WO2019193330A1 - Laser processing method for thin film structures - Google Patents

Laser processing method for thin film structures Download PDF

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Publication number
WO2019193330A1
WO2019193330A1 PCT/GB2019/050953 GB2019050953W WO2019193330A1 WO 2019193330 A1 WO2019193330 A1 WO 2019193330A1 GB 2019050953 W GB2019050953 W GB 2019050953W WO 2019193330 A1 WO2019193330 A1 WO 2019193330A1
Authority
WO
WIPO (PCT)
Prior art keywords
stack
laser
substrate
cut
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/GB2019/050953
Other languages
English (en)
French (fr)
Inventor
Brian Hayden
Louise TURNER
Thomas RISBRIDGER
Thomas Foley
Nadeem RIZVI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ilika Technologies Ltd
Original Assignee
Ilika Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ilika Technologies Ltd filed Critical Ilika Technologies Ltd
Priority to US16/971,185 priority Critical patent/US12109651B2/en
Priority to EP19717556.5A priority patent/EP3774161A1/en
Priority to KR1020207026760A priority patent/KR102832158B1/ko
Priority to JP2020544023A priority patent/JP7424641B2/ja
Priority to CN201980021879.9A priority patent/CN112135707A/zh
Publication of WO2019193330A1 publication Critical patent/WO2019193330A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0436—Small-sized flat cells or batteries for portable equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/058—Construction or manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/06—Lead-acid accumulators
    • H01M10/12—Construction or manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/24—Alkaline accumulators
    • H01M10/28—Construction or manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/36—Accumulators not provided for in groups H01M10/05-H01M10/34
    • H01M10/38—Construction or manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Figure 6 shows a schematic cross-sectional view of the stack of Figure 5 after a further processing step to enable electrical connection
  • FIG. 2 shows a schematic view (not to scale) of an example apparatus which may be used to carry out the laser direct write technique.
  • the structure 10 comprising the stack 12 on the substrate 14 is mounted on a translation stage 50 or similar device configured to provide movement of the structure in an XY plane parallel to the surface 14a of the substrate 14. The movement is orthogonal to the depth (thickness) of the stack 12.
  • a laser 52 is provided to generate a beam 54 of laser light, output as a sequence of ultrashort (ultrafast) pulses 56, by which is meant pulses with a duration in the femtosecond or picosecond regime.
  • the beam 54 is focussed by a focussing arrangement comprising one or more lens, mirrors or the like to a spot 60 which is directed onto the surface 12a of the stack 12.
  • the cut line or lines 70 can be arranged in any shape, and the cells 28 or other elements can be any desired size or shape, and need not all be the same size or shape. Note that the grid shown in Figure 3 is for illustrative purposes only to present an example of a possible cut line. In reality, the cut line 70 is not marked on the stack surface.
  • the motion should cause the spot to pass over every part of the cut line area at least once so that every part of the stack material under the cut line receives energy from the laser beam.
  • the movement of the spot is a scan path which is designed to uniformly cover the cut line area.
  • the scan path may be continuous or discontinuous. For example, a series of hatched scanning lines can be used to achieve a uniform depth of ablation.
  • the beam is scanned over a part of the cut line width in a first direction, and also in a second direction roughly orthogonal to the first direction. Then two more orthogonal directions are followed, oriented at an angle to the first pair of directions.
  • the laser ablation was carried out using a femtosecond solid-state laser operating at a wavelength of 343 nm.
  • the fluence was 856 mJ/cm, delivered at a pulse repetition rate of 185 Hz and a pulse duration of 130 fs with a scan speed of 500 mm/s.
  • the beam had a width (spot size) of 0.015 mm, and was scanned to cover a cut line of 500 pm width by following a scan path with a hatching pattern.
  • the lines of the hatching pattern were arranged in four sets of two overlaid angles, with a hatch pitch of 7 pm. Six passes of the scan path were performed.
  • successful cutting can be readily achieved for fluences around 865 mJ/crrr 2 , such as between 800 and 900 mJ/crrr 2 , or between 850 and 950 mJ/crrr 2 , or between 800 to 1000 mJ/crrr 2 , or between 700 to 1000 mJ/crrr 2 .
  • the scan (writing) speed may be chosen to be within the range, for example, of 1 to 10,000 mm/s.
  • the combination of a higher repetition rate and a faster scan speed may produce the same fluence as a lower repetition rate and a slower scan speed. While the scan speed may be very fast, speeds in the lower part of this range can be suitable which may simplify the apparatus.
  • the total thickness of the thin film stack, perpendicular to the substrate surface and measured from that surface may be in the range of about 1 to 200 pm, 1.5 to 200 pm, 1 to 170 pm, 1.5 to 170 pm, 1 to 150 pm, 1.5 to 150 pm, 150 pm or less, 170 pm or less, or 200 pm or less, for example.
  • Typical stack thicknesses may be around 10 pm, such as between 10 and 20 pm, 10 and 40 pm, 8 and 12 pm or between 5 and 15 pm or between 2 and 20 pm, for example.
  • the positive electrode current collector material selected from the group consisting of Pt, Ni, Mo, Al, Au, stainless steel, indium doped tin oxide (ITO) and other electrically conducting metal oxides.
  • the positive electrode active material of a battery of the present invention is selected from the group consisting of UC0O 2 , FeS 2 , UC0PO 4 , LiFePCU, Li 2 FeS 2 , Li 2 FeSi0 4 , LiMn 2 0 4 , LiMnPCU, LiNiP0 4 , UV 3 0 8 , LiV 6 0 13 , LiV0P0 4 , LiV0P0 4 F, Li 3 V 2 (P0 4 ) 3 , Mn0 2 , MoS 3 , S, TiS 2 , TiS 3 , V 2 Os, / d q , LiNio . 5Mni . 50 4, and LiMnNiCoAI0 2 .
  • the electrode is a lithium intercalation electrode.
  • intercalation refers to the reversible inclusion or insertion of a molecule or ion into compounds with layered structures. Therefore, a lithium intercalation electrode may be an electrode in which lithium ions may be reversibly included or inserted into a layered structure, e.g. graphite.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Secondary Cells (AREA)
  • Battery Electrode And Active Subsutance (AREA)
PCT/GB2019/050953 2018-04-03 2019-04-02 Laser processing method for thin film structures Ceased WO2019193330A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US16/971,185 US12109651B2 (en) 2018-04-03 2019-04-02 Laser processing method for thin film structures
EP19717556.5A EP3774161A1 (en) 2018-04-03 2019-04-02 Laser processing method for thin film structures
KR1020207026760A KR102832158B1 (ko) 2018-04-03 2019-04-02 박막 구조물들을 위한 레이저 프로세싱 방법
JP2020544023A JP7424641B2 (ja) 2018-04-03 2019-04-02 薄膜構造のレーザー処理方法
CN201980021879.9A CN112135707A (zh) 2018-04-03 2019-04-02 薄膜结构的激光处理方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1805624.2A GB2572608A (en) 2018-04-03 2018-04-03 Laser processing method for thin film structures
GB1805624.2 2018-04-03

Publications (1)

Publication Number Publication Date
WO2019193330A1 true WO2019193330A1 (en) 2019-10-10

Family

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Family Applications (1)

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PCT/GB2019/050953 Ceased WO2019193330A1 (en) 2018-04-03 2019-04-02 Laser processing method for thin film structures

Country Status (7)

Country Link
US (1) US12109651B2 (https=)
EP (1) EP3774161A1 (https=)
JP (1) JP7424641B2 (https=)
KR (1) KR102832158B1 (https=)
CN (1) CN112135707A (https=)
GB (1) GB2572608A (https=)
WO (1) WO2019193330A1 (https=)

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WO2022203916A2 (en) 2021-03-23 2022-09-29 Clerio Vision, Inc. Coordinated scanning and power control of laser for forming structures in ophthalmic lenses
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CN114290698B (zh) * 2021-12-24 2023-01-31 华中科技大学 高分子薄膜大深宽比激光加工方法
CN114740615B (zh) * 2022-04-11 2023-06-30 南京邮电大学 一种可调太赫兹衰减器及其制备方法
CN114953621B (zh) * 2022-05-26 2025-03-25 广东光钛领先新材料有限公司 一种垂直丝状排列的薄膜型导热材料及其制备方法
CN115360318B (zh) * 2022-09-14 2025-07-15 大连大学 硫化锌离子电池负极材料的改性方法
CN115519259B (zh) * 2022-10-22 2024-05-24 长沙大科激光科技有限公司 一种高频电流辅助双光束激光切割方法
KR102759257B1 (ko) * 2023-01-06 2025-01-23 주식회사 에스에프에이 기판 레이저 커팅 장치 및 기판 레이저 커팅 방법
KR102926416B1 (ko) * 2023-02-16 2026-02-11 국립공주대학교 산학협력단 비전도성 패턴을 포함하는 이온교환막의 제조방법 및 이에 의해 제조된 이온교환막
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