WO2020082212A1 - 柔性基材、柔性面板及电子设备 - Google Patents

柔性基材、柔性面板及电子设备 Download PDF

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Publication number
WO2020082212A1
WO2020082212A1 PCT/CN2018/111236 CN2018111236W WO2020082212A1 WO 2020082212 A1 WO2020082212 A1 WO 2020082212A1 CN 2018111236 W CN2018111236 W CN 2018111236W WO 2020082212 A1 WO2020082212 A1 WO 2020082212A1
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Prior art keywords
flexible substrate
region
flexible
hardness
hard
Prior art date
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Ceased
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PCT/CN2018/111236
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English (en)
French (fr)
Inventor
雷晓华
李贺
胡康军
陈鑫
朱林
袁泽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Priority to PCT/CN2018/111236 priority Critical patent/WO2020082212A1/zh
Priority to CN201880096022.9A priority patent/CN112889144A/zh
Publication of WO2020082212A1 publication Critical patent/WO2020082212A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Definitions

  • the invention relates to the technical field of electronics, in particular to a flexible substrate, a flexible panel and electronic equipment.
  • Flexible electronic devices such as flexible touch panels
  • have outstanding characteristics such as easy bending, convenient carrying, and bending resistance, and have attracted more and more attention.
  • the functional layer (such as the touch electrode layer) provided on the flexible substrate needs to be led out and bonded to the electronic device on the flexible substrate, however, the temperature and pressure applied during the bonding and bonding are high Higher, it is easy to damage the flexible substrate, so the flexible substrate cannot meet the process implementation conditions of the binding material and cannot be effectively bound and connected.
  • embodiments of the present invention disclose a flexible substrate, a flexible panel, and an electronic device that are not easily damaged.
  • a flexible substrate including a first region and a second region connected to the first region, a portion of the flexible substrate located in the second region has a hardness greater than that of the flexible substrate located in the first region
  • the hardness of the part of the area, and the second area of the flexible substrate is used for binding bonding of electronic devices.
  • a flexible panel includes the flexible substrate as described above.
  • An electronic device includes the flexible panel as described above.
  • the flexible substrate, the flexible panel and the electronic equipment provided by the present invention because the flexible substrate includes a second area for bonding and bonding of electronic devices, so that when the electronic device is bonding and bonding in the second area,
  • the flexible substrate is not easy to be damaged and deformed, prolongs the service life of the flexible substrate, and solves the problem that the flexible substrate cannot be effectively bound and connected.
  • FIG. 1 is a schematic perspective view of a flexible substrate provided by the first embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a hard structure provided by an embodiment of the present invention.
  • FIG 3 is a perspective schematic view of a flexible substrate provided by a second embodiment of the present invention.
  • FIG. 4 is a perspective schematic view of a flexible substrate provided by a third embodiment of the present invention.
  • FIG. 5 is a perspective schematic view of a flexible substrate provided by a fourth embodiment of the present invention.
  • FIG. 6 is a schematic perspective view of a flexible substrate provided by a fifth embodiment of the present invention.
  • FIG. 7 is a schematic perspective view of a flexible panel provided by an embodiment of the present invention.
  • FIG. 8 is a schematic front view of an electronic device provided by an embodiment of the present invention.
  • FIG. 1 is a three-dimensional schematic diagram of a flexible substrate according to a first embodiment of the present invention.
  • the flexible substrate 10 includes a first region 11 and a second region 13 connected to the first region 11.
  • the portion of the flexible substrate 10 located in the second region 13 has a greater hardness than the portion located in the first region 11.
  • the second region 13 Used for bonding bonding of electronic devices (not shown). Since the flexible substrate 10 includes the second region 13 for bonding and bonding with the electronic device, when the electronic device is bonding and bonding on the second region 13, the flexible substrate 10 is not easily damaged and deformed, and the flexible substrate is extended The service life of wood 10.
  • the manufacturing material of the flexible substrate 10 located in the first region 11 portion is the first material
  • the manufacturing material of the flexible substrate 10 located in the second region 13 portion is the second material
  • the second material is different from the first material
  • the second material includes a hard material.
  • the hardness of the first material is less than the hardness of the second material. That is, the material of the flexible substrate 10 located in the second region 13 includes a hard material.
  • the flexible substrate 10 is substantially plate-shaped.
  • the flexible substrate 10 further includes a flexible body 15 and a hard structure 17, the hard material is combined with the flexible body 15 to form the second region 13 of the flexible substrate 10, the hard material is located in the The second region forms a hard structure 17, and the first region 11 of the flexible substrate 10 is provided with only the flexible body 15, so that the portion of the flexible substrate 10 located in the second region 13 is harder than the portion located in the first region 11 hardness.
  • the hard material is used to increase the hardness of the flexible substrate 10 in the second region 13 and further improve the mechanical and mechanical properties of the flexible substrate 10 in the second region 13 so that the flexible substrate 10 is located in the second region
  • the part 13 is resistant to high temperature and pressure.
  • the hard structure 17 is a three-dimensional network structure, and the flexible body 15 and the chain structure of the hard material are fitted into one body.
  • the height of the second region 13 is the same as the thickness of the flexible substrate 10, so that the flexible substrate 10 forms a structure with a flat surface and improved surface hardness in the second region 13, which facilitates binding of electronic devices in the second region 13.
  • the first material may be a thermoplastic elastomer plastic material such as polyurethane, silicone, rubber, or the like.
  • the flexible body 15 can be formed into a film by processes such as blow molding, calendering, casting, and casting.
  • the hard material includes an insulated metal.
  • the insulation treatment may be an insulation treatment method such as coating an insulation material on the metal surface. It can be understood that the material of the hard structure 17 is not limited to insulated metal, but may be at least insulated metal, high-strength polyester nylon, glass fiber, and insulated high-strength carbon fiber. One kind.
  • the first material may also be a thermosetting plastic material, such as vulcanized rubber.
  • the hard material forms a hard structure 17 to form the second region 13 of the flexible substrate 10.
  • the first material may flow into a liquid or semi-liquid state, and the hard material is mixed and filled in the local area to form a hard structure 17 to form Second area 13.
  • the heating temperature is 130-180 degrees Celsius, a pressure of 0.1-5 MPa is applied, and the temperature is maintained for 10-30 seconds, the flexible body 15 is made
  • the material is in a flowing liquid state or a semi-liquid state; after cooling, the hard structure 17 formed of the hard material is integrated with the flexible body 15 at the position of the second region 13 as a mechanical skeleton to form the second region 13 of the flexible substrate 10, in other words
  • the flexible body 15 and the segment structure of the hard material are fitted with each other to form an integral body.
  • the overall material hardness after compounding is between the hardness of each component.
  • the first material with low hardness is liquid or semi-liquid
  • a hard material is filled in a predetermined area, thereby generating a portion of the flexible substrate 10 located in the second area 13 having a hardness higher than that of the first material.
  • the local area of the prefabricated base material is heated and pressed to fill or embed the hard structure 17 into the local area. After cooling, a flexible substrate 10 with a uniform thickness is finally formed.
  • the bonding temperature range is usually 150-160 degrees Celsius
  • the applied pressure range is 1-3Mpa
  • the time is 10-20 seconds, which is calculated according to the pencil hardness standard.
  • the hardness of the flexible substrate 10 in the second region 13 is greater than the hardness of HB.
  • the second region 13 of the flexible substrate 10 will not be affected by Damaged by binding temperature and pressure.
  • the hard structure 17 may not be a three-dimensional network structure, and the hard structure 17 may be a two-dimensional network structure, that is, as shown in FIG. 2, the hard structure may also be a sheet-like network structure.
  • the hard structure 17 may also be a non-network structure.
  • the hard structure 17 may be a sheet.
  • the flexible body 15 forms a receiving slot in the second region 13. The hard structure 17 is received in the receiving slot and is connected to the receiving The side walls of the groove are joined together.
  • FIG. 3 is a perspective schematic view of a flexible substrate provided by a second embodiment of the present invention.
  • the flexible substrate 20 is similar in structure to the flexible substrate 10 provided in the first embodiment.
  • the flexible substrate 20 includes a first region 21 and a second region 23 connected to the first region 21.
  • the hardness of the portion of the flexible substrate 20 located in the second region 23 is greater than the hardness of the portion of the flexible substrate 20 located in the first region 21.
  • the second area 23 is used for bonding of electronic devices.
  • the flexible substrate 20 is different from the flexible substrate 10 provided in the first embodiment in that the hard material in the material of the flexible substrate 20 located in the portion of the second region 23 is micro-nano particles.
  • the manufacturing material of the flexible substrate 20 provided in the first region 21 is the first material
  • the manufacturing material of the flexible substrate 20 located in the second region 23 is the second material.
  • the second material is made by doping the first material with a mixed hard material.
  • the first material is an organic material
  • the micro-nano particles are inorganic particulate silicon powder.
  • the surface of the inorganic particle powder is modified, such as lipophilic treatment, and polymer dispersion is added
  • the agent is coated on the surface of the particles, and the particles are treated with a coupling agent to provide affinity groups of organic and inorganic materials to improve the fusion effect.
  • micro-nano particles are not limited, for example, the micro-nano particles include calcium powder, silicon nitride powder, silica powder, alumina powder, micro-nano-length glass fiber, insulation-treated micro-nano-length carbon fiber, hard At least one of qualitative plastic micro-nano particles.
  • FIG. 4 is a perspective schematic view of a flexible substrate provided by a third embodiment of the present invention.
  • the flexible substrate 30 is similar in structure to the flexible substrate 20 provided in the second embodiment, except that the flexible substrate 30 further includes a third region 35, and the portion of the flexible substrate 30 located in the third region 35 has a hardness less than that of the flexible substrate The hardness of the material 30 located in the second region 33 and the hardness of the third region 35 are greater than the hardness of the flexible substrate 30 located in the first region 31.
  • the third region 35 is used to reduce the influence of mechanical differences caused by materials in different regions of the flexible substrate 30 and improve the bonding strength between the regions of the flexible substrate 30.
  • the number of the third regions 35 is two, which are located on both sides of the second region 33, and the sides of each third region 35 are respectively adjacent to the second region 33 and the adjacent first region 31. The two sides of the second area 33 and the first area 31 on both sides of the second area 33 are connected together.
  • the manufacturing material of the flexible substrate 30 in the second region 33 and the manufacturing material of the flexible substrate 30 in the third region 35 both include micro-nano particles.
  • the density of the micro-nano particles in the third region 35 is less than the density of the micro-nano particles in the second region 33, so that the hardness of the flexible substrate 30 located in the third region 35 is less than that of the flexible substrate 30
  • the hardness of the second region 33 is described. It is assumed that the manufacturing material of the flexible substrate 30 in the first region 31 is the first material, the manufacturing material of the flexible substrate 30 in the second region 33 is the second material, and the manufacturing material of the flexible substrate 30 in the third region 35 is The finished material is a third material.
  • the second material and the third material are formed by doping and mixing hard micro-nano particles in the first material, but the proportion of micro-nano particles mixed and filled in the second region 33 is higher than In the third region 35, the proportion of filled micro-nano particles is mixed.
  • the mass ratio of the first material to the micro-nano particles in the second region 33 is 1: 1; in the third region 35, the filling ratio is reduced, such as the third region 35
  • the mass ratio of the first material to the micro-nano particles is reduced to 1: 0.5, so that the density of the micro-nano particles in the second region 33 is greater than the density of the micro-nano particles in the third region 35, reaching the flexible substrate 30 in
  • the hardness of the second region 33 is greater than the hardness of the third region 35.
  • FIG. 5 is a schematic perspective view of a flexible substrate according to a fourth embodiment of the present invention.
  • the flexible substrate 40 is similar in structure to the flexible substrate 10 provided in the first embodiment.
  • the flexible substrate 40 includes a first region 41 and a second region 43 connected to the first region 41.
  • the hardness of the flexible substrate 40 located in the second region 43 is greater than the hardness of the flexible substrate 40 located in the first region 41.
  • the area 43 is used for bonding and bonding of electronic devices.
  • the manufacturing material of the flexible substrate 40 provided in the first region 41 is the first material
  • the manufacturing material of the flexible substrate 40 located in the second region 43 is the second material.
  • the flexible substrate 40 differs from the flexible substrate 10 provided in the first embodiment in that the second material is made after adjusting the synthetic formula of the first material.
  • the adjustment includes increasing the curing crosslink density, Add at least one of hard functional groups and reactive short-branched chains to improve the mechanical and mechanical properties of the flexible substrate 40 located in the second region 43, so that the hardness of the flexible substrate 40 located in the second region 43 is greater than the flexibility
  • the hardness of the base material 40 is located in the remaining area.
  • an additive is added to the synthetic formula of the first material for adjustment, and the additive includes a high-functionality, low-molecular-weight polyether polyol having a functionality of 3 or more, an aromatic polyol, a heterocyclic polyol, At least one of aromatic polyisocyanates such as diphenylmethane diisocyanate, aromatic diamines such as 3,3'dichloro-4,4'-benzylalkyldiamine, and aromatic polyamines.
  • the additive can be used as a cross-linking agent and a chain extender, so that there are many hard segments in the polymer segment, thereby increasing the hardness of the elastomer.
  • the second material is filled between the first regions 41, the first material and the second material are melted and After cooling, the hybrid spliced flexible substrate 40 is formed.
  • FIG. 6 is a perspective schematic view of a flexible substrate provided by a fifth embodiment of the present invention.
  • the flexible substrate 50 is similar in structure to the flexible substrate 40 provided in the fourth embodiment.
  • the flexible substrate 50 includes a first region 51 and a second region 53 connected to the first region 51.
  • the hardness of the flexible substrate 50 located in the second region 53 is greater than the hardness of the flexible substrate 50 located in the first region 51.
  • the area 53 is used for bonding and bonding of electronic devices.
  • the flexible substrate 50 differs from the flexible substrate 40 provided in the fourth embodiment in that the flexible substrate 50 further includes a third region 55.
  • the third region 55 is located between the first region 51 and the second region 53.
  • the flexible substrate The hardness of the portion 50 located in the third region 55 is less than the hardness of the portion of the flexible substrate 50 located in the second region 53, and the hardness of the portion of the flexible substrate 50 located in the third region 55 is greater than the hardness of the portion of the flexible substrate 50 located in the first region 51.
  • the manufacturing material of the flexible substrate 50 located in the first region 51 is the first material
  • the manufacturing material of the flexible substrate 50 located in the second region 53 is the second material
  • the manufacturing material of the flexible substrate 50 is located in the third region 55
  • the finished material is the third material.
  • the first material may be a thermoplastic elastomer plastic material such as polyurethane, silicone, rubber, or the like.
  • the second material is made by adjusting the synthetic formula of the first material, and the adjusting includes at least one of increasing curing crosslink density, increasing hard functional groups, and increasing reactive short-chain branches.
  • an additive is added to the monomer synthesis formulation of the first material for adjustment, and the additive includes a high-functionality and low-molecular-weight polyether polyol having a functionality of 3 or more, an aromatic polyol, and a heterocyclic polyhydric At least one of aromatic polyisocyanates such as alcohol, diphenylmethane diisocyanate, and aromatic diamines such as 3,3'dichloro-4,4'- benzhydrylalkanediamine and aromatic polyamines.
  • the additive can be used as a cross-linking agent and a chain extender to increase the hardness of the elastomer by increasing the number of hard segments in the polymer segment.
  • the third material is a mixed hard material of the first material.
  • the hard material is micro-nano particles, and the micro-nano particles are inorganic particle silicon fine powder.
  • the material of the hard micro-nano particles is not limited, it can make the hardness of the flexible substrate 50 in the third region 55 is greater than the hardness in the first region 51, and the flexible substrate 50 in the third region 55 The hardness of the part is less than the hardness of the flexible substrate 50 in the second region 53 and it does not have to adversely affect the binding.
  • the hard micro-nano particles include at least one of calcium powder, silicon nitride powder, silica powder, alumina powder, micro-nano-length glass fibers, insulation-treated micro-nano-length carbon fibers, and rigid plastic micro-nano particles Species. It can be understood that the hard material is not limited to micro-nano particles, and the hard material may be a hard network structure, a hard layer structure, or the like.
  • the manufacturing material of the flexible substrate 50 located in the second region 53 is not limited, and the manufacturing material of the flexible substrate 50 located in the third region 55 is not limited.
  • the hardness of the region 53 is greater than the hardness of the flexible substrate 50 located in the third region 55, and the hardness of the flexible substrate 50 located in the third region 55 is greater than the hardness of the flexible substrate 50 located in the first region 51, for example, the flexible substrate
  • the manufacturing material of the portion 50 located in the second region 53 may be a third material, and the manufacturing material of the portion of the flexible substrate 50 located in the third region 55 may be the second material.
  • the present invention also provides a flexible panel 100 including a flexible substrate 60, a first electronic device 101 and a second electronic device 103.
  • the flexible substrate 60 may be the flexible substrate 10 provided in the first embodiment One of the flexible substrate 20 provided in the second embodiment, the flexible substrate 30 provided in the third embodiment, the flexible substrate 40 provided in the fourth embodiment, and the flexible substrate 50 provided in the fifth embodiment.
  • the flexible panel 100 is a touch panel
  • the first electronic device 101 is a touch electrode
  • the second electronic device 103 is a flexible circuit board.
  • the flexible panel 100 may be other structures or functional modules, for example, the flexible panel 100 may be a flexible display panel, the first electronic device 101 may be other devices, and the second electronic device 103 may be other devices.
  • the flexible substrate 60 includes a first area 61 and a second area 63. Among them, the first electronic device 101 and the second electronic device 103 are bonded in the second region 63 by binding. Further, the first electronic device 101 is provided on the first region 61 of the flexible substrate 60, and the terminal 1011 of the first electronic device 101 and the second electronic device 103 are bonded in the second region 63 by binding, thereby achieving The first electronic device 101 and the second electronic device 103 are joined in the second region 63 by binding.
  • the first electronic device 101 and the second electronic device 103 are conductively thermocompression bonded by anisotropic conductive film (Anisotropic Conductive Film, ACF).
  • an anisotropic conductive adhesive at a low pressure combination temperature such as an anisotropic conductive adhesive composed of Sn and Bi low-melting alloy microparticles, an anisotropic conductive adhesive with a low curing temperature epoxy curing system, or a thermoplastic
  • the rubber resin system is an anisotropic conductive adhesive of the curing system.
  • the binding temperature can also be reduced to 100-130 degrees.
  • the applied pressure range is 1-3Mpa, the time is 10-20 seconds, and the pressure can reach 7-20N / cm. After bonding strength.
  • the hardness of the flexible substrate 60 in the second region 63 is relatively high, it can withstand high temperature and pressure, and avoid damage to the flexible substrate 60, which is beneficial to increase the service life of the flexible substrate 60 and solves the problem that the flexible substrate cannot be effectively The problem of binding connection.
  • the present invention also provides a schematic front view of an electronic device 200 having the flexible panel 100 described above.
  • the electronic device 200 may be a mobile phone, a tablet computer, a reader, a game machine, and so on.

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Abstract

本发明公开一种柔性基材(10)，包括第一区域(11)及与所述第一区域(11)连接设置的第二区域(13)，所述柔性基材(10)位于所述第二区域(13)部分的硬度大于所述柔性基材(10)位于所述第一区域(11)部分的硬度，所述柔性基材(10)的第二区域(13)用于电子器件进行绑定接合，使得电子器件在第二区域(13)进行绑定接合时，柔性基材(10)不易受损及变形，延长柔性基材(10)的使用寿命，解决了柔性基材上无法进行有效的绑定连接的问题。本发明还提供一种柔性面板及电子设备。

Description

柔性基材、柔性面板及电子设备 技术领域
本发明涉及电子技术领域，特别涉及一种柔性基材、柔性面板及电子设备。
背景技术
柔性电子设备，例如柔性触控面板具有易于弯折、携带方便、耐弯折等突出特点，受到越来越多的关注。现有技术中，设于柔性基材的功能层(例如触控电极层)需引出部分在柔性基材上与电子器件绑定接合，然而，绑定接合时施加的温度较高以及施加的压力较高，容易对柔性基材进行损坏，因而柔性基材无法满足绑定材料的工艺实施条件而无法进行有效的绑定连接。
发明内容
为解决上述问题，本发明实施例公开一种不易损坏的柔性基材、柔性面板及电子设备。
一种柔性基材，包括第一区域及与所述第一区域连接设置的第二区域，所述柔性基材位于所述第二区域的部分的硬度大于所述柔性基材位于所述第一区域的部分的硬度，所述柔性基材的第二区域用于电子器件进行绑定接合。
一种柔性面板，包括如上所述的柔性基材。
一种电子设备，包括如上所述的柔性面板。
本发明提供的柔性基材、柔性面板及电子设备，由于所述柔性基材包括用于电子器件进行绑定接合的第二区域，使得电子器件在所述第二区域进行绑定接合时，所述柔性基材不易受损及变形，延长所述柔性基材的使用寿命，解决了柔性基材上无法进行有效的绑定连接的问题。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一 些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明第一实施方式提供的一种柔性基材的立体示意图。
图2为本发明一实施方式提供的硬质结构的示意图。
图3为本发明第二实施方式提供的一种柔性基材的立体示意图。
图4为本发明第三实施方式提供的一种柔性基材的立体示意图。
图5为本发明第四实施方式提供的一种柔性基材的立体示意图。
图6为本发明第五实施方式提供的一种柔性基材的立体示意图。
图7为本发明实施方式提供的一种柔性面板的立体示意图。
图8为本发明实施方式提供的一种电子设备的正面示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，图1为本发明第一实施方式提供的一种柔性基材的立体示意图。柔性基材10包括第一区域11及与第一区域11连接的第二区域13，柔性基材10位于第二区域13的部分的硬度大于位于第一区域11的部分的硬度，第二区域13用于电子器件(图未示)进行绑定(bonding)接合。由于柔性基材10包括用于与电子器件进行绑定接合的第二区域13，使得电子器件在第二区域13上进行绑定接合时，柔性基材10不易受损及变形，延长了柔性基材10的使用寿命。
柔性基材10位于第一区域11部分的制成材料为第一材料，柔性基材10位于第二区域13部分的制成材料为第二材料，所述第二材料不同于所述第一材料。所述第二材料包括硬质材料。所述第一材料的硬度小于所述第二材料的硬度。即柔性基材10位于第二区域13的部分的制成材料包括硬质材料。柔性 基材10大致呈板体状。具体的，柔性基材10还包括柔性本体15及硬质结构17，所述硬质材料与所述柔性本体15结合形成所述柔性基材10的第二区域13，所述硬质材料在所述第二区域形成硬质结构17，柔性基材10的第一区域11则仅设置柔性本体15，从而使得柔性基材10位于第二区域13的部分的硬度大于位于第一区域11的部分的硬度。所述硬质材料用于提高柔性基材10在第二区域13部分的硬度，进而提高柔性基材10位于第二区域13的部分的机械性能及力学性能，使得柔性基材10位于第二区域13的部分耐高温及耐压。
本实施方式中，硬质结构17为三维立体网络结构，柔性本体15与硬质材料的链段结构相互嵌合成一体。第二区域13的高度与柔性基材10的厚度相同，使得柔性基材10形成一个表面平整的且在第二区域13的表面硬度提高的结构，方便电子器件在第二区域13进行绑定。
所述第一材料可以为聚氨酯、有机硅、橡胶等热塑料弹性体塑料材质。柔性本体15可通过吹塑、压延、流延、浇注等工艺制造成膜。所述硬质材料包括经绝缘处理的金属。所述经绝缘处理可以为在金属表面上涂覆绝缘材料等绝缘处理方式。可以理解，硬质结构17的制成材料并不限定为经绝缘处理的金属，还可以为经绝缘处理的金属、高强度聚酯尼纶、玻璃纤维、经绝缘处理的高强度碳纤维中的至少一种。在其他实施方式中，所述第一材料还可以选用热固性塑料材质，例如硫化橡胶。
通过在柔性本体15的成膜工艺中局部填充埋入硬质材料，所述硬质材料形成硬质结构17从而形成柔性基材10的第二区域13。具体的，制备柔性基材10时，在一定加热加压情况下，第一材料可流动成液态或半液态，在所述局部区域混合填入所述硬质材料形成硬质结构17，以形成第二区域13。以柔性本体15的制成材料为热塑性弹性体聚氨酯(Thermoplastic polyurethanes，TPU)为例，加热温度至130-180摄氏度，施加0.1-5MPa的压力，且保温10-30秒，柔性本体15的制成材料呈流动液态或半液态；冷却后，硬质材料形成的硬质结构17在第二区域13的位置作为力学骨架与柔性本体15融为一体形成柔性基材10的第二区域13，换句话说，柔性本体15与所述硬质材料的链段结构相互嵌合形成一体。
由于复合材料的硬度与各组分硬度相关，复合后整体材料硬度介于各成分 硬度之间，本实施方式中，在制备柔性基材10时，在低硬度的第一材料呈液态或半液态时，在预设区域中填充硬质材料，从而生成硬度高于第一材料的硬度的位于第二区域13的柔性基材10部分。
可以理解，还可以对柔性本体15的制成材料进行熔融形成预制基材后，再对所述预制基材的局部区域进行加热加压，将硬质结构17填充或埋入所述局部区域进行冷却，最终形成统一厚度的柔性基材10。
本实施方式中，电子器件进行绑定时，通常绑定温度范围为150-160摄氏度，施加的压力范围为1-3Mpa，时间为10-20秒，以铅笔硬度(pencil hardness)标准来算，柔性基材10在第二区域13的硬度大于HB的硬度，较佳地，柔性基材10在第二区域13的硬度范围为H-3H时，柔性基材10的第二区域13不会因绑定温度及压力而受损。
在其他实施方式中，硬质结构17可以不为三维立体网络结构，硬质结构17可以为二维网络结构，即，如图2所示，硬质结构也可为片状式的网络结构。硬质结构17也可以为非网络结构，硬质结构17可以为片体，例如，柔性本体15在第二区域13形成收容槽，硬质结构17收容于所述收容槽内并与所述收容槽的侧壁结合于一起。
请参阅图3，图3为本发明第二实施方式提供的一种柔性基材的立体示意图。柔性基材20与第一实施方式提供的柔性基材10结构相似。柔性基材20包括第一区域21及与第一区域21连接的第二区域23，柔性基材20位于第二区域23的部分的硬度大于柔性基材20位于第一区域21的部分的硬度，第二区域23用于电子器件进行绑定(bonding)接合。
柔性基材20与第一实施方式提供的柔性基材10的不同在于，位于第二区域23部分的柔性基材20的制成材料中的硬质材料为微纳米颗粒。换句话说，设置于第一区域21的柔性基材20的制成材料为第一材料，位于第二区域23的柔性基材20的制成材料为第二材料。所述第二材料通过在所述第一材料掺杂混合硬质材料制成。本实施方式中，所述第一材料为有机材料，所述微纳米颗粒为无机颗粒硅微粉。在制备柔性基材20时，为提高所述无机微纳米颗粒硅微粉与有机的第一材料的分散混合相容性，对无机颗粒粉体表面进行改性，如亲油性处理，加入高分子分散剂包覆于颗粒表面、加入偶联剂处理颗粒，以 提供有机、无机材质的亲合基团，提高熔合效果。
当然，对所述微纳米颗粒不作限定，例如，所述微纳米颗粒包括钙粉、氮化硅粉、二氧化硅粉、氧化铝粉、微纳米长度玻璃纤维、绝缘处理微纳米长度碳纤维、硬质塑料微纳米颗粒中的至少一种。
请参阅图4，图4为本发明第三实施方式提供的一种柔性基材的立体示意图。柔性基材30与第二实施方式提供的柔性基材20结构相似，不同在于，柔性基材30还包括第三区域35，柔性基材30位于所述第三区域35的部分的硬度小于柔性基材30位于第二区域33的部分的硬度，位于第三区域35的硬度大于位于第一区域31的柔性基材30的硬度。
第三区域35用于降低柔性基材30上不同区域因材料引起的力学差异的影响，提高柔性基材30各区域之间的接合强度。本实施方式中，第三区域35的数量为两个，分别位于第二区域33的两侧，每个第三区域35的两侧分别与相邻的第二区域33及相邻第一区域31结合，而将第二区域33的两侧和位于第二区域33两侧的第一区域31连接在一起。
位于第二区域33的柔性基材30的制成材料与第三区域35的柔性基材30的制成材料均包括微纳米颗粒。所述微纳米颗粒在第三区域35的密度小于所述微纳米颗粒在第二区域33的密度，使得柔性基材30位于所述第三区域35部分的硬度小于所述柔性基材30位于所述第二区域33部分的硬度。设第一区域31的柔性基材30的制成材料为第一材料，位于第二区域33的柔性基材30的制成材料为第二材料，位于第三区域35的柔性基材30的制成材料为第三材料，所述第二材料与所述第三材料通过在所述第一材料掺杂混合硬质微纳米颗粒形成，但在第二区域33混合填充的微纳米颗粒比例高于在第三区域35混合填充的微纳米颗粒比例。
以下举例进行说明，在制备柔性基材30时，在第二区域33的第一材料与微纳米颗粒的质量比例为1：1；在第三区域35则降低填充比例，比如第三区域35的第一材料与微纳米颗粒的质量比例降为1：0.5，如此使得所述微纳米颗粒在第二区域33的密度大于所述微纳米颗粒在第三区域35的密度，达到柔性基材30在第二区域33部分的硬度大于在第三区域35部分的硬度。
请参阅图5，图5为本发明第四实施方式提供的一种柔性基材的立体示意 图。柔性基材40与第一实施方式提供的柔性基材10结构相似。柔性基材40包括第一区域41及与第一区域41连接的第二区域43，柔性基材40位于第二区域43部分的硬度大于柔性基材40位于第一区域41部分的硬度，第二区域43用于电子器件进行绑定接合。
设置于第一区域41的柔性基材40的制成材料为第一材料，位于第二区域43的柔性基材40的制成材料为第二材料。柔性基材40与第一实施方式提供的柔性基材10的不同在于，所述第二材料为对所述第一材料的合成配方进行调整后制成，所述调整包括增加固化交联密度、增加硬质官能团、增加反应短支链中的至少一种，从而提高位于第二区域43的柔性基材40的机械性能及力学性能，使得柔性基材40位于第二区域43部分的硬度大于柔性基材40位于其余区域部分的硬度。例如，在所述第一材料的合成配方中添加添加物进行调整，所述添加物包括官能度3以上的高官能度低分子量的聚醚多元醇、芳香族多元醇、杂环系多元醇、二苯基甲烷二异氰酸酯等芳香族多异氰酸酯、3,3'二氯–4,4'-二苯甲基烷二胺等芳香族二胺、芳香族多胺中的至少一种。所述添加物能够作为交联剂、扩链剂，使聚合物链段中硬段较多，从而提高弹性体的硬度。
在所述第一材料成膜形成柔性基材40位于第一区域41的部分时，在第一区域41之间填充所述第二材料，所述第一材料与所述第二材料进行熔融及冷却后形成混合拼接的柔性基材40。
请参阅图6，图6为本发明第五实施方式提供的一种柔性基材的立体示意图。柔性基材50与第四实施方式提供的柔性基材40结构相似。柔性基材50包括第一区域51及与第一区域51连接的第二区域53，柔性基材50位于第二区域53部分的硬度大于柔性基材50位于第一区域51部分的硬度，第二区域53用于电子器件进行绑定接合。
柔性基材50与第四实施方式提供的柔性基材40的不同在于，柔性基材50还包括第三区域55，第三区域55位于第一区域51及第二区域53之间，柔性基材50位于第三区域55部分的硬度小于柔性基材50位于第二区域53部分的硬度，柔性基材50位于第三区域55部分的硬度大于柔性基材50位于第一区域51部分的硬度。
柔性基材50位于第一区域51部分的制成材料为第一材料，柔性基材50位于第二区域53部分的制成材料为第二材料，柔性基材50位于第三区域55部分的制成材料为第三材料。
所述第一材料可以为聚氨酯、有机硅、橡胶等热塑料弹性体塑料材质。
所述第二材料为对所述第一材料的合成配方进行调整后制成，所述调整包括增加固化交联密度、增加硬质官能团、增加反应短支链中的至少一种。例如，在所述第一材料的单体合成配方中添加添加物进行调整，所述添加物包括官能度3以上的高官能度低分子量的聚醚多元醇、芳香族多元醇、杂环系多元醇、二苯基甲烷二异氰酸酯等芳族多异氰酸酯、3,3'二氯–4,4'-二苯甲基烷二胺等芳香族二胺、芳香族多胺中的至少一种。所述添加物能够作为交联剂、扩链剂，使聚合链段中硬段较多，从而提高弹性体的硬度。
所述第三材料为所述第一材料混合硬质材料。本实施方式中，所述硬质材料为微纳米颗粒，所述微纳米颗粒为无机颗粒硅微粉。当然，对所述硬质微纳米颗粒的材料不作限定，其能够使柔性基材50在第三区域55部分的硬度大于在第一区域51部分的硬度，及柔性基材50在第三区域55部分的硬度小于柔性基材50在第二区域53部分的硬度，且对绑定不造成不良影响即可。例如，所述硬质微纳米颗粒包括钙粉、氮化硅粉、二氧化硅粉、氧化铝粉、微纳米长度玻璃纤维、绝缘处理微纳米长度碳纤维、硬质塑料微纳米颗粒中的至少一种。可以理解，所述硬质材料不限定为微纳米颗粒，所述硬质材料可以为硬质网络结构、硬质层状结构等。
在其他实施方式中，不限定柔性基材50位于第二区域53部分的制成材料，不限定柔性基材50位于第三区域55部分的制成材料，仅需满足柔性基材50位于第二区域53部分的硬度大于柔性基材50位于第三区域55部分的硬度，柔性基材50位于第三区域55部分的硬度大于柔性基材50位于第一区域51部分的硬度，例如，柔性基材50位于第二区域53部分的制成材料可以为第三材料，柔性基材50位于第三区域55部分的制成材料可以为第二材料。
请参阅图7，本发明还提供一种柔性面板100，其包括柔性基材60、第一电子器件101及第二电子器件103，柔性基材60可以为第一实施方式提供的柔性基材10、第二实施方式提供的柔性基材20、第三实施方式提供的柔性基 材30、第四实施方式提供的柔性基材40、第五实施方式提供的柔性基材50中的一种。本实施方式中，柔性面板100为触控面板，第一电子器件101为触控电极，第二电子器件103为柔性电路板。可以理解，柔性面板100可以为其他结构或功能模组，例如柔性面板100可以为柔性显示面板，第一电子器件101可以为其他器件，第二电子器件103可以为其他器件。
柔性基材60包括第一区域61及第二区域63。其中，第一电子器件101与第二电子器件103在第二区域63通过绑定方式接合。进一步的，第一电子器件101设于柔性基材60的第一区域61上，通过第一电子器件101的引出端1011与第二电子器件103在第二区域63通过绑定方式接合，而实现所述第一电子器件101与第二电子器件103在所述第二区域63通过绑定方式接合。本实施方式中，通过异方性导电胶膜(Anisotropic Conductive Film，ACF)将第一电子器件101与第二电子器件103进行导电性热压绑定接合。例如，低压合温度的异方性导电胶，如以Sn、Bi组成的低熔点合金微颗粒组成的异方性导电胶，以低固化温度的环氧固化体系异方性导电胶，或以热塑性橡胶树脂系为固化体系的异方性导电胶，绑定温度还可以降低到100-130度，施加的压力范围为1-3Mpa，时间10-20秒，可达到7-20N/cm的压合后粘接强度。
由于柔性基材60在第二区域63的硬度较高，能够耐高温及压力，避免柔性基材60受到损坏，有利于提高柔性基材60的使用寿命，解决了柔性基材上无法进行有效的绑定连接的问题。
请参阅图8，本发明还提供一种的具上述柔性面板100的电子设备200的正面示意图。电子设备200可以为手机、平板电脑、阅读器、游戏机等。
以上所述是本发明的优选实施例，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (19)

  1. 一种柔性基材，其特征在于，所述柔性基材包括第一区域及与所述第一区域连接设置的第二区域，所述柔性基材位于所述第二区域的部分的硬度大于所述柔性基材位于所述第一区域的部分的硬度，所述柔性基材的第二区域用于电子器件进行绑定接合。
  2. 如权利要求1所述的柔性基材，其特征在于，所述柔性基材位于所述第一区域部分的制成材料为第一材料，所述柔性基材位于所述第二区域部分的制成材料为第二材料，所述第二材料不同于所述第一材料。
  3. 如权利要求2所述的柔性基材，其特征在于，所述第二材料包括硬质材料。
  4. 如权利要求3所述的柔性基材，其特征在于，所述柔性基材包括柔性本体及硬质结构，所述硬质材料与所述柔性本体结合形成所述柔性基材的第二区域，所述硬质材料在所述第二区域形成硬质结构，所述柔性基材的第一区域仅设置所述柔性本体，使得位于所述第二区域的柔性基材的硬度大于位于所述第一区域的柔性基材的硬度。
  5. 如权利要求4所述的柔性基材，其特征在于，所述硬质结构为网络结构，所述柔性本体与所述硬质材料的链段结构相互嵌合形成一体。
  6. 如权利要求5所述的柔性基材，其特征在于，所述硬质结构为三维立体网络结构。
  7. 如权利要求6所述的柔性基材，其特征在于，所述硬质结构的厚度与所述柔性基材的厚度相同。
  8. 如权利要求4所述的柔性基材，其特征在于，所述硬质材料包括经绝缘处理的金属、高强度聚酯尼纶、玻璃纤维、经绝缘处理的高强度碳纤维中的至少一种。
  9. 如权利要求3所述的柔性基材，其特征在于，所述硬质材料为微纳米颗粒。
  10. 如权利要求9所述的柔性基材，其特征在于，所述柔性基材还包括第三区域，所述第三区域位于所述第一区域及所述第二区域之间，所述柔性基材位 于所述第三区域部分的制成材料包括微纳米颗粒，所述微纳米颗粒在所述第三区域的密度小于所述微纳米颗粒在所述第二区域的密度，所述柔性基材位于所述第三区域部分的硬度小于所述柔性基材位于所述第二区域部分的硬度，所述柔性基材位于所述第三区域部分的硬度大于所述柔性基材位于所述第一区域部分的硬度。
  11. 如权利要求9所述的柔性基材，其特征在于，所述微纳米颗粒为无机颗粒硅微粉、钙粉、氮化硅粉、二氧化硅粉、氧化铝粉、微纳米长度玻璃纤维、绝缘处理微纳米长度碳纤维、硬质塑料微纳米颗粒中的至少一种。
  12. 如权利要求2所述的柔性基材，其特征在于，所述第二材料通过对所述第一材料的合成配方进行调整形成，所述调整包括增加固化交联密度、增加硬质官能团、增加反应短支链中的至少一种。
  13. 如权利要求12所述的柔性基材，其特征在于，所述柔性基材还包括第三区域，所述第三区域位于所述第一区域及所述第二区域之间，所述柔性基材位于所述第三区域部分的硬度小于所述柔性基材位于所述第二区域部分的硬度，所述柔性基材位于所述第三区域部分的硬度大于所述柔性基材位于所述第一区域部分的硬度。
  14. 如权利要求13所述的柔性基材，其特征在于，所述柔性基材位于所述第三区域部分的制成材料为第三材料，所述第三材料通过对所述第一材料混合硬质材料制成。
  15. 如权利要求2所述的柔性基材，其特征在于，所述第一材料为热塑料弹性体塑料材质。
  16. 一种柔性面板，其特征在于，包括如权利要求1-15任意一项所述的柔性基材。
  17. 如权利要求16所述的柔性面板，其特征在于，所述柔性面板还包括第一电子器件及第二电子器件，所述第一电子器件与所述第二电子器件在所述第二区域通过绑定方式接合。
  18. 如权利要求17所述的柔性面板，其特征在于，所述第一电子器件为触控电极层，所述触控电极层设于所述第一区域，所述第二电子器件为柔性电路板，通过所述触控电极层延伸至所述第二区域的引出端与所述柔性电路板在所述 第二区域通过绑定方式接合，而实现所述第一电子器件与所述第二电子器件在所述第二区域通过绑定方式接合。
  19. 一种电子设备，其特征在于，包括如权利要求16-18任意一项所述的柔性面板。
PCT/CN2018/111236 2018-10-22 2018-10-22 柔性基材、柔性面板及电子设备 Ceased WO2020082212A1 (zh)

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US8736785B2 (en) * 2011-07-12 2014-05-27 Fujitsu Mobile Communications Limited Liquid crystal display device and electronic device
CN106847871A (zh) * 2017-03-22 2017-06-13 武汉华星光电技术有限公司 Oled显示面板及其显示装置
CN107665854A (zh) * 2017-09-21 2018-02-06 京东方科技集团股份有限公司 背膜结构及其制备方法、柔性显示屏

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CN107968154A (zh) * 2016-10-20 2018-04-27 上海和辉光电有限公司 一种显示装置
CN207303146U (zh) * 2017-10-30 2018-05-01 京东方科技集团股份有限公司 柔性显示器件和显示装置
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US8736785B2 (en) * 2011-07-12 2014-05-27 Fujitsu Mobile Communications Limited Liquid crystal display device and electronic device
CN106847871A (zh) * 2017-03-22 2017-06-13 武汉华星光电技术有限公司 Oled显示面板及其显示装置
CN107665854A (zh) * 2017-09-21 2018-02-06 京东方科技集团股份有限公司 背膜结构及其制备方法、柔性显示屏

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