WO2019208039A1 - はんだ付け監視装置、はんだ付け監視方法およびはんだ付け装置 - Google Patents

はんだ付け監視装置、はんだ付け監視方法およびはんだ付け装置 Download PDF

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Publication number
WO2019208039A1
WO2019208039A1 PCT/JP2019/011901 JP2019011901W WO2019208039A1 WO 2019208039 A1 WO2019208039 A1 WO 2019208039A1 JP 2019011901 W JP2019011901 W JP 2019011901W WO 2019208039 A1 WO2019208039 A1 WO 2019208039A1
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WO
WIPO (PCT)
Prior art keywords
soldering
soldered
workpiece
temperature distribution
work
Prior art date
Application number
PCT/JP2019/011901
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English (en)
French (fr)
Japanese (ja)
Inventor
洵 小形
高木　誠司
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2020516113A priority Critical patent/JP6906696B2/ja
Priority to CN201980027206.4A priority patent/CN112004629B/zh
Publication of WO2019208039A1 publication Critical patent/WO2019208039A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • time-series temperature distribution data may be expressed in correspondence with the electronic component 12 mounted on the soldered workpiece 10 instead of expressing the upper surface of the workpiece 10 to be soldered with a two-dimensional matrix. For example, if time-series temperature distribution data is generated from a temperature distribution image signal of a temperature distribution image of 30 images taken at intervals of 0.1 seconds for a workpiece 10 to be soldered on which four electronic components 12 are mounted. The time change of the temperature distribution of the workpiece 10 to be soldered is expressed as a 4 ⁇ 30 three-dimensional matrix.
  • step S50 a step of determining whether the electronic component 12 is soldered to the workpiece 10 to be soldered and determining whether the maintenance work of the soldering apparatus 100 is necessary is performed.
  • the monitoring determination unit 62 calculates the temperature difference by comparing the data of the corresponding divided regions in the master data accumulated in the storage unit 63 and the time-series temperature distribution data generated in step S40. Then, the monitoring determination unit 62 determines whether or not the temperature difference is within a predetermined allowable temperature difference range by comparing the temperature difference and the allowable temperature difference range.
  • the allowable temperature difference range is a criterion for determining the soldering state, and is information indicating the allowable temperature difference range, and is stored in the storage unit 63 in advance.
  • an appropriate value preset in the monitoring determination unit 62 can be used as the adjustment instruction value of the device control parameter.
  • the electronic component 12 may be damaged.
  • the first peak temperature P1 and the second peak temperature P2 are too low, the soldering of the electronic component 12 fails.
  • the peak temperature time PT is too short, it is considered that at least one of the primary jet 86 and the secondary jet 87 is weakened.
  • the peak temperature time PT is too long, it is considered that at least one of the primary jet 86 and the secondary jet 87 is too strong.
  • the melting point of lead-free solder is about 200 ° C. or more and 230 ° C. or less.
  • the allowable range of peak temperature differs for each electronic component 12, and the case where the allowable range of peak temperature exists below 200 ° C. It is also conceivable that the range exists at 230 ° C. or higher. This is because the temperature measured by the thermo camera 5 is the upper surface of the workpiece 10 to be soldered, not the lower surface where the terminals 13 of the electronic component 12 to be soldered are present. For this reason, the temperature of the upper surface of the workpiece 10 to be soldered measured by the thermo camera 5 may be lower than the temperature of the lower surface where the terminal 13 of the electronic component 12 is present and the molten solder 85 is sprayed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
PCT/JP2019/011901 2018-04-27 2019-03-20 はんだ付け監視装置、はんだ付け監視方法およびはんだ付け装置 WO2019208039A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020516113A JP6906696B2 (ja) 2018-04-27 2019-03-20 はんだ付け監視装置、はんだ付け監視方法およびはんだ付け装置
CN201980027206.4A CN112004629B (zh) 2018-04-27 2019-03-20 钎焊监视装置、钎焊监视方法以及钎焊装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-087377 2018-04-27
JP2018087377 2018-04-27

Publications (1)

Publication Number Publication Date
WO2019208039A1 true WO2019208039A1 (ja) 2019-10-31

Family

ID=68294486

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/011901 WO2019208039A1 (ja) 2018-04-27 2019-03-20 はんだ付け監視装置、はんだ付け監視方法およびはんだ付け装置

Country Status (3)

Country Link
JP (1) JP6906696B2 (zh)
CN (1) CN112004629B (zh)
WO (1) WO2019208039A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021242062A1 (ko) * 2020-05-29 2021-12-02 주식회사 고영테크놀러지 솔더 인쇄 장치의 제어 파라미터를 최적화하기 위한 장치 및 방법
WO2022039193A1 (ja) * 2020-08-21 2022-02-24 三菱電機株式会社 はんだ噴流の評価装置及び評価方法、並びに、プリント基板の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115107360A (zh) * 2021-03-17 2022-09-27 英业达科技有限公司 基于网格聚类的锡膏印刷异常区域定位系统及其方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6391541A (ja) * 1986-10-06 1988-04-22 Fujitsu Ltd プリント板装置の半田付け個所検査方法
JPH0483152A (ja) * 1990-07-25 1992-03-17 Shuji Nakada 電子部品の接合部検査方法および検査装置
JP2002062273A (ja) * 2000-06-06 2002-02-28 Matsushita Electric Ind Co Ltd 鉛フリーはんだ材料の品質評価方法および装置ならびにフローはんだ付け方法およびシステム
JP2006140244A (ja) * 2004-11-11 2006-06-01 Nissan Motor Co Ltd ハンダ付け方法および装置
JP2008153342A (ja) * 2006-12-15 2008-07-03 Toshiba Corp 工程管理方法、データ登録プログラム及び電子装置の製造方法
JP2014236110A (ja) * 2013-06-03 2014-12-15 太洋工業株式会社 プリント基板層間接続部の検査方法およびプリント基板層間接続部検査装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01302149A (ja) * 1988-05-31 1989-12-06 Nec Home Electron Ltd 赤外線センサによる半田量検出法
CN102346079A (zh) * 2010-08-03 2012-02-08 英业达股份有限公司 一种采用计算机程序来监测电路板温度的方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6391541A (ja) * 1986-10-06 1988-04-22 Fujitsu Ltd プリント板装置の半田付け個所検査方法
JPH0483152A (ja) * 1990-07-25 1992-03-17 Shuji Nakada 電子部品の接合部検査方法および検査装置
JP2002062273A (ja) * 2000-06-06 2002-02-28 Matsushita Electric Ind Co Ltd 鉛フリーはんだ材料の品質評価方法および装置ならびにフローはんだ付け方法およびシステム
JP2006140244A (ja) * 2004-11-11 2006-06-01 Nissan Motor Co Ltd ハンダ付け方法および装置
JP2008153342A (ja) * 2006-12-15 2008-07-03 Toshiba Corp 工程管理方法、データ登録プログラム及び電子装置の製造方法
JP2014236110A (ja) * 2013-06-03 2014-12-15 太洋工業株式会社 プリント基板層間接続部の検査方法およびプリント基板層間接続部検査装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021242062A1 (ko) * 2020-05-29 2021-12-02 주식회사 고영테크놀러지 솔더 인쇄 장치의 제어 파라미터를 최적화하기 위한 장치 및 방법
WO2022039193A1 (ja) * 2020-08-21 2022-02-24 三菱電機株式会社 はんだ噴流の評価装置及び評価方法、並びに、プリント基板の製造方法
JP7439271B2 (ja) 2020-08-21 2024-02-27 三菱電機株式会社 はんだ噴流の評価装置、評価方法、及び、評価システム、並びに、プリント基板の製造方法

Also Published As

Publication number Publication date
JPWO2019208039A1 (ja) 2020-12-10
CN112004629A (zh) 2020-11-27
JP6906696B2 (ja) 2021-07-21
CN112004629B (zh) 2022-05-03

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