WO2019163191A1 - Dispositif de centrage, procédé de centrage, dispositif de traitement de substrat, et procédé de traitement de substrat - Google Patents

Dispositif de centrage, procédé de centrage, dispositif de traitement de substrat, et procédé de traitement de substrat Download PDF

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Publication number
WO2019163191A1
WO2019163191A1 PCT/JP2018/037877 JP2018037877W WO2019163191A1 WO 2019163191 A1 WO2019163191 A1 WO 2019163191A1 JP 2018037877 W JP2018037877 W JP 2018037877W WO 2019163191 A1 WO2019163191 A1 WO 2019163191A1
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WIPO (PCT)
Prior art keywords
substrate
pusher
centering
spin base
contact
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PCT/JP2018/037877
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English (en)
Japanese (ja)
Inventor
通矩 岩尾
憲幸 菊本
藤田　直人
渉 酒井
Original Assignee
株式会社Ｓｃｒｅｅｎホールディングス
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Publication of WO2019163191A1 publication Critical patent/WO2019163191A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Definitions

  • the present invention relates to a centering device and a centering method for bringing the center of a substrate closer to the center of rotation of the substrate.
  • the present invention also relates to a substrate processing apparatus including a centering apparatus and a substrate processing method including a centering method.
  • substrates to be processed include semiconductor wafers, liquid crystal display substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, solar cell substrates, and organic EL (electroluminescence) substrates.
  • FPD Full Panel Display
  • Patent Document 1 discloses a single-wafer type substrate processing system that processes substrates one by one.
  • This substrate processing system includes a substrate processing unit in which a bevel processing apparatus that performs bevel processing and a substrate positioning apparatus that positions a substrate are incorporated.
  • the bevel processing apparatus includes a rotating part provided with a vacuum chuck part and a drain cup for receiving the processing liquid used for the bevel processing and discharging it to the outside of the bevel processing apparatus.
  • the substrate positioning device described in Patent Document 1 includes a first drive unit that can linearly move a first reference unit that contacts the side surface of the substrate in the radial direction of the substrate, and a first contact unit that contacts the side surface of the substrate. And a second driving unit capable of linearly moving the two reference portions in the radial direction of the substrate.
  • the first and second drive units are disposed below the drain cup. Some of these are arranged outside the outer peripheral surface of the drain cup.
  • the first and second reference portions of the substrate positioning device are horizontally opposed.
  • the first and second reference portions are driven toward the substrate in a state where the substrate is not attracted to the vacuum chuck portion, and the side surface of the substrate To touch.
  • the substrate is horizontally sandwiched between the first and second reference portions. In this state, the first and second reference portions move horizontally together with the substrate, and the substrate is positioned.
  • the first and second reference portions contact the substrate on the vacuum chuck portion in a state where the substrate is not attracted to the vacuum chuck portion. Therefore, the substrate may move due to contact between the first and second reference portions and the substrate, and may be sandwiched between the first and second reference portions in a state where the substrate is displaced from an assumed position. In this case, since the positioning is performed with the substrate being displaced, the positioning accuracy is lowered.
  • one of the objects of the present invention is to provide a centering device, a centering method, a substrate processing apparatus, and a substrate processing method capable of centering a substrate with higher accuracy.
  • One embodiment of the present invention is disposed below a disk-shaped substrate, and generates a spin base that horizontally supports the substrate and an adsorption force that adsorbs the substrate on the spin base to the spin base.
  • an adsorption device for fixing the substrate to the spin base, and a spin motor for rotating the spin base around a vertical rotation axis passing through a central portion of the substrate in a state where the substrate is fixed to the spin base A pusher that moves the substrate horizontally relative to the spin base by pushing the substrate on the spin base, a non-contact position where the pusher is separated from the substrate on the spin base, and the pusher A center that is in contact with the outer periphery of the substrate on the spin base and has completed the movement of the substrate relative to the spin base.
  • a centering actuator that moves the pusher between the non-contact position and the centering position, and the pusher is moved from a non-contact state in which the pusher is separated from the substrate.
  • a contact confirmation unit for confirming that the pusher has reached a contact position where the pusher switches to a contact state in contact with the outer peripheral portion of the substrate, and fixing for fixing the substrate to the spin base by generating the suction force in the suction device. The suction device so that the centering actuator moves the pusher from the non-contact position to the contact position in a state where the substrate is fixed to the spin base by the suction force of the suction device and the execution step.
  • a contact step for controlling the centering actuator and in the contact step, After the contact confirmation unit confirms that the shear has reached the contact position, the fixation release step for releasing the fixation of the substrate to the spin base by the suction device, and the fixation of the substrate to the spin base are released.
  • the suction device and the centering actuator are controlled so that the centering actuator moves the pusher to the centering position, the substrate is moved horizontally with respect to the spin base, and the rotation axis is
  • a centering device comprising: a control device that executes a push step of reducing the amount of eccentricity of the substrate.
  • the pusher moves from the non-contact position to the contact position and contacts the outer peripheral portion of the substrate on the spin base. Thereafter, the substrate is pushed by the pusher and moves horizontally with respect to the spin base. As a result, the center of the substrate approaches the center of rotation of the substrate corresponding to the rotation axis. When the pusher reaches the centering position, the pusher stops and the movement of the substrate relative to the spin base is completed. In this way, the center of the substrate is brought closer to the center of rotation of the substrate, and the amount of eccentricity of the substrate with respect to the rotation axis is reduced.
  • the substrate is fixed to the spin base. Therefore, even if the pusher contacts the substrate, the substrate does not move relative to the spin base.
  • the fixing of the substrate to the spin base is released after the pusher contacts the substrate. Thereafter, the pusher is disposed at the centering position, and the center of the substrate is brought close to the rotation center of the substrate. Therefore, it is possible to prevent the displacement of the substrate caused by the contact between the pusher and the substrate, and to improve the centering accuracy of the substrate.
  • the centering actuator may be a linear actuator that horizontally moves the pusher or a rotary actuator that linearly moves the pusher. Since the position of the pusher can be controlled with high accuracy, the centering actuator is preferably an electric actuator.
  • the centering actuator is a rotary actuator, when the pusher is moved linearly in a horizontal direction, a conversion mechanism (for example, a ball screw mechanism) that converts the rotation of the rotary actuator into a linear motion of the pusher may be provided.
  • At least one of the following features may be added to the centering device.
  • the centering actuator can be switched between a plurality of modes including a thrust control mode that continues to move the pusher while controlling the thrust applied to the pusher, and a positioning mode that moves the pusher to a predetermined set position. And the control device executes the contact step while setting the centering actuator in the thrust control mode, and executes the push step while setting the centering actuator in the positioning mode.
  • the centering actuator is driven in the thrust control mode from the non-contact position to the contact position. From the contact position to the centering position, the centering actuator is driven in the positioning mode. In the thrust control mode, the centering actuator continues to move the pusher while controlling the thrust applied to the pusher. Therefore, the force applied to the substrate from the pusher when the pusher contacts the substrate can be reduced. In the positioning mode, the centering actuator moves the pusher to a predetermined setting position, that is, the centering position. Therefore, the pusher can be positioned at the centering position with higher accuracy.
  • the thrust control mode may be a mode that keeps moving the pusher while applying a constant thrust to the pusher, or a mode that keeps moving the pusher while changing the thrust applied to the pusher.
  • the positioning mode may be a mode in which the pusher is moved to the set position while applying a constant thrust to the pusher, or a mode in which the pusher is moved to the set position while changing the thrust applied to the pusher. Good.
  • the thrust applied from the centering actuator to the pusher may be larger, smaller, or equal to the thrust applied from the centering actuator to the pusher when the centering actuator is in the positioning mode.
  • the control device controls the centering actuator such that a thrust applied from the centering actuator to the pusher in the contact step is smaller than a thrust applied from the centering actuator to the pusher in the push step.
  • the thrust applied to the pusher when the pusher is moved from the non-contact position to the contact position is smaller than the thrust applied to the pusher when the pusher is moved from the contact position to the centering position. Therefore, the pusher contacts the substrate on the spin base with a small thrust applied to the pusher. Therefore, the impact generated by the contact between the pusher and the substrate can be reduced, and the amount of elastic deformation of the pusher and the substrate can be reduced. If the amount of elastic deformation of the pusher and the substrate is small, the substrate does not move with respect to the spin base with a large amount of movement even if the fixation of the substrate to the spin base is released while the pusher is in contact with the substrate. Therefore, the centering accuracy of the substrate can be increased.
  • the thrust applied to the pusher when the pusher is moving from the non-contact position to the contact position may be constant or may be changed.
  • the thrust applied to the pusher when the pusher is moving from the contact position to the centering position may be constant or may be changed.
  • it is sufficient that the thrust applied to the pusher when the pusher reaches the contact position is smaller than the maximum value of the thrust applied to the pusher when the pusher is moving from the contact position to the centering position.
  • the centering actuator is a linear motor that moves the pusher horizontally and linearly.
  • the pusher since the pusher moves horizontally in a straight line, the volume of the space through which the pusher passes can be reduced. Furthermore, if the linear motion of the linear motor is transmitted to the pusher, the pusher moves linearly, and therefore a mechanism for converting the linear motion of the linear motor need not be provided. Thereby, a centering apparatus can be reduced in size. In addition, since the linear motor, which is an example of the electric actuator, moves the pusher, the position of the pusher can be controlled with high accuracy.
  • the centering device further includes an eccentricity detection unit that detects an eccentricity amount of the substrate with respect to the rotation axis without contacting the substrate on the spin base, and the centering position is a detection value of the eccentricity detection unit. Is set based on
  • the amount of eccentricity of the substrate with respect to the rotation axis that is, the shortest distance from the rotation axis to the center of the substrate is detected.
  • the centering actuator moves the substrate horizontally with respect to the spin base by a movement amount based on the detection value of the eccentricity detection unit.
  • the substrate is centered.
  • the amount of eccentricity is detected without contact with the substrate, it is difficult for the substrate to move relative to the spin base during or after the detection of the amount of eccentricity. Therefore, the amount of eccentricity of the substrate can be detected with higher accuracy.
  • the contact confirmation unit includes a position sensor that detects the position of the pusher.
  • the position of the pusher is detected.
  • the position of the pusher changes with time. If the pusher is not moving, the position of the pusher does not change.
  • the substrate is fixed to the spin base. Therefore, when the pusher reaches the contact position, the pusher stops at the contact position. Therefore, by detecting the position of the pusher, it can be directly confirmed that the pusher is located at the contact position.
  • the contact confirmation unit includes a timer that measures an elapsed time from the time when the centering actuator starts to apply thrust to the pusher located at the non-contact position.
  • the pusher when the pusher starts to move toward the contact position, the elapsed time from that point is measured.
  • the pusher When the pusher reaches the contact position, since the substrate is fixed to the spin base, the pusher should be stationary at the contact position after a certain time has passed. Therefore, if the elapsed time from the time when the pusher starts to move is measured, it can be determined that the pusher has reached the contact position and is stationary at that position without detecting the position of the pusher itself.
  • the control device is a position between the contact position and the non-contact position after the contact step and before the unlocking step, and the pusher is on the spin base.
  • a retreating process for controlling the centering actuator is further performed so that the pusher retreats to a retreat position away from the substrate.
  • the pusher contacts the outer peripheral portion of the substrate while the substrate is fixed to the spin base. Thereafter, the pusher moves backward and leaves the substrate. In this state, the fixing of the substrate to the spin base is released.
  • the substrate When the substrate is unfixed from the spin base in a state where stress is generated in the substrate due to the contact between the pusher and the substrate, the substrate may move relative to the spin base, although only slightly. Such a movement of the substrate can be prevented by releasing the fixation of the substrate while the pusher is away from the substrate. Furthermore, since the distance from the retracted position to the contact position is shorter than the distance from the non-contact position to the contact position, the substrate is not easily displaced when the pusher contacts the substrate again.
  • Another embodiment of the present invention provides a substrate processing apparatus including the centering apparatus and a nozzle that supplies a processing liquid to the substrate on the spin base.
  • the substrate on the spin base is centered, and the center of the substrate is brought close to the rotation center of the substrate corresponding to the rotation axis. Thereafter, the processing liquid is supplied to the substrate on the spin base. Thereby, the centered substrate can be processed with the processing liquid. Therefore, it is possible to improve the uniformity of the bevel processing in which only the outer peripheral portion of the substrate is processed with the processing liquid and the entire surface processing in which the entire upper surface or lower surface of the substrate is processed with the processing liquid.
  • At least one of the following features may be added to the substrate processing apparatus.
  • the substrate processing apparatus includes a cylindrical guard that surrounds the spin base and receives a processing liquid splashed outward from the substrate on the spin base, and at least a part of the centering actuator is a plan view. It arrange
  • the processing liquid splashed outward from the substrate on the spin base is received by the guard surrounding the spin base.
  • At least a part of the centering actuator is disposed above the guard and overlaps the guard in plan view. Therefore, the substrate processing apparatus can be reduced in size as compared with the case where the entire centering actuator is disposed around the guard or the case where the centering actuator is disposed below the guard. Thereby, it is possible to supply and center the processing liquid while suppressing an increase in the size of the substrate processing apparatus.
  • Yet another embodiment of the present invention is a centering method for bringing the center of a disk-like substrate horizontally disposed above a spin base rotating about a vertical rotation axis close to the rotation axis,
  • a fixing execution step of generating an adsorption force to fix the substrate to the spin base, and a pusher on the spin base in a state where the substrate is fixed to the spin base by the adsorption force of the adsorption device
  • a fixing release step for releasing the fixation of the substrate by the suction device, and the pusher in contact with an outer peripheral portion of the substrate on the spin base in a state where the fixation of the substrate to the spin base is released.
  • At least one of the following features may be added to the centering method.
  • the push process is executed in a state where the centering actuator is set to a positioning mode for moving the pusher to a predetermined set position. According to this method, the same effect as described above can be obtained.
  • the thrust that the centering actuator that moves the pusher applies to the pusher in the contact step is smaller than the thrust that the centering actuator applies to the pusher in the push step. According to this method, the same effect as described above can be obtained.
  • the contact step and the push step are steps in which the pusher is moved horizontally and linearly by a linear motor. According to this method, the same effect as described above can be obtained.
  • the centering method further includes an eccentricity detection step of detecting an eccentricity amount of the substrate with respect to the rotation axis without contacting the substrate on the spin base, and the centering position is detected in the eccentricity detection step. It is set based on the value. According to this method, the same effect as described above can be obtained.
  • the centering method further includes a contact confirmation step of confirming that the pusher has reached the contact position based on a detection value of a position sensor that detects the position of the pusher. According to this method, the same effect as described above can be obtained.
  • the centering method further includes a contact confirmation step of confirming that the pusher has reached the contact position based on an elapsed time from the time when the pusher starts moving toward the contact position. According to this method, the same effect as described above can be obtained.
  • the centering method is a position between the contact position and the non-contact position after the contact step and before the unlocking step, and the pusher is on the spin base.
  • the method further includes a retracting step of retracting the pusher to a retracted position away from the substrate. According to this method, the same effect as described above can be obtained.
  • Still another embodiment of the present invention provides a substrate processing method, comprising: the centering method; and a processing liquid supply step of supplying a processing liquid to the substrate on the spin base after the centering method is performed. provide. According to this method, the same effect as described above can be obtained.
  • At least one of the following features may be added to the substrate processing method.
  • the substrate processing method further includes a processing liquid capturing step of receiving a processing liquid splashed outward from the substrate on the spin base by a cylindrical guard surrounding the spin base in parallel with the processing liquid supply step.
  • the contact step and the push step include a step of moving the pusher to a centering actuator disposed above the guard so that at least a part thereof overlaps the guard in plan view. According to this method, the same effect as described above can be obtained.
  • FIG. 1 is a schematic view of the inside of a processing unit 2 provided in the substrate processing apparatus 1 according to the first embodiment of the present invention when viewed horizontally.
  • the substrate processing apparatus 1 is a single-wafer type apparatus that processes a disk-shaped substrate W such as a semiconductor wafer one by one.
  • the substrate processing apparatus 1 includes a processing unit 2 that processes a substrate W with a processing fluid such as a processing liquid or a processing gas, a transfer robot R1 that transfers the substrate W to the processing unit 2, and a control device 3 that controls the substrate processing apparatus 1.
  • a processing unit 2 that processes a substrate W with a processing fluid such as a processing liquid or a processing gas
  • a transfer robot R1 that transfers the substrate W to the processing unit 2
  • a control device 3 that controls the substrate processing apparatus 1.
  • the substrate processing apparatus 1 includes a centering device 40, which is not shown in FIG. The centering device 40 will be described later with reference to FIG.
  • the processing unit 2 includes a box-shaped chamber 4 having an internal space, and a spin chuck 9 that rotates around a vertical rotation axis A1 that passes through a central portion of the substrate W while holding a single substrate W horizontally in the chamber 4. And a cylindrical processing cup 17 that receives the processing liquid discharged outward from the spin chuck 9.
  • the chamber 4 includes a box-shaped partition wall 6 provided with a loading / unloading port 6b through which the substrate W passes, and a shutter 7 for opening and closing the loading / unloading port 6b.
  • the chamber 4 further includes an FFU 5 (fan filter unit) that sends clean air (air filtered by a filter) downward from the blower opening 6a that opens at the ceiling surface of the partition wall 6 into the partition wall 6, and the partition wall 6 by the FFU 5.
  • a rectifying plate 8 that rectifies clean air sent into the inside.
  • the rectifying plate 8 partitions the inside of the partition wall 6 into an upper space above the rectifying plate 8 and a lower space below the rectifying plate 8.
  • the upper space between the ceiling surface of the partition wall 6 and the upper surface of the rectifying plate 8 is a diffusion space in which clean air diffuses.
  • a lower space between the lower surface of the rectifying plate 8 and the floor surface of the partition wall 6 is a processing space where the processing of the substrate W is performed.
  • the spin chuck 9 and the processing cup 17 are disposed in the lower space.
  • Clean air supplied to the upper space from the blower opening 6a hits the rectifying plate 8 and diffuses in the upper space.
  • the clean air in the upper space passes through a plurality of through holes penetrating the current plate 8 in the vertical direction, and flows downward from the entire area of the current plate 8.
  • Clean air supplied to the lower space is discharged from the bottom of the chamber 4. As a result, a uniform clean air flow (down flow) that flows downward from the entire area of the current plate 8 is always formed in the lower space.
  • the spin chuck 9 adsorbs the substrate W on the spin base 10 by adsorbing the disc-shaped spin base 10 having an outer diameter smaller than that of the substrate W and the lower surface (back surface) of the substrate W on the spin base 10 to the spin base 10.
  • a suction pump 16 that is held horizontally, a suction pipe 14 that transmits the suction force of the suction pump 16 to the spin base 10, and a suction valve 15 that opens and closes the suction pipe 14 are included.
  • the spin chuck 9 further includes a spin shaft 11 extending downward from the central portion of the spin base 10, a spin motor 12 that rotates the spin shaft 11 and the spin base 10 about the rotation axis A 1, and a motor housing that houses the spin motor 12. 13 and so on.
  • the processing cup 17 includes a cylindrical guard 20 that receives the processing liquid discharged outward from the substrate W, a cup 19 that receives the processing liquid guided downward by the guard 20, and an outer peripheral ring that surrounds the guard 20 and the cup 19. 18 and so on.
  • the guard 20 includes a cylindrical portion 20b that surrounds the spin chuck 9, and an annular ceiling portion 20a that extends obliquely upward from the upper end portion of the cylindrical portion 20b toward the rotation axis A1.
  • the annular upper end of the ceiling portion 20 a corresponds to the upper end 20 x of the guard 20.
  • An upper end 20x of the guard 20 surrounds the substrate W and the spin base 10 in plan view (see FIG. 5).
  • the cup 19 is arrange
  • the cup 19 forms an annular liquid receiving groove 19a that opens upward.
  • the guard 20 can move vertically with respect to the bottom of the chamber 4.
  • the cup 19 is fixed to the bottom of the chamber 4.
  • the processing unit 2 includes a guard lifting / lowering unit 21 that lifts and lowers the guard 20.
  • the guard lifting / lowering unit 21 vertically lifts the guard 20 between an upper position (a position indicated by a two-dot chain line) and a lower position (a position indicated by a solid line), and the guard 20 at an arbitrary position from the upper position to the lower position.
  • the upper position is a position where the upper end 20x of the guard 20 is positioned above the support position (the position of the substrate W shown in FIG. 1) where the substrate W supported by the spin chuck 9 is disposed.
  • the lower position is a position where the upper end 20x of the guard 20 is positioned below the support position.
  • the processing liquid supplied to the substrate W is shaken off around the substrate W.
  • the upper end 20x of the guard 20 is disposed above the substrate W. Accordingly, the treatment liquid such as the chemical liquid or the rinse liquid discharged around the substrate W is received by the guard 20 and guided to the cup 19.
  • the processing unit 2 includes a chemical liquid nozzle 22 that discharges the chemical liquid downward toward the upper surface of the substrate W.
  • the chemical liquid nozzle 22 is connected to a chemical liquid pipe 23 that guides the chemical liquid.
  • the chemical liquid valve 24 interposed in the chemical liquid pipe 23 is opened, the chemical liquid is continuously discharged downward from the discharge port of the chemical liquid nozzle 22.
  • the chemical liquid discharged from the chemical nozzle 22 is sulfuric acid, nitric acid, hydrochloric acid, hydrofluoric acid, phosphoric acid, acetic acid, aqueous ammonia, hydrogen peroxide, organic acid (for example, citric acid or oxalic acid), organic alkali (for example, TMAH:
  • the liquid may contain at least one of tetramethylammonium hydroxide and the like, a surfactant, and a corrosion inhibitor, or may be a liquid other than this.
  • the chemical valve 24 includes a valve body that forms a flow path, a valve element disposed in the flow path, and an actuator that moves the valve element.
  • the actuator may be a pneumatic actuator or an electric actuator, or may be an actuator other than these.
  • the control device 3 changes the opening degree of the chemical liquid valve 24 by controlling the actuator.
  • the chemical nozzle 22 is a scan nozzle that can move within the chamber 4.
  • the chemical nozzle 22 is connected to a nozzle moving unit 25 that moves the chemical nozzle 22 in at least one of the vertical direction and the horizontal direction.
  • the nozzle moving unit 25 is configured between a processing position where the chemical liquid discharged from the chemical liquid nozzle 22 is deposited on the upper surface of the substrate W and a standby position where the chemical liquid nozzle 22 is positioned around the processing cup 17 in a plan view.
  • the nozzle 22 is moved horizontally.
  • FIG. 1 shows an example in which the nozzle moving unit 25 is a turning unit that horizontally moves the chemical nozzle 22 around the nozzle turning axis A ⁇ b> 2 that extends vertically around the processing cup 17.
  • the nozzle moving unit 25 includes a nozzle arm 25a that holds the chemical liquid nozzle 22, and a drive unit 25b that moves the chemical liquid nozzle 22 horizontally by moving the nozzle arm 25a.
  • the chemical nozzle 22 extends downward from the tip of a horizontally extending nozzle arm 25a.
  • the nozzle arm 25a overlaps the substrate W on the spin chuck 9 in plan view.
  • the nozzle arm 25a is disposed around the substrate W on the spin chuck 9 in plan view.
  • the processing unit 2 further includes a rinsing liquid nozzle 26 that discharges the rinsing liquid downward toward the upper surface of the substrate W.
  • the rinse liquid nozzle 26 is connected to a rinse liquid pipe 27 that guides the rinse liquid.
  • the rinsing liquid valve 28 provided in the rinsing liquid pipe 27 is opened, the rinsing liquid is continuously discharged downward from the discharge port of the rinsing liquid nozzle 26.
  • the rinse liquid is, for example, pure water (deionized water: DIW (Deionized water)).
  • the rinse liquid is not limited to pure water, but may be any of IPA (isopropyl alcohol), electrolytic ion water, hydrogen water, ozone water, and hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm), Liquids other than these may be used.
  • IPA isopropyl alcohol
  • electrolytic ion water hydrogen water
  • ozone water ozone water
  • hydrochloric acid water having a diluted concentration (for example, about 10 to 100 ppm)
  • Liquids other than these may be used.
  • the rinse liquid nozzle 26 is a scan nozzle.
  • the rinse liquid nozzle 26 may be a fixed nozzle fixed to the bottom of the chamber 4.
  • the rinse liquid nozzle 26 is connected to a nozzle moving unit 29 that moves the rinse liquid nozzle 26 in at least one of the vertical direction and the horizontal direction.
  • the nozzle moving unit 29 is located between a processing position where the rinsing liquid discharged from the rinsing liquid nozzle 26 is deposited on the upper surface of the substrate W and a standby position where the rinsing liquid nozzle 26 is positioned around the spin chuck 9 in plan view. Then, the rinsing liquid nozzle 26 is moved horizontally.
  • the processing unit 2 may include a heater 30 that heats the substrate W on the spin base 10.
  • the heater 30 is disposed below the substrate W supported by the spin base 10.
  • the heater 30 surrounds the spin base 10.
  • the outer diameter of the heater 30 is smaller than the inner diameter of the upper end 20 x of the guard 20.
  • the inner diameter of the heater 30 is larger than the outer diameter of the spin base 10.
  • the heater 30 is disposed above the motor housing 13 and is supported by the motor housing 13. Even if the spin base 10 rotates, the heater 30 does not rotate.
  • FIG. 2 is a block diagram showing hardware and functional blocks of the control device 3 provided in the substrate processing apparatus 1.
  • the rotation angle control unit 38 illustrated in FIG. 2 is a functional block realized by the CPU 31 executing the program P installed in the control device 3.
  • the control device 3 includes a computer main body 3a and a peripheral device 3b connected to the computer main body 3a.
  • the computer main body 3a includes a CPU 31 (central processing unit) that executes various instructions and a main storage device 32 that stores information.
  • the peripheral device 3b includes an auxiliary storage device 33 that stores information such as the program P, a reading device 34 that reads information from the removable medium M, and a communication device 35 that communicates with devices other than the control device 3 such as the host computer HC.
  • the control device 3 may include a timer 39 that measures time.
  • the control device 3 is connected to an input device 36 and a display device 37.
  • the input device 36 is operated when an operator such as a user or a maintenance person inputs information to the substrate processing apparatus 1. Information is displayed on the screen of the display device 37.
  • the input device 36 may be any one of a keyboard, a pointing device, and a touch panel, or may be a device other than these.
  • a touch panel display that doubles as the input device 36 and the display device 37 may be provided in the substrate processing apparatus 1.
  • the CPU 31 executes the program P stored in the auxiliary storage device 33.
  • the program P in the auxiliary storage device 33 may be preinstalled in the control device 3, or may be sent from the removable medium M to the auxiliary storage device 33 through the reading device 34, It may be sent from an external device such as the host computer HC to the auxiliary storage device 33 through the communication device 35.
  • the auxiliary storage device 33 and the removable medium M are non-volatile memories that retain memory even when power is not supplied.
  • the auxiliary storage device 33 is a magnetic storage device such as a hard disk drive, for example.
  • the removable medium M is, for example, an optical disk such as a compact disk or a semiconductor memory such as a memory card.
  • the removable medium M is an example of a computer-readable recording medium on which the program P is recorded.
  • the control device 3 includes a rotation angle control unit 38 that controls the rotation angle of the spin motor 12.
  • the rotation angle control unit 38 stops the spin base 10 at an arbitrary rotation angle by adjusting the number of drive pulses supplied to the spin motor 12.
  • the rotation angle of the spin motor 12 is detected by a rotation angle sensor such as an encoder.
  • the rotation angle control unit 38 stops the spin base 10 at an arbitrary rotation angle by adjusting the energization time during which power is supplied to the spin motor 12 based on the detection value of the rotation angle sensor.
  • the control device 3 controls the substrate processing apparatus 1 so that the substrate W is processed according to the recipe specified by the host computer HC.
  • the auxiliary storage device 33 stores a plurality of recipes.
  • the recipe is information that defines the processing content, processing conditions, and processing procedure of the substrate W.
  • the plurality of recipes differ from each other in at least one of the processing content, processing conditions, and processing procedure of the substrate W.
  • the following steps are executed by the control device 3 controlling the substrate processing apparatus 1. In other words, the control device 3 is programmed to execute the following steps.
  • FIG. 3 is a process diagram for explaining an example of the processing of the substrate W performed by the substrate processing apparatus 1. In the following, reference is made to FIG. 1 and FIG.
  • the bevel region is an annular region including a bevel portion (inclined portion) located on the outer peripheral portion of the upper surface of the substrate W.
  • the inner peripheral edge of the bevel region substantially coincides with the liquid landing position of the chemical solution.
  • the width of the bevel region (the radial distance from the outer peripheral edge of the substrate W to the inner peripheral edge of the bevel region) is shorter than the radial distance from the center C1 of the substrate W to the inner peripheral edge of the bevel region.
  • the width of the bevel region may be about several millimeters to several tens of millimeters, or may be 1 millimeter or less.
  • a loading step (step S1 shown in FIG. 3) for loading the substrate W into the chamber 4 is performed.
  • the transport robot R1 supports the substrate W with the hand H1, while the hand H1.
  • the transfer robot R1 places the substrate W on the hand H1 on the spin base 10 with the surface of the substrate W facing upward, and retracts the hand H1 from the inside of the chamber 4.
  • a centering process (step S2 shown in FIG. 3) is performed in which the center C1 of the substrate W is disposed on or near the rotation axis A1. The centering process will be described later.
  • step S3 shown in FIG. 3 After the centering process is performed, a chemical solution supplying step (step S3 shown in FIG. 3) for supplying the chemical solution to the substrate W is performed.
  • the spin motor 12 rotates the substrate W and the spin base 10 while the substrate W is fixed to the spin base 10 by the suction force of the suction pump 16. Thereby, the rotation of the substrate W is started. Further, the nozzle moving unit 25 moves the chemical liquid nozzle 22 to the processing position, and the guard lifting / lowering unit 21 positions the guard 20 at the upper position. Accordingly, the chemical nozzle 22 is disposed above the outer peripheral portion of the substrate W, and the upper end 20x of the guard 20 is disposed above the substrate W.
  • the chemical valve 24 is opened and the chemical nozzle 22 starts to discharge the chemical.
  • the nozzle moving unit 25 may move the chemical liquid nozzle 22 so that the liquid solution landing position moves in the radial direction within the bevel region, or the chemical liquid nozzle 22 may be moved. It may be stationary.
  • the heater 30 may heat the substrate W and the chemical solution on the substrate W during at least a part of the period during which the chemical solution nozzle 22 is discharging the chemical solution in order to promote the reaction between the chemical solution and the substrate W. .
  • the chemical liquid discharged from the chemical liquid nozzle 22 lands on the bevel area of the substrate W and then flows outward along the bevel area. Thereby, a chemical
  • the nozzle moving unit 25 moves the liquid deposition position within the bevel area, the bevel area is scanned at the liquid deposition position, so that the liquid is uniformly supplied to the bevel area.
  • a rinsing liquid supply step for supplying pure water, which is an example of a rinsing liquid, to the upper surface of the substrate W is performed (step S4 shown in FIG. 3).
  • the nozzle moving unit 29 moves the rinse liquid nozzle 26 to the processing position. Thereby, the rinse liquid nozzle 26 is disposed above the outer peripheral portion of the substrate W. Thereafter, the rinsing liquid valve 28 is opened, and the rinsing liquid nozzle 26 starts discharging pure water.
  • the nozzle moving unit 29 may move the rinsing liquid nozzle 26 so that the pure water landing position moves in the radial direction within the bevel area, The rinse liquid nozzle 26 may be stationary.
  • the heater 30 heats the substrate W and the pure water on the substrate W during at least a part of the period during which the rinsing liquid nozzle 26 is discharging pure water in order to promote the reaction between the pure water and the substrate W. May be.
  • the pure water discharged from the rinse liquid nozzle 26 lands on the bevel area of the substrate W and then flows outward along the bevel area. Thereby, pure water is supplied only to the bevel region, and the chemical solution on the bevel region is washed away.
  • the nozzle moving unit 29 moves the pure water landing position within the bevel area, the bevel area is scanned at the pure water landing position, so that pure water is uniformly supplied to the bevel area.
  • the nozzle moving unit 29 moves the rinse liquid nozzle 26 to the standby position.
  • a drying process for drying the substrate W by high-speed rotation of the substrate W is performed (step S5 shown in FIG. 3).
  • the spin motor 12 accelerates the substrate W in the rotation direction, and rotates the substrate W at a higher rotation speed (for example, several thousand rpm) than the rotation speed of the substrate W so far. Thereby, the liquid is removed from the substrate W, and the substrate W is dried.
  • the spin motor 12 stops rotating. Thereby, the rotation of the substrate W is stopped.
  • step S6 an unloading process for unloading the substrate W from the chamber 4 is performed (step S6 shown in FIG. 3).
  • the guard lifting / lowering unit 21 lowers the guard 20 to the lower position.
  • the transfer robot R1 causes the hand H1 to enter the chamber 4.
  • the transfer robot R1 supports the substrate W on the spin base 10 with the hand H1.
  • the transport robot R1 retracts the hand H1 from the chamber 4 while supporting the substrate W with the hand H1. Thereby, the processed substrate W is unloaded from the chamber 4.
  • FIG. 4 is a schematic view of the centering device 40 that horizontally reduces the amount of eccentricity of the substrate W with respect to the center of rotation of the substrate W.
  • FIG. 5 is a schematic view of the centering unit 45 provided in the centering device 40 as viewed from above.
  • FIG. 6A is a schematic diagram showing a vertical cross section of the centering unit 45.
  • FIG. 6B is an enlarged view of a part of FIG. 6A.
  • FIG. 6C is a schematic diagram showing a vertical cross section of the linear motor 49. 4, 5, 6A, and 6B show a state in which the pusher 46 is disposed at the origin position.
  • the substrate processing apparatus 1 includes a centering device 40 that reduces the amount of eccentricity of the substrate W with respect to the rotation axis A1, that is, the shortest distance from the rotation axis A1 to the center C1 of the substrate W.
  • the centering device 40 includes an eccentricity detection unit 41 that detects the eccentricity of the substrate W on the spin base 10 without contacting the substrate W on the spin base 10.
  • the eccentricity detection unit 41 may be an outer periphery detection unit that detects the eccentricity of the substrate W by detecting only the position of the outer peripheral edge of the substrate W, or an image of the substrate W located on the spin base 10. It may be a photographing unit that detects the amount of eccentricity of the substrate W based on it.
  • the eccentricity detection unit 41 may detect the position of the center C1 of the substrate W with respect to the rotation axis A1 (angle around the rotation axis A1) in addition to the eccentricity of the substrate W with respect to the rotation axis A1.
  • FIG. 4 shows an example in which the eccentricity detection unit 41 is an outer periphery detection unit and detects both the eccentricity of the substrate W and the position of the center C1 of the substrate W.
  • the eccentricity detection unit 41 includes a light emitting unit 42 that emits light toward the outer periphery of the substrate W on the spin base 10, and a light receiving unit 43 that receives the light emitted from the light emitting unit 42.
  • One of the light emitting unit 42 and the light receiving unit 43 is disposed above the support position of the substrate W, and the other of the light emitting unit 42 and the light receiving unit 43 is disposed below the support position.
  • FIG. 4 shows an example in which the light emitting unit 42 is disposed below the support position and the light receiving unit 43 is disposed above the support position.
  • the light emitting unit 42 is disposed in the motor housing 13 of the spin chuck 9.
  • the light emitting unit 42 includes a light emitting unit including a light source.
  • the light emitting part of the light emitting unit 42 is disposed below a transmission hole that penetrates the motor housing 13 in the vertical direction.
  • the transmission hole of the motor housing 13 is covered with a transmission member that transmits light from the light emitting unit.
  • the light of the light emitting unit 42 is emitted out of the motor housing 13 through the transparent member.
  • the light receiving unit 43 is disposed in a sensor housing 44 disposed in the chamber 4.
  • the light receiving unit 43 includes a light receiving unit that receives light from the light emitting unit.
  • the light receiving portion of the light receiving unit 43 is disposed above a transmission hole that penetrates the sensor housing 44 in the vertical direction.
  • the transmission hole of the sensor housing 44 is closed with a transparent member that transmits light from the light emitting unit. Light from the light emitting unit 42 enters the sensor housing 44 through the transparent member and is irradiated to the light receiving unit.
  • the control device 3 can detect whether or not the substrate W is on the spin base 10 based on the detection value of the light receiving unit 43.
  • the control device 3 rotates the substrate W at 360 degrees or an angle close to it while emitting light to the light emitting unit 42, whereby the eccentric amount of the substrate W with respect to the rotation axis A1 and the center of the substrate W with respect to the rotation axis A1.
  • the position of C1 can be detected based on the detection value of the light receiving unit 43.
  • the centering device 40 includes a centering unit 45 that moves the center C1 of the substrate W toward the rotation axis A1 based on the detection value of the eccentricity detection unit 41.
  • the centering unit 45 is disposed between the rectifying plate 8 and the guard 20.
  • a nozzle arm 25 a (see FIG. 1) that holds the chemical nozzle 22 is disposed above the centering unit 45.
  • the centering unit 45 is disposed below the passage area (hatched area) through which the chemical liquid nozzle 22 and the nozzle arm 25 a pass.
  • a unit housing 56 which will be described later, is disposed below the passage region and overlaps the passage region in plan view.
  • the centering unit 45 includes a pusher 46 that contacts the substrate W on the spin base 10 and a linear motor 49 that moves the pusher 46 horizontally.
  • the centering unit 45 further includes a main base 52 that supports the linear motor 49, a base ring 54 that supports the main base 52, and a spacer 53 that is interposed between the main base 52 and the base ring 54.
  • the pusher 46 is supported by the linear motor 49.
  • the linear motor 49 is disposed on the main base 52.
  • the main base 52 is disposed between the linear motor 49 and the guard 20.
  • the main base 52 is supported by the base ring 54 via the spacer 53.
  • the main base 52 is fixed to the base ring 54.
  • the base ring 54 has an annular shape that surrounds the rotation axis A ⁇ b> 1 in plan view. At least a part of the base ring 54 is disposed above the guard 20 and overlaps the guard 20 in plan view.
  • the linear motor 49 is an example of a centering actuator that moves the substrate W horizontally with respect to the spin chuck 9 by moving a pusher 46 that is an example of a contact portion in a horizontal linear direction. As shown in FIG. 6C, the linear motor 49 moves in the linear direction together with the fixed member 50 fixed to the main base 52, the movable member 51 movable in the linear direction with respect to the fixed member 50, and the movable member 51.
  • the permanent magnet 49m and the coil 49c which forms the magnetic field which moves the movable member 51 to a linear direction with the permanent magnet 49m are included.
  • the linear motor 49 further includes a scale 49s that moves in the linear direction together with the movable member 51, and a head 49h that detects the amount of movement of the scale 49s in the linear direction.
  • the detection value of the head 49h is input to the control device 3.
  • the control device 3 detects the movement of the pusher 46 based on the detection value of the head 49h.
  • the scale 49s and the head 49h are included in a position sensor that detects the position of the pusher 46.
  • the movable member 51 is disposed above the fixed member 50.
  • the permanent magnet 49m and the coil 49c are disposed between the fixed member 50 and the movable member 51.
  • the pusher 46 is attached to the movable member 51.
  • the pusher 46 moves with respect to the fixed member 50 together with the movable member 51.
  • the moving direction of the pusher 46 and the movable member 51 is a direction extending horizontally along a reference plane P1 (see FIG. 5) which is a vertical plane passing through the rotation axis A1.
  • the moving direction of the pusher 46 and the movable member 51 is the same direction as the centering direction Dc, which is the direction in which the substrate W moves in the centering step described later.
  • the linear motor 49 moves the movable member 51 horizontally with respect to the fixed member 50, thereby linearly moving the pusher 46 between the origin position and the end position in the radial direction of the substrate W (direction perpendicular to the rotation axis A1).
  • the origin position and the end position are positions at both ends of the straight path through which the pusher 46 passes.
  • the origin position and the end position are fixed positions.
  • the control device 3 controls the linear motor 49 to stop the pusher 46 at an arbitrary position from the origin position to the end position.
  • the origin position is the position outside the end position, that is, the position opposite to the rotation axis A1 of the substrate W with respect to the end position.
  • the origin position is a position where the inner end of the pusher 46 is disposed outside the upper end 20x of the guard 20.
  • the end position is a position where the inner end of the pusher 46 is disposed inside the upper end 20 x of the guard 20.
  • the end position is set such that the pusher 46 contacts the substrate W regardless of the amount of eccentricity of the substrate W on the spin base 10 with respect to the rotation axis A1.
  • the pusher 46 is an example of a contact portion that contacts the substrate W on the spin base 10. As shown in FIGS. 5 and 6A, the pusher 46 includes a hand portion 47 that comes into contact with the substrate W on the spin base 10 and an arm portion 48 that extends outward from the hand portion 47. The hand portion 47 is supported by the linear motor 49 via the arm portion 48. The hand part 47 and the arm part 48 are disposed above the upper end 20 x of the guard 20.
  • the hand unit 47 may include a contact surface 46 a that contacts the substrate W, or may include two contact protrusions that contact the substrate W. FIG. 5 shows an example in which the contact surface 46 a is provided on the hand portion 47.
  • the horizontal cross section of the contact surface 46a of the pusher 46 may be a V-shape that opens toward the substrate W, or may be an arc that opens toward the substrate W and has a smaller radius of curvature than the substrate W. Other shapes may be used.
  • both ends of the contact surface 46a are disposed at two positions that are symmetrical with respect to the reference plane P1.
  • the two contact projections are respectively disposed at two positions symmetrical with respect to the reference plane P1. Therefore, the pusher 46 contacts the substrate W at two positions that are symmetrical with respect to the reference plane P1.
  • the centering device 40 includes a unit housing 56 that forms an accommodation chamber 55 for accommodating the centering unit 45 together with the guard 20.
  • the linear motor 49 is accommodated in the unit housing 56.
  • the unit housing 56 includes a case 57 surrounding the linear motor 49 and a lid 58 disposed above the linear motor 49.
  • the case 57 forms the peripheral wall of the storage chamber 55, and the lid 58 forms the upper wall of the storage chamber 55.
  • the guard 20 forms at least a part of the bottom of the storage chamber 55.
  • the case 57 is fixed to the guard 20.
  • the opening provided at the upper end of the case 57 is closed with a lid 58.
  • a gap between the case 57 and the lid 58 is sealed with a seal member SL1.
  • the lid 58 is detachably attached to the case 57 with a plurality of bolts B1. When the bolt B1 is removed, the lid 58 can be removed from the case 57 and the inside of the case 57 can be accessed. Therefore, maintenance of the centering unit 45 and replacement of parts are easy.
  • the arm portion 48 of the pusher 46 is inserted into an insertion hole 56 a that penetrates the case 57 in the moving direction of the pusher 46.
  • the hand portion 47 of the pusher 46 is disposed outside the unit housing 56.
  • a cylindrical bellows 59 surrounding the arm portion 48 is disposed outside the unit housing 56.
  • One end of the bellows 59 is fixed to the pusher 46, and the other end of the bellows 59 is fixed to the case 57.
  • the bellows 59 expands and contracts in the moving direction of the pusher 46 as the pusher 46 moves. Intrusion of liquid into the unit housing 56 through the insertion hole 56 a is prevented by the bellows 59.
  • all or part of the linear motor 49 is disposed above the guard 20 and overlaps the guard 20 in plan view.
  • the entire pusher 46 is disposed above the guard 20 and overlaps the guard 20 in plan view.
  • the linear motor 49 and the pusher 46 are disposed around the upper end 20x of the guard 20 in a plan view and do not overlap the upper end 20x of the guard 20.
  • FIG. 7 is a schematic diagram showing a vertical cross section of a centering lifting unit 61 that lifts and lowers the centering unit 45.
  • FIG. 8 is a schematic view of the centering lift unit 61 viewed in the direction of the arrow VIII shown in FIG.
  • the centering device 40 includes a centering lifting unit 61 that lifts and lowers a centering unit 45 including a pusher 46 and a linear motor 49.
  • the centering lifting unit 61 also serves as the guard lifting unit 21. That is, the centering lift unit 61 moves the centering unit 45 up and down and lifts the guard 20 up and down.
  • the centering lift unit 61 includes a lift actuator 62 that generates power for moving the centering unit 45 up and down, and a transmission mechanism 63 that transmits the power of the lift actuator 62 to the centering unit 45.
  • the elevating actuator 62 is a rotary actuator such as an electric motor, for example.
  • the transmission mechanism 63 includes a ball screw mechanism that converts the rotation transmitted from the elevating actuator 62 into a linear motion.
  • the lift actuator 62 may be a linear actuator such as an air cylinder.
  • the transmission mechanism 63 includes a support column 64 extending downward from the base ring 54, and an elevating base 66 connected to the support column 64.
  • the transmission mechanism 63 further includes a lifting bracket 65 that extends from the guard 20 to the lifting base 66.
  • the support column 64 and the lifting bracket 65 are fixed to the lifting base 66.
  • pillar 64 is inserted in the through-hole 20y which penetrates the guard 20 to an up-down direction.
  • the lifting base 66 is disposed below the guard 20.
  • the control device 3 controls the elevating actuator 62 to position the centering unit 45 and the guard 20 at an arbitrary height from the upper position to the lower position.
  • the control device 3 positions the centering unit 45 and the guard 20 at the centering height.
  • the pusher 46 is horizontally opposed to the outer peripheral surface of the substrate W on the spin base 10.
  • the centering height may be the upper position or the lower position, or may be a position between the upper position and the lower position.
  • control device 3 controlling the substrate processing apparatus 1.
  • FIG. 9 is a flowchart for explaining an example of the centering process performed by the centering device 40.
  • FIG. 9 shows details of the centering step (step S2) shown in FIG. Steps S11 to S19 in FIG. 9 correspond to the centering step (step S2) shown in FIG. 10A to 10F are schematic diagrams illustrating an example of operations of the substrate W and the centering unit 45 when the example of the centering process illustrated in FIG. 9 is performed.
  • the chuck ON means that the substrate W is fixed to the spin base 10 by the suction force of the suction pump 16
  • the chuck OFF means that the substrate W with respect to the spin base 10 is fixed. This means that the fixing has been released.
  • FIG. 4 and FIG. 10A to 10F will be referred to as appropriate.
  • a measurement process is performed for measuring the amount of eccentricity of the substrate W with respect to the rotation axis A1 and the position of the center C1 of the substrate W with respect to the rotation axis A1.
  • the control device 3 opens the suction valve 15, and the substrate W is moved to the spin base 10. (Step S11 in FIG. 9). Further, the control device 3 causes the light emitting unit 42 to emit light toward the outer peripheral portion of the substrate W. In this state, the spin motor 12 rotates the substrate W and the spin base 10 by 360 degrees, and then stops on the spot. At this time, as long as the pusher 46 does not interfere with the substrate W, the guard 20 and the centering unit 45 may be arranged at any height. Light emission of the light emitting unit 42 is stopped after the rotation of the substrate W is stopped.
  • a part of the light of the light emitting unit 42 is blocked by the outer peripheral portion of the substrate W on the spin base 10, and the remaining light enters the light receiving unit 43.
  • the substrate W is rotated in a state where the light emitting unit 42 emits light, the light irradiation position on the substrate W moves in the rotation direction of the substrate W along the outer peripheral portion of the substrate W. If the substrate W is eccentric with respect to the rotation axis A1, the width of the light incident on the light receiving unit 43 when the substrate W is rotated changes.
  • the control device 3 Based on the detection value of the light receiving unit 43, the control device 3 detects the shortest distance from the rotation axis A1 to the center C1 of the substrate W and the position of the center C1 of the substrate W with respect to the rotation axis A1. Thereby, the amount of eccentricity of the substrate W with respect to the rotation axis A1 is detected (step S12 in FIG. 9).
  • an eccentricity determination step is performed to determine whether the amount of eccentricity of the substrate W with respect to the rotation axis A1 is within an allowable range (step S13 in FIG. 9). .
  • the amount of eccentricity is within the allowable range (Yes in step S13 in FIG. 9)
  • the centering process for moving the center C1 of the substrate W toward the rotation axis A1 is not performed, and the above-described chemical supply process (FIGS. 9 and 3 step S3) and subsequent steps are performed.
  • a position confirmation process is performed to confirm whether or not the substrate W is positioned at a preparation position where the substrate W is arranged in the centering process ( Step S14 in FIG. 9).
  • the position of the center C1 of the substrate W with respect to the rotation axis A1 (the angle around the rotation axis A1 and the shortest distance from the rotation axis A1) is known.
  • the control device 3 confirms whether or not the substrate W is located at the preparation position based on the detection value of the light receiving unit 43.
  • the preparation position is a rotation angle at which the center C1 of the substrate W overlaps the reference plane P1 and is positioned between the pusher 46 and the rotation axis A1 of the substrate W in plan view.
  • FIG. 10B shows a state where the center C1 of the substrate W does not overlap the reference plane P1.
  • the spin motor 12 stops the substrate W and the spin base 10 on the spot without rotating.
  • the spin motor 12 rotates the substrate W and the spin base 10 to the preparation position and stops at the preparation position (preparation process FIG. 9).
  • Step S15) For example, when the substrate W is in the state shown in FIG. 10B, the spin motor 12 rotates the substrate W and the spin base 10 90 degrees clockwise. Thereby, as shown in FIG. 10C, the center C1 of the substrate W overlaps the reference plane P1, and the substrate W is arranged at the preparation position.
  • a centering step (step S18 in FIG. 9) is performed in which the center C1 of the substrate W is moved toward the rotation axis A1 by horizontally pushing the substrate W with the pusher 46.
  • the centering lift unit 61 that also serves as the guard lift unit 21 with the substrate W positioned at the preparation position and the pusher 46 positioned at the origin position centers the centering unit 45 together with the guard 20. Raise to height.
  • the centering height is a height at which the pusher 46 is disposed at a height equal to the outer peripheral portion of the substrate W located on the spin base 10. Therefore, when the centering unit 45 is disposed at the centering height, the pusher 46 faces the outer peripheral portion of the substrate W horizontally.
  • the linear motor 49 moves the pusher 46 from the origin position to the contact position in a state where the substrate W is fixed to the spin base 10 (chuck ON state).
  • the origin position is an example of a non-contact position where the pusher 46 is separated from the substrate W on the spin base 10.
  • the contact position is a position where the pusher 46 switches from a non-contact state where the pusher 46 is separated from the substrate W to a contact state where the pusher 46 is in contact with the outer peripheral portion of the substrate W. Therefore, when the pusher 46 reaches the contact position, the pusher 46 comes into contact with the outer peripheral portion of the substrate W on the spin base 10.
  • FIG. 10D shows a state where the pusher 46 is located at the contact position.
  • the control device 3 can determine whether or not the pusher 46 is located at the contact position based on the detection value of the position sensor.
  • the centering position is a position where the amount of eccentricity of the substrate W with respect to the rotation axis A1 decreases to a value within an allowable range, and is set based on the amount of eccentricity of the substrate W measured in the measurement process. That is, if the amount of eccentricity of the substrate W measured in the measurement process is different, the centering position is also different.
  • the centering position may be a position between the contact position and the end position, or may be an end position.
  • the pusher 46 tries to move toward the centering position while pushing the substrate W toward the rotation axis A1.
  • the substrate W is released from being fixed to the spin base 10. Accordingly, the substrate W moves horizontally with respect to the spin motor 12 while being in contact with the spin base 10.
  • the substrate W moves in the centering direction Dc, which is the same direction as the movement direction of the pusher 46, and the center C1 of the substrate W approaches the rotation axis A1.
  • the amount of eccentricity of the substrate W with respect to the rotation axis A1 decreases to a value within the allowable range.
  • the thrust control mode is a mode in which the linear motor 49 continues to move the pusher 46 while applying a constant thrust to the pusher 46. If there is no obstacle in the movement path of the pusher 46 when the linear motor 49 is driven in the thrust control mode, the pusher 46 continues to move to the end position. In other words, in the thrust control mode, if there is a substrate W that is an obstacle in the movement path of the pusher 46, the pusher 46 stops moving without reaching the end position.
  • the linear motor 49 is driven in the positioning mode from the contact position to the centering position.
  • the positioning mode is a mode in which the linear motor 49 moves the pusher 46 to a predetermined setting position, that is, a centering position.
  • the amount of movement of the pusher 46 is controlled by the number of drive pulses input to the linear motor 49, for example.
  • the linear motor 49 increases the thrust and moves the pusher 46 to the centering position even if there is a substrate W that is an obstacle in the movement path of the pusher 46.
  • the thrust applied to the pusher 46 is changed as necessary.
  • the thrust applied to the pusher 46 when the linear motor 49 is in the thrust control mode is smaller than the thrust applied to the pusher 46 when the linear motor 49 is in the positioning mode.
  • the linear motor 49 returns the pusher 46 to the origin position. During this time, the pusher 46 moves away from the substrate W.
  • the suction valve 15 may be opened before or after the pusher 46 is moved from the centering position, or may be opened at the same time as the pusher 46 is moved from the centering position. In any case, the fixing of the substrate W to the spin base 10 is resumed (chuck ON, step S19 in FIG. 9), and the movement of the substrate W with respect to the spin base 10 is prevented. Therefore, the state where the substrate W is centered with respect to the rotation axis A1 can be maintained.
  • a measurement process may be performed (return to step S12 in FIG. 9), without performing the second measurement process.
  • You may perform the above-mentioned chemical
  • the chemical solution supply process and the subsequent processes can be performed while the substrate W is reliably centered.
  • the pusher 46 moves from the origin position to the contact position and contacts the outer peripheral portion of the substrate W on the spin base 10. Thereafter, the substrate W is pushed by the pusher 46 and moves horizontally with respect to the spin base 10. As a result, the center C1 of the substrate W approaches the rotation center of the substrate W corresponding to the rotation axis A1. When the pusher 46 reaches the centering position, the pusher 46 stops and the movement of the substrate W relative to the spin base 10 is completed. In this way, the center C1 of the substrate W is brought close to the rotation center of the substrate W, and the amount of eccentricity of the substrate W with respect to the rotation axis A1 is reduced.
  • the substrate W is fixed to the spin base 10. Therefore, even if the pusher 46 contacts the substrate W, the substrate W does not move relative to the spin base 10. The fixing of the substrate W to the spin base 10 is released after the pusher 46 contacts the substrate W. Thereafter, the pusher 46 is disposed at the centering position, and the center C1 of the substrate W is brought close to the rotation center of the substrate W. Therefore, the positional deviation of the substrate W caused by the contact between the pusher 46 and the substrate W can be prevented, and the centering accuracy of the substrate W can be improved.
  • the linear motor 49 is driven in the thrust control mode from the origin position to the contact position. From the contact position to the centering position, the linear motor 49 is driven in the positioning mode. In the thrust control mode, the linear motor 49 continues to move the pusher 46 while controlling the thrust applied to the pusher 46. Therefore, the force applied to the substrate W from the pusher 46 when the pusher 46 contacts the substrate W can be reduced. In the positioning mode, the linear motor 49 moves the pusher 46 to a predetermined setting position, that is, a centering position. Therefore, the pusher 46 can be positioned at the centering position with higher accuracy.
  • the thrust applied to the pusher 46 when the pusher 46 is moved from the origin position to the contact position is smaller than the thrust applied to the pusher 46 when the pusher 46 is moved from the contact position to the centering position. . Accordingly, the pusher 46 contacts the substrate W on the spin base 10 with a small thrust applied to the pusher 46. Therefore, the impact generated by the contact between the pusher 46 and the substrate W can be reduced, and the amount of elastic deformation of the pusher 46 and the substrate W can be reduced. If the amount of elastic deformation of the pusher 46 and the substrate W is small, even if the fixation of the substrate W to the spin base 10 is released while the pusher 46 is in contact with the substrate W, the substrate W moves to the spin base 10 with a large amount of movement. It does not move. Therefore, the centering accuracy of the substrate W can be increased.
  • the pusher 46 since the pusher 46 moves linearly horizontally, the volume of the space through which the pusher 46 passes can be reduced. Furthermore, if the linear motion of the linear motor 49 is transmitted to the pusher 46, the pusher 46 moves linearly, so that a mechanism for converting the linear motion of the linear motor 49 need not be provided. Thereby, the centering apparatus 40 can be reduced in size. In addition, since the linear motor 49, which is an example of the electric actuator, moves the pusher 46, the position of the pusher 46 can be controlled with high accuracy.
  • the amount of eccentricity of the substrate W with respect to the rotation axis A1 that is, the shortest distance from the rotation axis A1 to the center C1 of the substrate W is detected.
  • the linear motor 49 moves the substrate W horizontally with respect to the spin base 10 by a movement amount based on the detection value of the eccentricity detection unit 41.
  • the substrate W is centered.
  • the eccentric amount is detected without contact with the substrate W, the substrate W is difficult to move relative to the spin base 10 during or after the detection of the eccentric amount. Therefore, the amount of eccentricity of the substrate W can be detected with higher accuracy.
  • the position of the pusher 46 is detected.
  • the position of the pusher 46 changes with time. If the pusher 46 is not moved, the position of the pusher 46 does not change.
  • the substrate W is fixed to the spin base 10, so that when the pusher 46 reaches the contact position, the pusher 46 stops at the contact position. Therefore, by detecting the position of the pusher 46, it can be directly confirmed that the pusher 46 is located at the contact position.
  • the substrate W on the spin base 10 is centered, and the center C1 of the substrate W is brought close to the rotation center of the substrate W corresponding to the rotation axis A1. Thereafter, the processing liquid is supplied to the substrate W on the spin base 10. Thereby, the centered substrate W can be processed with the processing liquid. Therefore, it is possible to improve the uniformity of the bevel processing in which only the outer peripheral portion of the substrate W is processed with the processing liquid.
  • the processing liquid splashed outward from the substrate W on the spin base 10 is received by the guard 20 surrounding the spin base 10. At least a part of the linear motor 49 is disposed above the guard 20 and overlaps the guard 20 in plan view. Therefore, the substrate processing apparatus 1 can be reduced in size as compared with the case where the entire linear motor 49 is arranged around the guard 20 or the case where the linear motor 49 is arranged below the guard 20. As a result, the processing liquid can be supplied and centered while suppressing an increase in the size of the substrate processing apparatus 1.
  • a Bernoulli device may be provided in place of the suction pump 16 to generate a suction force that attracts the substrate W to the upper surface of the spin base 10 according to Bernoulli's theorem and to fix the substrate W to the spin base 10.
  • the spin chuck 9 may be a Bernoulli chuck instead of a vacuum chuck.
  • the spin chuck 9 may be an electrostatic chuck that electrostatically attracts the substrate W to the upper surface of the spin base 10.
  • the spin chuck 9 may include an electrode to which a voltage is applied instead of the suction pump 16.
  • the suction pump 16, the Bernoulli device, and the electrode are all examples of the adsorption device.
  • the mode of the linear motor 49 may not be switched from the thrust control mode to the positioning mode.
  • the pusher 46 may be moved to the contact position while the linear motor 49 is set to the positioning mode, and then moved to the centering position.
  • the thrust applied from the linear motor 49 to the pusher 46 when the pusher 46 is moved from the origin position to the contact position is the thrust applied from the linear motor 49 to the pusher 46 when the pusher 46 is moved from the contact position to the centering position. It may be larger or equal.
  • the eccentricity detection unit 41 may detect the eccentricity of the substrate W with respect to the rotation axis A1 while contacting the substrate W on the spin base 10.
  • the control device 3 may confirm that the pusher 46 is located at the contact position using a device other than the position sensor.
  • a device other than the position sensor For example, a timer 39 (see FIG. 2) may be used, or a camera that photographs the pusher 46 and the substrate W from above may be used.
  • a timer 39 or the like and a position sensor may be used in combination.
  • the control device 3 causes the timer 39 to measure the elapsed time from that point.
  • the pusher 46 reaches the contact position, since the substrate W is fixed to the spin base 10, the pusher 46 should be stationary at the contact position after a certain period of time has passed. Therefore, if the elapsed time from when the pusher 46 starts to move is measured, the pusher 46 has reached the contact position and is still at that position without detecting the position of the pusher 46 itself. I can judge.
  • FIG. 11A shows a state where the pusher 46 is located at the contact position.
  • the control device 3 does not move the pusher 46 from the contact position to the centering position, but retracts the pusher 46 from the contact position to the retracted position toward the origin position, thereby moving the pusher 46 to the substrate W. May be separated from
  • the control device 3 may release the fixation of the substrate W to the spin base 10 after the pusher 46 is separated from the substrate W, and move the pusher 46 from the retracted position to the centering position.
  • the retracted position is a position closer to the contact position than the middle between the contact position and the origin position, and is a position close to the outer peripheral portion of the substrate W in a state where the pusher 46 is separated from the substrate W.
  • the distance in the centering direction Dc from the pusher 46 positioned at the retracted position to the outer peripheral portion of the substrate W is, for example, a value exceeding 0 and exceeding 5 mm.
  • the substrate W may move relative to the spin base 10. is there. As described above, if the substrate W is released while the pusher 46 is away from the substrate W, such movement of the substrate W can be prevented. Further, since the distance from the retracted position to the contact position is shorter than the distance from the origin position to the contact position, when the pusher 46 comes into contact with the substrate W again, it is difficult for the substrate W to be displaced.
  • At least a part of the linear motor 49 may be disposed below the guard 20 instead of above the guard 20. Further, at least a part of the linear motor 49 may be disposed around the guard 20 in plan view.
  • the processing cup 17 may include a plurality of guards 20.
  • the plurality of ceiling portions 20a are stacked in the vertical direction, and the plurality of cylindrical portions 20b are arranged concentrically.
  • the centering unit 45 is provided on the guard 20 having the ceiling portion 20a located at the top.
  • the support column 64 of the centering lift unit 61 may be arranged around the guard 20 instead of in the through hole 20y (see FIG. 7) of the guard 20.
  • the centering elevating unit 61 may be a unit different from the guard elevating unit 21 that elevates the guard 20. In the latter case, the centering unit 45 can be raised and lowered independently of the raising and lowering of the guard 20. Furthermore, compared with the case where the guard lifting / lowering unit 21 moves both the guard 20 and the centering unit 45 up / down, the guard lifting / lowering unit 21 can be downsized.
  • the treatment of the substrate W may be a whole surface treatment in which the treatment liquid is supplied to the entire upper surface or lower surface of the substrate W instead of the bevel treatment in which the treatment liquid is supplied only to the outer peripheral portion of the substrate W.
  • the chemical nozzle 22 is an example of a nozzle.
  • the rinse liquid nozzle 26 is an example of a nozzle.
  • the timer 39 is an example of a contact confirmation unit.
  • the linear motor 49 is an example of a centering actuator.
  • the scale 49s of the position sensor is an example of a contact confirmation unit.
  • the position sensor head 49h is an example of a contact confirmation unit.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Ce dispositif de centrage comprend un dispositif d'aspiration pour fixer un substrat sur une base de rotation, et un actionneur de centrage qui amène un poussoir à se déplacer. Un dispositif de commande du dispositif de centrage exécute : une étape de fixation consistant à fixer le substrat sur la base de rotation ; une étape de mise en contact consistant à déplacer le poussoir d'une position sans contact à une position de contact avec le substrat dans un état fixé sur la base de rotation ; une étape de libération consistant à amener le dispositif d'aspiration à libérer le substrat sécurisé de la base de rotation après qu'une unité de vérification de contact a vérifié que le poussoir a atteint la position de contact lors de l'étape de mise en contact ; et une étape de poussée consistant à déplacer le poussoir vers une position de centrage avec le substrat qui a été fixé sur la base de rotation dans un état libéré, déplaçant ainsi le substrat horizontalement par rapport à la base de rotation, pour réduire l'excentricité du substrat.
PCT/JP2018/037877 2018-02-26 2018-10-11 Dispositif de centrage, procédé de centrage, dispositif de traitement de substrat, et procédé de traitement de substrat WO2019163191A1 (fr)

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JP2018032381A JP6934435B2 (ja) 2018-02-26 2018-02-26 センタリング装置、センタリング方法、基板処理装置、および基板処理方法
JP2018-032381 2018-02-26

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JP7330027B2 (ja) * 2019-09-13 2023-08-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、基板処理方法
JP7486984B2 (ja) 2020-03-06 2024-05-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、基板処理方法
CN113109356B (zh) * 2021-04-09 2021-11-23 徐州盛科半导体科技有限公司 一种用于半导体封装缺陷检测的移动平台

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JPS60239024A (ja) * 1984-05-11 1985-11-27 Nippon Kogaku Kk <Nikon> 基板の位置決め装置
JPS6232625A (ja) * 1985-08-05 1987-02-12 Nippon Texas Instr Kk ウエハ位置決め装置
JP2006032661A (ja) * 2004-07-16 2006-02-02 Disco Abrasive Syst Ltd 切削装置
JP2006156612A (ja) * 2004-11-29 2006-06-15 Tokyo Ohka Kogyo Co Ltd 位置決め装置

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US4655584A (en) * 1984-05-11 1987-04-07 Nippon Kogaku K. K. Substrate positioning apparatus
JP4698407B2 (ja) * 2005-12-20 2011-06-08 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2007250783A (ja) * 2006-03-15 2007-09-27 Dainippon Screen Mfg Co Ltd 基板保持回転装置
US8031312B2 (en) * 2006-11-28 2011-10-04 Lg Display Co., Ltd. Array substrate for liquid crystal display device and method of manufacturing the same
JP6847770B2 (ja) * 2017-05-31 2021-03-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

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JPS60239024A (ja) * 1984-05-11 1985-11-27 Nippon Kogaku Kk <Nikon> 基板の位置決め装置
JPS6232625A (ja) * 1985-08-05 1987-02-12 Nippon Texas Instr Kk ウエハ位置決め装置
JP2006032661A (ja) * 2004-07-16 2006-02-02 Disco Abrasive Syst Ltd 切削装置
JP2006156612A (ja) * 2004-11-29 2006-06-15 Tokyo Ohka Kogyo Co Ltd 位置決め装置

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