Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/80—Constructional details
  • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
  • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
  • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
  • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
  • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
  • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
  • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
  • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
  • B06B1/0207—Driving circuits
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
  • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
  • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
  • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
  • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
  • B06B1/0666—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface used as a diaphragm
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
  • G01N29/22—Details, e.g. general constructional or apparatus details
  • G01N29/24—Probes
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
  • G01N29/22—Details, e.g. general constructional or apparatus details
  • G01N29/24—Probes
  • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
  • G01N29/22—Details, e.g. general constructional or apparatus details
  • G01N29/24—Probes
  • G01N29/2437—Piezoelectric probes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/01—Manufacture or treatment
  • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/80—Constructional details
  • H10N30/802—Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits
• • A—HUMAN NECESSITIES
  • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
  • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
  • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
  • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
  • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
  • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N2291/00—Indexing codes associated with group G01N29/00
  • G01N2291/10—Number of transducers
  • G01N2291/106—Number of transducers one or more transducer arrays

Definitions

• An ultrasound transducer commonly includes a diaphragm, a substrate which forms a backing of the diaphragm, and contact(s) that connects the diaphragm to enable signal communication to and from the transducer.
• Micromachined ultrasonic transducer (MUT) array(s) offer immense opportunity in the field of ultrasonics due to their efficiency in transducing between the electrical and acoustic energy domains.
• a MUT chip integrated with a circuit features electrical contact(s) that is configured to transmit and receive signals to and from the MUT and ASIC.
• the electrical contact(s) can play a secondary but significant role in dictating the MUT dynamics because they act as a mechanical spring that impacts critical boundary conditions (e.g., mechanical boundary conditions such as how the MUT is attached to the MUT array, how the MUT array is anchored to the ASIC, and how the MUT is connected to the transmission media) of the MUT.
• critical boundary conditions e.g., mechanical boundary conditions such as how the MUT is attached to the MUT array, how the MUT array is anchored to the ASIC, and how the MUT is connected to the transmission media
• the present disclosure includes systems and methods that enable MUT integration to an ASIC via hybrid contacts.
• a hybrid contact herein can enable both electrical connection as well as non-electrical connection, e.g., mechanical connection for the purpose of enhancing MUT dynamics, for example, magnitude of pressure output, surface velocity, and ultrasonic frequency bandwidth of the MUTs.
• the systems and methods herein can significantly enhance dynamic performance of MUTs.
• Such systems and methods may utilize one or more of: (1) adding additional mechanical contacts to the MUT, (2) arranging the contacts (electrical and/or mechanical), and (3) modifying the dimensions and shape of the contacts (electrical and/or mechanical).
• ultrasonic transducer systems with hybrid contacts comprising: an ultrasonic transducer element comprising a substrate and a membrane; an electrical circuitry; and one or more contacts connected to the ultrasonic transducer element and the electrical circuitry, wherein the one or more contacts are: designed geometrically using a set of rules; arranged with respect to the membrane based on the set of rules or a second set of rules, or both.
• the ultrasonic transducer element is a micromachined ultrasonic transducer (MUT) element.
• the ultrasonic transducer element is a piezoelectric micromachined ultrasonic transducer (pMUT) element.
• the ultrasonic transducer system further comprises: a second ultrasonic transducer element comprising a second substrate and a second membrane; a second electrical circuitry; and one or more additional contacts connected to the second ultrasonic transducer element and the second electrical circuitry, wherein the one or more additional contacts optionally designed
• the first and the second ultrasonic transducer elements form an array with a plurality of additional ultrasonic transducer elements.
• the array is two-dimensional.
• the array is 32 by 32, 32 by 64, 32 by 194, 12 by 128, 24 by 128, 32 by 128, 64 by 128, 64 by 32, or 64 by 194.
• the electric circuitry is an application specific integrated circuit (ASIC).
• the one or more contacts comprise at least one contact that is not hybrid contact. In some
• the one or more contacts are electrical contacts only or mechanical contacts only. In some embodiments, the one or more contacts are hybrid contacts. In some embodiments, the one or more contacts comprise at least one electrical contact and one mechanical contact. In some embodiments, the one or more contacts comprise at least one contact that is both electrical and mechanical.
• the set of rules comprises one or more of: a range of diameter, a range of height, a range of aspect ratio, and one or more shapes of the one or more contacts. In some embodiments, the range of diameter is about 5 pm to about 100 pm. In some embodiments, the range of height is about 0 pm to about 300 pm. In some embodiments, the aspect ratio of height to effective diameter is less than about 60: 1.
• the one or more shapes are from: a cylinder, an annular shape, a cubic shape, a cuboid shape, and an elongated shape.
• the second set of rules comprises one or more of: a range of spacing of the one or more contacts to the membrane, a minimum number of electrical contacts within the ultrasonic transducer element, a maximum number of electrical contacts within the ultrasonic transducer element, a minimum number of mechanical contacts within the ultrasonic transducer element, a maximum number of mechanical contacts within the ultrasonic transducer element, a minimum number of hybrid contacts within the ultrasonic transducer element, a maximum number of hybrid contacts within the ultrasonic transducer element.
• the range of spacing is no less than about 5 pm. The ultrasonic transducer system of claim 19, wherein the minimum number of electrical contacts is 2. In some
• the maximum number of electrical contacts is 4. In some embodiments, the minimum number of mechanical contacts is 2. In some embodiments, the minimum number of mechanical contacts is a single contact. In some embodiments, the maximum number of mechanical contacts is 10. In some embodiments, the second set of rules comprises: arranging the one or more contacts to be symmetrical about an axis of the membrane; and arranging the one or more contacts to surround the membrane, or their combination.
• obtaining an ultrasonic transducer system comprising: an ultrasonic transducer element comprising a substrate and a membrane; and an electrical circuitry connected to the ultrasonic transducer element; obtaining one or more contacts, the one or more contacts optionally designed geometrically using a set of rules; adding the one or more contacts to the ultrasonic transducer element, comprising: arranging the one or more contacts with respect to the membrane based on the set of rules or a second set of rules; and connecting the one or more contacts to the ultrasonic transducer element and the electrical circuitry.
• obtaining an ultrasonic transducer system comprising: an ultrasonic transducer element comprising a substrate and a membrane; and an electrical circuitry connected to the ultrasonic transducer element; obtaining one or more contacts, the one or more contacts optionally designed geometrically using a set of rules; adding the one or more contacts to the ultrasonic transducer system, comprising: arranging the one or more contacts with respect to the membrane based on the set of rules or a second set of rules; and connecting the one or more contacts to the ultrasonic transducer element and the electrical circuitry.
• the ultrasonic transducer element is a micromachined ultrasonic transducer (MUT) element. In some embodiments, the ultrasonic transducer element is a piezoelectric micromachined ultrasonic transducer (pMUT) element. In some embodiments, the ultrasonic transducer system further comprise: a second ultrasonic transducer element comprising a second substrate and a second membrane; a second electrical circuitry; and one or more additional contacts connected to the second ultrasonic transducer element and the second electrical circuitry, wherein the one or more additional contacts optionally designed geometrically using the set of rules, and wherein the one or more additional contacts are arranged with respect to the second membrane based on the set of rules or the second set of rules.
• MUT micromachined ultrasonic transducer
• pMUT piezoelectric micromachined ultrasonic transducer
• the first and the second ultrasonic transducer elements form an array with a plurality of additional ultrasonic transducer elements.
• the array is two-dimensional.
• the array is 32 by 32, 32 by 64, 32 by 194, 12 by 128, 24 by 128, 32 by 128, 64 by 128, 64 by 32, or 64 by 194.
• the electric circuitry is ASIC.
• the one or more contacts comprise at least one contact that is not a hybrid contact. The method of claim 34, wherein the one or more contacts are electrical contacts only or mechanical contacts only. In some embodiments, the one or more contacts are hybrid contacts. In some embodiments, the one or more contacts comprise at least one electrical contact and one mechanical contact.
• the one or more contacts comprise at least one contact that is both electrical and mechanical.
• the set of rules comprises one or more of: a range of diameter, a range of height, a range of aspect ratio, and a shape of the one or more contacts.
• the range of diameter is about 5 pm to about 100 pm.
• the range of height is about 0 pm to about 300 pm. In some embodiments, the aspect ratio is less than about 60: 1. In some embodiments, the shape is one or more selected from: a cylinder, an annular shape, and an elongated shape.
• the second set of rules comprises one or more of: a range of spacing of the one or more contacts to the membrane, a minimum number of electrical contacts within the ultrasonic transducer element, a maximum number of electrical contacts within the ultrasonic transducer element, a minimum number of mechanical contacts within the ultrasonic transducer element, a maximum number of mechanical contacts within the ultrasonic transducer element, a minimum number of hybrid contacts within the ultrasonic transducer element, a maximum number of hybrid contacts within the ultrasonic transducer element.
• the range of spacing is no less than about 5 pm.
• the minimum number of electrical contacts is 2.
• the maximum number of electrical contacts is 4.
• the minimum number of mechanical contacts is 2.
• the minimum number of mechanical contacts is a single contact. In some embodiments, the maximum number of mechanical contacts is 10. In some embodiments, the second set of rules comprises: arranging the one or more contacts to be symmetrical about an axis of the membrane; arranging the one or more contacts to surround the membrane, or their combination.
• FIGs. 1A-1B show a cross-section view and layout view, respectively, of an exemplary embodiment of an integrated MUT and ASIC system using electrical contacts with asymmetry in the electrical contacts (102) (the ASIC die (104) is removed from this figure for clarity purposes);
• FIG. 2 shows a layout view of an exemplary embodiment of an integrated MUT and ASIC system using hybrid contacts with added contacts for symmetrical boundary conditions
• FIG. 3 shows exemplary dynamic response of the central MUT membrane in the MUT array of Fig. IB with asymmetric contacts and the dynamic response of the central MUT membrane in the MUT array of Fig. 2 with symmetric hybrid contacts;
• FIG. 4 show exemplary geometrical parameters of a cylindrical electrical and/or mechanical contact of an integrated MUT and ASIC system herein;
• FIG. 5 shows exemplary performance of the integrated MUT and ASIC system with hybrid contact arrangement as shown in Fig. 2 with contacts of a 60 pm diameter and three different heights: 6 pm, 16 pm, and 40 pm;
• Fig. 6 shows exemplary performance of the integrated MUT and ASIC system with hybrid contact arrangement as shown in Fig. 2 with contacts of a 50 pm diameter (left) and 40 pm diameter (right), at three different heights: 6 pm, 16 pm, and 40 pm;
• Fig. 7 shows a layout view of an exemplary embodiment of an integrated MUT and ASIC system using hybrid contacts in Fig. IB with added hybrid contacts;
• Fig. 8 shows a layout view of an exemplary embodiment of an integrated MUT and ASIC system using hybrid contacts in Fig. IB with added hybrid contacts.
• a transducer herein is a device that converts a physical variation in one energy domain into a physical variation in a different domain.
• a micromachined ultrasonic transducer (MUT), for example, converts electrical variations into mechanical vibrations of a diaphragm. These vibrations of the diaphragm result in pressure waves in any gas, liquid, or solid adjoining the diaphragm. Conversely, pressure waves in the adjoining media may cause mechanical vibration of the diaphragm. The diaphragm vibration may in turn result in electrical variations on the MUT’s electrodes, which can be sensed.
• a piezoelectric MUT For a piezoelectric MUT (pMUT), an electrical field across the piezoelectric film will change the strain on the diaphragm which may cause the diaphragm to move and subsequently generate pressure waves. Impinging pressure waves from the media onto the pMUT may, in turn, vibrate the diaphragm and create strain in the piezoelectric film which may produce a change in charge on the electrodes of the pMUT.
• pMUT piezoelectric MUT
• the pMUT piezoelectric MUT
• the pMUT converts between while the other domain being mechanical, e.g., mechanical pressure.
• the present disclosure includes methods of changing the dynamic behavior of an electrical transducer.
• the methods herein are applicable to electrical transducers, ultrasonic transducers, MUT transducers, pMUT transducers, or any other types of transducers.
• the methods herein are applicable to electrical transducers other than pMUT, including but not limited to capacitive, piezo-resistive, thermal, optical, radioactive transducers.
• a piezo-resistive pressure transducer for example, converts mechanical pressure variations into changes in electrical resistance variations via the piezo-resistance effect. Because the resistance variations are in the electrical domain, the piezo-resistive pressure transducer qualifies as an electrical transducer.
• the term“about” refers to an amount that is near the stated amount by about 10%, 5%, or 1%, including increments therein.
• the systems and methods herein include a MUT integrated with an ASIC featuring both electrical contacts to transmit/receive signals to/from the ASIC as well as non-electrical contacts (e.g., mechanical contacts) to ensure dynamic performance and reliability of the MUT.
• the contacts can be located close to the mechanically sensitive membrane portion of the MUTs, where the membrane vibrates at high frequency band of about 1 MHz to about 10 MHz.
• the contact design e.g., contact type, location, shape, size, etc
• the systems and methods herein includes arranging the contacts in such a way to enhance mechanical
• the contact herein connects the elements to which it is attached.
• connection provided by the contact is electrical or non-electrical.
• such connection is mechanical.
• such connection is mechanical only.
• a contact herein is mechanical, although based off its location, the contact may or may not affect the transducer’s mechanical operation at a same level.
• the contact herein is hybrid, e.g., both electrical and non-electrical.
• such hybrid contact herein enables mechanical and electrical contact.
• the mechanical contact can be used to carry electrical signals as the electrical contacts, thus making it a hybrid contact.
• the hybrid contact may be configured to provide more than one type of connections either simultaneously, or at different time points. For example, a contact may be configured to provide mechanical and electrical connection simultaneously while another contact may be configured to provide electrical connecting but not mechanical connection when a predetermined threshold condition has been met (e.g., a location threshold).
• a hybrid contact array includes more than one type of contacts arranged in one, two, or three dimensions. In some embodiments, a hybrid contact array includes one or more hybrid contacts arranged in one, two, or three dimensions. In some embodiments, the contact herein is a hybrid contact providing any two different type of connections (e.g., electrical and mechanical). In some embodiments, the contact herein is an electrical only (e.g., with no or minimal mechanical effect to the transducer’s mechanical operations) and/or mechanical only contact.
• the electrical contacts are generally of simple shapes, typically an approximate cylinder shape with a set diameter and height.
• the position of electrical contacts on the die is typically dictated by the electrical routing of the MUT and the ASIC.
• Disadvantages can exist in conventional integrated systems as the electrical contacts are often designed (e.g., size, shape, and position, etc.) to achieve thermal cycle reliability with no consideration for MUT performance.
• the MUT here is a MUT array of MUT transducers (interchangeable herein as transducer elements), each MUT transducer having a substrate, a diaphragm (interchangeable here as“membrane”), and/or a piezoelectric element.
• the array is in two dimensions.
• each MUT transducer acts as a pixel.
• the array size may be variable and customized for various applications. Non-limiting exemplary array sizes are: 32 by 32, 32 by 64, 32 by 194, 12 by 128, 24 by 128, 32 by 128, 64 by 128, 64 by 32, or 64 by 194 (columns by rows, or rows by columns).
• each pixel herein includes a width (x-axis) and/or height (z axis) that is in the range of about 10 pm to about 1000 pm or 10 pm to 1000 pm. In some embodiments, each pixel herein includes a width (x-axis) that is in the range of about 20 pm to about 600 pm, about 30 pm to about 500 pm, about 40 to about 400 pm, about 50 to about 300 pm, or about 50 pm to about 250 pm.
• each pixel herein includes a height that is in the range of about 10 pm to about 1000 pm, about 20 pm to about 950 pm, about 30 to about 900 pm, about 40 to about 850 pm, or about 50 pm to about 800 pm.
• the pixel may be asymmetric or symmetric about x, y, z and/or any other axis in the 3D space.
• a pixel is taller in the elevation direction, and narrower in the azimuth direction.
• an electrical contact, a mechanical contact, and/or a hybrid contact herein are in close proximity to one or more membranes.
• the maximal or minimal distance from an electrical contact 102 or a hybrid contact 105/106 to a membrane 101 is greater than 0 pm, 1 pm, 2 pm, 3 pm, 4 pm, 5 pm, 6 pm, 7 pm, 8 pm, 9 pm, or 10 pm.
• the maximal or minimal distance from an electrical contact or a hybrid contact to a membrane is less than 200 pm, 180 pm, 160 pm, 140 pm, 120 pm, 100 pm, 90 pm, 80 pm, 70 pm, 60 pm, 50 pm, 40 pm, 30 pm, 20 pm, 10 pm or even less, including increments therein.
• the maximal or minimal distance from an electrical contact or a hybrid contact to a membrane is in the range of about 10 pm to about 100 pm or 10 pm to 100 pm. In some embodiments, the maximal or minimal distance from an electrical contact or a hybrid contact to a membrane is in the range of about 5 pm to about 150 pm or 5 pm to 150 pm.
• the integrated system of MUT and ASIC includes a MUT die 100 that is attached or connected to an ASIC die 104 via a plurality of contacts 102.
• the ASIC die 104 herein may be other circuit element such as printed circuit board (PCB).
• PCB printed circuit board
• the cross-section (at B-B’ in Fig. IB) and layout views (at A-A’ in Fig. 1A) of the integrated system are shown in Fig. 1A and IB, respectively.
• the MUT die includes an array of transducers which includes an array of membranes 101.
• the contacts are electrical contacts.
• the contacts 102 may be configured to provide additional contacts, such as mechanical contacts.
• one or more of the electrical contacts 102 are in close proximity (e.g., with a maximal distance in the range of about 10 pm to about 100 pm) to the mechanically sensitive MUT membranes 101.
• one or more electrical contacts 102 is configured to form a critical interface between the MUT and ASIC.
• one or more electrical contacts 102, and/or mechanical contacts is configured to act as important boundary condition for the MUT dynamics or performance.
• additional contacts are added to the conventional contact configuration, for example, shown in Figs. 1A-1B.
• each of the added contacts can be an electrical contact, a mechanical contact, or a hybrid contact.
• the location of the existing and/or additional contacts e.g., mechanical contacts is designed to enhance the thermal stability, structural rigidity and/or dynamic performance of the integrated MUT and ASIC system.
• a symmetric array includes symmetrical arrangement of identical geometrical shapes of contacts, but the contacts may be of different types, e.g., as shown in Fig. 2.
• a symmetric array includes symmetrical arrangement of contacts.
• Fig. 3 shows the surface velocity versus frequency of the asymmetric contact arrangement of Fig. IB in comparison to the symmetric hybrid contact arrangement of Fig. 2.
• an advantage of a MUT is that it is configurable to provide a maximum surface velocity of the membrane higher than other types of ultrasound transducers.
• the maximum surface velocity of the membrane is directly related to the maximum pressure output achievable with the MUT.
• the symmetric hybrid contact arrangement/array in Fig. 2 can achieve more than an order of magnitude higher maximum surface velocity of the membrane.
• the mechanical contacts can offer additional mechanical support that enhances MUT dynamics such as surface velocity of the membrane.
• the mechanical contact(s) can shift the primary frequency up or down, move harmonic frequencies relative to the primary frequency, thereby affecting the perceived bandwidth of the device.
• the contact(s) may increase or decrease the mechanical damping, thus directly affecting the bandwidth of the transducer for its primary and harmonic mode shapes.
• the maximum surface velocity is variable and can dependent on specific applications. In some embodiments, the maximum surface velocity is in the range of about 0.01 m/second to about 100 m/second. In some embodiments, the maximum surface velocity is in the range of about 0.1 m/second to about 10 m/second. In some embodiments, the maximum surface velocity is in the range of about 2 mm/second to about 100 m/second. In some embodiments, the maximum surface velocity is in the range of about 5 mm/second to about 80 m/second. In some embodiments, the maximum surface velocity is in the range of about 5 mm/second to about 60 m/second. In some embodiments, the maximum surface velocity is in the range of about 6 mm/second to about 50 m/second. In some embodiments, the maximum surface velocity is in the range of about 6 mm/second to about 40 m/second. In some embodiments, the maximum surface velocity is in the range of about 0.01 m/second to about 100 m/second. In some embodiments, the maximum surface velocity is in the range of
• the maximum surface velocity is in the range of about 6 mm/second to about 30 m/second. In some embodiments, the maximum surface velocity is in the range of about 8 mm/second to about 30 m/second. In some embodiments, the maximum surface velocity is in the range of about 8 mm/second to about 20 m/second. In some embodiments, the maximum surface velocity is in the range of about 8 mm/second to about 15 m/second. In some
• the maximum surface velocity is in the range of about 10 mm/second to about 10 m/second.
• the integrated MUT and ASIC systems herein include a different symmetric hybrid contact array from the one shown in Fig. 2. Such different symmetric hybrid contact array is configured to improve MUT dynamics over conventional contact arrays.
• the symmetric hybrid contact array is symmetrical about x-axis, y axis or any other axes within the x-y plane of the MUT die 100.
• the symmetric hybrid contact array herein includes contacts that are symmetrically positioned about the x-axis, y-axis or any other axes within the x-y plane of individual MUT membrane 101.
• symmetry herein includes: size, shape, type, position, or their combinations of the contact(s). For example, two different contacts (e.g., one hybrid, one electrical) positioned symmetrically about a MUT membrane may be considered a symmetrical arrangement of such two contacts.
• the systems and methods herein includes a MUT array with an arbitrary number of membranes.
• the total number of membranes in the MUT array is in the range of 1 to 15,000. In some embodiments, the number of membranes in the MUT array is in the range of 250 to 4,200.
• the systems and methods herein includes a MUT array with an arbitrary number of contacts or hybrid contacts.
• the number of contacts or hybrid contacts in the MUT array is in the range of 2 to 120,000. In some embodiments, the number of contacts or hybrid contacts in the MUT array is in the range of 250 to 8,500.
• arrangement of the hybrid contacts is not the sole parameter of the systems and methods herein.
• the contacts themselves can be designed to further optimize MUT performance.
• the contact materials can be set by the integration technology, and so are fixed.
• the contact height (along z axis) and diameter (x-y plane) can be parameters for optimization, as shown in Fig. 4.
• MUT performance can be improved or optimized for a given MUT design and integration scheme using a first set of rules, a second set of rules, or their combinations.
• the first set of rules, for each contact can include: a range of diameter, a range of height, range of cross section area, a range of aspect ratio, a shape of the one or more contacts, and a cross-section shape of the one or more contacts.
• the second set of rules which may provide for each contact one or more of: a range of spacing of the one or more contacts to the membrane, a minimum number of electrical contacts within the ultrasonic transducer element, a maximum number of electrical contacts within the ultrasonic transducer element, a minimum number of mechanical contacts within the ultrasonic transducer element, a maximum number of mechanical contacts within the ultrasonic transducer element, a minimum number of hybrid contacts within the ultrasonic transducer element, a maximum number of hybrid contacts within the ultrasonic transducer element, a maximum contact area with the ultrasonic transducer element, a minimum contact area with the ultrasonic transducer element.
• a range of spacing of the one or more contacts to the membrane a minimum number of electrical contacts within the ultrasonic transducer element, a maximum number of electrical contacts within the ultrasonic transducer element, a minimum number of mechanical contacts within the ultrasonic transducer element, a maximum number of mechanical contacts within the ultrasonic transducer element, a minimum number of hybrid contacts
• a contact shape may be given as cylindrical, and the integration scheme may be provided to be via hybrid contact.
• the other rules of the first and/or the second set of rules can be selected, either manually, empirically, automatically, or using machine learning algorithms to determine features of the contacts thus optimize MUT performance.
• Fig. 5 shows the dynamic performance of the MUT membrane 101 of the hybrid contact configuration illustrated in Fig. 2.
• the contact with the tallest height of three different heights, i.e., 40 pm has the best performance compared to 6 pm and 16 pm high contacts, for an identical contact diameter of 60 pm. If the contact diameter is adjusted to 50 pm, the best contact height is 16 pm as illustrated in Fig. 6 (left). For a contact diameter of 40 pm, the best contact height is 6 pm as in Fig. 6 (right).
• the contacts herein can be of shapes other than cylindrical shapes to achieve optimized MUT performance.
• three dimensional contact shape includes a part or entirety of: a sphere, pyramid, baseball, spindle shape, cube, cuboid, tetrahedron, cone, hexagonal prism, triangular prism, and donut shape.
• contact shapes along the x-y plane include a part or entirety of: a circle, ring, fan, oval, triangle, square, rectangular, trapezoid, rhomboid, and polygon.
• the contact herein includes a height (along z axis) that can be variable and customized for different applications. In some embodiments, the contact herein includes a height (along z axis) in the range of about 0 pm to 300 pm. In some embodiments, the contact herein includes a height in the range of about 0 pm to 250 pm. In some embodiments, the contact herein includes a height in the range of about 0 pm to 200 pm. In some
• the contact herein includes a height in the range of about 0 pm to 100 pm. In some embodiments, the contact herein includes a height in the range of about 1 pm to 100 pm.
• the contact herein includes a height in the range of about 1 pm to 80 pm.
• the contact herein includes a height in the range of about 2 pm to 80 pm.
• the contact herein includes a height in the range of about 2 pm to 60 pm.
• the contact herein includes a height in the range of about 3 pm to 60 pm.
• the contact herein includes a height in the range of about 3 pm to 50 pm.
• the contact herein includes a diameter (in x-y plane) that can be variable and customized for different applications. In some embodiments, the contact herein includes a diameter (in x-y plane) in the range of about 0 pm to 300 pm. In some embodiments, the contact herein includes a diameter in the range of about 0 pm to 250 pm. In some
• the contact herein includes a diameter in the range of about 4 pm to 120 pm. In some embodiments, the contact herein includes a diameter in the range of about 5 pm to 100 pm. In some embodiments, the contact herein includes a diameter in the range of about 10 pm to 90 pm. In some embodiments, the contact herein includes a diameter in the range of about 15 pm to 80 pm. In some embodiments, the contact herein includes a diameter in the range of about 20 mih to 80mih. In some embodiments, the contact herein includes a diameter in the range of about 25 mih to 75 mih. In some embodiments, the contact herein includes a diameter in the range of about 25 mih to 70 pm In some embodiments, the contact herein includes a diameter in the range of about 30 mih to 60 pm
• the contact herein includes an aspect ratio (i.e., height: diameter) (that can be variable and customized for different applications.
• aspect ratio includes but is not limited to: less than 6: 1, less than 5: 1, less than 4: 1, less than 3: 1, or less than 2: 1.
• the aspect ratio is less than 1 : 1.
• the aspect ratio is less than 0.9: 1.
• the aspect ratio is less than 0.8: 1.
• the aspect ratio is less than 0.7: 1.
• the aspect ratio is less than 0.6: 1.
• the aspect ratio is less than 0.5: 1.
• the aspect ratio is less than 0.4: 1.
• the aspect ratio is less than 0.3: 1. In some embodiments, the aspect ratio is less than 1.2: 1. In some embodiments, the aspect ratio is less than 0.2: 1. In some embodiments, the aspect ratio is less than 0.8: 1. In some embodiments, the aspect ratio is less than 1.5: 1.
• the contacts herein include a contact area in the x-y plane. In some embodiments, the contact area contacts the transducer element and/or the circuit herein. In some embodiments, the contact area is a cross section perpendicular to the z-axis. In some embodiments, the contact area is equivalent to a circle of diameter ranging from 30 pm to 60 pm.
• the contact area is equivalent to a circle of diameter ranging from 10 pm to 100 pm. In some embodiments, the contact area is equivalent to a circle of diameter ranging from 20 pm to 80 pm. In some embodiments, the contact area is equivalent to a circle of diameter ranging from 30 pm to 50 pm. In some embodiments, the contact area is equivalent to a circle of diameter ranging from 40 pm to 60 pm.
• each pixel herein includes one or more electrical, mechanical, and/or hybrid contacts. In some embodiments, each pixel includes 1 to 5, 1 to 4, 1 to 3, or 1 to 2 electrical contacts. In some embodiments, each pixel includes 1 to 10, 1 to 8, 1 to 6, or 1 to 5, 1 to 4, 1 to 3, or 1 to 2 mechanical contacts. In some embodiments, each pixel includes 1 to 10, 1 to 8, 1 to 6, or 1 to 5, 1 to 4, 1 to 3, or 1 to 2 hybrid contacts.
• the hybrid contacts may not be of a uniform layout shape. Instead, in some embodiments, the hybrid contacts may be with a variety of shapes that facilitate improvement of MUT performance.
• Fig. 7 illustrates added elongated contacts 106 that are longer (e.g., along x axis) and slender (e.g., along y axis).
• the contact 106 can be hybrid contact or mechanical contact. In this embodiment, such elongated contacts provide a large fixed boundary condition thus improving the MUT performance.
• one or more of the membranes 101 of the MUT array 100 may be enclosed at least partly by the annular hybrid contacts 107 illustrated in Fig. 8. In these embodiments, the annular contacts and the elongated contacts are hybrid. In some embodiments, the annular contacts and the elongated contacts are electrical and/or mechanical.
• a and/or B encompasses one or more of A or B, and combinations thereof such as A and B. It will be understood that although the terms“first,”“second,”“third,” etc. may be used herein to describe various elements, components, regions and/or sections, these elements, components, regions and/or sections should not be limited by these terms. These terms are merely used to distinguish one element, component, region or section from another element, component, region or section. Thus, a first element, component, region or section discussed below could be termed a second element, component, region or section without departing from the teachings of the present disclosure.
• the term "about,” and“approximately,” or“substantially” refers to variations of less than or equal to +/- 0.1%, +/- 1%, +/- 2%, +/- 3%, +/- 4%, +/- 5%, +/- 6%, +/- 7%, +/- 8%, +/- 9%, +/- 10%, +/- 11%, +/- 12%, +/- 14%, +/- 15%, or +/- 20%, including increments therein, of the numerical value depending on the embodiment.
• about 100 meters represents a range of 95 meters to 105 meters (which is +/- 5% of 100 meters), 90 meters to 110 meters (which is +/- 10% of 100 meters), or 85 meters to 115 meters (which is +/- 15% of 100 meters) depending on the embodiments.

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• 2019
  • 2019-07-31 JP JP2021504786A patent/JP7515182B2/ja active Active
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