WO2019205437A1 - Micro LED显示面板的制作方法及Micro LED显示面板 - Google Patents

Micro LED显示面板的制作方法及Micro LED显示面板 Download PDF

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Publication number
WO2019205437A1
WO2019205437A1 PCT/CN2018/105589 CN2018105589W WO2019205437A1 WO 2019205437 A1 WO2019205437 A1 WO 2019205437A1 CN 2018105589 W CN2018105589 W CN 2018105589W WO 2019205437 A1 WO2019205437 A1 WO 2019205437A1
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elastic conductive
micro led
pixel electrodes
substrate
solvent
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French (fr)
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陈黎暄
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US16/096,692 priority Critical patent/US10665573B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

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  • the present invention relates to the field of display technologies, and in particular, to a method for fabricating a Micro LED display panel and a Micro LED display panel.
  • Micro LED LED miniaturization and matrixing, refers to high-density, tiny-sized LED arrays that are integrated on a single chip.
  • Micro LEDs consume far less power than liquid crystal displays (LCDs), and are self-illuminating like organic light-emitting diodes (OLEDs), which can reduce the distance between pixels from millimeters to micrometers. The color saturation is close to OLED, so many manufacturers regard Micro LED as the next generation display technology.
  • a micro LED array is fabricated by a micro transfer printing method: after the LED bare chip (Bare Chip) is separated from the sapphire substrate by laser lift-off (LLO) technology, a The patterned transfer layer adsorbs the LED bare chip from the supply substrate and transfers it to the receiving substrate.
  • the receiving substrate is a silicon substrate in which the circuit pattern has been prepared in advance, and by aligning the transfer substrate and the receiving substrate, the bare LED chip adsorbed on the transfer substrate is attached to the matching position of the receiving substrate, and then stripped and transferred.
  • the substrate can complete the transfer of the LED bare chip.
  • Patents such as US 2013/0210194, US 2013/0128585 and the like have a more detailed description of the micro transfer technology.
  • the existing Micro LED can be divided into a vertical structure of a Micro LED and a horizontal structure of a Micro LED.
  • the two electrodes of the vertical structure of the Micro LED are respectively located on the upper and lower sides of the light-emitting layer, and two of the horizontally-structured Micro LEDs.
  • the electrodes are located on the lower side of the light-emitting layer; compared with the horizontal structure of the Micro LED, the vertical structure of the Micro LED has the following advantages: 1.
  • the manufacturing process is similar to the manufacturing process of the conventional TFT-LCD, and some machines and equipment can be Inheritance; 2, the industry has developed some techniques to control the leakage current of the vertical structure of the Micro LED.
  • an upper pixel electrode and a lower pixel electrode are respectively required to be driven to operate on the upper and lower electrodes, wherein the upper pixel electrode is formed on the package substrate, and the lower pixel electrode is formed on the driving substrate. Then, the package substrate and the driving substrate are paired to obtain a Micro LED display panel. When the package substrate and the driving substrate are paired, the height of each Micro LED is not completely the same, which is easy. The upper electrode of the pixel electrode and the upper electrode of the Micro LED do not fit properly, which causes the problem that the upper pixel electrode and the upper electrode of the Micro LED cannot be electrically connected.
  • An object of the present invention is to provide a method for fabricating a Micro LED display panel, which can improve the effect of pairing the micro LED display panel and avoid poor connection between the upper pixel electrode and the upper electrode of the Micro LED.
  • Another object of the present invention is to provide a Micro LED display panel capable of improving the effect of the pairing and avoiding poor connection between the upper pixel electrode and the upper electrode of the Micro LED.
  • the present invention provides a method for fabricating a Micro LED display panel, comprising the following steps:
  • Step S1 providing a driving substrate, forming a plurality of lower pixel electrodes arranged in an array on the driving substrate, and forming vertical LEDs on each of the lower pixel electrodes, wherein the respective lower pixel electrodes respectively correspond to the micro LEDs Electrical connection of the lower electrode;
  • Step S2 providing a package substrate, forming a plurality of upper pixel electrodes arranged in an array on the package substrate, and forming an elastic conductive layer on each of the upper pixel electrodes;
  • Step S3 The package substrate and the driving substrate are paired and pressurized, so that each of the upper pixel electrodes is fixedly attached to the corresponding upper microelectrode through the elastic conductive layer and electrically connected to the upper electrode of the Micro LED.
  • the elastic conductive layer is formed in the step S2 by coating a first solution on each of the upper pixel electrodes.
  • the first solution includes a first solvent and a plurality of elastic conductive balls dispersed in the first solvent, and the first solvent is a solvent capable of curing.
  • the package substrate and the drive substrate are paired and pressurized, and a curing process is performed to cure the first solvent in the elastic conductive layer.
  • the thickness of the elastic conductive layer is less than twice the diameter of the elastic conductive ball in a natural state, and after the first solvent is cured, the thickness of the elastic conductive layer is smaller than The diameter of the elastic conductive ball in a natural state.
  • the elastic conductive layer is formed in the step S2 by coating a conductive paste having elasticity on each of the upper pixel electrodes.
  • the package substrate Before the package substrate and the drive substrate are bonded to each other, the package substrate further includes a support formed on the drive substrate or the package substrate.
  • the present invention also provides a micro LED display panel, comprising: a driving substrate, a package substrate disposed opposite to the driving substrate, and a plurality of lower pixel electrodes arranged in an array disposed on a side of the driving substrate adjacent to the package substrate; a plurality of upper pixel electrodes facing the plurality of lower pixel electrodes on a side of the package substrate adjacent to the driving substrate, a Micro LED disposed between each of the lower pixel electrodes and the upper pixel electrode, and An elastic conductive layer between each of the Micro LEDs and the upper pixel electrode, wherein the Micro LED is a vertical structure of the Micro LED, and each of the lower pixel electrodes is electrically connected to a lower electrode of the corresponding Micro LED, and each of the upper pixel electrodes The elastic conductive layers are respectively electrically connected to the upper electrodes of the corresponding micro LEDs.
  • the material of the elastic conductive layer is a first solution or a conductive paste having elasticity
  • the first solution includes: a first solvent and a plurality of elastic conductive balls dispersed in the first solvent, the first solvent is capable of curing Solvent.
  • the Micro LED display panel further includes a support located on a side of the drive substrate adjacent to the package substrate or a side of the package substrate adjacent to the drive substrate.
  • the invention also provides a method for manufacturing a Micro LED display panel, comprising the following steps:
  • Step S1 providing a driving substrate, forming a plurality of lower pixel electrodes arranged in an array on the driving substrate, and forming vertical LEDs on each of the lower pixel electrodes, wherein the respective lower pixel electrodes respectively correspond to the micro LEDs Electrical connection of the lower electrode;
  • Step S2 providing a package substrate, forming a plurality of upper pixel electrodes arranged in an array on the package substrate, and forming an elastic conductive layer on each of the upper pixel electrodes;
  • Step S3 the package substrate and the driving substrate are paired and pressurized, so that the upper pixel electrodes are respectively fixedly attached to the corresponding micro-LEDs through the elastic conductive layer and electrically connected to the upper electrode of the Micro LED;
  • the elastic conductive layer is formed by coating a first solution on each upper pixel electrode;
  • the first solution comprises: a first solvent and a plurality of elastic conductive materials dispersed in the first solvent a ball, the first solvent is a solvent capable of curing;
  • the package substrate and the drive substrate are paired and pressurized, and a curing process is further performed to cure the first solvent in the elastic conductive layer;
  • the package substrate Before the package substrate and the drive substrate are bonded to the group, the package substrate further includes a support formed on the drive substrate or the package substrate.
  • the present invention provides a method for fabricating a micro LED display panel by forming an elastic conductive layer on an upper pixel electrode on a package substrate, and implementing an elastic conductive layer when the package substrate and the drive substrate are paired
  • the electrical connection between the upper pixel electrode and the upper electrode of the Micro LED can fill the height difference between the respective micro LEDs by utilizing the elasticity of the elastic conductive layer, thereby avoiding poor connection between the upper pixel electrode and the upper electrode of the Micro LED, and improving the Micro LED display panel
  • the invention also provides a Micro LED display panel, which can improve the pairing effect of the Micro LED display panel and avoid the poor connection between the upper pixel electrode and the upper electrode of the Micro LED.
  • FIG. 1 is a schematic view showing a step S1 of a method of fabricating a Micro LED display panel of the present invention
  • step S2 is a schematic diagram of step S2 of the method for fabricating the Micro LED display panel of the present invention
  • FIG. 3 is a schematic view showing a step S3 of the method for fabricating the Micro LED display panel of the present invention and a schematic view of the Micro LED display panel of the present invention;
  • FIG. 4 is a flow chart of a method of fabricating a Micro LED display panel of the present invention.
  • the present invention provides a method for fabricating a Micro LED display panel, including the following steps:
  • Step S1 referring to FIG. 1, a driving substrate 11 is formed, a plurality of lower pixel electrodes 12 arranged in an array are formed on the driving substrate 11, and a micro LED 13 having a vertical structure is formed on each of the lower pixel electrodes 12, Each of the lower pixel electrodes 12 is electrically connected to a lower electrode of the corresponding micro LED 13;
  • Step S2 please refer to FIG. 2, a package substrate 21 is formed, a plurality of upper pixel electrodes 22 arranged in an array are formed on the package substrate 21, and an elastic conductive layer 23 is formed on each of the upper pixel electrodes 22;
  • Step S3 referring to FIG. 3, the package substrate 21 and the driving substrate 11 are paired and pressurized, so that the upper pixel electrodes 22 are respectively fixed and bonded to the corresponding micro LEDs 13 through the elastic conductive layer 23.
  • the upper electrode of the LED 13 is electrically connected.
  • the elastic conductive layer 23 is formed by coating a first solution on each of the upper pixel electrodes 22, and the first solution is a flexible and electrically conductive solution, thereby passing the first solution.
  • the elastic conductive layer 23 is formed.
  • the first solution includes a first solvent and a plurality of elastic conductive balls dispersed in the first solvent, and the first solvent is a solvent capable of curing.
  • the first solvent is a resin solvent or other curable solvent
  • the elastic conductive ball is a nano- or micro-scale silica pellet coated with a conductive material on the outer surface, or the elastic conductive ball It is an Au ball.
  • the conductive material covering the silica beads may be carbon nanotubes.
  • the package substrate 21 and the drive substrate 11 are combined and pressurized, and the first solvent in the elastic conductive layer 23 is cured.
  • the method of the curing treatment may select heat curing or ultraviolet light curing depending on the properties of the first solvent.
  • the thickness of the elastic conductive layer 23 is less than twice the diameter of the elastic conductive ball in a natural state, and the first solvent is cured. After that, the thickness of the elastic conductive layer 23 is smaller than the diameter of the elastic conductive ball in a natural state to ensure that the upper pixel electrode 22 can be made through the elastic conductive ball after the elastic conductive layer 23 is cured.
  • the upper electrode of the Micro LED 13 maintains a good ohmic contact.
  • the total reflection of the emission system of the Micro LED 13 can be partially destroyed by providing the elastic conductive ball, so that the light extraction efficiency of the Micro LED 13 is higher.
  • the elastic conductive layer 23 may be formed in the step S2 by coating a conductive paste having elasticity on each of the upper pixel electrodes 22.
  • the thickness of the elastic conductive layer 23 in the natural state after the pair (the uncompressed state) should be greater than the upper electrode of the lowest height Micro LED 13 to the corresponding upper pixel electrode 22 The distance is such that all of the elastic conductive layers 23 can be contacted to the upper electrode of their corresponding Micro LEDs 13 after being pressed, so that the upper pixel electrodes 22 maintain good ohmic contact with the upper electrodes of the Micro LEDs 13 .
  • the present invention is further included in the driving substrate 11 or the package substrate before the package substrate 21 and the driving substrate 11 are bonded to the group.
  • a support 30 is formed on 21, and the height of the support 30 is smaller than a gap between the drive substrate 11 and the package substrate 21.
  • the sum of the height of the support 30 and the diameter of the elastic conductive ball in a natural state should be greater than that between the drive substrate 11 and the package substrate 21. gap.
  • the present invention further provides a micro LED display panel, comprising: a driving substrate 11 , a package substrate 21 disposed opposite to the driving substrate 11 , and a driving substrate 11 disposed adjacent to the package substrate 21 .
  • a plurality of lower pixel electrodes 12 arranged in one side array, and a plurality of upper pixel electrodes 22 disposed on a side of the package substrate 21 adjacent to the driving substrate 11 and opposite to the plurality of lower pixel electrodes 12 a micro LED 13 between each of the lower pixel electrodes 12 and the upper pixel electrode 22, and an elastic conductive layer 23 disposed between the respective micro LEDs 13 and the upper pixel electrode 22, wherein the micro LEDs 13 are vertical LEDs.
  • Each of the lower pixel electrodes 12 is electrically connected to a lower electrode of the corresponding micro LED 13
  • each of the upper pixel electrodes 22 is electrically connected to an upper electrode of the corresponding micro LED 13 via the elastic conductive layer 23 .
  • the material of the elastic conductive layer 23 is a first solution
  • the first solution includes: a first solvent and a plurality of elastic conductive materials dispersed in the first solvent
  • the ball, the first solvent is a solvent capable of curing.
  • the first solvent is a resin solvent or other curable solvent
  • the elastic conductive ball is a nano- or micro-scale silica pellet coated with a conductive material on the outer surface, or the elastic conductive ball It is an Au ball.
  • the conductive material covering the silica beads may be carbon nanotubes.
  • a curing treatment is required to cure the first solvent therein.
  • the method of the curing treatment may select heat curing or ultraviolet light curing depending on the properties of the first solvent.
  • the thickness of the elastic conductive layer 23 is less than twice the diameter of the elastic conductive ball in a natural state, and after the first solvent is cured, the elastic conductive layer The thickness of 23 is smaller than the diameter of the elastic conductive ball in a natural state to ensure that the upper pixel electrode 22 and the upper electrode of the Micro LED 13 can be passed through the elastic conductive ball after the elastic conductive layer 23 is cured. Maintain good ohmic contact.
  • the total reflection of the emission system of the Micro LED 13 can be partially destroyed by providing the elastic conductive ball, so that the light extraction efficiency of the Micro LED 13 is higher.
  • the material of the elastic conductive layer 23 may also be a conductive paste having elasticity.
  • the thickness of the elastic conductive layer 23 in the natural state after the pair (the uncompressed state) should be greater than the upper electrode of the lowest height Micro LED 13 to the corresponding upper pixel electrode 22 The distance is such that all of the elastic conductive layers 23 can be contacted to the upper electrode of their corresponding Micro LEDs 13 after being pressed, so that the upper pixel electrodes 22 maintain good ohmic contact with the upper electrodes of the Micro LEDs 13 .
  • the micro LED display panel of the present invention further includes a side of the drive substrate 11 adjacent to the package substrate 21 or the package substrate 21 is adjacent to the drive.
  • the support 30 on one side of the substrate 11 has a height smaller than a gap between the drive substrate 11 and the package substrate 21.
  • the sum of the height of the support 30 and the diameter of the elastic conductive ball in a natural state should be greater than that between the drive substrate 11 and the package substrate 21. gap.
  • the present invention provides a method for fabricating a micro LED display panel by forming an elastic conductive layer on an upper pixel electrode on a package substrate, and forming an elastic conductive layer on the package substrate and the drive substrate.
  • the electrical connection between the pixel electrode and the upper electrode of the Micro LED can fill the height difference between the respective micro LEDs by utilizing the elasticity of the elastic conductive layer, thereby avoiding poor connection between the upper pixel electrode and the upper electrode of the Micro LED, and improving the micro LED display panel.
  • the invention also provides a Micro LED display panel, which can improve the pairing effect of the Micro LED display panel and avoid the poor connection between the upper pixel electrode and the upper electrode of the Micro LED.

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Abstract

提供一种Micro LED显示面板的制作方法及Micro LED显示面板，所述Micro LED显示面板的制作方法通过在位于封装基板（21）上的上像素电极（22）上形成弹性导电层（23），在封装基板（21）与驱动基板（11）对组时，通过弹性导电层（23）实现上像素电极（22）与Micro LED（13）的上电极的电性连接，可利用弹性导电层（23）的弹性填补各个Micro LED（13）之间的高度差，避免上像素电极（22）与Micro LED（13）的上电极的连接不良，提升Micro LED显示面板的对组效果和Micro LED显示面板的制程良率。

Description

Micro LED显示面板的制作方法及Micro LED显示面板 技术领域
本发明涉及显示技术领域，尤其涉及一种Micro LED显示面板的制作方法及Micro LED显示面板。
背景技术
随着可穿戴显示设备的快速发展，出现了微发光二极管(Micro LED，uLED)技术。Micro LED技术即LED微缩化和矩阵化技术，指的是在一个芯片上集成的高密度微小尺寸的LED阵列。Micro LED的耗电量远小于液晶显示器(Liquid Crystal Display，LCD)，与有机发光二极管(Organic Light-Emitting Diode，OLED)一样属于自发光，能够将像素之间的距离从毫米等级降至微米等级，色彩饱和度接近OLED，所以很多厂商把Micro LED视为下一代的显示技术。
现有技术通过微转印(Micro Transfer Print)法来制作Micro LED阵列：将LED裸芯片(Bare Chip)通过激光剥离(Laser Lift-off，LLO)技术从蓝宝石衬底上分离开后，使用一个图案化的转移基板(Transfer Layer)将LED裸芯片从供给基板吸附起来，转移到接收基板。具体地，这个接收基板是已经预先制备完成电路图案的硅基板，通过将转移基板与接收基板进行对位，转移基板上所吸附的LED裸芯片被贴附到接收基板的匹配位置，再剥离转移基板，即可完成LED裸芯片的转移。诸如US2013/0210194，US2013/0128585等专利对微转印技术有较为细致地描述。
现有的Micro LED按照结构不同，可分为垂直结构的Micro LED和水平结构的Micro LED，垂直结构的Micro LED的两个电极分别位于发光层的上下两侧，水平结构的Micro LED的两个电极均位于发光层的下侧；相比于水平结构的Micro LED，垂直结构的Micro LED具有以下优势：1、制作工艺与传统TFT-LCD的制作工艺有相近之处，部分机台和设备可以沿用；2、业内已经发展出一些技术来控制垂直结构的Micro LED的漏电流。
在采用垂直结构的Micro LED的显示面板中，需要对应其上下电极分别设置上像素电极和下像素电极来驱动其工作，其中上像素电极制作于封装基板上，下像素电极制作于驱动基板上，然后将封装基板与驱动基板对组得到Micro LED显示面板，此时在封装基板与驱动基板进行对组时，由于Micro LED的上方存在高低不平，即各个Micro LED的高度并不是完全 相同的，容易出现部分上像素电极与Micro LED的上电极不能正确贴合，导致上像素电极与Micro LED的上电极不能实现电性连接的问题。
发明内容
本发明的目的在于提供一种Micro LED显示面板的制作方法，能够提升Micro LED显示面板的对组效果，避免上像素电极与Micro LED的上电极的连接不良。
本发明的另一目的在于提供一种Micro LED显示面板，能够提升对组效果，避免上像素电极与Micro LED的上电极的连接不良。
为实现上述目的，本发明提供了一种Micro LED显示面板的制作方法，包括如下步骤：
步骤S1、提供一驱动基板，在所述驱动基板上形成阵列排布的多个下像素电极，在各个下像素电极上分别形成垂直结构的Micro LED，所述各个下像素电极分别与其对应Micro LED的下电极电性连接；
步骤S2、提供一封装基板，在所述封装基板上形成阵列排布的多个上像素电极，在各个上像素电极上形成弹性导电层；
步骤S3、将所述封装基板与所述驱动基板对组并加压，使得各个上像素电极通过弹性导电层分别与其对应的Micro LED固定贴合并与所述Micro LED的上电极电性连接。
所述步骤S2中通过在各个上像素电极上涂布第一溶液形成所述弹性导电层。
所述第一溶液包括：第一溶剂以及分散于所述第一溶剂中的多个弹性导电球，第一溶剂为能够固化的溶剂。
所述步骤S3中在所述封装基板与所述驱动基板对组并加压的同时还进行固化处理，使得弹性导电层中的第一溶剂固化。
在所述第一溶剂固化前，所述弹性导电层的厚度小于所述弹性导电球在自然状态下的直径的两倍，在所述第一溶剂固化后，所述弹性导电层的厚度小于所述弹性导电球在自然状态下的直径。
所述步骤S2中通过在各个上像素电极上涂布具有弹性的导电胶形成所述弹性导电层。
所述封装基板与所述驱动基板对组贴合前，还包括在所述驱动基板或封装基板上形成支撑物。
本发明还提供一种Micro LED显示面板，包括：驱动基板、与所述驱动基板相对设置的封装基板、设于所述驱动基板靠近封装基板的一侧阵列排布的多个下像素电极、设于所述封装基板靠近所述驱动基板的一侧的与 所述多个下像素电极相对的多个上像素电极、设于各个下像素电极与上像素电极之间的Micro LED以及设于所述各个Micro LED与上像素电极之间的弹性导电层，所述Micro LED为垂直结构的Micro LED，所述各个下像素电极分别与其对应的Micro LED的下电极电性连接，所述各个上像素电极通过弹性导电层分别与其对应的Micro LED的上电极电性连接。
所述弹性导电层的材料为第一溶液或具有弹性的导电胶，所述第一溶液包括：第一溶剂以及分散于所述第一溶剂中的多个弹性导电球，第一溶剂为能够固化的溶剂。
所述Micro LED显示面板还包括位于所述驱动基板靠近封装基板的一侧或所述封装基板靠近所述驱动基板的一侧的支撑物。
本发明还提供一种Micro LED显示面板的制作方法，包括如下步骤：
步骤S1、提供一驱动基板，在所述驱动基板上形成阵列排布的多个下像素电极，在各个下像素电极上分别形成垂直结构的Micro LED，所述各个下像素电极分别与其对应Micro LED的下电极电性连接；
步骤S2、提供一封装基板，在所述封装基板上形成阵列排布的多个上像素电极，在各个上像素电极上形成弹性导电层；
步骤S3、将所述封装基板与所述驱动基板对组并加压，使得各个上像素电极通过弹性导电层分别与其对应的Micro LED固定贴合并与所述Micro LED的上电极电性连接；
其中，所述步骤S2中通过在各个上像素电极上涂布第一溶液形成所述弹性导电层；所述第一溶液包括：第一溶剂以及分散于所述第一溶剂中的多个弹性导电球，第一溶剂为能够固化的溶剂；所述步骤S3中在所述封装基板与所述驱动基板对组并加压的同时还进行固化处理，使得弹性导电层中的第一溶剂固化；
其中，所述封装基板与所述驱动基板对组贴合前，还包括在所述驱动基板或封装基板上形成支撑物。
本发明的有益效果：本发明提供一种Micro LED显示面板的制作方法，通过在位于封装基板上的上像素电极上形成弹性导电层，在封装基板与驱动基板对组时，通过弹性导电层实现上像素电极与Micro LED的上电极的电性连接，可利用弹性导电层的弹性填补各个Micro LED之间的高度差，避免上像素电极与Micro LED的上电极的连接不良，提升Micro LED显示面板的对组效果和Micro LED显示面板的制程良率。本发明还提供一种Micro LED显示面板，能够提升Micro LED显示面板的对组效果，避免上像素电极与Micro LED的上电极的连接不良。
附图说明
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
附图中，
图1为本发明的Micro LED显示面板的制作方法的步骤S1的示意图；
图2为本发明的Micro LED显示面板的制作方法的步骤S2的示意图；
图3为本发明的Micro LED显示面板的制作方法的步骤S3的示意图暨本发明的Micro LED显示面板的示意图；
图4为本发明的Micro LED显示面板的制作方法的流程图。
具体实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
请参阅图4，本发明提供一种Micro LED显示面板的制作方法，包括如下步骤：
步骤S1、请参阅图1，提供一驱动基板11，在所述驱动基板11上形成阵列排布的多个下像素电极12，在各个下像素电极12上分别形成垂直结构的Micro LED13，所述各个下像素电极12分别与其对应Micro LED13的下电极电性连接；
步骤S2、请参阅图2，提供一封装基板21，在所述封装基板21上形成阵列排布的多个上像素电极22，在各个上像素电极22上形成弹性导电层23；
步骤S3、请参阅图3，将所述封装基板21与所述驱动基板11对组并加压，使得各个上像素电极22通过弹性导电层23分别与其对应的Micro LED13固定贴合并与所述Micro LED13的上电极电性连接。
具体地，所述步骤S2中通过在各个上像素电极22上涂布第一溶液形成所述弹性导电层23，所述第一溶液为有弹性且能导电的溶液，从而通过所述第一溶液形成所述弹性导电层23。
具体地，在本发明的第一实施例中，所述第一溶液包括：第一溶剂以及分散于所述第一溶剂中的多个弹性导电球，第一溶剂为能够固化的溶剂。优选地，所述第一溶剂为树脂溶剂或其他可固化的溶剂，所述弹性导电球为外表面包覆有导电材料的纳米级或微米级的二氧化硅小球，或者所述弹 性导电球为金球(Au ball)。所述包覆所述二氧化硅小球的导电材料可以为碳纳米管。
进一步地，在第一实施例中，所述步骤S3中在所述封装基板21与所述驱动基板11对组并加压的同时还进行固化处理，使得弹性导电层23中的第一溶剂固化。所述固化处理的方法可以根据第一溶剂的性质的不同选择加热固化或紫外光照射固化。
进一步地，在第一实施例中，在所述第一溶剂固化前，所述弹性导电层23的厚度小于所述弹性导电球在自然状态下的直径的两倍，在所述第一溶剂固化后，所述弹性导电层23的厚度小于所述弹性导电球在自然状态下的直径，以保证所述弹性导电层23固化后，能够通过所述弹性导电球使得所述上像素电极22与所述Micro LED 13的上电极保持良好的欧姆接触。
需要说明的是，在本发明的第一实施例中，通过设置所述弹性导电球还能够部分破坏Micro LED 13出射系统的全反射，使得Micro LED 13的光取出效率更高。
具体地，在本发明的第二实施例中，所述步骤S2中还可以通过在各个上像素电极22上涂布具有弹性的导电胶形成所述弹性导电层23。
需要说明的是，所述弹性导电层23在对组后自然状态下(未受压的状态)的厚度应大于所述高度最低的Micro LED 13的上电极到其对应的上像素电极22之间的距离，以保证所有的弹性导电层23在受压后能够均能够接触到其对应的Micro LED13的上电极，使得所述上像素电极22与所述Micro LED 13的上电极保持良好的欧姆接触。
具体地，为了提升所述驱动基板11和封装基板21的受压能力，本发明在所述封装基板21与所述驱动基板11对组贴合前，还包括在所述驱动基板11或封装基板21上形成支撑物30，所述支撑物30的高度小于所述驱动基板11和封装基板21之间的间隙。进一步地，对应到本发明的第一实施例中，所述支撑物30的高度与所述弹性导电球在自然状态下的直径之和还应该大于所述驱动基板11和封装基板21之间的间隙。
进一步地，请参阅图3，本发明还提供一种Micro LED显示面板，包括：驱动基板11、与所述驱动基板11相对设置的封装基板21、设于所述驱动基板11靠近封装基板21的一侧阵列排布的多个下像素电极12、设于所述封装基板21靠近所述驱动基板11的一侧的与所述多个下像素电极12相对的多个上像素电极22、设于各个下像素电极12与上像素电极22之间的Micro LED 13以及设于所述各个Micro LED 13与上像素电极22之间的弹性导电层23，所述Micro LED 13为垂直结构的Micro LED，所述各个下像 素电极12分别与其对应的Micro LED13的下电极电性连接，所述各个上像素电极22通过弹性导电层23分别与其对应的Micro LED13的上电极电性连接。
具体地，在本发明的第一实施例中，所述弹性导电层23的材料为第一溶液，所述第一溶液包括：第一溶剂以及分散于所述第一溶剂中的多个弹性导电球，第一溶剂为能够固化的溶剂。
优选地，所述第一溶剂为树脂溶剂或其他可固化的溶剂，所述弹性导电球为外表面包覆有导电材料的纳米级或微米级的二氧化硅小球，或者所述弹性导电球为金球(Au ball)。所述包覆所述二氧化硅小球的导电材料可以为碳纳米管。
进一步地，在第一实施例中，所述第一溶液涂布形成所述弹性导电层23后需要进行固化处理，使其中的第一溶剂固化。所述固化处理的方法可以根据第一溶剂的性质的不同选择加热固化或紫外光照射固化。
进一步地，在所述第一溶剂固化前，所述弹性导电层23的厚度小于所述弹性导电球在自然状态下的直径的两倍，在所述第一溶剂固化后，所述弹性导电层23的厚度小于所述弹性导电球在自然状态下的直径，以保证所述弹性导电层23固化后，能够通过所述弹性导电球使得所述上像素电极22与所述Micro LED 13的上电极保持良好的欧姆接触。
需要说明的，在本发明的第一实施例中，通过设置所述弹性导电球还能够部分破坏Micro LED 13出射系统的全反射，使得Micro LED 13的光取出效率更高。
具体地，在本发明的第二实施例中，所述弹性导电层23的材料还可以为具有弹性的导电胶。
需要说明的是，所述弹性导电层23在对组后自然状态下(未受压的状态)的厚度应大于所述高度最低的Micro LED 13的上电极到其对应的上像素电极22之间的距离，以保证所有的弹性导电层23在受压后能够均能够接触到其对应的Micro LED13的上电极，使得所述上像素电极22与所述Micro LED 13的上电极保持良好的欧姆接触。
具体地，为了提升所述驱动基板11和封装基板21的受压能力，本发明Micro LED显示面板还包括位于所述驱动基板11靠近封装基板21的一侧或所述封装基板21靠近所述驱动基板11的一侧的支撑物30，所述支撑物30的高度小于所述驱动基板11和封装基板21之间的间隙。
进一步地，对应到本发明的第一实施例中，所述支撑物30的高度与所述弹性导电球在自然状态下的直径之和还应该大于所述驱动基板11和封装 基板21之间的间隙。
综上所述，本发明提供一种Micro LED显示面板的制作方法，通过在位于封装基板上的上像素电极上形成弹性导电层，在封装基板与驱动基板对组时，通过弹性导电层实现上像素电极与Micro LED的上电极的电性连接，可利用弹性导电层的弹性填补各个Micro LED之间的高度差，避免上像素电极与Micro LED的上电极的连接不良，提升Micro LED显示面板的对组效果和Micro LED显示面板的制程良率。本发明还提供一种Micro LED显示面板，能够提升Micro LED显示面板的对组效果，避免上像素电极与Micro LED的上电极的连接不良。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (12)

  1. 一种Micro LED显示面板的制作方法，包括如下步骤：
    步骤S1、提供一驱动基板，在所述驱动基板上形成阵列排布的多个下像素电极，在各个下像素电极上分别形成垂直结构的Micro LED，所述各个下像素电极分别与其对应Micro LED的下电极电性连接；
    步骤S2、提供一封装基板，在所述封装基板上形成阵列排布的多个上像素电极，在各个上像素电极上形成弹性导电层；
    步骤S3、将所述封装基板与所述驱动基板对组并加压，使得各个上像素电极通过弹性导电层分别与其对应的Micro LED固定贴合并与所述Micro LED的上电极电性连接。
  2. 如权利要求1所述的Micro LED显示面板的制作方法，其中，所述步骤S2中通过在各个上像素电极上涂布第一溶液形成所述弹性导电层。
  3. 如权利要求2所述的Micro LED显示面板的制作方法，其中，所述第一溶液包括：第一溶剂以及分散于所述第一溶剂中的多个弹性导电球，第一溶剂为能够固化的溶剂。
  4. 如权利要求3所述的Micro LED显示面板的制作方法，其中，所述步骤S3中在所述封装基板与所述驱动基板对组并加压的同时还进行固化处理，使得弹性导电层中的第一溶剂固化。
  5. 如权利要求4所述的Micro LED显示面板的制作方法，其中，在所述第一溶剂固化前，所述弹性导电层的厚度小于所述弹性导电球在自然状态下的直径的两倍，在所述第一溶剂固化后，所述弹性导电层的厚度小于所述弹性导电球在自然状态下的直径。
  6. 如权利要求1所述的Micro LED显示面板的制作方法，其中，所述步骤S2中通过在各个上像素电极上涂布具有弹性的导电胶形成所述弹性导电层。
  7. 如权利要求1所述的Micro LED显示面板的制作方法，其中，所述封装基板与所述驱动基板对组贴合前，还包括在所述驱动基板或封装基板上形成支撑物。
  8. 一种Micro LED显示面板，包括：驱动基板、与所述驱动基板相对设置的封装基板、设于所述驱动基板靠近封装基板的一侧阵列排布的多个下像素电极、设于所述封装基板靠近所述驱动基板的一侧的与所述多个下像素电极相对的多个上像素电极、设于各个下像素电极与上像素电极之间 的Micro LED以及设于所述各个Micro LED与上像素电极之间的弹性导电层，所述Micro LED为垂直结构的Micro LED，所述各个下像素电极分别与其对应的Micro LED的下电极电性连接，所述各个上像素电极通过弹性导电层分别与其对应的Micro LED的上电极电性连接。
  9. 如权利要求8所述的Micro LED显示面板，其中，所述弹性导电层的材料为第一溶液或具有弹性的导电胶，所述第一溶液包括：第一溶剂以及分散于所述第一溶剂中的多个弹性导电球，第一溶剂为能够固化的溶剂。
  10. 如权利要求8所述的Micro LED显示面板，还包括位于所述驱动基板靠近封装基板的一侧或所述封装基板靠近所述驱动基板的一侧的支撑物。
  11. 一种Micro LED显示面板的制作方法，包括如下步骤：
    步骤S1、提供一驱动基板，在所述驱动基板上形成阵列排布的多个下像素电极，在各个下像素电极上分别形成垂直结构的Micro LED，所述各个下像素电极分别与其对应Micro LED的下电极电性连接；
    步骤S2、提供一封装基板，在所述封装基板上形成阵列排布的多个上像素电极，在各个上像素电极上形成弹性导电层；
    步骤S3、将所述封装基板与所述驱动基板对组并加压，使得各个上像素电极通过弹性导电层分别与其对应的Micro LED固定贴合并与所述Micro LED的上电极电性连接；
    其中，所述步骤S2中通过在各个上像素电极上涂布第一溶液形成所述弹性导电层；所述第一溶液包括：第一溶剂以及分散于所述第一溶剂中的多个弹性导电球，第一溶剂为能够固化的溶剂；所述步骤S3中在所述封装基板与所述驱动基板对组并加压的同时还进行固化处理，使得弹性导电层中的第一溶剂固化；
    其中，所述封装基板与所述驱动基板对组贴合前，还包括在所述驱动基板或封装基板上形成支撑物。
  12. 如权利要求11所述的Micro LED显示面板的制作方法，其中，在所述第一溶剂固化前，所述弹性导电层的厚度小于所述弹性导电球在自然状态下的直径的两倍，在所述第一溶剂固化后，所述弹性导电层的厚度小于所述弹性导电球在自然状态下的直径。
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