WO2019119943A1 - 一种吸音颗粒的封装结构及扬声器模组 - Google Patents

一种吸音颗粒的封装结构及扬声器模组 Download PDF

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WO2019119943A1
WO2019119943A1 PCT/CN2018/110214 CN2018110214W WO2019119943A1 WO 2019119943 A1 WO2019119943 A1 WO 2019119943A1 CN 2018110214 W CN2018110214 W CN 2018110214W WO 2019119943 A1 WO2019119943 A1 WO 2019119943A1
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gas permeable
sound absorbing
package
package structure
permeable mesh
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PCT/CN2018/110214
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English (en)
French (fr)
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朱本超
郝正恩
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歌尔科技有限公司
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Publication of WO2019119943A1 publication Critical patent/WO2019119943A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the utility model belongs to the technical field of electroacoustic transducing, in particular, the utility model relates to a packaging structure of a sound absorbing particle and a speaker module.
  • the speaker module is an indispensable component in electro-acoustic products.
  • the speaker module is usually composed of a casing and a speaker unit, and the speaker unit separates the inner cavity of the module casing into a front sound chamber and a rear sound chamber.
  • a sound absorbing member is usually added in the rear sound chamber, and the sound absorbing member absorbs part of the sound energy, which is equivalent to expanding the volume of the rear cavity, thereby Achieve the effect of reducing the module F0.
  • the granular sound absorbing material is widely used in the sound absorbing member of the speaker module because of its good sound absorbing effect.
  • the existing sound absorbing member packaging method cannot fully exert the sound absorbing effect of the granular sound absorbing material. Even in the case of improper packaging, it may cause problems such as increased rear cavity acoustic resistance, lower intermediate frequency response, and higher intermediate frequency distortion.
  • a package structure for sound absorbing particles comprising:
  • a package housing the package housing forming an open receiving area, the receiving area comprising a first transparent surface and a second transparent surface;
  • first gas permeable mesh cloth and a second gas permeable mesh cloth, the first gas permeable mesh cloth is encapsulated on the first transparent surface, and the second gas permeable mesh cloth is encapsulated on the second transparent surface, a first breathable mesh and a second breathable mesh cover the receiving area;
  • the sound absorbing particles are disposed in a receiving area surrounded by the casing, the first gas permeable mesh, and the second gas permeable mesh.
  • the package housing has a filling hole, and the filling hole is closed by the package.
  • the filling hole upper cover is provided with a third gas permeable mesh cloth as a package, and the third gas permeable mesh cloth corresponds to the size and shape of the filling hole;
  • the filling hole is located at an edge of the first transparent surface, and the first gas permeable mesh is covered as a package on the filling hole.
  • the first transparent surface is opposite to the second transparent surface.
  • a speaker module including:
  • the module housing is formed with a rear sound chamber
  • a package structure of the sound absorbing particles is disposed in the rear acoustic cavity
  • At least a gap of a predetermined distance is left between one of the first breathable mesh or the second breathable mesh and the inner surface of the module housing, the gap being in communication with the rear sound hole of the speaker unit.
  • a gap is left between the first air permeable mesh and the second air permeable mesh and the inner surface of the module housing.
  • a sound absorbing material is disposed in the gap.
  • the module housing is formed with a boss in the rear sound cavity, the package structure is mounted on the boss, the first air permeable mesh and the second air permeable mesh and the module shell The gap is formed between the inner surfaces of the body.
  • the boss is provided with four, and the four protrusions are respectively located at four corner positions of the package structure.
  • the package structure is bonded or ultrasonically welded to the boss.
  • One technical effect of the present invention is that the packaging mode of the sound absorbing particles can be improved, and the acoustic performance of the sound absorbing particles can be more fully exerted.
  • Embodiment 1 is an exploded view of a package structure of sound absorbing particles provided in Embodiment 1 of the present invention
  • Figure 2 is an assembled view of the exploded view shown in Figure 1;
  • FIG. 3 is a schematic diagram of a speaker module according to Embodiment 2 of the present invention.
  • the utility model provides a package structure of sound absorbing particles, as shown in FIG. 1 , comprising a package shell 1 , a first gas permeable mesh cloth 2 and a second gas permeable mesh cloth 3 .
  • the package housing 1 forms an open receiving area for filling sound absorbing particles.
  • the accommodating area includes an open first permeable surface and a second permeable surface, and the two permeable surfaces are located on upper and lower sides of the package housing 1.
  • the first air permeable mesh 2 is disposed on the first transparent surface
  • the second air permeable mesh 3 is disposed on the second transparent surface
  • the second breathable mesh 3 has a slit that allows airflow therethrough.
  • Sound absorbing particles are filled in the accommodating area surrounded by the package casing 1, the first permeable mesh 2, and the second permeable mesh 3.
  • the package structure provided by the utility model allows air and sound to circulate in the two areas of the first transparent surface and the second transparent surface, thereby increasing the gas permeable area of the sound absorbing particles, and fully utilizing the sound absorbing effect of the sound absorbing particles.
  • the receiving area formed by the package housing is a through cavity, and the first through surface and the second transparent surface are opposite to each other and communicate with each other.
  • the package housing 1 has a filling hole 4 through which the sound absorbing particles can be filled into the receiving area.
  • the filling hole 4 needs to be closed by the package to prevent the sound absorbing particles from leaking out.
  • the filling hole 4 is provided with a third gas permeable mesh 5 sized to match the filling hole 4, and the third gas permeable mesh 5 serves as a package for the filling hole. 4 closed.
  • the filling hole 4 can also be disposed on the side wall of the package housing 1 without occupying the original gas permeable area of the sound absorbing particle package, thereby ensuring that the sound absorbing effect is fully exerted.
  • the filling hole 4 is located at the edge of the first transparent surface, and the first gas permeable mesh 2 is used as the package, when the first gas permeable mesh 2 covers the first pass. When the surface is permeated, the filling hole 4 is closed together. This embodiment simplifies the assembly process.
  • the utility model also provides a speaker module, as shown in FIG. 3, comprising a module housing, the module housing comprises an upper shell 7 and a lower shell 8, and the upper shell 7 and the lower shell 8 cooperate to form An inner cavity including a front acoustic cavity 9 and a rear acoustic cavity 10.
  • a package structure 6 of the sound absorbing particles provided in an embodiment is disposed in the rear acoustic cavity 10.
  • the package structure 6 increases the gas permeable area of the sound absorbing particles, and more fully exerts the sound absorbing effect of the sound absorbing particles. Therefore, after configuring the package, the speaker module can improve the intermediate frequency response, reduce the intermediate frequency distortion, and improve the sound quality of the module.
  • a gap of a predetermined distance is left between the package structure 6 and the module housing, at least the first air permeable mesh cloth 2 or the second air permeable mesh cloth 3
  • the gap is left between the inner surface of the module housing and the inner surface of the module housing.
  • a speaker unit is usually provided in the speaker module, and the speaker unit is used for working sound. The sound it emits can be transmitted from the sound outlet of the module housing.
  • the speaker unit itself also has a rear sound hole for venting sound and balancing the air pressure on both sides of the diaphragm in the unit. The sound produced by the speaker unit is also transmitted from the rear sound hole, and the gap is communicated with the rear sound hole of the speaker unit. In this way, air and sound can be transmitted to the accommodating area through the ventilated mesh cloth, ensuring smooth airflow on the ventilated mesh cloth, ensuring the sound absorbing effect of the sound absorbing particles, and improving the sound quality of the module.
  • a gap is left between the first gas permeable mesh cloth 2 and the second gas permeable mesh cloth 3 and the inner surface of the module casing.
  • the two breathable mesh cloths can effectively exert the functions of ventilation and sound transmission, effectively increase the area where the sound absorbing particles can receive the sound, and improve the performance of the sound absorbing particles.
  • the gap is filled with a sound absorbing material.
  • the sound absorbing material is sound absorbing cotton.
  • Other sound absorbing materials can be used by those skilled in the art, and the conversion of these sound absorbing materials is within the protection scope of the present application.
  • bosses 11 are provided in the rear acoustic cavity 10 for supporting and fixing the package structure 6.
  • the boss 11 can support the package structure 6, and can form a rear sound hole with the speaker unit between the first air permeable mesh cloth 2 and the second air permeable mesh cloth 3 and the inner surface of the module housing. Connected gaps.
  • the boss 11 firmly fixes the package structure 6 on the boss 11 to avoid looseness.
  • the module housing at the rear sound chamber 10 is rectangular, and the boss 11 is provided with four corners respectively located at four corners of the rectangular module housing.
  • package structure 6 and the boss 11 are fixed together by bonding.
  • ultrasonic welding, riveting, snapping, etc. may be used, and the present application does not limit this.
  • the speaker module further includes a vibration system and a magnetic circuit system.
  • An sound outlet is formed on the module housing, and the module housing is configured to transmit sound generated when the vibration system vibrates from the sound outlet. At the same time, the sound generated when the vibration system vibrates can also be transmitted to the rear sound chamber 10.
  • the magnetic circuit system is configured to drive the vibration system to vibrate when an acoustic signal is applied to the vibration system.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本实用新型涉及一种吸音颗粒的封装结构及扬声器模组，封装壳体，所述封装壳体形成开放的容纳区域，所述容纳区域包括第一通透面和第二通透面；第一透气网布和第二透气网布，所述第一透气网布封装在所述第一通透面上，所述第二透气网布封装在所述第二通透面上，所述第一透气网布和第二透气网布封闭所述容纳区域；吸音颗粒，所述吸音颗粒设置在所述壳体、第一透气网布和第二透气网布围成的容纳区域中。本实用新型所达到的一个技术效果是改善了吸音颗粒的封装方式。

Description

一种吸音颗粒的封装结构及扬声器模组 技术领域
本实用新型属于电声换能技术领域，具体地，本实用新型涉及一种吸音颗粒的封装结构及扬声器模组。
背景技术
扬声器模组作为一种将电信号转换为声音信号能量转换器，是电声产品中不可或缺的部件。扬声器模组通常由外壳和扬声器单体组成，扬声器单体将模组外壳的内腔分隔成前声腔和后声腔。
随着科技发展，智能手机等电子产品对扬声器要求越来越高，低共振频率F0、高频率响应、优良的音质要求越来越受到关注。为了改善扬声器模组声学性能(如降低模组的谐振频率F0、扩展带宽)，通常会在后声腔内增设吸音件，吸音件会吸收掉部分声能，等效于扩大后腔体容积，从而达到降低模组F0效果。
颗粒状吸声材料因具有良好的吸音效果，被广泛应用于扬声器模组的吸音件中。但是，现有的吸音件封装方式不能完全发挥颗粒状吸音材料的吸声效果。甚至，在封装方式不当的情况下，反而有可能导致后腔声阻增大、中频频响降低、中频失真升高等问题的出现。
实用新型内容
本实用新型的一个目的是提供一种改进的吸音颗粒的封装结构。
根据本实用新型的第一个方面，提供一种吸音颗粒的封装结构，包括：
封装壳体，所述封装壳体形成开放的容纳区域，所述容纳区域包括第一通透面和第二通透面；
第一透气网布和第二透气网布，所述第一透气网布封装在所述第一通透面上，所述第二透气网布封装在所述第二通透面上，所述第一透气网布 和第二透气网布封闭所述容纳区域；
吸音颗粒，所述吸音颗粒设置在所述壳体、第一透气网布和第二透气网布围成的容纳区域中。
可选地，所述封装壳体上具有灌装孔，所述灌装孔被封装件封闭。
可选地，所述灌装孔上盖设有作为封装件的第三透气网布，所述第三透气网布与所述灌装孔大小和形状对应；
或者，所述灌装孔位于所述第一通透面的边缘，所述第一透气网布作为封装件盖设在所述灌装孔上。
可选地，所述第一通透面与所述第二通透面位置相对。
根据本实用新型的第二个方面，提供了一种扬声器模组，包括：
模组壳体，所述模组壳体形成有后声腔；
所述后声腔中设置有上述吸音颗粒的封装结构；
至少所述第一透气网布或第二透气网布之一与所述模组壳体的内表面之间留有预定距离的间隙，所述间隙与扬声器单体的后声孔连通。
可选地，所述第一透气网布和第二透气网布与所述模组壳体的内表面之间均留有间隙。
可选地，所述间隙中设置有吸音材料。
可选地，所述模组壳体在后声腔中形成有凸台，所述封装结构架设在所述凸台上，所述第一透气网布和第二透气网布与所述模组壳体的内表面之间均形成有所述间隙。
可选地，所述凸台设有四个，四个所述凸台分别位于所述封装结构的四个边角位置。
可选地，所述封装结构粘接或超声焊接在所述凸台上。
本实用新型的一个技术效果在于，能够改善吸音颗粒的封装方式，更充分的发挥吸音颗粒的声学性能。
通过以下参照附图对本实用新型的示例性实施例的详细描述，本实用新型的其它特征及其优点将会变得清楚。
附图说明
构成说明书的一部分的附图描述了本实用新型的实施例，并且连同说明书一起用于解释本实用新型的原理。
图1是本实用新型实施例一提供的吸音颗粒的封装结构爆炸图；
图2是图1所示爆炸图的组装示意图；
图3是本实用新型实施例二提供的扬声器模组示意图。
具体实施方式
现在将参照附图来详细描述本实用新型的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本实用新型的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本实用新型及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
实施例一
本实用新型提供了一种吸音颗粒的封装结构，如图1所示，包括封装壳体1、第一透气网布2、第二透气网布3。所述封装壳体1形成开放的容纳区域，用于填充吸音颗粒。所述容纳区域包括开放的第一通透面和第二通透面，上述两个通透面位于所述封装壳体1的上下两面。所述第一透气网布2盖设在所述第一通透面上，所述第二透气网布3盖设在所述第二通透面上，所述第一透气网布2和第二透气网布3上具有允许气流通过的缝隙。在所述封装壳体1、第一透气网布2和第二透气网布3围成的容纳区 域内填充有吸音颗粒。本实用新型提供的封装结构在第一通透面和第二通透面两个区域允许空气、声音流通，增加了吸音颗粒的透气面积，能够更充分的发挥吸音颗粒的吸音效果。
可选地，封装壳体构成的容纳区域为一贯通的腔体，所述第一通透面和所述第二通透面位置相对、相互连通。
进一步地，如图1所示，所述封装壳体1上具有灌装孔4，所述吸音颗粒可以通过所述灌装孔4填充到所述容纳区域中。所述灌装孔4需要被封装件封闭，以防吸音颗粒漏出。在一种可选的实施方式中，所述灌装孔4上设置有大小与灌装孔4相匹配的第三透气网布5，第三透气网布5作为封装件将所述灌装孔4封闭。采用这样的填充结构，方便了吸音颗粒的填充，而且灌装孔4同样采用透气网布封闭，能够减少因灌装孔4的设置占用过多透气面积，保证了吸音颗粒封装的透气面积。可选地，所述灌装孔4还可以设置在所述封装壳体1的侧壁上，不占用吸音颗粒封装原有的透气面积，保证吸音效果充分发挥。
在另一种实施方式中，所述灌装孔4位于所述第一通透面的边缘，所述第一透气网布2作为上述封装件，当第一透气网布2覆盖在第一通透面上时，一同将灌装孔4封闭。这种实施方式简化了装配工序。
实施例二
本实用新型还提供了一种扬声器模组，如图3所示，包括模组壳体，所述模组壳体包括上壳7和下壳8，所述上壳7和下壳8配合形成内腔，所述内腔包括前声腔9和后声腔10。所述后声腔10中配置有实施例一种提供的吸音颗粒的封装结构6。所述封装结构6增加了吸音颗粒的透气面积，更充分的发挥了吸音颗粒的吸音效果。因此，扬声器模组在配置所述封装后，能够提高中频频响、降低中频失真和改善模组音质。
所述封装结构6配置在所述后声腔10时，所述封装结构6与所述模组壳体之间留有预定距离的间隙，至少第一透气网布2或第二透气网布3之一与模组壳体的内表面之间留有上述间隙。扬声器模组中通常设置有扬声器单体，扬声器单体用于工作发声。其发出的声音能够从模组壳体的出 声口传出。扬声器单体自身还具有后声孔，该后声孔用于泄声、平衡单体内振膜两侧的气压。扬声器单体产生的声音也会从所述后声孔传出，上述间隙与扬声器单体的后声孔连通。这样，空气和声音能够通过透气网布传递至容纳区域中，保证透气网布上气流流通顺畅，使吸音颗粒的吸音效果得到保证，提升模组的音质。
优选地，所述第一透气网布2和第二透气网布3与所述模组壳体的内表面之间均留有间隙。这样，两个透气网布均能够有效发挥透气、透声的作用，有效增大吸音颗粒能够接收到声音的面积，提高吸音颗粒的性能发挥。
进一步地，所述间隙中填充有吸音材料。通过向间隙内填充吸音材料，可以进一步地提高中频频响、降低中频失真和改善模组音质。优选地，所述吸音材料为吸音棉。本领域技术人员可以采用其它吸音材料，这些吸音材料的变换，都属于本申请的保护范围。
具体的，在所述后声腔10中设置有预定数量的凸台11，所述凸台11用于支撑和固定所述封装结构6。凸台11能够支撑所述封装结构6，能够使所述第一透气网布2和第二透气网布3与所述模组壳体的内表面之间均形成与扬声器单体的后声孔连通的间隙。同时，所述凸台11将所述封装结构6牢牢的固定在凸台11上，避免松动。优选地，所述后声腔10处的模组壳体为矩形，所述凸台11设置有四个，分别位于矩形的模组壳体的四个边角。
进一步地，所述封装结构6与所述凸台11通过粘接固定在一起。可选地，也可以采用超声焊接、铆接、卡接等连接方式，本申请对此不做限制。
如图3-4所示，所述扬声器模组还包括振动系统和磁路系统。模组壳体上形成有出声口，所述模组壳体配置为能使所述振动系统振动时产生的声音从所述出声口传出。同时，振动系统振动时产生的声音也能够传至所述后声腔10中。所述磁路系统被配置为当振动系统中通入声音信号时驱动所述振动系统振动。
虽然已经通过示例对本实用新型的一些特定实施例进行了详细说明， 但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本实用新型的范围。本领域的技术人员应该理解，可在不脱离本实用新型的范围和精神的情况下，对以上实施例进行修改。本实用新型的范围由所附权利要求来限定。

Claims (10)

  1. 一种吸音颗粒的封装结构，其特征在于，包括：
    封装壳体，所述封装壳体形成开放的容纳区域，所述容纳区域包括第一通透面和第二通透面；
    第一透气网布和第二透气网布，所述第一透气网布封装在所述第一通透面上，所述第二透气网布封装在所述第二通透面上，所述第一透气网布和第二透气网布封闭所述容纳区域；
    吸音颗粒，所述吸音颗粒设置在所述壳体、第一透气网布和第二透气网布围成的容纳区域中。
  2. 根据权利要求1所述的封装结构，其特征在于，所述封装壳体上具有灌装孔，所述灌装孔被封装件封闭。
  3. 根据权利要求2所述的封装结构，其特征在于，所述灌装孔上盖设有作为封装件的第三透气网布，所述第三透气网布与所述灌装孔大小对应；
    或者，所述灌装孔位于所述第一通透面的边缘，所述第一透气网布作为封装件盖设在所述灌装孔上。
  4. 根据权利要求1所述的封装结构，其特征在于，所述第一通透面与所述第二通透面位置相对。
  5. 一种扬声器模组，其特征在于，包括：
    模组壳体，所述模组壳体形成有后声腔；
    所述后声腔中设置有权利要求1-4任一所述的吸音颗粒的封装结构；
    至少所述第一透气网布或第二透气网布之一与所述模组壳体的内表面之间留有预定距离的间隙，所述间隙与扬声器单体的后声孔连通。
  6. 根据权利要求5所述的扬声器模组，其特征在于，所述第一透气网布和第二透气网布与所述模组壳体的内表面之间均留有间隙。
  7. 根据权利要求5所述的扬声器模组，其特征在于，所述间隙中设置有吸音材料。
  8. 根据权利要求5所述的扬声器模组，其特征在于，所述模组壳体在后声腔中形成有凸台，所述封装结构架设在所述凸台上，所述第一透气网 布和第二透气网布与所述模组壳体的内表面之间均形成有所述间隙。
  9. 根据权利要求8所述的扬声器模组，其特征在于，所述凸台设有四个，四个所述凸台分别位于所述封装结构的四个边角位置。
  10. 根据权利要求8所述的扬声器模组，其特征在于，所述封装结构粘接或超声焊接在所述凸台上。
PCT/CN2018/110214 2017-12-22 2018-10-15 一种吸音颗粒的封装结构及扬声器模组 WO2019119943A1 (zh)

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CN109831725A (zh) * 2018-12-27 2019-05-31 瑞声科技(新加坡)有限公司 扬声器模组
CN109905819B (zh) * 2018-12-27 2021-06-15 瑞声科技(新加坡)有限公司 一种扬声器结构、移动设备及扬声器结构的组装方法
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