WO2020039709A1 - Dispositif d'affichage et module de circuit intégré - Google Patents

Dispositif d'affichage et module de circuit intégré Download PDF

Info

Publication number
WO2020039709A1
WO2020039709A1 PCT/JP2019/023454 JP2019023454W WO2020039709A1 WO 2020039709 A1 WO2020039709 A1 WO 2020039709A1 JP 2019023454 W JP2019023454 W JP 2019023454W WO 2020039709 A1 WO2020039709 A1 WO 2020039709A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminal group
glass substrate
integrated circuit
display device
flexible substrate
Prior art date
Application number
PCT/JP2019/023454
Other languages
English (en)
Japanese (ja)
Inventor
英明 阿部
日向　章二
前田　謹一
鈴木　由幸
真弘 田口
Original Assignee
株式会社ジャパンディスプレイ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Publication of WO2020039709A1 publication Critical patent/WO2020039709A1/fr

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to a display device and an integrated circuit module.
  • Patent Document 1 discloses connecting a flexible substrate (Flexible Printed Circuit (FPC) Board) on which a driver IC glass chip is mounted to a liquid crystal display.
  • the flexible substrate is connected to an end of the liquid crystal display, and is bent at its side toward the back surface.
  • the flexible substrate is provided so that the integrated circuit chip is located inside (the side of the liquid crystal display). For this reason, it is necessary to provide a gap between the integrated circuit chip and the liquid crystal display so that the chip does not come into contact with the liquid crystal display.
  • the base substrate of the flexible substrate needs to be made of a material suitable for bonding an integrated circuit chip.
  • a material suitable for bonding an integrated circuit chip has a large elastic force, so that it is difficult to make the flexible substrate bend tightly, and it is also difficult to bend locally. For this reason, the flexible substrate becomes large around the display and the size of the module cannot be reduced (narrow frame).
  • the present invention aims to make a display device smaller (narrower frame).
  • the display device has a display surface on which an image is displayed and a display panel having a back surface opposite to the display surface, and a first surface and a second surface opposite to the first surface, A first glass substrate that overlaps the display panel such that a first surface faces the back surface and has a wiring pattern on the second surface; and an integrated circuit chip mounted on the second surface of the first glass substrate.
  • the integrated circuit chip is mounted on the first glass substrate, the occurrence of warpage can be suppressed by the hardness of the first glass substrate.
  • a material having a small elastic force can be used in addition to a material suitable for mounting the integrated circuit chip. In that case, the flexible substrate can be bent tightly, so that the display device can be reduced in size (narrow frame).
  • FIG. 2 is a plan view of the display device in which the first flexible substrate shown in FIG. 1 is developed.
  • FIG. 3 is a diagram illustrating a circuit of a display panel.
  • FIG. 4 is a diagram illustrating a circuit configuration of a sub-pixel illustrated in FIG. 3.
  • FIG. 5 is a sectional view taken along line VV of the display panel shown in FIG. 2. It is a top view of a mounting glass substrate.
  • FIG. 3 is a perspective view of a first flexible substrate shown in FIG. 2.
  • FIG. 8 is an enlarged sectional view taken along line VIII-VIII of the integrated circuit module shown in FIG. 2. It is a figure showing the end of a display panel.
  • FIG. 1 is a plan view of the display device in which the first flexible substrate shown in FIG. 1 is developed.
  • FIG. 3 is a diagram illustrating a circuit of a display panel.
  • FIG. 4 is a diagram illustrating a circuit configuration of a sub-pixel illustrated in FIG. 3.
  • FIG. 5 is
  • FIG. 3 is a perspective view of a second flexible substrate shown in FIG. 2.
  • FIG. 4 is a diagram illustrating a method of manufacturing the integrated circuit module according to the embodiment.
  • FIG. 4 is a diagram illustrating a method of manufacturing the integrated circuit module according to the embodiment.
  • FIG. 4 is a diagram illustrating a method of manufacturing the integrated circuit module according to the embodiment.
  • FIG. 4 is a diagram illustrating a method of manufacturing the integrated circuit module according to the embodiment.
  • FIG. 11 is a diagram illustrating a method of manufacturing the integrated circuit module according to Modification Example 1 of the embodiment.
  • FIG. 11 is a diagram illustrating a method of manufacturing the integrated circuit module according to Modification Example 1 of the embodiment.
  • FIG. 1 is a diagram illustrating a method of manufacturing the integrated circuit module according to Modification Example 1 of the embodiment.
  • FIG. 11 is a diagram illustrating a method of manufacturing the integrated circuit module according to Modification Example 1 of the embodiment.
  • FIG. 11 is a diagram illustrating a method of manufacturing the integrated circuit module according to Modification 2 of the embodiment.
  • FIG. 15 is a diagram illustrating a method of manufacturing the integrated circuit module according to Modification 3 of the embodiment.
  • ⁇ above '' and ⁇ below '' are only when located directly above or directly below a certain component. Unless otherwise specified, it is intended to include the case where another component is further interposed therebetween.
  • FIG. 1 is a schematic cross-sectional view of the display device according to the embodiment.
  • the display device has a display panel 10, a backlight module 68, and an integrated circuit module 70.
  • the first flexible substrate 98 included in the integrated circuit module 70 is bent.
  • FIG. 2 is a plan view of the display device in which the first flexible substrate 98 shown in FIG. 1 is developed.
  • FIG. 3 is a diagram illustrating a circuit of the display panel 10.
  • the display panel 10 is a liquid crystal display panel in the present embodiment.
  • the display panel 10 includes a display area DA for displaying an image, and a peripheral area PA outside the display area DA.
  • the peripheral area PA surrounds the display area DA and has a frame shape.
  • the display panel 10 includes a plurality of sub-pixels SP in the display area DA.
  • the plurality of sub-pixels SP are arranged in a matrix in the first direction X and the second direction Y. In the present embodiment, one pixel is constituted by three sub-pixels SP adjacent in the first direction X.
  • the display panel 10 includes a plurality of scanning lines 12 and a plurality of signal lines 14.
  • the scanning lines 12 extend in the first direction X and are arranged at intervals in the second direction Y.
  • the signal lines 14 extend in the second direction Y and are arranged at intervals in the first direction X. Note that the scanning lines 12 and the signal lines 14 do not necessarily extend linearly, and some of them may be bent.
  • the scanning line 12 is connected to a scanning drive circuit GD.
  • the signal line 14 is connected to the signal drive circuit SD.
  • FIG. 4 is a diagram showing a circuit configuration of the sub-pixel SP shown in FIG.
  • the sub-pixel SP includes a thin film transistor 16 arranged near a position where the scanning line 12 and the signal line 14 intersect.
  • the thin film transistor 16 is electrically connected to the scanning line 12 and the signal line 14.
  • the scanning line 12 is connected to the thin film transistors 16 in each of the sub-pixels SP arranged in the first direction X shown in FIG.
  • the signal line 14 is connected to the thin film transistor 16 in each of the sub-pixels SP arranged in the second direction Y shown in FIG.
  • the thin film transistor 16 is further electrically connected to the pixel electrode 18.
  • the pixel electrode 18 faces the common electrode 20 and drives the liquid crystal layer 22 by an electric field generated between the pixel electrode 18 and the common electrode 20.
  • the common electrode 20 is connected to the common drive circuit CD shown in FIG. 3 and is arranged over a plurality of sub-pixels SP.
  • the storage capacitor CS is formed between the common electrode 20 and the pixel electrode 18, for example.
  • the scanning lines 12 extend in the first direction X and are arranged at intervals in the second direction Y
  • the signal lines 14 extend in the second direction Y and are arranged at intervals in the first direction X.
  • the pixel electrodes 18 are arranged in a region surrounded by the scanning lines 12 and the signal lines 14.
  • FIG. 5 is a cross-sectional view taken along line VV of the display panel 10 shown in FIG.
  • the display panel 10 has a TFT glass substrate 24.
  • the circuit layer 26 is laminated on the TFT glass substrate 24.
  • the circuit layer 26 includes the thin film transistor 16.
  • the thin film transistor 16 includes a semiconductor layer 28, a gate electrode 30, and a first insulating film 32 including a portion interposed therebetween as a gate insulating film.
  • a second insulating film is stacked on the first insulating film 32 so as to cover the gate electrode 30.
  • a drain electrode 38 is provided so as to be connected to the semiconductor layer 28 via a contact hole 36 penetrating the second insulating film 34.
  • a third insulating film 40 is stacked on the second insulating film 34 so as to cover the drain electrode 38.
  • a light shielding film 42 made of, for example, metal is provided on the TFT glass substrate 24 in order to prevent malfunction due to light.
  • a base insulating film 44 is stacked on the TFT glass substrate 24 so as to cover the light shielding film 42, and the semiconductor layer 28 is provided on the base insulating film 44.
  • the circuit layer 26 has the signal line 14 (FIG. 3) formed in the same layer as the drain electrode 38, and the scanning line 12 (FIG. 3) formed in the same layer as the gate electrode 30.
  • the plurality of signal lines 14 are arranged at intervals in the first direction X, and are arranged between the plurality of pixel electrodes 18 in the display area DA.
  • the source electrode (not shown) of the thin film transistor 16 is formed integrally with the signal line 14 (see FIG. 4).
  • the common electrode 20 is arranged on the circuit layer 26 so as to be stacked on the third insulating film 40.
  • the common electrode 20 is formed over a plurality of sub-pixels SP.
  • a fourth insulating film 46 is stacked on the third insulating film 40 so as to cover the common electrode 20.
  • the plurality of pixel electrodes 18 are stacked on the fourth insulating film 46.
  • the pixel electrode 18 has a contact portion 48 penetrating through the fourth insulating film 46 and connecting to the drain electrode 38.
  • the first alignment film 50 is stacked so as to cover the plurality of pixel electrodes 18.
  • the pixel electrode 18 is formed above the common electrode 20 and has a plurality of slits (not shown).
  • the display panel 10 has the opposite glass substrate 52.
  • the opposite glass substrate 52 is provided with a black matrix 54 and a color filter layer 56, and is covered with an overcoat layer 58 on the lower side.
  • the second alignment film 60 is stacked so as to cover the overcoat layer 58.
  • the black matrix 54 is disposed between the counter glass substrate 52 and the color filter layer 56, but may be disposed between the color filter layer 56 and the overcoat layer 58. Alternatively, it may be disposed between the overcoat layer 58 and the second alignment film 60.
  • the liquid crystal layer 22 is interposed between the first alignment film 50 and the second alignment film 60.
  • the cell gap is held by the plurality of spacers 62.
  • the plurality of spacers 62 are located between the first alignment film 50 and the overcoat layer 58.
  • a spacer 62 is provided on the overcoat layer 58, and a second alignment film 60 is formed so as to cover the overcoat layer 58 and the spacer 62.
  • the first alignment film 50 and the spacer 62 may be in contact with each other, or the second alignment film 60 may be interposed between them.
  • a lateral electric field driving method in which the common electrode 20 and the pixel electrode 18 are located on the TFT glass substrate 24 side of the display panel 10 is adopted.
  • the display panel 10 has a display surface 64 on which an image is displayed and a back surface 66 opposite thereto.
  • the display device has a backlight module 68 on the back surface 66 side of the display panel 10.
  • the backlight module 68 includes a light source such as an LED (Light Emitting Diode), a light guide plate, an optical film, a diffusion plate, a reflection plate, and a frame.
  • the point light source is converted into a surface light source by the light guide plate.
  • the integrated circuit module 70 has a mounting glass substrate 72.
  • the mounting glass substrate 72 has a first surface 74 and a second surface 76 opposite thereto.
  • the mounting glass substrate 72 overlaps the display panel 10 such that the first surface 74 faces the back surface 66 of the display panel 10.
  • the mounting glass substrate 72 is below the backlight module 68. Even though the mounting glass substrate 72 is indirectly fixed to the display panel 10, it is not directly fixed.
  • FIG. 6 is a plan view of the mounting glass substrate 72.
  • the mounting glass substrate 72 has a first end 78 and a second end 80 on both sides in the length direction L.
  • the mounting glass substrate 72 has a wiring pattern 82 on the second surface 76.
  • the wiring pattern 82 includes a first terminal group 84.
  • the first terminal group 84 is arranged at the first end portion 78 in the width direction W orthogonal to the length direction L.
  • the first terminal group 84 extends radially along a plurality of straight lines intersecting each other at one point P1. For example, set the reference line L R to the center in the width direction W of the mounting glass substrate 72, on both sides of the reference line L R, a first terminal group 84 are arranged.
  • One point P1 is on the side of the first end portion 78 and outside the mounting glass substrate 72. Therefore, the first terminal group 84 is inclined outwardly so as to approach each other. As a modification, the first terminal group 84 may be inclined outward and away from each other. One point in that case is on the side of the second end portion 80 and outside the mounting glass substrate 72.
  • the first terminal group 84 is arranged so that the interval between adjacent terminals is equal. On the other hand, the first terminal group 84 is unequal in width orthogonal to the length (the length in the direction along the plurality of straight lines). Width is wider farther from the reference line L R. Therefore, the first terminal groups 84 are arranged at an uneven pitch. Pitch is wider farther from the reference line L R. The maximum pitch is 1.1 to 2 times the minimum pitch.
  • the wiring pattern 82 includes a second terminal group 86.
  • the second terminal group 86 is arranged at the second end 80 in the width direction W.
  • the second terminal groups 86 extend parallel to each other along the length direction L.
  • the second terminal groups 86 are arranged at an equal pitch.
  • the second terminal group 86 may extend radially along a plurality of straight lines that cross each other at one point.
  • the wiring pattern 82 includes a first wiring group 88.
  • the first wiring group 88 extends from the first terminal group 84 to the mounting region MR.
  • the wiring pattern 82 includes a second wiring group 90.
  • the second wiring group 90 extends from the second terminal group 86 to the mounting region MR.
  • the mounting glass substrate 72 has first alignment marks 92 (for example, negative marks) on both sides of the first terminal group 84 in the width direction W.
  • the first alignment mark 92 sandwiches the first terminal group 84.
  • the first alignment mark 92 is used for positioning the mounting glass substrate 72 and the first flexible substrate 98 (FIG. 2).
  • the outermost first terminal 84 is branched so as to draw a scale line, which is also used for alignment.
  • the mounting glass substrate 72 has second alignment marks 94 on both sides of the second terminal group 86 in the width direction W.
  • the second alignment mark 94 sandwiches the second terminal group 86.
  • the second alignment mark 94 is a recognition mark for visually checking the position of the mounting glass substrate 72.
  • the mounting glass substrate 72 is thinner than the TFT glass substrate 24 of the display panel 10 (FIG. 5). Note that the same technical effects as those of the embodiment can be achieved by using a PCB (Printed Circuit Board) having a fine pitch wiring pattern instead of the mounting glass substrate 72.
  • PCB Printed Circuit Board
  • the mounting glass substrate 72 has a mounting region MR between the first end 78 and the second end 80.
  • the integrated circuit chip 96 shown in FIG. 2 is mounted on the mounting area MR.
  • the integrated circuit chip 96 is electrically connected to the first wiring group 88 and the second wiring group 90.
  • the glass constituting the mounting glass substrate 72 has higher hardness than resin. Therefore, the mounting glass substrate 72 is suitable for mounting the integrated circuit chip 96 even if it is thin. For example, even if the integrated circuit chip 96 is warped, the mounting glass substrate 72 can resist the stress. In addition, if there is a technology for mounting the integrated circuit chip 96 on a glass substrate, a technology for mounting the integrated circuit chip 96 on a flexible substrate is not required.
  • the mounting region MR is on the second surface 76 of the mounting glass substrate 72 (the side opposite to the display panel 10 and the backlight module 68), as shown in FIG. It does not intervene between the display panels 10 (backlight module 68). Therefore, the mounting glass substrate 72 can be brought closer to the display panel 10 (the backlight module 68), and the display device can be reduced in size (narrow frame).
  • the integrated circuit module 70 has a first flexible substrate 98.
  • the first flexible substrate 98 is electrically connected to the display panel 10 and the mounting glass substrate 72 and is bent. Since the first flexible substrate 98 does not have the integrated circuit chip 96 mounted thereon, it is possible to select a material (resin) that does not satisfy the requirement therefor. Can be done. Thus, the display device can be reduced in size (narrow frame).
  • FIG. 7 is a perspective view of the first flexible substrate 98 shown in FIG.
  • the first flexible substrate 98 has a third end 100 and a fourth end 102 on both sides in the length direction L.
  • the first flexible substrate 98 has a first wiring pattern 104.
  • the first wiring pattern 104 includes a third terminal group 106.
  • the third terminal group 106 is arranged in the width direction W orthogonal to the length direction L at the third end 100.
  • the third terminal group 106 extends radially along a plurality of straight lines intersecting each other at one point P3. For example, it sets the reference line L R is the center in the width direction W of the first flexible substrate 98, on both sides of the reference line L R, the third terminal group 106 are arranged.
  • One point P3 is on the side of the fourth end 102 opposite to the third end 100 where the third terminal group 106 is provided, and is outside the first flexible substrate 98. Therefore, the third terminal group 106 is inclined outwardly away from each other. This shape is symmetric with the first terminal group 84 (FIG. 6) described above. As a modification, similarly to the first terminal group 84, the third terminal group 106 may be inclined so as to approach each other outward. One point in that case is on the third end 100 side and outside the first flexible substrate 98.
  • the third terminal group 106 is uniform in width orthogonal to the length (the direction along the plurality of straight lines). On the other hand, the third terminal groups 106 are arranged such that the intervals between adjacent terminals are unequal. Interval is wider farther from the reference line L R. Therefore, the third terminal groups 106 are arranged at an uneven pitch. Pitch is wider farther from the reference line L R. The maximum pitch is 1.1 to 2 times the minimum pitch.
  • the first wiring pattern 104 includes the fourth terminal group 108.
  • the fourth terminal group 108 is arranged in the width direction W at the fourth end 102.
  • the fourth terminal group 108 extends radially along a plurality of straight lines intersecting each other at one point P4.
  • the details of the third terminal group 106 correspond to the fourth terminal group 108.
  • the first wiring pattern 104 includes a third wiring group 110.
  • the third wiring group 110 connects the third terminal group 106 and the fourth terminal group 108, respectively.
  • the first flexible substrate 98 has third alignment marks 112 (for example, positive marks) on both sides of the third terminal group 106 in the width direction W.
  • third alignment marks 112 for example, positive marks
  • the outermost third terminal is branched so as to draw a scale line, which is also used for alignment.
  • the third alignment mark 112 sandwiches the third terminal group 106.
  • the first flexible substrate 98 has fourth alignment marks 114 (for example, positive marks) on both sides of the fourth terminal group 108 in the width direction W.
  • the outermost fourth terminal 108 is branched so as to draw a scale line, which is also used for alignment.
  • the fourth alignment mark 114 sandwiches the fourth terminal group 108.
  • FIG. 8 is an enlarged cross-sectional view taken along line VIII-VIII of the integrated circuit module 70 shown in FIG.
  • the third terminal group 106 of the first flexible substrate 98 is connected to the first terminal group 84 of the mounting glass substrate 72, respectively.
  • an anisotropic conductive film 116 in which fine metal particles are mixed with a thermosetting resin is used.
  • the first terminal group 84 has an equal pitch between the adjacent terminals, but has an uneven pitch because of an uneven width.
  • the third terminal group 106 is uniform in width, but has an uneven pitch because the distance between adjacent terminals is uneven. Any pitch, large enough distance from the reference line L R.
  • the first flexible substrate 98 has a larger coefficient of thermal expansion than the mounting glass substrate 72.
  • the positions of the first terminal group 84 and the third terminal group 106 are shifted.
  • a point P1 (FIG. 6) at which a plurality of straight lines extending along the first terminal group 84 respectively intersects with a point P3 (FIG. 7) at which a plurality of straight lines extending along the third terminal group 106 intersect.
  • the positions of the first terminal group 84 and the third terminal group 106 can be adjusted by relatively moving the first flexible substrate 98 and the mounting glass substrate 72 so that the points P1 and P3 coincide. . That is, the first flexible substrate 98 and the mounting glass substrate 72 may be relatively moved in a direction toward or away from each other.
  • the first flexible substrate 98 is connected to the display panel 10.
  • the details correspond to the description of the connection between the first flexible substrate 98 and the mounting glass substrate 72.
  • FIG. 9 is a diagram showing an end of the display panel 10.
  • the display panel 10 has a TFT glass substrate 24. As shown in FIG. 5, a circuit including the thin film transistor 16 is formed on the TFT glass substrate 24.
  • the display panel 10 (TFT glass substrate 24) has an external terminal group 118.
  • the external terminal group 118 extends radially along a plurality of straight lines intersecting each other at one point Px. The details of the external terminal group 118 correspond to the description of the first terminal group 84 shown in FIG.
  • the display panel 10 has alignment marks 120 (for example, negative marks) on both sides of the external terminal group 118 in the width direction W.
  • the display panel 10 and the first flexible substrate 98 are aligned.
  • the fourth terminal group 108 of the first flexible substrate 98 is electrically connected to the external terminal group 118 of the display panel 10.
  • FIG. 10 is a perspective view of the second flexible substrate 122 shown in FIG.
  • the integrated circuit module 70 has a second flexible substrate 122.
  • the second flexible board 122 has a second wiring pattern 124.
  • the second wiring pattern 124 includes several terminals 124 ⁇ / b> A for electrically connecting to the second terminal group 86 of the mounting glass substrate 72.
  • the second wiring pattern 124 includes some other terminals 124B for connecting to a circuit board (not shown) (for example, PCB: Printed Circuit Board).
  • the second wiring pattern 124 includes some other terminals 124C for connecting to the third flexible substrate 126 (FIG. 2) connected to the backlight module 68.
  • the second flexible substrate 122 is fixed (adhered) to the backlight module 68 (frame (not shown)).
  • the mounting glass substrate 72 is indirectly fixed to the backlight module 68.
  • a backlight module 68 is provided between the display panel 10 and the mounting glass substrate 72 and the second flexible substrate 122.
  • the integrated circuit chip 96 is mounted on the mounting glass substrate 72, it is possible to suppress the occurrence of warpage due to the hardness of the mounting glass substrate 72.
  • a material having a small elastic force can be used for the first flexible substrate 98. In that case, the first flexible substrate 98 can be bent tightly, so that the display device can be reduced in size (narrow frame).
  • FIG. 11 to 14 are views showing a method for manufacturing an integrated circuit module according to the embodiment.
  • multiple mounting of the mounting glass substrate 72 is performed.
  • the wiring patterns 82 corresponding to the plurality of mounting glass substrates 72 are formed on the mother glass substrate 128 (FIG. 11), and the individual mounting glass substrates 72 are cut from the mother glass substrate 128 (FIG. 12).
  • the integrated circuit chip 96 is mounted on the mounting glass substrate 72 (FIG. 13), and the first flexible substrate 98 and the second flexible substrate 122 are connected to the mounting glass substrate 72 (FIG. 14).
  • FIGS. 15 to 17 are views showing a method of manufacturing an integrated circuit module according to Modification 1 of the embodiment.
  • a plurality of integrated circuit chips 96 are mounted on the mother glass substrate 128 so as to be arranged in a plurality of rows and a plurality of columns (FIG. 15).
  • FIG. 16 an assembly 130 in which the mounting glass substrates 72 arranged in a line are integrated is cut out from the mother glass substrate 128.
  • the adjacent mounting glass substrates 72 are integrated at a portion not related to the connection between the first flexible substrate 98 and the second flexible substrate 122.
  • the first flexible substrate 98 and the second flexible substrate 122 are connected to the respective mounting glass substrates 72. Note that either the first flexible substrate 98 or the second flexible substrate 122 may be connected first.
  • the assembly 130 is cut into individual mounting glass substrates 72.
  • FIG. 18 is a diagram illustrating the method of manufacturing the integrated circuit module according to the second modification of the embodiment.
  • a chip bonder (not shown) for mounting a chip corresponds to a substrate of a certain size or more (at least 20 mm square), and mounts the chip at a position close to one side of the substrate. Therefore, as shown in FIG. 18, a glass substrate 132 larger than the size of the mounting glass substrate 72 is prepared, the wiring pattern 82 is formed, and the integrated circuit chip 96 is mounted by a chip bonder. Thereafter, unnecessary portions are cut and removed.
  • FIG. 19 is a diagram illustrating the method of manufacturing the integrated circuit module according to Modification 3 of the embodiment.
  • the wiring patterns of the TFT glass substrate 24 and the mounting glass substrate 72 are mixedly formed on the mother glass substrate 128, and thereafter, these are cut.
  • the mounting of the integrated circuit chip 96 on the mounting glass substrate 72 is performed after cutting.
  • the present invention is not limited to the embodiments described above, and various modifications are possible.
  • the configuration described in the embodiment can be replaced with a configuration having substantially the same configuration, a configuration having the same operation and effect, or a configuration capable of achieving the same object.

Abstract

L'invention concerne un dispositif d'affichage comprenant : une surface d'affichage (64) sur laquelle sont affichées des images ; un panneau d'affichage (10) comprenant une surface arrière (66) qui est opposée à la surface d'affichage (64) ; un substrat de verre de montage (72) comprenant une première surface (74) ainsi qu'une seconde surface (76) qui est opposée à la première surface (74), la première surface (74) chevauchant le panneau d'affichage (10) de manière à faire face à la surface arrière (66) et la seconde surface (76) comprenant un motif de câblage (82) ; une puce de circuit intégré (96) montée sur la seconde surface (76) du substrat de verre de montage (72) ; et un premier substrat souple (98) qui se courbe et est connecté électriquement au panneau d'affichage (10) et au substrat de verre de montage (72), et qui comprend un premier motif de câblage (104).
PCT/JP2019/023454 2018-08-22 2019-06-13 Dispositif d'affichage et module de circuit intégré WO2020039709A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-155273 2018-08-22
JP2018155273A JP2020030298A (ja) 2018-08-22 2018-08-22 表示装置及び集積回路モジュール

Publications (1)

Publication Number Publication Date
WO2020039709A1 true WO2020039709A1 (fr) 2020-02-27

Family

ID=69592458

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/023454 WO2020039709A1 (fr) 2018-08-22 2019-06-13 Dispositif d'affichage et module de circuit intégré

Country Status (2)

Country Link
JP (1) JP2020030298A (fr)
WO (1) WO2020039709A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021258736A1 (fr) * 2020-06-22 2021-12-30 深圳市全洲自动化设备有限公司 Module de commande de cof, module d'affichage de cof et leurs procédés de fabrication
CN113903767A (zh) * 2020-06-22 2022-01-07 上海和辉光电股份有限公司 阵列基板、柔性显示面板及显示装置
WO2024000990A1 (fr) * 2022-06-29 2024-01-04 合肥维信诺科技有限公司 Structure de liaison, panneau d'affichage, carte de circuit imprimé souple et appareil d'affichage

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113362715B (zh) * 2021-06-17 2022-07-05 合肥维信诺科技有限公司 引脚绑定结构、阵列基板及显示面板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11112119A (ja) * 1997-05-21 1999-04-23 General Electric Co <Ge> 接続パッド配列
WO2012093468A1 (fr) * 2011-01-06 2012-07-12 シャープ株式会社 Substrat pour un dispositif d'affichage et dispositif d'affichage
US20140118969A1 (en) * 2012-10-25 2014-05-01 Samsung Display Co., Ltd. Chip on film and display device including the same
JP2015232660A (ja) * 2014-06-10 2015-12-24 株式会社Ｊｏｌｅｄ 表示装置の製造方法及び表示装置
WO2016204056A1 (fr) * 2015-06-16 2016-12-22 シャープ株式会社 Procédé permettant de fabriquer un dispositif d'affichage, et dispositif d'affichage
WO2017006856A1 (fr) * 2015-07-07 2017-01-12 シャープ株式会社 Dispositif d'affichage et procédé de production d'un composant de circuit de pilotage

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11112119A (ja) * 1997-05-21 1999-04-23 General Electric Co <Ge> 接続パッド配列
WO2012093468A1 (fr) * 2011-01-06 2012-07-12 シャープ株式会社 Substrat pour un dispositif d'affichage et dispositif d'affichage
US20140118969A1 (en) * 2012-10-25 2014-05-01 Samsung Display Co., Ltd. Chip on film and display device including the same
JP2015232660A (ja) * 2014-06-10 2015-12-24 株式会社Ｊｏｌｅｄ 表示装置の製造方法及び表示装置
WO2016204056A1 (fr) * 2015-06-16 2016-12-22 シャープ株式会社 Procédé permettant de fabriquer un dispositif d'affichage, et dispositif d'affichage
WO2017006856A1 (fr) * 2015-07-07 2017-01-12 シャープ株式会社 Dispositif d'affichage et procédé de production d'un composant de circuit de pilotage

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021258736A1 (fr) * 2020-06-22 2021-12-30 深圳市全洲自动化设备有限公司 Module de commande de cof, module d'affichage de cof et leurs procédés de fabrication
CN113903767A (zh) * 2020-06-22 2022-01-07 上海和辉光电股份有限公司 阵列基板、柔性显示面板及显示装置
WO2024000990A1 (fr) * 2022-06-29 2024-01-04 合肥维信诺科技有限公司 Structure de liaison, panneau d'affichage, carte de circuit imprimé souple et appareil d'affichage

Also Published As

Publication number Publication date
JP2020030298A (ja) 2020-02-27

Similar Documents

Publication Publication Date Title
KR101195688B1 (ko) 플렉시블 기판 및 전기 회로 구조체
US10886643B2 (en) Display device
WO2020039709A1 (fr) Dispositif d&#39;affichage et module de circuit intégré
US20060109394A1 (en) Mounting structure, electro-optical device, and electronic apparatus
US20060097364A1 (en) Electro-optical device and electronic apparatus
JP5315747B2 (ja) 表示装置
WO2018135362A1 (fr) Dispositif d&#39;affichage
US8421979B2 (en) Display panel and display device including the same
US8062461B2 (en) Method of manufacturing an electro-optical device
KR101644055B1 (ko) 외곽영역이 최소화된 액정표시장치
KR100848768B1 (ko) 기판 장치 및 표시 소자의 제조 방법
JP7148310B2 (ja) フレキシブル基板及び表示装置
US7591651B2 (en) Substrate with helically curved terminals superimposed and connected to identical terminals on a second substrate
JP2007178668A (ja) 平面表示装置及びその製造方法
CN102914890A (zh) 柔性电路板
KR102023923B1 (ko) 인쇄회로기판 및 이를 포함한 평판 표시 장치
JP2007219300A (ja) 表示装置
JP5332219B2 (ja) 電気光学装置の製造方法
JP3575482B2 (ja) 表示装置
KR20070106261A (ko) 액정표시장치
US20200363687A1 (en) Circuit substrate and display apparatus
US20210132429A1 (en) Display device
KR100551439B1 (ko) 엘씨디 모듈
KR102212456B1 (ko) 씨오지 방식의 표시장치 및 그 제조방법
JP2008134380A (ja) 吸着テーブル

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19852964

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19852964

Country of ref document: EP

Kind code of ref document: A1