WO2020000577A1 - Oled显示面板 - Google Patents

Oled显示面板 Download PDF

Info

Publication number
WO2020000577A1
WO2020000577A1 PCT/CN2018/098326 CN2018098326W WO2020000577A1 WO 2020000577 A1 WO2020000577 A1 WO 2020000577A1 CN 2018098326 W CN2018098326 W CN 2018098326W WO 2020000577 A1 WO2020000577 A1 WO 2020000577A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
end portion
layer
insulating layer
corner portion
Prior art date
Application number
PCT/CN2018/098326
Other languages
English (en)
French (fr)
Inventor
陈彩琴
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/095,708 priority Critical patent/US11264586B2/en
Publication of WO2020000577A1 publication Critical patent/WO2020000577A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3275—Details of drivers for data electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0404—Matrix technologies
    • G09G2300/0408—Integration of the drivers onto the display substrate
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0421—Structural details of the set of electrodes
    • G09G2300/043—Compensation electrodes or other additional electrodes in matrix displays related to distortions or compensation signals, e.g. for modifying TFT threshold voltage in column driver

Definitions

  • the invention relates to the field of display, and in particular to an OLED display panel.
  • the OLED display panel is very sensitive to external moisture and oxygen, in order to ensure the characteristics of the OLED display panel, we use a thin film package to block the erosion of water and oxygen.
  • the stress of the packaging film is likely to be inconsistent with that of the underlying substrate due to the difference in process temperature. When the difference is too large, the packaging film is likely to peel off and the package fails.
  • An object of the embodiments of the present invention is to provide an OLED display panel, which can prevent the packaging film from falling off.
  • An embodiment of the present invention provides an OLED display panel, including:
  • An OLED device layer, the OLED device layer is disposed on the substrate, and a through hole is provided on the OLED device layer;
  • the OLED device layer includes a display area and a non-display area; wherein the through hole is located on the non-display area;
  • the thin film encapsulation layer includes a first organic layer, an inorganic layer, and a second organic layer that are sequentially stacked on the OLED device layer.
  • the through-holes include a first through-hole, a second through-hole, and a third through-hole; wherein the first through-hole is located at an edge of the display area, and the third A through hole is located at an edge of the thin film encapsulation layer, and the second through hole is located between an edge of the display region and an edge of the thin film encapsulation layer.
  • the display area includes a first end portion and a second end portion disposed oppositely, a third end portion and a fourth end portion disposed opposite to each other, and the first end portion and A first corner portion between the third end portion, a second corner portion between the first end portion and the fourth end portion, the second end portion and the third end portion A third corner portion therebetween, and a fourth corner portion between the second end portion and the fourth end portion;
  • the first through hole is disposed along the first corner portion, the second corner portion, the third corner portion, the fourth corner portion, and the second end portion;
  • the second through hole and the third through hole are all along the first end portion, the third end portion, the fourth end portion, the first corner portion, and the second corner portion.
  • the third corner portion and the fourth corner portion are provided.
  • the non-display area is provided with a power supply trace and a data signal driving chip
  • the first through hole includes a first sub through hole and a second sub through hole
  • the first sub-via is disposed between the display area and the power supply trace
  • the second sub-via is disposed between the power supply trace and the data signal driving chip.
  • the through holes have different depth values.
  • the through holes have different area values.
  • the display area includes a plurality of sub power supply traces, the plurality of sub power supply traces extend to the non-display area, and are connected to the power supply through a plurality of first vias.
  • the wires are electrically connected, and the first sub vias are disposed between adjacent sub power traces.
  • the display area includes a plurality of data signal driving lines, the plurality of data signal driving lines extend to the non-display area, and communicate with the through a plurality of second via holes.
  • the data signal driving chip is connected, and the second sub-via is disposed between adjacent data signal driving lines.
  • the OLED device layer includes a fourth insulating layer, a third insulating layer, a second insulating layer, a first insulating layer, and a light-emitting functional layer that are sequentially stacked on the substrate;
  • the through hole penetrates the first insulating layer and the second insulating layer and extends to the third insulating layer; or
  • the through hole penetrates the first insulating layer, the second insulating layer, and the third insulating layer; or
  • the through hole penetrates the first insulating layer, the second insulating layer, and the third insulating layer and extends to the fourth insulating layer.
  • An embodiment of the present invention provides an OLED display panel, including:
  • An OLED device layer, the OLED device layer is disposed on the substrate, and a through hole is provided on the OLED device layer;
  • a thin film encapsulation layer covering the OLED device layer and extending into the through hole so that the thin film encapsulation layer is bonded to the OLED device layer.
  • the OLED device layer includes a display area and a non-display area; wherein the through hole is located on the non-display area.
  • the through-holes include a first through-hole, a second through-hole, and a third through-hole; wherein the first through-hole is located at an edge of the display area, and the third A through hole is located at an edge of the thin film encapsulation layer, and the second through hole is located between an edge of the display region and an edge of the thin film encapsulation layer.
  • the display area includes a first end portion and a second end portion disposed oppositely, a third end portion and a fourth end portion disposed opposite to each other, and the first end portion and A first corner portion between the third end portion, a second corner portion between the first end portion and the fourth end portion, the second end portion and the third end portion A third corner portion therebetween, and a fourth corner portion between the second end portion and the fourth end portion;
  • the first through hole is disposed along the first corner portion, the second corner portion, the third corner portion, the fourth corner portion, and the second end portion;
  • the second through hole and the third through hole are all along the first end portion, the third end portion, the fourth end portion, the first corner portion, and the second corner portion.
  • the third corner portion and the fourth corner portion are provided.
  • the non-display area is provided with a power supply trace and a data signal driving chip
  • the first through hole includes a first sub through hole and a second sub through hole
  • the first sub-via is disposed between the display area and the power supply trace
  • the second sub-via is disposed between the power supply trace and the data signal driving chip.
  • the through holes have different depth values.
  • the through holes have different area values.
  • the display area includes a plurality of sub power supply traces, the plurality of sub power supply traces extend to the non-display area, and pass through a plurality of first vias to the power supply The wires are electrically connected, and the first sub vias are disposed between adjacent sub power traces.
  • the display area includes a plurality of data signal driving lines, the plurality of data signal driving lines extend to the non-display area, and communicate with the through a plurality of second via holes.
  • the data signal driving chip is connected, and the second sub via is disposed between adjacent sub data signal driving lines.
  • the thin film encapsulation layer includes a first organic layer, an inorganic layer, and a second organic layer that are sequentially stacked on the OLED device layer.
  • the OLED device layer includes a fourth insulating layer, a third insulating layer, a second insulating layer, a first insulating layer, and a light-emitting functional layer that are sequentially stacked on the substrate;
  • the through hole penetrates the first insulating layer and the second insulating layer and extends to the third insulating layer; or
  • the through hole penetrates the first insulating layer, the second insulating layer, and the third insulating layer; or
  • the through hole penetrates the first insulating layer, the second insulating layer, and the third insulating layer and extends to the fourth insulating layer.
  • the display panel of the present invention includes: a substrate; an OLED device layer, the OLED device layer is disposed on the substrate, and at least one through hole is provided on the OLED device layer; and a thin film encapsulation layer, the thin film encapsulation layer Covering the OLED device layer and extending into the at least one through hole, so that the thin film encapsulation layer is bonded to the OLED device layer, by opening a through hole in the OLED device layer, and making the thin film encapsulation layer The through hole is filled, so that the adhesion of the thin film encapsulation layer can be enhanced, and peeling and peeling of the film layer can be avoided.
  • FIG. 1 is a schematic plan view of an OLED display panel according to an embodiment of the present invention.
  • FIG. 2 is a partial schematic diagram of an OLED display panel according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the OLED display panel shown in FIG. 1 along the A-A direction.
  • FIG. 4 is a schematic structural diagram of a thin film encapsulation layer in an OLED display panel according to an embodiment of the present invention.
  • first and second are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality” is two or more, unless specifically defined otherwise.
  • the "first” or “lower” of the first feature may include the first and second features in direct contact, and may also include the first and second features. Not directly, but through another characteristic contact between them.
  • the first feature is “above”, “above”, and “above” the second feature, including that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature is higher in level than the second feature.
  • the first feature is “below”, “below”, and “below” of the second feature, including the fact that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature is less horizontal than the second feature.
  • FIG. 1 is a schematic plan view of an OLED display panel according to an embodiment of the present invention.
  • an OLED display panel according to an embodiment of the present invention includes a substrate 10, an OLED device layer 20, and a thin film encapsulation layer 30.
  • the OLED device layer 20 is disposed on the substrate 10, and a through hole 200 is defined in the OLED device layer 20.
  • the thin-film encapsulation layer 30 covers the OLED device layer 20 and extends into the through hole 200 so that the thin-film encapsulation layer 30 and the OLED device layer 20 are bonded together.
  • the OLED device layer 20 includes a display area 210 and a non-display area 220.
  • the non-display area 220 surrounds the display area 210.
  • the through hole 200 is provided on the non-display area 220. While not affecting the normal display of the OLED display panel, the Increasing the compactness of the combination of the thin-film encapsulation layer 30 and the OLED device layer 20, thereby improving the encapsulation effect.
  • the through-hole 200 includes a first through-hole 201, a second through-hole 202, and a third through-hole 203.
  • the first through-hole 201 is located at the edge of the display area 210, and the third through-hole 203 is located at the thin film encapsulation layer 30.
  • Edge, the second through hole 202 is located between the edge of the display area 210 and the edge of the thin film encapsulation layer 30.
  • the first through hole 201 is located at the outer edge of the display area 210, and the first through hole 201 is spaced from the outer edge of the display area 210. The distance is such that when the first through hole 201 is formed, the display area 210 is not Make an impact.
  • the display area 210210 includes a first end portion 2111, a second end portion 2112, a third end portion 2113, a fourth end portion 2114, a first corner portion 2115, a second corner portion 2116, and a third corner connected to each other.
  • the portion 2117 and the fourth corner portion 2118, the first end portion 2111 and the second end portion 2112 are oppositely disposed, the third end portion 2113 and the fourth end portion 2114 are oppositely disposed, and the first corner portion 2115 is disposed on the first end portion 2111 and Between the third end portion 2113, the second corner portion 2116 is provided between the first end portion 2111 and the fourth end portion 2114, and the third corner portion 2117 is provided between the second end portion 2112 and the third end portion 2113.
  • a fourth corner portion 2118 is provided between the second end portion 2112 and the fourth end portion 2114.
  • the first through hole 201 is provided along the first corner portion 2115, the second corner portion 2116, the third corner portion 2117, the fourth corner portion 2118, and the second end portion 2112. That is, the first corner portion 2115, the second corner portion 2116, the third corner portion 2117, the fourth corner portion 2118, and the second end portion 2112 are provided with a plurality of first through holes 201.
  • the through holes 201 are arranged at intervals.
  • the second through hole 202 and the third through hole 203 are along the first end portion 2111, the third end portion 2113, the fourth end portion 2114, the first corner portion 2115, the second corner portion 2116, the third corner portion 2117, and A fourth corner portion 2118 is provided. That is, a plurality of first end portions 2111, third end portions 2113, fourth end portions 2114, first corner portions 2115, second corner portions 2116, third corner portions 2117, and fourth corner portions 2118 are provided.
  • the second through hole 202 and the third through hole 203 Among them, a plurality of first through holes 201 are arranged at intervals, a plurality of third through holes 203 are arranged at intervals, and the second through holes 202 are closer to the third through holes 203. Display area 210.
  • the above description of the through-holes is merely to set up through-holes in the non-display area 220 as much as possible, and those skilled in the art may set the through-holes 200 in the non-display area 220 as needed.
  • the first end portion 2111, the second end portion 2112, the third end portion 2113, the fourth end portion 2114, the first corner portion 2115, the second corner portion 2116, and the third corner portion 2117 or the fourth corner portion 2118 is provided with a through hole 200.
  • FIG. 2 is a partial schematic diagram of an OLED display panel according to an embodiment of the present invention.
  • a plurality of scanning signal driving lines 401, a plurality of data signal driving lines 402, a plurality of scanning signal driving lines 401, and a plurality of data signal driving are provided on a display area 210 of the OLED display panel.
  • the scanning signal driving line 401, the data signal driving line 402, and the sub power source wiring 403 drive the pixels 404 to emit light.
  • a power supply line 50 and a data signal driving chip 40 are provided on the non-display area 220 of the OLED display panel.
  • the power supply line 50 is connected to the power supply terminal 501 of the OLED display panel.
  • Multiple sub power traces 403 extend to the non-display area 220 and are connected to the power trace 50 through multiple first vias 204; multiple data signal drive lines 402 extend to the non-display area 220 and pass through multiple second vias
  • the hole 205 is connected to the data signal driving chip 40.
  • the first through-hole 201 includes a first sub-through-hole 2011 and a second sub-through-hole 2012.
  • the first sub-through-hole 2011 is disposed between the display area 210 and the power supply trace 50; the second sub-through-hole 2012 is disposed on the power supply trace 50 and the data signal driving chip 50.
  • first sub vias 2011 are disposed between adjacent sub power supply traces 403; the second sub vias 2012 are disposed between adjacent data signal driving lines 402.
  • FIG. 3 is a cross-sectional view of the OLED display panel shown in FIG. 1 along the A-A direction.
  • the OLED device layer includes a fourth insulating layer 24, a third insulating layer 23, a second insulating layer 22, a first insulating layer 21, a light-emitting functional layer 25, and Thin film encapsulation layer 30.
  • a through hole 200 is provided on the non-display area 220.
  • the through hole 200 includes a first through hole 201, a second through hole 202, and a third through hole 203.
  • the thin film encapsulation layer 30 extends to the first through hole 201 and the second through hole 200.
  • the holes 202 and the third through holes 203 increase the tightness of the thin film encapsulation layer 30 with the fourth insulation layer 24, the third insulation layer 23, the second insulation layer 22, and the first insulation layer 21, thereby improving the packaging effect.
  • the through hole 200 has different depth values, and the depth value of the through hole 200 located at the outermost periphery of the display area 210 is greater than the depth value of other through holes 200, so that the thin film encapsulation layer 30 can extend to the outermost through hole 200. Medium and will not overflow. That is, the depth value of the first through hole 201 is greater than the depth value of the second through hole 202, and the depth value of the third through hole 203 is greater than the depth value of the first through hole 201.
  • the second through hole 202 penetrates the first The insulating layer 21 and the second insulating layer 22 extend to the third insulating layer 23; the first through hole 201 penetrates the first insulating layer 21, the second insulating layer 22, and the third insulating layer 23; the third through hole 203 penetrates the first The insulating layer 21, the second insulating layer 22 and the third insulating layer 23 extend to the fourth insulating layer 24.
  • the through holes 200 have different area values. That is, a technician can flexibly set the area of the through-hole 200 as needed, so that the routing can be avoided in some places of the non-display area 220.
  • FIG. 4 is a schematic structural diagram of a thin film encapsulation layer in an OLED display panel according to an embodiment of the present invention.
  • the thin film encapsulation layer 30 includes a first organic layer 301, an inorganic layer 302, and a second organic layer 303 that are stacked in order.
  • the embodiment of the present invention extends the first organic layer 301 to In 200, the first organic layer 301 and the OLED device layer 20 are bonded together, thereby improving the packaging effect.
  • the display panel of the present invention includes: a substrate; an OLED device layer, the OLED device layer is disposed on the substrate, and at least one through hole is provided on the OLED device layer; and a thin film encapsulation layer, the thin film encapsulation layer Covering the OLED device layer and extending into the at least one through hole, so that the thin film encapsulation layer is bonded to the OLED device layer, by opening a through hole in the OLED device layer, and making the thin film encapsulation layer The through hole is filled, so that the adhesion of the thin film encapsulation layer can be enhanced, and peeling and peeling of the film layer can be avoided.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本发明的显示面板，包括：基板；OLED器件层，OLED器件层设置在基板上，且OLED器件层上开设有通孔；以及薄膜封装层，薄膜封装层覆盖OLED器件层，并延伸至至少一个通孔中，以使得薄膜封装层与OLED器件层贴合，通过在OLED器件层中开设通孔，并使得该薄膜封装层将该通孔填充，从而可以增强薄膜封装层的依附力，避免出现膜层起皮脱落现象。

Description

OLED显示面板 技术领域
本发明涉及显示领域，具体涉及一种OLED显示面板。
 背景技术
由于OLED显示面板对外界的水汽和氧气非常敏感，为了保证OLED显示面板的特性，我们采用薄膜封装来阻隔水氧的侵蚀。然而，在制作OLED显示面板的过程中，由于制程温度差异容易造成封装薄膜其应力与下层基板的膜层应力不一致，差异过大时，极易造成封装薄膜剥落，封装失效。
因此，现有技术存在缺陷，急需改进。
 技术问题
本发明实施例的目的是提供一种OLED显示面板，可以避免封装薄膜脱落。
 技术解决方案
本发明实施例提供一种OLED显示面板，包括：
基板；
OLED器件层，所述OLED器件层设置在所述基板上，且所述OLED器件层上开设有通孔；以及
薄膜封装层，所述薄膜封装层覆盖所述OLED器件层，并延伸至所述通孔中，以使得所述薄膜封装层与所述OLED器件层贴合；
其中，所述OLED器件层包括显示区域和非显示区域；其中，所述通孔位于所述非显示区域上；
所述薄膜封装层包括依次层叠设置在所述OLED器件层上的第一有机层、无机层和第二有机层。
在本发明所述的OLED显示面板中，所述通孔包括第一通孔、第二通孔和第三通孔；其中，所述第一通孔位于所述显示区域边缘，所述第三通孔位于所述薄膜封装层边缘，所述第二通孔位于所述显示区域边缘与所述薄膜封装层边缘之间。
在本发明所述的OLED显示面板中，所述显示区域包括相对设置的第一端部和第二端部、相对设置的第三端部和第四端部、在所述第一端部和所述第三端部之间的第一拐角部、在所述第一端部和所述第四端部之间的第二拐角部、在所述第二端部和所述第三端部之间的第三拐角部、以及在所述第二端部和所述第四端部之间的第四拐角部；
所述第一通孔沿着所述第一拐角部、所述第二拐角部、所述第三拐角部、所述第四拐角部以及所述第二端部设置；
所述第二通孔和所述第三通孔均沿着所述第一端部、所述第三端部、所述第四端部、所述第一拐角部、所述第二拐角部、所述第三拐角部和所述第四拐角部设置。
在本发明所述的OLED显示面板中，所述非显示区域上设置有电源走线和数据信号驱动芯片，所述第一通孔包括第一子通孔和第二子通孔；其中，所述第一子通孔设置在所述显示区域与所述电源走线之间，所述第二子通孔设置在所述电源走线与所述数据信号驱动芯片之间。
在本发明所述的OLED显示面板中，所述通孔具有不同的深度值。
在本发明所述的OLED显示面板中，所述通孔具有不同的面积值。
在本发明所述的OLED显示面板中，所述显示区域包括多条子电源走线，所述多条子电源走线延伸至所述非显示区域，并通过多个第一过孔与所述电源走线电连接，所述第一子通孔设置在相邻子电源走线之间。
在本发明所述的OLED显示面板中，所述显示区域包括多条数据信号驱动线，所述多条数据信号驱动线延伸至所述非显示区域，并通过多个第二过孔与所述数据信号驱动芯片连接，所述第二子通孔设置在相邻数据信号驱动线之间。
在本发明所述的OLED显示面板中，所述OLED器件层包括依次层叠设置在所述基板的第四绝缘层、第三绝缘、第二绝缘层、第一绝缘层和发光功能层；其中，
所述通孔贯穿所述第一绝缘层以及所述第二绝缘层并延伸至所述第三绝缘层；或
所述通孔贯穿所述第一绝缘层、第二绝缘层以及第三绝缘层；或
所述通孔贯穿所述第一绝缘层、第二绝缘层以及第三绝缘层并延伸至所述第四绝缘层。
本发明还实施例提供一种OLED显示面板，包括：
基板；
OLED器件层，所述OLED器件层设置在所述基板上，且所述OLED器件层上开设有通孔；以及
薄膜封装层，所述薄膜封装层覆盖所述OLED器件层，并延伸至所述通孔中，以使得所述薄膜封装层与所述OLED器件层贴合。
在本发明所述的OLED显示面板中，所述OLED器件层包括显示区域和非显示区域；其中，所述通孔位于所述非显示区域上。
在本发明所述的OLED显示面板中，所述通孔包括第一通孔、第二通孔和第三通孔；其中，所述第一通孔位于所述显示区域边缘，所述第三通孔位于所述薄膜封装层边缘，所述第二通孔位于所述显示区域边缘与所述薄膜封装层边缘之间。
在本发明所述的OLED显示面板中，所述显示区域包括相对设置的第一端部和第二端部、相对设置的第三端部和第四端部、在所述第一端部和所述第三端部之间的第一拐角部、在所述第一端部和所述第四端部之间的第二拐角部、在所述第二端部和所述第三端部之间的第三拐角部、以及在所述第二端部和所述第四端部之间的第四拐角部；
所述第一通孔沿着所述第一拐角部、所述第二拐角部、所述第三拐角部、所述第四拐角部以及所述第二端部设置；
所述第二通孔和所述第三通孔均沿着所述第一端部、所述第三端部、所述第四端部、所述第一拐角部、所述第二拐角部、所述第三拐角部和所述第四拐角部设置。
在本发明所述的OLED显示面板中，所述非显示区域上设置有电源走线和数据信号驱动芯片，所述第一通孔包括第一子通孔和第二子通孔；其中，所述第一子通孔设置在所述显示区域与所述电源走线之间，所述第二子通孔设置在所述电源走线与所述数据信号驱动芯片之间。
在本发明所述的OLED显示面板中，所述通孔具有不同的深度值。
在本发明所述的OLED显示面板中，所述通孔具有不同的面积值。
在本发明所述的OLED显示面板中，所述显示区域包括多条子电源走线，所述多条子电源走线延伸至所述非显示区域，并通过多个第一过孔与所述电源走线电连接，所述第一子通孔设置在相邻子电源走线之间。
在本发明所述的OLED显示面板中，所述显示区域包括多条数据信号驱动线，所述多条数据信号驱动线延伸至所述非显示区域，并通过多个第二过孔与所述数据信号驱动芯片连接，所述第二子通孔设置在相邻子数据信号驱动线之间。
在本发明所述的OLED显示面板中，所述薄膜封装层包括依次层叠设置在所述OLED器件层上的第一有机层、无机层和第二有机层。
在本发明所述的OLED显示面板中，所述OLED器件层包括依次层叠设置在所述基板的第四绝缘层、第三绝缘、第二绝缘层、第一绝缘层和发光功能层；其中，
所述通孔贯穿所述第一绝缘层以及所述第二绝缘层并延伸至所述第三绝缘层；或
所述通孔贯穿所述第一绝缘层、第二绝缘层以及第三绝缘层；或
所述通孔贯穿所述第一绝缘层、第二绝缘层以及第三绝缘层并延伸至所述第四绝缘层。
 有益效果
本发明的显示面板，包括：基板；OLED器件层，所述OLED器件层设置在所述基板上，且所述OLED器件层上开设有至少一个通孔；以及薄膜封装层，所述薄膜封装层覆盖所述OLED器件层，并延伸至所述至少一个通孔中，以使得所述薄膜封装层与所述OLED器件层贴合，通过在OLED器件层中开设通孔，并使得该薄膜封装层将该通孔填充，从而可以增强薄膜封装层的依附力，避免出现膜层起皮脱落现象。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例的OLED显示面板的平面示意图。
图2为本发明实施例的OLED显示面板的局部示意图。
图3为图1所示OLED显示面板沿A-A方向的剖面图。
图4为本发明实施例的OLED显示面板中的薄膜封装层的结构示意图。
 本发明的最佳实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1，图1为本发明实施例的OLED显示面板的平面示意图。如图1所示，本发明实施例的OLED显示面板，包括：基板10、OLED器件层20以及薄膜封装层30。该OLED器件层20设置在基板10上，且该OLED器件层20上开设有通孔200。该薄膜封装层30覆盖OLED器件层20，并延伸至通孔200中，以使得薄膜封装层30与OLED器件层20贴合。
其中，该OLED器件层20包括显示区域210和非显示区域220，非显示区域220围绕显示区域210，该通孔200设置在非显示区域220上，在不影响OLED显示面板正常显示的同时，可以增加薄膜封装层30与OLED器件层20结合的紧密型，进而提升封装效果。
在一些实施例中，该通孔200包括第一通孔201、第二通孔202和第三通孔203，第一通孔201位于显示区域210边缘，第三通孔203位于薄膜封装层30边缘，第二通孔202位于显示区域210边缘和薄膜封装层30边缘之间。特别的，第一通孔201位于显示区域210的外边缘，且第一通孔201与显示区域210的外边缘具有间距，该间距使得在形成第一通孔201时，不会对显示区域210造成影响。
进一步的，该显示区域210210包括相连接的第一端部2111、第二端部2112、第三端部2113、第四端部2114、第一拐角部2115、第二拐角部2116、第三拐角部2117和第四拐角部2118，第一端部2111和第二端部2112相对设置，第三端部2113和第四端部2114相对设置，第一拐角部2115设置在第一端部2111和第三端部2113之间，第二拐角部2116设置在第一端部2111和第四端部2114之间，第三拐角部2117设置在第二端部2112和第三端部2113之间，第四拐角部2118设置在第二端部2112和第四端部2114之间。
第一通孔201沿着第一拐角部2115、第二拐角部2116、第三拐角部2117、第四拐角部2118以及第二端部2112设置。也即，在第一拐角部2115、第二拐角部2116、第三拐角部2117、第四拐角部2118以及第二端部2112上设置有多个第一通孔201，其中，多个第一通孔201间隔排列。
第二通孔202和第三通孔203均沿着第一端部2111、第三端部2113、第四端部2114、第一拐角部2115、第二拐角部2116、第三拐角部2117和第四拐角部2118设置。也即，在第一端部2111、第三端部2113、第四端部2114、第一拐角部2115、第二拐角部2116、第三拐角部2117和第四拐角部2118上设置有多个第二通孔202和第三通孔203，其中，多个第一通孔201间隔排列，多个第三通孔203间隔排列，且第二通孔202相较于第三通孔203更靠近显示区域210。
需要说明的是，以上对通孔的描述仅仅只是尽可能在非显示区域220上设置通孔，本领域技术人员可以根据需要在非显示区域220上设置通孔200。例如，为了提升效率，可以仅仅沿着第一端部2111、第二端部2112、第三端部2113、第四端部2114、第一拐角部2115、第二拐角部2116、第三拐角部2117或第四拐角部2118设置通孔200。
在一些实施例中，请参阅图2，图2为本发明实施例的OLED显示面板的局部示意图。结合图1、图2所示，在该OLED显示面板的显示区域210上设置有多条扫描信号驱动线401、多条数据信号驱动线402、多条扫描信号驱动线401和多条数据信号驱动线402交叉限定的多个像素404、以及多条子电源走线403，多条扫描信号驱动线401沿第一方向排列，多条数据信号驱动线402沿第二方向排列，多条子电源走线403沿第二方向排列，第一方向和第二方向相互垂直。其中，扫描信号驱动线401、数据信号驱动线402和子电源走线403驱动像素404发光显示。
在该OLED显示面板的非显示区域220上设置有电源走线50和数据信号驱动芯片40，电源走线50与OLED显示面板的供电端501连接。多条子电源走线403延伸至非显示区域220，并通过多个第一过孔204与电源走线50连接；多条数据信号驱动线402延伸至非显示区域220，并通过多个第二过孔205与数据信号驱动芯片40连接。
第一通孔201包括第一子通孔2011和第二子通孔2012，第一子通孔2011设置在显示区域210与电源走线50之间；第二子通孔2012设置在电源走线50与数据信号驱动芯片50之间。
进一步的，第一子通孔2011设置在相邻子电源走线403之间；第二子通孔2012设置在相邻数据信号驱动线402之间。
请参阅图3，图3为图1所示OLED显示面板沿A-A方向的剖面图。结合图1、图3所示，该OLED器件层包括依次层叠设置在基板10的第四绝缘层24、第三绝缘层23、第二绝缘层22、第一绝缘层21、发光功能层25和薄膜封装层30。在非显示区域220上设置有通孔200，该通孔200包括第一通孔201、第二通孔202和第三通孔203，薄膜封装层30延伸至第一通孔201、第二通孔202和第三通孔203中，以增加薄膜封装层30与第四绝缘层24、第三绝缘层23、第二绝缘层22和第一绝缘层21的紧密型，进而提升封装效果。
其中，该通孔200具有不同的深度值，且位于显示区域210最外围的通孔200的深度值大于其他通孔200的深度值，从而可以使得薄膜封装层30延伸至最外围的通孔200中并且不会溢出。也即，第一通孔201的深度值大于第二通孔202的深度值，第三通孔203的深度值大于第一通孔201的深度值，具体的，第二通孔202贯穿第一绝缘层21以及第二绝缘层22并延伸至第三绝缘层23；第一通孔201贯穿第一绝缘层21、第二绝缘层22以及第三绝缘层23；第三通孔203贯穿第一绝缘层21、第二绝缘层22以及第三绝缘层23并延伸至第四绝缘层24。
其中，该通孔200具有不同的面积值。也即，技术人员可以根据需要灵活设置通孔200的面积，从而可以在非显示区域220的一些地方避开走线。
请参阅图4，图4为本发明实施例的OLED显示面板中的薄膜封装层的结构示意图。结合一1，图4所示，该薄膜封装层30包括依次层叠设置的第一有机层301、无机层302、第二有机层303，本发明实施例通过将第一有机层301延伸至通,200中，从而使得第一有机层301与OLED器件层20贴合，进而提升封装效果。
本发明的显示面板，包括：基板；OLED器件层，所述OLED器件层设置在所述基板上，且所述OLED器件层上开设有至少一个通孔；以及薄膜封装层，所述薄膜封装层覆盖所述OLED器件层，并延伸至所述至少一个通孔中，以使得所述薄膜封装层与所述OLED器件层贴合，通过在OLED器件层中开设通孔，并使得该薄膜封装层将该通孔填充，从而可以增强薄膜封装层的依附力，避免出现膜层起皮脱落现象。
以上对本发明实施例提供的OLED显示面板进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明。同时，对于本领域的技术人员，依据本发明的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本发明的限制。

Claims (20)

  1. 一种OLED显示面板，其包括：
    基板；
    OLED器件层，所述OLED器件层设置在所述基板上，且所述OLED器件层上开设有通孔；以及
    薄膜封装层，所述薄膜封装层覆盖所述OLED器件层，并延伸至所述通孔中，以使得所述薄膜封装层与所述OLED器件层贴合；
    其中，所述OLED器件层包括显示区域和非显示区域；其中，所述通孔位于所述非显示区域上；
    所述薄膜封装层包括依次层叠设置在所述OLED器件层上的第一有机层、无机层和第二有机层。
  2. 根据权利要求1所述的OLED显示面板，其中，所述通孔包括第一通孔、第二通孔和第三通孔；其中，所述第一通孔位于所述显示区域边缘，所述第三通孔位于所述薄膜封装层边缘，所述第二通孔位于所述显示区域边缘与所述薄膜封装层边缘之间。
  3. 根据权利要求2所述的OLED显示面板，其中，所述显示区域包括相对设置的第一端部和第二端部、相对设置的第三端部和第四端部、在所述第一端部和所述第三端部之间的第一拐角部、在所述第一端部和所述第四端部之间的第二拐角部、在所述第二端部和所述第三端部之间的第三拐角部、以及在所述第二端部和所述第四端部之间的第四拐角部；
    所述第一通孔沿着所述第一拐角部、所述第二拐角部、所述第三拐角部、所述第四拐角部以及所述第二端部设置；
    所述第二通孔和所述第三通孔均沿着所述第一端部、所述第三端部、所述第四端部、所述第一拐角部、所述第二拐角部、所述第三拐角部和所述第四拐角部设置。
  4. 根据权利要求3所述的OLED显示面板，其中，所述非显示区域上设置有电源走线和数据信号驱动芯片，所述第一通孔包括第一子通孔和第二子通孔；其中，所述第一子通孔设置在所述显示区域与所述电源走线之间，所述第二子通孔设置在所述电源走线与所述数据信号驱动芯片之间。
  5. 根据权利要求4所述的OLED显示面板，其中，所述通孔具有不同的深度值。
  6. 根据权利要求4所述的OLED显示面板，其中，所述通孔具有不同的面积值。
  7. 根据权利要求4所述的OLED显示面板，其中，所述显示区域包括多条子电源走线，所述多条子电源走线延伸至所述非显示区域，并通过多个第一过孔与所述电源走线电连接，所述第一子通孔设置在相邻子电源走线之间。
  8. 根据权利要求4所述的OLED显示面板，其中，所述显示区域包括多条数据信号驱动线，所述多条数据信号驱动线延伸至所述非显示区域，并通过多个第二过孔与所述数据信号驱动芯片连接，所述第二子通孔设置在相邻数据信号驱动线之间。
  9. 根据权利要求1所述的OLED显示面板，其中，所述OLED器件层包括依次层叠设置在所述基板的第四绝缘层、第三绝缘、第二绝缘层、第一绝缘层和发光功能层；其中，
    所述通孔贯穿所述第一绝缘层以及所述第二绝缘层并延伸至所述第三绝缘层；或
    所述通孔贯穿所述第一绝缘层、第二绝缘层以及第三绝缘层；或
    所述通孔贯穿所述第一绝缘层、第二绝缘层以及第三绝缘层并延伸至所述第四绝缘层。
  10. 一种OLED显示面板，其包括：
    基板；
    OLED器件层，所述OLED器件层设置在所述基板上，且所述OLED器件层上开设有通孔；以及
    薄膜封装层，所述薄膜封装层覆盖所述OLED器件层，并延伸至所述通孔中，以使得所述薄膜封装层与所述OLED器件层贴合。
  11. 根据权利要求10所述的OLED显示面板，其中，所述OLED器件层包括显示区域和非显示区域；其中，所述通孔位于所述非显示区域上。
  12. 根据权利要求11所述的OLED显示面板，其中，所述通孔包括第一通孔、第二通孔和第三通孔；其中，所述第一通孔位于所述显示区域边缘，所述第三通孔位于所述薄膜封装层边缘，所述第二通孔位于所述显示区域边缘与所述薄膜封装层边缘之间。
  13. 根据权利要求12所述的OLED显示面板，其中，所述显示区域包括相对设置的第一端部和第二端部、相对设置的第三端部和第四端部、在所述第一端部和所述第三端部之间的第一拐角部、在所述第一端部和所述第四端部之间的第二拐角部、在所述第二端部和所述第三端部之间的第三拐角部、以及在所述第二端部和所述第四端部之间的第四拐角部；
    所述第一通孔沿着所述第一拐角部、所述第二拐角部、所述第三拐角部、所述第四拐角部以及所述第二端部设置；
    所述第二通孔和所述第三通孔均沿着所述第一端部、所述第三端部、所述第四端部、所述第一拐角部、所述第二拐角部、所述第三拐角部和所述第四拐角部设置。
  14. 根据权利要求13所述的OLED显示面板，其中，所述非显示区域上设置有电源走线和数据信号驱动芯片，所述第一通孔包括第一子通孔和第二子通孔；其中，所述第一子通孔设置在所述显示区域与所述电源走线之间，所述第二子通孔设置在所述电源走线与所述数据信号驱动芯片之间。
  15. 根据权利要求14所述的OLED显示面板，其中，所述通孔具有不同的深度值。
  16. 根据权利要求14所述的OLED显示面板，其中，所述通孔具有不同的面积值。
  17. 根据权利要求14所述的OLED显示面板，其中，所述显示区域包括多条子电源走线，所述多条子电源走线延伸至所述非显示区域，并通过多个第一过孔与所述电源走线电连接，所述第一子通孔设置在相邻子电源走线之间。
  18. 根据权利要求14所述的OLED显示面板，其中，所述显示区域包括多条数据信号驱动线，所述多条数据信号驱动线延伸至所述非显示区域，并通过多个第二过孔与所述数据信号驱动芯片连接，所述第二子通孔设置在相邻数据信号驱动线之间。
  19. 根据权利要求10所述的OLED显示面板，其中，所述薄膜封装层包括依次层叠设置在所述OLED器件层上的第一有机层、无机层和第二有机层。
  20. 根据权利要求10所述的OLED显示面板，其中，所述OLED器件层包括依次层叠设置在所述基板的第四绝缘层、第三绝缘、第二绝缘层、第一绝缘层和发光功能层；其中，
    所述通孔贯穿所述第一绝缘层以及所述第二绝缘层并延伸至所述第三绝缘层；或
    所述通孔贯穿所述第一绝缘层、第二绝缘层以及第三绝缘层；或
    所述通孔贯穿所述第一绝缘层、第二绝缘层以及第三绝缘层并延伸至所述第四绝缘层。
PCT/CN2018/098326 2018-06-28 2018-08-02 Oled显示面板 WO2020000577A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/095,708 US11264586B2 (en) 2018-06-28 2018-08-02 OLED display panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810685206.0A CN108963103B (zh) 2018-06-28 2018-06-28 Oled显示面板
CN201810685206.0 2018-06-28

Publications (1)

Publication Number Publication Date
WO2020000577A1 true WO2020000577A1 (zh) 2020-01-02

Family

ID=64487293

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/098326 WO2020000577A1 (zh) 2018-06-28 2018-08-02 Oled显示面板

Country Status (3)

Country Link
US (1) US11264586B2 (zh)
CN (1) CN108963103B (zh)
WO (1) WO2020000577A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110246885B (zh) * 2019-06-28 2021-10-01 上海天马有机发光显示技术有限公司 一种显示面板
CN110911420B (zh) * 2019-11-18 2022-06-10 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
CN113629068B (zh) * 2021-07-16 2023-09-26 武汉华星光电半导体显示技术有限公司 一种显示面板及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204720454U (zh) * 2015-06-30 2015-10-21 昆山工研院新型平板显示技术中心有限公司 有机发光显示装置和电子设备
US20160141557A1 (en) * 2014-11-18 2016-05-19 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting diode (oled) display
CN106783881A (zh) * 2016-12-26 2017-05-31 武汉华星光电技术有限公司 一种柔性显示面板及其制造方法
CN106935728A (zh) * 2017-03-22 2017-07-07 京东方科技集团股份有限公司 Oled封装结构、显示面板以及制备封装结构的方法
CN107425033A (zh) * 2017-04-27 2017-12-01 上海天马微电子有限公司 一种显示面板和显示设备
US20180040679A1 (en) * 2016-08-03 2018-02-08 Motorola Mobility Llc Display Device with Heterogeneous Pixel Array for Borderless Design

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7538488B2 (en) * 2004-02-14 2009-05-26 Samsung Mobile Display Co., Ltd. Flat panel display
KR100623338B1 (ko) * 2004-10-21 2006-09-19 엘지전자 주식회사 유기 전계 발광 소자 및 이를 제조하는 방법
DE602005022665D1 (de) 2004-10-21 2010-09-16 Lg Display Co Ltd Organische elektrolumineszente Vorrichtung und Herstellungsverfahren
KR100751453B1 (ko) * 2006-06-14 2007-08-23 삼성전자주식회사 표시장치와 이의 제조방법
KR102117612B1 (ko) * 2013-08-28 2020-06-02 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
CN203883009U (zh) * 2014-05-29 2014-10-15 京东方科技集团股份有限公司 Oled显示面板
CN106816546B (zh) * 2015-11-30 2019-08-23 上海和辉光电有限公司 一种oled阵列基板及oled显示器件
US10743425B2 (en) * 2016-10-31 2020-08-11 Lg Display Co., Ltd. Display device and method for manufacturing the same
CN106876328B (zh) 2017-02-20 2020-07-03 京东方科技集团股份有限公司 Oled显示面板及其制备方法、显示装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160141557A1 (en) * 2014-11-18 2016-05-19 Samsung Display Co., Ltd. Method of manufacturing organic light-emitting diode (oled) display
CN204720454U (zh) * 2015-06-30 2015-10-21 昆山工研院新型平板显示技术中心有限公司 有机发光显示装置和电子设备
US20180040679A1 (en) * 2016-08-03 2018-02-08 Motorola Mobility Llc Display Device with Heterogeneous Pixel Array for Borderless Design
CN106783881A (zh) * 2016-12-26 2017-05-31 武汉华星光电技术有限公司 一种柔性显示面板及其制造方法
CN106935728A (zh) * 2017-03-22 2017-07-07 京东方科技集团股份有限公司 Oled封装结构、显示面板以及制备封装结构的方法
CN107425033A (zh) * 2017-04-27 2017-12-01 上海天马微电子有限公司 一种显示面板和显示设备

Also Published As

Publication number Publication date
US11264586B2 (en) 2022-03-01
CN108963103A (zh) 2018-12-07
CN108963103B (zh) 2020-07-10
US20210226156A1 (en) 2021-07-22

Similar Documents

Publication Publication Date Title
WO2020000577A1 (zh) Oled显示面板
WO2021218395A1 (zh) 显示面板及显示装置
CN109887928B (zh) 一种柔性显示面板
WO2020151123A1 (zh) 有机发光二极管柔性阵列基板
WO2019214157A1 (zh) Oled显示面板以及显示装置
WO2020037770A1 (zh) 基板及显示装置
WO2019100874A1 (zh) 显示基板及其制造方法以及对应显示面板及其封装方法
WO2018152920A1 (zh) 有机发光触控显示屏
WO2021223304A1 (zh) 显示面板及显示装置
TW202032226A (zh) 軟性電路結構
CN112582433B (zh) 一种显示面板及显示装置
WO2020063049A1 (zh) 显示面板、其制备方法、其驱动方法、显示装置
WO2022047973A1 (zh) Oled 显示面板及其制作方法
CN112542499A (zh) 显示面板及其制造方法
WO2019085630A1 (zh) 有机电致发光器件、显示器及移动通信设备
WO2022246893A1 (zh) Oled显示面板
EP3226321B1 (en) Organic electroluminescence device and manufacturing method thereof, and display device
WO2021147851A1 (zh) 一种显示面板和显示装置
US7576425B2 (en) Conducting layer in chip package module
WO2019200638A1 (zh) 一种触控电极结构及触控面板
TW202018992A (zh) 畫素結構
WO2020143582A1 (zh) 显示面板、阵列基板及其制备方法
CN110911420B (zh) 显示面板及显示装置
KR20160009269A (ko) 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법
WO2022067520A9 (zh) 显示基板及其制作方法、显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18924458

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18924458

Country of ref document: EP

Kind code of ref document: A1