WO2020071271A1 - Film conducteur anisotrope, structure de connexion et procédé permettant de fabriquer une structure de connexion - Google Patents

Film conducteur anisotrope, structure de connexion et procédé permettant de fabriquer une structure de connexion

Info

Publication number
WO2020071271A1
WO2020071271A1 PCT/JP2019/038143 JP2019038143W WO2020071271A1 WO 2020071271 A1 WO2020071271 A1 WO 2020071271A1 JP 2019038143 W JP2019038143 W JP 2019038143W WO 2020071271 A1 WO2020071271 A1 WO 2020071271A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive particles
resin layer
insulating resin
anisotropic conductive
conductive film
Prior art date
Application number
PCT/JP2019/038143
Other languages
English (en)
Japanese (ja)
Inventor
裕美 久保出
怜司 塚尾
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR1020217005129A priority Critical patent/KR20210033513A/ko
Priority to CN201980061791.XA priority patent/CN112740483B/zh
Priority claimed from JP2019176515A external-priority patent/JP2020095941A/ja
Publication of WO2020071271A1 publication Critical patent/WO2020071271A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors

Definitions

  • the rigidity of the IC chip is much higher than the rigidity of the plastic substrate, so the deformation at the plastic substrate side is increased due to the pressure at the time of connection, and the “wiring of the wiring at the plastic substrate side” or “insufficient pushing of particles”.
  • FIG. 8 a case where heating and pressing are performed to anisotropically conductively connect the bump B of the IC chip and the electrode 21 of the plastic substrate 24 via the anisotropic conductive film ACF.
  • the adhesive layer 23 of the plastic substrate 24 is removed outside the periphery of the bump B of the IC chip and the inverted dome-shaped thin portion 25 is formed (doming phenomenon).
  • An object of the present invention is to solve the above-mentioned conventional problems.
  • an electronic component having a bump such as an image display element or a driving IC chip, is connected to an electrode (for example, a metal such as Ti or Ti / AL).
  • Anisotropic conductive material suitable for anisotropic conductive connection to a flexible plastic substrate on which an electrode, a metal oxide electrode such as ITO, or a metal oxide electrode such as the above is oxidized.
  • Anisotropic conductive film that has good anisotropic conductive connection without forming cracks in the wiring of the plastic substrate during anisotropic conductive connection and realizes high conduction reliability It is to provide a conductive film.
  • the present inventors when performing anisotropic conductive connection using an anisotropic conductive film having a conductive particle dispersion layer composed of at least an insulating resin layer and conductive particles dispersed therein, the conductive particles Focusing on the point that will receive a compressive force in the thickness direction of the film, by controlling the elements that strongly affect the behavior when the conductive particles are subjected to compression, it can meet the object of the present invention By controlling the 20% compression elastic modulus, the compression recovery rate, the average particle diameter, the number density, and the minimum melt viscosity of the insulating resin layer of the conductive particles within specific numerical ranges under the assumption of the present invention, The inventors have found that the object can be achieved, and have completed the present invention.
  • the present invention relates to an anisotropic conductive film having a conductive particle dispersion layer composed of at least an insulating resin layer and conductive particles dispersed therein, and the following conditions (a) to (e): Is provided.
  • the present invention also provides a method for producing the above-described anisotropic conductive film of the present invention, which comprises a step of forming a conductive particle dispersed layer by pushing conductive particles into an insulating resin layer.
  • the conductive particles are held in a predetermined arrangement on the surface of the insulating resin layer, and the conductive particles are pressed into the insulating resin layer with a flat plate or a roller to form a conductive particle dispersion layer.
  • the anisotropic conductive film of the present invention has a conductive particle dispersed layer at least composed of an insulating resin layer and conductive particles dispersed therein.
  • the conductive particles held in the conductive particle dispersion layer those having 20% compression elastic modulus, compression recovery rate and average particle diameter each in a specific numerical range are used.
  • the insulating resin layer holding such conductive particles a resin having a minimum melt viscosity of a specific value or less is used, and the degree of holding the conductive particles in such insulating resin layer (in other words, the number density ) Is set within a specific range.
  • an electronic component having a bump such as an image display element or a driving IC chip is anisotropically mounted on a flexible plastic substrate on which electrodes and wiring are formed.
  • the conductive connection is made, it is possible to prevent cracks from being generated in the wiring of the plastic substrate.
  • FIG. 1A is a plan view showing an arrangement of conductive particles of an anisotropic conductive film 10A of an example.
  • FIG. 1B is a cross-sectional view of the anisotropic conductive film 10A of the example.
  • FIG. 2 is a cross-sectional view of the anisotropic conductive film 10B of the example.
  • FIG. 3 is a cross-sectional view of the anisotropic conductive film 10C of the example.
  • FIG. 4 is a cross-sectional view of the anisotropic conductive film 10D of the example.
  • FIG. 5 is a cross-sectional view of the anisotropic conductive film 10E of the example.
  • FIG. 6 is a cross-sectional view of the anisotropic conductive film 10F of the example.
  • FIG. 7 is a schematic sectional view of a plastic substrate.
  • FIG. 8 is an explanatory diagram when an IC chip is anisotropically conductively connected to a plastic substrate.
  • the anisotropic conductive film of the present invention has a conductive particle dispersed layer at least composed of an insulating resin layer and conductive particles dispersed therein.
  • the condition (a) “20% compression elastic modulus”, the condition (b): “compression recovery”, and the condition (c): “average particle diameter”
  • the condition (d) “lowest melt viscosity” is used in a specific range, and such insulating resin layer is used.
  • FIG. 1A is a plan view illustrating the particle arrangement of the anisotropic conductive film 10A according to one embodiment of the present invention
  • FIG. 1B is a cross-sectional view taken along line XX.
  • 2 and 3-4 are cross-sectional views of the anisotropic conductive films 10B, 10C, and 10D of the embodiment of the present invention, respectively.
  • the anisotropic conductive film of the present invention is not limited to the embodiments disclosed in these drawings.
  • the anisotropic conductive film 10A may be in the form of a long film having a length of, for example, 5 m or more, and may be a wound body wound around a core.
  • the anisotropic conductive film 10A is composed of the conductive particle dispersion layer 3, in which the conductive particles 1 are in non-contact with the insulating resin layer 2.
  • conductive particles 1 are regularly arranged in a state where conductive particles 1 are exposed on one surface of insulating resin layer 2.
  • the conductive particles 1 are not in contact with each other in plan view of the film, and the conductive particles 1 are also present in the film thickness direction without overlapping each other.
  • the conductive particles 1 constitute a single conductive particle layer in which the positions in the film thickness direction are aligned.
  • the ratio (number basis) of the conductive particles that are not in contact with each other is preferably 95% or more, and more preferably 98% or more.
  • a recess 2b may be formed with respect to the tangent plane 2p of the insulating resin layer 2 at the center between adjacent conductive particles ( (FIG. 1B, FIG. 2). Further, the top 1a of the conductive particles 1 may be flush with the surface 2a of the insulating resin layer 2 as shown in FIG. At the time of connection, movement of the conductive particles due to resin flow can be reduced. As described later, in the anisotropic conductive film of the present invention, a recess 2c may be formed on the surface of the insulating resin layer immediately above the conductive particles 1 embedded in the insulating resin layer 2. 3, FIG. 4). In the case of FIG. 3, one point of the top 1a of the conductive particle 1 may be exposed from the insulating resin layer.
  • metal-coated resin particles having a metal layer formed on the surface of the resin core particles can be appropriately selected from the conductive particles used in known anisotropic conductive films.
  • metal-coated resin particles those whose surfaces have been subjected to an insulating coating treatment (for example, an insulating fine particle adhesion treatment, an insulating resin coating treatment, etc.) can also be used. Two or more kinds of metal-coated resin particles can be used in combination.
  • conductive particles conductive particles having conductive protrusions on the surface can also be used.
  • the conductive layer may be two or more layers.
  • the protrusion may be present between the conductive layers.
  • Such a conductive layer can be formed on the surface of the resin core particles by a known film forming method such as electroless plating, electrolytic plating, and sputtering.
  • a method of attaching conductive fine particles there is no particular limitation as long as the conductive particles satisfy the conditions described below and can satisfy conduction performance.
  • the surface of the conductive layer may be subjected to a known insulating treatment. In this case, the size excluding the thickness of the insulating layer formed by the insulating treatment is defined as the particle size of the conductive particles.
  • F is a load value (N) when the conductive particles are compressed and deformed by 20%
  • S is a compressive displacement (mm) when the conductive particles are compressed and deformed by 20%
  • R is a conductive displacement. (Mm).
  • the conductive particles used in the present invention are required to break through the oxide film formed on the surface of the electrode or terminal of the electronic component as described above, a corresponding pressure is applied to the conductive particles during connection. This is expected to flatten the conductive particles. Therefore, after the pressure of the connection is released, the conductive particles are required to be restored after compression in order to secure a sufficient contact area with the facing electrode or terminal surface. From this viewpoint, the lower limit of the compression recovery ratio (X) is 40% or more, preferably 55% or more.
  • the lower limit of the average particle diameter of the conductive particles 1 used in the present invention is 1 ⁇ m or more, and preferably 2.5 ⁇ m or more, from the viewpoint of coping with the variation in wiring height. From the viewpoint of suppressing occurrence of short-circuit, the upper limit is 30 ⁇ m or less, preferably 9 ⁇ m or less.
  • the average particle size can be determined using a general particle size distribution measuring device (for example, FPIA-3000 (Malvern Panicalical)).
  • the number of measurement samples is preferably 1000 or more.
  • the average particle diameter D of the conductive particles in the anisotropic conductive film can be determined using an electron microscope such as a SEM. In this case, the number of measurement samples is preferably 200 or more.
  • the average particle size of the conductive particles in the present invention means an average particle size not including the surface insulating fine particles.
  • the insulating resin layer 2 that holds the conductive particles 1 and functions as a base layer of the anisotropic conductive film may be formed from a curable resin composition as described later. It satisfies the following condition (d).
  • the upper limit thereof is to reduce the pressure at the time of connection, particularly when the substrate is made of plastic, etc. It is 4000 Pa ⁇ s or less, and preferably 3000 Pa ⁇ s or less, from the viewpoint of enabling good pushing of the conductive particles.
  • the lower limit is preferably not particularly limited since it is desirable from the viewpoint of suppressing deformation of the plastic substrate, particularly in connection with the plastic substrate, and may be appropriately adjusted, but the conductive particles to be sandwiched between the terminals during anisotropic conductive connection From the viewpoint of preventing 1 from being excessively flown by the resin flow as well as from the viewpoint of preventing the resin from overflowing when wound into a wound body, preferably 200 Pa ⁇ s or more, more preferably 400 Pa ⁇ s or more It is.
  • the minimum melt viscosity can be obtained by using a rotary rheometer (manufactured by TA Instruments) as an example, using a measurement plate having a diameter of 8 mm, keeping the measurement pressure constant at 5 g, and more specifically, In a temperature range of 30 to 200 ° C., the temperature can be determined by setting the temperature to 10 ° C./min, the measurement frequency to 10 Hz, and the load on the measurement plate to 5 g.
  • the insulating resin layer 2 when the conductive particles 1 are pressed is When the conductive particles 1 are pushed into the insulating resin layer 2 so that the resin particles are exposed from the insulating resin layer 2 with the exposed diameter Lc, the insulating resin layer 2 is plastically deformed and the insulating resin layer around the conductive particles 1 is deformed. 2 or a high-viscosity viscous material such that a recess 2b (FIGS. 1B and 2) is formed, or the conductive particles 1 are buried in the insulating resin layer 2 without being exposed from the insulating resin layer 2.
  • the conductive particles 1 can be connected between terminals during anisotropic conductive connection. Since the resistance received from the insulating resin to the flattening of the conductive particles 1 generated when the conductive particles 1 are pinched is reduced as compared with the case where the recess 2b is not provided, the conductive particles are easily pinched at the terminals, so that conduction is achieved. The performance is improved, and the trapping property is improved.
  • the recess 2c (FIGS. 3 and 4) is formed on the surface of the insulating resin layer 2 immediately above the conductive particles 1 buried without being exposed from the insulating resin layer 2, the recess 2c does not exist. As compared with the case, the pressure at the time of anisotropic conductive connection is more likely to concentrate on the conductive particles 1, and the conductive particles 1 are more easily pinched between the terminals, so that the trapping property is improved and the conduction performance is improved.
  • the ratio (La / D) between the layer thickness La of the insulating resin layer 2 and the average particle diameter D of the conductive particles 1 is 0 if the amount of resin capable of holding the conductive particles is sufficient. 0.3 or more, preferably 0.6 or more, and more preferably 1.0 or more. If La / D is less than 0.3, it may be difficult to precisely maintain the conductive particles 1 in a predetermined particle dispersion state or a predetermined arrangement by the insulating resin layer 2.
  • the average particle diameter D is defined by the size of the metal-coated resin particles (the size of the resin core particles and the conductive layer on the surface thereof).
  • the upper limit of La / D is preferably 8.0 or less, and more preferably 6.0 or less.
  • the insulating resin layer 2 can be formed from a curable resin composition, for example, from a thermopolymerizable composition containing a thermopolymerizable compound and a thermopolymerization initiator.
  • the thermopolymerizable composition may contain a photopolymerization initiator as needed.
  • thermopolymerizable compound When a thermal polymerization initiator and a photopolymerization initiator are used in combination, those that also function as a photopolymerizable compound may be used as the thermopolymerizable compound, and the photopolymerizable compound is contained separately from the thermopolymerizable compound. You may. Preferably, a photopolymerizable compound is contained separately from the thermopolymerizable compound.
  • a cationic polymerization initiator is used as a thermal polymerization initiator
  • an epoxy resin is used as a thermopolymerizable compound
  • photoradical polymerization initiator is used as a photopolymerization initiator
  • an acrylate compound is used as a photopolymerizable compound.
  • the photopolymerization initiator a plurality of types that react to light having different wavelengths may be contained. Thereby, the wavelength used in the photocuring of the resin constituting the insulating resin layer during the production of the anisotropic conductive film and the photocuring of the resin for bonding the electronic components together at the time of the anisotropic conductive connection. You can use them properly.
  • the photocuring at the time of producing the anisotropic conductive film all or a part of the photopolymerizable compound contained in the insulating resin layer can be photocured. Due to this photocuring, the arrangement of the conductive particles 1 in the insulating resin layer 2 is held or fixed, and short-circuit suppression and improvement in capture are expected. In addition, the viscosity of the insulating resin layer in the process of manufacturing the anisotropic conductive film may be appropriately adjusted by the photocuring.
  • thermopolymerizable composition examples include a thermoradical polymerizable acrylate composition containing a (meth) acrylate compound and a thermoradical polymerization initiator, and a thermocation polymerizable epoxy system containing an epoxy compound and a thermocation polymerization initiator. And the like.
  • a thermal anionic polymerizable epoxy composition containing a thermal anionic polymerization initiator may be used instead of the thermal cationic polymerizable epoxy composition containing a thermal cationic polymerization initiator.
  • a plurality of types of polymerizable compositions may be used in combination as long as there is no particular problem. Examples of the combination include a combination of a thermocationically polymerizable composition and a thermoradical polymerizable composition.
  • thermal radical polymerization initiator examples include organic peroxides and azo compounds.
  • organic peroxides that does not generate nitrogen that causes bubbles can be preferably used.
  • the epoxy compound examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, modified epoxy resin thereof, alicyclic epoxy resin and the like, and two or more of these may be used in combination. it can.
  • An oxetane compound may be used in addition to the epoxy compound.
  • thermal cationic polymerization initiator those known as thermal cationic polymerization initiators for epoxy compounds can be employed.
  • thermal cationic polymerization initiators for epoxy compounds can be employed.
  • an iodonium salt, a sulfonium salt, a phosphonium salt, a ferrocene, or the like that generates an acid by heat is used.
  • an aromatic sulfonium salt having a good potential with respect to temperature can be preferably used.
  • the amount of the thermal cationic polymerization initiator is preferably 2 to 60 parts by mass relative to 100 parts by mass of the epoxy compound. Parts, more preferably 5 to 40 parts by mass.
  • the thermopolymerizable composition preferably contains a film-forming resin and a silane coupling agent.
  • the film-forming resin include a phenoxy resin, an epoxy resin, an unsaturated polyester resin, a saturated polyester resin, a urethane resin, a butadiene resin, a polyimide resin, a polyamide resin, and a polyolefin resin. be able to.
  • a phenoxy resin can be preferably used from the viewpoints of film formability, workability, and connection reliability.
  • the weight average molecular weight is preferably 10,000 or more.
  • the silane coupling agent include an epoxy silane coupling agent and an acrylic silane coupling agent. These silane coupling agents are mainly alkoxysilane derivatives.
  • the thermopolymerizable composition may contain an insulating filler for adjusting the melt viscosity.
  • the insulating filler include silica powder and alumina powder.
  • the size of the insulating filler is preferably 20 to 1000 nm in particle size, and the blending amount is preferably 5 to 50 parts by mass with respect to 100 parts by mass of a thermopolymerizable compound (and a photopolymerizable compound) such as an epoxy compound. .
  • a filler a softener, an accelerator, an antioxidant, a colorant (pigment, dye), an organic solvent, an ion catcher agent and the like different from the above-mentioned insulating filler may be contained.
  • the insulating resin layer 2 having the above-described minimum melt viscosity holds the conductive particles 1 as described above, and the degree of the holding can be evaluated using the number density as an index. That is, in the anisotropic conductive film of the present invention, the following condition (e) is satisfied with respect to the number density of the conductive particles 1.
  • the lower limit of the number density of the conductive particles in the anisotropic conductive film of the present invention in the film plan view is 6000 particles / mm 2 or more, because if the number density is too small, the number of trapped particles may decrease and the conduction resistance may increase. It becomes 7500 pieces / mm 2 or more. If the number density is too high, it is necessary to increase the pressure at the time of connection. If the substrate is made of plastic or the like, there is a concern about deformation, so that the pressure at the time of connection is not excessively increased. 2 or less, preferably 30000 pieces / mm 2 or less.
  • the number density of the conductive particles may be obtained by observing using a metallographic microscope or by measuring the observed image using image analysis software (WinROOF, Mitani Corporation). The observation method and the measurement method are not limited to the above.
  • a rectangular region having one side of 100 ⁇ m or more is arbitrarily set at a plurality of positions (preferably 5 or more, more preferably 10 or more), and the total area of the measurement region is 2 mm. It is preferred to be 2 or more.
  • the size and number of the individual regions may be appropriately adjusted depending on the state of the number density. As an example of a case where the number density for a fine pitch application is relatively large, 200 images (2 mm 2 ) of an area having an area of 100 ⁇ m ⁇ 100 ⁇ m arbitrarily selected from the anisotropic conductive film 10 ⁇ / b > A are observed using a metallographic microscope or the like.
  • a region having an area of 100 ⁇ m ⁇ 100 ⁇ m is a region where one or more bumps are present in a connection target having a space between bumps of 50 ⁇ m or less and an L / S (line / space) of 1 or less.
  • the dispersion state of the conductive particles 1 in the conductive particle dispersion layer 3 of the anisotropic conductive film of the present invention includes a state in which the conductive particles 1 are randomly dispersed and a state in which the conductive particles 1 are dispersed in a regular arrangement. In either case, it is preferable that the positions in the film thickness direction are aligned from the viewpoint of capture stability.
  • that the position of the conductive particles 1 in the film thickness direction is uniform is not limited to that the conductive particles 1 are aligned at a single depth in the film thickness direction, but the front and back interfaces of the insulating resin layer 2 or the vicinity thereof. In which conductive particles are present.
  • the conductive particles 1 are regularly arranged in a plan view of the film from the viewpoint of suppressing a short circuit.
  • the arrangement mode depends on the layout of terminals and bumps, and is not particularly limited.
  • the film can be arranged in a square lattice arrangement as shown in FIG. 1A in plan view.
  • a lattice arrangement such as a rectangular lattice, an oblique lattice, a hexagonal lattice, and a triangular lattice can be given.
  • a plurality of lattices having different shapes may be combined.
  • a particle row in which conductive particles are linearly arranged at predetermined intervals may be arranged in parallel at predetermined intervals.
  • the conductive particles are regularly arranged in a plan view of the film and the positions in the film thickness direction are uniform in order to achieve both capture stability and short-circuit suppression.
  • the conductive particles may be randomly dispersed without being regularly arranged. Even in the case of dispersing, it is preferable that the individual conductive particles are arranged in a non-contact manner (the individual conductive particles are independently present in a non-contact manner) in a plan view of the film.
  • the number ratio may be 75% or more, preferably 90% or more, more preferably 95% or more, and even more preferably 98% or more.
  • the lattice axis or the arrangement axis of the arrangement may be parallel to the longitudinal direction of the anisotropic conductive film or a direction perpendicular to the longitudinal direction, and the longitudinal axis of the anisotropic conductive film. It may intersect with the direction, and can be determined according to the terminal width, terminal pitch and the like to be connected.
  • the lattice axis A of the arrangement of the conductive particles 1 is inclined with respect to the longitudinal direction of the anisotropic conductive film 10A.
  • the angle ⁇ between the longitudinal direction (the short direction of the film) of the terminal 200 connected with the anisotropic conductive film 10A and the lattice axis A is 6 ° or more and 84 ° or less, preferably 11 ° or more and 74 ° or less. .
  • the distance between the conductive particles 1 is appropriately determined according to the size and the terminal pitch of the terminals connected by the anisotropic conductive film.
  • the lower limit of the distance between the nearest particles is preferably 50% or more of the average particle diameter D of the conductive particles or 0.2 ⁇ m or more.
  • the upper limit is not particularly limited as long as the condition of the number density can be satisfied.
  • the average particle diameter D of the conductive particles is preferably 30 ⁇ m or less, which is a preferable maximum diameter, or the average particle diameter is relatively small. When the diameter D is small, it is preferably 10 times or less the average particle diameter D.
  • the area occupancy of the conductive particles of the anisotropic conductive film of the present invention in a plan view is an index of the thrust required for the pressing jig for thermocompression bonding the anisotropic conductive film to the electronic component. If the area occupancy is too large, the thrust increases accordingly, and if the substrate is easily deformed such as plastic, it becomes a factor of deformation. Therefore, the upper limit of the area occupancy of the conductive particles is preferably 30% or less, more preferably 26% or less, and even more preferably 23% or less. Further, if the area occupancy is too small, there is a possibility that the device cannot cope with the fine pitch, so that it is preferably 3% or more, more preferably 6% or more, and still more preferably 9% or more.
  • the area occupancy [%] of the conductive particles can be calculated by the following equation.
  • the measurement region of the number density and the area occupancy of the conductive particles may be a rectangular region having a side of 100 ⁇ m or more at a plurality of positions (preferably 5 or more, more preferably 10 or more), and the total area of the measurement regions is preferably 2 mm 2 or more.
  • the size and number of the individual regions may be appropriately adjusted depending on the state of the number density.
  • the position of the conductive particles 1 in the thickness direction of the insulating resin layer 2 may be such that the conductive particles 1 are exposed from the insulating resin layer 2 as described above.
  • the surface 2 a of the insulating resin layer on which the recesses 2 b and 2 c are formed may be buried from the tangent plane 2 p at the center between adjacent conductive particles.
  • the distance Lb at the deepest part of the conductive particles (hereinafter referred to as an embedding amount), and the ratio of the embedding amount Lb to the particle diameter D of the conductive particles 1 [(Lb / D) ⁇ 100] (hereinafter referred to as an embedding rate) Is preferably 60% or more and 105% or less.
  • the conductive particles 1 are maintained in a predetermined particle dispersion state or a predetermined arrangement by the insulating resin layer 2, and by setting the embedding rate to 105% or less, the anisotropic conductive connection is achieved.
  • the amount of resin in the insulating resin layer that acts to flow the conductive particles between the terminals unnecessarily can be reduced.
  • the numerical value of the embedding rate, the numerical value of the embedding rate (Lb / D) is 80% or more, preferably 90% or more, more preferably 90% or more of the total number of conductive particles contained in the anisotropic conductive film.
  • the embedding rate is obtained by arbitrarily extracting 10 or more areas having an area of 30 mm 2 or more from the anisotropic conductive film, observing a part of the cross section of the film with an SEM image, and measuring a total of 50 or more conductive particles. You can ask. In order to further increase the accuracy, it may be obtained by measuring 200 or more conductive particles.
  • the embedding rate can be collectively obtained for a certain number by adjusting the focus in the surface visual field image.
  • a laser type discriminating displacement sensor manufactured by Keyence Corporation may be used for measuring the embedding rate.
  • the anisotropic conductive film of the present invention is, like the anisotropic conductive film 10E shown in FIG. 5, a surface of the conductive particle dispersion layer 3 on which the conductive particles 1 are held (in other words, an insulating resin).
  • a second insulating resin layer 4 (functioning as an insulating adhesive layer) having a lower minimum melt viscosity than that of the insulating resin layer 2 may be laminated on the surface of the layer 2 where the recess 2c is formed.
  • the surface of the conductive particle dispersion layer 3 on the side where the conductive particles 1 are not held (in other words, the recess 2c of the insulating resin layer 2 is formed).
  • a second insulating resin layer 4 (functioning as an insulating adhesive layer) having a lower minimum melt viscosity than the insulating resin layer 2 may be laminated on the non-conductive surface).
  • the second insulating resin layer 4 When the second insulating resin layer 4 is laminated, the second insulating resin layer 4 is added with a tool regardless of whether the second insulating resin layer 4 is on the surface on which the recess 2c is formed. It is preferably on the side of an electronic component such as an IC chip to be pressed (in other words, the insulating resin layer 2 is on the side of an electronic component such as a substrate mounted on a stage). By doing so, unintentional movement of the conductive particles can be avoided, and trapping properties can be improved.
  • the space formed by the electrodes and bumps of the electronic component is more easily filled with the second insulating resin layer 4.
  • the effect of improving the adhesion between electronic components can be expected.
  • the larger the difference the relatively small the amount of movement of the insulating resin layer 2 existing in the conductive particle dispersion layer 3, so that the ability of the terminal to capture the conductive particles can be easily improved.
  • the lowest melt viscosity ratio between the insulating resin layer 2 and the second insulating resin layer 4 is preferably 2 or more, more preferably 5 or more, and further preferably 8 or more.
  • the ratio is too large, when a long anisotropic conductive film is formed into a wound body, there is a possibility that the resin will protrude or block, so that the ratio is preferably 15 or less in practical use.
  • the preferred minimum melt viscosity of the second insulating resin layer 4 can be determined with reference to the description of Japanese Patent No. 6187665 (paragraph 0091).
  • the second insulating resin layer 4 can be formed by adjusting the viscosity of the same resin composition as the insulating resin layer.
  • the layer thickness of the second insulating resin layer 4 is preferably 4 ⁇ m or more and 20 ⁇ m or less. Alternatively, it is preferably 1 to 8 times the conductive particle diameter.
  • the minimum melt viscosity of the entire anisotropic conductive films 10E and 10F including the insulating resin layer 2 and the second insulating resin layer 4 is preferably 200 Pa ⁇ s or more and 4000 Pa ⁇ s or less.
  • the minimum melt viscosity of the second insulating resin layer 4 itself is preferably 2000 Pa ⁇ s or less, more preferably 100 to 2000 Pa ⁇ s, on the assumption that the above-described minimum melt viscosity ratio is satisfied.
  • a third insulating resin layer may be provided on the opposite side of the second insulating resin layer 4 and the insulating resin layer 2 with the insulating resin layer 2 interposed therebetween.
  • the third insulating resin layer or the insulating adhesive layer can function as a tack layer.
  • the second insulating resin layer it may be provided to fill the space formed by the electrodes and bumps of the electronic component.
  • the resin composition, viscosity and thickness of the third insulating resin layer may be the same as or different from those of the second insulating resin layer.
  • the minimum melt viscosity of the anisotropic conductive film including the insulating resin layer 2, the second insulating resin layer 4, and the third insulating resin layer is not particularly limited, but may be 200 to 4000 Pa ⁇ s. it can.
  • the anisotropic conductive film of the present invention can be manufactured by a manufacturing method including a step of forming a conductive particle dispersed layer by injecting conductive particles into an insulating resin layer.
  • the conductive particles are held in a predetermined arrangement on the surface of the insulating resin layer, and the conductive particles are pressed into the insulating resin layer with a flat plate or a roller to form a conductive particle dispersion layer.
  • the insulating resin layer 2 is pressed against the stretched film to transfer the conductive particles to the insulating resin layer 2, thereby holding the conductive particles 1 on the insulating resin layer 2.
  • the lowest melt viscosity of the insulating resin layer may be determined with reference to the description of Japanese Patent No. 6187665 (paragraph 0097). it can. Thereby, the conductive particles can be pushed so that the surface of the insulating resin layer forming the surface of the conductive particle dispersion layer has a recess with respect to the tangent plane of the insulating resin layer at the center between adjacent conductive particles. .
  • the anisotropic conductive film When an anisotropic conductive film having an embedding ratio of more than 100% is manufactured, the anisotropic conductive film may be pressed with a pressing plate so as to have a convex portion corresponding to the conductive particle arrangement.
  • the transfer mold When the conductive particles 1 are held in the insulating resin layer 2 using a transfer mold, examples of the transfer mold include inorganic materials such as silicon, various ceramics, glass, metals such as stainless steel, and various resins.
  • the organic material described above a material in which an opening is formed by a known method for forming an opening such as a photolithographic method or a material to which a printing method is applied can be used.
  • the transfer mold can take a shape such as a plate shape or a roll shape. Note that the present invention is not limited to the above method.
  • a second insulating resin layer having a lower viscosity than the insulating resin layer can be laminated on the surface of the insulating resin layer into which the conductive particles have been pressed, on the surface on which the conductive particles have been pressed, or on the opposite surface.
  • the anisotropic conductive film has a certain length. Therefore, it is preferable that the length of the anisotropic conductive film is specifically 5 m or more. It can also be determined with reference to the description of Japanese Patent No. 6187665 (paragraph 0103).
  • the resin viscosity that is, substantially proportional to the minimum melt viscosity of the film
  • the minimum melt viscosity of the anisotropic conductive film is preferably set to 200 Pa ⁇ s or more. This is the same even if the second insulating resin layer and the third insulating resin layer are laminated.
  • the first electronic component (the side heated by the tool) has relatively high rigidity such as an IC chip or an IC module (for example, from a wafer similar to a general IC chip).
  • the second electronic component (the side to be mounted on the stage) is a flexible material such as a plastic substrate.
  • a first electronic component such as a semiconductor element, an IC chip, an IC module, or an FPC is connected to a second electronic component such as an FPC, a glass substrate, a plastic substrate, a rigid substrate, or a ceramic substrate for anisotropic conductive connection. It does not exclude aspects.
  • IC chips or wafers may be stacked to form a multilayer using the anisotropic conductive film of the present invention.
  • the electronic components connected by the anisotropic conductive film of the present invention are not necessarily limited to the above electronic components. In recent years, it can be used for various diversified electronic components. For example, when an IC chip or an FPC is used as the first electronic component, an OLED plastic substrate can be used as the second electronic component. In particular, when the first electronic component is an IC chip and the second electronic component is a COP structure using a plastic substrate, the present invention particularly exerts its effect.
  • the present invention provides a “connection structure in which the first electronic component and the second electronic component are anisotropically conductively connected via the anisotropic conductive film of the present invention”; And a second electronic component through an anisotropic conductive film of the present invention for anisotropically conductive connection.
  • the anisotropic conductive film is used for the second electronic component such as various substrates.
  • the first electronic component such as an IC chip is provided on the side of the temporarily-bonded anisotropic conductive film where the conductive particles 1 are not embedded in the surface, in which the conductive particles 1 are temporarily embedded and temporarily compressed from the side where the conductive particles 1 are embedded in the surface. And thermocompression bonding.
  • the insulating resin layer of the anisotropic conductive film contains not only the thermal polymerization initiator and the thermopolymerizable compound but also the photopolymerization initiator and the photopolymerizable compound (which may be the same as the thermopolymerizable compound), A pressure bonding method using both light and heat may be used. In this way, unintentional movement of the conductive particles can be minimized.
  • the side where the conductive particles are not embedded may be temporarily attached to the second electronic component for use. Note that the anisotropic conductive film may be temporarily attached to the first electronic component instead of the second electronic component, and then aligned and connected.
  • the conductive particle dispersion layer 3 may be formed of various substrates.
  • the first electronic component such as an IC chip is aligned and placed on the side of the second insulating resin layer 4 of the anisotropically conductive film that has been temporarily bonded and temporarily bonded to the second electronic component. Crimp.
  • the second insulating resin layer 4 side of the anisotropic conductive film may be temporarily attached to the first electronic component. Further, the conductive particle dispersion layer 3 side can be temporarily attached to the first electronic component for use.
  • F is a load value (N) when the conductive particles are compressed and deformed by 20%
  • S is a compressive displacement (mm) when the conductive particles are compressed and deformed by 20%
  • R is a conductive displacement. (Mm).
  • the conductive particles 1, 3 and 4 are conductive particles for the present invention, and the conductive particles 2 are conductive particles for a comparative example.
  • a resin composition for forming the insulating resin layer, the second insulating resin layer or the insulating adhesive layer (Table 1) was coated on a PET film having a film thickness of 50 ⁇ m using a bar coater and dried in an oven at 80 ° C. for 5 minutes to form an insulating resin layer having a thickness shown in Table 3 on the PET film.
  • a second insulating resin layer or an insulating adhesive layer was formed on different PET films at the thicknesses shown in Table 3.
  • the conductive particles 1 have a square lattice arrangement shown in FIG. 1A in plan view, the distance between the particles is equal to the average particle diameter of the conductive particles, and the number density of the conductive particles is as shown in Table 3.
  • a mold was manufactured so as to be as follows.
  • the pattern of the convex portions of the mold is a square lattice array
  • the pitch of the convex portions on the lattice axis is twice the average conductive particle diameter
  • the angle ⁇ between the lattice axis and the lateral direction of the anisotropic conductive film is A mold of 15 ° is produced, and a known transparent resin pellet is melted and poured into the mold, and cooled and solidified to form a resin transfer master having an arrangement pattern as shown in FIG. 1A. did.
  • a two-layer type anisotropic conductive film was prepared by laminating a second insulating resin layer on the conductive particle dispersion layer similarly prepared (Examples 6 and 7). Furthermore, a three-layer type anisotropic conductive film was prepared by laminating an insulating adhesive layer having tackiness on the conductive particle dispersion layer side of the two-layer type anisotropic conductive film similarly prepared (executed). Example 8).
  • the terminal patterns of the evaluation IC and the plastic substrate correspond to each other, and the sizes are as follows.
  • the longitudinal direction of the anisotropic conductive film was aligned with the lateral direction of the bump.
  • Plastic substrate ITO wiring
  • Substrate material Polyethylene terephthalate base film / Polyurethane adhesive / Polyimide film (PET / PU / PI substrate) Outline 30 ⁇ 50mm Thickness 0.5mm Electrode ITO wiring
  • (B) Conduction reliability The conduction resistance after placing the connection for evaluation prepared in (a) in a thermostat at a temperature of 85 ° C. and a humidity of 85% RH for 500 hours was measured in the same manner as the initial conduction resistance.
  • the conduction reliability is practically preferably 5 ⁇ or less, more preferably 2 ⁇ or less.
  • connection object for evaluation prepared in (a) was observed with a metallographic microscope from the plastic substrate side, and it was confirmed whether or not an indentation was observed at the center of the bump end. The case where it was observed was evaluated as good (good), and the case where it was not observed was evaluated as poor (poor).
  • Evaluation standard of particle trapping property A 5 or more B 3 or more and less than 5 C 3 or less
  • the anisotropic conductive film of Comparative Example 1 which exceeded the numerical range of the condition (d), had a problem in “continuity reliability”. There was also a problem with "indentation”.
  • the anisotropic conductive film of Reference Example 1 in which the numerical ranges of the conditions (A) and (B) are slightly deviated downward, has an initial conduction resistance and an initial conduction resistance which are lower than those of Examples 1 to 8.
  • the resistance value in the conduction reliability is slightly high, it is not at a level that causes a problem in practical use.
  • the initial conduction resistance and the resistance value in conduction reliability are low as in Examples 1 to 8.
  • the anisotropic conductive film of the present invention as the conductive particles held in the conductive particle dispersion layer, those having 20% compression elastic modulus, compression recovery rate and average particle diameter each in a specific numerical range are used, As the insulating resin layer holding such conductive particles, a resin having a minimum melt viscosity of a specific value or less is used, and the degree of holding the conductive particles in such insulating resin layer (in other words, the number density ) Is set within a specific range. Therefore, via the anisotropic conductive film of the present invention, an electronic component having a bump such as an image display element or a driving IC chip is anisotropically mounted on a flexible plastic substrate on which electrodes and wiring are formed.
  • the anisotropic conductive film of the present invention is useful for connecting an electronic component (especially an IC chip) to an anisotropic conductive connection not only to a glass substrate but also to a plastic substrate.

Abstract

La présente invention concerne un film conducteur anisotrope approprié pour une connexion conductrice anisotrope à un substrat en plastique souple sur lequel sont formés un composant électronique ayant une bosse, telle qu'un élément d'affichage d'image ou une puce CI pour la conduite, et une électrode et un câblage transparents, le film ayant au moins une couche de dispersion de particules conductrices formée à partir d'une couche de résine isolante et de particules conductrices dispersées dans celle-ci. Ce film conducteur anisotrope satisfait les conditions suivantes. Condition (A) : le module d'élasticité des particules conductrices à 20 % de compression est de 6000-15000 N/mm2. Condition (B) : le taux de récupération de compression des particules conductrices est de 40-80 %. Condition (C) : le diamètre moyen de particule des particules conductrices est comprise entre 1 et 30 µm. Condition (D) : la viscosité à l'état fondu minimale de la couche de résine isolante est inférieure ou égale à 4 000 Pa∙s. Condition (E) : la densité de nombre des particules conductrices est de 6000-36000/mm2.
PCT/JP2019/038143 2018-10-03 2019-09-27 Film conducteur anisotrope, structure de connexion et procédé permettant de fabriquer une structure de connexion WO2020071271A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020217005129A KR20210033513A (ko) 2018-10-03 2019-09-27 이방성 도전 필름, 접속 구조체, 접속 구조체의 제조 방법
CN201980061791.XA CN112740483B (zh) 2018-10-03 2019-09-27 各向异性导电薄膜、连接结构体、连接结构体的制备方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018188024 2018-10-03
JP2018-188024 2018-10-03
JP2019176515A JP2020095941A (ja) 2018-10-03 2019-09-27 異方性導電フィルム、接続構造体、接続構造体の製造方法
JP2019-176515 2019-09-27

Publications (1)

Publication Number Publication Date
WO2020071271A1 true WO2020071271A1 (fr) 2020-04-09

Family

ID=70055171

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/038143 WO2020071271A1 (fr) 2018-10-03 2019-09-27 Film conducteur anisotrope, structure de connexion et procédé permettant de fabriquer une structure de connexion

Country Status (1)

Country Link
WO (1) WO2020071271A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022107800A1 (fr) * 2020-11-20 2022-05-27 昭和電工マテリアルズ株式会社 Film adhésif pour connexion de circuit et structure de connexion et son procédé de fabrication

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216841A (ja) * 1999-11-26 2001-08-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP2004164874A (ja) * 2002-11-08 2004-06-10 Osugi Kk 異方性導電接着剤用導電微粒子
JP2005327509A (ja) * 2004-05-12 2005-11-24 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2007035575A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2007035574A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
WO2010032854A1 (fr) * 2008-09-19 2010-03-25 株式会社日本触媒 Particules électroconductrices et matériau électroconducteur anisotrope utilisant ces particules
JP2013125651A (ja) * 2011-12-14 2013-06-24 Nippon Shokubai Co Ltd 導電性微粒子
WO2018101108A1 (fr) * 2016-12-01 2018-06-07 デクセリアルズ株式会社 Pellicule conductrice anisotrope
WO2018101106A1 (fr) * 2016-12-01 2018-06-07 デクセリアルズ株式会社 Film électroconducteur anisotrope

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001216841A (ja) * 1999-11-26 2001-08-10 Sekisui Chem Co Ltd 導電性微粒子及び導電接続構造体
JP2004164874A (ja) * 2002-11-08 2004-06-10 Osugi Kk 異方性導電接着剤用導電微粒子
JP2005327509A (ja) * 2004-05-12 2005-11-24 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2007035575A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
JP2007035574A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、異方性導電材料、及び、接続構造体
WO2010032854A1 (fr) * 2008-09-19 2010-03-25 株式会社日本触媒 Particules électroconductrices et matériau électroconducteur anisotrope utilisant ces particules
JP2013125651A (ja) * 2011-12-14 2013-06-24 Nippon Shokubai Co Ltd 導電性微粒子
WO2018101108A1 (fr) * 2016-12-01 2018-06-07 デクセリアルズ株式会社 Pellicule conductrice anisotrope
WO2018101106A1 (fr) * 2016-12-01 2018-06-07 デクセリアルズ株式会社 Film électroconducteur anisotrope

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022107800A1 (fr) * 2020-11-20 2022-05-27 昭和電工マテリアルズ株式会社 Film adhésif pour connexion de circuit et structure de connexion et son procédé de fabrication

Similar Documents

Publication Publication Date Title
JP6187665B1 (ja) 異方性導電フィルム
KR102524169B1 (ko) 필러 함유 필름
WO2017010446A1 (fr) Film conducteur anisotrope et structure de connexion
JP7315878B2 (ja) フィラー含有フィルム
WO2017061539A1 (fr) Film conducteur anisotrope et structure de connexion
KR20210031536A (ko) 이방성 도전 필름
KR102652055B1 (ko) 필러 함유 필름
JP7081097B2 (ja) フィラー含有フィルム
WO2020071271A1 (fr) Film conducteur anisotrope, structure de connexion et procédé permettant de fabriquer une structure de connexion
JP7352114B2 (ja) フィラー含有フィルム
JP7274815B2 (ja) 異方性導電フィルム
JP7332956B2 (ja) フィラー含有フィルム
JP7087305B2 (ja) フィラー含有フィルム
TWI775562B (zh) 異向性導電膜之製造方法、異向性導電膜、異向性導電膜捲裝體、連接構造體之製造方法、連接構造體、填料配置膜之製造方法、及填料配置膜
CN112740483B (zh) 各向异性导电薄膜、连接结构体、连接结构体的制备方法
TW202307162A (zh) 異向性導電膜
TWI740934B (zh) 異向性導電膜
JP7319578B2 (ja) フィラー含有フィルム
KR20200022510A (ko) 이방성 도전 필름
TWI835252B (zh) 含填料膜
JP2022176967A (ja) 異方性導電フィルム

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19869775

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
ENP Entry into the national phase

Ref document number: 20217005129

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19869775

Country of ref document: EP

Kind code of ref document: A1