WO2020006946A1 - 显示面板扇出走线结构及其制作方法 - Google Patents

显示面板扇出走线结构及其制作方法 Download PDF

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Publication number
WO2020006946A1
WO2020006946A1 PCT/CN2018/113365 CN2018113365W WO2020006946A1 WO 2020006946 A1 WO2020006946 A1 WO 2020006946A1 CN 2018113365 W CN2018113365 W CN 2018113365W WO 2020006946 A1 WO2020006946 A1 WO 2020006946A1
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WIPO (PCT)
Prior art keywords
fan
display panel
layer
bonding
buffer metal
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Ceased
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PCT/CN2018/113365
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English (en)
French (fr)
Inventor
宋利旺
徐洋
柴立
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Publication of WO2020006946A1 publication Critical patent/WO2020006946A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels

Definitions

  • the present invention relates to the field of display technology, and in particular, to a fan-out wiring structure of a display panel and a manufacturing method thereof.
  • Liquid crystal display (Liquid Crystal Display, LCD) has many advantages such as thin body and power saving, and has been widely used. Such as: LCD TVs, mobile phones, personal digital assistants (PDAs), digital cameras, computer screens or laptop screens, etc., which dominate the flat panel display field.
  • LCD Liquid Crystal Display
  • backlight LCDs which include LCD panels and backlight modules (Backlight Module).
  • the working principle of the LCD display device is to use the optical rotation and birefringence of the liquid crystal.
  • the rotation of the liquid crystal is controlled by the voltage, so that the linearly polarized light passing through the lower polarizer is rotated accordingly.
  • From the upper polarizer (the polarization direction of the upper polarizer) (Vertical), so that the upper and lower polarizers plus the liquid crystal cell function as an optical switch. Therefore, a polarizer must be attached to each of the upper and lower sides of the LCD panel.
  • the liquid crystal display panel has an effective display area and a fan-out area.
  • a plurality of pixels are arranged in the effective display area to form a pixel array, and a fan-out area is provided with fan-out traces.
  • Each pixel includes a thin film transistor and a pixel electrode connected to the thin film transistor, and the thin film transistor of each pixel is electrically connected to a scan line and a data line.
  • these scan lines and data lines extend from the effective display area to the fan-out area, and the fan-out lines and the driver chip (driver IC) is electrically connected.
  • a conventional fan-out wiring structure includes: a substrate 1, a metal layer provided on the substrate 1, an insulating layer 3 covering the substrate 1 and the metal layer 2, and The plurality of conductive leads 401 arranged in parallel at intervals on the insulating layer 3, and the metal layer 2 includes: a plurality of bonding leads arranged in parallel at intervals.
  • each conductive lead 401 corresponds to one through a connection via 31 penetrating the insulation layer 3 Bonding lead 201 is electrically connected, and the chip-on-film (COF) signal line is aligned and bonded to the conductive lead 401 to realize the electrical connection between the fan-out trace and the driving chip.
  • COF chip-on-film
  • the COF signal line 501 is correctly pressed at a predetermined position, the COF signal line 501 and the conductive lead 401 can be correctly connected without short-circuit failure, as shown in FIG. 4 As shown, because the distance between adjacent fan-out lines 202 is smaller than the distance between adjacent conductive leads 501 and there is an alignment error during lamination, alignment deviation may occur when the COF signal line 501 and the conductive lead 401 are laminated. As shown in FIG. 4, the COF signal line 501 is shifted to the lower right with respect to the correct position. At this time, if the pressure is too large and the insulation layer 3 is crushed, the COF signal line 501 will not only have a corresponding conductive lead 501.
  • the object of the present invention is to provide a fan-out wiring structure for a display panel, which can reduce the risk of short-circuiting of the COF signal line and the fan-out line when the COF signal lines are aligned and pressed, and realize narrow frame display.
  • the object of the present invention is also to provide a method for manufacturing a fan-out wiring structure of a display panel, which can reduce the risk of short-circuiting of the COF signal line and the fan-out line when the COF signal lines are aligned and aligned, and realize narrow frame display.
  • the present invention provides a display panel fan-out wiring structure, including: a substrate, a metal wiring layer located on the substrate, an insulation layer covering the metal wiring layer and the substrate, and the insulation layer.
  • a display panel fan-out wiring structure including: a substrate, a metal wiring layer located on the substrate, an insulation layer covering the metal wiring layer and the substrate, and the insulation layer.
  • the metal wiring layer includes a plurality of bonding leads arranged in parallel and spaced apart, and a plurality of fan-out lines that are in one-to-one correspondence with the bonding leads and are electrically connected;
  • Each buffer metal pad correspondingly covers a side of a fan-out line close to the bonding lead;
  • Corresponding via holes are formed corresponding to each of the bonding leads and penetrate through the insulating layer and the passivation protection layer. Each conductive lead is electrically connected to a bonding lead through the connection via.
  • the length of the buffer metal pad in the extending direction of the fan-out line is 50um ⁇ 100um.
  • the buffer metal pad has a continuous and uninterrupted flat plate shape.
  • the buffer metal pad has the same pattern as the fan-out line located below it.
  • the conductive leads are used for bonding COF signal lines, and a distance between an end of each conductive lead near the fan-out line and a fan-out line electrically connected to the bonding lead corresponding to the conductive lead is less than 80um.
  • the present invention also provides a fan-out wiring structure for a display panel, which includes: a metal wiring layer, an insulating layer covering the metal wiring layer, and a plurality of buffer metal cushion layers arranged in parallel on the insulating layer.
  • a passivation protection layer covering the insulating layer and the buffer metal pad layer and a plurality of parallel spaced conductive leads on the passivation protection layer;
  • the metal wiring layer includes: a plurality of bonding leads arranged in parallel and spaced apart, and a plurality of fan-out lines that are in one-to-one correspondence with the bonding leads and are electrically connected; and
  • Corresponding via holes are formed corresponding to each of the bonding leads and penetrate through the insulating layer and the passivation protection layer. Each conductive lead is electrically connected to a bonding lead through the connection via.
  • connection via is formed corresponding to each of the bonding leads through the insulating layer and the passivation protection layer.
  • each conductive lead is electrically connected to a bonding lead through a connection via.
  • the length of the buffer metal pad in the extending direction of the fan-out line is 50um ⁇ 100um.
  • the buffer metal pad has a continuous and uninterrupted flat plate shape.
  • the cushion metal pad has a rectangular plate shape.
  • the buffer metal pad has the same pattern as the fan-out line located below it.
  • the conductive leads are used for bonding COF signal lines, and the distance between the end of each conductive lead close to the fan-out line and the fan-out line electrically connected to the bonding lead corresponding to the conductive lead is less than 80um.
  • the multiple fan-out lines are used to connect multiple scan lines and multiple data lines of the display panel.
  • the bonding lead is used to align and press-fit the COF signal line with the conductive lead.
  • the invention also provides a method for manufacturing a fan-out wiring structure of a display panel, which includes the following steps:
  • Step S1 a substrate is provided, and a metal wiring layer is formed on the substrate.
  • the metal wiring layer includes: a plurality of bonding wires arranged in parallel and spaced apart, and one-to-one corresponding to the bonding wires and electrically Sexually connected multiple fan-out lines;
  • Step S2 covering the metal wiring layer and the substrate with an insulating layer
  • Step S3 forming a plurality of spaced-apart buffer metal pads on the insulation layer above the fan-out line, each buffer metal pad correspondingly covering a side of the fan-out line close to the bonding lead;
  • Step S4 covering the buffer metal pad and the insulating layer with a passivation protective layer
  • Step S5 forming connection vias through the insulating layer and the passivation protective layer corresponding to each of the bonding leads;
  • Step S6 forming a plurality of parallel spaced conductive leads on the passivation protective layer above the bonding leads, and each conductive lead is electrically connected to a bonding lead through a connection via.
  • the length of the buffer metal pad in the extending direction of the fan-out line is 50um ⁇ 100um.
  • the buffer metal pad has a continuous and uninterrupted flat plate shape.
  • the buffer metal pad has the same pattern as the fan-out line located below it.
  • the conductive leads are used for bonding COF signal lines.
  • the distance between the end of each conductive lead close to the fan-out line and the fan-out line electrically connected to the bonding lead corresponding to the conductive lead is less than 80um.
  • the present invention provides a display panel fan-out wiring structure, including: a substrate, a metal wiring layer located on the substrate, an insulating layer covering the metal wiring layer and the substrate, and A plurality of parallel spaced buffer metal cushion layers on the insulation layer, a passivation protection layer covering the insulation layer and the buffer metal cushion layer, and a plurality of parallel spaced conductive leads on the passivation protection layer;
  • the metal wiring layer includes: a plurality of bonding wires arranged in parallel at intervals and a plurality of fan-out lines that are in one-to-one correspondence with the plurality of bonding wires and are electrically connected; each buffer metal pad correspondingly covers a fan-out line It is close to the side of the bonding wire.
  • the buffer metal pad can be used to support the insulating layer, prevent the insulating layer from being crushed when it is aligned, and reduce the COF signal line. Risk of short circuit of fanout line, realize narrow border display.
  • the invention also provides a method for manufacturing a fan-out wiring structure of a display panel, which can reduce the risk of a short circuit between the COF signal line and the fan-out line when the COF signal lines are aligned and pressed.
  • FIG. 1 is a schematic diagram of a conventional fan-out wiring structure of a display panel
  • FIG. 2 is a cross-sectional view at A-A in FIG. 1;
  • FIG. 3 is a schematic diagram of a conventional display panel fan-out wiring structure and a COF signal line when they are properly pressed;
  • FIG. 4 is a schematic diagram when a conventional display panel fan-out wiring structure is offset from a COF signal line;
  • FIG. 5 is a schematic diagram of a conventional display panel fan-out routing structure after adding a buffer
  • FIG. 6 is a schematic diagram of the display panel fan-out wiring structure shown in FIG. 5 after being laminated with a COF signal line;
  • FIG. 7 is a schematic diagram of a first embodiment of a fan-out routing structure of a display panel according to the present invention.
  • FIG. 8 is a sectional view at D-D in FIG. 7;
  • FIG. 9 is a sectional view at E-E in FIG. 7; FIG.
  • FIG. 10 is a schematic diagram of a second embodiment of a fan-out routing structure of a display panel according to the present invention.
  • FIG. 11 is a cross-sectional view at F-F in FIG. 10;
  • Fig. 12 is a sectional view at G-G in Fig. 10;
  • FIG. 13 is a schematic view of a first embodiment of a fan-out routing structure of a display panel of the present invention after being laminated with a COF signal line;
  • FIG. 14 is a schematic diagram of a second embodiment of a fan-out routing structure of a display panel of the present invention after being laminated with a COF signal line;
  • FIG. 15 is a flowchart of a method for manufacturing a fan-out wiring structure of a display panel according to the present invention.
  • the present invention provides a display panel fan-out wiring structure, which includes a substrate 10, a metal wiring layer 20 on the substrate 10, and insulation covering the metal wiring layer 20 and the substrate 10.
  • Layer 30, a plurality of buffer metal cushion layers 41 arranged in parallel on the insulating layer 30, a passivation protection layer 50 covering the insulation layer 30 and the buffer metal cushion layer 41, and the passivation protection layer 50 A plurality of conductive leads 61 arranged in parallel and spaced apart from each other.
  • the metal wiring layer 20 includes a plurality of bonding leads 21 arranged in parallel and spaced apart, and one-to-one correspondence with the bonding leads 21.
  • a plurality of fan-out lines 22 electrically connected to each bonding lead 21 are formed with connection vias 51 penetrating through the insulating layer 30 and the passivation protection layer 50, and each conductive lead 61 passes through the connection via 51 Corresponds to an electrical connection with a bonding wire 21.
  • the fan-out line 22 is used to connect signal lines such as scan lines and data lines in the display area of the display panel, and the bonding wire 21 is used to align and press-fit the COF signal line 81 with the conductive wire 61 to connect
  • the driving chip provides signals such as scanning signals and data signals to the display panel through the driving chip to drive the display panel to work.
  • each buffer metal pad 41 covers a side of the fan-out line 22 near the bonding lead 21 correspondingly.
  • the buffer metal pad 41 extends from the connection point of the fan-out line 22 and the bonding wire 21 in a direction away from the bonding wire 21, and the extended length ranges from 50um to 100um.
  • the shape of the buffer metal pad 41 is a continuous and uninterrupted flat plate shape, and more specifically a rectangular plate shape.
  • the buffer metal pad 41 has the same pattern as the fan-out line 22 below it.
  • the fan-out line 22 in FIG. 6 is wavy.
  • the buffer metal pad 41 can also be made into a wavy winding.
  • the function of the buffer metal pad 41 is to provide support for the insulating layer 30 when pressing the alignment of the COF signal line 81 onto the conductive lead 61 to prevent During pressing, the insulating layer 30 is crushed due to excessive pressing force to ensure that the COF signal line 81 will not be misaligned and connected to other fan-out lines 22 when the COF signal line 81 is displaced. , Resulting in short circuit and poor display, due to the presence of the buffer metal pad 41, the probability of the insulating layer 30 being crushed is greatly reduced, and the short circuit does not occur without the insulating layer 30 being crushed, so the conductive lead 61 can be reduced accordingly.
  • the length of the buffer zone between the fan-out line 22 and the fan-out line 22 is less than 80um.
  • the buffer zone may not be provided, that is, the end of each conductive lead 61 near the fan-out line 22 is set to a distance from the bonding lead 21 corresponding to the conductive lead 61.
  • the distance of the electrically connected fan-out lines 22 is less than 80um, so as to make full use of the space of the substrate 10 and realize narrow frame display.
  • the substrate 10 is a glass substrate
  • the material of the metal wiring layer 20 and the buffer metal pad 41 is a combination of one or more of molybdenum, aluminum, and copper
  • the material of the conductive lead 61 is Indium tin oxide (ITO).
  • the present invention also provides a method for manufacturing a fan-out wiring structure of a display panel, including the following steps:
  • Step S1 please refer to FIG. 7 to FIG. 9 or FIG. 10 to FIG. 12, a substrate 10 is provided, and a metal wiring layer 20 is formed on the substrate 10.
  • the metal wiring layer 20 includes: The bonding leads 21 and a plurality of fan-out lines 22 which are in one-to-one correspondence with the plurality of bonding leads 21 and are electrically connected.
  • the step S1 includes depositing a metal thin film on the substrate 10, and then patterning the metal thin film through a yellow light process and a wet etching process to obtain the metal wiring layer 20.
  • a material of the metal wiring layer 20 is a combination of one or more of molybdenum, aluminum, and copper, and the substrate 10 is a glass substrate.
  • a plurality of scanning lines are formed simultaneously with the bonding leads 21 and the fan-out lines 22, and each scanning line is correspondingly connected to one fan-out line 22.
  • Step S2 Referring to FIGS. 8 to 9 or 11 to 12, an insulating layer 30 is covered on the metal wiring layer 20 and the substrate 10.
  • Step S3 please refer to FIG. 7 to FIG. 9 or FIG. 10 to FIG. 12, a plurality of spaced-apart buffer metal pads 41 are formed on the insulation layer 30 above the fan-out line 22, and each buffer metal pad 41 covers a fan correspondingly The outgoing line 22 is close to a side of the bonding lead 21.
  • a plurality of data lines are formed at the same time as the buffer metal pad 41, and each data line is correspondingly connected to a fan-out line 22 through a via hole penetrating through the insulation layer 30.
  • the step S3 specifically includes depositing a metal thin film on the insulating layer 30, and then patterning the metal thin film through a yellow light process and a wet etching process to obtain a buffer metal pad 41.
  • the buffer metal pad 41 extends from the connection point of the fan-out line 22 and the bonding wire 21 in a direction away from the bonding wire 21, and the extended length ranges from 50um to 100um.
  • the shape of the buffer metal pad 41 is a continuous and uninterrupted flat plate shape, and more specifically a rectangular plate shape.
  • the buffer metal pad 41 has the same pattern as the fan-out line 22 below it.
  • the fan-out line 22 in FIG. 6 is wavy.
  • the buffer metal pad 41 can also be made into a wavy winding.
  • Step S4 referring to FIG. 8 to FIG. 9 or FIG. 11 to FIG. 12, the buffer metal pad 41 and the insulating layer 30 are covered with a passivation protective layer 50.
  • the passivation protection layer 50 is formed by a physical vapor deposition method and a chemical vapor deposition method.
  • Step S5 referring to FIGS. 8 to 9 or 11 to 12, a connection via 51 is formed corresponding to each bonding wire 21 and penetrates the insulating layer 30 and the passivation protection layer 50.
  • Step S6 referring to FIG. 7 to FIG. 9 or FIG. 10 to FIG. 12, a plurality of parallel spaced conductive leads 61 are formed on the passivation protective layer 50 above the bonding leads 21, and each conductive lead 61 passes The connection via 51 is electrically connected to a bonding lead 21.
  • step S6 a pixel electrode is also formed at the same time as the conductive lead 61.
  • the bonding lead 21, the fan-out line 22 and the scanning line are formed simultaneously, the buffer metal pad 41 and the data line are formed simultaneously, and the conductive lead 61 and the pixel electrode are formed simultaneously.
  • the function of the buffer metal pad 41 is to provide support for the insulating layer 30 when pressing the alignment of the COF signal line 81 onto the conductive lead 61 to prevent During pressing, the insulating layer 30 is crushed due to excessive pressing force to ensure that the COF signal line 81 will not be misaligned and connected to other fan-out lines 22 when the COF signal line 81 is displaced. , Resulting in short circuit and poor display, due to the presence of the buffer metal pad 41, the probability of the insulating layer 30 being crushed is greatly reduced, and the short circuit does not occur without the insulating layer 30 being crushed, so the conductive lead 61 can be reduced accordingly.
  • the length of the buffer zone between the fan-out line 22 and the fan-out line 22 is less than 80um.
  • the buffer zone may not be provided, that is, the end of each conductive lead 61 near the fan-out line 22 is set to a distance from the bonding lead 21 corresponding to the conductive lead 61.
  • the distance of the electrically connected fan-out lines 22 is less than 80um, so as to make full use of the space of the substrate 10 and realize narrow frame display.
  • the present invention provides a fan-out wiring structure for a display panel, including: a substrate, a metal wiring layer located on the substrate, an insulation layer covering the metal wiring layer and the substrate, and the insulation layer.
  • a plurality of buffer metal cushion layers arranged in parallel on the layer, a passivation protective layer covering the insulating layer and the buffer metal cushion layer, and a plurality of conductive wires arranged in parallel on the passivation protection layer;
  • the metal routing layer includes: a plurality of bonding wires arranged in parallel and a plurality of fan-out lines that are in one-to-one correspondence with the plurality of bonding wires and are electrically connected; each buffer metal pad correspondingly covers a fan-out line.
  • the invention also provides a method for manufacturing a fan-out wiring structure of a display panel, which can reduce the risk of a short circuit between the COF signal line and the fan-out line when the COF signal lines are aligned and pressed.

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

一种显示面板扇出走线结构及其制作方法。显示面板扇出走线结构包括：基板（10）、位于基板（10）上的金属走线层（20）、覆盖金属走线层（20）和基板（10）的绝缘层（30）、位于绝缘层（30）上的多个平行间隔排列的缓冲金属垫层（41）、覆盖绝缘层（30）和缓冲金属垫层（41）的钝化保护层（50）以及位于钝化保护层（50）上的多条平行间隔排列的导电引线（61）；金属走线层（20）包括：多条平行间隔排列的邦定引线（21）以及分别与多条邦定引线（21）的一端一一对应且电性连接的多条扇出线（22）；每一个缓冲金属垫（41）均对应覆盖一条扇出线（22）靠近所述邦定引线（21）的一侧；通过缓冲金属垫（41）的设置，能够对绝缘层（30）形成支撑，防止绝缘层（30）被压破，降低COF信号线（81）对位压合时出现COF信号线（81）与扇出线（22）短路的风险，实现窄边框显示。

Description

显示面板扇出走线结构及其制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种显示面板扇出走线结构及其制作方法。
 背景技术
液晶显示装置(Liquid Crystal Display，LCD)具有机身薄、省电等众多优点，得到了广泛的应用。如：液晶电视、移动电话、个人数字助理(PDA)、数字相机、计算机屏幕或笔记本电脑屏幕等，在平板显示领域中占主导地位。
现有市场上的液晶显示器大部分为背光型液晶显示器，其包括液晶面板及背光模组(Backlight Module)。LCD显示器件的工作原理是利用液晶的旋光性和双折射，通过电压控制液晶的转动，使经过下偏光片后的线偏振光随之发生旋转，从上偏光片(与上偏光片的偏振方向垂直)射出，从而上、下偏光片加上液晶盒起到光开关的作用。因此，液晶显示面板上下两侧还必须各贴附一片偏光片。
液晶显示面板具有有效显示区以及扇出区。有效显示区内配置有多个像素以形成像素阵列，扇出区则设有扇出走线。每个像素都包括薄膜晶体管以及与该薄膜晶体管连接的像素电极，且每个像素的薄膜晶体管均电性连接一条扫描线以及一条数据线。通常这些扫描线以及数据线会由有效显示区域延伸至扇出区，并通过扇出走线与驱动芯片(driver IC)电性连接。
 技术问题
如图1及图2所示，现有的扇出走线结构包括：基板1、设于所述基板1上的金属层2、覆盖所述基板1和金属层2的绝缘层3以及设于所述绝缘层3上的多条平行间隔排列的导电引线401，所述金属层2包括：多个平行间隔排列的邦定引线(bonding wire)201及分别与所述多条邦定引线201一一对应且电性连接的多条扇出线(fanout)202，每一条导电引线401均通过贯穿绝缘层3的连接过孔31对应与一条邦定引线201电性连接，通过将覆晶薄膜(Chip On Flex，COF)信号线对位压合到所述导电引线401上，实现扇出走线与驱动芯片的电性连接，在COF信号线501与导电引线401对位压合时，如图3所示，若COF信号线501按照预定位置正确压合，COF信号线501与导电引线401能够正确连接，不会出现短路不良，如图4所示，由于相邻扇出线202之间的间距小于相邻导电引线501之间的间距以及压合时存在对位误差的原因，COF信号线501与导电引线401压合时可能出现对位偏移，如图4中COF信号线501相对于正确位置向右下偏移，此时若压合时压力过大压破绝缘层3，则会出现COF信号线501不仅会与其对应的导电引线501电性连接，还会错位连接到其他扇出线202上的情况，如图4中的位置B处所示，COF信号线501错位连接到其他扇出线202上，造成短路，最终导致显示不良，为了避免上述问题，如图5所示，现有技术在导电引线401和扇出线202之间增设了一长度大于200um的缓冲区C，此时如图6所示，即便COF信号线501压合时出现与图5相同的偏移，也不会出现COF信号线501错位连接到其他扇出线202上的情况，但缓冲区C的存在会导致显示面板的边框变宽，这一设计不符合目前窄边框显示的要求。
 技术解决方案
本发明的目的在于提供一种显示面板扇出走线结构，能够降低COF信号线对位压合时出现COF信号线与扇出线短路的风险，实现窄边框显示。
本发明的目的还在于提供一种显示面板扇出走线结构的制作方法，能够降低COF信号线对位压合时出现COF信号线与扇出线短路的风险，实现窄边框显示。
为实现上述目的，本发明提供了一种显示面板扇出走线结构，包括：基板、位于所述基板上的金属走线层、覆盖所述金属走线层和基板的绝缘层、位于所述绝缘层上的多个平行间隔排列的缓冲金属垫层、覆盖所述绝缘层和缓冲金属垫层的钝化保护层以及位于所述钝化保护层上的多条平行间隔排列的导电引线；
所述金属走线层包括：多条平行间隔排列的邦定引线以及分别与所述多条邦定引线一一对应且电性连接的多条扇出线；
每一个缓冲金属垫均对应覆盖一条扇出线靠近所述邦定引线的一侧；
对应每一条邦定引线均形成有贯穿所述绝缘层和钝化保护层的连接过孔，每一条导电引线均通过连接过孔对应与一条邦定引线电性连接。
可选地，所述缓冲金属垫在所述扇出线的延伸方向上的长度为50um~100um。
可选地，所述缓冲金属垫呈连续不间断的平板状。
可选地，所述缓冲金属垫具有与位于其下方的扇出线相同的图案。
可选地，所述导电引线用于邦定COF信号线，每一条导电引线靠近所述扇出线的一端距离与所述条导电引线对应的邦定引线电性连接的扇出线的距离小于80um。
本发明还提供了一种显示面板扇出走线结构，其包括：金属走线层、覆盖所述金属走线层的绝缘层、位于所述绝缘层上的多个平行间隔排列的缓冲金属垫层、覆盖所述绝缘层和缓冲金属垫层的钝化保护层以及位于所述钝化保护层上的多条平行间隔排列的导电引线；
所述金属走线层包括：多条平行间隔排列的邦定引线以及分别与所述多条邦定引线一一对应且电性连接的多条扇出线；及
对应每一条邦定引线均形成有贯穿所述绝缘层和钝化保护层的连接过孔，每一条导电引线均通过连接过孔对应与一条邦定引线电性连接。
可选地，对应每一条邦定引线均形成有贯穿所述绝缘层和钝化保护层的连接过孔。
可选地，每一条导电引线均通过连接过孔对应与一条邦定引线电性连接。
可选地，所述缓冲金属垫在所述扇出线的延伸方向上的长度为50um~100um。
可选地，所述缓冲金属垫呈连续不间断的平板状。
可选地，所述缓冲金属垫为一矩形板状。
可选地，所述缓冲金属垫具有与位于其下方的扇出线相同的图案。
可选地，所述导电引线用于邦定COF信号线，每一条导电引线靠近所述扇出线的一端距离与所述条导电引线对应的邦定引线电性连接的扇出线的距离小于80um。
可选地，所述多条扇出线用于连接显示面板的多条扫描线及多条数据线。
可选地，所述邦定引线用于通过所述导电引线与COF信号线对位压合。
本发明还提供一种显示面板扇出走线结构的制作方法，包括如下步骤：
步骤S1、提供一基板，在所述基板上形成金属走线层，所述金属走线层包括：多条平行间隔排列的邦定引线及分别与所述多条邦定引线一一对应且电性连接的多条扇出线；
步骤S2、在所述金属走线层和基板上覆盖绝缘层；
步骤S3、在所述扇出线上方的绝缘层上形成多个间隔排列缓冲金属垫，每一个缓冲金属垫均对应覆盖一条扇出线靠近所述邦定引线的一侧；
步骤S4、在所述缓冲金属垫和绝缘层上覆盖钝化保护层；
步骤S5、分别对应每一条邦定引线形成贯穿所述绝缘层和钝化保护层的连接过孔；
步骤S6、在所述邦定引线上方的钝化保护层上形成多条平行间隔排列的导电引线，每一条导电引线均通过连接过孔对应与一条邦定引线电性连接。
所述缓冲金属垫在所述扇出线的延伸方向上的长度为50um~100um。
所述缓冲金属垫呈连续不间断的平板状。
所述缓冲金属垫具有与位于其下方的扇出线相同的图案。
所述导电引线用于邦定COF信号线，每一条导电引线靠近所述扇出线的一端距离与所述条导电引线对应的邦定引线电性连接的扇出线的距离小于80um。
 有益效果
本发明的有益效果：本发明提供了一种显示面板扇出走线结构，包括：基板、位于所述基板上的金属走线层、覆盖所述金属走线层和基板的绝缘层、位于所述绝缘层上的多个平行间隔排列的缓冲金属垫层、覆盖所述绝缘层和缓冲金属垫层的钝化保护层以及位于所述钝化保护层上的多条平行间隔排列的导电引线；所述金属走线层包括：多条平行间隔排列的邦定引线以及分别与所述多条邦定引线一一对应且电性连接的多条扇出线；每一个缓冲金属垫均对应覆盖一条扇出线靠近所述邦定引线的一侧；通过缓冲金属垫的设置，能够对绝缘层形成支撑，防止绝缘层在对位压合时压破，降低COF信号线对位压合时出现COF信号线与扇出线短路的风险，实现窄边框显示。本发明还提供一种显示面板扇出走线结构的制作方法，能够降低COF信号线对位压合时出现COF信号线与扇出线短路的风险。
 附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为现有的显示面板扇出走线结构的示意图；
图2为图1中A-A处的剖面图；
图3为现有的显示面板扇出走线结构与COF信号线正确压合时的示意图；
图4为现有的显示面板扇出走线结构与COF信号线压合出现偏移时的示意图；
图5为现有的显示面板扇出走线结构增设缓冲区后的示意图；
图6为图5所示的显示面板扇出走线结构与COF信号线压合后的示意图；
图7为本发明的显示面板扇出走线结构的第一实施例的示意图；
图8为图7中D-D处的剖面图；
图9为图7中E-E处的剖面图；
图10为本发明的显示面板扇出走线结构的第二实施例的示意图；
图11为图10中F-F处的剖面图；
图12为图10中G-G处的剖面图；
图13为本发明的显示面板扇出走线结构的第一实施例与COF信号线压合后的示意图；
图14为本发明的显示面板扇出走线结构的第二实施例与COF信号线压合后的示意图；
图15为本发明的显示面板扇出走线结构的制作方法的流程图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅7至图12，本发明提供一种显示面板扇出走线结构，包括：基板10、位于所述基板10上的金属走线层20、覆盖所述金属走线层20和基板10的绝缘层30、位于所述绝缘层30上的多个平行间隔排列的缓冲金属垫层41、覆盖所述绝缘层30和缓冲金属垫层41的钝化保护层50以及位于所述钝化保护层50上的多条平行间隔排列的导电引线61。
具体地，请参阅图7至图9或图10至图12，所述金属走线层20包括：多条平行间隔排列的邦定引线21以及分别与所述多条邦定引线21一一对应且电性连接的多条扇出线22，对应每一条邦定引线21均形成有贯穿所述绝缘层30和钝化保护层50的连接过孔51，每一条导电引线61均通过连接过孔51对应与一条邦定引线21电性连接。
其中，所述扇出线22用于连接显示面板的显示区内的扫描线和数据线等信号线，所述邦定引线21用于通过导电引线61与COF信号线81对位压合，以连接驱动芯片，从而通过驱动芯片将扫描信号及数据信号等信号提供至显示面板内，以驱动显示面板工作。
具体地，每一个缓冲金属垫41均对应覆盖一条扇出线22靠近所述邦定引线21的一侧。
优选地，所述缓冲金属垫41自扇出线22与邦定引线21的连接点处开始往远离所述邦定引线21的方向延伸，延伸的长度范围为50um~100um。
进一步地，如图7所示，在本发明的第一实施例中，所述缓冲金属垫41的形状呈连续不间断的平板状，更具体地的为一矩形板状。
进一步地，如图10所示，在本发明的第二实施例中，所述缓冲金属垫41具有与位于其下方的扇出线22相同的图案，例如，图6中所述扇出线22为波浪形的绕线，此时所述缓冲金属垫41也可以制作成波浪形的绕线。
需要说明的是，如图13及图14所示，所述缓冲金属垫41的作用为：在将COF信号线81的对位压合至导电引线61上时，为绝缘层30提供支撑，防止压合时，因压合力过大压破绝缘层30，以保证在COF信号线81出现偏移的情况下，也不会因绝缘层30破裂导致COF信号线81错位连接到其他扇出线22上，造成短路和显示不良，由于缓冲金属垫41的存在，绝缘层30被压破的机率大大减小，在绝缘层30不被压破的情况下不会发生短路，因此可以相应减少导电引线61与扇出线22之间的缓冲区的长度至80um以下，甚至可以不设置缓冲区，即设置每一条导电引线61靠近所述扇出线22的一端距离与所述导电引线61对应的邦定引线21电性连接的扇出线22的距离小于80um，以充分利用基板10的空间，实现窄边框显示。
优选地，所述基板10为玻璃基板，所述金属走线层20及缓冲金属垫41的材料均为钼、铝及铜中的一种或多种的组合，所述导电引线61的材料为氧化铟锡（Indium tin oxide, ITO）。
请参阅图15，本发明还提供一种显示面板扇出走线结构的制作方法，包括如下步骤：
步骤S1、请参阅图7至图9或图10至图12，提供一基板10，在所述基板10上形成金属走线层20，所述金属走线层20包括：多条平行间隔排列的邦定引线21及分别与所述多条邦定引线21一一对应且电性连接的多条扇出线22。
具体地，所述步骤S1具体包括在所述基板10上沉积金属薄膜，随后通过黄光制程和湿蚀刻制程对所述金属薄膜进行图案化，得到所述金属走线层20。
优选地，所述金属走线层20的材料为钼、铝及铜中的一种或多种的组合，所述基板10为玻璃基板。
具体地，所述步骤S1中，与所述邦定引线21和扇出线22同时形成的还包括多条扫描线，每一条扫描线均对应连接一条扇出线22。
步骤S2、请参阅图8至图9或图11至图12，在所述金属走线层20和基板10上覆盖绝缘层30。
步骤S3、请参阅图7至图9或图10至图12，在所述扇出线22上方的绝缘层30上形成多个间隔排列缓冲金属垫41，每一个缓冲金属垫41均对应覆盖一条扇出线22靠近所述邦定引线21的一侧。
具体地，所述步骤S3中，与所述缓冲金属垫41同时形成的还包括多条数据线，每一条数据线均通过一贯穿所述绝缘层30的过孔对应连接一条扇出线22。
具体地，所述步骤S3具体包括在所述绝缘层30上沉积金属薄膜，并随后通过黄光制程和湿蚀刻制程对所述金属薄膜进行图案化，得到缓冲金属垫41。
优选地，所述缓冲金属垫41自扇出线22与邦定引线21的连接点处开始往远离所述邦定引线21的方向延伸，延伸的长度范围为50um~100um。
进一步地，如图7所示，在本发明的第一实施例中，所述缓冲金属垫41的形状呈连续不间断的平板状，更具体地的为一矩形板状。
进一步地，如图10所示，在本发明的第二实施例中，所述缓冲金属垫41具有与位于其下方的扇出线22相同的图案，例如，图6中所述扇出线22为波浪形的绕线，此时所述缓冲金属垫41也可以制作成波浪形的绕线。
步骤S4、请参阅图8至图9或图11至图12，在所述缓冲金属垫41和绝缘层30上覆盖钝化保护层50。
具体地，所述步骤S4中通过物理气相沉积和化学气相沉积的方法形成所述钝化保护层50。
步骤S5、请参阅图8至图9或图11至图12，分别对应每一条邦定引线21形成贯穿所述绝缘层30和钝化保护层50的连接过孔51。
步骤S6、请参阅图7至图9或图10至图12，在所述邦定引线21上方的钝化保护层50上形成多条平行间隔排列的导电引线61，每一条导电引线61均通过连接过孔51对应与一条邦定引线21电性连接。
具体地，所述步骤S6中，与所述导电引线61同时形成的还包括像素电极。
也即，所述邦定引线21、扇出线22与所述扫描线同时形成，所述缓冲金属垫41及数据线同时形成，所述导电引线61和像素电极同时形成。
需要说明的是，如图13及图14所示，所述缓冲金属垫41的作用为：在将COF信号线81的对位压合至导电引线61上时，为绝缘层30提供支撑，防止压合时，因压合力过大压破绝缘层30，以保证在COF信号线81出现偏移的情况下，也不会因绝缘层30破裂导致COF信号线81错位连接到其他扇出线22上，造成短路和显示不良，由于缓冲金属垫41的存在，绝缘层30被压破的机率大大减小，在绝缘层30不被压破的情况下不会发生短路，因此可以相应减少导电引线61与扇出线22之间的缓冲区的长度至80um以下，甚至可以不设置缓冲区，即设置每一条导电引线61靠近所述扇出线22的一端距离与所述导电引线61对应的邦定引线21电性连接的扇出线22的距离小于80um，以充分利用基板10的空间，实现窄边框显示。
综上所述，本发明提供了一种显示面板扇出走线结构，包括：基板、位于所述基板上的金属走线层、覆盖所述金属走线层和基板的绝缘层、位于所述绝缘层上的多个平行间隔排列的缓冲金属垫层、覆盖所述绝缘层和缓冲金属垫层的钝化保护层以及位于所述钝化保护层上的多条平行间隔排列的导电引线；所述金属走线层包括：多条平行间隔排列的邦定引线以及分别与所述多条邦定引线一一对应且电性连接的多条扇出线；每一个缓冲金属垫均对应覆盖一条扇出线靠近所述邦定引线的一侧；通过缓冲金属垫的设置，能够对绝缘层形成支撑，防止绝缘层在对位压合时压破，降低COF信号线对位压合时出现COF信号线与扇出线短路的风险，实现窄边框显示。本发明还提供一种显示面板扇出走线结构的制作方法，能够降低COF信号线对位压合时出现COF信号线与扇出线短路的风险。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (20)

  1. 一种显示面板扇出走线结构，其包括：基板、位于所述基板上的金属走线层、覆盖所述金属走线层和基板的绝缘层、位于所述绝缘层上的多个平行间隔排列的缓冲金属垫层、覆盖所述绝缘层和缓冲金属垫层的钝化保护层以及位于所述钝化保护层上的多条平行间隔排列的导电引线；
    所述金属走线层包括：多条平行间隔排列的邦定引线以及分别与所述多条邦定引线一一对应且电性连接的多条扇出线；
    每一个缓冲金属垫均对应覆盖一条扇出线靠近所述邦定引线的一侧；
    对应每一条邦定引线均形成有贯穿所述绝缘层和钝化保护层的连接过孔，每一条导电引线均通过连接过孔对应与一条邦定引线电性连接。
  2. 如权利要求1所述的显示面板扇出走线结构，其中所述缓冲金属垫在所述扇出线的延伸方向上的长度为50um~100um。
  3. 如权利要求1所述的显示面板扇出走线结构，其中所述缓冲金属垫呈连续不间断的平板状。
  4. 如权利要求1所述的显示面板扇出走线结构，其中所述缓冲金属垫具有与位于其下方的扇出线相同的图案。
  5. 如权利要求1所述的显示面板扇出走线结构，其中所述导电引线用于邦定COF信号线，每一条导电引线靠近所述扇出线的一端距离与所述条导电引线对应的邦定引线电性连接的扇出线的距离小于80um。
  6. 一种显示面板扇出走线结构的制作方法，其包括如下步骤：
    步骤S1、提供一基板，在所述基板上形成金属走线层，所述金属走线层包括：多条平行间隔排列的邦定引线及分别与所述多条邦定引线一一对应且电性连接的多条扇出线；
    步骤S2、在所述金属走线层和基板上覆盖绝缘层；
    步骤S3、在所述扇出线上方的绝缘层上形成多个间隔排列缓冲金属垫，每一个缓冲金属垫均对应覆盖一条扇出线靠近所述邦定引线的一侧；
    步骤S4、在所述缓冲金属垫和绝缘层上覆盖钝化保护层；
    步骤S5、分别对应每一条邦定引线形成贯穿所述绝缘层和钝化保护层的连接过孔；
    步骤S6、在所述邦定引线上方的钝化保护层上形成多条平行间隔排列的导电引线，每一条导电引线均通过连接过孔对应与一条邦定引线电性连接。
  7. 如权利要求6所述的显示面板扇出走线结构的制作方法，其中所述缓冲金属垫在所述扇出线的延伸方向上的长度为50um~100um。
  8. 如权利要求6所述的显示面板扇出走线结构的制作方法，其中所述缓冲金属垫呈连续不间断的平板状。
  9. 如权利要求6所述的显示面板扇出走线结构的制作方法，其中所述缓冲金属垫具有与位于其下方的扇出线相同的图案。
  10. 如权利要求6所述的显示面板扇出走线结构的制作方法，其中所述导电引线用于邦定COF信号线，每一条导电引线靠近所述扇出线的一端距离与所述条导电引线对应的邦定引线电性连接的扇出线的距离小于80um。
  11. 一种显示面板扇出走线结构，其包括：金属走线层、覆盖所述金属走线层的绝缘层、位于所述绝缘层上的多个平行间隔排列的缓冲金属垫层、覆盖所述绝缘层和缓冲金属垫层的钝化保护层以及位于所述钝化保护层上的多条平行间隔排列的导电引线；
    所述金属走线层包括：多条平行间隔排列的邦定引线以及分别与所述多条邦定引线一一对应且电性连接的多条扇出线；及
    对应每一条邦定引线均形成有贯穿所述绝缘层和钝化保护层的连接过孔，每一条导电引线均通过连接过孔对应与一条邦定引线电性连接。
  12. 如权利要求11所述的显示面板扇出走线结构，其中对应每一条邦定引线均形成有贯穿所述绝缘层和钝化保护层的连接过孔。
  13. 如权利要求11所述的显示面板扇出走线结构，其中每一条导电引线均通过连接过孔对应与一条邦定引线电性连接。
  14. 如权利要求11所述的显示面板扇出走线结构，其中所述缓冲金属垫在所述扇出线的延伸方向上的长度为50um~100um。
  15. 如权利要求11所述的显示面板扇出走线结构，其中所述缓冲金属垫呈连续不间断的平板状。
  16. 如权利要求11所述的显示面板扇出走线结构，其中所述缓冲金属垫为一矩形板状。
  17. 如权利要求11所述的显示面板扇出走线结构，其中所述缓冲金属垫具有与位于其下方的扇出线相同的图案。
  18. 如权利要求11所述的显示面板扇出走线结构，其中所述导电引线用于邦定COF信号线，每一条导电引线靠近所述扇出线的一端距离与所述条导电引线对应的邦定引线电性连接的扇出线的距离小于80um。
  19. 如权利要求11所述的显示面板扇出走线结构，其中所述多条扇出线用于连接显示面板的多条扫描线及多条数据线。
  20. 如权利要求11所述的显示面板扇出走线结构，其中所述邦定引线用于通过所述导电引线与COF信号线对位压合。
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