WO2019134196A1 - 柔性oled面板的制造方法、柔性oled面板和显示器 - Google Patents

柔性oled面板的制造方法、柔性oled面板和显示器 Download PDF

Info

Publication number
WO2019134196A1
WO2019134196A1 PCT/CN2018/073841 CN2018073841W WO2019134196A1 WO 2019134196 A1 WO2019134196 A1 WO 2019134196A1 CN 2018073841 W CN2018073841 W CN 2018073841W WO 2019134196 A1 WO2019134196 A1 WO 2019134196A1
Authority
WO
WIPO (PCT)
Prior art keywords
openings
inorganic layer
area
region
rows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/073841
Other languages
English (en)
French (fr)
Inventor
李鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to US15/961,412 priority Critical patent/US10651406B2/en
Publication of WO2019134196A1 publication Critical patent/WO2019134196A1/zh
Priority to US16/826,140 priority patent/US10770669B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/11—Separation of active layers from substrates
    • H10P95/112—Separation of active layers from substrates leaving a reusable substrate, e.g. epitaxial lift off
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the field of display panel technologies, and in particular, to a method for manufacturing a flexible OLED panel, a flexible OLED panel, and a display.
  • the LLO (Laser lift off) process is one of the key manufacturing processes of a flexible OLED (Organic Light-Emitting Diode) panel.
  • the flexible OLED panel includes a display area and a frame area, and cracks may occur in the frame area when the LLO is performed. As time passes, the crack will continue to spread and eventually spread to the display area, affecting the normal display of the display area.
  • the present application provides a method for manufacturing a flexible OLED panel, a flexible OLED panel, and a display, which can avoid defects that affect normal display due to cracks in the frame region.
  • a manufacturing method of a flexible OLED panel comprising: providing a rigid substrate; forming a flexible substrate, a first inorganic layer, a TFT device, a second inorganic layer, an OLED device, and an encapsulation layer on the rigid substrate to form a first flexible An OLED large plate, wherein the first inorganic layer is formed between the flexible substrate and a semiconductor layer of the TFT device; the second inorganic layer covers the semiconductor layer, a gate of the TFT device, and The first inorganic layer, the source and the drain of the TFT device penetrate into the second inorganic layer and are connected to the semiconductor layer, and the second inorganic layer connects the gate and the source
  • the OLED device is formed on the TFT device; the encapsulation layer encapsulates the OLED device and the TFT device for packaging;
  • the first flexible OLED slab includes a display area, a frame area surrounding the periphery of the display area, and a cutting area surrounding the outer periphery of the frame area, the frame area
  • each of the openings of each row is spaced apart from each other, and the openings of two adjacent rows are At least one of the openings of the other row is distributed between every two adjacent openings of one of the rows.
  • each of the openings in each row is sequentially connected, and the openings in the adjacent two rows are At least one of the openings of the other row is distributed between every two adjacent ones of the rows.
  • the at least two rows of openings form a plurality of X-shaped patterns connected in sequence.
  • each of the openings penetrates only the second inorganic layer or penetrates the second inorganic layer and a portion of the first inorganic layer.
  • a flexible OLED panel having a display area and a frame area surrounding the periphery of the display area, the frame area including the connected first area and the second area, the first area being away from the second area
  • the side is connected to the display area;
  • the flexible OLED panel comprises a flexible substrate and an inorganic layer disposed on the flexible substrate, the flexible substrate and the inorganic layer are both distributed in the display area, a first zone and a second zone;
  • the inorganic layer is located at a portion of the second zone and is provided with at least two rows of openings, and a line connecting each of the openings of each row is surrounded by the frame zone a direction extending, the adjacent two rows of the openings being misaligned in the surrounding direction such that the second region is away from any position on a boundary of the first region to any position of the display region At least one of the openings is distributed on the line.
  • each of the openings of each row is arranged at intervals; wherein, among the two adjacent rows, at least one of another row is disposed between each two adjacent ones of the rows The opening.
  • each of the openings in each row is connected in sequence; of the two adjacent rows, one of the two adjacent ones of the rows is distributed with at least one of the other row Open the hole.
  • the at least two rows of openings form a plurality of X-shaped patterns connected in sequence.
  • a display comprising the flexible OLED panel described above.
  • an opening is first provided in a portion of the second inorganic layer located in the second region, and laser peeling is performed. Cracks are generated even when the laser is peeled off, but the cracks can release the cracking stress of the second inorganic layer, so that the crack stops diffusing when it encounters the opening, thereby avoiding the crack propagation from the frame region to the display region. .
  • the opening serves to block the crack diffusion by releasing the cracking stress; and, the openings are arranged in at least two rows, and the adjacent two rows of the openings are misaligned in the surrounding direction, so that Disposing at least one of the openings in the second region from any position on the boundary of the first region to any position in the display region, which can spread cracks at any position of the inorganic layer Both can be blocked by at least one of the openings, thereby ensuring that cracks at any position cannot spread to the display area, improving the manufacturing yield of the flexible OLED panel and improving the reliability of the flexible OLED panel.
  • FIG. 1 is a schematic front view of a flexible OLED panel according to an embodiment of the present application.
  • FIG. 2 is a schematic cross-sectional structural view of a first flexible OLED large plate formed in the manufacturing method of the embodiment of the present application;
  • FIG. 3 is a schematic view showing an opening provided on an inorganic layer in the manufacturing method of the embodiment of the present application.
  • FIG. 4 is a schematic view showing a distribution structure of an opening in a first embodiment of the embodiment of the present application
  • FIG. 5 is a schematic view showing a distribution structure of an opening in a second embodiment of the embodiment of the present application.
  • FIG. 6 is a schematic view showing the distribution structure of the openings in the third embodiment of the embodiment of the present application.
  • the fixed connection may also be detachably connected or integrally connected; it may be a mechanical connection; it may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood in the specific circumstances for those skilled in the art.
  • Embodiments of the present application provide a method for manufacturing a flexible OLED panel for manufacturing a flexible OLED panel.
  • the flexible OLED panel may be the flexible OLED panel 10 shown in FIG. 1 , which includes a display area D and a bezel area B surrounding the periphery of the display area D.
  • the display area D is distributed with a display device for displaying a picture.
  • the display area D has a boundary d (the boundary d is also a common boundary between the display area D and the border area B).
  • the border area B is a non-display area, and a driving circuit, a frame seal glue, and the like can be arranged.
  • the bezel area B has a boundary b, and the bezel area B surrounds the outer circumference of the display area D.
  • the first flexible OLED slab includes a display area and a border surrounding the periphery of the display area And a cutting area surrounding the outer periphery of the frame area, the frame area including the connected first area and the second area, and the side of the first area
  • a rigid substrate 11 is provided in step 1, which includes, but is not limited to, a glass substrate as a rigid carrier for the film formation in a subsequent step.
  • a flexible substrate 12 As shown in FIG. 2, in step 2, a flexible substrate 12, a first inorganic layer 131, a TFT device, a second inorganic layer 132, an OLED device 16, and an encapsulation layer 15 are formed over the rigid substrate 11 to form a first flexibility.
  • OLED large board 100 As shown in FIG. 2, in step 2, a flexible substrate 12, a first inorganic layer 131, a TFT device, a second inorganic layer 132, an OLED device 16, and an encapsulation layer 15 are formed over the rigid substrate 11 to form a first flexibility.
  • OLED large board 100 As shown in FIG. 2, in step 2, a flexible substrate 12, a first inorganic layer 131, a TFT device, a second inorganic layer 132, an OLED device 16, and an encapsulation layer 15 are formed over the rigid substrate 11 to form a first flexibility.
  • OLED large board 100 As shown in FIG. 2, in step 2, a flexible substrate 12, a first inorganic layer 131, a T
  • the flexible substrate 12 includes, but is not limited to, a PI (Polyimide Film) film or other flexible bending resistant film layer.
  • the first inorganic layer 131 and the second inorganic layer 132 include, but are not limited to, SiNx, SiOx or SiNx+SiOx material layers.
  • the first inorganic layer 131 and the second inorganic layer 132 may each include a plurality of stacked inorganic material layers by multiple material deposition.
  • the formed TFT device includes a semiconductor layer 19, a gate electrode 18, a source electrode 14, and a drain electrode 17.
  • the first inorganic layer 131 is formed between the flexible substrate 12 and the semiconductor layer 19 of the TFT device to provide insulation and buffering.
  • the second inorganic layer 132 is located above the first inorganic layer 131, and the second inorganic layer 132 covers the semiconductor layer 19, the gate electrode 18 of the TFT device, and the first inorganic layer 131.
  • the source electrode 14 and the drain electrode 17 both penetrate into the second inorganic layer 132 and are connected to the semiconductor layer 19 to be conducted through the semiconductor layer 19.
  • the second inorganic layer 132 isolates the gate electrode 18, the source electrode 14 and the drain electrode 17 to ensure normal performance of the TFT device.
  • OLED device 16 is located over the TFT device. It should be understood that a planarization layer may also be formed between the OLED device 16 and the TFT device to planarize the surface of the TFT device to facilitate formation of the OLED device 16.
  • the encapsulation layer 15 encapsulates the OLED device 16, the TFT device, the second inorganic layer 132, and the first inorganic layer 131 to serve as a package protection.
  • a display area, a frame area surrounding the periphery of the display area, and a cutting area C surrounding the periphery of the frame area may be formed (the display is omitted in FIG. 3).
  • the display area is the display area D of the final product OLED panel 10
  • the frame area is the frame area B of the final product OLED panel 10. Therefore, the display area D is directly used to refer to the display area.
  • the border area B refers to the border area. Forming the display area D and the frame area B is actually a process of forming a film layer, a device, a related support structure, a circuit structure, and the like by a patterning process.
  • the film layer, device, related support structure, circuit structure, and the like in B are formed to define the display area D and the frame area B.
  • the cutting zone C is the area to be cut in the cutting process (the process of cutting the large plate into panels).
  • the bezel area B in step 2, in the direction from the outer edge of the bezel area B to the display area D, the bezel area B includes the second area B2 and the first area B1 connected, and the second area The side of B2 away from the first zone B1 is connected to the cutting zone C, and the side of the first zone B1 away from the second zone B2 is connected to the display zone D.
  • FIG. 3 is only a partial cross-sectional schematic view of the frame area B and the cutting area C. Actually, the positional relationship of the cutting area C, the second area B2 and the first area B1 is a nested relationship from the outside to the inside. The first area B1 is adjacent to the display area D. As can also be seen from FIG.
  • the first area B1 is located at the innermost layer of the frame area B, and the boundary d of the display area D is also the left boundary of the first area B1; the cutting area C is located The outer circumference of the border area B, the boundary b of the border area B is also the left boundary of the cutting area C.
  • the rigid substrate 11, the flexible substrate 12, and the first inorganic layer 131 cover the display area D, the first area B1, the second area B2, and the cutting area C. That is, each of the rigid substrate 11, the flexible substrate 12, and the first inorganic layer 131 has a distribution in the display region D, the first region B1, the second region B2, and the dicing region C. It should be understood that the display area D is not shown in FIG. 3, but actually the rigid substrate 11, the flexible substrate 12, and the first inorganic layer 131 are also distributed in the display area D.
  • the second inorganic layer 132 is distributed at least in the display region D, the first region B1, and the second region B2.
  • the second inorganic layer 132 may also be distributed in the dicing region C.
  • the TFT device and the encapsulation layer 15 are both distributed in the display region D and the first region B1, and the OLED device 16 is distributed in the display region D (the TFT device, the OLED device 16 and the encapsulation layer 15 are not shown in FIG. 3).
  • a driving circuit such as a gate line and a data line of the TFT device may be disposed in the first region B1; the cutting region C may be cut out as a cutting region in a subsequent step; and the second region B2 serves as a stress buffer region and can be buffered and released.
  • the stress in the bezel area B when the cutting zone C is cut (this will be described in detail later), so that there is no need to form a device in both the cutting zone C and the second zone B2.
  • step 3 at least two rows of openings are provided in a portion of the second inorganic layer 132 located in the second region B2.
  • two rows of apertures 132a and 132b are shown schematically in Figures 3 and 4.
  • the connecting lines of the respective openings in each row extend along the surrounding direction of the frame area B, and the surrounding direction is the direction in which the frame area B surrounds the display area D, that is, the circumferential direction of the frame area B.
  • the adjacent two rows of openings are misaligned in the surrounding direction such that the second region B2 is away from any position on the boundary b of the first region B1, and at least one opening is distributed to the connecting line of the display region D. .
  • the openings 132a and 132b may be through holes or blind holes. Further, when it is a through hole, each of the openings 132a and each of the openings 132b may penetrate only the second inorganic layer 132 or penetrate the second inorganic layer 132 and a portion of the first inorganic layer 131 to avoid the flexible substrate. 12 exposed and caused the organic matter to volatilize and cause pollution.
  • each of the openings 132a and 132b including a plurality of openings spaced apart from each other.
  • one of the openings 132b is distributed between every two adjacent openings in the opening 132a, and one of the openings 132a is distributed between every two adjacent openings in the opening 132b.
  • Opening thereby causing at least one opening to be distributed on any line on the boundary b to the display area D, thereby achieving the above-mentioned "adjacent two rows of openings in the surrounding direction"
  • the misalignment is arranged such that the second region is away from any position on the boundary of the first region, and at least one of the openings is distributed to a line connecting the display regions.
  • the opening may be hexagonal, and the opening may actually be other shapes such as a circle, a square, or the like.
  • two or more of the openings 132b may be distributed between every two adjacent openings in the opening 132a (or the opening 132b), ie, the opening
  • the openings in 132a (or openings 132b) are sparsely arranged, while the openings in openings 132b (or openings 132a) are relatively dense.
  • two rows of openings 232a and 232b may be formed.
  • each of the openings 232a and 232b is sequentially connected, and one of the openings 232b is disposed between each two adjacent openings of the opening 232a, and the opening 232b is opened.
  • One of the openings 232a is distributed between each of the two adjacent openings.
  • the connection of the openings refers to the communication of the openings.
  • two or more of the openings 232b may be distributed between each two adjacent openings of the opening 232a (or the opening 232b), that is, the opening
  • the openings in 232a (or opening 232b) are sparsely arranged, while the openings in opening 232b (or opening 232a) are relatively dense.
  • At least two rows of openings form a plurality of X-shaped patterns which are sequentially connected.
  • the X-shaped pattern is as shown by the dashed box in FIG.
  • a plurality of X-shaped patterns are connected in a row; in other embodiments, two or more rows of X-shaped patterns may be connected, that is, two or more X-shaped patterns are formed in the lateral direction of FIG.
  • the cutting region C of the first flexible OLED large plate is cut away, that is, all the layers in the cutting region C in FIG. 3 are cut off to obtain a second flexible OLED large plate (not shown).
  • the first flexible OLED large plate provided with the opening obtained after the steps 1 to 3 is the entire flexible OLED mother board, and needs to be cut into small flexible OLED panel semi-finished products through a cutting process (ie, the first Two flexible OLED panels), wherein the cutting zone C is the portion that is cut.
  • the laser cutting process can be used for cutting. Since the laser-cut beam has a certain width, it is necessary to design a region having a certain width (i.e., the cutting region C) as a target region for laser irradiation.
  • the width of the cutting zone C i.e., the spacing of the boundary b to the boundary c
  • step 5 the rigid substrate 11 in the second flexible OLED slab is removed using a laser lift-off technique.
  • the subsequent process can also be continued to finally produce a flexible OLED panel.
  • an opening is provided in a portion where the second inorganic layer 132 is located in the second region B2, and laser peeling is performed. Even if cracks are still generated in the laser lift-off, since the openings can release the cracking stress of the second inorganic layer 132, the cracks stop diffusing when the openings are encountered, thereby avoiding the crack propagation to the defects of the display region D. That is, the opening serves to block the crack propagation by releasing the cracking stress. Further, the openings are arranged in at least two rows, and the adjacent two rows of the openings are misaligned in the surrounding direction such that the second region is away from the boundary of the first region.
  • At least one of the openings is disposed on a line connecting the display area to the display area, so that diffusion of cracks at any position in the second inorganic layer 132 can be blocked by at least one of the openings, thereby ensuring Cracks at any position cannot spread to the display area D, which improves the manufacturing yield of the flexible OLED panel and improves the reliability of the flexible OLED panel.
  • the reason why the second inorganic layer 132 does not cover the cutting region C is that the cutting region C is to be cut, and the excessive thickness of the material layer affects the cutting quality of the cutting region C. Therefore, only the first inorganic layer 131 is formed in the dicing region C to serve to ensure the quality of the dicing and to buffer the flexible substrate 12. In other embodiments, the second inorganic layer may also cover the cutting zone C.
  • each of the openings may penetrate only the second inorganic layer 132 or penetrate the second inorganic layer 132 and a portion of the first inorganic layer 131.
  • cracks may appear on the first inorganic layer 131 and or the second inorganic layer 132, and thus the openings may be provided on at least one of the two layers to block crack propagation.
  • the embodiment of the present application also provides a flexible OLED panel which can be fabricated by the manufacturing method described in the above embodiments.
  • the portions of the above-described FIGS. 3 to 6 in which all the material layers in the dicing region C are removed and the rigid substrate 11 are peeled off are the flexible OLED panel of the present embodiment.
  • the flexible OLED panel of the present embodiment will be described below with continued reference to FIGS. 1 through 6.
  • the flexible OLED panel 10 of the present embodiment includes a display area D and a bezel area B surrounding the periphery of the display area D.
  • a display device such as a TFT device, an OLED device, etc.
  • the display area D has a boundary d (the boundary d is also a common boundary between the display area D and the border area B).
  • the border area B is a non-display area, and a driving circuit, a frame seal glue, and the like can be arranged.
  • the bezel area B has a boundary b, and the bezel area B surrounds the outer circumference of the display area D.
  • the frame area B includes a first area B1 and a second area B2 which are connected, the second area B2 is disposed around the outer circumference of the first area B1, and the first area B1 is connected to the display area D.
  • the first zone B1 is located at the innermost layer of the frame zone B, and the boundary d of the display zone D is also the left boundary of the first zone B1.
  • the flexible OLED panel 10 includes a flexible substrate 12 and an inorganic layer 13 disposed on the flexible substrate 12.
  • the flexible substrate 12 and the inorganic layer 13 both cover the display area D and the first area B1.
  • the display area D is not shown in FIG. 3, but actually the flexible substrate 12 and the inorganic layer 13 are also distributed in the display area D.
  • a driving circuit may be disposed in the first region B1; the second region B2 serves as a stress buffering region capable of buffering release cracking stress, which will be described below.
  • At least two rows of openings are provided in a portion of the inorganic layer 13 located in the second region B2.
  • two rows of openings 132a and 132b are shown schematically in Figures 2 and 3.
  • the connecting lines of the respective openings in each row extend along the surrounding direction of the frame area B, and the surrounding direction is the direction in which the frame area B surrounds the display area D, that is, the circumferential direction of the frame area B.
  • the adjacent two rows of openings are arranged in a staggered manner in the surrounding direction such that the second region B2 is away from any position on the boundary b of the first region B1, and is distributed to any line of the display region D.
  • At least one opening In the present embodiment, it should be understood that in order to avoid contamination of the organic substrate by exposing the flexible substrate 12, the opening on the inorganic layer 13 should be a blind hole rather than a through hole.
  • two rows of openings 132a and 132b may be formed, and the openings 132a and 132b each include a plurality of openings spaced apart from each other. Moreover, one of the openings 132b is distributed between every two adjacent openings in the opening 132a, and one of the openings 132a is distributed between each two adjacent openings in the opening 132b.
  • Opening thereby causing at least one opening to be distributed on any line on the boundary b to the display area D, thereby achieving the above-mentioned "adjacent two rows of openings in the surrounding direction"
  • the misalignment is arranged such that the second region is away from any position on the boundary of the first region, and at least one of the openings is distributed to a line connecting the display regions.
  • the opening may be hexagonal, and the opening may actually be other shapes such as a circle, a square, or the like.
  • two or more of the openings 132b may be distributed between every two adjacent openings in the opening 132a (or the opening 132b), ie, the opening
  • the openings in 132a (or openings 132b) are sparsely arranged, while the openings in openings 132b (or openings 132a) are relatively dense.
  • two rows of openings 232a and 232b may be formed.
  • each of the openings 232a and 232b is sequentially connected, and one of the openings 232b is disposed between each two adjacent openings of the opening 232a, and the opening 232b is opened.
  • One of the openings 232a is distributed between each of the two adjacent openings.
  • the connection of the openings refers to the communication of the openings.
  • two or more of the openings 232b may be distributed between each two adjacent openings of the opening 232a (or the opening 232b), that is, the opening
  • the openings in 232a (or opening 232b) are sparsely arranged, while the openings in opening 232b (or opening 232a) are relatively dense.
  • At least two rows of openings form a plurality of X-shaped patterns that are sequentially connected.
  • the X-shaped pattern is as shown by the dashed box in FIG.
  • a plurality of X-shaped patterns are connected in a row; in other embodiments, two or more rows of X-shaped patterns may be connected, that is, two or more X-shaped patterns are formed in the lateral direction of FIG.
  • the portion of the inorganic layer 13 located near the boundary b of the second region B2 is prone to cracks, and the crack extends substantially in the direction directed to the display region D. As time accumulates, the crack will gradually spread to the display area D, which in turn affects the normal operation of the device in the display area D.
  • the portion of the inorganic layer 13 located in the second region B2 is provided with an opening, even if cracks are still generated, since the opening can release the cracking stress of the inorganic layer 13, the crack is encountered when the opening is encountered. The diffusion is stopped, thereby avoiding the crack propagation to the defect of the display area D. That is, the opening serves to block the crack propagation by releasing the cracking stress. Further, the openings are arranged in at least two rows, and the adjacent two rows of the openings are misaligned in the surrounding direction such that the second region is away from the boundary of the first region.
  • At least one of the openings is distributed on any line connecting the display area to the display area, so that the diffusion of cracks at any position in the inorganic layer 13 can be blocked by at least one of the openings, thereby ensuring either The cracks in the position cannot spread to the display area D, which improves the reliability of the flexible OLED panel.
  • the inorganic layer 13 may include a first inorganic layer 131 and a second inorganic layer 132, and the first inorganic layer 131 and the second inorganic layer 132 both cover the first region B1 and the second region B2.
  • the first inorganic layer 131 and the second inorganic layer 132 may each actually comprise a plurality of stacked inorganic material layers by multiple material deposition.
  • the at least two rows of openings are disposed in a portion of the second inorganic layer 132 located in the second region B2, the openings only penetrating through the second inorganic layer 132, or penetrating the second inorganic layer 132 and a portion of the first inorganic layer Layer 131.
  • cracks may occur on the first inorganic layer 131 and or the second inorganic layer 132, and thus the openings may be provided on at least one of the two layers to block crack propagation.
  • first inorganic layer 131 and the second inorganic layer 132 by further forming the first inorganic layer 131 and the second inorganic layer 132, a specific inorganic layer deposition manner is provided, which can well buffer the flexible substrate 12 and improve the flexible OLED panel. Trustworthiness.
  • the embodiment of the present application further provides an OLED display (not shown), including the flexible OLED panel described above.
  • the OLED display of this embodiment has high reliability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本申请提供了一种柔性OLED面板的制造方法、柔性OLED面板及显示器。所述柔性OLED面板采用所述制造方法制造而成，所述显示器包括所述柔性OLED面板。本申请的方案通过在无机层上设置开孔来释放开裂应力，起到了阻挡裂纹扩散的作用；使得所述开孔排成至少两排，且相邻两排的所述开孔在所述围绕方向上错位排列，以使所述第二区远离所述第一区的边界上的任一位置到所述显示区内任一位置的连线上分布有至少一个所述开孔，能够使无机层任一位置裂纹的扩散，都能被至少一个所述开孔阻挡，从而确保了任一位置的裂纹均无法蔓延至显示区D，提高了柔性OLED面板的制造良率，提升了柔性OLED面板的信赖性。

Description

柔性OLED面板的制造方法、柔性OLED面板和显示器
本申请要求于2018年01月05日提交中国专利局、申请号为2018100131788、申请名称为“柔性OLED面板的制造方法、柔性OLED面板和显示器”的中国专利申请的优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本申请涉及显示面板技术领域，尤其涉及一种柔性OLED面板的制造方法、柔性OLED面板和显示器。
背景技术
LLO(Laser lift off，激光剥离)工艺是柔性OLED(Organic Light-Emitting Diode，有机发光二极管)面板的关键制造工序之一。
柔性OLED面板包括显示区及边框区，在进行LLO时，边框区会产生裂纹。随时间累积，裂纹将不断扩散，最终蔓延至显示区，影响显示区的正常显示。
申请内容
有鉴于此，本申请提供了一种柔性OLED面板的制造方法、柔性OLED面板及显示器，能够避免由于边框区出现裂纹而影响正常显示的缺陷。
一种柔性OLED面板的制造方法，包括：提供刚性基板；在所述刚性基板之上制作柔性衬底、第一无机层、TFT器件、第二无机层、OLED器件、封装层，形成第一柔性OLED大板，其中，所述第一无机层形成于所述柔性衬底与所述TFT器件的半导体层之间；所述第二无机层覆盖所述半导体层、所述TFT器件的栅极及所述第一无机层，所述TFT器件的源极和漏极均穿入所述第二无机层内并与所述半导体层相连，所述第二无机层将所述栅极、所述源极及所述漏极相隔绝；所述OLED器件形成于所述TFT器件之上；所述封装层包覆所述OLED器件及所述TFT器件以进行封装；所述第一柔性OLED大 板包括显示区、围设在所述显示区外周的边框区，以及围设在所述边框区外周的切割区，所述边框区包括相连的第一区和第二区，所述第一区远离所述第二区的一侧与所述显示区相连，所述第二区远离所述第一区的一侧与所述切割区相连；所述TFT器件与所述封装层均分布在所述显示区及所述第一区；所述OLED器件分布在所述显示区；所述刚性基板、所述柔性衬底及第一无机层均分布在所述显示区、所述第一区、所述第二区边以及所述切割区；所述第二无机层至少分布在所述显示区、所述第一区及所述第二区；在所述第二无机层位于所述第二区的部分开设至少两排开孔，使每一排的各个所述开孔的连线围绕所述边框区的围绕方向延伸，且相邻两排的所述开孔在所述围绕方向上错位排列，以使所述第二区与所述切割区之间的边界上的任一位置到所述显示区的任一位置的连线上分布至少一个所述开孔；切除所述第一OLED大板中的所述切割区，得到第二柔性OLED大板；采用激光剥离技术去除所述第二柔性OLED大板中的所述刚性基板。
其中，在所述第二无机层位于所述第二区的部分开设至少两排开孔的步骤中，每一排的各个所述开孔相互间隔排布，相邻两排的所述开孔中，其中一排的每两个相邻所述开孔之间分布有另一排的至少一个所述开孔。
其中，在所述第二无机层位于所述第二区的部分开设至少两排开孔的步骤中，每一排中各个所述开孔依次相连，相邻两排的所述开孔中，其中一排的每两个相邻所述开孔之间分布有另一排的至少一个所述开孔。
其中，在所述第二无机层位于所述第二区的部分开设至少两排开孔的步骤中，所述至少两排开孔形成依次相连的若干X形图案。
其中，每个所述开孔仅贯穿所述第二无机层，或者贯穿所述第二无机层与部分所述第一无机层。
一种柔性OLED面板，具有显示区和围设在所述显示区外周的边框区，所述边框区包括相连的第一区和第二区，所述第一区远离所述第二区的一侧与所述显示区相连；所述柔性OLED面板包括柔性衬底和设于所述柔性衬底之上的无机层，所述柔性衬底与所述无机层均分布在所述显示区、所述第一区以及所述第二区；所述无机层位于所述第二区的部分设有至少两排开孔，每一排的各个所述开孔的连线沿所述边框区的围绕方向延伸，相邻两排的所述开孔在 所述围绕方向上错位排列，以使所述第二区远离所述第一区的边界上的任一位置到所述显示区的任一位置的连线上分布有至少一个所述开孔。
其中，每一排的各个所述开孔相间隔排布；相邻两排的所述开孔中，其中一排的每两个相邻所述开孔之间分布有另一排的至少一个所述开孔。
其中，每一排中各个所述开孔依次相连；相邻两排的所述开孔中，其中一排的每两个相邻所述开孔之间分布有另一排的至少一个所述开孔。
其中，所述至少两排开孔形成依次相连的若干X形图案。
一种显示器，包括上述的柔性OLED面板。
本申请的方案中，先在第二无机层位于第二区的部分设置开孔，再进行激光剥离。即使在激光剥离时依然会产生裂纹，但由于开孔能够释放第二无机层的开裂应力，使得裂纹在遇到开孔时会停止扩散，由此避免了裂纹由边框区蔓延至显示区的缺陷。即开孔通过释放开裂应力，起到了阻挡裂纹扩散的作用；并且，使得所述开孔排成至少两排，且相邻两排的所述开孔在所述围绕方向上错位排列，以使所述第二区远离所述第一区的边界上的任一位置到所述显示区内任一位置的连线上分布有至少一个所述开孔，能够使无机层任一位置裂纹的扩散，都能被至少一个所述开孔阻挡，从而确保了任一位置的裂纹均无法蔓延至显示区，提高了柔性OLED面板的制造良率，提升了柔性OLED面板的信赖性。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例的柔性OLED面板的正视结构示意图；
图2在本申请实施例的制造方法中形成的第一柔性OLED大板的横截面结构示意图；
图3是本申请实施例的制造方法中在无机层上设置开孔的示意图；
图4是本申请实施例的第一实施方式中开孔的分布结构示意图；
图5是本申请实施例的第二实施方式中开孔的分布结构示意图；
图6是本申请实施例的第三实施方式中开孔的分布结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
此外，以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请中所提到的方向用语，例如，“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”、“侧面”等，仅是参考附加图式的方向，因此，使用的方向用语是为了更好、更清楚地说明及理解本申请，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“设置在……上”应做广义理解，例如，可以是固定连接，也可以是可拆卸地连接，或者一体地连接；可以是机械连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
此外，在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。若本说明书中出现“工序”的用语，其不仅是指独立的工序，在与其它工序无法明确区别时，只要能实现该工序所预期的作用则也包括在本用语中。另外，本说明书中用“～”表示的数值范围是指将“～”前后记载的数值分别作为最小值及最大值包括在内的范围。在附图中，结构相似或相同的单元用相同的标号表示。
本申请实施例提供了一种柔性OLED面板的制造方法，用于制造柔性OLED面板。示意性地，所述柔性OLED面板可以是图1所示的柔性OLED面板10，其包括显示区D和围设在显示区D外周的边框区B。其中，显示区D分布有显示器件，用于显示画面。显示区D具有边界d(边界d也为显示区 D与边框区B之间的公共边界)。边框区B为非显示区，可以布置驱动电路、封框胶等等。边框区B具有边界b，边框区B围绕显示区D的外周一周。以下将结合具体附图详细描述本申请实施例的柔性OLED面板的制造方法。
本实施例的柔性OLED面板的制造方法包括以下步骤：
1.提供刚性基板；
2.在所述刚性基板之上制作柔性衬底、第一无机层、TFT器件、第二无机层、OLED器件、封装层，形成第一柔性OLED大板，其中，所述第一无机层形成于所述柔性衬底与所述TFT器件的半导体层之间；所述第二无机层覆盖所述半导体层、所述TFT器件的栅极及所述第一无机层，所述TFT器件的源极和漏极均穿入所述第二无机层内并与所述半导体层相连，所述第二无机层将所述栅极、所述源极及所述漏极相隔绝；所述OLED器件形成于所述TFT器件之上；所述封装层包覆所述OLED器件及所述TFT器件以进行封装；所述第一柔性OLED大板包括显示区、围设在所述显示区外周的边框区，以及围设在所述边框区外周的切割区，所述边框区包括相连的第一区和第二区，所述第一区远离所述第二区的一侧与所述显示区相连，所述第二区远离所述第一区的一侧与所述切割区相连；所述TFT器件与所述封装层均分布在所述显示区及所述第一区；所述OLED器件分布在所述显示区；所述第一无机层分布在所述显示区、所述第一区、所述第二区边以及所述切割区；所述第二无机层至少分布在所述显示区、所述第一区及所述第二区；
3.在所述第二无机层位于所述第二区的部分开设至少两排开孔，使每一排的各个所述开孔的连线围绕所述边框区的围绕方向延伸，且相邻两排的所述开孔在所述围绕方向上错位排列，以使所述第二区与所述切割区的边界上的任一位置到所述显示区任一位置的连线上分布至少一个所述开孔；
4.切除所述第一柔性OLED大板中的所述切割区，得到第二柔性OLED大板；
5.采用激光剥离技术去除所述第二柔性OLED大板中的所述刚性基板。
具体的，如图2所示，在步骤1中提供了刚性基板11，刚性基板11包括但不限于为玻璃基板，其作为后续步骤所成膜层的刚性载体。
如图2所示，在步骤2中，在刚性基板11之上形成柔性衬底12、第一无 机层131、TFT器件、第二无机层132、OLED器件16、封装层15，形成第一柔性OLED大板100。
其中，柔性衬底12包括但不限于为PI(Polyimide Film，聚酰亚胺)膜或其他柔性耐弯折膜层。第一无机层131与第二无机层132包括但不限于为SiNx、SiOx或SiNx+SiOx材料层。本实施例中，通过多次材料沉积，第一无机层131与第二无机层132均可以包括若干层叠的无机材料层。
如图2所示，所形成的TFT器件包括半导体层19、栅极18、源极14及漏极17。第一无机层131形成于柔性衬底12与TFT器件的半导体层19之间，起到绝缘和缓冲作用。第二无机层132位于第一无机层131之上，第二无机层132覆盖了半导体层19、TFT器件的栅极18及第一无机层131。源极14和漏极17均穿入第二无机层132内并与半导体层19相连，以通过半导体层19导通。第二无机层132将所栅极18、源极14及漏极17相隔绝，以保证TFT器件的正常性能。
如图2所示，OLED器件16位于TFT器件之上。应理解，OLED器件16与TFT器件之间还可以形成平坦化层，以将TFT器件的表面平坦化，便于形成OLED器件16。封装层15包覆OLED器件16、TFT器件、第二无机层132及第一无机层131，起到封装防护作用。
本实施例中，结合图1和图3所示，在步骤2中可形成显示区、围设在显示区外周的边框区和围设在边框区外周的切割区C(图3中略去了显示区)，所述显示区即为最终产品OLED面板10的显示区D，所述边框区即为最终产品OLED面板10的边框区B，因此下文直接用显示区D指代所述显示区，用边框区B指代所述边框区。形成显示区D与边框区B实际上是通过图案化工艺形成膜层、器件、相关支撑结构、电路结构等的过程，显示区D与边框区B一旦形成，就表示位于显示区D与边框区B内的膜层、器件、相关支撑结构、电路结构等形成，从而限定了出显示区D与边框区B。切割区C为将在切割制程(将大板切割成面板的工艺)中被切除的区域。
结合图1和图3所示，在步骤2中，在由边框区B的外边缘到显示区D的方向上，边框区B包括由相连的第二区B2和第一区B1，第二区B2远离第一区B1的一侧与切割区C相连，第一区B1远离第二区B2的一侧与显示区D 相连C。应理解，图3仅仅为边框区B和切割区C的局部横截面示意图，实际上切割区C、第二区B2和第一区B1的位置关系是由外到内的依次嵌套关系。第一区B1与显示区D相邻，由图3也可知，第一区B1位于边框区B的最内层，显示区D的边界d也为第一区B1的左边界；切割区C位于边框区B的外周，边框区B的边界b也为切割区C的左边界。
如图3所示，在步骤2中，刚性基板11、柔性衬底12、第一无机层131均覆盖显示区D、第一区B1、第二区B2，及切割区C。即刚性基板11、柔性衬底12，及第一无机层131中的每个材料层在显示区D、第一区B1、第二区B2，及切割区C具有分布。应理解，图3中并未示出显示区D，但实际上刚性基板11、柔性衬底12，及第一无机层131在显示区D内也均有分布。第二无机层132至少分布在显示区D、第一区B1及第二区B2，即进一步的，第二无机层132还可以在切割区C分布。TFT器件与封装层15均分布在显示区D及第一区B1，OLED器件16分布在显示区D(图3并未示出TFT器件、OLED器件16及封装层15)。
本实施例中，第一区B1内可以布置驱动电路，如TFT器件的栅线和数据线；切割区C作为切割区域可以在后续步骤中切除；第二区B2作为应力缓冲区域，能够缓冲释放切割切割区C时边框区B内的应力(此将在下文详细描述)，因此切割区C与第二区B2内均无需形成器件。
在步骤3中，在第二无机层132位于第二区B2的部分设置至少两排开孔。例如，图3和图4中示意性的示出了两排开孔132a和132b。每一排中各个开孔的连线沿边框区B的围绕方向延伸，所述围绕方向为边框区B包绕显示区D的方向，也即边框区B的周向。相邻两排的开孔在所述围绕方向上错位排列，以使第二区B2远离第一区B1的边界b上的任一位置，到显示区D的连线上分布有至少一个开孔。本实施例中，在第二无机层132上，开孔132a和132b可以是通孔，也可以是盲孔。进一步的，当为通孔时，每个开孔132a与每个开孔132b可以仅贯穿第二无机层132，或者贯穿第二无机层132与部分第一无机层131，以避免将柔性衬底12露出而导致有机物挥发造成污染。
具体的，如图4所示，在步骤3的第一种实施方式中，可以形成两排开孔132a和132b，开孔132a和132b均包括相互间隔排布的若干个开孔。并且， 开孔132a中每两个相邻开孔之间都分布有开孔132b中的一个开孔，同时开孔132b中每两个相邻开孔之间都分布有开孔132a中的一个开孔，由此使得边界b上的任一位置到显示区D的连线上分布有至少一个开孔，以此实现上文所述的“相邻两排的开孔在所述围绕方向上错位排列，以使所述第二区远离所述第一区的边界上的任一位置，到所述显示区的连线上分布有至少一个所述开孔”。本实施方式中，开孔示意性的可以为六边形，实际上开孔还可以是其他形状，如圆形、方形等等。在其他实施方式中，开孔132a(或开孔132b)中每两个相邻开孔之间可以分布开孔132b(或开孔132a)中的两个或两个以上开孔，即开孔132a(或开孔132b)中的开孔排列较为稀疏，而开孔132b(或开孔132a)中的开孔较为密实。
或者，如图5所示，在步骤3的第二种实施方式中，可以形成两排开孔232a和232b。与上述实施方式不同的是，开孔232a和232b中的各个开孔依次相连，且开孔232a中每两个相邻开孔之间分布有开孔232b中的一个开孔，同时开孔232b中每两个相邻开孔之间分布有开孔232a中的一个开孔。本实施方式中，开孔相连指的是开孔相连通。在其他实施方式中，开孔232a(或开孔232b)中每两个相邻开孔之间可以分布开孔232b(或开孔232a)中的两个或两个以上开孔，即开孔232a(或开孔232b)中的开孔排列较为稀疏，而开孔232b(或开孔232a)中的开孔较为密实。
又或者，如图6所示，在步骤3的第三种实施方式中，与上述实施方式均不同的是，至少两排开孔形成依次相连的若干X形图案。所述X形图案如图6中的虚线框所示。本实施方式中，若干X形图案连成一排；在其他实施方式中，还可以连成两排及以上的X形图案，即在图5的横向上形成两个及以上的X形图案。
在步骤4中，切除所述第一柔性OLED大板的切割区C，即将图3中切割区C内的全部层都切除，得到第二柔性OLED大板(图未标)。本实施例中，经步骤1～3后得到的设有开孔的所述第一柔性OLED大板是整个柔性OLED母板，需要经过切割工序切割成小的柔性OLED面板半成品(即所述第二柔性OLED大板)，其中切割区C为被切割掉的部分。具体的，可以使用激光切割工艺进行切割。由于激光切割束具有一定宽度，因此需要设计具有一定宽度 的区域(即切割区C)作为激光照射的靶区域。切割区C的宽度(即边界b至边界c的间距)可以设为大于激光切割束的宽度，且两者的差值在公差范围之内。
在步骤5中，采用激光剥离技术去除所述第二柔性OLED大板中的刚性基板11。本实施例中，还可以继续进行后续工艺，以最终制得柔性OLED面板。
现有技术中，使用激光剥离技术剥离刚性基板11时，第二无机层132在第二区B2的边界b附近的部分容易产生裂纹，裂纹基本沿指向显示区D的方向延伸。随时间累积，裂纹将逐渐蔓延至显示区D，进而影响显示区D内器件的正常工作。
但本实施例的制造方法中，先在第二无机层132位于第二区B2的部分设置开孔，再进行激光剥离。即使在激光剥离中依然会产生裂纹，但由于开孔能够释放第二无机层132的开裂应力，使得裂纹在遇到开孔时会停止扩散，由此避免了裂纹蔓延至显示区D的缺陷。即开孔通过释放开裂应力，起到了阻挡裂纹扩散的作用。进一步的，使得所述开孔排成至少两排，且相邻两排的所述开孔在所述围绕方向上错位排列，以使所述第二区远离所述第一区的边界上的任一位置到所述显示区的连线上分布有至少一个所述开孔，能够使第二无机层132内任一位置裂纹的扩散，都能被至少一个所述开孔阻挡，从而确保了任一位置的裂纹均无法蔓延至显示区D，提高了柔性OLED面板的制造良率，提升了柔性OLED面板的信赖性。
本实施例中，第二无机层132未覆盖切割区C的原因在于切割区C将被切割，而材料层过厚会影响切割区C的切割质量。因此在切割区C内仅形成第一无机层131，以起到保障切割质量以及对柔性衬底12进行缓冲隔绝的作用。在其他实施例中，第二无机层也可以覆盖切割区C。
相应的，在步骤3中，每个所述开孔可以仅贯穿第二无机层132，或者贯穿第二无机层132及部分第一无机层131。本实施例中，裂纹可以在第一无机层131和或第二无机层132上出现，因而可以在此两层中的至少一层上设置所述开孔，以阻挡裂纹扩散。
本申请实施例还提供了一种柔性OLED面板，可采用上述实施例所述的 制造方法制成。上述图3～图6中去除切割区C内的所有材料层并剥离刚性基板11之后的部分，即为所本实施例的柔性OLED面板。以下将继续参考图1～图6描述本实施例的柔性OLED面板。
如图1所示，本实施例的柔性OLED面板10包括显示区D和围设在显示区D外周的边框区B。其中，显示区D内可以分布显示器件(如TFT器件、OLED器件等)，用于显示画面。显示区D具有边界d(边界d也为显示区D与边框区B之间的公共边界)。边框区B为非显示区，可以布置驱动电路、封框胶等等。边框区B具有边界b，边框区B围绕显示区D的外周一周。
如图3所示，边框区B包括相连的第一区B1和第二区B2，第二区B2围设在第一区B1的外周，第一区B1与显示区D相连。由图3也可知，第一区B1位于边框区B的最内层，显示区D的边界d也为第一区B1的左边界。
结合图1和图3所示，柔性OLED面板10包括柔性衬底12及设于柔性衬底12之上的无机层13，柔性衬底12与无机层13均覆盖显示区D、第一区B1和第二区B2。即柔性衬底12与无机层13中的任一个在显示区D、第一区B1、第二区B2均有分布。应理解，图3中并未示出显示区D，但实际上柔性衬底12及无机层13在显示区D内也均有分布。本实施例中，第一区B1内可以布置驱动电路；第二区B2作为应力缓冲区域，能够缓冲释放开裂应力，此将在下文进行描述。
本实施例中，在无机层13位于第二区B2内的部分设置至少两排开孔。例如，图2和图3中示意性的示出了两排开孔132a和132b。每一排中各个开孔的连线沿边框区B的围绕方向延伸，所述围绕方向为边框区B包绕显示区D的方向，也即边框区B的周向。相邻两排的开孔在所述围绕方向上错位排列，以使第二区B2远离第一区B1的边界b上的任一位置，到显示区D的任一位置的连线上分布有至少一个开孔。本实施例中，应理解，为了避免将柔性衬底12露出而导致有机物挥发造成污染，在无机层13上，开孔应该为盲孔而并非通孔。
具体的，如图4所示，在第一种实施方式中，可以形成两排开孔132a和132b，开孔132a和132b均包括相互间隔排布的若干个开孔。并且，开孔132a中每两个相邻开孔之间都分布有开孔132b中的一个开孔，同时开孔132b中每 两个相邻开孔之间都分布有开孔132a中的一个开孔，由此使得边界b上的任一位置到显示区D的连线上分布有至少一个开孔，以此实现上文所述的“相邻两排的开孔在所述围绕方向上错位排列，以使所述第二区远离所述第一区的边界上的任一位置，到所述显示区的连线上分布有至少一个所述开孔”。本实施方式中，开孔示意性的可以为六边形，实际上开孔还可以是其他形状，如圆形、方形等等。在其他实施方式中，开孔132a(或开孔132b)中每两个相邻开孔之间可以分布开孔132b(或开孔132a)中的两个或两个以上开孔，即开孔132a(或开孔132b)中的开孔排列较为稀疏，而开孔132b(或开孔132a)中的开孔较为密实。
或者，如图5所示，在第二种实施方式中，可以形成两排开孔232a和232b。与上述实施方式不同的是，开孔232a和232b中的各个开孔依次相连，且开孔232a中每两个相邻开孔之间分布有开孔232b中的一个开孔，同时开孔232b中每两个相邻开孔之间分布有开孔232a中的一个开孔。本实施方式中，开孔相连指的是开孔相连通。在其他实施方式中，开孔232a(或开孔232b)中每两个相邻开孔之间可以分布开孔232b(或开孔232a)中的两个或两个以上开孔，即开孔232a(或开孔232b)中的开孔排列较为稀疏，而开孔232b(或开孔232a)中的开孔较为密实。
又或者，如图6所示，在第三种实施方式中，与上述实施方式均不同的是，至少两排开孔形成依次相连的若干X形图案。所述X形图案如图5中的虚线框所示。本实施方式中，若干X形图案连成一排；在其他实施方式中，还可以连成两排及以上的X形图案，即在图6的横向上形成两个及以上的X形图案。
现有技术中，无机层13位于第二区B2的边界b附近的部分容易产生裂纹，裂纹基本沿指向显示区D的方向延伸。随时间累积，裂纹将逐渐蔓延至显示区D，进而影响显示区D内器件的正常工作。
但本实施例方案中，无机层13位于第二区B2内的部分设置有开孔，即使依然会产生裂纹，但由于开孔能够释放无机层13的开裂应力，使得裂纹在遇到开孔时会停止扩散，由此避免了裂纹蔓延至显示区D的缺陷。即开孔通过释放开裂应力，起到了阻挡裂纹扩散的作用。进一步的，使得所述开孔排成 至少两排，且相邻两排的所述开孔在所述围绕方向上错位排列，以使所述第二区远离所述第一区的边界上的任一位置到所述显示区的连线上分布有至少一个所述开孔，能够使无机层13内任一位置裂纹的扩散，都能被至少一个所述开孔阻挡，从而确保了任一位置的裂纹均无法蔓延至显示区D，提升了柔性OLED面板的信赖性。
本实施例中，进一步的，无机层13可以包括第一无机层131和第二无机层132，第一无机层131和第二无机层132均覆盖第一区B1和第二区B2。应理解，通过多次材料沉积，第一无机层131和第二无机层132实际上均可以包括多个层叠的无机材料层。相应的，所述至少两排开孔设于第二无机层132位于第二区内B2的部分，所述开孔仅贯穿第二无机层132，或者贯穿第二无机层132及部分第一无机层131。本实施例中，裂纹可能在第一无机层131和或第二无机层132上出现，因而可以在此两层中的至少一层上设置所述开孔，以阻挡裂纹扩散。
本实施例中，通过进一步形成第一无机层131和第二无机层132，提供了一种具体的无机层沉积方式，能很好地对柔性衬底12进行缓冲隔绝，提升了柔性OLED面板的信赖性。
本申请实施例还提供了一种OLED显示器(图未示)，包括上述的柔性OLED面板。本实施例的OLED显示器信赖性高。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易的想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (16)

  1. 一种柔性OLED面板的制造方法，其中，包括：
    提供刚性基板；
    在所述刚性基板之上制作柔性衬底、第一无机层、TFT器件、第二无机层、OLED器件、封装层，形成第一柔性OLED大板，其中，所述第一无机层形成于所述柔性衬底与所述TFT器件的半导体层之间；所述第二无机层覆盖所述半导体层、所述TFT器件的栅极及所述第一无机层，所述TFT器件的源极和漏极均穿入所述第二无机层内并与所述半导体层相连，所述第二无机层将所述栅极、所述源极及所述漏极相隔绝；所述OLED器件形成于所述TFT器件之上；所述封装层包覆所述OLED器件及所述TFT器件以进行封装；所述第一柔性OLED大板包括显示区、围设在所述显示区外周的边框区，以及围设在所述边框区外周的切割区，所述边框区包括相连的第一区和第二区，所述第一区远离所述第二区的一侧与所述显示区相连，所述第二区远离所述第一区的一侧与所述切割区相连；所述TFT器件与所述封装层均分布在所述显示区及所述第一区；所述OLED器件分布在所述显示区；所述刚性基板、所述柔性衬底及第一无机层均分布在所述显示区、所述第一区、所述第二区边以及所述切割区；所述第二无机层至少分布在所述显示区、所述第一区及所述第二区；
    在所述第二无机层位于所述第二区的部分开设至少两排开孔，使每一排的各个所述开孔的连线围绕所述边框区的围绕方向延伸，且相邻两排的所述开孔在所述围绕方向上错位排列，以使所述第二区与所述切割区之间的边界上的任一位置到所述显示区的任一位置的连线上分布至少一个所述开孔；
    切除所述第一OLED大板中的所述切割区，得到第二柔性OLED大板；
    采用激光剥离技术去除所述第二柔性OLED大板中的所述刚性基板。
  2. 根据权利要求1所述的制造方法，其中，
    在所述第二无机层位于所述第二区的部分开设至少两排开孔的步骤中，每一排的各个所述开孔相互间隔排布，相邻两排的所述开孔中，其中一排的每两个相邻所述开孔之间分布有另一排的至少一个所述开孔。
  3. 根据权利要求1所述的制造方法，其中，
    在所述第二无机层位于所述第二区的部分开设至少两排开孔的步骤中，每一排中各个所述开孔依次相连，相邻两排的所述开孔中，其中一排的每两个相邻所述开孔之间分布有另一排的至少一个所述开孔。
  4. 根据权利要求1所述的制造方法，其中，
    在所述第二无机层位于所述第二区的部分开设至少两排开孔的步骤中，所述至少两排开孔形成依次相连的若干X形图案。
  5. 根据权利要求1所述的制造方法，其中，
    每个所述开孔仅贯穿所述第二无机层，或者贯穿所述第二无机层与部分所述第一无机层。
  6. 根据权利要求2所述的制造方法，其中，
    每个所述开孔仅贯穿所述第二无机层，或者贯穿所述第二无机层与部分所述第一无机层。
  7. 根据权利要求3所述的制造方法，其中，
    每个所述开孔仅贯穿所述第二无机层，或者贯穿所述第二无机层与部分所述第一无机层。
  8. 根据权利要求4所述的制造方法，其中，
    每个所述开孔仅贯穿所述第二无机层，或者贯穿所述第二无机层与部分所述第一无机层。
  9. 一种柔性OLED面板，具有显示区和围设在所述显示区外周的边框区，其中，
    所述边框区包括相连的第一区和第二区，所述第一区远离所述第二区的一侧与所述显示区相连；所述柔性OLED面板包括柔性衬底和设于所述柔性衬底之上的无机层，所述柔性衬底与所述无机层均分布在所述显示区、所述第一区以及所述第二区；
    所述无机层位于所述第二区的部分设有至少两排开孔，每一排的各个所述开孔的连线沿所述边框区的围绕方向延伸，相邻两排的所述开孔在所述围绕方向上错位排列，以使所述第二区远离所述第一区的边界上的任一位置到所述显示区的任一位置的连线上分布有至少一个所述开孔。
  10. 根据权利要求9所述的柔性OLED面板，其中，
    每一排的各个所述开孔相间隔排布；相邻两排的所述开孔中，其中一排的每两个相邻所述开孔之间分布有另一排的至少一个所述开孔。
  11. 根据权利要求9所述的柔性OLED面板，其中，
    每一排中各个所述开孔依次相连；相邻两排的所述开孔中，其中一排的每两个相邻所述开孔之间分布有另一排的至少一个所述开孔。
  12. 根据权利要求9所述的柔性OLED面板，其中，
    所述至少两排开孔形成依次相连的若干X形图案。
  13. 一种显示器，其中，
    包括权利要求9所述的柔性OLED面板。
  14. 根据权利要求13所述的显示器，其中，
    每一排的各个所述开孔相间隔排布；相邻两排的所述开孔中，其中一排的每两个相邻所述开孔之间分布有另一排的至少一个所述开孔。
  15. 根据权利要求13所述的显示器，其中，
    每一排中各个所述开孔依次相连；相邻两排的所述开孔中，其中一排的每两个相邻所述开孔之间分布有另一排的至少一个所述开孔。
  16. 根据权利要求13所述的显示器，其中，
    所述至少两排开孔形成依次相连的若干X形图案。
PCT/CN2018/073841 2018-01-05 2018-01-23 柔性oled面板的制造方法、柔性oled面板和显示器 Ceased WO2019134196A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/961,412 US10651406B2 (en) 2018-01-05 2018-04-24 Manufacturing method of flexible OLED panel, flexible OLED display panel, and display
US16/826,140 US10770669B2 (en) 2018-01-05 2020-03-20 Manufacturing method of flexible OLED panel, flexible OLED display panel, and display

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810013178.8A CN108231855A (zh) 2018-01-05 2018-01-05 柔性oled面板的制造方法、柔性oled面板和显示器
CN201810013178.8 2018-01-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US15/961,412 Continuation US10651406B2 (en) 2018-01-05 2018-04-24 Manufacturing method of flexible OLED panel, flexible OLED display panel, and display

Publications (1)

Publication Number Publication Date
WO2019134196A1 true WO2019134196A1 (zh) 2019-07-11

Family

ID=62643406

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/073841 Ceased WO2019134196A1 (zh) 2018-01-05 2018-01-23 柔性oled面板的制造方法、柔性oled面板和显示器

Country Status (2)

Country Link
CN (1) CN108231855A (zh)
WO (1) WO2019134196A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114527890A (zh) * 2022-02-18 2022-05-24 京东方科技集团股份有限公司 显示面板的制备方法、显示面板及显示装置

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109037469B (zh) 2018-07-09 2020-11-03 上海天马微电子有限公司 一种柔性显示面板和显示装置
CN108962952B (zh) * 2018-07-17 2021-02-26 京东方科技集团股份有限公司 一种显示面板及其制作方法、显示装置
CN110931521B (zh) * 2018-08-29 2022-07-12 京东方科技集团股份有限公司 显示面板及其制造方法、显示装置
CN109671753B (zh) * 2018-12-14 2021-06-01 武汉华星光电半导体显示技术有限公司 显示装置及其制造方法
CN109860208B (zh) * 2019-02-28 2021-09-21 云谷（固安）科技有限公司 显示面板母板、显示面板及其制作方法
CN110048028B (zh) * 2019-03-25 2020-09-08 武汉华星光电半导体显示技术有限公司 显示面板及其制备方法
CN110265569A (zh) * 2019-06-10 2019-09-20 武汉华星光电半导体显示技术有限公司 柔性显示面板及其制造方法
CN110277510B (zh) 2019-06-27 2021-03-23 京东方科技集团股份有限公司 一种显示面板及其制备方法、以及显示装置
CN112216804A (zh) * 2019-07-12 2021-01-12 陕西坤同半导体科技有限公司 一种柔性保护层及具有柔性保护层的有机发光器件
CN110400891B (zh) * 2019-08-30 2022-06-24 武汉天马微电子有限公司 一种显示面板、显示面板的制作方法以及显示装置
CN110767664B (zh) * 2019-10-31 2022-08-26 京东方科技集团股份有限公司 一种显示基板及其制作方法、显示装置
CN111477120B (zh) * 2020-05-21 2022-07-05 京东方科技集团股份有限公司 一种显示母板及其分离方法和制作方法、显示面板
CN115867074A (zh) * 2022-11-23 2023-03-28 京东方科技集团股份有限公司 一种显示基板、其制作方法及显示装置
CN116507176A (zh) * 2023-04-28 2023-07-28 合肥维信诺科技有限公司 显示面板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016204121A1 (ja) * 2015-06-18 2016-12-22 シャープ株式会社 フレキシブル電子デバイス及びフレキシブル電子デバイスの製造方法
CN106486491A (zh) * 2015-08-31 2017-03-08 乐金显示有限公司 背板基板及使用它的柔性显示器
WO2017113256A1 (zh) * 2015-12-30 2017-07-06 深圳市柔宇科技有限公司 柔性显示屏及柔性显示屏制作方法
CN106992263A (zh) * 2017-04-01 2017-07-28 上海天马微电子有限公司 一种柔性显示面板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016204121A1 (ja) * 2015-06-18 2016-12-22 シャープ株式会社 フレキシブル電子デバイス及びフレキシブル電子デバイスの製造方法
CN106486491A (zh) * 2015-08-31 2017-03-08 乐金显示有限公司 背板基板及使用它的柔性显示器
WO2017113256A1 (zh) * 2015-12-30 2017-07-06 深圳市柔宇科技有限公司 柔性显示屏及柔性显示屏制作方法
CN106992263A (zh) * 2017-04-01 2017-07-28 上海天马微电子有限公司 一种柔性显示面板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114527890A (zh) * 2022-02-18 2022-05-24 京东方科技集团股份有限公司 显示面板的制备方法、显示面板及显示装置
CN114527890B (zh) * 2022-02-18 2025-02-11 京东方科技集团股份有限公司 显示面板的制备方法、显示面板及显示装置

Also Published As

Publication number Publication date
CN108231855A (zh) 2018-06-29

Similar Documents

Publication Publication Date Title
WO2019134196A1 (zh) 柔性oled面板的制造方法、柔性oled面板和显示器
KR102632597B1 (ko) 표시 장치 및 이의 제조 방법
US10770669B2 (en) Manufacturing method of flexible OLED panel, flexible OLED display panel, and display
US10665815B2 (en) Naturally discontinuous display mother-substrate and method of manufacturing the same, display substrate and display apparatus
CN109256487B (zh) 一种显示面板
KR101915755B1 (ko) 유기 발광 디스플레이 장치 및 그 제조 방법
KR101971202B1 (ko) 유기 발광 표시 장치 및 그 제조방법
US20210359262A1 (en) Organic light-emitting diode display panel and manufacturing method thereof
WO2020228213A1 (zh) Oled显示面板及其制备方法
KR20210123389A (ko) 디스플레이 패널, 그 제조 방법 및 디스플레이 장치
KR20200025916A (ko) 표시 장치 및 이의 제조 방법
KR101609050B1 (ko) 표시 장치 및 그 제조 방법
US11177448B2 (en) Flexible display device and manufacturing method
JP2016085796A (ja) 有機ｅｌ表示装置
US9373811B2 (en) Organic light-emitting diode (OLED) display panel substrate and method of cutting OLED display panels from the substrate
US20230345798A1 (en) Display substrate, manffacturing method thereof, and display device
JP2009098425A (ja) 液晶表示装置及びその製造方法
WO2022041337A1 (zh) 柔性显示面板
WO2019127760A1 (zh) 柔性显示面板的边缘区结构、柔性显示面板
CN108520884B (zh) 阵列基板及其制备方法、显示装置
WO2019127203A1 (zh) 显示屏及其制作方法，以及显示设备
WO2019114438A1 (zh) 显示基板及其制作方法
US20170054104A1 (en) Display device and method of manufacturing the same
WO2020172946A1 (zh) 显示面板及其制造方法
WO2016145810A1 (zh) Oled基板及制备方法、oled面板及显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18898079

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18898079

Country of ref document: EP

Kind code of ref document: A1