WO2020015295A1 - 一种扬声器模组 - Google Patents

一种扬声器模组 Download PDF

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Publication number
WO2020015295A1
WO2020015295A1 PCT/CN2018/121127 CN2018121127W WO2020015295A1 WO 2020015295 A1 WO2020015295 A1 WO 2020015295A1 CN 2018121127 W CN2018121127 W CN 2018121127W WO 2020015295 A1 WO2020015295 A1 WO 2020015295A1
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Prior art keywords
cavity
module
sound
speaker
module according
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PCT/CN2018/121127
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English (en)
French (fr)
Inventor
张北京
贾锋超
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歌尔股份有限公司
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Publication of WO2020015295A1 publication Critical patent/WO2020015295A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present application relates to the technical field of electro-acoustic products, and in particular, to a speaker module.
  • the speaker module in an electronic device needs to be continuously improved in performance.
  • the speaker module generally includes a housing and a speaker unit housed in the housing.
  • the speaker unit separates the space in the housing into a front acoustic cavity and a rear acoustic cavity.
  • the front acoustic cavity is in communication with the side sound hole of the speaker module, and the rear acoustic cavity is provided with A leak hole communicating with the outside world.
  • a speaker unit inside is provided with a gap for radiating sound waves to the rear acoustic cavity, and the airflow generated by the vibration of the speaker unit can smoothly flow into the rear acoustic cavity. This structure will cause the speaker module to The sound resistance of the group is small, resulting in a higher Q value of the speaker module.
  • a sound-absorbing particle cavity is separated by a breathable spacer in the rear cavity, and sound-absorbing particles are filled in the sound-absorbing particle cavity.
  • Acoustic cavity to improve the acoustic performance of the speaker module is often limited by the size and structure of the rear acoustic cavity.
  • the breathable spacer must be horizontally arranged, and the breathable spacer must maintain a certain gap with the upper case of the module, so that the airflow can enter the sound absorption containing the sound absorption particles. In the particle cavity.
  • the conventional method is to connect the breathable isolator 1 with the module lower shell 6, and a filling is provided on the module lower shell 6 to communicate with the sound-absorbing particle cavity 8.
  • the purpose of this application is to provide a new technical solution for a speaker module.
  • a speaker module including: a housing and a speaker unit disposed in the housing, the speaker unit dividing a space in the housing into a front acoustic cavity and a rear acoustic cavity; the speaker A gap is provided on the single body to radiate sound waves to the rear acoustic cavity; the speaker unit and the rear acoustic cavity communicate through a slit, and a cross-sectional area of the slit is smaller than a cross-sectional area of the gap.
  • a sound-absorbing particle cavity is provided in the rear sound cavity, and a breathable spacer is provided in the rear sound cavity to prevent the sound-absorbing particles from entering the speaker unit.
  • the breathable spacer uses a mesh cloth.
  • the shell includes a module upper shell and a module lower shell that are cooperatively connected.
  • the inner wall of the upper shell of the module is provided with two vertical retaining walls that extend into the rear acoustic cavity; the breathable spacer is connected to the lower ends of the two vertical retaining walls in a horizontal state.
  • the inner wall of the lower shell of the module opposite to the breathable spacer is flat.
  • the air-permeable spacer divides the rear acoustic cavity into two cavities that are distributed upward and downward, the cavity located at the upper part is a sound-absorbing particle cavity, and the cavity located at the lower part is in communication with the slit.
  • a slit between a convex portion on the inner wall of the lower shell of the module and a vertical retaining wall near the convex portion forms the slit.
  • a filling hole communicating with the sound-absorbing particle cavity is provided on the module upper shell at a position corresponding to the sound-absorbing particle cavity.
  • a ring groove is provided on the module upper shell corresponding to the filling hole, and the groove is provided with a covering covering the filling hole for sealing the filling hole. Seals.
  • the outside of the seal is flush with the outside of the upper case of the module.
  • the speaker module solution provided in this application has a slit between the rear acoustic cavity and the speaker unit in the speaker module, which can increase the acoustic resistance of the rear acoustic cavity and effectively reduce the phenomenon that the Q value of the speaker module is high.
  • the cavity of the sound-absorbing particle cavity in the rear acoustic cavity is larger than the cavity of the conventionally designed sound-absorbing particle cavity, which can reduce the resonance frequency F0 of the speaker module and improve the low-frequency performance of the speaker module.
  • FIG. 1 is a schematic structural diagram of a speaker module according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram illustrating an external structure of a module upper case of a speaker module according to an embodiment of the present application.
  • FIG. 3 is a schematic diagram illustrating an external structure of a module lower case of a speaker module according to an embodiment of the present application.
  • any specific value should be construed as exemplary only and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.
  • a speaker module provided in an embodiment of the present application includes a casing and a speaker unit 4 disposed in the casing, and the speaker unit 4 divides a space in the casing. Is the front acoustic cavity and the rear acoustic cavity; the speaker unit 4 is provided with a gap 5 for radiating sound waves to the rear acoustic cavity; the speaker unit 4 and the rear acoustic cavity are communicated through a slit 2, and the cross-sectional area of the slit 2 is smaller than the gap 5 Cross-sectional area.
  • the above-mentioned gap 5 refers to a position on the speaker unit 4 where sound waves propagate to the rear acoustic cavity.
  • the magnetic circuit system of the speaker unit 4 may include a center magnet and a side magnet forming a magnetic gap with the center magnet, and the gap 5 is located at a corner position of two adjacent side magnets. When the speaker unit 4 emits sound, the sound will propagate from the gap 5 to the rear acoustic cavity.
  • magnetic circuit systems of other structures may also be selected, such as a single magnetic circuit structure or a multiple magnetic circuit structure, which will not be described in detail here.
  • a communication slot 2 is provided between the internal speaker unit and the rear acoustic cavity.
  • the slot 2 can increase the sound resistance during sound transmission and improve the low frequency of the speaker module. Performance, thereby improving the high Q value of the speaker module.
  • a sound-absorbing particle cavity 8 is provided in the rear sound cavity, and a breathable spacer 1 for preventing sound-absorbing particles from entering the speaker unit 4 is also provided in the rear sound cavity.
  • the breathable spacer 1 can be a mesh cloth.
  • the shell structure of the speaker module includes: a module upper case 3 and a module lower case 6; a module upper case 3 and a module lower case; 6
  • the contact position needs to be sealed.
  • the contact portions of the module upper case 3 and the module lower case 6 are connected as a whole by welding to form a shell.
  • the welding of the module upper shell 3 and the module lower shell 6 can be firmly connected together.
  • the contact portions of the module upper case 3 and the module lower case 6 are all coated with glue and connected together by means of bonding. This connection method is simple and low cost.
  • the contact portions of the module upper case 3 and the module lower case 6 are connected together by means of crimping, which can make the module upper case 3 and the module lower case 6 firmly together and have a relatively high integrity. it is good.
  • a side acoustic hole 9 is provided on the side wall of the module lower case 6, and the side acoustic hole 9 communicates with the front acoustic cavity and is used to form an outlet channel of the front acoustic cavity.
  • the speaker unit 4 vibrates to generate sound, the sound is transmitted from the front channel of the front sound cavity, and then transmitted to the outside of the speaker module through the side sound hole 9.
  • two vertical blocking walls 11 extending into the rear acoustic cavity are provided on the inner wall of the upper shell 3 of the module.
  • the two vertical blocking walls 11 are located on the left and right sides of the filling hole 7 and are air-permeable and isolated.
  • the piece 1 is connected between the lower ends of the two vertical retaining walls 11 in a horizontal state (here, the lower end of the vertical retaining walls 11, as shown in FIG. 1, means that the vertical retaining walls 11 extend into the rear acoustic cavity.
  • One end which is used to connect the air-permeable spacer 1), wherein the inner wall of the module lower shell 6 opposite to the air-permeable spacer 1 has a flat plate shape, and a part of the inner wall of the module upper shell 3 opposite to the air-permeable spacer 1 forms a protrusion upward.
  • the air-permeable spacer 1 can be used to divide the rear sound cavity into two cavities that are distributed upward and downward, of which the cavity at the upper part is the sound-absorbing particle cavity 8 and the cavity at the lower part
  • the body is in direct communication with the above-mentioned slit 2, and the airflow can flow into the lower cavity in the sound cavity through the slit 2, and the airflow flows upward through the air-permeable spacer 1 and enters the sound-absorbing particle cavity 8 to communicate with the sound-absorbing particles.
  • a convex portion is further provided on the inner wall of the module lower case 6, and a gap is left between the convex portion and the adjacent vertical blocking wall 11, and the gap constitutes the slit 2.
  • the cross-sectional area of the slit 2 must be smaller than the cross-sectional area of the gap 5 described above. Due to the existence of the slit 2, the airflow can pass through the slit 2 and the air-permeable spacer 1 into the sound-absorbing particle cavity 8. In the process, the airflow passage is reduced, the sound resistance of the rear acoustic cavity is increased, and the speaker module Q value.
  • the speaker module provided by the embodiment of the present application uses With the gap 12 in FIG. 4, to a certain extent, the volume of the sound-absorbing particle cavity 8 is significantly increased, so that more sound-absorbing particles can be filled, and the resonance frequency (F0) of the speaker module can be reduced to a greater extent, which improves the Speaker module low frequency performance.
  • the air-permeable spacer 1 can be connected to the lower ends of the two vertical retaining walls 11 by heat fusion, so that the air-permeable spacer 1 can be firmly connected between the lower ends of the two vertical retaining walls 11, The air-permeable spacer 1 does not drop during use, so that sound-absorbing particles can be prevented from entering the speaker unit 4.
  • the breathable spacer 1 can also be connected to the lower ends of the two vertical barrier walls 11 in other ways, such as bonding or injection molding, as long as the breathable spacer 1 can be firmly connected to the two vertical barrier walls 11 Just fine.
  • the air-permeable spacer 1 can be made of mesh, for example, metal mesh can be used, which is stronger and more durable.
  • the cavity of the sound-absorbing particle cavity 8 has a large volume and can accommodate a large number of sound-absorbing particles, which can reduce the resonance frequency (F0) of the speaker module to a greater extent and improve low-frequency performance.
  • the inner wall of the upper case 3 of the module is provided with two vertical retaining walls 11 that vertically extend into the rear acoustic cavity; the breathable spacer 1 is selected from a mesh cloth, and the mesh cloth is connected in a horizontal state. Between the lower ends of the two vertical retaining walls 11 and the distance between the mesh cloth and the module lower shell is 0.3 mm, the inner wall of the module lower shell 6 opposite to the breathable spacer 1 is flat, and the breathable A part of the inner wall of the upper shell 3 of the module 1 opposite to the spacer 1 forms a protrusion upward, and the mesh divides the rear acoustic cavity into two cavities distributed upwards and downwards.
  • the upper cavity is the above-mentioned sound-absorbing particle cavity 8 and is located at the lower portion.
  • the cavity is in communication with the above-mentioned slit 2.
  • a filling hole 7 communicating with the sound-absorbing particle cavity 8 is provided on the module upper shell 3 at a position corresponding to the sound-absorbing particle cavity 8.
  • the sound-absorbing particles can be filled into the sound-absorbing particle cavity 8 through the filling holes 7.
  • the filling amount of sound-absorbing particles can be flexibly set according to needs.
  • the sound-absorbing particles are used to reduce the resonance frequency (F0) of the speaker module, improve the low-frequency frequency response, and expand the bandwidth.
  • the filling holes 7 communicating with the sound-absorbing particle cavity 8 are closed, and the filling holes 7 are generally sealed with a sealing member (the sealing plate is not shown in the figure).
  • a sealing member the sealing plate is not shown in the figure.
  • PET board, PC board, PP board, etc. can be used as the sealing member.
  • the shape of the seal is not limited, as long as the filling hole can be closed.
  • a groove can be provided along the filling hole 7 on the outside of the top wall of the upper shell 3 of the module, and the filling hole 7 can be provided in the groove to cover the filling hole 7
  • the sealed seal wherein the design of the groove is favorable for fixing the seal, so that the filling hole 7 can be closed.
  • Leak holes 10 communicating with the outside are provided on the module lower shell 6 at positions corresponding to the rear acoustic cavity.
  • the number and position of the leak holes 10 can be adjusted according to actual needs.
  • the leak hole is used to balance the air pressure between the rear acoustic cavity and the outside world, and adjust the acoustic performance of the speaker module.
  • a circle avoidance structure may be provided on the outer wall of the module lower case 6 around the leak hole 10, and the avoidance structure may surround the leak hole 10
  • the grooves are round, and the depth of the grooves is smaller than the thickness of the module lower shell 6.
  • the avoidance structure can be designed into different shapes as required.
  • the speaker module provided in the embodiment of the present application has a significant improvement on the mid-to-low frequency hearing sense.

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  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本申请公开了一种扬声器模组，包括：壳体和设置于壳体内的扬声器单体，扬声器单体将壳体内的空间分为前声腔和后声腔；扬声器单体上设置有向后声腔辐射声波的间隙；扬声器单体和后声腔之间通过狭缝连通，且狭缝的截面面积小于间隙的截面面积。本申请的扬声器模组，改善了现有扬声器模组Q值偏高的情况。

Description

一种扬声器模组 技术领域
本申请涉及电声产品技术领域，特别涉及一种扬声器模组。
背景技术
随着电子科技的快速发展，人们对电子产品越来越依赖，尤其是人们对于电子产品的音频播放性能有了更高的要求。因此，电子设备中的扬声器模组需要不断的进行性能提升。
扬声器模组一般包括壳体和收容在壳体内的扬声器单体，扬声器单体将壳体内的空间分隔为前声腔和后声腔，前声腔与扬声器模组的侧出声孔连通，后声腔设有连通外界的泄漏孔。然而，上述结构的扬声器模组，其内部的扬声器单体上设置有向后声腔辐射声波的间隙，扬声器单体振动产生的气流能很顺畅的流入到后声腔内，这种结构会导致扬声器模组的声阻较小，导致扬声器模组的Q值偏高。
另外，为了获得更优的声学性能，提高扬声器模组的低频响度，现有技术是在后腔内通过透气隔离件分隔出一个吸音颗粒腔，在吸音颗粒腔内灌装吸音颗粒，虚拟扩大后声腔，以此来提高扬声器模组的声学性能。但是，这种方式往往受到后声腔大小和结构的限制，其中的透气隔离件必须呈水平设置，且透气隔离件还必须与模组上壳保持一定的间隙，气流才能进入容纳有吸音颗粒的吸音颗粒腔中。在后声腔中设置透气隔离件1时，参照图4所示，常规的方式是将透气隔离件1与模组下壳6连接，在模组下壳6上设置连通吸音颗粒腔8的灌装孔7，但在靠近扬声器单体4处，透气隔离件1与模组上壳3之间的缝隙12会被浪费掉，即没有被有效利用，实际是缩小了吸音颗粒腔8的体积，即减少了吸音颗粒的灌装量，这会导致扬声器模组低频性能提升有限，还会使扬声器模组的Q值偏高，最终影响扬声器模组的中低频听感。
申请内容
本申请的目的在于提供一种扬声器模组的新技术方案。
根据本申请的一个方面，提供了一种扬声器模组，包括：壳体和设置于壳体内的扬声器单体，所述扬声器单体将壳体内的空间分为前声腔和后声腔；所述扬声器单体上设置有向所述后声腔辐射声波的间隙；所述扬声器单体和所述后声腔之间通过狭缝连通，且所述狭缝的截面面积小于所述间隙的截面面积。
可选地，所述后声腔内设置有吸音颗粒腔，所述后声腔内还设置有防止吸音颗粒进入到扬声器单体中的透气隔离件。
可选地，所述透气隔离件采用网布。
可选地，可选地，所述壳体，包括配合连接的模组上壳和模组下壳。
可选地，所述模组上壳的内壁上设置有伸入所述后声腔内的两个竖直挡壁；所述透气隔离件以水平状态连接于两个所述竖直挡壁的下端之间，其中，与所述透气隔离件相对的模组下壳内壁呈平板状。
可选地，所述透气隔离件将所述后声腔分成呈上、下分布的两个腔体，位于上部的腔体为吸音颗粒腔，位于下部的腔体与所述狭缝连通。
可选地，所述模组下壳内壁上的凸起部与靠近所述凸起部的竖直挡壁之间的缝隙构成所述狭缝。
可选地，所述模组上壳上对应于所述吸音颗粒腔的位置设置有与所述吸音颗粒腔连通的灌装孔。
可选地，在所述模组上壳上对应所述灌装孔的周围设置一圈凹槽，所述凹槽内设置有覆盖在所述灌装孔上用于将所述灌装孔密封的密封件。
可选地，所述密封件的外侧与所述模组上壳的外侧齐平。
本申请提供的扬声器模组方案，在扬声器模组内的后声腔与扬声器单体之间留有狭缝，可以增大后声腔声阻，能有效降低扬声器模组的Q值偏高的现象。并且，后声腔内吸音颗粒腔的腔体比常规设计吸音颗粒腔的腔体大，能降低扬声器模组的谐振频率F0，提高扬声器模组的低频性能。
为使本申请的上述目的、特征和优点能更明显易懂，下文特举较佳实施例，并配合所附附图，作详细说明如下。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对实施例中所需要使用的附图作简单地介绍。应当理解，以下附图仅示出了本申请的某些实施例，因此不应被看作是对范围的限定。对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。
图1示出了本申请实施例提供的扬声器模组的结构示意图。
图2示出了本申请实施例提供的扬声器模组的模组上壳的外部结构示意图。
图3示出了本申请实施例提供的扬声器模组的模组下壳的外部结构示意图。
附图标记说明。
1.透气隔离件，2.狭缝，3.模组上壳，4.扬声器单体，5.间隙，6.模组下壳，7.灌装孔，8.吸音颗粒腔，9.侧出声孔，10.泄露孔，11.竖直挡壁，12.缝隙。
具体实施方式
现在将参照附图来详细描述本申请的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本申请的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本申请及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步 讨论。
本申请实施例提供的一种扬声器模组，参照图1、图2以及图3所示，包括：壳体和设置于壳体内的扬声器单体4，该扬声器单体4将壳体内的空间分为前声腔和后声腔；扬声器单体4上设置有向后声腔辐射声波的间隙5；扬声器单体4和后声腔之间通过狭缝2连通，且该狭缝2的横截面面积小于间隙5的横截面面积。
其中，上述的间隙5指的是扬声器单体4上向后声腔传播声波的位置。例如扬声器单体4的磁路系统可以包括中心磁铁以及与中心磁铁形成磁间隙的边磁铁，间隙5位于相邻两个边磁铁的拐角位置。当扬声器单体4发声时，声音会从该间隙5中向后声腔传播。当然，对于本领域技术人员而言，还可以选择其它结构的磁路系统，例如单磁路结构或者多磁路结构，在此不再具体说明。
通过该间隙5，扬声器单体振动产生的声音可以顺畅地传播到后声腔内，扬声器模组后声腔的声阻较小，导致扬声器模组的Q值偏高。本申请实施例提供的扬声器模组，其内部的扬声器单体与后声腔之间设有连通的狭缝2，该狭缝2可增大声音传播时的声阻，提升了扬声器模组的低频性能，从而改善了扬声器模组Q值偏高的现象。
上述的扬声器模组，在后声腔内设置有吸音颗粒腔8，且后声腔内还设置有防止吸音颗粒进入到扬声器单体4中的透气隔离件1。该透气隔离件1可以采用网布。
其中，参照图1、图2以及图3所示，上述扬声器模组的壳体结构为，包括：模组上壳3和模组下壳6两部分；模组上壳3和模组下壳6接触的位置需要密封。
在一个例子中，模组上壳3和模组下壳6的接触部分通过焊接的方式连接为一体，形成一个壳体。采用焊接的方式能使模组上壳3和模组下壳6牢固的连接在一起。
在一个例子中，模组上壳3和模组下壳6的接触部分均涂胶，采用粘接的方式连接在一起，这种连接方式简单且成本低。
在一个例子中，模组上壳3和模组下壳6的接触部分采用压接的方式 连接在一起，能使模组上壳3和模组下壳6牢固的结合在一起且整体性较好。
当然，并不限于上述方式，只要能使模组上壳3与模组下壳6牢固的密封即可。
其中，在模组下壳6的侧壁上设置有侧出声孔9，且该侧出声孔9与前声腔连通，用于形成前声腔的出声道。当扬声器单体4振动产生声音时，声音先由前声腔的出声道传出，再由侧出声孔9传送至扬声器模组的外部。
上述的扬声器模组，在模组上壳3的内壁上设置有伸入后声腔内的两个竖直挡壁11，两个竖直挡壁11位于灌装孔7的左右两侧，透气隔离件1以水平状态连接于两个竖直挡壁11的下端之间(此处，竖直挡壁11的下端，参照图1所示，指的是竖直挡壁11伸入后声腔内的一端，该端用于连接透气隔离件1)，其中，与透气隔离件1相对的模组下壳6内壁呈平板状，与透气隔离件1相对的模组上壳3内壁一部分向上形成凸起(相当于增加了吸音颗粒腔8的体积)；采用透气隔离件1可以将后声腔分成呈上、下分布的两个腔体，其中位于上部的腔体为吸音颗粒腔8，位于下部的腔体与上述的狭缝2是直接连通的，气流可以经狭缝2流入后声腔内位于下部的腔体中，气流向上流动穿过透气隔离件1后进入到吸音颗粒腔8内，与吸音颗粒接触，从而达到降低扬声器模组Q值的目的。
参照图1所示，在模组下壳6的内壁上还设置有一个凸起部，该凸起部与邻近的竖直挡壁11之间留有缝隙，该缝隙构成狭缝2。狭缝2的横截面面积一定要小于上述间隙5的横截面面积。由于狭缝2的存在可以使气流经狭缝2、透气隔离件1进入吸音颗粒腔8内，在这一过程中缩小了气流的流通通道，增大后声腔的声阻，降低扬声器模组的Q值。
本申请实施例提供的扬声器模组内后声腔结构与常规设计的扬声器模组后声腔结构相比，分别参照图1、图4所示，可以看出：本申请实施例提供的扬声器模组利用了图4中的缝隙12，在一定程度上，吸音颗粒腔8的体积明显增大，这样可以填充更多的吸音颗粒，能更大程度的降低扬声器模组的谐振频率(F0)，提升了扬声器模组低频性能。
在一个具体的例子中，透气隔离件1可以采用热熔方式与两个竖直挡 壁11的下端连接，使透气隔离件1能牢固的连接于两个竖直挡壁11的下端之间，不会在使用中发生透气隔离件1掉落的现象，从而能避免吸音颗粒进入扬声器单体4中。当然，透气隔离件1也可以采用其他的方式与两个竖直挡壁11的下端连接，如：粘接或注塑方式结合，只要能使透气隔离件1与两个竖直挡壁11连接牢固即可。
其中，透气隔离件1可以采用网布，如：可以采用金属网布，更加坚固、耐用。
其中，透气隔离件1与模组下壳6之间留有一定的间距，其间距离不小于0.3mm，保证吸音颗粒腔8较大体积的同时，不会影响气流的流通。其中，吸音颗粒腔8的腔体体积大，能容纳能多的吸音颗粒，可以更大程度的降低扬声器模组的谐振频率(F0)，提高低频性能。
在一个具体的例子中，在模组上壳3的内壁上设置有竖直伸入后声腔内的两个竖直挡壁11；将透气隔离件1选用网布，将网布以水平状态连接于两个竖直挡壁11的下端之间，且使网布距离模组下壳的距离为0.3mm，与所述透气隔离件1相对的模组下壳6内壁呈平板状，所述透气隔离件1相对的模组上壳3内壁一部分向上形成凸起，网布将后声腔分成呈上、下分布的两个腔体，其中位于上部的腔体为上述的吸音颗粒腔8，位于下部的腔体与上述的狭缝2连通。
为了方便灌装吸音颗粒，在模组上壳3上对应于吸音颗粒腔8的位置开设有与吸音颗粒腔8连通的灌装孔7。可以通过灌装孔7向吸音颗粒腔8内灌装吸音颗粒。其中，吸音颗粒的灌装量可以根据需要灵活设置。吸音颗粒用于降低扬声器模组的谐振频率(F0)，提高低频频响，扩展带宽。
当灌装吸音颗粒完毕后，要封闭与吸音颗粒腔8连通的灌装孔7，一般是采用密封件对灌装孔7进行密封(图中未示出密封板)。其中，密封件可以采用PET板、PC板、PP板等。密封件的形状不做限定，只要能将灌装孔封闭起来即可。
在一个具体的例子中，可以在模组上壳3的顶壁外侧沿着灌装孔7设置一圈凹槽，在凹槽内设置覆盖在灌装孔7上用于将该灌装孔7密封的密封件，其中，凹槽的设计利于固定密封件，从而能将灌装孔7封闭起来。
在模组下壳6上对应于后声腔的位置开设有与外部连通的泄露孔10，泄露孔10的数量和位置可以根据实际需求进行调整。泄漏孔用于平衡后声腔与外界的气压，调节扬声器模组的声学性能。在组装产品时，为了防止开设的泄露孔10被产品的其它部分封堵上，可以在模组下壳6的外壁上围绕泄露孔10设置一圈避让结构，该避让结构可以为围绕泄露孔10的一圈凹槽，且凹槽的深度要小于模组下壳6的厚度，避让结构可以根据需要设计为不同的形状。
综合起来，本申请实施例提供的扬声器模组，对于中低频听感有明显改善。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。
虽然已经通过例子对本申请的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本申请的范围。本领域的技术人员应该理解，可在不脱离本申请的范围的情况下，对以上实施例进行修改。本申请的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括：壳体和设置于壳体内的扬声器单体，所述扬声器单体将壳体内的空间分为前声腔和后声腔；所述扬声器单体上设置有向所述后声腔辐射声波的间隙；所述扬声器单体和所述后声腔之间通过狭缝连通，且所述狭缝的截面面积小于所述间隙的截面面积。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述后声腔内设置有吸音颗粒腔，所述后声腔内还设置有防止吸音颗粒进入到扬声器单体中的透气隔离件。
  3. 根据权利要求2所述的扬声器模组，其特征在于，所述透气隔离件采用网布。
  4. 根据权利要求1所述的扬声器模组，其特征在于，所述壳体，包括配合连接的模组上壳和模组下壳。
  5. 根据权利要求4所述的扬声器模组，其特征在于，所述模组上壳的内壁上设置有伸入所述后声腔内的两个竖直挡壁；所述透气隔离件以水平状态连接于两个所述竖直挡壁的下端之间，其中，与所述透气隔离件相对的模组下壳内壁呈平板状。
  6. 根据权利要求5所述的扬声器模组，其特征在于，所述透气隔离件将所述后声腔分成呈上、下分布的两个腔体，位于上部的腔体为吸音颗粒腔，位于下部的腔体与所述狭缝连通。
  7. 根据权利要求6所述的扬声器模组，其特征在于，所述模组下壳内壁上的凸起部与靠近所述凸起部的竖直挡壁之间的缝隙构成所述狭缝。
  8. 根据权利要求4所述的扬声器模组，其特征在于，所述模组上壳上对应于所述吸音颗粒腔的位置设置有与所述吸音颗粒腔连通的灌装孔。
  9. 根据权利要求8所述的扬声器模组，其特征在于，在所述模组上壳上对应所述灌装孔的周围设置一圈凹槽，所述凹槽内设置有覆盖在所述灌装孔上用于将所述灌装孔密封的密封件。
  10. 根据权利要求9所述的扬声器模组，其特征在于，所述密封件的外侧与所述模组上壳的外侧齐平。
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