KR102832158B1 - 박막 구조물들을 위한 레이저 프로세싱 방법 - Google Patents
박막 구조물들을 위한 레이저 프로세싱 방법 Download PDFInfo
- Publication number
- KR102832158B1 KR102832158B1 KR1020207026760A KR20207026760A KR102832158B1 KR 102832158 B1 KR102832158 B1 KR 102832158B1 KR 1020207026760 A KR1020207026760 A KR 1020207026760A KR 20207026760 A KR20207026760 A KR 20207026760A KR 102832158 B1 KR102832158 B1 KR 102832158B1
- Authority
- KR
- South Korea
- Prior art keywords
- thin film
- stack
- laser
- substrate
- film structures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
- H01M10/0436—Small-sized flat cells or batteries for portable equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/058—Construction or manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/06—Lead-acid accumulators
- H01M10/12—Construction or manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/24—Alkaline accumulators
- H01M10/28—Construction or manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/36—Accumulators not provided for in groups H01M10/05-H01M10/34
- H01M10/38—Construction or manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials
- B23K2103/166—Multilayered materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Laser Beam Processing (AREA)
- Secondary Cells (AREA)
- Battery Electrode And Active Subsutance (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1805624.2A GB2572608A (en) | 2018-04-03 | 2018-04-03 | Laser processing method for thin film structures |
| GB1805624.2 | 2018-04-03 | ||
| PCT/GB2019/050953 WO2019193330A1 (en) | 2018-04-03 | 2019-04-02 | Laser processing method for thin film structures |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20200136391A KR20200136391A (ko) | 2020-12-07 |
| KR102832158B1 true KR102832158B1 (ko) | 2025-07-09 |
Family
ID=66175435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020207026760A Active KR102832158B1 (ko) | 2018-04-03 | 2019-04-02 | 박막 구조물들을 위한 레이저 프로세싱 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12109651B2 (https=) |
| EP (1) | EP3774161A1 (https=) |
| JP (1) | JP7424641B2 (https=) |
| KR (1) | KR102832158B1 (https=) |
| CN (1) | CN112135707A (https=) |
| GB (1) | GB2572608A (https=) |
| WO (1) | WO2019193330A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019216070A1 (de) * | 2019-10-18 | 2021-04-22 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Bearbeiten einer Lithiumfolie oder einer mit Lithium beschichteten Metallfolie mittels eines Laserstrahls |
| US11984599B2 (en) * | 2019-11-27 | 2024-05-14 | GM Global Technology Operations LLC | Electrode components with laser induced surface modified current collectors and methods of making the same |
| KR20210141870A (ko) * | 2020-05-14 | 2021-11-23 | 삼성전자주식회사 | 웨이퍼 처리 장치 및 이를 이용한 반도체 소자 제조 방법 |
| CN112662864B (zh) * | 2020-12-11 | 2022-06-21 | 浙江工业大学 | 一种薄钢板的水下淬火方法 |
| WO2022203916A2 (en) | 2021-03-23 | 2022-09-29 | Clerio Vision, Inc. | Coordinated scanning and power control of laser for forming structures in ophthalmic lenses |
| DE102021202964A1 (de) | 2021-03-25 | 2022-09-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Verfahren und Vorrichtung zum Schneiden einer metallhaltigen Folie und Laser-geschnittene metallhaltige Folie |
| CN114290698B (zh) * | 2021-12-24 | 2023-01-31 | 华中科技大学 | 高分子薄膜大深宽比激光加工方法 |
| CN114740615B (zh) * | 2022-04-11 | 2023-06-30 | 南京邮电大学 | 一种可调太赫兹衰减器及其制备方法 |
| CN114953621B (zh) * | 2022-05-26 | 2025-03-25 | 广东光钛领先新材料有限公司 | 一种垂直丝状排列的薄膜型导热材料及其制备方法 |
| CN115360318B (zh) * | 2022-09-14 | 2025-07-15 | 大连大学 | 硫化锌离子电池负极材料的改性方法 |
| CN115519259B (zh) * | 2022-10-22 | 2024-05-24 | 长沙大科激光科技有限公司 | 一种高频电流辅助双光束激光切割方法 |
| KR102759257B1 (ko) * | 2023-01-06 | 2025-01-23 | 주식회사 에스에프에이 | 기판 레이저 커팅 장치 및 기판 레이저 커팅 방법 |
| KR102926416B1 (ko) * | 2023-02-16 | 2026-02-11 | 국립공주대학교 산학협력단 | 비전도성 패턴을 포함하는 이온교환막의 제조방법 및 이에 의해 제조된 이온교환막 |
| EP4585354A1 (en) * | 2024-01-10 | 2025-07-16 | Toyota Jidosha Kabushiki Kaisha | Method for cutting a stack of several layers |
| DE102024207809B3 (de) * | 2024-08-15 | 2025-12-11 | Volkswagen Aktiengesellschaft | Verfahren zum Trennen einer Stoffschlussverbindung zwischen einem Zellverbinder und einer Batteriezelle |
| CN120164761A (zh) * | 2025-03-12 | 2025-06-17 | 东莞市竞沃电子科技有限公司 | 一种表贴式厚膜熔断器及其制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008134053A1 (en) * | 2007-04-27 | 2008-11-06 | Front Edge Technology, Inc. | Thin film battery fabrication using laser shaping |
| US20100038825A1 (en) * | 2006-12-21 | 2010-02-18 | Mcdonald Joel P | Methods of forming microchannels by ultrafast pulsed laser direct-write processing |
| US20120322241A1 (en) * | 2011-06-15 | 2012-12-20 | Applied Materials, Inc. | Multi-layer mask for substrate dicing by laser and plasma etch |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3518351B2 (ja) | 1997-07-25 | 2004-04-12 | 松下電工株式会社 | エネルギービームによる被加工品表面への複合形状の形成方法及びこの方法により得られた物品 |
| US6120725A (en) * | 1997-07-25 | 2000-09-19 | Matsushita Electric Works, Ltd. | Method of forming a complex profile of uneven depressions in the surface of a workpiece by energy beam ablation |
| US6562698B2 (en) | 1999-06-08 | 2003-05-13 | Kulicke & Soffa Investments, Inc. | Dual laser cutting of wafers |
| US6420245B1 (en) | 1999-06-08 | 2002-07-16 | Kulicke & Soffa Investments, Inc. | Method for singulating semiconductor wafers |
| US6586707B2 (en) | 2000-10-26 | 2003-07-01 | Xsil Technology Limited | Control of laser machining |
| JP2002373997A (ja) * | 2001-04-10 | 2002-12-26 | Kanegafuchi Chem Ind Co Ltd | 集積型ハイブリッド薄膜光電変換モジュール |
| ATE537558T1 (de) | 2001-10-01 | 2011-12-15 | Electro Scient Ind Inc | Bearbeiten von substraten, insbesondere von halbleitersubstraten |
| JP4318993B2 (ja) * | 2003-09-03 | 2009-08-26 | シャープ株式会社 | 薄膜半導体装置の製造方法 |
| JP2005209719A (ja) | 2004-01-20 | 2005-08-04 | Disco Abrasive Syst Ltd | 半導体ウエーハの加工方法 |
| US7202141B2 (en) | 2004-03-29 | 2007-04-10 | J.P. Sercel Associates, Inc. | Method of separating layers of material |
| US8624157B2 (en) | 2006-05-25 | 2014-01-07 | Electro Scientific Industries, Inc. | Ultrashort laser pulse wafer scribing |
| JP5212103B2 (ja) | 2007-03-30 | 2013-06-19 | 東レ株式会社 | ポジ型感光性樹脂組成物 |
| US8870974B2 (en) * | 2008-02-18 | 2014-10-28 | Front Edge Technology, Inc. | Thin film battery fabrication using laser shaping |
| US20170005206A1 (en) | 2007-10-06 | 2017-01-05 | Solexel, Inc. | Patterning of silicon oxide layers using pulsed laser ablation |
| GB2458986B (en) * | 2008-04-08 | 2012-05-30 | M Solv Ltd | Apparatus for patterning thin films on continuous flexible substrates |
| US7855089B2 (en) | 2008-09-10 | 2010-12-21 | Stion Corporation | Application specific solar cell and method for manufacture using thin film photovoltaic materials |
| US8211731B2 (en) | 2010-06-07 | 2012-07-03 | Sunpower Corporation | Ablation of film stacks in solar cell fabrication processes |
| US8329496B2 (en) * | 2010-10-14 | 2012-12-11 | Miasole | Dithered scanned laser beam for scribing solar cell structures |
| EP3118912B1 (en) * | 2011-06-17 | 2018-03-14 | Applied Materials, Inc. | Thin film batteries comprising a step in the electrolyte layer |
| GB2492972B (en) * | 2011-07-15 | 2013-09-11 | M Solv Ltd | Method and apparatus for dividing a thin film device into separate cells |
| TWI612712B (zh) * | 2012-10-25 | 2018-01-21 | 應用材料股份有限公司 | 繞射光學元件及用於圖案化薄膜電化學元件的方法 |
| JP6101139B2 (ja) | 2013-04-12 | 2017-03-22 | 株式会社東芝 | レーザ加工方法およびレーザ加工装置 |
| US20150059411A1 (en) | 2013-08-29 | 2015-03-05 | Corning Incorporated | Method of separating a glass sheet from a carrier |
| GB201400277D0 (en) | 2014-01-08 | 2014-02-26 | Ilika Technologies Ltd | Vapour deposition method for preparing crystalline lithium-containing compounds |
| GB201400276D0 (en) | 2014-01-08 | 2014-02-26 | Ilika Technologies Ltd | Vapour deposition method for fabricating lithium-containing thin film layered structures |
| GB201400274D0 (en) | 2014-01-08 | 2014-02-26 | Ilika Technologies Ltd | Vapour deposition method for preparing amorphous lithium-containing compounds |
| US9281244B1 (en) * | 2014-09-18 | 2016-03-08 | Applied Materials, Inc. | Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process |
| CA3014185C (en) | 2016-02-12 | 2024-05-28 | Ipg Photonics Corporation | Laser cutting head with dual movable mirrors providing beam alignment and/or wobbling movement |
| JP2017183500A (ja) | 2016-03-30 | 2017-10-05 | 富士フイルム株式会社 | 有機薄膜トランジスタの製造方法および有機薄膜トランジスタ |
| EP3472881B1 (en) | 2016-06-15 | 2023-10-11 | Ilika Technologies Limited | Lithium borosilicate glass as electrolyte and electrode protective layer |
| CN105895745B (zh) * | 2016-06-21 | 2017-11-21 | 苏州协鑫集成科技工业应用研究院有限公司 | 异质结太阳能电池片的切割方法 |
| US10586974B2 (en) | 2017-09-15 | 2020-03-10 | Dyson Technology Limited | Laser ablation for manufacture of battery cells |
| US10720633B2 (en) | 2017-09-15 | 2020-07-21 | Dyson Technology Limited | Multilayer electrochemical device |
| US20190088996A1 (en) | 2017-09-15 | 2019-03-21 | Dyson Technology Limited | Multiple active and inter layers in a solid-state device |
| WO2019176632A1 (ja) | 2018-03-12 | 2019-09-19 | 株式会社アマダホールディングス | 切削加工機及び切削加工方法 |
| DE102018203899A1 (de) | 2018-03-14 | 2019-09-19 | Amada Holdings Co., Ltd. | Laserbearbeitungsvorrichtung und Laserbearbeitungsverfahren |
-
2018
- 2018-04-03 GB GB1805624.2A patent/GB2572608A/en not_active Withdrawn
-
2019
- 2019-04-02 JP JP2020544023A patent/JP7424641B2/ja active Active
- 2019-04-02 KR KR1020207026760A patent/KR102832158B1/ko active Active
- 2019-04-02 US US16/971,185 patent/US12109651B2/en active Active
- 2019-04-02 WO PCT/GB2019/050953 patent/WO2019193330A1/en not_active Ceased
- 2019-04-02 EP EP19717556.5A patent/EP3774161A1/en active Pending
- 2019-04-02 CN CN201980021879.9A patent/CN112135707A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100038825A1 (en) * | 2006-12-21 | 2010-02-18 | Mcdonald Joel P | Methods of forming microchannels by ultrafast pulsed laser direct-write processing |
| WO2008134053A1 (en) * | 2007-04-27 | 2008-11-06 | Front Edge Technology, Inc. | Thin film battery fabrication using laser shaping |
| US20120322241A1 (en) * | 2011-06-15 | 2012-12-20 | Applied Materials, Inc. | Multi-layer mask for substrate dicing by laser and plasma etch |
Also Published As
| Publication number | Publication date |
|---|---|
| US20210101231A1 (en) | 2021-04-08 |
| CN112135707A (zh) | 2020-12-25 |
| WO2019193330A1 (en) | 2019-10-10 |
| EP3774161A1 (en) | 2021-02-17 |
| KR20200136391A (ko) | 2020-12-07 |
| US12109651B2 (en) | 2024-10-08 |
| GB2572608A (en) | 2019-10-09 |
| JP7424641B2 (ja) | 2024-01-30 |
| JP2021528249A (ja) | 2021-10-21 |
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