WO2020006946A1

WO2020006946A1 - Fan-out wiring structure of display panel and manufacturing method therefor

Info

Publication number: WO2020006946A1
Application number: PCT/CN2018/113365
Authority: WO
Inventors: 宋利旺; 徐洋; 柴立
Original assignee: 深圳市华星光电半导体显示技术有限公司
Priority date: 2018-07-02
Filing date: 2018-11-01
Publication date: 2020-01-09
Also published as: CN108845465B; CN108845465A

Abstract

A fan-out wiring structure of a display panel and a manufacturing method therefor. The fan-out wiring structure of a display panel comprises: a substrate (10), a metal wiring layer (20) located on the substrate (10), an insulation layer (30) covering the metal wiring layer (20) and the substrate (10), multiple buffer metal pad layers (41) that are located on the insulation layer (30) and that are alternately arranged in parallel, a passivation protection layer (50) covering the insulation layer (30) and the buffer metal pad layers (41), and multiple conductive wires (61) that are located on the passivation protection layer (50) and that are alternately arranged in parallel; the metal wiring layer (20) comprises: multiple bonding wires (21) that are alternately arranged in parallel and multiple fan-out wires (22) that are in one-to-one correspondence with and electrically connected to an end of the multiple bonding wires (21) respectively; each buffer metal pad (41) correspondingly covers a side of a fan-out wire (22) that is close to the bonding wires (21). By means of the configuration of the buffer metal pads (41), a support may be formed for the insulation layer (30) so as to prevent the insulation layer (30) from being crushed, and reduce the risk of COF signal wires (81) and the fan-out wires (22) short-circuiting during the aligned lamination of the COF signal wires (81), thereby achieving narrow bezel display.

Description

Fan-out wiring structure of display panel and manufacturing method thereof

Technical field

The present invention relates to the field of display technology, and in particular, to a fan-out wiring structure of a display panel and a manufacturing method thereof.

Background technique

Liquid crystal display (Liquid Crystal Display, LCD) has many advantages such as thin body and power saving, and has been widely used. Such as: LCD TVs, mobile phones, personal digital assistants (PDAs), digital cameras, computer screens or laptop screens, etc., which dominate the flat panel display field.

Most of the LCD displays on the existing market are backlight LCDs, which include LCD panels and backlight modules (Backlight Module). The working principle of the LCD display device is to use the optical rotation and birefringence of the liquid crystal. The rotation of the liquid crystal is controlled by the voltage, so that the linearly polarized light passing through the lower polarizer is rotated accordingly. From the upper polarizer (the polarization direction of the upper polarizer) (Vertical), so that the upper and lower polarizers plus the liquid crystal cell function as an optical switch. Therefore, a polarizer must be attached to each of the upper and lower sides of the LCD panel.

The liquid crystal display panel has an effective display area and a fan-out area. A plurality of pixels are arranged in the effective display area to form a pixel array, and a fan-out area is provided with fan-out traces. Each pixel includes a thin film transistor and a pixel electrode connected to the thin film transistor, and the thin film transistor of each pixel is electrically connected to a scan line and a data line. Generally, these scan lines and data lines extend from the effective display area to the fan-out area, and the fan-out lines and the driver chip (driver IC) is electrically connected.

technical problem

As shown in FIG. 1 and FIG. 2, a conventional fan-out wiring structure includes: a substrate 1, a metal layer provided on the substrate 1, an insulating layer 3 covering the substrate 1 and the metal layer 2, and The plurality of conductive leads 401 arranged in parallel at intervals on the insulating layer 3, and the metal layer 2 includes: a plurality of bonding leads arranged in parallel at intervals. wire) 201 and a plurality of fanouts 202 that are in one-to-one correspondence with the plurality of bonding leads 201 and are electrically connected, and each conductive lead 401 corresponds to one through a connection via 31 penetrating the insulation layer 3 Bonding lead 201 is electrically connected, and the chip-on-film (COF) signal line is aligned and bonded to the conductive lead 401 to realize the electrical connection between the fan-out trace and the driving chip. When the 501 and the conductive lead 401 are aligned and aligned, as shown in FIG. 3, if the COF signal line 501 is correctly pressed at a predetermined position, the COF signal line 501 and the conductive lead 401 can be correctly connected without short-circuit failure, as shown in FIG. 4 As shown, because the distance between adjacent fan-out lines 202 is smaller than the distance between adjacent conductive leads 501 and there is an alignment error during lamination, alignment deviation may occur when the COF signal line 501 and the conductive lead 401 are laminated. As shown in FIG. 4, the COF signal line 501 is shifted to the lower right with respect to the correct position. At this time, if the pressure is too large and the insulation layer 3 is crushed, the COF signal line 501 will not only have a corresponding conductive lead 501. Electrically connected and misplaced to other fan-outs For the situation on line 202, as shown at position B in FIG. 4, the COF signal line 501 is misaligned and connected to other fan-out lines 202, causing a short circuit and eventually causing a poor display. In order to avoid the above problem, as shown in FIG. 5, There is a technique to add a buffer C between the conductive lead 401 and the fan-out line 202 with a length greater than 200um. At this time, as shown in FIG. 6, even when the COF signal line 501 has the same offset as that shown in FIG. 5, There may be cases where the COF signal line 501 is misaligned and connected to other fan-out lines 202, but the presence of the buffer C will cause the border of the display panel to widen. This design does not meet the current requirements for narrow border display.

Technical solutions

The object of the present invention is to provide a fan-out wiring structure for a display panel, which can reduce the risk of short-circuiting of the COF signal line and the fan-out line when the COF signal lines are aligned and pressed, and realize narrow frame display.

The object of the present invention is also to provide a method for manufacturing a fan-out wiring structure of a display panel, which can reduce the risk of short-circuiting of the COF signal line and the fan-out line when the COF signal lines are aligned and aligned, and realize narrow frame display.

In order to achieve the above object, the present invention provides a display panel fan-out wiring structure, including: a substrate, a metal wiring layer located on the substrate, an insulation layer covering the metal wiring layer and the substrate, and the insulation layer. A plurality of parallel spaced buffer metal cushion layers on the layer, a passivation protection layer covering the insulation layer and the buffer metal cushion layer, and a plurality of parallel spaced conductive leads on the passivation protection layer;

The metal wiring layer includes a plurality of bonding leads arranged in parallel and spaced apart, and a plurality of fan-out lines that are in one-to-one correspondence with the bonding leads and are electrically connected;

Each buffer metal pad correspondingly covers a side of a fan-out line close to the bonding lead;

Corresponding via holes are formed corresponding to each of the bonding leads and penetrate through the insulating layer and the passivation protection layer. Each conductive lead is electrically connected to a bonding lead through the connection via.

Optionally, the length of the buffer metal pad in the extending direction of the fan-out line is 50um ~ 100um.

Optionally, the buffer metal pad has a continuous and uninterrupted flat plate shape.

Optionally, the buffer metal pad has the same pattern as the fan-out line located below it.

Optionally, the conductive leads are used for bonding COF signal lines, and a distance between an end of each conductive lead near the fan-out line and a fan-out line electrically connected to the bonding lead corresponding to the conductive lead is less than 80um.

The present invention also provides a fan-out wiring structure for a display panel, which includes: a metal wiring layer, an insulating layer covering the metal wiring layer, and a plurality of buffer metal cushion layers arranged in parallel on the insulating layer. A passivation protection layer covering the insulating layer and the buffer metal pad layer and a plurality of parallel spaced conductive leads on the passivation protection layer;

The metal wiring layer includes: a plurality of bonding leads arranged in parallel and spaced apart, and a plurality of fan-out lines that are in one-to-one correspondence with the bonding leads and are electrically connected; and

Optionally, a connection via is formed corresponding to each of the bonding leads through the insulating layer and the passivation protection layer.

Optionally, each conductive lead is electrically connected to a bonding lead through a connection via.

Optionally, the cushion metal pad has a rectangular plate shape.

Optionally, the conductive leads are used for bonding COF signal lines, and the distance between the end of each conductive lead close to the fan-out line and the fan-out line electrically connected to the bonding lead corresponding to the conductive lead is less than 80um.

Optionally, the multiple fan-out lines are used to connect multiple scan lines and multiple data lines of the display panel.

Optionally, the bonding lead is used to align and press-fit the COF signal line with the conductive lead.

The invention also provides a method for manufacturing a fan-out wiring structure of a display panel, which includes the following steps:

Step S1, a substrate is provided, and a metal wiring layer is formed on the substrate. The metal wiring layer includes: a plurality of bonding wires arranged in parallel and spaced apart, and one-to-one corresponding to the bonding wires and electrically Sexually connected multiple fan-out lines;

Step S2, covering the metal wiring layer and the substrate with an insulating layer;

Step S3: forming a plurality of spaced-apart buffer metal pads on the insulation layer above the fan-out line, each buffer metal pad correspondingly covering a side of the fan-out line close to the bonding lead;

Step S4, covering the buffer metal pad and the insulating layer with a passivation protective layer;

Step S5: forming connection vias through the insulating layer and the passivation protective layer corresponding to each of the bonding leads;

Step S6: forming a plurality of parallel spaced conductive leads on the passivation protective layer above the bonding leads, and each conductive lead is electrically connected to a bonding lead through a connection via.

The length of the buffer metal pad in the extending direction of the fan-out line is 50um ~ 100um.

The buffer metal pad has a continuous and uninterrupted flat plate shape.

The buffer metal pad has the same pattern as the fan-out line located below it.

The conductive leads are used for bonding COF signal lines. The distance between the end of each conductive lead close to the fan-out line and the fan-out line electrically connected to the bonding lead corresponding to the conductive lead is less than 80um.

Beneficial effect

Beneficial effects of the present invention: The present invention provides a display panel fan-out wiring structure, including: a substrate, a metal wiring layer located on the substrate, an insulating layer covering the metal wiring layer and the substrate, and A plurality of parallel spaced buffer metal cushion layers on the insulation layer, a passivation protection layer covering the insulation layer and the buffer metal cushion layer, and a plurality of parallel spaced conductive leads on the passivation protection layer; The metal wiring layer includes: a plurality of bonding wires arranged in parallel at intervals and a plurality of fan-out lines that are in one-to-one correspondence with the plurality of bonding wires and are electrically connected; each buffer metal pad correspondingly covers a fan-out line It is close to the side of the bonding wire. The buffer metal pad can be used to support the insulating layer, prevent the insulating layer from being crushed when it is aligned, and reduce the COF signal line. Risk of short circuit of fanout line, realize narrow border display. The invention also provides a method for manufacturing a fan-out wiring structure of a display panel, which can reduce the risk of a short circuit between the COF signal line and the fan-out line when the COF signal lines are aligned and pressed.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, but the drawings are provided for reference and explanation only, and are not intended to limit the present invention.

In the drawing,

1 is a schematic diagram of a conventional fan-out wiring structure of a display panel;

2 is a cross-sectional view at A-A in FIG. 1;

3 is a schematic diagram of a conventional display panel fan-out wiring structure and a COF signal line when they are properly pressed;

FIG. 4 is a schematic diagram when a conventional display panel fan-out wiring structure is offset from a COF signal line;

FIG. 5 is a schematic diagram of a conventional display panel fan-out routing structure after adding a buffer;

6 is a schematic diagram of the display panel fan-out wiring structure shown in FIG. 5 after being laminated with a COF signal line;

7 is a schematic diagram of a first embodiment of a fan-out routing structure of a display panel according to the present invention;

8 is a sectional view at D-D in FIG. 7;

FIG. 9 is a sectional view at E-E in FIG. 7; FIG.

10 is a schematic diagram of a second embodiment of a fan-out routing structure of a display panel according to the present invention;

11 is a cross-sectional view at F-F in FIG. 10;

Fig. 12 is a sectional view at G-G in Fig. 10;

13 is a schematic view of a first embodiment of a fan-out routing structure of a display panel of the present invention after being laminated with a COF signal line;

14 is a schematic diagram of a second embodiment of a fan-out routing structure of a display panel of the present invention after being laminated with a COF signal line;

FIG. 15 is a flowchart of a method for manufacturing a fan-out wiring structure of a display panel according to the present invention.

Embodiments of the invention

In order to further explain the technical means adopted by the present invention and its effects, the following describes in detail with reference to the preferred embodiments of the present invention and the accompanying drawings.

Please refer to FIG. 7 to FIG. 12. The present invention provides a display panel fan-out wiring structure, which includes a substrate 10, a metal wiring layer 20 on the substrate 10, and insulation covering the metal wiring layer 20 and the substrate 10. Layer 30, a plurality of buffer metal cushion layers 41 arranged in parallel on the insulating layer 30, a passivation protection layer 50 covering the insulation layer 30 and the buffer metal cushion layer 41, and the passivation protection layer 50 A plurality of conductive leads 61 arranged in parallel and spaced apart from each other.

Specifically, please refer to FIG. 7 to FIG. 9 or FIG. 10 to FIG. 12. The metal wiring layer 20 includes a plurality of bonding leads 21 arranged in parallel and spaced apart, and one-to-one correspondence with the bonding leads 21. In addition, a plurality of fan-out lines 22 electrically connected to each bonding lead 21 are formed with connection vias 51 penetrating through the insulating layer 30 and the passivation protection layer 50, and each conductive lead 61 passes through the connection via 51 Corresponds to an electrical connection with a bonding wire 21.

The fan-out line 22 is used to connect signal lines such as scan lines and data lines in the display area of the display panel, and the bonding wire 21 is used to align and press-fit the COF signal line 81 with the conductive wire 61 to connect The driving chip provides signals such as scanning signals and data signals to the display panel through the driving chip to drive the display panel to work.

Specifically, each buffer metal pad 41 covers a side of the fan-out line 22 near the bonding lead 21 correspondingly.

Preferably, the buffer metal pad 41 extends from the connection point of the fan-out line 22 and the bonding wire 21 in a direction away from the bonding wire 21, and the extended length ranges from 50um to 100um.

Further, as shown in FIG. 7, in the first embodiment of the present invention, the shape of the buffer metal pad 41 is a continuous and uninterrupted flat plate shape, and more specifically a rectangular plate shape.

Further, as shown in FIG. 10, in the second embodiment of the present invention, the buffer metal pad 41 has the same pattern as the fan-out line 22 below it. For example, the fan-out line 22 in FIG. 6 is wavy. In this case, the buffer metal pad 41 can also be made into a wavy winding.

It should be noted that, as shown in FIGS. 13 and 14, the function of the buffer metal pad 41 is to provide support for the insulating layer 30 when pressing the alignment of the COF signal line 81 onto the conductive lead 61 to prevent During pressing, the insulating layer 30 is crushed due to excessive pressing force to ensure that the COF signal line 81 will not be misaligned and connected to other fan-out lines 22 when the COF signal line 81 is displaced. , Resulting in short circuit and poor display, due to the presence of the buffer metal pad 41, the probability of the insulating layer 30 being crushed is greatly reduced, and the short circuit does not occur without the insulating layer 30 being crushed, so the conductive lead 61 can be reduced accordingly. The length of the buffer zone between the fan-out line 22 and the fan-out line 22 is less than 80um. The buffer zone may not be provided, that is, the end of each conductive lead 61 near the fan-out line 22 is set to a distance from the bonding lead 21 corresponding to the conductive lead 61. The distance of the electrically connected fan-out lines 22 is less than 80um, so as to make full use of the space of the substrate 10 and realize narrow frame display.

Preferably, the substrate 10 is a glass substrate, and the material of the metal wiring layer 20 and the buffer metal pad 41 is a combination of one or more of molybdenum, aluminum, and copper, and the material of the conductive lead 61 is Indium tin oxide (ITO).

Referring to FIG. 15, the present invention also provides a method for manufacturing a fan-out wiring structure of a display panel, including the following steps:

Step S1, please refer to FIG. 7 to FIG. 9 or FIG. 10 to FIG. 12, a substrate 10 is provided, and a metal wiring layer 20 is formed on the substrate 10. The metal wiring layer 20 includes: The bonding leads 21 and a plurality of fan-out lines 22 which are in one-to-one correspondence with the plurality of bonding leads 21 and are electrically connected.

Specifically, the step S1 includes depositing a metal thin film on the substrate 10, and then patterning the metal thin film through a yellow light process and a wet etching process to obtain the metal wiring layer 20.

Preferably, a material of the metal wiring layer 20 is a combination of one or more of molybdenum, aluminum, and copper, and the substrate 10 is a glass substrate.

Specifically, in the step S1, a plurality of scanning lines are formed simultaneously with the bonding leads 21 and the fan-out lines 22, and each scanning line is correspondingly connected to one fan-out line 22.

Step S2. Referring to FIGS. 8 to 9 or 11 to 12, an insulating layer 30 is covered on the metal wiring layer 20 and the substrate 10.

Step S3, please refer to FIG. 7 to FIG. 9 or FIG. 10 to FIG. 12, a plurality of spaced-apart buffer metal pads 41 are formed on the insulation layer 30 above the fan-out line 22, and each buffer metal pad 41 covers a fan correspondingly The outgoing line 22 is close to a side of the bonding lead 21.

Specifically, in the step S3, a plurality of data lines are formed at the same time as the buffer metal pad 41, and each data line is correspondingly connected to a fan-out line 22 through a via hole penetrating through the insulation layer 30.

Specifically, the step S3 specifically includes depositing a metal thin film on the insulating layer 30, and then patterning the metal thin film through a yellow light process and a wet etching process to obtain a buffer metal pad 41.

Step S4, referring to FIG. 8 to FIG. 9 or FIG. 11 to FIG. 12, the buffer metal pad 41 and the insulating layer 30 are covered with a passivation protective layer 50.

Specifically, in step S4, the passivation protection layer 50 is formed by a physical vapor deposition method and a chemical vapor deposition method.

Step S5, referring to FIGS. 8 to 9 or 11 to 12, a connection via 51 is formed corresponding to each bonding wire 21 and penetrates the insulating layer 30 and the passivation protection layer 50.

Step S6, referring to FIG. 7 to FIG. 9 or FIG. 10 to FIG. 12, a plurality of parallel spaced conductive leads 61 are formed on the passivation protective layer 50 above the bonding leads 21, and each conductive lead 61 passes The connection via 51 is electrically connected to a bonding lead 21.

Specifically, in step S6, a pixel electrode is also formed at the same time as the conductive lead 61.

That is, the bonding lead 21, the fan-out line 22 and the scanning line are formed simultaneously, the buffer metal pad 41 and the data line are formed simultaneously, and the conductive lead 61 and the pixel electrode are formed simultaneously.

In summary, the present invention provides a fan-out wiring structure for a display panel, including: a substrate, a metal wiring layer located on the substrate, an insulation layer covering the metal wiring layer and the substrate, and the insulation layer. A plurality of buffer metal cushion layers arranged in parallel on the layer, a passivation protective layer covering the insulating layer and the buffer metal cushion layer, and a plurality of conductive wires arranged in parallel on the passivation protection layer; The metal routing layer includes: a plurality of bonding wires arranged in parallel and a plurality of fan-out lines that are in one-to-one correspondence with the plurality of bonding wires and are electrically connected; each buffer metal pad correspondingly covers a fan-out line. One side of the bonding wire; through the provision of a buffer metal pad, the insulating layer can be supported to prevent the insulating layer from being crushed when the registration is pressed, and the COF signal line and the fan are reduced when the registration is pressed. Risk of short circuit in the outgoing line, enabling narrow border display. The invention also provides a method for manufacturing a fan-out wiring structure of a display panel, which can reduce the risk of a short circuit between the COF signal line and the fan-out line when the COF signal lines are aligned and pressed.

As described above, for a person of ordinary skill in the art, various other corresponding changes and modifications can be made according to the technical solution and technical concept of the present invention, and all these changes and deformations should fall within the protection scope of the claims of the present invention. .

Claims

A display panel fan-out wiring structure includes a substrate, a metal wiring layer on the substrate, an insulating layer covering the metal wiring layer and the substrate, and a plurality of parallel spaced arrangements on the insulating layer. A buffer metal cushion layer, a passivation protection layer covering the insulation layer and the buffer metal cushion layer, and a plurality of parallel spaced conductive leads on the passivation protection layer;

The metal wiring layer includes a plurality of bonding leads arranged in parallel and spaced apart, and a plurality of fan-out lines that are in one-to-one correspondence with the bonding leads and are electrically connected;

Each buffer metal pad correspondingly covers a side of a fan-out line close to the bonding lead;

Corresponding via holes are formed corresponding to each of the bonding leads and penetrate through the insulating layer and the passivation protection layer. Each conductive lead is electrically connected to a bonding lead through the connection via.
The fan-out routing structure of a display panel according to claim 1, wherein a length of the buffer metal pad in an extending direction of the fan-out line is 50um ~ 100um.
The fan-out wiring structure of the display panel according to claim 1, wherein the buffer metal pad is in a continuous and uninterrupted flat plate shape.
The fan-out routing structure of the display panel according to claim 1, wherein the buffer metal pad has the same pattern as the fan-out lines located below it.
The fan-out wiring structure of a display panel according to claim 1, wherein the conductive leads are used for bonding COF signal lines, and an end of each conductive lead close to the fan-out line is a bond lead corresponding to the conductive lead. The distance of the fan-out lines for electrical connection is less than 80um.
A manufacturing method of a fan-out wiring structure for a display panel includes the following steps:

Step S1, a substrate is provided, and a metal wiring layer is formed on the substrate. The metal wiring layer includes: a plurality of bonding wires arranged in parallel and spaced apart, and one-to-one corresponding to the bonding wires and electrically Sexually connected multiple fan-out lines;

Step S2, covering the metal wiring layer and the substrate with an insulating layer;

Step S3: forming a plurality of spaced-apart buffer metal pads on the insulation layer above the fan-out line, each buffer metal pad correspondingly covering a side of the fan-out line close to the bonding lead;

Step S4, covering the buffer metal pad and the insulating layer with a passivation protective layer;

Step S5: forming connection vias through the insulating layer and the passivation protective layer corresponding to each of the bonding leads;

Step S6: forming a plurality of parallel spaced conductive leads on the passivation protective layer above the bonding leads, and each conductive lead is electrically connected to a bonding lead through a connection via.
The method for manufacturing a fan-out routing structure of a display panel according to claim 6, wherein a length of the buffer metal pad in an extending direction of the fan-out line is 50um ~ 100um.
The method for manufacturing a fan-out wiring structure of a display panel according to claim 6, wherein the buffer metal pad is in a continuous and uninterrupted flat plate shape.
The method for manufacturing a fan-out routing structure of a display panel according to claim 6, wherein the buffer metal pad has the same pattern as the fan-out lines located below it.
The method for manufacturing a fan-out wiring structure of a display panel according to claim 6, wherein the conductive leads are used to bond a COF signal line, and an end of each conductive lead near the fan-out line corresponds to the conductive lead. The distance between the fan-out lines for the electrical connection of the bonding wires is less than 80um.
A display panel fan-out wiring structure includes: a metal wiring layer, an insulating layer covering the metal wiring layer, a plurality of buffer metal cushion layers arranged in parallel on the insulating layer, and covering the insulation. A passivation protection layer of a layer and a buffer metal pad layer and a plurality of parallel spaced conductive leads arranged on the passivation protection layer;

The metal wiring layer includes: a plurality of bonding leads arranged in parallel and spaced apart, and a plurality of fan-out lines that are in one-to-one correspondence with the bonding leads and are electrically connected; and

Corresponding via holes are formed corresponding to each of the bonding leads and penetrate through the insulating layer and the passivation protection layer. Each conductive lead is electrically connected to a bonding lead through the connection via.
The fan-out wiring structure for a display panel according to claim 11, wherein a connection via is formed through the insulation layer and the passivation protection layer corresponding to each bonding wire.
The fan-out wiring structure of a display panel according to claim 11, wherein each conductive lead is electrically connected to a bonding lead through a connection via.
The fan-out routing structure of a display panel according to claim 11, wherein a length of the buffer metal pad in an extending direction of the fan-out line is 50um ~ 100um.
The fan-out wiring structure of the display panel according to claim 11, wherein the buffer metal pad is in a continuous and uninterrupted flat plate shape.
The fan-out routing structure for a display panel according to claim 11, wherein the buffer metal pad has a rectangular plate shape.
The fan-out routing structure of a display panel according to claim 11, wherein the buffer metal pad has the same pattern as the fan-out lines located below it.
The fan-out wiring structure of a display panel according to claim 11, wherein the conductive leads are used for bonding COF signal lines, and an end of each conductive lead near the fan-out line is a bond lead corresponding to the conductive lead. The distance of the fan-out lines for electrical connection is less than 80um.
The fan-out routing structure of a display panel according to claim 11, wherein the plurality of fan-out lines are used to connect a plurality of scan lines and a plurality of data lines of the display panel.
The fan-out wiring structure of a display panel according to claim 11, wherein the bonding leads are used to align and align the COF signal lines with the conductive leads.