WO2019210689A1 - 从机通信电路、从机、电器设备、主从机通信电路和方法 - Google Patents

从机通信电路、从机、电器设备、主从机通信电路和方法 Download PDF

Info

Publication number
WO2019210689A1
WO2019210689A1 PCT/CN2018/120598 CN2018120598W WO2019210689A1 WO 2019210689 A1 WO2019210689 A1 WO 2019210689A1 CN 2018120598 W CN2018120598 W CN 2018120598W WO 2019210689 A1 WO2019210689 A1 WO 2019210689A1
Authority
WO
WIPO (PCT)
Prior art keywords
slave
output
host
relay
communication circuit
Prior art date
Application number
PCT/CN2018/120598
Other languages
English (en)
French (fr)
Inventor
刘文斌
王星
贺小林
李洋
Original Assignee
珠海格力电器股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 珠海格力电器股份有限公司 filed Critical 珠海格力电器股份有限公司
Publication of WO2019210689A1 publication Critical patent/WO2019210689A1/zh

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/50—Control or safety arrangements characterised by user interfaces or communication
    • F24F11/54—Control or safety arrangements characterised by user interfaces or communication using one central controller connected to several sub-controllers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/88—Electrical aspects, e.g. circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0175—Coupling arrangements; Interface arrangements
    • H03K19/017545—Coupling arrangements; Impedance matching circuits
    • H03K19/017572—Coupling arrangements; Impedance matching circuits using opto-electronic devices

Definitions

  • the present disclosure relates to the field of communications technologies, and in particular, to a slave communication circuit, a slave, an electrical device, a master-slave communication circuit, and a method.
  • an electrical device having one host and at least one slave
  • the host simultaneously controls the operation of the plurality of slaves while the appliance is operating.
  • an air conditioner has a main control board and a plurality of compressors, and the main control board controls the operation of a plurality of compressors simultaneously during air conditioning operation.
  • a slave communication circuit including a slave universal asynchronous transceiver transmitter and an optocoupler output conversion circuit, wherein:
  • the slave universal asynchronous transceiver transmitter includes a slave signal transmitting end
  • the slave universal asynchronous transceiver transmitter is connected to the optocoupler output conversion circuit
  • the optocoupler output conversion circuit includes an output photocoupler and a relay, wherein the first input end of the output photocoupler is connected to the power source, the second input end of the output photocoupler is connected to the slave signal transmitting end; and the output photocoupler is The first output end is connected to the power source, the second output end of the output photocoupler is connected to the relay input end, and the relay output end is connected to the host signal receiving end of the host communication circuit.
  • the relay is a triode
  • the base of the triode is a relay input end
  • the collector of the triode is a relay output
  • the emitter of the triode is grounded.
  • the relay includes a relay coil, a relay moving contact, and a relay static contact, wherein:
  • the relay coil is the relay input end, the relay moving contact is the relay output end, and the relay static contact is grounded;
  • the relay coil is the relay input terminal, the relay static contact is the relay output terminal, and the relay dynamic contact is grounded.
  • the optocoupler output conversion circuit further includes a first resistor and a second resistor, wherein the first resistor is disposed in series between the second output end of the output photocoupler and the relay input terminal, One end of the second resistor is connected to the power source, and the other end of the second resistor is connected to the relay output end.
  • the output voltage of the relay output terminal is less than a predetermined value.
  • the output optocoupler includes a light emitting diode located in a primary loop and a phototransistor located in the secondary loop;
  • the anode of the light emitting diode is the first input end of the output photocoupler, the cathode of the light emitting diode is the second input end of the output photocoupler; the collector of the phototransistor is the first output end of the output photocoupler, and the emission of the phototransistor Extremely outputting the second output of the optocoupler.
  • a master-slave communication circuit including a host communication circuit and at least one slave communication circuit is provided, wherein
  • the slave communication circuit is the slave communication circuit as described in any of the above embodiments;
  • the host communication circuit includes a host communication interface that is connected to the slave communication interface of the at least one slave communication circuit through parallel lines.
  • the host communication interface includes a host signal sending interface and a host signal receiving interface, wherein the host signal sending interface is connected to the host signal sending end, and the host signal receiving interface is connected to the host signal receiving end;
  • the slave asynchronous transceiver transmitter includes a slave signal transmitting interface and a slave signal receiving interface;
  • the host signal transmitting interface is connected to the slave signal receiving interface of the at least one slave through a parallel line, and the host signal receiving interface is connected to the slave signal transmitting interface of the at least one slave through parallel lines.
  • the host communication circuit includes a host universal asynchronous transceiver transmitter and a power amplification circuit, wherein:
  • the host universal asynchronous transceiver transmitter includes a host signal transmitting end
  • the input end of the power amplifying circuit is connected to the signal transmitting end of the host to perform current amplification on the host signal;
  • An output of the power amplifying circuit is coupled to the at least one slave to transmit a master signal to the at least one slave.
  • a slave comprising the slave communication circuit as described in any of the above embodiments.
  • an electrical apparatus comprising a mainframe and at least one slave, wherein the slave is a slave as described in any of the above embodiments.
  • an electrical apparatus comprising a host, at least one slave, and a master-slave communication circuit as described in any of the above embodiments.
  • a master-slave communication method including:
  • a second output of the output photocoupler has a current output
  • the current output from the second output of the output photocoupler is such that the relay input is energized
  • the relay output In the case where the relay input is energized, the relay output outputs a low level.
  • the master-slave communication method further includes:
  • the host signal transmitting end sends the host signal to the power amplifying circuit
  • the power amplifying circuit performs current amplification on the host signal
  • the host universal asynchronous transceiver transmits the amplified host signal to at least one slave.
  • FIG. 1 is a schematic diagram of some embodiments of a UART optocoupler communication circuit.
  • FIG. 2 is a schematic diagram of some embodiments of a master-slave communication circuit of the present disclosure.
  • FIG. 3 is a schematic diagram of an optocoupler output conversion circuit in some embodiments of the present disclosure.
  • FIG. 4 is a schematic diagram of an optocoupler output conversion circuit in other embodiments of the present disclosure.
  • FIG. 5 is a schematic diagram of an optocoupler output conversion circuit in still another embodiment of the present disclosure.
  • FIG. 6 is a schematic diagram of still another embodiment of a master-slave communication circuit of the present disclosure.
  • FIG. 7 is a schematic diagram of still another embodiment of a master-slave communication circuit of the present disclosure.
  • FIG. 8 is a schematic diagram of still another embodiment of a master-slave communication circuit of the present disclosure.
  • FIG. 9 is a schematic diagram of some embodiments of an electrical device of the present disclosure.
  • Figure 10 is a schematic illustration of some embodiments of an electrical device of the present disclosure.
  • FIG. 11 is a schematic diagram of some embodiments of a master-slave communication method according to the present disclosure.
  • FIG. 12 is a schematic diagram of still another embodiment of a master-slave communication method according to the present disclosure.
  • Communication quality based on UART optocoupler communication is susceptible to the characteristics of optocoupler components. When the optocoupler is at high or low temperatures, the minimum level will change. In particular, in the case where the current transfer ratio is at the upper or lower limit, communication failures in which the minimum level is too high and the chip is not recognized are more likely to occur.
  • the hot ground refers to: in the circuit, if the reference ground level is connected with the external power grid through a rectifier bridge or a diode, etc., and has a direct electrical connection with the power grid, the ground level is called hot ground. That is, the current can flow from the ground level to the grid, and the voltage at which the ground level meets the earth is half of the voltage of the grid fire line, which is dangerous to the human body.
  • Floating refers to: in the circuit, the reference ground level has no actual electrical connection with the grid.
  • the ground level is called floating, such as connecting through isolated components such as transformers. This ground level is suspended, and any When the level is connected, it will be passively assimilated. If it is connected to the human body, the level of the entire floating position will remain the same as the human body level, and the human body will not be in danger of electric shock.
  • the circuit structure of the embodiment of FIG. 1 has limited output power, and cannot realize long-distance and multi-node communication, and can only perform one-to-one communication, and the communication quality is related to the transmission ratio of the optocoupler.
  • the optocoupler transmission bias limit or the ambient temperature bias limit the actual low level will occur above 0.8V, and the chip cannot recognize the low level and cause communication failure.
  • the circuit structure shown in FIG. 1 tends to prevent the secondary side of the optocoupler from entering deep saturation, and the output voltage on the secondary side is relatively high.
  • the output low level of the secondary side appears to be higher than 0.8V, so that the chip cannot recognize the low level and cause a communication failure.
  • the present disclosure provides a slave communication circuit, a slave, an electrical device, a master-slave communication circuit and a method, which can eliminate a low level caused by an optocoupler transmission ratio characteristic Impact.
  • the master-slave communication circuit may include a host communication circuit 10 and a slave communication circuit 20, wherein:
  • the master-slave communication circuit of the embodiment of Fig. 2 can be disposed in an electrical device including a host and at least one slave to implement communication between the master and the slave.
  • the host communication circuit 10 may be disposed on the host side
  • the slave communication circuit 20 may be disposed on the slave side.
  • the master-slave communication circuit of the embodiment of FIG. 2 may be disposed in an air conditioner including a main control board and at least one compressor, wherein the main unit of the air conditioner is a main control board, and the slave of the air conditioner is a compressor.
  • the host communication circuit 10 may be disposed on the air conditioner main control board, and the slave communication circuit 20 may be disposed on the compressor drive board.
  • the host communication circuit 10 includes a host communication interface 11
  • the slave communication circuit 20 includes a slave communication interface 21
  • the host communication interface 11 communicates with the slave communication interface 21 of at least one slave communication circuit 20 via parallel lines 30. connection.
  • the parallel lines 30 include a power line, a host signal transmission line, a host signal receiving line, and a ground line in order from top to bottom.
  • the host communication interface includes a host signal sending interface and a host signal receiving interface, wherein the host signal sending interface is connected to the host signal sending end, and the host signal receiving interface is connected to the host signal receiving end;
  • the slave asynchronous transceiver transmitter includes a slave signal transmitting interface and a slave signal receiving interface;
  • the host signal transmitting interface is connected to the slave signal receiving interface of the at least one slave through a parallel line, and the host signal receiving interface is connected to the slave signal transmitting interface of the at least one slave through parallel lines.
  • the slave communication circuit 20 may include a slave communication interface 21, a slave universal asynchronous transceiver 220, and an optocoupler output conversion circuit, where:
  • the slave universal asynchronous transceiver transmitter 22 includes a slave signal receiving terminal RXS and a slave signal transmitting terminal TXS.
  • the slave communication interface 21 is connected to the optocoupler output conversion circuit.
  • the optocoupler output conversion circuit can be a high and low level conversion circuit.
  • the optocoupler output conversion circuit may include an output photocoupler U1 and a relay Q3, wherein the first input end of the output photocoupler U1 is connected to the power source, and the second input end of the output photocoupler U1 and the slave signal transmitting end The first output end of the output photocoupler U1 is connected to the power source, the second output end of the output photocoupler U1 is connected to the relay input end, and the relay output end is connected to the host signal receiving end of the host communication circuit.
  • the output photocoupler U1 may include an illuminator located in the primary loop and a photodetector located in the secondary loop.
  • the illuminator may be a light emitting diode U11 located in a primary loop; the photodetector may be a phototransistor U12 located in a secondary loop.
  • the anode of the light emitting diode is the first input end of the output photocoupler, the cathode of the light emitting diode is the second input end of the output photocoupler; the collector of the phototransistor is the first output end of the output photocoupler, and the emission of the phototransistor Extremely outputting the second output of the optocoupler.
  • the anode of the light-emitting diode U11 is connected to the power source; the cathode of the light-emitting diode U11 is connected to the signal transmitting end of the slave; the collector of the phototransistor U12 is connected to the power source, the emitter of the phototransistor U12 is connected to the input end of the relay Q3, and the output of the relay Q3 is connected.
  • the terminal is connected to the host signal receiving terminal RX through the slave communication interface 21.
  • the output voltage of the output terminal of the relay Q3 is less than a predetermined value to ensure the partial limit of the optocoupler transmission or the extreme temperature of the ambient temperature. In this case, the low level signal of the slave can also be accurately identified.
  • the predetermined value may be 0.8V.
  • the relay Q3 may be a triode relay or a conventional relay.
  • the relay Q3 may be a triode relay, that is, the relay Q3 is a triode.
  • the base of the triode is the input end of the relay Q3
  • the collector of the triode is the output end of the relay Q3
  • the emitter of the triode is grounded.
  • the slave sends a signal through the optocoupler and level shifting circuit, as shown in Figure 2 and Figure 3.
  • the primary side (light emitting diode U11) of the output photocoupler U1 is turned on; in the case where the light emitting diode U11 is turned on, the photocoupler U1 is turned on.
  • the stage side (phototransistor U12) is turned on; the emitter current of the phototransistor U12 flows through the transistor Q3, so that the transistor Q3 is in operation.
  • the collector current of the transistor Q3 flows through the triode through R3, and the collector of the triode outputs a low level to the receiving side of the host, at which time the host receives a low level.
  • the triode In the actual communication process, if the secondary side voltage of the optocoupler exceeds 0.8V at the temperature limit due to the characteristics of the optocoupler, or reaches 1V, the triode is normally turned on, and the collector current ⁇ base current * ⁇ Still established, the triode is still saturated, and the Vce of the transistor Q3 will still be lower than 0.7V, which is at a normal low level.
  • the master-slave communication circuit provided by the above embodiment of the present disclosure is provided with a relay or a triode at the second output end of the output photocoupler to form a high-low level conversion circuit, thereby transmitting the partial coupling in the optocoupler
  • the slave's low level signal can also be accurately identified. Therefore, the above embodiments of the present disclosure solve the technical problem that the related art causes a communication failure when the actual low level is higher than 0.8V and the chip cannot recognize the low level in the case of the optocoupler transmission bias limit or the ambient temperature bias limit. .
  • the above embodiments of the present disclosure can eliminate the influence of the low level of the optocoupler transmission ratio characteristic, thereby improving the communication reliability, and enabling the host side chip to recognize the high and low levels in various situations.
  • the optocoupler output conversion circuit may further include a first resistor R1, a second resistor R2, and a third resistor R3, wherein:
  • the first resistor R1 is disposed in series between the emitter of the phototransistor U12 and the base of the triode relay Q3.
  • the first resistor R1 is used to drive the transistor Q3 to be turned on or to energize the relay coil when the phototransistor is turned on.
  • One end of the second resistor R2 is connected to the power source, and the other end of the second resistor R2 is connected to the output terminal of the relay Q3 (ie, the collector of the transistor relay Q3).
  • the second resistor R2 is used to ensure that the voltage at the output of the relay is low when the transistor Q3 is turned on or the relay contact is turned on.
  • One end of the third resistor R3 is connected to the power source, and the anode of the other end of the third resistor R3 is connected to the anode of the light-emitting diode U11.
  • R1 and R2 are generally equal in resistance selection to meet the requirements.
  • the resistance of R1 and R2 can be selected to be 1K ohm.
  • R2 may also be slightly larger than R1, making it easier to bring transistor Q3 into the saturation region.
  • the first resistor R1, the second resistor R2, and the third resistor R3 are pull-up resistors.
  • the resistance of the third resistor R3 may be 680 ohms.
  • the slave when the slave transmits a high level signal (1 signal), the primary side of the photocoupler U1 is not turned on, the secondary side has no current signal, the transistor Q3 does not operate, and the triode is set.
  • the electrode output is a high level signal (1 signal), and the host receives a high level.
  • the embodiment of Figures 2 and 3 of the present disclosure employs a method of adding a triode at a second output end of the output photocoupler (e.g., phototransistor emitter), which can remove the extreme temperature characteristics and the limiting current transfer ratio characteristic of the optocoupler element.
  • the effect of low level is too high.
  • the host side chip of the above embodiment of the present disclosure can recognize high and low levels in various situations, and is safe and reliable.
  • the slave communication circuit 20 may further include an optocoupler input conversion circuit, wherein:
  • the input of the optocoupler input conversion circuit is connected to the host signal transmitting terminal TX through the slave communication interface 21 to receive the host signal.
  • the output of the optocoupler input conversion circuit is connected to the slave signal receiving terminal RXS.
  • the slave communication circuit of the foregoing embodiment of the present disclosure can also conveniently receive the host signal sent by the host.
  • the optocoupler input conversion circuit includes an input photocoupler U2 including a primary side light emitting diode U21 and a secondary side photodiode U22, among them:
  • the anode of the light-emitting diode U21 is connected to the power source, and the cathode of the light-emitting diode U21 is connected to the host signal transmitting terminal TX via the slave communication interface 21.
  • the collector of the photodiode U22 is connected to the slave signal receiving terminal RXS, and the emitter of the photodiode U22 is grounded.
  • the optocoupler input conversion circuit may further include a fourth resistor R4, wherein:
  • One end of the fourth resistor R4 is connected to the power source, and the other end of the fourth resistor R4 is connected to the collector of the photodiode U22.
  • the resistance of the fourth resistor R4 may be 1 k ohm.
  • the host communication circuit 10 may further include a fifth resistor R5, wherein:
  • One end of the fifth resistor R5 is connected to the host signal transmitting terminal TX, and the other end of the fifth resistor R5 is connected to the host signal transmitting interface of the host communication interface 11.
  • the resistance of the fifth resistor R5 may be 680 ohms.
  • the supply voltage VCC may be 3.3V.
  • the host communication circuit 10 may further include a first capacitor C1 and a second capacitor C2, and the slave communication circuit 20 may further include a third capacitor C3, wherein:
  • one end of the first capacitor C1 is connected to the host signal transmitting end TX, and the other end of the first capacitor C1 is grounded; one end of the second capacitor C2 is connected to the host signal receiving end RX, and the other end of the second capacitor C2 is grounded.
  • the first capacitor C1 and the second capacitor C2 are used for filtering to reduce system interference.
  • one end of the third capacitor C3 is connected to the slave signal receiving interface, and the other end of the third capacitor C3 is connected to the power source.
  • the first capacitor C1, the second capacitor C2, and the third capacitor C3 may be filter capacitors.
  • the capacities of the first capacitor C1, the second capacitor C2, and the third capacitor C3 may each be 1 nF.
  • the slave signal receiving terminal RXS receives a high level signal.
  • the slave signal receiving terminal RXS receives the low level signal.
  • the relay Q3 can be a conventional relay.
  • the relay Q3 includes a relay coil 41, a relay moving contact 42, and a relay static contact 43, wherein:
  • the relay coil 41 is the input end of the relay Q3, the relay moving contact 42 is the output end of the relay Q3, and the relay static contact 43 is grounded.
  • the primary side (light emitting diode U11) of the output photocoupler U1 is turned on; in the case where the light emitting diode U11 is turned on, the photocoupler U1 is turned on.
  • the stage side (phototransistor U12) is turned on; the emitter current of the phototransistor U12 flows through the relay coil 41, so that the relay coil 41 is energized.
  • the relay moving contact 42 In the case where the relay coil 41 is energized, the relay moving contact 42 is closed, the relay moving contact 42 is in communication with the relay stationary contact 43, and the relay moving contact 42 outputs a low level to the receiving side of the host.
  • the slave when the slave sends a high level signal (1 signal), the primary side of the photocoupler U1 is not conducting, the secondary side has no current signal, and the relay coil 41 is not energized, the relay The moving contact 42 is a high level signal (1 signal), and the host receives a high level.
  • the above embodiment of the present disclosure provides a relay at the second output end of the output photocoupler to form a high-low level conversion circuit, thereby being capable of removing the extreme temperature characteristic of the optocoupler element and the low level of the limit current transfer ratio characteristic. Impact.
  • the host side chip of the above embodiment of the present disclosure can recognize high and low levels in various situations, and is safe and reliable.
  • FIG. 5 is a schematic diagram of an optocoupler output conversion circuit in still another embodiment of the present disclosure.
  • the relay Q3 includes a relay coil 41, a relay moving contact 42, and a relay static contact 43, wherein:
  • the relay coil 41 is the input end of the relay Q3, the relay static contact 43 is the output end of the relay Q3, and the relay moving contact 42 is grounded.
  • the primary side (light emitting diode U11) of the output photocoupler U1 is turned on; in the case where the light emitting diode U11 is turned on, the photocoupler U1 is turned on.
  • the stage side (phototransistor U12) is turned on; the emitter current of the phototransistor U12 flows through the relay coil 41, so that the relay coil 41 is energized.
  • the relay moving contact 42 In the case where the relay coil 41 is energized, the relay moving contact 42 is closed, the relay moving contact 42 is in communication with the relay stationary contact 43, and the relay stationary contact 43 outputs a low level to the receiving side of the host.
  • the voltage difference between the relay moving contact 42 and the relay stationary contact 43 is less than 0.7 V, which is at a normal low level.
  • the slave when the slave sends a high level signal (1 signal), the primary side of the photocoupler U1 is not conducting, the secondary side has no current signal, and the relay coil 41 is not energized, the relay The static contact 43 is a high level signal (1 signal), and the host receives a high level.
  • the master-slave communication circuit provided according to the embodiment of FIG. 4 or FIG. 5 of the present disclosure may specifically be a slave communication circuit, which adopts a method of adding a conventional relay at a second output end of the output photocoupler (for example, a phototransistor emitter).
  • the slave's low level signal can also be accurately identified. Therefore, the above embodiments of the present disclosure solve the technical problem that the related art causes a communication failure when the actual low level is higher than 0.8V and the chip cannot recognize the low level in the case of the optocoupler transmission bias limit or the ambient temperature bias limit. .
  • the master-slave communication circuit may include a host communication circuit 10 and at least two slave communication circuits 20, wherein:
  • the master-slave communication circuit of the embodiment of Fig. 6 can be disposed in an electrical device including a host and at least two slaves to implement communication between the master and the slave.
  • the host communication circuit 10 may be disposed on the host side, and at least two slave communication circuits 20 may be respectively disposed on different slave sides.
  • the master-slave communication circuit of the embodiment of FIG. 6 may be disposed in an air conditioner including a main control board and at least two compressors, wherein the main unit of the air conditioner is a main control board, and the slave of the air conditioner is a compressor.
  • the host communication circuit 10 may be disposed on the air conditioner main control board, and the slave communication circuit 20 may be disposed on the compressor drive board.
  • the structure of the at least two slave communication circuits 20 is identical.
  • the host communication circuit 10 can be connected to at least one slave communication circuit 20 through parallel lines.
  • the parallel lines 30 include, from top to bottom, a power line, a host signal transmission line, a host signal receiving line, and a ground line.
  • the host communication circuit 10 includes a host universal asynchronous transceiver 12 and a power amplifier circuit 13, wherein:
  • the host universal asynchronous transceiver transmitter 12 includes a host signal transmitting terminal TX and a host signal receiving terminal RX.
  • the input end of the power amplifying circuit 13 is connected to the host signal transmitting terminal TX to perform current amplification on the host signal.
  • An output of the power amplifying circuit 13 is coupled to at least one slave to transmit a master signal to at least one slave.
  • the host communication circuit 10 may further include a sixth resistor R6 and a seventh resistor R7, wherein:
  • One end of the sixth resistor R6 is connected to the host signal receiving end RX, and the other end of the sixth resistor R6 is connected to at least one slave through a host receiving line.
  • One end of the seventh resistor R7 is connected to the power source, and the other end is connected to the sixth resistor R6.
  • the resistance of the sixth resistor R6 and the seventh resistor R7 may be 1 k ohm.
  • the slave communication circuit 20 may include a slave universal asynchronous transceiver 220, an optocoupler output conversion circuit, and an optocoupler input conversion circuit, wherein:
  • the slave universal asynchronous transceiver transmitter 22 includes a slave signal receiving terminal RXS and a slave signal transmitting terminal TXS.
  • the optocoupler output conversion circuit can include an output photocoupler U1 and a third resistor R3, wherein the output photocoupler U1 includes a light emitting diode U11 in the primary loop and a phototransistor U12 in the secondary loop.
  • the anode of the light-emitting diode U11 is connected to the power source through the third resistor R3; the cathode of the light-emitting diode U11 is connected to the signal transmitting end of the slave; the collector of the phototransistor U12 is connected to the host signal receiving end RX, and the emitter of the phototransistor U12 is grounded.
  • the optocoupler input conversion circuit may include an input photocoupler U2, a third capacitor C3, a fourth resistor R4, and an eighth resistor R8, wherein
  • the input photocoupler U2 may include a light emitting diode U21 on the primary side and a photodiode U22 on the secondary side.
  • the optocoupler input conversion circuit includes an input photocoupler U2 including a primary side light emitting diode U21 and a secondary side photodiode U22, among them:
  • the anode of the light-emitting diode U21 is connected to the power source through the eighth resistor R8, and the cathode of the light-emitting diode U21 is connected to the host signal transmitting terminal TX.
  • the resistance of the eighth resistor R8 may be 680 ohms.
  • the collector of the photodiode U22 is connected to the slave signal receiving terminal RXS, and the emitter of the photodiode U22 is grounded.
  • One end of the fourth resistor R4 is connected to the power source, and the other end of the fourth resistor R4 is connected to the collector of the photodiode U22.
  • One end of the third capacitor C3 is connected to the anode of the light-emitting diode U21, and the other end of the third capacitor C3 is connected to the cathode of the light-emitting diode U21.
  • the slave signal receiving terminal RXS receives a high level signal.
  • the light emitting diode U21 is turned on in each of the slave communication circuits, the photodiode U22 is turned on, and the collector of the photodiode U22 outputs a low level. Therefore, the slave signal receiving terminal RXS receives the low level signal.
  • the host signal receiving end RX of the host communication circuit 10 may also be coupled to at least one slave for receiving a slave signal transmitted by at least one slave.
  • the light-emitting diode U11 of the output photocoupler U1 is driven to emit light through the third resistor R3, and the phototransistor U12 of the output photocoupler U1 is turned on. Since the emitter of the phototransistor U12 is grounded, after the phototransistor U12 is turned on, the level of the collector of the phototransistor U12 is pulled to a low level, and the host receives a low level signal of 0.
  • each slave of the electrical device transmits a high level signal 1
  • the light emitting diode U11 does not emit light, and at this time, the host receives the high level signal 1.
  • the master-slave communication circuit of the above embodiment of the present disclosure comprises a host communication circuit and a plurality of slave communication circuits, wherein the host communication circuit is disposed on a main control board on the host side of the electrical device, and the slave communication circuit is disposed on the slave side of the electrical device Driver board.
  • the current UART technology is designed to be a master-to-one slave.
  • the current provided by the master chip is limited. When multiple slaves are available, the host cannot provide enough current to cause communication failure.
  • the applicant sets a power amplifying circuit at the transmitting end of the UART of the host communication circuit, and performs current amplification processing on the signal output by the UART through the power amplifying circuit, so that the amplified current signal can drive the photocoupler in each driving board, thereby
  • the communication between the host and the plurality of slaves in the electrical device is realized. Since the above embodiment of the present disclosure does not need to use a dedicated chip, the communication circuit disclosed in the above embodiment of the present disclosure effectively reduces the system cost with respect to the 485 communication mode.
  • the power amplifying circuit 13 of the embodiment of FIG. 6 may be a two-stage power amplifying circuit, a three-stage power amplifying circuit, or a higher-level power amplifying circuit.
  • the number of levels of the power amplifying circuit 13 can be determined according to the demand of the number of slaves. After the amplified communication current, the current is determined according to the number of slaves, and then the current amplification factor and the corresponding power amplification circuit level are determined. According to the circuit for amplification, for the secondary power amplifier circuit, the maximum amplification of the current is the amplification factor product of the two transistors.
  • FIG. 7 is a schematic diagram of still another embodiment of a master-slave communication circuit of the present disclosure. Compared with the embodiment of Fig. 6, the specific structure of the secondary power amplifying circuit is given in the embodiment of Fig. 7.
  • the host communication circuit 10 can be connected to at least one slave communication circuit 20 via parallel lines 30.
  • the parallel lines 30 include a power line, a host signal transmission line (TX_BUS), a host signal receiving line, and a ground line, from top to bottom.
  • TX_BUS host signal transmission line
  • TX_BUS host signal receiving line
  • ground line from top to bottom.
  • the host signal transmitting interface is connected to the slave signal receiving interface of at least two slaves through a host signal transmitting line in the parallel line 30, and the host signal receiving interface passes the host signal receiving line in the parallel line 30 and the slave of at least two slaves
  • the machine signal transmission interface is connected.
  • the secondary power amplifier circuit may include a first transistor Q1 and a second transistor Q2, wherein the first transistor Q1 is a PNP type transistor, The two transistor Q2 is an NPN type triode.
  • the emitter of the first transistor Q1 is connected to the DC power source VCC, and the base of the first transistor Q1 is connected to the transmitting terminal TX of the UART of the main control board 1 through the thirteenth resistor R13, and at the same time, the first transistor The base of Q1 is connected to the DC power source VCC through the eleventh resistor R11.
  • the base of the second transistor Q2 is connected to the collector of the first transistor Q1 through the twelfth resistor R12, while the base of the second transistor Q2 is grounded through the ninth resistor R9, and the second transistor Q2
  • the emitter is grounded, the collector of the second transistor Q2 is connected to the DC power source VCC through the tenth resistor R10, and the collector of the second transistor Q2 is connected to the cathode of the Zener diode ZD1, and the anode of the Zener diode ZD1 is grounded.
  • the collector of the second transistor Q2 is the output of the power amplifying circuit.
  • the output terminal TX of the UART of the main control board 1 drives the first transistor Q1 to conduct through the thirteenth resistor R13, and the collector of the first transistor Q1 at this time
  • the side current is amplified by ⁇ times, and the amplified current is further turned on by the twelfth resistor R12 to drive the second transistor Q2, and the current is second amplified by the second transistor Q2, flowing through the second transistor Q2.
  • the collector current is again amplified by a factor of ⁇ , and the current flowing through the illuminator of the input photocoupler U2 of each of the drive plates is the amplified current.
  • the illuminators in the input photocoupler U2 of the respective driving boards emit light, and the photoreceiver of the driving input photocoupler U2 is turned on, resulting in the electric power of the first output end of the input photocoupler U2 (the collector of the photodiode U22).
  • the flat is pulled low and the slave receives 0.
  • the power amplifying circuit 11 When the host of the electrical device transmits 1, the power amplifying circuit 11 does not operate, and the illuminator of the input photocoupler U2 in the driving board of each slave does not emit light, and at this time, the slave receives 1.
  • the resistance of the thirteenth resistor R13 and the twelfth resistor R12 may be 5.1 k ohms.
  • the fifth resistor R5 of the host transmitting end drives the first transistor Q1, and the current on the collector side is amplified by ⁇ times, and the amplified current is driven by another 5.1K resistor (the twelfth resistor R12) to drive the common emitter second.
  • Transistor Q2 performs second-stage amplification, and the current is amplified by a factor of ⁇ . This amplified current can be equivalent to 485 communication when communicating within 8 meters, thus meeting the multi-level node communication requirements.
  • the resistance of the ninth resistor R9 may be 5.1 k ohms; the resistance of the tenth resistor R10 may be 1 k ohms.
  • the host communication circuit may further include a first capacitor C1, a second capacitor C2, and a fourth capacitor C4, and the structure thereof is as shown in FIG. 7. Specifically, the collector of the second transistor Q2 is grounded through the first capacitor C1, the base of the second transistor Q2 is grounded through the fourth capacitor C4, and the common end of the first resistor R1 and the second resistor R2 is passed through the second Capacitor C2 is grounded.
  • the first capacitor C1, the second capacitor C2, and the fourth capacitor C4 in the host communication circuit system interference can be reduced.
  • the capacity of the fourth capacitor C4 may be 1 nF.
  • the host communication circuit 10 may include a host communication interface 11, and the slave communication circuit 20 includes a slave communication interface 21.
  • the host communication interface 11 is connected to the slave communication interface 21 of at least two slave communication circuits 20 via parallel lines 30.
  • the above embodiment of the present disclosure can conveniently realize the expansion of the number of slave communication circuits in the master-slave communication circuit through the host communication interface and the slave communication interface.
  • the slave communication interface 21 and the host communication interface 11 can be implemented as a socket.
  • the host communication circuit 10 and each of the slave communication circuits 20 can be connected by a socket.
  • the main control board is connected.
  • the needle holder can be used to quickly expand.
  • the host communication interface 11 includes a host signal transmission interface and a host signal reception interface
  • the slave communication interface 21 includes a slave signal transmission interface and a slave signal reception interface, wherein the host signal transmission interface passes through the parallel
  • the master signal transmission line in line 30 is connected to the slave signal receiving interfaces of at least two slaves
  • the master signal receiving interface is connected to the slave signal transmitting interfaces of at least two slaves through a host signal receiving line in parallel line 30.
  • FIG. 8 is a schematic diagram of still another embodiment of a master-slave communication circuit of the present disclosure.
  • the embodiment of FIG. 8 differs from the embodiment of FIG. 7 only in that the optocoupler output conversion circuit of the slave side of the embodiment of FIG. 7 is replaced with the optocoupler output conversion circuit of any of FIGS.
  • the slave side optocoupler output conversion circuit may include an output photocoupler U1 and a relay Q3, wherein the output photocoupler U1 includes a light emitting diode U11 located in the primary loop and a photosensitive light located in the secondary loop.
  • the anode of the light-emitting diode U11 is connected to the power source through the third resistor R3; the cathode of the light-emitting diode U11 is connected to the signal transmitting end of the slave; the collector of the phototransistor U12 is connected to the power source, and the emitter of the phototransistor U12 passes through the first resistor R1 and the relay
  • the input of Q3 for example, the base of transistor Q3
  • the output of relay Q3 for example, the collector of transistor Q3
  • the secondary side second resistor R2 similar to any of the embodiments of FIGS. 2-5 can be moved to the receiving end of the host side to prevent the circuit from having multiple nodes. Resistor R2 will be connected in parallel to change the overall slave transmission resistance in the circuit.
  • FIG. 8 embodiment combines any of the embodiments of FIG. 2 to FIG. 5 with the embodiment of FIG. 6 or FIG. 7, whereby the embodiment of FIG. 8 can implement multi-node UART communication as shown in the embodiment of FIG. 6 or FIG. Air conditioning industry communication cost; and can remove the extreme temperature effect of the optocoupler element and the low level effect caused by the limit current transfer ratio characteristic as in any of the embodiments of FIG. 2 to FIG. 5, the host side chip is in various situations. Both can recognize high and low levels, safe and reliable.
  • the above embodiment of the present disclosure provides a multi-node UART optocoupler isolation communication circuit, which is a multi-node UART communication circuit that automatically adapts to an optocoupler, which can eliminate the influence of the low-level high level caused by the optocoupler transmission ratio characteristic. .
  • the above embodiments of the present disclosure can reduce the communication cost of the air conditioner industry.
  • the above embodiments of the present disclosure can also improve the communication reliability, so that the high and low levels are at the normal level that the chip can recognize, and the host side chip can recognize the high and low levels under various conditions.
  • the electrical device may include a host 1 and at least one slave 2, wherein:
  • the electrical device may be an air conditioner including a main control panel and at least one compressor.
  • the host 1 is the main control board, and the slave 2 can be the compressor.
  • Host 1 may include host communication circuitry 10 as described in any of the above embodiments (e.g., any of Figures 2-8).
  • Slave 2 may include slave communication circuitry 20 as described in any of the above embodiments (e.g., any of Figures 2-8).
  • multi-node UART communication can be realized to reduce the communication cost of the electrical appliance industry such as air conditioner.
  • the above embodiments of the present disclosure can also eliminate the influence of the low level of the optocoupler transmission ratio characteristic, thereby improving the communication reliability, so that the high and low levels are at the normal level that the chip can recognize, and the host side chip is in various situations. Both can recognize high and low levels.
  • FIG. 10 is a schematic illustration of some embodiments of an electrical device of the present disclosure.
  • the electrical equipment may include a host 1, at least one slave 2, and a master-slave communication circuit 3, wherein:
  • the electrical device may be an air conditioner including a main control panel and at least one compressor.
  • the host 1 is the main control board, and the slave 2 can be the compressor.
  • the master-slave communication circuit 3 can be a master-slave communication circuit as described in any of the above embodiments (e.g., any of the embodiments of Figures 2-8).
  • multi-node UART communication can be implemented to reduce communication costs of the electrical industry such as air conditioners.
  • the above embodiments of the present disclosure can also eliminate the influence of the low level of the optocoupler transmission ratio characteristic, thereby improving the communication reliability, so that the high and low levels are at the normal level that the chip can recognize, and the host side chip is in various situations. Both can recognize high and low levels.
  • FIG. 11 is a schematic diagram of some embodiments of a master-slave communication method according to the present disclosure.
  • the embodiment can be executed by the master-slave communication circuit described in any of the embodiments of FIG. 2 to FIG. 5 and FIG.
  • the method can include:
  • Step 111 in the slave communication circuit 20 as described in any of the above embodiments (for example, any of the embodiments of FIG. 2 to FIG. 5 and FIG. 8), in the case where the slave signal transmitting end outputs a low level signal
  • the second output of the output photocoupler U1 has a current output.
  • the output photocoupler U1 includes the light emitting diode U11 and the phototransistor U12
  • the emission of the phototransistor U12 is extremely outputted to the second output of the photocoupler U1.
  • the phototransistor U12 is turned on when the light-emitting diode U11 is turned on, and the emitter of the phototransistor U12 has a current output.
  • step 112 the current output from the second output of the output photocoupler U1 is such that the input of the relay Q3 is energized.
  • step 113 in the case where the input terminal of the relay Q3 is energized, the output terminal of the relay Q3 outputs a low level.
  • the low-level signal of the slave can also be accurately identified. Therefore, the above embodiments of the present disclosure solve the technical problem that the related art causes a communication failure when the actual low level is higher than 0.8V and the chip cannot recognize the low level in the case of the optocoupler transmission bias limit or the ambient temperature bias limit. .
  • the master-slave communication method may further include: in the host communication circuit 10 as described in any of the above embodiments (for example, the embodiment of FIG. 8), the host signal transmitting end TX power
  • the amplifying circuit 13 transmits a host signal; the power amplifying circuit 13 performs current amplification on the host signal; and the host communication interface 11 transmits the amplified host signal to at least one slave 2.
  • the master-slave communication method provided by the above embodiments of the present disclosure can not only realize multi-node UART communication, but also reduce the communication cost of the electric appliance industry such as air conditioner.
  • the above embodiments of the present disclosure can also eliminate the influence of the low level of the optocoupler transmission ratio characteristic, thereby improving the communication reliability, so that the high and low levels are at the normal level that the chip can recognize, and the host side chip is in various situations. Both can recognize high and low levels.
  • FIG. 12 is a schematic diagram of still another embodiment of a master-slave communication method according to the present disclosure.
  • the present embodiment can be performed by the master-slave communication circuit described in any of the embodiments of Figures 6-8 of the present disclosure.
  • the method can include:
  • Step 121 in the host communication circuit 10 as described in any of the above embodiments (for example, any of the embodiments of FIG. 6 to FIG. 8), the host signal transmitting end TX transmits a host signal to the power amplifying circuit 13;
  • Step 122 the power amplifying circuit 13 performs current amplification on the host signal
  • step 123 the host communication interface 11 transmits the amplified host signal to at least one slave 2.
  • the master-slave communication method provided by the above embodiments of the present disclosure can eliminate the influence of the low-level high level caused by the optocoupler transmission ratio characteristic.
  • the above embodiments of the present disclosure can reduce the communication cost of the air conditioner industry.
  • the above embodiments of the present disclosure can also improve the communication reliability, so that the high and low levels are at the normal level that the chip can recognize, and the host side chip can recognize the high and low levels under various conditions.
  • the methods and systems of the present disclosure may be implemented in a number of ways.
  • the methods and systems of the present disclosure may be implemented in software, hardware, firmware, or any combination of software, hardware, or firmware.
  • the above-described sequence of steps for the method is for illustrative purposes only, and the steps of the method of the present disclosure are not limited to the order specifically described above unless otherwise specifically stated.
  • the present disclosure may also be embodied as programs recorded in a recording medium, the programs including machine readable instructions for implementing a method in accordance with the present disclosure.
  • the present disclosure also covers a recording medium storing a program for executing the method according to the present disclosure.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Dc Digital Transmission (AREA)
  • Electronic Switches (AREA)

Abstract

本公开涉及通信技术领域，公开一种从机通信电路、从机、电器设备、主从机通信电路和方法。该从机通信电路包括从机通用异步收发传输器和光耦输出转换电路，其中，从机通用异步收发传输器包括从机信号发送端；光耦输出转换电路的第一输入端与电源连接，输出光电耦合器的第二输入端与从机信号发送端连接；输出光电耦合器的第一输出端与电源连接，输出光电耦合器的第二输出端与继电器输入端连接，继电器输出端与主机通信电路的主机信号接收端连接。本公开可以消除光耦传输比特性带来的低电平偏高的影响，从而提高通讯可靠性，使主机侧芯片在各种情况下均能识别高低电平。

Description

从机通信电路、从机、电器设备、主从机通信电路和方法
相关申请的交叉引用
本申请是以CN申请号为201810413923.8，申请日为2018年5月3日的申请为基础，并主张其优先权，该CN申请的公开内容在此作为整体引入本申请中。
技术领域
本公开涉及通信技术领域，特别涉及一种从机通信电路、从机、电器设备、主从机通信电路和方法。
背景技术
对于具有一个主机和至少一个从机的电器设备，在电器设备运行时，该主机要同时控制多个从机的运行。例如：空调具有主控制板和多个压缩机，在空调运行期间，该主控制板要同时控制多个压缩机的运行。
发明内容
根据本公开的一个方面，提供一种从机通信电路，包括从机通用异步收发传输器和光耦输出转换电路，其中：
从机通用异步收发传输器包括从机信号发送端；
从机通用异步收发传输器与光耦输出转换电路连接；
光耦输出转换电路包括输出光电耦合器和继电器，其中，输出光电耦合器的第一输入端与电源连接，输出光电耦合器的第二输入端与从机信号发送端连接；输出光电耦合器的第一输出端与电源连接，输出光电耦合器的第二输出端与继电器输入端连接，继电器输出端与主机通信电路的主机信号接收端连接。
在本公开的一些实施例中，所述继电器为三极管，三极管的基极为继电器输入端，三极管的集电极为继电器输出端，三极管的发射极接地。
在本公开的一些实施例中，所述继电器包括继电器线圈、继电器动触点和继电器静触点，其中：
继电器线圈为继电器输入端，继电器动触点为继电器输出端，继电器静触点接地；
或者，
继电器线圈为继电器输入端，继电器静触点为继电器输出端，继电器动触点接地。
在本公开的一些实施例中，所述光耦输出转换电路还包括第一电阻和第二电阻，其中，第一电阻串联设置在输出光电耦合器的第二输出端与继电器输入端之间，第二电阻的一端与电源连接，第二电阻的另一端与继电器输出端连接。
在本公开的一些实施例中，在从机信号发送端的发送信号为低电平的情况下，继电器输出端的输出电压小于预定值。
在本公开的一些实施例中，所述输出光电耦合器包括位于初级回路中的发光二极管和位于次级回路中的光敏三极管；
发光二极管的正极为输出光电耦合器的第一输入端，发光二极管的负极为输出光电耦合器的第二输入端；光敏三极管的集电极为输出光电耦合器的第一输出端，光敏三极管的发射极为输出光电耦合器的第二输出端。
根据本公开的另一方面，提供一种主从机通信电路，包括主机通信电路和至少一个从机通信电路，其中，
从机通信电路为如上述任一实施例所述的从机通信电路；
主机通信电路包括主机通信接口，主机通信接口通过平行线与至少一个从机通信电路的从机通信接口连接。
在本公开的一些实施例中，主机通信接口包括主机信号发送接口和主机信号接收接口，其中，主机信号发送接口与主机信号发送端连接，主机信号接收接口与主机信号接收端连接；
从机异步收发传输器包括从机信号发送接口和从机信号接收接口；
主机信号发送接口通过平行线与至少一个从机的从机信号接收接口连接，主机信号接收接口通过平行线与至少一个从机的从机信号发送接口连接。
在本公开的一些实施例中，主机通信电路包括主机通用异步收发传输器和功率放大电路，其中：
主机通用异步收发传输器包括主机信号发送端；
功率放大电路的输入端与主机信号发送端连接，对主机信号进行电流放大；
功率放大电路的输出端与至少一个从机连接，以便向至少一个从机发送主机信号。
根据本公开的另一方面，提供一种从机，包括如上述任一实施例所述的从机通信电路。
根据本公开的另一方面，提供一种电器设备，包括主机和至少一个从机，其中，从机为如上述任一实施例所述的从机。
根据本公开的另一方面，提供一种电器设备，包括主机、至少一个从机、以及如上述任一实施例所述的主从机通信电路。
根据本公开的另一方面，提供一种主从机通信方法，包括：
在如上述任一实施例所述的从机通信电路中，在从机信号发送端输出低电平信号的情况下，
输出光电耦合器的第二输出端有电流输出；
输出光电耦合器的第二输出端输出的电流使得继电器输入端得电；
在继电器输入端得电的情况下，继电器输出端输出低电平。
在本公开的一些实施例中，所述主从机通信方法还包括：
在如上述任一实施例所述的主机通信电路中，主机信号发送端向功率放大电路发送主机信号；
功率放大电路对主机信号进行电流放大；
主机通用异步收发传输器将放大后的主机信号发送到至少一个从机。
附图说明
为了更清楚地说明本公开实施例或相关技术中的技术方案，下面将对实施例或相关技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1为UART光耦通信电路一些实施例的示意图。
图2为本公开主从机通信电路一些实施例的示意图。
图3为本公开一些实施例中光耦输出转换电路的示意图。
图4为本公开另一些实施例中光耦输出转换电路的示意图。
图5为本公开又一些实施例中光耦输出转换电路的示意图。
图6为本公开主从机通信电路另一些实施例的示意图。
图7为本公开主从机通信电路再一些实施例的示意图。
图8为本公开主从机通信电路另一些实施例的示意图。
图9为本公开电器设备一些实施例的示意图。
图10为本公开电器设备一些实施例的示意图。
图11为本公开主从机通信方法一些实施例的示意图。
图12为本公开主从机通信方法另一些实施例的示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
申请人发现：相关技术空调等电器设备行业的通信方式有两种：485通信和UART(Universal Asynchronous Receiver/Transmitter，通用异步收发传输器)光耦通信。基于485通信，可以在一个主机和多个从机之间进行集中通信，实现多套机组共联。但是基于485通信成本较高，需要专用的芯片。
基于UART光耦通信方式的通信质量容易受光耦元器件特性的影响。光耦在高温或低温时，最小电平会出现变化。特别是电流传输比在上限或下限的情况下，更容易出现最小电平过高、芯片无法识别的通信故障。
图1为UART光耦通信电路一些实施例的示意图。如图1所示，相关技术的UART光耦隔离通信电路。该电路结构简单，成本低廉，只需两个光耦即可实现热地和浮地主板的板间通信。其中，热地指的是：在电路中，如参考地电平与外界电网通过整流桥或二极管等连接，与电网有直接电气连接，该地电平称为热地。即电流可以从该地电平向电网流通，地电平相遇大地的电压为电网火线电压的一半，对人体危险。浮地指的是：电路中，参考地电平与电网无实际电气连接，该地电平称为浮地，如通过变压器等隔离型元器件连接，这种地电平是悬浮的，与任何电平连通时，都会被动同化，如与人体连接，则整个浮地的电平都保持与人体电平一致，人体不会有触电危险。
图1实施例的电路结构输出功率有限，无法实现长距离和多节点通信，只能进行一对一通信，且通信质量与光耦的传输比有关。在光耦传输偏极限或环境温度偏极限时，实际低电平会出现高于0.8V的情况，芯片无法识别该低电平而造成通信故障。
例如：由于光耦的特性，在电流传输比偏下限的情况下，图1所示的电路结构容易使光耦次级侧不能进入深度饱和，次级侧的输出电压偏高。次级侧的输出低电平出现高于0.8V的情况，由此芯片无法识别该低电平而造成通信故障。
鉴于相关技术技术问题中的至少一个，本公开提供了一种从机通信电路、从机、电器 设备、主从机通信电路和方法，可以消除光耦传输比特性带来的低电平偏高的影响。
图2为本公开主从机通信电路一些实施例的示意图。如图2所示，所述主从机通信电路可以包括主机通信电路10和从机通信电路20，其中：
图2实施例的主从机通信电路可以设置在包含主机和至少一个从机的电器设备中，以实现主机和从机之间的通信。具体而言，主机通信电路10可以设置在主机侧，从机通信电路20可以设置在从机侧。
例如：图2实施例的主从机通信电路可以设置在包含主控板和至少一个压缩机的空调中，其中空调的主机为主控板，空调的从机为压缩机。主机通信电路10可以设置在空调主控板，从机通信电路20可以设置在压缩机驱动板。
如图2所示，主机通信电路10包括主机通信接口11，从机通信电路20包括从机通信接口21，主机通信接口11通过平行线30与至少一个从机通信电路20的从机通信接口21连接。
如图2所示，所述平行线30从上到下，依次包括电源线、主机信号发送线、主机信号接收线和地线。
在本公开的一些实施例中，主机通信接口包括主机信号发送接口和主机信号接收接口，其中，主机信号发送接口与主机信号发送端连接，主机信号接收接口与主机信号接收端连接；
从机异步收发传输器包括从机信号发送接口和从机信号接收接口；
主机信号发送接口通过平行线与至少一个从机的从机信号接收接口连接，主机信号接收接口通过平行线与至少一个从机的从机信号发送接口连接。
在本公开的一些实施例中，如图2所示，所述从机通信电路20可以包括从机通信接口21、从机通用异步收发传输器22和光耦输出转换电路，其中：
从机通用异步收发传输器22包括从机信号接收端RXS和从机信号发送端TXS。
从机通信接口21与光耦输出转换电路连接。
所述光耦输出转换电路可以为一种高低电平转换电路。
所述光耦输出转换电路可以包括输出光电耦合器U1和继电器Q3，其中，输出光电耦合器U1的第一输入端与电源连接，输出光电耦合器U1的第二输入端与从机信号发送端连接；输出光电耦合器U1的第一输出端与电源连接，输出光电耦合器U1的第二输出端与继电器输入端连接，继电器输出端与主机通信电路的主机信号接收端连接。
在本公开的一些实施例中，输出光电耦合器U1可以包括位于初级回路中的发光器和 位于次级回路中的受光器。
在本公开的一些具体实施例中，如图2和图3所示，所述发光器可以为位于初级回路中的发光二极管U11；所述受光器可以为位于次级回路中的光敏三极管U12。
发光二极管的正极为输出光电耦合器的第一输入端，发光二极管的负极为输出光电耦合器的第二输入端；光敏三极管的集电极为输出光电耦合器的第一输出端，光敏三极管的发射极为输出光电耦合器的第二输出端。
发光二极管U11的正极与电源连接；发光二极管U11的负极与从机信号发送端连接；光敏三极管U12的集电极与电源连接，光敏三极管U12的发射极与继电器Q3的输入端连接，继电器Q3的输出端通过从机通信接口21与主机信号接收端RX连接。
在本公开的一些实施例中，在从机信号发送端的发送信号为低电平的情况下，继电器Q3的输出端的输出电压小于预定值，以保证在光耦传输偏极限或环境温度偏极限的情况下，也可以准确识别从机的低电平信号。
在本公开的一些具体实施例中，所述预定值可以为0.8V。
在本公开的一些实施例中，所述继电器Q3可以为三极管继电器或常规继电器。
图3为本公开一些实施例中光耦输出转换电路的示意图。如图2和图3所示，所述继电器Q3可以为三极管继电器，即，所述继电器Q3为三极管。
如图2和图3所示，三极管的基极为继电器Q3的输入端，三极管的集电极为继电器Q3的输出端，三极管的发射极接地。
从机在向主机发送信号的过程中，发送信号经过光耦及电平转换电路，如图2和图3所示，
在从机信号发送端输出低电平信号(0)的情况下，输出光电耦合器U1的初级侧(发光二极管U11)导通；在发光二极管U11导通的情况下，光电耦合器U1的次级侧(光敏三极管U12)导通；光敏三极管U12的发射极电流流经三极管Q3，使三极管Q3处于工作状态。
三极管Q3工作后，三极管Q3的集电极电流经R3流过三极管，三极管集电极输出低电平至主机接收侧，此时主机接收为低电平。
在实际通信的过程中，如由于光耦的特性引起的温度极限下光耦次级侧电压超过0.8V，或达到1V的情况下，三极管正常导通，且集电极电流<基极电流*β依然成立，三极管仍然是饱和状态，三极管Q3的Vce仍会低于0.7V，处于常规低电平水平。
基于本公开上述实施例提供的主从机通信电路，具体为从机通信电路，在输出光电耦 合器的第二输出端设置继电器或三极管，构成高低电平转换电路，由此在光耦传输偏极限或环境温度偏极限的情况下，也可以准确识别从机的低电平信号。由此本公开上述实施例解决了相关技术在光耦传输偏极限或环境温度偏极限的情况下、实际低电平会出现高于0.8V、芯片无法识别低电平而造成通信故障的技术问题。
本公开上述实施例可以消除光耦传输比特性带来的低电平偏高的影响，从而提高通讯可靠性，使主机侧芯片在各种情况下均能识别高低电平。
在本公开的一些实施例中，如图2和图3所示，所述光耦输出转换电路还可以包括第一电阻R1、第二电阻R2和第三电阻R3，其中：
第一电阻R1串联设置在光敏三极管U12的发射极与三极管继电器Q3的基极之间。第一电阻R1用于在光敏三极管导通的情况下，驱动三极管Q3导通，或给继电器线圈通电。
第二电阻R2的一端与电源连接，第二电阻R2的另一端与继电器Q3的输出端(即三极管继电器Q3的集电极)连接。第二电阻R2用于保证在三极管Q3导通或继电器触点导通的情况下，继电器输出端电压为低电平。
第三电阻R3的一端与电源连接，第三电阻R3的另一端的发光二极管U11的正极连接。
在本公开的一些实施例中，在电阻选型上，R1与R2一般相等即可满足要求。例如：在图2和图3实施例中，R1与R2的阻值可以选择为1K欧姆。
在本公开的另一些实施例中，R2也可比R1稍大，更容易使三极管Q3进入饱和区。
在本公开上述实施例中，第一电阻R1、第二电阻R2和第三电阻R3为上拉电阻。
在本公开的一些实施例中，第三电阻R3的阻值可以为680欧姆。
在本公开的一些实施例中，当从机发送高电平信号(1信号)的情况下，光电耦合器U1的初级侧不导通，次级侧无电流信号，三极管Q3不工作，三极管集电极输出为高电平信号(1信号)，主机接收为高电平。
本公开图2和图3实施例采用在输出光电耦合器的第二输出端(例如光敏三极管发射极)处增加三极管的方式，可以去掉光耦元件的极限温度特性和极限电流传输比特性带来的低电平过高的影响。本公开上述实施例的主机侧芯片在各种情况下均能识别高低电平，安全可靠。
在本公开的一些实施例中，如图2所示，所述从机通信电路20还可以包括光耦输入转换电路，其中：
光耦输入转换电路的输入端通过从机通信接口21与主机信号发送端TX连接，以接收主机信号。
光耦输入转换电路的输出端与从机信号接收端RXS连接。
由此本公开上述实施例的从机通信电路还可以方便地接收主机下发的主机信号。
在本公开的一些实施例中，如图2所示，所述光耦输入转换电路包括输入光电耦合器U2，输入光电耦合器U2包括初级侧的发光二极管U21和次级侧的光敏二极管U22，其中：
发光二极管U21的正极与电源连接，发光二极管U21的负极与通过从机通信接口21与主机信号发送端TX连接。
光敏二极管U22的集电极与从机信号接收端RXS连接，光敏二极管U22的发射极接地。
在本公开的一些实施例中，如图2所示，所述光耦输入转换电路还可以包括第四电阻R4，其中：
第四电阻R4的一端与电源连接，第四电阻R4的另一端与光敏二极管U22的集电极连接。
在本公开的一些具体实施例中，第四电阻R4的阻值可以为1k欧姆。
在本公开的一些实施例中，如图2所示，主机通信电路10还可以包括第五电阻R5，其中：
第五电阻R5的一端与主机信号发送端TX连接，第五电阻R5的另一端与主机通信接口11的主机信号发送接口连接。
在本公开的一些具体实施例中，第五电阻R5的阻值可以为680欧姆。
在本公开的一些具体实施例中，电源电压VCC可以为3.3V。
在本公开的一些实施例中，如图2所示，主机通信电路10还可以包括第一电容C1和第二电容C2，从机通信电路20还可以包括第三电容C3，其中：
在主机侧，第一电容C1的一端与主机信号发送端TX连接，第一电容C1的另一端接地；第二电容C2的一端与主机信号接收端RX连接，第二电容C2的另一端接地。第一电容C1和第二电容C2用于滤波，以降低系统干扰。
在从机侧，第三电容C3的一端与从机信号接收接口连接，第三电容C3的另一端与电源连接。
在本公开的一些实施例中，第一电容C1、第二电容C2和第三电容C3可以为滤波电容。
在本公开的一些实施例中，第一电容C1、第二电容C2和第三电容C3的容量均可以为1nF。
在本公开的一些实施例中，在主机信号发送端TX输出高电平的情况下，发光二极管U21不导通，光敏二极管U22不导通，光敏二极管U22的集电极输出高电平。因此，从机信号接收端RXS接收到高电平信号。
在主机信号发送端TX输出低电平的情况下，发光二极管U21导通，光敏二极管U22导通，光敏二极管U22的集电极输出低电平。因此，从机信号接收端RXS接收到低电平信号。
图4为本公开另一些实施例中光耦输出转换电路的示意图。与图2和图3实施例相比，在图4实施例中，所述继电器Q3可以常规继电器。
如图4所示，所述继电器Q3包括继电器线圈41、继电器动触点42和继电器静触点43，其中：
继电器线圈41为继电器Q3的输入端，继电器动触点42为继电器Q3的输出端，继电器静触点43接地。
在从机信号发送端输出低电平信号(0)的情况下，输出光电耦合器U1的初级侧(发光二极管U11)导通；在发光二极管U11导通的情况下，光电耦合器U1的次级侧(光敏三极管U12)导通；光敏三极管U12的发射极电流流经继电器线圈41，使得继电器线圈41得电。
在继电器线圈41得电的情况下，继电器动触点42闭合，继电器动触点42与继电器静触点43连通，继电器动触点42输出低电平到主机接收侧。
在本公开的一些实施例中，当从机发送高电平信号(1信号)的情况下，光电耦合器U1的初级侧不导通，次级侧无电流信号，继电器线圈41不得电，继电器动触点42为高电平信号(1信号)，主机接收为高电平。
本公开上述实施例在输出光电耦合器的第二输出端设置继电器，构成高低电平转换电路，由此能够去掉光耦元件的极限温度特性和极限电流传输比特性带来的低电平过高的影响。本公开上述实施例的主机侧芯片在各种情况下均能识别高低电平，安全可靠。
图5为本公开又一些实施例中光耦输出转换电路的示意图。与图4相比，在图5实施例中，所述继电器Q3包括继电器线圈41、继电器动触点42和继电器静触点43，其中：
继电器线圈41为继电器Q3的输入端，继电器静触点43为继电器Q3的输出端，继电器动触点42接地。
在从机信号发送端输出低电平信号(0)的情况下，输出光电耦合器U1的初级侧(发光二极管U11)导通；在发光二极管U11导通的情况下，光电耦合器U1的次级侧(光敏三极管U12)导通；光敏三极管U12的发射极电流流经继电器线圈41，使得继电器线圈41得电。
在继电器线圈41得电的情况下，继电器动触点42闭合，继电器动触点42与继电器静触点43连通，继电器静触点43输出低电平到主机接收侧。
继电器动触点42与继电器静触点43连通的情况下，继电器动触点42与继电器静触点43之间的电压差小于0.7V，处于常规低电平水平。
在本公开的一些实施例中，当从机发送高电平信号(1信号)的情况下，光电耦合器U1的初级侧不导通，次级侧无电流信号，继电器线圈41不得电，继电器静触点43为高电平信号(1信号)，主机接收为高电平。
基于本公开图4或图5实施例提供的主从机通信电路，具体可以为从机通信电路，采用在输出光电耦合器的第二输出端(例如光敏三极管发射极)处增加常规继电器的方式，在光耦传输偏极限或环境温度偏极限的情况下，也可以准确识别从机的低电平信号。由此本公开上述实施例解决了相关技术在光耦传输偏极限或环境温度偏极限的情况下、实际低电平会出现高于0.8V、芯片无法识别低电平而造成通信故障的技术问题。
图6为本公开主从机通信电路另一些实施例的示意图。如图6所示，所述主从机通信电路可以包括主机通信电路10和至少两个从机通信电路20，其中：
图6实施例的主从机通信电路可以设置在包含主机和至少两个从机的电器设备中，以实现主机和从机之间的通信。具体而言，主机通信电路10可以设置在主机侧，至少两个从机通信电路20可以分别设置在不同从机侧。
例如：图6实施例的主从机通信电路可以设置在包含主控板和至少两个压缩机的空调中，其中空调的主机为主控板，空调的从机为压缩机。主机通信电路10可以设置在空调主控板，从机通信电路20可以设置在压缩机驱动板。
所述至少两个从机通信电路20的结构一致。
如图6所示，主机通信电路10可以通过平行线与至少一个从机通信电路20连接。
如图6所示，所述平行线30从上到下，依次包括电源线、主机信号发送线、主机信号接收线和地线。
如图6所示，主机通信电路10包括主机通用异步收发传输器12和功率放大电路13， 其中：
主机通用异步收发传输器12包括主机信号发送端TX和主机信号接收端RX。
功率放大电路13的输入端与主机信号发送端TX连接，对主机信号进行电流放大。
功率放大电路13的输出端与至少一个从机连接，以便向至少一个从机发送主机信号。
如图6所示，主机通信电路10还可以包括第六电阻R6和第七电阻R7，其中：
第六电阻R6的一端与主机信号接收端RX连接，第六电阻R6的另一端通过主机接收线与至少一个从机连接。
第七电阻R7的一端与电源连接，另一端与第六电阻R6连接。
在本公开的一些具体实施例中，第六电阻R6和第七电阻R7的阻值可以为1k欧姆。
如图6所示，从机通信电路20可以包括从机通用异步收发传输器22、光耦输出转换电路和光耦输入转换电路，其中：
从机通用异步收发传输器22包括从机信号接收端RXS和从机信号发送端TXS。
光耦输出转换电路可以包括输出光电耦合器U1和第三电阻R3，其中，输出光电耦合器U1包括位于初级回路中的发光二极管U11和位于次级回路中的光敏三极管U12。
发光二极管U11的正极通过第三电阻R3与电源连接；发光二极管U11的负极与从机信号发送端连接；光敏三极管U12的集电极与主机信号接收端RX连接，光敏三极管U12的发射极接地。
光耦输入转换电路可以包括输入光电耦合器U2、第三电容C3、第四电阻R4和第八电阻R8，其中
输入光电耦合器U2可以包括初级侧的发光二极管U21和次级侧的光敏二极管U22，
在本公开的一些实施例中，如图2所示，所述光耦输入转换电路包括输入光电耦合器U2，输入光电耦合器U2包括初级侧的发光二极管U21和次级侧的光敏二极管U22，其中：
发光二极管U21的正极通过第八电阻R8与电源连接，发光二极管U21的负极与主机信号发送端TX连接。
在本公开的一些具体实施例中，第八电阻R8的阻值可以为680欧姆。
光敏二极管U22的集电极与从机信号接收端RXS连接，光敏二极管U22的发射极接地。
第四电阻R4的一端与电源连接，第四电阻R4的另一端与光敏二极管U22的集电极连接。
第三电容C3的一端与发光二极管U21的正极连接，第三电容C3的另一端与发光二 极管U21的负极连接。
在本公开的一些实施例中，在主机信号发送端TX输出高电平的情况下，各个从机通信电路中发光二极管U21不导通，光敏二极管U22不导通，光敏二极管U22的集电极输出高电平。因此，从机信号接收端RXS接收到高电平信号。
在主机信号发送端TX输出低电平的情况下，各个从机通信电路中发光二极管U21导通，光敏二极管U22导通，光敏二极管U22的集电极输出低电平。因此，从机信号接收端RXS接收到低电平信号。
在本公开的一些实施例中，如图6所示，所述主机通信电路10的主机信号接收端RX还可以与至少一个从机连接，用于接收至少一个从机发送的从机信号。
当电器设备的任意一个从机发送低电平信号(0)的情况下，通过第三电阻R3驱动输出光电耦合器U1的发光二极管U11发光，驱动输出光电耦合器U1的光敏三极管U12导通，由于光敏三极管U12的发射极接地，因此光敏三极管U12导通后，光敏三极管U12的集电极的电平被拉至低电平，此时主机接收到低电平信号0。
当电器设备的各个从机发送高电平信号1的情况下，发光二极管U11不发光，此时，主机接收到高电平信号1。
本公开上述实施例的主从机通信电路，包括主机通信电路和多个从机通信电路，其中主机通信电路设置于电器设备主机侧的主控板，从机通信电路设置于电器设备从机侧的驱动板。
申请人发现：当前UART技术，设计出来就是一主对一从的，主芯片所能提供的电流有限，当多个从机时，主机无法提供足够的电流导致通讯失败。
因此申请人在主机通信电路的UART的发送端设置功率放大电路，通过功率放大电路对该UART输出的信号进行电流放大处理，使得放大后的电流信号可以驱动各个驱动板中的光电耦合器，从而实现电器设备中主机和多个从机之间的通信，由于本公开上述实施例无需使用专用芯片，因此本公开上述实施例公开的通信电路相对于485通信方式，有效降低了系统成本。
在本公开的一些实施例中，图6实施例的功率放大电路13可以为二级功率放大电路、三级功率放大电路或者是更高等级的功率放大电路。
功率放大电路13的等级数量，可以根据从机个数的需求来确定。放大后的通讯电流，根据从机个数的需求确定电流大小，进而确定电流放大倍数和相应功率放大电路等级。根据电路进行放大，对于二级功率放大电路而言，电流的最大放大倍数为两个三极管的放大 倍数乘积。
图7为本公开主从机通信电路再一些实施例的示意图。与图6实施例相比，在图7实施例给出了二级功率放大电路的具体结构。
如图7所示，主机通信电路10可以通过平行线30与至少一个从机通信电路20连接。
如图7所示，所述平行线30从上到下，依次包括电源线、主机信号发送线(TX_BUS)、主机信号接收线和地线。
主机信号发送接口通过平行线30中的主机信号发送线与至少两个从机的从机信号接收接口连接，主机信号接收接口通过平行线30中的主机信号接收线与至少两个从机的从机信号发送接口连接。
在本公开的一些实施例中，如图7所示，二级功率放大电路可以包括第一三极管Q1和第二三极管Q2，其中，第一三极管Q1为PNP型三极管，第二三极管Q2为NPN型三极管。
具体的：
第一三极管Q1的发射极连接至直流电源VCC，第一三极管Q1的基极通过第十三电阻R13连接至主控板1的UART的发送端TX，同时，第一三极管Q1的基极通过第十一电阻R11连接至直流电源VCC。
第二三极管Q2的基极通过第十二电阻R12连接至第一三极管Q1的集电极，同时第二三极管Q2的基极通过第九电阻R9接地，第二三极管Q2的发射极接地，第二三极管Q2的集电极通过第十电阻R10连接至直流电源VCC，同时第二三极管Q2的集电极连接稳压二极管ZD1的阴极，稳压二极管ZD1的阳极接地，第二三极管Q2的集电极为功率放大电路的输出端。
当电器设备的主机发送低电平信号0时，主控板1的UART的输出端TX通过第十三电阻R13驱动第一三极管Q1导通，此时第一三极管Q1的集电极侧电流被放大α倍，放大后的电流再通过第十二电阻R12驱动第二三极管Q2导通，由第二三极管Q2对电流进行二次放大，流过第二三极管Q2集电极的电流再被放大β倍，流过各个驱动板的输入光电耦合器U2的发光器的电流是经过放大后的电流。之后，各个驱动板的输入光电耦合器U2中的发光器发光，驱动输入光电耦合器U2的受光器导通，导致输入光电耦合器U2的第一输出端(光敏二极管U22的集电极)的电平被拉至低电平，此时从机接收到0。
当电器设备的主机发送1时，功率放大电路11不工作，各个从机中的驱动板中输入光电耦合器U2的发光器不发光，此时，从机接收到1。
在本公开的一些具体实施例中，第十三电阻R13和第十二电阻R12的阻值可以为5.1k欧姆。主机发送端第五电阻R5驱动第一三极管Q1，此时集电极侧电流放大了α倍，放大后的电流再通过另一5.1K电阻(第十二电阻R12)驱动共射极第二三极管Q2进行第二级放大，电流再放大了β倍，此放大后的电流在8米内通信时能等同485通信效果，从而可以满足多级节点通信需求。
在本公开的一些具体实施例中，第九电阻R9的阻值可以为5.1k欧姆；第10电阻R10的阻值可以为1k欧姆。
在本公开的一些实施例中，所述主机通信电路还可以包括第一电容C1、第二电容C2和第四电容C4，其结构如图7所示。具体的：第二三极管Q2的集电极通过第一电容C1接地，第二三极管Q2的基极通过第四电容C4接地，第一电阻R1和第二电阻R2的公共端通过第二电容C2接地。通过在主机通信电路中进一步设置第一电容C1、第二电容C2和第四电容C4，可以降低系统干扰。
在本公开的一些具体实施例中，第四电容C4的容量可以为1nF。
在本公开的一些实施例中，如图7所示，主机通信电路10可以包括主机通信接口11，从机通信电路20包括从机通信接口21。主机通信接口11通过平行线30与至少两个从机通信电路20的从机通信接口21连接。
本公开上述实施例通过主机通信接口和从机通信接口，可以方便地实现主从机通信电路中从机通信电路个数的扩展。
所述从机通信接口21和主机通信接口11可以实现为针座，主机通信电路10和各个从机通信电路20之间可以采用针座连接，当需要增设节点时，例如在主控板连接更多驱动板时，可以利用针座快速实现扩展。
在本公开的一些实施例中，主机通信接口11包括主机信号发送接口和主机信号接收接口，从机通信接口21包括从机信号发送接口和从机信号接收接口，其中，主机信号发送接口通过平行线30中的主机信号发送线与至少两个从机的从机信号接收接口连接，主机信号接收接口通过平行线30中的主机信号接收线与至少两个从机的从机信号发送接口连接。
图8为本公开主从机通信电路另一些实施例的示意图。图8实施例与图7实施例的区别仅在于：将图7实施例的从机侧的光耦输出转换电路替换为图3-图5任一实施例的光耦输出转换电路。
如图8所示，从机侧的光耦输出转换电路可以包括输出光电耦合器U1和继电器Q3，其中，输出光电耦合器U1包括位于初级回路中的发光二极管U11和位于次级回路中的光敏三极管U12。
发光二极管U11的正极通过第三电阻R3与电源连接；发光二极管U11的负极与从机信号发送端连接；光敏三极管U12的集电极与电源连接，光敏三极管U12的发射极通过第一电阻R1与继电器Q3的输入端(例如三极管Q3的基极)连接，继电器Q3的输出端(例如三极管Q3的集电极)通过从机通信接口21与主机信号接收端RX连接。
在实际电路中，如图8所示，与图2-图5中任一实施例类似的次级侧第二电阻R2可以移到主机侧的接收端，以防止电路有多个节点时，该电阻R2会并联，改变电路中的整体从机发送阻值。
图8实施例将图2-图5中任一实施例与图6或图7实施例相结合，由此图8实施例不仅可以如图6或图7实施例一样实现多节点UART通信，降低空调行业通信成本；而且可以如图2-图5中任一实施例一样去掉光耦元件的极限温度特性和极限电流传输比特性带来的低电平过高影响，主机侧芯片在各种情况下均能识别高低电平，安全可靠。
本公开上述实施例提供了一种多节点的UART光耦隔离通信电路，是一种自动适应光耦的多节点UART通讯电路，能消除光耦传输比特性带来的低电平偏高的影响。本公开上述实施例可以降低空调行业通讯成本。本公开上述实施例还可以提高通讯可靠性，使高低电平均处于芯片能识别的正常水平，主机侧芯片在各种情况下均能识别高低电平。
图9为本公开电器设备一些实施例的示意图。如图9所示，所述电器设备可以包括主机1和至少一个从机2，其中：
所述电器设备可以为包括主控板和至少一个压缩机的空调。其中主机1为主控板，从机2可以为压缩机。
主机1可以包括如上述任一实施例(例如图2-图8任一实施例)所述的主机通信电路10。
从机2可以包括如上述任一实施例(例如图2-图8任一实施例)所述的从机通信电路20。
基于本公开上述实施例提供的主机、从机和电器设备，可以实现多节点UART通信，以降低空调等电器行业的通讯成本。本公开上述实施例还可以消除光耦传输比特性带来的低电平偏高的影响，从而提高通讯可靠性，使高低电平均处于芯片能识别的正常水平，主 机侧芯片在各种情况下均能识别高低电平。
图10为本公开电器设备一些实施例的示意图。如图10所示，所述电器设备可以包括主机1、至少一个从机2和主从机通信电路3，其中：
所述电器设备可以为包括主控板和至少一个压缩机的空调。其中主机1为主控板，从机2可以为压缩机。
主从机通信电路3可以为如上述任一实施例(例如图2-图8任一实施例)所述的主从机通信电路。
基于本公开上述实施例提供的电器设备，可以实现多节点UART通信，以降低空调等电器行业的通讯成本。本公开上述实施例还可以消除光耦传输比特性带来的低电平偏高的影响，从而提高通讯可靠性，使高低电平均处于芯片能识别的正常水平，主机侧芯片在各种情况下均能识别高低电平。
图11为本公开主从机通信方法一些实施例的示意图。优选的，本实施例可由本公开图2-图5、图8中任一实施例所述的主从机通信电路执行。所述方法可以包括：
步骤111，在如上述任一实施例(例如图2-图5、图8中任一实施例)所述的从机通信电路20中，在从机信号发送端输出低电平信号的情况下，输出光电耦合器U1的第二输出端有电流输出。
在本公开的一些实施例中，在输出光电耦合器U1包括发光二极管U11和光敏三极管U12的情况下，光敏三极管U12的发射极为输出光电耦合器U1的第二输出端。在从机信号发送端输出低电平信号时，在发光二极管U11导通的情况下，光敏三极管U12导通，光敏三极管U12的发射极有电流输出。
步骤112，输出光电耦合器U1的第二输出端输出的电流使得继电器Q3的输入端得电。
步骤113，在继电器Q3的输入端得电的情况下，继电器Q3的输出端输出低电平。
基于本公开上述实施例提供的主从机通信方法，在光耦传输偏极限或环境温度偏极限的情况下，也可以准确识别从机的低电平信号。由此本公开上述实施例解决了相关技术在光耦传输偏极限或环境温度偏极限的情况下、实际低电平会出现高于0.8V、芯片无法识别低电平而造成通信故障的技术问题。
在本公开的一些实施例中，所述主从机通信方法还可以包括：在如上述任一实施例(例如图8实施例)所述的主机通信电路10中，主机信号发送端TX向功率放大电路13发送主机信号；功率放大电路13对主机信号进行电流放大；主机通信接口11将放大后的主机 信号发送到至少一个从机2。
基于本公开上述实施例提供的主从机通信方法，不仅可以实现多节点UART通信，以降低空调等电器行业的通讯成本。本公开上述实施例还可以消除光耦传输比特性带来的低电平偏高的影响，从而提高通讯可靠性，使高低电平均处于芯片能识别的正常水平，主机侧芯片在各种情况下均能识别高低电平。
图12为本公开主从机通信方法另一些实施例的示意图。优选的，本实施例可由本公开图6-图8中任一实施例所述的主从机通信电路执行。所述方法可以包括：
步骤121，在如上述任一实施例(例如图6-图8任一实施例)所述的主机通信电路10中，主机信号发送端TX向功率放大电路13发送主机信号；
步骤122，功率放大电路13对主机信号进行电流放大；
步骤123，主机通信接口11将放大后的主机信号发送到至少一个从机2。
基于本公开上述实施例提供的主从机通信方法，能消除光耦传输比特性带来的低电平偏高的影响。本公开上述实施例可以降低空调行业通讯成本。本公开上述实施例还可以提高通讯可靠性，使高低电平均处于芯片能识别的正常水平，主机侧芯片在各种情况下均能识别高低电平。
显然，本领域的技术人员可以对本公开实施例进行各种改动和变型而不脱离本公开的精神和范围。这样，倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内，则本公开也意图包含这些改动和变型在内。
可能以许多方式来实现本公开的方法和系统。例如，可通过软件、硬件、固件或者软件、硬件、固件的任何组合来实现本公开的方法和系统。用于方法的步骤的上述顺序仅是为了进行说明，本公开的方法的步骤不限于以上具体描述的顺序，除非以其它方式特别说明。此外，在一些实施例中，还可将本公开实施为记录在记录介质中的程序，这些程序包括用于实现根据本公开的方法的机器可读指令。因而，本公开还覆盖存储用于执行根据本公开的方法的程序的记录介质。
本公开的描述是为了示例和描述起见而给出的，而并不是无遗漏的或者将本公开限于所公开的形式。很多修改和变化对于本领域的普通技术人员而言是显然的。选择和描述实施例是为了更好说明本公开的原理和实际应用，并且使本领域的普通技术人员能够理解本公开从而设计适于特定用途的带有各种修改的各种实施例。

Claims (14)

  1. 一种从机通信电路，包括从机通用异步收发传输器和光耦输出转换电路，其中：
    从机通用异步收发传输器包括从机信号发送端；
    光耦输出转换电路包括输出光电耦合器和继电器，其中，输出光电耦合器的第一输入端与电源连接，输出光电耦合器的第二输入端与从机信号发送端连接；输出光电耦合器的第一输出端与电源连接，输出光电耦合器的第二输出端与继电器输入端连接，继电器输出端与主机通信电路的主机信号接收端连接。
  2. 根据权利要求1所述的从机通信电路，其中，所述继电器为三极管，三极管的基极为继电器输入端，三极管的集电极为继电器输出端，三极管的发射极接地。
  3. 根据权利要求1所述的从机通信电路，其中，所述继电器包括继电器线圈、继电器动触点和继电器静触点，其中：
    继电器线圈为继电器输入端，继电器动触点为继电器输出端，继电器静触点接地；
    或者，
    继电器线圈为继电器输入端，继电器静触点为继电器输出端，继电器动触点接地。
  4. 根据权利要求1-3中任一项所述的从机通信电路，其中，所述光耦输出转换电路还包括第一电阻和第二电阻，其中，第一电阻串联设置在输出光电耦合器的第二输出端与继电器输入端之间，第二电阻的一端与电源连接，第二电阻的另一端与继电器输出端连接。
  5. 根据权利要求1-3中任一项所述的从机通信电路，其中，
    在从机信号发送端的发送信号为低电平的情况下，继电器输出端的输出电压小于预定值。
  6. 根据权利要求1-3中任一项所述的从机通信电路，其中，所述输出光电耦合器包括位于初级回路中的发光二极管和位于次级回路中的光敏三极管；
    发光二极管的正极为输出光电耦合器的第一输入端，发光二极管的负极为输出光电耦合器的第二输入端；光敏三极管的集电极为输出光电耦合器的第一输出端，光敏三极管 的发射极为输出光电耦合器的第二输出端。
  7. 一种主从机通信电路，包括主机通信电路和至少一个从机通信电路，其中，
    从机通信电路为如权利要求1-6中任一项所述的从机通信电路。
  8. 根据权利要求7所述的主从机通信电路，其中，
    主机通信电路包括主机通信接口，主机通信接口通过平行线与至少一个从机通信电路的从机通信接口连接；
    主机通信接口包括主机信号发送接口和主机信号接收接口，其中，主机信号发送接口与主机信号发送端连接，主机信号接收接口与主机信号接收端连接；
    从机异步收发传输器包括从机信号发送接口和从机信号接收接口；
    主机信号发送接口通过平行线与至少一个从机的从机信号接收接口连接，主机信号接收接口通过平行线与至少一个从机的从机信号发送接口连接。
  9. 根据权利要求7或8所述的主从机通信电路，其中，主机通信电路包括主机通用异步收发传输器和功率放大电路，其中：
    主机通用异步收发传输器包括主机信号发送端；
    功率放大电路的输入端与主机信号发送端连接，对主机信号进行电流放大；
    功率放大电路的输出端与至少一个从机连接，以便向至少一个从机发送主机信号。
  10. 一种从机，包括如权利要求1-6中任一项所述的从机通信电路。
  11. 一种电器设备，包括主机和至少一个从机，其中，从机为权利要求10所述的从机。
  12. 一种电器设备，包括主机、至少一个从机、以及如权利要求7-9中任一项所述的主从机通信电路。
  13. 一种主从机通信方法，包括：
    在如权利要求1-6中任一项所述的从机通信电路中，在从机信号发送端输出低电平信 号的情况下，输出光电耦合器的第二输出端有电流输出；
    输出光电耦合器的第二输出端输出的电流使得继电器输入端得电；
    在继电器输入端得电的情况下，继电器输出端输出低电平。
  14. 根据权利要求13所述的主从机通信方法，其中，还包括：
    在如权利要求9中任一项所述的主从机通信电路中，主机信号发送端向功率放大电路发送主机信号；
    功率放大电路对主机信号进行电流放大；
    主机通用异步收发传输器将放大后的主机信号发送到至少一个从机。
PCT/CN2018/120598 2018-05-03 2018-12-12 从机通信电路、从机、电器设备、主从机通信电路和方法 WO2019210689A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810413923.8 2018-05-03
CN201810413923.8A CN108534298B (zh) 2018-05-03 2018-05-03 从机通信电路、从机、电器设备、主从机通信电路和方法

Publications (1)

Publication Number Publication Date
WO2019210689A1 true WO2019210689A1 (zh) 2019-11-07

Family

ID=63475877

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/120598 WO2019210689A1 (zh) 2018-05-03 2018-12-12 从机通信电路、从机、电器设备、主从机通信电路和方法

Country Status (2)

Country Link
CN (1) CN108534298B (zh)
WO (1) WO2019210689A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113985771A (zh) * 2021-10-25 2022-01-28 华能澜沧江水电股份有限公司 一种全站仪观测站的卷帘门控制系统
CN114726494A (zh) * 2022-03-04 2022-07-08 深圳拓邦股份有限公司 uart接口电路、uart通信方法及装置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108534298B (zh) * 2018-05-03 2023-11-14 珠海格力电器股份有限公司 从机通信电路、从机、电器设备、主从机通信电路和方法
CN109302172B (zh) * 2018-11-29 2022-06-28 广东电网有限责任公司 一种用于无人机的电磁干扰隔离电路装置
CN109525475B (zh) * 2018-12-20 2024-05-10 苏州路之遥科技股份有限公司 一种单总线通讯信号隔离电路
CN110944370A (zh) * 2019-02-19 2020-03-31 深圳梧童科技有限公司 一种无线组网系统及方法
CN110868236B (zh) * 2019-11-28 2022-02-18 广东美的暖通设备有限公司 通信电路和空调器
CN110830026A (zh) * 2019-11-28 2020-02-21 广东美的暖通设备有限公司 光耦隔离通信电路、电路板和空调器
CN111970448B (zh) * 2020-08-27 2022-04-22 上海艾为电子技术股份有限公司 光学防抖驱动电路、驱动系统及其控制方法和电子设备
CN114817112B (zh) * 2022-04-29 2024-03-26 北京中科银河芯科技有限公司 一种从机设备以及主从机通信系统
CN114760164B (zh) * 2022-05-20 2023-10-27 淮安威灵电机制造有限公司 家电设备的隔离异步通讯电路和方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202135150U (zh) * 2011-07-25 2012-02-01 南京太西天溯信息技术有限公司 一种总线式电流环通信电路
CN104776559A (zh) * 2015-03-30 2015-07-15 广东美的制冷设备有限公司 一种变频空调及其总线式电流环通信系统
CN105160862A (zh) * 2015-07-30 2015-12-16 谢玉翠 M-bus从机通信电路
CN108534298A (zh) * 2018-05-03 2018-09-14 珠海格力电器股份有限公司 从机通信电路、从机、电器设备、主从机通信电路和方法
CN208154732U (zh) * 2018-05-03 2018-11-27 珠海格力电器股份有限公司 从机通信电路、从机、电器设备和主从机通信电路

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5944098A (en) * 1997-07-17 1999-08-31 Jackson; Ronald E. Zone control for HVAC system
JP2000340833A (ja) * 1999-06-01 2000-12-08 Mitsubishi Electric Corp 光半導体装置
JP4648195B2 (ja) * 2003-10-21 2011-03-09 パナソニック株式会社 設備機器用通信回路
CN201118630Y (zh) * 2007-11-09 2008-09-17 深圳天行健电子有限公司 一种光电隔离的无极性两芯线通讯总线收发器
DE102012217488A1 (de) * 2012-09-26 2014-03-27 Wolfgang Rein Verfahren und Vorrichtung zum Koppeln von Parametern von Audiosignalen
CN103075782B (zh) * 2012-12-20 2015-06-17 四川长虹电器股份有限公司 多联式空调无极性供电通讯系统
CN203119870U (zh) * 2013-03-18 2013-08-07 珠海格力电器股份有限公司 一种通讯电路、电器设备及空调
CN205299829U (zh) * 2015-10-26 2016-06-08 广东美的制冷设备有限公司 分体式一拖多空调控制器及空调设备
CN206861819U (zh) * 2017-06-22 2018-01-09 青岛海信日立空调系统有限公司 一种空调控制系统及空调

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202135150U (zh) * 2011-07-25 2012-02-01 南京太西天溯信息技术有限公司 一种总线式电流环通信电路
CN104776559A (zh) * 2015-03-30 2015-07-15 广东美的制冷设备有限公司 一种变频空调及其总线式电流环通信系统
CN105160862A (zh) * 2015-07-30 2015-12-16 谢玉翠 M-bus从机通信电路
CN108534298A (zh) * 2018-05-03 2018-09-14 珠海格力电器股份有限公司 从机通信电路、从机、电器设备、主从机通信电路和方法
CN208154732U (zh) * 2018-05-03 2018-11-27 珠海格力电器股份有限公司 从机通信电路、从机、电器设备和主从机通信电路

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113985771A (zh) * 2021-10-25 2022-01-28 华能澜沧江水电股份有限公司 一种全站仪观测站的卷帘门控制系统
CN114726494A (zh) * 2022-03-04 2022-07-08 深圳拓邦股份有限公司 uart接口电路、uart通信方法及装置
CN114726494B (zh) * 2022-03-04 2024-03-29 深圳拓邦股份有限公司 uart接口电路、uart通信方法及装置

Also Published As

Publication number Publication date
CN108534298B (zh) 2023-11-14
CN108534298A (zh) 2018-09-14

Similar Documents

Publication Publication Date Title
WO2019210689A1 (zh) 从机通信电路、从机、电器设备、主从机通信电路和方法
CN108800484B (zh) 空调器电源控制电路、控制器及空调器
CN110285552B (zh) 线控器供电控制电路、空调内机和空调系统
KR20090031972A (ko) 공기 조화 시스템 및 실내기
US8766221B1 (en) Isolation system for a bi-directional communication bus line
KR101080973B1 (ko) 조명장치를 위한 자가진단 시스템
US8042345B2 (en) Outdoor unit and air conditioning system using the same
CN101820314B (zh) 单线双向通信光耦隔离电路
CN203119870U (zh) 一种通讯电路、电器设备及空调
CN208154732U (zh) 从机通信电路、从机、电器设备和主从机通信电路
CN102855211A (zh) 通用串行总线—平衡电压数字接口转换器
CN110245103B (zh) 用于模块并联的同步信号母线电路、同步系统及同步方法
US8097841B2 (en) Conversion circuit for converting data of signal line between an air-conditioner and a computer
CN106533429B (zh) 强弱电隔离装置及电器
JP2003287265A (ja) 空気調和機の運転制御装置及びマルチ式空気調和機の運転制御装置
CN209949101U (zh) 一种485通讯自收发电路
CN106708772A (zh) 一种智能usb集线器
CN207650801U (zh) 一种485通信电路
CN201569170U (zh) 带有错接补救功能的燃气热水器通讯系统
CN206584349U (zh) 一种智能usb集线器电路
CN219243849U (zh) 一种空调控制板及空调设备
CN115118151B (zh) 一种软硬双控电路及电源启动控制方法
CN215729355U (zh) 安全控制器及其输出检测装置
CN114785940B (zh) 图像采集设备及同步采集控制方法
JP2006112704A (ja) 設備機器用通信回路

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18917245

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18917245

Country of ref document: EP

Kind code of ref document: A1