WO2020038017A1 - 显示面板、显示装置和显示面板的制备方法 - Google Patents

显示面板、显示装置和显示面板的制备方法 Download PDF

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Publication number
WO2020038017A1
WO2020038017A1 PCT/CN2019/085063 CN2019085063W WO2020038017A1 WO 2020038017 A1 WO2020038017 A1 WO 2020038017A1 CN 2019085063 W CN2019085063 W CN 2019085063W WO 2020038017 A1 WO2020038017 A1 WO 2020038017A1
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Prior art keywords
pixel
display panel
defining layer
groove
array substrate
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English (en)
French (fr)
Inventor
黄金雷
王旭深
张豪峰
陈建平
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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Priority to US16/817,599 priority Critical patent/US11139353B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present invention relates to the field of display devices, and particularly to a display panel, a display device using the display panel, and a method for manufacturing the display panel.
  • OLED displays also known as organic electroluminescence displays, are a new type of flat-panel display device; because of its simple preparation process, low cost, low power consumption, high light emission, Light and thin, fast response speed, easy to implement color display, large screen display, easy to realize flexible display, etc., has broad application prospects.
  • the drop ball test is usually used to test the impact resistance of the screen.
  • the phenomenon of stress surge may cause display abnormality, especially for flexible screens.
  • the stress increases sharply due to the absence of a hard protective layer, which is more likely to cause black spots, bright spots, and colorful spots in the display area. defect.
  • a display panel a display device using the display panel, and a method of manufacturing the display panel are provided.
  • a display panel includes: an array substrate; a pixel-defining layer disposed on the array substrate; the pixel-defining layer includes a plurality of pixel regions; a plurality of grooves are provided on the pixel-defining layer;
  • the pixel-defining layer further includes a plurality of non-pixel regions surrounding the plurality of pixel regions, and the groove is disposed in the non-pixel region.
  • the shape of the projection of the plurality of grooves on the array substrate includes at least one of a circle, a square, a rectangle, and a prism.
  • the diagonal length or diameter of the opening on the side of the groove away from the array substrate is less than 1 ⁇ m.
  • the display panel further includes a plurality of support columns, which are disposed at positions where no grooves are provided on the pixel defining layer.
  • the distance between each support pillar and the groove adjacent to it is smaller than the distance between the support pillar and the pixel region adjacent to it.
  • the groove is a patterned groove
  • the pixel-defining layer includes a side wall between the groove and the pixel region.
  • the pixel defining layer is made of an organic polymer material.
  • the organic polymer material is flexible.
  • the groove structure is disposed on the pixel defining layer penetratingly or non-penetratingly.
  • a display device is also provided, including the display panel described above.
  • a method for manufacturing a display panel includes the following steps: providing an array substrate; forming a pixel-defining layer on the array substrate, the pixel-defining layer including a plurality of pixel regions; Does not overlap the pixel area.
  • the array substrate includes a base substrate and a TFT array substrate disposed on the base substrate.
  • the forming a pixel-defining layer on the array substrate, where the pixel-defining layer includes a plurality of pixel regions includes:
  • Different color light-emitting layer materials are vapor-deposited in the corresponding pixel openings to form pixels of different colors.
  • the pixel region is rectangular, and the groove is provided around the pixel region.
  • the groove is dry-etched, wet-etched, or laser-cauterized.
  • the groove and the pixel opening are formed by the same etching process, and the same photomask is used.
  • FIG. 1 is a schematic plan view of a display panel according to an embodiment.
  • Fig. 2 is a sectional view taken along line AA 'in Fig. 1.
  • FIG 3 is a cross-sectional view of a display panel in another embodiment.
  • FIG. 4 is a schematic plan view of a display panel according to another embodiment.
  • FIG. 5 is a schematic plan view of a display panel according to another embodiment.
  • FIG. 6 is a partially enlarged cross-sectional view of a display panel in an embodiment.
  • FIG. 7 is a cross-sectional view of a display panel in an embodiment.
  • FIG. 8 is a flowchart of a method for manufacturing a display panel according to an embodiment.
  • FIG. 9 is a specific flowchart of step S104 in FIG. 8.
  • the present application proposes a display panel including an array substrate (including a substrate and a TFT provided on the substrate) and a pixel-defining layer.
  • the pixel-defining layer is disposed on the array substrate and includes a plurality of pixel regions and a pixel region surrounding the pixel region.
  • a plurality of grooves are provided on the non-pixel region of the pixel-defining layer, and the setting position of each groove does not overlap the position where the pixel region is located.
  • the groove can disperse and release the instantaneously increased stress on the inner side wall of the groove, thereby preventing the display elements in the pixel area from being damaged, and avoiding dark spots, bright spots, and colorful spots.
  • the occurrence of display defects improves the impact resistance of the display panel and achieves the purpose of protecting the pixel area under the impact of an external force.
  • FIG. 1 is a schematic plan view of a display panel in this embodiment
  • FIG. 2 is a cross-sectional view taken along line AA 'in FIG.
  • this embodiment provides a display panel 100 including a base substrate 110, a Thin Film Transistor (TFT) array substrate 120, and a pixel defining layer 130.
  • the base substrate 110, the TFT array substrate 120, and the pixel defining layer 130 are arranged layer by layer from bottom to top.
  • the pixel defining layer 130 is provided with a plurality of pixel openings 170.
  • the pixel defining layer 130 includes a plurality of pixel regions 101 corresponding to the plurality of pixel openings 170 and a plurality of non-pixel regions 102 surrounding the plurality of pixel regions 101. Furthermore, the materials of the light emitting layers of different colors can be evaporated in the corresponding pixel openings to form the pixels 140 of different colors.
  • a plurality of grooves 131 are provided on the non-pixel region 102 around the pixel region 101, that is, the setting position of each groove 131 does not overlap the position where the pixel region 101 is located. It can be understood that the shape and arrangement of the groove 131 can be changed and combined in various forms, and are not limited by the graphics in FIG. 1 and FIG. 2.
  • the pixel region 101 may be arranged in a matrix, staggered, or other arrangement manner, and the pixels 140 provided in the pixel region 101 may be one of three primary color pixels or one of four primary color pixels. This is also not limited.
  • a groove 131 is provided around the pixel region 101, so that the display panel 100 inductively disperses and releases an instantaneously increased stress in the groove 131 when receiving an external impact, thereby improving the display panel 100's
  • the anti-impact performance achieves the purpose of protecting the pixel area 101 under the impact of an external force.
  • the above display panel 100 does not need to be provided with an additional buffer material, and the bending performance of the display panel 100 is improved without increasing the thickness of the display panel 100.
  • the groove 131 may be provided around the pixel area 101. Specifically, the groove 131 may be provided around the pixel area 101, that is, provided in the non-pixel area 102 to protect the located area. The pixels 140 are protected from damage by an impact force.
  • the number of the grooves 131 provided around the pixel region 101 may be one or more, and the setting positions of the grooves 131 may be specifically selected according to actual processes or products, which is not limited herein.
  • the instantaneously increased stress of the display panel 100 can be timely dispersed and released in the groove 131 around the pixel area 101, thereby protecting the pixel structure in the pixel area 101 from Damaged by stress.
  • the shape of the projection of the groove 131 on the array substrate may be variously selected, such as a circle, a square, a rectangle, and a prism.
  • the shape of the groove 131 may be a circular hole shape, a cube shape, a rectangular parallelepiped shape, or a prism shape.
  • the groove 131 may be a single one of the above-mentioned various shapes, or may be a combination of a plurality of shapes.
  • the shape of the groove 131 provided around the periphery of the pixel region 101 may be a circular hole shape.
  • the diagonal length or diameter of the opening of the groove 131 away from the array substrate is less than 1 ⁇ m.
  • the opening on the side of the groove 131 away from the array substrate is the position where the circular shape is displayed on the pixel defining layer in FIG. 2.
  • the maximum diameter distance of the shape of the opening on the side of the groove 131 away from the array substrate does not exceed 1 ⁇ m.
  • this distance is controlled at about 0.51 ⁇ m.
  • the grooves 131 with small apertures should be arranged as densely as possible.
  • the groove 131 is set as a small-aperture hole to prevent other film structures directly covering the pixel-defining layer 130 from being deposited in the groove 131 when the film structure is not provided with a supporting column, so that the groove 131 lost effect.
  • the circular diameter of the upper surface thereof does not exceed 1 ⁇ m.
  • the diagonal length of the opening polygon does not exceed 1 ⁇ m.
  • the display panel 100 includes a base substrate 110, a TFT array substrate 120, a pixel defining layer 130, a pixel 140, and a plurality of supporting pillars 150 and a package cover 160.
  • the support pillar 150 is disposed at a position where no groove is provided on the pixel defining layer 130.
  • the package cover 160 covers a side of the support pillars 150 away from the pixel defining layer.
  • the support pillar 150 is located above the pixel defining layer 130 between adjacent pixels 140 and can play a certain supporting role on the cover plate 160.
  • the support pillar 150 may be made of a hard material such as silicon nitride or silicon oxide, or may be made of an organic polymer material having a certain flexibility.
  • the support pillar 150 can withstand the surge stress and transmit the stress downward to the pixel defining layer 130 and then release it into the groove 131 to protect the pixel 140 from being damaged by the impact force.
  • the groove may be a patterned groove.
  • the pixel-defining layer by subjecting the pixel-defining layer to patterning processing such as exposure and development, the pixel-defining layer can be formed into a structure with a certain pattern, and a side wall can be formed between the trench and the pixel region. The presence of the side wall can well protect the pixels from stress damage.
  • the thickness of the side wall is between 2 ⁇ m and 6 ⁇ m.
  • the patterned trenches can have various forms and surround the periphery of the pixel structure through a combination of various forms.
  • the patterned trenches in FIG. 4 and FIG. 5 are taken as an example for illustration. As shown in FIGS. 4 and 5, the trenches 131 in this embodiment have large openings and are not very densely distributed.
  • the shape of the groove 131 is regular and mostly rectangular parallelepiped. Between the pixel 140 and the trench 131, a sidewall 132 surrounded by the pixel defining layer 130 is formed. One, two or more sets of grooves 131 are provided between the side walls 132 located between two adjacent pixels 140. Each group of grooves 131 is provided with one, two or several grooves 131 in a direction parallel to the corresponding side wall 132. In this embodiment, in addition to forming the trenches 131 on the pixel-defining layer 130, a portion of the pixel-defining layer 130 is retained to provide a plurality of support pillars 150 on the portion of the pixel-defining layer 130. Optionally, each support post 150 is disposed between the two grooves 131.
  • These supporting pillars 150 can play a certain supporting role, and can prevent the film 131 from being deposited and blocking the trench 131.
  • the display panel can be induced to release the deformation of the inorganic layer induced by the stress in the trenches between the side walls 132 when the display panel is subjected to an instantaneous impact.
  • the pixel 140 cannot continue to be transmitted to the pixel 140, thereby improving the impact resistance of the display panel and achieving the purpose of protecting the pixel area 101 under the impact of an external force.
  • the distance d1 between each support pillar 150 and the adjacent groove 131 is smaller than the distance d2 between the support pillar 150 and the adjacent pixel region 101, that is, each groove 131. Both are disposed between the support pillar 150 and the pixel region 101.
  • the display panel can release the stress in the groove 131 in a timely manner after receiving the instant impact, and prevent the stress from further spreading in the direction of the pixel 140.
  • the grooves 131 may be the dense holes described in the above embodiments, or may be the patterned grooves 131 described in the above embodiments.
  • the groove 131 may be disposed on the pixel defining layer 130 penetratingly or non-penetratingly, and forms a penetrating groove 1311 and a non-penetrating groove 1312 as shown in FIG. 7.
  • the depths of the grooves provided in the pixel-defining layer may be all the same, may be partially the same, or may be different. Specifically, they may be selected according to actual needs or actual manufacturing process conditions. Be limited.
  • the pixel defining layer is made of an organic polymer material.
  • the pixel defining layer may be made of polyimide (PSPI).
  • PSPI polyimide
  • polyimide is a dual-function photoresist that is both photosensitive and high temperature resistant. It has the characteristics of high temperature resistance, corrosion resistance and good insulation.
  • the organic polymer material used to make the pixel-defining layer usually has a certain degree of flexibility, and can absorb a part of the stress auxiliaryly, to a certain extent, reducing the damage caused to the display panel by the transient stress surge.
  • a method for manufacturing a display panel includes the following steps:
  • Step S102 Provide an array substrate.
  • the array substrate may specifically include a base substrate and a TFT array substrate disposed on the base substrate. Therefore, the array substrate may refer to a collective composed of a glass substrate substrate or a flexible substrate substrate and a TFT array substrate.
  • Step S104 A pixel-defining layer is formed on the array substrate, and the pixel-defining layer includes a plurality of pixel regions.
  • step S104 includes:
  • Step S1040 forming a pixel defining layer on the array substrate.
  • Step S1042 forming a plurality of pixel openings on the pixel defining layer through a photomask etching process, thereby including a plurality of pixel areas corresponding to the plurality of pixel openings and a plurality of non-pixel areas surrounding the plurality of pixel areas.
  • Step S1044 evaporating materials of light-emitting layers of different colors into corresponding pixel openings to form pixels of different colors.
  • Step S106 A plurality of grooves are provided on the pixel-defining layer, and the grooves do not overlap with the pixel area.
  • a plurality of grooves are formed on a non-pixel region of the pixel defining layer.
  • the groove may be provided around the pixel area to protect the pixels located therein from being damaged by the impact force.
  • the grooves can be formed by etching or laser irradiation, such as dry etching, wet etching, laser cauterization, etc.
  • the grooves can be formed using the same etching process as the pixel opening, and used The same photomask saves costs.
  • the display panel manufacturing method described above can produce a display panel with high impact resistance through the existing process, without the need for additional buffer materials, the process is simple, the cost is low, and the prepared display panel can be very resistant to external impact. Good protection of the pixel area effectively improves the problem of display panel display failure.
  • An embodiment of the present disclosure further provides a display device including the display panel according to any one of the above embodiments.
  • the display device may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, and a smart wearable device.
  • the above display panel has high stability, and it is difficult for display defects such as black spots, bright spots, and colorful spots to appear when subjected to external impact.
  • Other essential components of the display device are understood by those of ordinary skill in the art, and will not be repeated here.

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Abstract

一种显示面板、显示装置和显示面板的制备方法。该显示面板包括阵列基板和像素限定层，像素限定层设置在阵列基板上，并包括若干个像素区域，像素限定层上设置有若干个凹槽，凹槽与像素区域不重叠。

Description

显示面板、显示装置和显示面板的制备方法
相关申请的交叉引用
本申请要求于2018年8月20日提交中国专利局，申请号为201810948119.X，申请名称为“显示面板、显示装置和显示面板的制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及显示装置领域，特别是涉及显示面板、使用该显示面板的显示装置和该显示面板的制备方法。
背景技术
有机发光二极管(Organic Light-Emitting Diode，OLED)显示器，也称为有机电致发光显示器，是一种新兴的平板显示装置；由于其具有制备工艺简单、成本低、功耗低、发光亮度高、体积轻薄、响应速度快，而且易于实现彩色显示和大屏幕显示、易于实现柔性显示等优点，具有广阔的应用前景。
在有机发光二极管显示器制作完成后，通常需要进行一系列的显示屏可靠性测试，通常采用落球实验测试屏幕的抗冲击性能，在该类测试方案及实际使用中，存在瞬间的冲击导致显示屏局部应力激增的现象，从而可能引起显示异常，尤其对于柔性屏幕，其受到瞬间冲击时，由于不存在硬质保护层，应力急剧增大，更易引发显示区域出现黑斑、亮斑、彩斑等显示缺陷。
现有技术中，通常采用增加额外缓冲材料来改善显示异常的情况，但这种方式会使得显示屏的厚度增加，弯折性能有所下降。
发明内容
根据各种实施例，提供一种显示面板、使用该显示面板的显示装置以及制备该显示面板的方法。
一种显示面板，包括：阵列基板；像素限定层，设置在阵列基板上，像素限定层包括若干个像素区域；像素限定层上设置有若干个凹槽，凹槽与像素区域不重叠。
在其中一个实施例中，所述像素限定层还包括环绕所述若干个像素区域的若干个非像素区域，所述凹槽设置在所述非像素区域。
在其中一个实施例中，所述若干个凹槽在所述阵列基板上的投影的形状包括圆形、正方形、长方形和棱形中的至少一种。
在其中一个实施例中，所述凹槽远离所述阵列基板一侧的开口的对角线长度或直径小于1μm。
在其中一个实施例中，所述显示面板还包括若干个支撑柱，设置于所述像素限定层上未设置凹槽的位置。
在其中一个实施例中，每个支撑柱与和其相邻的所述凹槽之间的距离小于所述支撑柱与和其相邻的所述像素区域之间的距离。
在其中一个实施例中，所述凹槽为图案化的沟槽，所述像素限定层包括位于所述沟槽和所述像素区域之间的侧墙。
在其中一个实施例中，所述像素限定层由有机高分子材料制成。
在其中一个实施例中，所述有机高分子材料具有柔性。
在其中一个实施例中，所述凹槽结构贯穿或非贯穿地设置于所述像素限定层上。
还提供一种显示装置，包括上述的显示面板。
还提供一种显示面板的制备方法，包括以下步骤：提供一阵列基板；在阵列基板上形成像素限定层，像素限定层包括若干个像素区域；在像素限定层上形成若干个凹槽，凹槽与像素区域不重叠。
在其中一个实施例中，所述阵列基板包括衬底基板以及设置在所述衬底基板上的TFT阵列基板。
在其中一个实施例中，所述在所述阵列基板上形成像素限定层，所述像素限定层包括多个像素区域包括：
在阵列基板上形成一层所述像素限定层；
通过光罩刻蚀工艺在所述像素限定层上形成若干个像素开口，以此包括对应若干个像素开口的若干个像素区域和环绕所述若干个像素区域的若干个非像素区域；以及
将不同颜色的发光层材料蒸镀在对应的所述像素开口内，以形成不同颜色的像素。
在其中一个实施例中，所述像素区域为矩形，所述凹槽设置于所述像素区域的四周。
在其中一个实施例中，所述凹槽采用干法刻蚀、湿法刻蚀或激光烧灼。
在其中一个实施例中，所述凹槽与所述像素开口采用同一刻蚀工艺形成，并使用同一光罩。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其它特征、目的和优点将根据说明书、附图以及权利要求书的描述变得明显。
附图说明
为了更好地描述和说明本申请的实施例和/或示例，可以参考一幅或多幅附图。用于描述附图的附加细节或示例不应当被认为是对所公开的申请、目前描述的实施例和示例以及目前理解的这些申请的最佳模式中的任何一者的范围的限制。
图1为一个实施例中显示面板的俯视结构示意图。
图2为图1沿AA’线的剖面图。
图3为另一个实施例中显示面板的剖视图。
图4为另一个实施例中显示面板的俯视结构示意图。
图5为又一个实施例中显示面板的俯视结构示意图。
图6为一个实施例中显示面板的局部放大剖视图。
图7为一个实施例中显示面板的剖视图。
图8为一个实施例中显示面板制备方法的流程图。
图9为图8中步骤S104的具体流程图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚，以下结合附图及实施例，对本申请进行详细说明。此处所描述的具体实施例仅用以解释本申请，不应当被认为是对本申请的限制。
现有的显示装置在落球实验后会出现黑斑、亮斑、彩斑等显示缺陷，且无法恢复，影响电子设备的显示性能。通过对现有技术的研究发现，当显示面板受到瞬时的冲击时，显示面板上被冲击的部分会出现应力激增的现象，如果显示面板不能及时的分散和吸收应力，就会导致被击中的部分出现元件受损或膜层间剥离的问题。在现有技术中，通常采用增加额外缓冲材料来改善显示异常的情况，但是这会导致显示面板的厚度增加，弯折能力有所下降。
基于此，本申请提出一种显示面板，包括阵列基板(包括基板和设置在基板上的TFT)和像素限定层，像素限定层设置在阵列基板上，并包括若干个像素区域以及环绕像素区域的非像素区域，在像素限定层的非像素区域上设置有若干个凹槽，并且，每个凹槽的设置位置与像素区域所在的位置不重叠。当显示面板受到瞬时冲击时，凹槽可以将瞬时增加的应力分散和释放在凹槽的内侧壁上，从而避免了像素区域的显示元件受到损坏，也避免了黑斑、亮斑、彩斑等显示缺陷的产生，提高了显示面板的抗冲击性能，达到在外力冲击下保护像素区域的目的。
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本申请能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本发明内涵的情况下做类似改进，因此本发明不受下面公开的具体实施例的限制。
图1为本实施例中显示面板的俯视结构示意图，图2为图1沿AA’线的 剖面图。如图1和图2所示，本实施例提供了一种显示面板100，包括衬底基板110、TFT(Thin Film Transistor薄膜晶体管)阵列基板120以及像素限定层130。衬底基板110、TFT阵列基板120以及像素限定层130由底至顶逐层设置。在本实施例中，像素限定层130上设有若干个像素开口170。像素限定层130包括与若干个像素开口170一一对应的若干个像素区域101和环绕在若干个像素区域101周围的若干个非像素区域102。进而，不同颜色的发光层材料可以蒸镀在对应的像素开口内，以形成不同颜色的像素140。在本实施例中，在像素区域101的周边的非像素区域102上设置有若干个凹槽131，即每个凹槽131的设置位置与像素区域101所在的位置不重叠。可以理解的是，凹槽131的形状与设置方式可以有多种形式的变化和组合，不受图1和图2中图形的限制。另外，像素区域101的排列方式可以采用矩阵排列或者交错排列或其他排列方式，而设置在像素区域101内的像素140可以为三基色像素中的一个，也可以为四基色像素中的一个，在此也不做限定。
上述显示面板，通过在像素区域101周边位置设置凹槽131，使显示面板100在受到外来冲击时，将瞬时增加的应力诱导性地分散和释放在凹槽131中，从而提高了显示面板100的抗冲击性能，达到在外力冲击下保护像素区域101的目的。另外，上述显示面板100无需设置额外的缓冲材料，在不增加显示面板100厚度的同时，提高了显示面板100的弯折性能。
在一些实施例中，如图2所示，凹槽131可以环绕像素区域101设置，具体地，凹槽131可以设置于像素区域101的四周，即设置在非像素区域102，以保护位于其中的像素140免受冲击力的损坏。在本实施例中，环绕于像素区域101设置的凹槽131的数量可以为一个或多个，并且凹槽131的设置位置可以根据实际工艺或产品具体选择，在此不做限定。本实施例通过将凹槽131环绕像素区域101设置，可以将显示面板100瞬时增加的应力及时的分散和释放在像素区域101四周的凹槽131内，从而保护了像素区域101内的像素结构免受应力的破坏。
在一些实施例中，凹槽131在阵列基板上的投影的形状可以有多种选择， 比如圆形、正方形、长方形和棱形等。相对应地，凹槽131的形状具体可以为圆孔型、正方体形、长方体形或棱柱形。并且，凹槽131可以为上述多种形状中的单独一种，也可以为多种形状的组合。如图2所示，围绕像素区域101周边位置设置的凹槽131的形状可以为圆孔形。通过将凹槽131的开口形状设置为多种常见的形状，可以有效地降低工艺难度，利于方案的执行。
在一些实施例中，凹槽131远离阵列基板一侧的开口的对角线长度或直径小于1μm。参照图1和图2可知，凹槽131远离阵列基板一侧的开口即为图2中像素限定层上显示出圆形形状的位置。在本实施例中，凹槽131远离阵列基板一侧的开口的形状最大径距离不超过1μm。可选地，这一距离控制在0.51μm左右。另外，小孔径的凹槽131要尽可能地密集设置。在本实施例中，将凹槽131设置为小孔径的孔洞是为了避免膜层结构不设置支撑柱时直接覆盖于像素限定层130上的其他膜层结构沉积在凹槽131内，使凹槽131失去作用。具体地，对于圆孔形的凹槽131来说，其上表面的圆形直径不超过1μm。对于正方体形、长方体形或棱柱形的凹槽131来说，其开口的多边形对角线长度不超过1μm。在本实施例中，通过将凹槽131设置为密集的孔洞，可以使像素限定层的结构像海绵一样，及时地吸收和释放瞬时间受到的应力，从而保护像素结构不受到破坏。
在一些实施例中，如图3所示，显示面板100包括衬底基板110、TFT阵列基板120、像素限定层130、像素140，以及若干个支撑柱150和封装盖板160。支撑柱150设置于像素限定层130上未设置凹槽的位置。封装盖板160覆盖在若干个支撑柱150远离像素限定层的一侧。在本实施例中，支撑柱150位于相邻像素140之间的像素限定层130的上方，可以对盖板160起到一定的支撑作用。具体地，支撑柱150可以由氮化硅或氧化硅等硬质材料制成，也可由具有一定柔性的有机高分子材料制成。当盖板160受到瞬时冲击时，支撑柱150可以承受住激增的应力，并将应力向下传递给像素限定层130，随后释放于凹槽131当中，从而保护像素140不受到冲击力的损坏。
在一些实施例中，凹槽可以为图案化的沟槽。具体地，可以通过对像素 限定层进行曝光、显影等图案化处理，使像素限定层形成具有一定图案规则的结构，同时使得沟槽与像素区域之间形成一道侧墙。通过侧墙的存在可以很好地保护像素免受应力的损坏。可选地，该侧墙的厚度在2μm～6μm。图案化的沟槽可以有多种形式，并通过多种形式的组合环绕在像素结构的外周，现以图4和图5中的图案化沟槽为例进行说明。如图4和图5所示，本实施例中的沟槽131开孔较大且分布不十分密集。沟槽131的形状规则且多为长方体形。在像素140与沟槽131之间，形成有由像素限定层130围成的侧墙132。在位于相邻两个像素140之间的侧墙132之间设置有一组、两组或多组沟槽131。每组沟槽131在平行于相应侧墙132的方向上设置有一个、两个或若干个沟槽131。在本实施例中，除了在像素限定层130上形成沟槽131之外，还保留了部分像素限定层130以在该部分像素限定层130上设置若干个支撑柱150。可选地，每个支撑柱150设置在两个沟槽131之间。这些支撑柱150可以起到一定的支撑作用，可以避免膜层向下沉积堵住沟槽131。在本实施例中，通过对像素限定层130的结构进行图案化的处理，可以使显示面板在受到瞬时冲击时，将应力引起的无机层形变诱导性的释放在侧墙132之间的沟槽131内，而无法继续传递给像素140，从而改善了显示面板的抗冲击性能，达到了在外力冲击下保护像素区域101的目的。
在一些实施例中，如图6所示，每一个支撑柱150到与其相邻的凹槽131的距离d1小于支撑柱150到与其相邻的像素区域101的距离d2，即每一个凹槽131都是设置在支撑柱150和像素区域101之间的。通过这样的设置，可以使显示面板在受到瞬时冲击之后及时的将应力释放于凹槽131当中，避免应力进一步向像素140方向扩散。在本实施例中，凹槽131可以为上述实施例中所述的密集型的孔洞，也可以为上述实施例中所述的图案化的沟槽131。
在一些实施例中，参照图7，凹槽131可以贯穿或者非贯穿地设置于像素限定层130上，并形成如图7中所示的贯穿性凹槽1311和非贯穿性凹槽1312。在本实施例中，在像素限定层中设置的凹槽的深度可以全部相同，也可以部分相同，也可以各不相同，具体可以根据实际需要或者实际制作的工 艺条件进行选定，在此不做限定。
在一些实施例中，像素限定层由有机高分子材料制成，具体地，像素限定层可以由聚酰亚胺(PSPI)制成。可知聚酰亚胺是一种既光敏又耐高温的双功能光刻胶，它具有耐高温、耐腐蚀、绝缘性好的特性。在本实施例中，用于制作像素限定层的有机高分子材料通常具有一定的柔性，可以辅助性地吸收一部分应力，在一定程度上减少了瞬时应力激增对显示面板带来的损坏。
在一些实施例中，如图8所示，一种显示面板的制备方法包括以下步骤：
步骤S102：提供一阵列基板。
具体地，该阵列基板具体可以包括衬底基板以及设置在衬底基板上的TFT阵列基板，因而阵列基板可以指玻璃衬底基板或柔性衬底基板与TFT阵列基板共同组成的集合。
步骤S104：在阵列基板上形成像素限定层，像素限定层包括若干个像素区域。
具体地，如图9所示，步骤S104包括：
步骤S1040：在阵列基板上形成一层像素限定层。
步骤S1042：通过光罩刻蚀工艺在像素限定层上形成若干个像素开口，以此包括对应若干个像素开口的若干个像素区域和环绕所述若干个像素区域的若干个非像素区域。
步骤S1044：将不同颜色的发光层材料蒸镀在对应的像素开口内，以形成不同颜色的像素。
步骤S106：在像素限定层上设置若干个凹槽，凹槽与像素区域不重叠。
具体地，在像素限定层的非像素区域上形成若干个凹槽。进一步地，该凹槽可以设置于像素区域的四周，以保护位于其中的像素免受冲击力的损坏。进一步地，凹槽可以采用刻蚀或激光照射的方法形成，例如干法刻蚀、湿法刻蚀、激光烧灼等，可选地，凹槽可以与像素开口采用同一刻蚀工艺形成，并使用同一光罩，节约成本。
上述显示面板的制备方法，通过现有工艺即可制备出具有高抗冲击性能 的显示面板，无需设置额外的缓冲材料，工艺简单，成本低，且制备出的显示面板在承受外力冲击时可以很好的保护像素区域，有效地改善了显示面板显示失效的问题。
本公开实施例还提供了一种显示装置，包括：如上述任一项实施例所述的显示面板。具体地，该显示装置可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪、智能穿戴设备等任何具有显示功能的产品或部件。上述显示面板具有较高的稳定性，在受到外来冲击时，不易出现黑斑、亮斑、彩斑等显示缺陷。对于该显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不作赘述。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出多变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (17)

  1. 一种显示面板，包括：
    阵列基板；及
    像素限定层，设置在所述阵列基板上，所述像素限定层包括若干个像素区域；
    其中，所述像素限定层上设置有若干个凹槽，所述凹槽与所述像素区域不重叠。
  2. 根据权利要求1所述的显示面板，其中，所述像素限定层还包括环绕所述若干个像素区域的若干个非像素区域，所述凹槽设置在所述非像素区域。
  3. 根据权利要求1所述的显示面板，其中，所述若干个凹槽在所述阵列基板上的投影的形状包括圆形、正方形、长方形和棱形中的至少一种。
  4. 根据权利要求3所述的显示面板，其中，所述凹槽远离所述阵列基板一侧的开口的对角线长度或直径小于1μm。
  5. 根据权利要求1所述的显示面板，其中，所述显示面板还包括若干个支撑柱，设置于所述像素限定层上未设置凹槽的位置。
  6. 根据权利要求5所述的显示面板，其中，每个支撑柱与和其相邻的所述凹槽之间的距离小于所述支撑柱与和其相邻的所述像素区域之间的距离。
  7. 根据权利要求1所述的显示面板，其中，所述凹槽为图案化的沟槽，所述像素限定层包括位于所述沟槽和所述像素区域之间的侧墙。
  8. 根据权利要求1所述的显示面板，其中，所述像素限定层由有机高分子材料制成。
  9. 根据权利要求8所述的显示面板，其中，所述有机高分子材料具有柔性。
  10. 根据权利要求1所述的显示面板，其中，所述凹槽结构贯穿或非贯穿地设置于所述像素限定层上。
  11. 一种显示装置，包括如权利要求1所述的显示面板。
  12. 一种显示面板的制备方法，包括：
    提供一阵列基板；
    在所述阵列基板上形成像素限定层，所述像素限定层包括若干个像素区域；
    在所述像素限定层上形成若干个凹槽，所述凹槽与所述像素区域不重叠。
  13. 根据权利要求12所述的方法，其中，所述阵列基板包括衬底基板以及设置在所述衬底基板上的TFT阵列基板。
  14. 根据权利要求12所述的方法，其中，所述在所述阵列基板上形成像素限定层，所述像素限定层包括多个像素区域包括：
    在阵列基板上形成一层所述像素限定层；
    通过光罩刻蚀工艺在所述像素限定层上形成若干个像素开口，以此包括对应若干个像素开口的若干个像素区域和环绕所述若干个像素区域的若干个非像素区域；以及
    将不同颜色的发光层材料蒸镀在对应的所述像素开口内，以形成不同颜色的像素。
  15. 根据权利要求12所述的方法，其中，所述像素区域为矩形，所述凹槽设置于所述像素区域的四周。
  16. 根据权利要求12所述的方法，其中，所述凹槽采用干法刻蚀、湿法刻蚀或激光烧灼。
  17. 根据权利要求14所述的方法，其中，所述凹槽与所述像素开口采用同一刻蚀工艺形成，并使用同一光罩。
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