WO2020044460A1 - Carte de circuit imprimé flexible - Google Patents

Carte de circuit imprimé flexible Download PDF

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Publication number
WO2020044460A1
WO2020044460A1 PCT/JP2018/031935 JP2018031935W WO2020044460A1 WO 2020044460 A1 WO2020044460 A1 WO 2020044460A1 JP 2018031935 W JP2018031935 W JP 2018031935W WO 2020044460 A1 WO2020044460 A1 WO 2020044460A1
Authority
WO
WIPO (PCT)
Prior art keywords
pattern layer
terminal portion
layer
base
pattern
Prior art date
Application number
PCT/JP2018/031935
Other languages
English (en)
Japanese (ja)
Inventor
卓郎 品田
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2018/031935 priority Critical patent/WO2020044460A1/fr
Publication of WO2020044460A1 publication Critical patent/WO2020044460A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present application relates to a flexible printed circuit board.
  • a flexible board is often used.
  • a flexible substrate is used for connection between the transceiver-side substrate and a PKG (package) ceramic substrate.
  • a flexible substrate is used for wiring between the substrates.
  • the flexible substrate connected to the optical module product is bent for position adjustment. At the time of bending, stress concentrates on the base portion of the substrate, which may cause disconnection.
  • a first brazing material pattern is provided at one end of a flexible substrate at a lead connecting portion of a first wiring pattern, and a second brazing material pattern is provided at a lead connecting portion of a second wiring pattern.
  • JP-A-2011-238883 (paragraphs 0018 to 0022, FIG. 2)
  • the present application discloses a technique for solving the above-described problems, and not only suppresses disconnection, but also can maintain electrical continuity even when disconnection occurs, realizing a long life.
  • An object of the present invention is to provide a flexible printed circuit board that can be used.
  • a flexible printed board disclosed in the present application has a base formed in a flexible plate shape made of a dielectric material, and a plurality of signal lines provided on a surface of the base and connecting between external substrates.
  • a first pattern layer provided with a terminal portion at an end thereof, and a second pattern layer provided with a terminal portion on the back surface of the base corresponding to the terminal portion of the first pattern layer;
  • a first cover layer and a second cover layer that respectively expose and cover a surface of an end portion of the layer and the second pattern layer, and a terminal portion of the second pattern layer and a terminal of the first pattern layer via the base.
  • the one via hole is provided so as to connect a portion of the terminal portion of the second pattern layer or the terminal portion of the first pattern layer on a side of the terminal portion of the second pattern layer or the first pattern layer connected to the external substrate.
  • the second via hole is provided so as to connect an extended portion of the terminal portion of the second pattern layer to a corresponding terminal portion of the first pattern layer.
  • a second base provided on the front surface side and formed in a flexible plate shape made of a dielectric material, and a terminal portion was provided on the surface of the second base corresponding to the terminal portion of the first pattern layer.
  • the terminal portion of the pattern layer is extended and wired across the end portion of the cover layer, the first via hole is connected on the external substrate side connected to the terminal portion, and the second via hole is connected to the end portion of the cover layer.
  • FIG. 2 is an exploded perspective view showing a configuration of the flexible printed circuit board according to the first embodiment.
  • FIG. 3 is a plan view of a pattern layer in the flexible printed board according to the first embodiment.
  • FIG. 2 is a cross-sectional view illustrating a configuration of a flexible printed board according to Embodiment 1.
  • FIG. 5 is a cross-sectional view showing another example of use of the flexible printed board according to the first embodiment.
  • FIG. 9 is a plan view of a pattern layer in a flexible printed board according to Embodiment 2.
  • FIG. 7 is a cross-sectional view illustrating a configuration of a flexible printed board according to a second embodiment.
  • FIG. 13 is a plan view of a pattern layer in a flexible printed board according to Embodiment 3.
  • FIG. 13 is a cross-sectional view illustrating a configuration of a flexible printed board according to a third embodiment.
  • FIG. 14 is a plan view of a pattern layer in a flexible printed board according to a
  • FIG. 1 is an exploded perspective view showing the configuration of the flexible printed circuit board according to the first embodiment.
  • FIG. 2 is a plan view showing the configuration of the pattern layer of the flexible printed board, and
  • FIG. 3 is a cross-sectional view of the flexible printed board at the position of the pattern layer shown in FIG.
  • the flexible printed circuit board 101 includes a first base 1, a first pattern layer 2 provided on the front surface of the first base 1, and a second pattern provided on the back surface of the first base 1. It comprises a layer 3, a first cover layer 4 for protecting the first pattern layer 2, and a second cover layer 5 for protecting the second pattern layer 3.
  • the first base 1 is made of a dielectric material such as polyimide and is formed in a 25 ⁇ m-thick flexible plate.
  • a first pattern layer 2 is provided on the front surface of the first base 1, and a second pattern layer 3 is provided on the back surface.
  • the first base 1 is provided with a first via hole 6 a and a second via hole 6 b penetrating from the first pattern layer 2 to the second pattern layer 3.
  • the first pattern layer 2 is made of a metal material such as copper or gold, and is formed on the surface of the first base 1 with a thickness of 28 ⁇ m ⁇ 5% by a method such as plating or printing.
  • the first pattern layer 2 has a plurality of pairs of signal wirings 2a and 2b as signal lines connecting the external substrates. At both ends of the first pattern layer 2, a plurality of terminal portions 20g of the ground wiring are provided next to the pair of terminal portions 20a and 20b of the signal wirings 2a and 2b.
  • the terminal portions 20a and 20b of the signal wires 2a and 2b and the terminal portion 20g of the ground wire are provided with a first via hole 6a and a second via hole 6b penetrating through the first base 1 to the second pattern layer 3,
  • the first pattern layer 2 and the second pattern layer 3 are electrically connected.
  • the second pattern layer 3 is made of a metal material such as copper or gold, and is formed on the back surface of the first base 1 with a thickness of 28 ⁇ m ⁇ 5% by a method such as plating or printing. You.
  • the second pattern layer 3 includes a plurality of pairs of signal wiring terminal portions 30a and 30b, and a ground wiring 3g and a ground wiring 3g provided on the entire central portion so as to correspond to the wiring pattern of the first pattern layer 2. , And a plurality of terminal portions 30g arranged toward both ends.
  • the terminal portions 30a and 30b of the signal wiring and the terminal portion 30g of the ground wiring 3g are provided with a first via hole 6a and a second via hole 6b penetrating into the first pattern layer 2, and the second pattern layer 3 and the first pattern The layer 2 is electrically connected.
  • the first via hole 6a and the second via hole 6b are made of a metal material such as copper or gold, and are formed in a columnar shape with a thickness of 100 ⁇ m by plating or the like.
  • the first via hole 6 a and the second via hole 6 b are formed through the first pattern layer 2, the first base 1, and the second pattern layer 3, and electrically connect the first pattern layer 2 and the second pattern layer 3. Conduct continuity.
  • the first cover layer 4 and the second cover layer 5 are made of a dielectric material such as polyimide, and are formed in a flexible plate having a thickness of 40 ⁇ m.
  • the first cover layer 4 and the second cover layer 5 are respectively provided with an adhesive on the front surface of the first base 1 on which the first pattern layer 2 is formed and on the back surface of the first base 1 on which the second pattern layer 3 is formed. To protect the first pattern layer 2 and the second pattern layer 3 respectively.
  • the flexible printed board 101 is mounted on the external board 7 via the terminal portions 30a, 30b, 30g of the second pattern layer 3.
  • the terminal portions 30a, 30b, 30g of the second pattern layer 3 and the external substrate 7 are joined by, for example, a joining material such as a solder material or a conductive film.
  • a joining material such as a solder material or a conductive film.
  • the terminal portions 30a and 30b of the signal wiring of the second pattern layer 3 are wired from the end of the second pattern layer 3 to a position short of the position of Bu. Therefore, the terminal portions 30a and 30a of the signal wiring are located at the position of Bu. There was no 30b wiring.
  • the terminal portions 30a and 30b of the signal wiring of the second pattern layer 3 extend and extend over the position of Bu, that is, the position of the end of the second cover layer 5.
  • the first via hole 6 a is closer to the terminal portion 30 a, 30 b of the second pattern layer 3 than the end of the second cover layer 5 is connected to the external substrate 7, and the terminal portion of the signal wiring of the second pattern layer 3
  • the terminals 30a and 30b are connected to the terminals 20a and 20b of the signal wirings 2a and 2b of the first pattern layer 2, respectively.
  • the second via hole 6 b is formed by extending the terminal portions 30 a and 30 b of the second pattern layer 3 wired across the end of the second cover layer 5 and the signal wiring 2 a of the first pattern layer 2. 2b are electrically connected to the corresponding portions of the terminal portions 20a and 20b.
  • the terminal portions 30a and 30b of the signal wiring of the second pattern layer 3 are also positioned at the position of Bd, that is, the position of the end of the second cover layer 5. Since the wiring is extended so as to straddle, strength against stress concentration on the flexible printed circuit board 101 can be improved, and disconnection can be suppressed. Further, even when the terminal portion of the signal wiring (the position of Bd) is broken around the stress concentration portion, the external substrate 7 ⁇ the signal wiring terminal portions 30a and 30b of the second pattern layer 3 ⁇ the second via hole 6b ⁇ the first via hole 6b ⁇ Electrical continuity can be maintained in the path of the signal wirings 2a and 2b of the pattern layer 2.
  • the present invention is not limited to this. As shown in FIG. 4, the external substrate 7 may be joined to the terminal portions 20a and 20b of the first pattern layer 2. In this case, the same effect can be obtained.
  • the first base 1 formed of a flexible plate made of a dielectric material and the first base 1
  • a first pattern layer 2 having a plurality of pairs of signal wirings 2a and 2b for connecting between the substrates, having terminal portions 20a and 20b provided at both ends of the signal wirings 2a and 2b, and terminals of the first pattern layer 2
  • the second pattern layer 3 in which the terminal portions 30a and 30b are provided on the back surface of the first base 1, and the surfaces of the end portions of the first pattern layer 2 and the second pattern layer 3, respectively.
  • the first and second cover layers 4 and 5 that are exposed and covered, and the terminals 30a and 30b of the second pattern layer 3 and the terminals 20a and 20b of the first pattern layer 2 are electrically connected via the first base 1.
  • the second via holes 6b are provided so as to connect the terminal portions 20a and 20b of the second pattern layer 2 and the corresponding terminal portions 20a of the first pattern layer 2 with the extended portions of the terminal portions 30a and 30b of the second pattern layer 3. , 20b are connected to each other, so that strength against stress concentration on the flexible printed circuit board can be improved, and disconnection can be suppressed. Further, even when the terminal portion of the signal wiring is disconnected around the stress concentration portion, electrical conduction can be maintained.
  • Embodiment 2 FIG. In the first embodiment, the case where the terminal portions 30a and 30b of the signal wiring of the second pattern layer 3 are disconnected has been described. It shows about.
  • FIG. 5 is a plan view showing the configuration of the pattern layer of the flexible printed board according to the second embodiment
  • FIG. 6 is a cross-sectional view of the flexible printed board at the position of the CC in the pattern layer of FIG.
  • the second base 8 and the second base layer 8 are further provided on the second pattern layer 3 of the flexible printed circuit board 101 of the first embodiment.
  • the third pattern layer 9 is provided on the second base 8.
  • the second base 8 is made of a dielectric material such as polyimide, like the first base 1, and is formed in a 25 ⁇ m-thick flexible plate.
  • the third pattern layer 9 is provided on the surface of the second base 8.
  • the second base 8 is provided with a first via hole 6 a and a second via hole 6 b penetrating from the third pattern layer 9 to the second pattern layer 3.
  • the third pattern layer 9 is made of a metal material such as copper or gold, and is formed on the surface of the second base 8 with a thickness of 28 ⁇ m ⁇ 5% by a method such as plating or printing.
  • the third pattern layer 9 includes a plurality of pairs of signal wiring terminal portions 90a and 90b and a ground wiring 9g and a ground wiring 9g provided on the entire central portion so as to correspond to the wiring pattern of the first pattern layer 2. And a plurality of terminal portions 90g disposed toward both ends of the terminal portion.
  • the first via hole 6a and the second via hole 6b penetrating to the second pattern layer 3 are provided in the terminal portions 90a and 90b of the signal wiring and the terminal portion 90g of the ground wiring 9g.
  • the layer 2 and the second pattern layer 3 are electrically connected.
  • the first via hole 6a and the second via hole 6b are made of a metal material such as copper or gold, similarly to the via hole 6 in the first embodiment, and are formed in a columnar shape with a thickness of 100 ⁇ m by plating or the like.
  • the first via hole 6a and the second via hole 6b are formed through the first pattern layer 2, the first base 1, the second pattern layer 3, the second base 8 and the third pattern layer 9, and the third pattern layer 9
  • the first pattern layer 2 and the second pattern layer 3 are electrically connected.
  • the first cover layer 4 is bonded to the surface of the second base 8 on which the third pattern layer 9 is formed with an adhesive or the like to protect the third pattern layer 9.
  • Other configurations of the flexible printed circuit board 102 according to the second embodiment are the same as those of the flexible printed circuit board 101 according to the first embodiment, and corresponding portions are denoted by the same reference numerals and description thereof will be omitted.
  • the flexible printed board 102 when the flexible printed board 102 is bent in a direction in which the flexible printed board 102 is peeled off from the board (U direction), the stress at the cut in the second cover layer 5 is reduced. Stress tends to concentrate on the concentrated portion Su. When the stress is concentrated on the stress concentration portion Su, not only the disconnection occurs at the position of Eu of the second pattern layer 3 but also the disconnection may occur up to the position of Eu of the first pattern layer 2.
  • the terminal portions 30 a and 30 b of the signal wiring of the second pattern layer 3 are wired so as to straddle the position of Eu, that is, the position of the end of the second cover layer 5.
  • the terminal portions 90a and 90b of the signal wiring of the third pattern layer 9 are also wired so as to straddle the position B, that is, the position of the end of the second cover layer 5.
  • the first via hole 6 a is closer to the terminal portion 30 a, 30 b of the second pattern layer 3 than the end of the second cover layer 5 is connected to the external substrate 7, and the terminal portion of the signal wiring of the second pattern layer 3 30a, 30b, the terminal portions 20a, 20b of the first pattern layer 2 and the terminal portions 90a, 90b of the third pattern layer 9 are electrically connected.
  • the second via holes 6b are extended portions of the terminal portions 30a, 30b of the second pattern layer 3 wired across the end of the second cover layer 5, the signal wires 2a of the first pattern layer 2,
  • the corresponding portions of the terminal portions 20a and 20b of the second pattern layer 2b and the extended and wired portions of the terminal portions 90a and 90b of the third pattern layer 9 wired across the end of the second cover layer 5 are electrically connected. I do.
  • the strength against stress concentration on the flexible printed circuit board 102 can be further improved, and disconnection can be suppressed.
  • the external substrate 7 ⁇ the terminal portion 30a of the signal wiring of the second pattern layer 3.
  • 30b ⁇ the first via hole 6a ⁇ the terminal portions 90a, 90b of the signal wiring of the third pattern layer 9 ⁇ the second via hole 6b ⁇ the electrical wiring is maintained in the route of the signal wiring 2a, 2b of the first pattern layer 2.
  • the terminal portions 30a and 30b of the signal wiring of the second pattern layer 3 are formed in the flexible printed circuit board 102 in the second embodiment.
  • Eu that is, not only are wired so as to straddle the position of the end of the second cover layer 5, but also the terminal portions 90a, 90b of the signal wiring of the third pattern layer 9 are located at the position of B, that is, Since the wiring is provided so as to straddle the position of the end of the two cover layers 5, the strength against stress concentration on the flexible printed circuit board 102 can be further improved, and disconnection can be suppressed.
  • the present invention is not limited to this.
  • the external substrate 7 may be joined to the terminal portions 90a and 90b of the third pattern layer 9. In this case, the same effect can be obtained.
  • the first base 1 formed of a flexible plate made of a dielectric material and the surface of the first base 1
  • a first pattern layer 2 having a plurality of pairs of signal wirings 2a and 2b for connecting between the substrates, having terminal portions 20a and 20b provided at both ends of the signal wirings 2a and 2b, and terminals of the first pattern layer 2
  • a second pattern layer 3 having terminal portions 30a and 30b provided on the back surface of the first base 1 corresponding to the portions 20a and 20b, and a flexible material made of a dielectric material provided on the front surface side of the first pattern layer 2
  • the second base 8 formed in a flat plate shape and the third pattern layer 9 having the terminal portions 90a and 90b provided on the surface of the second base 8 corresponding to the terminal portions 20a and 20b of the first pattern layer 2.
  • the first and second cover layers 4 and 5 expose and cover the surfaces of the end portions of the three pattern layer 9 and the second pattern layer 3, respectively, and the first base 1, the first pattern layer 2 and the second base 8 And first and second via holes 6a and 6b for electrically connecting the terminal portions 30a and 30b of the second pattern layer 3 and the terminal portions 90a and 90b of the third pattern layer 9, respectively.
  • the terminal portions 30a, 30b and the terminal portions 90a, 90b of the third pattern layer 9 are wired so as to extend over the ends of the first and second cover layers 4, 5, and the first via hole 6a is
  • the terminal portions 30a, 30b of the second pattern layer 3 on the side of the terminal portions 30a, 30b of the layer 3 or the terminal portions 90a, 90b of the third pattern layer 9 connected to the external substrate 7, and the terminal portions 20a of the first pattern layer 2 , 20b and third pattern 9 are provided so as to connect the terminal portions 90a and 90b, and the second via holes 6b are formed by extending the terminal portions 30a and 30b of the second pattern layer 3 and the terminal portions 90a and 90b of the third pattern layer 9.
  • the corresponding terminal portions 20a and 20b of the first pattern layer 2 are connected to each other, so that the strength against stress concentration on the flexible printed circuit board can be further improved, and disconnection can be suppressed.
  • electrical conduction can be maintained.
  • the second pattern layer 3 and the third pattern layer 9 have the same shape, the same mask can be used for forming the second pattern layer 3 and the third pattern layer 9. Therefore, the cost for manufacturing the flexible substrate can be reduced.
  • Embodiment 3 In the first and second embodiments, the first and second cover layers 4 and 5 have the same length, but in the third embodiment, the first and second cover layers have different lengths. The case is shown.
  • FIG. 7 is a plan view showing the configuration of the pattern layer of the flexible printed board according to the third embodiment
  • FIG. 8 is a cross-sectional view of the flexible printed board at the position of the FF in the pattern layer of FIG.
  • the first cover layer 4 of the flexible printed circuit board 102 of the second embodiment is provided shorter than the second cover layer 5.
  • Other configurations of the flexible printed circuit board 103 according to the third embodiment are the same as those of the flexible printed circuit board 102 according to the second embodiment, and the corresponding portions are denoted by the same reference numerals and description thereof will be omitted.
  • the length of the first cover layer 4 and the length of the second cover layer 5 are different from each other.
  • the position of the portion and the end of the second cover layer 5 not only the effect of the second embodiment but also the position of stress concentration can be dispersed, and disconnection can be suppressed.
  • the ground wirings 3g, 9g of the second pattern layer 3 and the third pattern layer 9 may have a mesh shape as shown in FIG.
  • the second pattern layer 3 and the third pattern layer 9 are easily bent. Therefore, when the flexible printed board is bent, the stress is dispersed due to the deformation of the mesh portion first, and it is possible to suppress the occurrence of disconnection due to the concentration of stress at the cut of the cover layer.
  • Reference Signs List 1 1st base, 2 1st pattern layer, 2a, 2b signal wiring, 3 2nd pattern layer, 4 1st cover layer, 5 2nd cover layer, 6a 1st via hole, 6b 2nd via hole, 7 outside board, 8 Second base, 9 ⁇ third pattern layer, 20a, 20b, 30a, 30b, 90a, 90b ⁇ terminal section, 101, 102, 103 ⁇ flexible printed circuit board.

Abstract

La présente invention concerne une carte de circuit imprimé flexible pourvue : d'une première couche de motif 2 qui est disposée sur une surface d'une première base façonnée sous la forme d'une plaque flexible, qui comprend une pluralité de fils de signal 2a, 2b connectant des substrats externes, et qui comporte des parties bornes 20a, 20b aux deux extrémités de chaque fil de signal ; d'une seconde couche de motif 3 qui est disposée sur une surface arrière de la première base et qui comporte des parties bornes 30a, 30b à des positions correspondant aux parties bornes 20a, 20b ; de première et seconde couches de recouvrement 4, 5 recouvrant les première et seconde couches de motif, leurs parties d'extrémité étant exposées ; et de premier et second trous d'interconnexion 6a, 6b connectant les parties bornes de la seconde couche de motif et de la première couche de motif. Les parties bornes de la seconde couche de motif sont câblées d'un bout à l'autre des parties d'extrémité de la couche de recouvrement. Les premiers trous d'interconnexion connectent les parties bornes de la seconde couche de motif et de la première couche de motif du côté plus près du substrat externe connecté aux parties bornes de la première couche de motif ou de la seconde couche de motif que les parties d'extrémité des couches de recouvrement. Les seconds trous d'interconnexion connectent des parties de prolongement des parties bornes de la seconde couche de motif câblées de part et d'autre des parties d'extrémité des couches de recouvrement et les parties de fil de signal de la première couche de motif.
PCT/JP2018/031935 2018-08-29 2018-08-29 Carte de circuit imprimé flexible WO2020044460A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/031935 WO2020044460A1 (fr) 2018-08-29 2018-08-29 Carte de circuit imprimé flexible

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/031935 WO2020044460A1 (fr) 2018-08-29 2018-08-29 Carte de circuit imprimé flexible

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WO2020044460A1 true WO2020044460A1 (fr) 2020-03-05

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5360949A (en) * 1993-06-30 1994-11-01 Northern Telecom Limited Printed circuit board
JP2005244029A (ja) * 2004-02-27 2005-09-08 Molex Inc 信号伝達基板及び信号伝達基板とコネクタの接続構造
JP2007123742A (ja) * 2005-10-31 2007-05-17 Sony Corp 基板接続構造、フレックスリジッド基板、光送受信モジュール及び光送受信装置
JP2009295989A (ja) * 2008-06-09 2009-12-17 Samsung Electronics Co Ltd フレキシブル印刷回路基板
JP2013510407A (ja) * 2009-11-06 2013-03-21 モレックス インコーポレイテド 多層回路部材とそのためのアセンブリ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5360949A (en) * 1993-06-30 1994-11-01 Northern Telecom Limited Printed circuit board
JP2005244029A (ja) * 2004-02-27 2005-09-08 Molex Inc 信号伝達基板及び信号伝達基板とコネクタの接続構造
JP2007123742A (ja) * 2005-10-31 2007-05-17 Sony Corp 基板接続構造、フレックスリジッド基板、光送受信モジュール及び光送受信装置
JP2009295989A (ja) * 2008-06-09 2009-12-17 Samsung Electronics Co Ltd フレキシブル印刷回路基板
JP2013510407A (ja) * 2009-11-06 2013-03-21 モレックス インコーポレイテド 多層回路部材とそのためのアセンブリ

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