WO2020087357A1 - 智能终端热管及其制作方法 - Google Patents

智能终端热管及其制作方法 Download PDF

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Publication number
WO2020087357A1
WO2020087357A1 PCT/CN2018/113065 CN2018113065W WO2020087357A1 WO 2020087357 A1 WO2020087357 A1 WO 2020087357A1 CN 2018113065 W CN2018113065 W CN 2018113065W WO 2020087357 A1 WO2020087357 A1 WO 2020087357A1
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Prior art keywords
copper plate
heat pipe
groove
lower copper
manufacturing
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PCT/CN2018/113065
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English (en)
French (fr)
Inventor
李俊宇
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深圳市万景华科技有限公司
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Priority to PCT/CN2018/113065 priority Critical patent/WO2020087357A1/zh
Publication of WO2020087357A1 publication Critical patent/WO2020087357A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
    • B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Definitions

  • the invention belongs to the technical field of radiators, and more specifically, relates to an intelligent terminal heat pipe and a manufacturing method thereof.
  • a method for manufacturing a smart terminal heat pipe is provided to solve the technical problem of poor heat dissipation performance of the smart terminal heat pipe in the prior art.
  • a method for manufacturing a smart terminal heat pipe is provided to solve the technical problem of poor heat dissipation performance of the smart terminal heat pipe in the prior art.
  • a method for manufacturing a smart terminal heat pipe including the following process steps:
  • an intelligent terminal heat pipe which includes an upper copper plate and a lower copper plate that are stacked and welded together, the top surface of the lower copper plate has a groove along the length direction, and copper powder is provided in the groove
  • a sintered liquid channel is provided with a vapor channel between the liquid channel and the edge of the groove, a liquid is provided in the liquid channel, and the groove is in a vacuum negative pressure state.
  • the beneficial effects of the intelligent terminal heat pipe and the manufacturing method provided by the embodiments of the present invention are as follows: the upper copper plate and the lower copper plate are stacked and welded to make the intelligent terminal heat pipe. In this way, a separate selection method can be used. Directly set the upper copper plate and the lower copper plate into the desired shape. For special shapes, there is no need to bend after forming. Such processing is not limited by shape and size, nor does it produce wrinkles, and has strong applicability; and internal The liquid channel is sintered with copper powder and has good heat dissipation performance.
  • FIG. 1 is a flowchart of a method for manufacturing a smart terminal heat pipe according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of an upper copper plate in a heat pipe of an intelligent terminal according to Embodiment 1 of the present invention
  • FIG. 3 is a schematic structural diagram of a lower terminal copper plate in a heat pipe of an intelligent terminal provided with a liquid channel not provided in Embodiment 1 of the present invention
  • FIG. 4 is a schematic structural diagram of a liquid channel in a lower copper plate of a heat pipe of an intelligent terminal provided by Embodiment 1 of the present invention
  • FIG. 5 is a longitudinal cross-sectional view of FIG. 4;
  • FIG. 6 is an exploded view of a heat pipe of a smart terminal provided in Embodiment 1 of the present invention.
  • FIG. 7 is a schematic structural diagram of a smart terminal heat pipe according to Embodiment 1 of the present invention.
  • FIG. 8 is a schematic structural diagram of a heat pipe for an intelligent terminal according to Embodiment 2 of the present invention.
  • a component when referred to as being “fixed” or “installed” on another component, it can be directly on the other component or indirectly on the other component.
  • a component When a component is said to be “connected to” another component, it can be directly connected to the other component or indirectly connected to the other component.
  • first and second are used for description purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.
  • features defined as “first” and “second” may explicitly or implicitly include one or more of the features.
  • the meaning of “plurality” is two or more, unless otherwise specifically limited.
  • an embodiment of the present invention provides a method for manufacturing a smart terminal heat pipe 1, including the following process steps:
  • the prepared upper copper plate 10 has a straight-line structure, and the bottom surface of the upper copper plate 10 is flat.
  • the upper copper plate 10 is etched from a copper plate with a thickness of 0.2 mm, and the thickness of the upper copper plate 10 after molding is in the range of 0.05 mm to 0.1 mm.
  • the lower copper plate 20 also has an in-line structure, whose length and width match the upper copper plate 10
  • the finally formed smart terminal heat pipe 1 also has an in-line structure (as shown in FIG. 7).
  • the shape of the heat pipe may be different according to the actual internal structure of the smart terminal. As shown in FIG.
  • the upper copper plate in L-shape is directly prepared 10 ⁇ L ⁇ ⁇ ⁇ ⁇ 20 ⁇ 10 and L-shaped lower copper plate 20.
  • both the upper copper plate 10 and the lower copper plate 20 are S-shaped or the like.
  • the groove 21 is formed by etching, and during the etching, a plurality of spaced support pillars 25 are reserved along the length of the groove 21.
  • the use of multiple support columns 25 makes the internal flatness of the lower copper plate 20 better and the structure stronger.
  • the wall thickness of the lower copper plate 20 after etching is 0.05 mm-0.1 mm.
  • the wall thickness of the upper copper plate 10 is 0.05mm-0.1mm. The thickness of the upper copper plate 10 and the lower copper plate 20 are matched to ensure the stability of the molded heat pipe after welding.
  • liquid channel 22 formed by sintering copper powder, and the liquid channel 22 has a straight shape.
  • the liquid channel 22 is provided with a plurality of small holes 221 corresponding to the plurality of support columns 25 one by one.
  • each supporting column 25 passes through each small hole 221.
  • multiple liquid channels 22 can also be formed by sintering.
  • the vapor channel 23 reserved between the liquid channel 22 and the edge of the groove 21 is U-shaped.
  • one or more inline vapor channels 23 may also be reserved.
  • the upper copper plate 10 and the lower copper plate 20 are stacked and docked, a water injection pipe 30 is inserted at the liquid injection port 24, and the upper copper plate 10, the lower copper plate 20 and the water injection pipe are inserted 30 welding as one.
  • the water injection pipe 30 is a copper pipe with a diameter of 1 mm and a wall thickness of 0.1 mm.
  • the flux 40 is placed in the flux area 26 before welding, and the upper copper plate 10, the lower copper plate 20, and the water injection pipe 30 are welded together using the flux 40.
  • the flux 40 is copper fiber material.
  • the copper fiber material fills the gap between the upper copper plate 10 and the lower copper plate 20 to ensure a seamless connection between the upper copper plate 10 and the lower copper plate 20.
  • the working liquid is injected from the water injection pipe 30, and then a vacuum is drawn to keep the space between the upper copper plate 10 and the lower copper plate 20 at a negative pressure, and then the water injection pipe 30 is sealed.
  • the water injection pipe 30 is sealed with a cutter die and a spot welding machine, and then the sealed portion is flattened to a thickness of 0.3 mm.
  • the lower positioning piece 27 and the lower positioning piece 27 are cut to form the final intelligent terminal heat pipe 1.
  • the thickness of the finished smart terminal heat pipe 1 is formed by stacking the depths of the upper copper plate 10, the lower copper plate 20, and the grooves 21 on the lower copper plate 20.
  • the thickness of the finished smart terminal heat pipe 1 manufactured by the above method is about 0.3 mm.
  • the upper terminal copper plate 10 and the lower terminal copper plate 20 are stacked and welded to make the smart terminal heat pipe 1.
  • the upper terminal copper plate 10 and the lower terminal copper plate 20 can be directly arranged in a desired shape by using a separate selection
  • the special shape does not need to be bent after forming.
  • Such processing is not limited by the shape and size, nor will it produce wrinkles, and has strong applicability; and the internal liquid channel 22 is sintered with copper powder, which has good heat dissipation performance.
  • an embodiment of the present invention further provides a heat pipe 1 for an intelligent terminal, including an upper copper plate 10 and a lower copper plate 20 stacked and welded in one body.
  • the top surface of the lower copper plate 20 has a groove 21 along its longitudinal direction
  • a liquid channel 22 formed by sintering copper powder is provided in the groove 21
  • a vapor channel 23 is provided between the liquid channel 22 and the edge of the groove 21
  • a liquid is provided in the liquid channel 22, and the groove 21 is in a vacuum negative pressure state.
  • the wall thickness of the upper copper plate 10 and the lower copper plate 20 are both 0.05mm-0.1mm.
  • a plurality of support posts 25 are arranged in the groove 21 and spaced in the longitudinal direction thereof.
  • a sealed water injection pipe 30 is provided on the lower copper plate 20.
  • the water injection pipe 30 is flat and has a thickness of about 0.3 mm. Through this water injection pipe 30, the working liquid is injected into the groove 21 enclosed by the upper copper plate 10 and the lower copper plate 20, and the injection pipe 30 is sealed after the injection work is completed.
  • the water injection pipe is a copper pipe
  • the diameter of the copper pipe is 1 mm
  • the wall thickness is 0.1 mm.
  • the upper copper plate 10 and the lower copper plate 20 are both in a shape of a line, so the intelligent terminal heat pipe formed by welding is also in a shape of a line.
  • both the upper copper plate 10 and the lower copper plate 20 are L-shaped.
  • the upper copper plate 10 and the lower copper plate 20 are both S-shaped.

Abstract

一种智能终端热管，包括叠置并焊接于一体的上铜板(10)与下铜板(20)，所述下铜板(20)的顶面沿其长度方向具有凹槽(21)，所述凹槽(21)内设有铜粉烧结而成的液体通道(22)，所述液体通道(22)与所述凹槽(21)边缘之间设有汽体通道(23)，所述液体通道(22)内设有液体，且所述凹槽(21)为真空负压状态。上铜板(10)与下铜板(20)叠置焊接形成的智能终端热管，可直接将上铜板(10)与下铜板(20)设置呈所需形状，对于特别形状，不需在成型后再进行折弯，这样的加工不受形状和大小的限制，也不会产生褶皱，适用性强；而且内部液体通道(23)采用铜粉烧结而成，散热性能好。

Description

智能终端热管及其制作方法 技术领域
本发明属于散热器技术领域，更具体地说，是涉及一种智能终端热管及其制作方法。
 背景技术
随着科技产业快速的进步，各种智能终端如手机、平板电脑，游戏机等集成化、智能化、轻薄化程度越来越高，功能也愈来愈强大，特别是随着5G时代的到来，智能终端散热也就越来越重要。目前应用于智能终端的热管在制作时还是延用传统方法，但是传统方法制作的热管散热性能欠佳，不能满足超薄、集成化高的智能终端需求。
 技术问题
本发明实施例的目的在于：第一方面，提供一种智能终端热管的制作方法，用以解决现有技术中存在的智能终端热管散热性能欠佳的技术问题。
第二方面，提供一种智能终端热管的制作方法，用以解决现有技术中存在的智能终端热管散热性能欠佳的技术问题。
 技术解决方案
为解决上述技术问题，本发明实施例采用的技术方案是：
第一方面，提供了一种智能终端热管的制作方法，包括以下工艺步骤：
S1、预备可叠置对接的上铜板与下铜板，于所述下铜板的顶面沿其长度方向开设凹槽，于所述凹槽内设置由铜粉烧结而成的液体通道，所述液体通道与所述凹槽边缘之间预留汽体通道，于所述下铜板一侧设置与所述凹槽连通的注液口；
S2、将所述上铜板与所述下铜板叠置对接，于所述注液口处插设注水管，并将所述上铜板、所述下铜板及所述注水管焊接为一体；
S3、向所述注水管内注入液体，并由所述注水管处抽取真空并封口。
第二方面，提供了一种智能终端热管，包括叠置并焊接于一体的上铜板与下铜板，所述下铜板的顶面沿其长度方向具有凹槽，所述凹槽内设有铜粉烧结而成的液体通道，所述液体通道与所述凹槽边缘之间设有汽体通道，所述液体通道内设有液体，且所述凹槽为真空负压状态。
 有益效果
与现有技术相比，本发明实施例提供的智能终端热管及其制作方法的有益效果在于：采用上铜板与下铜板叠置焊接的方式来制作智能终端热管，这样采用分开选择的方式，可直接将上铜板与下铜板设置呈所需形状，对于特别形状，不需在成型后再进行折弯，这样的加工不受形状和大小的限制，也不会产生褶皱，适用性强；而且内部液体通道采用铜粉烧结而成，散热性能好。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1为本发明实施例提供的智能终端热管的制作方法流程图；
图2为本发明实施例一提供的智能终端热管中上铜板的结构示意图；
图3为本发明实施例一提供的智能终端热管中下铜板未设置液体通道时的结构示意图；
图4为本发明实施例一提供的智能终端热管中下铜板设置液体通道后的结构示意图；
图5为图4的纵向剖视图；
图6为本发明实施例一提供的智能终端热管爆炸图；
图7为本发明实施例一提供的智能终端热管的结构示意图；
图8为本发明实施例二提供的智能终端热管的结构示意图；
其中，附图中的标号如下：
10-上铜板；11-上定位片；20-下铜板；21-凹槽；22-液体通道；221-小孔；23-汽体通道；24-注液口；25-支撑柱；26-助焊剂；27-下定位片；30-注水管；40-助焊剂。
 本发明的实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本发明。
需说明的是，当部件被称为“固定于”或“设置于”另一个部件，它可以直接在另一个部件上或者间接在该另一个部件上。当一个部件被称为是“连接于”另一个部件，它可以是直接连接到另一个部件或者间接连接至该另一个部件上。
还需说明的是，本发明实施例的附图中相同或相似的标号对应相同或相似的部件；在本发明的描述中，需要理解的是，若有术语“上”、“下”、“左”、“右”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此，附图中描述位置关系的用语仅用于示例性说明，不能理解为对本专利的限制，对于本领域的普通技术人员而言，可以根据具体情况理解上述术语的具体含义。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多该特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
为了说明本发明所述的技术方案，以下结合具体附图对本发明提供的一种智能终端热管及其制作方法通过具体实施例进行详细说明。
请参考图1，本发明实施例提供了一种智能终端热管1的制作方法，包括以下工艺步骤：
S1、预备可叠置对接的上铜板10与下铜板20，于所述下铜板20的顶面沿其长度方向开设凹槽21，于所述凹槽21内设置由铜粉烧结而成的液体通道22，所述液体通道22与所述凹槽21边缘之间预留汽体通道23，于所述下铜板20一侧设置与所述凹槽21连通的注液口24。
具体地，如图2、图3所示，在本步骤中，预备的上铜板10呈一字型结构，且上铜板10的底面为平面。上铜板10由厚度为0.2mm的铜板蚀刻而成，成型后的上铜板10厚度范围为0.05mm-0.1mm。相应地，下铜板20也呈一字型结构，其长度，宽度与上铜板10匹配，最终形成的智能终端热管1也是呈一字型结构（如图7所示）。当然，在其他实施例中，根据实际智能终端内部结构不同，热管形状也可不同，如图8所示，当智能终端热管1为L型时，本步骤中，直接预备呈L型的上铜板10与L型的下铜板20。或者，上铜板10与下铜板20均呈S型等。
在本步骤中，参照图4至图6，凹槽21采用蚀刻形成，且在蚀刻时凹槽21内沿其长度方向预留多个间隔设置的支撑柱25。利用多个支撑柱25，使下铜板20内部平面度更好，结构更牢固。下铜板20在蚀刻后壁厚为0.05mm-0.1mm。同样的，上铜板10的壁厚为0.05mm-0.1mm。上铜板10与下铜板20厚度匹配，以确保焊接后成型热管的稳定性。
在本步骤中，铜粉烧结而成的液体通道22为一条，且液体通道22呈一字型。液体通道22上设有多个小孔221，与多个支撑柱25一一对应。液体通道22置于凹槽21时，各支撑柱25穿过各小孔221。当然，也可以烧结形成多条液体通道22。而且，液体通道22与凹槽21边缘之间预留的汽体通道23呈U型，当然，也可以预留一条或多条一字型汽体通道23。
在本步骤中，凹槽21周边距离与下铜板20的边缘之间预留一定的区域，此区域为助焊剂区域26。
进一步地，本步骤中，预备上铜板10与下铜板20时，在上铜板10的两侧边缘设置多个上定位片11，下铜板20的两侧边缘对应设置多个下定位片27。
S2、将所述上铜板10与所述下铜板20叠置对接，于所述注液口24处插设注水管30，并将所述上铜板10、所述下铜板20及所述注水管30焊接为一体。
在本步骤中，在将上铜板10与下铜板20叠置对接时，将上定位片11与下定位片27分别贴合对接，为上铜板10与下铜板20之间的精准对接提供可靠的定位基准，确保不发生错位。
在本步骤中，注水管30为铜管，铜管的直径为1mm，壁厚为0.1mm。
S3、向所述注水管30内注入液体，并由所述注水管30处抽取真空并封口。
在本步骤中，在焊接前于助焊剂区域26放置助焊剂40，利用助焊剂40将上铜板10、下铜板20及注水管30焊接为一体。具体地，助焊剂40为铜纤料。在焊接时，铜纤料填充上铜板10与下铜板20之间的缝隙，保证上铜板10与下铜板20之间的无缝连接。
焊接完成后将工作液体由注水管30注入，然后抽取真空，让上铜板10与下铜板20之间的空间保持负压状态，再对注水管30进行封口。具体地，利用切刀模和点焊机将注水管30封口，再将封口处压扁到0.3mm厚度。最后，将下定位片27与下定位片27裁切，形成最终的智能终端热管1。成品智能终端热管1的厚度由上铜板10、下铜板20以及下铜板20上的凹槽21的深度叠加而成，采用上述方法制成的成品智能终端热管1的厚度约为0.3mm。
本发明实施例中，采用上铜板10与下铜板20叠置焊接的方式来制作智能终端热管1，这样采用分开选择的方式，可直接将上铜板10与下铜板20设置呈所需形状，对于特别形状，不需在成型后再进行折弯，这样的加工不受形状和大小的限制，也不会产生褶皱，适用性强；而且内部液体通道22采用铜粉烧结而成，散热性能好。
参照图7，本发明实施例还提供了一种智能终端热管1，包括叠置并焊接于一体的上铜板10与下铜板20，下铜板20的顶面沿其长度方向具有凹槽21，凹槽21内设有铜粉烧结而成的液体通道22，液体通道22与凹槽21边缘之间设有汽体通道23，液体通道22内设有液体，且凹槽21为真空负压状态。其中，上铜板10与下铜板20的壁厚均为0.05mm-0.1mm。
进一步地，凹槽21内且其长度方向间隔设置多个支撑柱25。
进一步地，在下铜板20上设置有已封口的注水管30，注水管30呈扁平状，厚度约为0.3mm。通过此注水管30向上铜板10与下铜板20围合的凹槽21内注入工作液体，注入工作完成后将注水管30封口。
具体地，注水管为铜管，铜管的直径为1mm，壁厚为0.1mm。
本实施例中，上铜板10与下铜板20均呈一字型，故焊接形成的智能终端热管也呈一字型。当然，也可如图8所示，上铜板10与下铜板20均呈L型。或者，上铜板10与下铜板20均呈S字型。
以上仅为本发明的优选实施例而已，并不用于限制本发明。对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的权利要求范围之内。

Claims (14)

  1. 一种智能终端热管的制作方法，其特征在于，包括以下工艺步骤：
    S1、预备可叠置对接的上铜板与下铜板，于所述下铜板的顶面沿其长度方向开设凹槽，于所述凹槽内设置由铜粉烧结而成的液体通道，所述液体通道与所述凹槽边缘之间预留汽体通道，于所述下铜板一侧设置与所述凹槽连通的注液口；
    S2、将所述上铜板与所述下铜板叠置对接，于所述注液口处插设注水管，并将所述上铜板、所述下铜板及所述注水管焊接为一体；
    S3、向所述注水管内注入液体，并由所述注水管处抽取真空并封口。
  2. 根据权利要求1所述的智能终端热管的制作方法，其特征在于，在所述步骤S1中，所述凹槽采用蚀刻形成，且在蚀刻时所述凹槽内沿其长度方向预留多个间隔设置的支撑柱。
  3. 根据权利要求1所述的智能终端热管的制作方法，其特征在于：在所述步骤S1中，在所述下铜板的边缘与所述凹槽之间预留助焊剂区域；在所述步骤S3中，在焊接前于所述助焊剂区域放置助焊剂，利用所述助焊剂将所述上铜板、所述下铜板及所述注水管焊接为一体。
  4. 根据权利要求3所述的智能终端热管的制作方法，其特征在于：所述助焊剂为铜纤料。
  5. 根据权利要求1所述的智能终端热管的制作方法，其特征在于：在所述步骤S1中，所述上铜板的两侧边缘设有多个上定位片，所述下铜板的两侧边缘对应设有多个下定位片；在所述步骤S2中，将所述上铜板与所述下铜板叠置对接，将所述上定位片与所述下定位片分别贴合对接；在所述步骤S3中，封口后将所述下定位片与所述下定位片裁切。
  6. 根据权利要求2所述的智能终端热管的制作方法，其特征在于，在所述步骤S1中，所述下铜板蚀刻后的壁厚为0.05mm-0.1mm；所述上铜板的壁厚为0.05mm-0.1mm。
  7. 根据权利要求1所述的智能终端热管的制作方法，其特征在于，在所述步骤S2中，所述注水管为铜管，所述铜管的直径为1mm，壁厚为0.1mm。
  8. 根据权利要求1所述的智能终端热管的制作方法，其特征在于，在所述步骤S1中，所述上铜板与所述下铜板均呈一字型；或者，所述上铜板与所述下铜板均呈L型；或者，所述上铜板与所述下铜板均呈S字型。
  9. 一种智能终端热管，其特征在于，包括叠置并焊接于一体的上铜板与下铜板，所述下铜板的顶面沿其长度方向具有凹槽，所述凹槽内设有铜粉烧结而成的液体通道，所述液体通道与所述凹槽边缘之间设有汽体通道，所述液体通道内设有液体，且所述凹槽为真空负压状态。
  10. 根据权利要求9所述的智能终端热管，其特征在于，所述上铜板与所述下铜板的壁厚均为0.05mm-0.1mm。
  11. 根据权利要求9所述的智能终端热管，其特征在于，所述凹槽内且其长度方向间隔设置多个支撑柱。
  12. 根据权利要求9所述的智能终端热管，其特征在于，还包括与所述下铜板连通且封口的注水管。
  13. 根据权利要求12所述的智能终端热管，其特征在于，所述注水管为铜管，所述铜管的直径为1mm，壁厚为0.1mm。
  14. 根据权利要求9所述的智能终端热管，其特征在于，所述上铜板与所述下铜板均呈一字型；或者，所述上铜板与所述下铜板均呈L型；或者，所述上铜板与所述下铜板均呈S字型。
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