WO2019174136A1 - 像素单元及其制作方法、显示装置 - Google Patents

像素单元及其制作方法、显示装置 Download PDF

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WO2019174136A1
WO2019174136A1 PCT/CN2018/089933 CN2018089933W WO2019174136A1 WO 2019174136 A1 WO2019174136 A1 WO 2019174136A1 CN 2018089933 W CN2018089933 W CN 2018089933W WO 2019174136 A1 WO2019174136 A1 WO 2019174136A1
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drain
pixel
film transistor
gate
thin film
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PCT/CN2018/089933
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French (fr)
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周志超
夏慧
陈梦
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深圳市华星光电半导体显示技术有限公司
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Priority to US16/096,946 priority Critical patent/US11322527B2/en
Publication of WO2019174136A1 publication Critical patent/WO2019174136A1/zh

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    • HELECTRICITY
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    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1251Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • G02F1/134309Electrodes characterised by their geometrical arrangement
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136227Through-hole connection of the pixel electrode to the active element through an insulation layer
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/1288Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
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    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/1296Multistep manufacturing methods adapted to increase the uniformity of device parameters

Definitions

  • the pixel electrode includes a plurality of arc-shaped electrode units distributed in a radial array in a circumferential direction of the thin film transistor, and the electrode units are electrically connected.
  • each of the drains includes two arc-shaped first drains and second drains, and the arc-shaped openings of the first drain and the second drain are oppositely disposed, the first drain And the second drain is electrically connected to the data line through a line,
  • a source is fabricated on the active layer, and a scan line and a gate are formed between the drain and the source, specifically, deposition by physical vapor deposition or electron beam evaporation or steaming.
  • the present invention has an advantage in that the present invention adopts a ring-shaped pixel (similar to a concentric circle) design to make the liquid crystal alignment closer to isotropic, and selects different rings on the main pixel region and the sub-pixel region.
  • the vertical thin film transistor design utilizes the difference in W/L and the difference in capacitance to cause the main pixel electrode and the sub-pixel electrode to obtain different potentials, thereby increasing the viewing angle and improving the color shift.
  • the other electrode units are respectively distributed in a radial array, and the arcuate opening of the electrode unit 1321 faces the center of the corresponding gate 1311. All of the electrode units 1321 are concentrically arranged and integrally enclosed in a concentric annular structure.
  • the thin film transistor adopts a vertical structure, and has no overlapping area of the gate and the source and the drain, thereby reducing the parasitic capacitance and the transistor size of the transistor.
  • the active layer 1413 includes two oppositely disposed U-shaped structures respectively corresponding to the junctions of the drain cells and the data lines 12.
  • the embodiment of the present application further discloses a display device including a plurality of pixel units distributed in an array.
  • Fig. 1b the left diagram is a cross-sectional view of A-A in Fig. 1a, and the right diagram is a cross-sectional view of B-B in Fig. 1a.
  • the active layers 1313 and 1413 are formed.
  • the method may be: removing the photoresist, forming the active layer by sol gel, chemical vapor deposition or physical vapor deposition, and then forming the active layer 1313 by exposure etching. 1413 pattern.
  • the active layer material may be an oxide semiconductor, amorphous silicon, and polycrystalline silicon typified by IGZO, or may be an organic semiconductor.
  • a passivation layer (PV) 1315, 1415 is deposited, and a plurality of annular pixel electrodes 132 and 142 are formed around the source surface and the source.
  • the pixel electrodes 132 and 142 are formed by first forming a pixel electrode pattern on the passivation layer, then depositing a layer of metal by physical vapor deposition, and then performing exposure etching to form a pixel electrode.
  • the present invention adopts different vertical TFT designs in the main pixel region and the sub-pixel region, and can obtain different pixel potentials, and the liquid crystals are arranged in a ring, which is relatively easy to improve the color shift and the viewing angle of the VA liquid crystal display. .

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Abstract

本申请公开了一种像素单元,包括薄膜晶体管、以及与薄膜晶体管对应的像素电极,像素电极与薄膜晶体管的源极连接,所述像素电极包括多个弧形的电极单元,该多个弧形的电极单元沿径向阵列分布于薄膜晶体管的周向,电极单元之间电性连接。本申请还公开了一种像素单元的制作方法和显示装置。本发明采用环形像素(类似于同心圆)设计使液晶排列更接近于各向同性,并通过在主像素区和次像素区上选择不同的环形垂直薄膜晶体管设计,利用其W/L的差异和电容的差异,使主像素电极和次像素电极来获得不同的电位,从而增大视野角和改善色偏。

Description

像素单元及其制作方法、显示装置 技术领域
本申请涉及显示技术领域,特别是涉及一种像素单元及其制作方法、显示装置。
背景技术
作为当前常用的一款显示装置,LCD(Liquid Crystal Display,液晶显示器)包括相对间隔的两个基板以及填充于其间的液晶层。LCD通过施加电压到两基板上的像素电极和公共电极而在产生电场,电场控制液晶层中的液晶分子偏转并结合入射光的偏振以显示图像。
当前,VA(Vertical Alignment,垂直配向)模式的LCD由于具有高对比度和大视角等优点脱颖而出,然而,为了使得侧面观看与正面观看的品质相接近,VA面板的一个像素通常被划分为两个子像素,且两个子像素的灰阶电压不同,这导致了两者所处区域的透光率不同,从而会在大视角显示时出现色偏(Color Shift)现象,影响显示品质。
发明内容
本发明的目的在于提供一种像素单元及其制作方法、显示装置,以克服现有技术中的不足。
为实现上述目的,本发明提供如下技术方案:
本申请实施例公开一种像素单元,包括薄膜晶体管、以及与薄膜晶体管对应的像素电极,像素电极与薄膜晶体管的源极连接,
所述像素电极包括多个弧形的电极单元,该多个弧形的电极单元沿径向阵列分布于薄膜晶体管的周向,电极单元之间电性连接。
优选的,在上述的像素单元中,所述薄膜晶体管为垂直结构的薄膜晶体管,包括栅极、源极、有源层和漏极,所述源极与栅极在竖直方向的投影区不重叠,所述漏极与栅极在竖直方向的投影区不重叠。
优选的,在上述的像素单元中,所述源极、有源层和漏极绕设于所述栅极周向,所述源极、有源层和漏极上下叠加设置,多个所述电极单元以所述栅极为圆心径向阵列分布。
优选的,在上述的像素单元中,所述像素单元包括扫描线、数据线、以及由所述扫描线和数据线定义的主像素区和次像素区。
优选的,在上述的像素单元中,所述像素电极的弧形开口面向对应的薄膜晶体管的圆心,该像素电极中,一个电极单元的头部与径向相邻电极单元之间的尾部电性连接。
优选的,在上述的像素单元中,所述像素电极的弧形开口背离对应的薄膜晶体管的圆心。
优选的,在上述的像素单元中,所述薄膜晶体管中,每个漏极分别包括两个弧形的第一漏极和第二漏极,所述第一漏极和第二漏极的弧形开口相对设置,所述第一漏极和第二漏极分别通过一支线电性连接于所述数据线,栅极构成所述扫描线的一部分,并位于所述第一漏极和第二漏极围成的区域内。
优选的,在上述的像素单元中,所述薄膜晶体管中,每个漏极分别包括四个弧形的漏极单元,漏极单元的弧形开口朝外,漏极单元之间首尾相接并围成一闭合区域,该漏极单元构成数据线的一部分,闭合区域内设置的栅极构成扫描线的一部分。
相应的,本申请还公开了一种显示装置,包括阵列分布的所述的像素单元。
本申请还公开了一种像素单元的制作方法,包括:
(1)、在同一制程中,采用物理气相沉积方法在基体上先沉积一层金属,利用光刻胶图案作为掩模,然后曝光刻蚀形成数据线和并在主像素区和次像素区分别形成漏极,其中,
主像素区中,每个漏极分别包括两个弧形的第一漏极和第二漏极,所述第一漏极和第二漏极的弧形开口相对设置,所述第一漏极和第二漏极分别通过一支线电性连接于所述数据线,
次像素区中,每个漏极分别包括四个弧形的漏极单元,漏极单元的弧形开口朝外,漏极单元之间首尾相接并围成一闭合区域,该漏极单元构成数据线的一部分;
(2)、剥离掉光刻胶,采用溶胶凝胶、化学气相沉积或物理气相沉积的方法制作有源层,然后采用曝光刻蚀的方式在漏极上形成有源层,其中,
主像素区中,有源层包括两个弧形的结构,分别对应形成于第一漏极和第二漏极的顶面,有源层的形状与第一漏极和第二漏极的形状匹配,
次像素区中,有源层包括两个相对设置的U形的结构,分别对应形成于漏极单元和数据线的接合处;
(3)、在同一制程中,在有源层上制作源极,同时在漏极和源极之间制作扫描线和栅极,具体地,先使用物理气相沉积方法沉积或者电子束蒸发或者蒸镀一层金属,然后通过曝光和刻蚀的方式去除多余的金属,在栅极形成的区域,此处曝光可以用能够形成不同光刻胶厚度的半色调掩模或者灰阶掩膜,其中,
主像素区中,扫描线穿设在第一漏极和第二漏极的缝隙之间,栅极位于第一漏极和第二漏极围成的区域中心,栅极构成扫描线的一部分,
次像素区中,扫描线穿设在有源层的缝隙之间,栅极位于漏极单元围成的区域中心,栅极构成扫描线的一部分,
在主像素区和次像素区中,源极、有源层和漏极绕设于栅极周向,源极、有源层和漏极上下叠加设置,源极与栅极在竖直方向的投影区不重叠,漏极与栅极在竖直方向的投影区不重叠;
(4)、沉积钝化层,然后在钝化层上形成像素电极图案,再采用物理气相沉积方法沉积一层金属,最后曝光刻蚀在源极表面以及源极的四周制作多条环形的像素电极,其中,
在主像素区和次像素区中,像素电极包括多个弧形的电极单元,该多个弧形的电极单元沿径向阵列分布于薄膜晶体管的周向,电极单元之间电性连接。
与现有技术相比,本发明的优点在于:本发明采用环形像素(类似于同心圆)设计使液晶排列更接近于各向同性,并通过在主像素区和次像素区上选择不同的环形垂直薄膜晶体管设计,利用其W/L的差异和电容的差异,使主像素电极和次像素电极来获得不同的电位,从而增大视野角和改善色偏。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请中记载的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1a所示为本发明具体实施例中制作的漏极和数据线的俯视图;
图1b所示为图1a中A-A和B-B的剖视图;
图2a所示为本发明具体实施例中制作的有源层的俯视图;
图2b所示为图1a中A-A和B-B的剖视图;
图3a所示为本发明具体实施例中制作的扫描线、栅极和源极的俯视图;
图3b所示为图1a中A-A和B-B的剖视图;
图4a所示为本发明具体实施例中制作的像素电极的俯视图;
图4b所示为图1a中A-A和B-B的剖视图;
图5所示为本发明具体实施例中显示装置的像素单元示意图。
具体实施方式
下面将结合附图对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实 施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
在本发明的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”、“第三”仅用于描述目的,而不能理解为指示或暗示相对重要性。
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。
结合图1a、图3a、图4a和图5所示,在一实施例中,像素单元10包括扫描线11和数据线12,扫描线11和数据线12定义有主像素区13和次像素区14。
扫描线11和数据线12之间垂直且绝缘设置。
每个主像素区13分别包括一主薄膜晶体管131、以及与主薄膜晶体管131对应连接的第一像素电极132。
主薄膜晶体管131为垂直结构的薄膜晶体管,包括栅极1311、源极1312、有源层1313和漏极1314,源极1312与栅极1311在竖直方向的投影区不重叠,漏极1314与栅极1311在竖直方向的投影区不重叠。
该技术方案中,薄膜晶体管采用垂直结构,栅极和源漏极的无重叠面积,从而降低了晶体管的寄生电容和晶体管尺寸。
在一具体实施例中,源极1312、有源层1313和漏极1314绕设于栅极1311周向,源极1312、有源层1313和漏极1314上下叠加设置。
进一步地,每个漏极1314分别包括两个弧形的第一漏极1315和第二漏极1316,第一漏极1315和第二漏极1316的弧形开口相对设置,第一漏极1315和第二漏极1316之间间隔设置。
第一漏极1315和第二漏极1316分别通过一支线121电性连接于数据线12。
在一实施例中,两个支线121平行设置。
栅极1311构成扫描线11的一部分,并位于第一漏极1315和第二漏极1315围成的区域内。扫描线11穿设于第一漏极1315和第二漏极1316之间的间隔空间。
在一实施例中,扫描线11、栅极1311和漏极1314形成于同一平面内。
有源层1313包括两个弧形(半圆形)的结构,分别对应形成于第一漏极1315和第二漏极1315的顶面,有源层1313的形状与第一漏极1315和第二漏极1315的形状匹配。
源极1312包括两个弧形(半圆形)的结构,分别对应形成于有源层的顶面,源极1312的形状与第一漏极1315和第二漏极1315的形状匹配。
扫描线11穿设在第一漏极1315和第二漏极1315的缝隙之间,栅极1311位于第一漏极1315和第二漏极1315围成的区域中心,栅极1311构成扫描线11的一部分,栅极1311优选为圆形。
第一像素电极132包括多个弧形的电极单元1321,其中两个电极单元1321分别直接形成在两个弧形源极1312的顶面,并与源极1312之间电性连接。
其他的电极单元分别沿径向阵列分布,电极单元1321的弧形开口面向对应的栅极1311的圆心。所有的电极单元1321同心设置,整体围成同心圆环结构。
第一像素电极132包括两部分,分别对应于两个漏极,两部分电极单元分别对称在扫描线11的两侧,每部分的电极单元之间电性连接。
在优选的实施例中,每部分的电极单元中,一个电极单元的头部与径向相邻电极单元之间的尾部电性连接,整体形成一曲线弯折的电极结构。
每个主像素区14分别包括一次薄膜晶体管141、以及与次薄膜晶体管141对应连接的第二像素电极142。
次薄膜晶体管141为垂直结构的薄膜晶体管,包括栅极1411、源极1412、有源层1413和漏极1414,源极1412与栅极1411在竖直方向的投影区不重叠,漏极1414与栅极1411在竖直方向的投影区不重叠。
该技术方案中,薄膜晶体管采用垂直结构,栅极和源漏极的无重叠面积,从而降低了晶体管的寄生电容和晶体管尺寸。
在一具体实施例中,源极1412、有源层1413和漏极1414绕设于栅极1411周向,源极1412、有源层1413和漏极1414上下叠加设置。
进一步地,每个漏极1414分别包括四个弧形的漏极单元1415,漏极单元1415的弧形开口朝外,漏极单元1415之间首尾相接并围成一闭合区域,该漏极单元1415构成数据线12的一部分,闭合区域内设置的栅极1411构成扫描线11a的一部分。
有源层1413包括两个相对设置的U形的结构,分别对应形成于漏极单元和数据线12的接合处。
源极1412包括两个相对设置的U形的结构,分别对应形成于有源层的顶面,源极1412的形状与有源层的形状匹配。
扫描线11a穿设在有源层的缝隙之间,栅极1411位于漏极单元1415围成的区域中心,栅极1411构成扫描线11a的一部分,栅极1411优选为矩形,更优选为正方形。
第二像素电极142包括多个弧形的电极单元1421,其中四个电极单元1421电性连接构成两个U形结构,分别直接形成在源极1412的顶面,并与源极1412之间电性连接。
其他的电极单元分别沿径向阵列分布,电极单元1421的弧形开口背离对应的栅极1411的圆心。所有的电极单元整体呈米字形发散设置。
进一步地,电极单元包括两部分,该两部分电极单元对称分布于扫描线11a的两侧。每部分的电极单元之间电性连接。
在优选的实施例中,每部分的电极单元中,通过一连接线依次与每个电极单元电性连接。
本申请实施例还公开了一种显示装置,包括阵列分布的多个像素单元。
上述像素单元的制作方法,包括:
s1、结合图1a和图1b所示,在同一制程中,在基体15上形成数据线12、漏极1314和漏极1414。
在一实施例中,可以采用物理气相沉积方法先沉积一层金属,利用光刻胶图案作为掩模,然后曝光刻蚀形成漏极图形。
图1b中,左图为图1a中A-A的剖视图,右图图1a中为B-B的剖视图。
s2、结合图2a和图2b所示,制作形成有源层1313和1413。
在一实施例中,其制作方法可以为:剥离掉光刻胶,采用溶胶凝胶、化学气相沉积或物理气相沉积的方法制作有源层,然后采用曝光刻蚀的方式形成有源层1313和1413图案。有源层材料可以是以IGZO为代表的氧化物半导体、非晶硅和多晶硅,也可以是有机物半导体。
图2b中,左图为图2a中A-A的剖视图,右图图2a中为B-B的剖视图。
s3、结合图3a和图3b所示,在同一制程中,在有源层上制作源极1312和1412,同时在漏极和源极之间制作扫描线11、11a和栅极1311、1411。
在一实施例中,源极、扫描线和栅极的制作可以先使用物理气相沉积(PVD)方法沉积或者电子束蒸发或者蒸镀一层金属,然后通过曝光和刻蚀的方式去除多余的金属。在金属线上形成一个区域(比如栅极线区域),其厚度需要厚于其他位置的金属,此处曝光可以用能够形成不同光刻胶厚度的半色调掩模(Half-ToneMask)或者灰阶掩膜(Gray-Tone Mask)。
S4、结合图4a和图4b所示,沉积钝化层(PV)1315、1415,并在源极表面以及源极的四周制作多条环形的像素电极132和142。
在一实施例中,像素电极132和142的制作方法:首先在钝化层上形成像素电极图案,然后采用物理气相沉积方法先沉积一层金属,然后曝光刻蚀形成像素电极。
综上所述,本发明在主像素区和次像素区上采用了不同的垂直TFT设计,能获得不同的像素电位,同时液晶环形排列,比较容易改善VA型液晶显示器的色偏和视野角等。
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。

Claims (20)

  1. 一种像素单元,其中,包括薄膜晶体管、以及与薄膜晶体管对应的像素电极,像素电极与薄膜晶体管的源极连接,
    所述像素电极包括多个弧形的电极单元,该多个弧形的电极单元沿径向阵列分布于薄膜晶体管的周向,电极单元之间电性连接。
  2. 根据权利要求1所述的像素单元,其中,所述薄膜晶体管为垂直结构的薄膜晶体管,包括栅极、源极、有源层和漏极,所述源极与栅极在竖直方向的投影区不重叠,所述漏极与栅极在竖直方向的投影区不重叠。
  3. 根据权利要求2所述的像素单元,其中,所述源极、有源层和漏极绕设于所述栅极周向,所述源极、有源层和漏极上下叠加设置,多个所述电极单元以所述栅极为圆心径向阵列分布。
  4. 根据权利要求1所述的像素单元,其中,所述像素单元包括扫描线、数据线、以及由所述扫描线和数据线定义的主像素区和次像素区。
  5. 根据权利要求4所述的像素单元,其中,所述像素电极的弧形开口面向对应的薄膜晶体管的圆心,该像素电极中,一个电极单元的头部与径向相邻电极单元之间的尾部电性连接。
  6. 根据权利要求4所述的像素单元,其中,所述像素电极的弧形开口背离对应的薄膜晶体管的圆心。
  7. 根据权利要求4所述的像素单元,其中,
    所述薄膜晶体管中,每个漏极分别包括两个弧形的第一漏极和第二漏极,所述第一漏极和第二漏极的弧形开口相对设置,所述第一漏极和第二漏极分别通过一支线电性连接于所述数据线,栅极构成所述扫描线的一部分,并位于所述第一漏极和第二漏极围成的区域内。
  8. 根据权利要求2所述的像素单元,其中,所述像素单元包括扫描线、数据线、以及由所述扫描线和数据线定义的主像素区和次像素区。
  9. 根据权利要求8所述的像素单元,其中,所述像素电极的弧形开口面向对应的薄膜晶体管的圆心,该像素电极中,一个电极单元的头部与径向相邻电极单元之间的尾部电性连接。
  10. 根据权利要求8所述的像素单元,其中,所述像素电极的弧形开口背离对应的薄膜晶体管的圆心。
  11. 根据权利要求8所述的像素单元,其中,
    所述薄膜晶体管中,每个漏极分别包括两个弧形的第一漏极和第二漏极,所述第一漏极和第二漏极的弧形开口相对设置,所述第一漏极和第二漏极分别通过一支线电性连接于所述数据线,栅极构成所述扫描线的一部分,并位于所述第一漏极和第二漏极围成的区域内。
  12. 根据权利要求3所述的像素单元,其中,所述像素单元包括扫描线、数据线、以及由所述扫描线和数据线定义的主像素区和次像素区。
  13. 根据权利要求12所述的像素单元,其中,所述像素电极的弧形开口面向对应的薄膜晶体管的圆心,该像素电极中,一个电极单元的头部与径向相邻电极单元之间的尾部电性连接。
  14. 根据权利要求12所述的像素单元,其中,所述像素电极的弧形开口背离对应的薄膜晶体管的圆心。
  15. 根据权利要求12所述的像素单元,其中,
    所述薄膜晶体管中,每个漏极分别包括两个弧形的第一漏极和第二漏极,所述第一漏极和第二漏极的弧形开口相对设置,所述第一漏极和第二漏极分别通过一支线电性连接于所述数据线,栅极构成所述扫描线的一部分,并位于所述第一漏极和第二漏极围成的区域内。
  16. 根据权利要求4所述的像素单元,其中,
    所述薄膜晶体管中,每个漏极分别包括四个弧形的漏极单元,漏极单元的弧形开口朝外,漏极单元之间首尾相接并围成一闭合区域,该漏极单元构成数据线的一部分,闭合区域内设置的栅极构成扫描线的一部分。
  17. 根据权利要求8所述的像素单元,其中,
    所述薄膜晶体管中,每个漏极分别包括四个弧形的漏极单元,漏极单元的弧形开口朝外,漏极单元之间首尾相接并围成一闭合区域,该漏极单元构成数据线的一部分,闭合区域内设置的栅极构成扫描线的一部分。
  18. 根据权利要求12所述的像素单元,其中,
    所述薄膜晶体管中,每个漏极分别包括四个弧形的漏极单元,漏极单元的弧形开口朝外,漏极单元之间首尾相接并围成一闭合区域,该漏极单元构成数据线的一部分,闭合区域内设置的栅极构成扫描线的一部分。
  19. 一种显示装置,其中,包括阵列分布的权利要求1所述的像素单元。
  20. 一种像素单元的制作方法,其中,包括:
    (1)、在同一制程中,采用物理气相沉积方法在基体上先沉积一层金属,利用光刻胶图案作为掩模,然后曝光刻蚀形成数据线和并在主像素区和次像素区分别形成漏极,其中,
    主像素区中,每个漏极分别包括两个弧形的第一漏极和第二漏极,所述第一漏极和第二漏极的弧形开口相对设置,所述第一漏极和第二漏极分别通过一支线电性连接于所述数据线,
    次像素区中,每个漏极分别包括四个弧形的漏极单元,漏极单元的弧形开口朝外,漏极单元之间首尾相接并围成一闭合区域,该漏极单元构成数据线的一部分;
    (2)、剥离掉光刻胶,采用溶胶凝胶、化学气相沉积或物理气相沉积的方法制作有源层,然后采用曝光刻蚀的方式在漏极上形成有源层,其中,
    主像素区中,有源层包括两个弧形的结构,分别对应形成于第一漏极和第二漏极的顶面,有源层的形状与第一漏极和第二漏极的形状匹配,
    次像素区中,有源层包括两个相对设置的U形的结构,分别对应形成于漏极单元和数据线的接合处;
    (3)、在同一制程中,在有源层上制作源极,同时在漏极和源极之间制作扫描线和栅极,具体地,先使用物理气相沉积方法沉积或者电子束蒸发或者蒸镀一层金属,然后通过曝光和刻蚀的方式去除多余的金属,在栅极形成的区域,此处曝光可以用能够形成不同光刻胶厚度的半色调掩模或者灰阶掩膜,其中,主像素区中,扫描线穿设在第一漏极和第二漏极的缝隙之间,栅极位于第一漏极和第二漏极围成的区域中心,栅极构成扫描线的一部分,
    次像素区中,扫描线穿设在有源层的缝隙之间,栅极位于漏极单元围成的区域中心,栅极构成扫描线的一部分,
    在主像素区和次像素区中,源极、有源层和漏极绕设于栅极周向,源极、有源层和漏极上下叠加设置,源极与栅极在竖直方向的投影区不重叠,漏极与栅极在竖直方向的投影区不重叠;
    (4)、沉积钝化层,然后在钝化层上形成像素电极图案,再采用物理气相沉积方法沉积一层金属,最后曝光刻蚀在源极表面以及源极的四周制作多条环形的像素电极,其中,
    在主像素区和次像素区中,像素电极包括多个弧形的电极单元,该多个弧形的电极单元沿径向阵列分布于薄膜晶体管的周向,电极单元之间电性连接。
PCT/CN2018/089933 2018-03-13 2018-06-05 像素单元及其制作方法、显示装置 WO2019174136A1 (zh)

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