WO2019153452A1 - 一种印刷电路板及其制作方法和电子装置 - Google Patents

一种印刷电路板及其制作方法和电子装置 Download PDF

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Publication number
WO2019153452A1
WO2019153452A1 PCT/CN2018/080937 CN2018080937W WO2019153452A1 WO 2019153452 A1 WO2019153452 A1 WO 2019153452A1 CN 2018080937 W CN2018080937 W CN 2018080937W WO 2019153452 A1 WO2019153452 A1 WO 2019153452A1
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WO
WIPO (PCT)
Prior art keywords
core
layer
core plate
heat sink
printed circuit
Prior art date
Application number
PCT/CN2018/080937
Other languages
English (en)
French (fr)
Inventor
谢占昊
缪桦
李传智
陈绪东
Original Assignee
深南电路股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 深南电路股份有限公司 filed Critical 深南电路股份有限公司
Publication of WO2019153452A1 publication Critical patent/WO2019153452A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the present application relates to the field of integrated circuit technology, and in particular, to a printed circuit board, a manufacturing method thereof, and an electronic device.
  • PCB Printed circuit board Board
  • the technical problem to be solved by the present application is to provide a printed circuit board, a manufacturing method thereof and an electronic device to solve the heat dissipation problem of the circuit board caused by the volume reduction of the electronic device.
  • a technical solution adopted by the present application is to provide a printed circuit board comprising: a core board assembly comprising a first core board and a second core board stacked in sequence, the second core board being close to One side of the first core plate is provided with a metal layer, the first core plate is provided with a through groove penetrating the first core plate; a heat dissipating device is received in the through groove; and a conductive bonding layer Provided between the metal layer of the second core board and the heat sink for electrically connecting the heat sink to the metal layer.
  • an electronic device including: a printed circuit board, comprising: a core board assembly, comprising a first core board and a second core board stacked in sequence, a metal layer is disposed on a side of the second core board adjacent to the first core board, and the first core board is provided with a through slot penetrating the first core board, and the second core board is provided with a through hole a mounting slot of the second core board; a first heat sink disposed in the through slot; a conductive bonding layer disposed between the metal layer of the second core board and the first heat sink for electrically connecting the first heat sink to the metal layer; and a heat generating device In the mounting groove, the maximum cross-sectional area of the heat generating device is smaller than the area of the bottom surface of the first heat sink that constitutes the mounting groove.
  • another technical solution adopted by the present application is to provide a first core board, a second core board, a heat dissipating device and a conductive bonding material, and one side of the second core board is provided with a metal layer;
  • the first core plate is grooved to form a first through groove penetrating the first core plate; the heat sink is placed in the first through groove; and the first core plate and the The second core plate is pressed to form the printed circuit board such that the heat sink is attached to the metal layer by the conductive bonding material.
  • the beneficial effects of the above embodiment are as follows: by forming a through groove in the core plate assembly, and placing the first heat sink in the through groove on the core plate assembly, and then using the conductive bonding layer to the first heat sink and the second core The metal layer on the board is connected and turned on, so that the heat of the metal layer on the second core board is transmitted to the first heat dissipating device through the conductive bonding layer, thereby dissipating heat through the first heat dissipating device and improving the printed circuit board Thermal performance.
  • FIG. 1 is a cross-sectional view showing the overall structure of a printed circuit board in an embodiment of the present application
  • FIG. 2 is a schematic perspective structural view of a first heat dissipating device according to another embodiment of the present application.
  • FIG. 3 is a schematic perspective structural view of an electronic device according to another embodiment of the present application.
  • 4-6 are flowcharts showing a method of fabricating a printed circuit board according to still another embodiment of the present application.
  • FIG. 7-11 are flow charts showing a manufacturing process of a printed circuit board according to still another embodiment of the present application.
  • first and second in this application are used for descriptive purposes only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the meaning of "a plurality” is at least two, such as two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, etc.) in the embodiments of the present application After ...) is only used to explain the relative positional relationship, motion, etc.
  • the fixed connection may also be detachably connected or integrally connected; it may be a mechanical connection; it may be a direct connection or an indirect connection through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood by those skilled in the art as the case may be.
  • the electronic device may include, for example, a smart phone, a tablet personal computer, a mobile phone, a video phone, an e-book reader, a desktop computer, a laptop, a netbook computer, a workstation, a server, a personal digital assistant, One of a portable multimedia player, player, medical instrument, camera, and wearable device.
  • the wearable device may include accessories (such as watches, rings, bracelets, anklets, glasses, contact lenses or head-mounted devices), clothing-integrated (eg, electronic clothes), body-attached (eg, skin pads or tattoos), or implantable Incoming type (eg implantable circuit).
  • the home appliance may include, for example, a digital versatile disc player, audio, refrigerator, air conditioner, cleaner, oven, microwave oven, washing machine, air filter, set top box, home automation control panel, security control panel, television box , game consoles, electronic dictionaries, electronic keys, cameras and electronic panels.
  • a digital versatile disc player audio, refrigerator, air conditioner, cleaner, oven, microwave oven, washing machine, air filter, set top box, home automation control panel, security control panel, television box , game consoles, electronic dictionaries, electronic keys, cameras and electronic panels.
  • the electronic device may also include various medical devices (eg, various portable medical measuring devices (glucometers, heart rate measuring devices, blood pressure measuring devices, and body temperature measuring devices), magnetic resonance angiography, magnetic resonance imaging devices, computed tomography devices, photography Devices and ultrasonic devices), navigation systems, global navigation satellite systems, event data recorders, flight data recorders, vehicle infotainment devices, electronic devices for boats (eg navigation devices for vessels and gyrocompasses), aviation Electronic devices, security devices, vehicle head units, industrial or home robots, ATMs at financial companies, point of sale in stores, and Internet of Things (such as light bulbs, various sensors, electricity meters or gas meters, sprinkler devices, fire alarm devices, At least one of a thermostat, a utility pole, a toaster, a motion device, a hot water tank, a heater, and a boiler.
  • various medical devices eg, various portable medical measuring devices (glucometers, heart rate measuring devices, blood pressure measuring devices, and body temperature measuring devices), magnetic resonance angiography, magnetic
  • an electronic device may include furniture or a building/structure or a part of a vehicle, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (eg, water service, electric energy, gas, or electric wave measurement) Device).
  • the electronic device may be flexible, or the electronic device may be two or more combinations of various devices.
  • the electronic device according to an embodiment of the present application is not limited to the above device.
  • references to "an embodiment” herein mean that a particular feature, structure, or characteristic described in connection with the embodiments can be included in at least one embodiment of the present application.
  • the appearances of the phrases in various places in the specification are not necessarily referring to the same embodiments, and are not exclusive or alternative embodiments that are mutually exclusive. Those skilled in the art will understand and implicitly understand that the embodiments described herein can be combined with other embodiments.
  • FIG. 1 is a cross-sectional view showing the overall structure of a printed circuit board according to an embodiment of the present application.
  • the printed circuit board 100 can generally include: a core board assembly 10 , a heat sink 20 embedded in the core board assembly 10 , and a conductive bonding layer 30 , and the heat sink 20
  • the core layer assembly 10 is connected by the conductive bonding layer 30.
  • the core board assembly 10 may include a first core board 12 and a second core board 14 which are sequentially stacked.
  • the first core panel 12 may include a core dielectric 120 and a metal layer 122 on at least one side of the core dielectric 120.
  • the second core panel 14 can include a core panel media 140 and a metal layer 142 on at least one side of the core panel media 140.
  • the choice of materials for the core media 120 and 140 can be selected based on the functional design of each core. It is also possible that the loss factor (DF, Damping) is suitable for RF circuits. Factor) Smaller materials such as ceramic-based high-frequency materials or polytetrafluoroethylene. It can also be a material with a large loss factor suitable for conventional circuits, such as FR-4 (including epoxy resin).
  • the core dielectrics 120 and 140 may be made of a material that allows passage of a radio frequency signal of a certain frequency, and the material may also be a thermosetting material, and the core dielectrics 120 and 140 are previously heat-treated and cured, so that the shape thereof Fixed, the core media 120 and 140 will not deform again during subsequent heating.
  • the core medium can also be a thermoplastic material that softens after heating.
  • thermosetting material means that the material can soften and flow when heated for the first time, and is heated to a certain temperature to generate a chemical reaction to solidify and harden the crosslink; the change is irreversible, and thereafter, when heated again, the material It can no longer be softened.
  • thermoset materials include, but are not limited to, allyl resins, epoxy resins, thermosets Polyurethane, silicone or polysiloxane, etc. These resins may be formed from the reaction product of a polymerizable composition comprising at least one oligomeric urethane (meth) acrylate. Typically, the oligomeric urethane (meth) acrylate is a poly(meth) acrylate.
  • (meth)acrylate is used to refer to esters of acrylic acid and methacrylic acid, and is in contrast to "poly(meth)acrylate” which is generally referred to as a (meth)acrylate polymer, "multiple ( "Methyl) acrylate” means a molecule comprising more than one (meth) acrylate group. Most commonly, the poly(meth)acrylate is di(meth)acrylate, but tris(meth)acrylate, tetra(meth)acrylate, and the like are also contemplated.
  • the metal layer 142 is disposed on the side of the first core board 12 adjacent to the second core board 14.
  • the metal layers 122, 142 on the first core plate 12 and the second core plate 14 may each be a copper layer.
  • copper has good electrical conductivity and is the most commonly used circuit material for printed circuit board 100.
  • Each of the first core board 12 and the second core board 14 is patterned to obtain a desired line pattern, and the metal layers 122 and 142 can be divided into a signal layer 144 and a ground layer 142 according to a functional design; The pattern of the signal layer 144 is more complex than the pattern of the ground plane.
  • signal layer 144 is the layer in which the plurality of metal lines are used to form electrical connections between the electronic devices; ground layer 142 is used to connect to ground, typically a layer of large area continuous metal regions.
  • the metal layer 142 of the second core board 14 connected to the heat sink 20 through the conductive bonding layer 30 is the ground layer 142, that is, the indirect electrical connection between the heat sink 20 and the ground layer 142 on the second core board 14 is achieved.
  • the ground layer 142 can be electrically connected to the heat sink 20 directly through the laminated structure of the sandwich, thereby directly grounding, and the grounding path can be shortened, thereby improving the grounding effect of the electronic device to be grounded on the printed circuit board 100. And grounding stability.
  • the opposite sides of the core medium 140 of the second core plate 14 are provided with a metal layer 142 .
  • the metal layer 142 on the side of the second core board 14 adjacent to the first core board 12 is the ground layer 142, and the metal layer 144 facing away from the other side of the first core board 12 is the first signal layer 144.
  • the number of the first core plates 12 may be plural, and the plurality of first core plates 12 may be sequentially stacked.
  • the number of first core sheets 12 in the illustrated embodiment is two.
  • the number of the second core plates 14 may also be multiple.
  • the core plate assembly 14 may further include at least one third core plate, and at least one third core plate is stacked on a side of the second core plate 14 facing away from the first core plate 12.
  • Each of the third core sheets may include a core medium and a metal layer on at least one side of the core medium.
  • the distance between the third core plates of all the third core plates 13 and the second core plate 14 that faces the second core plate 14 is away from the second core plate 14
  • the metal layer on one side is the second signal layer (ie, the outer metal layer of the outermost third core plate is the signal layer).
  • the core board assembly 10 includes two layers of a first core board 12 and a second core board 14, and the order of the first core board 12 and the second core board 14 is sequentially stacked.
  • the core plate assembly 10 can be provided with a through slot 16 for receiving the heat sink 20 and the heat conductive bonding layer 30 .
  • the through groove 16 extends through the entire first core plate 12 in the thickness direction of the first core plate 12, but does not extend to any portion of the second core plate 14.
  • a through groove (shown in FIG. 8) is formed on the plurality of first core plates 12, and when the first core plate 12 and the second core plate 14 are sequentially stacked, the first core plate 12 is All of the through grooves 124 are disposed corresponding to each other and are cut off at the metal layer 142 in contact with the second core plate 14 to form an accommodating space for accommodating the heat sink 20, and the heat sink is at least partially housed in the accommodating space.
  • the maximum cross-sectional area of the through groove 16 is larger than the maximum cross-sectional area of the heat sink 20 so that the outer wall of the heat sink 20 and the side wall of the first core plate 12 surrounding the through groove 16 can be formed. Clearance 17.
  • the maximum cross-sectional area of the through groove 16 refers to the maximum area of the through groove 16 projected in the stacking direction perpendicular to the first core plate 12 and the second core plate 14.
  • the maximum cross-sectional area of the heat sink 20 refers to the maximum area of the heat sink 20 along a section perpendicular to the stacking direction of the first core board 12 and the second core board 14.
  • the heat sink 20 is disposed in the through slot 16 for dissipating heat from the metal layer 142 in contact therewith.
  • the heat sink 20 is a device having a conductive and heat conducting function, which may be a metal block in which the metal block is entirely or partially embedded in the through groove 16 to dissipate heat from the metal layer 142 electrically connected through the conductive bonding layer 30.
  • the metal block 20 may be made of pure metal, and the metal materials used include, but are not limited to, copper, copper alloy, aluminum, aluminum alloy, iron, iron alloy, nickel, nickel alloy, gold, gold alloy, Silver, silver alloy, platinum group, platinum group alloy, chromium, chromium alloy, magnesium, magnesium alloy, tungsten, tungsten alloy, molybdenum, molybdenum alloy, lead, lead alloy, tin, tin alloy, indium, indium alloy, zinc or zinc Alloys, etc.
  • the material of the metal block 20 may also be composed of a metal base block and a conductive graphite sheet. Since the thermal resistance of the conductive graphite sheet is smaller than that of ordinary metals and alloys, the conductive graphite sheet can be embedded in the metal to make the heat conduction more rapid.
  • the material of the heat sink 20 is not limited in the present application.
  • the shape of the heat sink 20 may be a regular shape such as a cube, a cylinder or a regular cube, or may be an irregular shape.
  • the structure of the heat sink 20 is not limited in the present application.
  • a heat dissipation fin 21 connected to the heat sink 20 may be disposed.
  • the heat dissipation fin 21 may include a base portion 211 and a plurality of fin portions 212 .
  • the base portion 211 of the heat dissipation fin 21 is connected to the heat sink 20, and the plurality of fin portions 212 are spaced apart from one side of the heat dissipation fin 21 on the side of the discrete heat device 20.
  • the base 211 can transfer heat on the heat sink 20 to the fin portion 212.
  • the gap can form an air flow passage, and thus the contact area of the heat dissipation fin 21 with the air can be increased, thereby accelerating heat dissipation.
  • a heat pipe may be disposed on the heat dissipation fins 21.
  • at least one through hole may be formed in each fin portion 212, and a heat pipe may be disposed on each of the through holes.
  • a thermal conductive adhesive may be coated between the heat pipe and the perforated hole wall.
  • the heat conductivity of the heat pipe is much higher than that of pure metals such as copper and aluminum, and the heat transfer is not oriented and has a certain length, the heat can be transferred to a long distance, and therefore, the heat dissipation performance is obviously improved.
  • the present application may also use other embodiments that can increase the heat dissipation area of the heat sink 20 to speed up the heat dissipation. These embodiments are similar to the structure and principle of the present application, and fall within the protection scope of the present application.
  • the conductive bonding layer 30 is disposed between the metal layer 142 of the second core board 14 and the heat sink 20 for the metal layer on the heat sink 20 and the second core board 14. 142 electrical connections.
  • the conductive bonding layer 30 is a bonding layer having electrical conductivity and adhesion.
  • the conductive bonding material may be a mixture comprising a conductive material and a viscous material, wherein the conductive material may be metal or graphite; the viscous material may be epoxy resin.
  • the heat dissipation device 20 and the metal layer 142 on the second core board 14 can be indirectly realized. Electrical connection enables grounding of the metal layer 142 on the second core board 14.
  • the conductive bonding layer 30 has adhesiveness, the heat sink 20 and the metal layer 142 can be closely bonded together to ensure contact between the heat sink 20 and the metal layer 142 of the second core board 14. effect.
  • the conductive bonding sheet 30 also has thermal conduction properties, and can transfer heat generated on the metal layer 142 to the heat sink 20 to accelerate heat dissipation of the metal layer 142.
  • the indirect electrical connection between the heat dissipating device 20 and the metal layer 142 on the second core plate 14 is achieved by using the conductive bonding layer 30, since the contact area of the conductive bonding layer 30 and the metal layer 142 is larger than that of the conventional drilling ground.
  • the contact area with the metal layer 142, so that the conductive bonding layer 30 is used to increase the contact area, can make the grounding stability of the metal layer 142 better.
  • the conductive bonding layer 30 may have a cross-sectional area that is less than or equal to the area of the surface of the heat sink 20 that is in contact with the conductive bonding layer 30.
  • the cross-sectional area of the conductive bonding layer 30 refers to an area in a direction parallel to the surface of the heat sink 20 that is in contact with the conductive bonding layer 30.
  • the electrically conductive bonding layer 30 can be a conductive bonding material.
  • the so-called conductive bonding material may be in the form of a paste or a paste having a certain fluidity, or may be in a semi-cured form.
  • the semi-immobilized form is solid at normal temperature, but has a certain fluidity after heating to a certain temperature, and then forms a final solidification at a certain temperature.
  • the conductive material may be bonded to the heat sink 20 or the metal layer 142 of the second core board 14 connected to the heat sink 20 by printing or coating, and then placed in the heat sink 20, and When the first core plate 12 and the second core plate 14 are pressed together to form a laminated sandwich structure, the heat sink 20 is bonded to the metal layer 142 of the second core plate 14.
  • the conductive material is, for example, a conductive paste composed of a resin matrix, conductive particles, a dispersing additive, an auxiliary agent, or the like.
  • the resin matrix may be an adhesive system such as an epoxy resin, a silicone resin, a polyimide resin, a phenol resin, a polyurethane, or an acrylic resin. These adhesives form a molecular skeleton structure of the conductive paste after curing, providing mechanical properties and bonding properties, and forming conductive channel particles into channels.
  • the conductive particles may be powders of gold, silver, copper, aluminum, zinc, iron, nickel, and graphite and some conductive compounds for achieving electrical conductivity.
  • the conductive material may also be a conductive silver paste, a conductive copper paste or a conductive solder paste or the like.
  • a conductive silver paste may be applied to the heat sink 20 and the metal layer 142 connected to the heat sink 20, and the conductive silver paste is coated before the conductive silver paste is uncured. The regions are bonded to each other, and the conductive silver paste can be cured to form the conductive bonding layer 30 by a subsequent curing process, whereby the heat sink 20 can be bonded to the metal layer 142 of the second core plate 14.
  • the electrically conductive bonding layer 30 can also be a semi-cured bonding sheet.
  • the semi-cured bonding sheet is bonded to the metal layer 142 on the heat sink 20 or the second core board, and then the side of the heat sink 20 to which the semi-cured bonding sheet is attached is placed in the core board assembly.
  • the heat sink 20 is bonded to the metal layer 142 of the second core plate 14 when the first core plate 12 and the second core plate 14 are pressed together to form a sandwich structure. It will be understood that all manner of indirectly electrically connecting the heat sink 20 to the metal layer 142 on the second core panel 14 using the conductive bonding layer 30 is within the scope of the present application.
  • the conductive bonding layer 30 may be a conductive foam.
  • the conductive foam can be disposed on the opposite sides of the conductive foam, so that the conductive foam can be respectively adhered to the heat dissipation device 20 and the metal layer 142 through the double-sided adhesive on opposite sides, thereby implementing the heat dissipation device. Bonding and electrical connection of 20 and metal layer 142 on second core panel 14.
  • the conductive foam has the characteristics of good electrical conductivity and large elasticity, and can effectively fill the small gap between the heat sink 20 and the metal layer 142, so that the heat sink 20 and the metal layer 142 are in sufficient contact, thereby effectively Overcoming the problem of insufficient grounding due to insufficient contact between the heat sink 20 and the metal layer 142 during the mounting process is overcome.
  • the bonding sheet can also be obtained by adding a metal silver to the epoxy resin.
  • the printed circuit board 100 may further include a first connection layer 18.
  • the first connecting layer 18 is disposed between the first core board 12 and the second core board 14, and is disposed around the conductive bonding layer 30 for bonding the first core board 12 and the second core board 14 .
  • the adjacent two first core plates 12 and between the adjacent two second core plates 14 may also be disposed.
  • the first connecting layer 18 bonds the plurality of core sheets 12 and 14 of the core board assembly 10 to each other.
  • the first connecting layer 18 may be a viscous material, and may specifically be a thermosetting material.
  • the first connecting layer 18 is different from the core dielectrics 120 and 140 in that the first connecting layer 18 is a thermosetting material that has not been heat treated. Therefore, when the first connecting layer 18 is heated, the first connecting layer 18 can be melted, and the adjacent two first core plates 12, the adjacent two second core plates 14, and the first core plates 12 adjacent to each other are further melted. Bonded to the second core panel 14.
  • the first tie layer 18 can also be made of a thermoplastic material.
  • the thermoplastic material means that the thermoplastic refers to a plastic having heat softening and cooling hardening properties. It becomes soft and even flows when heated, and the cooling becomes hard. This process is reversible and can be repeated.
  • Common thermoplastic materials include, but are not limited to, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyoxymethylene, polycarbonate, polyamide, acrylic, other polyolefins and copolymers thereof, agglomeration, polystyrene Ether, chlorinated polyether, etc.
  • the molecular chains of the resin are linear or branched, and there is no chemical bond between the molecular chains. The process of softening and heating when heated, the process of cooling and hardening is a physical change.
  • thermoplastic material may include: polyketone, polyaramid, polyimide, polyetherimide, polyamideimide, polyphenylene sulfide, polyphenylsulfone, fluoropolymer, polyphenylene Imidazole, their derivatives or a combination thereof.
  • thermoplastic material can include a polymer such as polyketone, thermoplastic polyimide, polyetherimide, polyphenylene sulfide, polyethersulfone, polysulfone, polyamideimide, Their derivatives, or a combination thereof.
  • a polymer such as polyketone, thermoplastic polyimide, polyetherimide, polyphenylene sulfide, polyethersulfone, polysulfone, polyamideimide, Their derivatives, or a combination thereof.
  • thermoplastic material can also include polyketones such as polyetheretherketone, polyetherketone, polyetherketoneketone, polyetherketoneetherketone, derivatives thereof, or combinations thereof.
  • An exemplary thermoplastic fluoropolymer comprises: fluorinated ethylene propylene, polytetrafluoroethylene, polyvinylidene fluoride, perfluoroalkoxy, tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride. Terpolymer, polychlorotrifluoroethylene, ethylene-tetrafluoroethylene copolymer, ethylene-chlorotrifluoroethylene copolymer, or any combination thereof.
  • an outer sidewall of the heat sink 20 and the inner sidewall of the first core panel 12 may be enclosed.
  • a second connection layer 19 is disposed in the gap 17.
  • the second connecting layer 19 can likewise be made of an untreated thermosetting material or a thermoplastic material. Therefore, when the core plate assembly 10 is heated, the second connecting layer 19 is uniformly melted in the gap 17 after being melted by heat, which not only allows the heat sink 20 and the first core plate 12 to be closely bonded to reduce the falling off. possibility.
  • the first connection layer 18 and the second connection layer 19 may be a unitary structure. Specifically, when a plurality of first core sheets 12 and a plurality of second core sheets 14 are provided, two adjacent first core sheets 12 and two adjacent second core sheets 14 are used by the first connecting layer 18. Bonded to each other. When the layered sandwich structure is heated, the first connecting layer 18 melts and flows into the outer side wall of the heat sink 20 and the gap 17 between the inner side walls of the first core plate 12 enclosing the through groove 16 to be cooled. Thereafter, a second connection layer 19 is formed which is received at the outer side wall of the heat sink 20 and the gap 17 between the inner side walls of the first core plate 12 which surrounds the through groove 16.
  • a mounting slot 40 is formed through the second core panel 14 on the second core panel 14, and the mounting slot 40 is used to further mount a heat generating device (shown in FIG. 3).
  • the mounting groove 40 is disposed corresponding to the position of the heat sink 20, and the mounting groove 40 passes through the conductive bonding layer 30 and extends to the surface or the inside of the heat sink 20, but the depth thereof is smaller than the height of the printed circuit board 100.
  • the mounting groove 40 may also extend from the signal layer 144 on the second core board 14 to the surface or interior of the heat sink 20. .
  • the extension of the mounting groove 40 to the inside of the heat sink 20 specifically means that the depth of the mounting groove 40 is greater than the thickness of the second core plate 14 and smaller than the thickness of the printed circuit board 100.
  • the area of the conductive bonding layer 30 occupied by the mounting groove 40 is smaller than the cross-sectional area of the conductive bonding layer 30, so that the heat sink 20 can pass through the remaining conductive bonding layer 30 and the metal layer 142 on the second core board 14. connection.
  • the mounting groove 40 of a predetermined depth can be directly milled on the second core plate 14 by the controlled deep milling process on the second core plate 14.
  • the mounting groove 40 of the preset depth can be processed once on the second core plate 14 and the heat sink 20; the molding step is small, only the processing reference is selected once, and the processing of the product can be improved. Precision.
  • a via 50 can also be formed on the printed circuit board 100.
  • the via hole 50 extends through the second core plate 14 and extends from the first signal layer 144 of the second core plate 14 through the conductive bonding layer 30 to the inside of the heat sink 20.
  • a conductive layer 52 electrically connecting the first signal layer of the second core board 14 and the ground layer of the second core board 14 is disposed in the via hole 50.
  • the via 50 extends from the second signal layer of the third core through the second core 14 to the interior of the heat sink 20.
  • a conductive layer 52 electrically connecting the second signal layer of the third core board and the ground layer of the second core board 14 is further disposed in the via hole 50.
  • the conductive layer 52 in the via hole 50 can extend from the first signal layer 144 of the second core board 14 or the second signal layer of the third core board to the heat sink 20, so the second core can be
  • the metal layer 142 of the board 14 or the second signal layer of the third core board is directly connected to the heat sink 20 to enhance the grounding performance of the first signal layer or the second signal layer, and further accelerate the metal on the second core board 14.
  • the heat dissipation of the layer 142 improves the heat dissipation performance of the printed circuit board 100.
  • the via 50 may also extend from the signal layer 144 of the second core board 14 or the second signal layer of the third core board to the conductive bonding layer 30 and not through the conductive bonding layer. 30 and heat sink 20.
  • the via hole 50 may also be from the second core board 14. The signal layer 144 or the second signal layer of the third core extends to the heat sink 20 but does not pass through the conductive bonding layer 30.
  • the material of the metal of the conductive layer 52 may include, but is not limited to, titanium palladium, zinc, cadmium, gold or brass, bronze, etc.; or may be a dispersion layer such as nickel-silicon carbide, nickel-fluorinated graphite, etc.;
  • the layer is laminated, such as a copper-nickel-chromium layer, a silver-indium layer, or the like. This embodiment is not limited.
  • the present application further provides an electronic device 300 including: a printed circuit board 100 and a heat generating device 200 .
  • the printed circuit board 100 in this embodiment includes a core board assembly 10, a first heat sink 20a, and a conductive bonding layer 30.
  • the printed circuit board 100 in this embodiment is similar in structure to the printed circuit board 100 in the previous embodiment. In this embodiment, only the structure different from the printed circuit board 100 in the previous embodiment, the same structure is mainly emphasized. I will not repeat them here.
  • the first heat dissipating device 20a in this embodiment has the same structure as the heat dissipating device 20 in the previous embodiment. The specific structure of the first heat dissipating device 20a will not be described in detail herein. Please refer to the heat dissipating device in the previous embodiment. The structure of 20.
  • the heat generating device 200 is mounted in the mounting groove 40 of the printed circuit board 100, and the maximum cross-sectional area of the heat generating device 200 is smaller than the area of the bottom surface of the first heat sink 20a constituting the mounting groove 40.
  • the maximum cross-sectional area of the heat generating device 200 is the largest area of the cross section perpendicular to the stacking direction of the first core plate 12 and the second core plate 14.
  • the heat generating device 200 may be a member that generates heat or a portion thereof that includes the member that generates heat. For example, electrical parts, application processors or IC chips.
  • the heat generating device 200 is mounted in the mounting groove 40.
  • the heat generating device 200 is connected to the first heat sink 20a through a conductive solder material layer 80 (solder paste, tin sheet or copper paste, etc.), and the heat conductive resin 80 efficiently transfers heat from the heat generating device 200 from the heat generating device 200 to the first heat sink.
  • the device 20a achieves heat dissipation.
  • the heat generating device 200 is a member that generates heat, and the heat generating device 200 is directly connected to the first heat sink 20a. In this way, the surface area for heat dissipation is further increased, and the heat dissipation performance of the printed circuit board 100 is improved.
  • the heat generating device 200 includes an electronic device 210 and a second heat sink 220.
  • the electronic device 210 may be an integrated circuit, a three-stage tube, or an IGBT (Insulated Gate) that is packaged or unpackaged (ie, has no metal base, plastic seal or ceramic case). Bipolar Transistor, insulated gate bipolar transistor) and MOS transistor (field effect transistor).
  • IGBT Insulated Gate
  • MOS transistor field effect transistor
  • the second heat sink 220 is disposed in the mounting slot 40, and the second heat sink 220 is located between the first heat sink 20a and the electronic device 210, and the heat radiated by the electronic device 210 is transmitted to the second heat sink 220 through the second heat sink 220.
  • the first heat sink 20a is further emitted by the first heat sink 20a. Therefore, by providing the second heat sink 220 between the electronic device 210 and the first heat sink 20a, heat of the electronic device 210 can be quickly transferred to the first heat sink 20a, improving the heat dissipation performance of the printed circuit board 100.
  • the maximum cross-sectional area of the second heat sink 220 is smaller than the area of the bottom surface of the first heat sink 20a constituting the mounting groove 40.
  • the maximum cross-sectional area of the second heat sink 70 is the largest area of the section perpendicular to the stacking direction of the first core sheet 12 and the second core sheet 14.
  • the second heat dissipating device 220 may be a metal block, and the metal used for forming the metal block includes but is not limited to copper, copper alloy, aluminum, aluminum alloy, iron, iron alloy, nickel, nickel alloy, gold, Gold alloy, silver, silver alloy, platinum group, platinum group alloy, chromium, chromium alloy, magnesium, magnesium alloy, tungsten, tungsten alloy, molybdenum, molybdenum alloy, lead, lead alloy, tin, tin alloy, indium, indium alloy, Zinc or zinc alloys, etc.
  • the metal block can be composed of a metal block and a conductive graphite sheet. Since the thermal resistance of the conductive graphite sheet is smaller than that of ordinary metals and alloys, the conductive graphite sheet can be embedded in the metal to make the heat conduction more rapid.
  • the material of the second heat sink 220 is not limited in the present application.
  • the shape of the second heat dissipating device 220 may be a regular shape such as a cube, a cylinder or a regular cube, or may be an irregular shape.
  • the structure of the second heat dissipating device 220 is not limited in the present application.
  • the method of connecting the second heat dissipating device 220 and the first heat dissipating device 20a may be various.
  • the second heat dissipating device 220 may be directly bonded to the first heat dissipating device 20a by using double-sided tape; or the electric welding method may also be used.
  • the second heat sink 220 and the first heat sink 20a are connected together by soldering; a conductive solder material layer 80 (solder paste, tin sheet or copper paste, etc.) may also be used to make the second heat sink 220 and the first Bonding between the heat sinks 20a, and the like. It can be understood that the rest can connect the second heat sink 220 with the first heat sink 20a, and the manner in which heat conduction can be performed is within the protection scope of the present application.
  • FIG. 4-6 is a flowchart of a method for fabricating a printed circuit board according to still another embodiment of the present application
  • FIGS. 7-11 are flowcharts showing a manufacturing process of a printed circuit board according to still another embodiment of the present application.
  • Making a printed circuit board 100 includes the following steps:
  • S10 providing a first core board 12, a second core board 14, a heat sink 20, and a conductive bonding material 30, and a metal layer 142 is disposed on a side of the second core board 14 adjacent to the first core board 12.
  • the number of the first core board 12 and the second core board 14 is at least one.
  • the first core panel 12 can include a core dielectric 120 and a metal layer 122 on at least one side of the core dielectric 120.
  • the second core panel 14 can include a core panel media 140 and a metal layer 142 on at least one side of the core panel media 140.
  • the metal layer 142 is disposed on the side of the first core plate 12 adjacent to the second core plate 14.
  • each of the second core plates 14 includes a core medium 140, and on the opposite sides of the core medium 140, only one metal layer 142 may be disposed, or the metal layer 142 may be disposed on both sides, but at least A metal layer 142 is disposed on a side of the second core plate 14 adjacent to the heat sink 20.
  • the opposite sides of the core medium 140 of the second core plate 14 are provided with a metal layer 142 .
  • the metal layer 142 on the side of the second core board 14 adjacent to the first core board 12 is a ground layer, and the metal layer 144 facing away from the other side of the first core board 12 is a signal layer.
  • Each of the first core plate 12 and the second core plate 14 needs to be surface-treated, and the surface treatment includes:
  • Electroplating is performed on the surface of each of the first core plate 12 and the second core plate 14 in accordance with a predetermined pattern such that a pattern is formed on the surface thereof.
  • each of the first core plate 12 and the second core plate 14 is treated with a chemical reagent; wherein the chemical agent can react with the unplated region of the metal layer, but does not react with the plating layer. Therefore, the unplated region on the metal layer can be dissolved.
  • each of the chemically treated first core plate 12 and the second core plate 14 is subjected to a tin-removing treatment to obtain metal layers 122 and 142 of a region covered by the plating pattern to form a metal pattern.
  • the first core plate 12 is grooved to form a first through groove 124 penetrating the first core plate 12.
  • This step specifically includes:
  • S220 The first core plate 12 and the first connection layer 18 are grooved to form a first through groove 124 on the first core plate 12, and a second through groove 182 is formed on the first connection layer 18.
  • the processed first connection layer 18 is placed between the first core plate 12 and the second core plate 14, and the first through groove 124 is aligned with the second through groove 182.
  • the maximum cross-sectional area of the first through slot 124 and the second through slot 182 should be greater than the maximum cross-sectional area of the heat sink 20 so that the heat sink 20 can be placed in the first through slot 124 and the second through slot 182. .
  • the first connecting layer 18 can be a thermoplastic material.
  • the thermoplastic material comprises: polyketone, polyaramid, polyimide, polyetherimide, polyamideimide, polyphenylene sulfide, polyphenylsulfone, fluoropolymer, polyphenylene Imidazole, their derivatives or a combination thereof.
  • the thermoplastic material comprises a polymer such as a polyketone, a thermoplastic polyimide, Polyetherimide, polyphenylene sulfide, polyethersulfone, polysulfone, polyamideimide, derivatives thereof, or combinations thereof.
  • the thermoplastic material comprises a polyketone such as polyetheretherketone, polyetherketone, polyetherketoneketone, polyetherketoneetherketoneketone, derivatives thereof, or combinations thereof.
  • the first tie layer 18 can also be a thermoset material.
  • the thermoset material comprises: an allyl resin, an epoxy resin, a thermoset polyurethane, a silicone or a polysiloxane, and the like. These resins may be formed from the reaction product of a polymerizable composition comprising at least one oligomeric urethane (meth) acrylate. Typically, the oligomeric urethane (meth) acrylate is a poly(meth) acrylate.
  • (meth)acrylate is used to refer to esters of acrylic acid and methacrylic acid, and is in contrast to "poly(meth)acrylate” which is generally referred to as a (meth)acrylate polymer, "multiple ( "Methyl) acrylate” means a molecule comprising more than one (meth) acrylate group. Most commonly, the poly(meth)acrylate is di(meth)acrylate, but tris(meth)acrylate, tetra(meth)acrylate, and the like are also contemplated.
  • the slotting process of the first core board 12 specifically includes:
  • S210a providing a plurality of first connecting layers 18 having a viscosity.
  • S220a performing a grooving process on the plurality of first core plates 12 and the plurality of first connection layers 18 to form first through grooves 124 on the plurality of first core plates 12, and on the plurality of first connection layers 18 Forming a second through slot 182;
  • S230a placing the processed plurality of first connection layers 18 between any two adjacent first core plates 12 and between any two adjacent second core plates 14, and an adjacent first core plate 12 And a second core plate 14 and the second through grooves 182 of the plurality of first connecting layers 18 are aligned with the first through grooves 124 of the plurality of first core plates 12.
  • the first core plate 12 and the second core plate 14 may be sequentially stacked in the vertical direction, and the first connection layer 18 is placed adjacent to the plurality of first core plates 12 and the plurality of second core plates 14 Between, and between the adjacent first core plate 12 and the second core plate 14.
  • the order of stacking is: the first core plate 12, the first connecting layer 18, the first core plate 12, and the first A connecting layer 18, a second core plate 12, a first connecting layer 18, and a second core plate 14.
  • the electrically conductive bonding material 30 can be a paste or paste conductive material.
  • the step of connecting the heat sink 20 to the metal layer 142 of the second core plate 14 through the conductive bonding material 30 includes: first printing the conductive material through printing Or coating the heat sink 20 or the metal layer 142 of the second core 14 and then placing the heat sink 20 in the slot to achieve the connection of the heat sink 20 to the metal layer 142 of the second core 14. .
  • the conductive material is, for example, a conductive paste composed of a resin matrix, conductive particles, a dispersing additive, an auxiliary agent, or the like.
  • the resin matrix may be an adhesive system such as an epoxy resin, a silicone resin, a polyimide resin, a phenol resin, a polyurethane, or an acrylic resin. These adhesives form a molecular skeleton structure of the conductive paste after curing, providing mechanical properties and bonding properties, and forming conductive channel particles into channels.
  • the conductive particles may be powders of gold, silver, copper, aluminum, zinc, iron, nickel, and graphite and some conductive compounds for achieving electrical conductivity.
  • the liquid conductive material may also be a conductive silver paste, a conductive copper paste or a conductive solder paste.
  • the electrically conductive bonding layer 30 can also be a semi-cured bonding sheet.
  • the step of connecting the heat sink 20 to the metal layer 142 of the second core board 14 through the conductive bonding layer 30 includes: attaching the conductive bonding layer 30 to the heat sink 20, then one end of the heat sink 20 to which the conductive bonding layer 30 is attached is first placed in the slot, so that the heat sink 20 is connected to the metal layer 142 of the second core board 14.
  • the bonding sheet may be a conductive foam.
  • the conductive foam can be disposed on the opposite sides of the conductive foam, so that the conductive foam can be adhered to the heat dissipation device and the metal layer through the double-sided adhesive on opposite sides, thereby implementing the first heat dissipation device. Bonding and electrical connection to the metal layer on the second core.
  • the conductive foam has the characteristics of good electrical conductivity and large elasticity, can effectively fill the small gap between the heat dissipating device and the metal layer, and make sufficient contact between the heat dissipating device and the metal layer, thereby effectively overcoming the installation process. Insufficient contact between the heat sink and the metal layer results in a problem of poor grounding.
  • the bonding sheet can also be obtained by adding a metal silver to the epoxy resin.
  • the bonding sheet having a thickness of 0.05 to 0.5 mm and a volume resistance of less than 0.4 m ⁇ can be easily produced by adding metal silver to the epoxy resin.
  • the first core board 12 and the second core board 14 are pressed together to form the printed circuit board 100 such that the heat sink 20 is connected to the metal layer 142 through the conductive bonding material 30.
  • the step S40 specifically includes:
  • the first core plate 12 and the second core plate 14 and the first connecting layer 18 are heated such that the first connecting layer 18 melts and flows into and fills between the first core plate 12 and the second core plate 14 and is filled with heat dissipation.
  • the device 20 is interposed between the first through groove 124 and the inner side wall of the second through groove 182, and applies pressure to the first core plate 12 and the second core plate 14 and the first connection layer 18 to form the printed circuit board 100.
  • the first core plate 12 and the second core plate 14 and the first connecting layer 18 are hot pressed. Since the first connecting layer 18 is a thermosetting material or a thermoplastic material, the first connecting layer 18 softens and flows when heated. Since the cross-sectional area of the first through groove 124 and the second through groove 182 is larger than the maximum cross-sectional area of the heat sink 20, a gap 17 exists between the inner wall of the second through groove 182 and the outer wall of the heat sink 20, and flows. The thermosetting material flows into the gap 17 to fill the gap 17 between the inner wall of the second through groove 182 and the outer wall of the heat sink 20. At this time, the heating is stopped, and the flowing thermosetting material is cooled and hardened to fill the gap 17.
  • the first connecting layer 18 is a thermosetting material or a thermoplastic material
  • a mounting groove 40 is formed in the second core board 14.
  • the mounting slot 40 is disposed corresponding to the heat sink 20 and extends to the interior of the heat sink 20 .
  • the depth of the mounting groove 20 is smaller than the height of the printed circuit board 100, and the bottom area of the mounting groove 40 is smaller than the cross-sectional area of the conductive bonding layer 30.
  • the mounting groove 40 may also extend from the signal layer 144 on the second core board 14 to the interior of the first heat sink 20. .
  • the extension of the mounting groove 40 to the inside of the heat sink 20 specifically means that the depth of the mounting groove 40 is greater than the thickness of the second core plate 14 and smaller than the thickness of the printed circuit board 100.
  • the bottom area of the mounting groove 40 is smaller than the cross-sectional area of the conductive bonding layer 30 so that the heat sink 20 can be connected to the metal layer 142 on the second core board 14 through the remaining conductive bonding layer 30.
  • the mounting groove 40 of a predetermined depth can be directly milled on the second core plate 14 by the controlled deep milling process on the second core plate 14.
  • the mounting groove 40 of the predetermined depth can be processed once on the second core plate 14 and the first heat sink 20; the molding step is small, only the machining reference is selected once, and the product processing precision is high. .
  • the via 50 extends from the first signal layer 144 of the second core 14 through the conductive bonding layer 30 to the interior of the heat sink 20.
  • the via hole 50 may be metallized such that the inner wall of the via hole 50 is adhered with a conductive layer 52 for electrically connecting the first signal layer of the second core board 14 and the ground layer of the second core board 14. .
  • the via 50 extends from the second signal layer of the third core through the second core 14 to the interior of the heat sink 20.
  • a conductive layer 52 electrically connecting the second signal layer of the third core board and the ground layer of the second core board 14 is further disposed in the via hole 50.
  • a blind hole or a through hole may be drilled in the second core plate 14 or the third core plate by a method of drilling, and the blind hole or the through hole is in contact with the heat sink 20 to enhance the signal layer on the second core plate 14. 144 or the grounding effect of the second signal layer of the third core board.
  • the via hole 50 can be metallized by electroplating. Specifically, in the salt solution containing the metal to be plated, the metal of the via hole 50 is used as a cathode, and the cation to be plated in the plating solution is deposited on the metal surface of the via hole 50 by electrolysis. Thereby, the conductive layer 52 is formed.
  • Common metals for electroplating include, but are not limited to, titanium palladium, zinc, cadmium, gold or brass, bronze, and the like.
  • the metallization of the via 50 can also be achieved by, for example, coating.
  • the via 50 may also extend from the signal layer of the second signal layer of the second core board 14 or the third core board to the conductive bonding layer 30 and not through the conductive bonding layer 30. And a heat sink 20.
  • the via hole 50 may also be from the second core board 14.
  • the signal layer 144 or the second signal layer of the third core extends to the heat sink 20 but does not pass through the conductive bonding layer 30. Exemplary embodiments of the printed circuit board 100 and the method of manufacturing the printed circuit board 100 are described in detail in this specification.
  • the printed circuit board 100 and method are not limited to the specific embodiments described in this specification, and conversely, the operations of the elements and/or methods of the printed circuit board 100 may be independent of other elements and/or operations described in this specification. And use separately. Moreover, the elements and/or operations may also be defined in other systems, methods, and/or devices, or used with other systems, methods, and/or devices, and are not limited to use only the printed circuit board 100 described in this specification. Carry out implementation.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

本申请公开了一种印刷电路板及其制作方法以及电子装置，该印刷电路板包括：芯板组件，包括依次层叠的第一芯板和第二芯板，所述第二芯板上靠近所述第一芯板的一侧设置有金属层，所述第一芯板开设有贯穿所述第一芯板的通槽；散热装置，容置在所述通槽中；及导电粘结层，设置于所述第二芯板的所述金属层和所述散热装置之间，用于将所述散热装置与所述金属层电连接。本申请利用导电粘接层将第一散热装置与金属层直接相连，加强了金属层的接地性能的同时，也可以帮助金属层进行散热，由此可以提升印刷电路板的散热性能。

Description

一种印刷电路板及其制作方法和电子装置
【技术领域】
本申请涉及集成电路技术领域，特别是涉及一种印刷电路板及其制作方法和电子装置。
【背景技术】
印刷电路板（Printed Circuit Board,简称PCB）是重要的电子元件，是电子工业的重要元件之一。几乎每种电子设备，小到电子手表、计算器，大到计算机、通讯电子设备、军用武器系统，只要有集成电路等电子元器件，为实现它们之间的电气互连，都要使用印刷电路板。因此，印刷电路板在电路技术领域中扮演的角色越来越重要。而随着电子设备体积的不断缩小，电子器件的功能逐渐完善，要在一个较小的空间实现更多的电子元器件的安装，势必会造成电路板的发热不断增加，故而解决电路板的散热问题变得尤为紧迫。
【发明内容】
本申请主要解决的技术问题是提供一种印刷电路板及其制作方法和电子装置，以解决因电子设备体积缩小导致的电路板散热问题。
为解决上述技术问题，本申请采用的一个技术方案是：提供一种印刷电路板，包括：芯板组件，包括依次层叠的第一芯板和第二芯板，所述第二芯板上靠近所述第一芯板的一侧设置有金属层，所述第一芯板开设有贯穿所述第一芯板的通槽；散热装置，容置在所述通槽中；及导电粘结层，设置于所述第二芯板的所述金属层和所述散热装置之间，用于将所述散热装置与所述金属层电连接。
为解决上述技术问题，本申请采用的又一个技术方案是：提供一种电子装置，包括：印刷电路板，包括：芯板组件，包括依次层叠的第一芯板和第二芯板，所述第二芯板上靠近所述第一芯板的一侧设置有金属层，所述第一芯板上开设有贯穿所述第一芯板的通槽，所述第二芯板上开设有贯穿所述第二芯板的安装槽；第一散热装置，容置在所述通槽内； 导电粘结层，设置于所述第二芯板的所述金属层和所述第一散热装置之间，用于将所述第一散热装置与所述金属层电连接；及发热器件，安装于所述安装槽内，且所述发热器件的最大横截面积小于所述第一散热装置上构成所述安装槽的底面的面积。
为解决上述技术问题，本申请采用的另一个技术方案是：提供第一芯板、第二芯板、散热装置和导电粘结材料，所述第二芯板的一侧设置有金属层；对所述第一芯板进行开槽处理以形成贯穿所述第一芯板的第一通槽；将所述散热装置置于所述第一通槽中；及对所述第一芯板和所述第二芯板进行压合以形成所述印刷电路板，以使所述散热装置通过所述导电粘结材料连接在所述金属层上。
上述实施例的有益效果为：通过在芯板组件上开设通槽，并将第一散热装置放置在芯板组件上的通槽内，然后利用导电粘结层将第一散热装置与第二芯板上的金属层进行连接并导通，实现了第二芯板上的金属层的热量通过导电粘结层传递给第一散热装置，由此可以通过第一散热装置加快散热，提升印刷电路板的散热性能。
【附图说明】
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请一实施例中的印刷电路板的整体结构剖视示意图；
图2是本申请另一实施例第一散热装置的立体结构示意图；
图3是本申请另一实施例电子装置的立体结构示意图；
图4-6是本申请又一实施例的印刷电路板的制作方法的流程图；
图7-11是本申请又一实施例的印刷电路板的制作工艺流程图。
主要元件符号说明
印刷电路板 100
芯板组件 10
散热装置 20
导电粘结层 30
第一芯板 12
第二芯板 14
芯板介质 120
金属层 122
第二芯板介质 140
接地层 142
信号层 144
通槽 16
第一连接层 18
第二连接层 19
安装槽 40
导通孔 50
导电层 52
电子装置 300
发热器件 200
第一散热装置 20a
电子器件 210
第二散热装置 220
导电焊接材料层 80
【具体实施方式】
下面将对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请中的术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示（诸如上、下、左、右、前、 后……）仅用于解释在某一特定姿态（如附图所示）下各元件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。此外，术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或元件的过程、方法、系统、产品或设备，没有限定于已列出的步骤或元件，而是可选地还包括没有列出的步骤或元件，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或元件。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“设置在……上”应做广义理解，例如，可以是固定连接，也可以是可拆卸地连接，或者一体地连接；可以是机械连接；可以是直接连接，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以视具体情况理解上述术语在本申请中的具体含义。
在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。若本说明书中出现“工序”的用语，其不仅是指独立的工序，在与其它工序无法明确区别时，只要能实现该工序所预期的作用则也包括在本用语中。另外，本说明书中用“-”表示的数值范围是指将“-”前后记载的数值分别作为最小值及最大值包括在内的范围。在附图中，结构相似或相同的元件用相同的标号表示。
此外，在本申请的描述中，电子装置例如可以包括智能手机、平板个人计算机、移动电话、视频电话、电子书阅读器、台式电脑、膝上型、上网本计算机、工作站、服务器、个人数字助理、便携式多媒体播放器、播放器、医疗仪器、照相机和可穿戴装置中的一个。可穿戴装置可以包括配件(例如手表、戒指、手镯、脚链、眼镜、隐形眼镜或头戴式装置)、衣服集成型(例如电子衣服)、身体附着型(例如皮肤垫或纹身)或可植入型(例如可植入电路)。在一些实施方式中，家用电器可以包括例如数字多功能盘播放器、音频、冰箱、空调、清洁器、烤箱、微波炉、洗衣机、空气过滤器、机顶盒、家庭自动化控制面板、安全控制面板、电视盒、游戏控制台、电子词典、电子钥匙、摄像机和电子面板等。
电子装置还可以包括各种医疗装置(例如各种便携式医疗测量装置(血糖仪、心率测量装置、血压测量装置和体温测量装置)、磁共振血管造影、磁共振成像装置、计算机断层摄影装置、摄影装置和超声波装置)、导航系统、全球导航卫星系统)、事件数据记录器、飞行数据记录器、车辆信息娱乐装置、用于船只的电子装置(例如用于船只的导航装置和陀螺罗盘)、航空电子装置、安全装置、车辆头部单元、工业或家庭机器人、金融公司的自动柜员机、商店的销售点和物联网(例如灯泡、各种传感器、电表或气表、洒水器装置、火灾报警装置、恒温器、电线杆、烤面包机、运动装置、热水箱、加热器和锅炉)中的至少一种。根据本公开的各种实施方式，电子装置可以包括家具或建筑物/结构或车辆的一部分、电子板、电子签名接收装置、投影仪或各种测量装置(例如水服务、电能、燃气或电波测量装置)。在本申请的各种实施方式中，电子装置可以是柔性的，或者电子装置可以是各种装置的两个或更多个组合。根据本申请的实施方式的电子装置不限于上述装置。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现该短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
请参阅图1，图1是本申请一实施例中的印刷电路板的整体结构剖视示意图。
如图1所示，在本实施例中，该印刷电路板100大体上可包括：芯板组件10、嵌设于芯板组件10内的散热装置20和导电粘结层30，且散热装置20通过该导电粘结层30与芯板组件10连接。
其中，芯板组件10可包括依次层叠设置的第一芯板12和第二芯板14。
如图1所示，在本实施例中，第一芯板12可包括芯板介质120和位于芯板介质120至少一侧的金属层122。
同样地，第二芯板14可包括芯板介质140和位于芯板介质140至少一侧的金属层142。
芯板介质120和140的材料的选择可根据每一层芯板的功能设计来选择。也有可能均为适用于射频电路的损耗因子（DF，Damping Factor）较小的材料，如陶瓷基高频材料或聚四氟乙烯等。也可以均为适用于常规电路的损耗因子较大的材料，如FR-4（包括环氧树脂）。
在本实施例中，芯板介质120和140除可由允许一定频率的射频信号通过的材料制成外，该材料还可以为热固性材料，且芯板介质120和140预先经过热处理固化，因此其形状固定，在后续加热过程中，该芯板介质120和140不会再次发生形变。该芯板介质也可以为加热后发生软化的热塑性材料。
其中，热固性材料是指：第一次加热时该材料可以软化流动，加热到一定温度，产生化学反应，使交链固化而变硬；这种变化是不可逆的，此后，再次加热时，该材料已不能再变软流动了。
常见的热固性材料包括但不限于烯丙基树脂、环氧树脂、热固性 聚氨酯、有机硅或聚硅氧烷等等。这些树脂可由可聚合组合物的反应产物形成，所述可聚合组合物包括至少一种低聚聚氨酯(甲基)丙烯酸酯。通常，所述低聚聚氨酯(甲基)丙烯酸酯为多(甲基)丙烯酸酯。术语“(甲基)丙烯酸酯”用于指代丙烯酸和甲基丙烯酸的酯，并且与通常指代(甲基)丙烯酸酯聚合物的“聚(甲基)丙烯酸酯”相对比，“多(甲基)丙烯酸酯”是指包括不止一个(甲基)丙烯酸酯基团的分子。最常见的是，多(甲基)丙烯酸酯为二(甲基)丙烯酸酯，但是也可以考虑采用三(甲基)丙烯酸酯、四(甲基)丙烯酸酯等等。
进一步地，金属层142设置在第一芯板12邻近第二芯板14一侧。
在本实施例中，该第一芯板12和第二芯板14上的金属层122、142均可以为铜层。其中，铜具有良好的导电性能，是印刷电路板100最常用的线路材料。对每一第一芯板12和第二芯板14进行图案化处理，即可得到所需要的线路图形，并根据功能设计可以将金属层122和142分为信号层144和接地层142；其中信号层144的图案较接地层的图案复杂。通常，信号层144为用于形成电子器件之间的电连接的多条金属线路所在的层；接地层142用于与地连接，通常为大面积连续金属区域的层。
可选地，第二芯板14上与散热装置20通过导电粘结层30连接的金属层142为接地层142，即将散热装置20与第二芯板14上的接地层142实现间接的电连接。通过这种方式，可使接地层142直接通过三明治的层叠结构与散热装置20进行电连接，从而直接接地，可以缩短接地路径，由此提升印刷电路板100上的待接地电子器件的接地效果，以及接地稳定性。
可选地，参阅图1，该第二芯板14的芯板介质140相对的两侧均设置有金属层142。其中，第二芯板14上靠近第一芯板12一侧的金属层142为接地层142，而背离该第一芯板12的另一侧的金属层144为第一信号层144。
该第一芯板12的数量可以为多个，且多个第一芯板12可依次层叠设置。例如，图示的实施例中第一芯板12的数量为两个。当然，在其他实施例中，该第二芯板14的数量也可以为多个。
在一个实施例中，该芯板组件14还可以包括至少一个第三芯板，且至少一个第三芯板叠设于该第二芯板14背离第一芯板12一侧。每一第三芯板可包括芯板介质和位于该芯板介质至少一侧的金属层。
在本实施例中，当该第三芯板的数量为多个时，所有的第三芯板13中与第二芯板14的距离最大的一第三芯板的背离第二芯板14的一侧上的金属层为第二信号层（即，最外层第三芯板的外侧金属层为信号层）。
图1所示的实施例中，该芯板组件10包括两层第一芯板12和一层第二芯板14，且第一芯板12和第二芯板14的依次层叠的顺序是第一芯板12、第一芯板12和第二芯板14。
进一步参阅图1，在本实施例中，该芯板组件10上可开设有通槽16，用于容置该散热装置20和导热粘结层30。其中，该通槽16沿第一芯板12的厚度方向贯穿整个第一芯板12，但并未延伸至第二芯板14的任何部分。
在本实施例中，在多个第一芯板12上开设有通槽（图8中示出），在第一芯板12和第二芯板14依次层叠时，第一芯板12上的所有通槽124彼此对应设置，并在与第二芯板14接触的金属层142处截止，以形成用于容纳散热装置20的容纳空间，且散热装置至少部分容纳于容纳空间中。
在本实施例中，通槽16的最大横截面积大于散热装置20的最大横截面积，以使散热装置20的外壁和第一芯板12上围成通槽16的侧壁之间可形成间隙17。该通槽16的最大横截面积是指该通槽16在垂直于该第一芯板12和第二芯板14的层叠方向上的投影的最大面积。而散热装置20的最大横截面积则是指该散热装置20沿垂直于该第一芯板12和第二芯板14的层叠方向剖面的最大面积。其中，散热装置20设置于在通槽16内，用于对与其接触的金属层142进行散热。
具体地，散热装置20是具有导电和导热功能的装置，其可以为金属块，将金属块整个或者部分的嵌入在通槽16中对通过导电粘接层30电连接的金属层142进行散热。
在一实施例中，该金属块20可以为纯金属制成，用到的金属材料包括但不限于铜、铜合金、铝、铝合金、铁、铁合金、镍、镍合金、金、金合金、银、银合金、铂族、铂族合金、铬、铬合金、镁、镁合金、钨、钨合金、钼、钼合金、铅、铅合金、锡、锡合金、铟、铟合金、锌或锌合金等。
在另一实施例中，该金属块20的材料也可以由金属基块和导电石墨片组成。由于导电石墨片的热阻较普通金属及合金的小，可以在金属中嵌入导电石墨片使得导热更加迅速。本申请对该散热装置20的材质不作限制。
散热装置20的形状可以为立方体，圆柱体以及正立方体等规则形状，也可以为不规则形状，本申请对该散热装置20的结构不作限制。
由于散热时，物体的温度和物体的表面积之间具有密切的关系，即物体的表面积越大，其热量散失的越快，物体的温度降低的越快。请参阅图2，为了进一步加快散热，还可设置与散热装置20连接的散热鳍片21。其中，该散热鳍片21可包括基部211及多个鳍片部212。该散热鳍片21的基部211与散热装置20连接，而多个鳍片部212则间隔设置在该散热鳍片21上背离散热装置20的一侧。因此，基部211可将散热装置20上的热量传递给鳍片部212。此外，由于相邻两个鳍片部212彼此间隔设置具有空隙，该空隙可以形成气流通道，因此可增大该散热鳍片21与空气的接触面积，从而加快散热。
为了进一步加快散热速度，还可以在散热鳍片21上设置热管。例如，在每一鳍片部212上可开设有至少一穿孔，且每一穿孔上可穿设有一热管。通过热管的设置，可进一步增大散热装置20与空气的接触面积，加快散热速度。可选地，为提高该散热装置20的散热效果，在热管和穿孔的孔壁之间还可涂覆有导热胶。由于热管的热传导率大大高于如铜、铝等纯金属，且传热不定向、有一定长度，可以将热量传递至较远距离，因此，对散热性能有明显的提升作用。
当然，本申请还可使用其他可以增大散热装置20的散热面积来加快散热速度的的实施方式，这些实施方式均与本申请的结构和原理类似，属于本申请的保护范围。
继续参阅图1，在本实施例中，导电粘结层30设置于第二芯板14的金属层142和散热装置20之间，用于将散热装置20与第二芯板14上的金属层142电连接。
其中，该导电粘结层30为具有导电和粘合作用的粘结层。导电粘结材料可以为包括导电材料与粘性材料的混合体，其中，导电材料可以为金属或石墨；粘性材料可以为环氧树脂。
因此，将导电粘结层30设置在散热装置20和芯板组件10之间、并形成层叠的三明治结构时，一方面可使散热装置20与第二芯板14上的金属层142实现间接的电连接，实现第二芯板14上的金属层142接地。另一方面，由于该导电粘结层30具有粘结性，可以将散热装置20与金属层142紧密的粘结在一起，保证散热装置20与第二芯板14的金属层142之间的接触效果。此外，该导电粘结片30还具有热传导性能，能将金属层142上产生的热量传递给散热装置20，以加快金属层142的散热。
具体地，利用导电粘结30层实现散热装置20与第二芯板14上的金属层142的间接电连接，由于导电粘结层30与金属层142的接触面积要大于传统钻孔接地的孔与金属层142的接触面积，故而采用导电粘结层30增大接触面积，可以使得金属层142的接地稳定性更好。
进一步参阅图1，该导电粘结层30的横截面积可小于或等于散热装置20上与导电粘结层30接触的表面的面积。具体地，导电粘结层30的横截面积指与散热装置20上与导电粘结层30接触的表面平行方向上的面积。
在一个实施例中，例如，导电粘结层30可以为导电粘结材料。所谓的导电粘结材料可以为具有一定流动性的膏状或浆状的形态，也可为半固化形态。其中，半固定化形态为常温下为固态，但加热到一定温度后具有一定的流动性，然后在一定温度下形成最终固化。
在制作时可以先通过印刷或涂覆的方式将导电材料粘结在散热装置20上或与散热装置20连接的第二芯板14的金属层142上，而后放入散热装置20，并在将第一芯板12和第二芯板14压合形成层叠的三明治结构时，将散热装置20与第二芯板14的金属层142粘合。
其中，该导电材料例如由树脂基体、导电粒子和分散添加剂、助剂等组成的导电胶。其中，树脂基体可以为环氧树脂、有机硅树脂、聚酰亚胺树脂、酚醛树脂、聚氨酯、丙烯酸树脂等胶黏剂体系。这些胶黏剂在固化后形成了导电胶的分子骨架结构，提供了力学性能和粘接性能保障，并使导电填料粒子形成通道。而导电粒子可以是金、银、铜、铝、锌、铁、镍的粉末和石墨及一些导电化合物，用于实现导电性能。
此外，该导电材料还可以为导电银浆、导电铜浆或导电焊膏等。以导电银浆为例，在使用时，可将导电银浆涂敷于散热装置20和与散热装置20连接的金属层142上，并在该导电银浆未固化前将涂覆导电银浆的区域相互粘结，通过之后的固化过程可将该导电银浆固化形成导电粘结层30，由此可将散热装置20与第二芯板14的金属层142进行粘结。
在另一实施例中，导电粘结层30还可以为半固化的粘结片。在制作时，将半固化的粘结片粘结在散热装置20或第二芯板上的金属层142上，然后将散热装置20附着有半固化的粘结片的一侧放入芯板组件10上的通槽16中，并在第一芯板12和第二芯板14压合形成三明治结构时将散热装置20粘结在第二芯板14的金属层142上。可以理解地是，所有利用导电粘结层30将散热装置20与第二芯板14上的金属层142实现间接电连接的方式均在本申请的保护范围内。
在一实施例中，该导电粘结层30可以为导电泡棉。其中，该导电泡棉的相对两侧面上可设置有导电双面胶，从而使得该导电泡棉可通过相对两侧面的双面胶分别粘贴于散热装置20和金属层142上，进而实现散热装置20和第二芯板14上的金属层142的粘合和电连接。其中，导电泡棉具有良好导电性及弹性大的特点，能够有效地填补散热装置20和金属层142之间的微小间隙，使散热装置20和金属层142之间充分的接触，从而可以有效地克服在安装过程中散热装置20和金属层142之间的接触不充分导致接地不良的问题。
由于环氧树脂可以在室温或低于150℃固化，并且具有丰富的配方可设计性能，在另一实施例中，该粘结片还可以通过在环氧树脂内添加金属银的方法制作来获得固态的粘结片，以实现散热装置20与第二芯板14上的金属层142之间的粘结和电连接。
进一步如图1所示，在本实施例中，该印刷电路板100还可以包括第一连接层18。其中，该第一连接层18设置在第一芯板12和第二芯板14之间，并环绕该导电粘结层30设置，用于将第一芯板12和第二芯板14粘合。此外，当设置有多个第一芯板12和多个第二芯板14时，相邻两个第一芯板12之间，以及相邻两个第二芯板14之间也可以设置该第一连接层18，从而将芯板组件10的多个芯板12和14彼此粘合。
在本实施例中，该第一连接层18可以为粘性材料，并具体可以为热固性材料。其中，第一连接层18和芯板介质120和140的区别在于，第一连接层18为未经过热处理的热固性材料。因此，对第一连接层18加热时，第一连接层18可融化，进而将相邻两个第一芯板12、相邻两个第二芯板14以及彼此相邻的第一芯板12和第二芯板14粘合。
在其他实施例中，该第一连接层18还可以由热塑性材料制成。其中，热塑性材料是指：热塑性塑料指具有加热软化、冷却硬化特性的塑料。加热时变软以至流动，冷却变硬，这种过程是可逆的，可以反复进行。常见的热塑性材料包括但不限于聚乙烯、聚丙烯、聚氯乙烯、聚苯乙烯、聚甲醛，聚碳酸酪，聚酰胺、丙烯酸类塑料、其它聚烯侵及其共聚物、聚讽、聚苯醚，氯化聚醚等。热塑性塑料中树脂分子链都是线型或带支链的结构，分子链之间无化学键产生，加热时软化流动，冷却变硬的过程是物理变化。
在一个实例中，该热塑性材料可以包括：聚酮、聚芳酰胺、聚酰亚胺、聚醚酰亚胺、聚酰胺酰亚胺、聚苯硫醚、聚苯砜、氟聚合物、聚苯并咪唑、它们的衍生物或它们的组合。
在另一实例中，该热塑性材料可以包括一种聚合物，如聚酮、热塑性聚酰亚胺、聚醚酰亚胺、聚苯硫醚、聚醚砜、聚砜、聚酰胺酰亚胺、它们的衍生物、或它们的组合。
在又一实例中，该热塑性材料还可以包括聚酮，如聚醚醚酮、聚醚酮、聚醚酮酮、聚醚酮醚酮、它们的衍生物、或它们的组合。一种示例性的热塑性氟聚合物包括：氟化的乙烯丙烯、聚四氟乙烯、聚偏二氟乙烯、全氟烷氧基，四氟乙烯、六氟丙烯、以及偏二氟乙烯的一种三聚物、聚氯三氟乙烯、乙烯-四氟乙烯共聚物、乙烯-氯三氟乙烯共聚物、或者它们的任何组合。
此外，为使散热装置20的外侧壁和第一芯板12的内侧壁粘合，还可以在该散热装置20的外侧壁和第一芯板12上围成该通槽16的内侧壁之间的间隙17内设置第二连接层19。其中，该第二连接层19同样可由未处理的热固性材料或热塑性材料制成。因此，在对芯板组件10进行加热时，第二连接层19受热融化后可均匀地填充在间隙17中，其不仅可使散热装置20和第一芯板12紧密粘合，以减少脱落的可能性。
在一实施例中，第一连接层18和第二连接层19可以为一体结构。具体地，当设置有多个第一芯板12和多个第二芯板14时，利用第一连接层18将相邻两个第一芯板12，以及相邻两个第二芯板14彼此粘合。当对层状的三明治结构进行加热时，第一连接层18融化，并流入散热装置20的外侧壁和第一芯板12上围成该通槽16的内侧壁之间的间隙17内，冷却后，即形成了容置在散热装置20的外侧壁和第一芯板12上围成该通槽16的内侧壁之间的间隙17处的第二连接层19。
继续如图1所示，在第二芯板14上还开设有贯穿第二芯板14的安装槽40，且该安装槽40用于进一步安装发热器件（图3中示出）。在本实施例中，该安装槽40对应散热装置20的位置设置，且安装槽40穿过导电粘结层30并延伸到散热装置20的表面或内部，但其深度小于印刷电路板100的高度。当第二芯板14上背离第一芯板12的一侧设置有信号层144时，该安装槽40还可自第二芯板14上的信号层144延伸至该散热装置20的表面或内部。
其中，安装槽40延伸到散热装置20的内部具体是指，安装槽40的深度大于第二芯板14的厚度且小于印刷电路板100的厚度。另外，安装槽40占据的导电粘结层30的面积小于导电粘结层30的横截面积，以使散热装置20可以通过剩余的导电粘结层30与第二芯板14上的金属层142连接。
在本实施例中，可在第二芯板14上通过控深铣工艺直接在第二芯板14上铣出预设深度的安装槽40。采用该控深铣工艺，可在第二芯板14和散热装置20上一次性加工出预设深度的安装槽40；其成型步骤少，只需选定加工基准一次，且可提高产品的加工精度。
继续如图1所示，在印刷电路板100上还可以开设导通孔50。在本实施例中，该导通孔50贯穿第二芯板14，并从第二芯板14的第一信号层144经过导电粘结层30而延伸至散热装置20的内部。此外，该导通孔50内还设置有电连接该第二芯板14的第一信号层和第二芯板14的接地层的导电层52。
当该芯板组件10还包括第三芯板时，该导通孔50自第三芯板的第二信号层经过第二芯板14延伸至散热装置20的内部。此外，该导通孔50内还设置有电连接该第三芯板的第二信号层和第二芯板14的接地层的导电层52。
具体地，该导通孔50内的导电层52可从第二芯板14的第一信号层144或第三芯板的第二信号层一直延伸到散热装置20上，因此可将第二芯板14中的金属层142或第三芯板的第二信号层与散热装置20直接相连，加强该第一信号层或第二信号层的接地性能，同时进一步加快了第二芯板14上金属层142的散热，从而提高了印刷电路板100的散热性能。
在另一实施例中，该导通孔50还可以自第二芯板14的信号层144或第三芯板的第二信号层延伸至导电粘结层30且未穿过该导电粘结层30和散热装置20。而在又一实施例中，该导电粘结层30的最大横截面积小于散热装置20上与导电粘结层30接触的表面的面积时，该导通孔50还可以自第二芯板14的信号层144或第三芯板的第二信号层延伸至散热装置20，但并未穿过该导电粘结层30。导电层52的金属的材料可以包括但不限于钛钯、锌、镉、金或黄铜、青铜等；也可以为弥散层，如镍-碳化硅、镍-氟化石墨等；还可以为覆合层，如铜-镍-铬层、银-铟层等。在本实施例中不作限定。
请参阅图3，本申请还提供了一种电子装置300，该电子装置300包括：印刷电路板100和发热器件200。
其中，本实施例中的印刷电路板100包括：芯板组件10、第一散热装置20a和导电粘结层30。
本实施例中的印刷电路板100与上一实施例中的印刷电路板100的结构类似，本实施例中，只着重描述与上一实施例中的印刷电路板100不同的结构，相同的结构此处不再赘述。另，本实施例中的第一散热装置20a与上一实施例中的散热装置20结构相同，此处不再对第一散热装置20a的具体结构详细说明，请参照上一实施例中散热装置20的结构。
其中，该发热器件200安装于印刷电路板100的安装槽40内，且该发热器件200的最大横截面积小于第一散热装置20a上构成该安装槽40的底面的面积。该发热器件200的最大横截面积为沿垂直于第一芯板12和第二芯板14的层叠方向的截面的最大面积。
其中，发热器件200可以为产生热的构件或其中部分包括该产生热的构件。例如是电气零件、应用处理器或IC芯片等。发热器件200安装于安装槽40内。将发热器件200通过导电焊接材料层80（锡膏、锡片或铜浆等）与第一散热装置20a相连，导热树脂80将来自发热器件200的热量有效地自发热器件200传递到第一散热装置20a，实现散热。
在一实施例中，该发热器件200为产生热的构件，将该发热器件200与第一散热装置20a直接连接。通过这种方式，使得用于散热的表面积进一步增大，提高了印刷电路板100的散热性能。
如图3所示，在又一实施例中，发热器件200包括电子器件210和第二散热装置220。
其中，电子器件210可以为封装或未封装（即没有金属底座、塑封胶或陶瓷壳）的集成电路、三级管、IGBT(Insulated Gate Bipolar Transistor，绝缘栅双极型晶体管)和MOS管（metal oxide semiconductor，场效应晶体管）。
第二散热装置220置于安装槽40内，且第二散热装置220位于第一散热装置20a和电子器件210之间，用于将该电子器件210散发的热量通过该第二散热装置220传递至第一散热装置20a，进而通过第一散热装置20a散发出去。因此，通过在电子器件210和第一散热装置20a之间设置第二散热装置220，可使电子器件210的热量迅速传递至第一散热装置20a中，提高了印刷电路板100的散热性能。其中，该第二散热装置220的最大横截面积小于第一散热装置20a上构成该安装槽40的底面的面积。类似地，该第二散热装置70的最大横截面积为沿垂直于第一芯板12和第二芯板14的层叠方向的截面的最大面积。
在本实施例中，该第二散热装置220可以为金属块，用于制成金属块的金属包括但不限于铜、铜合金、铝、铝合金、铁、铁合金、镍、镍合金、金、金合金、银、银合金、铂族、铂族合金、铬、铬合金、镁、镁合金、钨、钨合金、钼、钼合金、铅、铅合金、锡、锡合金、铟、铟合金、锌或锌合金等。
在另一实施例中，该金属块可以由金属基块和导电石墨片组成。由于导电石墨片的热阻较普通金属及合金的小，可以在金属中嵌入导电石墨片使得导热更加迅速。本申请对该第二散热装置220的材质不作限制。
第二散热装置220的形状可以为立方体，圆柱体以及正立方体等规则形状，也可以为不规则形状，本申请对第二散热装置220的结构不作限制。
其中，将第二散热装置220与第一散热装置20a连接的方法可以有多种，例如可以直接使用双面胶将第二散热装置220与第一散热装置20a粘结；也可以使用电焊的方式，将第二散热装置220和第一散热装置20a通过焊接的方式连接在一起；还可以使用导电焊接材料层80（锡膏、锡片或铜浆等）来使第二散热装置220和第一散热装置20a之间粘结等。可以理解地，其余可以将第二散热装置220与第一散热装置20a进行连接，且可以进行热传导的方式均在本申请的保护范围内。
请参阅图4-10，图4-6是本申请又一实施例的印刷电路板的制作方法的流程图，图7-11是本申请又一实施例的印刷电路板的制作工艺流程图。
制作印刷电路板100包括以下步骤：
S10：提供第一芯板12、第二芯板14、散热装置20和导电粘结材料30，且第二芯板14上靠近第一芯板12的一侧设置有金属层142。
其中，第一芯板12和第二芯板14的数量至少为一个。第一芯板12可包括芯板介质120和位于芯板介质120至少一侧的金属层122。同样地，第二芯板14可包括芯板介质140和位于芯板介质140至少一侧的金属层142。
在本实施例中，金属层142设置在第一芯板12邻近第二芯板14一侧。
也就是说，每一第二芯板14均包括一个芯板介质140，而在芯板介质140的相对两侧，可以只设置一个金属层142，也可以两侧都设置金属层142，但是至少在第二芯板14邻近散热装置20的一侧设置有金属层142。
在本实施例中，参阅图1，该第二芯板14的芯板介质140相对的两侧均设置有金属层142。其中，第二芯板14上靠近第一芯板12一侧的金属层142为接地层，而背离该第一芯板12的另一侧的金属层144为信号层。每一第一芯板12和第二芯板14需要进行表面处理，表面处理包括：
在每一第一芯板12和第二芯板14的表面上按照预设图形进行电镀，使得其表面上形成图案。
其中，在实际生产中，最常用的是在每一第一芯板12和第二芯板14表面金属层的部分区域上进行镀锡处理。利用化学方法将未进行电镀的金属层的区域溶解掉。利用化学试剂对电镀后的每一第一芯板12和第二芯板14进行处理；其中，化学试剂可以与金属层未电镀的区域相互反应，但是与镀层不发生反应。因此，可以将金属层上未电镀的区域溶解。随后，将化学处理过的每一第一芯板12和第二芯板14进行退锡处理，得到被电镀图案覆盖的区域的金属层122和142，形成金属图案。
得到表面具有图案的第一芯板12和第二芯板14后即可进行以下步骤：
S20：对第一芯板12进行开槽处理以形成贯穿第一芯板12的第一通槽124。
该步骤具体包括：
S210：提供具有粘性的第一连接层18。
S220：对第一芯板12和第一连接层18进行开槽处理，以在第一芯板12上形成第一通槽124，且在第一连接层18上形成第二通槽182。
S230：将处理后的第一连接层18放置在第一芯板12和第二芯板14之间，并使第一通槽124与第二通槽182对齐。其中，该第一通槽124与第二通槽182的最大横截面积应当大于散热装置20的最大横截面积，以使散热装20可以放入第一通槽124与第二通槽182中。
在本实施例中，该第一连接层18可为热塑性材料。在一实施例中，该热塑性材料包括：聚酮、聚芳酰胺、聚酰亚胺、聚醚酰亚胺、聚酰胺酰亚胺、聚苯硫醚、聚苯砜、氟聚合物、聚苯并咪唑、它们的衍生物或它们的组合。在另一实施例中，该热塑性材料包括一种聚合物，如聚酮、热塑性聚酰亚胺、 聚醚酰亚胺、聚苯硫醚、聚醚砜、聚砜、聚酰胺酰亚胺、它们的衍生物、或它们的组合。在其他实施例中，该热塑性材料包括聚酮，如聚醚醚酮、聚醚酮、聚醚酮酮、聚醚酮醚酮酮、它们的衍生物、或它们的组合。
第一连接层18还可为热固性材料，在一实施例中，该热固性材料包括：烯丙基树脂、环氧树脂、热固性聚氨酯、有机硅或聚硅氧烷等。这些树脂可由可聚合组合物的反应产物形成，所述可聚合组合物包括至少一种低聚聚氨酯(甲基)丙烯酸酯。通常，所述低聚聚氨酯(甲基)丙烯酸酯为多(甲基)丙烯酸酯。术语“(甲基)丙烯酸酯”用于指代丙烯酸和甲基丙烯酸的酯，并且与通常指代(甲基)丙烯酸酯聚合物的“聚(甲基)丙烯酸酯”相对比，“多(甲基)丙烯酸酯”是指包括不止一个(甲基)丙烯酸酯基团的分子。最常见的是，多(甲基)丙烯酸酯为二(甲基)丙烯酸酯，但是也可以考虑采用三(甲基)丙烯酸酯、四(甲基)丙烯酸酯等等。
在其他实施中，当第一芯板12的数量为多个且第二芯板14数量为多个时，则对第一芯板12进行开槽处理具体包括：
S210a：提供多个具有粘性的第一连接层18。
S220a：对多个第一芯板12和多个第一连接层18进行开槽处理，以在多个第一芯板12上形成第一通槽124，且在多个第一连接层18上形成第二通槽182；
S230a：将处理后的多个第一连接层18放置在任意两个相邻第一芯板12之间和任意两个相邻第二芯板14之间，以及一个相邻第一芯板12和一个第二芯板14之间，并使多个第一连接层18上的第二通槽182与多个第一芯板上12的第一通槽124对齐。
具体地，可以在竖直方向依次叠置第一芯板12和第二芯板14，且将第一连接层18放置在相邻多个第一芯板12和多个第二芯板14之间，以及在相邻的第一芯板12与第二芯板14之间。例如，加入第一芯板12的数量为二且第二芯板14的数量为二时，依次叠置的顺序为：第一芯板12、第一连接层18、第一芯板12、第一连接层18、第二芯板12、第一连接层18、第二芯板14。
S30：将散热装置20置于第一通槽124中。
在一个实施例中，导电粘结材料30可以为膏状或浆状的导电材料。当导电粘结材料30为膏状或浆状的的导电材料时，将散热装置20通过导电粘结材料30连接在第二芯板14的金属层142上的步骤包括：先将导电材料通过印刷或涂覆的方式粘结散热装置20或第二芯板14的金属层142上，然后将散热装置20置于开槽中，以实现散热装置20与第二芯板14的金属层142的连接。
其中，该导电材料例如由树脂基体、导电粒子和分散添加剂、助剂等组成的导电胶。其中，树脂基体可以为环氧树脂、有机硅树脂、聚酰亚胺树脂、酚醛树脂、聚氨酯、丙烯酸树脂等胶黏剂体系。这些胶黏剂在固化后形成了导电胶的分子骨架结构，提供了力学性能和粘接性能保障，并使导电填料粒子形成通道。而导电粒子可以是金、银、铜、铝、锌、铁、镍的粉末和石墨及一些导电化合物，用于实现导电性能。此外，该液态的导电材料还可以为导电银浆、导电铜浆或导电焊膏等。
在另一实施例中，导电粘结层30还可以为半固化的粘结片。当导电粘结层30为固态的粘结片时，将散热装置20通过导电粘结层30连接在第二芯板14的金属层142上的步骤包括：将导电粘结层30贴在散热装置20上，然后将散热装置20附着有导电粘结层30的一端先放入开槽中，使得散热装置20与第二芯板14的金属层142连接。
在一实施例中，该粘结片可以为导电泡棉。其中，该导电泡棉的相对两侧面上可设置有导电双面胶，从而使得该导电泡棉可通过相对两侧面的双面胶分别粘贴于散热装置和金属层上，进而实现第一散热装置和第二芯板上的金属层的粘合和电气连接。其中，导电泡棉具有良好导电性及弹性大的特点，能够有效地填补散热装置和金属层之间的微小间隙，使散热装置和金属层之间充分的接触，从而可以有效地克服在安装过程中散热装置和金属层之间的接触不充分导致接地不良的问题。
由于环氧树脂可以在室温或低于150℃固化，并且具有丰富的配方可设计性能，在另一实施例中，该粘结片还可以通过在环氧树脂内添加金属银的方法制作来获得固态的粘结片，以实现第一散热装置20与第二芯板14上的金属层142之间的粘结和电连接。其中，采用环氧树脂添加金属银的方式可以容易地制成上述厚度在0.05-0.5mm之间，且体积电阻小于0.4mΩ的粘结片。
将散热装置20和第二芯板14的金属层142连接，并放入第一连接层18后，继续进行以下步骤：
S40：对第一芯板12和第二芯板14进行压合以形成印刷电路板100，以使散热装置20通过导电粘结材料30连接在金属层142上。该步骤S40具体包括：
对第一芯板12和第二芯板14以及第一连接层18进行加热，使得第一连接层18融化后流入并填充于第一芯板12和第二芯板14之间以及填充于散热装置20与第一通槽124和第二通槽182的内侧壁之间，并对第一芯板12和第二芯板14以及第一连接层18施加压力，以形成该印刷电路板100。
具体地，对第一芯板12和第二芯板14以及第一连接层18进行热压，由于第一连接层18为热固性材料或热塑性材料，在加热时，第一连接层18软化流动，由于第一通槽124和第二通槽182的横截面积要大于散热装置20的最大的横截面积，使得第二通槽182的内壁与散热装置20的外壁之间存在间隙17，流动的热固性材料流入间隙17处，填满第二通槽182的内壁与散热装置20的外壁之间的间隙17，此时停止加热，流动的热固性材料冷却硬化，填充在间隙17处。
在形成印刷电路板100后，为了进一步增加印刷电路板100上用于安装发热器件200的安装区域，在第二芯板14上开设安装槽40。其中，该安装槽40对应散热装置20设置，且延伸到散热装置20的内部。该安装槽20的深度小于印刷电路板100的高度，且安装槽40的底面积小于导电粘结层30的横截面积。当第二芯板14上背离第一芯板12的一侧设置有信号层144时，该安装槽40还可自第二芯板14上的信号层144延伸至该第一散热装置20的内部。
其中，安装槽40延伸到散热装置20的内部具体是指，安装槽40的深度大于第二芯板14的厚度且小于印刷电路板100的厚度。安装槽40的底面积小于导电粘结层30的横截面积，以使散热装置20可以通过剩余的导电粘结层30与第二芯板14上的金属层142连接。
在本实施例中，可在第二芯板14上通过控深铣工艺直接在第二芯板14上铣出预设深度的安装槽40。采用该控深铣工艺，可在第二芯板14和第一散热装置20上一次性加工出预设深度的安装槽40；其成型步骤少，只需选定加工基准一次，产品加工精度高。
也可以在将第一芯板12和第二芯板14进行压合以形成印刷电路板100之后，在第二芯板14上开设导通孔50。导通孔50从第二芯板14的第一信号层144经过导电粘结层30而延伸至散热装置20的内部。可对导通孔50进行金属化处理，使得导通孔50内壁附着导电层52，该导电层52用于电连接该第二芯板14的第一信号层和第二芯板14的接地层。
在其他实施例中，当该芯板组件10还包括第三芯板时，该导通孔50自第三芯板的第二信号层经过第二芯板14延伸至散热装置20的内部。此外，该导通孔50内还设置有电连接该第三芯板的第二信号层和第二芯板14的接地层的导电层52。
具体地，可采用钻孔的方法在第二芯板14或第三芯板上钻盲孔或者通孔，盲孔或者通孔均与散热装置20接触，以增强第二芯板14上信号层144或第三芯板的第二信号层的接地效果。
在本实施例中，可通过电镀的方式对导通孔50进行金属化处理。具体地，可在含有欲镀金属的盐类溶液中，以安导通孔50的金属为阴极，通过电解作用，使镀液中欲镀金属的阳离子在导通孔50的金属表面沉积出来，从而形成导电层52。常用的用于电镀的金属包括但不限于钛钯、锌、镉、金或黄铜、青铜等。当然，在其他实施例中，还可以通过例如涂覆的方式实现该导通孔50的金属化处理。
在另一实施例中，该导通孔50还可以自第二芯板14或第三芯板的第二信号层的信号层延伸至导电粘结层30且未穿过该导电粘结层30和散热装置20。而在又一实施例中，该导电粘结层30的最大横截面积小于散热装置20上与导电粘结层30接触的表面的面积时，该导通孔50还可以自第二芯板14的信号层144或第三芯板的第二信号层延伸至散热装置20，但并未穿过该导电粘结层30。本说明书中详细描述了印刷电路板100以及印刷电路板100制造方法的示例性实施例。所述印刷电路板100和方法不限于本说明书中描述的具体实施例，相反地，所述印刷电路板100的元件和/或方法的操作可与本说明书中描述的其他元件和/或操作独立和分开地利用。此外，所述元件和/或操作还可限定在其他系统、方法和/或装置中，或与其他系统、方法和/或装置一起使用，并且不限于仅利用本说明书中描述的印刷电路板100进行实施。
除非另作规定，否则本说明书中所述的本发明实施例的操作执行或实施顺序并非必要顺序。即，除非另外指明，否则操作可以任何次序执行，并且本发明的实施例可包括另外或比本说明书公开的那些少的操作。例如，预计在另一操作之前、同时、或之后执行或进行特定操作在本发明的各个方面的范围之内。
以上所述仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (20)

  1. 一种印刷电路板，其特征在于，包括：
    芯板组件，包括依次层叠的第一芯板和第二芯板，所述第二芯板上靠近所述第一芯板的一侧设置有金属层，所述第一芯板开设有贯穿所述第一芯板的通槽；
    散热装置，容置在所述通槽中；及
    导电粘结层，设置于所述第二芯板的所述金属层和所述散热装置之间，用于将所述散热装置与所述金属层电连接。
  2. 根据权利要求1所述的印刷电路板，其特征在于，所述第一芯板的数量为多个，且多个所述第一芯板依次层叠；
    多个所述第一芯板的所有所述通槽对应设置，并截止于所述第二芯板，以形成用于容纳所述散热装置的容纳空间；所述散热装置至少部分容纳于所述容纳空间中。
  3. 根据权利要求1所述的印刷电路板，其特征在于，还包括位于所述第一芯板和所述第二芯板之间并环绕所述导电粘结层设置的第一连接层；所述第一连接层为粘性材料，用于将所述第一芯板和所述第二芯板粘合。
  4. 根据权利要求3所述的印刷电路板，其特征在于，所述通槽的最大横截面积大于所述散热装置的最大横截面积，以使所述散热装置的外侧壁和所述第一芯板上围成所述通槽的内侧壁之间形成间隙。
  5. 根据权利要求4所述的印刷电路板，其特征在于，所述间隙内还设置有第二连接层，且所述第二连接层由粘接材料制成，用于将所述散热装置和所述第一芯板粘合。
  6. 根据权利要求5所述的印刷电路板，其特征在于，所述第二连接层与所述第一连接层为一体结构。
  7. 根据权利要求1所述的印刷电路板，其特征在于，所述导电粘结层的横截面积小于或等于所述散热装置上与所述导电粘结层接触的表面的面积。
  8. 根据权利要求1所述的印刷电路板，其特征在于，在所述第二芯板上开设有贯穿所述第二芯板且用于安装发热器件的安装槽；所述安装槽对应所述散热装置设置，穿过所述导电粘结层并延伸到所述散热装置的表面或内部，且所述安装槽的深度小于所述印刷电路板的高度。
  9. 根据权利要求1所述的印刷电路板，其特征在于，所述金属层为接地层；所述第二芯板上背离所述第一芯板的一侧还设置有第一信号层；
    所述印刷电路板进一步开设有自所述第一信号层至少延伸至所述接地层的导通孔；所述导通孔内设置有电连接所述第一信号层和所述接地层的导电层，用于加强所述第一信号层的接地性能。
  10. 根据权利要求1所述的印刷电路板，其特征在于，还包括叠设于所述第二芯板背离所述第一芯板一侧的至少一个第三芯板；
    所有的第三芯板中与所述第二芯板距离最大的第三芯板上背离所述第二芯板的一侧还设置有第二信号层；所述印刷电路板进一步开设有自所述第二信号层至少延伸至所述接地层的导通孔；所述导通孔内设置有电连接所述第二信号层和所述接地层的导电层，用于加强所述第二信号层的接地性能。
  11. 一种电子装置，其特征在于，包括：
    印刷电路板，包括：
    芯板组件，包括依次层叠的第一芯板和第二芯板，所述第二芯板上靠近所述第一芯板的一侧设置有金属层，所述第一芯板上开设有贯穿所述第一芯板的通槽，所述第二芯板上开设有贯穿所述第二芯板的安装槽；
    第一散热装置，容置在所述通槽内；
    导电粘结层，设置于所述第二芯板的所述金属层和所述第一散热装置之间，用于将所述第一散热装置与所述金属层电连接；及
    发热器件，安装于所述安装槽内，且所述发热器件的最大横截面积小于所述第一散热装置上构成所述安装槽的底面的面积。
  12. 根据权利要求11所述的电子装置，其特征在于，所述发热器件包括电子器件和第二散热装置；所述第二散热装置设置于所述安装槽内，且位于所述第一散热装置及所述电子器件之间；所述第二散热装置的最大横截面积小于所述第一散热装置上构成所述安装槽的底面的面积。
  13. 一种印刷电路板的制作方法，其特征在于，所述制作方法包括：
    提供第一芯板、第二芯板、散热装置和导电粘结材料，所述第二芯板的一侧设置有金属层；
    对所述第一芯板进行开槽处理以形成贯穿所述第一芯板的第一通槽；
    将所述散热装置置于所述第一通槽中；及
    对所述第一芯板和所述第二芯板进行压合以形成所述印刷电路板，以使所述散热装置通过所述导电粘结材料连接在所述金属层上。
  14. 根据权利要求13所述的制作方法，其特征在于，所述导电粘结材料为膏状或浆状；所述使所述散热装置通过所述导电粘结材料连接在所述金属层上的步骤包括：将所述导电粘结材料通过印刷或涂覆的方式粘结在所述金属层或所述散热装置上。
  15. 根据权利要求13所述的制作方法，其特征在于，所述导电粘结材料为半固化状；使所述散热装置通过所述导电粘结材料连接在所述金属层上的步骤包括：将所述导电粘结材料贴在所述散热装置上，并将所述散热装置附着有所述导电粘结材料的一端与所述金属层连接。
  16. 根据权利要求13所述的制作方法，其特征在于，对所述第一芯板进行开槽处理的步骤包括：
    提供具有粘性的第一连接层；
    对所述第一芯板和所述第一连接层进行开槽处理，以在所述第一芯板上形成所述第一通槽，且在所述第一连接层上形成第二通槽；
    将处理后的所述第一连接层放置在所述第一芯板和所述第二芯板之间，并使所述第一通槽与所述第二通槽对齐。
  17. 根据权利要求16所述的制作方法，其特征在于，对所述第一芯板和所述第二芯板进行压合以形成所述印刷电路板的步骤包括：
    对所述第一芯板和所述第二芯板以及所述第一连接层进行加热，使得所述第一连接层融化后流入并填充于所述第一芯板和所述第二芯板之间以及填充于所述散热装置与所述第一通槽和所述第二通槽的内侧壁之间，并对所述第一芯板和所述第二芯板以及所述第一连接层施加压力，以形成所述印刷电路板。
  18. 根据权利要求13所述的制作方法，其特征在于，对所述第一芯板和所述第二芯板进行压合以形成所述印刷电路板之后还包括：
    在所述第二芯板上对应所述散热装置的位置处开设贯穿所述第二芯板的安装槽，使所述安装槽穿过所述导电粘结材料并延伸到所述散热装置的表面或内部；其中，所述安装槽的深度小于所述印刷电路板的高度。
  19. 根据权利要求17所述的制作方法，其特征在于，所述第二芯板上背离所述第一芯板的一侧还设置有信号层且所述第二芯板上靠近所述第一芯板的一侧设置的所述金属层为接地层；
    对所述第一芯板和所述第二芯板进行压合以形成所述印刷电路板之后还包括：
    在所述第二芯板上开设自所述信号层至少延伸至所述金属层的导通孔；及
    对所述导通孔进行金属化处理，使得所述导通孔内侧壁附着用于电连接所述信号层和所述接地层的导电层。
  20. 根据权利要求13所述的制作方法，其特征在于，对所述第一芯板和所述第二芯板进行压合以形成所述印刷电路板的步骤还包括：
    提供至少一个第三芯板，并将第一芯板、第二芯板和至少一个第三芯板一次层叠；其中，所有的第三芯板中与所述第二芯板距离最大的第三芯板上背离所述第二芯板的一侧设置有信号层；所述第二芯板上靠近所述第一芯板的一侧设置的所述金属层为接地层；
    在所述至少一个第三芯板上开设自所述信号层至少延伸至所述接地层的导通孔；及
    对所述导通孔进行金属化处理，使得所述导通孔内侧壁附着用于电连接所述信号层和所述接地层的导电层。
PCT/CN2018/080937 2018-02-09 2018-03-28 一种印刷电路板及其制作方法和电子装置 WO2019153452A1 (zh)

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