WO2020041942A1 - 一种感光芯片封装结构、摄像头模组及移动终端 - Google Patents

一种感光芯片封装结构、摄像头模组及移动终端 Download PDF

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Publication number
WO2020041942A1
WO2020041942A1 PCT/CN2018/102540 CN2018102540W WO2020041942A1 WO 2020041942 A1 WO2020041942 A1 WO 2020041942A1 CN 2018102540 W CN2018102540 W CN 2018102540W WO 2020041942 A1 WO2020041942 A1 WO 2020041942A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive chip
frame
wall
photosensitive
substrate
Prior art date
Application number
PCT/CN2018/102540
Other languages
English (en)
French (fr)
Inventor
矢岛淳史
冉坤
罗振东
傅立峰
林威智
黄昌福
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2018/102540 priority Critical patent/WO2020041942A1/zh
Priority to CN201880094335.0A priority patent/CN112930598B/zh
Priority to US17/266,057 priority patent/US11869908B2/en
Priority to EP18931620.1A priority patent/EP3813115B1/en
Publication of WO2020041942A1 publication Critical patent/WO2020041942A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Definitions

  • the present application relates to the technical field of electronic devices, and in particular, to a photosensitive chip package structure, a camera module, and a mobile terminal.
  • the conventional camera module includes a circuit board 01, a photosensitive chip 02 and a package cover 03, a filter 04, a voice coil motor 05, and a camera 06 disposed on the circuit board 01.
  • the circuit board 01 Signal pins 011 and surface-mount devices 012 such as capacitors and resistors are provided on the upper area that avoids the light sensitive chip 02.
  • the side of the light sensitive chip 02 facing away from the circuit board 01 has a light sensitive area and a non-light sensitive area surrounding the light sensitive area.
  • a pad 021 is provided, and the pad 021 of the photosensitive chip 02 and the signal pin 011 of the circuit board 01 are connected by a metal wire 07 extending from the non-photosensitive region of the photosensitive chip 02 to the circuit board 01;
  • the side walls of the package cover are bonded to the circuit board 01 on the photosensitive chip 02, the metal wire 07, and the surface-mount component 012, and the package cover 03 has a light-transmitting hole at a position opposite to the photosensitive region of the photosensitive chip 02;
  • the filter 04, the voice coil motor 05, and the camera 06 are sequentially disposed on a side of the package cover 03 away from the circuit board 01, and the filter 04 is positioned opposite to the light transmitting hole of the package cover 03.
  • the present application provides a photosensitive chip package structure, a camera module, and a mobile terminal, which are used to reduce the size of the camera module and facilitate miniaturization.
  • the present application provides a photosensitive chip packaging structure including a substrate, a photosensitive chip, and a frame, wherein the photosensitive chip is mounted on the substrate, and the frame is disposed on a side of the photosensitive chip facing away from the substrate;
  • the chip has a photosensitive area and a non-photosensitive area, and the non-photosensitive area is arranged around the photosensitive area; the photosensitive chip and the substrate are electrically connected through a metal wire.
  • the non-photosensitive area of the photosensitive chip is provided with a pad and a signal is provided on the substrate.
  • the pins and the two ends of the metal wires are respectively connected to the pads and signal pins, that is, the metal wires extend from the non-photosensitive area of the photosensitive chip to the substrate; on the side of the frame facing the substrate, a frame is provided for avoiding Avoidance grooves for metal wires.
  • the avoidance grooves extend along the side of the frame, and the inner wall of the avoidance grooves is an arc-shaped inner wall.
  • the avoidance grooves are filled with filling glue. When the filling glue is set, it can be wrapped around the metal wires to To protect the metal wire, on the other hand, the frame can be bonded to the non-photosensitive area of the photosensitive chip and the substrate, so as to support the frame and make the frame and Between the substrate and the optical chip relatively fixed.
  • the side of the avoidance groove is opened on the frame, and the filler is filled with the metal wire while the frame is bonded to the photosensitive chip and the substrate, so that the photosensitive chip is sealed on the side.
  • the cured filling glue can also support the frame, that is, the filling glue filled in the avoidance groove can not only achieve the role of the side wall in the prior art, but also does not need to reserve a side wall on the side of the substrate Space, so the size of the substrate can be greatly reduced, thereby achieving the purpose of reducing the size of the camera module;
  • the curved inner wall of the avoidance groove can prevent air bubbles from being generated when filling the filling glue, so that the filling glue is filled in the avoidance groove. The effect is better, avoiding excessive overflow of the filling glue during assembly, improving the supporting effect of the filling glue after curing, and thereby improving the structural stability of the package structure of the photosensitive chip.
  • the frame has a light-transmitting hole opposite to the photosensitive region of the photosensitive chip, so that light can be irradiated to the photosensitive region of the photosensitive chip through the light-transmitting hole; at the same time, in order to filter out light In the infrared, the light-sensitive chip package structure further includes a filter, and the filter is disposed on the frame at a position opposite to the transparent hole.
  • the frame can be designed with different structures according to the specific position of the filter in the frame.
  • the filter is disposed on a side of the frame facing away from the photosensitive chip.
  • the side of the frame facing away from the photosensitive chip is sunken. Holes, and the counterbore can form an annular step structure with the light-transmitting hole, so that the filter can be fixed on the annular step structure, so that the distance between the filter and the photosensitive chip is shortened, thereby reducing the camera module The purpose of the height.
  • the depth of the counterbore is not less than the thickness of the filter, so that when the filter is fixed on the annular step structure, the filter will not exceed the side of the frame facing away from the photosensitive chip Surface, which can further reduce the height of the camera module.
  • the filter is disposed on a side of the frame facing the photosensitive chip, which can further reduce the thickness of the frame; and when a voice coil motor is installed on the side of the frame facing away from the photosensitive chip
  • the area supporting the frame is actually the surrounding area of the light-transmitting hole, so you only need to ensure that the size of the voice coil motor is larger than the size of the light-transmitting hole, so that a smaller size voice coil can be installed on the frame.
  • the motor helps to further reduce the size of the camera module.
  • the frame has a first retaining wall and a second retaining wall, and the first retaining wall and the second retaining wall are respectively disposed on both sides of the avoidance groove, so as to limit the filling glue in the escape groove as much as possible;
  • the first blocking wall is located on the side of the avoidance groove close to the photosensitive region, and in order to ensure the adhesion effect between the frame and the non-photosensitive region of the photosensitive chip and the substrate, the A lower end surface is disposed at a distance from the photosensitive chip, and a lower end surface of the second barrier wall is disposed at a distance from the substrate.
  • a side wall of the filter is used to form an inner side wall of the first blocking wall, which not only simplifies The structure of the frame can reduce the thickness of the frame.
  • the included angle formed by the inner side wall of the first blocking wall and the lower end surface of the first blocking wall is an obtuse angle, which helps to make the filling Glue better wraps metal wires.
  • an inner side wall of the second blocking wall includes a first curved surface and a second curved surface, wherein the first curved surface is connected to a lower end surface of the second blocking wall,
  • the second arc-shaped surface is connected to the bottom wall of the avoidance groove, and in order to smoothly connect the first arc-shaped surface and the second arc-shaped surface, the first arc-shaped surface protrudes toward the inside of the escape groove, and the second arc-shaped The inside of the avoidance groove protrudes from the back.
  • the radius of the first curved surface is greater than the radius of the second curved surface
  • the plane on which the photosensitive chip is mounted on the substrate is the preset first plane.
  • the width of the projection of the first curved surface on the first plane is greater than the width of the projection of the second curved surface on the first plane.
  • the inner side wall of the second retaining wall has a first end and a second end, wherein the first end is a connection end between the inner side wall of the second retaining wall and the lower end surface of the second retaining wall, and the second end is a second end of the second retaining wall.
  • the angle formed by the connection between the first end and the second end and the lower end face of the second retaining wall is an obtuse angle, similar to Ground, this solution also helps to make the filling glue better wrap the metal wire.
  • the avoidance groove can be set along one side, two sides, or three sides of the frame.
  • the photosensitive area of the photosensitive chip can be sealed by filling the side of the frame with the avoidance groove.
  • the frame On one side of the avoidance groove, the frame has a side wall connected to the substrate, and the photosensitive area of the photosensitive chip can be sealed through the side wall. That is to say, in this solution, the filler and the sidewall jointly package the photosensitive area of the photosensitive chip.
  • the avoidance grooves are arranged along the four sides of the frame, and the avoidance grooves have a ring structure, so that the photosensitive region of the photosensitive chip can be encapsulated by the filling glue filled in the avoidance grooves.
  • the frame when a surface-mount device is provided on an area of the substrate that avoids the light-sensitive chip, the frame is further provided with a flange, which can cover the surface-mount device to perform surface-mounting. Protection of the device.
  • the frame further includes a support post, one end of the support post is connected to the substrate, and the other end is connected to the frame, so that the frame support.
  • the frame is made by an epoxy resin molding process, so as to obtain better flatness and structural strength.
  • the present application also provides a camera module including the photosensitive chip package structure of any one of the above.
  • the camera module has a smaller size.
  • the present application also provides a mobile terminal including the above-mentioned camera module. Since the size of the camera module is reduced, the mobile terminal is easier to implement a miniaturization and ultra-thin design.
  • FIG. 1 is a schematic structural diagram of a conventional camera module
  • FIG. 2 is a schematic structural diagram of a photosensitive chip package structure according to an embodiment of the present application.
  • FIG. 3 is a partial structural schematic diagram of a photosensitive chip package structure according to an embodiment of the present application.
  • FIG. 4 is a schematic diagram of another partial structure of a photosensitive chip package structure according to an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of another photosensitive chip package structure in the X direction according to an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of another photosensitive chip package structure in the Y direction according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a framework provided by an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of another photosensitive chip package structure according to an embodiment of the present application.
  • FIG. 10 is another schematic partial structure diagram of a photosensitive chip package structure according to an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of another photosensitive chip package structure in the X direction according to an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of another photosensitive chip package structure in the Y direction according to an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of another framework provided by an embodiment of the application.
  • FIG. 14 is a schematic structural diagram of another camera module according to an embodiment of the present application.
  • the photosensitive chip package structure provided in the embodiment of the present application includes a substrate 10 and a photosensitive chip 20, wherein the photosensitive chip 20 is mounted on the substrate 10, and on the side of the photosensitive chip 20 facing away from the substrate 10, the photosensitive chip 20 has a photosensitive region 21 and a non-photosensitive region 22 surrounding the photosensitive region 21.
  • the photosensitive chip 20 is electrically connected to the substrate 10, in the embodiment of the present application, the non-photosensitive region 22 of the photosensitive chip 20 is provided with a pad 23, and the region of the substrate 10 that avoids the photosensitive chip 20 is provided with a signal pin 11.
  • the disk 23 and the signal pin 11 are connected by a metal wire 30, and the metal wire 30 extends from the non-photosensitive region 22 of the photosensitive chip 20 to the substrate 10.
  • the pad 23 or the signal pin 11 may be disposed along one side, two sides, three sides, or four sides of the photosensitive chip 20, and accordingly, the metal wire 30 may also be arranged along the photosensitive chip 20 Unilateral, bilateral, trilateral or quadrilateral settings.
  • the photosensitive chip package structure further includes a frame 40 disposed on a side of the photosensitive chip 20 facing away from the substrate 10.
  • the frame 40 is made by an epoxy resin molding process, so Good flatness and structural strength.
  • an escape groove 41 for avoiding the metal wire 30 is opened on the frame 40.
  • the escape groove 41 extends along the side of the frame 40, and the inner wall of the escape groove 41 is an arc-shaped inner wall.
  • the avoidance groove is filled with filling glue 60. As shown in FIG. 2 or FIG. 9, the filling glue 60 can wrap the metal wire 30 on the one hand, and the non-photosensitive frame 40 and the photosensitive chip 20 on the other.
  • the area 22 is bonded to the substrate 10, so the side of the metal wire 30 is provided on the photosensitive chip 20, and the side of the photosensitive chip 20 can be sealed with a filler 60, and the cured filler 60 can also serve as a support frame 40. Role.
  • the arrangement manner of the avoidance groove 41 on the frame 40 is related to the installation position of the metal wire 30. When the sensor chip 20 is installed on one side, two sides, or three sides, it is only necessary to open the avoidance groove 41 on the corresponding side of the frame 40 to avoid the metal wire 30. At this time, the side of the avoidance groove 41 on the frame 40 is opened by filling.
  • the adhesive 60 supports the frame 40 and seals the light-sensitive chip 20, but the side of the frame 40 is not provided with the avoidance groove 41, and a side wall 44 can be provided on the frame 40 to connect with the substrate 10, and the side wall 44 is used to support the frame 40 and
  • the photosensitive chip 20 is sealed, and can be glued on the bottom of the side wall 44 to adhere to the substrate 10 during the specific implementation. It should be understood that whether the avoidance groove 41 is opened on any side of the frame 40, after the frame 40 is fixed, it is necessary to ensure that the filling glue 60 in the avoidance groove 41 and the above-mentioned side wall 44 can be enclosed so that the photosensitive chip 20 can be enclosed. The enclosed space enclosed by the photosensitive area 21.
  • the avoidance groove 41 for avoiding the metal wire 30 is of course also provided along the four sides of the frame 40.
  • the avoidance groove 41 has a ring structure and is filled in the annular avoidance groove 41.
  • the inner filling glue 60 can encapsulate the photosensitive area 21 of the photosensitive chip 20.
  • the frame 40 has a first retaining wall 45 and a second retaining wall 46.
  • the first retaining wall 45 and the second retaining wall 46 are respectively disposed on both sides of the avoidance groove 41 to fill the glue 60.
  • Limit to the avoidance groove 41 as much as possible, avoid overflow of the filling 60 during assembly, and contaminate the photosensitive area 21 of the photosensitive chip 20 or the electronic components on the substrate 10; among them, the first blocking wall 45 is located in the avoidance groove 41 near the photosensitive area 21
  • the second baffle wall 46 is located on the side of the avoidance groove 41 away from the photosensitive area 21, and in specific installation, the lower end surface of the first baffle wall 45 is spaced from the photosensitive chip 20, and the lower end surface of the second baffle wall 46 and spacer substrate 10 is provided so that a gap between the first retaining wall 20 and the lower end surface of the photosensitive chip 45 L 1, the lower end surface of the second blocking wall 46 and the gap between the substrate 10 L 2 60 practically underfill
  • the overflow provides
  • L 1, L 10 is the specific value of the gap between the gap between the first retaining wall 20 and the lower end surface of the photosensitive chip 45 and the lower end surface of the second substrate 2 of the retaining wall 46 may be provided empirically, for example, in the present application embodiment, the lower end surface of the substrate L 1, a second retaining wall and a gap between the first retaining wall 20 and the lower end surface 46 of the photosensitive chip 45 of the gap 10 between the L 2 can be set to not less than 0.15mm, The specific setting value can be 0.16mm, 0.18mm, or 0.2mm; the specific value of the width L 3 of the lower end surface of the first retaining wall 45 and the width L 4 of the lower end surface of the second retaining wall 46 can also be customized, such as in In the embodiment of the present application, the width L 3 of the lower end surface of the first retaining wall 45 is not
  • the included angle ⁇ formed by the inner wall of the first retaining wall and the lower end surface of the first retaining wall is an obtuse angle.
  • This solution can make the shape of the avoidance groove 41 more compatible with the shape of the metal wire, which helps to make The filling glue 60 better wraps the metal wire.
  • the specific angle value of ⁇ can be determined according to experience.
  • ⁇ can take a value in the range of 100 ° to 120 °, and the specific setting value can be 110 °, 115 ° or 120 °.
  • the inner side wall of the second blocking wall 46 includes a first curved surface 461 and a second curved surface 462, where the first curved surface 461 and The lower end surface of the second blocking wall 46 is connected, the second curved surface 462 is connected to the bottom wall of the avoidance groove 41, and in order to smoothly connect the first curved surface 461 and the second curved surface 462, the first arc
  • the shape surface 461 protrudes toward the inside of the avoidance groove 41
  • the second curved surface 462 protrudes away from the inside of the avoidance groove 41, so that the filling glue can obtain a better filling effect in the avoidance groove 41.
  • the radius R 1 of the first curved surface 461 is greater than the radius R 2 of the second curved surface 462. If the plane on which the photosensitive chip 20 is mounted on the substrate 10 is the preset first A plane. In this embodiment, the width L 5 of the projection of the first curved surface 461 on the first plane is greater than the width L 6 of the projection of the second curved surface 462 on the first plane. This solution can make the avoidance groove 41 The shape of the wire fits more closely with the shape of the metal wire, so that the filling glue better wraps the metal wire.
  • first arcuate surface of radius R 461 and a second arcuate surface of radius R 462 may be a specific value 2 custom settings, application in the present embodiment the first arcuate surface of radius R 461 of the embodiment 1 may be 0.4 The value is in the range of mm to 0.6mm.
  • the specific setting value can be 0.45mm, 0.5mm, or 0.55mm; the radius R 2 of the second curved surface 462 can be in the range of 0.2mm to 0.3mm.
  • the specific setting value can be 0.25mm or 0.3mm; the width of the projection of the first curved surface 461 on the first plane and the width of the projection of the second curved surface 462 on the first plane refer to the width in the X direction or the Y direction, and in this application
  • the width L 5 of the projection of the first curved surface 461 on the first plane may be a value in a range of 0.15 mm to 0.25 mm, and a specific setting value may be 0.18 mm, 0.2 mm, or 0.22 mm.
  • the inner wall of the second barrier wall 46 has a first end a and a second end b, where the first end a is the inner wall of the second barrier wall 46 and the lower end surface of the second barrier wall 46.
  • the connection end and the second end b are connection ends of the inner side wall of the second blocking wall 46 and the bottom wall of the avoidance groove 41.
  • the connection between the first end a and the second end b is The included angle ⁇ formed by the lower end surface of the second barrier wall 46 is an obtuse angle.
  • this solution is also to make the shape of the avoidance groove 41 and the shape of the metal wire more compatible.
  • the specific angle value of ⁇ can also be determined based on experience. In the embodiment of the present application, ⁇ can be taken in a range of 120 ° to 150 °, and the specific setting value can be 125 °, 135 °, or 145 °.
  • the second end b of the inner side wall of the second blocking wall 46 actually constitutes one end of the bottom wall of the avoidance groove 41.
  • the distance between the projection of this end on the first plane and the edge of the photosensitive chip 20 is A 1 .
  • the distance between the projection of the other end c of the bottom wall of the groove 41 on the first plane and the edge of the photosensitive chip 20 is A 2.
  • a 1 and A 2 are equal to each other and are equal to those provided on the photosensitive chip 20. The distance from the pad 23 to the edge of the photosensitive chip 20.
  • the frame 40 also has a light-transmissive hole 42.
  • the position of the light-transmissive hole 42 is opposite to the position of the photosensitive region 21 of the photosensitive chip 20, so that light can reach the photosensitive chip 20 through the transparent hole 42.
  • a filter 50 is provided on the frame 40 at a position opposite to the light-transmissive hole 42, and the filter 50 can be fixed to the frame 40 by bonding.
  • the filter 50 may be disposed on a side of the frame 40 facing away from the photosensitive chip 20, or may be disposed on a side of the frame 40 facing the photosensitive chip 20.
  • the position of the filter 50 is set according to the filter 50.
  • the frame 40 may have different structures. For example, when the filter 50 is disposed on the side of the frame 40 facing away from the photosensitive chip 20, as shown in FIG. 2, the side of the frame 40 facing away from the photosensitive chip 20 in this embodiment has a counterbore 43.
  • the hole 42 forms a ring-shaped stepped structure, and the filter 50 is fixed on the ring-shaped stepped structure.
  • the solution filters the filter 50 is embedded in the structure of the frame 40, and the distance between the filter 50 and the photosensitive chip 20 is shortened, so that the height of the photosensitive chip package structure can be reduced, thereby achieving the purpose of reducing the height of the camera module.
  • the counterbore 43 is provided, as shown in FIG. 2 and FIG. 6, the depth H of the counterbore 43 is not less than the thickness of the filter 50. In this way, when the filter 50 is fixed on the annular step structure, the filter 50 It does not exceed the side of the frame 40 facing away from the photosensitive chip 20, so that the height of the camera module can be further reduced.
  • the filter 50 when the filter 50 is disposed on the side of the frame 40 facing the photosensitive chip 20, the height of the frame 40 can be further reduced; and, as shown in FIG. 11 and FIG. 14, the frame 40 faces away from
  • the voice coil motor 70 is installed on one side of the photosensitive chip 20
  • the area supporting the frame 40 is actually the area around the light transmitting hole 42, so it is only necessary to ensure that the size of the voice coil motor in the X or Y direction is greater than The diameter of the light hole 42 is sufficient, so that a smaller voice coil motor can be installed on the frame 40, which is beneficial to further reducing the size of the camera module in the X direction and the Y direction, thereby achieving miniaturization of the mobile terminal and Ultra-thin design.
  • the width of the lower end surface of the first blocking wall 45 and the width of the lower end surface of the second blocking wall 46 also refer to the width of the structure in the X direction or the Y direction.
  • a sidewall of the filter 50 may be used to form a first blocking wall. 45 inner wall, so this solution does not need to provide a structure of the first retaining wall on the frame 40, so that under the premise of reducing the thickness of the frame 40, the structure of the frame 40 can be simplified, and the manufacturing process of the frame 40 is reduced. .
  • the side of the avoidance groove 41 is opened on the frame 40, and the frame 40 is adhered to the photosensitive chip 20 and the substrate 10 while the metal wire 30 is wrapped by the filling glue filled in the avoidance groove 41, so that The photosensitive chip 20 is sealed on this side, and the cured filling glue 60 can also support the frame 40.
  • the filling glue 60 filled in the avoidance groove 41 can realize the prior art.
  • the function of the side wall does not need to reserve space for installing the side wall on the side of the substrate 10, so the size of the substrate 10 in the X direction or the Y direction can be greatly reduced, thereby achieving the purpose of reducing the size of the camera module;
  • the curved inner wall of the avoidance groove 41 can prevent air bubbles from being generated when filling the filler 60, so that the filling effect of the filler 60 in the avoidance groove 41 is better, avoiding excessive overflow of the filler 60 during assembly, and improving the cured filler.
  • the supporting effect of 60 thereby improving the structural stability of the package structure of the photosensitive chip.
  • the frame 40 is further provided with a flange 47.
  • the flange 47 can cover the surface mount device 12.
  • the flange 47 is an extension structure on the frame 40 and does not need to be separately supported. Therefore, this solution protects the surface mount device 12 without increasing the size of the substrate 10.
  • the filter 50 when assembling the photosensitive chip package structure, the filter 50 is first fixed on the frame 40, and the orientation of the frame 40 is adjusted so that the side on which the avoidance groove 41 is opened faces upward; Glue, turn the frame 40 after dispensing, and place it in the loading tray of the automatic placement machine, and then use the automatic placement machine to position the frame 40 on the substrate 10 that has been wired, so as to avoid the groove 41 covers the area where the metal wire 30 is disposed, the filling glue 60 in the avoidance groove 41 surrounds the metal wire 30 and bonds the frame 40 to the non-photosensitive region 22 of the photosensitive chip 20 and the substrate 10.
  • the filling glue 60 in the avoidance groove 41 surrounds the metal wire 30 and bonds the frame 40 to the non-photosensitive region 22 of the photosensitive chip 20 and the substrate 10.
  • the frame 40 further includes support pillars 48.
  • the two ends of the support pillar 48 are respectively connected to the substrate 10 and the substrate 10.
  • the frames 40 are connected to support the frames 40.
  • the mounting height of the frame 40 can be controlled by the support post 48, that is, the positioning of the frame 40 at the assembly height is achieved, thereby reducing the mounting difficulty.
  • the support post 48 It can also play the role of supporting the frame 40 to prevent the weight of the frame 40 and other components provided on the frame 40 from being all applied to the filling glue 60, which causes reliability problems caused by aging of the glue.
  • the support pillars 48 can be disposed on the flange 47 of the frame 40, and when the support pillars 48 are evenly arranged on the flange 47, the mounting difficulty can be further reduced.
  • FIG. 6 is a case where the filter 50 is disposed on the side of the frame 40 facing away from the photosensitive chip 20. Referring to FIG. 12, when the filter 50 is disposed on the frame 40 facing the photosensitive chip 20 On one side, a support post 48 can also be provided on the flange 47 to support the frame 40 and reduce the mounting difficulty, which will not be repeated here.
  • An embodiment of the present application further provides a camera module including any of the above-mentioned photosensitive chip package structures.
  • the camera module further includes a voice coil motor 70 and a camera. 80, the voice coil motor 70 and the camera 80 are sequentially disposed on a side of the frame 40 away from the substrate 10.
  • An embodiment of the present application further provides a mobile terminal including the aforementioned camera module, and the mobile terminal may be a common mobile terminal such as a mobile phone, a tablet computer, and a notebook computer.
  • the mobile terminal is easier to achieve miniaturization and ultra-thin design.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
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Abstract

本申请公开了一种感光芯片封装结构、摄像头模组及移动终端，以实现减小摄像头模组的尺寸的目的。该包括基板、贴装于基板的感光芯片，感光芯片背离基板的一侧具有感光区以及围绕感光区的非感光区，感光芯片与基板通过金属线电连接；感光芯片封装结构还包括：框架，设置于感光芯片背离基板的一侧，框架朝向基板的一侧开设有用于避让金属线的避让槽，避让槽沿框架的侧边延伸，且避让槽的内壁为弧形内壁；填充胶，填充于避让槽内，用于包裹金属线并将框架与感光芯片的非感光区和基板粘接。

Description

一种感光芯片封装结构、摄像头模组及移动终端 技术领域
本申请涉及电子设备技术领域，尤其涉及一种感光芯片封装结构、摄像头模组及移动终端。
背景技术
随着手机小型化、超薄化设计的持续推进，手机各部件也面临着小型化发展的严峻挑战。摄像头模组作为手机重要的模组部件，需要进一步缩小尺寸以适应当前发展需求。如图1所示，传统的摄像头模组包括电路板01、设置于电路板01上的感光芯片02以及封装盖板03、滤光片04、音圈马达05和摄像头06，其中，电路板01上避开感光芯片02的区域设置有信号管脚011以及电容、电阻等表面贴装器件012；感光芯片02背离电路板01的一侧具有感光区以及围绕感光区的非感光区，非感光区设置有焊盘021，感光芯片02的焊盘021与电路板01的信号管脚011之间通过由感光芯片02的非感光区延伸至电路板01的金属线07连接；封装盖板03罩设于感光芯片02、金属线07以及表面贴装元件012之上且封装盖板的侧壁与电路板01粘接，封装盖板03上与感光芯片02的感光区相对的位置具有透光孔；滤光片04、音圈马达05和摄像头06依次设置于封装盖板03远离电路板01的一侧且滤光片04与封装盖板03的透光孔位置相对。
在上述结构的摄像头模组中，一方面电路板上需预留一定的空间用于粘接封装盖板的侧壁；另一方面，在粘接时，需要在封装盖板的侧壁底部点胶，将点胶后的封装盖板贴装于电路板上时，胶水不可避免地会有部分溢出，为避免溢出的胶水对电路板上的表面贴装器件造成影响，封装盖板的侧壁与表面贴装器件之间也需预留一定的安全距离，这样就导致了电路板的尺寸进一步增大，不利于摄像头模组的小型化设计。
发明内容
本申请提供了一种感光芯片封装结构、摄像头模组及移动终端，用以减小摄像头模组的尺寸，便于小型化发展。
第一方面，本申请提供了一种感光芯片封装结构，该感光芯片封装结构包括基板、感光芯片以及框架，其中，感光芯片贴装于基板上，框架设置于感光芯片背离基板的一侧；感光芯片具有感光区和非感光区，且非感光区围绕感光区设置；感光芯片与基板之间通过金属线电连接，具体设置时，感光芯片的非感光区设置有焊盘，基板上设置有信号管脚，金属线的两端分别与焊盘和信号管脚连接，也就是说，金属线由感光芯片的非感光区延伸至基板上；在框架朝向基板的一侧，框架上开设有用于避让金属线的避让槽，该避让槽沿框架的侧边延伸，且避让槽的内壁为弧形内壁；避让槽内填充有填充胶，在设置填充胶时，一方面可以使其包裹金属线以起到保护金属线的作用，另一方面还可以将框架与感光芯片的非感光区和基板粘接，从而支撑框架并使框架与感光芯片和基板间相对固定。
上述实施例中，在框架上开设避让槽的侧边，通过填充于避让槽内的填充胶，在包裹金属线的同时将框架与感光芯片和基板进行粘接，从而将感光芯片在该侧密封，并且固化后的填充胶还能够支撑框架，也就是说，该填充于避让槽内的填充胶既能够实现现有技术 中的侧壁的作用，又无需在基板的该侧预留安装侧壁的空间，因此可以大大缩小基板的尺寸，进而实现减小摄像头模组的尺寸的目的；此外，避让槽的弧形内壁可以防止在填充填充胶时产生气泡，使填充胶在避让槽内的填充效果更佳，避免组装时填充胶过量溢出，提高了固化后的填充胶的支撑效果，从而提高了感光芯片封装结构的结构稳定性。
在一个具体的实施方案中，框架上具有透光孔，该透光孔与感光芯片的感光区位置相对，以使光线能够经过透光孔照射到感光芯片的感光区；同时，为了滤除光线中的红外线，该感光芯片封装结构还包括滤光片，所述滤光片设置于所述框架上与所述透光孔相对的位置。
在设置滤光片时，可以根据滤光片在框架的具体位置的不同，将框架设计为不同的结构。例如，在一个具体的实施方案中，所述滤光片设置于框架背离感光芯片的一侧，具体设置时，为了降低摄像头模组的高度，所述框架背离所述感光芯片的一侧具有沉孔，并且沉孔能够与透光孔形成环形台阶结构，使得滤光片可以固定于该环形台阶结构上，这样就拉近了滤光片与感光芯片之间的距离，从而达到降低摄像头模组的高度的目的。
在具体设置沉孔时，所述沉孔的深度不小于所述滤光片的厚度，这样，当滤光片固定于环形台阶结构上时，滤光片不会超出框架背离感光芯片的一侧表面，从而可以进一步降低摄像头模组的高度。
在另一个具体的实施方案中，所述滤光片设置于框架朝向所述感光芯片的一侧，这样可以进一步减小框架的厚度；并且，在框架背离感光芯片的一侧安装音圈马达时，框架上起到支撑作用的区域实际上是透光孔的周围区域，因此只需保证音圈马达的尺寸大于透光孔的尺寸即可，这样就可以在框架上安装尺寸更小的音圈马达，有利于进一步减小摄像头模组的尺寸。
在一个具体的实施方案中，框架具有第一挡壁和第二挡壁，第一挡壁和第二挡壁分别设置于避让槽的两侧，以将填充胶尽量地限制于避让槽内；其中，第一挡壁位于所述避让槽靠近所述感光区的一侧，并且为了保证框架与感光芯片的非感光区和基板之间的粘接效果，在具体设置时，第一挡壁的下端面与所述感光芯片间隔设置，第二挡壁的下端面与所述基板间隔设置。
当所述滤光片设置于框架朝向感光芯片的一侧时，在一个具体的实施方案中，所述滤光片的侧壁用于形成所述第一挡壁的内侧壁，这样既简化了框架的结构，又可以减小框架的厚度。
当所述滤光片设置于框架背向感光芯片的一侧时，所述第一挡壁的内侧壁与所述第一挡壁的下端面形成的夹角为钝角，这样有助于使填充胶更好地包裹金属线。
在具体设置避让槽的弧形内壁时，所述第二挡壁的内侧壁包括第一弧形面和第二弧形面，其中，第一弧形面与第二挡壁的下端面连接，第二弧形面与避让槽的底壁连接，并且为了使第一弧形面和第二弧形面之间圆滑过渡连接，第一弧形面朝向避让槽的内部凸出，第二弧形面背向避让槽的内部凸出。
在一个具体的实施方案中，第一弧形面的半径大于第二弧形面的半径，以基板上贴装感光芯片的一侧所在平面为预设的第一平面，在该实施例中，第一弧形面在第一平面的投影的宽度大于第二弧形面在第一平面的投影的宽度，该方案可使得避让槽的弧形内壁的形状与金属线的形状更加契合，从而使填充胶更好地包裹金属线。
第二挡壁的内侧壁具有第一端和第二端，其中，第一端为第二挡壁的内侧壁与第二挡 壁的下端面的连接端，第二端为第二挡壁的内侧壁与避让槽的底壁的连接端，在一个具体的实施方案中，第一端和第二端之间的连线与所述第二挡壁的下端面形成的夹角为钝角，类似地，该方案同样有助于使填充胶更好地包裹金属线。
在具体设置避让槽时，避让槽可以沿框架的单边、双边或者三边设置，这样，在框架设置避让槽的一侧，可以通过填充胶将感光芯片的感光区密封；而在框架未设置避让槽的一侧，框架具有与基板连接的侧壁，通过侧壁可将感光芯片的感光区密封，也就是说，该方案中填充胶与侧壁共同封装感光芯片的感光区。
在另一个具体的实施方案中，避让槽沿框架的四边设置，避让槽为环形结构，这样通过填充于避让槽内的填充胶就可将感光芯片的感光区封装。
在一个具体的实施方案中，当基板上避开感光芯片的区域设置有表面贴装器件时，框架还设置有凸缘，该凸缘能够覆盖所述表面贴装器件，以起到对表面贴装器件的保护作用。
为了降低感光芯片封装结构的组装难度，同时改善填充胶的受力情况，上述框架还包括支撑柱，所述支撑柱的一端与所述基板连接，另一端与所述框架连接，从而对框架进行支撑。
在一个具体的实施方案中，所述框架采用环氧树脂成型工艺制作而成，以便可以获得较好的平整度和结构强度。
第二方面，本申请还提供了一种摄像头模组，该摄像头模组包括上述任一项的感光芯片封装结构。该摄像头模组具有较小的尺寸。
第三方面，本申请还提供了一种移动终端，该移动终端包括上述的摄像头模组，由于摄像头模组的尺寸得以减小，该移动终端较易实现小型化及超薄化设计。
附图说明
图1为现有技术的摄像头模组的结构示意图；
图2为本申请实施例提供的一种感光芯片封装结构的结构示意图；
图3为本申请实施例提供的感光芯片封装结构的一种局部结构示意图；
图4为本申请实施例提供的感光芯片封装结构的另一种局部结构示意图；
图5为本申请实施例提供的另一种感光芯片封装结构在X方向的结构示意图；
图6为本申请实施例提供的另一种感光芯片封装结构在Y方向的结构示意图；
图7为本申请实施例提供的一种框架的结构示意图；
图8为本申请实施例提供的一种摄像头模组的结构示意图；
图9为本申请实施例提供的另一种感光芯片封装结构的结构示意图；
图10为本申请实施例提供的感光芯片封装结构的又一种局部结构示意图；
图11为本申请实施例提供的又一种感光芯片封装结构在X方向的结构示意图；
图12为本申请实施例提供的又一种感光芯片封装结构在Y方向的结构示意图；
图13为申请实施例提供的另一种框架的结构示意图；
图14为本申请实施例提供的另一种摄像头模组的结构示意图。
具体实施方式
为了使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明作进一步地详细描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。 基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
首先参考图2所示，本申请实施例提供的感光芯片封装结构包括基板10以及感光芯片20，其中，感光芯片20贴装于基板10上，在感光芯片20背离基板10的一侧，感光芯片20具有感光区21和围绕感光区21的非感光区22。在将感光芯片20与基板10电连接时，本申请实施例中，感光芯片20的非感光区22设置有焊盘23，基板10上避开感光芯片20的区域设置有信号管脚11，焊盘23与信号管脚11之间通过金属线30连接，金属线30由感光芯片20的非感光区22延伸至基板10上。在设置焊盘23或者信号管脚11时，焊盘23或者信号管脚11可以沿感光芯片20的单边、双边、三边或者四边设置，相应的，金属线30也可以沿感光芯片20的单边、双边、三边或者四边设置。
请继续参考图2所示，本申请实施例的感光芯片封装结构还包括设置于感光芯片20背离基板10的一侧的框架40，该框架40采用环氧树脂成型工艺制作而成，因此具有较好的平整度和结构强度。在该框架40朝向基板10的一侧，框架40上开设有用于避让金属线30的避让槽41，该避让槽41沿框架40的侧边延伸，且避让槽41的内壁为弧形内壁。在将框架固定时，避让槽内填充有填充胶60，参考图2或图9所示，填充胶60一方面可以包裹金属线30，另一方面还可以将框架40与感光芯片20的非感光区22和基板10粘接，因此在感光芯片20上设置金属线30的侧边，利用填充胶60可以将感光芯片20的该侧密封，并且固化后的填充胶60还能够起到支撑框架40的作用。另外，在具体设置避让槽41时，请结合图2和图7或者图9和图12所示，避让槽41在框架40上的布置方式与金属线30的设置位置相关，当金属线30沿感光芯片20的单边、双边或者三边设置时，只需在框架40的对应侧边开设避让槽41避让金属线30即可，此时，在框架40开设避让槽41的侧边，通过填充胶60支撑框架40并将感光芯片20密封，而在框架未设置避让槽41的侧边，则可在框架40上设置侧壁44与基板10连接，利用侧壁44在该侧支撑框架40并将感光芯片20密封，具体实施时可在侧壁44的底部点胶将其与基板10粘接。应当理解的是，无论避让槽41开设于框架40的任何一侧，都应当保证在将框架40固定后，避让槽41内的填充胶60与上述侧壁44能够合围成可以将感光芯片20的感光区21封装的封闭空间。当金属线30沿感光芯片20的四边设置时，该用于避让金属线30的避让槽41当然也要沿框架40的四边设置，此时避让槽41呈环形结构，通过填充于环形避让槽41内的填充胶60就可将感光芯片20的感光区21封装。
请参考图4至6所示，框架40具有第一挡壁45和第二挡壁46，第一挡壁45和第二挡壁46分别设置于避让槽41的两侧，以将填充胶60尽量限制于避让槽41内，避免在组装时填充胶60溢流，污染感光芯片20的感光区21或者基板10上的电子元件；其中，第一挡壁45位于避让槽41靠近感光区21的一侧，第二挡壁46位于避让槽41远离感光区21的一侧，并且在具体设置时，第一挡壁45的下端面与感光芯片20间隔设置，第二挡壁46的下端面与基板10间隔设置，这样，第一挡壁45的下端面与感光芯片20之间的间隙L 1、第二挡壁46的下端面与基板10之间的间隙L 2实际上为填充胶60的溢流提供了一定的缓冲空间，在不至于对感光芯片20的感光区21或者基板10上的电子元件造成污染的前提下，保证了填充胶60在避让槽41内的填充效果，并且增大了填充胶60与感光芯片20和基板10的粘接面积，从而进一步地提高了感光芯片封装结构的结构稳定性。其中，第一挡壁45的下端面与感光芯片20之间的间隙L 1、第二挡壁46的下端面与基板10之间 的间隙L 2的具体值可根据经验设置，例如在本申请实施例中，第一挡壁45的下端面与感光芯片20之间的间隙L 1、以及第二挡壁46的下端面与基板10之间的间隙L 2均可设置为不小于0.15mm，具体设置值可以为0.16mm、0.18mm或者0.2mm；第一挡壁45的下端面的宽度L 3、第二挡壁46的下端面的宽度L 4的具体值也可自定义设置，例如在本申请实施例中，第一挡壁45的下端面的宽度L 3不小于0.1mm，具体设置值可以为0.12mm、0.14mm或者0.15mm，第二挡壁46的下端面的宽度L 4不小于0.2mm，具体设置值可以为0.22mm、0.24mm或者0.25mm。
参考图4所示，第一挡壁的内侧壁与第一挡壁的下端面形成的夹角α为钝角，该方案可以使得避让槽41的形状与金属线的形状更加契合，有助于使填充胶60更好地包裹金属线，其中，α的具体角度值可根据经验确定，例如在本申请实施例中α可在100°～120°范围内取值，具体设置值可以为110°、115°或者120°。
在具体设置避让槽41的弧形内壁时，参考图3所示，第二挡壁46的内侧壁包括第一弧形面461和第二弧形面462，其中，第一弧形面461与第二挡壁46的下端面连接，第二弧形面462与避让槽41的底壁连接，并且为了使第一弧形面461和第二弧形面462之间圆滑过渡连接，第一弧形面461朝向避让槽41的内部凸出，第二弧形面462背向避让槽41的内部凸出，从而可以使填充胶在避让槽41内取得较佳的填充效果。在一个具体的实施例中，第一弧形面461的半径R 1大于第二弧形面462的半径R 2，若以基板10上贴装感光芯片20的一侧所在平面为预设的第一平面，在该实施例中，第一弧形面461在第一平面的投影的宽度L 5大于第二弧形面462在第一平面的投影的宽度L 6，该方案可以使得避让槽41的形状与金属线的形状更加契合，从而使填充胶更好地包裹金属线。
其中，第一弧形面461的半径R 1与第二弧形面462的半径R 2的具体值可自定义设置，在本申请实施例中第一弧形面461的半径R 1可在0.4mm～0.6mm范围内取值，具体设置值可以为0.45mm、0.5mm或者0.55mm；第二弧形面462的半径R 2可在0.2mm～0.3mm范围内取值，具体设置值可以为0.25mm或者0.3mm；第一弧形面461在第一平面的投影的宽度、第二弧形面462在第一平面的投影的宽度指其在X方向或者Y方向的宽度，并且在本申请实施例中，第一弧形面461在第一平面的投影的宽度L 5可在0.15mm～0.25mm范围内取值，具体设置值可以为0.18mm、0.2mm或者0.22mm。
如图4所示，第二挡壁46的内侧壁具有第一端a和第二端b，其中，第一端a为第二挡壁46的内侧壁与第二挡壁46的下端面的连接端，第二端b为第二挡壁46的内侧壁与避让槽41的底壁的连接端，在一个具体的实施方案中，第一端a和第二端b之间的连线与第二挡壁46的下端面形成的夹角β为钝角，同理，该方案也是为了使避让槽41的形状与金属线的形状能够更加契合，β的具体角度值也可根据经验确定，在本申请实施例中β可在120°～150°范围内取值，具体设置值可以为125°、135°或者145°。
此外，第二挡壁46的内侧壁的第二端b实际上也构成避让槽41的底壁的其中一端，该端在第一平面的投影与感光芯片20的边缘的距离为A 1，避让槽41的底壁的另一端c在第一平面的投影与感光芯片20的边缘的距离为A 2，在本申请实施例中，A 1与A 2相等且均等于感光芯片20上所设置的焊盘23至感光芯片20的边缘的距离。
请参考图2所示，框架40上还具有透光孔42，透光孔42的位置与感光芯片20的感光区21的位置相对，以使光线能够经过透光孔42照射到感光芯片20的感光区21；同时，为了滤除光线中的红外线，在框架40上与透光孔42相对的位置还设置有滤光片50，滤光 片50可通过粘接的方式固定于框架40上。
在本申请实施例中，滤光片50既可以设置于框架40背离感光芯片20的一侧，也可以设置于框架40朝向感光芯片20的一侧，具体实施时，根据滤光片50设置位置的不同，框架40可以具有不同的结构。例如，当滤光片50设置于框架40背离感光芯片20的一侧时，如图2所示，该实施例中框架40背离感光芯片20的一侧具有沉孔43，沉孔43与透光孔42形成了一个环形台阶结构，滤光片50就固定于该环形台阶结构上，相比于将滤光片50直接设置于框架40背离感光芯片20的一侧表面，该方案将滤光片50内嵌在了框架40结构中，拉近了滤光片50与感光芯片20之间的距离，从而可以降低感光芯片封装结构的高度，进而达到降低摄像头模组的高度的目的。在设置沉孔43时，结合图2和图6所示，沉孔43的深度H不小于滤光片50的厚度，这样，当滤光片50固定于环形台阶结构上时，滤光片50不会超出框架40背离感光芯片20的一侧表面，从而可以进一步降低摄像头模组的高度。
请参考图9所示，当滤光片50设置于框架40朝向感光芯片20的一侧时，可以进一步降低该框架40的高度；并且，请结合图11以及图14所示，在框架40背离感光芯片20的一侧安装音圈马达70时，框架40上起到支撑作用的区域实际上是透光孔42周围的区域，因此只需保证音圈马达在X方向或Y方向的尺寸大于透光孔42的直径即可，这样就可以在框架40上安装尺寸更小的音圈马达，从而有利于进一步减小摄像头模组在X方向及Y方向的尺寸，进而实现移动终端的小型化及超薄化设计。需要说明的是，上述第一挡壁45的下端面的宽度、第二挡壁46的下端面的宽度同样是指该结构其沿X方向或者Y方向的宽度。
此外，在本申请实施例中，当滤光片50设置于框架40朝向感光芯片20的一侧时，参考图9和图10所示，滤光片50的侧壁可用于形成第一挡壁45的内侧壁，因此该方案无需在框架40上另外设置第一挡壁的结构，这样在减小了框架40的厚度的前提下，还可以简化框架40的结构，降低框架40的制作工艺难度。
上述实施例中，在框架40上开设避让槽41的侧边，通过填充于避让槽41内的填充胶，在包裹金属线30的同时将框架40与感光芯片20和基板10进行粘接，从而将感光芯片20在该侧密封，并且固化后的填充胶60还能够支撑框架40，对比图1和图5可以看出，该填充于避让槽41内的填充胶60既能够实现现有技术中的侧壁的作用，又无需在基板10的该侧预留安装侧壁的空间，因此可以大大缩小基板10在X方向或Y方向的尺寸，进而实现减小摄像头模组的尺寸的目的；此外，避让槽41的弧形内壁可以防止在填充填充胶60时产生气泡，使填充胶60在避让槽41内的填充效果更佳，避免组装时填充胶60过量溢出，提高了固化后的填充胶60的支撑效果，从而提高了感光芯片封装结构的结构稳定性。
参考图5或图11所示，当基板10上避开感光芯片20的区域设置有表面贴装器件12时，框架40还设置有凸缘47，通过凸缘47可以覆盖表面贴装器件12，并且凸缘47是框架40上的延伸结构，无需单独对其进行支撑，因此该方案在不增加基板10的尺寸的前提下，起到了对表面贴装器件12的保护作用。
参考图8所示，在组装感光芯片封装结构时，首先将滤光片50固定于框架40上，调整框架40的方位使其开设避让槽41的一侧朝上设置；在避让槽41内点胶，点胶后翻转框架40并将其置于自动贴片机的上料托盘内，然后利用自动贴片机进行定位后将框架40 贴装于已完成打线的基板10上，使避让槽41覆盖设置金属线30的区域，避让槽41内的填充胶60包裹金属线30并将框架40与感光芯片20的非感光区22和基板10粘接。为了降低感光芯片封装结构的组装难度，同时改善填充胶60的受力情况，如图6所示，本申请实施例中框架40还包括支撑柱48，支撑柱48的两端分别与基板10和框架40连接，从而对框架40进行支撑。在将框架40贴装于基板10上时，通过支撑柱48可以控制框架40的贴装高度，即实现了对框架40在组装高度上的定位，从而降低了贴装难度，同时，支撑柱48还可以起到支撑框架40的作用，避免框架40以及其上所设置的其它部件的重量全部施加在填充胶60上，造成胶水老化引发可靠性问题。具体实施时，可将支撑柱48设置于框架40的凸缘47上，并且当支撑柱48在凸缘47上均匀布置时，可以进一步降低贴装难度。可以理解的，图6所示实施例为滤光片50设置于框架40背向感光芯片20的一侧的情况，参考图12所示，当滤光片50设置于框架40朝向感光芯片20的一侧时，同样可以在凸缘47上设置支撑柱48用以支撑框架40并降低贴装难度，此处不再赘述。
本申请实施例还提供了一种摄像头模组，包括上述任一项的感光芯片封装结构，除此之外，如图8或图13所示，该摄像头模组还包括音圈马达70以及摄像头80，音圈马达70和摄像头80依次设置于框架40远离基板10的一侧。通过采用前述感光芯片封装结构，该摄像头模组的尺寸可以大大减小。
本申请实施例还提供了一种移动终端，包括前述的摄像头模组，该移动终端可以为手机、平面电脑、笔记本电脑等常见的移动终端。在摄像头模组的尺寸得以减小的情况下，该移动终端较易实现小型化及超薄化设计。
以上，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以权利要求的保护范围为准。

Claims (17)

  1. 一种感光芯片封装结构，包括基板、贴装于所述基板的感光芯片，所述感光芯片背离所述基板的一侧具有感光区以及围绕感光区的非感光区，所述感光芯片与所述基板通过金属线电连接；其特征在于，还包括：
    框架，设置于所述感光芯片背离所述基板的一侧，所述框架朝向所述基板的一侧开设有用于避让所述金属线的避让槽，所述避让槽沿所述框架的侧边延伸，且所述避让槽的内壁为弧形内壁；
    填充胶，填充于所述避让槽内，用于包裹所述金属线并将所述框架与所述感光芯片的非感光区和所述基板粘接。
  2. 如权利要求1所述的感光芯片封装结构，其特征在于，所述框架上对应所述感光芯片的感光区具有透光孔；
    所述感光芯片封装结构还包括滤光片，所述滤光片设置于所述框架上与所述透光孔相对的位置。
  3. 如权利要求2所述的感光芯片封装结构，其特征在于，所述滤光片固定于所述框架朝向所述感光芯片的一侧。
  4. 如权利要求2所述的感光芯片封装结构，其特征在于，所述框架背离所述感光芯片的一侧具有沉孔，所述沉孔与所述透光孔形成环形台阶结构，所述滤光片固定于所述环形台阶结构上。
  5. 如权利要求4所述的感光芯片封装结构，其特征在于，所述沉孔的深度不小于所述滤光片的厚度。
  6. 如权利要求1至5任一项所述的感光芯片封装结构，其特征在于，所述框架具有设置于所述避让槽的两侧的第一挡壁和第二挡壁，所述第一挡壁位于所述避让槽靠近所述感光区的一侧，所述第一挡壁的下端面与所述感光芯片间隔设置，所述第二挡壁的下端面与所述基板间隔设置。
  7. 如权利要求6所述的感光芯片封装结构，其特征在于，当所述感光芯片封装结构还包括固定于所述框架朝向所述感光芯片的一侧的滤光片时，所述滤光片的侧壁用于形成所述第一挡壁的内侧壁。
  8. 如权利要求6所述的感光芯片封装结构，其特征在于，所述第一挡壁的内侧壁与所述第一挡壁的下端面形成的夹角为钝角。
  9. 如权利要求6至8任一项所述的感光芯片封装结构，其特征在于，所述第二挡壁的内侧壁包括相连接的第一弧形面和第二弧形面，其中，所述第一弧形面与所述第二挡壁的下端面连接，且所述第一弧形面朝向所述避让槽的内部凸出，所述第二弧形面背向所述避让槽的内部凸出。
  10. 如权利要求9所述的感光芯片封装结构，其特征在于，所述第一弧形面的半径大于所述第二弧形面的半径，所述第一弧形面在第一平面的投影的宽度大于所述第二弧形面在第一平面的投影的宽度，其中，所述第一平面为所述基板上贴装感光芯片的一侧所在平面。
  11. 如权利要求9所述的感光芯片封装结构，其特征在于，所述第二挡壁的内侧壁的第一端和其第二端之间的连线与所述第二挡壁的下端面形成的夹角为钝角，其中，所述第 二挡壁的内侧壁的第一端为第二挡壁的内侧壁与所述第二挡壁的下端面的连接端，所述第二挡壁的内侧壁的第二端为第二挡壁的内侧壁与所述避让槽的底壁的连接端。
  12. 如权利要求1至11任一项所述的感光芯片封装结构，其特征在于，所述避让槽沿所述框架的单边、双边或三边设置，且所述框架未设置避让槽的一侧具有与所述基板连接的侧壁，所述填充胶与侧壁共同封装所述感光芯片的感光区。
  13. 如权利要求1至11任一项所述的感光芯片封装结构，其特征在于，所述避让槽沿所述框架的四边呈环形设置，所述填充胶封装所述感光芯片的感光区。
  14. 如权利要求1至13任一项所述的感光芯片封装结构，其特征在于，所述基板上避开所述感光芯片的区域设置有表面贴装器件，所述框架设置有覆盖所述表面贴装器件的凸缘。
  15. 如权利要求14所述的感光芯片封装结构，其特征在于，所述框架还包括支撑柱，所述支撑柱的一端与所述基板连接，另一端与所述框架连接。
  16. 一种摄像头模组，其特征在于，包括如权利要求1～15任一项所述的感光芯片封装结构。
  17. 一种移动终端，其特征在于，包括如权利要求16所述的摄像头模组。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111415954A (zh) * 2020-04-26 2020-07-14 上海微阱电子科技有限公司 一种背照式图像传感器芯片的封装结构及方法
CN111739901A (zh) * 2020-05-18 2020-10-02 甬矽电子(宁波)股份有限公司 传感器封装结构及封装方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11869908B2 (en) * 2018-08-27 2024-01-09 Honor Device Co., Ltd. Photosensitive chip package structure, camera module, and mobile terminal
WO2024051423A1 (zh) * 2022-09-05 2024-03-14 广东越海集成技术有限公司 芯片及裸芯片的封装方法
CN115547195B (zh) * 2022-09-21 2024-07-26 厦门天马显示科技有限公司 一种显示面板、显示面板的制造方法及显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040113286A1 (en) * 2002-12-16 2004-06-17 Jackson Hsieh Image sensor package without a frame layer
CN101179086A (zh) * 2006-11-08 2008-05-14 欣相光电股份有限公司 镶嵌式影像感测芯片的封装结构
CN102117817A (zh) * 2010-01-05 2011-07-06 昆山鸿荣电子有限公司 影像感测芯片的超薄式封装结构及其封装方法
US20110175182A1 (en) * 2010-01-15 2011-07-21 Yu-Hsiang Chen Optical Seneor Package Structure And Manufactueing Method Thereof
CN205883378U (zh) * 2016-03-28 2017-01-11 宁波舜宇光电信息有限公司 摄像模组的感光组件
CN207706274U (zh) * 2017-11-10 2018-08-07 格科微电子（上海）有限公司 摄像头模组

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5375968B2 (ja) 2009-11-05 2013-12-25 株式会社島津製作所 放射線検出器
CN107301988B (zh) 2017-05-27 2023-06-13 格科微电子（上海）有限公司 摄像头模组及其装配方法
US11869908B2 (en) * 2018-08-27 2024-01-09 Honor Device Co., Ltd. Photosensitive chip package structure, camera module, and mobile terminal

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040113286A1 (en) * 2002-12-16 2004-06-17 Jackson Hsieh Image sensor package without a frame layer
CN101179086A (zh) * 2006-11-08 2008-05-14 欣相光电股份有限公司 镶嵌式影像感测芯片的封装结构
CN102117817A (zh) * 2010-01-05 2011-07-06 昆山鸿荣电子有限公司 影像感测芯片的超薄式封装结构及其封装方法
US20110175182A1 (en) * 2010-01-15 2011-07-21 Yu-Hsiang Chen Optical Seneor Package Structure And Manufactueing Method Thereof
CN205883378U (zh) * 2016-03-28 2017-01-11 宁波舜宇光电信息有限公司 摄像模组的感光组件
CN207706274U (zh) * 2017-11-10 2018-08-07 格科微电子（上海）有限公司 摄像头模组

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3813115A4 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111415954A (zh) * 2020-04-26 2020-07-14 上海微阱电子科技有限公司 一种背照式图像传感器芯片的封装结构及方法
CN111415954B (zh) * 2020-04-26 2023-05-23 上海微阱电子科技有限公司 一种背照式图像传感器芯片的封装结构及方法
CN111739901A (zh) * 2020-05-18 2020-10-02 甬矽电子(宁波)股份有限公司 传感器封装结构及封装方法

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