WO2019187380A1 - Display device and the display device manufacturing method - Google Patents

Display device and the display device manufacturing method Download PDF

Info

Publication number
WO2019187380A1
WO2019187380A1 PCT/JP2018/045689 JP2018045689W WO2019187380A1 WO 2019187380 A1 WO2019187380 A1 WO 2019187380A1 JP 2018045689 W JP2018045689 W JP 2018045689W WO 2019187380 A1 WO2019187380 A1 WO 2019187380A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
display device
substrate
region
display
Prior art date
Application number
PCT/JP2018/045689
Other languages
French (fr)
Japanese (ja)
Inventor
歴人 鶴岡
Original Assignee
株式会社ジャパンディスプレイ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ジャパンディスプレイ filed Critical 株式会社ジャパンディスプレイ
Publication of WO2019187380A1 publication Critical patent/WO2019187380A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Definitions

  • the present invention relates to a display device and a method for manufacturing the display device.
  • the resin composition before curing is applied on the terminal area adjacent to the display area of the display panel. This is for improving the bending strength in the terminal region when the display panel is bent by the resin film generated by curing the resin composition described above.
  • the resin film also serves to protect the terminal area of the display panel. For example, since a connection wiring layer for causing a pixel to emit light is provided on the terminal region of the display panel, the resin film prevents corrosion of the connection wiring layer.
  • the applied resin composition is not sufficiently guided to the display area side of the terminal area at the stage of applying the resin composition before curing. Therefore, in the terminal region where the resin film does not exist because the resin composition before curing is not guided, the bending strength is lower than the desired bending strength. Further, in the terminal region where the resin film does not exist, the protection by the resin film is not sufficient. For example, the connection wiring layer corrodes because moisture or the like enters from a terminal region where no resin film exists.
  • the present invention has been made in view of the above problems, and its purpose is to provide a resin film that covers the terminal region so that the bending strength in the terminal region does not decrease and corrosion of the connection wiring layer is prevented. It is to provide a display device provided.
  • a flexible substrate and a terminal region on the substrate are provided, and a pixel array portion provided in the display region on the substrate is connected to a connection substrate provided in the terminal region.
  • a display device comprising: one or more wiring layers extending; a surface film provided so as to cover the display area of the substrate; and a resin film provided in the terminal area, wherein the resin film in the terminal area
  • the base portion has a plurality of grooves extending from the display region side to the connection substrate side for guiding the resin film before curing to the display region side.
  • FIG. 28 is a plan view illustrating an example of a structure of a display panel.
  • FIG. 28 is a plan view illustrating an example of a structure of a display panel. It is the top view which expanded the principal part of FIG. 2A or FIG. 2B in 1st Embodiment.
  • FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3.
  • FIG. 4 is a diagram showing an example of a BB cross section of FIG. 3.
  • FIG. 4 is a diagram illustrating an example of a CC cross section of FIG. 3.
  • FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3.
  • FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3.
  • FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3. It is the top view to which the principal part of FIG. 2A or FIG. 2B was expanded in 2nd Embodiment. It is a figure which shows an example of the AA cross section of FIG. It is a figure which shows an example of the BB cross section of FIG. It is the top view to which the principal part of FIG. 2A or FIG. 2B was expanded in 3rd Embodiment.
  • FIG. 10 is a diagram illustrating an example of an AA cross section of FIG. 9.
  • FIG. 10 is a diagram showing an example of a BB cross section of FIG. 9.
  • FIG. 10 is a diagram illustrating an example of a CC cross section of FIG. 9.
  • FIG. 10 is a diagram illustrating an example of an AA cross section of FIG. 9.
  • FIG. 10 is a diagram illustrating an example of an AA cross section of FIG. 9.
  • FIG. 1 is a diagram schematically showing a display device 1 according to an embodiment of the present invention.
  • the display device 1 is configured to include a display panel 100 fixed so as to be sandwiched between an upper frame 10 and a lower frame 20.
  • FIGS. 2a and 2b are plan views for explaining an example of the configuration of the display panel 100.
  • the driver IC 230 is provided on the first connection substrate 210.
  • the display panel 100 includes a substrate 101, a first connection substrate 210, and a second connection substrate 220.
  • the substrate 101, the first connection substrate 210, and the second connection substrate 220 are resin substrates having flexibility such as polyimide and polyethylene terephthalate.
  • the thickness of the substrate is, for example, 10 to 20 ⁇ m.
  • the substrate 101 includes a display area 170, a terminal area 180, and a frame area 190.
  • a substrate connecting portion (not shown) is further provided at one end of the substrate 101.
  • the substrate 101 and the first connection substrate 210 are connected by disposing the first connection substrate 210 in the substrate connection portion.
  • the display area 170 has a pixel array section (not shown) in which a plurality of pixels are arranged in a matrix.
  • the pixel array section includes at least one terminal for supplying power and signals for lighting the pixels to each pixel.
  • the terminals included in the pixel array unit are supplied from, for example, a driver IC 230 provided on the first connection substrate 210 via a connection wiring layer 140 provided in the terminal region 180, a scanning signal, a video signal, and a power supply. Is a terminal to which is input.
  • the terminal area 180 connects the display area 170 and the connection area 200.
  • the terminal region 180 has a connection wiring layer 140 disposed between the pixel array portion and the substrate connection portion.
  • the frame area 190 is an area around the display area 170. Specifically, the undercoat layer 102 and the gate insulating film 103 are disposed in the frame region 190 so as to include the display region 170 (see FIGS. 4b, 8b, and 10b).
  • a circuit for generating a signal for selecting a row of the pixel array portion is disposed on the upper layer of the gate insulating film 103.
  • wiring for routing the power supply, wiring for distributing the data signal, and the like are arranged.
  • the first connection substrate 210 and the second connection substrate 220 include a connection region 200.
  • the connection area 200 is arranged on the back side of the display area 170 due to the curvature in the terminal area 180. Further, the connection area 200 is provided with a connection terminal 222 to which a signal is supplied from an external device.
  • the connection terminal 222 is disposed on the back surface side of the display region 170 by being disposed on the first connection substrate 210 and / or the second connection substrate 220.
  • the first connection substrate 210 is a wiring substrate connected to the substrate 101.
  • a driver IC 230 is disposed on the first connection board 210.
  • the driver IC 230 supplies the data signal and the power supply voltage supplied from the second connection substrate 220 to the pixel array unit provided in the display region 170 via the connection wiring layer 140.
  • a plurality of pixels included in the pixel array unit emit light by the supplied data signal and power supply voltage, and an image is displayed in the display area 170.
  • the second connection board 220 is connected to the first connection board 210.
  • Circuit components 221 and connection terminals 222 are arranged on the second connection board 220.
  • the connection terminal 222 is, for example, an external connection connector, and is connected to an external device that supplies power and data signals to the pixel array unit.
  • the connection terminal 222 supplies the power supply and data signal to an electronic circuit (not shown) formed by the circuit component 221.
  • the power supply and data signal generated by the electronic circuit are supplied to the pixel array section via the connection wiring 140.
  • the driver IC 230 is directly provided on the substrate 101.
  • the display panel 100 shown in FIG. Therefore, the display panel 100 does not necessarily have the second connection substrate 220.
  • the circuit component 221 and the connection terminal 222 are arranged on the first connection board 210.
  • FIGS. 3 to 6 hatching of some layers such as the passivation film 104, the interlayer insulating film 106, and the organic sealing film 132 is omitted in order to make the cross-sectional structure easy to see.
  • the stacking direction is the upward direction.
  • FIG. 3 is an enlarged view of the vicinity of the boundary between the display area 170 and the terminal area 180 in the first embodiment. Specifically, in FIG. 2a or 2b, the portion surrounded by the alternate long and short dash line is enlarged. In addition, FIG. 3 shows the thing before apply
  • a surface film 109 covers the surface of the display area 170.
  • the surface film 109 is, for example, a polarizing plate or an optical film.
  • the surface of the terminal region 180 is covered with, for example, the passivation film 104.
  • the terminal region 180 at least a part of a layer formed of an inorganic insulating material (eg, the undercoat layer 102, the base insulating film 103, and the passivation film 104) may be omitted or thinned.
  • an inorganic insulating material eg, the undercoat layer 102, the base insulating film 103, and the passivation film 104
  • a plurality of guide films are provided on the passivation film 104.
  • the guide films are provided so as to be parallel to each other with a predetermined distance therebetween. And the groove part of a fixed distance is formed in the location where this guide film separated from each other.
  • This constant distance is, for example, 1.5 mm or less, and preferably 0.5 mm or less.
  • the width of the guide film is also 1.5 mm or less, for example, and preferably 0.5 mm or less.
  • the guide film is the rib organic film 107.
  • the rib organic film 107 is provided extending from the display region 170.
  • the height of the groove corresponds to the height from the upper surface of the passivation film 104 to the upper surface of the rib organic film 107 as a guide film.
  • the height of the groove may be provided so as to be, for example, one third or less of the thickness of the sealing material 108.
  • the height of the groove is 1 to 6 ⁇ m.
  • the length of the groove part which guides the resin composition before hardening should just be below half of the length of the side of a terminal area
  • FIG. 4a is a cross-sectional view taken along the line AA shown in FIG.
  • FIG. 4a shows the thing before apply
  • the passivation film 104, the planarization film 105, and the interlayer insulating film 106 are the base portion of the resin film 150.
  • a plurality of guide films (rib organic films 107) for guiding the resin composition before curing are provided.
  • the structure of the guide film is not limited to the above-described structure.
  • one of the planarization film 105, the rib organic film 107, and the organic sealing film 132 provided in the display region 170 may be extended to the terminal region 180 and provided as a guide film.
  • an inorganic film or an organic film may be newly provided as a guide film regardless of the stacked structure of the display region 170.
  • FIG. 4b is a cross-sectional view taken along the line BB shown in FIG. That is, it is a cross-sectional view at a location where the guide film is not provided.
  • 4c is a cross-sectional view taken along the line CC shown in FIG. That is, it is a cross-sectional view at a location where a guide film is provided.
  • 4B and 4C show the state after the resin film is provided.
  • the laminated structure of the display panel 100 will be described with reference to FIGS. 4b and 4c.
  • the substrate 101 is made of a flexible resin composition such as glass or polyimide.
  • the substrate 101 is covered with an undercoat layer 102.
  • a semiconductor layer 111 is formed over the undercoat layer 102, and the semiconductor layer 111 is covered with a gate insulating film 103.
  • a gate electrode 112 is formed on the gate insulating film 103, and the gate electrode 112 is covered with the passivation film 104.
  • the drain electrode 113 and the source electrode 114 pass through the gate insulating film 103 and the passivation film 104 and are connected to the semiconductor layer 111.
  • the semiconductor layer 111, the gate electrode 112, the drain electrode 113, and the source electrode 114 constitute the thin film transistor 110.
  • the thin film transistor 110 is provided so as to correspond to each of the plurality of unit pixels.
  • the undercoat layer 102, the gate insulating film 103, and the passivation film 104 are formed of an inorganic insulating material such as SiO 2 , SiN, or SiON.
  • connection wiring layer 140 is formed in the terminal region 180.
  • the illustrated connection wiring layer 140 is a wiring for electrically connecting the first connection substrate 210 and terminals included in the pixel array unit. Note that the connection wiring layer 140 may be configured so that the surface layer is thinly covered with the passivation film 104.
  • the drain electrode 113 and the source electrode 114 are covered with the planarization film 105. Further, when the connection wiring layer 140 is located under the guide film, it is covered with the planarization film 105.
  • the planarization film 105 is covered with an interlayer insulating film 106.
  • the drain electrode 113, the source electrode 114, and the connection wiring layer 140 are formed of a conductive material including, for example, Al, Ag, Cu, Ni, Ti, Mo, or the like.
  • the planarization film 105 is formed of an organic insulating material such as acrylic resin or polyimide and has a flat upper surface.
  • the interlayer insulating film 106 is formed of an inorganic insulating material such as SiO 2 , SiN, or SiON. In FIG.
  • the interlayer insulating film 106 is not provided on the terminal region 180 where the guide film is not provided.
  • the present invention is not limited to the above configuration, and the interlayer insulating film 106 may be provided on the terminal region 180 where the guide film is not provided so as to cover the connection wiring layer 140.
  • a pixel electrode 121 (for example, an anode) is formed on the interlayer insulating film 106.
  • the pixel electrode 121 passes through the planarization film 105 and the interlayer insulating film 106 and is connected to the source electrode 114.
  • the pixel electrode 121 is provided so as to correspond to each of the plurality of unit pixels.
  • the pixel electrode 121 is formed as a reflective electrode.
  • the pixel electrode 121 is formed of a conductive material containing, for example, Al, Ag, Cu, Ni, Ti, Mo, or the like.
  • the pixel electrode 121 needs to be formed as a transmissive electrode.
  • the pixel electrode 121 may be formed of a conductive oxide such as ITO or IZO.
  • the pixel electrode 121 is covered with the rib organic film 107.
  • the rib organic film 107 is also called a bank.
  • the rib organic film 107 is formed of an organic insulating material such as acrylic resin or polyimide.
  • an opening 107s through which the pixel electrode 121 is exposed to the bottom is formed.
  • the inner edge portion of the rib organic film 107 forming the opening 107s is placed on the peripheral portion of the pixel electrode 121 and has a tapered shape that spreads outward as it goes upward.
  • the light emitting layers 122 are formed separately from each other.
  • the light emitting layer 122 emits light in a plurality of colors including, for example, red, green, and blue, corresponding to each of the plurality of unit pixels.
  • a hole transport layer, a hole injection layer, an electron transport layer, and an electron transport layer may be formed.
  • the light emitting layer 122 may be formed as a uniform film (so-called solid film) that extends over the entire display region 170.
  • the light emitting layer 122 emits light in a single color (for example, white), and each component of a plurality of colors including, for example, red, green, and blue is extracted by the color filter and the color conversion layer.
  • the light emitting layer 122 is vapor-deposited separately using a mask, it may be formed by application as another method.
  • the light emitting layer 122 and the rib organic film 107 are covered with a counter electrode 123 (for example, a cathode).
  • the counter electrode 123 is formed as a uniform film (so-called solid film) extending over the entire display region 170.
  • the light emitting element 120 is configured by the light emitting layer 122 and the pixel electrode 121 and the counter electrode 123 sandwiching the light emitting layer 122.
  • the light emitting layer 122 emits light by a current flowing between the pixel electrode 121 and the counter electrode 123.
  • the counter electrode 123 is formed of a transparent conductive material such as ITO or a metal thin film such as MgAg.
  • the counter electrode 123 needs to be formed as a transmissive electrode, and when a metal thin film is used, it is necessary to reduce the film thickness so that light can be transmitted.
  • the sealing film 130 has a three-layer laminated structure including, for example, a first inorganic sealing film 131, an organic sealing film 132, and a second inorganic sealing film 133 in this order from the bottom.
  • the first inorganic sealing film 131 and the second inorganic sealing film 133 are formed of an inorganic insulating material such as SiO 2 , SiN, or SiON.
  • the organic sealing film 132 is formed of an organic insulating material such as acrylic resin or polyimide, and planarizes the upper surface of the sealing film 130.
  • the rib organic film 107 is also formed near the boundary between the display region 170 and the terminal region 180.
  • the rib organic film 107 provided between the interlayer insulating film 106 and the first inorganic sealing film 131 also functions as a moisture shielding portion. This moisture shielding part prevents foreign substances such as moisture from entering the display area 170.
  • the rib organic film 107 is not formed in a portion other than the vicinity of the boundary between the display region 170 and the terminal region 180.
  • the edge part of the 2nd inorganic sealing film 133 is located on a moisture interruption
  • a surface film 109 is provided on the sealing film 130.
  • the surface film 109 is disposed on the sealing material 108 which is an adhesive layer for fixing to the display area 170.
  • the resin film 150 is formed.
  • the resin film 150 is formed of a resin material such as an acrylic resin.
  • the thickness of the resin film 150 is, for example, 40 to 200 ⁇ m.
  • the resin film 150 needs to cover at least the guide film (here, the rib organic film 107) provided in the terminal region 180 and the connection wiring layer 140. Therefore, specifically, the resin composition before curing is applied on the base portion and the guide film by an inkjet method or the like. The applied resin composition before curing is guided to the terminal area side end face of the display area 170 and the like by the formed groove. Thereafter, the guided resin composition before curing is cured, so that the resin film 150 is formed in contact with the sealing material 108 and the surface film 109.
  • the guide film here, the rib organic film 107
  • connection wiring layer 140 is a plurality of layers having different heights
  • the present invention is not limited to this configuration.
  • 5 and 6 are cross-sectional views taken along the line AA shown in FIG. 3, and show the arrangement of the connection wiring layer 140 as a modification of the first embodiment.
  • FIG. 5 and 6 shows the thing before apply
  • 5 and 6 both show the case where the connection wiring layer 140 is one layer.
  • the connection wiring layer 140 is provided under the base portion and the guide film.
  • the connection wiring layer 140 may be provided in a place other than the place where the base portion and the guide film are provided.
  • the resin composition before curing is guided to a region where the formation of the resin film 150 is desired by providing the guide film on the passivation film 104 and forming the groove. It becomes possible.
  • FIG. 7 is an enlarged view of the vicinity of the boundary between the display area 170 and the terminal area 180 in the second embodiment. Specifically, in FIG. 2a or 2b, the portion surrounded by the alternate long and short dash line is enlarged. In addition, FIG. 7 shows the thing before apply
  • FIG. 8a is a cross-sectional view taken along line AA shown in FIG.
  • FIG. 8a shows the thing before apply
  • the rib organic film 107 as a guide film is continuously provided on the bottom surface of the groove.
  • the bottom surface of the groove portion is the passivation film 104 in the first embodiment, whereas the bottom surface of the groove portion is also the rib organic film 107 in the second embodiment.
  • the thickness of the rib organic film 107 provided in the groove is desirably smaller than the thickness of the rib organic film 107 provided in a portion provided as a guide film (on the interlayer insulating film 106 in FIG. 8A).
  • the rib organic film 107 is also provided on the connection wiring layer 140.
  • the upper surface of the resin film 170 is flattened. However, the flattening is not necessarily required. The highest portion of the upper surface of the resin film 170 may be provided so as not to exceed the upper surface of the surface film 109.
  • the display panel 100 according to the second embodiment has a configuration in which the guide film continuously covers the entire terminal region 180 while providing the guide film to form the groove. Even if this configuration is adopted, in the second embodiment as well, the resin composition before curing can be guided to the region where the formation of the resin film 150 is desired by the formed groove, as in the first embodiment. It becomes possible.
  • FIGS. 10b and 10c also omit hatching of some layers such as the passivation film 104, the interlayer insulating film 106, and the organic sealing film 132 in order to make the cross-sectional structure easy to see.
  • the stacking direction is the upward direction.
  • FIG. 9 is an enlarged view of the vicinity of the boundary between the display area 170 and the terminal area 180 in the third embodiment. Specifically, in FIG. 2a or 2b, the portion surrounded by the alternate long and short dash line is enlarged.
  • FIG. 9 shows the thing before apply
  • 10a is a cross-sectional view taken along line AA shown in FIG.
  • FIG. 10a shows the thing before apply
  • the passivation film 104 corresponding to the base portion of the resin film 150 has a recess 160.
  • the bottom surface of the recess 160 is provided so as to be 1 to 6 ⁇ m lower surface from the upper surface of the passivation film 104, for example.
  • the processing for making the bottom surface of the recess 160 lower than the top surface of the passivation film 104 may be performed when the passivation film 104 is formed. In this case, the processing may be performed by, for example, a laser or may be performed by etching.
  • FIG. 10b is a cross-sectional view taken along the line BB shown in FIG. That is, it is a cross-sectional view at a location including the recess 160.
  • FIG. 10c is a cross-sectional view taken along the line CC shown in FIG. That is, it is a cross-sectional view at a location not including the recess 160.
  • 10B and 10C show the state after the resin film 150 is provided.
  • the surface of the passivation film 104 is sloped near the boundary with the terminal region 180 on the display region 170 side.
  • the shape of the recess 160 does not necessarily extend to the display area 170 side.
  • the recess 160 may be provided so as to extend from the terminal area side end face on the display area 170 side to the side to which the first connection substrate 210 is connected.
  • the portions other than the concave portion 160 have substantially the same configuration as that in FIG. 4c for explaining the first embodiment.
  • the specific difference is that the third embodiment adopts a configuration in which the upper surface of the connection wiring layer 140 is thinly covered with the passivation film 140.
  • connection wiring layer 140 is one layer.
  • the connection wiring layer 140 is provided at a place other than the recess 160.
  • the connection wiring layer 140 may be provided on the bottom surface of the recess 160 or directly below the bottom surface of the recess 160.
  • the recess 160 is formed in the base portion (passivation film 104) of the resin film 150.
  • the third embodiment can also guide the resin composition before curing to the region where the formation of the resin film 150 is desired, as in the first and second embodiments. .
  • a resin film 150 is cured to a desired region by providing a guide film or a recess to form a groove for guiding the resin composition before curing. It becomes possible to guide the previous resin composition. And the resin film 150 which coat
  • the display device 1 is provided in which the bending strength in the terminal region 180 is not lowered and the corrosion of the connection wiring layer 140 is prevented.
  • the resin composition when the viscosity of the resin composition before curing is lowered, the resin composition may flow outward. In this case, the resin film 150 may be formed beyond the region where the resin film 150 is desired to be formed. However, by providing a guide film or recess 160 in the terminal region 180, the direction in which the applied resin product flows can be controlled by guidance by the groove.
  • the resin composition when the viscosity of the resin composition is increased in order to increase the application accuracy, the resin composition may not be applied to a region where the formation of the resin film 150 is desired. However, by providing the guide film or the recess 160 in the terminal region 180, the resin composition can be easily guided to the region where the resin film 150 is desired to be formed.
  • the guide of the resin composition by the groove part may be a guide under the control of the shape of the groove part, or may utilize the capillary phenomenon by narrowing the width of the groove part.
  • an organic EL display device has been exemplified as a disclosure example, but as other application examples, a liquid crystal display device, another self-luminous display device, or an electronic paper display device having an electrophoretic element or the like Any flat panel display device can be used. Further, it goes without saying that the present invention can be applied without any particular limitation from a small and medium display device to a large display device.

Abstract

A display device is provided which comprises a resin film that covers a terminal region such that the bending strength in the terminal region does not decrease and so as to prevent corrosion of the connection wiring layer. This display device has a flexible substrate, one or more wiring layers which are provided in the terminal region on the substrate and which extend from a pixel array unit disposed on the display region of the substrate to a connection substrate provided in the terminal region, a surface film which is provided so as to cover the display region of the substrate, and a resin film which is provided on the terminal region, wherein the base portion of the resin film in the terminal region has multiple grooves which guide the resin film before curing towards the display region side and which extend from the display region side to the connection substrate side.

Description

表示装置および表示装置の製造方法Display device and manufacturing method of display device
　本発明は、表示装置および表示装置の製造方法に関する。 The present invention relates to a display device and a method for manufacturing the display device.
　有機エレクトロルミネッセンス（ＥＬ）表示装置や液晶表示装置など、表示領域を備える表示装置において、近年、可撓性を有する基材を用いることで、表示パネルを湾曲可能なフレキシブルディスプレイの開発が進められている。具体的には、下記特許文献１に開示されるように、表示パネルの表示領域より外側に設けられる、集積回路（ＩＣ：ｉｎｔｅｇｒａｔｅｄ　ｃｉｒｃｕｉｔ）やフレキシブルプリント基板（ＦＰＣ：ｆｌｅｘｉｂｌｅ　ｐｒｉｎｔｅｄ　ｃｉｒｃｕｉｔ）の実装部を表示領域の裏側に湾曲することが提案されている。 In display devices having a display region such as an organic electroluminescence (EL) display device and a liquid crystal display device, in recent years, development of a flexible display capable of bending a display panel by using a flexible base material has been advanced. Yes. Specifically, as disclosed in Patent Document 1 below, an integrated circuit (IC: integrated circuit) or flexible printed circuit (FPC) mounting portion provided outside the display area of the display panel is provided. It has been proposed to curve to the back of the display area.
特開２０１６－３１４９９号公報JP 2016-31499 A
　ところで、表示パネルの表示領域と隣接する端子領域上には、硬化前の樹脂組成物が塗布される。これは、上述の樹脂組成物が硬化することで生成される樹脂膜によって、表示パネルを湾曲する際の端子領域における湾曲強度を向上させるためである。また、樹脂膜によって、表示パネルの端子領域を保護する役割も担っている。例えば、表示パネルの端子領域上には画素を発光させるための接続配線層が備えられているため、樹脂膜はこの接続配線層の腐食などを防いでいる。 By the way, the resin composition before curing is applied on the terminal area adjacent to the display area of the display panel. This is for improving the bending strength in the terminal region when the display panel is bent by the resin film generated by curing the resin composition described above. The resin film also serves to protect the terminal area of the display panel. For example, since a connection wiring layer for causing a pixel to emit light is provided on the terminal region of the display panel, the resin film prevents corrosion of the connection wiring layer.
　しかし、硬化前の樹脂組成物を塗布する段階で、塗付された樹脂組成物が端子領域の表示領域側へ十分案内されないという問題が生じ得る。そのため、硬化前の樹脂組成物が案内されなかったことで樹脂膜が存在しない端子領域では、所望の湾曲強度より湾曲強度が低下してしまう。また、樹脂膜が存在しない端子領域では、樹脂膜による保護も十分ではなくなってしまう。例えば接続配線層は、樹脂膜が存在しない端子領域から水分等が侵入してしまうため、腐食してしまう。 However, there may be a problem in that the applied resin composition is not sufficiently guided to the display area side of the terminal area at the stage of applying the resin composition before curing. Therefore, in the terminal region where the resin film does not exist because the resin composition before curing is not guided, the bending strength is lower than the desired bending strength. Further, in the terminal region where the resin film does not exist, the protection by the resin film is not sufficient. For example, the connection wiring layer corrodes because moisture or the like enters from a terminal region where no resin film exists.
　本発明は、上記問題点に鑑みてなされたものであり、その目的は、端子領域における湾曲強度が低下しないようにし、かつ接続配線層の腐食を防ぐように、端子領域を被覆する樹脂膜が設けられた表示装置を提供することにある。 The present invention has been made in view of the above problems, and its purpose is to provide a resin film that covers the terminal region so that the bending strength in the terminal region does not decrease and corrosion of the connection wiring layer is prevented. It is to provide a display device provided.
　本発明の表示装置の一態様は、可撓性を有する基板と、前記基板上の端子領域に設けられ、前記基板上の表示領域に設けられる画素アレイ部から端子領域に設けられる接続基板へと延びる１以上の配線層と、前記基板の前記表示領域を覆うように設けられる表面フィルムと、前記端子領域に設けられる樹脂膜と、を有する表示装置であって、前記端子領域における前記樹脂膜の下地部は、硬化前の前記樹脂膜を前記表示領域側へ案内する、前記表示領域側から前記接続基板側へ延びる溝部を複数有する、ことを特徴とする。 According to one embodiment of the display device of the present invention, a flexible substrate and a terminal region on the substrate are provided, and a pixel array portion provided in the display region on the substrate is connected to a connection substrate provided in the terminal region. A display device comprising: one or more wiring layers extending; a surface film provided so as to cover the display area of the substrate; and a resin film provided in the terminal area, wherein the resin film in the terminal area The base portion has a plurality of grooves extending from the display region side to the connection substrate side for guiding the resin film before curing to the display region side.
本発明の実施形態に係る表示装置を概略的に示す図である。1 is a diagram schematically showing a display device according to an embodiment of the present invention. 表示パネルの構成の一例を説明する平面図である。FIG. 28 is a plan view illustrating an example of a structure of a display panel. 表示パネルの構成の一例を説明する平面図である。FIG. 28 is a plan view illustrating an example of a structure of a display panel. 第１の実施形態における、図２Ａ又は図２Ｂの要部を拡大した平面図である。It is the top view which expanded the principal part of FIG. 2A or FIG. 2B in 1st Embodiment. 図３のＡ－Ａ断面の一例を示す図である。FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3. 図３のＢ－Ｂ断面の一例を示す図である。FIG. 4 is a diagram showing an example of a BB cross section of FIG. 3. 図３のＣ－Ｃ断面の一例を示す図である。FIG. 4 is a diagram illustrating an example of a CC cross section of FIG. 3. 図３のＡ－Ａ断面の一例を示す図である。FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3. 図３のＡ－Ａ断面の一例を示す図である。FIG. 4 is a diagram showing an example of an AA cross section of FIG. 3. 第２の実施形態における、図２Ａ又は図２Ｂの要部を拡大した平面図である。It is the top view to which the principal part of FIG. 2A or FIG. 2B was expanded in 2nd Embodiment. 図７のＡ－Ａ断面の一例を示す図である。It is a figure which shows an example of the AA cross section of FIG. 図７のＢ－Ｂ断面の一例を示す図である。It is a figure which shows an example of the BB cross section of FIG. 第３の実施形態における、図２Ａ又は図２Ｂの要部を拡大した平面図である。It is the top view to which the principal part of FIG. 2A or FIG. 2B was expanded in 3rd Embodiment. 図９のＡ－Ａ断面の一例を示す図である。FIG. 10 is a diagram illustrating an example of an AA cross section of FIG. 9. 図９のＢ－Ｂ断面の一例を示す図である。FIG. 10 is a diagram showing an example of a BB cross section of FIG. 9. 図９のＣ－Ｃ断面の一例を示す図である。FIG. 10 is a diagram illustrating an example of a CC cross section of FIG. 9. 図９のＡ－Ａ断面の一例を示す図である。FIG. 10 is a diagram illustrating an example of an AA cross section of FIG. 9. 図９のＡ－Ａ断面の一例を示す図である。FIG. 10 is a diagram illustrating an example of an AA cross section of FIG. 9.
　以下に、本発明の実施形態について、図面を参照しつつ説明する。なお、開示はあくまで一例にすぎず、当業者において、発明の主旨を保っての適宜変更について容易に想到し得るものについては、当然に本発明の範囲に含有されるものである。また、図面は説明をより明確にするため、実際の態様に比べ、各部の幅、厚さ、形状等について模式的に表される場合があるが、あくまで一例であって、本発明の解釈を限定するものではない。また、本明細書と各図において、既出の図に関して前述したものと同様の要素には、同一の符号を付して、詳細な説明を適宜省略することがある。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate modifications while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, the drawings may be schematically represented with respect to the width, thickness, shape, and the like of each part in comparison with actual aspects for the sake of clarity of explanation, but are merely examples, and the interpretation of the present invention is not limited. It is not limited. In addition, in the present specification and each drawing, elements similar to those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description may be omitted as appropriate.
　さらに、本発明の詳細な説明において、ある構成物と他の構成物との位置関係を規定する際、「上に」「下に」とは、ある構成物の直上又は直下に位置する場合のみでなく、特に断りの無い限りは、間にさらに他の構成物を介在する場合を含むものとする。 Further, in the detailed description of the present invention, when defining the positional relationship between a certain component and another component, “up” and “under” are only when they are located directly above or directly below a certain component. In addition, unless otherwise specified, the case where another component is further interposed is included.
　図１は、本発明の実施形態に係る表示装置１を概略的に示す図である。図１に示すように、表示装置１は、上フレーム１０及び下フレーム２０に挟まれるように固定された表示パネル１００を含むように構成されている。 FIG. 1 is a diagram schematically showing a display device 1 according to an embodiment of the present invention. As shown in FIG. 1, the display device 1 is configured to include a display panel 100 fixed so as to be sandwiched between an upper frame 10 and a lower frame 20.
　次に、本発明の実施形態に係る表示装置１が有する表示パネル１００の構成を、図２ａ及び図２ｂを参照して説明する。図２ａ及び図２ｂは、共に表示パネル１００の構成の一例を説明する平面図である。なお、図２ａ及び図２ｂで図示する表示パネル１００は、硬化前の樹脂組成物を塗布する前のものを示す。 Next, the configuration of the display panel 100 included in the display device 1 according to the embodiment of the present invention will be described with reference to FIGS. 2a and 2b. 2a and 2b are plan views for explaining an example of the configuration of the display panel 100. FIG. Note that the display panel 100 illustrated in FIGS. 2A and 2B shows the display panel before applying the resin composition before curing.
　図２ａに示す表示パネル１００では、ドライバＩＣ２３０が第１の接続基板２１０に備えられる。表示パネル１００は、基板１０１、第１の接続基板２１０及び第２の接続基板２２０を有している。 In the display panel 100 shown in FIG. 2 a, the driver IC 230 is provided on the first connection substrate 210. The display panel 100 includes a substrate 101, a first connection substrate 210, and a second connection substrate 220.
　基板１０１、第１の接続基板２１０及び第２の接続基板２２０は、それぞれポリイミドやポリエチレンテレフタラート等の可撓性を有する樹脂製の基板である。基板の厚さは例として、１０乃至２０μｍで形成される。また、基板１０１は、表示領域１７０、端子領域１８０及び額縁領域１９０を含む。 The substrate 101, the first connection substrate 210, and the second connection substrate 220 are resin substrates having flexibility such as polyimide and polyethylene terephthalate. The thickness of the substrate is, for example, 10 to 20 μm. The substrate 101 includes a display area 170, a terminal area 180, and a frame area 190.
　基板１０１の一端部には、さらに、基板接続部（図示せず）が設けられている。基板接続部に第１の接続基板２１０が配置されることで、基板１０１と第１の接続基板２１０とが接続される。 A substrate connecting portion (not shown) is further provided at one end of the substrate 101. The substrate 101 and the first connection substrate 210 are connected by disposing the first connection substrate 210 in the substrate connection portion.
　表示領域１７０は、複数の画素がマトリクス状に配置された画素アレイ部（図示せず）を有する。画素アレイ部は、各画素に、画素を点灯させるための電源や信号を供給する端子を少なくとも１つ含む。画素アレイ部に含まれる当該端子は、例えば、第１の接続基板２１０上に設けられるドライバＩＣ２３０から、端子領域１８０に設けられる接続配線層１４０を介して供給される、走査信号、映像信号や電源が入力される端子である。 The display area 170 has a pixel array section (not shown) in which a plurality of pixels are arranged in a matrix. The pixel array section includes at least one terminal for supplying power and signals for lighting the pixels to each pixel. The terminals included in the pixel array unit are supplied from, for example, a driver IC 230 provided on the first connection substrate 210 via a connection wiring layer 140 provided in the terminal region 180, a scanning signal, a video signal, and a power supply. Is a terminal to which is input.
　端子領域１８０は、表示領域１７０と接続領域２００とを連結する。また、端子領域１８０は、画素アレイ部と基板接続部との間に配置される接続配線層１４０を有する。 The terminal area 180 connects the display area 170 and the connection area 200. The terminal region 180 has a connection wiring layer 140 disposed between the pixel array portion and the substrate connection portion.
　額縁領域１９０は、表示領域１７０の周囲の領域である。具体的には、額縁領域１９０には、表示領域１７０を含むようにアンダーコート層１０２及びゲート絶縁膜１０３が配置される（図４ｂ，図８ｂ及び図１０ｂを参照）。左右の額縁には、ゲート絶縁膜１０３の上層に、画素アレイ部の行を選択する信号を生成する回路等が配置される。上下の額縁には、電源を引き回す配線や、データ信号を分配する配線等が配置される。 The frame area 190 is an area around the display area 170. Specifically, the undercoat layer 102 and the gate insulating film 103 are disposed in the frame region 190 so as to include the display region 170 (see FIGS. 4b, 8b, and 10b). In the left and right frames, a circuit for generating a signal for selecting a row of the pixel array portion is disposed on the upper layer of the gate insulating film 103. In the upper and lower frames, wiring for routing the power supply, wiring for distributing the data signal, and the like are arranged.
　第１の接続基板２１０及び第２の接続基板２２０は、接続領域２００を含む。接続領域２００は、端子領域１８０における湾曲によって、表示領域１７０の裏面側に配置される。また接続領域２００には、外部装置から信号を供給される接続端子２２２が備えられる。接続端子２２２は、第１の接続基板２１０及び／又は第２の接続基板２２０に配置されることで、表示領域１７０の裏面側に配置される。 The first connection substrate 210 and the second connection substrate 220 include a connection region 200. The connection area 200 is arranged on the back side of the display area 170 due to the curvature in the terminal area 180. Further, the connection area 200 is provided with a connection terminal 222 to which a signal is supplied from an external device. The connection terminal 222 is disposed on the back surface side of the display region 170 by being disposed on the first connection substrate 210 and / or the second connection substrate 220.
　第１の接続基板２１０は、基板１０１と接続される配線基板である。第１の接続基板２１０には、ドライバＩＣ２３０が配置される。ドライバＩＣ２３０は、第２の接続基板２２０から供給されたデータ信号や電源電圧を、接続配線層１４０を介して表示領域１７０中に設けられる画素アレイ部に供給する。供給されたデータ信号や電源電圧によって、画素アレイ部に含まれる複数の画素が発光し、表示領域１７０に画像が表示される。 The first connection substrate 210 is a wiring substrate connected to the substrate 101. A driver IC 230 is disposed on the first connection board 210. The driver IC 230 supplies the data signal and the power supply voltage supplied from the second connection substrate 220 to the pixel array unit provided in the display region 170 via the connection wiring layer 140. A plurality of pixels included in the pixel array unit emit light by the supplied data signal and power supply voltage, and an image is displayed in the display area 170.
　第２の接続基板２２０は、第１の接続基板２１０と接続される。第２の接続基板２２０には、回路部品２２１や接続端子２２２が配置される。接続端子２２２は、例えば外部接続用コネクタであって、画素アレイ部に電源やデータ信号を供給する外部装置と接続される。また、接続端子２２２は、当該電源やデータ信号を回路部品２２１によって形成される電子回路（図示なし）に供給する。当該電子回路が生成した電源やデータ信号は、接続配線１４０を介して画素アレイ部に供給される。 The second connection board 220 is connected to the first connection board 210. Circuit components 221 and connection terminals 222 are arranged on the second connection board 220. The connection terminal 222 is, for example, an external connection connector, and is connected to an external device that supplies power and data signals to the pixel array unit. The connection terminal 222 supplies the power supply and data signal to an electronic circuit (not shown) formed by the circuit component 221. The power supply and data signal generated by the electronic circuit are supplied to the pixel array section via the connection wiring 140.
　図２ａに示す表示パネル１００に対して、図２ｂに示す表示パネル１００では、ドライバＩＣ２３０が直接基板１０１上に備えられる。そのため、表示パネル１００は、必ずしも第２の接続基板２２０を有する必要はない。この場合、回路部品２２１や接続端子２２２は、第１の接続基板２１０に配置される。 2A, in the display panel 100 shown in FIG. 2B, the driver IC 230 is directly provided on the substrate 101. In the display panel 100 shown in FIG. Therefore, the display panel 100 does not necessarily have the second connection substrate 220. In this case, the circuit component 221 and the connection terminal 222 are arranged on the first connection board 210.
［第１の実施形態］
　以下、図３乃至図６を参照して、本発明の第１の実施形態について説明する。なお、これらの図では断面構造を見易くするため、パシベーション膜１０４、層間絶縁膜１０６及び有機封止膜１３２などの一部の層のハッチングを省略する。また以下の説明では、積層方向を上方向とする。 [First Embodiment]
Hereinafter, the first embodiment of the present invention will be described with reference to FIGS. 3 to 6. In these drawings, hatching of some layers such as the passivation film 104, the interlayer insulating film 106, and the organic sealing film 132 is omitted in order to make the cross-sectional structure easy to see. In the following description, the stacking direction is the upward direction.
　図３は、第１の実施形態における表示領域１７０と端子領域１８０の境界付近を拡大した図である。具体的には、図２ａ又は図２ｂにおいて、一点鎖線で囲まれた箇所を拡大している。なお、図３は硬化前の樹脂組成物を塗布する前のものを示す。表示領域１７０表面は、表面フィルム１０９が覆っている。この表面フィルム１０９は、例えば偏光板又は光学フィルムである。端子領域１８０表面は、例えばパシベーション膜１０４が覆っている。なお、端子領域１８０においては、無機絶縁材料で形成される層（例えば、アンダーコート層１０２、下地絶縁膜１０３、パッシベーション膜１０４）の少なくとも一部を、省略または薄膜化してもよい。 FIG. 3 is an enlarged view of the vicinity of the boundary between the display area 170 and the terminal area 180 in the first embodiment. Specifically, in FIG. 2a or 2b, the portion surrounded by the alternate long and short dash line is enlarged. In addition, FIG. 3 shows the thing before apply | coating the resin composition before hardening. A surface film 109 covers the surface of the display area 170. The surface film 109 is, for example, a polarizing plate or an optical film. The surface of the terminal region 180 is covered with, for example, the passivation film 104. Note that in the terminal region 180, at least a part of a layer formed of an inorganic insulating material (eg, the undercoat layer 102, the base insulating film 103, and the passivation film 104) may be omitted or thinned.
　パシベーション膜１０４上には、複数の案内膜が設けられる。この案内膜は、互いに一定距離だけ離間して平行するように設けられている。そして、この案内膜が互いに離間した箇所に、一定距離の溝部が形成される。この一定距離は、例えば、１．５ｍｍ以下であり、さらに０．５ｍｍ以下であることが好ましい。また、案内膜の幅も、例えば、１．５ｍｍ以下であり、さらに０．５ｍｍ以下であることが好ましい。例えば、第１の実施形態を示す図３では、案内膜はリブ有機膜１０７である。このリブ有機膜１０７は、表示領域１７０から延伸されて設けられる。 A plurality of guide films are provided on the passivation film 104. The guide films are provided so as to be parallel to each other with a predetermined distance therebetween. And the groove part of a fixed distance is formed in the location where this guide film separated from each other. This constant distance is, for example, 1.5 mm or less, and preferably 0.5 mm or less. The width of the guide film is also 1.5 mm or less, for example, and preferably 0.5 mm or less. For example, in FIG. 3 showing the first embodiment, the guide film is the rib organic film 107. The rib organic film 107 is provided extending from the display region 170.
　溝部の高さは、パシベーション膜１０４の上面から、案内膜であるリブ有機膜１０７の上面までの高さと対応する。その上で、溝部の高さは、例えばシール材１０８の厚さの３分の１以下となるように設けられればよい。例えば第１の実施形態では、溝部の高さが１乃至６μｍで設けられる。また、硬化前の樹脂組成物を案内する溝部の長さは、表示領域１７０から端子領域１８０へ延びる、端子領域の辺の長さの半分以下であればよい。 The height of the groove corresponds to the height from the upper surface of the passivation film 104 to the upper surface of the rib organic film 107 as a guide film. In addition, the height of the groove may be provided so as to be, for example, one third or less of the thickness of the sealing material 108. For example, in the first embodiment, the height of the groove is 1 to 6 μm. Moreover, the length of the groove part which guides the resin composition before hardening should just be below half of the length of the side of a terminal area | region extended from the display area 170 to the terminal area | region 180. FIG.
　図４ａは、図３に示すＡ－Ａ線で切断した時の断面図である。なお、図４ａは硬化前の樹脂組成物を塗布する前のものを示す。パシベーション膜１０４の上面は、後に設けられる樹脂膜１５０の下面と接するため、樹脂膜１５０の下地部であるとも言える。また、案内膜を設けることで形成される溝部の高さをより高くするため、パシベーション膜１０４上に設けられる積層構造も樹脂膜１５０の下地部であると言える。例えば図４ａでは、パシベーション膜１０４側から順に、平坦化膜１０５及び層間絶縁膜１０６が設けられている。このように第１の実施形態では、パシベーション膜１０４、平坦化膜１０５及び層間絶縁膜１０６が、樹脂膜１５０の下地部である。この下地部が形成された後、上述のように、硬化前の樹脂組成物を案内するための複数の案内膜（リブ有機膜１０７）が設けられる。 FIG. 4a is a cross-sectional view taken along the line AA shown in FIG. In addition, FIG. 4a shows the thing before apply | coating the resin composition before hardening. Since the upper surface of the passivation film 104 is in contact with the lower surface of the resin film 150 to be provided later, it can be said that it is a base portion of the resin film 150. In addition, it can be said that the laminated structure provided on the passivation film 104 is also a base part of the resin film 150 in order to increase the height of the groove formed by providing the guide film. For example, in FIG. 4A, a planarizing film 105 and an interlayer insulating film 106 are provided in this order from the passivation film 104 side. As described above, in the first embodiment, the passivation film 104, the planarization film 105, and the interlayer insulating film 106 are the base portion of the resin film 150. After the base portion is formed, as described above, a plurality of guide films (rib organic films 107) for guiding the resin composition before curing are provided.
　なお、案内膜の構成は上述の構成に限られない。例えば、表示領域１７０に設けられる平坦化膜１０５、リブ有機膜１０７又は有機封止膜１３２のうちいずれかの膜の１つを端子領域１８０まで延伸し、案内膜として設けてもよい。また、表示領域１７０の積層構造に関係なく、新たに無機膜又は有機膜を案内膜として設けてもよい。 Note that the structure of the guide film is not limited to the above-described structure. For example, one of the planarization film 105, the rib organic film 107, and the organic sealing film 132 provided in the display region 170 may be extended to the terminal region 180 and provided as a guide film. In addition, an inorganic film or an organic film may be newly provided as a guide film regardless of the stacked structure of the display region 170.
　図４ｂは、図３に示すＢ－Ｂ線で切断した時の断面図である。つまり、案内膜が設けられていない箇所における断面図である。また、図４ｃは、図３に示すＣ－Ｃ線で切断した時の断面図である。つまり、案内膜が設けられる箇所における断面図である。なお、図４ｂ及び図４ｃは樹脂膜が設けられた後のものを示す。ここで、これら図４ｂ及び図４ｃを参照して、表示パネル１００の積層構造を説明する。 FIG. 4b is a cross-sectional view taken along the line BB shown in FIG. That is, it is a cross-sectional view at a location where the guide film is not provided. 4c is a cross-sectional view taken along the line CC shown in FIG. That is, it is a cross-sectional view at a location where a guide film is provided. 4B and 4C show the state after the resin film is provided. Here, the laminated structure of the display panel 100 will be described with reference to FIGS. 4b and 4c.
　基板１０１は、例えばガラス、又はポリイミド等の可撓性がある樹脂組成物からなる。基板１０１は、アンダーコート層１０２によって覆われる。アンダーコート層１０２上には半導体層１１１が形成され、半導体層１１１はゲート絶縁膜１０３によって覆われる。ゲート絶縁膜１０３上にはゲート電極１１２が形成され、ゲート電極１１２はパシベーション膜１０４によって覆われる。ドレイン電極１１３及びソース電極１１４は、ゲート絶縁膜１０３とパシベーション膜１０４とを貫通して、半導体層１１１に接続される。半導体層１１１、ゲート電極１１２、ドレイン電極１１３及びソース電極１１４により、薄膜トランジスタ１１０が構成される。薄膜トランジスタ１１０は、複数の単位画素のそれぞれに対応するように設けられる。アンダーコート層１０２、ゲート絶縁膜１０３及びパシベーション膜１０４は、例えばＳｉＯ２、ＳｉＮ又はＳｉＯＮ等の無機絶縁材料で形成される。 The substrate 101 is made of a flexible resin composition such as glass or polyimide. The substrate 101 is covered with an undercoat layer 102. A semiconductor layer 111 is formed over the undercoat layer 102, and the semiconductor layer 111 is covered with a gate insulating film 103. A gate electrode 112 is formed on the gate insulating film 103, and the gate electrode 112 is covered with the passivation film 104. The drain electrode 113 and the source electrode 114 pass through the gate insulating film 103 and the passivation film 104 and are connected to the semiconductor layer 111. The semiconductor layer 111, the gate electrode 112, the drain electrode 113, and the source electrode 114 constitute the thin film transistor 110. The thin film transistor 110 is provided so as to correspond to each of the plurality of unit pixels. The undercoat layer 102, the gate insulating film 103, and the passivation film 104 are formed of an inorganic insulating material such as SiO 2 , SiN, or SiON.
　パシベーション膜１０４上には、上述のドレイン電極１１３及びソース電極１１４に加えて、端子領域１８０に接続配線層１４０が形成される。図示の接続配線層１４０は、第１の接続基板２１０と画素アレイ部が有する端子とを電気的に接続するための配線である。なお、接続配線層１４０は、表層をパシベーション膜１０４で薄く覆う構成としてもよい。 On the passivation film 104, in addition to the drain electrode 113 and the source electrode 114 described above, a connection wiring layer 140 is formed in the terminal region 180. The illustrated connection wiring layer 140 is a wiring for electrically connecting the first connection substrate 210 and terminals included in the pixel array unit. Note that the connection wiring layer 140 may be configured so that the surface layer is thinly covered with the passivation film 104.
　ドレイン電極１１３及びソース電極１１４は、平坦化膜１０５によって覆われる。また接続配線層１４０が案内膜の下に位置する場合も、平坦化膜１０５によって覆われる。平坦化膜１０５は、層間絶縁膜１０６によって覆われる。ドレイン電極１１３、ソース電極１１４及び接続配線層１４０は、例えばＡｌ、Ａｇ、Ｃｕ、Ｎｉ、Ｔｉ、Ｍｏ等を含む導電性材料で形成される。平坦化膜１０５は、例えばアクリル樹脂又はポリイミド等の有機絶縁材料で形成され、平坦な上面を有する。層間絶縁膜１０６は、例えばＳｉＯ２、ＳｉＮ又はＳｉＯＮ等の無機絶縁材料で形成される。なお、図４ｂでは、案内膜が設けられない端子領域１８０上に層間絶縁膜１０６は設けられていない。しかし、上述の構成に限られず、接続配線層１４０を被覆するように、案内膜が設けられない端子領域１８０上に層間絶縁膜１０６を設けてもよい。 The drain electrode 113 and the source electrode 114 are covered with the planarization film 105. Further, when the connection wiring layer 140 is located under the guide film, it is covered with the planarization film 105. The planarization film 105 is covered with an interlayer insulating film 106. The drain electrode 113, the source electrode 114, and the connection wiring layer 140 are formed of a conductive material including, for example, Al, Ag, Cu, Ni, Ti, Mo, or the like. The planarization film 105 is formed of an organic insulating material such as acrylic resin or polyimide and has a flat upper surface. The interlayer insulating film 106 is formed of an inorganic insulating material such as SiO 2 , SiN, or SiON. In FIG. 4b, the interlayer insulating film 106 is not provided on the terminal region 180 where the guide film is not provided. However, the present invention is not limited to the above configuration, and the interlayer insulating film 106 may be provided on the terminal region 180 where the guide film is not provided so as to cover the connection wiring layer 140.
　層間絶縁膜１０６上には、画素電極１２１（例えば陽極）が形成される。画素電極１２１は、平坦化膜１０５と層間絶縁膜１０６とを貫通して、ソース電極１１４に接続される。画素電極１２１は、複数の単位画素のそれぞれに対応するように設けられる。画素電極１２１は反射電極として形成される。画素電極１２１は、例えばＡｌ、Ａｇ、Ｃｕ、Ｎｉ、Ｔｉ、Ｍｏ等を含む導電性材料で形成される。一方、表示装置１がボトムエミッション方式の場合は、画素電極１２１は透過電極として形成される必要がある。この場合、画素電極１２１は、例えばＩＴＯ、ＩＺＯ等の導電性酸化物で形成されてもよい。 A pixel electrode 121 (for example, an anode) is formed on the interlayer insulating film 106. The pixel electrode 121 passes through the planarization film 105 and the interlayer insulating film 106 and is connected to the source electrode 114. The pixel electrode 121 is provided so as to correspond to each of the plurality of unit pixels. The pixel electrode 121 is formed as a reflective electrode. The pixel electrode 121 is formed of a conductive material containing, for example, Al, Ag, Cu, Ni, Ti, Mo, or the like. On the other hand, when the display device 1 is a bottom emission method, the pixel electrode 121 needs to be formed as a transmissive electrode. In this case, the pixel electrode 121 may be formed of a conductive oxide such as ITO or IZO.
　画素電極１２１は、リブ有機膜１０７によって覆われる。リブ有機膜１０７は、バンクとも呼ばれる。リブ有機膜１０７は、例えばアクリル樹脂又はポリイミド等の有機絶縁材料で形成される。リブ有機膜１０７には、画素電極１２１が底に露出する開口１０７ｓが形成される。開口１０７ｓを形成するリブ有機膜１０７の内縁部分は、画素電極１２１の周縁部分に載っており、上方に向かうに従って外方に広がるテーパー形状を有する。 The pixel electrode 121 is covered with the rib organic film 107. The rib organic film 107 is also called a bank. The rib organic film 107 is formed of an organic insulating material such as acrylic resin or polyimide. In the rib organic film 107, an opening 107s through which the pixel electrode 121 is exposed to the bottom is formed. The inner edge portion of the rib organic film 107 forming the opening 107s is placed on the peripheral portion of the pixel electrode 121 and has a tapered shape that spreads outward as it goes upward.
　リブ有機膜１０７の開口１０７ｓの底に露出した画素電極１２１上には、発光層１２２が互いに離れて個別に形成されている。発光層１２２は、複数の単位画素のそれぞれに対応して、例えば赤、緑及び青からなる複数色で発光する。発光層１２２とともに、正孔輸送層、正孔注入層、電子輸送層及び電子輸送層の少なくとも１層が形成されてもよい。発光層１２２は、表示領域１７０の全体に広がる一様な膜（いわゆるベタ膜）として形成されてもよい。この場合、発光層１２２は単色（例えば白色）で発光し、カラーフィルタや色変換層によって、例えば赤、緑及び青からなる複数色のそれぞれの成分が取り出される。また、発光層１２２はマスクを用いて個別に蒸着されて形成されるが、別の方法として、塗付によって形成されてもよい。 On the pixel electrode 121 exposed at the bottom of the opening 107s of the rib organic film 107, the light emitting layers 122 are formed separately from each other. The light emitting layer 122 emits light in a plurality of colors including, for example, red, green, and blue, corresponding to each of the plurality of unit pixels. Along with the light emitting layer 122, at least one of a hole transport layer, a hole injection layer, an electron transport layer, and an electron transport layer may be formed. The light emitting layer 122 may be formed as a uniform film (so-called solid film) that extends over the entire display region 170. In this case, the light emitting layer 122 emits light in a single color (for example, white), and each component of a plurality of colors including, for example, red, green, and blue is extracted by the color filter and the color conversion layer. Moreover, although the light emitting layer 122 is vapor-deposited separately using a mask, it may be formed by application as another method.
　発光層１２２及びリブ有機膜１０７は、対向電極１２３（例えば陰極）によって覆われる。対向電極１２３は、表示領域１７０の全体に広がる一様な膜（いわゆるベタ膜）として形成される。発光層１２２、並びに発光層１２２を挟む画素電極１２１及び対向電極１２３によって、発光素子１２０が構成される。発光層１２２は、画素電極１２１と対向電極１２３との間を流れる電流によって発光する。対向電極１２３は、例えばＩＴＯ等の透明導電材料又はＭｇＡｇ等の金属薄膜で形成される。表示装置１がトップエミッション方式の場合は、対向電極１２３は透過電極として形成される必要があり、金属薄膜を用いる場合は、光が透過する程度に膜厚を小さくする必要がある。 The light emitting layer 122 and the rib organic film 107 are covered with a counter electrode 123 (for example, a cathode). The counter electrode 123 is formed as a uniform film (so-called solid film) extending over the entire display region 170. The light emitting element 120 is configured by the light emitting layer 122 and the pixel electrode 121 and the counter electrode 123 sandwiching the light emitting layer 122. The light emitting layer 122 emits light by a current flowing between the pixel electrode 121 and the counter electrode 123. The counter electrode 123 is formed of a transparent conductive material such as ITO or a metal thin film such as MgAg. When the display device 1 is a top emission system, the counter electrode 123 needs to be formed as a transmissive electrode, and when a metal thin film is used, it is necessary to reduce the film thickness so that light can be transmitted.
　リブ有機膜１０７及び対向電極１２３は、封止膜１３０によって覆われることで封止され、水分から遮断される。封止膜１３０は、図４ｂ及び図４ｃに示すように、例えば第１の無機封止膜１３１、有機封止膜１３２及び第２の無機封止膜１３３を下からこの順に含む３層積層構造を有する。第１の無機封止膜１３１及び第２の無機封止膜１３３は、例えばＳｉＯ２、ＳｉＮ又はＳｉＯＮ等の無機絶縁材料で形成される。有機封止膜１３２は、例えばアクリル樹脂又はポリイミド等の有機絶縁材料で形成されており、封止膜１３０の上面の平坦化させる。 The rib organic film 107 and the counter electrode 123 are sealed by being covered with the sealing film 130 and are shielded from moisture. As shown in FIGS. 4b and 4c, the sealing film 130 has a three-layer laminated structure including, for example, a first inorganic sealing film 131, an organic sealing film 132, and a second inorganic sealing film 133 in this order from the bottom. Have The first inorganic sealing film 131 and the second inorganic sealing film 133 are formed of an inorganic insulating material such as SiO 2 , SiN, or SiON. The organic sealing film 132 is formed of an organic insulating material such as acrylic resin or polyimide, and planarizes the upper surface of the sealing film 130.
　なお、リブ有機膜１０７は、表示領域１７０と端子領域１８０との境界近傍にも形成される。このうち、層間絶縁膜１０６と第１の無機封止膜１３１との間に設けられるリブ有機膜１０７は、水分遮蔽部としても機能する。この水分遮蔽部は、表示領域１７０への水分などの異物の侵入を防ぐ。なお、表示領域１７０と端子領域１８０との境界近傍以外の部分に、リブ有機膜１０７は形成されない。また、第２の無機封止膜１３３の端部は、水分遮断部上に位置する。 The rib organic film 107 is also formed near the boundary between the display region 170 and the terminal region 180. Among these, the rib organic film 107 provided between the interlayer insulating film 106 and the first inorganic sealing film 131 also functions as a moisture shielding portion. This moisture shielding part prevents foreign substances such as moisture from entering the display area 170. The rib organic film 107 is not formed in a portion other than the vicinity of the boundary between the display region 170 and the terminal region 180. Moreover, the edge part of the 2nd inorganic sealing film 133 is located on a moisture interruption | blocking part.
　封止膜１３０上には、表面フィルム１０９が設けられる。この表面フィルム１０９は、表示領域１７０に固定するための接着層であるシール材１０８上に配置される。 A surface film 109 is provided on the sealing film 130. The surface film 109 is disposed on the sealing material 108 which is an adhesive layer for fixing to the display area 170.
　パシベーション膜１０４上に下地部及び案内膜を形成した後に、樹脂膜１５０が形成される。樹脂膜１５０は、アクリル系樹脂等の樹脂材料で形成される。樹脂膜１５０の厚みは、例えば、４０乃至２００μｍである。 After forming the base portion and the guide film on the passivation film 104, the resin film 150 is formed. The resin film 150 is formed of a resin material such as an acrylic resin. The thickness of the resin film 150 is, for example, 40 to 200 μm.
　なお、樹脂膜１５０は、端子領域１８０に設けられた案内膜（ここでは、リブ有機膜１０７）及び接続配線層１４０が最低限覆われる必要がある。そのため、具体的には、インクジェット方式等で硬化前の樹脂組成物を、下地部及び案内膜上に塗布する。塗布された硬化前の樹脂組成物は、形成された溝部によって、表示領域１７０の端子領域側端面などに案内される。その後、案内された硬化前の樹脂組成物が硬化することで、シール材１０８及び表面フィルム１０９と接するように樹脂膜１５０が形成される。 The resin film 150 needs to cover at least the guide film (here, the rib organic film 107) provided in the terminal region 180 and the connection wiring layer 140. Therefore, specifically, the resin composition before curing is applied on the base portion and the guide film by an inkjet method or the like. The applied resin composition before curing is guided to the terminal area side end face of the display area 170 and the like by the formed groove. Thereafter, the guided resin composition before curing is cured, so that the resin film 150 is formed in contact with the sealing material 108 and the surface film 109.
　なお、図３及び図４では、接続配線層１４０が配置される高さの異なる複数層である場合を示したが、この構成に限られるものではない。図５及び６は、図３に示すＡ－Ａ線で切断した時の断面図で、第１の実施形態の変形例として、接続配線層１４０の配置を示す。なお、図５及び６は硬化前の樹脂組成物を塗布する前のものを示す。図５及び６は、共に接続配線層１４０が１層の場合を示す。その上で、図５では、下地部及び案内膜の下に接続配線層１４０が設けられる。または、図６に示すように、下地部及び案内膜が設けられている箇所以外の箇所に接続配線層１４０を設けてもよい。 3 and 4 show the case where the connection wiring layer 140 is a plurality of layers having different heights, the present invention is not limited to this configuration. 5 and 6 are cross-sectional views taken along the line AA shown in FIG. 3, and show the arrangement of the connection wiring layer 140 as a modification of the first embodiment. In addition, FIG. 5 and 6 shows the thing before apply | coating the resin composition before hardening. 5 and 6 both show the case where the connection wiring layer 140 is one layer. In addition, in FIG. 5, the connection wiring layer 140 is provided under the base portion and the guide film. Alternatively, as illustrated in FIG. 6, the connection wiring layer 140 may be provided in a place other than the place where the base portion and the guide film are provided.
　以上より、第１の実施形態の表示パネル１００では、パシベーション膜１０４上に案内膜を設けて溝部を形成することで、樹脂膜１５０の形成を所望する領域まで硬化前の樹脂組成物を案内することが可能となる。 As described above, in the display panel 100 according to the first embodiment, the resin composition before curing is guided to a region where the formation of the resin film 150 is desired by providing the guide film on the passivation film 104 and forming the groove. It becomes possible.
［第２の実施形態］
　以下、図７、図８ａ及び図８ｂを参照して、本発明の第２の実施形態について説明する。なお、第１の実施形態に記載の構成と同一の構成については、説明が重複するため、記載を省略する。また、図８ｂにおいても、断面構造を見易くするため、パシベーション膜１０４、層間絶縁膜１０６及び有機封止膜１３２などの一部の層のハッチングを省略する。また以下の説明では、積層方向を上方向とする。 [Second Embodiment]
The second embodiment of the present invention will be described below with reference to FIGS. 7, 8a and 8b. In addition, about the structure same as the structure as described in 1st Embodiment, since description overlaps, description is abbreviate | omitted. Also in FIG. 8b, hatching of some layers such as the passivation film 104, the interlayer insulating film 106, and the organic sealing film 132 is omitted in order to make the cross-sectional structure easy to see. In the following description, the stacking direction is the upward direction.
　図７は、第２の実施形態における表示領域１７０と端子領域１８０の境界付近を拡大した図である。具体的には、図２ａ又は図２ｂにおいて、一点鎖線で囲まれた箇所を拡大している。なお、図７は硬化前の樹脂組成物を塗布する前のものを示す。第２の実施形態において、端子領域１８０表面のうち、少なくとも表示領域側はリブ有機膜１０７によって覆われている。 FIG. 7 is an enlarged view of the vicinity of the boundary between the display area 170 and the terminal area 180 in the second embodiment. Specifically, in FIG. 2a or 2b, the portion surrounded by the alternate long and short dash line is enlarged. In addition, FIG. 7 shows the thing before apply | coating the resin composition before hardening. In the second embodiment, at least the display region side of the surface of the terminal region 180 is covered with the rib organic film 107.
　図８ａは、図７に示すＡ－Ａ線で切断した時の断面図である。なお、図８ａは硬化前の樹脂組成物を塗布する前のものを示す。第２の実施形態では、図８ａに示すように、案内膜であるリブ有機膜１０７が、連続して溝部の底面にも設けられる構成となっている。つまり、第１の実施形態では溝部の底面がパシベーション膜１０４であったのに対して、第２の実施形態では溝部の底面もリブ有機膜１０７となる。なお、溝部に設けられるリブ有機膜１０７の厚さは、案内膜として設けられる箇所（図８ａでは層間絶縁膜１０６上）に設けられるリブ有機膜１０７の厚さよりも薄く設けられることが望ましい。 FIG. 8a is a cross-sectional view taken along line AA shown in FIG. In addition, FIG. 8a shows the thing before apply | coating the resin composition before hardening. In the second embodiment, as shown in FIG. 8a, the rib organic film 107 as a guide film is continuously provided on the bottom surface of the groove. In other words, the bottom surface of the groove portion is the passivation film 104 in the first embodiment, whereas the bottom surface of the groove portion is also the rib organic film 107 in the second embodiment. Note that the thickness of the rib organic film 107 provided in the groove is desirably smaller than the thickness of the rib organic film 107 provided in a portion provided as a guide film (on the interlayer insulating film 106 in FIG. 8A).
　図８ｂは、図７に示すＢ－Ｂ線で切断した時の断面図である。上述のように、第２の実施形態では接続配線層１４０上にもリブ有機膜１０７が設けられている。また、第１の実施形態では、図４ｂのように、樹脂膜１７０の上面が平坦化されて図示されていたが、必ずしも平坦化する必要はない。樹脂膜１７０の上面のうち最も高い部分が、表面フィルム１０９の上面を越えないように設けられればよい。 8b is a cross-sectional view taken along the line BB shown in FIG. As described above, in the second embodiment, the rib organic film 107 is also provided on the connection wiring layer 140. In the first embodiment, as shown in FIG. 4B, the upper surface of the resin film 170 is flattened. However, the flattening is not necessarily required. The highest portion of the upper surface of the resin film 170 may be provided so as not to exceed the upper surface of the surface film 109.
　なお、第２の実施形態を説明する図７で示すＣ－Ｃ線において切断した時の断面図は、第１の実施形態（図４ｃ）と同じ図となるため、説明を省略する。 Note that a cross-sectional view taken along the line CC shown in FIG. 7 for explaining the second embodiment is the same as that of the first embodiment (FIG. 4c), and the explanation is omitted.
　以上より、第２の実施形態の表示パネル１００は、案内膜を設けて溝部を形成しつつ、案内膜が連続して端子領域１８０全体を被覆する構成を有する。この構成を採用しても、第２の実施形態も第１の実施形態と同様に、形成された溝部によって、樹脂膜１５０の形成を所望する領域まで硬化前の樹脂組成物を案内することが可能となる。 As described above, the display panel 100 according to the second embodiment has a configuration in which the guide film continuously covers the entire terminal region 180 while providing the guide film to form the groove. Even if this configuration is adopted, in the second embodiment as well, the resin composition before curing can be guided to the region where the formation of the resin film 150 is desired by the formed groove, as in the first embodiment. It becomes possible.
［第３の実施形態］
　以下、図９乃至図１２を参照して、本発明の第３の実施形態について説明する。なお、第１及び第２の実施形態に記載の構成と同一の構成については、説明が重複するため、記載を省略する。また、図１０ｂ及び図１０ｃにおいても、断面構造を見易くするため、パシベーション膜１０４、層間絶縁膜１０６及び有機封止膜１３２などの一部の層のハッチングを省略する。また以下の説明では、積層方向を上方向とする。 [Third Embodiment]
Hereinafter, a third embodiment of the present invention will be described with reference to FIGS. In addition, about the structure same as the structure as described in 1st and 2nd embodiment, since description overlaps, description is abbreviate | omitted. 10b and 10c also omit hatching of some layers such as the passivation film 104, the interlayer insulating film 106, and the organic sealing film 132 in order to make the cross-sectional structure easy to see. In the following description, the stacking direction is the upward direction.
　図９は、第３の実施形態における表示領域１７０と端子領域１８０の境界付近を拡大した図である。具体的には、図２ａ又は図２ｂにおいて、一点鎖線で囲まれた箇所を拡大している。なお、図９は硬化前の樹脂組成物を塗布する前のものを示す。図１０ａは、図９に示すＡ－Ａ線で切断した時の断面図である。なお、図１０ａは硬化前の樹脂組成物を塗布する前のものを示す。第３の実施形態では、第１及び第２の実施形態と異なり、樹脂膜１５０の下地部にあたるパシベーション膜１０４が、凹部１６０を有する。 FIG. 9 is an enlarged view of the vicinity of the boundary between the display area 170 and the terminal area 180 in the third embodiment. Specifically, in FIG. 2a or 2b, the portion surrounded by the alternate long and short dash line is enlarged. In addition, FIG. 9 shows the thing before apply | coating the resin composition before hardening. 10a is a cross-sectional view taken along line AA shown in FIG. In addition, FIG. 10a shows the thing before apply | coating the resin composition before hardening. In the third embodiment, unlike the first and second embodiments, the passivation film 104 corresponding to the base portion of the resin film 150 has a recess 160.
　凹部１６０の底面は、例えばパシベーション膜１０４の上面から１乃至６μｍ下面となるように設けられる。凹部１６０の底面をパシベーション膜１０４の上面よりも低くする加工は、パシベーション膜１０４を形成した段階で行ってもよい。この場合、当該加工は、例えばレーザーによって行ってもよく、又はエッチングによって行ってもよい。 The bottom surface of the recess 160 is provided so as to be 1 to 6 μm lower surface from the upper surface of the passivation film 104, for example. The processing for making the bottom surface of the recess 160 lower than the top surface of the passivation film 104 may be performed when the passivation film 104 is formed. In this case, the processing may be performed by, for example, a laser or may be performed by etching.
　図１０ｂは、図９に示すＢ－Ｂ線で切断した時の断面図である。つまり、凹部１６０を含む箇所における断面図である。また、図１０ｃは、図９に示すＣ－Ｃ線で切断した時の断面図である。つまり、凹部１６０を含まない箇所における断面図である。なお、図１０ｂ及び図１０ｃは樹脂膜１５０が設けられた後のものを示す。 FIG. 10b is a cross-sectional view taken along the line BB shown in FIG. That is, it is a cross-sectional view at a location including the recess 160. FIG. 10c is a cross-sectional view taken along the line CC shown in FIG. That is, it is a cross-sectional view at a location not including the recess 160. 10B and 10C show the state after the resin film 150 is provided.
　図１０ｂで示すように、表示領域１７０側の端子領域１８０との境界付近では、パシベーション膜１０４の表面がスロープ状となっている。しかし、凹部１６０の形状は、必ずしも表示領域１７０側に延びている必要はない。例えば、表示領域１７０側の端子領域側端面から、第１の接続基板２１０が接続される側へ延びるように、凹部１６０が設けられてもよい。 As shown in FIG. 10b, the surface of the passivation film 104 is sloped near the boundary with the terminal region 180 on the display region 170 side. However, the shape of the recess 160 does not necessarily extend to the display area 170 side. For example, the recess 160 may be provided so as to extend from the terminal area side end face on the display area 170 side to the side to which the first connection substrate 210 is connected.
　なお、凹部１６０以外の箇所については、図１０ｃに示すように、第１の実施形態を説明する図４ｃとほぼ同様の構成となる。具体的に相違する点は、第３の実施形態では、接続配線層１４０の上面がパシベーション膜１４０によって薄く覆われる構成を採用している点のみである。 In addition, as shown in FIG. 10c, the portions other than the concave portion 160 have substantially the same configuration as that in FIG. 4c for explaining the first embodiment. The specific difference is that the third embodiment adopts a configuration in which the upper surface of the connection wiring layer 140 is thinly covered with the passivation film 140.
　図１１及び１２は、図９に示すＡ－Ａ線で切断した時の断面図で、第３の実施形態の変形例として、接続配線層１４０の配置の例を示す。なお、図１１及び１２は硬化前の樹脂組成物を塗布する前のものを示す。図１１及び１２は、共に接続配線層１４０が１層の場合を示す。その上で、図１１では、凹部１６０以外の箇所に接続配線層１４０が設けられる。または、図１２に示すように、凹部１６０の底面や、凹部１６０の底面の直下に接続配線層１４０を設けてもよい。 11 and 12 are cross-sectional views taken along the line AA shown in FIG. 9, and show an example of the arrangement of the connection wiring layer 140 as a modification of the third embodiment. In addition, FIG.11 and 12 show the thing before apply | coating the resin composition before hardening. 11 and 12 both show a case where the connection wiring layer 140 is one layer. In addition, in FIG. 11, the connection wiring layer 140 is provided at a place other than the recess 160. Alternatively, as illustrated in FIG. 12, the connection wiring layer 140 may be provided on the bottom surface of the recess 160 or directly below the bottom surface of the recess 160.
　以上より、第３の実施形態の表示パネル１００は、樹脂膜１５０の下地部（パシベーション膜１０４）に凹部１６０が形成される。この凹部１６０によって、第３の実施形態も第１の実施形態や第２の実施形態と同様に、樹脂膜１５０の形成を所望する領域まで硬化前の樹脂組成物を案内することが可能となる。 As described above, in the display panel 100 according to the third embodiment, the recess 160 is formed in the base portion (passivation film 104) of the resin film 150. With this recess 160, the third embodiment can also guide the resin composition before curing to the region where the formation of the resin film 150 is desired, as in the first and second embodiments. .
　上述の第１乃至第３の実施形態で示すように、硬化前の樹脂組成物を案内する溝部を形成するため、案内膜又は凹部を設けることで、樹脂膜１５０の形成を所望する領域まで硬化前の樹脂組成物を案内することが可能となる。そして、樹脂組成物が硬化して樹脂膜１５０となることで、端子領域１８０を被覆する樹脂膜１５０が設けられる。これにより、端子領域１８０における湾曲強度が低下しないようにし、かつ接続配線層１４０の腐食を防ぐ表示装置１が提供される。 As shown in the first to third embodiments, a resin film 150 is cured to a desired region by providing a guide film or a recess to form a groove for guiding the resin composition before curing. It becomes possible to guide the previous resin composition. And the resin film 150 which coat | covers the terminal area | region 180 is provided because the resin composition hardens | cures and becomes the resin film 150. FIG. Thereby, the display device 1 is provided in which the bending strength in the terminal region 180 is not lowered and the corrosion of the connection wiring layer 140 is prevented.
　なお、硬化前の樹脂組成物の粘度を低くした場合、樹脂組成物が外方に流れてしまう可能性がある。この場合、樹脂膜１５０の形成を所望する領域を越えて、樹脂膜１５０が形成されるおそれがある。しかし、端子領域１８０に案内膜や凹部１６０を設けることで、塗付された樹脂生成物の流れる方向を、溝部による案内で制御することができる。 In addition, when the viscosity of the resin composition before curing is lowered, the resin composition may flow outward. In this case, the resin film 150 may be formed beyond the region where the resin film 150 is desired to be formed. However, by providing a guide film or recess 160 in the terminal region 180, the direction in which the applied resin product flows can be controlled by guidance by the groove.
　逆に、塗布精度を上げるために樹脂組成物の粘度を高くした場合、樹脂膜１５０の形成を所望する領域に樹脂組成物を塗布することができないおそれがある。しかし、端子領域１８０に案内膜や凹部１６０を設けることで、樹脂組成物を容易に樹脂膜１５０の形成を所望する領域へ案内することが可能となる。この溝部による樹脂組成物の案内は、溝部の形状による制御下での案内であってもよく、溝部の幅を狭めて毛細管現象を利用してもよい。 Conversely, when the viscosity of the resin composition is increased in order to increase the application accuracy, the resin composition may not be applied to a region where the formation of the resin film 150 is desired. However, by providing the guide film or the recess 160 in the terminal region 180, the resin composition can be easily guided to the region where the resin film 150 is desired to be formed. The guide of the resin composition by the groove part may be a guide under the control of the shape of the groove part, or may utilize the capillary phenomenon by narrowing the width of the groove part.
　本実施形態においては、開示例として有機ＥＬ表示装置の場合を例示したが、その他の適用例として、液晶表示装置、その他の自発光型表示装置、あるいは電気泳動素子等を有する電子ペーパー型表示装置等、あらゆるフラットパネル型の表示装置が挙げられる。また、中小型の表示装置から大型の表示装置まで、特に限定することなく適用が可能であることは言うまでもない。 In the present embodiment, the case of an organic EL display device has been exemplified as a disclosure example, but as other application examples, a liquid crystal display device, another self-luminous display device, or an electronic paper display device having an electrophoretic element or the like Any flat panel display device can be used. Further, it goes without saying that the present invention can be applied without any particular limitation from a small and medium display device to a large display device.
　本発明の思想の範疇において、当業者であれば、各種の変更例及び修正例に想到し得るものであり、それら変更例及び修正例についても本発明の範囲に属するものと了解される。例えば、前述の各実施形態に対して、当業者が適宜、構成要素の追加、削除若しくは設計変更を行ったもの、又は、工程の追加、省略若しくは条件変更を行ったものも、本発明の要旨を備えている限り、本発明の範囲に含まれる。

  In the scope of the idea of the present invention, those skilled in the art can conceive various changes and modifications, and it is understood that these changes and modifications also belong to the scope of the present invention. For example, those in which the person skilled in the art appropriately added, deleted, or changed the design of the above-described embodiments, or those in which the process was added, omitted, or changed the conditions are also included in the gist of the present invention. As long as it is included in the scope of the present invention.

Claims (9)

  1. 　可撓性を有する基板と、
    　前記基板上の端子領域に設けられ、前記基板上の表示領域に設けられる画素アレイ部から端子領域に設けられる接続基板へと延びる１以上の配線層と、
    　前記基板の前記表示領域を覆うように設けられる表面フィルムと、
    　前記端子領域に設けられる樹脂膜と、
    　を有する表示装置であって、
    　前記端子領域における前記樹脂膜の下地部は、硬化前の前記樹脂膜を前記表示領域側へ案内する、前記表示領域側から前記接続基板側へ延びる溝部を複数有する、
    　ことを特徴とする表示装置。     A flexible substrate;
    One or more wiring layers provided in a terminal region on the substrate and extending from a pixel array unit provided in a display region on the substrate to a connection substrate provided in the terminal region;
    A surface film provided to cover the display area of the substrate;
    A resin film provided in the terminal region;
    A display device comprising:
    The base portion of the resin film in the terminal region has a plurality of grooves extending from the display region side to the connection substrate side for guiding the resin film before curing to the display region side.
    A display device characterized by that.
  2. 　前記樹脂膜の下地部は、表層に絶縁膜が設けられ、
    　前記溝部は、前記絶縁膜の上面に形成された複数の凹部である、
    　ことを特徴とする請求項１に記載の表示装置。     The base portion of the resin film is provided with an insulating film on the surface layer,
    The groove is a plurality of recesses formed on the upper surface of the insulating film.
    The display device according to claim 1.
  3. 　前記樹脂膜の下地部は、前記基板側から順に絶縁膜及び前記表示領域の端子領域側端面から前記接続基板側へ延びる案内膜を複数有し、
    　前記溝部は、隣接する２つの前記案内膜の間である、
    　ことを特徴とする請求項１に記載の表示装置。     The base portion of the resin film has a plurality of guide films extending from the terminal side of the display region to the connection substrate side in order from the substrate side,
    The groove is between two adjacent guide films.
    The display device according to claim 1.
  4. 　前記案内膜は、互いに一定の距離だけ離間して並行するように設けられ、
    　前記案内膜の幅は、１．５ｍｍ以下である、
    　ことを特徴とする請求項３に記載の表示装置。     The guide films are provided so as to be parallel to each other by a certain distance from each other,
    The width of the guide membrane is 1.5 mm or less,
    The display device according to claim 3.
  5. 　前記溝部の幅は、１．５ｍｍ以下である、
    　ことを特徴とする請求項１乃至４の何れか一項に記載の表示装置。     The groove has a width of 1.5 mm or less.
    The display device according to claim 1, wherein the display device is a display device.
  6. 　前記樹脂膜の上面は、前記表面フィルムの上面を超えない、
    　ことを特徴とする請求項１乃至５の何れか一項に記載の表示装置。     The upper surface of the resin film does not exceed the upper surface of the surface film,
    The display device according to claim 1, wherein the display device is a display device.
  7. 　前記溝部の高さは、前記基板と前記表面フィルムとを接着するために設けられる接着層の厚さの３分の１以下である、
    　ことを特徴とする請求項１乃至６の何れか一項に記載の表示装置。     The height of the groove is 1/3 or less of the thickness of an adhesive layer provided for adhering the substrate and the surface film.
    The display device according to claim 1, wherein the display device is a display device.
  8. 　前記溝部は、前記表示領域側から前記接続基板側へ延びる前記端子領域の辺の長さの５０％以下の長さにわたって設けられる、
    　ことを特徴とする請求項１乃至７の何れか一項に記載の表示装置。     The groove is provided over a length of 50% or less of the length of the side of the terminal region extending from the display region side to the connection substrate side.
    The display device according to claim 1, wherein the display device is a display device.
  9. 　可撓性を有する基板を設ける工程と、
    　前記基板上の表示領域に設けられる画素アレイ部から端子領域に設けられる接続基板へと延びる１以上の配線層を、前記基板上の端子領域に設ける工程と、
    　前記基板の前記表示領域を覆うように表面フィルムを設ける工程と、
    　前記端子領域に樹脂膜を設ける工程と、
    　を有する表示装置の製造方法であって、
    　前記端子領域における前記樹脂膜の下地部には、硬化前の前記樹脂膜を前記表示領域側へ案内する、前記表示領域側から前記接続基板側へ延びる溝部を複数形成する工程をさらに有する、
    　ことを特徴とする表示装置の製造方法。

          Providing a flexible substrate;
    Providing one or more wiring layers in the terminal region on the substrate extending from a pixel array portion provided in the display region on the substrate to a connection substrate provided in the terminal region;
    Providing a surface film so as to cover the display area of the substrate;
    Providing a resin film in the terminal region;
    A method of manufacturing a display device having
    The base portion of the resin film in the terminal region further includes a step of forming a plurality of grooves extending from the display region side to the connection substrate side for guiding the resin film before curing to the display region side.
    A manufacturing method of a display device characterized by the above.

PCT/JP2018/045689 2018-03-28 2018-12-12 Display device and the display device manufacturing method WO2019187380A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018062365A JP2019174637A (en) 2018-03-28 2018-03-28 Display and method for manufacturing display
JP2018-062365 2018-03-28

Publications (1)

Publication Number Publication Date
WO2019187380A1 true WO2019187380A1 (en) 2019-10-03

Family

ID=68061174

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/045689 WO2019187380A1 (en) 2018-03-28 2018-12-12 Display device and the display device manufacturing method

Country Status (2)

Country Link
JP (1) JP2019174637A (en)
WO (1) WO2019187380A1 (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001330837A (en) * 2000-05-19 2001-11-30 Matsushita Electric Ind Co Ltd Hermetic structural, its manufacturing method, liquid crystal display device using the same and its manufacturing method
JP2005166266A (en) * 2003-11-28 2005-06-23 Optrex Corp Organic el display and its manufacturing method
JP2006319230A (en) * 2005-05-16 2006-11-24 Seiko Epson Corp Bank structure, method for forming wiring pattern, device, electrooptical device, and electronic apparatus
WO2011058679A1 (en) * 2009-11-12 2011-05-19 シャープ株式会社 Liquid crystal display device
JP2014235861A (en) * 2013-05-31 2014-12-15 株式会社ジャパンディスプレイ Organic electroluminescence display device
US20150380675A1 (en) * 2010-12-03 2015-12-31 Lg Display Co., Ltd. Organic light emitting display device and method for manufacturing the same
JP2017157313A (en) * 2016-02-29 2017-09-07 株式会社ジャパンディスプレイ Method for manufacturing display device and display device
US20170358602A1 (en) * 2016-06-08 2017-12-14 Samsung Display Co., Ltd. Display panel including external conductive pad, display apparatus including the same and method of manufacturing the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001330837A (en) * 2000-05-19 2001-11-30 Matsushita Electric Ind Co Ltd Hermetic structural, its manufacturing method, liquid crystal display device using the same and its manufacturing method
JP2005166266A (en) * 2003-11-28 2005-06-23 Optrex Corp Organic el display and its manufacturing method
JP2006319230A (en) * 2005-05-16 2006-11-24 Seiko Epson Corp Bank structure, method for forming wiring pattern, device, electrooptical device, and electronic apparatus
WO2011058679A1 (en) * 2009-11-12 2011-05-19 シャープ株式会社 Liquid crystal display device
US20150380675A1 (en) * 2010-12-03 2015-12-31 Lg Display Co., Ltd. Organic light emitting display device and method for manufacturing the same
JP2014235861A (en) * 2013-05-31 2014-12-15 株式会社ジャパンディスプレイ Organic electroluminescence display device
JP2017157313A (en) * 2016-02-29 2017-09-07 株式会社ジャパンディスプレイ Method for manufacturing display device and display device
US20170358602A1 (en) * 2016-06-08 2017-12-14 Samsung Display Co., Ltd. Display panel including external conductive pad, display apparatus including the same and method of manufacturing the same

Also Published As

Publication number Publication date
JP2019174637A (en) 2019-10-10

Similar Documents

Publication Publication Date Title
CN107104124B (en) Display device
US10749140B2 (en) Organic light-emitting display device
KR101872145B1 (en) Display device and method for manufacturing the same
WO2018158953A1 (en) Display device and method for manufacturing same
JP6324098B2 (en) Display device and manufacturing method thereof
CN111937489B (en) Display device
US10854828B2 (en) Display device including a bent portion and method for manufacturing the same
US11349098B2 (en) Display device with an improved sealing layer
US20210249631A1 (en) Display device and manufacturing method thereof
CN111146242A (en) Organic light emitting display device
JP5355494B2 (en) Display device and manufacturing method thereof
US8379179B2 (en) Flat panel display having particular compensating parts for a thickness difference between sealants
JP2017073260A (en) Organic el display device and method of manufacturing organic el display device
TW202105000A (en) Display panel
WO2020044690A1 (en) Display device and method for producing display device
CN111886925B (en) Display apparatus
WO2019187380A1 (en) Display device and the display device manufacturing method
US11094759B2 (en) Display device and method of manufacturing display device
US11475804B2 (en) Display panel having an auxiliary layer overlapped with a bendable region
US10644094B2 (en) Display device
US20240147776A1 (en) Display device
WO2019064592A1 (en) Display device, method for manufacturing display device, and apparatus for manufacturing display device
CN117812965A (en) display device
WO2020202281A1 (en) Display device
KR20220078266A (en) Electroluminescence Display

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18912330

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18912330

Country of ref document: EP

Kind code of ref document: A1