WO2024016702A1 - 显示面板及显示终端 - Google Patents

显示面板及显示终端 Download PDF

Info

Publication number
WO2024016702A1
WO2024016702A1 PCT/CN2023/083200 CN2023083200W WO2024016702A1 WO 2024016702 A1 WO2024016702 A1 WO 2024016702A1 CN 2023083200 W CN2023083200 W CN 2023083200W WO 2024016702 A1 WO2024016702 A1 WO 2024016702A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
substrate
display area
inorganic
orthographic projection
Prior art date
Application number
PCT/CN2023/083200
Other languages
English (en)
French (fr)
Inventor
倪晶
汪衎
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US18/195,593 priority Critical patent/US20240032396A1/en
Publication of WO2024016702A1 publication Critical patent/WO2024016702A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/142—Energy conversion devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of display technology, and in particular, to a display panel and a display terminal.
  • OLED Organic Light Emitting Diode
  • the commonly used substrates for flexible OLED display panels are mostly flexible substrates such as polyimide.
  • Thin film transistors control the OLED light-emitting devices through signal control on the substrate.
  • Inorganic and organic overlapping encapsulation layers cover OLED light-emitting devices to achieve water and oxygen protection.
  • the touch film layer is covered on the encapsulation layer to realize the touch function.
  • the inorganic layer in the touch film layer often uses an inorganic film with greater stress.
  • the inorganic film with greater stress will appear far away from the display area during the preparation process. Peeling at the borders, especially the lower border area of the display panel. Therefore, it is necessary to improve this defect.
  • Embodiments of the present invention provide a display panel, which is used to solve the technical problem in the prior art display panel that the highly stressed inorganic film peels off at the boundary away from the display area during the preparation process.
  • An embodiment of the present invention provides a display panel, which includes a display area and a non-display area arranged on at least one side of the display area.
  • the non-display area includes a second bending area close to the display area.
  • the display panel It includes a substrate, a first inorganic layer, an organic protective layer, a light-emitting functional layer, an encapsulation layer and a second inorganic layer; the first inorganic layer is arranged on one side of the substrate and in the second bending area A slot is provided; the organic protective layer is arranged on a side of the first inorganic layer away from the substrate and covers the slot; the light-emitting functional layer is arranged on a side of the first inorganic layer away from the substrate.
  • the light-emitting functional layer includes light-emitting pixels arranged in the display area; the encapsulating layer is arranged on the side of the light-emitting functional layer away from the substrate, and the encapsulating layer is separated from the display area.
  • the area extends to the non-display area, and there is a first spacing between the boundary of the encapsulation layer and the groove; the second inorganic layer is disposed on a side of the encapsulation layer away from the substrate, and the The second inorganic layer extends from the display area to the non-display area and beyond the boundary of the encapsulation layer; wherein the second inorganic layer includes a plurality of openings away from the boundary of the display area.
  • An embodiment of the present invention also provides a display terminal, which includes a terminal body and a display panel.
  • the terminal body and the display panel are combined into one body.
  • the display panel includes a display area and a non-display area disposed on at least one side of the display area.
  • a display area, the non-display area includes a second bending area close to the display area, and the display panel includes:
  • a first inorganic layer is provided on one side of the substrate, and is provided with grooves in the second bending area;
  • An organic protective layer disposed on the side of the first inorganic layer away from the substrate, and covering the groove;
  • a light-emitting functional layer arranged on a side of the first inorganic layer away from the substrate, the light-emitting functional layer including light-emitting pixels arranged in the display area;
  • An encapsulation layer is provided on the side of the light-emitting functional layer away from the substrate.
  • the encapsulation layer extends from the display area to the non-display area. There is a gap between the boundary of the encapsulation layer and the groove. first spacing;
  • a second inorganic layer is provided on a side of the encapsulation layer away from the substrate, the second inorganic layer extends from the display area to the non-display area and beyond the boundary of the encapsulation layer;
  • the second inorganic layer includes a plurality of openings away from the boundary of the display area.
  • the internal stress of the film layer at the boundary of the second inorganic layer away from the display area can be reduced, thereby reducing the stress at the boundary of the second inorganic layer away from the display area.
  • the risk of peeling effectively improves the problem that the highly stressed second inorganic layer in the lower frame area of the display panel is prone to peeling away from the boundary of the display area during the preparation process.
  • FIG. 1 is a schematic diagram of the basic structure of a display panel provided by an embodiment of the present invention.
  • Figures 2a to 2d are top views of areas A-A’ in the display panel of Figure 1.
  • Figure 3 is a stress comparison diagram of the surface of the organic protective layer before and after improvement provided by the embodiment of the present invention.
  • Figure 4 is a schematic diagram of the basic structure of the slot provided by the embodiment of the present invention.
  • 5a and 5b are schematic diagrams of the basic structure of a touch electrode layer provided by an embodiment of the present invention.
  • the inorganic layer in the touch film layer often uses an inorganic film with greater stress.
  • the inorganic film with greater stress will appear to be far away from the display during the preparation process.
  • embodiments of the present invention can solve the above defects.
  • the display panel includes a display area A1 and a There is a non-display area A2 on at least one side of the display area A1.
  • the display area A1 includes a first bending area A10 close to the non-display area A2, and the non-display area A2 includes a second bending area A20 close to the first bending area A10.
  • the display panel provided by the embodiment of the present invention is a curved display panel.
  • the first bending area A10 is arranged close to the non-display area A2, the bending arc of the first bending area A10 is greater than 0 and less than or equal to 90 degrees, and the curved surface formed by the first bending area A10 also has a display function; the second The bending area A20 is used to further bend the integrated circuit chip (not shown) in the non-display area A2 to the back of the display panel to reduce the size of the lower part. borders to increase the screen-to-body ratio.
  • the display panel includes a substrate 1, a first inorganic layer 2, an organic protective layer 4, a light-emitting functional layer 5, an encapsulation layer 6 and a second inorganic layer 7;
  • the first inorganic layer 2 is disposed on the substrate 1 One side, and a groove 3 is provided in the second bending area A20;
  • the organic protective layer 4 is provided on the side of the first inorganic layer 2 away from the substrate 1, and covers the groove 3;
  • the light-emitting functional layer 5 is provided on the first
  • the inorganic layer 2 is on the side away from the substrate 1, and the light-emitting functional layer 5 includes light-emitting pixels 502 arranged in the display area A1;
  • the encapsulation layer 6 is arranged on the side of the light-emitting functional layer 5 away from the substrate 1, and the encapsulating layer 6 is located on the side of the inorganic layer 2 away from the substrate 1.
  • the second inorganic layer 7 is provided on the side of the encapsulation layer 6 away from the substrate 1, and the second inorganic layer 7 is separated from the display area A1 extends to the non-display area A2 and exceeds the boundary of the encapsulation layer 6; wherein, the second inorganic layer 7 includes a plurality of openings 701 away from the boundary of the display area A1.
  • the second inorganic layer 7 in the touch film layer located on the encapsulation layer 6 needs to use a high-stress inorganic layer. film to improve the effect of covering the encapsulation layer 6.
  • the internal stress of the film layer at the boundary of the second inorganic layer 7 away from the display area A1 can be reduced, thereby reducing the stress of the second inorganic layer. 7.
  • the risk of peeling off at the boundary far away from the display area A1 effectively improves the problem that the highly stressed second inorganic layer 7 in the lower frame area of the display panel is prone to peeling off at the boundary far away from the display area A1 during the preparation process.
  • the opening 701 is not formed after the second inorganic layer 7 is formed, but is formed together during the film formation process of the second inorganic layer 7.
  • the area corresponding to the opening 701 can be blocked by a photomask, so that the corresponding The area of opening 701 is free of material deposition. If the second inorganic layer 7 is formed first and then the opening 701 is formed, the internal stress of the second inorganic layer 7 cannot be reduced.
  • organic filling material 301 is provided in slot 3; organic protective layer 4 covers organic filling material 301.
  • first inorganic layers 2 are also provided between the substrate 1 and the source electrode 504, the drain electrode 505, the power line 506 and the signal line 507. Since the flexibility of the plurality of first inorganic layers 2 is poor, therefore, in this embodiment, grooves 3 are provided on the plurality of first inorganic layers 2 at positions corresponding to the second bending areas A20, and then organic filling materials 301 are placed in the grooves 3 to enhance the flexibility of the second bending areas A20.
  • the light-emitting functional layer 5 includes an anode layer 501, a light-emitting pixel 502 and a cathode layer 503.
  • a planarization layer 508 is provided between the anode layer 501 and the source electrode 504, the drain electrode 505, the power line 506 and the signal line 507.
  • the anode layer 501 is electrically connected to the drain electrode 505 through the via hole on the planarization layer 508.
  • the display panel also includes a pixel definition layer 509 located on the planarization layer 508 and the anode layer 501.
  • the pixel definition layer 509 includes a plurality of pixel openings, and the light-emitting pixels 502 are located in the pixel openings.
  • the planarization layer 508 and the pixel definition layer 509 are both organic film layers.
  • the display panel further includes a retaining wall structure located in the non-display area A2.
  • the retaining wall structure includes a first bank portion 510 disposed close to the display area A1, and a first bank portion 510 located away from the display area A1.
  • the second bank portion includes a first sub-bank portion 511 and a second sub-bank portion 512 located on a side surface of the first sub-bank portion 511 away from the substrate 1 , wherein the first sub-bank portion 511
  • the first bank portion 510 and the second sub-bank portion 512 are formed in the same process as the planarization layer 508 and the pixel definition layer 509 are formed in the same process.
  • a plurality of organic protective layers 4 are stacked along the direction of the light exit side of the display panel, specifically a first organic protective layer 401, a second organic protective layer 402 and a third organic protective layer 403; wherein, the first organic protective layer
  • the protective layer 401 is provided in the same layer as the planarization layer 508 located in the display area A1; the second organic protective layer 402 is provided in the same layer as the pixel definition layer 509 located in the display area A1; and the third organic protective layer 403 is a support pillar.
  • the signal line 507 in the display area A1 needs to be electrically connected to the integrated circuit chip (not shown) through the second bending area A20.
  • the signal line 507 will be routed between the organic filling material 301 and the substrate 1 or from the organic filling material. 301 and the organic protective layer 4.
  • the first organic protective layer 401 and the second organic protective layer 402 are used to planarize the signal line 507
  • the third organic protective layer 403 is used to support the mask used when forming the light-emitting pixel 502.
  • the first organic protective layer 401 and the planarization layer 508 are formed in the same process, and the second organic protective layer 402 and the pixel definition layer 509 are formed in the same process.
  • the orthographic projection of the second inorganic layer 7 on the substrate 1 partially overlaps the orthographic projection of the organic protective layer 4 on the substrate 1 . That is, the second inorganic layer 7 overlaps with the organic protective layer 4 at the boundary away from the display area A1.
  • the orthographic projection of the plurality of openings 701 on the substrate 1 overlaps with the orthographic projection of the side surface of the organic protective layer 4 away from the substrate 1 on the substrate 1 .
  • the internal stress of the film layer in the overlapping portion of the second inorganic layer 7 and the organic protective layer 4 can be reduced, and the stress between the second inorganic layer 7 and the organic protective layer 4 can also be reduced.
  • the interlayer stress between the layers 4 can reduce the risk of peeling between the second inorganic layer 7 and the organic protective layer 4 .
  • the orthographic projection of the plurality of openings 701 on the substrate 1 overlaps with the orthographic projection of the bevel on the side of the organic protective layer 4 close to the display area on the substrate 1 .
  • the inter-film stress between the second inorganic layer 7 and the slope of the organic protective layer 4 can be reduced, thereby reducing the stress between the second inorganic layer 7 and the slope of the organic protective layer 4. Risk of delamination between layer 7 and organic protective layer 4.
  • the stress in the film layer in the area where the orthographic projection of the second inorganic layer 7 on the substrate 1 overlaps with the orthographic projection of the organic protective layer 4 on the substrate 1 is less than that of the second inorganic layer 7 on the substrate. There is internal stress in the film layer in the area where the orthographic projection on the substrate 1 and the orthographic projection of the organic protective layer 4 on the substrate 1 do not overlap.
  • this embodiment can reduce the occurrence of peeling between the second inorganic layer 7 and the organic protective layer 4 by setting the internal stress of the film layer in the area where the second inorganic layer 7 and the organic protective layer 4 overlap to be smaller. risks of.
  • the internal stress of the film layer in the area where the orthographic projection of the second inorganic layer 7 on the substrate 1 does not overlap with the orthographic projection of the organic protective layer 4 on the substrate 1 is greater than that of the first inorganic layer 2 Intralayer stress.
  • the area where the second inorganic layer 7 does not overlap with the organic protective layer 4 is in contact with the first inorganic layer 2.
  • the film layer of the area where the second inorganic layer 7 does not overlap with the organic protective layer 4 is in contact with the first inorganic layer 2.
  • the internal stress is set to be greater than the internal stress of the film layer of the first inorganic layer 2, which can improve the bonding effect of the second inorganic layer 7 and the first inorganic layer 2.
  • the encapsulation layer 6 includes a first inorganic encapsulation layer 601, an organic encapsulation layer 602 and a second inorganic encapsulation layer 603; the first inorganic encapsulation layer 601 is located on the side of the light-emitting functional layer 5 away from the substrate 1; the organic The encapsulation layer 602 is located on the side of the first inorganic encapsulation layer 601 away from the substrate 1; the second inorganic encapsulation layer 603 is located on the side of the organic encapsulation layer 602 away from the substrate 1; wherein, the second inorganic layer 7 is on the substrate 1
  • the internal stress of the film layer in the area where the orthographic projection does not overlap with the orthographic projection of the organic protective layer 4 on the substrate 1 is greater than the internal stress of the film layer of the second inorganic encapsulation layer 603 .
  • the second inorganic layer 7 can cover the encapsulation layer 6 The effect is better.
  • the orthographic projection of the second inorganic layer 7 on the substrate 1 and the side surface of the organic protective layer 4 away from the substrate 1 are in the same direction.
  • the area on which the orthographic projection overlaps has a width b greater than or equal to 10 microns.
  • the width b of the overlapping area of the second inorganic layer 7 and the organic protective layer 4 is set to greater than or equal to 10 microns, the overlap width between the second inorganic layer 7 and the lower organic protective layer 4 is avoided from being too small. stripping problem.
  • the distance a from the boundary of the second inorganic layer 7 away from the display area A1 to one end of the groove 3 close to the display area A1 is greater than or equal to 5 microns. .
  • the distance a is the pre-bending area.
  • the distance a between the second inorganic layer 7 and the slot 3 is A distance a is set between them and a is greater than or equal to 5 microns to avoid peeling off between the second inorganic layer 7 and the organic protective layer 4 when the bending arc is too large during the bending process.
  • the plurality of openings 701 are arranged in the row direction and the column direction respectively (as shown in Figure 2a).
  • Figure 2a 3 rows and 15 columns are used as an example. Specifically, how many rows and columns are there? It depends on the area of the second inorganic layer 7 beyond the boundary of the encapsulation layer 6 , the width n of the opening 701 and the distance m between the centers of two adjacent openings 701 .
  • multiple openings 701 are arranged in rows, and one opening 701 is located in the area between two adjacent openings 701 in an adjacent row (as shown in Figure 2b).
  • the shape of the opening 701 is a circle (as shown in Figure 2d), a triangle, a rectangle (as shown in Figures 2a and 2b), a rhombus ( as shown in Figure 2c).
  • the present invention is not limited to this.
  • the shape of the opening 701 can also be any other regular pattern.
  • the width n of the opening 701 is greater than or equal to 3 microns, and the distance m between the centers of two adjacent openings 701 is greater than or equal to 5 microns. It can be understood that in this embodiment, by setting the width n of the opening 701 to be greater than or equal to 3 microns, and setting the distance m between the centers of two adjacent openings 701 to be greater than or equal to 5 microns, better results can be achieved. The effect of reducing the internal stress of the second inorganic layer 7 .
  • FIG. 3 is a stress comparison diagram of the surface of the organic protective layer before and after improvement provided by the embodiment of the present invention.
  • the organic protective layer here is the third organic protective layer 403 in contact with the second inorganic layer 7 , where, before the improvement (no opening 701 is provided on the second inorganic layer 7), the stress on the side surface of the third organic protective layer 403 in contact with the second inorganic layer 7 is 4.7 MPa; after the improvement (the second inorganic layer 7 7 is provided with an opening 701), and the stress on the side surface of the third organic protective layer 403 in contact with the second inorganic layer 7 is 4.2 MPa. That is, the embodiment of the present invention found through simulation that the film layer stress can be significantly reduced by about 10% before and after improvement.
  • FIG 4 is a schematic diagram of the basic structure of a slot according to an embodiment of the present invention.
  • a barrier layer 201, a buffer layer 202, and an active layer are arranged in sequence between the substrate 1, the source electrode 504, and the drain electrode 505. 21.
  • the source electrode 504 and the drain electrode 505 are located on the interlayer insulating layer 205, and the source electrode 504 and the drain electrode 505 are electrically connected to both ends of the active layer 21 respectively.
  • the groove 3 penetrates the interlayer insulating layer 205, the second gate insulating layer 204, the first gate insulating layer 203, the buffer layer 202 and the barrier layer 201 in order from top to bottom.
  • Figures 5a and 5b are schematic diagrams of the basic structure of a touch electrode layer according to an embodiment of the present invention.
  • the display panel includes a touch electrode layer 8, and the touch electrode layer 8 is located between the packaging layer 6 and the first between the two inorganic layers 7 (as shown in Figure 5a); or the touch electrode layer 8 is located on the side of the second inorganic layer 7 away from the encapsulation layer 6 (as shown in Figure 5b).
  • the second inorganic layer 7 provided in the embodiment of the present invention is an inorganic layer in the touch film layer.
  • the second inorganic layer 7 may be an inorganic layer covering the touch electrode layer 8 or an inorganic layer within the touch electrode layer 8 .
  • the display panel also includes a protective layer 9 covering the touch electrode layer 8 .
  • An embodiment of the present invention also provides a display terminal, which includes a terminal body and the above-mentioned display panel.
  • the terminal body and the display panel are combined into one body.
  • the display terminal provided by the embodiment of the present invention may be: a mobile phone, a tablet computer, a notebook computer, a television, a digital camera, a navigator and other products or components with display functions.

Abstract

本发明提供一种显示面板及显示终端，显示面板包括显示区和非显示区，非显示区包括第二弯折区，显示面板包括衬底、第一无机层、有机保护层、发光功能层、封装层以及第二无机层；第二无机层设置在封装层远离衬底的一侧，第二无机层从显示区延伸至非显示区，超出封装层的边界，第二无机层远离显示区的边界处包括多个开口。

Description

显示面板及显示终端 技术领域
本申请涉及显示技术领域，尤其涉及一种显示面板及显示终端。
 背景技术
有机发光二极管(Organic Light Emitting Diode，OLED)在固态照明和平板显示的方向拥有巨大的发展潜力，得到了学术界和产业界的极大关注。OLED平板可以做的更轻、更薄，因而柔性OLED显示技术将是未来的发展趋势。柔性OLED显示面板常用的衬底多为聚酰亚胺等柔性衬底，薄膜晶体管在衬底上通过信号的控制，实现对OLED发光器件的调控。无机、有机交叠的封装层对OLED发光器件进行包覆，以实现水氧防护。触控膜层在封装层上进行覆盖，以实现触控功能。
随着显示面板对弯折及大角度盖板形态的要求越来越高，对屏体极限的挑战也越来越大。在这种情况下，为了适配更高要求的盖板，触控膜层中的无机层往往会采用应力较大的无机膜，然而应力较大的无机膜在制备过程中会出现远离显示区的边界处剥离(peeling)的情况，尤其是显示面板的下边框区域。故，有必要改善这一缺陷。
 技术问题
本发明实施例提供一种显示面板，用于解决现有技术的显示面板中大应力的无机膜在制备过程中远离显示区的边界处发生剥离的技术问题。
 技术解决方案
本发明实施例提供一种显示面板，包括显示区和设置在所述显示区至少一侧的非显示区，所述非显示区包括靠近所述显示区的第二弯折区，所述显示面板包括衬底、第一无机层、有机保护层、发光功能层、封装层以及第二无机层；所述第一无机层设置在所述衬底的一侧，并在所述第二弯折区设置有开槽；所述有机保护层设置在所述第一无机层远离所述衬底的一侧，且覆盖所述开槽；所述发光功能层设置在所述第一无机层远离所述衬底的一侧，所述发光功能层包括设置在所述显示区的发光像素；所述封装层设置在所述发光功能层远离所述衬底的一侧，所述封装层从所述显示区延伸至所述非显示区，所述封装层的边界与所述开槽之间存在第一间距；所述第二无机层设置在所述封装层远离所述衬底的一侧，所述第二无机层从所述显示区延伸至所述非显示区，且超出所述封装层的边界；其中，所述第二无机层远离所述显示区的边界处包括多个开口。
本发明实施例还提供一种显示终端，包括终端主体和显示面板，所述终端主体与所述显示面板组合为一体，所述显示面板包括显示区和设置在所述显示区至少一侧的非显示区，所述非显示区包括靠近所述显示区的第二弯折区，所述显示面板包括：
衬底；
第一无机层，设置在所述衬底的一侧，并在所述第二弯折区设置有开槽；
有机保护层，设置在所述第一无机层远离所述衬底的一侧，且覆盖所述开槽；
发光功能层，设置在所述第一无机层远离所述衬底的一侧，所述发光功能层包括设置在所述显示区的发光像素；
封装层，设置在所述发光功能层远离所述衬底的一侧，所述封装层从所述显示区延伸至所述非显示区，所述封装层的边界与所述开槽之间存在第一间距；
第二无机层，设置在所述封装层远离所述衬底的一侧，所述第二无机层从所述显示区延伸至所述非显示区，且超出所述封装层的边界；
其中，所述第二无机层远离所述显示区的边界处包括多个开口。
 有益效果
本申请通过在第二无机层远离显示区的边界处设置多个开口，可以降低第二无机层远离显示区的边界处的膜层内应力，从而降低了第二无机层远离显示区的边界处发生剥离的风险，有效改善了显示面板的下边框区域大应力的第二无机层在制备过程中远离显示区的边界处容易发生剥离的问题。
 附图说明
图1是本发明实施例提供的显示面板的基本结构示意图。
图2a~图2d是图1的显示面板中A-A’区域的俯视图。
图3是本发明实施例提供的改善前后有机保护层表面的应力对比图。
图4是本发明实施例提供的开槽的基本结构示意图。
图5a和图5b是本发明实施例提供的触控电极层的基本结构示意图。
 本发明的实施方式
为使本申请的目的、技术方案及效果更加清楚、明确，以下参照附图并举实施例对本申请进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
需要说明的是，为了适配弯折及大角度盖板形态，触控膜层中的无机层往往会采用应力较大的无机膜，然而应力较大的无机膜在制备过程中会出现远离显示区的边界处剥离(peeling)的情况，尤其是显示面板的下边框区域，本发明实施例可以解决上述缺陷。
如图1和图2a~图2d所示，分别为本发明实施例提供的显示面板的基本结构示意图和图1的显示面板中A-A’区域的俯视图，显示面板包括显示区A1和设置在显示区A1至少一侧的非显示区A2，显示区A1包括靠近非显示区A2的第一弯折区A10，非显示区A2包括靠近第一弯折区A10的第二弯折区A20。需要说明的是，本发明实施例提供的显示面板为曲面显示面板。其中，第一弯折区A10靠近非显示区A2设置，第一弯折区A10的弯折弧度大于0且小于或等于90度，第一弯折区A10形成的曲面也具备显示功能；第二弯折区A20是用于在第一弯折区A10弯折之后的基础上进一步弯折，将非显示区A2内的集成电路芯片(图未示)弯折至显示面板的背部，以缩小下边框，提高屏占比。
在本实施例中，显示面板包括衬底1、第一无机层2、有机保护层4、发光功能层5、封装层6以及第二无机层7；第一无机层2设置在衬底1的一侧，并在第二弯折区A20设置有开槽3；有机保护层4设置在第一无机层2远离衬底1的一侧，且覆盖开槽3；发光功能层5设置在第一无机层2远离衬底1的一侧，发光功能层5包括设置在显示区A1的发光像素502；封装层6设置在发光功能层5远离衬底1的一侧，封装层6从显示区A1延伸至非显示区A2，封装层6的边界与开槽3之间存在第一间距c；第二无机层7设置在封装层6远离衬底1的一侧，第二无机层7从显示区A1延伸至非显示区A2，且超出封装层6的边界；其中，第二无机层7远离显示区A1的边界处包括多个开口701。
由于显示面板具有弯折形态，因此显示面板封装之后显示区A1和非显示区A2的高度存在段差，因此位于封装层6上的触控膜层中的第二无机层7需要采用大应力的无机膜，以提高覆盖封装层6的效果。本实施例通过在第二无机层7远离显示区A1的边界处设置多个开口701，可以降低第二无机层7远离显示区A1的边界处的膜层内应力，从而降低了第二无机层7远离显示区A1的边界处发生剥离的风险，有效改善了显示面板的下边框区域大应力的第二无机层7在制备过程中远离显示区A1的边界处容易发生剥离的问题。
需要说明的是，开口701并不是在形成第二无机层7之后形成的，而是在第二无机层7成膜的过程中一同形成的，对应开口701的区域可以采用光罩遮挡，使得对应开口701的区域不沉积材料。若先形成第二无机层7，再形成开口701，则无法降低第二无机层7的膜层内应力。
在一种实施例中，开槽3内设置有有机填充材料301；有机保护层4覆盖有机填充材料301。
需要说明的是，衬底1与源极504、漏极505、电源线506以及信号线507之间还设置有多个第一无机层2，由于多个第一无机层2的柔性较差，因此本实施例在多个第一无机层2上对应第二弯折区A20的位置设置开槽3，然后在开槽3内设置有机填充材料301，以增强第二弯折区A20的柔性。
需要说明的是，发光功能层5包括阳极层501、发光像素502以及阴极层503。阳极层501与源极504、漏极505、电源线506以及信号线507之间设置有平坦化层508，阳极层501通过平坦化层508上的过孔与漏极505电连接。显示面板还包括位于平坦化层508和阳极层501上的像素定义层509，像素定义层509包括多个像素开口，发光像素502位于像素开口内。其中，平坦化层508和像素定义层509均为有机膜层。
在一种实施例中，显示面板还包括位于非显示区A2的挡墙结构，挡墙结构包括靠近显示区A1设置的第一堤部510，以及位于第一堤部510远离显示区A1的一侧的第二堤部，第二堤部包括第一子堤部511以及位于第一子堤部511远离衬底1的一侧表面的第二子堤部512，其中，第一子堤部511与平坦化层508同制程形成，第一堤部510和第二子堤部512与像素定义层509同制程形成。
需要说明的是，沿显示面板的出光侧方向层叠设置有多个有机保护层4，具体为第一有机保护层401、第二有机保护层402以及第三有机保护层403；其中，第一有机保护层401与位于显示区A1内的平坦化层508同层设置；第二有机保护层402与位于显示区A1内的像素定义层509同层设置；第三有机保护层403为支撑柱。
显示区A1内的信号线507需要经过第二弯折区A20与集成电路芯片(图未示)电连接，信号线507会从有机填充材料301与衬底1之间走线或从有机填充材料301与有机保护层4之间走线。其中，第一有机保护层401和第二有机保护层402用于对信号线507进行平坦化，第三有机保护层403用于支撑形成发光像素502时使用的掩膜。其中，第一有机保护层401与平坦化层508同制程形成，第二有机保护层402与像素定义层509同制程形成。
在一种实施例中，第二无机层7在衬底1上的正投影与有机保护层4在衬底1上的正投影部分重叠。即第二无机层7远离显示区A1的边界处与有机保护层4搭接。
在一种实施例中，多个开口701在衬底1上的正投影与有机保护层4远离衬底1的一侧表面在衬底1上的正投影重叠。
本实施例通过将开口701形成在有机保护层4的正上方，可以降低第二无机层7与有机保护层4搭接部分的膜层内应力，同时也降低了第二无机层7与有机保护层4之间的膜层间应力，可以降低第二无机层7与有机保护层4之间发生剥离的风险。
在一种实施例中，多个开口701在衬底1上的正投影与有机保护层4靠近显示区的一侧斜面在衬底1上的正投影重叠。
本实施例通过将开口701形成在有机保护层4靠近显示区A1的一侧斜面上，可以降低第二无机层7与有机保护层4的斜面之间的膜层间应力，降低了第二无机层7与有机保护层4之间发生剥离的风险。
在一种实施例中，第二无机层7在衬底1上的正投影与有机保护层4在衬底1上的正投影有重叠的区域的膜层内应力小于第二无机层7在衬底1上的正投影与有机保护层4在衬底1上的正投影无重叠的区域的膜层内应力。
可以理解的是，本实施例通过将第二无机层7与有机保护层4有重叠的区域的膜层内应力设置得更小，可以降低第二无机层7与有机保护层4之间发生剥离的风险。
在一种实施例中，第二无机层7在衬底1上的正投影与有机保护层4在衬底1上的正投影无重叠的区域的膜层内应力大于第一无机层2的膜层内应力。
需要说明的是，第二无机层7与有机保护层4无重叠的区域与第一无机层2有接触，本实施例通过将第二无机层7与有机保护层4无重叠的区域的膜层内应力设置为大于第一无机层2的膜层内应力，能提高第二无机层7与第一无机层2的贴合效果。
在一种实施例中，封装层6包括第一无机封装层601、有机封装层602以及第二无机封装层603；第一无机封装层601位于发光功能层5远离衬底1的一侧；有机封装层602位于第一无机封装层601远离衬底1的一侧；第二无机封装层603位于有机封装层602远离衬底1的一侧；其中，第二无机层7在衬底1上的正投影与有机保护层4在衬底1上的正投影无重叠的区域的膜层内应力大于第二无机封装层603的膜层内应力。
本实施例通过将第二无机层7与有机保护层4无重叠的区域的膜层内应力设置为大于第二无机封装层603的膜层内应力，可使得第二无机层7覆盖封装层6的效果更好。
在一种实施例中，在显示区A1至非显示区A2的方向上，第二无机层7在衬底1上的正投影与有机保护层4远离衬底1的一侧表面在衬底1上的正投影重叠的区域的宽度b大于或等于10微米。
本实施例通过将第二无机层7与有机保护层4重叠区域的宽度b设置为大于或等于10微米，避免第二无机层7与下层的有机保护层4之间的搭接宽度过小导致的剥离问题。
在一种实施例中，在显示区A1至非显示区A2的方向上，第二无机层7远离显示区A1的边界处至开槽3靠近显示区A1的一端的距离a大于或等于5微米。
具体的，第二无机层7远离显示区A1的边界处与开槽3在水平方向还存在一段距离a，距离a为预弯折区域，本实施例通过在第二无机层7与开槽3之间设置一段距离a且a大于或等于5微米，避免弯折过程中第二无机层7的弯折弧度过大与有机保护层4之间发生剥离。
在一种实施例中，多个开口701分别按行方向和列方向排布(如图2a所示)，图2a中以3行、15列为例进行绘示，具体有多少行、多少列视第二无机层7超出封装层6的边界的面积、开口701的宽度n以及相邻的两个开口701的中心之间的间距m而定。
在一种实施例中，多个开口701逐行排布，一开口701位于相邻一行中相邻的两个开口701之间的区域(如图2b所示)。
在一种实施例中，在垂直于显示面板的出光侧的平面上，开口701的形状为圆形(如图2d所示)、三角形、矩形(如图2a、图2b所示)、菱形(如图2c所示)中的任一种。本发明不以此为限，在其它实施例中，在垂直于显示面板的出光侧的平面上，开口701的形状还可以为其它任意规则图形。
在一种实施例中，在显示区A1至非显示区A2的方向上，开口701的宽度n大于或等于3微米，相邻两个开口701的中心之间的间距m大于或等于5微米。可以理解的是，本实施例通过将开口701的宽度n设置为大于或等于3微米，将相邻两个开口701的中心之间的间距m设置为大于或等于5微米，能实现更好的降低第二无机层7的膜层内应力的效果。
请参阅图3，为本发明实施例提供的改善前后有机保护层表面的应力对比图，需要说明的是，此处的有机保护层为与第二无机层7相接触的第三有机保护层403，其中，改善前(第二无机层7上未设置开口701)，第三有机保护层403与第二无机层7相接触的一侧表面的应力为4.7兆帕；改善后(第二无机层7上设置开口701)，第三有机保护层403与第二无机层7相接触的一侧表面的应力为4.2兆帕。即本发明实施例通过仿真发现，改善前后可显著降低膜层应力10%左右。
请参阅图4，为本发明实施例提供的开槽的基本结构示意图，具体的，衬底1与源极504、漏极505之间依次还设置有阻挡层201、缓冲层202、有源层21、第一栅极绝缘层203、第一栅极层22、第二栅极绝缘层204、第二栅极层23以及层间绝缘层205。源极504和漏极505位于层间绝缘层205上，源极504和漏极505分别与有源层21的两端电连接。其中，开槽3从上至下依次贯穿层间绝缘层205、第二栅极绝缘层204、第一栅极绝缘层203、缓冲层202以及阻挡层201。
请参阅图5a和图5b，为本发明实施例提供的触控电极层的基本结构示意图，在本实施例中，显示面板包括触控电极层8，触控电极层8位于封装层6和第二无机层7之间(如图5a)；或者触控电极层8位于第二无机层7远离封装层6的一侧(如图5b)。
本发明实施例提供的第二无机层7为触控膜层中的无机层。具体的，第二无机层7可以为覆盖触控电极层8的无机层或触控电极层8内的无机层。其中，如图5b所示，显示面板还包括覆盖触控电极层8的保护层9。
本发明实施例还提供一种显示终端，包括终端主体和上述的显示面板，终端主体与显示面板组合为一体，显示面板的具体结构请参阅图1至图5b及相关说明，此处不再赘述。本发明实施例提供的显示终端可以为：手机、平板电脑、笔记本电脑、电视机、数码相机、导航仪等具有显示功能的产品或部件。
可以理解的是，对本领域普通技术人员来说，可以根据本申请的技术方案及其发明构思加以等同替换或改变，而所有这些改变或替换都应属于本申请所附的权利要求的保护范围。

Claims (20)

  1. 一种显示面板，其中，包括显示区和设置在所述显示区至少一侧的非显示区，所述非显示区包括靠近所述显示区的第二弯折区；所述显示面板包括：
    衬底；
    第一无机层，设置在所述衬底的一侧，并在所述第二弯折区设置有开槽；
    有机保护层，设置在所述第一无机层远离所述衬底的一侧，且覆盖所述开槽；
    发光功能层，设置在所述第一无机层远离所述衬底的一侧，所述发光功能层包括设置在所述显示区的发光像素；
    封装层，设置在所述发光功能层远离所述衬底的一侧，所述封装层从所述显示区延伸至所述非显示区，所述封装层的边界与所述开槽之间存在第一间距；
    第二无机层，设置在所述封装层远离所述衬底的一侧，所述第二无机层从所述显示区延伸至所述非显示区，且超出所述封装层的边界；
    其中，所述第二无机层远离所述显示区的边界处包括多个开口。
  2. 如权利要求1所述的显示面板，其中，所述第二无机层在所述衬底上的正投影与所述有机保护层在所述衬底上的正投影部分重叠。
  3. 如权利要求2所述的显示面板，其中，多个所述开口在所述衬底上的正投影与所述有机保护层远离所述衬底的一侧表面在所述衬底上的正投影重叠。
  4. 如权利要求2所述的显示面板，其中，多个所述开口在所述衬底上的正投影与所述有机保护层靠近所述显示区的一侧斜面在所述衬底上的正投影重叠。
  5. 如权利要求2所述的显示面板，其中，所述显示区包括靠近所述非显示区的第一弯折区；
    所述第二无机层在所述衬底上的正投影与所述有机保护层在所述衬底上的正投影有重叠的区域的膜层内应力，小于所述第二无机层在所述衬底上的正投影与所述有机保护层在所述衬底上的正投影无重叠的区域的膜层内应力。
  6. 如权利要求5所述的显示面板，其中，所述第二无机层在所述衬底上的正投影与所述有机保护层在所述衬底上的正投影无重叠的区域的膜层内应力大于所述第一无机层的膜层内应力。
  7. 如权利要求5所述的显示面板，其中，所述封装层包括：
    第一无机封装层，位于所述发光功能层远离所述衬底的一侧；
    有机封装层，位于所述第一无机封装层远离所述衬底的一侧；
    第二无机封装层，位于所述有机封装层远离所述衬底的一侧；
    其中，所述第二无机层在所述衬底上的正投影与所述有机保护层在所述衬底上的正投影无重叠的区域的膜层内应力大于所述第二无机封装层的膜层内应力。
  8. 如权利要求2所述的显示面板，其中，在所述显示区至所述非显示区的方向上，所述第二无机层在所述衬底上的正投影与所述有机保护层远离所述衬底的一侧表面在所述衬底上的正投影重叠的区域的宽度大于或等于10微米。
  9. 如权利要求2所述的显示面板，其中，在所述显示区至所述非显示区的方向上，所述第二无机层远离所述显示区的边界处至所述开槽靠近所述显示区的一端的距离大于或等于5微米。
  10. 如权利要求1所述的显示面板，其中，多个所述开口分别按行方向和列方向排布。
  11. 如权利要求1所述的显示面板，其中，多个所述开口逐行排布，一所述开口位于相邻一行中相邻的两个所述开口之间的区域。
  12. 如权利要求1所述的显示面板，其中，在垂直于所述显示面板的出光侧的平面上，所述开口的形状为圆形、三角形、矩形、菱形中的任一种。
  13. 如权利要求1所述的显示面板，其中，在所述显示区至所述非显示区的方向上，所述开口的宽度大于或等于3微米，相邻两个所述开口的中心之间的间距大于或等于5微米。
  14. 如权利要求1所述的显示面板，其中，所述显示面板包括触控电极层，所述触控电极层位于所述封装层和所述第二无机层之间；或者
    所述触控电极层位于所述第二无机层远离所述封装层的一侧。
  15. 一种显示终端，其中，包括终端主体和显示面板，所述终端主体与所述显示面板组合为一体，所述显示面板包括显示区和设置在所述显示区至少一侧的非显示区，所述非显示区包括靠近所述显示区的第二弯折区，所述显示面板包括：
    衬底；
    第一无机层，设置在所述衬底的一侧，并在所述第二弯折区设置有开槽；
    有机保护层，设置在所述第一无机层远离所述衬底的一侧，且覆盖所述开槽；
    发光功能层，设置在所述第一无机层远离所述衬底的一侧，所述发光功能层包括设置在所述显示区的发光像素；
    封装层，设置在所述发光功能层远离所述衬底的一侧，所述封装层从所述显示区延伸至所述非显示区，所述封装层的边界与所述开槽之间存在第一间距；
    第二无机层，设置在所述封装层远离所述衬底的一侧，所述第二无机层从所述显示区延伸至所述非显示区，且超出所述封装层的边界；
    其中，所述第二无机层远离所述显示区的边界处包括多个开口。
  16. 如权利要求15所述的显示终端，其中，所述第二无机层在所述衬底上的正投影与所述有机保护层在所述衬底上的正投影部分重叠。
  17. 如权利要求16所述的显示终端，其中，所述显示区包括靠近所述非显示区的第一弯折区；
    所述第二无机层在所述衬底上的正投影与所述有机保护层在所述衬底上的正投影有重叠的区域的膜层内应力，小于所述第二无机层在所述衬底上的正投影与所述有机保护层在所述衬底上的正投影无重叠的区域的膜层内应力。
  18. 如权利要求17所述的显示终端，其中，所述封装层包括：
    第一无机封装层，位于所述发光功能层远离所述衬底的一侧；
    有机封装层，位于所述第一无机封装层远离所述衬底的一侧；
    第二无机封装层，位于所述有机封装层远离所述衬底的一侧；
    其中，所述第二无机层在所述衬底上的正投影与所述有机保护层在所述衬底上的正投影无重叠的区域的膜层内应力大于所述第二无机封装层的膜层内应力。
  19. 如权利要求17所述的显示终端，其中，所述第二无机层在所述衬底上的正投影与所述有机保护层在所述衬底上的正投影无重叠的区域的膜层内应力大于所述第一无机层的膜层内应力。
  20. 如权利要求16所述的显示终端，其中，多个所述开口在所述衬底上的正投影与所述有机保护层靠近所述显示区的一侧斜面在所述衬底上的正投影重叠。
PCT/CN2023/083200 2022-07-19 2023-03-22 显示面板及显示终端 WO2024016702A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US18/195,593 US20240032396A1 (en) 2022-07-19 2023-05-10 Display panels and display terminals

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202210848077.9 2022-07-19
CN202210848077.9A CN115275045B (zh) 2022-07-19 2022-07-19 显示面板及显示终端

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/195,593 Continuation US20240032396A1 (en) 2022-07-19 2023-05-10 Display panels and display terminals

Publications (1)

Publication Number Publication Date
WO2024016702A1 true WO2024016702A1 (zh) 2024-01-25

Family

ID=83767924

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2023/083200 WO2024016702A1 (zh) 2022-07-19 2023-03-22 显示面板及显示终端

Country Status (2)

Country Link
CN (1) CN115275045B (zh)
WO (1) WO2024016702A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115275045B (zh) * 2022-07-19 2023-07-04 武汉华星光电半导体显示技术有限公司 显示面板及显示终端

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109585688A (zh) * 2018-12-28 2019-04-05 厦门天马微电子有限公司 显示面板和显示装置
CN109786426A (zh) * 2019-01-08 2019-05-21 昆山工研院新型平板显示技术中心有限公司 显示面板、显示装置及显示面板的制造方法
CN110504295A (zh) * 2019-08-30 2019-11-26 武汉天马微电子有限公司 一种柔性显示面板及显示装置
CN111430442A (zh) * 2020-04-27 2020-07-17 武汉华星光电半导体显示技术有限公司 显示面板及其制作方法
US20210074795A1 (en) * 2018-06-06 2021-03-11 Japan Display Inc. Display device
CN113078195A (zh) * 2021-03-25 2021-07-06 京东方科技集团股份有限公司 显示装置、显示面板及其制造方法
CN115275045A (zh) * 2022-07-19 2022-11-01 武汉华星光电半导体显示技术有限公司 显示面板及显示终端

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108831303B (zh) * 2018-06-19 2020-07-03 武汉华星光电半导体显示技术有限公司 一种用于曲面屏的背板及电子设备
CN110993828A (zh) * 2020-01-03 2020-04-10 武汉华星光电半导体显示技术有限公司 Oled显示面板
CN113471394B (zh) * 2021-05-27 2022-06-03 武汉天马微电子有限公司 显示面板的切割修边方法、显示面板及显示装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210074795A1 (en) * 2018-06-06 2021-03-11 Japan Display Inc. Display device
CN109585688A (zh) * 2018-12-28 2019-04-05 厦门天马微电子有限公司 显示面板和显示装置
CN109786426A (zh) * 2019-01-08 2019-05-21 昆山工研院新型平板显示技术中心有限公司 显示面板、显示装置及显示面板的制造方法
CN110504295A (zh) * 2019-08-30 2019-11-26 武汉天马微电子有限公司 一种柔性显示面板及显示装置
CN111430442A (zh) * 2020-04-27 2020-07-17 武汉华星光电半导体显示技术有限公司 显示面板及其制作方法
CN113078195A (zh) * 2021-03-25 2021-07-06 京东方科技集团股份有限公司 显示装置、显示面板及其制造方法
CN115275045A (zh) * 2022-07-19 2022-11-01 武汉华星光电半导体显示技术有限公司 显示面板及显示终端

Also Published As

Publication number Publication date
CN115275045B (zh) 2023-07-04
CN115275045A (zh) 2022-11-01

Similar Documents

Publication Publication Date Title
US10431771B2 (en) Organic light-emitting display device
CN108123062B (zh) 有机发光显示装置
KR102313366B1 (ko) 플렉서블 디스플레이 장치와, 이의 제조 방법
JP2023501031A (ja) 画素アレイ及び表示装置
KR20180005328A (ko) 플렉서블 디스플레이 장치
KR20180071122A (ko) 유기 발광 표시 장치
JP2018074161A (ja) 有機発光表示装置
KR102649145B1 (ko) 디스플레이 장치
CN110308822B (zh) 触摸显示面板及其制备方法
US11563064B2 (en) Array substrate, display device, and method for fabricating an array substrate
WO2021097690A1 (zh) 显示基板及其制作方法和显示装置
US11232755B2 (en) Display substrate and manufacturing method therefor, and display device
WO2021226750A1 (zh) 显示基板、显示面板、显示装置及显示面板的制造方法
US20220407032A1 (en) Display panel and preparation method therefor, and display device
WO2018205587A1 (zh) 显示基板及其制作方法、显示装置
WO2024016702A1 (zh) 显示面板及显示终端
JP2017147044A (ja) 表示装置、および表示装置の作製方法
US20220190284A1 (en) Display panel and manufacturing method thereof
WO2022083349A1 (zh) 显示基板及其制备方法、显示装置
US20230422561A1 (en) Flexible Display Device and Method of Manufacturing the Same
WO2024001430A1 (zh) 显示面板及显示装置
CN112289948B (zh) 有机发光二极体显示面板及其制作方法
US20240032396A1 (en) Display panels and display terminals
JP2023538158A (ja) 表示パネル、その製造方法、および表示装置
WO2022198448A1 (zh) 显示基板和显示面板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23841777

Country of ref document: EP

Kind code of ref document: A1