WO2020034171A1 - 光学传感模组及其制作方法 - Google Patents

光学传感模组及其制作方法 Download PDF

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Publication number
WO2020034171A1
WO2020034171A1 PCT/CN2018/100942 CN2018100942W WO2020034171A1 WO 2020034171 A1 WO2020034171 A1 WO 2020034171A1 CN 2018100942 W CN2018100942 W CN 2018100942W WO 2020034171 A1 WO2020034171 A1 WO 2020034171A1
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WO
WIPO (PCT)
Prior art keywords
groove
pcb
optical
hole
optical sensing
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Application number
PCT/CN2018/100942
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English (en)
French (fr)
Inventor
陆斌
沈健
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201880001182.0A priority Critical patent/CN109156079B/zh
Priority to PCT/CN2018/100942 priority patent/WO2020034171A1/zh
Publication of WO2020034171A1 publication Critical patent/WO2020034171A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Definitions

  • the present application relates to the field of optical sensors, and in particular, to an optical sensing module and a manufacturing method thereof.
  • optical sensors In recent years, various types of consumer electronics have integrated more and more optical sensors. With the help of optical sensors, smart terminals such as mobile phones and watches can implement a variety of functions such as ambient light intensity detection, distance detection, temperature detection, heart rhythm detection, face, fingerprint, and iris biometric identification.
  • the working principle of the optical sensor is to receive light of a specific wavelength emitted or reflected by an object through the receiving area of the chip, and use the photoelectric effect to convert the optical signal into an electrical signal.
  • a simple optical sensing module needs to include at least three parts: optical components (lenses, filters, etc.) for forming an optical path and filtering invalid optical signals, and optics for receiving valid optical signals to achieve photoelectric signal conversion Sensor chip and peripheral circuit for transmitting electrical signals.
  • the optical sensor chip When manufacturing an optical sensor module, the optical sensor chip is generally packaged independently. Because there cannot be any obstacles that hinder the transmission of optical signals directly above the chip receiving area, the packaging cost of optical sensor chips is usually higher. Both transparent and opaque materials are required. Among them, the light-transmitting material is located directly above the chip receiving area and is a window for transmitting optical signals; the opaque material encapsulates the rest of the chip to protect the chip and prevent light crosstalk. When assembling the optical sensor module, the packaged optical sensor chip is soldered to the circuit board, and then the optical components (filters, lenses, etc.) are placed above the optical signal window. The optical module thus obtained not only has a large overall thickness, but also has high processing costs.
  • the application provides an optical sensing module and a manufacturing method thereof, which can effectively reduce the thickness of the optical sensing module.
  • an optical sensing module including: a printed circuit board (PCB) (110), an optical sensing chip (120), and an optical component (130).
  • the PCB (110) A first groove (111) is provided on the lower surface, and a first through hole (112) is provided between the upper surface of the PCB (110) and the first groove (111); the optical sensor The chip (120) is located in the first groove (111) and is electrically connected to the PCB (110).
  • the optical sensing chip (120) is directed to the PCB through the first through hole (112).
  • An optical signal receiving area (121) is exposed on the upper surface; the optical component (130) is disposed on the first through hole (112), and the optical component (130) covers the optical signal receiving area (121).
  • the optical component (130) covers the first through hole (112).
  • a second groove (114) is provided on an upper surface of the PCB (110), and the first through hole (112) Located between the second groove (114) and the first groove (111); the optical component (130) is located in the second groove (114).
  • the optical sensing chip (120) passes through a metal bump (122) and a pad (113) of the PCB (110). )connection.
  • the pad (113) of the PCB (110) is located in the first groove (111).
  • an electrode of the optical sensing chip (120) passes through a lead wire (123) and a pad (113) of the PCB (110). )connection.
  • a second through hole is further provided between the upper surface of the PCB (110) and the first groove (111). (115), a pad (113) of the PCB (110) is located on an upper surface of the PCB (110), and the lead (123) passes through the second through hole (115) and the PCB (110) The pad (113) is connected.
  • a second groove (114) is provided on an upper surface of the PCB (110), and the first through hole (112) Located between the second groove (114) and the first groove (111); the optical component (130) is located in the second groove (114); the second groove (114) ) Is provided with a second through hole (115) between the first groove (111), the pad (113) of the PCB (110) is located in the second groove (114), and the lead (123) connected to the pad (113) of the PCB (110) through the second through hole (115).
  • the optical sensor chip (120) is fixed to the first groove by a first adhesive layer (141) stuck on a back surface. (111).
  • the optical component (130) is fixed on the PCB (110) through a second adhesive layer (142).
  • a groove is provided on a lower surface thereof, and a through hole is provided between the groove and the upper surface, so that when the optical sensor chip is disposed in the groove, The optical signal receiving area of the optical sensor chip can be exposed through the through hole, and then the optical component is covered on the through hole to cover the optical signal receiving area.
  • the optical component can also be arranged in the groove of the PCB. In this way, the thickness of the optical sensor module can be effectively reduced, the assembly is simple, and the cost is low.
  • a method for manufacturing an optical sensing module includes: manufacturing a first groove on a lower surface of a PCB; and manufacturing a first groove between an upper surface of the PCB and the first groove.
  • a through hole; an optical sensor chip is set in the first groove, and the optical sensor chip is electrically connected to the PCB, and the optical sensor chip is connected to the through the first through hole
  • An optical signal receiving area is exposed on the upper surface of the PCB; an optical component is disposed on the first through hole, and the optical component covers the optical signal receiving area.
  • the optical component covers the first through hole.
  • the providing an optical component on the first through hole includes: making a second groove on an upper surface of the PCB The first through hole is located between the second groove and the first groove; and the optical component is disposed in the second groove.
  • the electrically connecting the optical sensing chip to the PCB includes: connecting the optical sensing via a metal bump A chip and a pad of the PCB.
  • the pads of the PCB are located in the first groove.
  • the electrically connecting the optical sensor chip to the PCB includes: Electrodes and pads of the PCB.
  • the method further includes: making a second through hole between the upper surface of the PCB and the first groove, The pads of the PCB are located on the upper surface of the PCB, and the leads are connected to the pads of the PCB through the multiple second through holes.
  • the method further includes: making a second groove on an upper surface of the PCB, and the first through hole is located in the Between the second groove and the first groove; setting the optical component in the second groove; making a second through hole between the second groove and the first groove The pad of the PCB is located in the second groove, and the lead is connected to the pad of the PCB through the second through hole.
  • the making the first groove on the upper surface of the PCB includes: adopting a mechanical or laser processing method, and The first groove is made on the surface.
  • the disposing the optical sensor chip in the first groove includes: attaching a back surface with a first adhesive layer The optical sensor chip is disposed in the first groove.
  • the providing an optical component on the first through hole includes: fixing the optical component to a second adhesive layer through On the PCB.
  • a groove is provided on the lower surface of the PCB of the optical sensing module, and a through hole is provided between the groove and the upper surface of the PCB, so that the optical When the sensor chip is disposed in the groove, the optical signal receiving area of the optical sensor chip can be exposed through the through hole, and then the optical component is covered on the through hole to cover the optical signal receiving area.
  • the component can also be set in the groove of the PCB, which can effectively reduce the thickness of the optical sensor module, simple assembly and low cost.
  • FIG. 1 is a schematic diagram of an optical sensing module according to an embodiment of the present application.
  • FIG. 2 is another schematic diagram of an optical sensing module according to an embodiment of the present application.
  • FIG. 3 is another schematic diagram of an optical sensing module according to an embodiment of the present application.
  • FIG. 4 is another schematic diagram of an optical sensing module according to an embodiment of the present application.
  • FIG. 5 is another schematic diagram of an optical sensing module according to an embodiment of the present application.
  • FIG. 6 is another schematic diagram of an optical sensing module according to an embodiment of the present application.
  • FIG. 7 is a schematic flowchart of a method for manufacturing an optical sensing module according to an embodiment of the present application.
  • FIG. 8 is a schematic diagram of a process of manufacturing an optical sensing module according to an embodiment of the present application.
  • FIG. 1 shows an optical sensing module 100 according to an embodiment of the present application.
  • FIG. 1 shows a schematic diagram of an optical sensing module 100 according to an embodiment of the present application.
  • the first image in FIG. 1 is a top view of the optical sensing module 100, and the second image is as the first image.
  • the optical sensing module 100 includes: a PCB 110, an optical sensing chip 120, and an optical component 130.
  • a first groove 111 is provided on the lower surface of the PCB 110, and a first through hole 112 is provided between the upper surface of the PCB 110 and the first groove 111; the optical sensor chip 120 is located on the first The groove 111 is electrically connected to the PCB 110, and the optical sensor chip 120 exposes the optical signal receiving area 121 to the upper surface of the PCB 110 through the first through hole 112; the optical component 130 is disposed in the first through hole On 112, the optical component 130 covers the optical signal receiving area 121.
  • the optical sensing chip 120 of the optical sensing module 100 in the embodiment of the present application includes a light signal receiving area 121.
  • the light signal receiving area 121 may be used to receive a light signal passing through the optical component 130, and implement photoelectricity. Signal conversion.
  • the optical component 130 in the optical sensing module 100 may be used to form an optical path, and may also be used to filter invalid optical signals.
  • the optical component 130 may include multiple devices.
  • the optical component 130 may include a lens.
  • a filter may also be included, and the embodiments of the present application are not limited thereto.
  • the optical component 130 in the optical sensing module 100 completely covers the optical signal receiving area 121. Since the optical signal receiving area 121 passes through the first groove 111 and the PCB provided on the lower surface of the PCB 110 A first through hole 112 is provided between the upper surfaces of 110, and the optical signal receiving area 121 is exposed to the upper surface of the PCB 110. Therefore, the optical component 130 covers the optical signal receiving area 121.
  • the optical component 130 can cover the first through hole.
  • the hole 112 is implemented, that is, the optical component 130 as shown in FIG. 1 covers the upper surface of the first through hole 112.
  • the optical component 130 in the embodiment of the present application may have any shape, for example, a circle or a square; the optical signal receiving area 121 may also have any shape, for example, it may be the same as or different from the shape of the optical component 130.
  • the embodiments of the present application are not limited thereto.
  • the optical sensor chip 120 is located in the first groove 111 on the lower surface of the PCB 110.
  • the thickness of the optical sensor chip 120 may be Greater than or equal to or less than the depth of the first groove 111, the thickness of the optical sensor chip 120 is generally set to be smaller than the depth of the first groove 111, so that the optical sensor chip 120 is disposed in the first groove 111 After that, the thickness of the optical sensor module is reduced by not exceeding the lower surface of the PCB board.
  • the optical sensor chip 120 may be fixed in the first groove 111 through the first adhesive layer 141 pasted on the back surface.
  • the first adhesive layer 141 may be glue, and the embodiment of the present application is not limited thereto.
  • the optical component 130 is fixed on the upper surface of the PCB 110, and specifically, may be fixed on the periphery of the first through hole.
  • the optical component 130 is located above the optical sensor chip 120 and covers the optical signal receiving area 121.
  • the optical component 130 covers the first through hole 112 to cover the optical signal receiving area 121.
  • the optical component 130 may be fixed on the upper surface of the PCB 110 by a second adhesive layer 142.
  • the second adhesive layer 142 may be glue, and the embodiment of the present application is not limited thereto.
  • FIG. 2 shows another schematic diagram of the optical sensing module 100 according to the embodiment of the present application, wherein the first picture in FIG. 2 is a top view of the optical sensing module 100, and the second picture is as the first picture A cross-sectional view of the A1-A2 cross section in the horizontal direction shown in the figure.
  • the upper surface of the PCB 110 in the optical sensing module 100 is provided with a second groove 114 so that the first through hole 112 is located between the second groove 114 and the first groove 111.
  • the optical component 130 may be disposed in the second groove 114.
  • the depth of the second groove 113 may be greater than or equal to or less than the thickness of the optical component 130, and the embodiment of the present application is not limited thereto.
  • the optical component 130 can also be fixed in the second groove 114 through a second adhesive layer 142.
  • the second adhesive layer 142 can be glue.
  • An appropriate amount of glue is coated on the periphery of a through hole 112 for fixing the optical component 130, and the embodiment of the present application is not limited thereto.
  • the optical sensing chip 120 in the optical sensing module 100 in the embodiment of the present application is electrically connected to the PCB 110, and may include: the optical sensing chip 120 is connected to the pad 113 of the PCB 110 through a metal bump 122 Connection; or, it may further include: the electrode of the optical sensor chip 120 is connected to the pad 113 of the PCB 110 through a lead 123.
  • a plurality of pads 113 may be provided in the first groove 111 on the lower surface of the PCB 110, and the optical sensor chip 120 passes through the metal bump 122 It is connected to the pad 113 of the PCB 110.
  • FIG. 3 shows still another schematic diagram of the optical sensing module 100 according to the embodiment of the present application, wherein the first image in FIG. 3 is a top view of the optical sensing module 100 and the second image is As shown in the horizontal cross-sectional view of the A1-A2 cross section shown in the first figure, as shown in FIG.
  • a second through hole 115 may also be provided between the upper surface of the PCB 110 and the first groove 111, so that the The electrode of the optical sensor chip 120 is connected to the pad 113 of the PCB 110 through a lead 123, where the lead 123 passes through the second through hole, and the pad 113 of the PCB 110 is disposed on the upper surface of the PCB 110.
  • the second through hole 115 At the periphery of the second through hole 115.
  • the electrodes of the optical sensor chip 120 can be located at both ends, and the corresponding second through holes 115 of the PCB 110 can be set at the corresponding positions of the electrodes, such as Two through holes 115 may be provided, which are respectively located at two ends of the optical sensor chip 120, corresponding to the positions of the electrodes, so that the lead wires 123 connected to the electrodes may pass through the second through holes 115 and be provided on the upper surface of the PCB 110, respectively.
  • the plurality of pads 113 are connected, and the embodiment of the present application is not limited thereto.
  • FIG. 4 shows still another schematic diagram of the optical sensor module 100 according to the embodiment of the present application, wherein the first image in FIG. 4 is a top view of the optical sensor module 100 and the second image is A cross-sectional view of the A1-A2 cross section in the horizontal direction as shown in the first figure.
  • the upper surface of the PCB 110 in the optical sensing module 100 is provided with a second groove 114 so that the first through hole 112 is located between the second groove 114 and the first groove 111.
  • the optical component 130 may be disposed in the second groove 114.
  • the depth of the second groove 113 may be greater than or equal to or less than the thickness of the optical component 130, and the embodiment of the present application is not limited thereto.
  • FIG. 5 shows still another schematic diagram of the optical sensing module 100 according to the embodiment of the present application, wherein the first image in FIG. 5 is a top view of the optical sensing module 100 and the second image is A cross-sectional view of the A1-A2 cross section in the horizontal direction as shown in the first figure.
  • the upper surface of the PCB 110 in the optical sensing module 100 is provided with a second groove 114 so that the first through hole 112 is located between the second groove 114 and the first groove 111.
  • the optical component 130 may be disposed in the second groove 114.
  • a second through hole 115 is provided between the second groove 114 on the upper surface of the PCB 110 and the first groove 111 on the lower surface.
  • the pad 113 of the PCB 110 may be located in the second groove 114.
  • the periphery of the second through hole 115 or the pad 113 of the PCB 110 may also be located at the periphery of the second groove 114 on the upper surface of the PCB 110, so that the lead wire 123 connected to the electrode of the optical sensor chip 120 passes through the second through hole 115 It is connected to the pad 113 of this PCB 110.
  • a second groove 114 is provided on the upper surface of the PCB 110, and a first passage is provided between the first groove 111 and the second groove 114. ⁇ 112 ⁇ ⁇ ⁇ ⁇ 115 ⁇ Hole 112 and second through hole 115.
  • the electrodes of the optical sensor chip 120 can be located at both ends, the corresponding second through holes 115 of the PCB 110 can be provided at the corresponding positions of the electrodes.
  • two through holes 115 can be provided at the first recesses.
  • the positions corresponding to the two ends of the optical sensor chip 120 in the slot 114 correspond to the positions of the electrodes, so that the leads 123 connected to the electrodes can be connected to the pads 113 of the PCB 110 through the second through holes 115 respectively.
  • the pad 113 may be provided on the upper surface of the PCB 110 and / or the second groove 114.
  • all or part of the pad 113 of the PCB 110 may be provided on the upper surface of the PCB 110, such as FIG.
  • the lead 123 and the pad 113 on the right side of the A1-A2 cross-sectional view; or, all or part of the pad 113 of the PCB 110 may be set in the second groove 114, for example, the coordinates of the A1-A2 cross-sectional view of FIG.
  • the lead 123 and the pad 113 are shown; the embodiment of the present application is not limited thereto.
  • FIG. 4 The other parts of the optical sensing module 100 shown in FIG. 4 are consistent with the parts of the optical sensing module 100 shown in FIG. 4.
  • the optical component 130 includes a plurality of devices, such as a lens and a filter
  • the plurality of devices may be located at different positions.
  • there may be at least one device in the plurality of devices may be located in the second groove 114, that is, the second groove 114 for setting the optical component 130 described above; there may also be at least one device in the plurality of devices. It is located on the upper surface of the PCB and is not provided in any groove; or, one or more grooves may be additionally provided on the upper surface of the PCB for correspondingly setting more devices, and the embodiment of the present application is not limited to this.
  • the optical component 130 includes a filter 131 and a lens 132 as an example, and it is assumed that a second groove 114 is provided on the upper surface of the PCB 110 in the optical sensing module 100.
  • the first through hole 112 and the second through hole 115 are both disposed between the second groove 114 and the first groove 111.
  • FIG. 6 shows still another schematic diagram of the optical sensing module 100 according to the embodiment of the present application, wherein the first diagram in FIG. 6 is a top view of the optical sensing module 100 and the second diagram is A cross-sectional view of the A1-A2 cross section in the horizontal direction as shown in the first figure. As shown in FIG.
  • the upper surface of the PCB 110 in the optical sensing module 100 is provided with a second groove 114 so that the first through hole 112 is located between the second groove 114 and the first groove 111.
  • the optical component 130 may be disposed in the second groove 114.
  • a second through hole 115 is provided between the second groove 114 on the upper surface of the PCB 110 and the first groove 111 on the lower surface.
  • the pad 113 of the PCB 110 may be located in the second groove 114.
  • the periphery of the second through hole 115 or the pad 113 of the PCB 110 may also be located at the periphery of the second groove 114 on the upper surface of the PCB 110, so that the lead wire 123 connected to the electrode of the optical sensor chip 120 passes through the second through hole 115 It is connected to the pad 113 of this PCB 110.
  • a filter 131 in the optical component 130 may be disposed in the second groove 114, and a lens 132 in the optical component 130 is disposed on the upper surface of the PCB 110, that is, the PCB. 110 except for the second groove portion; or, another PCB groove is further provided on the PCB 110, and the lens 132 in the optical component 130 is disposed in the other groove.
  • the embodiment of the present application is not limited thereto .
  • the optical component 130 in FIG. 6 includes two types of devices: a filter 131 and a lens 132, and the filter 131 is located in the second groove 114 and the lens 132 is located on the upper surface of the PCB 110, the figure
  • the other parts of the optical sensing module 100 shown in FIG. 6 are consistent with the parts of the optical sensing module 100 shown in FIG. 5. For the sake of brevity, details are not described herein again.
  • a groove is provided on a lower surface thereof, and a through hole is provided between the groove and the upper surface, so that when the optical sensor chip is disposed in the groove, The optical signal receiving area of the optical sensor chip can be exposed through the through hole, and then the optical component is covered on the through hole to cover the optical signal receiving area.
  • the optical component can also be arranged in the groove of the PCB. In this way, the thickness of the optical sensor module can be effectively reduced, the assembly is simple, and the cost is low.
  • the optical sensor module 100 may use a packaged optical sensor chip 120, or the optical sensor chip 120 may be an unpackaged chip but a packaged optical transmission chip. Compared with the unpackaged sensor chip, the sensor chip has a larger thickness, and the cost of the corresponding optical sensor module is also higher.
  • the packaging cost of the optical sensor chip is usually higher, and it is necessary to use light transmission and opacity.
  • Two kinds of light materials of which the transparent material is located directly above the chip receiving area and is a window for transmitting optical signals; the opaque material encapsulates the rest of the chip to protect the chip and prevent light crosstalk. This process is costly and complicated.
  • the lower surface of the optical sensing module 100 in the embodiment of the present application is provided with a first groove 112.
  • the optical sensing chip 120 is disposed in the first groove 112, and the optical signal receiving area is exposed through the through hole. Covering the optical component 130 on top of it can effectively prevent light leakage. In this way, it is not necessary to separately package the optical sensor chip 120, which reduces packaging complexity and costs.
  • FIG. 7 shows a schematic flowchart of a method 200 for manufacturing an optical sensing module according to an embodiment of the present application.
  • the optical sensing module may be the optical sensing module 100 in FIGS. 1 to 6.
  • the method 200 includes: S210, making a first groove on the lower surface of the PCB; S220, making a first through hole between the upper surface of the PCB and the first groove; S230, optically The sensor chip is disposed in the first groove and electrically connects the optical sensor chip with the PCB. The optical sensor chip exposes the optical signal receiving area to the upper surface of the PCB through the first through hole; S240, An optical component is disposed on the first through hole, and the optical component covers the optical signal receiving area.
  • FIG. 8 shows a schematic diagram of a process of manufacturing an optical sensing module 100 according to an embodiment of the present application.
  • the left-side row of FIG. 8 is a top view, and the right-side row is as shown in the first view.
  • a first groove is made on the lower surface of the PCB.
  • the PCB 110 is manufactured, and the manufacturing of the PCB 110 includes a circuit and a pad 113 designed in advance.
  • some of the pads 113 are located on the upper surface of the PCB 110, and some of the pads are located inside the PCB 110.
  • a first groove 111 is made on the lower surface of the PCB.
  • a second groove 114 may be provided on the upper surface of the PCB 110.
  • the sizes of the first groove 111 and the second groove 114 can be set according to actual applications, and the sizes of the two grooves include the bottom area and / depth of the groove.
  • the bottom area of the first groove 111 can be set according to the area of the optical sensor chip 120, and the depth of the first groove 111 can be set according to the thickness of the optical sensor chip 120; and the bottom area of the second groove 114 can be set as Those larger than the first groove 111 are not limited to this embodiment.
  • first groove and / or the second groove may be made on the PCB 110 by a mechanical or laser processing method, or other processing methods, and the embodiment of the present application is not limited thereto.
  • a first through hole 112 is made between the upper surface of the PCB 110 and the first groove 111. Specifically, a first through hole 112 is made between the second groove 114 and the first groove 111 on the upper surface of the PCB 110, and the first through hole 112 is used to set the optical sensor chip 120 in the first groove. The light signal receiving region 121 of the optical sensor chip 120 is exposed when it is inside 111. Therefore, the first through hole 112 can be manufactured according to the position and size of the light signal receiving region 121 in the optical sensor chip 120.
  • a second through hole 115 may also be made between the second groove 114 and the first groove 111, and the second through hole 115 is used to pass the lead 123. Therefore, the position and size of the second through hole 115 can be set according to the positions of the electrodes of the optical sensor chip 120. For example, as shown in FIG. 8 (3), each position is set at each end of the second groove 114. A second through hole 115.
  • the first through hole and / or the second through hole can be made on the PCB 110 by mechanical or laser processing, or other processing methods, and the embodiment of the present application is not limited thereto.
  • the optical sensing chip 120 is set in the first groove 111, and the optical sensing chip 120 is electrically connected to the PCB 110.
  • the optical sensing chip 120 is connected to the first through hole 112.
  • the upper surface of the PCB 110 exposes the light signal receiving area 121.
  • the optical sensor chip 120 is disposed in the first groove 111.
  • the optical sensor chip 120 and the first groove 111 are disposed through the first adhesive layer 141.
  • the bottom surface is fixed, wherein the thickness of the optical sensor chip 120 is smaller than the depth of the first groove 111.
  • the optical sensor chip 120 includes a light signal receiving area 121, and the light signal receiving area 121 is aligned with the first through hole 112, so that the light signal receiving area 121 is exposed to the upper surface of the PCB through the first through hole 112.
  • electrically connecting the optical sensor chip 120 to the PCB 110 includes connecting the electrodes of the optical sensor chip 120 and soldering on the PCB 110 by means of wire bonding.
  • Disk 113 in which, according to different application requirements, the arc height of the wire can be controlled by changing the position of the pad 113 of the PCB 110.
  • the left pad 113 is located in the second groove 114, and the lead 123 passes through the second through hole 115 to connect the electrode of the optical sensor chip 120 and the left pad 113 .
  • FIG. 8 (5) the left pad 113 is located in the second groove 114, and the lead 123 passes through the second through hole 115 to connect the electrode of the optical sensor chip 120 and the left pad 113 .
  • the right pad 113 is located on the periphery of the second groove 114 on the upper surface of the PBC 110, and the lead 123 is connected to the electrode of the optical sensor chip 120 through the second through hole 115. With the right pad 113.
  • An optical component 130 is disposed on the first through hole 112, and the optical component 130 covers the optical signal receiving area 121. Specifically, as shown in FIG. 6 (6), the optical component 130 is disposed in the second groove 114, and the optical component 130 may be fixed in the second groove 114 through the second adhesive layer 142, for example, in An appropriate amount of glue is coated at a corresponding position in the second groove 114 to fix the optical component 130.
  • the optical component 130 covers the optical signal receiving area 121. Since the optical signal receiving area 121 is exposed through the first through hole 112, the optical component 130 may cover the first The through-hole 112 is used to cover the optical signal receiving area 121, that is, a second adhesive layer 142 is coated on a frame of the first through-hole 112 in the second groove 114 to fix the optical component 130.
  • a groove is provided on the lower surface of the PCB of the optical sensing module, and a through hole is provided between the groove and the upper surface of the PCB, so that the optical When the sensor chip is disposed in the groove, the optical signal receiving area of the optical sensor chip can be exposed through the through hole, and then the optical component is covered on the through hole to cover the optical signal receiving area.
  • the component can also be set in the groove of the PCB, which can effectively reduce the thickness of the optical sensor module, simple assembly and low cost.
  • B corresponding to A means that B is associated with A, and B can be determined according to A.
  • determining B based on A does not mean determining B based on A alone, but also determining B based on A and / or other information.
  • the size of the sequence numbers of the above processes does not mean the order of execution.
  • the execution order of each process should be determined by its function and internal logic, and should not deal with the embodiments of the present application.
  • the implementation process constitutes any limitation.

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  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Light Receiving Elements (AREA)
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Abstract

本申请实施例涉及光学传感模组及其制作方法。该光学传感模组包括印制电路板PCB(110)、光学传感芯片(120)以及光学组件(130)，该PCB(110)下表面设置有第一凹槽(111)，该PCB(110)上表面与该第一凹槽(111)之间设置有第一通孔(112)；该光学传感芯片(120)位于该第一凹槽内(111)且与该PCB(110)电连接，该光学传感芯片(120)通过该第一通孔(112)向该PCB上表面露出光信号接收区(121)；该光学组件(130)设置在该第一通孔(112)上且覆盖该光信号接收区(121)。本申请实施例的光学传感模组及其制作方法，能够有效降低光学传感模组的厚度。

Description

光学传感模组及其制作方法 技术领域
本申请涉及光学传感器领域，尤其涉及光学传感模组及其制作方法。
背景技术
近年来，各类消费电子集成了越来越多的光学传感器。借助于光学传感器，手机、手表等智能终端可以实现环境光强度检测、距离检测、温度检测、心律检测、人脸、指纹、虹膜等生物特征识别等多种功能。
光学传感器的工作原理是通过芯片的接收区接收物体发射或反射的特定波长的光线，利用光电效应将光信号转换成电信号。一个简单的光学传感模组需要至少包括三个部分：用于形成光路以及过滤无效光信号的光学组件(透镜、滤光片等)、用于接收有效的光信号以实现光电信号转换的光学传感芯片以及用于传输电信号的外围电路。
在制作光学传感模组时，一般先将光学传感芯片独立封装。由于芯片接收区正上方不能存在任何妨碍光信号传输的障碍物，光学传感芯片的封装成本通常较高。需要使用透光和不透光两种材料。其中，透光材料位于芯片接收区正上方，是传输光信号的窗口；不透光材料则将芯片其余部分塑封，保护芯片并防止光串扰。在组装光学传感模组时，先将封装好的光学传感芯片焊接到电路板上，再将光学组件(滤光片、透镜等)放置于光信号窗口的上方。由此得到的光学模组，不仅整体厚度较大，而且加工成本高。
发明内容
本申请提供了一种光学传感模组及其制作方法，能够有效降低光学传感模组的厚度。
第一方面，提供了一种光学传感模组，包括：印制电路板(Printed Circuit Board，PCB)(110)、光学传感芯片(120)以及光学组件(130)，所述PCB(110)的下表面设置有第一凹槽(111)，所述PCB(110)的上表面与所述第一凹槽(111)之间设置有第一通孔(112)；所述光学传感芯片(120)位于所述第一凹槽内(111)且与所述PCB(110)电连接，所述光学传感芯片(120)通过所述第一通孔(112)向所述PCB的上表面露出光信号接收区(121)；所述光学组件(130)设置在所 述第一通孔(112)上，所述光学组件(130)覆盖所述光信号接收区(121)。
结合第一方面，在第一方面的一种实现方式中，所述光学组件(130)覆盖第一通孔(112)。
结合第一方面及其上述实现方式，在第一方面的另一种实现方式中，所述PCB(110)的上表面设置有第二凹槽(114)，所述第一通孔(112)位于所述第二凹槽(114)与所述第一凹槽(111)之间；所述光学组件(130)位于所述第二凹槽(114)内。
结合第一方面及其上述实现方式，在第一方面的另一种实现方式中，所述光学传感芯片(120)通过金属凸点(122)与所述PCB(110)的焊盘(113)连接。
结合第一方面及其上述实现方式，在第一方面的另一种实现方式中，所述PCB(110)的焊盘(113)位于所述第一凹槽(111)内。
结合第一方面及其上述实现方式，在第一方面的另一种实现方式中，所述光学传感芯片(120)的电极通过引线(123)与所述PCB(110)的焊盘(113)连接。
结合第一方面及其上述实现方式，在第一方面的另一种实现方式中，所述PCB(110)的上表面与所述第一凹槽(111)之间还设置有第二通孔(115)，所述PCB(110)的焊盘(113)位于所述PCB(110)的上表面，所述引线(123)通过所述第二通孔(115)与所述PCB(110)的焊盘(113)连接。
结合第一方面及其上述实现方式，在第一方面的另一种实现方式中，所述PCB(110)的上表面设置有第二凹槽(114)，所述第一通孔(112)位于所述第二凹槽(114)与所述第一凹槽(111)之间；所述光学组件(130)位于所述第二凹槽(114)内；所述第二凹槽(114)与所述第一凹槽(111)之间设置有第二通孔(115)，所述PCB(110)的焊盘(113)位于所述第二凹槽(114)内，所述引线(123)通过所述第二通孔(115)与所述PCB(110)的焊盘(113)连接。
结合第一方面及其上述实现方式，在第一方面的另一种实现方式中，所述光学传感芯片(120)通过背面粘贴的第一黏附层(141)固定在所述第一凹槽(111)内。
结合第一方面及其上述实现方式，在第一方面的另一种实现方式中，所述光学组件(130)通过第二黏附层(142)固定在所述PCB(110)上。
因此，本申请实施例的光学传感模组，在其下表面设置凹槽，并在该凹槽和上表面之间设置通孔，使得在将光学传感芯片设置在该凹槽内时，该光 学传感芯片的光信号接收区可以通过该通孔露出，再将光学组件覆盖在该通孔上实现覆盖该光信号接收区，其中，该光学组件也可以设置在该PCB的凹槽内，这样可以有效降低光学传感模组厚度，组装简单，成本较低。
第二方面，提供了一种制作光学传感模组的方法，该方法包括：在PCB的下表面制作第一凹槽；在所述PCB的上表面与所述第一凹槽之间制作第一通孔；将光学传感芯片设置在所述第一凹槽内，并将所述光学传感芯片与所述PCB电连接，所述光学传感芯片通过所述第一通孔向所述PCB的上表面露出光信号接收区；在所述第一通孔上设置光学组件，所述光学组件覆盖所述光信号接收区。
结合第二方面，在第二方面的一种实现方式中，所述光学组件覆盖第一通孔。
结合第二方面及其上述实现方式，在第二方面的另一种实现方式中，所述在所述第一通孔上设置光学组件，包括：在所述PCB的上表面制作第二凹槽，所述第一通孔位于所述第二凹槽与所述第一凹槽之间；将所述光学组件设置在所述第二凹槽内。
结合第二方面及其上述实现方式，在第二方面的另一种实现方式中，所述将所述光学传感芯片与所述PCB电连接，包括：通过金属凸点连接所述光学传感芯片与所述PCB的焊盘。
结合第二方面及其上述实现方式，在第二方面的另一种实现方式中，所述PCB的焊盘位于所述第一凹槽内。
结合第二方面及其上述实现方式，在第二方面的另一种实现方式中，所述将所述光学传感芯片与所述PCB电连接，包括：通过引线连接所述光学传感芯片的电极与所述PCB的焊盘。
结合第二方面及其上述实现方式，在第二方面的另一种实现方式中，所述方法还包括：在所述PCB的上表面与所述第一凹槽之间制作第二通孔，所述PCB的焊盘位于所述PCB的上表面，所述引线通过所述多第二通孔与所述PCB的焊盘连接。
结合第二方面及其上述实现方式，在第二方面的另一种实现方式中，所述方法还包括：在所述PCB的上表面制作第二凹槽，所述第一通孔位于所述第二凹槽与所述第一凹槽之间；将所述光学组件设置在所述第二凹槽内；在所述第二凹槽与所述第一凹槽之间制作第二通孔，所述PCB的焊盘位于 所述第二凹槽内，所述引线通过所述第二通孔与所述PCB的焊盘连接。
结合第二方面及其上述实现方式，在第二方面的另一种实现方式中，所述在PCB的上表面制作第一凹槽，包括：采用机械或激光加工方式，在所述PCB的下表面制作所述第一凹槽。
结合第二方面及其上述实现方式，在第二方面的另一种实现方式中，所述将光学传感芯片设置在所述第一凹槽内，包括：将背面粘贴有第一黏附层的所述光学传感芯片设置在所述第一凹槽内。
结合第二方面及其上述实现方式，在第二方面的另一种实现方式中，所述在所述第一通孔上设置光学组件，包括：通过第二黏附层将所述光学组件固定在所述PCB上。
因此，本申请实施例的制作光学传感模组的方法，在光学传感模组的PCB的下表面设置凹槽，并在该凹槽和PCB上表面之间设置通孔，使得在将光学传感芯片设置在该凹槽内时，该光学传感芯片的光信号接收区可以通过该通孔露出，再将光学组件覆盖在该通孔上实现覆盖该光信号接收区，其中，该光学组件也可以设置在该PCB的凹槽内，这样可以有效降低光学传感模组厚度，组装简单，成本较低。
附图说明
图1是根据本申请实施例的光学传感模组的示意图。
图2是根据本申请实施例的光学传感模组的另一示意图。
图3是根据本申请实施例的光学传感模组的再一示意图。
图4是根据本申请实施例的光学传感模组的再一示意图。
图5是根据本申请实施例的光学传感模组的再一示意图。
图6是根据本申请实施例的光学传感模组的再一示意图。
图7是根据本申请实施例的制作光学传感模组的方法的示意性流程图。
图8是根据本申请实施例的制作光学传感模组的过程的示意图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
图1示出了本申请实施例提出了一种光学传感模组100，下面以图1为例进行描述。图1示出了根据本申请实施例的光学传感模组100的示意图， 其中图1中的第一幅图为该光学传感模组100的俯视图，第二幅图为如第一幅图所示的水平方向上A1-A2截面的截面图。如图1所示，该光学传感模组100包括：PCB 110、光学传感芯片120以及光学组件130。具体地，该PCB 110的下表面设置有第一凹槽111，该PCB 110的上表面与该第一凹槽111之间设置有第一通孔112；该光学传感芯片120位于该第一凹槽内111且与该PCB 110电连接，该光学传感芯片120通过该第一通孔112向该PCB 110的上表面露出光信号接收区121；该光学组件130设置在该第一通孔112上，该光学组件130覆盖该光信号接收区121。
应理解，本申请实施例中的该光学传感模组100的光学传感芯片120包括光信号接收区121，该光信号接收区121可以用于接收经过光学组件130的光信号，以及实现光电信号的转换。
应理解，该光学传感模组100中的光学组件130可以用于形成光路，也可以用于过滤无效的光信号，该光学组件130可以包括多个器件，例如，该光学组件130可以包括透镜，也可以包括滤光片，本申请实施例并不限于此。
在本申请实施例中，该光学传感模组100中的光学组件130完全覆盖该光信号接收区121，由于该光信号接收区121通过PCB 110的下表面设置的第一凹槽111与PCB 110的上表面之间设置的第一通孔112，向该PCB 110的上表面露出光信号接收区121，因此，光学组件130覆盖该光信号接收区121可以通过光学组件130覆盖该第一通孔112来实现，即如图1所示的该光学组件130覆盖第一通孔112的上表面。
另外，本申请实施例中的该光学组件130可以为任意形状，例如，圆形或方形；该光信号接收区121也可以为任意形状，例如可以与该光学组件130的形状相同，也可以不同，本申请实施例并不限于此。
应理解，如图1所示，例如图1中的A1-A2截面图，光学传感芯片120位于PCB 110的下表面的第一凹槽111中，其中，该光学传感芯片120的厚度可以大于或者等于或者小于第一凹槽111的深度，通常将该光学传感芯片120的厚度设置为小于第一凹槽111的深度，以使得该光学传感芯片120设置在第一凹槽111内后，不超过PCB板的下表面，减少该光学传感模组的厚度。另外，该光学传感芯片120可以通过背面粘贴的第一黏附层141固定在第一凹槽111内，例如，该第一黏附层141可以为胶水，本申请实施例并不限于此。
类似的，如图1所示，例如图1中的A1-A2截面图，光学组件130固定在PCB 110的上表面，具体地，可以固定在第一通孔外围。该光学组件130位于光学传感芯片120的上方，覆盖该光信号接收区121，例如该光学组件130覆盖该第一通孔112以实现覆盖该光信号接收区121。其中，该光学组件130可以通过第二黏附层142固定在该PCB 110上表面，例如，该第二黏附层142可以为胶水，本申请实施例并不限于此。
在本申请实施例中，为了进一步降低该光学传感模组100的厚度，可以在该PCB 110上设置第二凹槽，将该光学组件130设置在该第二凹槽中，具体地，图2示出了根据本申请实施例的光学传感模组100的另一示意图，其中图2中的第一幅图为该光学传感模组100的俯视图，第二幅图为如第一幅图所示的水平方向上A1-A2截面的截面图。如图2所示，该光学传感模组100中的PCB 110的上表面设置有第二凹槽114，使得第一通孔112位于该第二凹槽114与第一凹槽111之间，可以将该光学组件130设置在该第二凹槽114中。其中，该第二凹槽113的深度可以大于或者等于或者小于该光学组件130的厚度，本申请实施例并不限于此。
如图2所示，该光学组件130同样可以通过第二黏附层142固定在该第二凹槽114中，例如，该第二黏附层142可以为胶水，在该第二凹槽114内且第一通孔112的外围涂布适量胶水，用于固定光学组件130，本申请实施例并不限于此。
应理解，除了图2中的PCB 110上设置有第二凹槽114以外，该图2所示的光学传感模组100的其他部分与图1所示的光学传感模组100的各部分保持一致，为了简洁，在此不再赘述。
应理解，本申请实施例的该光学传感模组100中的光学传感芯片120与PCB 110电连接，可以包括：该光学传感芯片120通过金属凸点122与该PCB 110的焊盘113连接；或者，还可以包括：该光学传感芯片120的电极通过引线123与PCB 110的焊盘113连接。
可选地，作为一个实施例，如图1和图2所示，在该PCB 110的下表面的第一凹槽111内可以设置多个焊盘113，光学传感芯片120通过金属凸点122与PCB 110的焊盘113连接。
可选地，作为一个实施例，该光学传感芯片120的电极还可以通过引线123与PCB 110的焊盘113连接。具体地，图3示出了根据本申请实施例的 光学传感模组100的再一示意图，其中图3中的第一幅图为该光学传感模组100的俯视图，第二幅图为如第一幅图所示的水平方向上A1-A2截面的截面图，如图3所示，该PCB 110的上表面与第一凹槽111之间还可以设置第二通孔115，使得该光学传感芯片120的电极通过引线123与PCB 110的焊盘113连接，其中，该引线123穿过该第二通孔，PCB 110的焊盘113该设置在PCB 110的上表面，例如可以设置在第二通孔115的外围。
例如，以如图3的A1-A2截面图所示为例，光学传感芯片120的电极可以位于两端，对应的可以将PCB 110的第二通孔115设置在电极的对应位置处，例如，可以设置两个通孔115，分别位于光学传感芯片120的两端，与电极所在位置对应，以便于连接电极的引线123可以分别通过该第二通孔115与设置在PCB 110的上表面的多个焊盘113相连，本申请实施例并不限于此。
应理解，除了图3中的PCB 110上设置有第二通孔115以及光学传感芯片120的电极通过引线123与焊盘113相连以外，该图3所示的光学传感模组100的其他部分与图1所示的光学传感模组100的各部分保持一致，为了简洁，在此不再赘述。
与图2类似，对于如图3所示的光学传感模组100，为了进一步降低该光学传感模组100的厚度，可以在如图3所示的该PCB 110上设置第二凹槽，将该光学组件130设置在该第二凹槽中。具体地，图4示出了根据本申请实施例的光学传感模组100的再一示意图，其中图4中的第一幅图为该光学传感模组100的俯视图，第二幅图为如第一幅图所示的水平方向上A1-A2截面的截面图。如图4所示，该光学传感模组100中的PCB 110的上表面设置有第二凹槽114，使得第一通孔112位于该第二凹槽114与第一凹槽111之间，可以将该光学组件130设置在该第二凹槽114中。并且，该第二凹槽113的深度可以大于或者等于或者小于该光学组件130的厚度，本申请实施例并不限于此。
应理解，除了图4中的PCB 110上设置有第二凹槽114以外，该图4所示的光学传感模组100的其他部分与图3所示的光学传感模组100的各部分保持一致，为了简洁，在此不再赘述。
可选地，作为一个实施例，对于图4所示的设置第二凹槽114和第二通孔115，为了减少加工工艺复杂度，可以将该第二通孔115设置在第二凹槽 114内。具体地，图5示出了根据本申请实施例的光学传感模组100的再一示意图，其中图5中的第一幅图为该光学传感模组100的俯视图，第二幅图为如第一幅图所示的水平方向上A1-A2截面的截面图。如图5所示，该光学传感模组100中的PCB 110的上表面设置有第二凹槽114，使得第一通孔112位于该第二凹槽114与第一凹槽111之间，可以将该光学组件130设置在该第二凹槽114中。同时，在该PCB 110的上表面的第二凹槽114与下表面的第一凹槽111之间设置第二通孔115，该PCB 110的焊盘113可以位于该第二凹槽114内的第二通孔115外围，或者PCB 110的焊盘113也可以位于PCB 110的上表面的第二凹槽114的外围，使得连接该光学传感芯片120电极的引线123通过该第二通孔115与该PCB 110的焊盘113连接。
例如，以如图5的A1-A2截面图所示为例，在PCB 110的上表面设置第二凹槽114，并在第一凹槽111与该第二凹槽114之间设置第一通孔112和第二通孔115。其中，由于光学传感芯片120的电极可以位于两端，对应的可以将PCB 110的第二通孔115设置在电极的对应位置处，例如，可以设置两个通孔115，分别位于第一凹槽114内对应光学传感芯片120的两端对应的位置，与电极所在位置对应，以便于连接电极的引线123可以分别通过该第二通孔115与PCB 110的焊盘113连接。可选地，该焊盘113可以设置在PCB 110的上表面和/或第二凹槽114内，例如，可以将PCB 110的全部或者部分焊盘113设置在PCB 110的上表面，例如图5的A1-A2截面图右边的引线123和焊盘113所示；或者，也可以将PCB 110的全部或者部分焊盘113设置在第二凹槽114内，例如图5的A1-A2截面图坐标的引线123和焊盘113所示；本申请实施例并不限于此。
应理解，除了图5中的第二通孔115设置在第二凹槽114内以及PCB110的焊盘113可以设置在第二凹槽114内和/或PCB 110的上表面以外，该图5所示的光学传感模组100的其他部分与图4所示的光学传感模组100的各部分保持一致，为了简洁，在此不再赘述。
应理解，若该光学组件130包括多个器件，例如包括透镜和滤光片，则该多个器件可以位于不同位置。例如，该多个器件中可能存在至少一个器件可以位于第二凹槽114内，即上述的用于设置光学组件130的第二凹槽114中；该多个器件中还可能存在至少一个器件可以位于PCB的上表面，没有设置在任何凹槽内；或者，还可以在该PCB的上表面额外再设置一个或多 个凹槽，用于对应的设置更多器件，本申请实施例并不限于此。
可选地，作为一个实施例，以该光学组件130包括滤光片131和透镜132为例进行说明，并且假设该光学传感模组100中的PCB 110的上表面设置有第二凹槽114，第一通孔112和第二通孔115均设置在第二凹槽114与第一凹槽111之间。具体地，图6示出了根据本申请实施例的光学传感模组100的再一示意图，其中图6中的第一幅图为该光学传感模组100的俯视图，第二幅图为如第一幅图所示的水平方向上A1-A2截面的截面图。如图6所示，该光学传感模组100中的PCB 110的上表面设置有第二凹槽114，使得第一通孔112位于该第二凹槽114与第一凹槽111之间，可以将该光学组件130设置在该第二凹槽114中。同时，在该PCB 110的上表面的第二凹槽114与下表面的第一凹槽111之间设置第二通孔115，该PCB 110的焊盘113可以位于该第二凹槽114内的第二通孔115外围，或者PCB 110的焊盘113也可以位于PCB 110的上表面的第二凹槽114的外围，使得连接该光学传感芯片120电极的引线123通过该第二通孔115与该PCB 110的焊盘113连接。
另外，如图6所示，还可以将光学组件130中的滤光片131设置在该第二凹槽114内，而该光学组件130中的透镜132设置在PCB 110的上表面，也就是PCB 110上除了第二凹槽的部分；或者，在该PCB110上进一步设置有另一个凹槽，将该光学组件130中的透镜132设置在该另一个凹槽内，本申请实施例并不限于此。
应理解，除了图6中的光学组件130包括滤光片131和透镜132两种器件，且其中的滤光片131位于第二凹槽114内，透镜132位于PCB 110的上表面以外，该图6所示的光学传感模组100的其他部分与图5所示的光学传感模组100的各部分保持一致，为了简洁，在此不再赘述。
因此，本申请实施例的光学传感模组，在其下表面设置凹槽，并在该凹槽和上表面之间设置通孔，使得在将光学传感芯片设置在该凹槽内时，该光学传感芯片的光信号接收区可以通过该通孔露出，再将光学组件覆盖在该通孔上实现覆盖该光信号接收区，其中，该光学组件也可以设置在该PCB的凹槽内，这样可以有效降低光学传感模组厚度，组装简单，成本较低。
可选地，在本申请实施例中，光学传感模组100可以使用经过封装的光学传感芯片120，或者，该光学传感芯片120可以为未经过封装的芯片，但经过封装的光学传感芯片相比于未封装的，厚度较大，对应的光学传感模组 的成本也较高。
对于独立封装的光学传感芯片，由于光学传感芯片的光信号接收区正上方不能存在任何妨碍光信号传输的障碍物，光学传感芯片的封装成本通常较高，需要使用透光和不透光两种材料，其中，透光材料位于芯片接收区正上方，是传输光信号的窗口；不透光材料则将芯片其余部分塑封，保护芯片并防止光串扰，该过程成本较高且工艺复杂。而本申请实施例中的光学传感模组100的下表面设置有第一凹槽112，将该光学传感芯片120设置在该第一凹槽112内，通过通孔露出光信号接收区，并在其上方覆盖光学组件130，可以有效防止漏光，这样，可以无需独立封装光学传感芯片120，降低封装复杂度，减少成本。
图7示出了根据本申请实施例的制作光学传感模组的方法200的示意性流程图，具体地，该光学传感模组可以为图1至图6中的光学传感模组100。如图7所示，该方法200包括：S210，在PCB的下表面制作第一凹槽；S220，在该PCB的上表面与该第一凹槽之间制作第一通孔；S230，将光学传感芯片设置在该第一凹槽内，并将该光学传感芯片与该PCB电连接，该光学传感芯片通过该第一通孔向该PCB的上表面露出光信号接收区；S240，在该第一通孔上设置光学组件，该光学组件覆盖该光信号接收区。
为了便于说明，下面结合图7和图8，以制作如图5所示的光学传感模组100为例进行说明。图8示出了根据本申请实施例的制作光学传感模组100的过程的示意图，其中，图8的左侧一列的图均为俯视图，而右侧一列的图为如第一幅图所示的水平方向的截面的截面图。
在S210中，在PCB的下表面制作第一凹槽。具体地，如图8中图(1)所示，在制作第一凹槽之前，制作该PCB110，制作该PCB110包括预先设计好电路和焊盘113。可选地，对于如图5所示的光学传感模组100，存在部分焊盘113位于PCB110的上表面，也存在部分焊盘位于PCB 110的内部中间位置。
如图8中图(2)所示，在PCB的下表面制作第一凹槽111，可选地，还可以在该PCB110的上表面设置第二凹槽114。其中，该第一凹槽111和第二凹槽114的尺寸可以根据实际应用设置，这两个凹槽的尺寸包括凹槽的底面积和/深度。例如，可以根据光学传感芯片120的面积设置第一凹槽111的底面积，根据光学传感芯片120的厚度设置第一凹槽111的深度；而将第 二凹槽114的底面积设置为大于第一凹槽111的，本申请实施例并不限于此。
具体地，可以通过机械或者激光的加工方式，或者其它加工方式，在PCB110上制作第一凹槽和/或第二凹槽，本申请实施例并不限于此。
在S220中，如图8中图(3)所示，在该PCB 110的上表面与该第一凹槽111之间制作第一通孔112。具体地，在该PCB 110上表面的第二凹槽114与第一凹槽111之间制作第一通孔112，该第一通孔112用于将光学传感芯片120设置在第一凹槽111内时露出该光学传感芯片120的光信号接收区121，因此，可以根据光学传感芯片120中光信号接收区121的位置与尺寸制作该第一通孔112。
可选地，如图8中图(3)所示，还可以在该第二凹槽114与第一凹槽111之间制作第二通孔115，该第二通孔115用于通过引线123，因此可以根据光学传感芯片120的电极的位置设置该第二通孔115的位置和大小，例如，如图8中图(3)所示，在第二凹槽114两端位置处各设置一个第二通孔115。
具体地，可以通过机械或激光加工的方式，或者其它加工方式，在PCB 110上制作第一通孔和/或第二通孔，本申请实施例并不限于此。
在S230中，将光学传感芯片120设置在该第一凹槽111内，并将该光学传感芯片120与该PCB 110电连接，该光学传感芯片120通过该第一通孔112向该PCB 110的上表面露出光信号接收区121。
具体地，如图8中图(4)所示，将光学传感芯片120设置在该第一凹槽111内，例如，通过第一黏附层141将光学传感芯片120与第一凹槽111的底面固定，其中，该光学传感芯片120的厚度小于该第一凹槽111的深度。该光学传感芯片120包括光信号接收区121，将该光信号接收区121与第一通孔112对齐，使得通过该第一通孔112向PCB的上表面露出该光信号接收区121。
可选的，如图8中图(5)所示，将该光学传感芯片120与该PCB 110电连接，包括：通过打线的方式连接光学传感芯片120的电极和PCB 110上的焊盘113，其中，根据不同的应用需求，可以通过更改PCB 110的焊盘113的位置来控制打线的弧高。例如，如图8中图(5)所示，左边的焊盘113位于第二凹槽114内，则引线123通过第二通孔115，连接光学传感芯片120的电极与左边的焊盘113。再例如，如图8中图(5)所示，右边的焊盘113位于PBC 110的上表面第二凹槽114外围，则引线123通过第二通孔115， 连接光学传感芯片120的电极与右边的焊盘113。
S240，在该第一通孔112上设置光学组件130，该光学组件130覆盖该光信号接收区121。具体地，如图8中图(6)所示，将光学组件130设置在第二凹槽114内，该光学组件130可以通过第二黏附层142固定在第二凹槽114内，例如，在该第二凹槽114内的相应位置涂布适量胶水，固定该光学组件130。
其中，如图8中图(6)所示，该光学组件130覆盖该光信号接收区121，由于该光信号接收区121通过第一通孔112露出，所以该光学组件130可以通过覆盖第一通孔112上来实现覆盖该光信号接收区121，即在第二凹槽114内的第一通孔112的边框处涂布第二黏附层142，以固定光学组件130。
因此，本申请实施例的制作光学传感模组的方法，在光学传感模组的PCB的下表面设置凹槽，并在该凹槽和PCB上表面之间设置通孔，使得在将光学传感芯片设置在该凹槽内时，该光学传感芯片的光信号接收区可以通过该通孔露出，再将光学组件覆盖在该通孔上实现覆盖该光信号接收区，其中，该光学组件也可以设置在该PCB的凹槽内，这样可以有效降低光学传感模组厚度，组装简单，成本较低。
应理解，在本申请实施例中，“与A相应的B”表示B与A相关联，根据A可以确定B。但还应理解，根据A确定B并不意味着仅仅根据A确定B，还可以根据A和/或其它信息确定B。
另外，本文中术语“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
应理解，在本申请的各种实施例中，上述各过程的序号的大小并不意味着执行顺序的先后，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本申请实施例的实施过程构成任何限定。
本领域普通技术人员可以意识到，以上结合附图详细描述了本申请的优选实施方式，但是，本申请并不限于上述实施方式中的具体细节。在本申请的技术构思范围内，专业技术人员可以对本申请的技术方案进行多种简单变型，这些简单变型均属于本申请的保护范围。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限 于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (21)

  1. 一种光学传感模组，其特征在于，包括：印制电路板PCB(110)、光学传感芯片(120)以及光学组件(130)，
    所述PCB(110)的下表面设置有第一凹槽(111)，所述PCB(110)的上表面与所述第一凹槽(111)之间设置有第一通孔(112)；
    所述光学传感芯片(120)位于所述第一凹槽内(111)且与所述PCB(110)电连接，所述光学传感芯片(120)通过所述第一通孔(112)向所述PCB(110)的上表面露出光信号接收区(121)；
    所述光学组件(130)设置在所述第一通孔(112)上，所述光学组件(130)覆盖所述光信号接收区(121)。
  2. 根据权利要求1所述的光学传感模组，其特征在于，所述光学组件(130)覆盖第一通孔(112)。
  3. 根据权利要求1或2所述的光学传感模组，其特征在于，
    所述PCB(110)的上表面设置有第二凹槽(114)，所述第一通孔(112)位于所述第二凹槽(114)与所述第一凹槽(111)之间；
    所述光学组件(130)位于所述第二凹槽(114)内。
  4. 根据权利要求1至3中任一项所述的光学传感模组，其特征在于，所述光学传感芯片(120)通过金属凸点(122)与所述PCB(110)的焊盘(113)连接。
  5. 根据权利要求4所述的光学传感模组，其特征在于，所述PCB(110)的焊盘(113)位于所述第一凹槽(111)内。
  6. 根据权利要求1至3中任一项所述的光学传感模组，其特征在于，所述光学传感芯片(120)的电极通过引线(123)与所述PCB(110)的焊盘(113)连接。
  7. 根据权利要求6所述的光学传感模组，其特征在于，所述PCB(110)的上表面与所述第一凹槽(111)之间还设置有第二通孔(115)，所述PCB(110)的焊盘(113)位于所述PCB(110)的上表面，所述引线(123)通过所述第二通孔(115)与所述PCB(110)的焊盘(113)连接。
  8. 根据权利要求6所述的光学传感模组，其特征在于，
    所述PCB(110)的上表面设置有第二凹槽(114)，所述第一通孔(112)位于所述第二凹槽(114)与所述第一凹槽(111)之间；
    所述光学组件(130)位于所述第二凹槽(114)内；
    所述第二凹槽(114)与所述第一凹槽(111)之间设置有第二通孔(115)，所述PCB(110)的焊盘(113)位于所述第二凹槽(114)内，所述引线(123)通过所述第二通孔(115)与所述PCB(110)的焊盘(113)连接。
  9. 根据权利要求1至8中任一项所述的光学传感模组，其特征在于，所述光学传感芯片(120)通过背面粘贴的第一黏附层(141)固定在所述第一凹槽(111)内。
  10. 根据权利要求1至9中任一项所述的光学传感模组，其特征在于，所述光学组件(130)通过第二黏附层(142)固定在所述PCB(110)上。
  11. 一种制作光学传感模组的方法，其特征在于，包括：
    在印制电路板PCB的下表面制作第一凹槽；
    在所述PCB的上表面与所述第一凹槽之间制作第一通孔；
    将光学传感芯片设置在所述第一凹槽内，并将所述光学传感芯片与所述PCB电连接，所述光学传感芯片通过所述第一通孔向所述PCB的上表面露出光信号接收区；
    在所述第一通孔上设置光学组件，所述光学组件覆盖所述光信号接收区。
  12. 根据权利要求11所述的方法，其特征在于，所述光学组件覆盖第一通孔。
  13. 根据权利要求11或12所述的方法，其特征在于，所述在所述第一通孔上设置光学组件，包括：
    在所述PCB的上表面制作第二凹槽，所述第一通孔位于所述第二凹槽与所述第一凹槽之间；
    将所述光学组件设置在所述第二凹槽内。
  14. 根据权利要求11至13中任一项所述的方法，其特征在于，所述将所述光学传感芯片与所述PCB电连接，包括：
    通过金属凸点连接所述光学传感芯片与所述PCB的焊盘。
  15. 根据权利要求14所述的方法，其特征在于，所述PCB的焊盘位于所述第一凹槽内。
  16. 根据权利要求11至13中任一项所述的方法，其特征在于，所述将所述光学传感芯片与所述PCB电连接，包括：
    通过引线连接所述光学传感芯片的电极与所述PCB的焊盘。
  17. 根据权利要求16所述的方法，其特征在于，所述方法还包括：
    在所述PCB的上表面与所述第一凹槽之间制作第二通孔，所述PCB的焊盘位于所述PCB的上表面，所述引线通过所述多第二通孔与所述PCB的焊盘连接。
  18. 根据权利要求16所述的方法，其特征在于，所述方法还包括：
    在所述PCB的上表面制作第二凹槽，所述第一通孔位于所述第二凹槽与所述第一凹槽之间；
    将所述光学组件设置在所述第二凹槽内；
    在所述第二凹槽与所述第一凹槽之间制作第二通孔，所述PCB的焊盘位于所述第二凹槽内，所述引线通过所述第二通孔与所述PCB的焊盘连接。
  19. 根据权利要求11至18中任一项所述的方法，其特征在于，所述在印制电路板PCB的上表面制作第一凹槽，包括：
    采用机械或激光加工方式，在所述PCB的下表面制作所述第一凹槽。
  20. 根据权利要求11至19中任一项所述的方法，其特征在于，所述将光学传感芯片设置在所述第一凹槽内，包括：
    将背面粘贴有第一黏附层的所述光学传感芯片设置在所述第一凹槽内。
  21. 根据权利要求11至20中任一项所述的方法，其特征在于，所述在所述第一通孔上设置光学组件，包括：
    通过第二黏附层将所述光学组件固定在所述PCB上。
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