WO2019193644A1 - Procédé et dispositif de formation de structure tridimensionnelle - Google Patents

Procédé et dispositif de formation de structure tridimensionnelle Download PDF

Info

Publication number
WO2019193644A1
WO2019193644A1 PCT/JP2018/014234 JP2018014234W WO2019193644A1 WO 2019193644 A1 WO2019193644 A1 WO 2019193644A1 JP 2018014234 W JP2018014234 W JP 2018014234W WO 2019193644 A1 WO2019193644 A1 WO 2019193644A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
curable resin
hole
unit
forming
Prior art date
Application number
PCT/JP2018/014234
Other languages
English (en)
Japanese (ja)
Inventor
重義 稲垣
Original Assignee
株式会社Ｆｕｊｉ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｆｕｊｉ filed Critical 株式会社Ｆｕｊｉ
Priority to PCT/JP2018/014234 priority Critical patent/WO2019193644A1/fr
Priority to JP2020512129A priority patent/JP6987975B2/ja
Publication of WO2019193644A1 publication Critical patent/WO2019193644A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto

Definitions

  • the present invention relates to a three-dimensional structure forming method and a three-dimensional structure forming apparatus for forming a three-dimensional structure with a curable resin.
  • the present specification includes a first forming step of forming a first plate-like structure with a curable resin, and a second plate-like structure having a hole with the curable resin.
  • the curable resin is applied to at least one of the second forming step to be formed, the surface of the first plate-like structure, and the surface of the second plate-like structure where the hole is opened.
  • the first plate-like structure and the coating step so that the opening of the hole portion of the second plate-like structure is closed with the first plate-like structure and the hole portion is sealed.
  • a three-dimensional structure forming method including a laminating step of laminating a second plate-like structure and a curing step of curing the curable resin applied in the applying step.
  • this specification describes the 1st forming apparatus which forms a 1st plate-shaped structure with curable resin, and the 2nd plate-shaped structure which has a hole part with the said curable resin.
  • the curable resin is provided on at least one of a second forming apparatus for forming an object, a surface of the first plate-like structure, and a surface of the second plate-like structure where the hole portion is opened. And the first plate-like structure so that the opening of the hole of the second plate-like structure is closed by the first plate-like structure and the hole is sealed.
  • a three-dimensional structure forming apparatus including a laminating apparatus that laminates the second plate-like structure and a curing apparatus that cures the curable resin applied by the coating apparatus is disclosed.
  • the first plate-like structure and the second plate-like structure are formed so that the opening of the hole of the second plate-like structure is closed by the first plate-like structure and the hole is sealed. And are laminated. Then, a curable resin that is a raw material of the first plate-like structure and the second plate-like structure is applied to the laminated surface of the first plate-like structure and the second plate-like structure, Harden. As a result, the first plate-like structure and the second plate-like structure are integrally bonded with the cured resin, and a three-dimensional structure having a sealed space inside can be appropriately formed. Become.
  • FIG. 3 is a cross-sectional view showing the laminated plate-like structures of the first to third layers.
  • FIG. 5 is a cross-sectional view showing the laminated plate-like structures in the first to fourth layers.
  • FIG. 5 is a cross-sectional view showing the laminated plate-like structures of the first to fifth layers. It is sectional drawing which shows the 1st-layer plate-shaped structure laminated
  • FIG. 1 shows a circuit forming apparatus 10.
  • the circuit forming apparatus 10 includes a transport device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 25, a stacking unit 26, and a control device (see FIG. 2) 27.
  • the conveying device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 25, and the lamination unit 26 are disposed on the base 28 of the circuit forming device 10.
  • the base 28 has a generally rectangular shape.
  • the longitudinal direction of the base 28 is orthogonal to the X-axis direction
  • the short direction of the base 28 is orthogonal to both the Y-axis direction, the X-axis direction, and the Y-axis direction.
  • the direction will be described as the Z-axis direction.
  • the transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32.
  • the X-axis slide mechanism 30 has an X-axis slide rail 34 and an X-axis slider 36.
  • the X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction.
  • the X-axis slider 36 is held by an X-axis slide rail 34 so as to be slidable in the X-axis direction.
  • the X-axis slide mechanism 30 has an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 moves to an arbitrary position in the X-axis direction by driving the electromagnetic motor 38.
  • the Y axis slide mechanism 32 includes a Y axis slide rail 50 and a stage 52.
  • the Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction, and is movable in the X-axis direction.
  • One end of the Y-axis slide rail 50 is connected to the X-axis slider 36.
  • a stage 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction.
  • the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to an arbitrary position in the Y-axis direction by driving the electromagnetic motor 56.
  • the stage 52 moves to an arbitrary position on the base 28 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.
  • the stage 52 has a base 60 and a lifting device 64.
  • the base 60 is formed in a flat plate shape, and a structure is formed on the upper surface of the base 60.
  • the lifting device 64 is disposed below the base 60 and lifts the base 60.
  • the 1st modeling unit 22 is a unit which models wiring, and has the 1st printing part 72 and the baking part 74.
  • FIG. The first printing unit 72 has an inkjet head (see FIG. 2) 76 and ejects metal ink in a linear shape.
  • the metal ink is obtained by dispersing metal fine particles in a solvent.
  • the inkjet head 76 ejects metal ink from a plurality of nozzles by, for example, a piezo method using a piezoelectric element.
  • the firing unit 74 has a laser irradiation device (see FIG. 2) 78.
  • the laser irradiation device 78 is a device that irradiates the discharged metal ink with a laser, and the metal ink irradiated with the laser is baked to form a wiring.
  • the firing of the metal ink is a phenomenon in which, by applying energy, the solvent is vaporized, the metal particulate protective film is decomposed, etc., and the metal particulates are brought into contact with or fused to increase the conductivity. is there.
  • metal wiring is formed by baking metal ink.
  • the second modeling unit 24 is a unit that models a plate-like structure, and includes a second printing unit 84, a discharge unit 85, and a curing unit 86.
  • the second printing unit 84 has an inkjet head (see FIG. 2) 88, and the inkjet head 88 discharges an ultraviolet curable resin.
  • the ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet rays.
  • the inkjet head 88 may be, for example, a piezo method using a piezoelectric element, or a thermal method in which bubbles are generated by heating a resin to be discharged from a plurality of nozzles.
  • the discharge unit 85 has a dispense head (see FIG. 2) 89 and discharges a conductive ultraviolet curable resin.
  • the conductive ultraviolet curable resin is obtained by dispersing metal fine particles in a resin that is cured by irradiation with ultraviolet rays. Then, the resin is cured and contracted by the irradiation of ultraviolet rays, whereby the metal fine particles adhere to each other, and the conductive ultraviolet curable resin exhibits conductivity.
  • the dispense head 89 is configured to remove the conductive ultraviolet curable resin from one nozzle having a diameter larger than the diameter of the nozzle of the inkjet head 76. Discharge.
  • the dispense head 89 may be a transfer head that transfers paste with a stamp, for example, and the conductive ultraviolet curable resin may be, for example, a conductive thermosetting resin.
  • the curing unit 86 includes a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92.
  • the flattening device 90 flattens the upper surface of the ultraviolet curable resin discharged by the inkjet head 88. For example, the surface of the ultraviolet curable resin is leveled and the excess resin is scraped off by a roller or a blade. Thus, the thickness of the UV curable resin is made uniform.
  • the irradiation device 92 includes a mercury lamp or LED as a light source, and irradiates the discharged ultraviolet curable resin or conductive ultraviolet curable resin with ultraviolet rays. Thereby, the discharged ultraviolet curable resin is cured, a resin layer is formed, the discharged conductive ultraviolet curable resin is cured, and a wiring is formed.
  • the mounting unit 25 is a unit for mounting electronic components, and includes a supply unit 100 and a mounting unit 102.
  • the supply unit 100 has a plurality of tape feeders 110 (see FIG. 2) that send out the taped electronic components one by one, and supplies the electronic components at the supply position.
  • the supply unit 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies electronic components from the tray.
  • the supply unit 100 may be configured to include both a tape type and a tray type, or other supply devices.
  • the mounting unit 102 includes a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114.
  • the mounting head 112 has a suction nozzle, and holds the electronic component by suction using the suction nozzle.
  • the moving device 114 moves the mounting head 112 between the electronic component supply position by the tape feeder 110 and the base 60. Thereby, in the mounting unit 102, the electronic component supplied from the tape feeder 110 is held by the suction nozzle 118, and the electronic component held by the suction nozzle 118 is mounted on the base 60.
  • the lamination unit 26 is a unit for laminating the plate-like structures modeled in the second modeling unit 24, and has a stock part 120 and a lamination part 122.
  • the stock unit 120 is for stocking a plate-like structure modeled in the second modeling unit 24.
  • the stacked unit 122 includes a holding head (see FIG. 2) 126 and a moving device (see FIG. 2) 128.
  • the holding head 126 has a holding tool, and holds the plate-like structure by the holding tool.
  • the moving device 128 moves the holding head 126 between the stock unit 120 and the base 60. Thereby, in the base 60, a plate-shaped structure is laminated
  • the control device 27 includes a controller 130 and a plurality of drive circuits 132 as shown in FIG.
  • the plurality of drive circuits 132 include the electromagnetic motors 38 and 56, the holding device 62, the lifting device 64, the ink jet head 76, the laser irradiation device 78, the ink jet head 88, the dispense head 89, the flattening device 90, the irradiation device 92, and the tape feeder. 110, the mounting head 112, the moving device 114, the holding head 126, and the moving device 128.
  • the controller 130 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 132. Thereby, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 25, and the stacking unit 26 is controlled by the controller 130.
  • a plurality of plate-like structures are formed by the above-described configuration, and a circuit is formed by stacking the plurality of plate-like structures.
  • the stage 52 is moved below the second modeling unit 24, and the plate-like structure 150 is formed on the base 60 in the second modeling unit 24 as shown in FIG.
  • the plate-like structure 150 is formed by repeating the discharge of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92 to the discharged ultraviolet curable resin.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the base 60 in a thin film shape. Subsequently, when the ultraviolet curable resin is discharged in the form of a thin film, the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86. Then, the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer 152 is formed on the base 60.
  • the inkjet head 88 discharges an ultraviolet curable resin in a thin film shape on the thin resin layer 152.
  • the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 152 is formed on the thin film resin layer 152.
  • a thin resin layer 152 is laminated. In this manner, the discharge of the ultraviolet curable resin onto the thin resin layer 152 and the irradiation of the ultraviolet rays are repeated, and the plurality of resin layers 152 are laminated, whereby the plate-like structure 150 is formed. .
  • the stage 52 is moved below the first modeling unit 22.
  • the inkjet head 76 discharges a metal ink on the upper surface of the plate-shaped structure 150 linearly according to a circuit pattern.
  • the laser irradiation apparatus 78 irradiates a metal ink with a laser. Thereby, the metal ink is baked, and the wiring 156 is formed on the plate-like structure 150 as shown in FIG.
  • the stage 52 is moved below the stacked unit 26.
  • the plate-like structure 150 on the base 60 is held by the holding head 126.
  • the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 150 held by the moving device 128 is stocked in the stock unit 120.
  • the plate-like structure 160 has a hole 162 and is formed by repeating the discharge of the ultraviolet curable resin from the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92 to the discharged ultraviolet curable resin.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the base 60 in a thin film shape.
  • the inkjet head 88 discharges the ultraviolet curable resin so that a predetermined portion of the upper surface of the base 60 is exposed in a generally rectangular shape.
  • the ultraviolet curable resin is flattened by the flattening device 90 so that the film thickness of the ultraviolet curable resin becomes uniform in the curing unit 86.
  • the irradiation device 92 irradiates the thin film ultraviolet curable resin with ultraviolet rays. As a result, a thin resin layer 166 is formed on the base 60.
  • the inkjet head 88 discharges the ultraviolet curable resin into a thin film only on the portion above the thin resin layer 166. That is, the inkjet head 88 discharges the ultraviolet curable resin in a thin film shape onto the thin resin layer 166 so that a predetermined portion of the upper surface of the base 60 is exposed in a generally rectangular shape. Then, the thin film ultraviolet curable resin is flattened by the flattening device 90, and the irradiation device 92 irradiates the ultraviolet curable resin discharged in the thin film shape with ultraviolet rays, so that the thin film resin layer 166 is formed on the thin film resin layer 166. A thin resin layer 166 is laminated.
  • the discharge of the ultraviolet curable resin onto the thin resin layer 166 excluding the generally rectangular portion on the upper surface of the base 60 and the irradiation with the ultraviolet rays are repeated, and a plurality of resin layers 166 are laminated.
  • the plate-like structure 160 having the hole 162 is formed.
  • the hole 162 is a through hole that opens to the upper surface and the lower surface of the plate-like structure 160.
  • the stage 52 is moved below the laminated unit 26.
  • the plate-like structure 160 on the base 60 is held by the holding head 126.
  • the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 160 held by the holding head 126 is stocked in the stock unit 120.
  • the stage 52 is moved below the second modeling unit 24.
  • a plate-like structure 170 is formed thereon. Note that, similarly to the plate-like structure 150, the plate-like structure 170 is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92.
  • the stage 52 is moved below the first modeling unit 22.
  • the inkjet head 76 discharges a metal ink on the upper surface of the plate-shaped structure 170 linearly according to a circuit pattern.
  • the laser irradiation apparatus 78 irradiates a metal ink with a laser. As a result, the metal ink is baked, and wiring 172 is formed on the plate-like structure 170 as shown in FIG.
  • the stage 52 is moved below the stacked unit 26.
  • the plate-like structure 170 on the base 60 is held by the holding head 126.
  • the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 170 held by the holding head 126 is stocked in the stock unit 120.
  • the plate-like structure 180 has a hole 182 and, like the plate-like structure 160, is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92. Is done.
  • the stage 52 is moved below the stacked unit 26.
  • the plate-like structure 180 on the base 60 is held by the holding head 126.
  • the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 180 held by the holding head 126 is stocked in the stock unit 120.
  • the stage 52 is moved below the second modeling unit 24.
  • a plate-like structure 190 is formed thereon. Similar to the plate-like structure 150, the plate-like structure 190 is formed by repeating the discharge of the ultraviolet curable resin by the inkjet head 88 and the irradiation of the ultraviolet rays by the irradiation device 92.
  • the stage 52 is moved below the stacked unit 26.
  • the plate-like structure 190 on the base 60 is held by the holding head 126.
  • the holding head 126 is moved to the stock unit 120 by the moving device 128, and the plate-like structure 190 held by the holding head 126 is stocked in the stock unit 120.
  • the plate-like structures 150 stocked in the stock unit 120 are It is held by the holder of the holding head 126 and is moved to the base 60 of the stage 52 by the moving device 128. Thereby, as shown in FIG. 4, the plate-like structure 150 is placed on the base 60.
  • the stage 52 is moved below the second modeling unit 24.
  • the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 150.
  • the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the plate-like structure 150 except for the end portion of the wiring 156 of the plate-like structure 150.
  • the stage 52 is moved below the laminated unit 26.
  • the plate-like structure 160 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128.
  • the plate-like structure 160 is moved onto the plate-like structure 150 so that the hole 162 is located above the end of the wiring 156.
  • the plate-like structure 160 is laminated on the upper surface of the plate-like structure 150 so that the end of the wiring 156 is exposed through the hole 162.
  • the stage 52 is moved below the second modeling unit 24.
  • the dispense head 89 discharges the conductive ultraviolet curable resin 196 to the edge part of the wiring 156 through the hole 162 of the plate-shaped structure 160.
  • the irradiation device 92 irradiates the entire upper surface of the plate-like structure 160 with ultraviolet rays.
  • the ultraviolet rays irradiated by the irradiation device 92 pass through the plate-like structure 160, and the ultraviolet curable resin discharged to the upper surface of the plate-like structure 150 is cured.
  • the ultraviolet curable resin is cured in a state where the plate-like structure 150 and the plate-like structure 160 are brought into close contact with each other. That is, the ultraviolet curable resin which is a raw material of the plate-like structure 150 and the plate-like structure 160 functions as an adhesive that bonds the plate-like structure 150 and the plate-like structure 160, and the plate-like structure 150 and the plate The structure 160 is integrally bonded with the cured resin.
  • the conductive ultraviolet curable resin 196 exerts conductivity when the conductive ultraviolet curable resin 196 discharged to the end of the wiring 156 is also irradiated with ultraviolet rays.
  • the stage 52 is moved below the mounting unit 25.
  • an electronic component (see FIG. 11) 200 is supplied from the tape feeder 110, and the electronic component 200 is held by the mounting head 112.
  • the mounting head 112 is moved by the moving device 114, and the electronic component 200 held by the mounting head 112 is formed in the plate-like structure 150 in the hole 162 of the plate-like structure 160 as shown in FIG. Mounted on top.
  • the electronic component 200 is mounted so that the electrode 202 of the electronic component 200 is in close contact with the conductive ultraviolet curable resin 196 discharged to the end of the wiring 156. Thereby, the electronic component 200 is electrically connected to the wiring 156 while being accommodated in the hole 162 of the plate-like structure 160.
  • the stage 52 is moved below the second modeling unit 24.
  • the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 160.
  • FIG. At this time, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the plate-like structure 160 except for the holes 162 of the plate-like structure 160.
  • the stage 52 is moved below the laminated unit 26.
  • the plate-like structure 170 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128. Accordingly, as shown in FIG. 12, the plate-like structure 170 is stacked on the upper surface of the plate-like structure 160, and the opening on the upper surface of the hole 162 of the plate-like structure 160 is closed by the plate-like structure 170. Can be removed. That is, the hole 162 of the plate-like structure 160 is closed by the plate-like structure 150 at the opening on the lower surface and is blocked by the plate-like structure 170 at the opening on the upper surface, so that the hole 162 is sealed. Space.
  • the stage 52 is moved below the second modeling unit 24.
  • the irradiation apparatus 92 irradiates the whole upper surface of the plate-shaped structure 170 with an ultraviolet-ray.
  • the ultraviolet rays irradiated by the irradiation device 92 pass through the plate-like structure 170, and the ultraviolet curable resin discharged onto the upper surface of the plate-like structure 160 is cured.
  • the ultraviolet curable resin is cured in a state where the plate-like structure 160 and the plate-like structure 170 are in close contact with each other, and the plate-like structure 160 and the plate-like structure 170 are integrally formed by the cured resin. Glued.
  • the stage 52 is moved below the second modeling unit 24.
  • the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 170.
  • the stage 52 is moved below the laminated unit 26.
  • the plate-like structure 180 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128.
  • the plate-like structure 180 is moved onto the plate-like structure 170 so that the hole 182 is located above the end of the wiring 172.
  • the plate-like structure 180 is laminated on the upper surface of the plate-like structure 170 so that the end of the wiring 172 is exposed through the hole 182.
  • the stage 52 is moved below the second modeling unit 24.
  • the dispense head 89 discharges the conductive ultraviolet curable resin 196 to the edge part of the wiring 172 through the hole part 182 of the plate-shaped structure 180.
  • the irradiation device 92 irradiates the entire upper surface of the plate-like structure 180 with ultraviolet rays.
  • the ultraviolet rays irradiated by the irradiation device 92 are transmitted through the plate-like structure 180, and the ultraviolet curable resin discharged onto the upper surface of the plate-like structure 170 is cured.
  • the ultraviolet curable resin is cured in a state where the plate-like structure 170 and the plate-like structure 180 are in close contact with each other, and the plate-like structure 170 and the plate-like structure 180 are integrally formed by the cured resin.
  • Glued the conductive ultraviolet curable resin 196 discharged to the end of the wiring 172 is also irradiated with ultraviolet rays, so that the conductive ultraviolet curable resin 196 exhibits conductivity.
  • the stage 52 is moved below the mounting unit 25.
  • an electronic component (see FIG. 13) 210 is supplied from the tape feeder 110, and the electronic component 210 is held by the mounting head 112.
  • the mounting head 112 is moved by the moving device 114, and the electronic component 210 held by the mounting head 112 is placed in the hole 182 of the plate-like structure 180 in the plate-like structure 170 as shown in FIG. Mounted on top.
  • the electronic component 210 is mounted so that the electrode 212 of the electronic component 210 is in close contact with the conductive ultraviolet curable resin 196 discharged to the end of the wiring 172.
  • the electronic component 210 is electrically connected to the wiring 172 while being accommodated in the hole 182 of the plate-like structure 180.
  • the stage 52 is moved below the second modeling unit 24.
  • the inkjet head 88 discharges an ultraviolet curable resin to the upper surface of the plate-shaped structure 180.
  • FIG. At this time, the inkjet head 88 discharges an ultraviolet curable resin onto the upper surface of the plate-like structure 180 except for the holes 182 of the plate-like structure 180.
  • the stage 52 is moved below the laminated unit 26.
  • the plate-like structure 190 stocked in the stock unit 120 is held by the holding tool of the holding head 126 and moved to the base 60 of the stage 52 by the moving device 128.
  • the plate-like structure 190 is laminated on the upper surface of the plate-like structure 180, and the opening on the upper surface of the hole 182 of the plate-like structure 180 is closed by the plate-like structure 190.
  • the stage 52 is moved below the second modeling unit 24.
  • the irradiation apparatus 92 irradiates the whole surface of the upper surface of the plate-shaped structure 190 with an ultraviolet-ray.
  • the ultraviolet rays irradiated by the irradiation device 92 are transmitted through the plate-like structure 190, and the ultraviolet curable resin discharged onto the upper surface of the plate-like structure 180 is cured.
  • the ultraviolet curable resin is cured in a state where the plate-like structure 180 and the plate-like structure 190 are in close contact, and the plate-like structure 180 and the plate-like structure 190 are integrally formed by the cured resin. Glued.
  • five plate-like structures 150, 160, 170, 180, 190 are formed. Then, these five plate-like structures 150, 160, 170, 180, and 190 are laminated and bonded together by an ultraviolet curable resin that is a raw material of each plate-like structure 150, 160, 170, 180, and 190. Is done. Accordingly, the five plate-like structures 150, 160, 170, 180, and 190 are suitably bonded in a stacked state.
  • the upper and lower openings of the hole 162 of the plate-like structure 160 are the plate-like structure 150 and the plate-like structure. It is blocked by 170.
  • the upper and lower openings of the hole 182 of the plate-like structure 180 are closed by the plate-like structure 170 and the plate-like structure 190.
  • a space sealed by the hole 162 and the hole 182 is formed inside the five plate-like structures 150, 160, 170, 180, and 190 that are integrally bonded in a stacked state.
  • the multilayer circuit 220 is formed by arranging the electronic components 200 and 210 in the sealed space.
  • the controller 130 of the control device 27 includes a first forming unit 230, a second forming unit 232, a coating unit 234, a stacking unit 236, a storage unit 237, and a curing unit 238.
  • the first forming unit 230 is a functional unit for forming the plate-like structures 150, 170, and 190.
  • the second forming part 232 is a functional part for forming the plate-like structures 160 and 180.
  • the application unit 234 is a functional unit for applying an ultraviolet curable resin used as an adhesive to the plate-like structure 150 or the like.
  • the stacked unit 236 is a functional unit for stacking the plate-like structures 150, 160, and 170 so that the openings of the holes 162 of the plate-like structure 160 are closed by the plate-like structures 150 and 170.
  • the laminated portion 236 is a functional unit for laminating the plate-like structures 170, 180, and 190 so that the openings of the hole portions 182 of the plate-like structure 180 are closed by the plate-like structures 170, 190. is there.
  • the accommodating portion 237 is a functional portion for accommodating the electronic components 200 and 210 in the hole portions 162 and 182.
  • the curing unit 238 is a functional unit for curing by irradiating the ultraviolet curable resin applied as an adhesive with ultraviolet rays.
  • the circuit forming apparatus 10 is an example of a three-dimensional structure forming apparatus.
  • the second modeling unit 24 is an example of a first forming device and a second forming device.
  • the stacking unit 26 is an example of a stacking apparatus.
  • the inkjet head 88 is an example of a coating apparatus.
  • the irradiation device 92 is an example of a curing device.
  • the plate-like structures 150, 170, 190 are an example of a first plate-like structure.
  • the plate-like structures 160 and 180 are an example of a second plate-like structure.
  • the holes 162 and 182 are an example of holes.
  • the electronic components 200 and 210 are examples of components.
  • the process executed by the first forming unit 230 is an example of a first forming process.
  • the process executed by the second forming unit 232 is an example of a second forming process.
  • the process executed by the application unit 234 is an example of an application process.
  • the process executed by the stacking unit 236 is an example of a stacking process.
  • the process executed by the storage unit 237 is an example of a storage process.
  • the process executed by the curing unit 238 is an example of a curing process.
  • the plate-like structures 160 and 180 are formed with the holes 162 and 182 that open on the upper surface and the lower surface, but as shown in FIG. You may form in the plate-shaped structure 252.
  • FIG. the plate-like structure 260 is laminated on the upper surface of the plate-like structure 252 so as to close the opening of the recess 250, whereby the recess 250 is sealed.
  • a sealed space can also be formed by closing the opening of the recess 250.
  • the plate-like structure 252 and the plate-like structure 260 are bonded with an ultraviolet curable resin.
  • the electronic components 200 and 210 are accommodated in the sealed space formed of the plate-shaped structure 150 grade
  • the circuit 220 is formed using the above-described method, but the circuit 220 is not limited thereto, and various three-dimensional structures can be formed.
  • Circuit forming device (three-dimensional structure forming device) 24: Second modeling unit (first forming device) (second forming device) 26: Laminating unit (stacking device) 88: Inkjet head (coating device) 92: Irradiation Device (curing device) 150: Plate-like structure (first plate-like structure) 160: Plate-like structure (second plate-like structure) 162: Hole 170: Plate-like structure (first plate) 180: plate-like structure (second plate-like structure) 182: hole 190: plate-like structure (first plate-like structure) 200: electronic component (component) 210: electronic component ( Parts) 230: First forming part (first forming process) 232: Second forming part (second forming process) 234: Application part (application process) 236: Laminating part (lamination process) 237: Housing part (accommodating) Degree) 238: cured portion (curing step)

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé de formation d'une structure tridimensionnelle, le procédé comprenant : une première étape de formation consistant à former une première structure de forme plate au moyen d'une résine durcissable ; une seconde étape de formation consistant former une seconde structure de forme plate comportant un trou au moyen d'une résine durcissable ; une étape de revêtement consistant à appliquer une résine durcissable sur une surface de la première structure de forme plate et/ou sur une surface de la seconde structure de forme plate sur laquelle un trou est ouvert ; une étape de stratification consistant à stratifier la première structure de forme plate et la seconde structure de forme plate de telle sorte qu'une ouverture du trou de la seconde structure de forme plate est fermée par la première structure de forme plate et que le trou est scellé ; et une étape de durcissement consistant à faire durcir la résine durcissable revêtue à l'étape de revêtement.
PCT/JP2018/014234 2018-04-03 2018-04-03 Procédé et dispositif de formation de structure tridimensionnelle WO2019193644A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2018/014234 WO2019193644A1 (fr) 2018-04-03 2018-04-03 Procédé et dispositif de formation de structure tridimensionnelle
JP2020512129A JP6987975B2 (ja) 2018-04-03 2018-04-03 ３次元構造物形成方法、および３次元構造物形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/014234 WO2019193644A1 (fr) 2018-04-03 2018-04-03 Procédé et dispositif de formation de structure tridimensionnelle

Publications (1)

Publication Number Publication Date
WO2019193644A1 true WO2019193644A1 (fr) 2019-10-10

Family

ID=68100591

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/014234 WO2019193644A1 (fr) 2018-04-03 2018-04-03 Procédé et dispositif de formation de structure tridimensionnelle

Country Status (2)

Country Link
JP (1) JP6987975B2 (fr)
WO (1) WO2019193644A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021181561A1 (fr) * 2020-03-11 2021-09-16 株式会社Ｆｕｊｉ Procédé de fabrication de substrat de montage par moulage de stratifié tridimensionnel
WO2021214813A1 (fr) * 2020-04-20 2021-10-28 株式会社Ｆｕｊｉ Procédé de formation de circuit et dispositif de formation de circuit
JP7411452B2 (ja) 2020-03-05 2024-01-11 株式会社Fuji 回路形成方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007888A (ja) * 2001-06-18 2003-01-10 Seiko Instruments Inc 気密封止ｉｃパッケージの製造方法
JP2008010589A (ja) * 2006-06-28 2008-01-17 Kobe Steel Ltd ガラス状炭素製ウェハボートおよびその製造方法
JP2013179189A (ja) * 2012-02-28 2013-09-09 Kyocera Corp 部品内蔵基板
JP2017028053A (ja) * 2015-07-21 2017-02-02 富士機械製造株式会社 回路形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007888A (ja) * 2001-06-18 2003-01-10 Seiko Instruments Inc 気密封止ｉｃパッケージの製造方法
JP2008010589A (ja) * 2006-06-28 2008-01-17 Kobe Steel Ltd ガラス状炭素製ウェハボートおよびその製造方法
JP2013179189A (ja) * 2012-02-28 2013-09-09 Kyocera Corp 部品内蔵基板
JP2017028053A (ja) * 2015-07-21 2017-02-02 富士機械製造株式会社 回路形成方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7411452B2 (ja) 2020-03-05 2024-01-11 株式会社Fuji 回路形成方法
WO2021181561A1 (fr) * 2020-03-11 2021-09-16 株式会社Ｆｕｊｉ Procédé de fabrication de substrat de montage par moulage de stratifié tridimensionnel
JPWO2021181561A1 (fr) * 2020-03-11 2021-09-16
JP7316742B2 (ja) 2020-03-11 2023-07-28 株式会社Fuji ３次元積層造形による実装基板の製造方法
WO2021214813A1 (fr) * 2020-04-20 2021-10-28 株式会社Ｆｕｊｉ Procédé de formation de circuit et dispositif de formation de circuit
JPWO2021214813A1 (fr) * 2020-04-20 2021-10-28

Also Published As

Publication number Publication date
JPWO2019193644A1 (ja) 2020-12-03
JP6987975B2 (ja) 2022-01-05

Similar Documents

Publication Publication Date Title
WO2019102522A1 (fr) Procédé de production de dispositif électronique multicouche tridimensionnel, et dispositif électronique multicouche tridimensionnel
WO2019193644A1 (fr) Procédé et dispositif de formation de structure tridimensionnelle
JP7053832B2 (ja) 回路形成方法、および回路形成装置
WO2016147284A1 (fr) Procédé de formation et dispositif de formation
JP6533112B2 (ja) 回路形成方法
JP6714109B2 (ja) 回路形成方法、および回路形成装置
JP6811770B2 (ja) 回路形成方法
WO2017009922A1 (fr) Procédé et dispositif de formation de câblage
WO2016189577A1 (fr) Procédé de formation de câblage
JP6663516B2 (ja) 回路形成方法、および回路形成装置
WO2021214813A1 (fr) Procédé de formation de circuit et dispositif de formation de circuit
WO2022113186A1 (fr) Procédé de formation de circuit électrique
WO2019186780A1 (fr) Procédé et dispositif de formation de circuit
WO2021075051A1 (fr) Procédé de montage de composant et dispositif de montage de composant
JP7394626B2 (ja) ３次元積層電子デバイスの製造方法及び製造装置
JP6949751B2 (ja) ３次元積層造形のビア形成方法
WO2023209960A1 (fr) Procédé de conception, programme de conception et procédé de production de carte de circuit imprimé
WO2023079607A1 (fr) Procédé de formation de circuit et appareil de formation de circuit
JP7411452B2 (ja) 回路形成方法
WO2023195175A1 (fr) Procédé de formation de circuit électrique et dispositif de formation de circuit électrique
WO2023157111A1 (fr) Procédé de formation de circuit électrique et dispositif de formation de circuit électrique
JP7213361B2 (ja) 積層ユニットの接着方法
WO2024057475A1 (fr) Dispositif de formation de stratifié de résine et procédé de formation de stratifié de résine
WO2023223562A1 (fr) Procédé de fabrication et dispositif de fabrication
WO2021199421A1 (fr) Procédé et dispositif de formation de circuit

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18913441

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2020512129

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18913441

Country of ref document: EP

Kind code of ref document: A1