WO2019244589A1 - 近赤外線吸収性組成物、近赤外線吸収性膜及び固体撮像素子用イメージセンサー - Google Patents
近赤外線吸収性組成物、近赤外線吸収性膜及び固体撮像素子用イメージセンサー Download PDFInfo
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- WO2019244589A1 WO2019244589A1 PCT/JP2019/021317 JP2019021317W WO2019244589A1 WO 2019244589 A1 WO2019244589 A1 WO 2019244589A1 JP 2019021317 W JP2019021317 W JP 2019021317W WO 2019244589 A1 WO2019244589 A1 WO 2019244589A1
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- 239000000203 mixture Substances 0.000 title claims abstract description 140
- 238000003384 imaging method Methods 0.000 title claims abstract description 32
- 150000001875 compounds Chemical class 0.000 claims abstract description 59
- 238000002834 transmittance Methods 0.000 claims abstract description 58
- 238000010521 absorption reaction Methods 0.000 claims abstract description 42
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 33
- 239000002904 solvent Substances 0.000 claims abstract description 29
- 150000004699 copper complex Chemical class 0.000 claims abstract description 22
- 125000000217 alkyl group Chemical group 0.000 claims description 34
- 125000004432 carbon atom Chemical group C* 0.000 claims description 30
- 239000006096 absorbing agent Substances 0.000 claims description 20
- 239000007787 solid Substances 0.000 claims description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- 239000005749 Copper compound Substances 0.000 claims description 12
- 125000003118 aryl group Chemical group 0.000 claims description 11
- 150000001880 copper compounds Chemical class 0.000 claims description 10
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 8
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 6
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 125000003342 alkenyl group Chemical group 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229940126062 Compound A Drugs 0.000 claims description 2
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 230000002745 absorbent Effects 0.000 abstract 2
- 239000002250 absorbent Substances 0.000 abstract 2
- -1 phosphate ester compound Chemical class 0.000 description 66
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 53
- 238000002360 preparation method Methods 0.000 description 37
- 229910019142 PO4 Inorganic materials 0.000 description 34
- 239000010452 phosphate Substances 0.000 description 34
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 27
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 26
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 25
- 239000000975 dye Substances 0.000 description 24
- 239000000758 substrate Substances 0.000 description 20
- 239000002245 particle Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 17
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 16
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 14
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 14
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 230000003595 spectral effect Effects 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 8
- 150000003014 phosphoric acid esters Chemical class 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 150000001879 copper Chemical class 0.000 description 7
- 238000003756 stirring Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- HVBMYHDTXIDFKE-UHFFFAOYSA-N diethyl hydrogen phosphate;ethyl dihydrogen phosphate Chemical compound CCOP(O)(O)=O.CCOP(O)(=O)OCC HVBMYHDTXIDFKE-UHFFFAOYSA-N 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 125000001624 naphthyl group Chemical group 0.000 description 4
- 125000005561 phenanthryl group Chemical group 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000004437 phosphorous atom Chemical group 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229960001860 salicylate Drugs 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- UBOXGVDOUJQMTN-UHFFFAOYSA-N 1,1,2-trichloroethane Chemical compound ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 2
- LAIUFBWHERIJIH-UHFFFAOYSA-N 3-Methylheptane Chemical compound CCCCC(C)CC LAIUFBWHERIJIH-UHFFFAOYSA-N 0.000 description 2
- ZRIMDWRLVGDUBW-UHFFFAOYSA-N 5-hydroxy-2-methylpent-2-enoic acid phosphoric acid Chemical compound P(=O)(O)(O)O.OCCC=C(C(=O)O)C ZRIMDWRLVGDUBW-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 229920001651 Cyanoacrylate Polymers 0.000 description 2
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 125000004062 acenaphthenyl group Chemical group C1(CC2=CC=CC3=CC=CC1=C23)* 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 125000005428 anthryl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C3C(*)=C([H])C([H])=C([H])C3=C([H])C2=C1[H] 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 125000003828 azulenyl group Chemical group 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 239000013065 commercial product Substances 0.000 description 2
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- ZJXZSIYSNXKHEA-UHFFFAOYSA-N ethyl dihydrogen phosphate Chemical compound CCOP(O)(O)=O ZJXZSIYSNXKHEA-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 150000004677 hydrates Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- LKKPNUDVOYAOBB-UHFFFAOYSA-N naphthalocyanine Chemical compound N1C(N=C2C3=CC4=CC=CC=C4C=C3C(N=C3C4=CC5=CC=CC=C5C=C4C(=N4)N3)=N2)=C(C=C2C(C=CC=C2)=C2)C2=C1N=C1C2=CC3=CC=CC=C3C=C2C4=N1 LKKPNUDVOYAOBB-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 125000003854 p-chlorophenyl group Chemical group [H]C1=C([H])C(*)=C([H])C([H])=C1Cl 0.000 description 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 239000001007 phthalocyanine dye Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- 125000001725 pyrenyl group Chemical group 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- BITJPPJAVHCIOK-UHFFFAOYSA-N (2-hydroxy-4-methoxy-5-methylphenyl)-phenylmethanone Chemical compound C1=C(C)C(OC)=CC(O)=C1C(=O)C1=CC=CC=C1 BITJPPJAVHCIOK-UHFFFAOYSA-N 0.000 description 1
- SXJSETSRWNDWPP-UHFFFAOYSA-N (2-hydroxy-4-phenylmethoxyphenyl)-phenylmethanone Chemical compound C=1C=C(C(=O)C=2C=CC=CC=2)C(O)=CC=1OCC1=CC=CC=C1 SXJSETSRWNDWPP-UHFFFAOYSA-N 0.000 description 1
- YFVAFSNSJVCBTE-UHFFFAOYSA-N (2-methylcyclohexyl)benzene Chemical compound CC1CCCCC1C1=CC=CC=C1 YFVAFSNSJVCBTE-UHFFFAOYSA-N 0.000 description 1
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- HKTCLPBBJDIBGF-UHFFFAOYSA-N 1-phenyl-2-propan-2-ylbenzene Chemical group CC(C)C1=CC=CC=C1C1=CC=CC=C1 HKTCLPBBJDIBGF-UHFFFAOYSA-N 0.000 description 1
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Natural products C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 1
- MEZZCSHVIGVWFI-UHFFFAOYSA-N 2,2'-Dihydroxy-4-methoxybenzophenone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1O MEZZCSHVIGVWFI-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KOWWPSSAXLGXIZ-UHFFFAOYSA-N 2,3-dimethyl-1,4-dioxane Chemical compound CC1OCCOC1C KOWWPSSAXLGXIZ-UHFFFAOYSA-N 0.000 description 1
- PWBIWYXOMBGIRF-UHFFFAOYSA-N 2,4-di(butan-2-yl)-6-(5-chlorobenzotriazol-2-yl)phenol Chemical compound CCC(C)C1=CC(C(C)CC)=C(O)C(N2N=C3C=C(Cl)C=CC3=N2)=C1 PWBIWYXOMBGIRF-UHFFFAOYSA-N 0.000 description 1
- WDEHDDXSEJQIJY-UHFFFAOYSA-N 2-(4,6-diphenyl-1h-triazin-2-yl)-5-hexoxyphenol Chemical compound OC1=CC(OCCCCCC)=CC=C1N1N=C(C=2C=CC=CC=2)C=C(C=2C=CC=CC=2)N1 WDEHDDXSEJQIJY-UHFFFAOYSA-N 0.000 description 1
- OLFNXLXEGXRUOI-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-phenylpropan-2-yl)phenol Chemical compound C=1C(N2N=C3C=CC=CC3=N2)=C(O)C(C(C)(C)C=2C=CC=CC=2)=CC=1C(C)(C)C1=CC=CC=C1 OLFNXLXEGXRUOI-UHFFFAOYSA-N 0.000 description 1
- UZUNCLSDTUBVCN-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-6-(2-phenylpropan-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound C=1C(C(C)(C)CC(C)(C)C)=CC(N2N=C3C=CC=CC3=N2)=C(O)C=1C(C)(C)C1=CC=CC=C1 UZUNCLSDTUBVCN-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- IXAZNYYEGLSHOS-UHFFFAOYSA-N 2-aminoethanol;phosphoric acid Chemical compound NCCO.OP(O)(O)=O IXAZNYYEGLSHOS-UHFFFAOYSA-N 0.000 description 1
- HHBZZTKMMLDNDN-UHFFFAOYSA-N 2-butan-2-yloxybutane Chemical compound CCC(C)OC(C)CC HHBZZTKMMLDNDN-UHFFFAOYSA-N 0.000 description 1
- LFPRPWSOCDKNRE-UHFFFAOYSA-N 2-cyano-3-(2-ethyl-3-hexylphenyl)-3-phenylprop-2-enoic acid Chemical compound CCCCCCC1=CC=CC(C(=C(C#N)C(O)=O)C=2C=CC=CC=2)=C1CC LFPRPWSOCDKNRE-UHFFFAOYSA-N 0.000 description 1
- LJKDOMVGKKPJBH-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphate Chemical compound CCCCC(CC)COP(O)(O)=O LJKDOMVGKKPJBH-UHFFFAOYSA-N 0.000 description 1
- JWUJQDFVADABEY-UHFFFAOYSA-N 2-methyltetrahydrofuran Chemical compound CC1CCCO1 JWUJQDFVADABEY-UHFFFAOYSA-N 0.000 description 1
- SEILKFZTLVMHRR-UHFFFAOYSA-N 2-phosphonooxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOP(O)(O)=O SEILKFZTLVMHRR-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- UQRONKZLYKUEMO-UHFFFAOYSA-N 4-methyl-1-(2,4,6-trimethylphenyl)pent-4-en-2-one Chemical group CC(=C)CC(=O)Cc1c(C)cc(C)cc1C UQRONKZLYKUEMO-UHFFFAOYSA-N 0.000 description 1
- UWSMKYBKUPAEJQ-UHFFFAOYSA-N 5-Chloro-2-(3,5-di-tert-butyl-2-hydroxyphenyl)-2H-benzotriazole Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O UWSMKYBKUPAEJQ-UHFFFAOYSA-N 0.000 description 1
- JXSRRBVHLUJJFC-UHFFFAOYSA-N 7-amino-2-methylsulfanyl-[1,2,4]triazolo[1,5-a]pyrimidine-6-carbonitrile Chemical compound N1=CC(C#N)=C(N)N2N=C(SC)N=C21 JXSRRBVHLUJJFC-UHFFFAOYSA-N 0.000 description 1
- KJYKWRJWBYVULV-UHFFFAOYSA-M C(CC(=O)C)(=O)[O-].C(C)[Cu+] Chemical compound C(CC(=O)C)(=O)[O-].C(C)[Cu+] KJYKWRJWBYVULV-UHFFFAOYSA-M 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000001000 anthraquinone dye Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- YTFJQDNGSQJFNA-UHFFFAOYSA-L benzyl phosphate Chemical compound [O-]P([O-])(=O)OCC1=CC=CC=C1 YTFJQDNGSQJFNA-UHFFFAOYSA-L 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- BNMJSBUIDQYHIN-UHFFFAOYSA-N butyl dihydrogen phosphate Chemical compound CCCCOP(O)(O)=O BNMJSBUIDQYHIN-UHFFFAOYSA-N 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- VZWHXRLOECMQDD-UHFFFAOYSA-L copper;2-methylprop-2-enoate Chemical compound [Cu+2].CC(=C)C([O-])=O.CC(=C)C([O-])=O VZWHXRLOECMQDD-UHFFFAOYSA-L 0.000 description 1
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 1
- HCRZXNOSPPHATK-UHFFFAOYSA-L copper;3-oxobutanoate Chemical compound [Cu+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O HCRZXNOSPPHATK-UHFFFAOYSA-L 0.000 description 1
- HFDWIMBEIXDNQS-UHFFFAOYSA-L copper;diformate Chemical compound [Cu+2].[O-]C=O.[O-]C=O HFDWIMBEIXDNQS-UHFFFAOYSA-L 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- AKAUCGJQKLOHHK-UHFFFAOYSA-N cyclohexyl dihydrogen phosphate Chemical compound OP(O)(=O)OC1CCCCC1 AKAUCGJQKLOHHK-UHFFFAOYSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- HHNHBFLGXIUXCM-GFCCVEGCSA-N cyclohexylbenzene Chemical compound [CH]1CCCC[C@@H]1C1=CC=CC=C1 HHNHBFLGXIUXCM-GFCCVEGCSA-N 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- ZAKOMNLPLIYIEO-UHFFFAOYSA-J dicopper dicarbonate Chemical compound [Cu++].[Cu++].[O-]C([O-])=O.[O-]C([O-])=O ZAKOMNLPLIYIEO-UHFFFAOYSA-J 0.000 description 1
- FWBOFUGDKHMVPI-UHFFFAOYSA-K dicopper;2-oxidopropane-1,2,3-tricarboxylate Chemical compound [Cu+2].[Cu+2].[O-]C(=O)CC([O-])(C([O-])=O)CC([O-])=O FWBOFUGDKHMVPI-UHFFFAOYSA-K 0.000 description 1
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 1
- TXEDBPFZRNBYGP-UHFFFAOYSA-N dimethyl hydrogen phosphate;methyl dihydrogen phosphate Chemical compound COP(O)(O)=O.COP(O)(=O)OC TXEDBPFZRNBYGP-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- TVACALAUIQMRDF-UHFFFAOYSA-N dodecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCOP(O)(O)=O TVACALAUIQMRDF-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 230000005274 electronic transitions Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- GGKJPMAIXBETTD-UHFFFAOYSA-N heptyl dihydrogen phosphate Chemical compound CCCCCCCOP(O)(O)=O GGKJPMAIXBETTD-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- PHNWGDTYCJFUGZ-UHFFFAOYSA-N hexyl dihydrogen phosphate Chemical compound CCCCCCOP(O)(O)=O PHNWGDTYCJFUGZ-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- QPPQHRDVPBTVEV-UHFFFAOYSA-N isopropyl dihydrogen phosphate Chemical compound CC(C)OP(O)(O)=O QPPQHRDVPBTVEV-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- UHGIMQLJWRAPLT-UHFFFAOYSA-N octadecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(O)(O)=O UHGIMQLJWRAPLT-UHFFFAOYSA-N 0.000 description 1
- WRKCIHRWQZQBOL-UHFFFAOYSA-N octyl dihydrogen phosphate Chemical compound CCCCCCCCOP(O)(O)=O WRKCIHRWQZQBOL-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- NVTPMUHPCAUGCB-UHFFFAOYSA-N pentyl dihydrogen phosphate Chemical compound CCCCCOP(O)(O)=O NVTPMUHPCAUGCB-UHFFFAOYSA-N 0.000 description 1
- RCMHUQGSSVZPDG-UHFFFAOYSA-N phenoxybenzene;phosphoric acid Chemical class OP(O)(O)=O.C=1C=CC=CC=1OC1=CC=CC=C1 RCMHUQGSSVZPDG-UHFFFAOYSA-N 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- NMPNTBQOLRXPGK-UHFFFAOYSA-N phenyl-(4-phenylmethoxyphenyl)methanone Chemical compound C=1C=C(OCC=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 NMPNTBQOLRXPGK-UHFFFAOYSA-N 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- MHZDONKZSXBOGL-UHFFFAOYSA-N propyl dihydrogen phosphate Chemical compound CCCOP(O)(O)=O MHZDONKZSXBOGL-UHFFFAOYSA-N 0.000 description 1
- ZJMWRROPUADPEA-UHFFFAOYSA-N sec-butylbenzene Chemical compound CCC(C)C1=CC=CC=C1 ZJMWRROPUADPEA-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- CXVGEDCSTKKODG-UHFFFAOYSA-N sulisobenzone Chemical compound C1=C(S(O)(=O)=O)C(OC)=CC(O)=C1C(=O)C1=CC=CC=C1 CXVGEDCSTKKODG-UHFFFAOYSA-N 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- LITQZINTSYBKIU-UHFFFAOYSA-F tetracopper;hexahydroxide;sulfate Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Cu+2].[Cu+2].[Cu+2].[Cu+2].[O-]S([O-])(=O)=O LITQZINTSYBKIU-UHFFFAOYSA-F 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/06—Phosphorus compounds without P—C bonds
- C07F9/08—Esters of oxyacids of phosphorus
- C07F9/09—Esters of phosphoric acids
- C07F9/093—Polyol derivatives esterified at least twice by phosphoric acid groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/06—Phosphorus compounds without P—C bonds
- C07F9/08—Esters of oxyacids of phosphorus
- C07F9/09—Esters of phosphoric acids
- C07F9/091—Esters of phosphoric acids with hydroxyalkyl compounds with further substituents on alkyl
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
- C07F9/02—Phosphorus compounds
- C07F9/06—Phosphorus compounds without P—C bonds
- C07F9/08—Esters of oxyacids of phosphorus
- C07F9/09—Esters of phosphoric acids
- C07F9/095—Compounds containing the structure P(=O)-O-acyl, P(=O)-O-heteroatom, P(=O)-O-CN
- C07F9/097—Compounds containing the structure P(=O)-O-N
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/208—Filters for use with infrared or ultraviolet radiation, e.g. for separating visible light from infrared and/or ultraviolet radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
- G02B5/223—Absorbing filters containing organic substances, e.g. dyes, inks or pigments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
Definitions
- the present invention relates to a near-infrared absorbing composition, a near-infrared absorbing film using the composition, and an image sensor for a solid-state imaging device. More specifically, a near-infrared absorbing composition having a high dispersibility and a high transmittance in the visible light region, and having excellent absorption characteristics in the near-infrared region, a near-infrared absorbing film using the same, The present invention relates to an image sensor for a solid-state imaging device having an absorbing film.
- Video cameras, digital still cameras, mobile phones with a camera function, and the like use CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) image sensors that are color image solid-state image sensors.
- CCD Charge Coupled Device
- CMOS Complementary Metal Oxide Semiconductor
- a glass optical filter containing copper ions in a special phosphate glass has been used as a photometric filter of an imaging camera or an optical filter for correcting the visibility of an imaging system of a video camera or the like.
- this kind of glass optical filter is heavy and has a large hygroscopic property, and in the production of the optical filter, there are problems such as difficulty in processing operations such as a molding step, a cutting step, and a polishing step. .
- an optical filter containing a phosphate ester compound having a specific structure and an ionic metal component containing copper salt as a main component efficiently cuts light in the near infrared region.
- An optical filter made of a synthetic resin that is lightweight, has low hygroscopicity, and is easy to process has been disclosed (for example, see Patent Document 1).
- a phosphate ester compound having a specific structure and a copper ion or a phosphate ester copper compound obtained by a reaction with a copper compound are contained, and the content of copper ions to phosphorus atoms is contained in a specific ratio range.
- An optical filter provided with a near-infrared light absorbing layer as described above and having excellent near-infrared light absorption and excellent moisture resistance is disclosed (for example, see Patent Document 2).
- the extinction coefficient is not high, and furthermore, it is required for an imaging system visibility correction filter. It has been found that the absorption performance in the wavelength region of 900 to 1100 nm is insufficient, and immediate improvement is required.
- the present invention has been made in view of the above-described problems and circumstances, and a solution to the problem is a near-infrared absorbing material having high dispersibility and high transmittance in the visible light region, and excellent absorption characteristics in the near-infrared region.
- An object of the present invention is to provide a composition, a near-infrared absorbing film formed using the composition, and an image sensor for a solid-state imaging device including the near-infrared absorbing film.
- a near-infrared absorbing composition containing a near-infrared absorbing agent and a solvent, wherein the near-infrared absorbing agent has a specific structure And a copper complex obtained by reacting a phosphate compound having the formula (I) with a copper ion or a copper compound, and near-infrared light containing phosphoric acid, which is a compound having a structure represented by the following formula (I), in a specific range:
- a near-infrared absorbing composition having high dispersibility and high transmittance in the visible light region, and having excellent absorption characteristics in the near-infrared region, and a near-infrared absorbing film formed using the same.
- the present inventors have found that it is possible to realize an image sensor for a solid-state imaging device having the near-infrared
- a near infrared absorbing composition comprising a near infrared absorbing agent and a solvent, As the near-infrared absorbing agent, it contains at least one of the following components (A) and (B), and In the following component (A) or the following component (B), a compound having a structure represented by the following formula (I) is used in an amount of 0.001 to 10% by mass based on the total mass of the near-infrared absorbing composition. Containing A near-infrared absorbing composition comprising:
- Component (A) Consists of at least one of a compound having a structure represented by the following general formula (1) or (2), a compound having a structure represented by the following formula (I), and copper ions
- R ' represents an alkyl group, an aryl group, an aralkyl group, or an alkenyl group having 1 to 18 carbon atoms, and the total number of carbon atoms is 1 to 36.
- n ' is 1 or 2, and when n' is 1, R's may be the same or different.
- R 11 to R 19 each represent an alkyl group having 1 to 20 carbon atoms, and an alkyl group having 6 to 20 carbon atoms.
- R 21 to R 30 each represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
- R 31 and R 32 each represent an alkylene group having 1 to 6 carbon atoms.
- R 41 represents an alkylene group having 1 to 10 carbon atoms.
- R 51 and R 52 each represent an alkyl group having 1 to 20 carbon atoms.
- R 53 and R 54 each represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, one of them is always a hydrogen atom, and both are not simultaneously hydrogen atoms.
- m represents an integer of 1 to 12
- k represents an integer of 0 to 5.
- p represents an integer of 1 to 10.
- r represents an integer of 1 to 10. ]
- the near-infrared absorbing composition according to any one of items 1 to 3, further comprising a near-infrared absorption modifier having an absorption maximum wavelength within a wavelength range of 4.650 to 1000 nm. .
- a near-infrared absorbing film using the near-infrared absorbing composition according to any one of items 1 to 4.
- An image sensor for a solid-state imaging device comprising the near-infrared absorbing film according to claim 5.
- a near-infrared absorbing composition having high dispersibility and high transmittance in the visible light region, and having excellent absorption characteristics in the near-infrared region, and a near-infrared absorbing film formed using the same
- an image sensor for a solid-state imaging device having the near-infrared absorbing film.
- the near-infrared absorbing composition of the present invention is a near-infrared absorbing composition containing a near-infrared absorbing agent and a solvent, and as the near-infrared absorbing agent, among the components (A) and (B)
- the compound containing at least one and having the structure represented by the formula (I) in the component (A) or the component (B) may be used in an amount of 0 to the total mass of the near-infrared absorbing composition. It is characterized in that it is contained in the range of 0.001 to 10% by mass.
- a conventional near-infrared absorbing composition comprising a component composed of a copper complex obtained by reacting at least one of the compounds having the structure represented by the copper compound
- the dispersion stability of the constituent materials is certainly high.
- Near-infrared absorbing composition with excellent properties and near-infrared cut stability, but further improvement has been required for the absorption performance in the higher near-infrared region, which has been recently required. .
- a near-infrared absorbing composition a composition comprising a phosphate complex and a copper complex obtained by a reaction with a copper ion or a copper compound,
- phosphoric acid which is a compound having the structure represented by I
- heat absorption can be performed with high accuracy.
- a near-infrared absorbing composition capable of improving the absorption performance in the wavelength range of 900 to 1100 nm was obtained.
- the electronic composition around the coexisting copper ions changes, and the structural symmetry of the copper complex coordinated with the phosphate ester compound changes, causing the absorption waveform and the absorption capacity to change.
- excellent near-infrared absorption capability could be exhibited in the near-infrared region within the wavelength range of 900 to 1100 nm. .
- FIG. 2 is a schematic cross-sectional view illustrating an example of a configuration of a camera module including a solid-state imaging device including a near-infrared absorbing film of the present invention.
- the near-infrared absorbing composition of the present invention is a near-infrared absorbing composition containing an infrared absorbing agent and a solvent, wherein at least one of the component (A) and the following component (B) is used as the near infrared absorbing agent.
- the solid concentration is in the range of 5 to 50% by mass from the viewpoint that the effects aimed at by the present invention can be more exhibited. This is preferable because it can be made into fine particles and can achieve high transmittance in the visible light region.
- the transmittance at a wavelength of 850 nm is 1.0%
- the average transmittance in a wavelength region of 450 to 550 nm is 70% or more
- a higher transmission performance in a visible light region is obtained, and A near-infrared absorbing composition having excellent infrared absorbing ability can be obtained.
- a near infrared absorption modifier having an absorption maximum wavelength in the wavelength range of 650 to 1000 nm, since more excellent near infrared absorption ability can be obtained.
- the near-infrared absorbing composition of the present invention has a high transmittance in the visible light region, and a near-infrared absorbing film having excellent absorption characteristics in the near-infrared region, and a solid having the same.
- An image sensor for the device was realized.
- the near-infrared absorbing composition of the present invention contains a near-infrared absorbing agent and a solvent, and contains at least one of the following components (A) and (B) as the near-infrared absorbing agent, and In the following component (A) or the following component (B), a compound having a structure represented by the following formula (I) is used in an amount of 0.001 to 10% by mass based on the total mass of the near-infrared absorbing composition. It is characterized by containing.
- Component (A) Consists of at least one of a compound having a structure represented by the following general formula (1) or (2), a compound having a structure represented by the following formula (I), and copper ions
- Component (B) Component: Reaction of at least one of a compound having a structure represented by the following general formula (1) or (2) with a compound having a structure represented by the following formula (I) and a copper compound The component which consists of a copper complex obtained by.
- Formula (I) O P- (OH) 3
- a high-molecular-weight phosphate having a structure represented by the general formula (1) which is a typical component of the near-infrared absorbing composition of the present invention
- a compound represented by the general formula (2) The low-molecular-weight phosphate having a structure, the compound having a structure represented by the formula (I), a copper ion or a copper complex, and a solvent will be described.
- the present invention is not limited only to the configuration exemplified here.
- a phosphoric ester having a structure represented by the general formula (1) (hereinafter, also referred to as a phosphoric ester 1), or represented by the general formula (2). It is characterized by containing at least one of phosphoric acid esters having a structure (hereinafter, also referred to as phosphoric acid ester 2).
- R represents at least one group selected from the following general formulas (A) to (H) and (J). n is 1 or 2, and when n is 1, R may be the same or different.
- R 11 to R 19 each represent an alkyl group having 1 to 20 carbon atoms and an aryl group having 6 to 20 carbon atoms. Or an aralkyl group (provided that at least one hydrogen atom bonded to a carbon atom constituting the aromatic ring may be substituted with an alkyl group having 1 to 6 carbon atoms or halogen).
- R 21 to R 30 each represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.
- R 31 and R 32 each represent an alkylene group having 1 to 6 carbon atoms.
- R 41 represents an alkylene group having 1 to 10 carbon atoms.
- R 51 and R 52 each represent an alkyl group having 1 to 20 carbon atoms.
- R 53 and R 54 each represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, one of them is always a hydrogen atom, and both are not simultaneously hydrogen atoms.
- m represents an integer of 1 to 12
- k represents an integer of 0 to 5.
- p represents an integer of 1 to 10.
- r represents an integer of 1 to 10.
- Examples of the alkyl group represented by R 11 to R 19 include a methyl group, an ethyl group, an isopropyl group, an n-octyl group, an n-decyl group, an n-dodecyl group, and an n-stearyl group.
- the aryl group represented by R 11 to R 19 includes, for example, phenyl group, p-chlorophenyl group, mesityl group, tolyl group, xylyl group, naphthyl group, anthryl group, azulenyl group, acenaphthenyl group, fluorenyl group, phenanthryl group , An indenyl group, a pyrenyl group, a biphenylyl group and the like, and preferred are a phenyl group, a naphthyl group, a fluorenyl group, a phenanthryl group, a biphenylyl group and a fluorenonyl group.
- Examples of the aralkyl group represented by R 11 to R 19 include a benzyl group and a phenethyl group.
- Plysurf A212C Polyoxyethylene tridecyl ether phosphate
- Prysurf A215C Polyoxyethylene tridecyl ether phosphate
- Prysurf A208F Polyoxyethylene alkyl (C8) ether phosphate Surf M208F: Polyoxyethylene alkyl (C8) ether phosphate-monoethanolamine salt
- Plysurf A208N Polyoxyethylene alkyl (C12, 13) ether phosphate
- Plysurf A208B Polyoxyethylene lauryl ether phosphate (oil) Dispersant)
- Plysurf A210B Polyoxyethylene lauryl ether phosphate E.
- Plysurf A219B Polyoxyethylene lauryl ether phosphate (aqueous dispersant)
- Price Surf DB-01 polyoxyethylene lauryl ether phosphate-monoethanolamine salt
- Price Surf AL polyoxyethylene styrenated phenyl ether phosphate, etc.
- NIKKOL DDP-2 manufactured by Nikko Chemicals Co., Ltd .: polyoxyethylene alkyl (C12 to C15) ether phosphoric acid (2EO di (C12-15) palace-2 phosphoric acid)
- NIKKOL DDP-4 polyoxyethylene alkyl (C12-C15) ether phosphoric acid (4EO di (C12-15) palace-4 phosphoric acid)
- NIKKOL DDP-6 polyoxyethylene alkyl (C12-C15) ether phosphate (6EO di (C12-15) palace-6 phosphate)
- NIKKOL DDP-8 polyoxyethylene alkyl (C12-C15) ether phosphoric acid (8EO di (C12-15) palace-8 phosphoric acid)
- NIKKOL DDP-10 polyoxyethylene alkyl (C12-C15) ether phosphoric acid (10EO di (C12-15) palace-10 phosphoric acid)
- NIKKOL DLP-10 Sodium polyoxyethylene lauryl ether phosphate (sodium dilaure
- R ′ represents an alkyl group, an aryl group, an aralkyl group or an alkenyl group having 1 to 18 carbon atoms, and the total carbon number is within 1 to 36.
- the alkyl group represented by R ' may be branched, linear or cyclic, and includes, for example, methyl, ethyl, n-propyl, i-propyl, n-butyl, t-butyl, cyclohexyl Group, n-octyl group, 2-ethylhexyl group, n-dodecyl group and the like.
- Examples of the aryl group represented by R ′ include phenyl, p-chlorophenyl, mesityl, tolyl, xylyl, naphthyl, anthryl, azulenyl, acenaphthenyl, fluorenyl, phenanthryl, indenyl , A pyrenyl group, a biphenylyl group and the like, and preferred are a phenyl group, a naphthyl group, a fluorenyl group, a phenanthryl group, a biphenylyl group and a fluorenonyl group.
- Examples of the aralkyl group represented by R ′ include a benzyl group and a phenethyl group.
- Examples of the alkenyl group represented by R ′ include a vinyl group, an allyl group, a butenyl group, a pentenyl group, a hexenyl group and the like.
- n ′ is 1 or 2, and when n ′ is 1, R ′ may be the same or different.
- Representative phosphate esters 2 having a structure represented by the general formula (2) include: 1) Phosphoric acid methyl ester 2) Phosphoric acid ethyl ester 3) Phosphoric acid n-propyl ester 4) Phosphoric acid i-propyl ester 5) Phosphoric acid n-butyl ester 6) Phosphoric acid t-butyl ester 7) Phosphoric acid n- Pentyl ester 8) n-hexyl phosphate 9) 2-ethylhexyl phosphate 10) n-heptyl phosphate 11) n-octyl phosphate 12) cyclohexyl phosphate 13) n-dodecyl phosphate 14 ) Stearyl phosphate 15) Phenyl phosphate 16) Benzyl phosphate 17) 2-Methacryloxyethyl phosphate
- a copper complex obtained by reacting a component composed of copper ions or at least one of the compounds having the structures represented by general formulas (1) and (2) with a copper compound Characterized by containing a component composed of
- a copper complex comprising a high-molecular-weight phosphate 1 having a structure represented by the general formula (1) and a copper ion according to the present invention, or a copper complex having a structure represented by the general formula (2) is used.
- a copper salt used for forming a copper complex comprising a phosphoric acid ester 2 having a molecular weight and copper ions
- a copper salt capable of supplying divalent copper ions is used.
- a copper complex comprising a phosphate ester having a structure represented by the general formula (1) and a copper ion according to the present invention, and a phosphate ester having a structure represented by the general formula (2) and a copper ion
- a method described in Japanese Patent No. 4442286 can be applied to a method for synthesizing a copper complex composed of
- the phosphate group of the phosphate ester according to the present invention binds to a copper ion by a coordination bond and / or an ionic bond, and the copper ion is dissolved in the near-infrared light absorbing film in a state surrounded by the phosphate ester. Or, the near-infrared light is selectively absorbed by the electronic transition between the d orbits of the copper ions.
- the content of phosphorus atoms in the near-infrared light absorbing film is preferably 1.5 or less per mole of copper ions, more preferably 0.4 to 1.3, that is, the content of phosphorus atoms with respect to copper ions.
- the molar ratio of P / Cu is less than 0.4, copper ions become excessive with respect to the coordinating phosphate ester, and the copper ions tend not to be uniformly dispersed in the near-infrared light absorbing film. is there.
- the molar ratio of P / Cu exceeds 1.3, when the thickness of the near-infrared absorbing film is reduced to increase the content of copper ions, devitrification tends to occur, and This tendency is particularly remarkable in a humid environment.
- the molar ratio of P / Cu is 0.8 to 1.3 mol. When the molar ratio is 0.8 or more, the dispersibility of copper ions in the resin can be surely and sufficiently increased.
- the content ratio of copper ions in the near-infrared absorbing film is less than the above lower limit, when the thickness of the near-infrared absorbing film is made thinner than about 1 mm, sufficient near-infrared light absorbing property is obtained. It tends to be difficult.
- the content ratio of the copper ion exceeds the above upper limit, it tends to be difficult to disperse the copper ion in the near-infrared light absorbing film.
- Formula (I) O P- (OH) 3
- the compound having the structure represented by the above formula (I) is specifically phosphoric acid, and is present in a near-infrared-absorbing composition in a specific content ratio within a specific content range, so that the compound can be highly heated by heat treatment.
- the absorption wavelength can be converted with high precision, and in particular, the effect of improving the absorption performance in the wavelength range of 900 to 1100 nm is exhibited.
- the present invention is characterized in that the content of the phosphoric acid represented by the formula (I) is in the range of 0.001 to 10% by mass relative to the total mass of the near-infrared absorbing composition, Is preferably in the range of 0.001 to 1.0% by mass, particularly preferably in the range of 0.001 to 0.1% by mass.
- the content of phosphoric acid is 0.001% by mass or more, the absorption performance in the wavelength range of 900 to 1100 nm can be improved. Particle size can be obtained.
- Solvents that can be used in the near-infrared absorbing composition of the present invention are not particularly limited, but include hydrocarbon solvents, more preferably aliphatic hydrocarbon solvents, aromatic hydrocarbons Preferred examples include a system solvent and a halogen solvent.
- aliphatic hydrocarbon-based solvent examples include non-cyclic aliphatic hydrocarbon-based solvents such as hexane and heptane; cyclic aliphatic hydrocarbon-based solvents such as cyclohexane; and alcohol-based solvents such as methanol, ethanol, n-propanol, and ethylene glycol.
- Solvents include ketone solvents such as acetone and methyl ethyl ketone, and ether solvents such as diethyl ether, diisopropyl ether, tetrahydrofuran, 1,4-dioxane, ethylene glycol monomethyl ether, propylene glycol monomethyl ether acetate (PGMEA), and the like.
- aromatic hydrocarbon-based solvent examples include toluene, xylene, mesitylene, cyclohexylbenzene, and isopropylbiphenyl.
- halogen-based solvent examples include methylene chloride, 1,1,2-trichloroethane, chloroform and the like.
- ether solvents are preferable, and among them, tetrahydrofuran is preferable in terms of boiling point and solubility.
- the solid concentration is preferably in the range of 5 to 50% by mass, more preferably in the range of 10 to 40% by mass, and still more preferably 20 to 40% by mass. It is in the range of 30% by mass.
- the solid concentration is 5% by mass or more, the absorption performance in the wavelength range of 900 to 1100 nm can be improved.
- the solids concentration is 50% by mass or less, excellent dispersibility and excellent average particle size can be obtained. Can be.
- near-infrared absorption adjuster In the near-infrared absorbing composition of the present invention, it is desirable to add at least one near-infrared absorption adjusting agent having an absorption maximum wavelength in a wavelength range of 650 to 1000 nm as an additive for adjusting an absorption waveform. It is preferable from the viewpoint that characteristics can be obtained. Among them, as the near-infrared absorption adjuster applied to the present invention, it is particularly preferable to use a near-infrared absorption dye having an absorption maximum wavelength in a wavelength range of 650 to 1000 nm, and examples thereof include a copper compound and an organic dye. Can be
- Examples of the near infrared absorbing dye which is an organic dye suitable for the present invention include, for example, a cyanine dye, a squarylium dye, a croconium dye, an azo dye, an anthraquinone dye, a naphthoquinone dye, a phthalocyanine dye, a naphthalocyanine dye, a quaterylene dye, and a dithiol metal complex. Dyes and the like can be mentioned. Among them, phthalocyanine dyes, naphthalocyanine dyes, and quaterylene dyes are particularly preferable because they sufficiently absorb near infrared rays, have high visible light transmittance, and are excellent in heat resistance.
- phthalocyanine compound examples include, for example, JP-A-2000-26748, JP-A-2000-63691, JP-A-2001-106689, JP-A-2004-149752, JP-A-2004-18561, Compounds described in JP-A-2005-220060, JP-A-2007-169343, JP-A-2016-204536, JP-A-2016-218167 and the like can be mentioned. It can be synthesized according to the method.
- quaterylene dye examples include, for example, compounds described in JP-A-2008-009206 and JP-A-2011-225608, and can be synthesized according to the methods described in these publications.
- the near-infrared absorbing dye is also available as a commercial product.
- FDR002, FDR003, FDR004, FDR005, FDN001 (all manufactured by Yamada Chemical Industry Co., Ltd.), Excolor @ TX-EX720, Excolor @ TX-EX708K (Nippon Shokubai) Lumogen @ IR765, Lumogen @ IR788 (all from BASF), ABS694, IRA735, IRA742, IRA751, IRA764, IRA788, IRA800 (all from Exciton), epolight5548, epolight5768 and more VIS695A, NIR700B, NIR735B, NIR757A, NIR762A, NIR775B, NIR778A, NIR78 C, NIR783I, NIR790B, NIR795A (manufactured by QCR Solutions Inc.), DLS740A, DLS740B, DLS740C, DLS744A, DLS
- the amount of the near-infrared absorbing dye added is preferably in the range of 0.01 to 0.1% by mass based on 100% by mass of the near-infrared absorbing agent constituting the near-infrared absorbing composition.
- the amount of the near infrared absorbing dye added is 0.01% by mass or more with respect to 100% by mass of the near infrared absorbing agent, the near infrared absorption can be sufficiently increased, and if it is 0.1% by mass or less. The visible light transmittance of the obtained near-infrared absorbing composition is not impaired.
- the near-infrared absorbing composition of the present invention preferably further contains an ultraviolet absorbing agent in addition to the near-infrared absorbing agent and the solvent from the viewpoint of spectral characteristics and light resistance.
- the ultraviolet absorber is not particularly limited, and includes, for example, a benzotriazole-based ultraviolet absorber, a benzophenone-based ultraviolet absorber, a salicylate-based ultraviolet absorber, a cyanoacrylate-based ultraviolet absorber, and a triazine-based ultraviolet absorber. Can be.
- benzotriazole-based ultraviolet absorber examples include 5-chloro-2- (3,5-di-sec-butyl-2-hydroxyphenyl) -2H-benzotriazole and (2-2H-benzotriazol-2-yl). ) -6- (linear and side chain dodecyl) -4-methylphenol.
- the benzotriazole-based ultraviolet absorber can be obtained as a commercial product.
- TINUVIN series such as TINUVIN109, TINUVIN171, TINUVIN234, TINUVIN326, TINUVIN327, TINUVIN328, and TINUVIN928, all of which are commercially available from BASF. Goods.
- benzophenone-based ultraviolet absorber examples include, for example, 2-hydroxy-4-benzyloxybenzophenone, 2,4-benzyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxy-5- Sulfobenzophenone, bis (2-methoxy-4-hydroxy-5-benzoylphenylmethane) and the like.
- salicylate-based ultraviolet absorber examples include phenyl salicylate, p-tert-butyl salicylate and the like.
- cyanoacrylate-based ultraviolet absorbers examples include 2'-ethylhexyl-2-cyano-3,3-diphenylacrylate, ethyl-2-cyano-3- (3 ', 4'-methylenedioxyphenyl) -acrylate and the like. Is mentioned.
- triazine-based ultraviolet absorber examples include 2- (2'-hydroxy-4'-hexyloxyphenyl) -4,6-diphenyltriazine.
- Commercial products of the triazine-based ultraviolet absorber include, for example, TINUVIN 477 (manufactured by BASF).
- the amount of the ultraviolet absorber added is preferably in the range of 0.1 to 5.0% by mass with respect to 100% by mass of the near infrared absorber constituting the near infrared absorbing composition.
- the amount of the ultraviolet absorber added is 0.1% by mass or more with respect to 100% by mass of the near-infrared ray absorber, the light resistance can be sufficiently increased. The visible light transmittance of the near-infrared absorbing composition is not impaired.
- the transmittance at a wavelength of 850 nm when the transmittance at a wavelength of 850 nm is 1.0%, the average transmittance in a wavelength region of 450 to 550 nm is 70%. It is preferable that it is above.
- the near-infrared absorptive composition having the constitution specified in the present invention has a transmittance at a wavelength of 850 nm, which is a near-infrared region, standardized to 1.0%, that is, visible light under a condition having a high near-infrared absorptivity. It has a high transmittance characteristic in which the average transmittance in the wavelength region of 450 to 550 nm is 70% or more.
- the spectral transmittance characteristics can be determined, for example, by the following method.
- the near-infrared absorbing composition of the present invention or the near-infrared absorbing film to which the composition is applied is used as a measurement sample, and a spectral transmission in a wavelength range of 300 to 1200 nm is performed using a spectrophotometer V-570 manufactured by JASCO Corporation as a measuring device. Measure the rate. Next, under the condition that the transmittance at a wavelength of 850 nm is 1.0%, the spectral transmittance of 450 to 550 nm is measured as a visible region, and the average transmittance is determined.
- ⁇ Near-infrared absorbing film and its application field ⁇ One feature of the present invention is that a near-infrared absorbing film is formed using the near-infrared absorbing composition of the present invention.
- the near-infrared absorbing film of the present invention is formed by adding a matrix resin to the near-infrared absorbing composition according to the present invention and dispersing fine particles of a copper complex in the matrix resin. Further, as an additive for adjusting the absorption waveform, at least one kind of the near-infrared dye having an absorption maximum wavelength in a wavelength range of 650 to 1000 nm can be added.
- the near-infrared absorbing film-forming coating solution having the above-described structure is applied onto a substrate by spin coating or a wet coating method using a dispenser to form a near-infrared absorbing film. Thereafter, the coating film is subjected to a predetermined heat treatment to cure the coating film, thereby forming a near-infrared absorbing film.
- the matrix resin used to form the near-infrared absorbing film is a resin that is transparent to visible light and near-infrared light and can disperse fine particles of a copper complex. Copper complexes are relatively low polarity substances and disperse well in hydrophobic materials. Therefore, a resin having an acryloyl group, an epoxy group, or a phenyl group can be used as the matrix resin for forming the near-infrared absorbing film. Among them, it is particularly preferable to use a resin having a phenyl group as the matrix resin of the near-infrared absorbing film. In this case, the matrix resin of the near-infrared absorbing film has high heat resistance.
- polysiloxane silicone resins are not easily thermally decomposed, have high transparency to visible light and near-infrared rays, and have high heat resistance, and therefore have advantageous properties as materials for image sensors for solid-state imaging devices. Therefore, it is also preferable to use polysiloxane as the matrix resin of the near-infrared absorbing film.
- Polysiloxanes that can be used as the matrix resin for the near-infrared absorbing film are commercially available, and include, for example, KR-255, KR-300, and KR-2621-1 silicone resins manufactured by Shin-Etsu Chemical Co., Ltd. , KR-211, KR-311, KR-216, KR-212, and KR-251.
- a sensitizer In the near-infrared absorbing film of the present invention, conventionally known various additives can be applied as long as the effects of the present invention are not impaired.
- a sensitizer for example, a crosslinking agent, a curing accelerator, a filler
- examples include a thermosetting accelerator, a thermal polymerization inhibitor, and a plasticizer.
- an adhesion promoter to a substrate surface and other auxiliaries for example, conductive particles, a filler, an antifoaming agent, a flame retardant, and a leveling agent
- An agent, a peeling accelerator, an antioxidant, a fragrance, a surface tension adjuster, a chain transfer agent and the like may be used in combination.
- JP-A-2012-003225 paragraph numbers (0183), JP-A-2008-250074, paragraph numbers (0101) to (0102), and JP-A-2008-250074, paragraph numbers ( 0103) to (0104) and paragraphs (0107) to (0109) of JP-A-2008-250074 can be referred to.
- the near-infrared absorbing composition of the present invention can be a liquid wet coating solution, for example, by a simple process of forming a film by spin coating, a near-infrared absorbing film, for example, near infrared Cut filters can be easily manufactured.
- the near-infrared absorbing film of the present invention includes, for example, a visibility correcting member for CCD, CMOS or other light receiving element, a photometric member, a heat ray absorbing member, a composite optical filter, a lens member (glasses, sunglasses, goggles).
- a visibility correcting member for CCD, CMOS or other light receiving element for example, a photometric member, a heat ray absorbing member, a composite optical filter, a lens member (glasses, sunglasses, goggles).
- Optical elements optical amplification elements, wavelength conversion elements, etc.
- Faraday elements for example, a light communication function devices such as isolators, optical disk elements, and the like.
- the use of the near-infrared absorbing film having the near-infrared absorbing composition of the present invention is particularly suitable for a near-infrared cut filter on the light receiving side of the solid-state imaging device substrate (for example, for a near-infrared cut filter for a wafer level lens, etc.), It is characterized by being applied to an image sensor for a solid-state imaging device, such as for a near-infrared cut filter on the back surface side (opposite to the light-receiving side) of the solid-state imaging device substrate.
- the near-infrared absorbing film of the present invention to an image sensor for a solid-state imaging device, it is possible to improve the line of the visible part transmittance, the near-infrared part absorption efficiency, the heat and humidity resistance and the like.
- the near-infrared absorbing film (near-infrared cut filter) of the present invention is provided on an image sensor for a solid-state imaging device.
- FIG. 1 is a schematic cross-sectional view showing the configuration of a camera module provided with a solid-state imaging device having an infrared cut filter that is a near-infrared absorbing film of the present invention.
- the camera module 1 shown in FIG. 1 is connected to a circuit board 12 as a mounting board via a solder ball 11 as a connecting member.
- the camera module 1 includes a solid-state image sensor substrate 10 having an image sensor 13 on a first main surface of a silicone substrate, and a solid-state image sensor substrate 10 provided on the first main surface side (light receiving side) of the solid-state image sensor substrate 10.
- Flattened layer 8 near-infrared cut filter (near-infrared absorbing film) 9 provided on flattened layer 8, and glass substrate 3 (light-transmitting A substrate), a lens holder 5 disposed above the glass substrate 3 and having an imaging lens 4 in an internal space, a light-shielding / electromagnetic shield 6 disposed so as to surround the solid-state imaging element substrate 10 and the glass substrate 3, It is configured with.
- Each member is bonded by adhesives 2 and 7.
- the present invention is a method for manufacturing a camera module having a solid-state imaging device substrate and an infrared cut filter disposed on the light-receiving side of the solid-state imaging device substrate.
- a near infrared absorbing film can be formed.
- the near-infrared absorbing film is formed by spin-coating the near-infrared absorbing composition of the present invention on the flattening layer 8 to form the infrared cut filter 9. .
- the incident light L from the outside passes through the imaging lens 4, the glass substrate 3, the infrared cut filter 9, and the flattening layer 8 in order, and then reaches the imaging device section of the solid-state imaging device substrate 10. Has become.
- the camera module 1 is connected to the circuit board 12 via solder balls 11 (connection material) on the second main surface side of the solid-state imaging device substrate 10.
- Example 1 Preparation of near infrared absorbing composition >> (Preparation of near-infrared absorbing composition 1) According to the following method, a near-infrared absorbing composition 1 was prepared.
- the compound represented by the general formula (2) includes phosphoric acid ethyl ester and the phosphoric acid ester copper complex formed by Plysurf A208F which is the compound represented by the general formula (1).
- a near-infrared absorbing composition 1 having a content of 0.10% by mass was prepared.
- the near-infrared absorbing composition 16 was prepared in the same manner except that the compound according to the general formula (1) was changed to the phosphoric acid ester (equivalent mole) described in Table I. 17-20 were prepared.
- the near-infrared absorbing composition was prepared in the same manner except that the compound according to the general formula (1) was changed to the phosphoric acid ester (equivalent mole) described in Table I. 21-24 were prepared.
- composition 40 preparation of near-infrared absorbing composition 40
- the amount of phosphoric acid was changed to 9.25 g and the content of phosphoric acid was changed to 15.0% by mass.
- Composition 40 was prepared.
- a near-infrared absorbing composition 42 as a comparative example was prepared in the same manner as in the preparation of the near-infrared absorbing composition 1 except that phosphoric acid was omitted.
- a near-infrared absorbing composition 43 as a comparative example was prepared in the same manner as in the preparation of the near-infrared absorbing composition 10 except that phosphoric acid was omitted.
- a near-infrared absorbing composition 44 as a comparative example was prepared in the same manner as in the preparation of the near-infrared absorbing composition 16 except that phosphoric acid was omitted.
- A208F Plysurf A208F (polyoxyethylene alkyl (C8) ether phosphate ester manufactured by Daiichi Kogyo Seiyaku Co., Ltd.)
- A208N Plysurf A208N (polyoxyethylene alkyl (C12, 13) ether phosphate ester manufactured by Daiichi Kogyo Seiyaku Co., Ltd.)
- A215C Plysurf A215C (polyoxyethylene tridecyl phosphate ester manufactured by Daiichi Kogyo Seiyaku Co., Ltd.)
- DDP-2 NIKKOL DDP-2 (polyoxyethylene alkyl (C12 to C15) ether phosphoric acid (2E, O, di (C12 to C15) palace-2 phosphoric acid) manufactured by Nikko Chemicals)
- DDP-4 NIKKOL DDP-4 (polyoxyethylene alkyl (C12-C15) ether phosphoric acid
- each evaluation sample A diluted with toluene was prepared so that the particle concentration (solid content concentration) of the copper complex particles as the particles was 1.0% by mass. .
- the average particle size of each evaluation sample A was measured by a dynamic light scattering method using a zeta potential / particle size measuring system (ELSZ-1000ZS, manufactured by Otsuka Electronics Co., Ltd.) as a measuring device.
- ELSZ-1000ZS zeta potential / particle size measuring system
- the average particle diameter immediately after preparation measured by the above method was ranked according to the following criteria.
- Average particle size is less than 50 nm :: Average particle size is in the range of 50 nm or more and less than 100 nm ⁇ : Average particle size is in the range of 100 nm or more and less than 200 nm ⁇ : Average particle size Is 200 nm or more [Measurement of spectral transmittance] Using each of the evaluation samples A prepared by the measurement of the average particle diameter, the spectral transmittance in a wavelength range of 300 to 1200 nm was measured by a spectrophotometer V-570 manufactured by JASCO Corporation as a measuring device.
- the transmittance at 550 nm of the near-infrared absorbing composition measured by the above method was ranked according to the following criteria, and the transmittance 1 in the visible region was evaluated.
- ⁇ : transmittance 90% or more ⁇ : transmittance is 80% or more and less than 90% ⁇ : transmittance is 70% or more and less than 80% X: transmittance is less than 70% (Evaluation of transmittance 2 in near infrared region)
- the transmittance at 750 nm of the near-infrared absorbing composition measured by the above method was ranked according to the following criteria, and the transmittance 2 in the near-infrared region was evaluated.
- transmittance is less than 5% :: transmittance is 5% or more and less than 15% ⁇ : transmittance is 15% or more and less than 25% ⁇ : transmittance is 25% or more (Evaluation of transmittance 3 in the near infrared region)
- the transmittance at 1000 nm of the near-infrared absorbing composition measured by the above method was ranked according to the following criteria, and the transmittance 3 in the near-infrared region was evaluated.
- the near-infrared absorbing composition of the present invention has a smaller average particle size of the copper complex particles than that of the comparative example by adopting the structure defined in the present invention. It has excellent spectral characteristics, high transmittance in the visible region (550 nm), and low transmittance in the near-infrared region (1000 nm). I understand. Further, it was confirmed that all of the near-infrared absorbing compositions 1 to 44 had an average transmittance of 70% or more in the visible region.
- Example 2 Preparation of near infrared absorbing film >> To each of the near-infrared absorbing compositions prepared in Example 1, a polysiloxane silicone resin (KR-255, manufactured by Shin-Etsu Chemical Co., Ltd.) was added and stirred to prepare a coating solution for forming a near-infrared absorbing film. . The prepared coating solution was applied on a substrate by spin coating to produce near infrared absorbing films 1 to 44.
- a polysiloxane silicone resin KR-255, manufactured by Shin-Etsu Chemical Co., Ltd.
- the near-infrared absorptive film was subjected to a predetermined heat treatment to cure the coating, thereby producing near-infrared cut filters 1 to 44 applicable to an image sensor for a solid-state imaging device.
- the visible light transmittance and the near-infrared transmittance in a film state were evaluated in the same manner as in the method described in Example 1. As a result, the same effect was obtained in a film system. It was confirmed that it could be obtained.
- the near-infrared absorbing composition of the present invention is a near-infrared absorbing composition having high dispersibility and high transmittance in the visible light region, and excellent absorption characteristics in the near-infrared region.
- the near-infrared absorptive film made of a product can be suitably used for an image sensor for a solid-state imaging device applied to a video camera, a digital still camera, a mobile phone with a camera function, and the like.
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Abstract
Description
前記近赤外線吸収剤として、下記(A)成分及び下記(B)成分のうち少なくとも1つを含有し、かつ、
下記(A)成分又は下記(B)成分において、下式(I)で表される構造を有する化合物を、前記近赤外線吸収性組成物の全質量に対し0.001~10質量%の範囲内で含有する、
ことを特徴とする近赤外線吸収性組成物。
式(I)
O=P-(OH)3
本発明の近赤外線吸収性組成物は、近赤外線吸収剤と溶媒を含有し、当該近赤外線吸収剤として、下記(A)成分及び下記(B)成分のうち少なくとも1つを含有し、かつ、下記(A)成分又は下記(B)成分において、下式(I)で表される構造を有する化合物を、前記近赤外線吸収性組成物の全質量に対し0.001~10質量%の範囲内で含有することを特徴とする。
(A)成分:下記一般式(1)又は一般式(2)で表される構造を有する化合物の少なくとも一方と、下式(I)で表される構造を有する化合物と銅イオンから構成される成分
(B)成分:下記一般式(1)又は一般式(2)で表される構造を有する化合物の少なくとも一方と、下式(I)で表される構造を有する化合物と銅化合物との反応により得られる銅錯体から構成される成分。
O=P-(OH)3
以下、本発明の近赤外線吸収性組成物の代表的な構成成分である前記一般式(1)で表される構造を有する高分子量のリン酸エステルと、前記一般式(2)で表される構造を有する低分子量のリン酸エステル、前記式(I)で表される構造を有する化合物、銅イオン又は銅錯体及び溶媒等について説明する。ただし、本発明は、ここで例示する構成にのみ限定されるものではない。
本発明の近赤外線吸収性組成物においては、一般式(1)で表される構造を有するリン酸エステル(以下、リン酸エステル1ともいう。)、又は前記一般式(2)で表される構造を有するリン酸エステル(以下、リン酸エステル2ともいう。)のうちの少なくとも一方を含有することを特徴とする。
1)第一工業製薬社製
プライサーフA212C:ポリオキシエチレントリデシルエーテルリン酸エステル
プライサーフA215C:ポリオキシエチレントリデシルエーテルリン酸エステル
プライサーフA208F:ポリオキシエチレンアルキル(C8)エーテルリン酸エステル
プライサーフM208F:ポリオキシエチレンアルキル(C8)エーテルリン酸エステル-モノエタノールアミン塩
プライサーフA208N:ポリオキシエチレンアルキル(C12、13)エーテルリン酸エステル
プライサーフA208B:ポリオキシエチレンラウリルエーテルリン酸エステル(油系分散剤)
プライサーフA210B:ポリオキシエチレンラウリルエーテルリン酸エステル
プライサーフA219B:ポリオキシエチレンラウリルエーテルリン酸エステル(水系分散剤)
プライサーフDB-01:ポリオキシエチレンラウリルエーテルリン酸エステル-モノエタノールアミン塩
プライサーフAL:ポリオキシエチレンスチレン化フェニルエーテルリン酸エステル等、
2)日光ケミカルズ社製
NIKKOL DDP-2:ポリオキシエチレンアルキル(C12~C15)エーテルリン酸(2E.O. ジ(C12-15)パレス-2リン酸)
NIKKOL DDP-4:ポリオキシエチレンアルキル(C12~C15)エーテルリン酸(4E.O. ジ(C12-15)パレス-4リン酸)
NIKKOL DDP-6:ポリオキシエチレンアルキル(C12~C15)エーテルリン酸(6E.O. ジ(C12-15)パレス-6リン酸)
NIKKOL DDP-8:ポリオキシエチレンアルキル(C12~C15)エーテルリン酸(8E.O. ジ(C12-15)パレス-8リン酸)
NIKKOL DDP-10:ポリオキシエチレンアルキル(C12~C15)エーテルリン酸(10E.O. ジ(C12-15)パレス-10リン酸)
NIKKOL DLP-10:ポリオキシエチレンラウリルエーテルリン酸ナトリウム(ジラウレス-10リン酸ナトリウム)
NIKKOL DOP-8NV:ポリオキシエチレンオレイユエーテルリン酸ナトリウム(ジオレス-8リン酸ナトリウム)等、
3)アデカ社製
アデカコールTS-230E、アデカコールCS-141E、アデカコールCS1361E、アデカコールCS-279(以上、芳香族リン酸エステル)、アデカコールPS-440E、アデカコールPS-810E、アデカコールPS-807、アデカコールPS-984(以上、脂肪族リン酸エステル)等、
を挙げることができる。
1)リン酸メチルエステル
2)リン酸エチルエステル
3)リン酸n-プロピルエステル
4)リン酸i-プロピルエステル
5)リン酸n-ブチルエステル
6)リン酸t-ブチルエステル
7)リン酸n-ペンチルエステル
8)リン酸n-ヘキシルエステル
9)リン酸2-エチルヘキシルエステル
10)リン酸n-へプチルエステル
11)リン酸n-オクチルエステル
12)リン酸シクロヘキシルエステル
13)リン酸n-ドデシルエステル
14)リン酸ステアリルエステル
15)リン酸フェニルエステル
16)リン酸ベンジルエステル
17)リン酸2-メタクリロキシエチルエステル
等を挙げることができる。
本発明においては、銅イオンから構成される成分、又は一般式(1)及び一般式(2)で表される構造を有する化合物のうちの少なくとも一方と、銅化合物との反応により得られる銅錯体から構成される成分を含有することを特徴とする。
本発明に係るリン酸エステルのリン酸基が配位結合及び/又はイオン結合により銅イオンに結合し、この銅イオンはリン酸エステルに囲まれた状態で近赤外光吸収性膜中に溶解又は分散されており、この銅イオンのd軌道間の電子遷移によって近赤外光が選択吸収される。また、近赤外光吸収成膜中におけるリン原子の含有量が銅イオン1モルに対して1.5以下が好ましく、更には、0.4~1.3、すなわち、銅イオンに対するリン原子の含有比(以下、「P/Cu」という)がモル比で0.4~1.3であると、近赤外線吸収性膜の耐湿性、及び近赤外光吸収層における銅イオンの分散性の観点から非常に好適であることが確認された。
本発明の近赤外線吸収性組成物においては、一般式(1)で表される構造を有するリン酸エステル1、又は前記一般式(2)で表される構造を有するリン酸エステル2ともに、下式(I)で表される構造を有する化合物を、近赤外線吸収性組成物の全質量に対し0.001~10質量%の範囲内で含有することを特徴とする。
上記式(I)で表される構造を有する化合物は、具体的にはリン酸であり、近赤外線吸収性組成物中に、特定の含有比率の範囲で存在させることにより、加熱処理により、高精度で吸収波長を変換させることができ、特に、900~1100nmの波長範囲内おける吸収性能を向上させることができる効果を発現する。
次いで、本発明の近赤外線吸収性組成物に適用可能な溶媒について説明する。
本発明の近赤外線吸収性組成物においては、固形分濃度が5~50質量%の範囲内であることが好ましく、より好ましくは、10~40質量%の範囲内であり、更に好ましくは20~30質量%の範囲内である。固形分濃度が5質量%以上であれば、900~1100nmの波長範囲内おける吸収性能を向上させることができ、50質量%以下であれば、分散性に優れ、良好な平均粒径を得ることができる。
本発明の近赤外線吸収性組成物においては、吸収波形調整用の添加剤として、650~1000nmの波長域内に吸収極大波長を有する近赤外線吸収調整剤を少なくとも1種添加することが、所望の分光特性を得ることができる観点から好ましい。その中でも、特に、本発明に適用する近赤外線吸収調整剤としては、650~1000nmの波長域に吸収極大波長を有する近赤外線吸収色素を適用することが好ましく、例えば、銅化合物や有機色素が挙げられる。
本発明の近赤外線吸収性組成物には、近赤外線吸収剤と溶媒の他に、紫外線吸収剤をさらに含有していることが、分光特性及び耐光性の観点から好ましい。
本発明の近赤外線吸収性組成物、又はそれを適用した近赤外線吸収性膜においては、波長850nmにおける透過率を1.0%としたとき、450~550nmの波長領域における平均透過率が70%以上であることが好ましい。
本発明においては、本発明の近赤外線吸収性組成物を用いて、近赤外線吸収性膜を形成することを一つの特徴とする。
本発明の近赤外線吸収性膜には、本発明の目的効果を損なわない範囲で、従来公知の各種添加剤を適用することができ、例えば、増感剤、架橋剤、硬化促進剤、フィラー、熱硬化促進剤、熱重合禁止剤、可塑剤などが挙げられ、更に基材表面への密着促進剤及びその他の助剤類、例えば、導電性粒子、充填剤、消泡剤、難燃剤、レベリング剤、剥離促進剤、酸化防止剤、香料、表面張力調整剤、連鎖移動剤等を併用してもよい。
本発明の近赤外線吸収性膜は、例えば、CCD用、CMOS用又は他の受光素子用の視感度補正部材、測光用部材、熱線吸収用部材、複合光学フィルター、レンズ部材(眼鏡、サングラス、ゴーグル、光学系、光導波系)、ファイバ部材(光ファイバ)、ノイズカット用部材、プラズマディスプレイ前面板等のディスプレイカバー又はディスプレイフィルター、プロジェクタ前面板、光源熱線カット部材、色調補正部材、照明輝度調節部材、光学素子(光増幅素子、波長変換素子等)、ファラデー素子、アイソレータ等の光通信機能デバイス、光ディスク用素子等を構成するものとして好適である。
《近赤外線吸収性組成物の調製》
(近赤外線吸収性組成物1の調製)
下記の方法に従って、近赤外線吸収性組成物1を調製した。
上記近赤外線吸収性組成物1の調製において、リン酸の含有量を、それぞれ0.001質量%、0.01質量%、1.00質量%、10.0質量%に変更した以外は同様にして、近赤外線吸収性組成物2~5を調製した。
上記近赤外線吸収性組成物1の調製において、THFの含有量を適宜調整して、固形分比率を、それぞれ、3.0質量%、5.0質量%、50.0質量%、60.0質量%に変更した以外は同様にして、近赤外線吸収性組成物6~9を調製した。
上記近赤外線吸収性組成物1の調製において、一般式(1)に係る化合物であるプライサーフA208Fを除き、リン酸エチルエステルを1.13gとした以外は同様にして、近赤外線吸収性組成物10を調製した。
上記近赤外線吸収性組成物10の調製において、一般式(2)に係る化合物であるリン酸エチルエステルを、それぞれ表Iに記載のリン酸エステル(同モル)に変更した以外は同様にして、近赤外線吸収性組成物11~15を調製した。
上記近赤外線吸収性組成物1の調製において、一般式(2)に係る化合物であるリン酸エチルエステルを除き、プライサーフA208Fを4.41gとした以外は同様にして、近赤外線吸収性組成物16を調製した。
上記近赤外線吸収性組成物16の調製において、一般式(1)に係る化合物を、それぞれ表Iに記載のリン酸エステル(同モル)に変更した以外は同様にして、近赤外線吸収性組成物17~20を調製した。
上記近赤外線吸収性組成物1の調製において、一般式(1)に係る化合物を、それぞれ表Iに記載のリン酸エステル(同モル)に変更した以外は同様にして、近赤外線吸収性組成物21~24を調製した。
上記近赤外線吸収性組成物1の調製において、一般式(1)に係る化合物を、それぞれ表IIに記載のリン酸エステル(同モル)に変更し、一般式(2)に係る化合物を、それぞれ表IIに記載のリン酸エステル(同モル)に変更した以外は同様にして、近赤外線吸収性組成物25~35を調製した。
上記近赤外線吸収性組成物1の調製において、室温で16時間撹拌した後に、表IIに示した近赤外線吸収調整剤として、近赤外線吸収色素であるFDR004(極大吸収波長:716nm、山田化学工業社製)を0.60mg添加し、さらにアニソール15.82gを加え、加熱して溶媒であるTHF及びアニソールを揮発させて固形分が20質量%となるようにした以外は同様にして、近赤外線吸収性組成物36を調製した。
上記近赤外線吸収性組成物1の調製において、室温で16時間撹拌した後に、表IIに示した近赤外線吸収調整剤として、近赤外線吸収色素であるFDR004を0.60mgと、LumogenIR765(BASF社製)を1.43mg添加し、さらにアニソール15.82gを加え、加熱して溶媒であるTHF及びアニソールを揮発させて固形分が20質量%となるようにした以外は同様にして、近赤外線吸収性組成物37を調製した。
上記近赤外線吸収性組成物27の調製において、室温で16時間撹拌した後に、表IIに示した近赤外線吸収調整剤として、近赤外線吸収色素であるFDR004を0.60mgと、LumogenIR765(BASF社製)を1.43mg添加し、さらにアニソール15.82gを加え、加熱して溶媒であるTHF及びアニソールを揮発させて固形分が20質量%となるようにした以外は同様にして、近赤外線吸収性組成物38を調製した。
上記近赤外線吸収性組成物28の調製において、室温で16時間撹拌した後に、表IIに示した近赤外線吸収調整剤として、近赤外線吸収色素であるFDR004を0.60mgと、LumogenIR765(BASF社製)を1.43mg添加し、さらにアニソール15.82gを加え、加熱して溶媒であるTHF及びアニソールを揮発させて固形分が20質量%となるようにした以外は同様にして、近赤外線吸収性組成物39を調製した。
上記近赤外線吸収性組成物1の調製において、リン酸の添加量を9.25gとし、リン酸の含有量を15.0質量%に変更した以外は同様にして、比較例の近赤外線吸収性組成物40を調製した。
上記近赤外線吸収性組成物10の調製において、一般式(2)に係る化合物であるリン酸エチルエステルを、モノ(2-ヒドロキシエチルメタクリレート)ホスフェートに変更し、かつリン酸の除いた以外は同様にして、比較例の近赤外線吸収性組成物41を調製した。
上記近赤外線吸収性組成物1の調製において、リン酸を除いた以外は同様にして、比較例である近赤外線吸収性組成物42を調製した。
上記近赤外線吸収性組成物10の調製において、リン酸を除いた以外は同様にして、比較例である近赤外線吸収性組成物43を調製した。
上記近赤外線吸収性組成物16の調製において、リン酸を除いた以外は同様にして、比較例である近赤外線吸収性組成物44を調製した。
A208F:プライサーフA208F(ポリオキシエチレンアルキル(C8)エーテルリン酸エステル 第一工業製薬社製)
A208N:プライサーフA208N(ポリオキシエチレンアルキル(C12、13)エーテルリン酸エステル 第一工業製薬社製)
A215C:プライサーフA215C(ポリオキシエチレントリデシルリン酸エステル
第一工業製薬社製)
DDP-2:NIKKOL DDP-2(ポリオキシエチレンアルキル(C12~C15)エーテルリン酸(2E,O,ジ(C12~C15)パレス-2リン酸) 日光ケミカルズ社製)
DDP-4:NIKKOL DDP-4(ポリオキシエチレンアルキル(C12~C15)エーテルリン酸(4E,O,ジ(C12~C15)パレス-4リン酸) 日光ケミカルズ社製)
(一般式(2)で表される構造を有する化合物)
*1:モノ(2-ヒドロキシエチルメタクリレート)ホスフェート
《近赤外線吸収性組成物の評価》
上記調製した各近赤外線吸収性組成物について、下記の方法に従って、平均粒径、可視部(550nm)及び近赤外部(1000nm)の透過率の測定を行った。
上記調製した近赤外線吸収性組成物1~44について、粒子である銅錯体粒子の粒子濃度(固形分濃度)が1.0質量%となるように、トルエンで希釈した各評価サンプルAを調製した。
○:平均粒径が、50nm以上、100nm未満の範囲内である
△:平均粒径が、100nm以上、200nm未満の範囲内である
×:平均粒径が、200nm以上である
〔分光透過率の測定〕
上記平均粒径の測定で調製した各評価サンプルAを用い、測定装置として日本分光社製の分光光度計V-570により、300~1200nmの波長域範囲における分光透過率を測定した。次いで、可視部領域として550nm、近赤外部領域として1000nmにおける分光透過率について、下記の評価を行った
(可視部領域における透過率1の評価)
上記方法で測定した近赤外線吸収性組成物の550nmにおける透過率を、下記の基準に従ってランク付けを行い、可視部領域の透過率1の評価を行った。
○:透過率が、80%以上、90%未満である
△:透過率が、70%以上、80%未満である
×:透過率が、70%未満である
(近赤外部領域における透過率2の評価)
上記方法で測定した近赤外線吸収性組成物の750nmにおける透過率を、下記の基準に従ってランク付けを行い、近赤外部領域の透過率2の評価を行った。
○:透過率が、5%以上、15%未満である
△:透過率が、15%以上、25%未満である
×:透過率が、25%以上である
(近赤外部領域における透過率3の評価)
上記方法で測定した近赤外線吸収性組成物の1000nmにおける透過率を、下記の基準に従ってランク付けを行い、近赤外部領域の透過率3の評価を行った。
○:透過率が、3%以上、8%未満である
△:透過率が、8%以上、15%未満である
×:透過率が、15%以上である
以上により得られた結果を、表I及び表IIに示す。
《近赤外線吸収性膜の作製》
実施例1で調製した各近赤外線吸収性組成物に、ポリシロキサンシリコーン樹脂(KR-255、信越化学工業社製)を加えて撹拌して、近赤外線吸収性膜形成用の塗布液を調製した。調製した塗布液をスピンコーティングにより基板上に塗布して近赤外線吸収性膜1~44を作製した。
2、7 接着剤
3 ガラス基板
4 撮像レンズ
5 レンズホルダー
6 遮光兼電磁シールド
8 平坦化層
9 近赤外線吸収性膜(近赤外線カットフィルター)
10 固体撮像素子基板
11 ハンダボール
12 回路基板
13 撮像素子部
Claims (6)
- 近赤外線吸収剤と溶媒を含有する近赤外線吸収性組成物であって、
前記近赤外線吸収剤として、下記(A)成分及び下記(B)成分のうち少なくとも1つを含有し、かつ、
下記(A)成分又は下記(B)成分において、下式(I)で表される構造を有する化合物を、前記近赤外線吸収性組成物の全質量に対し0.001~10質量%の範囲内で含有する、
ことを特徴とする近赤外線吸収性組成物。
(A)成分:下記一般式(1)又は一般式(2)で表される構造を有する化合物の少なくとも一方と、下式(I)で表される構造を有する化合物と銅イオンから構成される成分
(B)成分:下記一般式(1)又は一般式(2)で表される構造を有する化合物の少なくとも一方と、下式(I)で表される構造を有する化合物と銅化合物との反応により得られる銅錯体から構成される成分
式(I)
O=P-(OH)3
上記一般式(2)において、R′は炭素数が1~18の範囲内にあるアルキル基、アリール基、アラルキル基、又はアルケニル基を表し、総炭素数は1~36の範囲内である。n′は1又は2であり、n′が1のときにR′は同一であっても異なっていてもよい。〕
- 固形分濃度が、5~50質量%の範囲内であることを特徴とする請求項1に記載の近赤外線吸収性組成物。
- 波長850nmにおける透過率を1.0%としたとき、450~550nmの波長領域における平均透過率が70%以上であることを特徴とする請求項1又は請求項2に記載の近赤外線吸収性組成物。
- 650~1000nmの波長範囲内に吸収極大波長を有する近赤外線吸収調整剤を含有することを特徴とする請求項1から請求項3までのいずれか一項に記載の近赤外線吸収性組成物。
- 請求項1から請求項4までのいずれか一項に記載の近赤外線吸収性組成物を用いたことを特徴とする近赤外線吸収性膜。
- 請求項5に記載の近赤外線吸収性膜を具備することを特徴とする固体撮像素子用イメージセンサー。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003215325A (ja) * | 2002-01-25 | 2003-07-30 | Kureha Chem Ind Co Ltd | 光学材料 |
WO2005111170A1 (ja) * | 2004-05-17 | 2005-11-24 | Kureha Corporation | 近赤外光吸収材料、近赤外光吸収性組成物及び積層体 |
JP2011099038A (ja) * | 2009-11-05 | 2011-05-19 | Kureha Corp | 近赤外線吸収剤及びその製造方法、並びに光学材料 |
JP2014142628A (ja) * | 2012-12-28 | 2014-08-07 | Fujifilm Corp | 赤外線反射膜形成用の硬化性樹脂組成物、赤外線反射膜及びその製造方法、並びに赤外線カットフィルタ及びこれを用いた固体撮像素子 |
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JP4422866B2 (ja) | 1999-09-16 | 2010-02-24 | 株式会社クレハ | 光学フィルタ及びその製造方法 |
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JP6043569B2 (ja) * | 2012-10-03 | 2016-12-14 | 富士フイルム株式会社 | 近赤外線吸収性組成物、これを用いた近赤外線カットフィルタ及びその製造方法、並びに、カメラモジュール及びその製造方法 |
WO2014129295A1 (ja) * | 2013-02-19 | 2014-08-28 | 富士フイルム株式会社 | 近赤外線吸収性組成物、これを用いた近赤外線カットフィルタおよびその製造方法、並びに、カメラモジュールおよびその製造方法 |
JP6305901B2 (ja) * | 2014-01-21 | 2018-04-04 | 富士フイルム株式会社 | 近赤外線吸収性組成物、近赤外線カットフィルタおよびその製造方法、ならびに、カメラモジュールおよびその製造方法 |
JP6066977B2 (ja) * | 2014-01-21 | 2017-01-25 | 富士フイルム株式会社 | 近赤外線吸収性組成物、近赤外線カットフィルタおよびその製造方法、ならびに、カメラモジュールおよびその製造方法 |
WO2017051512A1 (ja) * | 2015-09-24 | 2017-03-30 | 日本板硝子株式会社 | 赤外線吸収層用組成物、赤外線カットフィルタ、及び撮像装置 |
JP6709029B2 (ja) * | 2015-09-28 | 2020-06-10 | 富士フイルム株式会社 | 組成物、組成物の製造方法、膜、近赤外線カットフィルタ、固体撮像素子、カメラモジュールおよび画像表示装置 |
KR102091954B1 (ko) * | 2016-04-21 | 2020-03-20 | 니혼 이타가라스 가부시키가이샤 | 적외선 흡수성 조성물, 적외선 컷 필터, 및 촬상 광학계 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003215325A (ja) * | 2002-01-25 | 2003-07-30 | Kureha Chem Ind Co Ltd | 光学材料 |
WO2005111170A1 (ja) * | 2004-05-17 | 2005-11-24 | Kureha Corporation | 近赤外光吸収材料、近赤外光吸収性組成物及び積層体 |
JP2011099038A (ja) * | 2009-11-05 | 2011-05-19 | Kureha Corp | 近赤外線吸収剤及びその製造方法、並びに光学材料 |
JP2014142628A (ja) * | 2012-12-28 | 2014-08-07 | Fujifilm Corp | 赤外線反射膜形成用の硬化性樹脂組成物、赤外線反射膜及びその製造方法、並びに赤外線カットフィルタ及びこれを用いた固体撮像素子 |
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