JP7515182B2 - ハイブリッド端子を備えた超音波トランスデューサの統合のためのシステムおよび方法 - Google Patents

ハイブリッド端子を備えた超音波トランスデューサの統合のためのシステムおよび方法 Download PDF

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Publication number
JP7515182B2
JP7515182B2 JP2021504786A JP2021504786A JP7515182B2 JP 7515182 B2 JP7515182 B2 JP 7515182B2 JP 2021504786 A JP2021504786 A JP 2021504786A JP 2021504786 A JP2021504786 A JP 2021504786A JP 7515182 B2 JP7515182 B2 JP 7515182B2
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terminals
ultrasonic transducer
electrical
hybrid
mechanical
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Japanese (ja)
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JP2021533620A (ja
JP2021533620A5 (https=
JPWO2020028580A5 (https=
Inventor
クォン，ヘソン
バーカムショー，ブライアン
アッカラジュ，サンディープ
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エコー イメージング，インク．
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/0666—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface used as a diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/802—Circuitry or processes for operating piezoelectric or electrostrictive devices not otherwise provided for, e.g. drive circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/10—Number of transducers
    • G01N2291/106—Number of transducers one or more transducer arrays

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Biophysics (AREA)
  • Veterinary Medicine (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Public Health (AREA)
  • Medical Informatics (AREA)
  • Biomedical Technology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Gynecology & Obstetrics (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
  • Circuit For Audible Band Transducer (AREA)
JP2021504786A 2018-08-01 2019-07-31 ハイブリッド端子を備えた超音波トランスデューサの統合のためのシステムおよび方法 Active JP7515182B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023169286A JP2023171875A (ja) 2018-08-01 2023-09-29 ハイブリッド端子を備えた超音波トランスデューサの統合のためのシステムおよび方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862713272P 2018-08-01 2018-08-01
US62/713,272 2018-08-01
PCT/US2019/044528 WO2020028580A1 (en) 2018-08-01 2019-07-31 Systems and methods for integrating ultrasonic transducers with hybrid contacts

Related Child Applications (1)

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JP2023169286A Division JP2023171875A (ja) 2018-08-01 2023-09-29 ハイブリッド端子を備えた超音波トランスデューサの統合のためのシステムおよび方法

Publications (4)

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JP2021533620A JP2021533620A (ja) 2021-12-02
JP2021533620A5 JP2021533620A5 (https=) 2022-02-08
JPWO2020028580A5 JPWO2020028580A5 (https=) 2022-02-08
JP7515182B2 true JP7515182B2 (ja) 2024-07-12

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JP2023169286A Pending JP2023171875A (ja) 2018-08-01 2023-09-29 ハイブリッド端子を備えた超音波トランスデューサの統合のためのシステムおよび方法

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Country Status (8)

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US (2) US12274174B2 (https=)
EP (1) EP3830877B1 (https=)
JP (2) JP7515182B2 (https=)
KR (1) KR102876668B1 (https=)
CN (1) CN112805843B (https=)
CA (1) CA3108024A1 (https=)
IL (1) IL280494A (https=)
WO (1) WO2020028580A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11039814B2 (en) 2016-12-04 2021-06-22 Exo Imaging, Inc. Imaging devices having piezoelectric transducers
US10648852B2 (en) 2018-04-11 2020-05-12 Exo Imaging Inc. Imaging devices having piezoelectric transceivers
US10656007B2 (en) 2018-04-11 2020-05-19 Exo Imaging Inc. Asymmetrical ultrasound transducer array
WO2019226547A1 (en) 2018-05-21 2019-11-28 Exo Imaging, Inc. Ultrasonic transducers with q spoiling
JP7515182B2 (ja) 2018-08-01 2024-07-12 エコー イメージング，インク． ハイブリッド端子を備えた超音波トランスデューサの統合のためのシステムおよび方法
WO2021050853A1 (en) 2019-09-12 2021-03-18 Exo Imaging, Inc. Increased mut coupling efficiency and bandwidth via edge groove, virtual pivots, and free boundaries
CN115968272A (zh) * 2021-03-29 2023-04-14 艾科索成像公司 用于减少mut阵列中的串扰的沟槽
US11819881B2 (en) 2021-03-31 2023-11-21 Exo Imaging, Inc. Imaging devices having piezoelectric transceivers with harmonic characteristics
US11951512B2 (en) 2021-03-31 2024-04-09 Exo Imaging, Inc. Imaging devices having piezoelectric transceivers with harmonic characteristics
US12486159B2 (en) 2021-06-30 2025-12-02 Exo Imaging, Inc. Micro-machined ultrasound transducers with insulation layer and methods of manufacture

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015154480A (ja) 2014-02-12 2015-08-24 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 電気音響変換器
US20180153510A1 (en) 2016-12-04 2018-06-07 Exo Imaging Inc. Low voltage, low power mems transducer with direct interconnect capability

Family Cites Families (123)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2808522A (en) 1953-02-26 1957-10-01 Gulton Ind Inc Accelerometer
US3088323A (en) 1960-02-10 1963-05-07 Gulton Ind Inc Piezoresistive transducer
GB1515287A (en) 1974-05-30 1978-06-21 Plessey Co Ltd Piezoelectric transducers
US4211949A (en) 1978-11-08 1980-07-08 General Electric Company Wear plate for piezoelectric ultrasonic transducer arrays
US4375042A (en) 1980-11-24 1983-02-22 Eastman Kodak Company Temperature gradient method of nonuniformly poling a body of polymeric piezoelectric material and novel flexure elements produced thereby
US4445063A (en) 1982-07-26 1984-04-24 Solid State Systems, Corporation Energizing circuit for ultrasonic transducer
US4517842A (en) 1982-11-02 1985-05-21 Slope Indicator Co. Fluid pressure transducer
GB2166022A (en) 1984-09-05 1986-04-23 Sawafuji Dynameca Co Ltd Piezoelectric vibrator
US4630465A (en) 1984-11-19 1986-12-23 Eaton Corporation Low viscous drag knock sensor
JPS61223683A (ja) 1985-03-29 1986-10-04 Nec Corp 超音波素子および超音波素子の駆動方法
US4668906A (en) 1985-07-11 1987-05-26 Ekstrand John P Switched resistor regulator
JPS6276392A (ja) 1985-09-28 1987-04-08 Victor Co Of Japan Ltd モ−シヨナルフイ−ドバツクシステム
US4709360A (en) 1985-11-12 1987-11-24 Sparton Corporation Hydrophone transducer with negative feedback system
JPH02218983A (ja) 1989-02-20 1990-08-31 Omron Tateisi Electron Co 超音波センサ
US5329496A (en) 1992-10-16 1994-07-12 Duke University Two-dimensional array ultrasonic transducers
JP3318687B2 (ja) 1993-06-08 2002-08-26 日本碍子株式会社 圧電／電歪膜型素子及びその製造方法
US5488956A (en) 1994-08-11 1996-02-06 Siemens Aktiengesellschaft Ultrasonic transducer array with a reduced number of transducer elements
US5520187A (en) 1994-11-25 1996-05-28 General Electric Company Ultrasonic probe with programmable multiplexer for imaging systems with different channel counts
US5825117A (en) 1996-03-26 1998-10-20 Hewlett-Packard Company Second harmonic imaging transducers
US5945770A (en) 1997-08-20 1999-08-31 Acuson Corporation Multilayer ultrasound transducer and the method of manufacture thereof
US6108121A (en) 1998-03-24 2000-08-22 The Board Of Trustees Of The Leland Stanford Junior University Micromachined high reflectance deformable mirror
US6051895A (en) 1998-04-17 2000-04-18 Milltronics Ltd. Electronic switch relay
TW469657B (en) 2000-11-30 2001-12-21 Ind Tech Res Inst Piezoelectric-actuated adjustable electronic device
SE518997C2 (sv) * 2001-04-02 2002-12-17 Impressonic Ab Förfarande och anordning för att detektera skada i material eller föremål
JP3985866B2 (ja) * 2001-12-05 2007-10-03 富士フイルム株式会社 超音波トランスジューサ及びその製造方法
DE60330860D1 (de) 2002-06-12 2010-02-25 Boston Scient Ltd The Corporat Medizinische schlinge
US7061158B2 (en) 2002-07-25 2006-06-13 Nanomotion Ltd. High resolution piezoelectric motor
US6958255B2 (en) 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
DE10254894B3 (de) 2002-11-20 2004-05-27 Dr. Hielscher Gmbh Vorrichtung zur Kühlung von Ultraschallwandlern
CN1445872A (zh) 2003-03-25 2003-10-01 西安康鸿信息技术股份有限公司 一种非对称驱动型压电陶瓷变压器
US20050072234A1 (en) 2003-05-20 2005-04-07 Weidong Zhu System and method for detecting structural damage
US7149515B2 (en) 2003-10-17 2006-12-12 Motorola, Inc. Vocoder selection method
US7800595B2 (en) 2003-12-18 2010-09-21 3M Innovative Properties Company Piezoelectric transducer
US7285897B2 (en) 2003-12-31 2007-10-23 General Electric Company Curved micromachined ultrasonic transducer arrays and related methods of manufacture
US7052464B2 (en) 2004-01-01 2006-05-30 General Electric Company Alignment method for fabrication of integrated ultrasonic transducer array
JP2007531357A (ja) 2004-02-27 2007-11-01 ジョージア テック リサーチ コーポレイション ハーモニックｃｍｕｔ素子及び製造方法
US7646133B2 (en) 2004-02-27 2010-01-12 Georgia Tech Research Corporation Asymmetric membrane cMUT devices and fabrication methods
JP4513596B2 (ja) * 2004-08-25 2010-07-28 株式会社デンソー 超音波センサ
US7888709B2 (en) 2004-09-15 2011-02-15 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer and manufacturing method
WO2006123300A2 (en) 2005-05-18 2006-11-23 Kolo Technologies, Inc. Micro-electro-mechanical transducers
US20070103697A1 (en) 2005-06-17 2007-05-10 Degertekin Fahrettin L Integrated displacement sensors for probe microscopy and force spectroscopy
JP2007082324A (ja) 2005-09-14 2007-03-29 Matsushita Electric Ind Co Ltd 電源装置とその制御方法及び前記電源装置を用いた電子機器
JP2007088805A (ja) 2005-09-22 2007-04-05 Sanyo Electric Co Ltd 超音波レーダ
US7532093B1 (en) 2006-02-06 2009-05-12 The United States Of America As Represented By The Secretary Of The Army RF MEMS series switch using piezoelectric actuation and method of fabrication
US20070197922A1 (en) 2006-02-17 2007-08-23 Honeywell International Inc. Disposable pressure sensor systems and packages therefor
US7750536B2 (en) 2006-03-02 2010-07-06 Visualsonics Inc. High frequency ultrasonic transducer and matching layer comprising cyanoacrylate
JP4804961B2 (ja) 2006-03-03 2011-11-02 オリンパスメディカルシステムズ株式会社 超音波振動子及びそれを搭載した体腔内超音波診断装置
JP4839099B2 (ja) 2006-03-03 2011-12-14 オリンパスメディカルシステムズ株式会社 マイクロマシンプロセスにより製造された超音波振動子、超音波振動子装置、その体腔内超音波診断装置、及びその制御方法
JP4839136B2 (ja) 2006-06-02 2011-12-21 富士フイルム株式会社 超音波トランスデューサアレイ、超音波用探触子、超音波内視鏡、超音波診断装置
US7741686B2 (en) 2006-07-20 2010-06-22 The Board Of Trustees Of The Leland Stanford Junior University Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame
KR20130014618A (ko) 2006-11-03 2013-02-07 리써치 트라이앵글 인스티튜트 굴곡 모드 압전 트랜스듀서를 사용하는 보강된 초음파 촬영 프로브
DE102007008120A1 (de) 2007-02-19 2008-08-21 Siemens Ag Piezostapel und Verfahren zum Herstellen eines Piezostapels
JP2009165212A (ja) 2007-12-28 2009-07-23 Panasonic Corp 圧電体を用いた発電素子およびそれを用いた発電装置
US8084750B2 (en) 2009-05-28 2011-12-27 Agilent Technologies, Inc. Curved ion guide with varying ion deflecting field and related methods
US9327316B2 (en) 2009-06-30 2016-05-03 Avago Technologies General Ip (Singapore) Pte. Ltd. Multi-frequency acoustic array
US8659921B2 (en) 2009-08-28 2014-02-25 General Electric Company Power supply with a piezoelectric transformer and method for power conversion
WO2011026187A1 (en) 2009-09-03 2011-03-10 Monash University Navigable system for catheter based endovascular neurosurgery
JP5342005B2 (ja) 2009-09-17 2013-11-13 株式会社日立メディコ 超音波探触子及び超音波撮像装置
US8563345B2 (en) * 2009-10-02 2013-10-22 National Semiconductor Corporated Integration of structurally-stable isolated capacitive micromachined ultrasonic transducer (CMUT) array cells and array elements
WO2011091423A2 (en) 2010-01-25 2011-07-28 The Arizona Board Of Regents On Behalf Of The University Of Arizona Ultrasonic/photoacoustic imaging devices and methods
US8626295B2 (en) 2010-03-04 2014-01-07 Cardiac Pacemakers, Inc. Ultrasonic transducer for bi-directional wireless communication
CN102822084B (zh) 2010-07-28 2015-06-10 歌尔声学股份有限公司 Cmos兼容的mems麦克风及其制造方法
US20120127136A1 (en) 2010-08-18 2012-05-24 Kent Displays Incorporated Display device including piezoelectric and liquid crystal layers
JP5677016B2 (ja) 2010-10-15 2015-02-25 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5603739B2 (ja) 2010-11-02 2014-10-08 キヤノン株式会社 静電容量型電気機械変換装置
US20130234559A1 (en) 2010-11-25 2013-09-12 Nokia Corporation Piezoelectric resonator
JP2012129662A (ja) 2010-12-13 2012-07-05 Ingen Msl:Kk 超音波探触子
US9070861B2 (en) 2011-02-15 2015-06-30 Fujifilm Dimatix, Inc. Piezoelectric transducers using micro-dome arrays
JP2014094886A (ja) 2011-02-28 2014-05-22 Nippon Chemiphar Co Ltd Ｇｐｒ１１９作動薬
US20130331705A1 (en) 2011-03-22 2013-12-12 Koninklijke Philips Electronics N.V. Ultrasonic cmut with suppressed acoustic coupling to the substrate
US20120250454A1 (en) 2011-04-04 2012-10-04 Robert Nicholas Rohling Method and system for shaping a cmut membrane
US20140225476A1 (en) 2011-06-17 2014-08-14 Levent F. Degertekin Systems and methods for harmonic reduction in capacitive micromachined ultrasonic transducers by gap feedback linearization
EP2759003B1 (en) 2011-09-20 2020-08-26 Sunnybrook Research Institute Ultrasound transducer
US8811636B2 (en) 2011-11-29 2014-08-19 Qualcomm Mems Technologies, Inc. Microspeaker with piezoelectric, metal and dielectric membrane
JP2013123150A (ja) 2011-12-12 2013-06-20 Konica Minolta Inc 圧電デバイスおよび超音波探触子
US8659212B2 (en) * 2012-02-16 2014-02-25 General Electric Company Ultrasound transducer and method for manufacturing an ultrasound transducer
KR101386101B1 (ko) 2012-03-07 2014-04-16 삼성메디슨 주식회사 초음파 흡음 소자, 이를 포함하는 트랜스듀서 및 초음파 프로브
US20130278111A1 (en) 2012-04-19 2013-10-24 Masdar Institute Of Science And Technology Piezoelectric micromachined ultrasound transducer with patterned electrodes
US10106397B1 (en) 2012-04-23 2018-10-23 University Of Southern California Acoustic tweezers
US9454954B2 (en) 2012-05-01 2016-09-27 Fujifilm Dimatix, Inc. Ultra wide bandwidth transducer with dual electrode
US9061320B2 (en) 2012-05-01 2015-06-23 Fujifilm Dimatix, Inc. Ultra wide bandwidth piezoelectric transducer arrays
JP6065421B2 (ja) 2012-06-15 2017-01-25 セイコーエプソン株式会社 超音波プローブおよび超音波検査装置
US20140019072A1 (en) 2012-07-16 2014-01-16 Verlitics, Inc. Preprocessor for removing masking signals in a time trace disaggregation process
US9660170B2 (en) 2012-10-26 2017-05-23 Fujifilm Dimatix, Inc. Micromachined ultrasonic transducer arrays with multiple harmonic modes
US8940639B2 (en) 2012-12-18 2015-01-27 Analog Devices, Inc. Methods and structures for using diamond in the production of MEMS
JP6182859B2 (ja) 2012-12-27 2017-08-23 セイコーエプソン株式会社 超音波トランスデューサーデバイス、超音波測定装置、プローブ及び超音波診断装置、電子機器
US9375850B2 (en) * 2013-02-07 2016-06-28 Fujifilm Dimatix, Inc. Micromachined ultrasonic transducer devices with metal-semiconductor contact for reduced capacitive cross-talk
US20140311245A1 (en) 2013-04-19 2014-10-23 Acoustic Sensing Technology (Uk) Ltd Pipe inspection system and related methods
WO2014210063A1 (en) 2013-06-24 2014-12-31 Zetroz, Inc. Low-profile, low-frequency, and low-impedance broad-band ultrasound transducer and methods thereof
JP6279725B2 (ja) * 2013-06-26 2018-02-14 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 超音波トランスジューサアレイのための集積回路装置
US9475093B2 (en) 2013-10-03 2016-10-25 Fujifilm Dimatix, Inc. Piezoelectric ultrasonic transducer array with switched operational modes
EP3110628B1 (en) 2014-02-28 2019-07-03 The Regents of the University of California Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut)
KR102205505B1 (ko) 2014-03-04 2021-01-20 삼성메디슨 주식회사 초음파 프로브의 제조 방법 및 그 초음파 프로브
US10605903B2 (en) 2014-03-18 2020-03-31 Duke University pMUT array for ultrasonic imaging, and related apparatuses, systems, and methods
US10814352B2 (en) * 2014-05-06 2020-10-27 Koninklijke Philips N.V. Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods
EP3140869B1 (en) 2014-05-09 2019-06-05 Chirp Microsystems, Inc. Micromachined ultrasound transducer using multiple piezoelectric materials
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
JP6424507B2 (ja) 2014-07-28 2018-11-21 コニカミノルタ株式会社 超音波トランスデューサ及び超音波診断装置
JP6299511B2 (ja) 2014-07-31 2018-03-28 セイコーエプソン株式会社 超音波デバイス並びにプローブおよび電子機器
KR20160021559A (ko) 2014-08-18 2016-02-26 삼성전자주식회사 나노필라 구조를 가진 정전용량 미세가공 초음파 변환기 및 그 제조방법
EP3201122B1 (en) 2014-10-02 2022-12-28 InvenSense, Inc. Micromachined ultrasonic transducers with a slotted membrane structure
US9743191B2 (en) 2014-10-13 2017-08-22 Knowles Electronics, Llc Acoustic apparatus with diaphragm supported at a discrete number of locations
US10139479B2 (en) 2014-10-15 2018-11-27 Qualcomm Incorporated Superpixel array of piezoelectric ultrasonic transducers for 2-D beamforming
CN106999163B (zh) 2014-12-11 2021-01-26 皇家飞利浦有限公司 具有交错列的微加工超声换能器的导管换能器
WO2016114173A1 (ja) 2015-01-13 2016-07-21 株式会社村田製作所 圧電デバイスの製造方法
WO2016115363A1 (en) 2015-01-16 2016-07-21 The Regents Of The University Of California Piezoelectric transducers and methods of making and using the same
US9479875B2 (en) 2015-01-23 2016-10-25 Silicon Audio Directional, Llc Multi-mode microphones
US10820888B2 (en) 2015-03-10 2020-11-03 The Regents Of The University Of California Miniature ultrasonic imaging system
US10427188B2 (en) 2015-07-30 2019-10-01 North Carolina State University Anodically bonded vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT)
US11097312B2 (en) 2015-08-11 2021-08-24 Koninklijke Philips N.V. Capacitive micromachined ultrasonic transducers with increased lifetime
JP2017047180A (ja) 2015-09-04 2017-03-09 キヤノン株式会社 探触子アレイ、および、該探触子アレイを備えた音響波測定装置。
US10856846B2 (en) 2016-01-27 2020-12-08 Maui Imaging, Inc. Ultrasound imaging with sparse array probes
WO2017182344A1 (en) 2016-04-19 2017-10-26 Koninklijke Philips N.V. Ultrasound transducer positioning
US10656255B2 (en) 2016-05-04 2020-05-19 Invensense, Inc. Piezoelectric micromachined ultrasonic transducer (PMUT)
WO2017216139A1 (en) 2016-06-13 2017-12-21 Koninklijke Philips N.V. Broadband ultrasound transducer
JP6776074B2 (ja) 2016-09-16 2020-10-28 株式会社東芝 圧電デバイスおよび超音波装置
WO2019002231A1 (en) 2017-06-30 2019-01-03 Koninklijke Philips N.V. INTRALUMINAL ULTRASONIC IMAGING DEVICE COMPRISING A SUBSTRATE SEPARATED IN A PLURALITY OF SPACED SEGMENTS, INTRALUMINAL ULTRASONIC IMAGING DEVICE COMPRISING A TRENCH, AND METHOD OF MANUFACTURING
US11623246B2 (en) 2018-02-26 2023-04-11 Invensense, Inc. Piezoelectric micromachined ultrasound transducer device with piezoelectric barrier layer
US10648852B2 (en) 2018-04-11 2020-05-12 Exo Imaging Inc. Imaging devices having piezoelectric transceivers
US10656007B2 (en) 2018-04-11 2020-05-19 Exo Imaging Inc. Asymmetrical ultrasound transducer array
WO2019226547A1 (en) 2018-05-21 2019-11-28 Exo Imaging, Inc. Ultrasonic transducers with q spoiling
JP7515182B2 (ja) 2018-08-01 2024-07-12 エコー イメージング，インク． ハイブリッド端子を備えた超音波トランスデューサの統合のためのシステムおよび方法
WO2021050853A1 (en) 2019-09-12 2021-03-18 Exo Imaging, Inc. Increased mut coupling efficiency and bandwidth via edge groove, virtual pivots, and free boundaries

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015154480A (ja) 2014-02-12 2015-08-24 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 電気音響変換器
US20180153510A1 (en) 2016-12-04 2018-06-07 Exo Imaging Inc. Low voltage, low power mems transducer with direct interconnect capability

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