WO2019187380A1 - Dispositif d'affichage et procédé de fabrication de dispositif d'affichage - Google Patents

Dispositif d'affichage et procédé de fabrication de dispositif d'affichage Download PDF

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Publication number
WO2019187380A1
WO2019187380A1 PCT/JP2018/045689 JP2018045689W WO2019187380A1 WO 2019187380 A1 WO2019187380 A1 WO 2019187380A1 JP 2018045689 W JP2018045689 W JP 2018045689W WO 2019187380 A1 WO2019187380 A1 WO 2019187380A1
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WIPO (PCT)
Prior art keywords
film
display device
substrate
region
display
Prior art date
Application number
PCT/JP2018/045689
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English (en)
Japanese (ja)
Inventor
歴人 鶴岡
Original Assignee
株式会社ジャパンディスプレイ
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Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Publication of WO2019187380A1 publication Critical patent/WO2019187380A1/fr

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers

Definitions

  • the present invention relates to a display device and a method for manufacturing the display device.
  • the resin composition before curing is applied on the terminal area adjacent to the display area of the display panel. This is for improving the bending strength in the terminal region when the display panel is bent by the resin film generated by curing the resin composition described above.
  • the resin film also serves to protect the terminal area of the display panel. For example, since a connection wiring layer for causing a pixel to emit light is provided on the terminal region of the display panel, the resin film prevents corrosion of the connection wiring layer.
  • the applied resin composition is not sufficiently guided to the display area side of the terminal area at the stage of applying the resin composition before curing. Therefore, in the terminal region where the resin film does not exist because the resin composition before curing is not guided, the bending strength is lower than the desired bending strength. Further, in the terminal region where the resin film does not exist, the protection by the resin film is not sufficient. For example, the connection wiring layer corrodes because moisture or the like enters from a terminal region where no resin film exists.
  • the present invention has been made in view of the above problems, and its purpose is to provide a resin film that covers the terminal region so that the bending strength in the terminal region does not decrease and corrosion of the connection wiring layer is prevented. It is to provide a display device provided.
  • a flexible substrate and a terminal region on the substrate are provided, and a pixel array portion provided in the display region on the substrate is connected to a connection substrate provided in the terminal region.
  • a display device comprising: one or more wiring layers extending; a surface film provided so as to cover the display area of the substrate; and a resin film provided in the terminal area, wherein the resin film in the terminal area
  • the base portion has a plurality of grooves extending from the display region side to the connection substrate side for guiding the resin film before curing to the display region side.
  • FIG. 28 is a plan view illustrating an example of a structure of a display panel.
  • FIG. 28 is a plan view illustrating an example of a structure of a display panel. It is the top view which expanded the principal part of FIG. 2A or FIG. 2B in 1st Embodiment.
  • FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3.
  • FIG. 4 is a diagram showing an example of a BB cross section of FIG. 3.
  • FIG. 4 is a diagram illustrating an example of a CC cross section of FIG. 3.
  • FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3.
  • FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3.
  • FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3. It is the top view to which the principal part of FIG. 2A or FIG. 2B was expanded in 2nd Embodiment. It is a figure which shows an example of the AA cross section of FIG. It is a figure which shows an example of the BB cross section of FIG. It is the top view to which the principal part of FIG. 2A or FIG. 2B was expanded in 3rd Embodiment.
  • FIG. 10 is a diagram illustrating an example of an AA cross section of FIG. 9.
  • FIG. 10 is a diagram showing an example of a BB cross section of FIG. 9.
  • FIG. 10 is a diagram illustrating an example of a CC cross section of FIG. 9.
  • FIG. 10 is a diagram illustrating an example of an AA cross section of FIG. 9.
  • FIG. 10 is a diagram illustrating an example of an AA cross section of FIG. 9.
  • FIG. 1 is a diagram schematically showing a display device 1 according to an embodiment of the present invention.
  • the display device 1 is configured to include a display panel 100 fixed so as to be sandwiched between an upper frame 10 and a lower frame 20.
  • FIGS. 2a and 2b are plan views for explaining an example of the configuration of the display panel 100.
  • the driver IC 230 is provided on the first connection substrate 210.
  • the display panel 100 includes a substrate 101, a first connection substrate 210, and a second connection substrate 220.
  • the substrate 101, the first connection substrate 210, and the second connection substrate 220 are resin substrates having flexibility such as polyimide and polyethylene terephthalate.
  • the thickness of the substrate is, for example, 10 to 20 ⁇ m.
  • the substrate 101 includes a display area 170, a terminal area 180, and a frame area 190.
  • a substrate connecting portion (not shown) is further provided at one end of the substrate 101.
  • the substrate 101 and the first connection substrate 210 are connected by disposing the first connection substrate 210 in the substrate connection portion.
  • the display area 170 has a pixel array section (not shown) in which a plurality of pixels are arranged in a matrix.
  • the pixel array section includes at least one terminal for supplying power and signals for lighting the pixels to each pixel.
  • the terminals included in the pixel array unit are supplied from, for example, a driver IC 230 provided on the first connection substrate 210 via a connection wiring layer 140 provided in the terminal region 180, a scanning signal, a video signal, and a power supply. Is a terminal to which is input.
  • the terminal area 180 connects the display area 170 and the connection area 200.
  • the terminal region 180 has a connection wiring layer 140 disposed between the pixel array portion and the substrate connection portion.
  • the frame area 190 is an area around the display area 170. Specifically, the undercoat layer 102 and the gate insulating film 103 are disposed in the frame region 190 so as to include the display region 170 (see FIGS. 4b, 8b, and 10b).
  • a circuit for generating a signal for selecting a row of the pixel array portion is disposed on the upper layer of the gate insulating film 103.
  • wiring for routing the power supply, wiring for distributing the data signal, and the like are arranged.
  • the first connection substrate 210 and the second connection substrate 220 include a connection region 200.
  • the connection area 200 is arranged on the back side of the display area 170 due to the curvature in the terminal area 180. Further, the connection area 200 is provided with a connection terminal 222 to which a signal is supplied from an external device.
  • the connection terminal 222 is disposed on the back surface side of the display region 170 by being disposed on the first connection substrate 210 and / or the second connection substrate 220.
  • the first connection substrate 210 is a wiring substrate connected to the substrate 101.
  • a driver IC 230 is disposed on the first connection board 210.
  • the driver IC 230 supplies the data signal and the power supply voltage supplied from the second connection substrate 220 to the pixel array unit provided in the display region 170 via the connection wiring layer 140.
  • a plurality of pixels included in the pixel array unit emit light by the supplied data signal and power supply voltage, and an image is displayed in the display area 170.
  • the second connection board 220 is connected to the first connection board 210.
  • Circuit components 221 and connection terminals 222 are arranged on the second connection board 220.
  • the connection terminal 222 is, for example, an external connection connector, and is connected to an external device that supplies power and data signals to the pixel array unit.
  • the connection terminal 222 supplies the power supply and data signal to an electronic circuit (not shown) formed by the circuit component 221.
  • the power supply and data signal generated by the electronic circuit are supplied to the pixel array section via the connection wiring 140.
  • the driver IC 230 is directly provided on the substrate 101.
  • the display panel 100 shown in FIG. Therefore, the display panel 100 does not necessarily have the second connection substrate 220.
  • the circuit component 221 and the connection terminal 222 are arranged on the first connection board 210.
  • FIGS. 3 to 6 hatching of some layers such as the passivation film 104, the interlayer insulating film 106, and the organic sealing film 132 is omitted in order to make the cross-sectional structure easy to see.
  • the stacking direction is the upward direction.
  • FIG. 3 is an enlarged view of the vicinity of the boundary between the display area 170 and the terminal area 180 in the first embodiment. Specifically, in FIG. 2a or 2b, the portion surrounded by the alternate long and short dash line is enlarged. In addition, FIG. 3 shows the thing before apply
  • a surface film 109 covers the surface of the display area 170.
  • the surface film 109 is, for example, a polarizing plate or an optical film.
  • the surface of the terminal region 180 is covered with, for example, the passivation film 104.
  • the terminal region 180 at least a part of a layer formed of an inorganic insulating material (eg, the undercoat layer 102, the base insulating film 103, and the passivation film 104) may be omitted or thinned.
  • an inorganic insulating material eg, the undercoat layer 102, the base insulating film 103, and the passivation film 104
  • a plurality of guide films are provided on the passivation film 104.
  • the guide films are provided so as to be parallel to each other with a predetermined distance therebetween. And the groove part of a fixed distance is formed in the location where this guide film separated from each other.
  • This constant distance is, for example, 1.5 mm or less, and preferably 0.5 mm or less.
  • the width of the guide film is also 1.5 mm or less, for example, and preferably 0.5 mm or less.
  • the guide film is the rib organic film 107.
  • the rib organic film 107 is provided extending from the display region 170.
  • the height of the groove corresponds to the height from the upper surface of the passivation film 104 to the upper surface of the rib organic film 107 as a guide film.
  • the height of the groove may be provided so as to be, for example, one third or less of the thickness of the sealing material 108.
  • the height of the groove is 1 to 6 ⁇ m.
  • the length of the groove part which guides the resin composition before hardening should just be below half of the length of the side of a terminal area
  • FIG. 4a is a cross-sectional view taken along the line AA shown in FIG.
  • FIG. 4a shows the thing before apply
  • the passivation film 104, the planarization film 105, and the interlayer insulating film 106 are the base portion of the resin film 150.
  • a plurality of guide films (rib organic films 107) for guiding the resin composition before curing are provided.
  • the structure of the guide film is not limited to the above-described structure.
  • one of the planarization film 105, the rib organic film 107, and the organic sealing film 132 provided in the display region 170 may be extended to the terminal region 180 and provided as a guide film.
  • an inorganic film or an organic film may be newly provided as a guide film regardless of the stacked structure of the display region 170.
  • FIG. 4b is a cross-sectional view taken along the line BB shown in FIG. That is, it is a cross-sectional view at a location where the guide film is not provided.
  • 4c is a cross-sectional view taken along the line CC shown in FIG. That is, it is a cross-sectional view at a location where a guide film is provided.
  • 4B and 4C show the state after the resin film is provided.
  • the laminated structure of the display panel 100 will be described with reference to FIGS. 4b and 4c.
  • the substrate 101 is made of a flexible resin composition such as glass or polyimide.
  • the substrate 101 is covered with an undercoat layer 102.
  • a semiconductor layer 111 is formed over the undercoat layer 102, and the semiconductor layer 111 is covered with a gate insulating film 103.
  • a gate electrode 112 is formed on the gate insulating film 103, and the gate electrode 112 is covered with the passivation film 104.
  • the drain electrode 113 and the source electrode 114 pass through the gate insulating film 103 and the passivation film 104 and are connected to the semiconductor layer 111.
  • the semiconductor layer 111, the gate electrode 112, the drain electrode 113, and the source electrode 114 constitute the thin film transistor 110.
  • the thin film transistor 110 is provided so as to correspond to each of the plurality of unit pixels.
  • the undercoat layer 102, the gate insulating film 103, and the passivation film 104 are formed of an inorganic insulating material such as SiO 2 , SiN, or SiON.
  • connection wiring layer 140 is formed in the terminal region 180.
  • the illustrated connection wiring layer 140 is a wiring for electrically connecting the first connection substrate 210 and terminals included in the pixel array unit. Note that the connection wiring layer 140 may be configured so that the surface layer is thinly covered with the passivation film 104.
  • the drain electrode 113 and the source electrode 114 are covered with the planarization film 105. Further, when the connection wiring layer 140 is located under the guide film, it is covered with the planarization film 105.
  • the planarization film 105 is covered with an interlayer insulating film 106.
  • the drain electrode 113, the source electrode 114, and the connection wiring layer 140 are formed of a conductive material including, for example, Al, Ag, Cu, Ni, Ti, Mo, or the like.
  • the planarization film 105 is formed of an organic insulating material such as acrylic resin or polyimide and has a flat upper surface.
  • the interlayer insulating film 106 is formed of an inorganic insulating material such as SiO 2 , SiN, or SiON. In FIG.
  • the interlayer insulating film 106 is not provided on the terminal region 180 where the guide film is not provided.
  • the present invention is not limited to the above configuration, and the interlayer insulating film 106 may be provided on the terminal region 180 where the guide film is not provided so as to cover the connection wiring layer 140.
  • a pixel electrode 121 (for example, an anode) is formed on the interlayer insulating film 106.
  • the pixel electrode 121 passes through the planarization film 105 and the interlayer insulating film 106 and is connected to the source electrode 114.
  • the pixel electrode 121 is provided so as to correspond to each of the plurality of unit pixels.
  • the pixel electrode 121 is formed as a reflective electrode.
  • the pixel electrode 121 is formed of a conductive material containing, for example, Al, Ag, Cu, Ni, Ti, Mo, or the like.
  • the pixel electrode 121 needs to be formed as a transmissive electrode.
  • the pixel electrode 121 may be formed of a conductive oxide such as ITO or IZO.
  • the pixel electrode 121 is covered with the rib organic film 107.
  • the rib organic film 107 is also called a bank.
  • the rib organic film 107 is formed of an organic insulating material such as acrylic resin or polyimide.
  • an opening 107s through which the pixel electrode 121 is exposed to the bottom is formed.
  • the inner edge portion of the rib organic film 107 forming the opening 107s is placed on the peripheral portion of the pixel electrode 121 and has a tapered shape that spreads outward as it goes upward.
  • the light emitting layers 122 are formed separately from each other.
  • the light emitting layer 122 emits light in a plurality of colors including, for example, red, green, and blue, corresponding to each of the plurality of unit pixels.
  • a hole transport layer, a hole injection layer, an electron transport layer, and an electron transport layer may be formed.
  • the light emitting layer 122 may be formed as a uniform film (so-called solid film) that extends over the entire display region 170.
  • the light emitting layer 122 emits light in a single color (for example, white), and each component of a plurality of colors including, for example, red, green, and blue is extracted by the color filter and the color conversion layer.
  • the light emitting layer 122 is vapor-deposited separately using a mask, it may be formed by application as another method.
  • the light emitting layer 122 and the rib organic film 107 are covered with a counter electrode 123 (for example, a cathode).
  • the counter electrode 123 is formed as a uniform film (so-called solid film) extending over the entire display region 170.
  • the light emitting element 120 is configured by the light emitting layer 122 and the pixel electrode 121 and the counter electrode 123 sandwiching the light emitting layer 122.
  • the light emitting layer 122 emits light by a current flowing between the pixel electrode 121 and the counter electrode 123.
  • the counter electrode 123 is formed of a transparent conductive material such as ITO or a metal thin film such as MgAg.
  • the counter electrode 123 needs to be formed as a transmissive electrode, and when a metal thin film is used, it is necessary to reduce the film thickness so that light can be transmitted.
  • the sealing film 130 has a three-layer laminated structure including, for example, a first inorganic sealing film 131, an organic sealing film 132, and a second inorganic sealing film 133 in this order from the bottom.
  • the first inorganic sealing film 131 and the second inorganic sealing film 133 are formed of an inorganic insulating material such as SiO 2 , SiN, or SiON.
  • the organic sealing film 132 is formed of an organic insulating material such as acrylic resin or polyimide, and planarizes the upper surface of the sealing film 130.
  • the rib organic film 107 is also formed near the boundary between the display region 170 and the terminal region 180.
  • the rib organic film 107 provided between the interlayer insulating film 106 and the first inorganic sealing film 131 also functions as a moisture shielding portion. This moisture shielding part prevents foreign substances such as moisture from entering the display area 170.
  • the rib organic film 107 is not formed in a portion other than the vicinity of the boundary between the display region 170 and the terminal region 180.
  • the edge part of the 2nd inorganic sealing film 133 is located on a moisture interruption
  • a surface film 109 is provided on the sealing film 130.
  • the surface film 109 is disposed on the sealing material 108 which is an adhesive layer for fixing to the display area 170.
  • the resin film 150 is formed.
  • the resin film 150 is formed of a resin material such as an acrylic resin.
  • the thickness of the resin film 150 is, for example, 40 to 200 ⁇ m.
  • the resin film 150 needs to cover at least the guide film (here, the rib organic film 107) provided in the terminal region 180 and the connection wiring layer 140. Therefore, specifically, the resin composition before curing is applied on the base portion and the guide film by an inkjet method or the like. The applied resin composition before curing is guided to the terminal area side end face of the display area 170 and the like by the formed groove. Thereafter, the guided resin composition before curing is cured, so that the resin film 150 is formed in contact with the sealing material 108 and the surface film 109.
  • the guide film here, the rib organic film 107
  • connection wiring layer 140 is a plurality of layers having different heights
  • the present invention is not limited to this configuration.
  • 5 and 6 are cross-sectional views taken along the line AA shown in FIG. 3, and show the arrangement of the connection wiring layer 140 as a modification of the first embodiment.
  • FIG. 5 and 6 shows the thing before apply
  • 5 and 6 both show the case where the connection wiring layer 140 is one layer.
  • the connection wiring layer 140 is provided under the base portion and the guide film.
  • the connection wiring layer 140 may be provided in a place other than the place where the base portion and the guide film are provided.
  • the resin composition before curing is guided to a region where the formation of the resin film 150 is desired by providing the guide film on the passivation film 104 and forming the groove. It becomes possible.
  • FIG. 7 is an enlarged view of the vicinity of the boundary between the display area 170 and the terminal area 180 in the second embodiment. Specifically, in FIG. 2a or 2b, the portion surrounded by the alternate long and short dash line is enlarged. In addition, FIG. 7 shows the thing before apply
  • FIG. 8a is a cross-sectional view taken along line AA shown in FIG.
  • FIG. 8a shows the thing before apply
  • the rib organic film 107 as a guide film is continuously provided on the bottom surface of the groove.
  • the bottom surface of the groove portion is the passivation film 104 in the first embodiment, whereas the bottom surface of the groove portion is also the rib organic film 107 in the second embodiment.
  • the thickness of the rib organic film 107 provided in the groove is desirably smaller than the thickness of the rib organic film 107 provided in a portion provided as a guide film (on the interlayer insulating film 106 in FIG. 8A).
  • the rib organic film 107 is also provided on the connection wiring layer 140.
  • the upper surface of the resin film 170 is flattened. However, the flattening is not necessarily required. The highest portion of the upper surface of the resin film 170 may be provided so as not to exceed the upper surface of the surface film 109.
  • the display panel 100 according to the second embodiment has a configuration in which the guide film continuously covers the entire terminal region 180 while providing the guide film to form the groove. Even if this configuration is adopted, in the second embodiment as well, the resin composition before curing can be guided to the region where the formation of the resin film 150 is desired by the formed groove, as in the first embodiment. It becomes possible.
  • FIGS. 10b and 10c also omit hatching of some layers such as the passivation film 104, the interlayer insulating film 106, and the organic sealing film 132 in order to make the cross-sectional structure easy to see.
  • the stacking direction is the upward direction.
  • FIG. 9 is an enlarged view of the vicinity of the boundary between the display area 170 and the terminal area 180 in the third embodiment. Specifically, in FIG. 2a or 2b, the portion surrounded by the alternate long and short dash line is enlarged.
  • FIG. 9 shows the thing before apply
  • 10a is a cross-sectional view taken along line AA shown in FIG.
  • FIG. 10a shows the thing before apply
  • the passivation film 104 corresponding to the base portion of the resin film 150 has a recess 160.
  • the bottom surface of the recess 160 is provided so as to be 1 to 6 ⁇ m lower surface from the upper surface of the passivation film 104, for example.
  • the processing for making the bottom surface of the recess 160 lower than the top surface of the passivation film 104 may be performed when the passivation film 104 is formed. In this case, the processing may be performed by, for example, a laser or may be performed by etching.
  • FIG. 10b is a cross-sectional view taken along the line BB shown in FIG. That is, it is a cross-sectional view at a location including the recess 160.
  • FIG. 10c is a cross-sectional view taken along the line CC shown in FIG. That is, it is a cross-sectional view at a location not including the recess 160.
  • 10B and 10C show the state after the resin film 150 is provided.
  • the surface of the passivation film 104 is sloped near the boundary with the terminal region 180 on the display region 170 side.
  • the shape of the recess 160 does not necessarily extend to the display area 170 side.
  • the recess 160 may be provided so as to extend from the terminal area side end face on the display area 170 side to the side to which the first connection substrate 210 is connected.
  • the portions other than the concave portion 160 have substantially the same configuration as that in FIG. 4c for explaining the first embodiment.
  • the specific difference is that the third embodiment adopts a configuration in which the upper surface of the connection wiring layer 140 is thinly covered with the passivation film 140.
  • connection wiring layer 140 is one layer.
  • the connection wiring layer 140 is provided at a place other than the recess 160.
  • the connection wiring layer 140 may be provided on the bottom surface of the recess 160 or directly below the bottom surface of the recess 160.
  • the recess 160 is formed in the base portion (passivation film 104) of the resin film 150.
  • the third embodiment can also guide the resin composition before curing to the region where the formation of the resin film 150 is desired, as in the first and second embodiments. .
  • a resin film 150 is cured to a desired region by providing a guide film or a recess to form a groove for guiding the resin composition before curing. It becomes possible to guide the previous resin composition. And the resin film 150 which coat
  • the display device 1 is provided in which the bending strength in the terminal region 180 is not lowered and the corrosion of the connection wiring layer 140 is prevented.
  • the resin composition when the viscosity of the resin composition before curing is lowered, the resin composition may flow outward. In this case, the resin film 150 may be formed beyond the region where the resin film 150 is desired to be formed. However, by providing a guide film or recess 160 in the terminal region 180, the direction in which the applied resin product flows can be controlled by guidance by the groove.
  • the resin composition when the viscosity of the resin composition is increased in order to increase the application accuracy, the resin composition may not be applied to a region where the formation of the resin film 150 is desired. However, by providing the guide film or the recess 160 in the terminal region 180, the resin composition can be easily guided to the region where the resin film 150 is desired to be formed.
  • the guide of the resin composition by the groove part may be a guide under the control of the shape of the groove part, or may utilize the capillary phenomenon by narrowing the width of the groove part.
  • an organic EL display device has been exemplified as a disclosure example, but as other application examples, a liquid crystal display device, another self-luminous display device, or an electronic paper display device having an electrophoretic element or the like Any flat panel display device can be used. Further, it goes without saying that the present invention can be applied without any particular limitation from a small and medium display device to a large display device.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne un dispositif d'affichage qui comprend un film de résine qui recouvre une région terminale de sorte que la résistance à la flexion dans la région terminale ne diminue pas et de façon à empêcher la corrosion de la couche de câblage de connexion. Ce dispositif d'affichage comporte un substrat flexible, une ou plusieurs couches de câblage qui sont disposées dans la région terminale sur le substrat et qui s'étendent à partir d'une unité de matrice de pixels disposée sur la région d'affichage du substrat par rapport à un substrat de connexion disposé dans la région terminale, un film de surface qui est disposé de façon à recouvrir la région d'affichage du substrat, et un film de résine qui est disposé sur la région terminale, la partie de base du film de résine dans la région terminale présentant de multiples rainures qui guident le film de résine avant durcissement vers le côté région d'affichage et qui s'étendent du côté région d'affichage au côté substrat de connexion.
PCT/JP2018/045689 2018-03-28 2018-12-12 Dispositif d'affichage et procédé de fabrication de dispositif d'affichage WO2019187380A1 (fr)

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JP2018-062365 2018-03-28
JP2018062365A JP2019174637A (ja) 2018-03-28 2018-03-28 表示装置および表示装置の製造方法

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Citations (8)

* Cited by examiner, † Cited by third party
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