WO2020019481A1 - Oled基板及其制作方法 - Google Patents

Oled基板及其制作方法 Download PDF

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Publication number
WO2020019481A1
WO2020019481A1 PCT/CN2018/107699 CN2018107699W WO2020019481A1 WO 2020019481 A1 WO2020019481 A1 WO 2020019481A1 CN 2018107699 W CN2018107699 W CN 2018107699W WO 2020019481 A1 WO2020019481 A1 WO 2020019481A1
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Prior art keywords
pixel region
pixel
sacrificial layer
layer
substrate
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PCT/CN2018/107699
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English (en)
French (fr)
Inventor
白亚梅
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/099,224 priority Critical patent/US10707451B2/en
Publication of WO2020019481A1 publication Critical patent/WO2020019481A1/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2101/00—Properties of the organic materials covered by group H10K85/00
    • H10K2101/10—Triplet emission

Definitions

  • the present application relates to the field of display, and in particular to an OLED substrate and a manufacturing method thereof.
  • Organic film-forming technology is one of the core technologies of OLED display technology.
  • the organic film layer in the OLED device is finely distributed and thin. Therefore, how to accurately fabricate a thin and uniform organic film layer is a difficult problem for those skilled in the art.
  • the high-precision metal mask (FMM) process is one of the processes commonly used for vacuum evaporation in organic film formation processes.
  • the FMM process refers to: heating an organic material under a vacuum condition, and the organic material is evaporated or deposited on a substrate covered with a mask (MASK), thereby forming a sub-pixel film at a corresponding position on the substrate.
  • a mask (MASK)
  • the FMM technology has high requirements for the alignment accuracy of the mask (MASK) and the substrate.
  • the mask (MASK) deforms due to its own gravity and thermal expansion, which affects the coating accuracy of the organic film layer.
  • a method for manufacturing an OLED substrate including the following steps:
  • Step S10 A substrate is provided, the substrate includes a pixel region and a non-pixel region, and the pixel region includes a first pixel region, a second pixel region, and a third pixel region;
  • Step S20 A first sacrificial layer is provided in the first pixel region and the second pixel region, and a third light-emitting material layer is formed above the substrate, and the first sacrificial layer is removed to expose the first sacrificial layer.
  • the first pixel region and the second pixel region form a third pixel region organic layer;
  • Step S30 A second sacrificial layer is provided in the first pixel region and the third pixel region, and a second luminescent material layer is formed above the substrate, and the second sacrificial layer is removed to expose the second sacrificial layer.
  • the first pixel region and the third pixel region form an organic layer of a second pixel region;
  • Step S40 A third sacrificial layer is provided in the second pixel region and the third pixel region, and a first luminescent material layer is formed above the substrate, and the third sacrificial layer is removed to expose the third sacrificial layer.
  • the second pixel region and the third pixel region form an organic layer of the first pixel region;
  • the first luminescent material layer, the second luminescent material layer, and the third luminescent material are formed using one of a vacuum evaporation technology, a physical vapor deposition technology, a chemical vapor deposition technology, and a pulsed laser deposition technology.
  • a vacuum evaporation technology e.g., a vacuum evaporation technology
  • a physical vapor deposition technology e.g., a physical vapor deposition technology
  • a chemical vapor deposition technology e.g., a pulsed laser deposition technology.
  • the first pixel region, the second pixel region, and the third pixel region are one of a blue pixel region, a green pixel region, and a red pixel region, and the The colors of the first pixel region, the second pixel region, and the third pixel region are different from each other.
  • the color of the first luminescent material layer is the same as the color of the first pixel region
  • the color of the second luminescent material layer is the same as the color of the two pixel region
  • the third The color of the luminescent material layer is the same as the color of the third pixel region.
  • the first sacrificial layer, the second sacrificial layer, and the third sacrificial layer are made of binary fluoride.
  • the first sacrificial layer, the second sacrificial layer, and the third sacrificial layer are formed by using an inkjet printing technology.
  • the step S20 specifically includes: printing the first sacrificial layer on the first pixel region and the second pixel region by using an inkjet printing technique, and forming the first sacrificial layer on the substrate.
  • the third luminescent material layer is baked or laser-peeled off the substrate to volatilize or sublimate the first sacrificial layer to expose the first pixel region and the second pixel region.
  • the baking temperature is lower than a cracking temperature of the third luminescent material layer and is higher than a sublimation temperature of the sacrificial layer.
  • the substrate in step S10, includes a substrate and a pixel definition layer.
  • the pixel definition layer includes pixel definition bodies spaced apart from each other.
  • the region is a pixel region, and the upper surface region of the pixel defining body is a non-pixel region.
  • an OLED substrate including:
  • a substrate including a pixel region and a non-pixel region, the pixel region including a first pixel region, a second pixel region, and a third pixel region;
  • a pixel definition layer is provided on the substrate and includes a pixel definition body that defines the first pixel area, the second pixel area, and the third pixel area, and an area corresponding to the pixel definition body. Is a non-pixel area;
  • the light emitting layer includes a first light emitting material, a second light emitting material, and a third light emitting material;
  • the non-pixel region is covered with the first luminescent material, the second luminescent material, and the third luminescent material.
  • a method for manufacturing an OLED substrate which includes the following steps:
  • Step S10 A substrate is provided, the substrate includes a pixel region and a non-pixel region, and the pixel region includes a first pixel region, a second pixel region, and a third pixel region;
  • Step S20 A first sacrificial layer is provided in the first pixel region and the second pixel region, and a third light-emitting material layer is formed above the substrate, and the first sacrificial layer is removed to expose the first sacrificial layer.
  • the first pixel region and the second pixel region form a third pixel region organic layer;
  • Step S30 A second sacrificial layer is provided in the first pixel region and the third pixel region, and a second luminescent material layer is formed above the substrate, and the second sacrificial layer is removed to expose the second sacrificial layer.
  • the first pixel region and the third pixel region form an organic layer of a second pixel region;
  • Step S40 A third sacrificial layer is provided in the second pixel region and the third pixel region, and a first luminescent material layer is formed above the substrate, and the third sacrificial layer is removed to expose the third sacrificial layer.
  • the second pixel region and the third pixel region form an organic layer of the first pixel region.
  • the first pixel region, the second pixel region, and the third pixel region are one of a blue pixel region, a green pixel region, and a red pixel region, and the The colors of the first pixel region, the second pixel region, and the third pixel region are different from each other.
  • the color of the first luminescent material layer is the same as the color of the first pixel region
  • the color of the second luminescent material layer is the same as the color of the two pixel region
  • the third The color of the luminescent material layer is the same as the color of the third pixel region.
  • the first sacrificial layer, the second sacrificial layer, and the third sacrificial layer are made of binary fluoride.
  • the first sacrificial layer, the second sacrificial layer, and the third sacrificial layer are formed by using an inkjet printing technology.
  • the step S20 specifically includes: printing the first sacrificial layer on the first pixel region and the second pixel region by using an inkjet printing technique, and forming the first sacrificial layer on the substrate.
  • the third luminescent material layer is baked or laser-peeled off the substrate to volatilize or sublimate the first sacrificial layer to expose the first pixel region and the second pixel region.
  • the baking temperature is lower than a cracking temperature of the third luminescent material layer and is higher than a sublimation temperature of the sacrificial layer.
  • the substrate in step S10, includes a substrate and a pixel definition layer.
  • the pixel definition layer includes pixel definition bodies spaced apart from each other.
  • the region is a pixel region, and the upper surface region of the pixel defining body is a non-pixel region.
  • the preparation of three types of pixel region light-emitting material layers has been accurately completed by using a method of setting a sacrificial layer and then removing it. It not only solves the difficulty of positioning the photomask and the substrate, but also solves the problem that the photomask is easily deformed due to its own gravity and thermal expansion, which leads to poor coating efficiency of the organic light-emitting material layer in the pixel area, and improves the product yield.
  • FIG. 1 is a schematic flowchart of a method for manufacturing an OLED substrate in an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a substrate in an embodiment of the present application.
  • 3a-3d are schematic structural diagrams of a method for manufacturing an OLED substrate in an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of an OLED substrate in an embodiment of the present application.
  • FIG. 1 is a schematic flowchart of a method for manufacturing an OLED substrate according to an embodiment of the present application.
  • This application provides a method for manufacturing an OLED substrate.
  • FIG. 2 is a schematic structural diagram of a substrate in an embodiment of the present application.
  • a substrate 1 is provided.
  • the substrate 1 includes a pixel region 121 and a non-pixel region 122.
  • the pixel region 121 includes a first pixel region 121a, a second pixel region 121b, and a third pixel region 121c.
  • the substrate 1 includes a substrate 11 and a pixel definition layer 12, and the pixel definition layer 12 includes pixel definition bodies distributed at intervals. A region enclosed by adjacent pixel definition bodies is a pixel region 121. The upper surface area of the pixel defining body is a non-pixel area 122.
  • the substrate 1 includes a thin film transistor array.
  • the thin film transistor array is used to control a switch of a pixel region in an OLED display panel composed of the OLED substrate to be closed.
  • the first pixel region, the second pixel region, and the third pixel region are one of a blue pixel region, a green pixel region, and a red pixel region, and the The colors of the first pixel region, the second pixel region, and the third pixel region are different from each other.
  • the pixel area in the present application is not limited to three pixel areas. According to actual needs, the pixel area also includes four pixel areas. For example, when the red pixel region, the green pixel region, the blue pixel region, and the white pixel region are used, it is only necessary to add a preparation process of the organic layer of the white pixel region in the subsequent preparation of the organic layer. The specific operation is the same as the method for preparing the red pixel region, the green pixel region, and the blue pixel region.
  • the step S10 further includes: forming a common layer on the surface of the substrate 1, the common layer covering the pixel region 121 and the non-pixel region 122, and the common layer has a light emitting property.
  • Excitons provide such functions as transporting holes.
  • step S20 a first sacrificial layer 21 is disposed in the first pixel region 121a and the second pixel region 121b.
  • a third light-emitting material layer 3 c is formed on the substrate 1.
  • the first sacrificial layer 21 is removed.
  • a third pixel region organic layer 33 is formed.
  • the first sacrificial layer 21 is printed on the first pixel region 121a and the second pixel region 121b by using an inkjet printing technology.
  • a third light-emitting material layer 3 c is formed on the substrate 1.
  • the substrate 1 is baked or laser-peeled to make the first sacrificial layer 21 volatilize or sublimate.
  • a third pixel region organic layer 33 is formed.
  • the application uses the addition of the sacrificial layer 2 so that the sacrificial layer 2 is removed in a subsequent process. Furthermore, the light-emitting material region on the upper part of the sacrificial layer 2 retains the required organic layer 3. In this way, the problem of difficult alignment of the photomask and the substrate 1 is avoided, and the yield of the OLED substrate is improved.
  • the first sacrificial layer 21 is made of binary fluoride. According to the purpose of this application, it is necessary to use materials that are easy to sublime under normal pressure. This material needs to have the characteristics of low volatility temperature and no reaction with the light-emitting material. Specifically, due to the inertness of fluorine ions, binary compounds can be formed with all elements except helium, neon, and argon. Therefore, the preparation material of the sacrificial layer is selected here as binary fluoride and other substances that easily sublimate or glass at room temperature. Similarly, the preparation materials of the second sacrificial layer 22 and the third sacrificial layer 23 are also binary fluoride and other substances that are easily sublimated or glass at normal temperature.
  • the third luminescent material layer 3c may be formed by using one of a vacuum evaporation technique, a physical vapor deposition technique, a chemical vapor deposition technique, and a pulsed laser deposition technique.
  • an open photomask is used to vapor-deposit the third luminescent material layer 3c over the substrate 1.
  • a second sacrificial layer 22 is disposed in the first pixel region 121 a and the third pixel region 121 c, and a second light-emitting material layer 3 b is formed above the substrate 1.
  • the second sacrificial layer 22 is removed to expose the first pixel region 121a and the third pixel region 121c, and a second pixel region organic layer 32 is formed.
  • step S30 is similar to the working principle of step S20, and the purpose is to form the second region organic layer 32.
  • the working principle of step S20 please refer to the working principle of step S20.
  • a third sacrificial layer 23 is disposed in the second pixel region 121b and the third pixel region 121c.
  • a first luminescent material layer 3 a is formed on the substrate 1.
  • the third sacrificial layer 23 is removed to expose the second pixel region 121b and the third pixel region 121c, and a first pixel region organic layer 31 is formed.
  • step S40 is similar to the working principle of step S20, and the purpose is to form the second region organic layer 31.
  • the working principle of step S20 please refer to the working principle of step S20.
  • the color of the first luminescent material layer is the same as the color of the first pixel region 121a.
  • the color of the second luminescent material layer is the same as the color of the two-pixel region 121b.
  • the color of the third luminescent material layer is the same as the color of the third pixel region 121c.
  • the first sacrificial layer, the second sacrificial layer, and the third sacrificial layer are formed using inkjet printing technology.
  • the baking temperature is lower than the cracking temperature of the third luminescent material layer and is higher than the sublimation temperature of the sacrificial layer.
  • the non-pixel region 122 of the OLED substrate is covered with a first luminescent material, a second luminescent material, and a third luminescent material.
  • the first luminescent material 131 is a blue luminescent material
  • the second luminescent material is a green luminescent material
  • the third luminescent material is a red luminescent material.
  • FIG. 2 is a schematic structural diagram of a substrate in an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of an OLED substrate in an embodiment of the present application.
  • an OLED substrate including:
  • the substrate 11 includes a pixel region 121 and a non-pixel region 122.
  • the pixel region 121 includes a first pixel region 121a, a second pixel region 121b, and a third pixel region 121c.
  • the pixel definition layer 12 is disposed on the substrate 11 and includes a pixel definition body that defines the first pixel area 121a, the second pixel area 121b, and the third pixel area 121c.
  • the region corresponding to the volume is the non-pixel region 122.
  • the light emitting layer includes a first light emitting material, a second light emitting material, and a third light emitting material;
  • the non-pixel region 122 is covered with the first luminescent material, the second luminescent material, and the third luminescent material.
  • the non-pixel region 122 is a non-light emitting region.
  • the preparation of the three pixel region light-emitting material layers has been accurately completed by using a method of setting and then removing the sacrificial layer, which not only solves the difficulty of positioning the photomask and the substrate, but also easily deforms the photomask due to its own gravity and thermal expansion. This leads to the problem of poor coating efficiency of the organic light-emitting material layer in the pixel region, which improves the yield of the product.

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Abstract

一种OLED基板及其制作方法，包括：提供包括非像素区域(122)、第一像素区域(121a)、第二像素区域(121b)和第三像素区域(121c)的基板(11)；在所述第一像素区域(121a)和所述第二像素区域(121b)内设置第一牺牲层(21)，并在所述基板(11)的上方形成第三发光材料层(3c)，除去所述第一牺牲层(21)；采用相同的方式依次制备第二像素区域有机层(32)和第一像素区域有机层(31)。

Description

OLED基板及其制作方法 技术领域
本申请涉及显示领域，具体涉及一种OLED基板及其制作方法。
 背景技术
有机成膜技术是OLED显示技术的核心技术之一。通常的，OLED器件中的有机膜层分布精细且厚度较薄。因此，如何精准的制作薄而均匀的有机膜层是本领域人员需要解决的一道难题。
高精度金属掩膜板（FMM）工艺是有机成膜制程中真空蒸镀常采用的工艺之一。所述FMM工艺指的：在真空条件下，将有机材料加热，是的有机材料挥发或沉积在覆盖有光罩（MASK）的基板上，从而在基板的相应位置形成子像素薄膜。虽然目前FMM技术较为成熟。但是FMM技术存在光罩（MASK）与基板对位精度要求高，光罩（MASK）因自身的重力及热膨胀导致自身变形，进而影响有机膜层的涂布精度。
 技术问题
现有工艺中光罩与基板对位难度大，光罩因自身重力及热膨胀容易变形，导致像素区域有机发光材料层涂布效率不佳的问题。
 技术解决方案
为实现上述目的，本发明提供的技术方案如下：
根据本申请的一个方面，提出了一种OLED基板的制作方法，包括以下步骤：
步骤S10、提供一基板，所述基板包括像素区域和非像素区域，所述像素区域包括第一像素区域、第二像素区域和第三像素区域；
步骤S20、在所述第一像素区域和所述第二像素区域内设置第一牺牲层，并在所述基板的上方形成第三发光材料层，除去所述第一牺牲层，以显露所述第一像素区域和所述第二像素区域，形成第三像素区域有机层；
步骤S30、在所述第一像素区域和所述第三像素区域内设置第二牺牲层，并在所述基板的上方形成第二发光材料层，除去所述第二牺牲层，以显露所述第一像素区域和所述第三像素区域，形成第二像素区域有机层；
步骤S40、在所述第二像素区域和所述第三像素区域内设置第三牺牲层，并在所述基板的上方形成第一发光材料层，除去所述第三牺牲层，以显露所述第二像素区域和所述第三像素区域，形成第一像素区域有机层；
其中，采用真空蒸镀技术、物理气相沉积技术、化学气相沉积技术、脉冲激光沉积技术中的其中一者形成所述第一发光材料层、所述第二发光材料层和所述第三发光材料层。
根据本申请一实施例，所述第一像素区域、所述第二像素区域和所述第三像素区域为蓝色像素区域、为绿色像素区域和红色像素区域中的其中一者，且所述第一像素区域、所述第二像素区域和所述第三像素区域的颜色互不相同。
根据本申请一实施例，所述第一发光材料层的颜色与所述第一像素区域的颜色相同，所述第二发光材料层的颜色与所述二像素区域的颜色相同，所述第三发光材料层的颜色与所述第三像素区域的颜色相同。
根据本申请一实施例，所述第一牺牲层、所述第二牺牲层和所述第三牺牲层的制备材料均为二元氟化物。
根据本申请一实施例，采用喷墨打印技术形成所述第一牺牲层、所述第二牺牲层和所述第三牺牲层。
根据本申请一实施例，所述步骤S20具体包括：采用喷墨打印技术将所述第一牺牲层打印在所述第一像素区域和所述第二像素区域，并在所述基板的上方形成第三发光材料层，烘烤或激光剥离所述基板，使所述第一牺牲层挥发或升华，以显露所述第一像素区域和所述第二像素区域。
根据本申请一实施例，所述烘烤温度低于所述第三发光材料层的裂解温度，并大于所述牺牲层的升华温度。
根据本申请一实施例，在步骤S10中，所述基板包括：衬底和像素定义层，所述像素定义层包括间隔分布的像素定义体，相邻所述像素定义体之间所围挡的区域为像素区域，所述像素定义体的上表面区域为非像素区域。
根据本申请的另一个方面，还提供了一种OLED基板，包括：
基板，包括像素区域和非像素区域，所述像素区域包括第一像素区域、第二像素区域和第三像素区域；
像素定义层，设置与所述基板之上，包括将所述第一像素区域、所述第二像素区域、所述第三像素区域进行定义的像素定义体，所述像素定义体所对应的区域为非像素区域；
发光层，包括第一发光材料、第二发光材料和第三发光材料；
其中，所述非像素区域内覆盖有所述第一发光材料、所述第二发光材料和所述第三发光材料。
根据本申请的又一个方面，提出了一种OLED基板的制作方法，包括以下步骤：
步骤S10、提供一基板，所述基板包括像素区域和非像素区域，所述像素区域包括第一像素区域、第二像素区域和第三像素区域；
步骤S20、在所述第一像素区域和所述第二像素区域内设置第一牺牲层，并在所述基板的上方形成第三发光材料层，除去所述第一牺牲层，以显露所述第一像素区域和所述第二像素区域，形成第三像素区域有机层；
步骤S30、在所述第一像素区域和所述第三像素区域内设置第二牺牲层，并在所述基板的上方形成第二发光材料层，除去所述第二牺牲层，以显露所述第一像素区域和所述第三像素区域，形成第二像素区域有机层；
步骤S40、在所述第二像素区域和所述第三像素区域内设置第三牺牲层，并在所述基板的上方形成第一发光材料层，除去所述第三牺牲层，以显露所述第二像素区域和所述第三像素区域，形成第一像素区域有机层。
根据本申请一实施例，所述第一像素区域、所述第二像素区域和所述第三像素区域为蓝色像素区域、为绿色像素区域和红色像素区域中的其中一者，且所述第一像素区域、所述第二像素区域和所述第三像素区域的颜色互不相同。
根据本申请一实施例，所述第一发光材料层的颜色与所述第一像素区域的颜色相同，所述第二发光材料层的颜色与所述二像素区域的颜色相同，所述第三发光材料层的颜色与所述第三像素区域的颜色相同。
根据本申请一实施例，所述第一牺牲层、所述第二牺牲层和所述第三牺牲层的制备材料均为二元氟化物。
根据本申请一实施例，采用喷墨打印技术形成所述第一牺牲层、所述第二牺牲层和所述第三牺牲层。
根据本申请一实施例，所述步骤S20具体包括：采用喷墨打印技术将所述第一牺牲层打印在所述第一像素区域和所述第二像素区域，并在所述基板的上方形成第三发光材料层，烘烤或激光剥离所述基板，使所述第一牺牲层挥发或升华，以显露所述第一像素区域和所述第二像素区域。
根据本申请一实施例，所述烘烤温度低于所述第三发光材料层的裂解温度，并大于所述牺牲层的升华温度。
根据本申请一实施例，在步骤S10中，所述基板包括：衬底和像素定义层，所述像素定义层包括间隔分布的像素定义体，相邻所述像素定义体之间所围挡的区域为像素区域，所述像素定义体的上表面区域为非像素区域。
 有益效果
本申请通过采用设置牺牲层再除去的方式先后精准的完成三种像素区域发光材料层的制备。既解决了光罩与基板对位难度大，也解决了光罩因自身重力及热膨胀容易变形，导致像素区域有机发光材料层涂布效率不佳的问题，提高了产品的良率。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例中OLED基板的制作方法的流程示意图；
图2为本申请实施例中基板的结构示意图；
图3a-3d为本申请实施例中OLED基板的制作方法的结构示意图；
图4为本申请实施例中OLED基板的结构示意图。
 本发明的实施方式
以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请所提到的方向用语，例如[上]、[下]、[前]、[后]、[左]、[右]、[内]、[外]、[侧面]等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本申请，而非用以限制本申请。在图中，结构相似的单元是用以相同标号表示。
本申请现有工艺中光罩与基板对位难度大，光罩因自身重力及热膨胀容易变形，导致像素区域有机发光材料层涂布效率不佳的问题，提出了一种OLED基板的制作方法，本实施例能够改善该缺陷。
下面结合附图和具体实施例对本申请做进一步的说明：
请参阅图1，图1为本申请实施例中OLED基板的制作方法的流程示意图。
本申请提供了一种OLED基板的制作方法。
请参阅图2，图2为本申请实施例中基板的结构示意图。
在步骤S10中、提供一基板1，所述基板1包括像素区域121和非像素区域122，所述像素区域121包括第一像素区域121a、第二像素区域121b和第三像素区域121c。
在一种实施例中，所述基板1包括：衬底11和像素定义层12，所述像素定义层12包括间隔分布的像素定义体。相邻所述像素定义体之间所围挡的区域为像素区域121。所述像素定义体的上表面区域为非像素区域122。
在一种实施例中，所述基板1包括薄膜晶体管阵列。所述薄膜晶体管阵列用于控由所述OLED基板所组成的OLED显示面板中像素区域的开关闭合。
在一种实施例中，所述第一像素区域、所述第二像素区域和所述第三像素区域为蓝色像素区域、为绿色像素区域和红色像素区域中的其中一者，且所述第一像素区域、所述第二像素区域和所述第三像素区域的颜色互不相同。
在一种实施例中，本申请中的像素区域并不仅限于三种像素区域，根据实际需要，所述像素区域也包括四种像素区域。如：红色像素区域、绿色像素区域、蓝色像素区域和白色像素区域时，只需要在后续有机层的制备过程中增添一道白色像素区域有机层的制备工艺。具体操作与红色像素区域、绿色像素区域和蓝色像素区域的制备方法原理相同。
在一种实施例中，所述步骤S10还包括：在所述基板1的表面形成共同层，所述共同层覆盖所述像素区域121和所述非像素区域122，所述共同层具有为发光激子提供传输空穴等作用。
请参阅图3a和3b，在步骤S20中、在所述第一像素区域121a和所述第二像素区域121b内设置第一牺牲层21。并在所述基板1的上方形成第三发光材料层3c。除去所述第一牺牲层21。以显露所述第一像素区域121a和所述第二像素区域121b，形成第三像素区域有机层33。
在一种实施例中，采用喷墨打印技术将所述第一牺牲层21打印在所述第一像素区域121a和所述第二像素区域121b。并在所述基板1的上方形成第三发光材料层3c。烘烤或激光剥离所述基板1，使所述第一牺牲层21挥发或升华。以显露所述第一像素区域121a和所述第二像素区域121b，形成第三像素区域有机层33。
本申请利用牺牲层2的添加，使得在后续工艺中通过牺牲层2的去除。进而将牺牲层2上部的发光材料区域，保留所需的有机层3。这样就避免了光罩与基板1对位较难的问题，提升了OLED基板的良率。
在一种实施例中，所述第一牺牲层21的制备材料为二元氟化物。根据本申请的目的，需要采用常压易升华的材料制备。这种材料需要具有挥发温度低，且不与发光材料发生反应的特性。具体的，由于氟离子的不活泼性，可与除氦氖氩之外的所有元素形成二元化合物。因此这里选择牺牲层的制备材料为二元氟化物及其它常温易升华或玻璃的物质。同理，所述第二牺牲层22、第三牺牲层23的制备材料也为二元氟化物及其它常温易升华或玻璃的物质。
在一种实施例中，在步骤S20中，可以采用真空蒸镀技术、物理气相沉积技术、化学气相沉积技术、脉冲激光沉积技术中的其中一者形成所述第三发光材料层3c。
在一种实施例中，采用开放式光罩在所述基板1上方蒸镀第三发光材料层3c。
请参阅图3b，步骤S30、在所述第一像素区域121a和所述第三像素区域121c内设置第二牺牲层22，并在所述基板1的上方形成第二发光材料层3b。除去所述第二牺牲层22，以显露所述第一像素区域121a和所述第三像素区域121c，形成第二像素区域有机层32。
所述步骤S30的工作原理与所述步骤S20的工作原理相似，目的在与形成第二区域有机层32,具体原理请参考步骤S20的工作原理。
请参阅图3d，在步骤S40中、在所述第二像素区域121b和所述第三像素区域121c内设置第三牺牲层23。并在所述基板1的上方形成第一发光材料层3a。除去所述第三牺牲层23，以显露所述第二像素区域121b和所述第三像素区域121c，形成第一像素区域有机层31。
所述步骤S40的工作原理与所述步骤S20的工作原理相似，目的在与形成第二区域有机层31,具体原理请参考步骤S20的工作原理。
在一种实施例中，所述第一发光材料层的颜色与所述第一像素区域121a的颜色相同。所述第二发光材料层的颜色与所述二像素区域121b的颜色相同。所述第三发光材料层的颜色与所述第三像素区域121c的颜色相同。
在一种实施例中，采用喷墨打印技术形成所述第一牺牲层、所述第二牺牲层和所述第三牺牲层。
在一种实施例中，所述烘烤温度低于所述第三发光材料层的裂解温度，并大于所述牺牲层的升华温度。
在一种实施例中,请参阅图3d，所述OLED基板的非像素区域122上覆盖有第一发光材料、第二发光材料和第三发光材料。所述第一发光材料131为蓝色发光材料，所述第二发光材料为绿色发光材料，所述第三发光材料为红色发光材料。
请参阅图2，图2为本申请实施例中基板的结构示意图。
请参阅图4，图4为本申请实施例中OLED基板的结构示意图。
根据本申请的另一个方面，还提供了一种OLED基板，包括：
基板11，包括像素区域121和非像素区域122，所述像素区域121包括第一像素区域121a、第二像素区域121b和第三像素区域121c。
像素定义层12，设置与所述基板11之上，包括将所述第一像素区域121a、所述第二像素区域121b、所述第三像素区域121c进行定义的像素定义体，所述像素定义体所对应的区域为非像素区域122。
发光层，包括第一发光材料、第二发光材料和第三发光材料；
其中，所述非像素区域122内覆盖有所述第一发光材料、所述第二发光材料和所述第三发光材料。
在一种实施例中，所述非像素区域122为非发光区域。
本申请通过采用设置牺牲层再除去的方式先后精准的完成三种像素区域发光材料层的制备，既解决了光罩与基板对位难度大，也解决了光罩因自身重力及热膨胀容易变形，导致像素区域有机发光材料层涂布效率不佳的问题，提高了产品的良率。
综上所述，虽然本申请已以优选实施例揭露如上，但上述优选实施例并非用以限制本申请，本领域的普通技术人员，在不脱离本申请的精神和范围内，均可作各种更动与润饰，因此本申请的保护范围以权利要求界定的范围为准。

Claims (17)

  1. 一种OLED基板的制作方法，其包括以下步骤：
    步骤S10、提供一基板，所述基板包括像素区域和非像素区域，所述像素区域包括第一像素区域、第二像素区域和第三像素区域；
    步骤S20、在所述第一像素区域和所述第二像素区域内设置第一牺牲层，并在所述基板的上方形成第三发光材料层，除去所述第一牺牲层，以显露所述第一像素区域和所述第二像素区域，形成第三像素区域有机层；
    步骤S30、在所述第一像素区域和所述第三像素区域内设置第二牺牲层，并在所述基板的上方形成第二发光材料层，除去所述第二牺牲层，以显露所述第一像素区域和所述第三像素区域，形成第二像素区域有机层；
    步骤S40、在所述第二像素区域和所述第三像素区域内设置第三牺牲层，并在所述基板的上方形成第一发光材料层，除去所述第三牺牲层，以显露所述第二像素区域和所述第三像素区域，形成第一像素区域有机层；
    其中，采用真空蒸镀技术、物理气相沉积技术、化学气相沉积技术、脉冲激光沉积技术中的其中一者形成所述第一发光材料层、所述第二发光材料层和所述第三发光材料层。
  2. 根据权利要求1所述的OLED基板的制作方法，其中，所述第一像素区域、所述第二像素区域和所述第三像素区域为蓝色像素区域、为绿色像素区域和红色像素区域中的其中一者，且所述第一像素区域、所述第二像素区域和所述第三像素区域的颜色互不相同。
  3. 根据权利要求2所述的OLED基板的制作方法，其中，所述第一发光材料层的颜色与所述第一像素区域的颜色相同，所述第二发光材料层的颜色与所述二像素区域的颜色相同，所述第三发光材料层的颜色与所述第三像素区域的颜色相同。
  4. 根据权利要求1所述的OLED基板的制作方法，其中，所述第一牺牲层、所述第二牺牲层和所述第三牺牲层的制备材料均为二元氟化物。
  5. 根据权利要求4所述的OLED基板的制作方法，其中，采用喷墨打印技术形成所述第一牺牲层、所述第二牺牲层和所述第三牺牲层。
  6. 根据权利要求5所述的OLED基板的制作方法，其中，所述步骤S20具体包括：采用喷墨打印技术将所述第一牺牲层打印在所述第一像素区域和所述第二像素区域，并在所述基板的上方形成第三发光材料层，烘烤或激光剥离所述基板，使所述第一牺牲层挥发或升华，以显露所述第一像素区域和所述第二像素区域。
  7. 根据权利要求6所述的OLED基板的制作方法，其中，所述烘烤温度低于所述第三发光材料层的裂解温度，并大于所述牺牲层的升华温度。
  8. 根据权利要求1所述的OLED基板的制作方法，其中，在步骤S10中，所述基板包括：衬底和像素定义层，所述像素定义层包括间隔分布的像素定义体，相邻所述像素定义体之间所围挡的区域为像素区域，所述像素定义体的上表面区域为非像素区域。
  9. 一种OLED基板，其包括：
    基板，包括像素区域和非像素区域，所述像素区域包括第一像素区域、第二像素区域和第三像素区域；
    像素定义层，设置与所述基板之上，包括将所述第一像素区域、所述第二像素区域、所述第三像素区域进行定义的像素定义体，所述像素定义体所对应的区域为非像素区域；
    发光层，包括第一发光材料、第二发光材料和第三发光材料；
    其中，所述非像素区域内覆盖有所述第一发光材料、所述第二发光材料和所述第三发光材料。
  10. 一种OLED基板的制作方法，其包括以下步骤：
    步骤S10、提供一基板，所述基板包括像素区域和非像素区域，所述像素区域包括第一像素区域、第二像素区域和第三像素区域；
    步骤S20、在所述第一像素区域和所述第二像素区域内设置第一牺牲层，并在所述基板的上方形成第三发光材料层，除去所述第一牺牲层，以显露所述第一像素区域和所述第二像素区域，形成第三像素区域有机层；
    步骤S30、在所述第一像素区域和所述第三像素区域内设置第二牺牲层，并在所述基板的上方形成第二发光材料层，除去所述第二牺牲层，以显露所述第一像素区域和所述第三像素区域，形成第二像素区域有机层；
    步骤S40、在所述第二像素区域和所述第三像素区域内设置第三牺牲层，并在所述基板的上方形成第一发光材料层，除去所述第三牺牲层，以显露所述第二像素区域和所述第三像素区域，形成第一像素区域有机层。
  11. 根据权利要求10所述的OLED基板的制作方法，其中，所述第一像素区域、所述第二像素区域和所述第三像素区域为蓝色像素区域、为绿色像素区域和红色像素区域中的其中一者，且所述第一像素区域、所述第二像素区域和所述第三像素区域的颜色互不相同。
  12. 根据权利要求11所述的OLED基板的制作方法，其中，所述第一发光材料层的颜色与所述第一像素区域的颜色相同，所述第二发光材料层的颜色与所述二像素区域的颜色相同，所述第三发光材料层的颜色与所述第三像素区域的颜色相同。
  13. 根据权利要求10所述的OLED基板的制作方法，其中，所述第一牺牲层、所述第二牺牲层和所述第三牺牲层的制备材料均为二元氟化物。
  14. 根据权利要求13所述的OLED基板的制作方法，其中，采用喷墨打印技术形成所述第一牺牲层、所述第二牺牲层和所述第三牺牲层。
  15. 根据权利要求14所述的OLED基板的制作方法，其中，所述步骤S20具体包括：采用喷墨打印技术将所述第一牺牲层打印在所述第一像素区域和所述第二像素区域，并在所述基板的上方形成第三发光材料层，烘烤或激光剥离所述基板，使所述第一牺牲层挥发或升华，以显露所述第一像素区域和所述第二像素区域。
  16. 根据权利要求15所述的OLED基板的制作方法，其中，所述烘烤温度低于所述第三发光材料层的裂解温度，并大于所述牺牲层的升华温度。
  17. 根据权利要求10所述的OLED基板的制作方法，其中，在步骤S10中，所述基板包括：衬底和像素定义层，所述像素定义层包括间隔分布的像素定义体，相邻所述像素定义体之间所围挡的区域为像素区域，所述像素定义体的上表面区域为非像素区域。
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