WO2020042839A1 - 带有泛光灯的电子设备及其装配方法 - Google Patents

带有泛光灯的电子设备及其装配方法 Download PDF

Info

Publication number
WO2020042839A1
WO2020042839A1 PCT/CN2019/097755 CN2019097755W WO2020042839A1 WO 2020042839 A1 WO2020042839 A1 WO 2020042839A1 CN 2019097755 W CN2019097755 W CN 2019097755W WO 2020042839 A1 WO2020042839 A1 WO 2020042839A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
electronic device
floodlight
assembly
receiving unit
Prior art date
Application number
PCT/CN2019/097755
Other languages
English (en)
French (fr)
Inventor
曾俊杰
黄桢
陈飞帆
王晓锋
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201821383599.1U external-priority patent/CN209330218U/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2020042839A1 publication Critical patent/WO2020042839A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means

Definitions

  • the present invention relates to the field of depth information camera modules, and in particular, to an electronic device with a floodlight and an assembling method thereof.
  • TOF camera module that is, Time of Flight
  • Time of Flight refers to the use of a sensor to emit modulated light, and then after the object reflects, the sensor calculates the time difference or phase difference between the light emission and reflection, and then converts the distance of the object to be photographed.
  • the conventional camera module can obtain the three-dimensional size and depth information of the image without being photographed.
  • Existing TOF camera modules generally include a flood light and a receiving unit, wherein the flood light is used to emit light of a specific wavelength, and the receiving unit receives light reflected from a photographed object.
  • the TOF camera module can be installed in an electronic device body of the electronic device, and then cooperates with other camera modules to complete the collection of image information and depth information of a photographed object.
  • the current production method of the electronic device with the TOF camera module requires assembling the complete TOF camera module and the electronic device body together.
  • the electronic device generally also carries other camera modules, such as a telephoto camera module, a medium focus camera module and a wide-angle camera module.
  • the TOF camera module also needs to communicate with the telephoto camera module or
  • the medium-focus camera module or the wide-angle camera module is assembled together in an electronic device and does not interfere with each other. Once the TOF camera module cannot be combined with the telephoto module or the medium-focus camera module
  • the group or the wide-angle camera module works well together, and the entire TOF camera module will be replaced or a matching camera module will be replaced, thereby increasing the cost.
  • An object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein a single said flood light can be mounted on an electronic device.
  • Another object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein a single said flood light can be mounted on said electronic device with a receiving unit, said flood light and said The receiving unit forms a TOF camera module to obtain depth information.
  • Another object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein once the performance of the TOF camera module cannot meet requirements, the flood light or the receiving unit can be individually performed. Replacement will help reduce production costs.
  • Another object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein the electronic device may further include at least one camera module, and the camera module and the TOF camera module work together. In order to make the electronic device shoot better.
  • Another object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein the camera module and the receiving unit can be separately assembled in the electronic device.
  • Another object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein the camera module and the receiving unit can be assembled to the electronic device together.
  • Another object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein the receiving unit can work with the flood light to obtain depth information, and the receiving unit can also be independent of the flood light.
  • the light lamp works to obtain an image information.
  • Another object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein the flood light includes a projection component, a circuit board component and at least one electronic component, wherein the electronic component can Is provided on the main body of the electronic device to facilitate the reduction in size of the entire flood light.
  • Another object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein the electronic components of the flood light can be at least partially provided in the receiving unit to facilitate the whole of the flood light. Reduced light size.
  • Another object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein the process of installing the flood light on the body of the electronic device is simple and convenient.
  • Another object of the present invention is to provide an electronic device with a flood light and an assembling method thereof, wherein the flood light can be conveniently adjusted in a mounting position before being fixed to the electronic device.
  • the present invention provides an electronic device with a floodlight, which includes:
  • a receiving unit and
  • a flood light wherein the flood light includes a projection component and a circuit board component, wherein the projection component is used for projecting light, and the circuit board component has a first conductive end and a second conductive end, wherein The first conductive end is connected to the second conductive end, the circuit board assembly has an upper surface, the first conductive end is exposed at the position of the upper surface, and the projection component is connectably connected.
  • the flood light and the receiving unit are respectively mounted on the electronic device body and the receiving unit is connectably connected to the flood light.
  • the second conductive end of the lamp forms a TOF camera module.
  • the electronic device body includes a circuit board, wherein the circuit board is disposed on the electronic device body, and the circuit board component of the floodlight is passed through the circuit board. Connectable to the receiving unit.
  • the circuit board assembly of the floodlight is at least partially conductively overlapped with the circuit board.
  • the floodlight further includes a flexible connecting member, wherein the floodlight is directly conductively connected to the circuit board through the flexible connecting member.
  • the floodlight further includes at least one electronic component, wherein at least a part of the electronic component is disposed on the circuit board of the electronic device, and the electronic component is conductive. Connected to the circuit board assembly of the floodlight.
  • the receiving unit includes a first lens assembly, a first photosensitive element, and a first circuit board, wherein the first lens assembly provides an optical path for light to pass through to the first lens assembly.
  • a photosensitive element performs photoelectric conversion, the first photosensitive element is connectably connected to the first circuit board, and the circuit board component of the floodlight is connectably connected to the receiving unit.
  • the second conductive end of the flood light is directly connectably connected to the first circuit board of the receiving unit.
  • the floodlight further includes a flexible connector, wherein one end of the flexible connector is connectably connected to the second conductive end, and the other end of the flexible connector It is connectably connected to the receiving unit.
  • the circuit board assembly of the floodlight is at least partially overlapped with the first circuit board.
  • the floodlight further includes at least one electronic component, wherein at least a part of the electronic component is disposed on the first circuit board of the receiving unit, and the electronic component is The circuit board assembly is connectably connected to the floodlight.
  • the first lens assembly further includes a first optical lens, a first base and at least two filter elements, wherein the first base supports the first optical lens and forms A light window, wherein the filter element is switchably held on a photosensitive path of the first photosensitive element.
  • the electronic device further includes a camera module, wherein the camera module is disposed on the electronic device body, wherein the camera module includes a second lens assembly, and a second The light sensing element and a second circuit board, wherein the second lens assembly provides an optical through hole for light to reach the second light sensing element for photoelectric conversion, and the second light sensing element is connectably connected to the light sensing element.
  • the second circuit board is described.
  • the electronic device further includes an assembly, wherein the camera module and the receiving unit that are assembled as a whole by the assembly are commonly mounted on the electronic device body.
  • the circuit board assembly of the floodlight is connectably connected to the second circuit board of the camera module.
  • the circuit board assembly of the floodlight is at least partially overlapped with the second circuit board.
  • the electronic device further includes a camera module, wherein the camera module is disposed on the electronic device body, wherein the camera module includes a second lens assembly, and a second The light sensing element and a second circuit board, wherein the second lens assembly provides an optical through hole for light to reach the second light sensing element for photoelectric conversion, and the second light sensing element is connectably connected to the light sensing element.
  • the second circuit board is described.
  • the electronic device further includes an assembly, wherein the camera module and the receiving unit that are assembled as a whole by the assembly are commonly mounted on the electronic device body.
  • the circuit board assembly of the floodlight is connectably connected to the second circuit board of the camera module.
  • the circuit board assembly of the floodlight is at least partially overlapped with the second circuit board.
  • the floodlight further includes at least one electronic component, wherein at least a part of the electronic component is disposed on the first circuit board of the receiving unit, and the electronic component is The circuit board assembly is connectably connected to the floodlight.
  • the circuit board assembly includes a first conductive portion, a second conductive portion, and an insulating portion, wherein the insulating portion separates the first conductive portion and the second conductive portion,
  • the first conductive portion has an upper surface
  • the projection component includes a light emitting element, the light emitting element is supported on the upper surface, and the first conductive end is exposed at least part of the upper surface position.
  • the first conductive portion penetrates the insulating portion in a height direction.
  • the present invention provides a method for assembling an electronic device with a floodlight, which includes the following steps:
  • a floodlight is mounted on an electronic device, and a circuit board assembly of the floodlight is connectably connected to a circuit board of the electronic device.
  • a second conductive end of the floodlight is directly conductively mounted on the circuit board.
  • At least a part of the circuit board assembly is overlapped on the circuit board of the electronic device.
  • a second conductive end of the floodlight is connected to the circuit board via a flexible connecting member.
  • the flexible connector is connected to the circuit board assembly of the floodlight.
  • the flexible connector is connected to the circuit board of the electronic device.
  • the electronic device before assembling the floodlight, the electronic device is installed with a receiving unit, wherein the circuit board is disposed on the receiving unit.
  • the electronic device before assembling the floodlight, the electronic device is installed with a camera module, and the circuit board is disposed on the camera module.
  • the electronic device before assembling the floodlight, is simultaneously installed with a camera module and a receiving unit, wherein the camera module and the receiving unit pass through An assembly forms a whole, and the circuit board is provided on the camera module; or the circuit board is provided on the receiving unit; or the circuit board is provided on the receiving unit and the receiving unit.
  • Camera module before assembling the floodlight, the electronic device is simultaneously installed with a camera module and a receiving unit, wherein the camera module and the receiving unit pass through An assembly forms a whole, and the circuit board is provided on the camera module; or the circuit board is provided on the receiving unit; or the circuit board is provided on the receiving unit and the receiving unit.
  • Camera module before assembling the floodlight, the electronic device is simultaneously installed with a camera module and a receiving unit, wherein the camera module and the receiving unit pass through An assembly forms a whole, and the circuit board is provided on the camera module; or the circuit board is provided on the receiving unit; or the circuit board is provided on the receiving unit and the receiving unit.
  • a second conductive end of the floodlight is directly conductively mounted on the circuit board.
  • At least a part of the circuit board assembly is overlapped on the circuit board.
  • a second conductive end of the floodlight is connected to the circuit board via a flexible connecting member.
  • the floodlight is assembled in the following manner:
  • An optical auxiliary component is mounted on the bracket to form a flood light.
  • the flood light is assembled by:
  • An optical auxiliary component is mounted on the bracket to form a flood light.
  • the flood light is assembled by:
  • the bracket is mounted on a circuit board assembly with a light emitting element.
  • the flood light is assembled by:
  • the bracket is mounted on a circuit board assembly with a light emitting element.
  • FIG. 1 is a schematic diagram of an electronic device with a flood light according to a preferred embodiment of the present invention.
  • FIG. 2A is a schematic diagram of an application of a flood light according to a preferred embodiment of the present invention.
  • FIG. 2B is a schematic diagram of an application of a flood light according to a preferred embodiment of the present invention.
  • FIG. 2C is a schematic diagram of an application of a flood light according to a preferred embodiment of the present invention.
  • 3A is a schematic diagram of an application of a flood light according to a preferred embodiment of the present invention.
  • 3B is a schematic diagram of an application of a flood light according to a preferred embodiment of the present invention.
  • FIG. 3C is a schematic diagram of a receiving unit according to a preferred embodiment of the present invention.
  • 3D is a schematic diagram of an application of a flood light according to a preferred embodiment of the present invention.
  • FIG. 4A is a schematic diagram of an application of a flood light according to a preferred embodiment of the present invention.
  • FIG. 4B is a schematic diagram of an application of a flood light according to a preferred embodiment of the present invention.
  • FIG. 4C is a schematic diagram of an application of a flood light according to a preferred embodiment of the present invention.
  • 4D is a schematic diagram of a camera module according to a preferred embodiment of the present invention.
  • FIG. 5A is a schematic diagram of a flood light according to a preferred embodiment of the present invention.
  • FIG. 5B is a schematic diagram of a flood light according to a preferred embodiment of the present invention.
  • FIG. 1 and FIG. 2A show a flood light and an application mode of the flood light. At least one of the flood light 110 can be separately installed in an electronic device 1000. Referring to FIG. Figure 5B.
  • the flood light 110 includes a projection component and a circuit board component 111, wherein the projection component includes a light emitting element 112, wherein the light emitting element 112 can emit light of a specific wavelength, and the light emitting element 112
  • the circuit board assembly 111 is supported by the circuit board assembly 111 and is connectably connected to the circuit board assembly 111.
  • the projection assembly may further include a bracket 113 and an optical auxiliary element 114, wherein the bracket 113 is supported by the circuit board assembly 111 and forms a light window for the light emitted by the light emitting element 112 to pass through.
  • the optical auxiliary element 114 is supported by the bracket 113 and located in an optical path of the light emitting element 112 so that the light emitted by the light emitting element 112 can pass through the optical auxiliary element 114 and then be emitted to the outside.
  • the bracket 113 of the floodlight 110 may be integrally formed on the circuit board assembly 111 or integrally formed on the optical auxiliary component 114.
  • the bracket 113 may also be fixed to the circuit board assembly 111 by a connection method such as a paste, or the optical auxiliary component 114 may be fixed to the bracket 113 by a connection method such as a paste.
  • the light-emitting element 112 may be a VCSEL array, which may emit modulated infrared light.
  • the light-emitting element 112 may also be another light source, such as an LED, which may emit a modulated laser.
  • the optical auxiliary element 114 may be an optical diffractive element, which can change the light emitting range and the effect of the light emitting element 112.
  • the circuit board assembly 111 has a first conductive end 1110 and a second conductive end 1120, wherein the circuit board assembly 111 has an upper surface and a lower surface, wherein the upper surface and the lower surface are oppositely disposed,
  • the light emitting element 112 is supported on the upper surface of the circuit board assembly 111.
  • the first conductive end 1110 and the second conductive end 1120 can be electrically connected to each other. At least a part of the first conductive end 1110 is exposed at the upper surface position of the circuit board assembly 111.
  • the light emitting element 112 is conductively supported on the first conductive end 1110, and the second conductive end 1120 is exposed to connect other conductive components to conduct electrical signals from the light emitting element 112 outward or An electrical signal is conducted toward the light emitting element 112.
  • the floodlight 110 further includes a flexible connecting member 115, wherein the flexible connecting member 115 is conductively connected to the circuit board assembly 111. Specifically, the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 is conductively connected to the flexible connecting member 115.
  • the floodlight 110 further includes at least one electronic component 116, wherein the electronic component 116 is connectably connected to the circuit board assembly 111.
  • the electronic component 116 is located on the upper surface of the circuit board assembly 111.
  • the electronic component 116 may be an electronic device such as a PD detector or a capacitor resistor.
  • the floodlight 110 may further include a cover body 117, wherein the cover body 117 is installed on the projection component for protection.
  • the electronic device 1000 includes the electronic device body 1001 and a circuit board 1002, wherein the circuit board 1002 is disposed on the electronic device 1000 body.
  • the flood light 110 can be connected to the circuit board 1002 of the electronic device 1000.
  • the floodlight 110 is connectably connected to the circuit board 1002 of the electronic device 1000 through the flexible connecting member 115.
  • the flexible connecting member 115 can be connected to the circuit board 1002 of the electronic device 1000 via a conductive adhesive.
  • the flexible connector 115 may also be connected to the circuit board 1002 of the electronic device 1000 by being plugged into the circuit board 1002.
  • the receiving unit 120 can be guided through the circuit board 1002 of the electronic device 1000. It is connected to the floodlight 110 through ground, so that the floodlight 110 can cooperate with the receiving unit 120.
  • the receiving unit 120 may be directly conductively connected to the circuit board assembly 111 of the floodlight 110 so that the receiving unit 120 and the floodlight 110 can work together.
  • the floodlight 110 does not need to be combined with the receiving unit 120 to form a TOF camera module before being installed in the electronic device 1000.
  • the floodlight 110 can be mounted on the electronic device 1000 in advance or delayed relative to the receiving unit 120.
  • the installation method of the TOF camera module can be more flexible.
  • the receiving module and the floodlight 110 of the TOF module are respectively assembled in the electronic device 1000, which can effectively reduce the problems caused by the assembly of the existing floodlight 110 and the receiving module, such as reducing assembly Duration and improve efficiency.
  • the floodlight 110 and the receiving unit 120 may be tested separately to determine the cause. In the subsequent process, the pantograph where the problem occurs
  • the light lamp 110 or the receiving unit 120 is replaced and tested separately, thereby eliminating the need for scrapping the entire TOF camera module. In this way, it is beneficial to reduce production costs.
  • the floodlight 110 may be assembled by integrally molding the bracket 113 to the circuit board assembly 111, and mounting the light emitting element 112 to The circuit board assembly 111 and the optical auxiliary component 114 are mounted on the bracket 113 to form the floodlight 110.
  • the flood light 110 may be assembled by mounting the light emitting element 112 on the circuit board assembly 111, and mounting the bracket 113 on the circuit board assembly 111 and The optical auxiliary component 114 is mounted on the bracket 113 to form the floodlight 110.
  • the flood light 110 may be assembled by installing the optical auxiliary element 114 on the bracket 113 and installing the bracket 113 on a The circuit board assembly 111.
  • the flood light 110 may be assembled by integrally forming the bracket 113 on the optical auxiliary element 114 and mounting the bracket 113 on the light emitting element 112.
  • the circuit board assembly 111 may be assembled by integrally forming the bracket 113 on the optical auxiliary element 114 and mounting the bracket 113 on the light emitting element 112.
  • FIG. 2B illustrates another application manner of the floodlight 110, and referring to FIGS. 1, 5A, and 5B.
  • the flood light 110 includes a projection component and a circuit board component 111, wherein the projection component includes a light emitting element 112, wherein the light emitting element 112 can emit light of a specific wavelength, and the light emitting element 112
  • the circuit board assembly 111 is supported by the circuit board assembly 111 and is connectably connected to the circuit board assembly 111.
  • the floodlight 110 may further include a bracket 113 and an optical auxiliary element 114, wherein the bracket 113 is supported by the circuit board assembly 111 and forms a light window for the light emitted by the light emitting element 112 to pass through.
  • the optical auxiliary element 114 is supported by the bracket 113 and is located in an optical path of the light emitting element 112 so that the light emitted by the light emitting element 112 can pass through the optical auxiliary element 114 and then be emitted to the outside.
  • the light-emitting element 112 may be a VCSEL array, which may emit modulated infrared light.
  • the light-emitting element 112 may also be another light source, such as an LED, which may emit a modulated laser.
  • the optical auxiliary element 114 may be an optical diffractive element, which can change the light emitting range and the effect of the light emitting element 112.
  • the circuit board assembly 111 has a first conductive end 1110 and a second conductive end 1120, wherein the circuit board assembly 111 has an upper surface and a lower surface, wherein the upper surface and the lower surface are oppositely disposed,
  • the light emitting element 112 is supported on the upper surface of the circuit board assembly 111.
  • the first conductive end 1110 and the second conductive end 1120 can be electrically connected to each other. At least a part of the first conductive end 1110 is exposed at the upper surface position of the circuit board assembly 111.
  • the light emitting element 112 is conductively supported on the first conductive end 1110, and the second conductive end 1120 is exposed to connect other conductive components to conduct electrical signals from the light emitting element 112 outward or An electrical signal is conducted toward the light emitting element 112.
  • the electronic device 1000 includes the electronic device body 1001 and a circuit board 1002, wherein the circuit board 1002 is disposed on the electronic device body 1001.
  • the floodlight 110 can be mounted on the circuit board 1002 of the electronic device 1000.
  • the flood light 110 is directly conductively mounted on the circuit board 1002 of the electronic device 1000, and the second conductive end of the circuit board assembly 111 of the flood light 110. 1120 is directly conductively connected to the circuit board 1002 of the electronic device 1000.
  • the floodlight 110 can be easily mounted on the electronic device 1000.
  • the flood light 110 can be conducted to all places of the electronic device 1000. Mentioned circuit board 1002.
  • the second conductive end 1120 is formed on the lower surface of the circuit board assembly 111 to facilitate installation between the floodlight 110 and the electronic device 1000.
  • the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 can be directly conductively fixed to a place of the electronic device 1000 by means of conductive silver glue or welding.
  • the circuit board 1002 for example, the circuit board 1002 of the electronic device 1000 has at least one connection solder joint, so that the second conductive end 1120 can achieve the connection with the electronic device 1000 through the connection solder joint.
  • the circuit board 1002 is turned on.
  • FIG. 2C illustrates another application manner of the floodlight 110, and reference is made to FIGS. 5A and 5B at the same time.
  • at least a part of the electronic components 116 of the floodlight 110 is disposed on the circuit board 1002 of the electronic device 1000.
  • the electronic components 116 located in the circuit board 1002 can communicate with the flood light in a conductive state.
  • the circuit board assembly 111 and the light emitting element 112 of the lamp 110 work together. Such an approach is beneficial to the reduction in size of the floodlight 110.
  • the electronic components 116 may be all of the circuit board 1002 provided in the electronic device 1000, or part of the circuit board 1002 provided in the electronic device 1000, and part of the circuit board 1002.
  • the circuit board assembly 111 of the light lamp 110 for example, an IC controller is disposed on the circuit board 1002 of the electronic device 1000, so that the size of the flood light 110 is reduced. After the IC controller located on the circuit board 1002 of the electronic device 1000 is turned on, the IC controller can be turned on between the circuit board assembly 111 and the floodlight 110.
  • the light emitting element 112 controls the operation of the floodlight 110.
  • the IC controller is electrically connected to the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 through the circuit board 1002 of the electronic device 1000, thereby passing
  • the second conductive end 1120 is electrically connected to the first conductive end 1110 of the circuit board assembly 111 of the floodlight 110, and the IC controller can be conducted through the first conductive end 1110. ⁇ mentioned light emitting element 112.
  • circuit board assembly 111 does not need to reserve sufficient installation space for the electronic components 116 to facilitate the reduction of the circuit board assembly 111 of the floodlight 110 and also facilitate the circuit. Simplification of the manufacturing process of the board assembly 111.
  • FIG. 3A illustrates another application mode of the flood light 110.
  • the flood light 110 may be installed in a receiving unit.
  • the electronic device 1000 includes an electronic device body 1001 and a receiving unit 120, wherein the receiving unit 120 is disposed on the electronic device body 1001, and the flood light 110 can be installed on the electronic device body 1001.
  • the electronic device body 1001 cooperates with the receiving unit 120 to form a TOF camera module.
  • the receiving unit 120 includes a first lens assembly 121, a first photosensitive element 122, and a first circuit board 123.
  • the first lens assembly 121 provides a light path for light to reach the first photosensitive element 122. Thereby, photoelectric conversion is performed, in which the first photosensitive element 122 is connected to the first circuit board 123 in a conductive manner.
  • the first lens assembly 121 further includes a first optical lens 1211 and a first base 1212, wherein the first base 1212 forms a light window for light to reach the first photosensitive element 122 and the first An optical lens 1211 is supported on the first base 1212.
  • the filter element is supported on the first base 1212, is held in a light sensing path of the first photosensitive element 122, and is located between the first optical lens 1211 and the first photosensitive element 122.
  • the flood light 110 includes the projection component and the circuit board component 111, wherein the projection component includes the light emitting element 112, wherein the light emitting element 112 can emit light of a specific wavelength, and
  • the light emitting element 112 is supported by the circuit board assembly 111 and is connectably connected to the circuit board assembly 111.
  • the floodlight 110 may further include the bracket 113 and the optical auxiliary element 114, wherein the bracket 113 is supported by the circuit board assembly 111 and forms a light window for the light emitted by the light emitting element 112.
  • the optical auxiliary element 114 is supported by the bracket 113 and located in an optical path of the light emitting element 112 so that light emitted by the light emitting element 112 can pass through the optical auxiliary element 114 and then be emitted to the outside.
  • the circuit board assembly 111 has the first conductive end 1110 and the second conductive end 1120, wherein the circuit board assembly 111 has an upper surface and a lower surface, wherein the upper surface and the lower surface are opposite to each other. It is provided that the light emitting element 112 is supported on the upper surface of the circuit board assembly 111.
  • the first conductive end 1110 and the second conductive end 1120 can be electrically connected to each other. At least a part of the first conductive end 1110 is exposed at the upper surface position of the circuit board assembly 111.
  • the light emitting element 112 is conductively supported on the first conductive end 1110, and the second conductive end 1120 is exposed to connect other conductive components to conduct electrical signals from the light emitting element 112 outward or An electrical signal is conducted toward the light emitting element 112.
  • the floodlight 110 further includes a flexible connecting member 115, wherein the flexible connecting member 115 is conductively connected to the circuit board assembly 111. Specifically, the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 is conductively connected to the flexible connecting member 115.
  • the floodlight 110 further includes at least one electronic component 116, wherein the electronic component 116 is connectably connected to the circuit board assembly 111.
  • the electronic component 116 is located on the upper surface of the circuit board assembly 111.
  • the electronic component 116 may be an electronic device such as a PD detector or a capacitor resistor.
  • the flood light 110 can be connected to the first circuit board 123 of the receiving unit 120 of the electronic device 1000.
  • the floodlight 110 is connectably connected to the first circuit board 123 of the receiving unit 120 of the electronic device 1000 through the flexible connecting member 115.
  • the flexible connecting member 115 can be connected to the first circuit board 123 of the receiving unit 120 of the electronic device 1000 via a conductive adhesive.
  • the flexible connector 115 may also be connected to the first circuit board 123 of the receiving unit 120 of the electronic device 1000.
  • FIG. 3B shows a modified implementation of the receiving unit 120 in the above embodiment.
  • the receiving unit 120 includes a first lens assembly 121, a first photosensitive element 122, and a first circuit.
  • the first lens assembly 121 further includes a first optical lens 1211 and a first base 1212, wherein the first base 1212 forms a light window for light to reach the first photosensitive element 122 and the first An optical lens 1211 is supported on the first base 1212.
  • the filter element 124 is supported by the first base 1212, is held in a light sensing path of the first photosensitive element 122, and is located between the first optical lens 1211 and the first photosensitive element 122.
  • the number of the filter elements 124 is at least two, and the receiving unit 120 further includes a housing, wherein the housing is located outside the first base 1212 and the filter element switcher 124 is disposed in the housing. Said filter element switch
  • the receiving unit 120 may be used as an RGB camera module, or may be combined with the floodlight 110 to form a TOF camera module.
  • the filter element 124 may be an infrared filter element 1241 and a visible light filter element 1242.
  • the filter element switch 125 drives the infrared filter element 1241 is located in the light sensing path of the first photosensitive element 122, and when the electronic device 1000 needs to obtain a depth information, the visible light filter element 1242 driven by the filter element switch 125 is located in the first The photosensitive path of the photosensitive element 122.
  • the receiving unit 120 can play multiple functions, thereby facilitating reduction in size of the electronic device 1000.
  • FIG. 3C shows another application mode of the flood light 110.
  • the flood light 110 may be installed with a receiving unit.
  • the electronic device 1000 includes an electronic device body 1001 and a receiving unit 120, wherein the receiving unit 120 is disposed on the electronic device body 1001, and the flood light 110 can be installed on the electronic device body 1001.
  • the electronic device body 1001 cooperates with the receiving unit 120 to form a TOF camera module.
  • the receiving unit 120 includes a first lens assembly 121, a first photosensitive element 122, and a first circuit board 123.
  • the first lens assembly 121 provides a light path for light to reach the first photosensitive element 122. Thereby, photoelectric conversion is performed, in which the first photosensitive element 122 is connected to the first circuit board 123 in a conductive manner.
  • the flood light 110 includes the projection component and the circuit board component 111, wherein the projection component includes the light emitting element 112, wherein the light emitting element 112 can emit light of a specific wavelength, and
  • the light emitting element 112 is supported by the circuit board assembly 111 and is connectably connected to the circuit board assembly 111.
  • the floodlight 110 further includes at least one of the electronic components 116, wherein the electronic components 116 are connectably connected to the circuit board assembly 111.
  • the electronic component 116 is located on the upper surface of the circuit board assembly 111.
  • the electronic component 116 may be an electronic device such as a PD detector or a capacitor resistor.
  • the floodlight 110 may further include the bracket 113 and the optical auxiliary element 114, wherein the bracket 113 is supported by the circuit board assembly 111 and forms a light window for the light emitted by the light emitting element 112.
  • the optical auxiliary element 114 is supported by the bracket 113 and located in an optical path of the light emitting element 112 so that light emitted by the light emitting element 112 can pass through the optical auxiliary element 114 and then be emitted to the outside.
  • the circuit board assembly 111 has the first conductive end 1110 and the second conductive end 1120, wherein the circuit board assembly 111 has an upper surface and a lower surface, wherein the upper surface and the lower surface are opposite to each other. It is provided that the light emitting element 112 is supported on the upper surface of the circuit board assembly 111.
  • the first conductive end 1110 and the second conductive end 1120 can be electrically connected to each other. At least a part of the first conductive end 1110 is exposed at the upper surface position of the circuit board assembly 111.
  • the light emitting element 112 is conductively supported on the first conductive end 1110, and the second conductive end 1120 is exposed to connect other conductive components to conduct electrical signals from the light emitting element 112 outward or An electrical signal is conducted toward the light emitting element 112.
  • the floodlight 110 can be mounted on the first circuit board 123 of the receiving unit 120 of the electronic device 1000.
  • the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 is connectably connected to the first circuit board 123 of the receiving unit 120.
  • the second conductive end 1120 of the floodlight 110 is directly aligned with the conductive portion of the first circuit board 123 of the receiving unit 120 in such a manner
  • the floodlight 110 can be directly connected to the receiving unit 120 in a conductive manner.
  • the circuit board assembly 111 of the floodlight 110 and the first circuit board 123 of the receiving unit 120 at least partially overlap. In this way, it is beneficial to reduce the floodlight 110 and The size of the receiving unit 120, especially the area size in the horizontal direction, improves the space utilization ratio of the receiving unit 120 in the height direction.
  • the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 can be directly conductively fixed to a place of the electronic device 1000 by means of conductive silver glue or welding.
  • the circuit board 1002 for example, the circuit board 1002 of the electronic device 1000 has at least one connection solder joint, so that the second conductive end 1120 can achieve the connection with the electronic device 1000 through the connection solder joint.
  • the circuit board 1002 is turned on.
  • FIG. 3D illustrates another application mode of the floodlight 110.
  • the electronic component 116 is disposed on the first circuit board 123 of the receiving unit 120 of the electronic device 1000.
  • the electronic components 116 located on the first circuit board 123 can communicate with the first circuit board 123 under the conduction condition.
  • the circuit board assembly 111 and the light emitting element 112 of the floodlight 110 work together.
  • the electronic components 116 may be all of the first circuit board 123 provided in the receiving unit 120, or may be part of the first circuit board 123 provided in the receiving unit 120, and part of The circuit board assembly 111 of the floodlight 110, such as an IC controller, is disposed on the first circuit board 123 of the receiving unit 120, so that the size of the floodlight 110 becomes smaller.
  • the IC controller located on the first circuit board 123 of the receiving unit 120 is turned on, the IC controller can be turned on to the circuit board assembly 111 and the floodlight 110.
  • the light emitting element 112 controls the operation of the flood light 110.
  • the IC controller is electrically connected to the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 through a flexible first circuit board 123, so as to pass through the second
  • the conductive terminal 1120 is connected to the first conductive terminal 1110 of the circuit board assembly 111 of the floodlight 110, and the IC controller can be connected to the first conductive terminal 1110 through the first conductive terminal 1110.
  • the electronic component 116 may be all of the first circuit board 123 of the receiving unit 120 of the electronic device 1000, or may be part of the receiving unit 120 of the electronic device 1000.
  • the first circuit board 123 is partially located on the circuit board assembly 111 of the floodlight 110.
  • circuit board assembly 111 does not need to reserve sufficient installation space for the electronic components 116 to facilitate the reduction of the circuit board assembly 111 of the floodlight 110 and also facilitate the circuit. Simplification of the manufacturing process of the board assembly 111.
  • a part of the electronic components 116 of the floodlight 110 may be disposed on a circuit board 1002 of the electronic device 1000. In this manner, the reception is reduced.
  • FIG. 4A illustrates another application mode of the flood light 110.
  • the flood light 110 is installed in An electronic device 1000 with a receiving unit 120 and at least one camera module.
  • the electronic device 1000 includes an electronic device body 1001, the receiving unit 120, and the camera module, wherein the camera module and the receiving unit 120 are respectively disposed on the electronic device body 1001.
  • the camera module may be a telephoto camera module or a wide-angle camera module, and the number of the camera modules may be one or two, or more.
  • the receiving unit 120 includes a first lens assembly 121, a first photosensitive element 122, and a first circuit board 123.
  • the first lens assembly 121 is held in a photosensitive path of the first photosensitive element 122.
  • the first lens assembly 121 provides a light path for light to make the light reach the first photosensitive element 122 to perform photoelectric conversion.
  • the first photosensitive element 122 is connectably connected to the first circuit board. 123.
  • the first circuit board 123 is used for transmitting electrical signals.
  • the camera module or the receiving unit 120 may be installed on the electronic device body 1001 in advance, and then the flood light 110 may be installed.
  • the camera module may be installed on the electronic device body 1001 in advance to form a half-finished product, and then the receiving unit 120 and the flood light 110 are sequentially installed on the electronic device body 1001.
  • the receiving unit 120 may be installed on the electronic device body 1001 in advance to form a semi-finished product, and then the camera module and the flood light 110 are respectively installed on the electronic device body 1001. It is also possible to first provide the electronic device 1000 with a circuit board 1002, and then mount the camera module, the receiving unit 120, and the floodlight 110 on the electronic device 1000, respectively. Further, the camera module and the receiving unit 120 can be assembled into an integrated mode in advance, and then the integrated module is mounted on the electronic device body 1001.
  • the camera module and the receiving unit 120 are separately mounted on the electronic device body 1001, respectively.
  • the camera module may be installed on the circuit board 1002 of the electronic device 1000.
  • the flood light 110 is connected to the circuit board of the receiving unit 120. In other examples of the present invention, the flood light 110 is connected to all of the electronic devices 1000. The circuit board 1002 is described. In other examples of the present invention, the flood light 110 is connected to a circuit board of the camera module.
  • the floodlight 110 is connectably connected to the circuit board of the receiving unit 120 through the flexible connecting member 115.
  • the electronic components 116 may be all of the circuit boards provided in the receiving unit 120, or may be part of the circuit boards provided in the receiving unit 120, and part of them may be located in the floodlight 110.
  • the circuit board assembly 111 such as an IC controller, is disposed on the circuit board of the receiving unit 120, so that the size of the floodlight 110 becomes smaller. When the IC controller on the circuit board of the receiving unit 120 is turned on, the IC controller can be turned on to the circuit board assembly 111 and the light emitting device of the floodlight 110.
  • the element 112 controls the operation of the floodlight 110.
  • the IC controller is electrically connected to the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 through the flexible connector 115 so as to pass the second conductive
  • the terminal 1120 is connected to the first conductive terminal 1110 of the circuit board assembly 111 of the floodlight 110, and the IC controller can be connected to the light emitting device through the first conductive terminal 1110.
  • the flood light 110 is directly conductively connected to the circuit board of the receiving unit 120 through the second conductive end 1120.
  • the floodlight 110 is directly conductively overlapped with the circuit board of the receiving unit 120 through the second conductive end 1120.
  • the flexible connector 115 is connected to the circuit board of the receiving unit 120, and the circuit board assembly 111 of the floodlight 110 is connectably connected to the circuit board.
  • the flexible connector 115 is connected to the circuit board of the receiving unit 120 in a conductive manner.
  • the flexible connector 115 is connected to the circuit board 1002 of the electronic device 1000, and the circuit board assembly 111 of the floodlight 110 is connectably connected to The flexible connecting member 115 is thus connectably connected to the circuit board 1002 of the electronic device 1000.
  • the floodlight 110 is directly conductively overlapped with the circuit board 1002 of the electronic device 1000 through the second conductive end 1120.
  • FIG. 4B shows another application mode of the floodlight 110.
  • the electronic device 1000 includes an electronic device The main body 1001, a receiving unit 120, a flood light 110, and a camera module 130, wherein the receiving unit 120 and the camera module 130 are collectively disposed on the electronic device body 1001.
  • the receiving unit 120 includes a first lens assembly 121, a first photosensitive element 122, and a first circuit board 123.
  • the first lens assembly 121 provides an optical path for light to reach the first photosensitive element 122. As a result, photoelectric conversion is performed, and the first photosensitive element 122 is conductively connected to the first circuit board 123.
  • the first lens assembly 121 further includes a first optical lens 1211 and a first base 1212.
  • the first base 1212 is supported on the first circuit board 123 and forms a first light window.
  • the first optical lens 1211 is supported on the first base 1212.
  • the electronic device 1000 further includes an assembly 140, wherein the assembly 140 is respectively connected to the receiving unit 120 and the camera module 130 so that the two form a whole, so as to reduce the number of Deviation.
  • the assembly 140 may be implemented as an outer bracket, and the outer bracket fixedly assembles the receiving unit 120 and the camera module 130 to form a whole body.
  • the assembly 140 is implemented as a one-piece base, that is, the receiving unit 120 and the camera module 130 share the one-piece base, that is, a filter element corresponding to the receiving unit.
  • the filter elements corresponding to the camera module 130 are respectively disposed on the one-piece base, so that the receiving unit 120 and the camera module 130 are integrated, and in this embodiment, the receiving unit 120
  • the camera module 130 and the camera module 130 can be further fixed by an external bracket, thereby increasing reliability.
  • the receiving unit 120 and the camera module 130 share a common circuit board, that is, the assembly 140 is implemented as a common circuit board, that is, the photosensitive element 122 and the receiving unit of the receiving unit.
  • the photosensitive elements of the camera module are respectively disposed on the common circuit board and are electrically connected to the common circuit board, so that the receiving unit 120 and the camera module 130 are integrated.
  • the number of the camera modules 130 is not limited to one, and may be multiple, such as a dual camera module.
  • the floodlight 110 is connectably connected to the first circuit board 123 of the receiving unit 120.
  • the floodlight 110 and the receiving unit 120 can work together after being turned on.
  • An electrical signal can be transmitted between the floodlight 110 and the receiving unit 120.
  • an IC controller of the electronic component 116 of the floodlight 110 sends out a control signal, wherein the control The signal can be transmitted to the circuit board assembly 111 of the floodlight 110 or the circuit board of the receiving unit 120.
  • the electronic components 116 may be all of the first circuit board 123 provided in the receiving unit 120, or may be part of the first circuit board 123 provided in the receiving unit 120, and part of The circuit board assembly 111 of the floodlight 110, for example, an IC controller is disposed on the first circuit board 123 of the receiving unit 120, so that the size of the floodlight 110 becomes smaller.
  • the IC controller located on the first circuit board 123 of the receiving unit 120 is turned on, the IC controller can be turned on to the circuit board assembly 111 and the floodlight 110.
  • the light emitting element 112 controls the operation of the flood light 110.
  • the IC controller is electrically connected to the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 through the flexible connector 115 so as to pass the second conductive
  • the terminal 1120 is connected to the first conductive terminal 1110 of the circuit board assembly 111 of the floodlight 110, and the IC controller can be connected to the light emitting device through the first conductive terminal 1110.
  • the flood light 110 is connectably connected to a circuit board of the camera module 130, with the aid of the circuit board and the receiving unit of the camera module 130.
  • the first circuit board 123 of 120 is turned on.
  • the flood light 110 is connectably connected to a circuit board 1002 of the electronic device 1000.
  • FIG. 4C and FIG. 4D show another application mode of the flood light 110.
  • the flood light The lamp 110 is conductively connected to a second circuit board 133 of the camera module 130.
  • the camera module 130 includes a second lens assembly 131, a second photosensitive element 132, and the second circuit board 133, wherein the second lens assembly 131 provides an optical path for light to reach the second photosensitive
  • the element 132 thus performs photoelectric conversion, and the second photosensitive element 132 is connectably connected to the second circuit board 133.
  • the second lens assembly 131 further includes a second optical lens 1311 and a second base 1312.
  • the second base 1312 is supported on the second circuit board 133 and forms a second light window.
  • the second optical lens 1311 is supported by the second base 1312.
  • the camera module 130 further includes a filter element 134, wherein the filter element 134 is held on a photosensitive path of the second photosensitive element 132.
  • the flood light 110 can be connected to the second circuit board 133 of the camera module 130 via a flexible connecting member 115.
  • the flexible connection board is connectably connected to the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110, and can be connected to the camera module 130.
  • the second circuit board 133 is connected to the second circuit board 133 of the camera module 130 by a conductive adhesive, for example.
  • the flood light 110 is directly connected to the second circuit board 133 of the camera module 130 through the flexible connector 115, and then passes through the second circuit board 133 of the camera module 130.
  • the circuit board 133 is connectably connected to the first circuit board 123 of the receiving unit 120.
  • the floodlight 110 and the receiving unit 120 can work together after being turned on.
  • An electrical signal can be transmitted between the floodlight 110 and the receiving unit 120.
  • an IC controller of the electronic component 116 of the floodlight 110 sends out a control signal, wherein the control The signal can be transmitted to the circuit board assembly 111 of the floodlight 110 or the circuit board of the receiving unit 120.
  • the electronic components 116 may be all of the second circuit board 133 provided on the camera module 130, or may be part of the second circuit board 133 provided on the camera module 130.
  • the second circuit board 133 located in the receiving unit 120 is partially part of the circuit board assembly 111 located in the floodlight 110, for example, an IC controller is disposed in the first part of the camera module 130.
  • Two circuit boards 133 make the size of the flood light 110 smaller. After the IC controller located on the second circuit board 133 of the camera module 130 is turned on, the IC controller can be turned on through the second circuit board 133 of the camera module 130.
  • the circuit board assembly 111 and the light emitting element 112 of the floodlight 110 control the operation of the floodlight 110, and the IC controller can pass the second
  • the circuit board 133 is electrically connected to the first circuit board 123 of the receiving unit 120.
  • the IC controller is electrically connected to the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 through the flexible connector 115 so as to pass the second conductive
  • the terminal 1120 is connected to the first conductive terminal 1110 of the circuit board assembly 111 of the floodlight 110, and the IC controller can be connected to the light emitting device through the first conductive terminal 1110.
  • the circuit board assembly 111 of the flood light 110 is directly connected to the second circuit board 133 of the camera module 130.
  • the second conductive end 1120 of the circuit board assembly 111 of the floodlight 110 is directly conductively connected to the second circuit board 133 of the camera module 130.
  • the flexible connector 115 is disposed on the camera module 130, and the flexible connector 115 is connectably connected to the second circuit of the camera module 130.
  • the circuit board assembly 111 of the floodlight 110 is connectably connected to the flexible connecting member 115, and the flexible connecting member 115 is inserted into the circuit board assembly in a conductive adhesive connection manner. 111 way.
  • the circuit board assembly 111 of the floodlight 110 includes a conductive portion 1111 and an insulating portion 1112, wherein the insulating portion 1112 is connected to the conductive portion 1111 and plays an insulating role.
  • the insulating portion 1112 is integrally formed with the insulating portion 1112.
  • the first conductive end 1110 and the second conductive end 1120 are respectively formed on an upper surface and a lower surface of the conductive portion 1111.
  • the second conductive end 1120 may also be formed on a side surface of the conductive portion 1111.
  • the conductive portion 1111 further includes a first conductive portion 11111 and a second conductive portion 11112.
  • the first conductive portion 11111 and the second conductive portion 11112 are isolated by the insulating portion 1112 to avoid the first conductive portion 11111 and the second conductive portion 11112.
  • a conductive portion 11111 and the second conductive portion 11112 are short-circuited when they are simultaneously turned on.
  • the first conductive portion 11111 can not only perform a conductive function but also a heat dissipation function to transfer heat generated by the light emitting element 112 from one side of the circuit board assembly 111 to the other side for dissipation.
  • the first conductive portion 11111 is larger than the second conductive portion 11112, wherein the first conductive portion 11111 can be used to support the light emitting element 112.
  • the first conductive portion 11111 may be electrically connected to one electrode of the light emitting element 112, and the second conductive portion 11112 may be electrically connected to another electrode of the light emitting element 112 to form a loop after being energized.
  • the first conductive portion 11111 penetrates the insulating portion 1112 in a height direction, the first conductive end 1110 is formed on an upper surface of the first conductive portion 11111, and the second conductive end 1120 is formed. On the lower surface of the first conductive portion 11111.
  • the second conductive end 1120 is formed on a side of the first conductive portion 11111.
  • the conductive portion 1111 may further include a third conductive portion 11113 and a fourth conductive portion 11114.
  • the third conductive portion 11113 and the fourth conductive portion 11114 can be used to support other electronic components in a conductive manner.
  • 116 for example, used to turn on PD components (light intensity detection), capacitor resistance, NTC (temperature control) and other components.
  • the conductive portion 1111 may further include a fifth conductive portion or even more conductive portions.
  • the structure and arrangement of the conductive parts can be flexibly designed according to requirements.
  • the circuit board assembly 111 of the floodlight 110 includes a conductive layer 10, a circuit layer 20, an insulating layer 30, and an The heat dissipation portion 40, wherein the insulating layer 30 is connected to the conductive layer 10 and the circuit layer 20, and the heat dissipation portion 40 is formed on the conductive layer 10 and the circuit layer 20.
  • the first conductive end 1110 is formed on an upper surface of the heat dissipation portion 40
  • the second conductive end 1120 is formed on the lower surface of the heat dissipation portion 40.
  • the conductive layer 10 and the circuit layer 20 are developed by a light, and then formed by electroplating.
  • the second conductive end 112 may also be formed on one side.
  • an assembling method of an electronic device 1000 with a flood light 110 is provided, wherein the assembling method includes the following steps:
  • the floodlight 110 is mounted on an electronic device 1000 in a manner that a circuit board assembly 111 of a floodlight 110 is connected to a circuit board 1002, wherein the electronic device body 1001 is provided with the circuit board 1002.
  • the flood light 110 is installed in a manner that a second conductive end 1120 of the flood light 110 is aligned with the circuit board 1002.
  • the floodlight 110 is provided with a flexible connecting member 115, and the circuit board assembly 111 is connectably connected to all of the boards through the flexible connecting member 115. Mentioned circuit board 1002.
  • the electronic device body 1001 is provided with a flexible connector 115 which is connectably connected to the circuit board 1002 and the circuit
  • the board assembly 111 is connectably connected to the circuit board 1002 through the flexible connecting member 115.
  • the electronic device 1000 in the assembling method, is mounted with a camera module 130 with a circuit board 1002, wherein the flood light 110 is mounted on the camera module 130.
  • the electronic device 1000 in the assembling method, is mounted with a receiving unit 120 with a circuit board, wherein the flood light 110 is mounted on the receiving unit 120 to form A TOF camera module.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Studio Devices (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本发明提供了一带有泛光灯的电子设备及其装配方法，其中所述电子设备包括一电子设备本体、一接收单元和一泛光灯，其中所述泛光灯包括一投射组件和一电路板组件，其中所述投射组件用于投射光线，所述电路板组件具有一第一导电端和一第二导电端，其中所述第一导电端被连通于所述第二导电端，所述电路板组件具有一上表面，所述第一导电端暴露于所述上表面位置，所述投射组件被可导通地连接于所述电路板组件的所述第一导电端，其中所述泛光灯和所述接收单元被分别安装于所述电子设备本体并且所述接收单元被可导通地连接于所述泛光灯的所述第二导电端以组成一TOF摄像模组。

Description

带有泛光灯的电子设备及其装配方法 技术领域
本发明涉及到深度信息摄像模组领域，尤其涉及到一带有泛光灯的电子设备及其装配方法。
背景技术
TOF摄像模组，即Time of Flight是指利用传感器发出经过调制后的光线，然后遇到物体反射后，传感器通计算光线发射和反射时间差或者是相位差，来换算被拍摄物体的距离，再结合常规的摄像模组就能够获得被拍摄无图的三维尺寸和深度信息。
现有的TOF摄像模组，其通常包括一泛光灯和一接收单元，其中所述泛光灯用于发出特定波长的光线，所述接收单元接收来自于一被拍摄物体反射的光线。所述TOF摄像模组能够被安装于所述电子设备的一电子设备本体，然后和其他摄像模组配合工作以完成对于被拍摄物体图像信息和深度信息的采集。换句话说，目前的带有所述TOF摄像模组的所述电子设备的生产方式需要将完整的所述TOF摄像模组和所述电子设备本体组装在一起。
所述电子设备一般还携带有其他的摄像模组，比如说长焦摄像模组，中焦摄像模组和广角摄像模组，所述TOF摄像模组还需要和所述长焦摄像模组或者是所述中焦摄像模组或者是所述广角摄像模组一起装配于电子设备，互相不产生干扰，一旦所述TOF摄像模组无法和所述长焦模组或者是所述中焦摄像模组或者是所述广角摄像模组较好地协同工作，整个所述TOF摄像模组将被更换或者是更换匹配的摄像模组，从而使得成本增加。
发明内容
本发明的一目的在于提供一带有泛光灯的电子设备及其装配方法，其中单个所述泛光灯能够被安装于一电子设备。
本发明的另一目的在于提供一带有泛光灯的电子设备及其装配方法，其中单 个所述泛光灯能够被安装于带有一接收单元的所述电子设备，所述泛光灯和所述接收单元组成一TOF摄像模组以获取深度信息。
本发明的另一目的在于提供一带有泛光灯的电子设备及其装配方法，其中一旦所述TOF摄像模组的性能无法满足需求，可以单个对于所述泛光灯或者是所述接收单元进行更换，有利于降低生产成本。
本发明的另一目的在于提供一带有泛光灯的电子设备及其装配方法，其中所述电子设备还可以包括至少一摄像模组，其中所述摄像模组和所述TOF摄像模组配合工作以使电子设备拍摄效果更佳。
本发明的另一目的在于提供一带有泛光灯的电子设备及其装配方法，其中所述摄像模组和所述接收单元可以被分别组装于所述电子设备。
本发明的另一目的在于提供一带有泛光灯的电子设备及其装配方法，其中所述摄像模组和所述接收单元可以共同被组装于所述电子设备。
本发明的另一目的在于提供一带有泛光灯的电子设备及其装配方法，其中所述接收单元能够和所述泛光灯配合工作获得深度信息，所述接收单元也能够独立于所述泛光灯工作以获得一图像信息。
本发明的另一目的在于提供一带有泛光灯的电子设备及其装配方法，其中所述泛光灯包括一投射组件，一电路板组件以及至少一电子元器件，其中所述电子元器件能够被设置于所述电子设备本体，以有利于整个所述泛光灯尺寸的缩小。
本发明的另一目的在于提供一带有泛光灯的电子设备及其装配方法，其中所述泛光灯的所述电子元器件能够至少部分被设置于所述接收单元以有利于整个所述泛光灯尺寸的缩小。
本发明的另一目的在于提供一带有泛光灯的电子设备及其装配方法，其中所述泛光灯安装于所述电子设备本体这一过程操作简单方便。
本发明的另一目的在于提供一带有泛光灯的电子设备及其装配方法，其中所述泛光灯在固定于所述电子设备之前还可以被方便地调整安装位置。
根据本发明的一方面，本发明提供了一带有泛光灯的电子设备，其包括：
一电子设备本体；
一接收单元；和
一泛光灯，其中所述泛光灯包括一投射组件和一电路板组件，其中所述投射组件用于投射光线，所述电路板组件具有一第一导电端和一第二导电端，其中所 述第一导电端被连通于所述第二导电端，所述电路板组件具有一上表面，所述第一导电端暴露于所述上表面位置，所述投射组件被可导通地连接于所述电路板组件的所述第一导电端，其中所述泛光灯和所述接收单元被分别安装于所述电子设备本体并且所述接收单元被可导通地连接于所述泛光灯的所述第二导电端以组成一TOF摄像模组。
根据本发明的一些实施例，所述电子设备本体包括一线路板，其中所述线路板被设置于所述电子设备本体，其中所述泛光灯的所述电路板组件通过所述线路板被可导通地连接于所述接收单元。
根据本发明的一些实施例，所述泛光灯的所述电路板组件被可导通地至少部分重叠于所述线路板。
根据本发明的一些实施例，所述泛光灯进一步包括一柔性连接件，其中所述泛光灯通过所述柔性连接件被可直接导通地连接于所述线路板。
根据本发明的一些实施例，所述泛光灯进一步包括至少一电子元器件，其中至少一部分所述电子元器件被设置于所述电子设备的所述线路板，所述电子元器件被可导通地连接于所述泛光灯的所述电路板组件。
根据本发明的一些实施例，所述接收单元包括一第一镜头组件，一第一感光元件以及一第一电路板，其中所述第一镜头组件提供一光学通路供光线穿过后达到所述第一感光元件进行光电转换，所述第一感光元件被可导通地连接于所述第一电路板，其中所述泛光灯的所述电路板组件被可导通地连接于所述接收单元。
根据本发明的一些实施例，所述泛光灯的所述第二导电端被可导通地直接连接于所述接收单元的所述第一电路板。
根据本发明的一些实施例，所述泛光灯进一步包括一柔性连接件，其中所述柔性连接件的一端被可导通地连接于所述第二导电端，所述柔性连接件的另一端被可导通地连接于所述接收单元。
根据本发明的一些实施例，所述泛光灯的所述电路板组件被至少部分重叠于所述第一电路板。
根据本发明的一些实施例，所述泛光灯进一步包括至少一电子元器件，其中至少一部分所述电子元器件被设置于所述接收单元的所述第一电路板，所述电子元器件被可导通地连接于所述泛光灯的所述电路板组件。
根据本发明的一些实施例，所述第一镜头组件进一步包括一第一光学镜头， 一第一基座和至少二滤光元件，其中所述第一基座支撑所述第一光学镜头并且形成一光窗，所述滤光元件被可切换地保持于所述第一感光元件的一感光路径。
根据本发明的一些实施例，所述电子设备进一步包括一摄像模组，其中所述摄像模组被设置于所述电子设备本体，其中所述摄像模组包括一第二镜头组件，一第二感光元件以及一第二电路板，其中所述第二镜头组件提供一光学通孔供光线穿过后达到所述第二感光元件进行光电转换，所述第二感光元件被可导通地连接于所述第二电路板。
根据本发明的一些实施例，所述电子设备进一步包括一组装体，其中通过所述组装体被组装为一整体的所述摄像模组和所述接收单元被共同安装于所述电子设备本体。
根据本发明的一些实施例，所述泛光灯的所述电路板组件被可导通地连接于所述摄像模组的所述第二电路板。
根据本发明的一些实施例，所述泛光灯的所述电路板组件被至少部分重叠于所述第二电路板。
根据本发明的一些实施例，所述电子设备进一步包括一摄像模组，其中所述摄像模组被设置于所述电子设备本体，其中所述摄像模组包括一第二镜头组件，一第二感光元件以及一第二电路板，其中所述第二镜头组件提供一光学通孔供光线穿过后达到所述第二感光元件进行光电转换，所述第二感光元件被可导通地连接于所述第二电路板。
根据本发明的一些实施例，所述电子设备进一步包括一组装体，其中通过所述组装体被组装为一整体的所述摄像模组和所述接收单元被共同安装于所述电子设备本体。
根据本发明的一些实施例，所述泛光灯的所述电路板组件被可导通地连接于所述摄像模组的所述第二电路板。
根据本发明的一些实施例，所述泛光灯的所述电路板组件被至少部分重叠于所述第二电路板。
根据本发明的一些实施例，所述泛光灯进一步包括至少一电子元器件，其中至少一部分所述电子元器件被设置于所述接收单元的所述第一电路板，所述电子元器件被可导通地连接于所述泛光灯的所述电路板组件。
根据本发明的一些实施例，所述电路板组件包括一第一导电部，一第二导电 部以及一绝缘部，其中所述绝缘部分隔所述第一导电部和所述第二导电部，其中所述第一导电部具有一上表面，所述投射组件包括一发光元件，所述发光元件被支撑于所述上表面，所述第一导电端暴露于至少部分所述上表面位置。
根据本发明的一些实施例，所述第一导电部在高度方向贯通于所述绝缘部。
根据本发明的另一方面，本发明提供了带有一泛光灯的一电子设备的装配方法，其包括如下步骤：
安装一泛光灯于一电子设备，并且所述泛光灯的一电路板组件被可导通地连接于所述电子设备的一线路板。
根据本发明的一些实施例，在上述方法中，将所述泛光灯的一第二导电端直接可导通地安装于所述线路板。
根据本发明的一些实施例，在上述方法中，重叠至少部分所述电路板组件于所述电子设备的所述线路板。
根据本发明的一些实施例，在上述方法中，通过一柔性连接件将所述泛光灯的一第二导电端可导通地连接于所述线路板。
根据本发明的一些实施例，所述柔性连接件被连接于所述泛光灯的所述电路板组件。
根据本发明的一些实施例，所述柔性连接件被连接于所述电子设备的所述线路板。
根据本发明的一些实施例，在上述方法中，在装配所述泛光灯之前，所述电子设备被安装有一接收单元，其中所述线路板被设置于所述接收单元。
根据本发明的一些实施例，在上述方法中，在装配所述泛光灯之前，所述电子设备被安装有一摄像模组，其中所述线路板被设置于所述摄像模组。
根据本发明的一些实施例，在上述方法中，在装配所述泛光灯之前，所述电子设备被同时安装有一摄像模组和一接收单元，其中所述摄像模组和所述接收单元通过一组装体形成一整体，所述线路板被设置于所述摄像模组；或者是所述线路板被设置于所述接收单元；或者是所述线路板被设置于所述接收单元和所述摄像模组。
根据本发明的一些实施例，将所述泛光灯的一第二导电端直接可导通地安装于所述线路板。
根据本发明的一些实施例，在上述方法中，重叠至少部分所述电路板组件于 所述线路板。
根据本发明的一些实施例，在上述方法中，通过一柔性连接件将所述泛光灯的一第二导电端可导通地连接于所述线路板。
根据本发明的一些实施例，所述泛光灯通过如下的方式组装而成：
一体模塑形成一支架于一电路板组件；
安装一发光元件于所述电路板组件；和
安装一光学辅助元件于所述支架以形成一泛光灯。
根据本发明的一些实施例，所述泛光灯通过如下方式组装而成：
安装一发光元件于一电路板组件；
安装一支架于所述电路板组件；和
安装一光学辅助元件于所述支架以形成一泛光灯。
根据本发明的一些实施例，所述泛光灯通过如下方式组装而成：
安装一光学辅助元件于一支架；和
安装所述支架于带有一发光元件的一电路板组件。
根据本发明的一些实施例，所述泛光灯通过如下方式组装而成：
一体成型一支架于一光学辅助元件；和
安装所述支架于带有一发光元件的一电路板组件。
附图说明
图1是根据本发明的一较佳实施例的带有一泛光灯的一电子设备的示意图。
图2A是根据本发明的一较佳实施例的一泛光灯的应用示意图。
图2B是根据本发明的一较佳实施例的一泛光灯的应用示意图。
图2C是根据本发明的一较佳实施例的一泛光灯的应用示意图。
图3A是根据本发明的一较佳实施例的一泛光灯的应用示意图。
图3B是根据本发明的一较佳实施例的一泛光灯的应用示意图。
图3C是根据本发明的一较佳实施例的一接收单元的示意图。
图3D是根据本发明的一较佳实施例的一泛光灯的应用示意图。
图4A是根据本发明的一较佳实施例的一泛光灯的应用示意图。
图4B是根据本发明的一较佳实施例的一泛光灯的应用示意图。
图4C是根据本发明的一较佳实施例的一泛光灯的应用示意图。
图4D是根据本发明的一较佳实施例的一摄像模组的示意图。
图5A是根据本发明的一较佳实施例的一泛光灯的示意图。
图5B是根据本发明的一较佳实施例的一泛光灯的示意图。
具体实施方式
以下描述用于揭露本发明以使本领域技术人员能够实现本发明。以下描述中的优选实施例只作为举例，本领域技术人员可以想到其他显而易见的变型。在以下描述中界定的本发明的基本原理可以应用于其他实施方案、变形方案、改进方案、等同方案以及没有背离本发明的精神和范围的其他技术方案。
本领域技术人员应理解的是，在本发明的揭露中，术语“纵向”、“横向”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系是基于附图所示的方位或位置关系，其仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此上述术语不能理解为对本发明的限制。
可以理解的是，术语“一”应理解为“至少一”或“一个或多个”，即在一个实施例中，一个元件的数量可以为一个，而在另外的实施例中，该元件的数量可以为多个，术语“一”不能理解为对数量的限制。
附图1和附图2A示出了一泛光灯及所述泛光灯的一应用方式，至少一所述泛光灯110能够被单独安装于一电子设备1000，同时参考附图5A和附图5B。
具体地说，所述泛光灯110包括一投射组件和一电路板组件111，其中所述投射组件包括一发光元件112，其中所述发光元件112可以发出特定波长的光线，所述发光元件112被支撑于所述电路板组件111并且被可导通地连接于所述电路板组件111。
所述投射组件还可以包括一支架113和一光学辅助元件114，其中所述支架113被支撑于所述电路板组件111并且形成一光窗以供所述发光元件112发出的光线通过，所述光学辅助元件114被支撑于所述支架113并且位于所述发光元件112的一光学通路以使所述发光元件112发出的光线能够通过所述光学辅助元件114，再朝外界射出。
所述泛光灯110的所述支架113可以一体成型于所述电路板组件111，也可 以一体成型于所述光学辅助元件114。所述支架113也可以通过粘贴等连接方式被固定于所述电路板组件111，或者是所述光学辅助元件114通过粘贴等连接方式被固定于所述支架113。
所述发光元件112可以是一VCSEL阵列，可以发射出经过调制的红外光，所述发光元件112还可以是其他的光源，比如说LED等，可以发射调制好的激光。所述光学辅助元件114可以是一光学衍射元件，可以改变所述发光元件112的光线射出范围和射出效果。
所述电路板组件111具有一第一导电端1110和一第二导电端1120，其中所述电路板组件111具有一上表面和一下表面，其中所述上表面和所述下表面被相对设置，所述发光元件112被支撑于所述电路板组件111的所述上表面。所述第一导电端1110和所述第二导电端1120能够被相互导通，至少部分所述第一导电端1110被暴露在所述电路板组件111的所述上表面位置，所述发光元件112被可导通地支撑于所述第一导电端1110，所述第二导电端1120被暴露在外用于连接其他的导电部件以将来自于所述发光元件112的电信号朝外传导或者是朝向所述发光元件112传导电信号。
所述泛光灯110进一步包括一柔性连接件115，其中所述柔性连接件115被可导通地连接于所述电路板组件111。具体地说，所述泛光灯110的所述电路板组件111的所述第二导电端1120被可导通地连接于所述柔性连接件115。
所述泛光灯110进一步包括至少一电子元器件116，其中所述电子元器件116被可导通地连接于所述电路板组件111。在本示例中，所述电子元器件116位于所述电路板组件111的所述上表面。
所述电子元器件116可以是PD检测器或者是电容电阻等电子器件。
所述泛光灯110还可以包括一罩体117，其中所述罩体117被安装于所述投射组件，起到保护作用。
进一步，所述电子设备1000包括所述电子设备本体1001和一线路板1002，其中所述线路板1002被设置于所述电子设备1000本体。所述泛光灯110能够被连接于所述电子设备1000的所述线路板1002。
具体地说，所述泛光灯110通过所述柔性连接件115被可导通地连接于所述的电子设备1000的所述线路板1002。
所述柔性连接件115可以通过一导电胶被可导通地连接于所述电子设备1000 的所述线路板1002。所述柔性连接件115也可以通过被插接于所述线路板1002的方式被可导通地连接于所述电子设备1000的所述线路板1002。
当所述电子设备1000被安装有一接收单元120以和所述泛光灯110配合形成所述TOF摄像模组之后，所述接收单元120通过所述电子设备1000的所述线路板1002可以被导通地连接于所述泛光灯110，从而所述泛光灯110能够和所述接收单元120配合工作。也可以是，所述接收单元120被直接可导通地连接于所述泛光灯110的所述电路板组件111，以使所述接收单元120和所述泛光灯110能够配合工作。
通过这样的方式，所述泛光灯110不需要和所述接收单元120共同组成一TOF摄像模组后再被安装于所述电子设备1000。所述泛光灯110能够相对于所述接收单元120被提前或者是延后地安装于所述电子设备1000。所述TOF摄像模组的安装方式能够更加地灵活。所述TOF模组的所述接收模组和所述泛光灯110分别组装于所述电子设备1000，可以有效减少现有泛光灯110与接收模组组装带来的问题，例如可以减少组装时长，提高效率。进一步地，在测试过程一旦发现所述TOF摄像模组不合格，可以单独对于所述泛光灯110和所述接收单元120进行测试以判断缘由，在后续过程中可以对于出现问题的所述泛光灯110或者是所述接收单元120单独进行更换和测试，从而不需要对于整个所述TOF摄像模组进行报废处理，通过这样的方式，有利于降低生产成本。
进一步地，对于单个所述泛光灯110而言，所述泛光灯110可以通过如下方式被组装：一体模塑形成所述支架113于所述电路板组件111，安装所述发光元件112于所述电路板组件111和安装所述光学辅助元件114于所述支架113以形成所述泛光灯110。
在本发明的另一些实施例中，所述泛光灯110可以通过如下方式被组装：安装所述发光元件112于所述电路板组件111，安装所述支架113于所述电路板组件111和安装所述光学辅助元件114于所述支架113以形成所述泛光灯110。
在本发明的另一些实施例中，所述泛光灯110可以通过如下方式被组装：安装所述光学辅助元件114于所述支架113和安装所述支架113于带有所述发光元件112的所述电路板组件111。
在本发明的另一些实施例中，所述泛光灯110可以通过如下方式被组装：一体成型所述支架113于所述光学辅助元件114和安装所述支架113于带有所述发 光元件112的所述电路板组件111。
附图2B示出了所述泛光灯110的另一应用方式，同时参考附图1、附图5A和附图5B。具体地说，所述泛光灯110包括一投射组件和一电路板组件111，其中所述投射组件包括一发光元件112，其中所述发光元件112可以发出特定波长的光线，所述发光元件112被支撑于所述电路板组件111并且被可导通地连接于所述电路板组件111。
所述泛光灯110还可以包括一支架113和一光学辅助元件114，其中所述支架113被支撑于所述电路板组件111并且形成一光窗以供所述发光元件112发出的光线通过，所述光学辅助元件114被支撑于所述支架113并且位于所述发光元件112的一光学通路以使所述发光元件112发出的光线能够通过所述光学辅助元件114，再朝外界射出。
所述发光元件112可以是一VCSEL阵列，可以发射出经过调制的红外光，所述发光元件112还可以是其他的光源，比如说LED等，可以发射调制好的激光。所述光学辅助元件114可以是一光学衍射元件，可以改变所述发光元件112的光线射出范围和射出效果。
所述电路板组件111具有一第一导电端1110和一第二导电端1120，其中所述电路板组件111具有一上表面和一下表面，其中所述上表面和所述下表面被相对设置，所述发光元件112被支撑于所述电路板组件111的所述上表面。所述第一导电端1110和所述第二导电端1120能够被相互导通，至少部分所述第一导电端1110被暴露在所述电路板组件111的所述上表面位置，所述发光元件112被可导通地支撑于所述第一导电端1110，所述第二导电端1120被暴露在外用于连接其他的导电部件以将来自于所述发光元件112的电信号朝外传导或者是朝向所述发光元件112传导电信号。
进一步，所述电子设备1000包括所述电子设备本体1001和一线路板1002，其中所述线路板1002被设置于所述电子设备本体1001。所述泛光灯110能够被安装于所述电子设备1000的所述线路板1002。
具体地说，所述泛光灯110被直接可导通地安装于所述电子设备1000的所述线路板1002，所述泛光灯110的所述电路板组件111的所述第二导电端1120被直接可导通地连接于所述电子设备1000的所述线路板1002。
通过这样的方式，所述泛光灯110能够非常方便地被安装于所述电子设备 1000。只要将所述泛光灯110的所述第二导电端1120和所述电子设备1000的所述线路板1002对准，所述泛光灯110就可以被导通于所述电子设备1000的所述线路板1002。优选地，所述第二导电端1120形成于所述电路板组件111的所述下表面，以方便所述泛光灯110和所述电子设备1000之间的安装。
进一步地，所述泛光灯110的所述电路板组件111的所述第二导电端1120能够通过导电银胶或者是焊接等方式，直接被可导通地固定于所述电子设备1000的所述线路板1002，比如说所述电子设备1000的所述线路板1002具有至少一连接焊点，以使所述第二导电端1120通过所述连接焊点实现和所述电子设备1000的所述线路板1002的导通。
附图2C示出了所述泛光灯110的另一应用方式，同时参考附图5A和附图5B。在本实例中，所述泛光灯110的至少一部分所述电子元器件116被设置于所述电子设备1000的所述线路板1002。当所述泛光灯110被导通地连接于所述电子设备1000的所述线路板1002，在导通情况下，位于所述线路板1002的所述电子元器件116能够和所述泛光灯110的所述电路板组件111以及所述发光元件112配合工作。这样的方式有利于所述泛光灯110尺寸的缩小。所述电子元器件116可以是全部被设置于所述电子设备1000的所述线路板1002，也可以是部分被设置于所述电子设备1000的所述线路板1002，部分被设置于所述泛光灯110的所述电路板组件111，例如一IC控制器被设置于所述电子设备1000的所述线路板1002，从而使得所述泛光灯110尺寸变小。当位于所述电子设备1000的所述线路板1002的所述IC控制器被导通后，所述IC控制器能够被导通于所述泛光灯110的所述电路板组件111和所述发光元件112，从而控制所述泛光灯110的工作。在本示例中，所述IC控制器通过所述电子设备1000的所述线路板1002被导通于所述泛光灯110的所述电路板组件111的所述第二导电端1120，从而通过所述第二导电端1120被导通于所述泛光灯110的所述电路板组件111的所述第一导电端1110，进而所述IC控制器能够通过所述第一导电端1110被导通于所述发光元件112。
进一步地，所述电路板组件111不需要为所述电子元器件116预留足够的安装空间，以有利于所述泛光灯110的所述电路板组件111的缩小，也有利于所述电路板组件111制造工艺的简化。
附图3A示出了所述泛光灯110的另一应用方式，同时参考附图1、附图3B、 附图5A和附图5B，所述泛光灯110可以被安装于带有一接收单元120的一电子设备1000。
具体地说，所述电子设备1000包括一电子设备本体1001和一接收单元120，其中所述接收单元120被设置于所述电子设备本体1001，其中所述泛光灯110能够被安装于所述电子设备本体1001以和所述接收单元120协作组成一TOF摄像模组。
所述接收单元120包括一第一镜头组件121，一第一感光元件122以及一第一电路板123，其中所述第一镜头组件121提供一光线通路以供光线达到所述第一感光元件122从而进行光电转换，其中所述第一感光元件122被可导通地连接于所述第一电路板123。
所述第一镜头组件121进一步包括一第一光学镜头1211和一第一基座1212，其中所述第一基座1212形成一光窗以供光线达到所述第一感光元件122并且所述第一光学镜头1211被支撑于所述第一基座1212。所述滤光元件被支撑于所述第一基座1212，被保持在所述第一感光元件122的一感光路径并且位于所述第一光学镜头1211和所述第一感光元件122之间。
具体地说，所述泛光灯110包括所述投射组件和所述电路板组件111，其中所述投射组件包括所述发光元件112，其中所述发光元件112可以发出特定波长的光线，所述发光元件112被支撑于所述电路板组件111并且被可导通地连接于所述电路板组件111。
所述泛光灯110还可以包括所述支架113和所述光学辅助元件114，其中所述支架113被支撑于所述电路板组件111并且形成一光窗以供所述发光元件112发出的光线通过，所述光学辅助元件114被支撑于所述支架113并且位于所述发光元件112的一光学通路以使所述发光元件112发出的光线能够通过所述光学辅助元件114，再朝外界射出。
所述电路板组件111具有所述第一导电端1110和所述第二导电端1120，其中所述电路板组件111具有一上表面和一下表面，其中所述上表面和所述下表面被相对设置，所述发光元件112被支撑于所述电路板组件111的所述上表面。所述第一导电端1110和所述第二导电端1120能够被相互导通，至少部分所述第一导电端1110被暴露在所述电路板组件111的所述上表面位置，所述发光元件112被可导通地支撑于所述第一导电端1110，所述第二导电端1120被暴露在外用于 连接其他的导电部件以将来自于所述发光元件112的电信号朝外传导或者是朝向所述发光元件112传导电信号。
所述泛光灯110进一步包括一柔性连接件115，其中所述柔性连接件115被可导通地连接于所述电路板组件111。具体地说，所述泛光灯110的所述电路板组件111的所述第二导电端1120被可导通地连接于所述柔性连接件115。
所述泛光灯110进一步包括至少一电子元器件116，其中所述电子元器件116被可导通地连接于所述电路板组件111。在本示例中，所述电子元器件116位于所述电路板组件111的所述上表面。
所述电子元器件116可以是PD检测器或者是电容电阻等电子器件。
所述泛光灯110能够被连接于所述电子设备1000的所述接收单元120的所述第一电路板123。
具体地说，所述泛光灯110通过所述柔性连接件115被可导通地连接于所述电子设备1000的所述接收单元120的所述第一电路板123。
所述柔性连接件115可以通过一导电胶被可导通地连接于所述电子设备1000的所述接收单元120的所述第一电路板123。所述柔性连接件115也可以通过被插接于所述电子设备1000的所述接收单元120的所述第一电路板123。
附图3B示出了上述实施例的所述接收单元120的一变形实施方式，在本示例中，所述接收单元120包括一第一镜头组件121，一第一感光元件122，一第一电路板123，至少一滤光元件124以及一滤光元件切换器125，其中所述第一镜头组件121提供一光学通路供光线达到所述第一感光元件122，从而进行光电转换，所述第一感光元件122被可导通地连接于所述第一电路板123。
所述第一镜头组件121进一步包括一第一光学镜头1211和一第一基座1212，其中所述第一基座1212形成一光窗以供光线达到所述第一感光元件122并且所述第一光学镜头1211被支撑于所述第一基座1212。所述滤光元件124被支撑于所述第一基座1212，被保持在所述第一感光元件122的一感光路径并且位于所述第一光学镜头1211和所述第一感光元件122之间。
所述滤光元件124的数目至少是二，所述接收单元120进一步包括一壳体，其中所述壳体位于所述第一基座1212外侧并且所述滤光元件切换器124被设置于所述壳体所述滤光元件切换器
在本示例中，所述接收单元120可以被当作一RGB摄像模组使用，也可以 配合所述泛光灯110组成一TOF摄像模组。
所述滤光元件124可以是一红外滤光元件1241和一可见光滤光元件1242，在所述电子设备1000需要进行一RGB拍摄时，所述滤光元件切换器125驱动所述红外滤光元件1241位于所述第一感光元件122的所述感光路径，在所述电子设备1000需要获取一深度信息时，所述滤光元件切换器125驱动的所述可见光滤光元件1242位于所述第一感光元件122的所述感光路径。
通过这样的切换，所述接收单元120可以起到多重作用，从而有利于所述电子设备1000尺寸的缩小。
附图3C示出了所述泛光灯110的另一应用方式，同时参考附图1、附图3B、附图5A和附图5B，所述泛光灯110可以被安装于带有一接收单元120的一电子设备1000。
具体地说，所述电子设备1000包括一电子设备本体1001和一接收单元120，其中所述接收单元120被设置于所述电子设备本体1001，其中所述泛光灯110能够被安装于所述电子设备本体1001以和所述接收单元120协作组成一TOF摄像模组。
所述接收单元120包括一第一镜头组件121，一第一感光元件122以及一第一电路板123，其中所述第一镜头组件121提供一光线通路以供光线达到所述第一感光元件122从而进行光电转换，其中所述第一感光元件122被可导通地连接于所述第一电路板123。
具体地说，所述泛光灯110包括所述投射组件和所述电路板组件111，其中所述投射组件包括所述发光元件112，其中所述发光元件112可以发出特定波长的光线，所述发光元件112被支撑于所述电路板组件111并且被可导通地连接于所述电路板组件111。所述泛光灯110进一步包括至少一所述电子元器件116，其中所述电子元器件116被可导通地连接于所述电路板组件111。在本示例中，所述电子元器件116位于所述电路板组件111的所述上表面。所述电子元器件116可以是PD检测器或者是电容电阻等电子器件。
所述泛光灯110还可以包括所述支架113和所述光学辅助元件114，其中所述支架113被支撑于所述电路板组件111并且形成一光窗以供所述发光元件112发出的光线通过，所述光学辅助元件114被支撑于所述支架113并且位于所述发光元件112的一光学通路以使所述发光元件112发出的光线能够通过所述光学辅 助元件114，再朝外界射出。
所述电路板组件111具有所述第一导电端1110和所述第二导电端1120，其中所述电路板组件111具有一上表面和一下表面，其中所述上表面和所述下表面被相对设置，所述发光元件112被支撑于所述电路板组件111的所述上表面。所述第一导电端1110和所述第二导电端1120能够被相互导通，至少部分所述第一导电端1110被暴露在所述电路板组件111的所述上表面位置，所述发光元件112被可导通地支撑于所述第一导电端1110，所述第二导电端1120被暴露在外用于连接其他的导电部件以将来自于所述发光元件112的电信号朝外传导或者是朝向所述发光元件112传导电信号。
所述泛光灯110能够被安装于所述电子设备1000的所述接收单元120的所述第一电路板123。所述泛光灯110的所述电路板组件111的所述第二导电端1120被可导通地连接于所述接收单元120的所述第一电路板123。
在本示例中，在安装过程中，将所述泛光灯110的所述第二导电端1120直接对准于所述接收单元120的所述第一电路板123的导电部分，通过这样的方式，所述泛光灯110能够被直接可导通地连接于所述接收单元120。换句话说，所述泛光灯110的所述电路板组件111和所述接收单元120的所述第一电路板123至少部分重叠，通过这样的方式，有利于减少所述泛光灯110和所述接收单元120的尺寸，尤其是水平方向上面积尺寸，提高了所述接收单元120在高度方向上的空间利用率。
进一步地，所述泛光灯110的所述电路板组件111的所述第二导电端1120能够通过导电银胶或者是焊接等方式，直接被可导通地固定于所述电子设备1000的所述线路板1002，比如说所述电子设备1000的所述线路板1002具有至少一连接焊点，以使所述第二导电端1120通过所述连接焊点实现和所述电子设备1000的所述线路板1002的导通。
附图3D示出了所述泛光灯110的另一应用方式，同时参考附图1、附图3B、附图5A和附图5B，在本实例中，所述泛光灯110的至少部分所述电子元器件116被设置于所述电子设备1000的所述接收单元120的所述第一电路板123。当所述泛光灯110被导通地连接于所述接收单元120的所述第一电路板123，在导通情况下，位于所述第一电路板123的所述电子元器件116能够和所述泛光灯110的所述电路板组件111以及所述发光元件112配合工作。
所述电子元器件116可以是全部被设置于所述接收单元120的所述第一电路板123，也可以是部分被设置于所述接收单元120的所述第一电路板123，部分被位于所述泛光灯110的所述电路板组件111，例如一IC控制器被设置于所述接收单元120的所述第一电路板123，从而使得所述泛光灯110尺寸变小。当位于所述接收单元120的所述第一电路板123的所述IC控制器被导通后，所述IC控制器能够被导通于所述泛光灯110的所述电路板组件111和所述发光元件112，从而控制所述泛光灯110的工作。在本示例中，所述IC控制器通过一柔性第一电路板123被导通于所述泛光灯110的所述电路板组件111的所述第二导电端1120，从而通过所述第二导电端1120被导通于所述泛光灯110的所述电路板组件111的所述第一导电端1110，进而所述IC控制器能够通过所述第一导电端1110被导通于所述发光元件112。
这样的方式有利于所述泛光灯110尺寸的缩小。所述电子元器件116可以是全部被设置于所述电子设备1000的所述接收单元120的所述第一电路板123，也可以是部分被设置于所述电子设备1000的所述接收单元120的所述第一电路板123，部分被位于所述泛光灯110的所述电路板组件111。
进一步地，所述电路板组件111不需要为所述电子元器件116预留足够的安装空间，以有利于所述泛光灯110的所述电路板组件111的缩小，也有利于所述电路板组件111制造工艺的简化。
在本发明的另一些示例中，所述泛光灯110的部分所述电子元器件116可以被设置于所述电子设备1000的一线路板1002，通过这样的方式，以有利于降低所述接收单元120的所述第一电路板123的尺寸和所述接收单元120的尺寸。
附图4A示出了所述泛光灯110的另一应用方式，同时参考附图1、附图3B、附图5A和附图5B，在本示例中，所述泛光灯110被安装于带有一接收单元120和至少一摄像模组的一电子设备1000。
所述电子设备1000包括一电子设备本体1001，所述接收单元120以及所述摄像模组，其中所述摄像模组和所述接收单元120被分别设置于所述电子设备本体1001。
所述摄像模组可以是一长焦摄像模组，或一广角摄像模组，所述摄像模组的数目可以是一或二，或者是更多。
所述接收单元120包括一第一镜头组件121，一第一感光元件122以及一第 一电路板123，其中所述第一镜头组件121被保持于所述第一感光元件122的一感光路径，所述第一镜头组件121为光线提供了一光线通路以使光线达到所述第一感光元件122从而进行光电转换，所述第一感光元件122被可导通地连接于所述第一电路板123，所述第一电路板123用于传递电信号。
对于所述电子设备1000而言，所述摄像模组或者是所述接收单元120可以被提前安装于所述电子设备本体1001，然后再安装所述泛光灯110。可以预先将所述摄像模组安装于所述电子设备本体1001形成一半成品，然后将所述接收单元120和所述泛光灯110依次安装于所述电子设备本体1001。也可以预先将所述接收单元120安装于所述电子设备本体1001形成一半成品，然后将所述摄像模组和所述泛光灯110分别安装于所述电子设备本体1001。也可以首先提供带有一线路板1002的所述电子设备1000，然后将所述摄像模组，所述接收单元120以及所述泛光灯110分别安装于所述电子设备1000。进一步地，所述摄像模组，所述接收单元120可以提前组装成一整体式模式，再将所述一体式模组安装于所述电子设备本体1001。
在本示例中，所述摄像模组和所述接收单元120被分别单独安装于所述电子设备本体1001。
当然，在本发明的另一些示例中，可以在完成所述接收单元120和所述泛光灯110的安装之后，再将所述摄像模组安装于所述电子设备1000的所述线路板1002。
在本示例中，所述泛光灯110被连接于所述接收单元120的所述电路板，在本发明的另一些示例中，所述泛光灯110被连接于所述电子设备1000的所述线路板1002，在本发明的另一些示例中，所述泛光灯110被连接于所述摄像模组的一电路板。
进一步地，在本示例中，所述泛光灯110通过所述柔性连接件115被可导通地连接于所述接收单元120的所述电路板。
所述电子元器件116可以是全部被设置于所述接收单元120的所述电路板，也可以是部分被设置于所述接收单元120的所述电路板，部分被位于所述泛光灯110的所述电路板组件111，例如一IC控制器被设置于所述接收单元120的所述电路板，从而使得所述泛光灯110尺寸变小。当位于所述接收单元120的所述电路板的所述IC控制器被导通后，所述IC控制器能够被导通于所述泛光灯110的 所述电路板组件111和所述发光元件112，从而控制所述泛光灯110的工作。在本示例中，所述IC控制器通过所述柔性连接件115被导通于所述泛光灯110的所述电路板组件111的所述第二导电端1120，从而通过所述第二导电端1120被导通于所述泛光灯110的所述电路板组件111的所述第一导电端1110，进而所述IC控制器能够通过所述第一导电端1110被导通于所述发光元件112。
在本发明的另一些示例中，所述泛光灯110通过所述第二导电端1120被直接可导通地连接于所述接收单元120的所述电路板。优选地，所述泛光灯110通过所述第二导电端1120被直接可导通地重叠于所述接收单元120的所述电路板。在本发明的另一些示例中，所述柔性连接件115被连接于所述接收单元120的所述电路板，所述泛光灯110的所述电路板组件111被可导通地连接于所述柔性连接件115，从而被可导通地连接于所述接收单元120的所述电路板。在本发明的另一些示例中，所述柔性连接件115被连接于所述电子设备1000的所述线路板1002，所述泛光灯110的所述电路板组件111被可导通地连接于所述柔性连接件115，从而被可导通地连接于所述电子设备1000的所述线路板1002。在本发明的另一些示例中，所述泛光灯110通过所述第二导电端1120被直接可导通地重叠于所述电子设备1000的所述线路板1002。
附图4B示出了所述泛光灯110的另一应用方式，同时参考附图1、附图3B、附图5A和附图5B，在本示例中，所述电子设备1000包括一电子设备本体1001，一接收单元120、一泛光灯110和一摄像模组130，其中所述接收单元120和所述摄像模组130被共同设置于所述电子设备本体1001。
所述接收单元120包括一第一镜头组件121，一第一感光元件122以及一第一电路板123，其中所述第一镜头组件121提供一光学通路以使光线达到所述第一感光元件122从而进行光电转换，所述第一感光元件122被可导通地连接于所述第一电路板123。所述第一镜头组件121进一步包括一第一光学镜头1211和一第一基座1212，其中第一基座1212被支撑于所述第一电路板123并且形成一第一光窗，其中所述第一光学镜头1211被支撑于所述第一基座1212。
所述电子设备1000进一步包括一组装体140，其中所述组装体140分别连接于所述接收单元120和所述摄像模组130以使两者形成一整体，以有利于减少在组装过程中两者出现偏差。值得一说的是，所述组装体140可被实施为一外支架，所述外支架将所述接收单元120和所述摄像模组130固定组装于一起，形成一整 体。
在另一实施例中，所述组装体140被实施为一连体底座，即所述接收单元120和所述摄像模组130共用所述连体底座，即所述接收单元对应的滤光元件和所述摄像模组130对应的滤光元件分别被设置于所述连体底座，从而实现所述接收单元120与所述摄像模组130一体，同时在该实施例中，所述接收单元120和所述摄像模组130进一步可用一外支架进行固定，增加可靠性。
在另一实施中，所述接收单元120和所述摄像模组130共用一共用线路板，即所述组装体140实施为共用线路板，即所述接收单元的所述感光元件122和所述摄像模组的感光元件分别被设置于所述共用线路板，并导通于所述共用线路板，从而使得所述接收单元120和所述摄像模组130为一整体。
所述摄像模组130的数量并不限制于一个，可以是多个，例如双摄模组。
在本示例中，所述泛光灯110被可导通地连接于所述接收单元120的所述第一电路板123。所述泛光灯110和所述接收单元120在相互导通后能够配合工作。电信号能够在所述泛光灯110和所述接收单元120之间相互传递，比如说所述泛光灯110的所述电子元器件116的一IC控制器发出一控制信号，其中所述控制信号能够被传递至所述泛光灯110的所述电路板组件111或者是所述接收单元120的所述电路板。
所述电子元器件116可以是全部被设置于所述接收单元120的所述第一电路板123，也可以是部分被设置于所述接收单元120的所述第一电路板123，部分被位于所述泛光灯110的所述电路板组件111，例如一IC控制器被设置于所述接收单元120的所述第一电路板123，使得所述泛光灯110尺寸变小。当位于所述接收单元120的所述第一电路板123的所述IC控制器被导通后，所述IC控制器能够被导通于所述泛光灯110的所述电路板组件111和所述发光元件112，从而控制所述泛光灯110的工作。在本示例中，所述IC控制器通过所述柔性连接件115被导通于所述泛光灯110的所述电路板组件111的所述第二导电端1120，从而通过所述第二导电端1120被导通于所述泛光灯110的所述电路板组件111的所述第一导电端1110，进而所述IC控制器能够通过所述第一导电端1110被导通于所述发光元件112。
在本发明的另一些示例中，所述泛光灯110被可导通地连接于所述摄像模组130的一电路板，借助所述摄像模组130的所述电路板和所述接收单元120的所 述第一电路板123导通。在本发明的另一些示例中，所述泛光灯110被可导通地连接于所述电子设备1000的一线路板1002。
附图4C和附图4D，示出了所述泛光灯110的另一应用方式，同时参考附图1、附图3B、附图5A和附图5B，在本示例中，所述泛光灯110被可导通地连接于所述摄像模组130的一第二电路板133。
所述摄像模组130包括一第二镜头组件131，一第二感光元件132以及所述第二电路板133，其中所述第二镜头组件131提供一光学通路以使光线达到所述第二感光元件132从而进行光电转换，所述第二感光元件132被可导通地连接于所述第二电路板133。所述第二镜头组件131进一步包括一第二光学镜头1311和一第二基座1312，其中所述第二基座1312被支撑于所述第二电路板133并且形成一第二光窗，其中所述第二光学镜头1311被支撑于所述第二基座1312。所述摄像模组130进一步包括一滤光件134，其中所述滤光件134被保持于所述第二感光元件132的一感光路径。
所述泛光灯110可以通过一柔性连接件115被可导通地连接于所述摄像模组130的所述第二电路板133。所述柔性连接板被可导通地连接于所述泛光灯110的所述电路板组件111的所述第二导电端1120，并且能够被可导通地连接于所述摄像模组130的所述第二电路板133，比如以导电胶连接或者是插接于所述摄像模组130的所述第二电路板133的方式。
更加具体地说，所述泛光灯110通过所述柔性连接件115被直接连接于所述摄像模组130的所述第二电路板133，然后通过所述摄像模组130的所述第二电路板133被可导通地连接于所述接收单元120的所述第一电路板123。
所述泛光灯110和所述接收单元120在相互导通后能够配合工作。电信号能够在所述泛光灯110和所述接收单元120之间相互传递，比如说所述泛光灯110的所述电子元器件116的一IC控制器发出一控制信号，其中所述控制信号能够被传递至所述泛光灯110的所述电路板组件111或者是所述接收单元120的所述电路板。
所述电子元器件116可以是全部被设置于所述摄像模组130的所述第二电路板133，也可以是部分被设置于所述摄像模组130的所述第二电路板133，部分位于所述接收单元120的所述第二电路板133，部分被位于所述泛光灯110的所述电路板组件111，例如一IC控制器被设置于所述摄像模组130的所述第二电 路板133，使得所述泛光灯110尺寸变小。当位于摄像模组130的所述第二电路板133的所述IC控制器被导通后，所述IC控制器能够通过所述摄像模组130的所述第二电路板133被导通于所述泛光灯110的所述电路板组件111和所述发光元件112，从而控制所述泛光灯110的工作，并且所述IC控制器能够通过所述摄像模组130的所述第二电路板133被导通于所述接收单元120的所述第一电路板123。
在本示例中，所述IC控制器通过所述柔性连接件115被导通于所述泛光灯110的所述电路板组件111的所述第二导电端1120，从而通过所述第二导电端1120被导通于所述泛光灯110的所述电路板组件111的所述第一导电端1110，进而所述IC控制器能够通过所述第一导电端1110被导通于所述发光元件112。
在本发明的另一些示例中，所述泛光灯110的所述电路板组件111被直接连接于所述摄像模组130的所述第二电路板133。所述泛光灯110的所述电路板组件111的所述第二导电端1120被直接可导通地连接于所述摄像模组130的所述第二电路板133。
在本发明的另一些示例中，所述柔性连接件115被设置于所述摄像模组130，所述柔性连接件115被可导通地连接于所述摄像模组130的所述第二电路板133。所述泛光灯110的所述电路板组件111被可导通地连接于所述柔性连接件115，以导电胶连接的方式或者是所述柔性连接件115被插接于所述电路板组件111的方式。
所述泛光灯110的所述电路板组件111的一种实施方式，被示出于附图5A。具体地说，所述电路板组件111包括一导电部1111和一绝缘部1112，其中所述绝缘部1112被连接于所述导电部1111，起到绝缘的作用。可选地，所述绝缘部1112被一体成型于所述绝缘部1112。
所述第一导电端1110和所述第二导电端1120分别形成于所述导电部1111的一上表面和一下表面。所述第二导电端1120也可以形成于所述导电部1111的一侧面。
所述导电部1111进一步包括一第一导电部11111和一第二导电部11112，其中所述第一导电部11111和所述第二导电部11112被所述绝缘部1112隔绝，以避免所述第一导电部11111和所述第二导电部11112在同时被导通时短路。
所述第一导电部11111不仅可以起到导电的作用，还可以起到散热的作用以 将所述发光元件112产生的热量从所述电路板组件111的一侧传递至另一侧进行散发。优选地，所述第一导电部11111大于所述第二导电部11112，其中所述第一导电部11111可以用于支撑所述发光元件112。所述第一导电部11111可以被导通于所述发光元件112的一电极，所述第二导电部11112可以被导通于所述发光元件112的另一电极以在通电后形成一回路。
优选地，所述第一导电部11111被在高度方向贯通所述绝缘部1112，所述第一导电端1110形成于所述第一导电部11111的一上表面，所述第二导电端1120形成于所述第一导电部11111的一下表面。
可以理解的是，在本发明的另一些示例中，所述第二导电端1120形成于所述第一导电部11111的一侧面。
所述导电部1111还可以包括一第三导电部11113和一第四导电部11114，其中所述第三导电部11113和所述第四导电部11114能够用于可导通地支撑其他电子元器件116，比如说用于导通PD元件(光强检测)、电容电阻、NTC(温控)等元器件。
本领域技术人员可以理解的是，所述导电部1111还可以包括一第五导电部甚至是更多的导电部。所述导电部的结构和排布可以根据需求被灵活设计。
所述泛光灯110的所述电路板组件111的一种实施方式，被示出于附图5B，所述电路板组件111包括一导电层10，一线路层20，一绝缘层30以及一散热部40，其中所述绝缘层30分别连接于所述导电层10和所述线路层20，所述散热部40形成于所述导电层10和所述线路层20。优选地，所述第一导电端1110形成于所述散热部40的一上表面，所述第二导电端1120形成于所述散热部40的所述下表面。所述导电层10，所述线路层20分别通过一光照显影，然后电镀形成。可选地，所述第二导电端112也可以形成于一侧面。
根据本发明的另一方面，提供了带有一泛光灯110的一电子设备1000的装配方法，其中所述装配方法包括如下步骤：
以导通一泛光灯110的一电路板组件111于一线路板1002的方式安装所述泛光灯110于一电子设备1000，其中所述电子设备本体1001带有所述线路板1002。
根据本发明的一些实施方式，在所述装配方法中，以所述泛光灯110的一第二导电端1120对准于所述线路板1002的方式安装所述泛光灯110。
根据本发明的一些实施方式，在所述装配方法中，所述泛光灯110被设置有一柔性连接件115，所述电路板组件111通过所述柔性连接件115被可导通地连接于所述线路板1002。
根据本发明的一些实施方式，在所述装配方法中，所述电子设备本体1001设置有一柔性连接件115，所述柔性连接件115被可导通地连接于所述线路板1002，所述电路板组件111通过所述柔性连接件115被可导通地连接于所述线路板1002。
根据本发明的一些实施方式，在所述装配方法中，所述电子设备1000被安装有带有一线路板1002的一摄像模组130，其中所述泛光灯110被安装于所述摄像模组130。
根据本发明的一些实施方式，在所述装配方法中，所述电子设备1000被安装有带有一电路板的一接收单元120，其中所述泛光灯110被安装于所述接收单元120以组成一TOF摄像模组。
本领域的技术人员应理解，上述描述及附图中所示的本发明的实施例只作为举例而并不限制本发明。本发明的目的已经完整并有效地实现。本发明的功能及结构原理已在实施例中展示和说明，在没有背离所述原理下，本发明的实施方式可以有任何变形或修改。

Claims (38)

  1. 带有泛光灯的电子设备，其特征在于，包括：
    一电子设备本体；
    一接收单元；和
    一泛光灯，其中所述泛光灯包括一投射组件和一电路板组件，其中所述投射组件用于投射光线，所述电路板组件具有一第一导电端和一第二导电端，其中所述第一导电端被连通于所述第二导电端，所述电路板组件具有一上表面，所述第一导电端暴露于所述上表面位置，所述投射组件被可导通地连接于所述电路板组件的所述第一导电端，其中所述泛光灯和所述接收单元被分别安装于所述电子设备本体并且所述接收单元被可导通地连接于所述泛光灯的所述第二导电端以组成一TOF摄像模组。
  2. 根据权利要求1所述的电子设备，其中所述电子设备本体包括一线路板，其中所述线路板被设置于所述电子设备本体，其中所述泛光灯的所述电路板组件通过所述线路板被可导通地连接于所述接收单元。
  3. 根据权利要求2所述的电子设备，其中所述泛光灯的所述电路板组件被可导通地至少部分重叠于所述线路板。
  4. 根据权利要求2所述的电子设备，其中所述泛光灯进一步包括一柔性连接件，其中所述泛光灯通过所述柔性连接件被可直接导通地连接于所述线路板。
  5. 根据权利要求2至4任一所述的电子设备，其中所述泛光灯进一步包括至少一电子元器件，其中至少一部分所述电子元器件被设置于所述电子设备的所述线路板，所述电子元器件被可导通地连接于所述泛光灯的所述电路板组件。
  6. 根据权利要求1所述的电子设备，其中所述接收单元包括一第一镜头组件，一第一感光元件以及一第一电路板，其中所述第一镜头组件提供一光学通路供光线穿过后达到所述第一感光元件进行光电转换，所述第一感光元件被可导通地连接于所述第一电路板，其中所述泛光灯的所述电路板组件被可导通地连接于所述接收单元。
  7. 根据权利要求6所述的电子设备，其中所述泛光灯的所述第二导电端被可导通地直接连接于所述接收单元的所述第一电路板。
  8. 根据权利要求6所述的电子设备，其中所述泛光灯进一步包括一柔性连 接件，其中所述柔性连接件的一端被可导通地连接于所述第二导电端，所述柔性连接件的另一端被可导通地连接于所述接收单元。
  9. 根据权利要求6所述的电子设备，其中所述泛光灯的所述电路板组件被至少部分重叠于所述第一电路板。
  10. 根据权利要求6至9任一所述的电子设备，其中所述泛光灯进一步包括至少一电子元器件，其中至少一部分所述电子元器件被设置于所述接收单元的所述第一电路板，所述电子元器件被可导通地连接于所述泛光灯的所述电路板组件。
  11. 根据权利要求10所述的电子设备，其中所述第一镜头组件进一步包括一第一光学镜头，一第一基座和至少二滤光元件，其中所述第一基座支撑所述第一光学镜头并且形成一光窗，所述滤光元件被可切换地保持于所述第一感光元件的一感光路径。
  12. 根据权利要求1所述的电子设备，其中所述电子设备进一步包括一摄像模组，其中所述摄像模组被设置于所述电子设备本体，其中所述摄像模组包括一第二镜头组件，一第二感光元件以及一第二电路板，其中所述第二镜头组件提供一光学通孔供光线穿过后达到所述第二感光元件进行光电转换，所述第二感光元件被可导通地连接于所述第二电路板。
  13. 根据权利要求12所述的电子设备，其中所述电子设备进一步包括一组装体，其中通过所述组装体被组装为一整体的所述摄像模组和所述接收单元被共同安装于所述电子设备本体。
  14. 根据权利要求12所述的电子设备，其中所述泛光灯的所述电路板组件被可导通地连接于所述摄像模组的所述第二电路板。
  15. 根据权利要求14所述的电子设备，其中所述泛光灯的所述电路板组件被至少部分重叠于所述第二电路板。
  16. 根据权利要求6所述的电子设备，其中所述电子设备进一步包括一摄像模组，其中所述摄像模组被设置于所述电子设备本体，其中所述摄像模组包括一第二镜头组件，一第二感光元件以及一第二电路板，其中所述第二镜头组件提供一光学通孔供光线穿过后达到所述第二感光元件进行光电转换，所述第二感光元件被可导通地连接于所述第二电路板。
  17. 根据权利要求16所述的电子设备，其中所述电子设备进一步包括一组装体，其中通过所述组装体被组装为一整体的所述摄像模组和所述接收单元被共 同安装于所述电子设备本体。
  18. 根据权利要求16所述的电子设备，其中所述泛光灯的所述电路板组件被可导通地连接于所述摄像模组的所述第二电路板。
  19. 根据权利要求18所述的电子设备，其中所述泛光灯的所述电路板组件被至少部分重叠于所述第二电路板。
  20. 根据权利要求16至19任一所述的电子设备，其中所述泛光灯进一步包括至少一电子元器件，其中至少一部分所述电子元器件被设置于所述接收单元的所述第一电路板，所述电子元器件被可导通地连接于所述泛光灯的所述电路板组件。
  21. 根据权利要求1所述的电子设备，其中所述电路板组件包括一第一导电部，一第二导电部以及一绝缘部，其中所述绝缘部分隔所述第一导电部和所述第二导电部，其中所述第一导电部具有一上表面，所述投射组件包括一发光元件，所述发光元件被支撑于所述上表面，所述第一导电端暴露于至少部分所述上表面位置。
  22. 根据权利要求21所述的电子设备，其中所述第一导电部在高度方向贯通于所述绝缘部。
  23. 带有一泛光灯的一电子设备的装配方法，其特征在于，包括如下步骤：
    安装一泛光灯于一电子设备，并且所述泛光灯的一电路板组件被可导通地连接于所述电子设备的一线路板。
  24. 根据权利要求23所述的装配方法，其中在上述方法中，将所述泛光灯的一第二导电端直接可导通地安装于所述线路板。
  25. 根据权利要求24所述的装配方法，其中在上述方法中，重叠至少部分所述电路板组件于所述电子设备的所述线路板。
  26. 根据权利要求23所述的装配方法，其中在上述方法中，通过一柔性连接件将所述泛光灯的一第二导电端可导通地连接于所述线路板。
  27. 根据权利要求26所述的装配方法，其中所述柔性连接件被连接于所述泛光灯的所述电路板组件。
  28. 根据权利要求26所述的装配方法，其中所述柔性连接件被连接于所述电子设备的所述线路板。
  29. 根据权利要求23所述的装配方法，其中在上述方法中，在装配所述泛 光灯之前，所述电子设备被安装有一接收单元，其中所述线路板被设置于所述接收单元。
  30. 根据权利要求23所述的装配方法，其中在上述方法中，在装配所述泛光灯之前，所述电子设备被安装有一摄像模组，其中所述线路板被设置于所述摄像模组。
  31. 根据权利要求23所述的装配方法，其中在上述方法中，在装配所述泛光灯之前，所述电子设备被同时安装有一摄像模组和一接收单元，其中所述摄像模组和所述接收单元通过一组装体形成一整体，所述线路板被设置于所述摄像模组；或者是所述线路板被设置于所述接收单元；或者是所述线路板被设置于所述接收单元和所述摄像模组。
  32. 根据权利要求25至27任一所述的装配方法，将所述泛光灯的一第二导电端直接可导通地安装于所述线路板。
  33. 根据权利要求29至31任一所述的装配方法，其中在上述方法中，重叠至少部分所述电路板组件于所述线路板。
  34. 根据权利要求29至31任一所述的装配方法，其中在上述方法中，通过一柔性连接件将所述泛光灯的一第二导电端可导通地连接于所述线路板。
  35. 根据权利要求23至31任一所述的装配方法，其中所述泛光灯通过如下的方式组装而成：
    一体模塑形成一支架于一电路板组件；
    安装一发光元件于所述电路板组件；和
    安装一光学辅助元件于所述支架以形成一泛光灯。
  36. 根据权利要求23至31任一所述的装配方法，其中所述泛光灯通过如下方式组装而成：
    安装一发光元件于一电路板组件；
    安装一支架于所述电路板组件；和
    安装一光学辅助元件于所述支架以形成一泛光灯。
  37. 根据权利要求23至31任一所述的装配方法，其中所述泛光灯通过如下方式组装而成：
    安装一光学辅助元件于一支架；和
    安装所述支架于带有一发光元件的一电路板组件。
  38. 根据权利要求23至31任一所述的装配方法，其中所述泛光灯通过如下方式组装而成：
    一体成型一支架于一光学辅助元件；和
    安装所述支架于带有一发光元件的一电路板组件。
PCT/CN2019/097755 2018-08-27 2019-07-25 带有泛光灯的电子设备及其装配方法 WO2020042839A1 (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN201821383599.1U CN209330218U (zh) 2018-08-27 2018-08-27 带有泛光灯的电子设备
CN201821383599.1 2018-08-27
CN201810979715.4A CN110868507A (zh) 2018-08-27 2018-08-27 带有泛光灯的电子设备及其装配方法
CN201810979715.4 2018-08-27

Publications (1)

Publication Number Publication Date
WO2020042839A1 true WO2020042839A1 (zh) 2020-03-05

Family

ID=69650842

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/097755 WO2020042839A1 (zh) 2018-08-27 2019-07-25 带有泛光灯的电子设备及其装配方法

Country Status (2)

Country Link
CN (1) CN110868507A (zh)
WO (1) WO2020042839A1 (zh)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206546435U (zh) * 2016-12-26 2017-10-10 艾普柯微电子（上海）有限公司 测距装置
US20170350691A1 (en) * 2016-06-01 2017-12-07 Pixart Imaging Inc. Measurement device and operation method thereof
US20170356982A1 (en) * 2016-06-09 2017-12-14 Heptagon Micro Optics Pte. Ltd. Optical ranging systems including optical cross-talk reducing features
US20180096489A1 (en) * 2016-09-30 2018-04-05 Magic Leap, Inc. Real time calibration for time-of-flight depth measurement
CN207382424U (zh) * 2017-11-01 2018-05-18 浙江舜宇智能光学技术有限公司 Tof摄像模组以及电子设备
CN108174075A (zh) * 2018-02-28 2018-06-15 信利光电股份有限公司 一种tof摄像模组以及电子设备
CN207704031U (zh) * 2017-12-08 2018-08-07 余姚舜宇智能光学技术有限公司 一种小型化tof电路模块及tof模组

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106686283A (zh) * 2015-11-09 2017-05-17 宁波舜宇光电信息有限公司 摄像装置及其应用
KR102320911B1 (ko) * 2016-02-18 2021-11-02 닝보 써니 오포테크 코., 엘티디. 어레이 이미징 모듈 및 성형된 감광성 어셈블리, 회로 보드 어셈블리 및 전자 장치용 그 제조 방법
CN207704030U (zh) * 2017-12-08 2018-08-07 余姚舜宇智能光学技术有限公司 一种小型化tof电路模块及tof模组
CN207691960U (zh) * 2017-12-14 2018-08-03 深圳奥比中光科技有限公司 集成3d成像装置及电子设备
CN108259724A (zh) * 2018-03-13 2018-07-06 欧菲影像技术（广州）有限公司 摄像模组及其支架结构
CN209330218U (zh) * 2018-08-27 2019-08-30 宁波舜宇光电信息有限公司 带有泛光灯的电子设备

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170350691A1 (en) * 2016-06-01 2017-12-07 Pixart Imaging Inc. Measurement device and operation method thereof
US20170356982A1 (en) * 2016-06-09 2017-12-14 Heptagon Micro Optics Pte. Ltd. Optical ranging systems including optical cross-talk reducing features
US20180096489A1 (en) * 2016-09-30 2018-04-05 Magic Leap, Inc. Real time calibration for time-of-flight depth measurement
CN206546435U (zh) * 2016-12-26 2017-10-10 艾普柯微电子（上海）有限公司 测距装置
CN207382424U (zh) * 2017-11-01 2018-05-18 浙江舜宇智能光学技术有限公司 Tof摄像模组以及电子设备
CN207704031U (zh) * 2017-12-08 2018-08-07 余姚舜宇智能光学技术有限公司 一种小型化tof电路模块及tof模组
CN108174075A (zh) * 2018-02-28 2018-06-15 信利光电股份有限公司 一种tof摄像模组以及电子设备

Also Published As

Publication number Publication date
CN110868507A (zh) 2020-03-06

Similar Documents

Publication Publication Date Title
US11493605B2 (en) Depth information camera module and base assembly, projection assembly, electronic device and manufacturing method thereof
WO2020125388A1 (zh) 飞行时间模组及电子设备
JP4332130B2 (ja) カメラモジュール
KR102434803B1 (ko) 칩-온-보드 모듈식 조명 시스템 및 제조 방법
WO2020048352A1 (zh) Tof摄像模组和电子设备以及组装方法
KR102627501B1 (ko) 카메라 모듈
WO2021036498A1 (zh) Tof摄像模组及其投射模块和电子设备
CN211321384U (zh) Tof摄像模组及其投射模块和电子设备
WO2022242225A1 (zh) 飞行时间摄像模组和电子设备
CN101452182B (zh) 部件减少的闪光组件以及具有该组件的数字图像拍摄设备
WO2020042839A1 (zh) 带有泛光灯的电子设备及其装配方法
CN212031902U (zh) 补光灯结构、拍摄设备及可移动平台
CN209330218U (zh) 带有泛光灯的电子设备
CN216257002U (zh) 摄像组件及胶囊内窥镜
CN110876003A (zh) Tof摄像模组和电子设备以及组装方法
WO2021217365A1 (zh) 补光灯结构、拍摄设备及可移动平台
JP6968901B2 (ja) 特定の事前組立モジュールを有する自動車両の光センサ装置用の送信装置、光センサ装置、及び自動車両
CN112995453B (zh) 深度信息摄像模组及其组装方法
CN220933191U (zh) 一种用于相机的测距结构及相机
CN221688769U (zh) 传感器模组和电子设备
CN218976748U (zh) 摄像模组及智能门锁系统
CN221726238U (zh) 一种汇聚光束的小型化tof摄像头模组
CN219761140U (zh) 车载摄像头
CN112666776B (zh) 发射模组及其制造方法、深度信息获取模组以及电子设备
JP2000330167A (ja) カメラ用ストロボ装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19854836

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19854836

Country of ref document: EP

Kind code of ref document: A1