WO2019205752A1 - Oled器件 - Google Patents

Oled器件 Download PDF

Info

Publication number
WO2019205752A1
WO2019205752A1 PCT/CN2019/072096 CN2019072096W WO2019205752A1 WO 2019205752 A1 WO2019205752 A1 WO 2019205752A1 CN 2019072096 W CN2019072096 W CN 2019072096W WO 2019205752 A1 WO2019205752 A1 WO 2019205752A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
oled device
stepped
platform
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/072096
Other languages
English (en)
French (fr)
Inventor
邴一飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Publication of WO2019205752A1 publication Critical patent/WO2019205752A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED device in which an organic functional layer is uniformly formed into a film.
  • OLED Organic Light Emitting Diodes
  • LCD passive liquid crystal display
  • self-illuminating OLED display has the advantages of fast response, high contrast, wide viewing angle, and easy to realize flexible display. It is generally optimistic in the industry, and the industry agrees that OLED display It is very likely to become the mainstream product of the next generation display technology.
  • the OLED has an anode, an organic functional layer, and a cathode which are sequentially formed on a substrate.
  • the organic functional layer generally includes a hole injection layer (Hole Inject) Layer, HIL), hole transport layer (Hole Transport Layer (HTL), Emitting Layer (EML), Electron Inject Layer (EIL), and Electro Transport Layer (ETL).
  • HIL hole injection layer
  • HTL hole transport layer
  • EML Emitting Layer
  • EIL Electron Inject Layer
  • ETL Electro Transport Layer
  • each functional material layer and cathode metal layer film of the OLED are prepared by a vacuum thermal evaporation process, that is, the organic small molecular material is heated in a vacuum chamber to be sublimated or melted into a material vapor, and is deposited through a metal mask plate. On the glass substrate.
  • vacuum thermal evaporation due to the high cost of vacuum thermal evaporation, the commercialization of OLED displays is limited.
  • IJP Ink-jet printing
  • IJP technology is compared with the traditional vacuum evaporation process in the preparation of OLED device luminescent layer. It has many advantages such as saving materials, mild process conditions, and more uniform film formation, so it has more application potential.
  • a plurality of nozzles are used to drop a functional material ink into a predetermined pixel area, and then a desired pattern film is obtained by drying.
  • a groove is usually formed to restrict the ink so that ink droplets in which the OLED material is dissolved can flow into the groove, and after drying and baking, the ink shrinks in the concave A film is formed within the range of the groove limitation.
  • the groove 450 is surrounded by a bank layer 400 on both sides of the anode layer 210 on the glass substrate 100 and the anode layer 210 , and the organic functional layer 220 is surrounded by the bank layer 400 on the anode layer 210 .
  • the hydrophilicity of the different inks is different, as shown in Fig. 2, for the ink having good hydrophilicity, the slope is inclined higher on the inclined inner surface of the bank layer 400 to form the concave film layer 220'. As shown in Fig. 3, for an ink having poor hydrophilicity, a convex film layer 220'' is formed in the groove 450 of the bank layer 400.
  • the organic functional layer is uneven, which not only affects the uniformity of OLED device illumination, but also affects the microcavity effect of the top emission type OLED device, and the quality of the OLED device is degraded.
  • An object of the present invention is to provide an OLED device capable of uniformly forming an organic functional layer in a pixel opening region, effectively improving the uniformity of illumination of the OLED device, and accurately controlling the microcavity effect of the top emission type OLED device.
  • the present invention provides an OLED device including a substrate substrate, an anode layer disposed on the substrate substrate, a pixel defining layer disposed on the substrate substrate and the anode layer, and an organic layer disposed on the anode layer Functional layer
  • the pixel defining layer comprises a hydrophobic dam layer, wherein the hydrophobic dam layer is provided with a plurality of stepped platforms in a stepped manner, and the hydrophobic dam layer defines an upper width and a lower width above the anode layer through the plurality of step platforms a pixel opening area, each step platform has an upper surface and a side connected to the upper surface, and a hydrophilic dam layer is disposed on an upper surface of each step platform;
  • the organic functional layer is formed in the pixel opening region by inkjet printing.
  • the hydrophobic dam layer has three step platforms, which are respectively a first step platform, a second step platform and a third step platform which are arranged from bottom to top.
  • the organic functional layer includes a hole injection layer, a hole transport layer, and a light-emitting layer which are sequentially disposed on the anode layer from bottom to top;
  • the first step platform, the second step platform, and the third step platform are respectively disposed corresponding to the hole injection layer, the hole transport layer, and the light emitting layer.
  • an upper surface of the first stepped platform is 1-20 nm lower in height than an upper surface of the hole injection layer, and an upper surface of the second stepped platform is higher than an upper surface of the hole transport layer
  • the upper surface of the third step platform is 1-20 nm lower in height than the upper surface of the light-emitting layer.
  • the hydrophilic dam layer has a thickness of 1 to 50 nm.
  • anode layer and the hydrophilic dam layer are each formed of a hydrophilic material
  • the hydrophobic dam layer is formed of a hydrophobic material
  • the organic functional layer is formed by ink printing by inkjet printing
  • the contact angle between the hydrophobic dam layer and the ink material forming the organic functional layer is 20-80°;
  • the contact angle of the anode layer and the hydrophilic bank layer with the ink material forming the organic functional layer is 0-10°.
  • the OLED device is a top emission type OLED device, and further includes a cathode layer disposed on the organic functional layer and the pixel defining layer.
  • the organic functional layer further includes an electron transport layer and an electron injection layer which are sequentially disposed on the light emitting layer from bottom to top.
  • the base substrate is a glass substrate.
  • An OLED device provided by the present invention comprises a substrate substrate, an anode layer, a pixel defining layer and an organic functional layer, wherein the pixel defining layer is composed of a hydrophobic dam layer and a hydrophilic dam layer, and the hydrophobic dam layer is provided with a stepped plurality of stepped platforms, wherein the hydrophobic dam layer defines an upper and lower narrow pixel opening area above the anode layer by the plurality of step platforms, and a hydrophilic dam layer is disposed on an upper surface of each step platform Therefore, when the organic functional layer is formed by the inkjet printing process, the ink material forming the organic functional layer can be better penetrated into the pixel opening region, and the film surface of the ink material in the pixel opening region is flattened. Furthermore, the organic functional layer can be uniformly formed in the pixel opening region, the luminescence uniformity of the OLED device can be effectively improved, and the microcavity effect of the top emission OLED device can be accurately controlled.
  • FIG. 1 is a schematic structural view of a conventional OLED device
  • FIG. 2 is a schematic view showing a hydrophilic ink forming a concave film layer in a groove
  • FIG. 3 is a schematic view showing a hydrophobic ink forming a convex film layer in a groove
  • FIG. 4 is a schematic structural view of an OLED device of the present invention.
  • the present invention provides an OLED device including a substrate substrate 10, an anode layer 21 disposed on the substrate substrate 10, and a pixel defining layer 40 disposed on the substrate substrate 10 and the anode layer 21.
  • the pixel defining layer 40 includes a hydrophobic dam layer 41.
  • the hydrophobic dam layer 41 is provided with a plurality of stepped platforms 411 in a stepped manner, and the hydrophobic dam layer 41 passes through the plurality of stepped platforms 411 at the anode layer.
  • a pixel opening area 45 is defined which is wide and narrow, and each step platform 411 has an upper surface and a side surface connected to the upper surface, and a hydrophilic dam layer 42 is disposed on the upper surface of each step platform 411.
  • the height of the hydrophobic dam layer 41 of the pixel defining layer 40 is higher than the height of the organic functional layer 22, and the organic functional layer 22 is formed by the ink material by inkjet printing in the pixel opening region 45, that is, The pixel defining layer 40 surrounds the organic functional layer 22 above the anode layer 21.
  • the pixel defining layer 40 of the OLED device of the present invention is composed of a hydrophobic dam layer 41 and a hydrophilic dam layer 42.
  • the hydrophobic dam layer 41 is provided with a plurality of stepped platforms 411 which are stepped, and the hydrophobic dam layer 41 passes through
  • the plurality of stepped platforms 411 define an upper and lower narrow pixel opening area 45 above the anode layer 21, and the hydrophilic dam layer 42 is disposed on the upper surface of each step platform, and then inkjet printing is employed.
  • the organic functional layer 22 of the OLED device is fabricated, the ink material that can be used to form the organic functional layer 22 can better enter the pixel opening region 45, and the ink material is flattened at the film surface of the pixel opening region 45.
  • the organic functional layer 22 is uniformly formed in the domain of the pixel opening region 45, thereby effectively improving the uniformity of light emission of the OLED device, and further capable of accurately controlling the microcavity effect of the top emission type OLED device.
  • the hydrophobic dam layer 41 has three step platforms 411, which are respectively a first step platform, a second step platform, and a third step platform disposed from bottom to top.
  • the organic functional layer 22 includes a hole injection layer 221, a hole transport layer 222, a light-emitting layer 223, an electron transport layer, and an electron injection layer which are sequentially disposed on the anode layer 21 from bottom to top (not shown).
  • the first step platform, the second step platform, and the third step platform of the hydrophobic dam layer 41 are respectively disposed corresponding to the hole injection layer 221, the hole transport layer 222, and the light-emitting layer 223.
  • the hydrophilic bank layer 42 has a thickness of 1 to 50 nm.
  • an upper surface of the first stepped platform is 1 nm lower in height than an upper surface of the hole injection layer 221, and an upper surface of the second stepped platform is higher than an upper surface of the hole transport layer 222
  • the upper surface of the third step platform is 1 nm lower in height than the upper surface of the light-emitting layer 223 by 1 nm lower in height.
  • the anode layer 21 and the hydrophilic bank layer 42 are each formed of a hydrophilic material
  • the hydrophobic bank layer 41 is formed of a hydrophobic material.
  • the contact angle of the hydrophobic dam layer 41 with the ink material forming the organic functional layer 22 is 20-80°.
  • the contact angle of the anode layer 21 and the hydrophilic bank layer 42 with the ink material forming the organic functional layer 22 is 0-10°.
  • the base substrate 10 is a glass substrate.
  • the OLED device is a top emission type OLED device.
  • the present invention provides an OLED device including a substrate substrate, an anode layer, a pixel defining layer, and an organic functional layer, the pixel defining layer being composed of a hydrophobic dam layer and a hydrophilic dam layer, the hydrophobic dam
  • the layer is provided with a plurality of stepped platforms in a stepped manner, and the hydrophobic dam layer defines an upper and lower narrow pixel opening area above the anode layer through the plurality of stepped platforms, and a hydrophilic dam layer is disposed on each On the upper surface of the step platform, so that when the organic functional layer is formed by the inkjet printing process, the ink material forming the organic functional layer can be better penetrated into the pixel opening region, and the ink material is in the pixel opening region
  • the film surface is flat, thereby enabling uniform formation of the organic functional layer in the pixel opening region, effectively improving the uniformity of illumination of the OLED device, and accurately controlling the microcavity effect of the top emission type OLED device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED器件,包括衬底基板(10)、阳极层(21)、像素定义层(40)以及有机功能层(22),所述像素定义层(40)由疏水堤坝层(41)和亲水堤坝层(42)组成,所述疏水堤坝层(41)上设有呈阶梯状的多个台阶平台(411),所述疏水堤坝层(41)通过所述多个台阶平台(411)在所述阳极层(21)上方定义出上宽下窄的像素开口区域(45),亲水堤坝层(42)设于每一台阶平台(411)的上表面上。

Description

OLED器件 技术领域
本发明涉及显示技术领域,尤其涉及一种有机功能层均匀成膜的OLED器件。
背景技术
有机电致发光二极体(Organic Light Emitting Diodes,OLED)属于一种新型电流型半导体发光器件,是通过控制该器件载流子的注入和复合激发有机材料发光显示,属于一种自主发光技术。与被动发光的液晶显示器( Liquid Crystal Display ,LCD)相比,自主发光的OLED显示器具有响应速度快、对比度高、视角广等优点,并且容易实现柔性显示,被业内普遍看好,业界一致认为OLED显示器极有可能成为下一代显示技术的主流产品。
OLED具有依次形成于基板上的阳极、有机功能层和阴极。其中有机功能层,一般包括空穴注入层(Hole Inject Layer,HIL)、空穴传输层(Hole Transport Layer,HTL)、发光层(Emitting layer,EML)、电子注入层(Electron Inject Layer,EIL)以及电子传输层(Electron Transport Layer,ETL)。目前,OLED各功能材料层与阴极金属层薄膜均通过真空热蒸镀工艺制备,即在真空腔体内加热有机小分子材料,使其升华或者熔融气化成材料蒸汽,通过金属掩模版的开孔沉积在玻璃基板上。但由于真空热蒸发制备成本高,限制了OLED显示器的大范围商业化。
喷墨打印(Ink-jet Printing,IJP)具有材料利用率高等优点,是解决大尺寸OLED显示器成本问题的关键技术,IJP技术在OLED器件发光层的制备中,相比于传统的真空蒸镀工艺,具有节省材料、制程条件温和、成膜更均匀等诸多优点,所以更具应用潜力。此方法是利用多个喷嘴将功能材料油墨滴入预定的像素区域,之后通过干燥获得所需图案薄膜。
在应用于IJP成膜工艺的基板上,通常会制作凹槽,用来限制住油墨,这样溶解有OLED材料的油墨液滴能够流进凹槽内,通过干燥烘烤后,油墨收缩在该凹槽限制的范围内形成薄膜。请参阅图1,所述凹槽450由阳极层210两边的堤坝(Bank)层400在玻璃基板100和阳极层210上围出,有机功能层220被堤坝层400围拢在阳极层210之上。
然而由于不同油墨的亲水性不同,如图2所示,对于亲水性好的油墨,会在堤坝层400的倾斜内面上爬坡较高,形成凹形膜层220’。如图3所示,对于亲水性不好的油墨,会在堤坝层400的凹槽450内形成凸形膜层220’’。而有机功能层凹凸不平,不仅会影响OLED器件发光的均匀性,对于顶发射(Top emission)型的OLED器件,还会严重的影响其微腔效应,使OLED器件的品质下降。
技术问题
本发明的目的在于提供一种OLED器件,能够实现有机功能层在像素开口区域内均匀成膜,有效改善OLED器件的发光均匀性,并能准确控制顶发射型OLED器件的微腔效应。
技术解决方案
为实现上述目的,本发明提供了一种OLED器件,包括衬底基板、设置于衬底基板上的阳极层、设于衬底基板及阳极层上的像素定义层以及设于阳极层上的有机功能层;
所述像素定义层包括疏水堤坝层,所述疏水堤坝层上设有呈阶梯状的多个台阶平台,所述疏水堤坝层通过所述多个台阶平台在阳极层上方定义出上宽下窄的像素开口区域,每一台阶平台具有上表面及与上表面连接的侧面,每一台阶平台的上表面上均设有亲水堤坝层;
所述有机功能层通过喷墨打印的方式形成于所述像素开口区域内。
进一步地,所述疏水堤坝层具有三个台阶平台,分别为由下至上设置的第一台阶平台、第二台阶平台、第三台阶平台。
进一步地,所述有机功能层包括由下至上依次设于所述阳极层上的空穴注入层、空穴传输层及发光层;
所述第一台阶平台、第二台阶平台、第三台阶平台分别对应空穴注入层、空穴传输层及发光层设置。
进一步地,所述第一台阶平台的上表面比所述空穴注入层的上表面在高度上低1-20nm,所述第二台阶平台的上表面比所述空穴传输层的上表面在高度上低1-20nm,所述第三台阶平台的上表面比所述发光层的上表面在高度上低1-20nm。
进一步地,所述亲水堤坝层的厚度为1-50nm。
进一步地,所述阳极层和亲水堤坝层均由亲水性材料制作形成,所述疏水堤坝层由疏水性材料制作形成。
进一步地,所述有机功能层由油墨材料通过喷墨打印的方式制作形成;
所述疏水堤坝层与形成有机功能层的油墨材料的接触角为20-80°;
所述阳极层和亲水堤坝层与形成有机功能层的油墨材料的接触角为0-10°。
进一步地,所述的OLED器件为顶发射型OLED器件,还包括设于有机功能层和像素定义层上的阴极层。
进一步地,所述有机功能层还包括由下至上依次设于所述发光层上的电子传输层和电子注入层。
进一步地,所述衬底基板为玻璃基板。
有益效果
本发明提供的一种OLED器件,包括衬底基板、阳极层、像素定义层以及有机功能层,所述像素定义层由疏水堤坝层和亲水堤坝层组成,所述疏水堤坝层上设有呈阶梯状的多个台阶平台,所述疏水堤坝层通过所述多个台阶平台在所述阳极层上方定义出上宽下窄的像素开口区域,亲水堤坝层设于每一台阶平台的上表面上,从而在采用喷墨打印工艺制作有机功能层时,可以使形成有机功能层的油墨材料能够更好地进入像素开口区域内,并且使得油墨材料在所述像素开口区域内的膜面平整,进而能够实现有机功能层在像素开口区域内均匀成膜,有效改善OLED器件的发光均匀性,并能准确控制顶发射型OLED器件的微腔效应。
为了能更进一步了解本发明的特征以及技术内容,请参阅以下有关本发明的详细说明与附图,然而附图仅提供参考与说明用,并非用来对本发明加以限制。
附图说明
下面结合附图,通过对本发明的具体实施方式详细描述,将使本发明的技术方案及其它有益效果显而易见。
图1为现有OLED器件的结构示意图;
图2为亲水性油墨在凹槽内形成凹形膜层的示意图;
图3为疏水性油墨在凹槽内形成凸形膜层的示意图;
图4为本发明的OLED器件的结构示意图。
本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果,以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图4,本发明提供一种OLED器件,包括衬底基板10、设置于衬底基板10上的阳极层21、设于衬底基板10及阳极层21上的像素定义层40、设于阳极层21上的有机功能层22以及设于有机功能层22和像素定义层40上的阴极层(未图示);
所述像素定义层40包括疏水堤坝层41,所述疏水堤坝层41上设有呈阶梯状的多个台阶平台411,所述疏水堤坝层41通过所述多个台阶平台411在所述阳极层21上方定义出上宽下窄的像素开口区域45,每一台阶平台411具有上表面及与上表面连接的侧面,每一台阶平台411的上表面上均设有亲水堤坝层42。
所述像素定义层40的疏水堤坝层41的高度高于所述有机功能层22的高度,所述有机功能层22由油墨材料通过喷墨打印的方式形成于所述像素开口区域45内,即所述像素定义层40将有机功能层22围拢在所述阳极层21的上方。
本发明的OLED器件的像素定义层40由疏水堤坝层41和亲水堤坝层42组成,所述疏水堤坝层41上设有呈阶梯状的多个台阶平台411,所述疏水堤坝层41通过所述多个台阶平台411在所述阳极层21上方定义出了上宽下窄的像素开口区域45,所述亲水堤坝层42设于每一台阶平台的上表面上,那么在采用喷墨打印工艺制作OLED器件的有机功能层22时,可以使用于形成有机功能层22的油墨材料能够更好地进入像素开口区域45内,并且使得油墨材料在所述像素开口区域45的膜面平整,实现有机功能层22在像素开口区45域内均匀成膜,从而有效改善OLED器件的发光均匀性,并进一步能够准确控制顶发射型OLED器件的微腔效应。
具体地,所述疏水堤坝层41具有三个台阶平台411,分别为由下至上设置的第一台阶平台、第二台阶平台、第三台阶平台。
具体地,所述有机功能层22包括由下至上依次设于所述阳极层21上的空穴注入层221、空穴传输层222、发光层223、电子传输层和电子注入层(未图示);所述疏水堤坝层41的第一台阶平台、第二台阶平台、第三台阶平台分别对应空穴注入层221、空穴传输层222及发光层223设置。
具体地,所述亲水堤坝层42的厚度为1-50nm。
优选地,所述第一台阶平台的上表面比所述空穴注入层221的上表面在高度上低1nm,所述第二台阶平台的上表面比所述空穴传输层222的上表面在高度上低1nm,所述第三台阶平台的上表面比所述发光层223的上表面在高度上低1nm。
具体地,所述阳极层21和亲水堤坝层42均由亲水性材料制作形成,所述疏水堤坝层41由疏水性材料制作形成。
具体地,所述疏水堤坝层41与形成有机功能层22的油墨材料的接触角为20-80°。
具体地,所述阳极层21和亲水堤坝层42与形成有机功能层22的油墨材料的接触角为0-10°。
具体地,所述衬底基板10为玻璃基板。
具体地,所述OLED器件为顶发射型OLED器件。
综上所述,本发明提供的一种OLED器件,包括衬底基板、阳极层、像素定义层以及有机功能层,所述像素定义层由疏水堤坝层和亲水堤坝层组成,所述疏水堤坝层上设有呈阶梯状的多个台阶平台,所述疏水堤坝层通过所述多个台阶平台在所述阳极层上方定义出上宽下窄的像素开口区域,亲水堤坝层设于每一台阶平台的上表面上,从而在采用喷墨打印工艺制作有机功能层时,可以使形成有机功能层的油墨材料能够更好地进入像素开口区域内,并且使得油墨材料在所述像素开口区域内的膜面平整,进而能够实现有机功能层在像素开口区域内均匀成膜,有效改善OLED器件的发光均匀性,并能准确控制顶发射型OLED器件的微腔效应。
以上所述,对于本领域的普通技术人员来说,可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形,而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (15)

  1. 一种OLED器件,其包括衬底基板、设置于衬底基板上的阳极层、设于衬底基板及阳极层上的像素定义层、设于阳极层上的有机功能层、以及设于有机功能层和像素定义层上的阴极层;
    所述像素定义层包括疏水堤坝层,所述疏水堤坝层上设有呈阶梯状的多个台阶平台,所述疏水堤坝层通过所述多个台阶平台在所述阳极层上方定义出上宽下窄的像素开口区域,每一台阶平台具有上表面及与上表面连接的侧面,每一台阶平台的上表面上均设有亲水堤坝层;
    所述有机功能层通过喷墨打印的方式形成于所述像素开口区域内;所述阳极层和亲水堤坝层均由亲水性材料制作形成,所述疏水堤坝层由疏水性材料制作形成。
  2. 如权利要求1所述的OLED器件,其中,所述疏水堤坝层具有三个台阶平台,分别为由下至上设置的第一台阶平台、第二台阶平台、第三台阶平台。
  3. 如权利要求2所述的OLED器件,其中,所述有机功能层包括由下至上依次设于所述阳极层上的空穴注入层、空穴传输层及发光层;
    所述第一台阶平台、第二台阶平台、第三台阶平台分别对应空穴注入层、空穴传输层及发光层设置。
  4. 如权利要求3所述的OLED器件,其中,所述第一台阶平台的上表面比所述空穴注入层的上表面在高度上低1-20nm,所述第二台阶平台的上表面比所述空穴传输层的上表面在高度上低1-20nm,所述第三台阶平台的上表面比所述发光层的上表面在高度上低1-20nm。
  5. 如权利要求1所述的OLED器件,其中,所述亲水堤坝层的厚度为1-50nm。
  6. 一种OLED器件,其包括衬底基板、设置于衬底基板上的阳极层、设于衬底基板及阳极层上的像素定义层以及设于阳极层上的有机功能层;
    所述像素定义层包括疏水堤坝层,所述疏水堤坝层上设有呈阶梯状的多个台阶平台,所述疏水堤坝层通过所述多个台阶平台在所述阳极层上方定义出上宽下窄的像素开口区域,每一台阶平台具有上表面及与上表面连接的侧面,每一台阶平台的上表面上均设有亲水堤坝层;
    所述有机功能层通过喷墨打印的方式形成于所述像素开口区域内。
  7. 如权利要求6所述的OLED器件,其中,所述疏水堤坝层具有三个台阶平台,分别为由下至上设置的第一台阶平台、第二台阶平台、第三台阶平台。
  8. 如权利要求7所述的OLED器件,其中,所述有机功能层包括由下至上依次设于所述阳极层上的空穴注入层、空穴传输层及发光层;
    所述第一台阶平台、第二台阶平台、第三台阶平台分别对应空穴注入层、空穴传输层及发光层设置。
  9. 如权利要求8所述的OLED器件,其中,所述第一台阶平台的上表面比所述空穴注入层的上表面在高度上低1-20nm,所述第二台阶平台的上表面比所述空穴传输层的上表面在高度上低1-20nm,所述第三台阶平台的上表面比所述发光层的上表面在高度上低1-20nm。
  10. 如权利要求8所述的OLED器件,其中,所述有机功能层还包括由下至上依次设于所述发光层上的电子传输层和电子注入层。
  11. 如权利要求6所述的OLED器件,其中,所述亲水堤坝层的厚度为1-50nm。
  12. 如权利要求6所述的OLED器件,其中,所述阳极层和亲水堤坝层均由亲水性材料制作形成,所述疏水堤坝层由疏水性材料制作形成。
  13. 如权利要求6所述的OLED器件,其中,所述有机功能层由油墨材料通过喷墨打印的方式制作形成;
    所述疏水堤坝层与形成有机功能层的油墨材料的接触角为20-80°;
    所述阳极层和亲水堤坝层与形成有机功能层的油墨材料的接触角为0-10°。
  14. 如权利要求6所述的OLED器件,其中,所述OLED器件为顶发射型OLED器件,还包括设于有机功能层和像素定义层上的阴极层。
  15. 如权利要求6所述的OLED器件,其中,所述衬底基板为玻璃基板。
PCT/CN2019/072096 2018-04-23 2019-01-17 Oled器件 Ceased WO2019205752A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810368599.2 2018-04-23
CN201810368599.2A CN108598110B (zh) 2018-04-23 2018-04-23 Oled器件

Publications (1)

Publication Number Publication Date
WO2019205752A1 true WO2019205752A1 (zh) 2019-10-31

Family

ID=63614172

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/072096 Ceased WO2019205752A1 (zh) 2018-04-23 2019-01-17 Oled器件

Country Status (2)

Country Link
CN (1) CN108598110B (zh)
WO (1) WO2019205752A1 (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108598110B (zh) * 2018-04-23 2020-11-24 深圳市华星光电半导体显示技术有限公司 Oled器件
KR20200071429A (ko) * 2018-12-11 2020-06-19 엘지디스플레이 주식회사 유기전계발광 표시장치 및 그 제조방법
CN110165090B (zh) * 2019-05-10 2021-06-01 深圳市华星光电半导体显示技术有限公司 有机发光显示器件及其制作方法
CN110176477A (zh) * 2019-05-20 2019-08-27 深圳市华星光电半导体显示技术有限公司 基于喷墨打印技术的有机发光显示装置及其制作方法
CN110224007B (zh) * 2019-05-29 2022-06-10 苏州星烁纳米科技有限公司 显示基板及其制备方法、显示面板
CN111029476A (zh) * 2019-11-25 2020-04-17 深圳市华星光电半导体显示技术有限公司 显示器及其制备方法
CN111081737A (zh) * 2019-12-05 2020-04-28 深圳市华星光电半导体显示技术有限公司 一种阵列基板制备方法及阵列基板
CN111834536B (zh) * 2020-07-07 2022-04-26 Tcl华星光电技术有限公司 一种oled面板及其制备方法
CN111930264B (zh) * 2020-09-15 2023-12-01 武汉华星光电半导体显示技术有限公司 一种触控显示面板和触控显示装置
JP7511183B2 (ja) * 2020-09-17 2024-07-05 パナソニックIpマネジメント株式会社 機能デバイス、および、機能デバイスの製造方法
CN112420795A (zh) * 2020-11-18 2021-02-26 武汉华星光电半导体显示技术有限公司 Oled显示面板及其制备方法
CN113053967A (zh) 2021-03-09 2021-06-29 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法、显示装置
CN115084189B (zh) * 2021-03-12 2025-07-08 京东方科技集团股份有限公司 一种阵列基板、显示装置及阵列基板的制作方法
CN113571559A (zh) * 2021-07-15 2021-10-29 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法、显示装置
US12446405B2 (en) 2021-07-15 2025-10-14 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Display panel and method for preparing same and display device
CN114220835A (zh) * 2021-12-13 2022-03-22 合肥鑫晟光电科技有限公司 一种显示基板及其制备方法、显示装置
CN114447258B (zh) * 2022-01-20 2023-12-01 深圳市华星光电半导体显示技术有限公司 显示面板及显示终端
CN115274794A (zh) * 2022-07-21 2022-11-01 深圳市华星光电半导体显示技术有限公司 显示面板及其制备方法
CN115954308A (zh) * 2023-01-13 2023-04-11 上海积塔半导体有限公司 晶圆结构及其制备方法
CN116234372B (zh) * 2023-03-03 2025-12-30 武汉天马微电子有限公司 显示面板及显示装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104733505A (zh) * 2015-03-19 2015-06-24 京东方科技集团股份有限公司 发光显示器的像素界定层及其制作方法
KR20160094525A (ko) * 2015-01-30 2016-08-10 엘지디스플레이 주식회사 유기 발광 소자와 그 제조 방법 및 그를 이용한 유기 발광 디스플레이 장치
CN105870157A (zh) * 2016-05-30 2016-08-17 深圳市华星光电技术有限公司 用于打印成膜的凹槽结构及其制作方法
CN105932037A (zh) * 2016-05-12 2016-09-07 京东方科技集团股份有限公司 一种有机电致发光显示基板及其制备方法、显示装置
CN107403823A (zh) * 2016-12-08 2017-11-28 广东聚华印刷显示技术有限公司 像素界定层及其制备方法和应用
CN108598110A (zh) * 2018-04-23 2018-09-28 深圳市华星光电半导体显示技术有限公司 Oled器件

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101871227B1 (ko) * 2011-08-12 2018-08-03 삼성디스플레이 주식회사 유기 발광 소자 및 그 제조 방법
CN104638147B (zh) * 2015-03-04 2017-01-25 京东方科技集团股份有限公司 一种像素界定层及oled器件
CN107527939B (zh) * 2017-08-17 2020-07-07 京东方科技集团股份有限公司 像素界定层及其制造方法、显示基板、显示面板

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160094525A (ko) * 2015-01-30 2016-08-10 엘지디스플레이 주식회사 유기 발광 소자와 그 제조 방법 및 그를 이용한 유기 발광 디스플레이 장치
CN104733505A (zh) * 2015-03-19 2015-06-24 京东方科技集团股份有限公司 发光显示器的像素界定层及其制作方法
CN105932037A (zh) * 2016-05-12 2016-09-07 京东方科技集团股份有限公司 一种有机电致发光显示基板及其制备方法、显示装置
CN105870157A (zh) * 2016-05-30 2016-08-17 深圳市华星光电技术有限公司 用于打印成膜的凹槽结构及其制作方法
CN107403823A (zh) * 2016-12-08 2017-11-28 广东聚华印刷显示技术有限公司 像素界定层及其制备方法和应用
CN108598110A (zh) * 2018-04-23 2018-09-28 深圳市华星光电半导体显示技术有限公司 Oled器件

Also Published As

Publication number Publication date
CN108598110A (zh) 2018-09-28
CN108598110B (zh) 2020-11-24

Similar Documents

Publication Publication Date Title
WO2019205752A1 (zh) Oled器件
US10811476B2 (en) Pixel definition layer, manufacturing method thereof, display substrate and display device
CN107887423B (zh) 一种显示面板、其制备方法及显示装置
TWI616546B (zh) 多噴嘴之有機蒸氣噴射印刷
CN107591432B (zh) 像素界定层、显示基板及制造方法、显示装置
JP3628997B2 (ja) 有機エレクトロルミネッセンス装置の製造方法
JP4048687B2 (ja) 有機el素子および有機el素子の製造方法
CN105895818B (zh) 用于打印成膜工艺的凹槽结构及其制作方法
CN105140236B (zh) 基板组件及其制备方法以及显示装置
US10510990B2 (en) Groove structure for printing OLED display and manufacturing method for OLED display
JP4313274B2 (ja) インクジェットプリント用基板及びその製造方法
CN107452782A (zh) 一种基板及其制备方法、显示面板
WO2017096709A1 (zh) 用于打印成膜工艺的凹槽结构及其制作方法
CN110164941B (zh) 像素界定层和制作方法、显示面板和制作方法、显示装置
WO2017206206A1 (zh) 用于打印成膜的凹槽结构及其制作方法
WO2021249158A1 (zh) 显示基板、其制作方法及显示装置
WO2018120362A1 (zh) Oled基板及其制作方法
WO2021227153A1 (zh) 显示面板
WO2019153732A1 (zh) 一种顶发光oled基板及其制备方法、oled显示面板
CN110828520B (zh) 一种阵列基板及其制备方法、显示面板和显示装置
WO2020056953A1 (zh) Oled显示面板及其制备方法
CN111341807B (zh) 像素界定结构、oled显示面板
WO2021212586A1 (zh) 显示面板及显示面板的制备方法
WO2020019481A1 (zh) Oled基板及其制作方法
WO2019075855A1 (zh) Oled基板结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19793726

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19793726

Country of ref document: EP

Kind code of ref document: A1