CN112930598A - 一种感光芯片封装结构、摄像头模组及移动终端 - Google Patents
一种感光芯片封装结构、摄像头模组及移动终端 Download PDFInfo
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- CN112930598A CN112930598A CN201880094335.0A CN201880094335A CN112930598A CN 112930598 A CN112930598 A CN 112930598A CN 201880094335 A CN201880094335 A CN 201880094335A CN 112930598 A CN112930598 A CN 112930598A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000003292 glue Substances 0.000 claims abstract description 19
- 230000000903 blocking effect Effects 0.000 claims description 53
- 230000003287 optical effect Effects 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- 206010070834 Sensitisation Diseases 0.000 abstract description 9
- 230000008313 sensitization Effects 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 13
- 230000008093 supporting effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Abstract
本申请公开了一种感光芯片封装结构、摄像头模组及移动终端，以实现减小摄像头模组的尺寸的目的。该包括基板、贴装于基板的感光芯片，感光芯片背离基板的一侧具有感光区以及围绕感光区的非感光区，感光芯片与基板通过金属线电连接；感光芯片封装结构还包括：框架，设置于感光芯片背离基板的一侧，框架朝向基板的一侧开设有用于避让金属线的避让槽，避让槽沿框架的侧边延伸，且避让槽的内壁为弧形内壁；填充胶，填充于避让槽内，用于包裹金属线并将框架与感光芯片的非感光区和基板粘接。
Description
PCT国内申请，说明书已公开。
Claims (17)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/102540 WO2020041942A1 (zh) | 2018-08-27 | 2018-08-27 | 一种感光芯片封装结构、摄像头模组及移动终端 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112930598A true CN112930598A (zh) | 2021-06-08 |
| CN112930598B CN112930598B (zh) | 2022-06-17 |
Family
ID=69642816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880094335.0A Active CN112930598B (zh) | 2018-08-27 | 2018-08-27 | 一种感光芯片封装结构、摄像头模组及移动终端 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11869908B2 (zh) |
| EP (1) | EP3813115B1 (zh) |
| CN (1) | CN112930598B (zh) |
| WO (1) | WO2020041942A1 (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115547195A (zh) * | 2022-09-21 | 2022-12-30 | 厦门天马显示科技有限公司 | 一种显示面板、显示面板的制造方法及显示装置 |
| WO2024051423A1 (zh) * | 2022-09-05 | 2024-03-14 | 广东越海集成技术有限公司 | 芯片及裸芯片的封装方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11869908B2 (en) * | 2018-08-27 | 2024-01-09 | Honor Device Co., Ltd. | Photosensitive chip package structure, camera module, and mobile terminal |
| CN111415954B (zh) * | 2020-04-26 | 2023-05-23 | 上海微阱电子科技有限公司 | 一种背照式图像传感器芯片的封装结构及方法 |
| CN111584529A (zh) * | 2020-05-18 | 2020-08-25 | 甬矽电子(宁波)股份有限公司 | 传感器封装结构及封装方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040113286A1 (en) * | 2002-12-16 | 2004-06-17 | Jackson Hsieh | Image sensor package without a frame layer |
| WO2011055508A1 (ja) * | 2009-11-05 | 2011-05-12 | 株式会社島津製作所 | 放射線検出器 |
| CN102117817A (zh) * | 2010-01-05 | 2011-07-06 | 昆山鸿荣电子有限公司 | 影像感测芯片的超薄式封装结构及其封装方法 |
| CN107301988A (zh) * | 2017-05-27 | 2017-10-27 | 格科微电子（上海）有限公司 | 摄像头模组及其装配方法 |
| CN207706274U (zh) * | 2017-11-10 | 2018-08-07 | 格科微电子（上海）有限公司 | 摄像头模组 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101179086A (zh) | 2006-11-08 | 2008-05-14 | 欣相光电股份有限公司 | 镶嵌式影像感测芯片的封装结构 |
| TWM382505U (en) | 2010-01-15 | 2010-06-11 | Cheng Uei Prec Ind Co Ltd | Video device |
| CN206596090U (zh) | 2016-03-28 | 2017-10-27 | 宁波舜宇光电信息有限公司 | 电子设备和摄像模组 |
| US11869908B2 (en) * | 2018-08-27 | 2024-01-09 | Honor Device Co., Ltd. | Photosensitive chip package structure, camera module, and mobile terminal |
-
2018
- 2018-08-27 US US17/266,057 patent/US11869908B2/en active Active
- 2018-08-27 WO PCT/CN2018/102540 patent/WO2020041942A1/zh unknown
- 2018-08-27 CN CN201880094335.0A patent/CN112930598B/zh active Active
- 2018-08-27 EP EP18931620.1A patent/EP3813115B1/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040113286A1 (en) * | 2002-12-16 | 2004-06-17 | Jackson Hsieh | Image sensor package without a frame layer |
| WO2011055508A1 (ja) * | 2009-11-05 | 2011-05-12 | 株式会社島津製作所 | 放射線検出器 |
| CN102117817A (zh) * | 2010-01-05 | 2011-07-06 | 昆山鸿荣电子有限公司 | 影像感测芯片的超薄式封装结构及其封装方法 |
| CN107301988A (zh) * | 2017-05-27 | 2017-10-27 | 格科微电子（上海）有限公司 | 摄像头模组及其装配方法 |
| CN207706274U (zh) * | 2017-11-10 | 2018-08-07 | 格科微电子（上海）有限公司 | 摄像头模组 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024051423A1 (zh) * | 2022-09-05 | 2024-03-14 | 广东越海集成技术有限公司 | 芯片及裸芯片的封装方法 |
| CN115547195A (zh) * | 2022-09-21 | 2022-12-30 | 厦门天马显示科技有限公司 | 一种显示面板、显示面板的制造方法及显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020041942A1 (zh) | 2020-03-05 |
| EP3813115A1 (en) | 2021-04-28 |
| US20210313366A1 (en) | 2021-10-07 |
| EP3813115A4 (en) | 2021-06-30 |
| EP3813115B1 (en) | 2022-06-08 |
| CN112930598B (zh) | 2022-06-17 |
| US11869908B2 (en) | 2024-01-09 |
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