WO2019202021A1 - Composant pouvant être monté en surface - Google Patents

Composant pouvant être monté en surface Download PDF

Info

Publication number
WO2019202021A1
WO2019202021A1 PCT/EP2019/059975 EP2019059975W WO2019202021A1 WO 2019202021 A1 WO2019202021 A1 WO 2019202021A1 EP 2019059975 W EP2019059975 W EP 2019059975W WO 2019202021 A1 WO2019202021 A1 WO 2019202021A1
Authority
WO
WIPO (PCT)
Prior art keywords
component
carrier
electronic component
electrical connection
connection
Prior art date
Application number
PCT/EP2019/059975
Other languages
German (de)
English (en)
Inventor
Michael Zitzlsperger
Matthias Goldbach
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2019202021A1 publication Critical patent/WO2019202021A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the surface-mountable component specified here is, in particular, a so-called package, which is used for external electrical contacting to a
  • Printed circuit board for example, a PCB, is soldered.
  • this includes
  • the carrier is used in particular
  • the upper side and the lower side of the carrier run, for example, in sections or completely parallel or substantially parallel to each other.
  • the top and / or the bottom may be partially or completely flat.
  • the side surfaces may be traces of a mechanical or chemical material removal, in particular a
  • “Surface-mountable” in this case means in particular that at least two of the underside of the component
  • Contact areas are provided for electrical contacting of the component.
  • the contact areas are exposed in the unassembled state of the component.
  • this includes
  • this includes
  • the surface mount component at least two electrical connections. That is, the component may comprise two or more electrical connections. Preferably flows in normal operation of the component in two or all electrical connections, an electric current.
  • the two electrical connections each connect two electrically conductive in a lateral direction spaced from each other
  • the electrically conductive areas are each spaced apart in the lateral direction by an electrically insulating material.
  • the direct electrical contact between the electrically conductive regions is produced exclusively by the associated electrical connection.
  • an electric current preferably flows through a lateral connection along the electrical connections
  • the two electrical connections each have a thickness which
  • the component comprises a plurality of electrical connections, then this feature can be implemented in all electrical connections.
  • the thickness of the carrier is defined as the maximum or minimum or average distance between the top and bottom of the carrier.
  • a lateral extent of the carrier is defined in particular as the extension of the carrier measured parallel to the upper side or to the lower side.
  • the lateral extent of the carrier is preferably at least twice as large or at least five times as large or at least ten times as large as the thickness. Alternatively or additionally, the lateral extent may be at most 20 times or at most 10 times as large as the thickness.
  • the thickness of an electrical connection is in particular the minimum or maximum or average thickness of the electrical connection.
  • the thickness is again measured as an extent along a direction from the bottom to
  • the thickness of one electrical connection is meant the thickness of the material that is adapted to conduct electricity.
  • the two are identical to each other. In accordance with at least one embodiment, the two are identical to each other.
  • the bonding techniques may be selected from: wire bonding, also called wire bonding, or ribbon bonding, too
  • planar connection also called planar interconnect, or tie-bar.
  • compounds are applied as a film and then patterned or applied using a mask.
  • Planar compounds are in particular form-fitting to the components that are electrically contacted with the planar connections.
  • a tie-bar is one in particular
  • tie bars may be exposed at the top or bottom.
  • this includes
  • the component comprises a first
  • the electrical connections in each case electrically connect two electrically conductive regions of the component which are spaced apart from one another in a lateral direction
  • the two electrical connections each have a thickness that is at most 1/4 of a thickness of the carrier.
  • the two electrical connections are further by different connection techniques
  • the present invention is based in particular on the finding that in the production of
  • Example a multilayer ceramic support or a
  • the idea is used to combine different electrical connections of different connection techniques for more complex interconnections of the electronic components in a surface-mountable component.
  • a simple support such as a lead frame or a ceramic insert, achieve a complex interconnection with relatively little effort and very space efficient.
  • processing options and possible material combinations applicable to the respective material classes are not restricted. This is cost effective and shortens the mechanical tolerance chain.
  • the number of materials in the component is minimized. For example, no multilayer ceramic substrate or FR4 substrate is used, but a lead frame.
  • the electrical connections can also be present only temporarily and optionally at a later
  • Component is then in particular a composite of several Individual components, which is separated in a process step.
  • an electrical connection is made on the underside of the carrier, for example as a tie-bar or as planar connections or as a flat bonding wire, and is then separated by sawing.
  • the electrical connection is not visible from above and can not cause contamination on the top when disconnected.
  • an electrical connection may be designed as a planar connection and by means of a
  • Surroundings of the separation point can be at least partially limited by the fact that in the top of the carrier around the separation point elevations or walls are formed, which absorb particles spewing around.
  • the electronic component is a component that is already made of a composite
  • the carrier has a metallic leadframe.
  • Component is electrically connected to the lead frame.
  • the electrical connection to the lead frame can be achieved, for example, by at least one of the two
  • the upper side and / or the lower side of the carrier are preferably formed at least partially or in sections by regions of the leadframe.
  • soldering structures or solder balls may be provided on areas of the underside formed by the lead frame.
  • the lead frame comprises or is made of a metal, such as copper or aluminum.
  • the ladder frame can be constructed in several parts. The individual parts of the
  • Lead frames are preferably each formed in one piece. However, different parts of the lead frame are then not integrally formed with each other. For example, at least two parts of the lead frame in normal operation of the component on different electrical
  • At least one of the two electrically conductive connections can connect two parts of the leadframe in an electrically conductive manner.
  • One or more parts, particularly contiguous and / or integral parts, of the leadframe may extend over the entire thickness of the support.
  • at least a portion of the leadframe forms both a portion of the top surface and a portion of the leadframe
  • the thickness of the carrier or the entire component may substantially correspond to the thickness of the lead frame or part of the lead frame. “Substantially” means, for example, except for deviations of at most 5 o
  • the various parts of the lead frame can by a filler, in particular an electrically insulating
  • Fillers for example made of plastic or silicone or epoxy or FR4, be mechanically connected to each other.
  • the filler is then part of the carrier.
  • the top and the bottom can be formed at least partially by the filler.
  • the wearer can exclusively from the
  • Lead frame and the filler consist. According to at least one embodiment, the
  • a planar connection can be arranged, for example, on the top side and / or the underside of the carrier.
  • connection technique of a second electrical connection selected from: planar connection, tie bar, wire bonding, ribbon bonding.
  • the second electrical connection for example, an electrical connection between an electronic component and solid material of the lead frame or between an electronic component and
  • Partially etched material of the lead frame or between two electronic components or between two parts of the lead frame is Partially etched material of the lead frame or between two electronic components or between two parts of the lead frame.
  • the two electrical connections overlap one another in a plan view of the underside of the carrier.
  • the two electrical connections cross in plan view onto the underside of the carrier so that in operation a current flows through the first electrical connection transversely or perpendicularly to a current through the second electrical connection.
  • the second electrical connection does not protrude beyond the carrier at the top side or at the bottom side. In other words, the second electrical connection extends only in the region between at least a portion of the top and
  • the second electrical connection does not protrude beyond all parts of the leadframe, either in a direction away from the leadframe
  • the first electronic component does not protrude beyond the carrier at the top side or at the bottom side. In other words, the first electrical component extends exclusively between
  • the first electronic component may be integrated in the carrier and / or completely surrounded by the carrier.
  • the first electronic component may be disposed on a partially etched portion of the lead frame.
  • Section is for example at most 75% or at most 50% of the thickness of the leadframe in another section or other part of the leadframe.
  • the first electronic component does not project beyond all parts of the
  • Leadframe either in a direction away from the top and towards the bottom or in a direction away from the bottom and towards the top.
  • at least a part of the leadframe projects beyond the first electronic component in the direction away from the upper side and towards the lower side and / or in a direction away from the underside and towards the upper side.
  • the first electrical connection thus does not run within the carrier, but is arranged on the carrier.
  • Laser diode chip or a photodiode
  • this includes
  • Optoelectronic component further comprises a second electronic component, which is electrically connected to or in the carrier.
  • the second electronic component is electrically connected to the first electronic component.
  • the first electronic component can be supplied with current via the first electrical connection and the second electronic component can be supplied with current via the second electrical connection.
  • the first electronic component is directly connected to the first electrical connection and the second electronic component directly to the second
  • the first electrical connection may electrically connect the first electronic component to the lead frame, the second
  • the electronic component an integrated circuit, in particular an ASIC, or an ESD protection device.
  • the second electronic component may, for example, also be an LED chip or a laser diode chip or a photodiode.
  • the second electronic component does not protrude beyond the carrier at the top side or at the bottom side.
  • the second electronic component does not project beyond all parts of the leadframe, neither in a direction away from the top and toward the bottom nor in a direction away from the bottom and towards the top.
  • the second electronic component is disposed on a partially etched portion of the lead frame.
  • at least a portion of the leadframe overhangs the second electronic component in the direction away from the top and toward the bottom and / or in a direction away from the bottom and toward the top.
  • an electrically conductive cover for example in the form of an electrically conductive planar connection, is applied to the top side and / or on the underside of the carrier.
  • the electrically conductive cover is preferably a
  • the electrically conductive cover covered in plan view of the top and / or the bottom, the electrically conductive cover, the second electronic
  • conductive cover is preferably arranged to provide electromagnetic shielding of the second
  • the surface mountable component includes a trench extending into the component from the top or bottom
  • a width of the trench is, for example, at most 100 ym.
  • the depth of the trench is
  • a length of the trench is greater than its width.
  • the trench is preferably gas-filled.
  • side faces of the trench have traces of a chemical or mechanical
  • the trench may be a laser-generated groove in the component.
  • the trench and the second electrical connection intersect in plan view when viewed from the top or bottom side.
  • Figures 1 to 4 are cross-sectional views of various components
  • Embodiments of the surface mount component. 1 shows a first embodiment of the surface mount component 100 in lateral
  • the component 100 comprises a carrier 1 with an upper side 11 and a lower side 12 opposite the upper side 11.
  • the carrier 1 serves for mechanical stabilization of the component 100.
  • the carrier 1 in turn comprises a metallic leadframe 10, which in the present case has a multi-part construction.
  • the individual parts of the lead frame 10 are electrically insulating
  • Filler material 7 in a lateral direction spaced from each other and mechanically through the filler 7
  • leadframe 10 is partially etched in some sections. In these partially etched
  • the thickness of the lead frame 10 is less than the thickness of the carrier. 1
  • the surface mount component 100 further comprises a first electronic component 2 and a second one
  • the first electronic component 2 is, for example, an LED chip or a laser diode chip or a photodiode.
  • the second electronic component 4 is, for example, a
  • ASIC integrated circuit
  • the first electronic component 2 is on a
  • connection 31 electrically connected to a second part of the lead frame 10.
  • the first electric In the present case, connection 31 is a planar connection, also called a planar interconnect.
  • the first electrical connection 31 is applied to the upper side 11 of the carrier 1.
  • the second electronic component 4 is on a
  • Bonding wires (wire bonding)
  • the second electronic component 4 is connected to a fourth and a fifth part of the lead frame 10.
  • an electrically conductive cover 5 in the form of a metal layer is applied, which, viewed in plan view on the upper side 11, completely covers the second electronic component 4.
  • electrically conductive cover 5 serves in the present case as
  • the underside 12 of the carrier 1 is partially formed by regions of the lead frame 10. About this exposed
  • the surface mountable component 100 can be contacted, for example, externally electrically, for example by soldering to a printed circuit board.
  • FIG. 2 shows a side view of a second exemplary embodiment of the surface-mounted component 100
  • the carrier 1 in turn comprises a multi-part lead frame 10 and an electrically insulating filling material 7, which mechanically connects the parts of the lead frame 10 with each other.
  • a first electronic component 2 for example in the form of an LED chip or a laser diode chip or a photodiode provided electrically conductive with the first part of the lead frame 10 and via a first one
  • Lead frame 10 is connected.
  • the electrically conductive covers 5 connect at the top 11 and at the bottom 12, the first part of the lead frame 10 with a third part of the lead frame 10 electrically conductive with each other. Between the two
  • Covers 5 a fourth part of the lead frame 10 is arranged, which is spaced from the covers 5 by the electrically insulating filling material 7 and electrically
  • the fourth part of the leadframe 10 forms in the present case, for example, the core of a coaxial cable.
  • the two covers 5, the first part of the lead frame 10 and the third part of the lead frame 10 form the jacket of the coaxial cable.
  • FIG. 3 shows a third exemplary embodiment of the surface-mountable component 100.
  • the component 100 comprises a carrier 1 with a multi-part lead frame 10 and an electrically insulating
  • Component 2 is again, for example, an LED chip or a laser diode chip or a photodiode. As in the previous embodiments, the first electronic component 2 does not protrude beyond the carrier 1 at its
  • a first electrical connection 31 is applied in the form of a planar interconnect.
  • the first electrical connection 31 electrically conductively connects the first electronic component 2 to a second part of the leadframe 10.
  • the second electronic component 4 is, for example, an ESD protection component.
  • the second electronic component 4 is directly electrically conductively connected to the second part of the leadframe 10 and also connected to the first part of the leadframe 10 via a second electrical connection 32 in the form of a bonding wire.
  • the second electrical connection 32 is designed so that it the carrier 1, in particular the
  • the first electrically conductive connection 31 serves at the same time as an electrically conductive cover 5, which completely covers the second electronic component 4 as viewed in plan view on the upper side 11 of the carrier 1 and thus effects an electromagnetic shielding of the second electronic component 4.
  • a shield on the bottom 12 can be realized by a further, not shown cover or a printed circuit board, not shown, to which the component 100 is soldered.
  • the carrier 1 comprises a plurality of parts of a leadframe 10, which by an electrically insulating filler material. 7
  • Leadframe 10 On a first part of the Leadframe 10 is again a first electronic one
  • first electrical connection 31 in the form of a planar
  • the component 100 comprises a second electrical connection 32 in the form of a bonding wire, which forms the second part of the
  • Lead frame 10 electrically conductively connects to a third part of the lead frame 10.
  • a trench 6 which extends from the bottom 12 of the carrier 1 in the carrier 1.
  • the trench 6 crosses the second electrical connection 32 when viewed in plan view.
  • the trench 6 is introduced into the carrier 1, for example, by means of a laser or by sawing. Accordingly, then point
  • a further first electrical connection 31 is again applied in the form of a planar interconnect which crosses the second electrical connection 32 in plan view on the upper side 11, so that during normal operation a current flows through this further first electrical connection 31 flows transversely or perpendicularly to a current through the second electrical connection 32.
  • the further first electrical connection 31 on the upper side 11 is, for example, in turn electrically connected to a second electronic component.
  • the thicknesses of the electrical connections 31, 32 amount to at most 1/4 of the thickness of the carrier 1.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Led Device Packages (AREA)

Abstract

Selon au moins un mode de réalisation, l'invention concerne un composant (100) pouvant être monté en surface qui comprend un support (1) comportant une face supérieure (11) et une face inférieure (12) opposée à la face supérieure (11). Ledit composant comprend également un composant électronique connecté électriquement sur ou dans le support (1) ainsi qu'au moins une première connexion (31) électrique et une seconde connexion (32) électrique. Les connexions électriques interconnectent électriquement dans chaque cas deux zones électroconductrices du composant éloignées l'une de l'autre dans une direction latérale. Les deux connexions électriques présentent chacune une épaisseur représentant au maximum ¼ de l'épaisseur du support (1). Les deux connexions électriques sont en outre réalisées par des techniques de connexion différentes.
PCT/EP2019/059975 2018-04-18 2019-04-17 Composant pouvant être monté en surface WO2019202021A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018109211.3A DE102018109211A1 (de) 2018-04-18 2018-04-18 Oberflächenmontierbares Bauteil
DE102018109211.3 2018-04-18

Publications (1)

Publication Number Publication Date
WO2019202021A1 true WO2019202021A1 (fr) 2019-10-24

Family

ID=66379878

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/059975 WO2019202021A1 (fr) 2018-04-18 2019-04-17 Composant pouvant être monté en surface

Country Status (2)

Country Link
DE (1) DE102018109211A1 (fr)
WO (1) WO2019202021A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022114582A1 (de) 2022-06-09 2023-12-14 Ams-Osram International Gmbh Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1168171A (ja) * 1997-08-13 1999-03-09 Citizen Electron Co Ltd 赤外線データ通信モジュールおよびその製造方法
US20040208210A1 (en) * 2003-04-01 2004-10-21 Sharp Kabushiki Kaisha Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
US20070246715A1 (en) * 2006-04-21 2007-10-25 Samsung Electro-Mechanics Co., Ltd. Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
US20120080674A1 (en) * 2010-01-29 2012-04-05 Kabushiki Kaisha Toshiba Led package
WO2017198668A1 (fr) * 2016-05-17 2017-11-23 Osram Opto Semiconductors Gmbh Dispositif équipé d'un module électrique

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3023066B1 (fr) * 2014-06-30 2017-10-27 Aledia Dispositif optoelectronique comprenant des diodes electroluminescentes et un circuit de commande
DE102015104185A1 (de) * 2015-03-20 2016-09-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1168171A (ja) * 1997-08-13 1999-03-09 Citizen Electron Co Ltd 赤外線データ通信モジュールおよびその製造方法
US20040208210A1 (en) * 2003-04-01 2004-10-21 Sharp Kabushiki Kaisha Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
US20070246715A1 (en) * 2006-04-21 2007-10-25 Samsung Electro-Mechanics Co., Ltd. Light emitting diode package having multi-stepped reflecting surface structure and fabrication method thereof
US20120080674A1 (en) * 2010-01-29 2012-04-05 Kabushiki Kaisha Toshiba Led package
WO2017198668A1 (fr) * 2016-05-17 2017-11-23 Osram Opto Semiconductors Gmbh Dispositif équipé d'un module électrique

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Publication number Publication date
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