WO2020080266A1 - Composition de résine photosensible, film durci, dispositif électronique pourvu d'un film durci, et procédé de fabrication dudit dispositif - Google Patents

Composition de résine photosensible, film durci, dispositif électronique pourvu d'un film durci, et procédé de fabrication dudit dispositif Download PDF

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Publication number
WO2020080266A1
WO2020080266A1 PCT/JP2019/040112 JP2019040112W WO2020080266A1 WO 2020080266 A1 WO2020080266 A1 WO 2020080266A1 JP 2019040112 W JP2019040112 W JP 2019040112W WO 2020080266 A1 WO2020080266 A1 WO 2020080266A1
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Prior art keywords
resin composition
photosensitive resin
solvent
group
ether
Prior art date
Application number
PCT/JP2019/040112
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English (en)
Japanese (ja)
Inventor
太郎 北畑
Original Assignee
住友ベークライト株式会社
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Priority to JP2020509127A priority Critical patent/JP7001147B2/ja
Priority to KR1020217014424A priority patent/KR20210080428A/ko
Publication of WO2020080266A1 publication Critical patent/WO2020080266A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0048—Photosensitive materials characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • the present invention relates to a photosensitive resin composition, a cured film, and an electronic device including the cured film.
  • Patent Document 1 includes an alkali-soluble resin, a quinonediazide compound, a surfactant and a solvent, and the surfactant is an organic fluorine compound, a predetermined first silicone compound, a predetermined second silicone compound. It has been disclosed that a photosensitive resin composition containing the above is disclosed. According to the photosensitive resin composition, unevenness during coating is reduced and coating with a uniform film thickness is possible.
  • the photosensitive resin composition described in Patent Document 1 may not spread evenly on a substrate containing an inorganic material, and a coating film having a uniform thickness may not be formed in some cases. It has been found that there is room for improvement in terms of reduction in wettability with respect to a substrate containing an inorganic material, occurrence of dents in the coating film, and exposure of the underlayer.
  • the present inventor diligently studied a photosensitive resin composition.
  • a solvent having a glycol ether structure which is water-soluble and has a boiling point of 130 ° C. or higher, as a component contained in the photosensitive resin composition, the wettability with respect to the substrate containing the inorganic material is improved, and the coating film
  • the present invention has been completed by finding that it is possible to suppress the occurrence of dents, underlayer exposure, etc.
  • the solvent contains a solvent (C-1) having a glycol ether structure which is water-soluble and has a boiling point of 130 ° C. or higher.
  • a cured film obtained by curing the photosensitive resin composition is provided.
  • an electronic device including the cured film.
  • a step of providing an electronic component on one surface of the substrate A coating film forming step of coating a photosensitive resin composition containing an alkali-soluble resin (A), a photosensitive material (B), and a solvent (C) on one surface of the substrate to form a coating film;
  • An exposure step of exposing the formed coating film A developing step of developing the exposed coating film, and a heating step of heating the coating film remaining after the development to cure the coating film to form a permanent film
  • a method of manufacturing an electronic device including a cured film of the photosensitive resin composition comprising: There is provided a method for manufacturing an electronic device, wherein the solvent includes a solvent (C-1) having a glycol ether structure, which is water-soluble and has a boiling point of 130 ° C. or higher.
  • a photosensitive resin having excellent wettability with respect to a substrate containing an inorganic material and capable of stably forming a coating film in which the occurrence of dents, undercoat exposure, etc. in the coating film is suppressed A composition is provided. Further, a cured film obtained by curing the photosensitive resin composition, and an electronic device provided with the cured film are provided.
  • the term “electronic device” means a semiconductor chip, a semiconductor element, a printed wiring board, an electric circuit display device, an information communication terminal, a light emitting diode, a physical battery, a chemical battery, or the like to which an electronic technology is applied. , Device, final product, etc.
  • the photosensitive resin composition for forming a permanent film of the present invention contains an alkali-soluble resin (A), a photosensitizer (B), and a solvent (C), and the solvent (C) is water-soluble and has a boiling point of 130 ° C. or higher.
  • a solvent (C-1) having a glycol ether structure is included.
  • a package called a wafer level package (Wafer Level Package) that is processed at the wafer level up to the final process of the package and completed, or a panel-level package (Panel Level Packaging: PLP), which is a larger panel-shaped substrate
  • Wafer Level Package wafer level package
  • PLP Panel-level package
  • the conventional photosensitive resin composition when a coating film is formed on the surface of a substrate containing an inorganic material, in particular, a dent may be seen in the formed coating film or a part of the underlying layer may be exposed, resulting in uniform coating. It may be difficult to form a resin film having a uniform thickness.
  • the present inventors are water-soluble in the solvent and have a boiling point of 130 ° C. or higher. It was found that a solvent (C-1) having a glycol ether structure is contained, so that a photosensitive resin composition having excellent wettability with respect to a metal and capable of forming a uniform resin film thickness can be obtained, and the present invention is achieved. It has been completed. That is, the conventional photosensitive resin composition has not been compatible with all the various materials existing on the surface of the panel level package or the like.
  • the photosensitive resin composition according to the present embodiment contains the solvent (C-1) having a glycol ether structure which is water-soluble and has a boiling point of 130 ° C. or higher as a solvent, it is present on the photosensitive resin composition and the substrate surface. It is presumed that the compatibility with a wide variety of materials is improved.
  • the photosensitive resin composition is, for example, slit-coated, the photosensitive resin composition is not largely repelled, and it is considered that it is possible to form a coating film having a uniform thickness and no dents or underlayers exposed.
  • the solvent volatilization is appropriately controlled in the drying step after forming the coating film, it is presumed that a resin film with less thickness unevenness is formed.
  • the photosensitive resin composition according to this embodiment includes an alkali-soluble resin (A), a photosensitizer (B), and a solvent (C).
  • the alkali-soluble resin is not limited and can be selected according to the physical properties required for the resin film, such as mechanical properties and optical properties.
  • Specific examples of the alkali-soluble resin include polyamide resin, polybenzoxazole resin, polyimide resin, phenol resin, hydroxystyrene resin, and cyclic olefin resin.
  • the alkali-soluble resin preferably contains at least one of the above specific examples.
  • the alkali-soluble resin may be used alone or in combination of two or more.
  • a polyamide resin or a polybenzoxazole resin is preferably used among the above specific examples, and a polybenzoxazole resin is more preferably used.
  • polyamide resin polybenzoxazole resin
  • PA1 a structural unit represented by the following formula
  • the aromatic ring means a benzene ring; a condensed aromatic ring such as a naphthalene ring, an anthracene ring or a pyrene ring; a heteroaromatic ring such as a pyridine ring or a pyrrole ring.
  • the polyamide resin of the present embodiment preferably contains a benzene ring as an aromatic ring.
  • the polyamide resin containing the structural unit represented by the above formula (PA1) is a precursor of a polybenzoxazole resin.
  • the polyamide resin containing the structural unit represented by the above formula (PA1) is dehydrated and ring-closed by being heat-treated at a temperature of 150 ° C. or higher and 380 ° C. or lower for 30 minutes or longer and 50 hours or shorter. It can be an oxazole resin.
  • the structural unit of the above formula (PA1) becomes a structural unit represented by the following formula (PBO1) by dehydration ring closure.
  • the alkali-soluble resin according to the present embodiment is a polyamide resin containing a structural unit represented by the above formula (PA1)
  • the photosensitive resin composition is subjected to the heat treatment to dehydrate and ring-close the polybenzoxazole resin.
  • the heat-treated photosensitive resin composition contains a polybenzoxazole resin which is an alkali-soluble resin.
  • the alkali-soluble resin is a polyamide resin containing a structural unit represented by the above formula (PA1)
  • a resin film and an electronic device to be described later are produced and then subjected to the heat treatment to dehydrate and ring-close the polybenzoate. It may be an oxazole resin.
  • a polybenzoxazole resin is obtained by subjecting a polyamide resin to ring opening by dehydration, mechanical properties and thermal properties can be improved. This is convenient from the viewpoint of suppressing the deformation of the resin film.
  • polyamide resin polyimide resin
  • a resin containing a structural unit represented by the following general formula (PA2) is a precursor of the polyimide resin.
  • the polyamide resin containing the structural unit represented by the following general formula (PA2) is dehydrated and ring-closed by being heat-treated at a temperature of 150 ° C. or higher and 380 ° C. or lower for 30 minutes or longer and 50 hours or shorter. It can be a resin.
  • the structural unit of the following formula (PA2) becomes a structural unit of the following formula (PI1) by dehydration ring closure.
  • the photosensitive resin composition may be dehydrated and ring-closed by heat treatment to obtain a polyimide resin. That is, the heat-treated photosensitive resin composition contains a polyimide resin which is an alkali-soluble resin. Further, when the alkali-soluble resin is a polyamide resin containing a structural unit represented by the following formula (PA2), dehydration ring closure and polyimide resin are performed by performing the above heat treatment after producing a resin film and an electronic device described later. May be
  • R B and R C are each independently an organic group having 1 to 30 carbon atoms.
  • R B and R C are the same as those in the general formula (PA2).
  • R B and R C in the general formula (PA2) and the general formula (PI1) are preferably organic groups having an aromatic ring.
  • the organic group having an aromatic ring specifically, a group containing a benzene ring, a naphthalene ring or an anthracene ring is preferable, and a group containing a benzene ring is more preferable.
  • the polyamide resin according to this embodiment is polymerized as follows, for example. First, in a polymerization step (S1), a polyamide is polymerized by polycondensing a diamine monomer and a dicarboxylic acid monomer. Then, in the low molecular weight component removing step (S2), the low molecular weight component is removed to obtain a polyamide resin containing polyamide as a main component.
  • Polymerization step (S1) In the polymerization step (S1), a diamine monomer and a dicarboxylic acid monomer are polycondensed.
  • the polycondensation method for polymerizing the polyamide is not limited, and specific examples thereof include melt polycondensation, acid chloride method, and direct polycondensation.
  • a compound selected from the group consisting of tetracarboxylic dianhydride, trimellitic anhydride, dicarboxylic acid dichloride or active ester type dicarboxylic acid may be used.
  • Specific examples of the method for obtaining the active ester type dicarboxylic acid include a method in which the dicarboxylic acid is reacted with 1-hydroxy-1,2,3-benzotriazole or the like.
  • the diamine monomer and dicarboxylic acid monomer used for polymerizing the polyamide resin will be described below.
  • the diamine monomer and the dicarboxylic acid monomer may be used each alone, or two or more diamine monomers and / or two or more dicarboxylic acid monomers may be used.
  • the diamine monomer used for the polymerization is not limited, and for example, a diamine monomer having an aromatic ring in the structure is preferably used, and a diamine monomer having a phenolic hydroxyl group in the structure is more preferably used.
  • a polyamide resin using such a diamine monomer as a raw material, the conformation of the polyamide resin can be controlled and the dispersibility of the composition can be further improved.
  • the diamine monomer having a phenolic hydroxyl group in the structure for example, a compound represented by the following general formula (DA1) is preferable.
  • a compound represented by the following general formula (DA1) is preferable.
  • the conformation of the polyamide resin can be controlled, and the molecular chains of the polyamide resin can form a denser structure. Therefore, it is considered that the molecular structure can be frozen by the coordination in which the molecule of the alkali-soluble resin and the metal molecule are more strongly bound, and the adhesion to the substrate can be improved.
  • the polyamide resin contains a structural unit represented by the following general formula (PA2). That is, the polyamide resin according to the present embodiment preferably contains, for example, a structural unit represented by the following general formula (PA2).
  • R 4 is one selected from the group consisting of a hydrogen atom, a carbon atom, an oxygen atom, a nitrogen atom, a sulfur atom, a phosphorus atom, a silicon atom, a chlorine atom, a fluorine atom and a bromine atom, or It is a group formed by two or more kinds of atoms.
  • R 5 to R 10 each independently represent hydrogen or an organic group having 1 to 30 carbon atoms.
  • R 4 and R 5 to R 10 are the same as those in the general formula (DA1).
  • R 4 in the general formulas (DA1) and (PA2) is selected from the group consisting of hydrogen atom, carbon atom, oxygen atom, nitrogen atom, sulfur atom, phosphorus atom, silicon atom, chlorine atom, fluorine atom and bromine atom.
  • R 4 is a divalent group.
  • the divalent group means valence. That is, it indicates that R 4 has two bonds to bond to another atom.
  • R 4 in the general formulas (DA1) and (PA2) contains a carbon atom
  • R 4 is, for example, a group having 1 to 30 carbon atoms, and preferably a group having 1 to 10 carbon atoms.
  • the group having a number of 1 or more and 5 or less is more preferable, and the group having a carbon number of 1 or more and 3 or less is more preferable.
  • R 4 in the general formulas (DA1) and (PA2) contains a carbon atom
  • specific examples of R 4 include an alkylene group, an arylene group, a halogen-substituted alkylene group, and a halogen-substituted arylene group.
  • the alkylene group may be, for example, a linear alkylene group or a branched alkylene group.
  • linear alkylene group specifically, a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decanylene group, a trimethylene group, a tetramethylene group.
  • Pentamethylene group hexamethylene group and the like.
  • branched alkylene group examples include -C (CH 3 ) 2- , -CH (CH 3 )-, -CH (CH 2 CH 3 )-, -C (CH 3 ) (CH 2
  • An alkylmethylene group such as CH 3 )-, -C (CH 3 ) (CH 2 CH 2 CH 3 )-, -C (CH 2 CH 3 ) 2- ; -CH (CH 3 ) CH 2- , -CH ( CH 3) CH (CH 3) -, - C (CH 3) 2 CH 2 -, - CH (CH 2 CH 3) CH 2 -, - C (CH 2 CH 3) 2 -CH 2 3) 2 - alkyl, such as ethylene Groups and the like.
  • the arylene group examples include a phenylene group, a biphenylene group, a naphthylene group, an anthrylene group, and a group in which two or more arylene groups are bonded to each other.
  • the halogen-substituted alkylene group and the halogen-substituted arylene group specifically, those in which the hydrogen atom in the above-mentioned alkylene group and arylene group is substituted with a halogen atom such as a fluorine atom, a chlorine atom, or a bromine atom are used. You can Among these, it is preferable to use one in which a hydrogen atom is replaced by a fluorine atom.
  • R 4 in the general formulas (DA1) and (PA2) does not contain a carbon atom
  • specific examples of R 4 include a group consisting of an oxygen atom or a sulfur atom.
  • R 5 to R 10 in formulas (DA1) and (PA2) are each independently hydrogen or an organic group having 1 to 30 carbon atoms, such as hydrogen or an organic group having 1 to 10 carbon atoms. It is preferable that hydrogen or an organic group having 1 to 5 carbon atoms is more preferable, hydrogen or an organic group having 1 to 3 carbon atoms is further preferable, and hydrogen or an organic group having 1 to 2 carbon atoms is preferable. More preferably, it is an organic group. This allows the aromatic rings of the polyamide resin to be densely arranged. Therefore, the molecule structure can be frozen and the adhesion can be improved by the coordination in which the molecule of the alkali-soluble resin and the metal molecule are more strongly bound.
  • organic group having 1 to 30 carbon atoms of R 5 to R 10 in the general formulas (DA1) and (PA2) include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, Alkyl groups such as isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, octyl group, nonyl group and decyl group; alkenyl groups such as allyl group, pentenyl group and vinyl group An alkynyl group such as an ethynyl group; an alkylidene group such as a methylidene group and an ethylidene group; an aryl group such as a tolyl group, a xylyl group, a phenyl group, a naphthyl
  • diamine monomer represented by the general formula (DA1) examples include 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane and 4,4′-methylenebis (2-amino-3). , 6 dimethylphenol), 4,4′-methylenebis (2-aminophenol), 1,1-bis (3-amino4-hydroxyphenyl) ethane, 3,3′-diamino-4,4′-dihydroxydiphenyl ether, etc. Is mentioned.
  • the aromatic rings of the polyamide resin can be closely arranged.
  • the molecule structure can be frozen and the adhesion can be improved by the coordination in which the molecule of the alkali-soluble resin and the metal molecule are more strongly bound.
  • the diamine monomer one kind or a combination of two or more kinds among the above specific examples can be used. The structural formulas of these diamine monomers are shown below.
  • the dicarboxylic acid monomer used for the polymerization is not limited, and for example, it is preferable to use a dicarboxylic acid monomer containing an aromatic ring in the structure.
  • a dicarboxylic acid monomer containing an aromatic ring it is preferable to use, for example, one represented by the following general formula (DC1).
  • DC1 general formula 1
  • R 11 is one or more selected from the group consisting of hydrogen atom, carbon atom, oxygen atom, nitrogen atom, sulfur atom, phosphorus atom, silicon atom, chlorine atom, fluorine atom and bromine atom. It is a group formed by two or more kinds of atoms.
  • R 12 to R 19 each independently represent hydrogen or an organic group having 1 to 30 carbon atoms.
  • the polyamide resin typically includes a structural unit represented by the following general formula (PA3).
  • PA3 the definitions of R 11 and R 12 to R 19 are the same as those in the general formula (DC1).
  • R 11 in the general formulas (DC1) and (PA3) is selected from the group consisting of hydrogen atom, carbon atom, oxygen atom, nitrogen atom, sulfur atom, phosphorus atom, silicon atom, chlorine atom, fluorine atom and bromine atom.
  • R 11 is a divalent group.
  • the divalent group means valence. That is, it shows that R 11 has two bonds to bond with other atoms.
  • R 11 in the general formulas (DC1) and (PA3) contains a carbon atom
  • R 11 is, for example, a group having 1 to 30 carbon atoms, preferably a group having 1 to 10 carbon atoms, The group having a number of 1 or more and 5 or less is more preferable, and the group having a carbon number of 1 or more and 3 or less is more preferable.
  • R 11 in the general formulas (DC1) and (PA3) contains a carbon atom
  • specific examples of R 11 include an alkylene group, an arylene group, a halogen-substituted alkylene group, and a halogen-substituted arylene group.
  • the alkylene group may be, for example, a linear alkylene group or a branched alkylene group.
  • linear alkylene group specifically, a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decanylene group, a trimethylene group, a tetramethylene group.
  • Pentamethylene group hexamethylene group and the like.
  • branched alkylene group examples include -C (CH 3 ) 2- , -CH (CH 3 )-, -CH (CH 2 CH 3 )-, -C (CH 3 ) (CH 2
  • An alkylmethylene group such as CH 3 )-, -C (CH 3 ) (CH 2 CH 2 CH 3 )-, -C (CH 2 CH 3 ) 2- ; -CH (CH 3 ) CH 2- , -CH ( CH 3) CH (CH 3) -, - C (CH 3) 2 CH 2 -, - CH (CH 2 CH 3) CH 2 -, - C (CH 2 CH 3) 2 -CH 2 3) 2 - alkyl, such as ethylene Groups and the like.
  • the arylene group examples include a phenylene group, a biphenylene group, a naphthylene group, an anthrylene group, and a group in which two or more arylene groups are bonded to each other.
  • the halogen-substituted alkylene group and the halogen-substituted arylene group specifically, those in which the hydrogen atom in the above-mentioned alkylene group and arylene group is substituted with a halogen atom such as a fluorine atom, a chlorine atom, or a bromine atom are used. You can Among these, it is preferable to use one in which a hydrogen atom is replaced by a fluorine atom.
  • R 11 in the general formulas (DC1) and (PA3) does not contain a carbon atom
  • specific examples of R 11 include a group composed of an oxygen atom or a sulfur atom.
  • R 12 to R 19 in formulas (DC1) and (PA3) are each independently hydrogen or an organic group having 1 to 30 carbon atoms, such as hydrogen or an organic group having 1 to 10 carbon atoms. It is preferable that hydrogen or an organic group having 1 to 5 carbon atoms is more preferable, hydrogen or an organic group having 1 to 3 carbon atoms is further preferable, and hydrogen is further preferable.
  • organic group having 1 to 30 carbon atoms of R 12 to R 19 in the general formulas (DC1) and (PA3) include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, Alkyl groups such as isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, octyl group, nonyl group and decyl group; alkenyl groups such as allyl group, pentenyl group and vinyl group An alkynyl group such as an ethynyl group; an alkylidene group such as a methylidene group and an ethylidene group; an aryl group such as a tolyl group, a xylyl group, a phenyl group, a naphthyl
  • dicarboxylic acid monomer specifically, diphenyl ether 4,4'-dicarboxylic acid, isophthalic acid, terephthalic acid, 4,4'-biphenyldicarboxylic acid or the like can be used.
  • dicarboxylic acid monomer it is preferable to use diphenyl ether 4,4'-dicarboxylic acid or isophthalic acid among the above specific examples, and more preferable to use diphenyl ether 4,4'-dicarboxylic acid.
  • the aromatic rings of the polyamide resin can be closely arranged. Therefore, the molecule structure of the alkali-soluble resin and the metal molecule are more strongly bound to each other, so that the molecular structure can be frozen and the adhesion can be improved.
  • the polyamide resin according to the present embodiment preferably has a terminal amino group modified with a specific acid anhydride or a specific monocarboxylic acid.
  • the specific acid anhydride and the specific monocarboxylic acid have at least one functional group consisting of an alkenyl group, an alkynyl group, and a hydroxyl group.
  • specific acid anhydride and specific monocarboxylic acid for example, those containing a nitrogen atom are preferable. This can improve the adhesion between the photosensitive resin composition after post-baking and the metal.
  • Specific examples of the specific acid anhydride include maleic acid anhydride, citraconic acid anhydride, 2,3-dimethylmaleic acid anhydride, 4-cyclohexene-1,2-dicarboxylic acid anhydride, and exo-3. , 6-Epoxy-1,2,3,6-tetrahydrophthalic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, methyl-5-norbornene-2,3-dicarboxylic anhydride, itaconic anhydride Compounds, het acid anhydride, 4-ethynylphthalic anhydride, 4-phenylethynylphthalic anhydride, 4-hydroxyphthalic anhydride and the like.
  • the specific acid anhydride one or a combination of two or more of the above specific examples can be used.
  • the ring-shaped specific acid anhydride is opened.
  • a ring-shaped structural unit derived from a specific acid anhydride may be closed to form an imide ring.
  • the method for ring closure include heat treatment and the like.
  • Specific examples of the above-mentioned monocarboxylic acid include 5-norbornene-2-carboxylic acid, 4-hydroxybenzoic acid, 3-hydroxybenzoic acid and the like.
  • the specific monocarboxylic acid one kind or a combination of two or more kinds out of the above specific examples can be used.
  • the carboxyl group existing at the terminal of the polyamide resin may be modified at the same time as the polymerization step (S1) or after the polymerization step (S1).
  • the modification can be performed, for example, by reacting a dicarboxylic acid monomer or a polyamide resin with a specific nitrogen atom-containing heteroaromatic compound. Therefore, it is preferable that the terminal carboxyl group of the polyamide resin according to this embodiment is modified with a specific nitrogen atom-containing heteroaromatic compound.
  • the specific nitrogen atom-containing heteroaromatic compound means 1- (5-1H-triazoyl) methylamino group, 3- (1H-pyrazolyl) amino group, 4- (1H-pyrazoyl) amino group, 5- (1H-pyrazolyl) amino group, 1- (3-1H-pyrazolyl) methylamino group, 1- (4-1H-pyrazolyl) methylamino group, 1- (5-1H-pyrazolyl) methylamino group, (1H- One or more functional groups consisting of a tetrazol-5-yl) amino group, a 1- (1H-tetrazol-5-yl) methyl-amino group and a 3- (1H-tetrazol-5-yl) benz-amino group It has a group.
  • a low molecular weight component removing step (S2) is preferably performed to remove the low molecular weight component. Specifically, an organic layer containing a mixture of a low molecular weight component and a polyamide resin is concentrated by filtration or the like, and then redissolved in an organic solvent such as water / isopropanol. As a result, the precipitate can be filtered off to obtain a polyamide resin from which the low molecular weight component has been removed.
  • the polyamide resin for example, it is preferable to prepare a photosensitive resin composition which is a varnish without going through the step of completely drying the solvent after the step of removing the low molecular weight component. This can prevent the dispersibility of the polyamide from decreasing due to the interaction between the molecules of the polyamide resin, which is derived from the amide bond. Therefore, the contact angles of various materials on the substrate of the panel level package can be kept uniform.
  • phenol resin examples include phenol novolac resins, cresol novolac resins, bisphenol novolac resins, phenol-biphenyl novolac resins, and other novolac-type phenol resins; phenols such as novolac-type phenol resins, resole-type phenol resins, and cresol novolac resins.
  • a reaction product of a compound and an aldehyde compound a reaction product of a phenol compound such as a phenol aralkyl resin and a dimethanol compound, and the like.
  • 1 type (s) or 2 or more types can be included among the said specific examples.
  • phenol compound used in the reaction product of the phenol compound and the aldehyde compound or the reaction product of the phenol compound and the dimethanol compound is not limited.
  • a phenol compound include cresols such as phenol, o-cresol, m-cresol and p-cresol; 2,3-xylenol, 2,4-xylenol, 2,5-xylenol, 2 , 6-xylenol, 3,4-xylenol, 3,5-xylenol and other xylenols; o-ethylphenol, m-ethylphenol, p-ethylphenol and other ethylphenols; isopropylphenol, butylphenol, p-tert- Examples thereof include alkylphenols such as butylphenol; polyhydric phenols such as resorcinol, catechol, hydroquinone, pyrogallol, and ph
  • the aldehyde compound used in the reaction product of the phenol compound and the aldehyde compound described above is not limited as long as it is a compound having an aldehyde group.
  • Specific examples of such aldehyde compounds include formaldehyde, paraformaldehyde, acetaldehyde, benzaldehyde, salicylaldehyde and the like.
  • the aldehyde compound one or more of the above specific examples can be used.
  • the dimethanol compound used in the reaction product of the phenol compound and the dimethanol compound described above is not limited.
  • Specific examples of such a dimethanol compound include 1,4-benzenedimethanol, 1,3-benzenedimethanol, 4,4′-biphenyldimethanol, 3,4′-biphenyldimethanol, 3, Dimethanol compounds such as 3'-biphenyldimethanol, 2,6-naphthalenedimethanol and 2,6-bis (hydroxymethyl) -p-cresol; 1,4-bis (methoxymethyl) benzene, 1,3-bis (Methoxymethyl) benzene, 4,4'-bis (methoxymethyl) biphenyl, 3,4'-bis (methoxymethyl) biphenyl, 3,3'-bis (methoxymethyl) biphenyl, methyl 2,6-naphthalenedicarboxylate , Etc., bis (alkoxymethyl) compounds, or 1,4-bis (chloromethyl) benzene, 1,3-bis (chloromethyl
  • the hydroxystyrene resin is not limited, and specifically, a polymerization reaction product or copolymer obtained by polymerizing or copolymerizing one kind or two or more kinds selected from the group consisting of hydroxystyrene, hydroxystyrene derivative, styrene and styrene derivative.
  • a polymerization reaction product can be used.
  • Specific examples of the hydroxystyrene derivative and the styrene derivative include those in which the hydrogen atom of the aromatic ring of hydroxystyrene or styrene is replaced with a monovalent organic group.
  • Examples of the monovalent organic group substituting a hydrogen atom include alkyl groups such as methyl group, ethyl group and n-propyl group; alkenyl groups such as allyl group and vinyl group; alkynyl groups such as ethynyl group; methylidene group, Examples thereof include an alkylidene group such as an ethylidene group; a cycloalkyl group such as a cyclopropyl group; a heterocyclic group such as an epoxy group and an oxetanyl group.
  • the cyclic olefin-based resin is not limited, and specifically, a polymerization reaction product or a copolymerization reaction product obtained by polymerizing or copolymerizing one kind or two or more kinds selected from the group consisting of norbornene and norbornene derivatives is used. be able to.
  • norbornene derivative specifically, norbornadiene, bicyclo [2.2.1] -hept-2-ene (conventional name: 2-norbornene), 5-methyl-2-norbornene, 5-ethyl- 2-norbornene, 5-butyl-2-norbornene, 5-hexyl-2-norbornene, 5-decyl-2-norbornene, 5-allyl-2-norbornene, 5- (2-propenyl) -2-norbornene, 5- (1-Methyl-4-pentenyl) -2-norbornene, 5-ethynyl-2-norbornene, 5-benzyl-2-norbornene, 5-phenethyl-2-norbornene, 2-acetyl-5-norbornene, 5-norbornene- Examples thereof include methyl 2-carboxylate and 5-norbornene-2,3-dicarboxylic acid anhydride.
  • the lower limit of the content of the alkali-soluble resin in the photosensitive resin composition is, for example, preferably 30 parts by mass or more, and 40 parts by mass when the total solid content of the photosensitive resin composition is 100 parts by mass. More preferably, it is more preferably 50 parts by mass or more, further preferably 60 parts by mass or more, and particularly preferably 70 parts by mass or more. As a result, the dispersibility of the alkali-soluble resin in the photosensitive resin composition can be improved and the contact angle for various materials can be set within a desired numerical range.
  • the upper limit of the content of the alkali-soluble resin in the photosensitive resin composition is preferably 95 parts by mass or less, for example, when the total solid content of the photosensitive resin composition is 100 parts by mass, and 90 It is more preferably not more than 85 parts by mass, further preferably not more than 85 parts by mass.
  • the total solid content of the photosensitive resin composition refers to the total of the components contained in the photosensitive resin composition excluding the solvent.
  • photoacid generator that generates an acid by absorbing light energy
  • the photoacid generator include diazoquinone compounds; diaryl iodonium salts; 2-nitrobenzyl ester compounds; N-iminosulfonate compounds; imidosulfonate compounds; 2,6-bis (trichloromethyl) -1,3. 5-triazine compounds; dihydropyridine compounds and the like.
  • the photosensitive diazoquinone compound it is preferable to use the photosensitive diazoquinone compound.
  • the photoacid generator may include one or more of the above specific examples.
  • a triarylsulfonium salt an onium salt such as a sulfonium / borate salt may be used in combination with the above specific examples. This can further improve the sensitivity of the photosensitive resin composition.
  • Q is a structure represented by the following formula (a), the following formula (b) and the following formula (c), or a hydrogen atom.
  • at least one of Q of each diazoquinone compound has a structure represented by the following formula (a), the following formula (b), and the following formula (c).
  • Q of the diazoquinone compound preferably includes the following formula (a) or the following formula (b).
  • the lower limit of the content of the photosensitizer in the photosensitive resin composition is, for example, preferably 1 part by mass or more, and more preferably 3 parts by mass or more, when the alkali-soluble resin is 100 parts by mass. It is more preferably 5 parts by mass or more. Thereby, the photosensitive resin composition can exhibit appropriate sensitivity.
  • the upper limit of the content of the photosensitizer in the photosensitive resin composition is, for example, preferably 30 parts by mass or less, and preferably 20 parts by mass or less, when the alkali-soluble resin is 100 parts by mass. More preferable. This can prevent the photosensitive resin composition from being repelled by the material present on the surface of the substrate.
  • the photosensitive resin composition according to the present embodiment contains, as the solvent (C), a water-soluble solvent having a glycol ether structure (C-1) having a boiling point of 130 ° C. or higher.
  • the water-soluble solvent in the present invention means a solvent having a solubility of 10 g or more in 100 g of water at 20 ° C.
  • the solubility of the solvent (C-1) in 100 g of water at 20 ° C. is 10 g or more, preferably 30 g or more, more preferably 50 g or more, and the higher the solubility, the more it is dissolved in water or the developer. Mixing is easy and preferred.
  • the solvent (C-1) having a glycol ether structure has a boiling point of 130 ° C. or higher, more preferably 135 ° C. or higher, and particularly preferably 140 ° C. or higher.
  • the solvent (C-1) having a glycol ether structure can have a boiling point of 200 ° C. or lower, and more preferably 190 ° C. or lower. This makes it possible to improve the wettability between the photosensitive resin composition and the material on the surface of various substrates, and to control the drying rate of the solvent, so that the substrate can be evenly spread and evenly spread. It is possible to form a resin film having various thicknesses and compositions.
  • the solvent (C-1) having a glycol ether structure preferably has a surface energy of 30 mN / m.
  • the surface tension of each solvent can be known from a solvent handbook (published by Kodansha Scientific Co., Ltd.), SDS of each solvent, and the like.
  • the solvent (C-1) having a glycol ether structure means a solvent having a structure in which one or both of the hydroxyl groups of glycol are etherified.
  • Specific examples of the solvent (C-1) include ethylene glycol monotert-butyl ether, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol isopropyl methyl ether, propylene glycol monopropyl ether, propylene glycol tertiary.
  • the solvent (C-1) preferably contains an alkylene glycol monoalkyl ether.
  • the solvent (C-1) more preferably contains propylene glycol monopropyl ether or ethylene glycol monobutyl ether, and particularly preferably contains propylene glycol monopropyl ether.
  • the solvent (C-1) in the above mode, the compatibility between the photosensitive resin composition and various materials existing on the surface of the substrate is improved, and the photosensitive resin composition is prevented from being greatly repelled. Since a coating film having a uniform thickness can be formed, and the volatilization of the solvent is appropriately controlled in the drying step after forming the coating film, it becomes possible to form a resin film with less unevenness in thickness.
  • the solvent (C-1) is preferably represented by the following formula.
  • R 1 to R 4 each independently represent a hydrogen atom or an organic group. It is preferable that the solvent (C-1) has a structure containing a hydroxyl group at its one end since the water solubility thereof becomes high and mixing with the developing solution becomes easy.
  • the solvent (C) may include at least one type of solvent (C-1) and may include two or more types.
  • the photosensitive resin composition according to the present embodiment may contain, as the solvent (C), a solvent that is water-soluble and has a boiling point of 130 ° C. or higher, other than the solvent having a glycol ether structure (C-1). That is, the solvent (C) is a mixed solvent containing the solvent (C-1) and a solvent other than the solvent (C-1) (hereinafter, referred to as other solvent (C-2)). Good.
  • the other solvent (C-2) include urea compounds, amide compounds, ether solvents, acetate solvents, alcohol solvents, ketone solvents, lactone solvents, carbonate solvents, sulfone solvents, ester solvents. , Aromatic hydrocarbon solvents and the like.
  • the other solvent (C-2) one of the above specific examples may be used, or two or more may be used in combination.
  • urea compound examples include tetramethylurea (TMU), 1,3-dimethyl-2-imidazolidinone, N, N-dimethylacetamide, tetrabutylurea, N, N′-dimethylpropyleneurea, 1, 3-dimethoxy-1,3-dimethylurea, N, N'-diisopropyl-O-methylisourea, O, N, N'-triisopropylisourea, O-tert-butyl-N, N'-diisopropylisourea, Examples thereof include O-ethyl-N, N′-diisopropylisourea and O-benzyl-N, N′-diisopropylisourea.
  • TNU tetramethylurea
  • 1,3-dimethyl-2-imidazolidinone N, N-dimethylacetamide
  • tetrabutylurea N, N′-dimethyl
  • amide compound examples include N-methylpyrrolidone (NMP), 3-methoxy-N, N-dimethylpropanamide, N, N-dimethylformamide, N, N-dimethylpropionamide, N, N-diethyl.
  • NMP N-methylpyrrolidone
  • ether solvent examples include propylene glycol monomethyl ether (PGME), ethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, diethylene glycol, ethylene glycol diethyl ether, and diethylene glycol dibutyl ether.
  • acetate solvent examples include propylene glycol monomethyl ether acetate (PGMEA), methyl lactate, ethyl lactate, butyl lactate, methyl-1,3-butylene glycol acetate and the like.
  • the alcohol solvent examples include tetrahydrofurfuryl alcohol, benzyl alcohol, 2-ethylhexanol, butanediol, isopropyl alcohol and the like.
  • ketone solvent examples include cyclopentanone, cyclohexanone, diacetone alcohol, 2-heptanone and the like.
  • lactone solvent examples include ⁇ -butyrolactone (GBL) and ⁇ -valerolactone.
  • the carbonate-based solvent examples include ethylene carbonate and propylene carbonate.
  • Specific examples of the sulfone-based solvent include dimethyl sulfoxide (DMSO) and sulfolane.
  • Specific examples of the ester solvent include methyl pyruvate, ethyl pyruvate, and methyl-3-methoxypropionate.
  • Specific examples of the aromatic hydrocarbon solvent include mesitylene, toluene, xylene and the like. Among the above, urea compounds, lactone solvents, ether solvents and acetate solvents are preferable.
  • propylene glycol monomethyl ether PGME
  • propylene glycol monomethyl ether acetate PGMEA
  • GBL ⁇ -butyrolactone
  • TMU tetramethylurea
  • NMP N-methylpyrrolidone
  • At least one is used in combination with propylene glycol monopropyl ether and / or ethylene glycol monobutyl ether, and at least one selected from PGME, PGMEA, GBL, TMU and NMP is used. It is particularly preferable to use in combination with the glycol monopropyl ether.
  • the solvent (C-1) is combined with another solvent (C-2) having a boiling point different from the boiling point of the solvent (C-1) by 20 degrees or more. You may try. Specifically, it is preferable to combine propylene glycol monopropyl ether and propylene glycol monopropyl ether with a solvent having a boiling point different by 20 ° C. or more. Among these, it is preferable to use one having a boiling point of the other solvent (C-2) higher than that of the solvent (C-1) by 20 ° C. or more, or 25 ° C. or more.
  • the difference between the boiling point of the solvent (C-1) and the boiling point of the other solvent (C-2) may be, for example, 100 degrees or less.
  • the lower limit of the content of the solvent (C-1) in the solvent (C) is, for example, preferably 1 part by mass or more, and preferably 3 parts by mass or more, when the solvent (C) is 100 parts by mass. It is more preferable that the amount is 5 parts by mass or more, further preferably 10 parts by mass or more. This makes it possible to improve the wettability between the photosensitive resin composition and the material on the surface of various substrates and to control the drying rate of the solvent, thereby forming a resin film having a uniform thickness. be able to.
  • the upper limit of the content of the solvent (C-1) in the solvent is, for example, 100 parts by mass or less, 80 parts by mass or less, 60 parts by mass or less, 40 parts by mass or less, when the solvent is 100 parts by mass.
  • the solvent (C) contains the solvent (C-1) and contains one other solvent (C-2).
  • the solvent (C) contains propylene glycol monopropyl ether as the solvent (C-1) and propylene glycol monomethyl ether (PGME) as the other solvent (C-2),
  • a polybenzoxazole resin When a polybenzoxazole resin is used as the alkali-soluble resin, it should contain N-methylpyrrolidone (NMP) and / or ⁇ -butyrolactone (GBL) and / or tetramethylurea (TMU) as another solvent (C-2). Is preferred.
  • NMP N-methylpyrrolidone
  • GBL ⁇ -butyrolactone
  • TNU tetramethylurea
  • C-2 tetramethylurea
  • PGME propylene glycol monomethyl ether
  • PGMEA propylene glycol monomethyl ether acetate
  • a cyclic olefin resin is used as the alkali-soluble resin
  • propylene glycol monopropyl ether and / or ethylene glycol monobutyl ether is used as the solvent (C-1) and no other solvent (C-2) is added, or the solvent
  • the lower limit of the content of the solvent (C) in the photosensitive resin composition is, for example, preferably 50 parts by mass or more, and 60 parts by mass or more, when the photosensitive resin composition is 100 parts by mass. It is more preferable that the amount is 70 parts by mass or more.
  • the upper limit of the content of the solvent (C) in the photosensitive resin composition is, for example, preferably 130 parts by mass or less and 110 parts by mass or less when the photosensitive resin composition is 100 parts by mass. Is more preferable. Thereby, the dispersibility in the photosensitive resin composition can be improved, the contact angle with respect to various materials can be set within a desired numerical range, and the viscosity suitable for forming a coating film can be obtained.
  • the photosensitive resin composition according to this embodiment may have a composition in which an amide compound having a cyclic structure such as N-methylpyrrolidone (NMP) is less than 1% by mass as a solvent.
  • the photosensitive resin composition according to the present embodiment may be a composition that does not include an amide compound having a cyclic structure such as N-methylpyrrolidone (NMP) as a solvent.
  • NMP N-methylpyrrolidone
  • Conventionally used amide compounds having a cyclic structure such as N-methylpyrrolidone have various adverse effects such as impaired reproductive function when taken into the human body, and amide compounds having a cyclic structure such as N-methylpyrrolidone (NMP).
  • the safety can be improved by making the composition not more than 1 mass% less than 1% by mass.
  • the photosensitive resin composition according to the present embodiment further contains additives such as an adhesion aid, a silane coupling agent, a thermal crosslinking agent, a surfactant, an antioxidant, a dissolution accelerator, a filler, and a sensitizer. You may.
  • additives such as an adhesion aid, a silane coupling agent, a thermal crosslinking agent, a surfactant, an antioxidant, a dissolution accelerator, a filler, and a sensitizer. You may.
  • additives such as an adhesion aid, a silane coupling agent, a thermal crosslinking agent, a surfactant, an antioxidant, a dissolution accelerator, a filler, and a sensitizer. You may.
  • the representative components will be described in detail below.
  • the photosensitive resin composition according to this embodiment may further include an adhesion aid.
  • an adhesion aid specifically, a triazole compound or aminosilane can be used. This can further increase the number of lone electron pairs derived from the nitrogen atom. Therefore, the components other than the solvent of the photosensitive resin composition can be coordinated with the metal atoms, and the adhesion can be further improved.
  • the adhesion aid one of a triazole compound and aminosilane may be used, or a triazole compound and aminosilane may be used in combination.
  • the triazole compound examples include 4-amino-1,2,4-triazole, 4H-1,2,4-triazol-3-amine, 4-amino-3,5-di-2-pyridyl- 4H-1,2,4-triazole, 3-amino-5-methyl-4H-1,2,4-triazole, 4-methyl-4H-1,2,4-triazol-3-amine, 3,4- Diamino-4H-1,2,4-triazole, 3,5-diamino-4H-1,2,4-triazole, 1,2,4-triazole-3,4,5-triamine, 3-pyridyl-4H- 1,2,4-triazole, 4H-1,2,4-triazole-3-carboxamide, 3,5-diamino-4-methyl-1,2,4-triazole, 3-pyridyl-4-methyl-1, 2,4-triazole, 4-me Include 1,2,4-triazole, such as Le-1,2,4-triazole-3-carboxamide.
  • the triazole compound one kind or a combination of two or more kinds out of the above specific examples can be used.
  • Specific examples of the aminosilane include condensates of cyclohexene-1,2-dicarboxylic acid anhydride and 3-aminopropyltriethoxysilane, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride and 3 -Aminopropyltriethoxysilane condensate, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (aminoethyl) -3-aminopropyltrimethoxysilane, N-2- (amino Ethyl) -3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,
  • the lower limit value of the content of the adhesion aid in the photosensitive resin composition is, for example, preferably 0.1 part by mass or more, and 1.0 part by mass or more with respect to 100 parts by mass of the alkali-soluble resin. It is more preferably 2.0 parts by mass or more, further preferably 3.0 parts by mass or more.
  • the triazole compound is preferably coordinated with the metal atom such as Al and Cu, and the adhesion can be further improved.
  • the upper limit of the content of the adhesion aid in the photosensitive resin composition is, for example, preferably 10 parts by mass or less, and 7 parts by mass or less with respect to 100 parts by mass of the alkali-soluble resin. It is more preferable that the amount is 5 parts by mass or less. As a result, the adhesion aid can be suitably dispersed in the photosensitive resin composition, and the adhesion can be improved.
  • the photosensitive resin composition according to this embodiment may further include a silane coupling agent.
  • silane coupling agent include those other than the aminosilane exemplified as the adhesion aid.
  • Specific examples of the silane coupling agent having a structure different from that of the above-mentioned silane compound include vinyl silane such as vinyltrimethoxysilane and vinyltriethoxysilane; 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3 -Epoxysilanes such as glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane and 3-glycidoxypropyltriethoxysilane; p-styryltrimethoxysilane Styrylsilane such as; 3-methacryloxypropylmethyldimethoxysilane, 3-me
  • Acrylic silane such as 3-acryloxypropyltrimethoxysilane; Isocyanurate silane; Alkylsilane; Ureidosilane such as 3-ureidopropyltrialkoxysilane; 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, etc.
  • silane coupling agent one kind or two or more kinds of the above specific examples can be blended.
  • the photosensitive resin composition according to the present embodiment may include a thermal crosslinking agent capable of reacting with an alkali-soluble resin by heat. This makes it possible to improve mechanical properties such as tensile elongation at break of a cured product obtained by post-baking the photosensitive resin composition. It is also convenient from the viewpoint of improving the sensitivity of the resin film formed of the photosensitive resin composition.
  • thermal crosslinking agent examples include 1,2-benzenedimethanol, 1,3-benzenedimethanol, 1,4-benzenedimethanol (paraxylene glycol), 1,3,5-benzenetrimethanol, Methylol groups such as 4,4-biphenyldimethanol, 2,6-pyridinedimethanol, 2,6-bis (hydroxymethyl) -p-cresol, 4,4'-methylenebis (2,6-dialkoxymethylphenol)
  • Methylol groups such as 4,4-biphenyldimethanol, 2,6-pyridinedimethanol, 2,6-bis (hydroxymethyl) -p-cresol, 4,4'-methylenebis (2,6-dialkoxymethylphenol)
  • the upper limit of the content of the thermal crosslinking agent in the photosensitive resin composition is, for example, preferably 20 parts by mass or less, and more preferably 15 parts by mass or less, relative to 100 parts by mass of the alkali-soluble resin. , 12 parts by mass or less, more preferably 10 parts by mass or less. Thereby, even if the thermal cross-linking agent has a solvating functional group such as a phenolic hydroxyl group, it is possible to suppress deterioration in chemical resistance after post-baking.
  • the lower limit of the content of the thermal crosslinking agent in the photosensitive resin composition is, for example, 0.1 part by mass or more, and preferably 1 part by mass or more, based on 100 parts by mass of the alkali-soluble resin. It is more preferably 3 parts by mass or more, further preferably 5 parts by mass or more, particularly preferably 8 parts by mass or more.
  • the photosensitive resin composition according to this embodiment may further contain a surfactant.
  • the surfactant is not limited, and specifically, polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether and other polyoxyethylene alkyl ethers; polyoxyethylene octyl phenyl ether, polyoxyethylene Polyoxyethylene aryl ethers such as nonyl phenyl ether; nonionic surfactants such as polyoxyethylene dialkyl esters such as polyoxyethylene dilaurate and polyoxyethylene distearate; Ftop EF301, Ftop EF303, Ftop EF352 (Manufactured by Shin-Akita Kasei Co., Ltd.), MegaFac F171, MegaFac F172, MegaFac F173, MegaFac F177, MegaFac F444, MegaFac F 70, MegaFac F471, MegaFac F475, MegaFac F482, MegaFa
  • a silicone-based surfactant for example, polyether-modified dimethylsiloxane
  • the silicone-based surfactant include SH series, SD series and ST series manufactured by Toray Dow Corning, BYK series manufactured by Big Chemie Japan, KP series manufactured by Shin-Etsu Chemical Co., Ltd., and deformed by NOF CORPORATION ( The registered trademark) series, TSF series of Toshiba Silicone Co., Ltd., and the like can be mentioned.
  • a fluorosurfactant having a perfluoroalkyl group it is preferable to use a fluorosurfactant having a perfluoroalkyl group.
  • fluorosurfactant having a perfluoroalkyl group examples include Megafac F171, Megafac F173, Megafac F444, Megafac F470, Megafac F471, Megafac F475, Megafac F482, and Megafac among the above specific examples.
  • One or more selected from F477 (manufactured by DIC), Surflon S-381, Surflon S-383, Surflon S-393 (manufactured by AGC Seimi Chemical Co.), Novec FC4430 and Novec FC4432 (manufactured by 3M Japan). Is preferably used.
  • the photosensitive resin composition according to this embodiment may further include an antioxidant.
  • an antioxidant one or more selected from phenol-based antioxidants, phosphorus-based antioxidants and thioether-based antioxidants can be used.
  • the antioxidant can suppress the oxidation of the resin film formed by the photosensitive resin composition.
  • phenolic antioxidants include pentaerythrityl-tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate] and 3,9-bis ⁇ 2- [3- (3 -T-butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1,1-dimethylethyl ⁇ 2,4,8,10-tetraoxaspiro [5,5] undecane, octadecyl-3- (3 5-di-t-butyl-4-hydroxyphenyl) propionate, 1,6-hexanediol-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], 1,3,5 -Trimethyl-2,4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene, 2,6-di-t-butyl-4-methylphenol, 2,6-di- -Butyl-4
  • phosphorus antioxidants include bis (2,6-di-t-butyl-4-methylphenyl) pentaerythritol diphosphite, tris (2,4-di-t-butylphenylphosphite), and tetrakis (2 , 4-Di-t-butyl-5-methylphenyl) -4,4'-biphenylenediphosphonite, 3,5-di-t-butyl-4-hydroxybenzylphosphonate-diethyl ester, bis- (2,6 -Dicumylphenyl) pentaerythritol diphosphite, 2,2-methylenebis (4,6-di-t-butylphenyl) octylphosphite, tris (mixed mono and di-nonylphenylphosphite), bis (2,2 4-di-t-butylphenyl) pentaerythritol diphosphite, bis
  • thioether type antioxidant dilauryl-3,3'-thiodipropionate, bis (2-methyl-4- (3-n-dodecyl) thiopropionyloxy) -5-t-butylphenyl) sulfide , Distearyl-3,3′-thiodipropionate, pentaerythritol-tetrakis (3-lauryl) thiopropionate and the like.
  • the photosensitive resin composition according to this embodiment may further contain a filler.
  • a filler an appropriate filler can be selected depending on the mechanical properties and thermal properties required for the resin film made of the photosensitive resin composition.
  • the filler include inorganic fillers and organic fillers.
  • Specific examples of the inorganic filler include fused crushed silica, fused spherical silica, crystalline silica, secondary agglomerated silica, silica such as finely divided silica; alumina, silicon nitride, aluminum nitride, boron nitride, titanium oxide, silicon carbide.
  • Metal compounds such as aluminum hydroxide, magnesium hydroxide, and titanium white; talc; clay; mica; glass fiber and the like.
  • the inorganic filler one kind or a combination of two or more kinds among the above specific examples can be used.
  • Specific examples of the organic filler include organosilicone powder and polyethylene powder.
  • the organic filler one kind or a combination of two or more kinds out of the above specific examples can be used.
  • the method for preparing the photosensitive resin composition in the present embodiment is not limited, and a known method can be used depending on the components contained in the photosensitive resin composition. For example, it can be prepared by mixing and dissolving each of the above components in a solvent. Thereby, the photosensitive resin composition as a varnish can be obtained.
  • the solid content concentration of the entire photosensitive resin composition can be, for example, 10 to 30% by mass.
  • the photosensitive resin composition according to the present embodiment for example, a varnish of the photosensitive resin composition is applied to a substrate having a relatively large area including a semiconductor element or the like, and then prebaked to dry the resin. It is used by forming a film, then exposing and developing to pattern the resin film into a desired shape, and then post-baking the resin film to cure it to form a cured film.
  • the prebaking condition may be, for example, a heat treatment at a temperature of 90 ° C. or higher and 130 ° C. or lower for 30 seconds or longer and 1 hour or shorter.
  • the post-baking condition for example, heat treatment at a temperature of 150 ° C. or higher and 350 ° C. or lower for 30 minutes or longer and 10 hours or shorter can be performed.
  • the viscosity of the photosensitive resin composition according to this embodiment can be appropriately set according to the desired thickness of the resin film.
  • the viscosity of the photosensitive resin composition can be adjusted by adding a solvent. During the adjustment, it is preferable to keep the content of the solvent (C-1) in the solvent (C) constant.
  • the upper limit of the viscosity of the photosensitive resin composition according to the exemplary embodiment may be, for example, 5000 mPa ⁇ s or less, 1800 mPa ⁇ s or less, or 1500 mPa ⁇ s or less.
  • the lower limit of the viscosity of the photosensitive resin composition according to the present embodiment may be, for example, 1 mPa ⁇ s or more, or 10 mPa ⁇ s or more, depending on the desired thickness of the resin film.
  • the viscosity of the photosensitive resin composition can be measured, for example, with an E-type viscometer at a temperature of 25 ° C. and 300 seconds after the start of rotation.
  • the flash point of the photosensitive resin composition according to the present embodiment is preferably 40 ° C. or higher, more preferably 50 ° C. or higher, and particularly preferably 60 ° C. or higher.
  • the flash point refers to the flash point obtained by the tag closing method based on JIS K 2265-1.
  • the surface energy of the photosensitive resin composition according to this embodiment is preferably 21.0 mN / m or less.
  • the surface energy can be obtained, for example, by evaluating the contact angle with respect to sputtered Cu and a bare silicon wafer. Specifically, at a temperature of 25 ° C., the contact angle 10 seconds after the deposition of 2 ml of the viscosity-adjusted varnish of the photosensitive resin composition on each substrate can be evaluated by the droplet method. it can.
  • a contact angle meter DROPMASTER-501 manufactured by Kyowa Interface Science Co., Ltd.
  • the lower limit of the surface energy is not particularly limited, but can be set to 15 mN / m, for example.
  • the cured film obtained by curing the photosensitive resin composition of the present embodiment is used for the purpose of using a permanent film, for example, it can be used for buffer coating and can be used for various electronic devices.
  • the resin film is a dry film or a cured film of the photosensitive resin composition. That is, the resin film according to the present embodiment is formed by drying or curing the photosensitive resin composition.
  • the permanent film is, for example, a cured film obtained by applying a photosensitive resin composition, then performing pre-baking, exposure and development, patterning into a desired shape, and curing by post-baking. Composed.
  • the permanent film can be used as a protective film for electronic devices, an interlayer film, a dam material, and the like.
  • the manufacturing method of the electronic device of the present invention is A step of providing an electronic component on one surface of the substrate, On one surface of the substrate, Alkali-soluble resin (A), A coating film forming step of forming a coating film by applying a photosensitive resin composition containing a photosensitive material (B) and a solvent (C); An exposure step of exposing the formed coating film, A developing step of developing the exposed coating film, and a heating step of heating the coating film remaining after the development to cure the coating film to form a permanent film,
  • the solvent (C) includes a solvent (C-1) having a glycol ether structure, which is water-soluble and has a boiling point of 130 ° C. or higher.
  • the substrate is not particularly limited, and examples thereof include a silicon wafer, a ceramic substrate, an aluminum substrate, a SiC wafer, and a GaN wafer.
  • the electronic component such as the semiconductor element or the display element can be provided by a known method.
  • a photosensitive resin composition containing an alkali-soluble resin (A), a photosensitive material (B), and a solvent (C) is applied onto a substrate to form a coating film.
  • the solvent (C) includes a solvent (C-1) having a glycol ether structure, which is water-soluble and has a boiling point of 130 ° C. or higher.
  • the photosensitive resin composition according to this embodiment is as described above.
  • the coating film can be formed by spin coating, spray coating, dipping, printing, roll coating, an inkjet method or the like, and for example, slit coating is preferable. Thereby, a uniform resin film can be formed in a wide area.
  • the thickness of the permanent film is not particularly limited, but is, for example, about 2 to 30 ⁇ m, preferably about 5 to 20 ⁇ m.
  • a method of removing the solvent and various methods can be applied to remove the solvent (for example, heating).
  • vacuum drying it is preferable to dry the panel coated with the photosensitive resin composition under a reduced pressure environment (for example, under an environment of 30 Pa or less). Note that drying under reduced pressure also has an advantage of reducing microbubbles that may occur during coating.
  • the conditions are, for example, 70 to 160 ° C. and 5 seconds to 30 minutes.
  • electromagnetic waves of various wavelengths, particle beams, etc. can be used.
  • ultraviolet rays such as g-rays and i-rays, visible rays, lasers, X-rays, electron rays and the like are used.
  • Ultraviolet rays such as g rays or i rays are preferable.
  • the exposure amount is appropriately set according to the sensitivity of the photosensitive adhesive composition and the like, but is, for example, about 30 to 3000 mJ / cm 2 .
  • the exposure is usually performed by using an appropriate mask pattern.
  • Various developers can be applied for the development.
  • alkali developers such as tetramethylammonium hydroxide, dimethylformamide, N-methyl-2-pyrrolidone, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, acetic acid.
  • organic developers such as butyl.
  • an alkali developing solution is preferable, and an aqueous solution of tetramethylammonium hydroxide is particularly preferable.
  • the method for supplying the developing solution include spraying, paddle, dipping and the like. The spray method is preferable in terms of processing a large-area panel.
  • the post-baking condition (curing condition) is not particularly limited, but is, for example, 80 to 300 °
  • a panel level package will be described as one of electronic devices including a resin film obtained by curing the photosensitive resin composition of the present embodiment.
  • Panel-level packages have various structures such as cores, chips, prepregs (reinforced plastic materials obtained by uniformly impregnating a fibrous reinforcing material such as glass cloth or carbon fiber with a thermosetting resin such as epoxy). It is sealed or fixed with a sheet-shaped sealing material to form a panel.
  • metals such as Cu and Al are usually used as wirings (these metals are usually incorporated in the panel level package by a plating method or a sputtering method), and a passivation film such as silicon nitride is also used. May be included.
  • the panel-level package has a resin film formed by curing the photosensitive resin composition (for example, a resin film formed by curing the photosensitive resin composition of the present embodiment) on the surface. .
  • the photosensitive resin composition of the present embodiment can form a uniform film in various panel level packages as described above by including the solvent (C-1).
  • the shape and size of the panel level package is, for example, a substantially rectangular shape with a length of 300 to 800 mm and a width of 300 to 800 mm.
  • 470 mm ⁇ 370 mm, 610 mm ⁇ 457 mm (24 inches ⁇ 18 inches), and panel level packages have been proposed. By collectively manufacturing such a large-area package, it is possible to reduce the cost of manufacturing the electronic device.
  • the solvent (C-1) is ethylene glycol mono-tert-butyl ether, ethylene glycol mono-butyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol isopropyl methyl ether, propylene glycol monopropyl ether, propylene glycol tertiary butyl ether, propylene glycol mono-ether.
  • the solvent (C-1) contains an alkylene glycol monoalkyl ether. Or 2.
  • the alkali-soluble resin (A) contains at least one selected from the group consisting of polyamide resin, polybenzoxazole resin, polyimide resin, phenol resin, hydroxystyrene resin, and cyclic olefin resin.
  • the flash point of the photosensitive resin composition is 40 ° C. or higher; ⁇ 4.
  • the viscosity of the photosensitive resin composition measured at 25 ° C. using an E-type viscometer is 0.1 mPa ⁇ S or more and 5000 mPa ⁇ S or less.
  • the photosensitizer (B) is a photo-acid generator. ⁇ 7.
  • the solid content concentration of the entire photosensitive resin composition is 10 to 30% by mass.
  • the solvent (C-1) is contained in an amount of 1% by mass or more and 100% by mass or less with respect to the entire solvent (C).
  • the photosensitive resin composition according to any one of 1. 11 In the photosensitive resin composition, N-methyl-2-pyrrolidone is less than 1% by mass with respect to the entire photosensitive resin composition.
  • the solvent (C) is at least selected from propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), ⁇ -butyrolactone (GBL), tetramethylurea (TMU) and N-methylpyrrolidone (NMP). Including one more type, 1. ⁇ 11.
  • 1. ⁇ 12 A cured film obtained by curing the photosensitive resin composition according to any one of 1. 14.
  • An electronic device comprising the cured film according to claim 1. 15.
  • a method of manufacturing an electronic device comprising: The method for producing an electronic device, wherein the solvent (C) includes a solvent (C-1) having a glycol ether structure, which is water-soluble and has a boiling point of 130 ° C. or higher.
  • the alkali-soluble resin 1 which is a polyamide resin was prepared by the following procedure.
  • a 4-neck glass separable flask equipped with a thermometer, a stirrer, a raw material inlet, and a dry nitrogen gas inlet tube 206.58 g of diphenyl ether-4,4′-dicarboxylic acid represented by the following formula (DC2) (0.800 mol) and 1-hydroxy-1,2,3-benzotriazole monohydrate 216.19 g (1.600 mol) were reacted to obtain 170.20 g (0) of a mixture of dicarboxylic acid derivatives.
  • Photosensitizer 1 As the photosensitizer 1, a compound represented by the following formula was used. Photosensitizer 1, which is a diazoquinone compound, was synthesized by the following procedure. In a four-neck separable flask equipped with a thermometer, a stirrer, a raw material inlet, and a dry nitrogen gas inlet tube, 11.04 g (0.026 mol) of phenol represented by the following formula (P-1) and 1, 18.81 g (0.070 mol) of 2-naphthoquinone-2-diazide-5-sulfonyl chloride and 170 g of acetone were put and stirred to be dissolved.
  • the following surfactant 1 was used as the surfactant.
  • -Surfactant 1 Fluorine-based surfactant (FC4430 manufactured by 3M Japan)
  • ⁇ Adhesion aid> The following coupling agent was used as an adhesion aid.
  • Coupling agent 1 N, N′-bis [3- (trimethoxysilyl) propyl] ethylenediamine (X-12-5263HP, manufactured by Shin-Etsu Chemical Co., Ltd.) represented by the following formula (S1) was prepared.
  • Coupleling agent 2 As the coupling agent 2, a coupling agent 2, which is a condensate of cyclohexene-1,2-dicarboxylic acid anhydride represented by the following formula (S1) and 3-aminopropyltriethoxysilane, was synthesized by the following method. Details of the synthesis method will be described. Cyclohexene-1,2-dicarboxylic acid anhydride (45.6 g, 300 mmol) was dissolved in N-methyl-2-pyrrolidone (970 g) in a reaction vessel of an appropriate size equipped with a stirrer and a cooling tube, and a thermostat The temperature was adjusted to 30 ° C.
  • S1 cyclohexene-1,2-dicarboxylic acid anhydride represented by the following formula (S1) and 3-aminopropyltriethoxysilane
  • the photosensitive resin compositions of Examples 1 to 4 and Comparative Examples 1 to 6 were prepared as follows. First, the solvent was mixed according to the blending ratio shown in Table 2 or Table 3 below to prepare a mixed solvent. Then, to the mixed solvent, each raw material component other than the solvent was added, stirred, and filtered with a PTFE membrane filter having a pore size of 0.2 ⁇ m to obtain a varnish of the photosensitive resin composition of each Example and each Comparative Example. Got The amount of the surfactant added is the concentration (ppm) of the photosensitive resin composition containing the mixed solvent in the whole varnish. Further, the tag closed flash point of the photosensitive resin composition of Example 1 based on JIS K 2265-1 was 60.4 ° C.
  • the sputtered Cu was purchased from Kyodo International Co., Ltd.
  • the bare silicon wafer used was purchased from Advantech Co., Ltd.
  • the viscosity measured after rotating for 300 seconds at a rotation frequency of 100 rpm and a temperature of 25 ° C. by an E-type viscometer is 50 mPa ⁇ s.
  • the viscosity was adjusted with the solvent used in each of the examples and comparative examples.
  • the solvent was added so that the compounding ratio of each solvent contained in each resin composition was constant.
  • 2 ml of the varnish of the photosensitive resin composition having the viscosity adjusted above was dropped on each substrate, and the contact angle 10 seconds after the drop was evaluated by a droplet method.
  • the measurement was performed using a contact angle meter (DROPMASTER-501 manufactured by Kyowa Interface Science Co., Ltd.). This evaluated the contact angle with respect to sputtered Cu and a bare silicon wafer. For the evaluation, the measurement was repeated 10 times, the average value thereof was calculated, and this was taken as the contact angle ⁇ (°). Moreover, the surface energy (mN / m) of the photosensitive resin composition was evaluated by this.
  • DROPMASTER-501 manufactured by Kyowa Interface Science Co., Ltd.
  • a copper clad laminated substrate in which a copper foil was attached to the substrate was prepared.
  • the substrate had a rectangular shape of 200 mm ⁇ 300 mm.
  • the compositions of Examples and Comparative Examples use the E-type viscometer so that the viscosity measured after rotating for 300 seconds at a rotation frequency of 100 rpm and a temperature of 25 ° C. is 50 mPa ⁇ s. The viscosity was adjusted with the solvent used. When adjusting the viscosity, the solvent was added so that the compounding ratio of each solvent contained in each resin composition was constant.
  • a coating film was formed on the surface of the substrate by using a film applicator with a film thickness adjusting function of 300 mm (manufactured by All Good Co., Ltd.) using the photosensitive resin compositions of Examples and Comparative Examples. Further, the coating film was prebaked under the conditions shown in Table 2 or Table 3, and the coating film after the prebaking treatment was subjected to appearance observation. The film thickness of the coating film was adjusted so that the film thickness after prebaking was 10 ⁇ m.
  • the state of the photosensitive resin film on the substrate was observed and evaluated according to the following criteria. (Sink) ⁇ No dents were found on the coating film. ⁇ Some dents occurred on the coating film (repelling). ⁇ There was no exposed part of the base ⁇ Part of the base was exposed
  • the photosensitive resin compositions of Examples 1 and 2 were more resistant to dents and underlayer exposure in the coating film as compared with Comparative Examples 2 to 4, and were more dried than those of Comparative Example 1 under reduced pressure. The result showed that sink marks (dents) were suppressed.
  • the photosensitive resin compositions of Examples 3 and 4 were more resistant to dents and exposure of the undercoat in the coating film as compared with Comparative Example 6, and compared with Comparative Example 5 in the coating film dried under reduced pressure. The result showed that sink marks (dents) were suppressed.
  • the photosensitive resin compositions of Examples 1 to 4 were excellent in wettability with respect to the substrate containing the inorganic material, and the dents and the underlayer exposure in the coating film were suppressed, and a stable and uniform coating film was obtained. It turned out that it can be formed. Further, the photosensitive resin compositions of these examples can be suitably used for wafer level packages and panel level packages.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Cette composition de résine photosensible pour former un film permanent contient une résine soluble dans les alcalis (A), un photosensibilisateur et un solvant (C), et contient également un solvant (C-1) ayant une structure d'éther de glycol soluble dans l'eau dont le point d'ébullition est supérieur ou égal à 130°C.
PCT/JP2019/040112 2018-10-18 2019-10-10 Composition de résine photosensible, film durci, dispositif électronique pourvu d'un film durci, et procédé de fabrication dudit dispositif WO2020080266A1 (fr)

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KR1020217014424A KR20210080428A (ko) 2018-10-18 2019-10-10 감광성 수지 조성물, 경화막, 및 경화막을 구비하는 전자 장치 및 그 제조 방법

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JP2013130816A (ja) * 2011-12-22 2013-07-04 Nippon Zeon Co Ltd 永久膜用樹脂組成物及び電子部品
JP2014071373A (ja) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2014162818A (ja) * 2013-02-22 2014-09-08 Toray Ind Inc 耐熱性樹脂組成物および耐熱性樹脂膜の製造方法
WO2016031928A1 (fr) * 2014-08-29 2016-03-03 東京応化工業株式会社 Composé d'imidazole, liquide de traitement de surface métallique, procédé de traitement de surface métallique et procédé de production de stratifié

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KR101209049B1 (ko) 2004-12-24 2012-12-07 스미또모 가가꾸 가부시끼가이샤 감광성 수지 및 상기 감광성 수지로 이루어진 패턴을 포함하는 박막 표시판 및 그 제조 방법
JP6999469B2 (ja) 2018-03-28 2022-01-18 東京応化工業株式会社 水素バリア剤、水素バリア膜形成用組成物、水素バリア膜、水素バリア膜の製造方法、及び電子素子

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JP2005292276A (ja) * 2004-03-31 2005-10-20 Nippon Zeon Co Ltd 感放射線組成物、積層体及びその製造方法並びに電子部品
JP2013130816A (ja) * 2011-12-22 2013-07-04 Nippon Zeon Co Ltd 永久膜用樹脂組成物及び電子部品
JP2014071373A (ja) * 2012-09-28 2014-04-21 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP2014162818A (ja) * 2013-02-22 2014-09-08 Toray Ind Inc 耐熱性樹脂組成物および耐熱性樹脂膜の製造方法
WO2016031928A1 (fr) * 2014-08-29 2016-03-03 東京応化工業株式会社 Composé d'imidazole, liquide de traitement de surface métallique, procédé de traitement de surface métallique et procédé de production de stratifié

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