board mother board 12 are arranged in pairs, the two are encapsulated by the encapsulant 13.
  • a driving circuit, a display unit, etc. are provided on the substrate motherboard 11 to form a display area 111 on the substrate motherboard 11; how many display panels the substrate motherboard 11 is used to make, that is, how many display areas are formed thereon 111.
  • the surrounding display area 111 is the non-display area 114.
  • the encapsulant 13 may be formed on the substrate mother board 11 or the cover board mother board 12, and then the cover board mother board 12 is covered on the substrate mother board 11 so that each encapsulant 13 Around one display area 111, the display area 111 is sealed.
  • the packaging method in this embodiment may be referred to as Frit (glass frit) packaging, that is, the encapsulant 13 may use Frit material.
  • the display area 111 is located inside I of the enclosing ring of the encapsulant 13, and the portion located outside O of the encapsulant 13 is used as the final display panel.
  • the cut AA where the display panel motherboard 100 is cut is also a portion located outside O of the encapsulant 13.
  • a thinning treatment is applied to the cutting points A-A to reduce the effect of stress. That is, for the display panel mother board 100, a substrate thinning portion 112 is formed on the substrate mother board 11 located outside O of the encapsulant 13, that is, the substrate mother board 11 is thinned, such as etching or laser ablation. , So that the thickness of the processed substrate thinning portion 112 is smaller than the original thickness of the substrate motherboard 11, specifically, the thickness of the thinning portion 112 is 40% to 80% of the original thickness. When the substrate thinned portion 112 is cut, the stress can be reduced to a certain extent, and the influence of chipping can be reduced.
  • the encapsulant 13 when the encapsulant 13 is closer to the cutting position AA, that is, the display panel adopts a narrow bezel design, for example, when the distance between the two encapsulants 13 adjacent to the display panel is in the range of 0 ⁇ 400 ⁇ m, if the thinning process is not performed, the cut
  • the stress may affect the packaging strength of the encapsulant 13, that is, the thinning process of the AA at the cutting position in this embodiment can also reduce the influence of the cutting on the encapsulant 13.
  • the edge of the cut display panel is thinner and the strength is weakened. Therefore, in order to ensure the strength of the edge of the display panel and reduce the influence of the thinned portion 112 on the encapsulant 13, the thinned portion 112 in this embodiment It is spaced from the orthographic projection of the encapsulant 13 on the substrate motherboard 11, and the width of the thinned portion 112 is 50% to 90% of the width between the encapsulants 13.
  • the substrate mother board 11 and the cover board mother board 12 need to be cut at the same time, so that the cover board thinning portion 122 can be further formed on the cover board mother board 12.
  • the thinned portion may be formed only on the substrate motherboard 11 or the cover motherboard 12, or may be formed on both motherboards.
  • both the substrate mother board 11 and the cover board mother board 12 are thinned, and the shape and size of the thinned portions on the two mother boards are the same.
  • the thinned parts are all in the shape of grooves, wherein the groove opening direction of one mother board is away from the other mother board, that is, the outer surfaces of the substrate mother board 11 and the cover board mother board 12 are thinned, such as etching treatment, To form a thinned portion.
  • the direction of the opening of the groove formed on one motherboard may also face the other motherboard.
  • the thinning process may be performed when no other layer is formed on the substrate mother board 11 or the cover board mother board 12, for example, when a glass substrate is used as the substrate mother board 11 or the cover board mother board 12, the provided glass substrate may be Pre-thinned.
  • the drive circuit and the light-emitting unit need to be deposited on the glass substrate.
  • the outer surfaces of the substrate mother board 11 and the cover board mother board 12 are generally thinned Treatment, so that the direction of the groove opening on one motherboard is away from the other motherboard.
  • FIG. 1 is another schematic structural diagram of a display panel motherboard used for manufacturing the display panel of the present application
  • FIG. 3 is another type of display panel motherboard used for manufacturing the display panel of the present application. Schematic.
  • a protrusion is formed on the thinned portion of the substrate mother board 11 and / or the cover board mother board 12 on the outer side of the encapsulant 13, taking the substrate mother board 11 as an example, the thinned portion 112 is formed
  • a protrusion 113 that is, when the substrate mother board 11 is thinned, only a part of the area is etched, and the remaining portion is formed with a protrusion 113 to ensure the strength of the thinned portion 112, that is, the thickness of the protrusion 113 It may be the original thickness of the substrate motherboard 11.
  • the protrusion 113 only serves to strengthen the thinned portion, so when cutting the motherboard 100, the cutting position A-A needs to avoid the protrusion 113 to ensure the cutting quality.
  • a cushion pad 14 is provided between the substrate motherboard 11 and the cover motherboard 12, the cushion pad 14 is located outside the outer ring O of the encapsulant 13 and corresponds to the thinned portion.
  • the embodiment of FIG. 3 uses cushion The pad 14 strengthens the thinned portion.
  • the height of the cushion pad 14 may be more than half of the height of the gap between the substrate mother board 11 and the cover board mother board 12.
  • the cushion pad 14 may be formed on the substrate board 11 or the cover board mother board 12; its material It can be Frit glass frit or organic glue. If it is Frit glass frit, the cushion 14 can be formed at the same time as the encapsulant 13 is manufactured.
  • the cushion 14 can also be used to release cutting stress. That is, when cutting the mother board 100, the cutter wheel can be placed on the cushion to avoid edge collapse and further ensure the cutting quality. Since the cushion 14 is also used to carry the cutting of the cutter wheel, in order to avoid its influence on the encapsulant 13, the two are also designed to be spaced from each other.
  • the cushion 14 may be designed in various shapes, as shown in FIG. 4, which is a schematic structural diagram of the cushion in the motherboard of the display panel shown in FIG. 3.
  • the cushion pad 14 includes an upper buffer portion 141 near the cover motherboard 11 and a lower buffer portion 142 near the substrate motherboard 12.
  • the area of the upper buffer portion 141 is smaller than the area of the lower buffer portion 142.
  • the lower buffer portion 142 in this embodiment has a larger size, so it can further play a supporting role, and for (a) in FIG. 4, the upper buffer portion 141 is formed
  • the groove shape can be used to guide the cutter wheel during cutting, which is more conducive to the stability of the cutter wheel cutting process.
  • the thinned portion is provided to ensure the cutting quality of the display panel motherboard 100, so the thinned portion is continuous, that is, the thinned portion is formed on the cutting edge of the display panel.
  • the cushion pad 14 is mainly used to strengthen the thinned portion, so the cushion pad 14 may not be continuous, and the cushion pad 14 is not necessarily required at the cutting position.
  • the cushion pad 14 may be multiple, and multiple buffers The pads 14 may be evenly distributed around the display area 111. Please refer to FIG. 5, which is a distribution diagram of a plurality of buffer pads in the motherboard of the display panel shown in FIG.
  • FIG. 6 is a schematic structural diagram of an embodiment of a display panel of the present application.
  • the display panel 200 includes a substrate 21, a cover 22 and an encapsulant 23.
  • the display panel 200 of the present embodiment defines a display area 211 and a non-display area 214 on the substrate 21, and the cover plate 22 is encapsulated on the substrate 21 by an encapsulant 23, and the encapsulant 23 is located in the non-display area.
  • the display area 214 is disposed around the display area 211 such that the display area 211 is located inside the encapsulant 23 surrounding circle, and a thinned portion 212 or 222 is formed on the edge of the substrate 21 and / or the edge of the cover plate 22 outside the encapsulant 23 surrounding circle.
  • the structure of the display panel 200 is derived from the motherboard of the display panel 100.
  • the orthographic projection of the thinned portion 212 (222) and the encapsulant 23 on the substrate 21 can be spaced from each other.
  • the thinned portion 212 (222) occupies the encapsulant 23 to 50% ⁇ 90% of the distance between the edges of the panel, etc.
  • FIG. 7 is another display panel of the present application.
  • FIG. 8 is a schematic structural diagram of yet another embodiment of the display panel of the present application.
  • protrusions 213 or 223 are formed on the thinned portions 212 or 222 of the edge of the substrate 21 and / or the edge of the cover 22 outside the encapsulant 23 surrounding the ring, respectively.
  • a cushion pad 24 is also provided between the substrate 21 and the cover plate 22, which is located outside the surrounding circle of the encapsulant 23, and the cushion pad 24 is used to strengthen the strength of the thinned portion 212 (222), so the cushion pad 24 is correspondingly thin
  • the portion 212 (222) is provided, and the orthographic projection of the thinned portion 212 (222) and the cushion pad 24 on the substrate 21 overlap each other.
  • the shape and layout of the buffer pad 24 are similar to those of the above-mentioned display panel motherboard 100, and will not be repeated here.
  • the display panel 200 is obtained by cutting, the outer side of the cushion 24 after cutting is flush with the side of the substrate, and the cut is flush.
  • the thinned design of the edge of the display panel 200 obtained by the above cutting can reduce the stress generated during the cutting, avoid edge collapse caused by the cutting stress, and then affect the packaging effect.
  • the display panel 200 is also provided with protrusions or cushions in the thinned portion to ensure the strength of the thinned portion and avoid breakage during the process. Among them, the cushion can further release the cutting stress during cutting to avoid the problem of edge collapse. Therefore, the display panel 200 of this embodiment has higher cutting quality and better packaging effect.
  • the above display panel can be specifically applied to a display device.
  • the present application also proposes a display device. Please refer to FIG. 9, which is a schematic structural diagram of an embodiment of a display device of the present application.
  • the display device 300 of this embodiment includes a display panel 31, which is similar to the above-mentioned display panel 200, and will not be described in detail.
  • the display device 300 may be an electronic device capable of displaying, such as a mobile phone, a computer, a tablet, and a TV.
  • FIG. 10 is a schematic flowchart of an embodiment of a method for manufacturing a display panel of the present application. The manufacturing method includes the following steps.
  • S101 Provide a substrate mother board.
  • a plurality of display areas and a plurality of non-display areas are defined on the provided substrate mother board.
  • the non-display areas surround the display area, and a thinned portion is formed on the edge of the display panel area on the substrate mother board.
  • the step S101 may further include: thinning the substrate mother board; forming a driving circuit and a display unit on the substrate mother board to form a display area.
  • a plurality of encapsulants are provided on the mother board of the cover board, and a thinning portion may also be formed on the edge of the display panel region on the mother board of the cover board.
  • This step S102 may further include: forming an encapsulant on the mother board of the cover plate. If a cushion pad is needed to protect the thinned portion, this step may further include: forming a cushion pad on the mother board of the cover plate.
  • each encapsulant is located in a non-display area and is arranged around a display area, and the display area is located inside the encapsulant surround.
  • the display panel manufactured by the above method has the structure shown in FIGS. 6 to 8, that is, a thinned portion is formed at the edge of the display panel, and when the display panel is finally cut, it can be ensured that the edge of the display panel does not collapse In turn, the problem of affecting the packaging effect is obtained.
  • the cutting quality is high, and a high-quality display panel can be obtained.
  • the display panel manufactured by the above method can also obtain a higher product yield.
  • the thinned portion may be worn away. Therefore, the display panel with the thinned portion worn away is also considered to be within the scope of protection of the present application.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种显示面板（100）、显示装置（300）及显示面板（100）的制造方法，显示面板（100）包括：基板（11）、盖板（12）及封装胶（13），基板（11）上定义有显示区（111）和围绕显示区（111）的非显示区（114）；盖板（12）通过封装胶（13）设置于基板（11）上；封装胶（13）位于非显示区（114）且围绕显示区（111）设置；位于封装胶（13）包围圈外侧的基板（11）边缘和/或盖板（12）边缘形成有薄化部（112）。对母板进行切割得到显示面板（100）的过程中，能够保证切割对显示面板（100）质量不构成影响。

Description

显示面板、显示装置及显示面板的制造方法
【技术领域】
本申请涉及显示技术领域，特别是涉及一种显示面板、显示装置及显示面板的制造方法。
【背景技术】
在显示面板的制造过程中，将盖板母板与基板母板封装结合，然后对母板进行切割，得到单个显示面板。为节省材料，母板上显示面板朝着零排版的方向发展，零排版即显示面板之间的间距为零或趋近零，切割后无需再进行切边，切割所得即为所设计显示面板。
对于零排版的母板，在使用刀轮进行切割时，会由于应力造成显示面板出现崩边问题，并影响到靠近切割边的封装胶，导致封装问题，造成显示面板的生产良率降低。
【发明内容】
本申请提供一种显示面板、显示装置及显示面板的制造方法，以解决现有技术中在切割形成显示面板时容易导致崩边，继而造成封装不良的问题。
为解决上述技术问题，本申请提供一种显示面板，包括：基板、盖板及封装胶，基板上定义有显示区和围绕显示区的非显示区；封装胶位于非显示区且围绕显示区设置；盖板通过封装胶设置于基板上；其中，位于封装胶包围圈外侧的基板边缘和/或盖板边缘形成有薄化部。
为解决上述技术问题，本申请提供一种显示装置，包括上述显示面板。
为解决上述技术问题，本申请提供一种显示面板的制造方法，包括：提供一基板母板，所述基板母板上定义有多个显示区和多个非显示区，每一非显示区围绕一显示区；提供一盖板母板，所述盖板母板上设置有多个封装胶；将盖板母板和基板母板盖合，每一封装胶位于一非显示区且围绕一显示区；其中，位于封装胶包围圈外侧的基板母板和/或盖板母板形成薄化部；沿着薄化部的位置对基板母板和盖板母板进行切割得到多个显示面板。
本申请显示面板包括基板，盖板，以及设置在基板和盖板之间的封装胶；基板上定义有显示区和围绕显示区的非显示区，封装胶位于非显示区且围绕显示区；位于封装胶包围圈外侧的基板边缘和/或盖板边缘形成有薄化部。单个显示面板是通过对母板进行切割而得到的，显示面板的基板边缘和盖板边缘即显示面板母板的切割位置，在两边缘位置即切割位置设置薄化部，即可减小切割产生的应力，避免边缘因切割应力而出现的崩边问题，继而避免了崩边对封装胶的影响，以保证封装效果，从而保证显示面板较高的生产良率。
【附图说明】
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是用于制造本申请显示面板的显示面板母板的一种结构示意图；
图2是用于制造本申请显示面板的显示面板母板的另一种结构示意图；
图3是用于制造本申请显示面板的显示面板母板的又一种结构示意图；
图4是图3所示显示面板母板中缓冲垫的结构示意图；
图5是图3所示显示面板母板中多个缓冲垫的分布图；
图6是本申请显示面板一实施例的结构示意图；
图7是本申请显示面板另一实施例的结构示意图；
图8是本申请显示面板又一实施例的结构示意图；
图9是本申请显示装置一实施例的结构示意图；
图10是本申请显示面板的制造方法一实施例的流程示意图。
【具体实施方式】
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
显示面板是由一块巨大的母板切割而成，本申请的设计思路适应于零排版的母板，即每个显示面板之间的间隔为零或趋近于零，在使用刀轮对该母板进行切割时，可能会造成切割所得的显示面板出现崩边的问题，即在显示面板的边缘出现崩边的情况，而显示面板中所设置的封装胶离边缘较近，因而边缘的崩边会影响到封装胶与基板间的粘附，造成封装失效。为了减小切割的影响，本申请提出一种显示面板母板，通过对切割位置进行薄化设计，以减小切割应力，减小切割造成的不良影响。具体请参阅图1，图1是用于制造本申请显示面板的显示面板母板的结构示意图。
显示面板母板100包括基板母板11、盖板母板12以及封装胶13；基板母板11和盖板母板12对合设置后，二者之间通过封装胶13实现封装。
一般在基板母板11上设置驱动电路、显示单元等，以在基板母板11上形成显示区111；基板母板11用于制得多少个显示面板，即在其上形成有多少个显示区111。另外，围绕显示区111则为非显示区114。
在制得显示面板母板100时，可将封装胶13形成在基板母板11或盖板母板12上，然后将盖板母板12盖合于基板母板11，使得每个封装胶13围绕一个显示区111，实现对显示区111的密封。在当前OLED显示面板的应用中，本实施例中的这种封装方式可以称为Frit（玻璃粉）封装，即封装胶13可采用Frit材料。
对于盖合后形成的显示面板母板100，从各元件的位置关系上来看，显示区111位于封装胶13包围圈的内侧I，而位于封装胶13外侧O的部分则作为最终制得的显示面板的边缘部分，对显示面板母板100进行切割的切割处A-A也是位于封装胶13外侧O的部分。
本实施例中，对切割处A-A采用薄化处理的方式，以减小应力的作用。即对于显示面板母板100，其位于封装胶13外侧O的基板母板11上形成有基板薄化部112，即对基板母板11进行薄化处理，例如可采用刻蚀或激光切除等工艺，使得处理后的基板薄化部112的厚度小于基板母板11原先的厚度，具体来说，薄化部112厚度为原先厚度的40%~80%。在该基板薄化部112进行切割时，即可一定程度的减小应力，减小崩边影响。
并且，当封装胶13距离切割处A-A较近，即显示面板采用窄边框设计，例如两显示面板相邻封装胶13之间的距离范围为0~400μm时，若不进行薄化处理，切割的应力可能影响封装胶13的封装强度，即本实施例中切割处A-A的薄化处理还可减小切割对封装胶13的影响。
采用本实施例的设计思路，切割得到的显示面板的边缘较薄，强度减弱，因而为了保证显示面板边缘的强度，减少薄化部112对封装胶13的影响，本实施例中薄化部112与封装胶13在基板母板11上的正投影相互间隔，且薄化部112的宽度为封装胶13之间宽度的50%~90%。
在封装胶13外侧O，需要同时对基板母板11和盖板母板12进行切割，因而还可进一步在盖板母板12上形成盖板薄化部122。基于本实施例的设计思路，可仅在基板母板11或盖板母板12上形成薄化部，也可在二母板上均形成薄化部。
图1所示即对基板母板11和盖板母板12均进行薄化处理，且两母板上薄化部的形状尺寸相同。薄化部均为凹槽形状，其中，一母板的凹槽开口方向背离另一母板，即对基板母板11和盖板母板12的外表面进行薄化处理，例如刻蚀处理，以形成薄化部。其他实施例中，一母板上所形成的凹槽开口方向也可朝向另一母板。
由于薄化处理可能是在基板母板11或盖板母板12上未形成其他层时进行的，例如将玻璃基板作为基板母板11或盖板母板12时，所提供的玻璃基板即可预先进行薄化处理。而在后续工艺中，需要在玻璃基板上沉积驱动电路及发光单元，为避免薄化后形成的凹槽影响沉积工艺，因此，一般对基板母板11和盖板母板12的外表面进行薄化处理，使得一母板上的凹槽开口方向背离另一母板。
图1所示实施例中，显示面板母板100的切割位置均采用了薄化处理，薄化部可能会在工艺制程中发生断裂。因此还可采用不同方式的薄化处理，使得薄化部具有一定的强度。例如图2和图3所示，图2是用于制造本申请显示面板的显示面板母板的另一种结构示意图，图3是用于制造本申请显示面板的显示面板母板的又一种结构示意图。
例如在图2中，在封装胶13包围圈外侧的基板母板11和/或盖板母板12的薄化部上形成有凸起，以基板母板11为例，其薄化部112上形成有凸起113，即在对基板母板11进行薄化处理时，仅对部分区域进行刻蚀处理，保留部分形成凸起113，以保证薄化部112的强度，即该凸起113的厚度可以是基板母板11原先的厚度。
凸起113仅起到加强薄化部的作用，因而在对母板100进行切割时，切割位置A-A需避开凸起113，以保证切割质量。
在图3中，则采用基板母板11和盖板母板12之间设置缓冲垫14的方式，缓冲垫14位于封装胶13包围圈外侧O，对应薄化部设置，图3的实施例利用缓冲垫14来加强薄化部的强度。缓冲垫14的高度可以是基板母板11和盖板母板12之间空隙高度的一半以上，缓冲垫14可以形成在基板母板11上，也可形成在盖板母板12上；其材料可以是Frit玻璃粉，也可以是有机胶。若为Frit玻璃粉，可以在制造形成封装胶13的同时形成缓冲垫14。
缓冲垫14除了起到加强薄化部的作用，还可用于释放切割应力，即在对母板100进行切割时，刀轮可垫在缓冲垫上，避免崩边问题，可进一步的保证切割质量。由于缓冲垫14也用于承载刀轮的切割，因而为避免其对封装胶13的影响，也将二者设计为相互间隔。
此外，缓冲垫14可以设计为多种形状，如图4所示，图4是图3所示显示面板母板中缓冲垫的结构示意图。其中，缓冲垫14包括靠近盖板母板11的上缓冲部141和靠近基板母板12的下缓冲部142，上缓冲部141的面积小于下缓冲部142的面积。
当刀轮从盖板母板11开始切割时，由于本实施例中下缓冲部142的尺寸较大，因而可进一步的起到支撑作用，且对于图4中（a），上缓冲部141形成凹槽形状，因而在切割时，可用于引导刀轮，更利于刀轮切割过程的稳定性。
本实施例中通过设置薄化部，以保证对显示面板母板100的切割质量，因而薄化部为连续的，即显示面板的切割边缘均形成有薄化部。而缓冲垫14主要用于加强薄化部，因此缓冲垫14可以不是连续的，切割处并不是一定需要有缓冲垫14，对应于一个显示面板，缓冲垫14可以是多个，而多个缓冲垫14可围绕显示区111均匀分布，可参阅图5，图5是图3所示显示面板母板中多个缓冲垫的分布图。
对上述显示面板母板100进行切割，可得到的高切割质量的显示面板，所得到显示面板的结构可参阅图6，图6是本申请显示面板一实施例的结构示意图。其中，显示面板200包括基板21、盖板22以及封装胶23。
对应于上述显示面板母板100的结构，本实施例显示面板200的基板21上定义有显示区211和非显示区214，盖板22通过封装胶23封装于基板21上，封装胶23位于非显示区214，围绕显示区211设置，使得显示区211位于封装胶23包围圈内侧，而在位于封装胶23包围圈外侧的基板21边缘和/或盖板22边缘则形成有薄化部212或222。
其中，显示面板200的结构来源于上述显示面板100母板，例如薄化部212（222）与封装胶23在基板21的正投影可相互间隔，薄化部212（222）占封装胶23到面板边缘距离的50%~90%等，其他不再赘述。
如上述显示面板母板100中薄化部可以采用不同的结构设计，因而切割所获得的显示面板也可有多种结构，如图7和图8所示，图7是本申请显示面板另一实施例的结构示意图，图8是本申请显示面板又一实施例的结构示意图。
图7中，封装胶23包围圈外侧的基板21边缘和/或盖板22边缘的薄化部212或222上分别形成有凸起213或223。
图8中，基板21和盖板22之间还设置有缓冲垫24，位于封装胶23包围圈外侧，且缓冲垫24用于加强薄化部212（222）的强度，因而缓冲垫24对应薄化部212（222）设置，薄化部212（222）与缓冲垫24在基板21的正投影相互重叠。
其中，缓冲垫24的形状及布局与上述显示面板母板100中的类似，不再赘述。此外，由于显示面板200为切割所得，因而切割后该缓冲垫24的外侧面与基板的侧面平齐，切割平齐。
上述切割得到的显示面板200边缘采用薄化设计，可减小切割时产生的应力，避免边缘因切割应力而出现的崩边，继而影响封装效果的问题。并且在显示面板200中还在薄化部设置凸起或缓冲垫，保证薄化部的强度，避免工艺过程中出现断裂。其中，缓冲垫还可在切割时进一步释放切割应力，避免崩边问题。因而本实施例显示面板200具有较高的切割质量，及较好的封装效果。
上述显示面板具体可应用于显示装置中，本申请还提出一种显示装置，请参阅图9，图9是本申请显示装置一实施例的结构示意图。
本实施例显示装置300包括显示面板31，该显示面板31与上述显示面板200类似，具体不再赘述。显示装置300可以为手机、电脑、平板、电视等可实现显示的电子设备。
对于上述显示面板，其制造过程请参阅图10，图10是本申请显示面板的制造方法一实施例的流程示意图。该制造方法包括以下步骤。
S101：提供一基板母板。
所提供的基板母板上定义有多个显示区和多个非显示区，非显示区围绕显示区，且在基板母板上显示面板区域的边缘形成有薄化部。该步骤S101可进一步包括：对基板母板进行薄化处理；在基板母板上形成驱动电路及显示单元以形成显示区。
S102：提供一盖板母板。
盖板母板上设置有多个封装胶，且盖板母板上显示面板区域的边缘也可形成有薄化部。该步骤S102可进一步包括：在盖板母板上形成封装胶。若还需设置缓冲垫以保护薄化部，则本步骤还可包括：在盖板母板上形成缓冲垫。
S103：将盖板母板与基板母板盖合。
将盖板母板和基板母板对位盖合后，每一封装胶位于一非显示区且围绕一显示区设置，显示区位于封装胶包围圈内侧。
S104：沿着薄化部的位置对基板母板和盖板母板进行切割。
在进行切割后，即可得到多个显示面板。
在采用上述方法制造得到的显示面板具有上述图6-图8的结构，即在显示面板的边缘处形成有薄化部，在最后切割得到显示面板时，能够保证显示面板的边缘不出现崩边，继而影响封装效果的问题，其切割质量高，可获得高质量的显示面板，在生产中采用上述方法制造显示面板也可获得较高的产品良率。而采用上述方法制得的显示面板作为产品出售时，薄化部可能被磨掉，因而薄化部被磨掉的显示面板也认为是本申请所保护的范围。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种显示面板，包括：
    基板，所述基板上定义有显示区和围绕所述显示区的非显示区；
    封装胶，所述封装胶位于所述非显示区且围绕所述显示区设置；及
    盖板，所述盖板通过所述封装胶设置于所述基板上；
    其中，位于所述封装胶包围圈外侧的所述基板边缘和/或所述盖板边缘形成有薄化部。
  2. 根据权利要求1所述的显示面板，其中，所述薄化部上形成有凸起，所述凸起在垂直于所述基板的方向上延伸远离所述封装胶。
  3. 根据权利要求1所述的显示面板，其中，所述薄化部与所述封装胶在所述基板的正投影相互间隔。
  4. 根据权利要求3所述的显示面板，其中，所述薄化部宽度占所述封装胶到所述面板边缘距离的50%~90%。
  5. 根据权利要求1所述的显示面板，其中，所述显示面板进一步包括缓冲垫，所述缓冲垫设置于所述基板和所述盖板之间，且位于所述封装胶包围圈外侧。
  6. 根据权利要求5所述的显示面板，其中，所述薄化部与所述缓冲垫在所述基板的正投影相互重叠。
  7. 根据权利要求5所述的显示面板，其中，所述缓冲垫的外侧面与所述基板的侧面平齐，且所述缓冲垫与所述封装胶相互间隔。
  8. 根据权利要求5所述的显示面板，其中，所述缓冲垫的个数为多个，多个所述缓冲垫围绕所述显示区均匀分布。
  9. 根据权利要求5所述的显示面板，其中，所述缓冲垫包括靠近所述盖板的上缓冲部和靠近所述基板的下缓冲部，所述上缓冲部的面积小于所述下缓冲部的面积。
  10. 根据权利要求9所述的显示面板，其中，所述上缓冲部靠近所述盖板的一侧形成有凹槽。
  11. 一种显示装置，包括显示面板，其中，所述显示面板包括：基板、盖板及封装胶，所述基板上定义有显示区和围绕所述显示区的非显示区，所述封装胶位于所述非显示区且围绕所述显示区设置，所述盖板通过所述封装胶设置于所述基板上；
    其中，位于所述封装胶包围圈外侧的所述基板边缘和/或所述盖板边缘形成有薄化部。
  12. 根据权利要求11所述的显示装置，其中，所述薄化部上形成有凸起，所述凸起在垂直于所述基板的方向上延伸远离所述封装胶。
  13. 根据权利要求11所述的显示装置，其中，所述薄化部与所述封装胶在所述基板的正投影相互间隔。
  14. 根据权利要求13所述的显示装置，其中，所述薄化部宽度占所述封装胶到所述面板边缘距离的50%~90%。
  15. 根据权利要求11所述的显示装置，其中，所述显示面板进一步包括缓冲垫，所述缓冲垫设置于所述基板和所述盖板之间，且位于所述封装胶包围圈外侧。
  16. 根据权利要求15所述的显示装置，其中，所述薄化部与所述缓冲垫在所述基板的正投影相互重叠。
  17. 根据权利要求15所述的显示装置，其中，所述缓冲垫的外侧面与所述基板的侧面平齐，且所述缓冲垫与所述封装胶相互间隔。
  18. 根据权利要求15所述的显示装置，其中，所述缓冲垫的个数为多个，多个所述缓冲垫围绕所述显示区均匀分布。
  19. 根据权利要求15所述的显示装置，其中，所述缓冲垫包括靠近所述盖板的上缓冲部和靠近所述基板的下缓冲部，所述上缓冲部的面积小于所述下缓冲部的面积。
  20. 一种显示面板的制造方法，所述方法包括：
    提供一基板母板，所述基板母板上定义有多个显示区和多个非显示区，每一所述非显示区围绕一所述显示区；
    提供一盖板母板，所述盖板母板上设置有多个封装胶；
    将所述盖板母板与所述基板母板盖合，每一所述封装胶位于一所述非显示区且围绕一所述显示区；其中，位于所述封装胶包围圈外侧的所述基板母板和/或所述盖板母板形成薄化部；
    沿着所述薄化部的位置对所述基板母板和所述盖板母板进行切割得到多个所述显示面板。
PCT/CN2019/076362 2018-10-30 2019-02-27 显示面板、显示装置及显示面板的制造方法 Ceased WO2020087816A1 (zh)

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CN111474749B (zh) * 2020-04-30 2022-08-12 厦门天马微电子有限公司 液晶显示面板的制作方法、液晶显示面板及液晶显示装置
CN114039011B (zh) * 2021-10-19 2023-07-28 昆山国显光电有限公司 一种显示装置
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