CN108845465A - Display panel is fanned out to Wiring structure and preparation method thereof - Google Patents
Display panel is fanned out to Wiring structure and preparation method thereof Download PDFInfo
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- CN108845465A CN108845465A CN201810708953.1A CN201810708953A CN108845465A CN 108845465 A CN108845465 A CN 108845465A CN 201810708953 A CN201810708953 A CN 201810708953A CN 108845465 A CN108845465 A CN 108845465A
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- insulating layer
- wiring structure
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- Nonlinear Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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- Chemical & Material Sciences (AREA)
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- General Physics & Mathematics (AREA)
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Abstract
The present invention provides a kind of display panels to be fanned out to Wiring structure and preparation method thereof.The display panel is fanned out to Wiring structure：The passivation protection layer of buffer metal bed course, the covering insulating layer and buffer metal bed course that substrate, the metal routing layer on the substrate, the covering metal routing layer and the insulating layer of substrate, multiple parallel intervals on the insulating layer arrange and the conductive lead wire of a plurality of parallel interval arrangement in the passivation protection layer；The metal routing layer includes：The bonding lead of a plurality of parallel interval arrangement and a plurality of fan-out line for corresponding and being electrically connected with one end of a plurality of bonding lead respectively；Each buffer metal pad one fan-out line of corresponding covering is close to the side of the bonding lead；By the setting of buffer metal pad, insulating layer can be formed and be supported, insulating layer is prevented to be crushed, the risk of COF signal wire Yu fan-out line short circuit occurred when reducing the contraposition pressing of COF signal wire, realize that narrow frame is shown.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of display panel to be fanned out to Wiring structure and preparation method thereof.
Background technique
Liquid crystal display device (Liquid Crystal Display, LCD) has many merits such as the thin, power saving of fuselage, obtains
To being widely applied.Such as：LCD TV, mobile phone, personal digital assistant (PDA), digital camera, computer screen or pen
Remember this computer screen etc., occupies an leading position in flat display field.
Liquid crystal display on existing market is largely backlight liquid crystal display comprising liquid crystal display panel and backlight mould
Group (Backlight Module).The working principle of LCD display part is to pass through voltage using the optical activity of liquid crystal and birefringent
The rotation for controlling liquid crystal, rotates the linearly polarized light after down polaroid therewith, from upper polaroid (with upper polaroid
Polarization direction is vertical) it projects, so that upper and lower polaroid plays the role of photoswitch plus liquid crystal cell.Therefore, liquid crystal display panel
Upper and lower two sides must also respectively attach a piece of polaroid.
Liquid crystal display panel has effective display area and fanout area.Configured with multiple pixels to be formed in effective display area
Pixel array, fanout area are then equipped with and are fanned out to cabling.Each pixel includes thin film transistor (TFT) and connect with the thin film transistor (TFT)
Pixel electrode, and the thin film transistor (TFT) of each pixel is electrically connected a scan line and a data line.Usually these
Scan line and data line can be extended to fanout area by effective display area domain, and by being fanned out to cabling and driving chip (driver
IC it) is electrically connected.
As shown in Figures 1 and 2, the existing Wiring structure that is fanned out to includes：Substrate 1, the metal layer 2 on the substrate 1,
Cover the conduction of the insulating layer 3 of the substrate 1 and metal layer 2 and a plurality of parallel interval arrangement on the insulating layer 3
Lead 401, the metal layer 2 include：The bonding lead (bonding lead) 201 of multiple parallel intervals arrangement and respectively with institute
State a plurality of fan-out line (fanout) 202 that a plurality of bonding lead 201 is corresponded and is electrically connected, each conductive lead wire 401
It is electrically connected by the way that the connection via hole 31 through insulating layer 3 is corresponding with a bonding lead 201, by by flip chip
The contraposition of (Chip On Flex, COF) signal wire presses on the conductive lead wire 401, realizes and is fanned out to cabling and driving chip
It is electrically connected, when COF signal wire 501 and the contraposition of conductive lead wire 401 press, as shown in figure 3, if COF signal wire 501 is according to pre-
Correct pressing is set in positioning, and it is not in poor short circuit that COF signal wire 501 can correctly be connect with conductive lead wire 401, such as Fig. 4 institute
Show, due to there is contraposition when the spacing between adjacent fan-out line 202 is less than the spacing and pressing between adjacent conductive wires 501
The reason of error, COF signal wire 501 and conductive lead wire 401 are likely to occur contraposition offset when pressing, such as COF signal wire in Fig. 4
501 deviate relative to correct position to bottom right, and pressure is excessive when if pressing at this time crushes insulating layer 3, will appear COF signal wire
501 not only can be corresponding conductive lead wire 501 be electrically connected, can also misplace situation about being connected on other fan-out lines 202, such as
Shown in position B in Fig. 4, the dislocation of COF signal wire 501 is connected on other fan-out lines 202, is caused short circuit, is eventually led to aobvious
Show it is bad, in order to avoid the above problem, as shown in figure 5, the prior art is additionally arranged between conductive lead wire 401 and fan-out line 202
One length is greater than the buffer area C of 200um, even if at this time as shown in fig. 6, occurring when COF signal wire 501 presses identical with Fig. 5
The situation that the dislocation of COF signal wire 501 is connected on other fan-out lines 202, but the presence meeting of buffer area C will not occur in offset
The frame of display panel is caused to broaden, this different design closes the requirement that current narrow frame is shown.
Summary of the invention
The purpose of the present invention is to provide a kind of display panels to be fanned out to Wiring structure, can reduce COF signal wire contraposition pressure
Occur the risk of COF signal wire Yu fan-out line short circuit when conjunction, realizes that narrow frame is shown.
The object of the invention is also to provide the production methods that a kind of display panel is fanned out to Wiring structure, can reduce COF
There is the risk of COF signal wire Yu fan-out line short circuit when signal wire contraposition pressing, realizes that narrow frame is shown.
To achieve the above object, the present invention provides a kind of display panels to be fanned out to Wiring structure, including：Substrate is located at institute
State the insulating layer, multiple on the insulating layer of metal routing layer on substrate, the covering metal routing layer and substrate
The buffer metal bed course of parallel interval arrangement, the passivation protection layer of the covering insulating layer and buffer metal bed course and it is located at institute
State the conductive lead wire of a plurality of parallel interval arrangement in passivation protection layer；
The metal routing layer includes：The bonding lead and draw respectively with a plurality of bonding that a plurality of parallel interval arranges
The a plurality of fan-out line that line is corresponded and is electrically connected；
Each buffer metal pad one fan-out line of corresponding covering is close to the side of the bonding lead；
Corresponding each bonding lead is each formed with the connection via hole through the insulating layer and passivation protection layer, each
Conductive lead wire passes through connection via hole and corresponds to and a bonding lead electric connection.
Optionally, length of the buffer metal pad on the extending direction of the fan-out line is 50um~100um.
Optionally, the buffer metal pad is in continuous continual tabular.
Optionally, the buffer metal pad has pattern identical with the fan-out line being disposed below.
Optionally, the conductive lead wire be used for bonding COF signal wire, each conductive lead wire close to the fan-out line one
It holds and is less than 80um at a distance from the distance fan-out line that corresponding bonding lead is electrically connected with this conductive lead wire.
The present invention also provides the production methods that a kind of display panel is fanned out to Wiring structure, include the following steps：
Step S1, a substrate is provided, forms metal routing layer on the substrate, the metal routing layer includes：It is a plurality of
The bonding lead of parallel interval arrangement and a plurality of fan-out line for corresponding and being electrically connected with a plurality of bonding lead respectively；
Step S2, insulating layer is covered on the metal routing layer and substrate；
Step S3, formed on the insulating layer above the fan-out line it is multiple be alternatively arranged buffer metal pad, each is slow
Metal gasket one fan-out line of corresponding covering is rushed close to the side of the bonding lead；
Step S4, passivation protection layer is covered on the buffer metal pad and insulating layer；
Step S5, it respectively corresponds each bonding lead and forms the connection for running through the insulating layer and passivation protection layer
Hole；
Step S6, the conduction that a plurality of parallel interval arrangement is formed in the passivation protection layer above the bonding lead is drawn
Line, each conductive lead wire pass through connection via hole and correspond to and a bonding lead electric connection.
Length of the buffer metal pad on the extending direction of the fan-out line is 50um~100um.
The buffer metal pad is in continuous continual tabular.
The buffer metal pad has pattern identical with the fan-out line being disposed below.
The conductive lead wire is used for bonding COF signal wire, one end distance of each conductive lead wire close to the fan-out line
It is less than 80um at a distance from the fan-out line that corresponding bonding lead is electrically connected with this conductive lead wire.
Beneficial effects of the present invention：The present invention provides a kind of display panels to be fanned out to Wiring structure, including：Substrate is located at
The insulating layer, more on the insulating layer of metal routing layer on the substrate, the covering metal routing layer and substrate
The buffer metal bed course of a parallel interval arrangement covers the passivation protection layer of the insulating layer and buffer metal bed course and is located at
The conductive lead wire of a plurality of parallel interval arrangement in the passivation protection layer；The metal routing layer includes：A plurality of parallel interval
The bonding lead of arrangement and a plurality of fan-out line for corresponding and being electrically connected with a plurality of bonding lead respectively；Each
Buffer metal pad one fan-out line of corresponding covering is close to the side of the bonding lead；Pass through the setting of buffer metal pad, energy
Enough formed to insulating layer supports, and prevents insulating layer from crushing when aligning pressing, COF occurs when reducing the contraposition pressing of COF signal wire
The risk of signal wire and fan-out line short circuit realizes that narrow frame is shown.The present invention also provides a kind of display panels to be fanned out to Wiring structure
Production method, can reduce COF signal wire contraposition pressing when there is the risk of COF signal wire Yu fan-out line short circuit.
Detailed description of the invention
For further understanding of the features and technical contents of the present invention, it please refers to below in connection with of the invention detailed
Illustrate and attached drawing, however, the drawings only provide reference and explanation, is not intended to limit the present invention.
In attached drawing,
Fig. 1 is the schematic diagram that existing display panel is fanned out to Wiring structure；
Fig. 2 is the sectional view in Fig. 1 at A-A；
Fig. 3 is fanned out to schematic diagram when Wiring structure is correctly pressed with COF signal wire for existing display panel；
Fig. 4 is fanned out to schematic diagram when Wiring structure is deviated with COF signal pressing for existing display panel；
Fig. 5 is fanned out to Wiring structure for existing display panel and adds the schematic diagram behind buffer area；
Fig. 6 is the schematic diagram that display panel shown in fig. 5 is fanned out to after Wiring structure and COF signal pressing；
Fig. 7 is the schematic diagram for the first embodiment that display panel of the invention is fanned out to Wiring structure；
Fig. 8 is the sectional view in Fig. 7 at D-D；
Fig. 9 is the sectional view in Fig. 7 at E-E；
Figure 10 is the schematic diagram for the second embodiment that display panel of the invention is fanned out to Wiring structure；
Figure 11 is the sectional view in Figure 10 at F-F；
Figure 12 is the sectional view in Figure 10 at G-G；
Figure 13 is the first embodiment and the signal after COF signal pressing that display panel of the invention is fanned out to Wiring structure
Figure；
Figure 14 is the second embodiment and the signal after COF signal pressing that display panel of the invention is fanned out to Wiring structure
Figure；
Figure 15 is the flow chart for the production method that display panel of the invention is fanned out to Wiring structure.
Specific embodiment
Further to illustrate technological means and its effect adopted by the present invention, below in conjunction with preferred implementation of the invention
Example and its attached drawing are described in detail.
Please referring to 7 to Figure 12, the present invention provides a kind of display panel and is fanned out to Wiring structure, including：Substrate 10, be located at it is described
The insulating layer 30 of metal routing layer 20, the covering metal routing layer 20 and substrate 10 on substrate 10 is located at the insulating layer
The passivation of the buffer metal bed course 41, the covering insulating layer 30 and buffer metal bed course 41 of multiple parallel intervals arrangement on 30
Protective layer 50 and the conductive lead wire 61 of a plurality of parallel interval arrangement in the passivation protection layer 50.
Specifically, Fig. 7 to Fig. 9 or Figure 10 are please referred to Figure 12, the metal routing layer 20 includes：A plurality of parallel interval row
The bonding lead 21 of column and a plurality of fan-out line 22 for corresponding and being electrically connected with a plurality of bonding lead 21 respectively, it is right
Each bonding lead 21 is answered to be each formed with the connection via hole 51 through the insulating layer 30 and passivation protection layer 50, each is led
Electrical lead 61 is electrically connected by the way that connection via hole 51 is corresponding with a bonding lead 21.
Wherein, the fan-out line 22 is used to connect the scan line and data line equisignal line in the viewing area of display panel,
The bonding lead 21 is used to press by conductive lead wire 61 and the contraposition of COF signal wire 81, to connect driving chip, to pass through
The signals such as scanning signal and data-signal are provided in display panel by driving chip, to drive display panel to work.
Specifically, each buffer metal pad 41 one fan-out line 22 of corresponding covering is close to the one of the bonding lead 21
Side.
Preferably, toward far from described the buffer metal pad 41 is since at the tie point of fan-out line 22 and bonding lead 21
The direction of bonding lead 21 extends, and the length range of extension is 50um~100um.
Further, as shown in fig. 7, in the first embodiment of the present invention, the shape of the buffer metal pad 41 is in company
Continue continual tabular, is more specifically a rectangular plate-like.
Further, as shown in Figure 10, in the second embodiment of the present invention, the buffer metal pad 41 has and is located at
The identical pattern of fan-out line 22 below, for example, fan-out line 22 described in Fig. 6 is wavy coiling, the at this time buffering
Metal gasket 41 can also be fabricated to wavy coiling.
It should be noted that as shown in FIG. 13 and 14, the effect of the buffer metal pad 41 is：By COF signal wire
When 81 contraposition is pressure bonded on conductive lead wire 61, support is provided for insulating layer 30, when preventing pressing, is crushed because pressure force is excessive absolutely
Edge layer 30 will not lead to COF signal wire because insulating layer 30 ruptures to guarantee in the case where COF signal wire 81 deviates
81 dislocation are connected on other fan-out lines 22, cause short circuit and display bad, due to the presence of buffer metal pad 41, insulating layer 30
The probability being crushed greatly reduces, and short circuit will not occur in the case where insulating layer 30 is not crushed, therefore can accordingly reduce
The length of buffer area between conductive lead wire 61 and fan-out line 22 is to 80um or less, it might even be possible to be not provided with buffer area, that is, being arranged
One end distance with this conductive lead wire 61 corresponding bonding lead 21 electricity of each conductive lead wire 61 close to the fan-out line 22
Property connection the distance of fan-out line 22 be less than 80um, to make full use of the space of substrate 10, realize that narrow frame is shown.
Preferably, the substrate 10 is glass substrate, and the material of the metal routing layer 20 and buffer metal pad 41 is
One of molybdenum, aluminium and copper or a variety of combinations, the material of the conductive lead wire 61 are tin indium oxide (Indium tin
Oxide, ITO).
Figure 15 is please referred to, the present invention also provides the production methods that a kind of display panel is fanned out to Wiring structure, including walk as follows
Suddenly：
Step S1, Fig. 7 to Fig. 9 or Figure 10 are please referred to Figure 12, a substrate 10 is provided, forms metal on the substrate 10
Routing layer 20, the metal routing layer 20 include：The bonding lead 21 of a plurality of parallel interval arrangement and respectively with a plurality of nation
Determine a plurality of fan-out line 22 that lead 21 is corresponded and is electrically connected.
Specifically, the step S1 is specifically included in deposited metal film on the substrate 10, then passes through yellow light process
The metallic film is patterned with wet etching processing procedure, obtains the metal routing layer 20.
Preferably, the material of the metal routing layer 20 is one of molybdenum, aluminium and copper or a variety of combinations, the substrate
10 be glass substrate.
Specifically, in the step S1, what is be formed simultaneously with the bonding lead 21 and fan-out line 22 further includes a plurality of sweep
Line is retouched, each scan line is correspondingly connected with a fan-out line 22.
Step S2, Fig. 8 to Fig. 9 or Figure 11 are please referred to Figure 12, is covered on the metal routing layer 20 and substrate 10 exhausted
Edge layer 30.
Step S3, Fig. 7 to Fig. 9 or Figure 10 are please referred to Figure 12, is formed on the insulating layer 30 above the fan-out line 22
Multiple to be alternatively arranged buffer metal pad 41, each buffer metal pad 41 one fan-out line 22 of corresponding covering is close to the bonding
The side of lead 21.
Specifically, in the step S3, what is be formed simultaneously with the buffer metal pad 41 further includes multiple data lines, each
Data line passes through the via hole that one runs through the insulating layer 30 and is correspondingly connected with a fan-out line 22.
Specifically, the step S3 is specifically included in deposited metal film on the insulating layer 30, and then passes through yellow light
Processing procedure and wet etching processing procedure pattern the metallic film, obtain buffer metal pad 41.
Preferably, toward far from described the buffer metal pad 41 is since at the tie point of fan-out line 22 and bonding lead 21
The direction of bonding lead 21 extends, and the length range of extension is 50um~100um.
Further, as shown in fig. 7, in the first embodiment of the present invention, the shape of the buffer metal pad 41 is in company
Continue continual tabular, is more specifically a rectangular plate-like.
Further, as shown in Figure 10, in the second embodiment of the present invention, the buffer metal pad 41 has and is located at
The identical pattern of fan-out line 22 below, for example, fan-out line 22 described in Fig. 6 is wavy coiling, the at this time buffering
Metal gasket 41 can also be fabricated to wavy coiling.
Step S4, Fig. 8 to Fig. 9 or Figure 11 are please referred to Figure 12, is covered on the buffer metal pad 41 and insulating layer 30
Passivation protection layer 50.
Specifically, the passivation is formed by the method for physical vapour deposition (PVD) and chemical vapor deposition in the step S4 to protect
Sheath 50.
Step S5, Fig. 8 to Fig. 9 or Figure 11 are please referred to Figure 12, each bonding lead 21 is respectively corresponded and is formed through institute
State the connection via hole 51 of insulating layer 30 and passivation protection layer 50.
Step S6, the passivation protection layer 50 for please referring to Fig. 7 to Fig. 9 or Figure 10 to Figure 12, above the bonding lead 21
The upper conductive lead wire 61 for forming a plurality of parallel interval arrangement, each conductive lead wire 61 are corresponded to and one by connection via hole 51
Bonding lead 21 is electrically connected.
Specifically, in the step S6, what is be formed simultaneously with the conductive lead wire 61 further includes pixel electrode.
That is, the bonding lead 21, fan-out line 22 are formed simultaneously with the scan line, the buffer metal pad 41 and number
It is formed simultaneously according to line, the conductive lead wire 61 and pixel electrode are formed simultaneously.
It should be noted that as shown in FIG. 13 and 14, the effect of the buffer metal pad 41 is：By COF signal wire
When 81 contraposition is pressure bonded on conductive lead wire 61, support is provided for insulating layer 30, when preventing pressing, is crushed because pressure force is excessive absolutely
Edge layer 30 will not lead to COF signal wire because insulating layer 30 ruptures to guarantee in the case where COF signal wire 81 deviates
81 dislocation are connected on other fan-out lines 22, cause short circuit and display bad, due to the presence of buffer metal pad 41, insulating layer 30
The probability being crushed greatly reduces, and short circuit will not occur in the case where insulating layer 30 is not crushed, therefore can accordingly reduce
The length of buffer area between conductive lead wire 61 and fan-out line 22 is to 80um or less, it might even be possible to be not provided with buffer area, that is, being arranged
One end distance with this conductive lead wire 61 corresponding bonding lead 21 electricity of each conductive lead wire 61 close to the fan-out line 22
Property connection the distance of fan-out line 22 be less than 80um, to make full use of the space of substrate 10, realize that narrow frame is shown.
In conclusion the present invention provides a kind of display panels to be fanned out to Wiring structure, including：Substrate is located at the substrate
On metal routing layer, the covering metal routing layer with the insulating layer of substrate, on the insulating layer it is multiple it is parallel between
Every the buffer metal bed course of arrangement, the passivation protection layer of the covering insulating layer and buffer metal bed course and it is located at the passivation
The conductive lead wire of a plurality of parallel interval arrangement on protective layer；The metal routing layer includes：The nation of a plurality of parallel interval arrangement
The a plurality of fan-out line for determining lead and corresponding and be electrically connected with a plurality of bonding lead respectively；Each buffer metal
Pad one fan-out line of corresponding covering is close to the side of the bonding lead；It, can be to insulation by the setting of buffer metal pad
Layer formed support, prevent insulating layer align pressing when crush, reduce COF signal wire contraposition pressing when occur COF signal wire with
The risk of fan-out line short circuit realizes that narrow frame is shown.The present invention also provides the production sides that a kind of display panel is fanned out to Wiring structure
There is the risk of COF signal wire Yu fan-out line short circuit when can reduce the contraposition pressing of COF signal wire in method.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology
Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the claims in the present invention
Protection scope.
Claims (10)
1. a kind of display panel is fanned out to Wiring structure, which is characterized in that including：Substrate (10) is located on the substrate (10)
Metal routing layer (20), is located at the insulating layer at the insulating layer (30) for covering the metal routing layer (20) and substrate (10)
(30) buffer metal bed course (41), the covering insulating layer (30) and the buffer metal bed course of multiple parallel intervals arrangement on
(41) conductive lead wire of passivation protection layer (50) and a plurality of parallel interval arrangement being located on the passivation protection layer (50)
(61)；
The metal routing layer (20) includes：The bonding lead (21) of a plurality of parallel interval arrangement and respectively with a plurality of nation
Determine a plurality of fan-out line (22) that lead (21) correspond and are electrically connected；
Each buffer metal pad (41) is corresponding to cover a fan-out line (22) close to the side of the bonding lead (21)；
Corresponding each bonding lead (21) are each formed with the connection through the insulating layer (30) and passivation protection layer (50)
Hole (51), each conductive lead wire (61) are electrically connected by the way that connection via hole (51) is corresponding with a bonding lead (21).
2. display panel as described in claim 1 is fanned out to Wiring structure, which is characterized in that the buffer metal pad (41) is in institute
Stating the length on the extending direction of fan-out line (22) is 50um~100um.
3. display panel as described in claim 1 is fanned out to Wiring structure, which is characterized in that the buffer metal pad (41) is in company
Continue continual tabular.
4. display panel as described in claim 1 is fanned out to Wiring structure, which is characterized in that the buffer metal pad (41) has
With the identical pattern of fan-out line (22) being disposed below.
5. display panel as described in claim 1 is fanned out to Wiring structure, which is characterized in that the conductive lead wire (61) is used for nation
Determine COF signal wire (81), one end distance and this conductive lead wire of each conductive lead wire (61) close to the fan-out line (22)
(61) distance for the fan-out line (22) that corresponding bonding lead (21) is electrically connected is less than 80um.
6. the production method that a kind of display panel is fanned out to Wiring structure, which is characterized in that include the following steps：
Step S1, a substrate (10) are provided, is formed on the substrate (10) metal routing layer (20), the metal routing layer
(20) include：The bonding lead (21) of a plurality of parallel interval arrangement and correspond respectively with a plurality of bonding lead (21) and
The a plurality of fan-out line (22) being electrically connected；
Step S2, insulating layer (30) are covered on the metal routing layer (20) and substrate (10)；
Step S3, formed on the insulating layer (30) above the fan-out line (22) it is multiple be alternatively arranged buffer metal pad (41),
Each buffer metal pad (41) is corresponding to cover a fan-out line (22) close to the side of the bonding lead (21)；
Step S4, passivation protection layer (50) are covered on the buffer metal pad (41) and insulating layer (30)；
Step S5, each bonding lead (21) are respectively corresponded to be formed through the insulating layer (30) and passivation protection layer (50)
It connects via hole (51)；
Step S6, the conduction of a plurality of parallel interval arrangement is formed in the passivation protection layer (50) above the bonding lead (21)
Lead (61), each conductive lead wire (61) are electrically connected by the way that connection via hole (51) is corresponding with a bonding lead (21).
7. the production method that display panel as claimed in claim 6 is fanned out to Wiring structure, which is characterized in that the buffer metal
Padding the length of (41) on the extending direction of the fan-out line (22) is 50um~100um.
8. the production method that display panel as claimed in claim 6 is fanned out to Wiring structure, which is characterized in that the buffer metal
Padding (41) is in continuous continual tabular.
9. the production method that display panel as claimed in claim 6 is fanned out to Wiring structure, which is characterized in that the buffer metal
Pad the identical pattern of fan-out line (22) that (41) have with are disposed below.
10. the production method that display panel as claimed in claim 6 is fanned out to Wiring structure, which is characterized in that the conduction is drawn
Line (61) be used for bonding COF signal wire (81), each conductive lead wire (61) close to the fan-out line (22) one end distance with
The distance for the fan-out line (22) that the corresponding bonding lead (21) of this conductive lead wire (61) is electrically connected is less than 80um.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810708953.1A CN108845465B (en) | 2018-07-02 | 2018-07-02 | Fan-out wiring structure of display panel and manufacturing method thereof |
| PCT/CN2018/113365 WO2020006946A1 (en) | 2018-07-02 | 2018-11-01 | Fan-out wiring structure of display panel and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810708953.1A CN108845465B (en) | 2018-07-02 | 2018-07-02 | Fan-out wiring structure of display panel and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108845465A true CN108845465A (en) | 2018-11-20 |
| CN108845465B CN108845465B (en) | 2020-07-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810708953.1A Active CN108845465B (en) | 2018-07-02 | 2018-07-02 | Fan-out wiring structure of display panel and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN108845465B (en) |
| WO (1) | WO2020006946A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109884830A (en) * | 2019-02-28 | 2019-06-14 | 京东方科技集团股份有限公司 | Array substrate and preparation method thereof, display device, mask plate |
| CN113031357A (en) * | 2021-03-18 | 2021-06-25 | 绵阳惠科光电科技有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
| WO2021136067A1 (en) * | 2020-01-02 | 2021-07-08 | 京东方科技集团股份有限公司 | Substrate and display panel |
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| CN109884830A (en) * | 2019-02-28 | 2019-06-14 | 京东方科技集团股份有限公司 | Array substrate and preparation method thereof, display device, mask plate |
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| WO2021136067A1 (en) * | 2020-01-02 | 2021-07-08 | 京东方科技集团股份有限公司 | Substrate and display panel |
| US11487169B2 (en) * | 2020-01-02 | 2022-11-01 | Fuzhou Boe Optoelectronics Technology Co., Ltd. | Substrate comprising a first lead having a curved section close to a bonding electrode and a straight section close to an edge of a substrate and display panel |
| CN113031357A (en) * | 2021-03-18 | 2021-06-25 | 绵阳惠科光电科技有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
| CN113031357B (en) * | 2021-03-18 | 2022-09-09 | 绵阳惠科光电科技有限公司 | Array substrate, liquid crystal display panel and liquid crystal display device |
| WO2022193786A1 (en) * | 2021-03-18 | 2022-09-22 | 绵阳惠科光电科技有限公司 | Array substrate, liquid crystal display panel, and liquid crystal display apparatus |
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| Publication number | Publication date |
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| WO2020006946A1 (en) | 2020-01-09 |
| CN108845465B (en) | 2020-07-28 |
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