WO2020202281A1

WO2020202281A1 - Display device

Info

Publication number: WO2020202281A1
Application number: PCT/JP2019/014092
Authority: WO
Inventors: 寛樹河邑; 塩田　素二
Original assignee: シャープ株式会社
Priority date: 2019-03-29
Filing date: 2019-03-29
Publication date: 2020-10-08

Abstract

In a display device (50), a resin film (34) is provided so as to make contact with a flexible circuit board (45) while covering an end portion (P).

Description

Display device

The present invention relates to a display device.

Patent Document 1 describes a step of dividing a large substrate including a plurality of display panels (for example, an organic EL element panel) provided with inspection wiring.

Japanese Patent Publication "Japanese Patent Laid-Open No. 2007-34275" (published on February 8, 2007)

However, in the case of the conventional display device disclosed in Patent Document 1, the inspection wiring is exposed as it is on the divided end surface of the display panel after the dividing step of dividing a large substrate provided with a plurality of display panels. It becomes. The inspection wiring exposed in this way may adversely affect the display quality of the display panel (for example, black floating), and may impair the reliability of the display panel.

It is also conceivable to apply a moisture-proof resin to the portion of the divided end surface of the display panel where the inspection wiring is exposed as it is, but the display is displayed because the thickness of the display panel is relatively thin (for example, 0.1 mm). It is difficult to form a moisture-proof resin on the split end face of the panel so as to cover the exposed inspection wiring.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a highly reliable display device.

In order to solve the above problems, the display device of the present invention
A display device including a substrate, a thin film transistor layer provided with transistors, a light emitting element, and a sealing layer.
A display area including the light emitting element and a frame area surrounding the display area are provided.
The frame region is provided with an inspection wiring for inspecting at least one of the transistor and the light emitting element, and a terminal portion of a signal wiring that contributes to light emission of the light emitting element.
A flexible circuit board including a second terminal electrode electrically connected to the first terminal electrode included in the terminal portion is further provided.
The inspection wiring has an end portion routed to the end face of the substrate.
The end is superimposed on the flexible circuit board.
It is characterized in that the resin film is provided so as to be in contact with the flexible circuit board and to cover the end portion.

In order to solve the above problems, the display device of the present invention
A display device including a substrate, a thin film transistor layer provided with transistors, a light emitting element, and a sealing layer.
A display area including the light emitting element and a frame area surrounding the display area are provided.
The frame region is provided with an inspection wiring for inspecting at least one of the transistor and the light emitting element, a first terminal portion of the inspection wiring, and a terminal portion of a signal wiring that contributes to light emission of the light emitting element.
A flexible circuit board including a second terminal electrode electrically connected to the first terminal electrode included in the terminal portion is further provided.
The flexible circuit board
A fourth terminal electrode electrically connected to a third terminal electrode included in the first terminal portion, an inspection input electrode for inputting an inspection signal to the inspection wiring, and the fourth terminal electrode and the inspection input electrode. It is characterized in that it includes a connection wiring that electrically connects and.

According to one aspect of the present invention, a highly reliable display device can be provided.

(A) is a plan view of the display device of the first embodiment, (b) is a cross-sectional view taken along the line AB in (a) of FIG. 1, and (c) is (a) of FIG. ) Is a cross-sectional view taken along the line CD. (A) is a diagram showing a schematic configuration of a portion where the first terminal portion of the inspection wiring and the flexible circuit board are electrically connected in the display device of the first embodiment, and (b) is a diagram showing the inspection wiring and the portion. It is a top view which shows the 3rd terminal electrode, (c) is the figure which shows the schematic structure of the part where the terminal part of a signal wiring and a flexible circuit board are electrically connected in the display device of Embodiment 1. .. (A) is a plan view of the display device of the second embodiment, and (b) is a cross-sectional view of the line EF in FIG. 3 (a). (A) is a diagram showing a schematic configuration of an end portion of an inspection wiring in the display device of the second embodiment, and (b) is a terminal portion of a signal wiring and a flexible circuit board in the display device of the second embodiment. It is a figure which shows the schematic structure of the part which is electrically connected with. It is a figure which shows the schematic structure of the end part of the inspection wiring in the large substrate before the dividing process which includes a plurality of display devices of Embodiment 2. It is a figure which shows the schematic structure of the large substrate before the dividing process which includes a plurality of display devices of Embodiment 2. It is a top view of the display device of Embodiment 3. (A) is a plan view of a display device as a comparative example, and (b) is a diagram showing a portion where the inspection wiring is exposed as it is on the divided end surface of the display device as a comparative example.

An embodiment of the present invention will be described as follows based on FIGS. 1 to 7 and FIG. 8 which is a comparative example. Hereinafter, for convenience of explanation, the same reference numerals may be added to the configurations having the same functions as the configurations described in the specific embodiments, and the description thereof may be omitted.

[Embodiment 1]
In the following, first, the display device 100 as a comparative example will be described with reference to FIG. 8, and the display device 1 of the first embodiment of the present invention will be described with reference to FIGS. 1 and 2.

FIG. 8A is a plan view of the display device 100 as a comparative example, and FIG. 8B is a portion of the divided end surface of the display device 100 as a comparative example in which the inspection wiring L1 is exposed as it is. It is a figure which shows.

As shown in FIGS. 8A and 8B, in the display device 100, the inspection wiring L1 is routed to the end face of the base substrate 10, and the display device is before the dividing step. Inspection can be performed using an inspection terminal (not shown) electrically connected to the inspection wiring L1 on the outside of 100. Further, before covering the second terminal portion L1T of the inspection wiring L1 with the moisture-proof resin 35, the inspection can be performed using the second terminal portion L1T of the inspection wiring L1.

In the display device 100, the terminal portion (not shown) of the signal wiring L2 is electrically connected to the first terminal electrode (not shown) of the flexible circuit board 104, but the inspection wiring L1 is a flexible circuit. It is not electrically connected to the board 104, and the flexible circuit board 104 and the inspection wiring L1 do not overlap. Therefore, as shown in FIG. 8B, the end portion P of the inspection wiring L1 routed to the end surface of the base substrate 10 does not overlap with the flexible circuit board 104.

As described above, after the dividing step, the inspection wiring L1 is exposed as it is on the divided end surface of the display device 100. Although it is conceivable to apply the moisture-proof resin to the portion where the inspection wiring L1 is exposed as it is, the point where the thickness of the display device 100 is relatively thin (for example, 0.1 mm) and the coated moisture-proof resin are applied to the upper side or the coated moisture-proof resin. Since there is no member to support on the lower side (for example, the flexible circuit board 104), it is difficult to form a moisture-proof resin that easily flows so as to cover the exposed inspection wiring L1. In the case of the display device 100 in which the inspection wiring L1 is exposed as it is on the divided end surface, the portion where the inspection wiring L1 is exposed as it is has an adverse effect on the display quality (for example, black floating), and the display device 100 There is a risk that the reliability of the

1A is a plan view of the display device 1 of the present embodiment, FIG. 1B is a cross-sectional view taken along the line AB in FIG. 1A, and FIG. (C) is a cross-sectional view taken along the line CD in FIG. 1 (a).

As shown in FIG. 1A, the display device 1 includes a display area DA and a frame area NDA surrounding the display area DA.

As shown in FIG. 1 (c), in the display region DA of the display device 1, the adhesive layer 11, the resin layer 12, the barrier layer 3, and the thin film transistor layer (TFT layer) are placed on the base substrate 10. ) 4, the light emitting element 5, and the sealing layer 6 are provided in this order.

Examples of the material of the base substrate 10 include, but are not limited to, polyethylene terephthalate (PET) and the like.

Examples of the adhesive layer 11 include, but are not limited to, OCA (Optical Clear Adhesive) or OCR (Optical Clear Resin).

Examples of the material of the resin layer 12 include, but are not limited to, polyimide resin, epoxy resin, polyamide resin and the like.

The barrier layer 3 is a layer that prevents moisture and impurities from reaching the transistor Tr and the light emitting element 5, and is, for example, a silicon oxide film, a silicon nitride film, or a silicon nitride film formed by CVD, or these. It can be composed of a laminated film of.

The transistor Tr and the capacitive element are provided on the upper layers of the resin layer 12 and the barrier layer 3. The thin film layer 4 including the transistor Tr and the capacitive element includes a semiconductor film 15, an inorganic insulating film (gate insulating film) 16 above the semiconductor film 15, a gate electrode GE above the inorganic insulating film 16, and a gate electrode. The inorganic insulating film (first insulating film) 18 above the GE, the counter electrode CE of the capacitive element above the inorganic insulating film 18, and the inorganic insulating film (second insulation) above the counter electrode CE of the capacitive element. The film) 20, the layer SH above the inorganic insulating film 20 forming the source electrode, the drain electrode and its wiring, and the interlayer insulating film 21 above the layer SH forming the source electrode, the drain electrode and its wiring. And include.

The capacitive element is the same layer as the counter electrode CE of the capacitive element formed directly above the inorganic insulating film 18, the inorganic insulating film 18, and the layer formed directly below the inorganic insulating film 18 and forming the gate electrode GE. It is composed of a capacitive electrode formed so as to overlap with the counter electrode CE of the capacitive element.

A transistor (thin film transistor (TFT)) Tr is configured to include a semiconductor film 15, an inorganic insulating film 16, a gate electrode GE, an inorganic insulating film 18, an inorganic insulating film 20, a source electrode and a drain electrode.

The semiconductor film 15 is composed of, for example, low temperature polysilicon (LTPS) or an oxide semiconductor.

The gate electrode GE, the counter electrode CE of the capacitive element, the source electrode and the drain electrode, and the layer SH forming the wiring thereof are, for example, aluminum (Al), tungsten (W), molybdenum (Mo), tantalum (Ta), and chromium (Ta). It is composed of a single-layer film or a laminated film of a metal containing at least one of Cr), titanium (Ti), copper (Cu), and silver (Ag).

The inorganic insulating films 16/18/20 can be composed of, for example, a silicon oxide (SiOx) film, a silicon nitride (SiNx) film, a silicon oxynitride film, or a laminated film thereof formed by a CVD method.

The interlayer insulating film 21 can be made of a coatable photosensitive organic material such as a polyimide resin or an acrylic resin.

The light emitting element 5 includes a first electrode 22 above the interlayer insulating film 21, a functional layer 24 including a light emitting layer above the first electrode 22, and a second electrode 25 above the functional layer 24. .. An edge cover (bank) 23 that covers the edge of the first electrode 22 is formed on the interlayer insulating film 21.

Each subpixel SP of the display device 1 includes an island-shaped first electrode 22, a functional layer 24 including a light emitting layer, and a second electrode 25. The edge cover 23 can be made of a coatable photosensitive organic material such as a polyimide resin or an acrylic resin.

The functional layer 24 is composed of, for example, laminating a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer in this order from the lower layer side. The light emitting layer is formed in an island shape for each subpixel SP by a vapor deposition method or an inkjet method, but the other layers may be solid common layers. Further, it is possible to configure the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer so as not to form one or more layers.

The first electrode 22 can be formed by, for example, laminating ITO (Indium Tin Oxide) and an alloy containing Ag, but is not particularly limited as long as conductivity and light reflectivity can be ensured. Further, the second electrode 25 can be made of a translucent conductive material such as ITO (Indium Tin Oxide) and IZO (Indium Zinc Oxide), but if conductivity and translucency can be ensured, There is no particular limitation.

The first electrode 22 is provided for each subpixel (pixel) SP and is electrically connected to the drain electrode of the transistor Tr. Further, the second electrode 25 is provided in common to all subpixels (pixels) SP. Further, the transistor Tr is driven for each subpixel SP.

In the present embodiment, the case where the light emitting element 5 is an OLED (Organic Light Emitting Diode) will be described as an example, but the present invention is not limited to this, and the light emitting element 5 is, for example, It may be an inorganic light emitting diode or a QLED (Quantum dot Light Emitting Diode).

The sealing layer 6 is translucent, and has a first inorganic sealing film 26 that covers the second electrode 25, an organic sealing film 27 that is formed above the first inorganic sealing film 26, and an organic sealing. It includes a second inorganic sealing film 28 that covers the film 27. The sealing layer 6 covering the light emitting element 5 prevents foreign substances such as water and oxygen from penetrating into the light emitting element 5.

The first inorganic sealing film 26 and the second inorganic sealing film 28 may each be composed of, for example, a silicon oxide film, a silicon nitride film, a silicon nitride film, or a laminated film thereof formed by CVD. it can. The organic sealing film 27 is a translucent organic film thicker than the first inorganic sealing film 26 and the second inorganic sealing film 28, and is made of a coatable photosensitive organic material such as a polyimide resin or an acrylic resin. can do.

In the present embodiment, an organic sealing film 27 is provided between the first inorganic sealing film 26 and the second inorganic sealing film 28, and the sealing is composed of one layer of organic film and two layers of inorganic film. Although the stop layer 6 has been described as an example, the present invention is not limited to this, and the sealing layer 6 may be formed of only one or more inorganic films or one or more organic films, and two layers. It may be formed of the above inorganic film and two or more organic films.

In the present embodiment, the case where the display device 1 is a flexible display device and the base substrate 10 which is a flexible substrate is attached to the resin layer 12 via the adhesive layer 11 has been described as an example, but the present invention is limited to this. Will not be done. For example, the step of attaching the base substrate 10 which is a flexible substrate via the adhesive layer 11 may be omitted, and the resin layer 12 may be used as it is as the flexible substrate. Further, the display device 1 may be a non-flexible display device. In this case, for example, the base substrate 10, the adhesive layer 11 and the resin layer 12 are omitted, and the glass substrate is a non-flexible substrate. The barrier layer 3 may be formed directly on the barrier layer 3.

As shown in FIG. 1A, the frame region NDA of the display device 1 includes an inspection wiring L1 for inspecting at least one of the transistor Tr and the light emitting element 5 shown in FIG. 1C, and a light emitting element. The signal wiring L2 of 5 is provided. The signal wiring L2 is an arbitrary wiring that contributes to light emission of the light emitting element 5, and is, for example, a data signal line, a scanning signal line, a light emission control line, an initialization power supply line, a low voltage power supply line, a high voltage power supply line, and a clock signal. Including wiring etc. Further, in the frame region NDA of the display device 1, the first terminal portion L1T'and the second terminal portion L1T of the inspection wiring L1 exposed from the thin film transistor layer 4 and the signal wiring L2 of the light emitting element 5 exposed from the thin film transistor layer 4 A terminal portion T2 is provided. In the present embodiment, the case where the first terminal portion L1T'is provided at two positions on the left and right of the terminal portion T2 so as to sandwich the terminal portion T2 is given as an example, but the present invention is not limited to this. Each of the first terminal portions L1T'consists of a plurality of third terminal electrodes L1T'n (see (a) and 2 (b) of FIG. 2) connected to each of the plurality of inspection wirings L1. ing. The second terminal portion L1T of the inspection wiring L1 is covered with the moisture-proof resin 35. As shown in FIG. 1A, the flexible circuit board 32 is composed of a fourth terminal electrode group E1 composed of a plurality of fourth terminal electrodes E1n and a plurality of second terminal electrodes E2n. The second terminal electrode group E2 is provided.

FIG. 1B is a cross-sectional view taken along the line AB in FIG. 1A, showing an end surface of one side of the display device 1 provided with the flexible circuit board 32.

As shown in FIG. 1B, the end face of one side of the frame region NDA of the display device 1 provided with the flexible circuit board 32 in the display device 1 is an adhesive layer on the base substrate 10. 11, the resin layer 12, the barrier layer 3, and the flexible circuit board 32 are provided in this order. The end surface of one side of the display device 1 provided with the flexible circuit board 32 is one of the divided end faces formed in the dividing step performed in the manufacturing process of the display device 1. The inspection wiring L1 and the signal wiring L2 illustrated in 1 are not exposed on the divided end face.

FIG. 2A shows a schematic configuration of a portion of the display device 1 in which the first terminal portion L1T'of the inspection wiring L1n (n is a natural number of 1 or more) and the flexible circuit board 32 are electrically connected. It is a figure which shows.

The inspection wiring L1n means each of the plurality of inspection wirings L1 shown in FIG. 1 (a). As shown in FIG. 2A, the third terminal electrode L1T'n forming the first terminal portion L1T'of the inspection wiring L1n and the inspection electrode L1Tn forming the second terminal portion L1T of the inspection wiring L1n Is exposed from the inorganic insulating film 16, the inorganic insulating film 18, the inorganic insulating film 20, and the interlayer insulating film 21 contained in the thin film transistor layer 4. The second terminal portion L1T of the inspection wiring L1n is covered with the moisture-proof resin 35.

The flexible circuit board 32 includes a fourth terminal electrode E1n electrically connected to a third terminal electrode L1T' included in the first terminal portion L1T'and an inspection input electrode for inputting an inspection signal to the inspection wiring L1n. 33, and a connection wiring 32Ln that electrically connects the fourth terminal electrode E1n and the inspection input electrode 33 are included. The fourth terminal electrode E1n of the flexible circuit board 32 and the third terminal electrode L1T'n of the inspection wiring L1n are via an anisotropic conductive material 40 (also referred to as an anisotropic conductive film (ACF)). And are electrically connected. The resin film 34 is provided so as to cover the inspection input electrode 33 of the flexible circuit board 32. The openings CON1 and CON1'are openings formed to expose the inspection wiring L1n from the inorganic insulating film 18 and the inorganic insulating film 20, and the openings 21c and 21c'are the third terminal electrodes L1T of the inspection wiring L1n. This is an opening formed to expose the'n and the inspection electrode L1Tn from the interlayer insulating film 21.

FIG. 2B is a plan view showing the inspection wiring L1n and the third terminal electrode L1T'n. In FIG. 2B, seven inspection wirings L1n (L1 (1) to L1 (7) are provided, and seven inspection wirings (L1 (1) to L1 (7)) are provided. An example is shown in the case where the third terminal electrodes L1T'1 to L1T'7 are provided. In this case, the seven third terminal electrodes L1T'1 to L1T'7 are the first terminal portion L1T. 'Constituting.

FIG. 2C shows an outline of a portion of the display device 1 in which the first terminal electrode T2n constituting the terminal portion T2 of the signal wiring L2n and the second terminal electrode E2n of the flexible circuit board 32 are electrically connected. It is a figure which shows the structure.

The signal wiring L2n means each of the plurality of signal wirings L2 shown in FIG. 1A. As shown in FIG. 2C, the first terminal electrode T2n of the signal wiring L2n has an inorganic insulating film 16, an inorganic insulating film 18, an inorganic insulating film 20, and interlayer insulation contained in the thin film transistor layer 4. It is exposed from the film 21. The flexible circuit board 32 further includes a second terminal electrode E2n that is electrically connected to the first terminal electrode T2n of the signal wiring L2n. The second terminal electrode E2n of the flexible circuit board 32 and the first terminal electrode T2n of the signal wiring L2n are electrically connected via the anisotropic conductive material 40. The opening CON2 is an opening formed to expose the signal wiring L2n from the inorganic insulating film 18 and the inorganic insulating film 20, and the opening 21d is an opening formed by exposing the first terminal electrode T2n of the signal wiring L2n from the interlayer insulating film 21. An opening formed for exposure.

As described above, since the display device 1 is provided with the inspection input electrode 33 on the flexible circuit board 32, it is easy to form the resin film 34 so as to cover the inspection input electrode 33. Further, the inspection wiring L1n and the signal wiring L2n are provided inside the end surface of the base substrate 10, and the third terminal electrode L1T'n of the inspection wiring L1n is electrically connected to the fourth terminal electrode E1n of the flexible circuit board 32. By being connected to, it is electrically connected to the inspection input electrode 33 provided outside the end face of the base substrate 10. The first terminal electrode T2n of the signal wiring L2n is electrically connected to the second terminal electrode E2n of the flexible circuit board 32, so that a signal input for controlling the light emitting element 5 can be input from outside the end surface of the base board 10. It will be possible. Therefore, in the present embodiment, unlike the comparative example shown in FIG. 8, the inspection wiring L1 and the signal wiring L2 are not exposed on the divided end surface of the display device 1. Therefore, a highly reliable display device 1 can be realized.

In the present embodiment, the inspection wiring L1n and the signal wiring L2n are formed in the same layer as the gate electrode GE, and the third terminal electrode L1T'n of the inspection wiring L1n, the inspection electrode L1Tn, and the first terminal electrode T2n of the signal wiring L2n are formed. The case where the source electrode, the drain electrode, and the layer SH forming the wiring thereof are formed in the same layer as an example has been described as an example, but the present invention is not limited to this, and for example, the inspection wiring L1n and the signal wiring L2n are capacitive. It is formed in the same layer as the counter electrode CE of the element, and the third terminal electrode L1T'n of the inspection wiring L1n and the inspection electrode L1Tn and the first terminal electrode T2n of the signal wiring L2n form a source electrode, a drain electrode and its wiring. It may be formed in the same layer as the layer SH, and the inspection wiring L1n and the signal wiring L2n are formed in the same layer as the gate electrode GE, and the third terminal electrode L1T'n of the inspection wiring L1n, the inspection electrode L1Tn, and the signal wiring L2n The first terminal electrode T2n may be formed in the same layer as the counter electrode CE of the capacitive element. Further, the inspection wiring L1n and the signal wiring L2n may be formed of different layers, and the third terminal electrode L1T'n and the inspection electrode L1Tn of the inspection wiring L1n and the first terminal electrode T2n of the signal wiring L2n may be formed. It may be formed in different layers.

In the present embodiment, the case where the display device 1 includes the second terminal portion L1T of the inspection wiring L1n in addition to the first terminal portion L1T of the inspection wiring L1n has been described as an example. The present invention is not limited, and the second terminal portion L1T of the inspection wiring L1n may not be provided as in the third embodiment described later.

The resin film 34 is preferably a moisture-proof resin, and at least one of the resin film 34 and the moisture-proof resin 35 is preferably an ultraviolet photocurable resin. For example, a resin material containing an acrylic resin and a photocuring initiator that initiates curing by irradiation with ultraviolet light (UV light) can be used.

In this embodiment, as shown in FIG. 1A, the case where the second terminal portion L1T of the inspection wiring L1 does not overlap with the flexible circuit board 32 has been described as an example. The second terminal portion L1T of the inspection wiring L1 may be superimposed on the flexible circuit board 32 without being limited to.

Further, the flexible circuit board 32 may be a COF (Chip On Film) type flexible circuit board in which a drive circuit chip is mounted on the flexible circuit board 32.

[Embodiment 2]
Next, Embodiment 2 of the present invention will be described with reference to FIGS. 3 to 6. In the display device 50 of the present embodiment, the inspection wiring L1 has an end portion P routed to the end surface of the base substrate 10, the end portion P overlaps with the flexible circuit board 45, and the resin film 34 is flexible. It is different from the first embodiment and the comparative example in that it is provided so as to be in contact with the circuit board 45 and to cover the end portion P, and the others are as described in the first embodiment and the comparative example. For convenience of explanation, members having the same functions as the members shown in the drawings of the first embodiment and the comparative example are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 3A is a plan view of the display device 50, and FIG. 3B is a sectional view taken along line EF in FIG. 3A.

As shown in (a) of FIG. 3 and (b) of FIG. 3, the frame region NDA of the display device 50 includes a transistor Tr (see (c) of FIG. 1) and a light emitting element 5 ((c) of FIG. 1). ) Is provided, and a terminal portion (not shown) of the signal wiring L2 of the light emitting element 5 exposed from the thin film transistor layer 4 (see (c) of FIG. 1) is provided. ..

As shown in FIG. 3B, in the display device 50, since the inspection wiring L1 has an end portion P routed to the end surface of the base substrate 10, the divided end surface of the display device 50 is after the dividing step. In, the inspection wiring L1 is exposed as it is, but the resin film 34 is provided so as to be in contact with the flexible circuit board 45 and to cover the end portion P. Then, the end portion P overlaps with the flexible circuit board 45.

In the present embodiment, as shown in FIG. 3B, the resin film 34 is provided only in the region where the end portion P routed to the end surface of the base substrate 10 of the inspection wiring L1 exists. Although the description will be given as an example, the present invention is not limited to this, and the resin film 34 may be provided in a region where the end portion P does not exist in the divided end surface where the end portion P exists.

FIG. 4A is a diagram showing a schematic configuration of an end P portion of the inspection wiring L1n and L1'n in the display device 50, and FIG. 4B is a diagram showing a schematic configuration of the signal wiring L2n in the display device 50. It is a figure which shows the schematic structure of the part where the 1st terminal electrode T2n of 1 and the 2nd terminal electrode E2n of a flexible circuit board 45 are electrically connected.

The inspection wiring L1 shown in FIGS. 3A and 3B is composed of the inspection wiring L1n and the inspection wiring L1'n shown in FIG. 4A, and the inspection wiring L1'n is composed of the inspection wiring L1'n. It has an end portion P routed to the end surface of the base substrate 10. The opening CON1 in FIG. 4A is an opening formed to expose the inspection wiring L1n from the inorganic insulating film 18 and the inorganic insulating film 20. The inspection wiring L1n and the inspection wiring L1'n (n is a natural number of 1 or more) mean each of the plurality of inspection wirings L1 shown in FIG. 3A.

In the present embodiment, the case where the inspection wiring L1 is composed of the inspection wiring L1n and the inspection wiring L1'n and the inspection wiring L1'n has an end portion P routed to the end surface of the base substrate 10 is given as an example. However, the present invention is not limited to this. For example, the inspection wiring L1 is composed of only the inspection wiring L1n, and the inspection wiring L1n has an end portion P routed to the end surface of the base substrate 10. The inspection wiring L1 may be formed of only the same layer as the inspection wiring L1'n, and the same layer as the inspection wiring L1'n may have an end portion P routed to the end surface of the base substrate 10.

In the present embodiment, as shown in FIG. 4A, the resin film 34 is in contact with the flexible circuit board 45, and the inspection wiring L1'n is routed to the end surface of the base substrate 10. The case where the interlayer insulating film 21 and the edge of the barrier layer 3 are in contact with each other will be described as an example, but the present invention is not limited to this, and the resin film 34 is the flexible circuit board 45. If the inspection wiring L1'n covers the end portion P routed to the end surface of the base substrate 10 as well as being in contact with each other, both the end portion of the interlayer insulating film 21, the end portion of the barrier layer 3 and the end portion of the resin layer 12 It may be in contact with the end of the interlayer insulating film 21, the end of the barrier layer 3, the end of the resin layer 12, and the end of the adhesive layer 11, and the end of the interlayer insulating film 21. It may also be in contact with the end of the barrier layer 3, the end of the resin layer 12, the end of the adhesive layer 11, and the end of the base substrate 10.

In the present embodiment, the case where the resin film 34 is formed separately from the anisotropic conductive material 40 has been described as an example, but the present invention is not limited to this, and the resin film 34 is different. When the second terminal electrode E2n of the flexible circuit board 45 and the first terminal electrode T2n of the signal wiring L2n are electrically connected by using the rectangular conductive material 40, the anisotropic conductive material 40 overflows. And may be formed.

FIG. 4B is a diagram showing a schematic configuration of a portion of the display device 50 in which the first terminal electrode T2n of the signal wiring L2n and the second terminal electrode E2n of the flexible circuit board 45 are electrically connected. ..

The signal wiring L2n means each of the plurality of signal wirings L2 illustrated in FIG. 3A. As shown in FIG. 4B, the first terminal electrode T2n of the signal wiring L2n has an inorganic insulating film 16, an inorganic insulating film 18, an inorganic insulating film 20, and interlayer insulation contained in the thin film transistor layer 4. It is exposed from the film 21. The flexible circuit board 45 further includes a second terminal electrode E2n that is electrically connected to the first terminal electrode T2n of the signal wiring L2n. The second terminal electrode E2n of the flexible circuit board 45 and the first terminal electrode T2n of the signal wiring L2n are electrically connected via the anisotropic conductive material 40. The opening CON2 is an opening formed to expose the signal wiring L2n from the inorganic insulating film 18 and the inorganic insulating film 20, and the opening 21d is an opening formed by exposing the first terminal electrode T2n of the signal wiring L2n from the interlayer insulating film 21. An opening formed for exposure.

FIG. 5 is a diagram showing a schematic configuration of an end portion of the inspection wiring L1'n in the large substrate 50A before the dividing step, which includes a plurality of display devices 50.

FIG. 6 is a diagram showing a schematic configuration of a large substrate 50A before the dividing step, which includes a plurality of display devices 50.

As shown in FIGS. 5 and 6, in the large substrate 50A before the dividing step including a plurality of display devices 50, the inspection wiring L1'n is routed to the outside of the display device 50, and the inspection terminal ETn and the inspection terminal ETn and A short ring wiring SR is formed. By the division along the GH line in FIG. 5, in the display device 50, a divided end surface having an end portion P routed to the end surface of the base substrate 10 of the inspection wiring L1'n is formed.

As shown in FIGS. 5 and 6, the inspection wiring L1'n is a part of the short ring wiring SR. The short ring wiring SR includes an inspection wiring L1n, an inspection wiring L1'n, and a terminal portion ETn. After the inspection is performed using the terminal portion ETn of the inspection wiring L1'n exposed from the interlayer insulating film 21 by the opening 21e, division along the GH line in FIG. 5 can be performed. The short ring wiring SR is, for example, electrically connected to the inspection electrode L1Tn of the second terminal portion L1T of the inspection wiring L1 shown in FIG. 3A, and is connected to the inspection electrode L1Tn in the manufacturing process of the display device 50. It suppresses a short circuit due to static electricity that may occur at the inspection electrode L1Tn of the second terminal portion L1T.

In this embodiment, as shown in FIG. 3A, the inspection electrode L1Tn of the second terminal portion L1T of the inspection wiring L1 does not overlap with the flexible circuit board 45, for example. However, the present invention is not limited to this, and the inspection electrode L1Tn of the second terminal portion L1T of the inspection wiring L1 may be superimposed on the flexible circuit board 45.

Further, the flexible circuit board 45 may be a COF (Chip On Film) type flexible circuit board in which a drive circuit chip is mounted on the flexible circuit board 45.

As described above, after the dividing step, the end portion P of the inspection wiring L1 is exposed as it is on the divided end surface of the display device 50, but the end portion P overlaps with the flexible circuit board 45 and the resin film 34 is formed. , It is provided so as to be in contact with the flexible circuit board 45 and to cover the end portion P. When the resin film 34 is applied and formed, since the resin film 34 is supported by the flexible circuit board 45, the resin film 34 can be easily formed so as to cover the end portion P. Therefore, a highly reliable display device 50 can be realized.

[Embodiment 3]
Next, Embodiment 3 of the present invention will be described with reference to FIG. 7. In the display device 60 of the present embodiment, the second terminal portion L1T of the inspection wiring L1 is not provided, the flexible circuit board 55 has a T-shape, and the drive circuit chip 56 is mounted on the board. It is different from the first embodiment in that it uses a COF (Chip On Film) type flexible circuit board, and the others are as described in the first embodiment. For convenience of explanation, members having the same functions as the members shown in the drawings of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 7 is a plan view of the display device 60.

As shown in FIG. 7, the COF (Chip On Film) type flexible circuit board 55 having a T-shape and having the drive circuit chip 56 mounted on the board is the base board 10 ((1) in FIG. b) Overlap with one side of). The flexible circuit board 55 has a first portion that overlaps with the base substrate 10 and a second portion that does not overlap with the base substrate 10 and has a narrower width in the length direction of one side (left-right direction in the drawing) than the first portion. And have. The terminal portion T2 of the signal wiring L2 and the first terminal portion L1T'of the inspection wiring L1 overlap with the first portion.

The flexible circuit board 55 includes a fourth terminal electrode group E1 composed of a plurality of fourth terminal electrodes E1n, a second terminal electrode group E2 composed of a plurality of second terminal electrodes E2n, and an inspection input electrode 33. I have. The fourth terminal electrode E1n is electrically connected to the third terminal electrode L1T'n of the first terminal portion L1T'of the inspection wiring L1, and the second terminal electrode E2n is the first terminal of the terminal portion T2 of the signal wiring L2. It is electrically connected to the electrode T2n, and the inspection input electrode 33 is electrically connected to the fourth terminal electrode E1n via a connection wiring (not shown).

Since the display device 60 is provided with the inspection input electrode 33 on the flexible circuit board 55, it is easy to form the resin film 34 so as to cover the inspection input electrode 33. Further, the inspection wiring L1 and the signal wiring L2 are provided inside the end surface of the base substrate 10, and the third terminal electrode L1T'n of the first terminal portion L1T'of the inspection wiring L1 is the first of the flexible circuit board 55. By being electrically connected to the fourth terminal electrode E1n of the four-terminal electrode group E1, it is electrically connected to the inspection input electrode 33 provided outside the end surface of the base substrate 10. The first terminal electrode T2n of the terminal portion T2 of the signal wiring L2 is electrically connected to the second terminal electrode E2n of the second terminal electrode group E2 of the flexible circuit board 55 from the outside of the end surface of the base substrate 10. It is also possible to input a signal for controlling the light emitting element 5. Therefore, the inspection wiring L1 and the signal wiring L2 are not exposed on the divided end surface of the display device 60. Therefore, a highly reliable display device 60 can be realized.

[Summary]
[Aspect 1]
A display device including a substrate, a thin film transistor layer provided with transistors, a light emitting element, and a sealing layer.
A display area including the light emitting element and a frame area surrounding the display area are provided.
The frame region is provided with an inspection wiring for inspecting at least one of the transistor and the light emitting element, and a terminal portion of a signal wiring that contributes to light emission of the light emitting element.
A flexible circuit board including a second terminal electrode electrically connected to the first terminal electrode included in the terminal portion is further provided.
The inspection wiring has an end portion routed to the end face of the substrate.
The end is superimposed on the flexible circuit board.
A display device in which a resin film is provided so as to be in contact with the flexible circuit board and to cover the end portion.

[Aspect 2]
The display device according to aspect 1, wherein the inspection wiring is a part of the short ring wiring.

[Aspect 3]
A display device including a substrate, a thin film transistor layer provided with transistors, a light emitting element, and a sealing layer.
A display area including the light emitting element and a frame area surrounding the display area are provided.
The frame region is provided with an inspection wiring for inspecting at least one of the transistor and the light emitting element, a first terminal portion of the inspection wiring, and a terminal portion of a signal wiring that contributes to light emission of the light emitting element.
A flexible circuit board including a second terminal electrode electrically connected to the first terminal electrode included in the terminal portion is further provided.
The flexible circuit board
A fourth terminal electrode electrically connected to a third terminal electrode included in the first terminal portion, an inspection input electrode for inputting an inspection signal to the inspection wiring, and the fourth terminal electrode and the inspection input electrode. A display device that includes a connection wiring that electrically connects and.

[Aspect 4]
The flexible circuit board overlaps with one side of the board,
The flexible circuit board has a T-shape having a first portion and a second portion having a width narrower in the length direction of one side than the first portion in a plan view.
The display device according to aspect 3, wherein the terminal portion and the first terminal portion are superimposed on the first portion.

[Aspect 5]
A second terminal portion of the inspection wiring is provided in the frame area.
The display device according to any one of aspects 1 to 4, wherein the second terminal portion is provided with an inspection electrode exposed from the thin film transistor layer.

[Aspect 6]
The display device according to aspect 5, wherein the inspection electrode is superimposed on the flexible circuit board.

[Aspect 7]
The display device according to

aspect

5 or 6, wherein the inspection electrode is covered with a moisture-proof resin.

[Aspect 8]
The display device according to

aspect

1 or 2, wherein the resin film is a moisture-proof resin.

[Aspect 9]
The display device according to aspect 7 or 8, wherein the moisture-proof resin is an ultraviolet photocurable resin.

[Aspect 10]
The display device according to any one of aspects 1 to 9, wherein the flexible circuit board includes a drive circuit chip.

[Additional notes]
The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the embodiments obtained by appropriately combining the technical means disclosed in the different embodiments. Is also included in the technical scope of the present invention. Furthermore, new technical features can be formed by combining the technical means disclosed in each embodiment.

The present invention can be used as a display device.

1, 50, 60 Display device 4 Thin film transistor layer (TFT layer)
5 Light emitting element 6 Encapsulating layer 10 Base substrate (board)
32, 45, 55 Flexible circuit board 32Ln connection wiring 33 Inspection input electrode 34 Moisture-proof resin (resin film)
35 Moisture-proof resin 56 Drive circuit chips L1, L1n Inspection wiring L2, L2n Signal wiring T2 Signal wiring terminal L1T'Inspection wiring 1st terminal L1T Inspection wiring 2nd terminal L1Tn Inspection electrode T2n 1st terminal electrode E2n 1st 2 terminal electrode L1T'n 3rd terminal electrode E1n 4th terminal electrode L1'n wiring P Inspection wiring end SR short ring wiring DA display area NDA frame area

Claims

A display device including a substrate, a thin film transistor layer provided with transistors, a light emitting element, and a sealing layer.
A display area including the light emitting element and a frame area surrounding the display area are provided.
The frame region is provided with an inspection wiring for inspecting at least one of the transistor and the light emitting element, and a terminal portion of a signal wiring that contributes to light emission of the light emitting element.
A flexible circuit board including a second terminal electrode electrically connected to the first terminal electrode included in the terminal portion is further provided.
The inspection wiring has an end portion routed to the end face of the substrate.
The end is superimposed on the flexible circuit board.
A display device characterized in that a resin film is provided so as to be in contact with the flexible circuit board and to cover the end portion.
The display device according to claim 1, wherein the inspection wiring is a part of the short ring wiring.
A display device including a substrate, a thin film transistor layer provided with transistors, a light emitting element, and a sealing layer.
A display area including the light emitting element and a frame area surrounding the display area are provided.
The frame region is provided with an inspection wiring for inspecting at least one of the transistor and the light emitting element, a first terminal portion of the inspection wiring, and a terminal portion of a signal wiring that contributes to light emission of the light emitting element.
A flexible circuit board including a second terminal electrode electrically connected to the first terminal electrode included in the terminal portion is further provided.
The flexible circuit board
A fourth terminal electrode electrically connected to a third terminal electrode included in the first terminal portion, an inspection input electrode for inputting an inspection signal to the inspection wiring, and the fourth terminal electrode and the inspection input electrode. A display device characterized in that it includes a connection wiring that electrically connects and.
The flexible circuit board overlaps with one side of the board,
The flexible circuit board has a T-shape having a first portion and a second portion having a width narrower in the length direction of one side than the first portion in a plan view.
The display device according to claim 3, wherein the terminal portion and the first terminal portion overlap with the first portion.
A second terminal portion of the inspection wiring is provided in the frame area.
The display device according to any one of claims 1 to 4, wherein the second terminal portion is provided with an inspection electrode exposed from the thin film transistor layer.
The display device according to claim 5, wherein the inspection electrode is superimposed on the flexible circuit board.
The display device according to claim 5 or 6, wherein the inspection electrode is covered with a moisture-proof resin.
The display device according to claim 1 or 2, wherein the resin film is a moisture-proof resin.
The display device according to claim 7 or 8, wherein the moisture-proof resin is an ultraviolet photocurable resin.
The display device according to any one of claims 1 to 9, wherein the flexible circuit board includes a drive circuit chip.