WO2019161702A1 - 一种扬声器模组以及电子设备 - Google Patents

一种扬声器模组以及电子设备 Download PDF

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Publication number
WO2019161702A1
WO2019161702A1 PCT/CN2018/123200 CN2018123200W WO2019161702A1 WO 2019161702 A1 WO2019161702 A1 WO 2019161702A1 CN 2018123200 W CN2018123200 W CN 2018123200W WO 2019161702 A1 WO2019161702 A1 WO 2019161702A1
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WO
WIPO (PCT)
Prior art keywords
sound absorbing
housing
port
filling
speaker
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PCT/CN2018/123200
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English (en)
French (fr)
Inventor
周树芝
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歌尔股份有限公司
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Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Priority to US16/975,319 priority Critical patent/US11206491B2/en
Publication of WO2019161702A1 publication Critical patent/WO2019161702A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H04R1/288—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2823—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
    • H04R1/2826—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the invention belongs to the technical field of electroacoustic conversion devices, and in particular, to a speaker module and an electronic device.
  • a speaker is a device that converts electrical energy into sound energy, and is widely used in electronic devices such as mobile phones and computers.
  • the speaker when the speaker is assembled with the terminal device, it is usually required to place the speaker unit in the outer casing and assemble it into the terminal device in the form of a module.
  • a retaining wall is usually disposed in the lower casing of the speaker, and a mesh is thermally fused on the retaining wall to form a filling space of the sound absorbing particles.
  • a certain slit is formed between the mesh and the upper casing of the module. The presence of the slit is susceptible to resonance, which affects the acoustic performance of the speaker module.
  • a speaker module comprises: a module housing, a speaker unit and sound absorbing particles; the speaker unit separates the inner cavity enclosed by the module housing into a front sound chamber and a rear sound chamber; the rear sound chamber has a separation a filling zone separated by a wall, the filling zone having a port capable of achieving air circulation; the sound absorbing particles being filled in the filling zone and confined in the filling zone; a port of the filling zone and the die A gap is formed between the inner walls of the group casing, and sound absorbing cotton is disposed in the gap.
  • the module housing includes a first housing and a second housing that is coupled to the first housing to form the inner cavity; the first housing is located in the rear acoustic cavity
  • the partition wall is provided on the bottom wall; the partition wall extends toward the second casing, and the gap is left between the partition and the second casing.
  • the partition wall is combined with a partition for sealing the port of the filling zone and providing airflow, and the sound absorbing cotton is located between the isolating net and the second casing.
  • the sound absorbing cotton is bonded to the partition wall to cover a port of the filling area.
  • the sound absorbing cotton is bonded to the partition wall by bonding or heat fusion.
  • the sound absorbing cotton is subjected to compressive deformation by the pressing force of the second casing in the gap.
  • the sound absorbing cotton is fixed on a position of an inner surface of the second casing facing the port of the filling zone, and the sound absorbing cotton is pressed by the second casing and the partition wall A cover for the fill zone port is achieved.
  • a side of the module housing remote from the sound absorbing cotton, and a filling port is formed on a wall of the filling area; the filling opening is covered with a sealing member.
  • a leakage hole is disposed on the module housing at a position facing the rear acoustic cavity; the leakage hole is covered with a damping.
  • an electronic device includes the above speaker module.
  • the sound absorbing cotton is disposed in the gap between the filling port of the sound absorbing particle and the inner wall of the module casing, and the sound wave transmitted from the speaker unit enters the gap and the resonance caused by the resonance The wave is absorbed by the sound absorbing cotton in the gap, thereby effectively reducing the degree of influence of resonance on the acoustic performance of the speaker module.
  • FIG. 1 is a cross-sectional view of a speaker module according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of a first direction view of a speaker module according to an embodiment of the present invention
  • FIG. 3 is a schematic structural diagram of a second direction view of a speaker module according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a third direction view of a speaker module according to an embodiment of the present invention.
  • FIG. 5 is an exploded view of a speaker module according to an embodiment of the present invention.
  • FIG. 6 is a schematic structural diagram of a fourth direction view of a speaker module according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a fifth direction view of a speaker module according to an embodiment of the present invention.
  • the speaker module includes: a module housing 2, a speaker unit 1 and sound absorbing particles 3; the speaker unit 1 separates a cavity enclosed by the module housing 2 into a front sound chamber. 200 and a rear acoustic cavity 201; the rear acoustic cavity 201 has a filling zone separated by a partition wall 21, the filling zone having a port capable of achieving air circulation; the sound absorbing particles 3 are filled in the filling zone and are limited A gap is formed between the port of the filling zone and the inner wall of the module housing 2, and the sound absorbing cotton 4 is disposed in the gap.
  • the sound absorbing particles have a sound absorbing effect
  • the sound absorbing particles are arranged in the rear sound chamber, which is equivalent to increasing the air flow space in the rear sound chamber, which can effectively improve the low frequency frequency response and improve the acoustic performance.
  • the gap described above is a slit designed in advance to realize the contact of the airflow in the rear acoustic chamber 201 with the sound absorbing particles 3.
  • the sound absorbing cotton is disposed in the gap between the filling port of the sound absorbing particle and the inner wall of the module casing, and the sound wave transmitted from the speaker unit enters the gap and the resonance caused by the resonance The wave is absorbed by the sound absorbing cotton in the gap, thereby effectively reducing the degree of influence of the resonance on the acoustic performance of the speaker module.
  • the gap is filled with the sound absorbing cotton 4, so that the resonance wave generated by the sound wave in the gap is absorbed as much as possible to improve the acoustic performance of the speaker.
  • the module housing 2 includes a first housing 22 and a second housing 23 that is coupled to the first housing 22 to form the inner cavity.
  • the partition wall 21 of the first housing 22 on the bottom wall 220 of the rear acoustic chamber 201 is disposed; the partition wall 21 extends toward the second housing 23, and the second housing 23
  • the gap is left between.
  • the purpose of setting the gap is to ensure that the sound absorbing particles 3 in the filling zone can be in full contact with the airflow in the rear sound chamber 201, thereby increasing the expansion ratio of the sound absorbing particles.
  • the partition wall 21 may be a wall extending from the bottom wall 220 toward the second casing 23; the wall and the bottom wall 220 together define a filling area.
  • the second housing 23 and the first housing 22 may be connected by an adhesive or glue.
  • the first housing 22 may be connected to the first housing 22 by ultrasonic welding.
  • the sound absorbing particles 3 may be confined within the filling zone by one or more of the following methods:
  • the isolation net sealing method can be adopted. Specifically, as shown in FIG. 1 , the partition wall 21 is combined with a partitioning net 31 for covering the port of the filling zone and providing airflow, and the sound absorbing cotton 4 is located at the isolating net 31 and the first Between the two housings 23. The gap exists between the partition net 31 and the inner wall of the second casing 23, and the sound absorbing cotton 4 is disposed in the gap.
  • the partition net 31 may be sealed at the end of the wall to confine the sound absorbing particles in the filling area to prevent the sound absorbing particles from leaking into the magnetic circuit system in the speaker unit.
  • the isolation net 31 includes, but is not limited to, a mesh cloth, a sound absorbing cotton, a metal corrosion resistant net, and the like.
  • the presence of the air holes in the isolation mesh 31 enables contact of the airflow in the rear acoustic cavity 201 with the sound absorbing particles in the filled region.
  • the spacer web 31 may be bonded to the partition wall 21 by means of heat fusion or bonding.
  • the sound absorbing cotton 4 can be directly used to restrict the sound absorbing particles 3 to the filling area.
  • the sound absorbing cotton 4 is bonded to the partition wall 21 to cover the port of the filling area.
  • one side of the sound absorbing cotton 4 is bonded to the sound absorbing particles 3, and the other side is attached to the inner wall of the second casing 23.
  • the sound absorbing cotton 4 can be bonded to the partition wall 21 by means of hot melt or paste, thereby confining the sound absorbing particles in the filling area.
  • the sound absorbing cotton not only plays the role of eliminating resonance, but also functions as a seal instead of the isolation net, thereby effectively saving cost and optimizing the process.
  • the sound absorbing cotton 4 can be sealed at the end of the wall to restrict the sound absorbing particles in the filling area to prevent the sound absorbing particles from leaking into the magnetic circuit system in the speaker unit.
  • the sound absorbing cotton 4 is fixed on the inner surface of the second casing 23 at a position facing the port of the filling zone, and the sound absorbing cotton 4 is sealed by the second casing 23 and the partition wall 21 to cover the filling zone port.
  • the sound absorbing cotton 4 can be fixed to the inner surface of the second casing 23 by heat fusion or pasting.
  • the sound absorbing cotton 4 is subjected to the compressive deformation of the second casing 23 in the gap to cause compression deformation. This allows the sound absorbing cotton 4 to closely fit the inner surface of the second casing 23 to avoid a gap between the sound absorbing cotton 4 and the inner surface of the second casing 23, and to improve the fastness of the sound absorbing cotton.
  • the filling of the sound absorbing particles can be achieved as follows:
  • the sound absorbing particles 4 can be filled into the filling area, and then covered by a spacer or sound absorbing cotton.
  • Method 2 A filling port is opened on the module shell, and after the module is assembled, the sound absorbing particles are filled through the filling port.
  • the side of the module housing 2 remote from the sound absorbing cotton 4 is facing the shell wall of the filling area.
  • a filling port is opened; the filling port is covered with a sealing member 230. It is more convenient to fill the sound absorbing particles 3 through the filling port, and after the filling is completed, sealing is performed by the sealing member 230 to avoid leakage of the sound absorbing particles 3.
  • the filling opening is opened at a position on the first casing 22 facing the filling zone.
  • the material of the sealing member 230 includes, but is not limited to, PET (Polyethylene terephthalate).
  • a leak hole 232 is formed in the module housing 2 at a position facing the rear acoustic cavity 201; the leakage hole 232 is covered with a damping 231. Since the air in the rear sound chamber 201 is compressed or expanded, the leakage hole 232 is provided on the module housing 2 to facilitate the circulation of air to balance the air pressure inside and outside the speaker module. Covering the damping 231 at the leak hole 232 can increase the acoustic resistance of the leak hole to reduce the effect of the leak hole on acoustic performance. Damping 231 includes, but is not limited to, a mesh.
  • the speaker unit 1 in the speaker module needs to be electrically connected to an external circuit through a connection circuit, for example, to an external power supply circuit.
  • the speaker module further includes: a flexible circuit board 5; one end of the flexible circuit board 5 extends into the module housing 2 and the The speaker unit 1 is electrically connected, and the other end protrudes outside the module housing 2.
  • the external circuit realizes electrical connection with the speaker unit 1 by extending one end of the module housing 2.
  • the above speaker module can be a side sound speaker module or a positive sound speaker module.
  • the speaker module in practical applications, in order to improve the IF characteristics or to achieve thinner and lighter products such as mobile phones, the speaker module is generally in a side-sound mode.
  • an electronic device comprising a speaker module.
  • the speaker module refers to related content in the foregoing embodiment, and details are not described herein again.
  • the speaker module includes: a module housing 2, a speaker unit 1 and sound absorbing particles 3; the speaker unit 1 separates a cavity enclosed by the module housing 2 a front acoustic cavity 200 and a rear acoustic cavity 201; the rear acoustic cavity 201 has a filling zone separated by a partition wall 21; the sound absorbing particles 3 are filled in the filling zone and are confined in the filling zone; A gap is formed between the particles 3 and the inner wall of the module casing 2, and the sound absorbing cotton 4 is disposed in the gap.
  • the electronic device includes, but is not limited to, a mobile phone, a tablet, an MP3, and the like.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本发明实施例提供了一种扬声器模组以及电子设备。该扬声器模组包括：模组壳体、扬声器单体以及吸音颗粒；所述扬声器单体将所述模组壳体围成的内腔分隔成前声腔和后声腔；所述后声腔具有通过分隔墙分隔出的填充区，所述填充区具有能够实现空气流通的端口；所述吸音颗粒填充于所述填充区内且被限制在所述填充区内；所述填充区的端口与所述模组壳体内壁之间形成有间隙，所述间隙内设有吸音棉。本发明提供的技术方案能够降低间隙引起的谐振对扬声器模组的声学性能的影响程度。

Description

一种扬声器模组以及电子设备 技术领域
本发明属于电声转换装置技术领域，具体地，本发明涉及一种扬声器模组以及电子设备。
背景技术
扬声器是一种能够将电能转化为声能的器件，其广泛应用于手机、电脑等电子设备中。现有技术中，扬声器与终端设备组配时，通常需要将扬声器单体置于外部壳体中，以模组的形式装配到终端设备中去。
现有技术中，通常会在扬声器下壳设置挡墙，并在该挡墙上方热熔网布以形成吸音颗粒的填充空间。为了确保气流能够透过网布接触吸音颗粒，会在网布与模组上壳之间形成一定的狭缝。而该狭缝的存在易导致谐振，从而影响扬声器模组的声学性能。
发明内容
本发明的一个目的是降低间隙引起的谐振对扬声器模组的声学性能的影响程度。
根据本发明的一个方面，提供了一种扬声器模组。该扬声器模组包括：模组壳体、扬声器单体以及吸音颗粒；所述扬声器单体将所述模组壳体围成的内腔分隔成前声腔和后声腔；所述后声腔具有通过分隔墙分隔出的填充区，所述填充区具有能够实现空气流通的端口；所述吸音颗粒填充于所述填充区内且被限制在所述填充区内；所述填充区的端口与所述模组壳体内壁之间形成有间隙，所述间隙内设有吸音棉。
可选地，所述模组壳体包括第一壳体和盖接于所述第一壳体上形成所述内腔的第二壳体；所述第一壳体的位于所述后声腔的底壁上设有所述分隔墙；所述分隔墙伸向所述第二壳体，且与所述第二壳体之间留有所述间 隙。
可选地，所述分隔墙上结合有用于封盖所述填充区的端口并提供气流流通的隔离网，所述吸音棉位于所述隔离网与所述第二壳体之间。
可选地，所述吸音棉结合于所述分隔墙上，以封盖所述填充区的端口。
可选地，所述吸音棉通过粘接或热熔结合于所述分隔墙上。
可选地，所述吸音棉在所述间隙中受到所述第二壳体的挤压力而产生压缩变形。
可选地，所述吸音棉固定于所述第二壳体的内表面上正对所述填充区的端口的位置，所述吸音棉通过所述第二壳体与所述分隔墙的挤压实现对所述填充区端口的封盖。
可选地，所述模组壳体的远离所述吸音棉的一侧，且正对所述填充区的壳壁上开有填充口；所述填充口处覆盖有密封件。
可选地，所述模组壳体上正对所述后声腔的位置处设有泄露孔；所述泄露孔处覆盖有阻尼。
根据本发明的另一个方面，提供了一种电子设备。该电子设备，包括上述的扬声器模组。
本发明实施例提供的技术方案中，在吸音颗粒的填充区端口与模组壳体内壁之间的间隙中设置吸音棉，当扬声器单体所传来的声波进入到间隙因谐振所产生的谐振波会被间隙内的吸音棉吸收，从而有效降低谐振对扬声器模组的声学性能的影响程度。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。
图1为本发明一实施例提供的扬声器模组的剖面图；
图2为本发明一实施例提供的扬声器模组的第一方向视角的结构示意图；
图3为本发明一实施例提供的扬声器模组的第二方向视角的结构示意图；
图4为本发明一实施例提供的扬声器模组的第三方向视角的结构示意图；
图5为本发明一实施例提供的扬声器模组的爆炸图；
图6为本发明一实施例提供的扬声器模组的第四方向视角的结构示意图；
图7为本发明一实施例提供的扬声器模组的第五方向视角的结构示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
图1为本发明一实施例提供的扬声器模组的剖面图。如图1所示，该扬声器模组包括：模组壳体2、扬声器单体1以及吸音颗粒3；所述扬声器单体1将所述模组壳体2围成的内腔分隔成前声腔200和后声腔201；所述后声腔201具有通过分隔墙21分隔出的填充区，所述填充区具有能够实现空气流通的端口；所述吸音颗粒3填充于所述填充区内且被限制在所述 填充区内；所述填充区的端口与所述模组壳体2内壁之间形成有间隙，所述间隙内设有吸音棉4。
由于吸音颗粒具有吸音效果，在后声腔内设置吸音颗粒，相当于增大了后声腔内的气流流动空间，可有效提高低频频响，提高声学性能。
上述的间隙为预先设计的用于实现后声腔201内的气流与吸音颗粒3接触的狭缝。
众所周知，声波一旦进入到狭窄的空间中，很容易出现谐振现象，产生谐振波，从而影响扬声器模组的声学性能。
本发明实施例提供的技术方案中，在吸音颗粒的填充区端口与模组壳体内壁之间的间隙中设置吸音棉，当扬声器单体所传来的声波进入到间隙因谐振所产生的谐振波会被间隙内的吸音棉吸收，从而有效降低了谐振对扬声器模组的声学性能的影响程度。
在一种可实现的方案中，上述间隙填满吸音棉4，这样可使得声波在间隙中产生的谐振波被尽可能地全部吸收，改善扬声器声学性能。
进一步的，如图1和图2所示，所述模组壳体2包括第一壳体22和盖接于所述第一壳体22上形成所述内腔的第二壳体23；所述第一壳体22的位于所述后声腔201的底壁220上设有所述分隔墙21；所述分隔墙21伸向所述第二壳体23，且与所述第二壳体23之间留有所述间隙。设置所述间隙的目的在于：确保填充区内的吸音颗粒3能够与后声腔201内的气流充分接触，提高吸音颗粒的扩容比。例如：所述分隔墙21可以为自所述底壁220向第二壳体23延伸的围墙；所述围墙和所述底壁220共同围成填充区。
具体地，第二壳体23和第一壳体22可通过粘合剂或胶水实现连接，当然，也可采用超声熔接实现第一壳体22与所述第一壳体22的连接。
可采用如下方法中的一种或多种，将吸音颗粒3限制在填充区内：
方案一，可采用隔离网封合方式。具体地，如图1所示，所述分隔墙21上结合有用于封盖所述填充区的端口并提供气流流通的隔离网31，所述吸音棉4位于所述隔离网31与所述第二壳体23之间。该隔离网31与第二壳体23的内壁之间存在有上述间隙，该间隙内设有吸音棉4。
当分隔墙为上述的围墙结构时，可将隔离网31封合于该围墙的端部，以将吸音颗粒限制在填充区内，避免吸音颗粒泄露进扬声器单体内的磁路系统中。
其中，隔离网31包括但不限于网布、吸音棉、金属耐腐蚀网等。隔离网31上的气孔的存在，实现了后声腔201内的气流与填充区内的吸音颗粒的接触。隔离网31可通过热熔或粘贴的方式结合于分隔墙21上。
方案二，可直接使用吸音棉4来将吸音颗粒3限制在填充区。具体地，所述吸音棉4结合于所述分隔墙21上，以封盖所述填充区的端口。如图1所示，吸音棉4的一侧面与吸音颗粒3贴合，另一侧面与第二壳体23内壁贴合。其中，吸音棉4可通过热熔或粘贴的方式结合于分隔墙21上，进而将吸音颗粒限制在填充区内。在本实施例中，该吸音棉不仅起到了消除谐振的作用，还能代替隔离网起到密封的作用，有效节省了成本，优化了工艺。
当分隔墙21为上述的围墙结构时，可将吸音棉4封合于该围墙的端部，以将吸音颗粒限制在填充区内，避免吸音颗粒泄露进扬声器单体内的磁路系统中。
方案三，吸音棉4固定于第二壳体23的内表面上正对填充区的端口的位置，吸音棉4通过第二壳体23与分隔墙21的挤压实现对填充区端口的封盖。在本方案中，吸音棉4可通过热熔或粘贴等方式固定于第二壳体23的内表面上。
进一步的，在上述方案一和方案二中，吸音棉4在间隙中受到第二壳体23的挤压力而产生压缩变形。这样可使得吸音棉4与第二壳体23的内表面紧密贴合，以避免在吸音棉4与第二壳体23的内表面之间形成缝隙,并且提高吸音棉固定的牢固度。
吸音颗粒的填充可采用如下方式实现：
方法一、可在连接第一壳体22与第二壳体23之前，将吸音颗粒4填充进填充区中，然后在通过隔离网或吸音棉进行封盖。
方法二、在模组壳体上开设填充口，在模组组装完毕后，通过该填充口进行填充吸音颗粒。
上述方法二中，可具体采用如下方式实现：如图3和图6所示，所述模组壳体2的远离所述吸音棉4的一侧，且正对所述填充区的壳壁上开有填充口；所述填充口处覆盖有密封件230。通过填充口填充吸音颗粒3更加方便，在填充完毕之后，通过密封件230进行密封，以避免吸音颗粒3的泄漏。例如：如图1所示，该填充口开设在第一壳体22上正对填充区的位置处。其中，密封件230的材质包括但不限于PET(Polyethylene terephthalate，聚对苯二甲酸乙二醇酯)。
进一步的，如图4、图5和图7所示，所述模组壳体2上正对所述后声腔201的位置处设有泄漏孔232；所述泄漏孔232处覆盖有阻尼231。由于后声腔201中的空气会被压缩或扩张，因此，在模组壳体2上设置泄漏孔232可方便空气的流通，以平衡扬声器模组内外气压。在泄漏孔232处覆盖阻尼231可增加泄漏孔的声阻以减小泄漏孔对声学性能带来的影响。阻尼231包括但不限于网布。
通常，扬声器模组内的扬声器单体1需通过连接电路与外部电路实现电连接，例如：与外部供电电路连接。在一种可实现的方案中，如图4和图5所示，上述扬声器模组还包括：柔性电路板5；所述柔性电路板5的一端伸入所述模组壳体2与所述扬声器单体1电连接，另一端伸出所述模组壳体2外。外部电路通过伸出模组壳体2外的一端实现与扬声器单体1的电连接。
上述的扬声器模组可以为侧出声扬声器模组，也可为正出声扬声器模组。在实际应用中，为了提升中频特性或为了实现手机等产品的轻薄化，扬声器模组一般为侧出声模式。
根据本发明的另一方面，还提供了一种电子设备，该电子设备包括扬声器模组。其中，扬声器模组的具体实现可参见上述实施例中的相关内容，此处不再赘述。
具体地，如图1所示，该扬声器模组包括：模组壳体2、扬声器单体1以及吸音颗粒3；所述扬声器单体1将所述模组壳体2围成的内腔分隔成前声腔200和后声腔201；所述后声腔201具有通过分隔墙21分隔出的填充区；所述吸音颗粒3填充于所述填充区内且被限制在所述填充区内；所 述吸音颗粒3与所述模组壳体2内壁之间形成有间隙，所述间隙内设有吸音棉4。
该电子设备包括但不限于手机、平板电脑、MP3等。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括：模组壳体、扬声器单体以及吸音颗粒；
    所述扬声器单体将所述模组壳体围成的内腔分隔成前声腔和后声腔；
    所述后声腔具有通过分隔墙分隔出的填充区，所述填充区具有能够实现空气流通的端口；
    所述吸音颗粒填充于所述填充区内且被限制在所述填充区内；
    所述填充区的端口与所述模组壳体内壁之间形成有间隙，所述间隙内设有吸音棉。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述模组壳体包括第一壳体和盖接于所述第一壳体上形成所述内腔的第二壳体；
    所述第一壳体的位于所述后声腔的底壁上设有所述分隔墙；
    所述分隔墙伸向所述第二壳体，且与所述第二壳体之间留有所述间隙。
  3. 根据权利要求2所述的扬声器模组，其特征在于，所述分隔墙上结合有用于封盖所述填充区的端口并提供气流流通的隔离网，所述吸音棉位于所述隔离网与所述第二壳体之间。
  4. 根据权利要求2所述的扬声器模组，其特征在于，所述吸音棉结合于所述分隔墙上，以封盖所述填充区的端口。
  5. 根据权利要求4所述的扬声器模组，其特征在于，所述吸音棉通过粘接或热熔结合于所述分隔墙上。
  6. 根据权利要求3至5中任一项所述的扬声器模组，其特征在于，所述吸音棉在所述间隙中受到所述第二壳体的挤压力而产生压缩变形。
  7. 根据权利要求2所述的扬声器模组，其特征在于，所述吸音棉固定于所述第二壳体的内表面上正对所述填充区的端口的位置，所述吸音棉通过所述第二壳体与所述分隔墙的挤压实现对所述填充区端口的封盖。
  8. 根据权利要求1至5、7中任一项所述的扬声器模组，其特征在于，
    所述模组壳体的远离所述吸音棉的一侧，且正对所述填充区的壳壁上 开有填充口；
    所述填充口处覆盖有密封件。
  9. 根据权利要求1至5中任一项所述的扬声器模组，其特征在于，所述模组壳体上正对所述后声腔的位置处设有泄露孔；
    所述泄露孔处覆盖有阻尼。
  10. 一种电子设备，其特征在于，包括权利要求1至9中任一所述的扬声器模组。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112420009A (zh) * 2020-10-28 2021-02-26 无锡华南钢结构环保有限公司 一种燃机用进气系统矩阵式消音器

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108124225B (zh) * 2018-02-26 2020-06-09 歌尔股份有限公司 一种扬声器模组以及电子设备
CN208908495U (zh) * 2018-08-03 2019-05-28 瑞声科技(新加坡)有限公司 扬声器模组
WO2020133320A1 (zh) * 2018-12-29 2020-07-02 瑞声声学科技(深圳)有限公司 扬声器
WO2021000172A1 (zh) * 2019-06-30 2021-01-07 瑞声声学科技(深圳)有限公司 扬声器模组
WO2021000182A1 (zh) * 2019-06-30 2021-01-07 瑞声声学科技(深圳)有限公司 扬声器模组
WO2021000166A1 (zh) * 2019-06-30 2021-01-07 瑞声声学科技(深圳)有限公司 扬声器模组
KR20210015556A (ko) * 2019-08-02 2021-02-10 삼성전자주식회사 공기 흡착 부재 및 스피커 모듈을 포함하는 전자 장치
CN210168222U (zh) * 2019-08-16 2020-03-20 瑞声科技(新加坡)有限公司 扬声器箱
CN110958507B (zh) * 2019-11-22 2021-05-28 歌尔股份有限公司 扬声器模组和电子设备
CN110896507B (zh) * 2019-11-28 2022-03-15 歌尔股份有限公司 扬声器模组
WO2021109156A1 (zh) * 2019-12-07 2021-06-10 瑞声声学科技(深圳)有限公司 扬声器箱
WO2021128008A1 (zh) * 2019-12-24 2021-07-01 瑞声声学科技(深圳)有限公司 扬声器箱
CN212628263U (zh) * 2020-06-29 2021-02-26 瑞声科技(新加坡)有限公司 扬声器箱
CN112995378B (zh) * 2021-02-09 2022-09-02 北京荣耀终端有限公司 一种扬声器模组和电子设备
CN113903320A (zh) * 2021-09-29 2022-01-07 瑞声光电科技(常州)有限公司 吸音材料及应用该吸音材料的扬声器
CN118102194A (zh) * 2024-04-25 2024-05-28 歌尔股份有限公司 吸音块及其制备方法、发声模组和电子设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205987335U (zh) * 2016-07-01 2017-02-22 歌尔股份有限公司 扬声器模组
CN206422903U (zh) * 2017-01-24 2017-08-18 歌尔科技有限公司 吸音组件及设有该吸音组件的扬声器模组
CN107071668A (zh) * 2017-05-24 2017-08-18 歌尔股份有限公司 扬声器模组及电子设备
CN206433156U (zh) * 2017-01-12 2017-08-22 瑞声科技(新加坡)有限公司 扬声器箱
CN108124225A (zh) * 2018-02-26 2018-06-05 歌尔股份有限公司 一种扬声器模组以及电子设备
CN207835803U (zh) * 2018-02-26 2018-09-07 歌尔股份有限公司 一种扬声器模组以及电子设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM490712U (en) * 2014-07-08 2014-11-21 Firstchair Acoustics Co Ltd Improved speaker structure
CN104219607B (zh) * 2014-09-01 2017-01-11 歌尔股份有限公司 扬声器模组
US10567868B2 (en) * 2017-01-26 2020-02-18 AAC Technologies Pte. Ltd. Sound generator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205987335U (zh) * 2016-07-01 2017-02-22 歌尔股份有限公司 扬声器模组
CN206433156U (zh) * 2017-01-12 2017-08-22 瑞声科技(新加坡)有限公司 扬声器箱
CN206422903U (zh) * 2017-01-24 2017-08-18 歌尔科技有限公司 吸音组件及设有该吸音组件的扬声器模组
CN107071668A (zh) * 2017-05-24 2017-08-18 歌尔股份有限公司 扬声器模组及电子设备
CN108124225A (zh) * 2018-02-26 2018-06-05 歌尔股份有限公司 一种扬声器模组以及电子设备
CN207835803U (zh) * 2018-02-26 2018-09-07 歌尔股份有限公司 一种扬声器模组以及电子设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112420009A (zh) * 2020-10-28 2021-02-26 无锡华南钢结构环保有限公司 一种燃机用进气系统矩阵式消音器

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