GB2572608A - Laser processing method for thin film structures - Google Patents

Laser processing method for thin film structures Download PDF

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Publication number
GB2572608A
GB2572608A GB1805624.2A GB201805624A GB2572608A GB 2572608 A GB2572608 A GB 2572608A GB 201805624 A GB201805624 A GB 201805624A GB 2572608 A GB2572608 A GB 2572608A
Authority
GB
United Kingdom
Prior art keywords
stack
laser
substrate
cut
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB1805624.2A
Other languages
English (en)
Inventor
Hayden Brian
Turner Louise
Risbridger Thomas
Foley Thomas
Rizvi Nadeem
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ilika Technologies Ltd
Original Assignee
Ilika Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ilika Technologies Ltd filed Critical Ilika Technologies Ltd
Priority to GB1805624.2A priority Critical patent/GB2572608A/en
Priority to US16/971,185 priority patent/US12109651B2/en
Priority to EP19717556.5A priority patent/EP3774161A1/en
Priority to KR1020207026760A priority patent/KR102832158B1/ko
Priority to JP2020544023A priority patent/JP7424641B2/ja
Priority to PCT/GB2019/050953 priority patent/WO2019193330A1/en
Priority to CN201980021879.9A priority patent/CN112135707A/zh
Publication of GB2572608A publication Critical patent/GB2572608A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0436—Small-sized flat cells or batteries for portable equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/058—Construction or manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/06—Lead-acid accumulators
    • H01M10/12—Construction or manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/24—Alkaline accumulators
    • H01M10/28—Construction or manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/36—Accumulators not provided for in groups H01M10/05-H01M10/34
    • H01M10/38—Construction or manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Laser Beam Processing (AREA)
  • Secondary Cells (AREA)
  • Battery Electrode And Active Subsutance (AREA)
GB1805624.2A 2018-04-03 2018-04-03 Laser processing method for thin film structures Withdrawn GB2572608A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB1805624.2A GB2572608A (en) 2018-04-03 2018-04-03 Laser processing method for thin film structures
US16/971,185 US12109651B2 (en) 2018-04-03 2019-04-02 Laser processing method for thin film structures
EP19717556.5A EP3774161A1 (en) 2018-04-03 2019-04-02 Laser processing method for thin film structures
KR1020207026760A KR102832158B1 (ko) 2018-04-03 2019-04-02 박막 구조물들을 위한 레이저 프로세싱 방법
JP2020544023A JP7424641B2 (ja) 2018-04-03 2019-04-02 薄膜構造のレーザー処理方法
PCT/GB2019/050953 WO2019193330A1 (en) 2018-04-03 2019-04-02 Laser processing method for thin film structures
CN201980021879.9A CN112135707A (zh) 2018-04-03 2019-04-02 薄膜结构的激光处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1805624.2A GB2572608A (en) 2018-04-03 2018-04-03 Laser processing method for thin film structures

Publications (1)

Publication Number Publication Date
GB2572608A true GB2572608A (en) 2019-10-09

Family

ID=66175435

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1805624.2A Withdrawn GB2572608A (en) 2018-04-03 2018-04-03 Laser processing method for thin film structures

Country Status (7)

Country Link
US (1) US12109651B2 (https=)
EP (1) EP3774161A1 (https=)
JP (1) JP7424641B2 (https=)
KR (1) KR102832158B1 (https=)
CN (1) CN112135707A (https=)
GB (1) GB2572608A (https=)
WO (1) WO2019193330A1 (https=)

Cited By (3)

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CN112662864A (zh) * 2020-12-11 2021-04-16 浙江工业大学 一种薄钢板的水下淬火方法
CN114290698A (zh) * 2021-12-24 2022-04-08 华中科技大学 高分子薄膜大深宽比激光加工方法
DE102021202964A1 (de) 2021-03-25 2022-09-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zum Schneiden einer metallhaltigen Folie und Laser-geschnittene metallhaltige Folie

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KR20210141870A (ko) * 2020-05-14 2021-11-23 삼성전자주식회사 웨이퍼 처리 장치 및 이를 이용한 반도체 소자 제조 방법
WO2022203916A2 (en) 2021-03-23 2022-09-29 Clerio Vision, Inc. Coordinated scanning and power control of laser for forming structures in ophthalmic lenses
CN114740615B (zh) * 2022-04-11 2023-06-30 南京邮电大学 一种可调太赫兹衰减器及其制备方法
CN114953621B (zh) * 2022-05-26 2025-03-25 广东光钛领先新材料有限公司 一种垂直丝状排列的薄膜型导热材料及其制备方法
CN115360318B (zh) * 2022-09-14 2025-07-15 大连大学 硫化锌离子电池负极材料的改性方法
CN115519259B (zh) * 2022-10-22 2024-05-24 长沙大科激光科技有限公司 一种高频电流辅助双光束激光切割方法
KR102759257B1 (ko) * 2023-01-06 2025-01-23 주식회사 에스에프에이 기판 레이저 커팅 장치 및 기판 레이저 커팅 방법
KR102926416B1 (ko) * 2023-02-16 2026-02-11 국립공주대학교 산학협력단 비전도성 패턴을 포함하는 이온교환막의 제조방법 및 이에 의해 제조된 이온교환막
EP4585354A1 (en) * 2024-01-10 2025-07-16 Toyota Jidosha Kabushiki Kaisha Method for cutting a stack of several layers
DE102024207809B3 (de) * 2024-08-15 2025-12-11 Volkswagen Aktiengesellschaft Verfahren zum Trennen einer Stoffschlussverbindung zwischen einem Zellverbinder und einer Batteriezelle
CN120164761A (zh) * 2025-03-12 2025-06-17 东莞市竞沃电子科技有限公司 一种表贴式厚膜熔断器及其制备方法

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112662864A (zh) * 2020-12-11 2021-04-16 浙江工业大学 一种薄钢板的水下淬火方法
DE102021202964A1 (de) 2021-03-25 2022-09-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren und Vorrichtung zum Schneiden einer metallhaltigen Folie und Laser-geschnittene metallhaltige Folie
US12564903B2 (en) 2021-03-25 2026-03-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method and device for cutting a metal-containing foil, and laser-cut metal-containing foil
CN114290698A (zh) * 2021-12-24 2022-04-08 华中科技大学 高分子薄膜大深宽比激光加工方法
CN114290698B (zh) * 2021-12-24 2023-01-31 华中科技大学 高分子薄膜大深宽比激光加工方法

Also Published As

Publication number Publication date
US20210101231A1 (en) 2021-04-08
CN112135707A (zh) 2020-12-25
WO2019193330A1 (en) 2019-10-10
KR102832158B1 (ko) 2025-07-09
EP3774161A1 (en) 2021-02-17
KR20200136391A (ko) 2020-12-07
US12109651B2 (en) 2024-10-08
JP7424641B2 (ja) 2024-01-30
JP2021528249A (ja) 2021-10-21

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