WO2020029635A1 - 微型发声器件 - Google Patents

微型发声器件 Download PDF

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Publication number
WO2020029635A1
WO2020029635A1 PCT/CN2019/087537 CN2019087537W WO2020029635A1 WO 2020029635 A1 WO2020029635 A1 WO 2020029635A1 CN 2019087537 W CN2019087537 W CN 2019087537W WO 2020029635 A1 WO2020029635 A1 WO 2020029635A1
Authority
WO
WIPO (PCT)
Prior art keywords
plating layer
voice coil
circuit board
flexible circuit
diaphragm
Prior art date
Application number
PCT/CN2019/087537
Other languages
English (en)
French (fr)
Inventor
肖波
Original Assignee
瑞声声学科技(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2020029635A1 publication Critical patent/WO2020029635A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/06—Electromagnets; Actuators including electromagnets
    • H01F7/08—Electromagnets; Actuators including electromagnets with armatures
    • H01F7/081—Magnetic constructions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/041—Centering
    • H04R9/043—Inner suspension or damper, e.g. spider
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/12—Non-planar diaphragms or cones
    • H04R7/127—Non-planar diaphragms or cones dome-shaped
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone

Definitions

  • the utility model relates to the field of electro-acoustic conversion, in particular to a miniature sounding device.
  • micro-sounding devices used in this type of equipment are correspondingly more miniaturized, so that the micro-sounding devices cooperate with other peripheral components more compact.
  • the quality requirements of the micro-sounding devices used in them are becoming higher and higher.
  • the miniature sounding device includes a vibration system, and the voice coil in the vibration system is electrically connected to an external circuit through a flexible circuit board.
  • the pads on the flexible circuit board for the spot welding of the voice coil leads are kept at the same thickness, The voice coil lead spot welding is divided into the following steps:
  • the coating covers the voice coil leads.
  • step 1 requires a thinner coating
  • step 2 requires a thicker coating.
  • the existing plating level cannot perfectly meet the requirements of steps 1 and 2, and there is a risk of false soldering of the voice coil leads.
  • the purpose of the utility model is to provide a miniature sound emitting device which avoids the welding of the voice coil leads.
  • the miniature sounding device provided by the utility model comprises a vibration system and a fixing system.
  • the vibration system includes a diaphragm, a voice coil located below the diaphragm and driving the diaphragm to generate sound, and a flexible circuit connected to the voice coil.
  • Board, the diaphragm and the flexible circuit board are fixed on the fixing system, the voice coil includes a body and leads extending from the body, a pad is formed on the flexible circuit board, and the solder
  • the disk includes a base and a plating layer formed on the base.
  • the plating layer includes a first plating layer and a second plating layer extending from the first plating layer. The thickness of the first plating layer is greater than the thickness of the second plating layer. An end of the lead remote from the body is soldered to the pad and covered by the second plating layer.
  • the first plating layer is closer to the body than the second plating layer.
  • the orthographic projection areas of the first plating layer and the second plating layer on the base are the same.
  • the first plating layer and the second plating layer are disposed on a side of the base facing the voice coil.
  • the flexible circuit board is sandwiched between the voice coil and the diaphragm.
  • the flexible circuit board includes a first fixing portion fixed on the fixing system, a second fixing portion connected to the body, and an elastic connection connecting the first fixing portion and the second fixing portion.
  • the pad is formed on the second fixing portion.
  • the first fixing portion and the second fixing portion are ring-shaped, and the pad is located on a short axis side of the second fixing portion.
  • the fixing system includes a basin frame having a receiving space and a magnetic circuit system, the magnetic circuit system and the vibration system are contained in the basin frame, and the magnetic circuit system includes a magnetic bowl and is fixed on the basin frame.
  • a first magnet portion of a magnetic bowl, the voice coil is wound around an outer periphery of the first magnet portion, the pad extends from the second fixing portion in a direction away from the first fixing portion, and the first A relief portion corresponding to the pad is formed in a recess on the magnet portion.
  • the voice coil is located between the flexible circuit board and the diaphragm.
  • the flexible circuit board is sandwiched between the voice coil and the diaphragm.
  • the miniature sound-emitting device includes a base and a plating layer formed on the base by setting a pad of the flexible circuit board, the plating layer including a first plating layer and an independent layer.
  • the second plating layer extends from the first plating layer, the thickness of the second plating layer is greater than the thickness of the first plating layer, and an end of the lead remote from the body is soldered to the pad and covered by the second plating layer.
  • FIG. 1 is a schematic exploded perspective view of an embodiment of a miniature sounding device provided by the present utility model
  • FIG. 2 is a perspective view of the miniature sounding device shown in FIG. 1 after assembly;
  • FIG. 3 is a cross-sectional view of the miniature sounding device shown in FIG. 2 taken along line A-A;
  • FIG. 4 is a cross-sectional view of the miniature sounding device shown in FIG. 2 along line B-B;
  • FIG. 5 is a perspective view of a part of the structure of the micro sounding device shown in FIG. 1 after assembly;
  • FIG. 6 is a sectional view of a portion of the structure shown in FIG. 5;
  • FIG. 7 is a schematic structural diagram of a flexible circuit board in a part of the structure shown in FIG. 5;
  • FIG. 8 is a schematic exploded perspective view of another embodiment of a miniature sounding device provided by the present utility model.
  • FIG. 9 is a perspective view of the miniature sounding device shown in FIG. 8 after assembly;
  • FIG. 10 is a cross-sectional view of the miniature sounding device shown in FIG. 9 along a line C-C;
  • FIG. 11 is a cross-sectional view of the miniature sounding device shown in FIG. 9 taken along the line D-D;
  • FIG. 12 is a schematic structural diagram of a flexible circuit board in the micro sounding device shown in FIG. 8.
  • the micro-sound generating device 100 includes a fixing system 1 and a vibration system 3.
  • the fixing system 1 includes a basin frame 5 and a magnetic circuit system 7 having a receiving space, the vibration system 3 and the magnetic circuit system 7 are housed in the basin frame 5, and the magnetic circuit system 7 drives the The vibration system 3 vibrates and sounds.
  • the vibration system 3 includes a diaphragm 31, a voice coil 32 located below the diaphragm 31 and driving the diaphragm 31 to vibrate and generate sound, and a flexible circuit board 33 connected to the voice coil 32.
  • the flexible circuit board 33 is fixed on the basin frame 5 of the fixing system 1.
  • the voice coil 32 is connected to an external circuit through the flexible circuit board 33. After the voice coil 32 is powered on, the voice coil 32 will vibrate under the magnetic field of the magnetic circuit system 7, and at the same time, The voice coil 32 drives the diaphragm 31 to vibrate and sound.
  • the voice coil 32 includes a body 321 and a lead wire 323 extending from the body 321.
  • a pad 33A is formed on the flexible circuit board 33 to be soldered to the lead 323.
  • the pad 33A includes a base 33B and a plating layer 33C formed on the base 33B.
  • the plating layer 33C includes a first plating layer 33D and a second plating layer 33E extending from the first plating layer 33D.
  • the first plating layer 33D Is thicker than the thickness of the second plating layer 33E, and an end of the lead 323 far from the body 321 is soldered to the pad 33A and covered by the second plating layer 33E.
  • the first plating layer 33D is closer to the body 321 than the second plating layer 33E.
  • the orthographic projection areas of the first plating layer 33D and the second plating layer 33E on the base 33B are the same.
  • the first plating layer 33D and the second plating layer 33E are disposed on a side of the base 33B facing the voice coil 32.
  • the flexible circuit board 33 is sandwiched between the voice coil 32 and the diaphragm 31. After the voice coil 32 is powered on, the flexible circuit board 33 vibrates together with the voice coil 32. Specifically, the flexible circuit board 33 is sandwiched between the body 321 of the voice coil 32 and the diaphragm 31.
  • the flexible circuit board 33 includes a first fixing portion 331 fixed on the basin frame 5 of the fixing system 1, a second fixing portion 333 connected to the body 321, and the connection The first fixing portion 331 and the elastic connecting portion 335 of the second fixing portion 333, and the pad 33A is formed on the second fixing portion 333.
  • the first fixing portion 331 and the second fixing portion 333 are both annular.
  • the second fixing portion 333 has a rectangular structure as a whole.
  • the pad 33A is located on a long axis side of the second fixing portion 333, and the pad 33A is away from the first fixing portion 331 from the second fixing portion 333. extend.
  • the diaphragm 31 includes a sound film 35 and a dome 37 fixed on a side of the sound film 35 facing away from the voice coil 32.
  • the sound film 35 includes a flat portion 351, a folded ring portion 353 extending outward from the flat portion 351, and a joint portion 355 surrounding the folded ring portion 353.
  • the flat portion 351 is sandwiched between the flexible portions. Between the second fixing portion 333 and the dome 37 of the circuit board 33, the opening of the folded ring portion 353 faces the flexible circuit board 33 to avoid the elastic connection portion 335, and the coupling portion 355 is fixed On the first fixing portion 331 of the flexible circuit board 33, the diaphragm 31 and the flexible circuit board 33 are fixed on the basin frame 5 of the fixing system 1. As shown in FIG. 1, the flat portion 351 has a center-cut hole 357, and the dome 37 covers the center-cut hole 357.
  • the flat portion 351 may not have a central hole, that is, the flat portion 351 is a complete flat structure; or the dome 37 is sandwiched between the dome 37 Between the flat portion 351 and the second fixing portion 333 of the flexible circuit board 33; or, when the flat portion 351 is a complete flat structure, the diaphragm 31 may not include a dome, The second fixing portion 333 of the flexible circuit board 33 is sandwiched between the flat portion 351 and the body 321 ′ of the voice coil 32.
  • the magnetic circuit system 7 includes a magnetic bowl 71, a first magnet portion 73, and a second magnet portion 75.
  • the magnetic bowl 71 is fixed on the basin frame 5.
  • the portion 75 is fixed to the magnetic bowl 71, and the second magnet portion 75 is provided around the first magnet portion 73 and forms a magnetic gap with the first magnet portion 73.
  • One end of the body 321 is inserted into the magnetic gap, so that after the voice coil 32 is energized, the voice coil 32 will vibrate under the magnetic field of the magnetic circuit system 7.
  • the magnetic bowl 71 includes a bottom plate 711, side plates 713 formed by bending and extending from the four sides of the bottom plate 711 toward the vibration direction of the diaphragm 31, the first magnet portion 73 and the second magnet
  • the portion 75 is fixed on the bottom plate 711, and the side plate 713 is fixed on the basin frame 5.
  • the first magnet portion 73 is directly opposite the diaphragm 31, and an avoiding portion 77 corresponding to the pad 33A is formed in the first magnet portion 73, wherein the avoiding portion 77 is formed from the first
  • the surface of the magnet portion 73 facing the diaphragm 31 is recessed in a direction away from the diaphragm 31.
  • the orthographic projection of the second fixing portion 333 along the vibration direction of the diaphragm 31 falls on the first magnet portion 73, in order to prevent the flexible circuit board 33 from following the voice coil When the 32 is vibrated, the second fixing portion 333 of the flexible circuit board 33 collides with the first magnet portion 73, and the first magnet portion 73 is further recessed to prevent the second fixing portion 333 from being formed. Ring-shaped yielding part 79.
  • the first magnet portion 73 includes a pole core 731 and a main magnetic steel 733.
  • the pole core 731 faces the diaphragm 31, and the main magnetic steel 733 is sandwiched between the pole core 731 and the magnetic bowl 71. Between the bottom plate 711, the avoidance portion 77 and the allowance portion 79 are formed on the pole core 731.
  • the second magnet portion 75 includes a secondary magnetic steel 751 fixed on the bottom plate 711 and arranged around the main magnetic steel 733, and a clamping plate 753 fixed on the basin frame 5 and stacked on the secondary magnetic steel 751.
  • the clamping plate 753 is made of a magnetic conductive material.
  • the clamping plate 753 has a through hole.
  • the pole core 731 is located in the through hole of the clamping plate 753 and is on the same plane as the clamping plate 753.
  • the miniature sound emitting device 100 further includes a cover 9 covered on the basin frame 5.
  • the cover 9 is provided with a sound outlet 91, and the sound outlet 91 is used for the vibration and sound of the diaphragm 31. Sound channel.
  • the micro-sound generating device 200 includes a fixing system 1 ′ and a vibration system 3 ′.
  • the fixing system 1 ' includes a basin frame 5' having a receiving space and a magnetic circuit system 7 ', the vibration system 3' and the magnetic circuit system 7 'are housed in the basin frame 5', and the magnetic The road system 7 'drives the vibration system 3' to vibrate and sound.
  • the vibration system 3 ' includes a diaphragm 31', a voice coil 32 'located below the diaphragm 31' and driving the diaphragm 31 'to generate sound, and a flexible circuit board 33' connected to the voice coil 32 '.
  • the diaphragm 31 'and the flexible circuit board 33' are fixed on the basin frame 5 'of the fixing system 1'.
  • the voice coil 32 ' is connected to an external circuit through the flexible circuit board 33'. After the voice coil 32 'is energized, the voice coil 32' will vibrate under the action of the magnetic field of the magnetic circuit system 7 ' At the same time, the voice coil 32 'drives the diaphragm 31' to vibrate and sound.
  • the voice coil 32 ' includes a body 321' and a lead wire 323 'extending from the body 321'.
  • the body 321 ' includes a pair of long-axis edges 325' and a pair of short-axis edges 327 '.
  • the short circuit sides 327 ' are respectively provided with the flexible circuit boards 33'.
  • the flexible circuit board 33 ' is used to support the body 321', so that the body 321 'can be restricted from swinging in the long axis direction.
  • one of the two flexible circuit boards 33 ′ is formed with a pad 33A ′ to be soldered to the lead 323 ′; or one of the two flexible circuit boards 33 ′ is formed with two and The bonding pad 33A 'of the lead 323'.
  • one of the flexible circuit boards 33 ' is formed with two pads 33A' soldered to the leads 323 '.
  • the pad 33A ′ includes a base 33B ′ and a plating layer 33C ′ formed on the base 33B ′.
  • the plating layer 33C ′ includes a first plating layer 33D ′ and a second plating layer 33E extending from the first plating layer 33D ′.
  • the thickness of the first plating layer 33D' is greater than the thickness of the second plating layer 33E ', and an end of the lead 323' far from the body 321 'is soldered to the pad 33A' and the second plating layer is used. 33E 'covered.
  • the first plating layer 33D ′ is closer to the body 321 ′ than the second plating layer 33E ′.
  • the orthographic projection areas of the first plating layer 33D ′ and the second plating layer 33E ′ on the base 33B ′ are the same.
  • the first plating layer 33D ′ and the second plating layer 33E ′ are disposed on a side of the base 33B ′ facing the voice coil 32 ′.
  • the voice coil 32 ' is located between the flexible circuit board 33' and the diaphragm 31 '.
  • the flexible circuit board 33 ' is sandwiched between the voice coil 32' and the diaphragm 31 ', and after the voice coil 32' is powered on, the flexible circuit board 33 '
  • the voice coil 32 ' vibrates together; specifically, the flexible circuit board 33' is sandwiched between the voice coil 32 ' 'Between the body 321' and the diaphragm 31 '.
  • the vibration system 3' may further include a lower diaphragm, which is attached to the flexible circuit board 33 'away from the voice coil 32'. Or the lower diaphragm is sandwiched between the flexible circuit board 33 'and the voice coil 32'. Wherein, after the voice coil 32 ′ is powered on, the lower diaphragm and the flexible circuit board 33 ′ are vibrated together with the voice coil 32 ′, so that the pronunciation effect can be enhanced.
  • the flexible circuit board 33 ' includes a first fixing portion 331' fixed on the basin frame 5 'of the fixing system 1', a second fixing portion 333 'connected to the body 321', and the connection The elastic connection portion 335 'of the first fixing portion 331' and the second fixing portion 333 ', and the pad 33A' is formed on the second fixing portion 333 '.
  • the pad 33A ' extends from the second fixing portion 333' in a direction away from the body 321 '.
  • the diaphragm 31 ′ includes a sound film 35 ′ and a dome 37 ′ fixed on a side of the sound film 35 ′ facing away from the voice coil 32 ′.
  • the sound film 35 includes a flat portion 351', a folded portion 353 'extending outward from the flat portion 351', and a joint portion 355 'surrounding the folded portion 353'.
  • the flat portion 351 'Clamped between the body 321' and the dome 37 'of the voice coil 32', and the joint portion 355 ' is fixed to a portion of the basin frame 5' away from the flexible circuit board 33 ' side.
  • the flat portion 351 has a center-cut hole 357, and the dome 37 covers the center-cut hole 357 ′.
  • the flat portion 351 ′ may not have a central hole, that is, the flat portion 351 ′ is a complete flat structure; or the dome 37 ′ is clamped.
  • the diaphragm 31 ′ may be provided between the flat portion 351 ′ and the body 321 ′ of the voice coil 32 ′; or, in a case where the flat portion 351 ′ is a complete flat structure, the diaphragm 31 ′ may also be The dome is not included, and the body 321 'of the voice coil 32' is sandwiched between the flat portion 351 'and the second fixing portion 333' of the flexible circuit board 33 '.
  • the magnetic circuit system 7 ′ includes a magnetic bowl 71 ′, a first magnet portion 73 ′, and a second magnet portion 75 ′.
  • the magnetic bowl 71 ′ is fixed on the basin frame 5 ′, and the first magnet portion 73 'And the second magnet portion 75' are fixed to the magnetic bowl 71 ', and the second magnet portion 75' is provided on both sides of the first magnet portion 73 'in the short-axis direction and is connected to the first
  • a magnetic gap is formed between a magnet portion 73 ', and one end of the body 321' of the voice coil 32 'is inserted into the magnetic gap, so that after the voice coil 32' is energized, the voice coil 32 'will
  • the magnetic circuit system 7 ' vibrates under the action of a magnetic field.
  • the magnetic bowl 71 ′ includes a bottom plate 711 ′, side plates 713 ′ formed by bending and extending from the four sides of the bottom plate 711 ′ toward the diaphragm 31 ′, and the first magnet portion 73 ′.
  • the second magnet portion 75 ' is fixed on the bottom plate 711', and the side plate 713 'is fixed on the basin frame 5'.
  • the first magnet portion 73 ′ faces the diaphragm 31 ′
  • the first magnet portion 73 ′ includes a pole core 731 ′ and a main magnetic steel 733 ′
  • the pole core 731 ′ faces the diaphragm 31
  • the main magnetic steel 733 ' is sandwiched between the pole core 731' and the bottom plate 711 'of the magnetic bowl 71'.
  • the second magnet portion 75 ' includes a secondary magnetic steel 751' fixed to the bottom plate 711 'and surrounding the main magnetic steel 733', and fixed to the basin frame 5 'and stacked on the secondary magnetic steel.
  • the micro-sounding device 200 further includes a cover 9 'covered on the basin frame 5'.
  • the cover 9 ' is provided with a sound outlet 91', and the sound outlet 91 'is used for the The diaphragm 31 'vibrates and emits sound.
  • the miniature sound emitting device 100 includes a base and a plating layer formed on the base by setting the pads of the flexible circuit board 33 to include a first plating layer and a first plating layer from the first plating layer.
  • An extended second plating layer, the thickness of the second plating layer is greater than the thickness of the first plating layer, and an end of the lead remote from the body is soldered to the pad and covered by the second plating layer.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本实用新型提供了一种微型发声器件。所述微型发声器件包括振动系统及固定系统，所述振动系统包括振膜、位于所述振膜下方并驱动所述振膜振动发声的音圈以及连接所述音圈的柔性电路板，所述振膜和所述柔性电路板固定于所述固定系统上，所述音圈包括本体及自所述本体延伸出来的引线，所述柔性电路板上形成有焊盘，所述焊盘包括底座以及形成在所述底座上的镀层，所述镀层包括第一镀层以及自所述第一镀层延伸的第二镀层，所述第一镀层的厚度大于所述第二镀层的厚度，所述引线远离所述本体的一端与所述焊盘焊接并由所述第二镀层覆盖。与相关技术相比，本实用新型提供的微型发声器件避免音圈引线虚焊的问题。

Description

微型发声器件 技术领域
本实用新型涉及电声转换领域，尤其涉及一种微型发声器件。
 背景技术
为适应各种音响设备与信息通信设备的小型化、多功能化发展，要求该类设备中所使用的微型发声器件对应更加趋于小型化，使所述微型发声器件与周边其他元件的配合更加紧凑。特别随着移动电话轻薄化发展的需求，对其中所使用的微型发声器件的质量要求也越来越高。
微型发声器件包括振动系统，振动系统中的音圈通过柔性电路板与外部电路电连接，然而，相关技术中，柔性电路板上用于音圈引线点焊的焊盘的镀层保持同一厚度，而音圈引线点焊分为如下步骤：
1、击穿音圈引线的绝缘层；
2、镀层覆盖音圈引线。
其中，步骤1 需要镀层偏薄，而步骤2需要镀层偏厚。现有镀层水平无法完美满足步骤1和2的要求，存在音圈引线虚焊的风险。
因此，实有必要提供一种新的微型发声器件解决上述问题。
 技术问题
本实用新型的目的在于提供一种避免音圈引线虚焊的微型发声器件。
 技术解决方案
本实用新型提供的微型发声器件，包括振动系统及固定系统，所述振动系统包括振膜、位于所述振膜下方并驱动所述振膜振动发声的音圈以及连接所述音圈的柔性电路板，所述振膜和所述柔性电路板固定于所述固定系统上，所述音圈包括本体及自所述本体延伸出来的引线，所述柔性电路板上形成有焊盘，所述焊盘包括底座以及形成在所述底座上的镀层，所述镀层包括第一镀层以及自所述第一镀层延伸的第二镀层，所述第一镀层的厚度大于所述第二镀层的厚度，所述引线远离所述本体的一端与所述焊盘焊接并由所述第二镀层覆盖。
优选地，所述第一镀层相对于所述第二镀层更加靠近所述本体。
优选地，所述第一镀层和所述第二镀层在所述底座上的正投影面积相同。
优选地，所述第一镀层和所述第二镀层设置在所述底座朝向所述音圈的一侧。
优选地，所述柔性电路板夹设在所述音圈与所述振膜之间。
优选地，所述柔性电路板包括固定于所述固定系统上的第一固定部、与所述本体连接的第二固定部及连接所述第一固定部和所述第二固定部的弹性连接部，所述焊盘形成于所述第二固定部上。
优选地，所述第一固定部和所述第二固定部呈环状，所述焊盘位于所述第二固定部的短轴边上。
优选地，所述固定系统包括具有收容空间的盆架以及磁路系统，所述磁路系统和所述振动系统收容于所述盆架内，所述磁路系统包括磁碗和固定在所述磁碗的第一磁体部，所述音圈绕设在所述第一磁体部外周，所述焊盘自所述第二固定部朝远离所述第一固定部的方向延伸，所述第一磁体部上凹陷形成有与所述焊盘对应的避让部。
优选地，所述音圈位于所述柔性电路板和所述振膜之间。
优选地，所述柔性电路板夹设在所述音圈与所述振膜之间。
 有益效果
与相关技术相比，本实用新型提供的微型发声器件，通过将所述柔性电路板的焊盘设置成，包括底座以及形成在所述底座上的镀层，所述镀层包括第一镀层以及自所述第一镀层延伸的第二镀层，所述第二镀层的厚度大于所述第一镀层的厚度，所述引线远离所述本体的一端与所述焊盘焊接并由所述第二镀层覆盖。从而使得所述引线与所述焊盘焊接时，便于击穿所述引线的绝缘层，且镀层能更好的覆盖所述引线的击穿区域，从而避免了音圈虚焊风险。
 附图说明
图1为本实用新型提供的微型发声器件一实施例的立体分解示意图；
图2为图1所示微型发声器件组装后的立体图；
图3为图2所示微型发声器件沿A-A线的剖视图；
图4为图2所示微型发声器件沿B-B线的剖视图；
图5为图1所示微型发声器件中部分结构组装后的立体图；
图6为图5所示部分结构的剖视图；
图7为图5所示部分结构中柔性电路板的结构示意图；
图8为本实用新型提供的微型发声器件另一实施例的立体分解示意图；
图9为图8所示微型发声器件组装后的立体图；
图10为图9所示微型发声器件沿C-C线的剖视图；
图11为图9所示微型发声器件沿D-D线的剖视图；
图12为图8所示微型发声器件中柔性电路板的结构示意图。
 本发明的实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本实用新型一部份实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本实用新型保护的范围。
实施例一
如图1至图7所示，所述微型发声器件100包括固定系统1及振动系统3。所述固定系统1包括具有收容空间的盆架5和磁路系统7，所述振动系统3和所述磁路系统7收容于所述盆架5内，且所述磁路系统7驱动所述振动系统3振动发声。
所述振动系统3包括振膜31、位于所述振膜31下方并驱动所述振膜31振动发声的音圈32以及连接所述音圈32的柔性电路板33，所述振膜31和所述柔性电路板33固定于所述固定系统1的所述盆架5上。其中，所述音圈32通过所述柔性电路板33与外部电路连接，所述音圈32通电后，所述音圈32会在所述磁路系统7磁场的作用下振动，与此同时，所述音圈32带动所述振膜31振动发声。
所述音圈32包括本体321及自所述本体321延伸出来的引线323。
所述柔性电路板33上形成有与所述引线323焊接的焊盘33A。
所述焊盘33A包括底座33B以及形成在所述底座33B上的镀层33C，所述镀层33C包括第一镀层33D以及自所述第一镀层33D延伸的第二镀层33E，所述第一镀层33D的厚度大于所述第二镀层33E的厚度，所述引线323远离所述本体321的一端与所述焊盘33A焊接并由所述第二镀层33E覆盖。
在本实施例中，所述第一镀层33D相对于所述第二镀层33E更加靠近所述本体321。
在本实施例中，所述第一镀层33D和所述第二镀层33E在所述底座33B上的正投影面积相同。
在本实施例中，所述第一镀层33D和所述第二镀层33E设置在所述底座33B朝向所述音圈32的一侧。
所述柔性电路板33夹设在所述音圈32与所述振膜31之间。所述音圈32通电后，所述柔性电路板33随所述音圈32一同振动。具体地，所述柔性电路板33夹设在所述音圈32的所述本体321与所述振膜31之间。
在本实施例中，所述柔性电路板33包括固定于所述固定系统1的所述盆架5上的第一固定部331、与所述本体321连接的第二固定部333及连接所述第一固定部331和所述第二固定部333的弹性连接部335，所述焊盘33A形成于所述第二固定部333上。
所述第一固定部331和所述第二固定部333均呈环状。
所述第二固定部333整体为长方形结构。在本实施例中，所述焊盘33A位于所述第二固定部333的长轴边上，且所述焊盘33A自所述第二固定部333朝远离所述第一固定部331的方向延伸。
所述振膜31包括音膜35及固设于所述音膜35背离所述音圈32一侧的球顶37。
所述音膜35包括平坦部351、自所述平坦部351向外延伸的折环部353及环绕于所述折环部353周围的结合部355，所述平坦部351夹设于所述柔性电路板33的所述第二固定部333和所述球顶37之间，所述折环部353的开口朝向所述柔性电路板33以避让所述弹性连接部335，所述结合部355固定于所述柔性电路板33的所述第一固定部331上，从而实现所述振膜31和所述柔性电路板33固定于所述固定系统1的所述盆架5上。如图1所示，所述平坦部351具有切中孔357，所述球顶37覆盖所述切中孔357。当然，在所述振膜31的其他实施方式中，所述平坦部351也可以不具有切中孔，即所述平坦部351为完整的平板结构；或者，所述球顶37夹设于所述平坦部351与所述柔性电路板33的所述第二固定部333之间；或者，在所述平坦部351为完整的平板结构的情况下，所述振膜31还可以不包括球顶，而所述柔性电路板33的所述第二固定部333夹设于所述平坦部351和所述音圈32的所述本体321'之间。
所述磁路系统7包括磁碗71、第一磁体部73及第二磁体部75，所述磁碗71固持于所述盆架5上，所述第一磁体部73和所述第二磁体部75固定在所述磁碗71，且所述第二磁体部75环绕所述第一磁体部73设置并与所述第一磁体部73之间形成磁间隙，所述音圈32的所述本体321的一端插入所述磁间隙，以使得所述音圈32通电后，所述音圈32会在所述磁路系统7磁场的作用下振动。
所述磁碗71包括底板711、自所述底板711的四个侧边向所述振膜31的放向弯折延伸形成的侧板713，所述第一磁体部73和所述第二磁体部75固定在所述底板711上，所述侧板713固定于所述盆架5上。
所述第一磁体部73正对所述振膜31，所述第一磁体部73上凹陷形成有与所述焊盘33A对应的避让部77，其中，所述避让部77自所述第一磁体部73朝向所述振膜31的表面向远离所述振膜31的方向凹陷形成。在本实施例中，由于所述第二固定部333沿所述振膜31振动方向上的正投影落在所述第一磁体部73上，为了避免所述柔性电路板33随所述音圈32振动时，所述柔性电路板33的所述第二固定部333与所述第一磁体部73发生碰撞，所述第一磁体部73上还凹陷形成有避让所述第二固定部333的环形的让位部79。
所述第一磁体部73包括极芯731及主磁钢733，所述极芯731正对所述振膜31，所述主磁钢733夹设于所述极芯731与所述磁碗71的所述底板711之间，所述避让部77和所述让位部79形成于所述极芯731上。
所述第二磁体部75包括固定在所述底板711并环绕所述主磁钢733设置的副磁钢751及固持于所述盆架5且叠设于所述副磁钢751上的夹板753，所述夹板753由导磁材料制成，所述夹板753具有通孔，所述极芯731位于所述夹板753的通孔内，且与所述夹板753处于同一平面。
所述微型发声器件100还包括盖合于所述盆架5上的盖体9，所述盖体9上设有出音口91，所述出音口91用于所述振膜31振动发声的出声通道。
实施例二
如图8至图12所示，所述微型发声器件200包括固定系统1'及振动系统3'。所述固定系统1'包括具有收容空间的盆架5'和磁路系统7'，所述振动系统3'和所述磁路系统7'收容于所述盆架5'内，且所述磁路系统7'驱动所述振动系统3'振动发声。
所述振动系统3'包括振膜31'、位于所述振膜31'下方并驱动所述振膜31'振动发声的音圈32'以及连接所述音圈32'的柔性电路板33'，所述振膜31'和所述柔性电路板33'固定于所述固定系统1'的所述盆架5'上。其中，所述音圈32'通过所述柔性电路板33'与外部电路连接，所述音圈32'通电后，所述音圈32'会在所述磁路系统7'磁场的作用下振动，与此同时，所述音圈32'带动所述振膜31'振动发声。
所述音圈32'包括本体321'及自所述本体321'延伸出来的引线323'，所述本体321'包括一对长轴边325'及一对短轴边327'，一对所述短轴边327'上分别设有所述柔性电路板33'。其中，所述柔性电路板33'用于支撑所述本体321'，从而可以限制所述本体321'在长轴方向上的摇摆。
其中，两个所述柔性电路板33'上分别形成有一个与所述引线323'焊接的焊盘33A'；或者，两个所述柔性电路板33'中的其中一方上形成有两个与所述引线323'焊接的焊盘33A'。在本实施例中，其中一个所述柔性电路板33'上形成有两个与所述引线323'焊接的焊盘33A'。
所述焊盘33A'包括底座33B'以及形成在所述底座33B'上的镀层33C'，所述镀层33C'包括第一镀层33D'以及自所述第一镀层33D'延伸的第二镀层33E'，所述第一镀层33D'的厚度大于所述第二镀层33E'的厚度，所述引线323'远离所述本体321'的一端与所述焊盘33A'焊接并由所述第二镀层33E'覆盖。
在本实施例中，所述第一镀层33D'相对于所述第二镀层33E'更加靠近所述本体321'。
在本实施例中，所述第一镀层33D'和所述第二镀层33E'在所述底座33B'上的正投影面积相同。
在本实施例中，所述第一镀层33D'和所述第二镀层33E'设置在所述底座33B'朝向所述音圈32'的一侧。
在本实施例中，所述音圈32'位于所述柔性电路板33'和所述振膜31'之间。
在本实施例中，所述柔性电路板33'夹设在所述音圈32'与所述振膜31'之间，所述音圈32'通电后，所述柔性电路板33'随所述音圈32'一同振动；具体地，所述柔性电路板33'夹设在所述音圈32 '的所述本体321'与所述振膜31'之间。当然，在所述振动系统3'的其他实施方式中，所述振动系统3'还可以包括下振膜，所述下振膜贴设于所述柔性电路板33'远离所述音圈32'的一侧；或者，所述下振膜夹设于所述柔性电路板33'和所述音圈32'之间。其中，所述音圈32'通电后，所述下振膜和所述柔性电路板33'随所述音圈32'一同振动，从而可以加强发音效果。
所述柔性电路板33'包括固定于所述固定系统1'的所述盆架5'上的第一固定部331'、与所述本体321'连接的第二固定部333'及连接所述第一固定部331'和所述第二固定部333'的弹性连接部335'，所述焊盘33A'形成于所述第二固定部333'上。
所述焊盘33A'自所述第二固定部333'朝远离所述本体321'的方向延伸。
所述振膜31'包括音膜35'及固设于所述音膜35'背离所述音圈32'一侧的球顶37'。
所述音膜35'包括平坦部351'、自所述平坦部351'向外延伸的折环部353'及环绕于所述折环部353'周围的结合部355'，所述平坦部351'夹设于所述音圈32'的所述本体321'和所述球顶37'之间，所述结合部355'固定于所述盆架5'远离所述柔性电路板33'的一侧。如图8所示，所述平坦部351具有切中孔357，所述球顶37覆盖所述切中孔357'。当然，在所述振膜31'的其他实施方式中，所述平坦部351'也可以不具有切中孔，即所述平坦部351'为完整的平板结构；或者，所述球顶37'夹设于所述平坦部351'与所述音圈32'的所述本体321'之间；或者，在所述平坦部351'为完整的平板结构的情况下，所述振膜31'还可以不包括球顶，而所述音圈32'的所述本体321'夹设于所述平坦部351'和所述柔性电路板33'的所述第二固定部333'之间。
所述磁路系统7'包括磁碗71'、第一磁体部73'及第二磁体部75'，所述磁碗71'固持于所述盆架5'上，所述第一磁体部73'和所述第二磁体部75'固定在所述磁碗71'，且所述第二磁体部75'设于所述第一磁体部73'沿短轴方向的两侧并与所述第一磁体部73'之间形成磁间隙，所述音圈32'的所述本体321'的一端插入所述磁间隙，以使得所述音圈32'通电后，所述音圈32'会在所述磁路系统7'磁场的作用下振动。
所述磁碗71'包括底板711'、自所述底板711'的四个侧边向所述振膜31'的放向弯折延伸形成的侧板713'，所述第一磁体部73'和所述第二磁体部75'固定在所述底板711'上，所述侧板713'固定于所述盆架5'上。
所述第一磁体部73'正对所述振膜31'，所述第一磁体部73'包括极芯731'及主磁钢733'，所述极芯731'正对所述振膜31，所述主磁钢733'夹设于所述极芯731'与所述磁碗71'的所述底板711'之间。
所述第二磁体部75'包括固定在所述底板711'并环绕所述主磁钢733'设置的副磁钢751'及固持于所述盆架5'且叠设于所述副磁钢751'上的夹板753'，所述夹板753'由导磁材料制成，所述夹板753'具有通孔，所述极芯731'位于所述夹板753'的通孔内，且与所述夹板753'处于同一平面。
所述微型发声器件200还包括盖合于所述盆架5'上的盖体9'，所述盖体9'上设有出音口91'，所述出音口91'用于所述振膜31'振动发声的出声通道。
本实用新型提供的微型发声器件100，通过将所述柔性电路板33的焊盘设置成，包括底座以及形成在所述底座上的镀层，所述镀层包括第一镀层以及自所述第一镀层延伸的第二镀层，所述第二镀层的厚度大于所述第一镀层的厚度，所述引线远离所述本体的一端与所述焊盘焊接并由所述第二镀层覆盖。从而使得所述引线与所述焊盘焊接时，便于击穿所述引线的绝缘层，且镀层能更好的覆盖所述引线的击穿区域，从而避免了音圈虚焊风险。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (10)

  1. 一种微型发声器件，包括振动系统及固定系统，所述振动系统包括振膜、位于所述振膜下方并驱动所述振膜振动发声的音圈以及连接所述音圈的柔性电路板，所述振膜和所述柔性电路板固定于所述固定系统上，所述音圈包括本体及自所述本体延伸出来的引线，所述柔性电路板上形成有焊盘，其特征在于：所述焊盘包括底座以及形成在所述底座上的镀层，所述镀层包括第一镀层以及自所述第一镀层延伸的第二镀层，所述第一镀层的厚度大于所述第二镀层的厚度，所述引线远离所述本体的一端与所述焊盘焊接并由所述第二镀层覆盖。
  2. 根据权利要求1所述的微型发声器件，其特征在于：所述第一镀层相对于所述第二镀层更加靠近所述本体。
  3. 根据权利要求1所述的微型发声器件，其特征在于：所述第一镀层和所述第二镀层在所述底座上的正投影面积相同。
  4. 根据权利要求1所述的微型发声器件，其特征在于：所述第一镀层和所述第二镀层设置在所述底座朝向所述音圈的一侧。
  5. 根据权利要求1-4中任一项所述的微型发声器件，其特征在于：所述柔性电路板夹设在所述音圈与所述振膜之间。
  6. 根据权利要求5所述的微型发声器件，其特征在于：所述柔性电路板包括固定于所述固定系统上的第一固定部、与所述本体连接的第二固定部及连接所述第一固定部和所述第二固定部的弹性连接部，所述焊盘形成于所述第二固定部上。
  7. 根据权利要求6所述的微型发声器件，其特征在于：所述第一固定部和所述第二固定部呈环状，所述焊盘位于所述第二固定部的短轴边上。
  8. 根据权利要求7所述的微型发声器件，其特征在于：所述固定系统包括具有收容空间的盆架以及磁路系统，所述磁路系统和所述振动系统收容于所述盆架内，所述磁路系统包括磁碗和固定在所述磁碗的第一磁体部，所述音圈绕设在所述第一磁体部外周，所述焊盘自所述第二固定部朝远离所述第一固定部的方向延伸，所述第一磁体部上凹陷形成有与所述焊盘对应的避让部。
  9. 根据权利要求1-4中任一项所述的微型发声器件，其特征在于：所述音圈位于所述柔性电路板和所述振膜之间。
  10. 根据权利要求9所述的微型发声器件，其特征在于：所述柔性电路板夹设在所述音圈与所述振膜之间。
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