WO2020087786A1 - 内嵌式触控显示面板及显示装置 - Google Patents

内嵌式触控显示面板及显示装置 Download PDF

Info

Publication number
WO2020087786A1
WO2020087786A1 PCT/CN2019/072721 CN2019072721W WO2020087786A1 WO 2020087786 A1 WO2020087786 A1 WO 2020087786A1 CN 2019072721 W CN2019072721 W CN 2019072721W WO 2020087786 A1 WO2020087786 A1 WO 2020087786A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
metal
sub
display panel
touch display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/072721
Other languages
English (en)
French (fr)
Inventor
唐岳军
李雪云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Technology Co Ltd
Priority to US16/349,294 priority Critical patent/US20200264718A1/en
Publication of WO2020087786A1 publication Critical patent/WO2020087786A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G02F1/136295—Materials; Compositions; Manufacture processes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes

Definitions

  • the present application relates to the field of display, and in particular to an in-cell touch display panel and display device.
  • the touch wires are usually formed of a newly added metal layer, or made of the same layer of source / drain electrode materials and the same process.
  • both methods have the disadvantages of increasing the number of masks or reducing the pixel aperture ratio.
  • the purpose of the embodiments of the present application is to provide an in-cell touch display panel and an electronic device, which can solve the problems of a large number of photomasks or a high pixel aperture ratio during the formation of touch wires.
  • An embodiment of the present application provides an in-cell touch display panel, including:
  • a multiplexing electrode layer, the multiplexing electrode layer is disposed on the light-shielding metal layer, and the multiplexing electrode layer includes multiple multiplexing metal blocks, the multiplexing metal blocks and the multiple touches Wires correspond to electrical connections one by one;
  • the light-shielding metal layer and the multiplexing electrode layer further include: a first insulating layer, a transistor layer, and a second insulating layer stacked in this order;
  • the first insulating layer is provided with a plurality of first vias
  • the transistor layer is provided with a plurality of second vias
  • the second insulating layer is provided with a plurality of third vias, each The multiplexed metal blocks are all electrically connected to the corresponding touch wires through the first via hole, the second via hole and the third via hole;
  • the in-cell touch display panel further includes a plurality of scanning lines and a plurality of data lines; the touch wire is disposed directly under the scanning line or the data line.
  • the multiplexed metal block extends to the first via hole, the second via hole, and the third via hole, and corresponds to the corresponding The touch wires are electrically connected.
  • the first via hole, the second via hole and the third via hole are coaxially arranged.
  • the transistor layer includes: a conductive channel sublayer, a third insulator sublayer, a gate metal sublayer, a fourth insulator sublayer, and source / drain layers that are sequentially stacked Metal sublayer
  • the conductive channel sub-layer is used to form a conductive channel of the transistor
  • the gate metal sub-layer is used to form the gate of the transistor
  • the source / drain metal sub-layer is used to form the source / drain of the transistor
  • the light-shielding metal is located directly under the transistor.
  • the source / drain metal sublayer is also used to form a plurality of first connection electrodes, the first connection electrodes extending to the second vias and The first via hole is electrically connected to the corresponding touch wire;
  • the multiplexed metal block extends to the third via hole and is electrically connected to the corresponding first connection electrode.
  • the first via and the second via are coaxially arranged, and the first via and the second via are arranged on different axes .
  • An embodiment of the present application further provides an in-cell touch display panel, including:
  • a multiplexing electrode layer, the multiplexing electrode layer is disposed on the light-shielding metal layer, and the multiplexing electrode layer includes multiple multiplexing metal blocks, the multiplexing metal blocks and the multiple touches
  • the wires correspond to the electrical connections one by one.
  • between the light-shielding metal layer and the multiplexing electrode layer further includes: a first insulating layer, a transistor layer, and a second insulating layer that are sequentially stacked;
  • the first insulating layer is provided with a plurality of first vias
  • the transistor layer is provided with a plurality of second vias
  • the second insulating layer is provided with a plurality of third vias
  • the multiplexed metal block extends to the first via hole, the second via hole, and the third via hole, and corresponds to the corresponding The touch wires are electrically connected.
  • the first via hole, the second via hole and the third via hole are coaxially arranged.
  • the transistor layer includes: a conductive channel sublayer, a third insulator sublayer, a gate metal sublayer, a fourth insulator sublayer, and source / drain layers that are sequentially stacked Metal sublayer
  • the conductive channel sub-layer is used to form a conductive channel of the transistor
  • the gate metal sub-layer is used to form the gate of the transistor
  • the source / drain metal sub-layer is used to form the source / drain of the transistor
  • the light-shielding metal is located directly under the transistor.
  • the source / drain metal sublayer is also used to form a plurality of first connection electrodes, the first connection electrodes extending to the second vias and The first via hole is electrically connected to the corresponding touch wire;
  • the multiplexed metal block extends to the third via hole and is electrically connected to the corresponding first connection electrode.
  • the first via and the second via are coaxially arranged, and the first via and the second via are arranged on different axes .
  • the second via hole includes a plurality of first sub-via holes and a plurality of second sub-via holes, and the first sub-via holes are provided in the first On the third insulator sublayer, the second sub-via is provided on the fourth insulator sublayer;
  • each of the multiplexed metal blocks passes through the first via, the first sub-via, the second sub-via, and the third via to communicate with the corresponding touch wire connection.
  • the source / drain metal sublayer is also used to form a plurality of second connection electrodes, and the gate metal sublayer is also used to form a plurality of third connections electrode;
  • the second connection electrode extends to the second sub-via and is electrically connected to the corresponding third connection electrode
  • the third connection electrode extends to the first sub-via and corresponds to The touch wires are electrically connected
  • the multiplexed metal block extends to the third via hole and is electrically connected to the corresponding second connection electrode.
  • the third via, the second sub-via and the first sub-via are arranged on different axes, and the first sub-via It is arranged coaxially with the first via.
  • the in-cell touch display panel further includes a plurality of scan lines and a plurality of data lines; the touch wire is disposed on the scan line or the The data line is directly below.
  • the light-shielding metal is insulated from the touch wire.
  • the light-shielding metal is electrically connected to part of the touch wires.
  • An embodiment of the present application further provides a display device, which includes an in-cell touch display panel, and the in-cell touch display panel includes:
  • a multiplexing electrode layer, the multiplexing electrode layer is disposed on the light-shielding metal layer, and the multiplexing electrode layer includes multiple multiplexing metal blocks, the multiplexing metal blocks and the multiple touches
  • the wires correspond to the electrical connections one by one.
  • the in-cell touch display panel and display device include: a substrate; a light-shielding metal layer disposed on the substrate, the light-shielding metal layer including the light-shielding metal and a plurality of touch wires; and a multiplexed electrode layer,
  • the multiplexing electrode layer is disposed on the light-shielding metal layer, and the multiplexing electrode layer includes multiple multiplexing metal blocks, and the multiple multiplexing metal blocks are electrically connected to the multiple touch wires in a one-to-one correspondence.
  • the touch wires and the light-shielding metal are arranged in the same layer, so that the number of photomasks can be reduced when forming the touch wires; and the touch wires can be arranged directly under the scan lines or data lines to increase the pixel aperture ratio.
  • FIG. 1 is a first schematic structural diagram of an in-cell touch display panel in an embodiment of the present application
  • FIG. 2 is a second schematic structural diagram of an in-cell touch display panel in an embodiment of the present application.
  • FIG. 3 is a third structural schematic diagram of an in-cell touch display panel in an embodiment of the present application.
  • FIG. 4 is a first structural schematic diagram of a circuit layout structure of an in-cell touch display panel in an embodiment of the present application
  • FIG. 5 is a second structural schematic diagram of the circuit layout structure of the in-cell touch display panel in the embodiment of the present application.
  • FIG. 6 is a third structural schematic diagram of the circuit layout structure of the in-cell touch display panel in the embodiment of the present application.
  • FIG. 7 is a fourth structural schematic diagram of the circuit layout structure of the in-cell touch display panel in the embodiment of the present application.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless otherwise specifically limited.
  • connection should be understood in a broad sense, for example, it can be fixed connection or detachable Connected, or integrally connected; may be mechanical, electrical, or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediary, may be the connection between two elements or the interaction of two elements relationship.
  • the first feature “above” or “below” the second feature may include the direct contact of the first and second features, or may include the first and second features Contact not directly but through another feature between them.
  • the first feature is “above”, “above” and “above” the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below” and “below” the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is less horizontal than the second feature.
  • FIG. 1 is a first structural schematic diagram of an in-cell touch display panel in an embodiment of the present application.
  • the in-cell touch display panel 100 of the embodiment of the present application includes: a substrate 10, a light-shielding metal layer 20, a first insulating layer 30, a transistor layer 40, a second insulating layer 50, and a multiplexed electrode layer 60.
  • the light-shielding metal layer 20, the first insulating layer 30, the transistor layer 40, the second insulating layer 50, the multiplexing electrode layer 60, the third insulating layer 70, and the pixel electrode 80 are sequentially stacked on the substrate 10.
  • the pixel electrode layer 80 includes a plurality of pixel electrodes 801.
  • the light-shielding metal layer 20 includes a light-shielding metal 201 and a plurality of touch wires 202. That is, the light-shielding metal 201 and the plurality of touch wires 202 are arranged in the same layer, and a plurality of touch wires 202 can be formed at the same time when the light-shielding metal 201 is formed, thereby reducing the number of photomasks required when forming the touch wires 202 .
  • a light-shielding metal layer 20 may be formed on the substrate 10 first, and then a light-shielding metal 201 and a plurality of metal lines 202 may be formed through a patterning process.
  • the multiplexing electrode layer 60 includes a plurality of multiplexing metal blocks 601.
  • the multiplexed metal blocks 601 and the multiple touch wires 202 are connected in a one-to-one correspondence.
  • the multiplexing electrode layer 60 may be a common electrode layer. That is, in the embodiment of the present application, the common electrode layer is cut into multiple multiplexed metal blocks 601 and connected to the chip on the in-cell touch display panel 100 through multiple touch wires 202.
  • the first insulating layer 30 is provided with a plurality of first vias 901.
  • the transistor layer 40 is provided with a plurality of second vias 902.
  • a plurality of third vias 903 are provided on the second insulating layer 50.
  • Each multiplexed metal block 601 is electrically connected to the corresponding touch wire 202 through the first via 901, the second via 902 and the third via 903. It can be understood that, in the embodiment of the present application, one multiplexed metal block 601 corresponds to one touch wire 202.
  • a multiplexed metal block 601 is electrically connected to a touch wire 202 through a first via 901, a second via 902, and a third via 903.
  • the multiplexing metal block 601 extends to the first via 901, the second via 902, and the third via 903, and is electrically connected to the corresponding touch wire 202. It can be understood that the first via 901, the second via 902 and the third via 903 are coaxially arranged.
  • a light-shielding metal layer 20 is first formed on the substrate 10, and a light-shielding metal 201 and a plurality of metal lines 202 are formed through a patterning process; then a first insulating layer 30, a transistor layer 40, and a second insulation are formed in this order Layer 50, and a first via 901, a second via 902, and a third via 903 are formed by etching; finally, a multiplexing electrode 60 layer is formed, and multiple multiplexing metal blocks 601 are formed by a patterning process.
  • each multiplexed metal block 601 corresponds to a first via 901, a second via 902, and a third via 903, each multiplexed metal block 601 extends to the first via 901, the first The two vias 902 and the third via 903 are used to electrically connect with the corresponding touch wires 202.
  • the transistor layer 40 includes: a conductive channel sub-layer 401, a third insulating sub-layer 402, a gate metal sub-layer 403, a fourth insulating sub-layer 404, and source / drain layers stacked in this order Metal sublayer 405.
  • the conductive channel sublayer 401 is used to form the conductive channel 4011 of the transistor 900
  • the gate metal sublayer 403 is used to form the gate 4031 of the transistor 900
  • the source / drain metal sublayer 405 is used to form the source of the transistor 900.
  • the third insulator sublayer 402 and the fourth insulator sublayer 404 both belong to the isolation layer.
  • the light-shielding metal 201 is located directly under the transistor 900.
  • FIG. 2 is a second structural schematic diagram of the in-cell touch display panel in the embodiment of the present application.
  • the difference between the in-cell touch panel 200 shown in FIG. 2 and the in-cell touch display panel 100 shown in FIG. 1 is that the source / drain metal sublayer 405 is also used to form a plurality of first connection electrodes 4053.
  • the first connection electrode 4053 extends to the second via 902 and the first via 901, and is electrically connected to the corresponding touch wire 202; the multiplexed metal block 601 extends to the third via 903, and connects to the corresponding third A connection electrode 4053 is electrically connected. It can be understood that the first via 901 and the second via 902 are coaxially arranged, and the first via 901 and the second via 903 are not coaxially disposed.
  • a light-shielding metal layer 20 is first formed on the substrate 10, and a light-shielding metal 201 and a plurality of metal lines 202 are formed through a patterning process; then a conductive channel sub-layer 401, a third insulating sub-layer 402, and a gate A metal sublayer 403 and a fourth insulating sublayer 404, and a first via 901 and a second via 902 are formed by etching; then a source / drain metal sublayer 405 is formed, and a plurality of first The connection electrode 4053; the second insulating layer 50 is formed next, and a third via 903 is formed by etching; finally, the multiplexing electrode layer 60 is formed, and a plurality of multiplexing metal blocks 601 are formed by a patterning process.
  • each multiplexed metal block 601 corresponds to one third via 903
  • each multiplexed metal block 601 extends to the third via 903 to achieve electrical connection with the corresponding first connection electrode 4053.
  • each first connection electrode 4053 corresponds to a first via 901 and a second via 902
  • each first connection electrode 4053 extends to the first via 901 and the second via 902, In order to achieve electrical connection with the corresponding touch wire 202.
  • FIG. 3 is a third structural schematic diagram of an in-cell touch display panel in an embodiment of the present application.
  • the difference between the in-cell touch panel 300 shown in FIG. 3 and the in-cell touch display panel 100 shown in FIG. 1 is that the source / drain metal sub-layer 405 is also used to form a plurality of second connection electrodes At 4054, the gate metal sub-layer 403 is further used to form a plurality of third connection electrodes 4032.
  • the second via 902 includes a plurality of first sub-vias 9021 and a plurality of second sub-vias 9022.
  • the first sub-via 9021 is disposed on the third insulating sub-layer 402, and the second sub-via 9022 is disposed on the second Four insulator layers 404.
  • Each multiplexed metal block 601 is electrically connected to the corresponding touch wire 202 through the first via 901, the first sub-via 9021, the second sub-via 9022, and the third via 903.
  • the second connection electrode 4054 extends to the second sub-via 9022 and is electrically connected to the corresponding third connection electrode 4032.
  • the third connection electrode 4032 extends to the first sub-via 9021 and the first via 901, and The corresponding touch wires 202 are electrically connected.
  • the multiplexed metal block 601 extends to the third via 903 and is electrically connected to the corresponding second connection electrode 4053. It can be understood that the third via 903, the second sub-via 9022, and the first sub-via 9021 are disposed on different axes, and the first sub-via 9021 and the first via 901 are coaxially disposed.
  • a light-shielding metal layer 20 is first formed on the substrate 10, and a light-shielding metal 201 and a plurality of metal lines 202 are formed through a patterning process; then a conductive channel sub-layer 401 and a third insulating sub-layer 402 are sequentially formed, and The first via 901 and the first sub-via 9021 are formed by etching; then a gate metal sub-layer 403 is formed, and a plurality of third connection electrodes 4032 are formed through a patterning process; then a fourth insulating sub-layer 404 is formed, and The second sub-via 9022 is formed by etching; then the source / drain metal sub-layer 405 is formed, and a plurality of second connection electrodes 4053 are formed by a patterning process; the second insulating layer 50 is then formed, and The third via 903 is formed by etching; finally, the multiplexing electrode layer 60 is formed, and a plurality of multiplexing metal
  • each multiplexed metal block 601 corresponds to one third via 903
  • each multiplexed metal block 601 extends to the third via 903 to achieve electrical connection with the corresponding second connection electrode 4053.
  • each second connection electrode 4053 corresponds to one second sub-via 9022
  • each second connection electrode 4053 extends to the second sub-via 9022 to achieve electrical connection with the third connection electrode 4032.
  • each third connection electrode 4032 corresponds to a first sub-via 9021 and a first via 901, each third connection electrode 4032 extends to the first sub-via 9021 and the first via 901, to achieve electrical connection with the corresponding touch wire 202.
  • 4 is a first schematic diagram of the circuit layout structure of the in-cell touch display panel in the embodiment of the present application
  • FIG. 5 is a second circuit layout structure of the in-cell touch display panel in the embodiment of the present application
  • 6 is a schematic diagram of a third structure of the circuit layout structure of the in-cell touch display panel in the embodiment of the present application
  • FIG. 7 is a circuit layout of the circuit of the in-cell touch display panel in the embodiment of the application
  • the fourth structural diagram of the structure As shown in FIGS.
  • the in-cell touch display panel further includes a plurality of scan lines 11 and a plurality of data lines 12, and the touch wires 202 can be disposed directly under the data lines 12 or scanned
  • the line 11 is directly below to increase the pixel aperture ratio.
  • the touch wire 202 may be connected to or separated from the light-shielding metal 201.
  • the touch wire may not be arranged directly under the data line or the scanning line, but may be arranged on a side parallel to the data line or the scanning line.
  • the in-cell touch display panel and display device include: a substrate; a light-shielding metal layer disposed on the substrate, the light-shielding metal layer including the light-shielding metal and a plurality of touch wires; and a multiplexed electrode layer,
  • the multiplexing electrode layer is disposed on the light-shielding metal layer, and the multiplexing electrode layer includes multiple multiplexing metal blocks, and the multiple multiplexing metal blocks are electrically connected to the multiple touch wires in a one-to-one correspondence.
  • the touch wires and the light-shielding metal are arranged in the same layer, so that the number of photomasks can be reduced when forming the touch wires; and the touch wires can be arranged directly under the scan lines or data lines to increase the pixel aperture ratio.
  • An embodiment of the present application further provides a display device, which includes the in-cell touch display panel described in the above embodiment.
  • a display device which includes the in-cell touch display panel described in the above embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请提供的内嵌式触控显示面板及显示装置，包括：基板；遮光金属层，遮光金属层设置在基板上，遮光金属层包括遮光金属以及多根触控导线；以及复用电极层，复用电极层设置在遮光金属层上，且复用电极层包括多个复用金属块，多个复用金属块与多根触控导线一一对应电连接。

Description

内嵌式触控显示面板及显示装置 技术领域
本申请涉及显示领域，具体涉及一种内嵌式触控显示面板及显示装置。
 背景技术
现有的内嵌式触控显示面板中，触控导线通常由新增加的一层金属层形成，或者由源/漏电极同层材料同工艺制成。然而这两种方法均存在增加光罩数量、或者降低像素开口率的缺点。
因此，现有技术存在缺陷，急需改进。
 技术问题
本申请实施例的目的是提供一种内嵌式触控显示面板及电子装置，可以解决触控导线形成过程中光罩数量多、或者像素开口率高的问题。
 技术解决方案
本申请实施例提供一种内嵌式触控显示面板，包括：
基板；
遮光金属层，所述遮光金属层设置在所述基板上，所述遮光金属层包括遮光金属以及多根触控导线；以及
复用电极层，所述复用电极层设置在所述遮光金属层上，且所述复用电极层包括多个复用金属块，所述多个复用金属块与所述多根触控导线一一对应电连接；
所述遮光金属层与所述复用电极层之间还包括：依次层叠设置的第一绝缘层、晶体管层、第二绝缘层；
其中，所述第一绝缘层上设置有多个第一过孔，所述晶体管层上设置有多个第二过孔，所述第二绝缘层上设置有多个第三过孔，每一所述复用金属块均通过所述第一过孔、所述第二过孔以及所述第三过孔与对应的所述触控导线电连接；
所述内嵌式触控显示面板还包括多条扫描线以及多条数据线；所述触控导线设置在所述扫描线或所述数据线正下方。
在本申请所述的内嵌式触控显示面板中，所述复用金属块延伸至所述第一过孔、所述第二过孔以及所述第三过孔，并与对应的所述触控导线电连接。
在本申请所述的内嵌式触控显示面板中，所述第一过孔、所述第二过孔以及所述第三过孔同轴设置。
在本申请所述的内嵌式触控显示面板中，所述晶体管层包括：依次层叠设置的导电沟道子层、第三绝缘子层、栅极金属子层、第四绝缘子层、源/漏极金属子层；
其中，所述导电沟道子层用于形成晶体管的导电沟道，所述栅极金属子层用于形成晶体管的栅极，所述源/漏极金属子层用于形成晶体管的源/漏极；且所述遮光金属位于所述晶体管正下方。
在本申请所述的内嵌式触控显示面板中，所述源/漏金属子层还用于形成多个第一连接电极，所述第一连接电极延伸至所述第二过孔与所述第一过孔，并与对应的所述触控导线电连接；
所述复用金属块延伸至所述第三过孔，并与对应的所述第一连接电极电连接。
在本申请所述的内嵌式触控显示面板中，所述第一过孔与所述第二过孔同轴设置，且所述第一过孔与所述第二过孔不同轴设置。
本申请实施例还提供一种内嵌式触控显示面板，包括：
基板；
遮光金属层，所述遮光金属层设置在所述基板上，所述遮光金属层包括遮光金属以及多根触控导线；以及
复用电极层，所述复用电极层设置在所述遮光金属层上，且所述复用电极层包括多个复用金属块，所述多个复用金属块与所述多根触控导线一一对应电连接。
在本申请所述的内嵌式触控显示面板中，所述遮光金属层与所述复用电极层之间还包括：依次层叠设置的第一绝缘层、晶体管层、第二绝缘层；
其中，所述第一绝缘层上设置有多个第一过孔，所述晶体管层上设置有多个第二过孔，所述第二绝缘层上设置有多个第三过孔，每一所述复用金属块均通过所述第一过孔、所述第二过孔以及所述第三过孔与对应的所述触控导线电连接。
在本申请所述的内嵌式触控显示面板中，所述复用金属块延伸至所述第一过孔、所述第二过孔以及所述第三过孔，并与对应的所述触控导线电连接。
在本申请所述的内嵌式触控显示面板中，所述第一过孔、所述第二过孔以及所述第三过孔同轴设置。
在本申请所述的内嵌式触控显示面板中，所述晶体管层包括：依次层叠设置的导电沟道子层、第三绝缘子层、栅极金属子层、第四绝缘子层、源/漏极金属子层；
其中，所述导电沟道子层用于形成晶体管的导电沟道，所述栅极金属子层用于形成晶体管的栅极，所述源/漏极金属子层用于形成晶体管的源/漏极；且所述遮光金属位于所述晶体管正下方。
在本申请所述的内嵌式触控显示面板中，所述源/漏金属子层还用于形成多个第一连接电极，所述第一连接电极延伸至所述第二过孔与所述第一过孔，并与对应的所述触控导线电连接；
所述复用金属块延伸至所述第三过孔，并与对应的所述第一连接电极电连接。
在本申请所述的内嵌式触控显示面板中，所述第一过孔与所述第二过孔同轴设置，且所述第一过孔与所述第二过孔不同轴设置。
在本申请所述的内嵌式触控显示面板中，所述第二过孔包括多个第一子过孔和多个第二子过孔，所述第一子过孔设置在所述第三绝缘子层上，所述第二子过孔设置在所述第四绝缘子层上；
其中，每一所述复用金属块均通过所述第一过孔、所述第一子过孔、所述第二子过孔以及所述第三过孔与对应的所述触控导线电连接。
在本申请所述的内嵌式触控显示面板中，所述源/漏金属子层还用于形成多个第二连接电极，所述栅极金属子层还用于形成多个第三连接电极；
其中，所述第二连接电极延伸至所述第二子过孔，并与对应的所述第三连接电极电连接，所述第三连接电极延伸至所述第一子过孔，并与对应的所述触控导线电连接；
所述复用金属块延伸至所述第三过孔，并与对应的所述第二连接电极电连接。
在本申请所述的内嵌式触控显示面板中，所述第三过孔、所述第二子过孔以及所述第一子过孔不同轴设置，且所述第一子过孔与所述第一过孔同轴设置。
在本申请所述的内嵌式触控显示面板中，所述内嵌式触控显示面板还包括多条扫描线以及多条数据线；所述触控导线设置在所述扫描线或所述数据线正下方。
在本申请所述的内嵌式触控显示面板中，所述遮光金属与所述触控导线绝缘隔离设置。
在本申请所述的内嵌式触控显示面板中，所述遮光金属与部分所述触控导线电连接。
本申请实施例还提供一种显示装置，其包括内嵌式触控显示面板，所述内嵌式触控显示面板，其包括：
基板；
遮光金属层，所述遮光金属层设置在所述基板上，所述遮光金属层包括遮光金属以及多根触控导线；以及
复用电极层，所述复用电极层设置在所述遮光金属层上，且所述复用电极层包括多个复用金属块，所述多个复用金属块与所述多根触控导线一一对应电连接。
 有益效果
本申请提供的内嵌式触控显示面板及显示装置，包括：基板；遮光金属层，遮光金属层设置在基板上，遮光金属层包括遮光金属以及多根触控导线；以及复用电极层，复用电极层设置在遮光金属层上，且复用电极层包括多个复用金属块，多个复用金属块与多根触控导线一一对应电连接。本申请通过将触控导线与遮光金属同层设置，从而在形成触控导线时可以减少光罩数量；并且将触控导线设置在扫描线或数据线的正下方，可以提高像素开口率。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例中的内嵌式触控显示面板的第一种结构示意图；
图2是本申请实施例中的内嵌式触控显示面板的第二种结构示意图；
图3是本申请实施例中的内嵌式触控显示面板的第三种结构示意图；
图4是本申请实施例中的内嵌式触控显示面板的线路布局结构的第一种结构示意图；
图5是本申请实施例中的内嵌式触控显示面板的线路布局结构的第二种结构示意图；
图6是本申请实施例中的内嵌式触控显示面板的线路布局结构的第三种结构示意图；
图7是本申请实施例中的内嵌式触控显示面板的线路布局结构的第四种结构示意图。
 本发明的实施方式
下面详细描述本申请的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1，图1是本申请实施例中的内嵌式触控显示面板的第一种结构示意图。如图1所示，本申请实施例的内嵌式触控显示面板100，包括：基板10、遮光金属层20、第一绝缘层30、晶体管层40、第二绝缘层50、复用电极层60、第三绝缘层70和像素电极层80。遮光金属层20、第一绝缘层30、晶体管层40、第二绝缘层50、复用电极层60、第三绝缘层70和像素电极80层依次层叠设置在基板10上。其中，像素电极层80包括多个像素电极801。
在本申请实施例中，遮光金属层20包括遮光金属201以及多根触控导线202。也即，遮光金属201以及多根触控导线202同层设置，在形成遮光金属201的同时可以一并形成多根触控导线202，从而可以减少在形成触控导线202时需要的光罩数量。例如，本申请实施例可以先在基板10上形成一遮光金属层20，随后通过图形化工艺形成遮光金属201以及多根金属线202。
另外，复用电极层60包括多个复用金属块601。多个复用金属块601与多根触控导线202一一对应连接。其中，该复用电极层60可以为公共电极层。也即，本申请实施例将公共电极层切割成多个复用金属块601，并通过多根触控导线202与内嵌式触控显示面板100上的芯片连接。
在一些实施例中，第一绝缘层30上设置有多个第一过孔901。晶体管层40上设置有多个第二过孔902。第二绝缘层50上设置有多个第三过孔903。每一复用金属块601均通过第一过孔901、第二过孔902以及第三过孔903与对应的触控导线202电连接。可以理解的是，在本申请实施例中，一个复用金属块601对应一条触控导线202。一个复用金属块601通过一个第一过孔901、一个第二过孔902以及一个第三过孔903与一条触控导线202实现电连接。
其中，复用金属块601延伸至第一过孔901、第二过孔902以及第三过孔903，并与对应的触控导线202电连接。可以理解的是，第一过孔901、第二过孔902以及第三过孔903同轴设置。
例如，本申请实施例先在基板10上形成遮光金属层20，并通过图形化工艺形成遮光金属201以及多根金属线202；随后再依次形成第一绝缘层30、晶体管层40以及第二绝缘层50，并通过刻蚀形成第一过孔901、第二过孔902以及第三过孔903；最后，形成复用电极60层，并通过图形化工艺形成多个复用金属块601。由于每个复用金属块601均对应一个第一过孔901、一个第二过孔902以及一个第三过孔903，因此，每个复用金属块601均延伸至第一过孔901、第二过孔902以及第三过孔903，以实现与对应的触控导线202电连接。
请继续参阅图1，在一些实施例中，晶体管层40包括：依次层叠设置的导电沟道子层401、第三绝缘子层402、栅极金属子层403、第四绝缘子层404、源/漏极金属子层405。
其中，导电沟道子层401用于形成晶体管900的导电沟道4011，栅极金属子层403用于形成晶体管900的栅极4031，源/漏极金属子层405用于形成晶体管900的源/漏极4051/4052。第三绝缘子层402以及第四绝缘子层404均属于隔离层。遮光金属201位于晶体管900正下方。
请参阅图2，图2是本申请实施例中的内嵌式触控显示面板的第二种结构示意图。其中，图2所示的内嵌式触控形式面板200与图1所示的内嵌式触控显示面板100的区别在于：源/漏金属子层405还用于形成多个第一连接电极4053。
其中，第一连接电极4053延伸至第二过孔902与第一过孔901，并与对应的触控导线电202连接；复用金属块601延伸至第三过孔903，并与对应的第一连接电极4053电连接。可以理解的是，第一过孔901与第二过孔902同轴设置，且第一过孔901与第二过孔903不同轴设置。
例如，本申请实施例先在基板10上形成遮光金属层20，并通过图形化工艺形成遮光金属201以及多根金属线202；随后再依次形成导电沟道子层401、第三绝缘子层402、栅极金属子层403、第四绝缘子层404，并通过刻蚀形成第一过孔901以及第二过孔902；接着形成源/漏极金属子层405，并通过图形化工艺形成多个第一连接电极4053；紧接着形成第二绝缘层50，并通过刻蚀形成第三过孔903；最后，形成复用电极层60，并通过图形化工艺形成多个复用金属块601。由于每个复用金属块601均对应一个第三过孔903，因此，每个复用金属块601均延伸至第三过孔903，以实现与对应的第一连接电极4053电连接。同样，由于每个第一连接电极4053均对应一个第一过孔901以及一个第二过孔902，因此，每个第一连接电极4053均延伸至第一过孔901以及第二过孔902，以实现与对应的触控导线202电连接。
请参阅图3，图3是本申请实施例中的内嵌式触控显示面板的第三种结构示意图。其中，图3所示的内嵌式触控形式面板300与图1所示的内嵌式触控显示面板100的区别在于：源/漏金属子层405还用于形成多个第二连接电极4054，栅极金属子层403还用于形成多个第三连接电极4032。
其中，第二过孔902包括多个第一子过孔9021和多个第二子过孔9022，第一子过孔9021设置在第三绝缘子层402上，第二子过孔9022设置在第四绝缘子层404上。每一复用金属块601均通过第一过孔901、第一子过孔9021、第二子过孔9022以及第三过孔903与对应的触控导线202电连接。
其中，第二连接电极4054延伸至第二子过孔9022，并与对应的第三连接电极4032电连接，第三连接电极4032延伸至第一子过孔9021以及第一过孔901，并与对应的触控导线202电连接。复用金属块601延伸至第三过孔903，并与对应的第二连接电极4053电连接。可以理解的是，第三过孔903、第二子过孔9022以及第一子过孔9021不同轴设置，且第一子过孔9021与第一过孔901同轴设置。
例如，本申请实施例先在基板10上形成遮光金属层20，并通过图形化工艺形成遮光金属201以及多根金属线202；随后再依次形成导电沟道子层401、第三绝缘子层402，并通过刻蚀形成第一过孔901以及第一子过孔9021；接着形成栅极金属子层403，并通过图形化工艺形成多个第三连接电极4032；紧接着形成第四绝缘子层404，并通过刻蚀形成第二子过孔9022；再接着形成源/漏极金属子层405，并通过图形化工艺形成多个第二连接电极4053；再紧接着形成第二绝缘层50，并通过刻蚀形成第三过孔903；最后，形成复用电极层60，并通过图形化工艺形成多个复用金属块601。由于每个复用金属块601均对应一个第三过孔903，因此，每个复用金属块601均延伸至第三过孔903，以实现与对应的第二连接电极4053电连接。同样，由于每个第二连接电极4053均对应一个第二子过孔9022，因此，每个第二连接电极4053均延伸至第二子过孔9022，以实现与第三连接电极4032电连接。同样，由于每个第三连接电极4032均对应一个第一子过孔9021以及一个第一过孔901，因此，每个第三连接电极4032均延伸至第一子过孔9021以及第一过孔901，以实现与对应的触控导线202电连接。
在一些实施例中，请参阅图4、图5、图6以及图7。图4是本申请实施例中的内嵌式触控显示面板的线路布局结构的第一种结构示意图；图5是本申请实施例中的内嵌式触控显示面板的线路布局结构的第二种结构示意图；图6是本申请实施例中的内嵌式触控显示面板的线路布局结构的第三种结构示意图；图7是本申请实施例中的内嵌式触控显示面板的线路布局结构的第四种结构示意图。如图4、图5、图6以及图7所示，内嵌式触控显示面板还包括多条扫描线11以及多条数据线12，触控导线202可以设置于数据线12正下方或者扫描线11正下方，以提高像素开口率。触控导线202可以与遮光金属201连接或者分离。
在一些实施例中，触控导线可以不设置在数据线或者扫描线正下方，而是设置在平行于数据线或者扫描线的一侧。
本申请提供的内嵌式触控显示面板及显示装置，包括：基板；遮光金属层，遮光金属层设置在基板上，遮光金属层包括遮光金属以及多根触控导线；以及复用电极层，复用电极层设置在遮光金属层上，且复用电极层包括多个复用金属块，多个复用金属块与多根触控导线一一对应电连接。本申请通过将触控导线与遮光金属同层设置，从而在形成触控导线时可以减少光罩数量；并且将触控导线设置在扫描线或数据线的正下方，可以提高像素开口率。
本申请实施例还提供一种显示装置，其包括以上实施例所述的内嵌式触控显示面板，具体可参照以上所述，在此不做赘述。
以上对本申请实施例提供的内嵌式触控显示面板及显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种内嵌式触控显示面板，其包括：
    基板；
    遮光金属层，所述遮光金属层设置在所述基板上，所述遮光金属层包括遮光金属以及多根触控导线；以及
    复用电极层，所述复用电极层设置在所述遮光金属层上，且所述复用电极层包括多个复用金属块，所述多个复用金属块与所述多根触控导线一一对应电连接；
    所述遮光金属层与所述复用电极层之间还包括：依次层叠设置的第一绝缘层、晶体管层、第二绝缘层；
    其中，所述第一绝缘层上设置有多个第一过孔，所述晶体管层上设置有多个第二过孔，所述第二绝缘层上设置有多个第三过孔，每一所述复用金属块均通过所述第一过孔、所述第二过孔以及所述第三过孔与对应的所述触控导线电连接；
    所述内嵌式触控显示面板还包括多条扫描线以及多条数据线；所述触控导线设置在所述扫描线或所述数据线正下方。
  2. 根据权利要求1所述的内嵌式触控显示面板，其中，所述复用金属块延伸至所述第一过孔、所述第二过孔以及所述第三过孔，并与对应的所述触控导线电连接。
  3. 根据权利要求2所述的内嵌式触控显示面板，其中，所述第一过孔、所述第二过孔以及所述第三过孔同轴设置。
  4. 根据权利要求1所述的内嵌式触控显示面板，其中，所述晶体管层包括：依次层叠设置的导电沟道子层、第三绝缘子层、栅极金属子层、第四绝缘子层、源/漏极金属子层；
    其中，所述导电沟道子层用于形成晶体管的导电沟道，所述栅极金属子层用于形成晶体管的栅极，所述源/漏极金属子层用于形成晶体管的源/漏极；且所述遮光金属位于所述晶体管正下方。
  5. 根据权利要求4所述的内嵌式触控显示面板，其中，所述源/漏金属子层还用于形成多个第一连接电极，所述第一连接电极延伸至所述第二过孔与所述第一过孔，并与对应的所述触控导线电连接；
    所述复用金属块延伸至所述第三过孔，并与对应的所述第一连接电极电连接。
  6. 根据权利要求5所述的内嵌式触控显示面板，其中，所述第一过孔与所述第二过孔同轴设置，且所述第一过孔与所述第二过孔不同轴设置。
  7. 一种内嵌式触控显示面板，其包括：
    基板；
    遮光金属层，所述遮光金属层设置在所述基板上，所述遮光金属层包括遮光金属以及多根触控导线；以及
    复用电极层，所述复用电极层设置在所述遮光金属层上，且所述复用电极层包括多个复用金属块，所述多个复用金属块与所述多根触控导线一一对应电连接。
  8. 根据权利要求7所述的内嵌式触控显示面板，其中，所述遮光金属层与所述复用电极层之间还包括：依次层叠设置的第一绝缘层、晶体管层、第二绝缘层；
    其中，所述第一绝缘层上设置有多个第一过孔，所述晶体管层上设置有多个第二过孔，所述第二绝缘层上设置有多个第三过孔，每一所述复用金属块均通过所述第一过孔、所述第二过孔以及所述第三过孔与对应的所述触控导线电连接。
  9. 根据权利要求8所述的内嵌式触控显示面板，其中，所述复用金属块延伸至所述第一过孔、所述第二过孔以及所述第三过孔，并与对应的所述触控导线电连接。
  10. 根据权利要求9所述的内嵌式触控显示面板，其中，所述第一过孔、所述第二过孔以及所述第三过孔同轴设置。
  11. 根据权利要求8所述的内嵌式触控显示面板，其中，所述晶体管层包括：依次层叠设置的导电沟道子层、第三绝缘子层、栅极金属子层、第四绝缘子层、源/漏极金属子层；
    其中，所述导电沟道子层用于形成晶体管的导电沟道，所述栅极金属子层用于形成晶体管的栅极，所述源/漏极金属子层用于形成晶体管的源/漏极；且所述遮光金属位于所述晶体管正下方。
  12. 根据权利要求11所述的内嵌式触控显示面板，其中，所述源/漏金属子层还用于形成多个第一连接电极，所述第一连接电极延伸至所述第二过孔与所述第一过孔，并与对应的所述触控导线电连接；
    所述复用金属块延伸至所述第三过孔，并与对应的所述第一连接电极电连接。
  13. 根据权利要求12所述的内嵌式触控显示面板，其中，所述第一过孔与所述第二过孔同轴设置，且所述第一过孔与所述第二过孔不同轴设置。
  14. 根据权利要求11所述的内嵌式触控显示面板，其中，所述第二过孔包括多个第一子过孔和多个第二子过孔，所述第一子过孔设置在所述第三绝缘子层上，所述第二子过孔设置在所述第四绝缘子层上；
    其中，每一所述复用金属块均通过所述第一过孔、所述第一子过孔、所述第二子过孔以及所述第三过孔与对应的所述触控导线电连接。
  15. 根据权利要求14所述的内嵌式触控显示面板，其中，所述源/漏金属子层还用于形成多个第二连接电极，所述栅极金属子层还用于形成多个第三连接电极；
    其中，所述第二连接电极延伸至所述第二子过孔，并与对应的所述第三连接电极电连接，所述第三连接电极延伸至所述第一子过孔，并与对应的所述触控导线电连接；
    所述复用金属块延伸至所述第三过孔，并与对应的所述第二连接电极电连接。
  16. 根据权利要求15所述的内嵌式触控显示面板，其中，所述第三过孔、所述第二子过孔以及所述第一子过孔不同轴设置，且所述第一子过孔与所述第一过孔同轴设置。
  17. 根据权利要求7所述的内嵌式触控显示面板，其中，所述内嵌式触控显示面板还包括多条扫描线以及多条数据线；所述触控导线设置在所述扫描线或所述数据线正下方。
  18. 根据权利要求7所述的内嵌式触控显示面板，其中，所述遮光金属与所述触控导线绝缘隔离设置。
  19. 根据权利要求7所述的内嵌式触控显示面板，其中，所述遮光金属与部分所述触控导线电连接。
  20. 一种显示装置，其包括内嵌式触控显示面板，所述内嵌式触控显示面板，其包括：
    基板；
    遮光金属层，所述遮光金属层设置在所述基板上，所述遮光金属层包括遮光金属以及多根触控导线；以及
    复用电极层，所述复用电极层设置在所述遮光金属层上，且所述复用电极层包括多个复用金属块，所述多个复用金属块与所述多根触控导线一一对应电连接。
PCT/CN2019/072721 2018-10-31 2019-01-22 内嵌式触控显示面板及显示装置 Ceased WO2020087786A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/349,294 US20200264718A1 (en) 2018-10-31 2019-01-22 Embedded touch display panel and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811282767.2A CN109358779A (zh) 2018-10-31 2018-10-31 内嵌式触控显示面板及显示装置
CN201811282767.2 2018-10-31

Publications (1)

Publication Number Publication Date
WO2020087786A1 true WO2020087786A1 (zh) 2020-05-07

Family

ID=65347422

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/072721 Ceased WO2020087786A1 (zh) 2018-10-31 2019-01-22 内嵌式触控显示面板及显示装置

Country Status (3)

Country Link
US (1) US20200264718A1 (zh)
CN (1) CN109358779A (zh)
WO (1) WO2020087786A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110162220B (zh) * 2019-05-28 2022-10-18 业成科技（成都）有限公司 触控装置及其制作方法
CN113157129B (zh) * 2021-03-04 2024-04-19 京东方科技集团股份有限公司 一种触控基板及其制备方法、触控显示装置
CN114779544A (zh) * 2022-03-29 2022-07-22 武汉华星光电技术有限公司 Tft基板及其制作方法、液晶显示面板和oled显示面板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106125440A (zh) * 2016-09-05 2016-11-16 京东方科技集团股份有限公司 阵列基板及其制备方法、显示装置
CN108511465A (zh) * 2018-04-28 2018-09-07 武汉华星光电技术有限公司 内嵌式触控阵列基板、显示面板及制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10802627B2 (en) * 2018-03-29 2020-10-13 Wuhan China Star Optoelectronics Technology Co., Ltd. Touch panel and manufacturing method thereof
US20190333938A1 (en) * 2018-04-28 2019-10-31 Wuhan China Star Optoelectronics Technology Co., Ltd. In-cell touch array substrate, display panel and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106125440A (zh) * 2016-09-05 2016-11-16 京东方科技集团股份有限公司 阵列基板及其制备方法、显示装置
CN108511465A (zh) * 2018-04-28 2018-09-07 武汉华星光电技术有限公司 内嵌式触控阵列基板、显示面板及制造方法

Also Published As

Publication number Publication date
CN109358779A (zh) 2019-02-19
US20200264718A1 (en) 2020-08-20

Similar Documents

Publication Publication Date Title
CN108376672B (zh) 阵列基板及其制备方法，以及显示装置
CN103296033B (zh) 一种阵列基板及其制作方法
CN104699321B (zh) 触控显示基板和触控显示装置
CN104793420B (zh) 阵列基板及制作方法、显示装置
CN106325608B (zh) 触控显示面板及触控显示装置
CN107340623B (zh) 阵列基板、显示面板及显示装置
CN104617106A (zh) 一种阵列基板及显示装置
CN104698665B (zh) 触控显示面板结构及其形成方法、触控显示装置
CN106292036A (zh) 一种阵列基板、显示装置及其制作方法
WO2020015071A1 (zh) 阵列基板及其制作方法
CN106935598A (zh) 阵列基板及其制造方法、触控面板和触控装置
WO2021023175A1 (zh) 触控基板及其制造方法以及显示装置
CN105117069B (zh) 一种阵列基板、触控显示面板及触控显示装置
CN104319274A (zh) 阵列基板及其制作方法、显示面板及显示装置
CN102809859B (zh) 液晶显示装置、阵列基板及其制作方法
CN106783872A (zh) 一种柔性显示面板
CN106842751B (zh) 阵列基板及其修复方法、显示装置
WO2020087786A1 (zh) 内嵌式触控显示面板及显示装置
CN105183259A (zh) 一种触控面板以及触控电子设备
WO2019184070A1 (zh) 显示装置及其阵列基板
WO2014176876A1 (zh) 显示面板及其制作方法、液晶显示器
CN108364936A (zh) 阵列基板及其制备方法、显示面板和显示装置
CN109062441B (zh) 阵列基板
CN110377180A (zh) 触控电极、触控结构、触控显示面板及触控显示装置
CN113540124B (zh) 一种阵列基板、显示面板及显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19878091

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19878091

Country of ref document: EP

Kind code of ref document: A1