WO2019128811A1 - 大功率电力电子器件性能测试装置以及系统 - Google Patents

大功率电力电子器件性能测试装置以及系统 Download PDF

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WO2019128811A1
WO2019128811A1 PCT/CN2018/122155 CN2018122155W WO2019128811A1 WO 2019128811 A1 WO2019128811 A1 WO 2019128811A1 CN 2018122155 W CN2018122155 W CN 2018122155W WO 2019128811 A1 WO2019128811 A1 WO 2019128811A1
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power
test
electronic device
circuit board
power electronic
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PCT/CN2018/122155
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English (en)
French (fr)
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陈义强
恩云飞
苏萌
黄云
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中国电子产品可靠性与环境试验研究所
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Publication of WO2019128811A1 publication Critical patent/WO2019128811A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Definitions

  • the present invention relates to the field of test equipment, and in particular to a high power power electronic device performance test apparatus and system.
  • HTRB high temperature reverse bias
  • IPM Intelligent Power Module
  • IGBT Insulated Gate Bipolar Transistor
  • MOS metal oxide semiconductor
  • an embodiment of the present invention provides a high power power electronic device performance testing device, including an industrial computer and various test modules connected to the industrial computer;
  • the test module includes a control circuit board, a heater, and a temperature control a temperature detector and a detection circuit board for connecting high-power power electronic devices;
  • the industrial computer is connected to the detection circuit board, and is respectively connected to the heater and the temperature measuring temperature controller through the control circuit board;
  • the industrial computer transmits a preset temperature value to the temperature measuring temperature controller through the control circuit board; the temperature measuring temperature controller sends a feedback instruction to the control circuit board when the measured test environment temperature reaches the preset temperature value; the control circuit board is based on the feedback The command controls the heater to maintain the test environment temperature at a preset temperature value; the detection circuit board transmits the to-be-tested performance data of the collected high-power power electronic device at the test environment temperature to the industrial computer.
  • a box body corresponding to each test module is further included;
  • the test module is disposed in an area enclosed by the casing.
  • test module further includes a superconducting thermostat disposed in an area enclosed by the casing;
  • Superconducting thermostats are used to isolate heaters and temperature controllers from the test environment.
  • test module further includes a constant temperature platform disposed on the outer wall of the superconducting thermostat;
  • the constant temperature platform is used to carry the detection circuit board.
  • the air control device connected to the industrial computer is further included; the air inlet hole and the air outlet hole are further disposed on the side wall of the casing;
  • the air outlet pipe of the gas control device is disposed in the air inlet hole, and the air outlet pipe is used for connecting the gas supply device and the box body;
  • the intake pipe of the gas control device is disposed in the air outlet, and the air inlet pipe is used for connecting the air supply device and the box body.
  • the test module further includes a power distribution board disposed on the inner wall of the casing of the casing, and a programmable power source;
  • the program-controlled power supply is respectively connected to the control circuit board, the heater, the temperature measuring temperature controller and the detecting circuit board, and is connected to the industrial computer through the power distribution board.
  • the industrial computer is a touch industrial computer.
  • the cabinet is further included; the industrial computer and the detection module are disposed in the cabinet.
  • an embodiment of the present invention further provides a high power power electronic device performance testing system, including a terminal device connected to the high power power electronic device performance testing device as described above.
  • the terminal device selects a parameter input setting button, a test start button, a test interrupt button, and a test stop button displayed on the display interface to obtain a corresponding instruction, and the instruction is used to indicate that the high-power power electronic device performance test device performs the corresponding Actions.
  • the embodiment of the high-power power electronic device performance testing device of the present invention may include an industrial computer and each test module; each test module is controlled by the industrial computer, and each test module can simultaneously test the performance of the high-power power electronic device in different test environments.
  • a test module can simultaneously test the performance of multiple high-power power electronic devices in the same test environment, and then calculate the average performance of the device under a certain test environment, wherein the control circuit board is used to control the heater and the temperature measuring temperature controller
  • the detection circuit board is used for detecting the performance of the high-power power electronic device, and collecting the performance data for transmission to the industrial computer.
  • the high-power power electronic device performance testing device of the invention can accurately determine the high-temperature grid bias and high-temperature reverse bias performance of the IPM and the IGBT module. It provides a special intelligent test equipment for the factory quality of the industrial control and control intelligent power module, which strongly supports the development and production of IPM and IGBT modules.
  • Embodiment 1 is a schematic diagram showing the circuit structure of Embodiment 1 of a performance testing device for a high-power power electronic device according to the present invention
  • FIG. 2 is a schematic diagram showing the arrangement of each device in one embodiment of a test module in a performance test device for a high-power power electronic device according to the present invention
  • FIG. 3 is a schematic structural diagram of a test module in a performance testing device for a high-power power electronic device according to the present invention
  • FIG. 4 is a schematic diagram showing the arrangement of each device in one embodiment of a superconducting thermostat in a high power power electronic device performance testing device according to the present invention
  • FIG. 5 is a schematic diagram showing a connection structure between a gas control device and a test module in a performance test device for a high-power power electronic device according to the present invention
  • FIG. 6 is a schematic structural diagram of a circuit of a high-power power electronic device performance testing device according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural view of a cabinet in a performance testing device for a high-power power electronic device according to the present invention.
  • FIG. 8 is a schematic diagram showing the circuit structure of Embodiment 1 of the high-power power electronic device performance test system of the present invention.
  • connection when an element is referred to as “connecting” another element, it can be directly connected to the other element and integrated, or a central element may be present at the same time.
  • the terms “set to”, “connected”, “bearing” and the like are used herein for the purpose of illustration.
  • the high-power power electronic device performance testing device of the present invention provides a high-power power electronic device performance testing device embodiment 1, and FIG. 1 is a high-power power electronic device of the present invention.
  • the circuit structure diagram of the device performance testing device embodiment 1, as shown in FIG. 1 includes the industrial computer 110 and the test modules connected to the industrial computer 110;
  • the test module 120 includes a control circuit board 121, a heater 123, a temperature measuring temperature controller 125, and a detection circuit board 129 connecting the high-power power electronic device 127;
  • the industrial computer 110 is connected to the detection circuit board 129, and is connected to the heater 123 and the temperature measuring temperature controller 125 through the control circuit board 121;
  • the industrial computer 110 transmits a preset temperature value to the temperature measuring temperature controller 125 through the control circuit board 121; the temperature measuring temperature controller 125 sends a feedback instruction to the control circuit board 121 when the measured test environment temperature reaches the preset temperature value;
  • the control circuit board 121 controls the heater 123 based on the feedback instruction to maintain the test environment temperature at a preset temperature value;
  • the detection circuit board 129 transmits the collected performance data of the collected high-power power electronic device at the test environment temperature to the industrial control Machine 110.
  • the tester inputs a preset temperature value through the industrial computer, wherein the preset temperature value is set according to the requirement of testing the performance of the high-power power electronic device, for example, when it is required to test the performance of the high-power power electronic device at 80 ° C.
  • the industrial computer transmits the preset temperature value to the temperature measuring temperature controller through the control circuit board, and the control circuit board controls the heater heating, when the temperature measuring temperature controller measures the large
  • the temperature measuring temperature controller sends feedback to the control circuit board to control the circuit board to control the heater to change the heating mode (for example, the heater can be intermittently heated)
  • the heating mode for example, the heater can be intermittently heated
  • the industrial computer is a touch industrial computer.
  • the detection circuit board is configured to collect performance data of the high-power power electronic device at a preset temperature value, wherein the high-power power electronic device can be plugged to the detection circuit board through the pins thereon, in various embodiments of the present invention
  • the performance data may be a temperature parameter, a voltage parameter, a current parameter, and a leakage current parameter of the high-power power electronic device.
  • the detection current of the detection circuit board is: 100 nA (nano) to 50 mA (milliampere).
  • the detection circuit board can meet all the requirements for high-power power electronic device performance detection, and also meet the high-precision requirements of the test, so that the high-power power electronic device performance test device of the present invention can accurately test Performance of high power power electronics under characteristic conditions.
  • the high-power power electronic device is an IPM, IGBT module, and there may be multiple stations in the test circuit board (station is a basic unit for testing the performance of high-power power electronic devices), that is, a test module. It can simultaneously test the performance of multiple high-power power electronic devices in the same test environment. According to statistics, the average performance of high-power power electronic devices in a test environment can be used. For example, 16 stations can be used, that is, one test module. The performance of 16 high-power power electronic devices can be tested simultaneously, and then the average performance of high-power power electronic devices is counted. Further, the high-power power electronic device performance test device of the present invention has multiple test modules, and the industrial computer controls each test module.
  • test modules can be set to different test environments (which can be different test temperatures), so that the high-power power electronic device performance test device of the present invention can simultaneously test high-power power electronic devices in different test environments. Performance, so as to fully grasp the performance of high-power power electronic devices, minus Test cycles, greatly improve the efficiency of the test.
  • the embodiments of the high-power power electronic device performance testing device of the present invention can be used to test the high-temperature gate bias and high-temperature reverse bias performance of IPM and IGBT modules.
  • Embodiments of the high-power power electronic device performance testing device of the present invention the industrial computer and each test module constitute the performance testing device for the high-power power electronic device of the present invention, and each test module is controlled by the industrial computer, wherein the control circuit board is used for controlling heating And temperature measuring temperature controller, detecting circuit board is used for detecting the performance of the intelligent power module, and collecting performance data is transmitted to the industrial computer, and the high-power power electronic device performance testing device of the invention can accurately detect the high temperature of the IPM and IGBT modules.
  • FIG. 2 is a schematic diagram of device setup of a test module in a performance test apparatus for a high-power power electronic device according to an embodiment of the present invention.
  • the test module includes a test module.
  • a corresponding box, the test module is disposed in an area enclosed by the box body.
  • FIG. 3 is a schematic structural diagram of a test module in a performance testing device for a high-power power electronic device according to the present invention.
  • the high-power power electronic device performance testing device of the present invention includes a plurality of test modules, each of which is tested. All the electronic components of the module (including the control circuit board, the heater, the temperature measuring temperature controller, the test circuit board, etc.) are disposed in the respective casings, and the middle casing of the present invention has a lid, which can be closed during the test.
  • the lid provides a closed test space for testing the performance of high-power power electronics, and the heat dissipated by the heater is not easily diffused, so that the high-power power electronics test environment can be kept at a constant temperature of a preset temperature value.
  • the box body provides a good loading carrier for the test module, so that the high-power power electronic device performance testing device of the present invention can be better managed, and the test environment is more easily maintained.
  • the constant temperature provides a better test environment for testing high-power power electronic devices, and improves the accuracy of the test of the high-power power electronic device performance test device of the present invention.
  • FIG. 4 is a schematic diagram of each device in a high-power power electronic device performance testing device according to the present invention.
  • the test module further includes a box.
  • the superconducting thermostat is enclosed in the area, and the superconducting thermostat is used to isolate the heater and the temperature controller from the test environment.
  • test module further includes a constant temperature platform disposed on the outer wall of the superconducting thermostat;
  • the constant temperature platform is used to carry the detection circuit board.
  • the superconducting thermostat is a box made of a superconducting material, and the heater and the temperature measuring thermostat are disposed inside the superconducting thermostat, and the superconducting material has a particularly high temperature guiding property, and can be quickly
  • the heat is conducted to the surrounding environment, wherein, in various embodiments of the present invention, the superconducting thermostat is designed to have a temperature range of normal temperature + 5 degrees to 300 degrees, and the accuracy is: deviation ⁇ 1 degree, and further, in the superconducting thermostat On the outer wall (that is, when the invention is used for horizontally placing the box for loading the test module, the thermostatic platform is on the upper wall of the superconducting thermostat), a constant temperature platform is provided, and the constant temperature platform is used to carry the test circuit board through the constant temperature platform. Transfer heat to the test board.
  • the heater and the temperature measuring temperature controller are placed in the inner superconducting thermostat to form a heating device, which can better control the temperature of the test environment of the high-power power electronic device.
  • the high power power electronic device performance test device of the present invention provides a more reliable test environment for testing high power power electronic devices.
  • FIG. 5 is a schematic diagram of a connection structure between a gas control device and a test module in a performance test device for a high-power power electronic device according to the present invention, as shown in FIG. 5, further including a gas control device connected to the industrial computer; An air inlet hole and an air outlet hole are further defined in the sidewall of the body;
  • the air outlet pipe of the gas control device is disposed in the air inlet hole, and the air outlet pipe is used for connecting the gas supply device and the box body;
  • the intake pipe of the gas control device is disposed in the air outlet, and the air inlet pipe is used for connecting the air supply device and the box body.
  • high-temperature power electronic devices are subjected to high-temperature tests in an air atmosphere, and the pins of the high-power power electronic devices or the unpackaged dies are easily oxidized, and may be formed by ionizing the air due to the ultra-high pressure.
  • each test module box The inside of the body is filled with an inert gas, and the inside of the box is filled with an inert gas, for example, N 2 (nitrogen), Ar (argon), through a gas control device controlled by the industrial computer, wherein the gas outlet of the gas control device is inserted through In the air inlet hole, the air outlet pipe is used for connecting the air supply device and the box body, and the air intake pipe of the gas control device is disposed in the air outlet hole, and the air inlet pipe is used for connecting the air supply device and the box body.
  • an inert gas for example, N 2 (nitrogen), Ar (argon
  • inert gas is charged into the casing of each test module by the gas control device to prevent the device pins or unpackaged dies of the high-power power electronic device from being in a high-temperature environment. Oxidation also prevents the arc formed by the ionization of the air at the time of the ultra-high pressure, and the inert gas is filled in the casing to ensure the accuracy of the test of the high-power power electronic device performance test device of the present invention, and to evaluate the performance of the high-power power electronic device more reliably.
  • FIG. 6 is a schematic structural diagram of a circuit of a high-power power electronic device performance testing device according to an embodiment of the present invention.
  • the test module further includes an inner wall of the casing disposed on the casing.
  • the program-controlled power supply is respectively connected to the control circuit board, the heater, the temperature measuring temperature controller and the detecting circuit board, and is connected to the industrial computer through the power distribution board.
  • the performance test of the high-power power electronic device needs to be subject to In a strictly controlled environment, power control and distribution is an important part of it. Good power control ensures that the test environment is kept constant and the performance data of high-power power electronics is accurately collected.
  • FIG. 7 is a schematic structural diagram of a cabinet in a performance testing device for a high-power power electronic device according to the present invention.
  • the cabinet further includes a cabinet; the industrial computer and the detecting module are disposed in the cabinet.
  • the industrial computer and each detection module are installed in the cabinet body, and the bottom of the cabinet body is provided with a roller to facilitate moving the entire cabinet.
  • the high-power power electronic device performance test system of the present invention also provides a high-power power electronic device performance test system embodiment 1, and FIG. 8 is a circuit structure diagram of the first embodiment of the high-power power electronic device performance test system of the present invention, as shown in FIG. As shown, a terminal device that connects the high-power power electronic device performance testing device described in the various embodiments of the high-power power electronic device performance testing device of the present invention may be included.
  • the high-power power electronic device performance testing device of the present invention is connected to the terminal device through a network, and the process of testing the performance of the high-power power electronic device through the terminal device is beneficial to improve the testing efficiency, for example, in the following three tests.
  • the high-power power electronics of the present invention can be controlled by the terminal device (smart mobile terminal) The device performance test device is tested; (3) If the scientific researcher has a new scientific research idea or test plan during the business trip or meeting, the high-power power electronic device performance test device of the present invention can be controlled by the terminal device to the scientific research idea or the test plan. Carry out inspection.
  • the terminal device may be a smart phone, a computer, a tablet computer, etc.
  • the terminal device is directly connected to the industrial computer in the high-power power electronic device performance testing device of the present invention through the network, and the test parameters are input to the industrial computer through the terminal device, and then
  • the industrial computer independently controls the performance test of the high-power power electronic device performance test device of the present invention on the high-power power electronic device, and the terminal device can also control the start test, stop test, and interrupt test of the high-power power electronic device performance test device of the present invention.
  • the high-power power electronic device performance testing device of the present invention is controlled by the terminal device, and the tester is liberated, and the tester is no longer needed to stay at the device and improve the tester's time. Utilization rate, the tester can do other work during the test, and the tester can control the high-power power electronic device performance test device of the present invention through the terminal device no matter where it is, and greatly improve the test efficiency.
  • the terminal device selects a parameter input setting button, a test start button, a test interrupt button, and a test stop button displayed on the display interface to obtain a corresponding instruction, and the instruction is used to indicate that the high-power power electronic device performance test device is executed. The corresponding action.
  • the tester can view the test data through the terminal device, and control the high-power power electronic device performance test device of the present invention through the terminal device, and the UI interface of the control program of the terminal device includes a parameter input setting button, a test start button, and a test start.
  • the button and the test start button can realize the corresponding operation through each button.
  • the terminal device of the present invention can be connected to the high-power power electronic device performance testing device of the present invention through a network, so that the tester can freely control the high-power power electronic device performance testing device of the present invention by using the terminal device of the present invention, thereby improving the testing efficiency.

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  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

一种大功率电力电子器件性能测试装置以及系统，其中，大功率电力电子器件性能测试装置包括：工控机（110）以及连接工控机（110）的各测试模块（120）；测试模块（120）包括控制电路板（121）、加热器（123）、测温控温器（125）以及连接大功率电力电子器件（127）的检测电路板（129）；工控机（110）连接检测电路板（129），通过控制电路板（121）分别连接加热器（123）、测温控温器（125）；检测电路板（129）用于采集大功率电力电子器件（127）在测试环境下的待测试性能数据，并将待测试性能数据传输给工控机（110），该装置能够准确地测试IPM、IGBT模块的高温栅偏和高温反偏性能，为工业制造上管控IPM、IGBT模块的出厂品质提供了一种专用的测试设备，从而支持IPM、IGBT模块的研发和生产。

Description

大功率电力电子器件性能测试装置以及系统 技术领域
本发明涉及测试设备技术领域，特别是涉及大功率电力电子器件性能测试装置以及系统。
背景技术
HTRB(high temperature reverse bias，反偏高温寿命试验)是测试半导体器件性能的一个最基本项目，IPM(Intelligent Power Module，智能功率模块)、IGBT(绝缘栅双极型晶体管，Insulated Gate Bipolar Transistor)作为新进发展的新型大功率电力电子器件，广泛应用于空调、电机、新能源汽车等领域，相对传统半导体器件，例如，二极管、三极管、MOS(metal oxide semiconductor，金属氧化物半导体)管而言其可靠性控制仍然处于探索中，目前，在IPM、IGBT模块工业化生产过程中，为了在生产过程中管控产品的缺陷，常见的做法就是借鉴科学研究的做法，对IPM、IGBT模块进行HTRB测试，从而将品质控制前移，对出厂的器件模块的品质、缺陷等有更加清晰认识和对策，使器件模块的可靠性得到有效地管控。
但是，在实现过程中，发明人发现传统技术中至少存在如下问题：目前大多数厂家仍然采用对传统半导体器件(二极管、三极管、MOS管等)进行人为的筛选试验、例行试验来管控IPM、IGBT模块的出厂品质，当前缺乏专门用于对IPM、IGBT模块进行可靠性试验的智能化测试设备。
发明内容
基于此，有必要针对传统技术无法智能化检测IPM、IGBT模块性能的问题，提供一种大功率电力电子器件性能测试装置以及系统。
为了实现上述目的，一方面，本发明实施例提供了一种大功率电力电子器件性能测试装置，包括工控机以及连接工控机的各测试模块；测试模块包括控制电路板、加热器、测温控温器以及连接大功率电力电子器件的检测电路板；
工控机连接检测电路板，并通过控制电路板分别连接加热器、测温控温器；
工控机通过控制电路板向测温控温器传输预设温度值；测温控温器在测得的测试环境温度达到预设温度值时，向控制电路板发送反馈指令；控制电路板基于反馈指令控制加热器、将测试环境温度维持在预设温度值；检测电路板将采集到的大功率电力电子器件在测试环境温度下的待测试性能数据、传输给工控机。
在其中一个实施例中，还包括分别与各测试模块一一对应的盒体；
测试模块设置于盒体围成的区域内。
在其中一个实施例中，测试模块还包括设置于盒体围成的区域内的超导恒温胆；
超导恒温胆用于将加热器、测温控温器隔离于测试环境。
在其中一个实施例中，测试模块还包括设置于超导恒温胆的外壁上的恒温平台；
恒温平台用于承载检测电路板。
在其中一个实施例中，还包括连接工控机的控气设备；盒体的侧壁上还开设有进气孔以及出气孔；
控气设备的出气管穿设于进气孔内，出气管用于连通供气设备与盒体；
控气设备的进气管穿设于出气孔内，进气管用于连通供气设备与盒体。
在其中一个实施例中，测试模块还包括设置于盒体的盒腔内壁上的电源分配板、程控电源；
程控电源分别连接控制电路板、加热器、测温控温器以及检测电路板，通过电源分配板连接工控机。
在其中一个实施例中，工控机为触摸式工控机。
在其中一个实施例中，还包括柜体；工控机和检测模块均设置于柜体内。
另一方面，本发明实施例还提供了一种大功率电力电子器件性能测试系统，包括连接如上所述的大功率电力电子器件性能测试装置的终端设备。
在其中一个实施例中，终端设备选取显示界面展示的参数输入设置按键、试验启动按键、试验中断按键、试验停止按键来获取相应的指令，指令用于指示大功率电力电子器件性能测试装置执行相应的动作。
上述技术方案中的一个技术方案具有如下优点和有益效果：
本发明大功率电力电子器件性能测试装置实施例可以包括工控机和各测试模块；各测试模块受控于工控机，各测试模块可同时测试大功率电力电子器件在不同的测试环境下的性能，一个测试模块可同时测试多个大功率电力电子器件在同一测试环境下的性能，然后统计出器件在某个测试环境下平均性能，其中，控制电路板用于控制加热器和测温控温器，检测电路板用于检测大功率电力电子器件的性能，并收集性能数据传输给工控机，本发明大功率电力电子器件性能测试装置能够准确的IPM、IGBT模块的高温栅偏和高温反偏性能，为工业制造上管控智能功率模块的出厂品质提供了一种专用的智能化测试设备，有力的支持IPM、IGBT模块的研发和生产。
附图说明
图1为本发明大功率电力电子器件性能测试装置实施例1的电路结构示意图；
图2为本发明大功率电力电子器件性能测试装置中的测试模块在一个实施例中各器件设置示意图；
图3为本发明大功率电力电子器件性能测试装置中的测试模块的结构示意图；
图4为本发明大功率电力电子器件性能测试装置中的超导恒温胆在一个实施例中各器件设置示意图；
图5为本发明大功率电力电子器件性能测试装置中的控气设备与测试模块连接结构示意图；
图6为本发明大功率电力电子器件性能测试装置在一个实施例中的电路结构示意图；
图7为本发明大功率电力电子器件性能测试装置中柜体的结构示意图；
图8本发明大功率电力电子器件性能测试系统实施例1的电路结构示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的首选实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容更加透彻全面。
需要说明的是，当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件并与之结合为一体，或者可能同时存在居中元件。本文所使用的术语“设置于”、“连通”、“承载”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
为了解决传统技术无法自动化检测IPM、IGBT模块性能的问题，本发明大功率电力电子器件性能测试装置提供了一种大功率电力电子器件性能测试装置实施例1，图1为本发明大功率电力电子器件性能测试装置实施例1的电路结构示意图，如图1所示，包括工控机110以及连接工控机110的各测试模块；
测试模块120包括控制电路板121、加热器123、测温控温器125以及连接大功率电力电子器件127的检测电路板129；
工控机110连接检测电路板129，通过控制电路板121分别连接加热器123、测温控温器125；
工控机110通过控制电路板121向测温控温器125传输预设温度值；测温控温器125在测得的测试环境温度达到预设温度值时，向控制电路板121发送反馈指令；控制电路板121基于反馈指令控制加热器123、将测试环境温度维持在预设温度值；检测电路板129将采集到的大功率电力电子器件在测试环境温度下的待测试性能数据、传输给工控机110。
具体而言，测试人员通过工控机输入预设温度值，其中预设温度值根据测试大功率电力电子器件性能的需要而设定，例如，当需要测试大功率电力电子器件在80℃下的性能时，即将预设温度值设定为80℃，工控机将预设温度值通过控制电路板传输给测温控温器，控制电路板控制加热器加热，当测温控温器 测得的大功率电力电子器件的测试环境的温度值达到预设温度值时，测温控温器向控制电路板发出反馈，以控制电路板控制加热器改变加热方式(例如，加热器可以通过间断式加热方式来维持环境温度为恒温)，从而保证大功率电力电子器件的测试环境保持在预设温度值的恒温下，使得能够测试大功率电力电子器件在预设温度值下的性能，其中，为了更简便的操作，优选的，工控机为触摸式工控机。
检测电路板用于采集大功率电力电子器件在预设温度值下的性能数据，其中，大功率电力电子器件可通过其上的引脚插接到检测电路板上，在本发明的各实施例中，性能数据可以为大功率电力电子器件的温度参数、电压参数、电流参数、漏电流参数，进一步的，检测电路板的漏电流检测范围为：100nA(纳安)～50mA(毫安)，精度：2％±2LSB(最低有效位)；电流检测分辨率为：100nA；电压检测范围为：0V(伏)～2000V，精度：2％±2LSB电压检测分辨率：0.3V(检测电压≤100V)，0.5V(检测电压≤2000V)，检测电路板能够满足对大功率电力电子器件性能检测的所有要求，也满足测试的高精度要求，使得本发明大功率电力电子器件性能测试装置能够精确测试大功率电力电子器件在特征条件下的性能。
需要说明的是，大功率电力电子器件为IPM、IGBT模块，在测试电路板可以有多个工位(工位是指用来测试大功率电力电子器件性能的一个基本单元)，即一个测试模块可以同时测试多个大功率电力电子器件在同一测试环境下的性能，根据统计学，统计大功率电力电子器件在一个测试环境下的平均性能，例如，可以用16个工位，即一个测试模块可同时测试16个大功率电力电子器件的性能，然后统计出大功率电力电子器件的平均性能，进一步的，本发明大功率电力电子器件性能测试装置具备多个测试模块，工控机控制各个测试模块，各个测试模块相互之间可被设定为不同测试环境(可以为不同的测试温度)，使得本发明大功率电力电子器件性能测试装置能够同时测试大功率电力电子器件在不同的测试环境下的性能，从而充分掌握大功率电力电子器件的性能，减少测试的周期，大大提高测试的效率。
本发明大功率电力电子器件性能测试装置各实施例可以用来测试IPM、 IGBT模块的高温栅偏和高温反偏性能。
本发明大功率电力电子器件性能测试装置各实施例，工控机和各测试模块构成本发明大功率电力电子器件性能测试装置，各测试模块受控于工控机，其中，控制电路板用于控制加热器和测温控温器，检测电路板用于检测智能功率模块的性能，并收集性能数据传输给工控机，本发明大功率电力电子器件性能测试装置能够准确的IPM、IGBT模块的高温栅偏和高温反偏性能，为工业制造上管控智能功率模块的出厂品质提供了一种专用的智能化测试设备，有力的支持IPM、IGBT模块的研发和生产，为实现自动化、智能化测试IPM、IGBT模块的性能，减少人工的投入，提高了测试的效率。
在一个具体的实施例中，图2为本发明大功率电力电子器件性能测试装置中的测试模块在一个实施例中的各器件设置示意图，如图2所示，还包括分别与各测试模块一一对应的盒体，测试模块设置于盒体围成的区域内。
具体而言，图3为本发明大功率电力电子器件性能测试装置中的测试模块的结构示意图，如图3所示，本发明大功率电力电子器件性能测试装置包括多个测试模块，每个测试模块所有的电子器件(包括控制电路板、加热器、测温控温器、测试电路板等)都设置于各自的盒体内，本发明的中盒体带有盒盖，在测试时可以合上盒盖为测试大功率电力电子器件的性能提供封闭的测试空间，且加热器散发的热量不容易扩散，使得大功率电力电子器件测试环境能保持在预设温度值的恒温下。
本发明大功率电力电子器件性能测试装置各实施例，盒体为测试模块提供了很好的装载载体，使得能更好的管理本发明大功率电力电子器件性能测试装置，也更容易保持测试环境恒温，为测试大功率电力电子器件提供更良好的测试环境，提高了本发明大功率电力电子器件性能测试装置测试的精确度。
在一个具体的实施例中，图4为本发明大功率电力电子器件性能测试装置中的超导恒温胆在一个实施例中各器件设置示意图，如图4所示，测试模块还包括设置于盒体围成区域内的超导恒温胆，超导恒温胆用于将加热器、测温控温器隔离于测试环境。
进一步的，如图4所示，测试模块还包括设置于超导恒温胆的外壁上的恒 温平台；
恒温平台用于承载检测电路板。
具体而言，超导恒温胆是采用超导材料制成的盒体，将加热器和测温控温器设置于超导恒温胆内部，由于超导材料的导温性能特别强，能很快将热量传导到周围环境，其中，在本发明各实施例中，超导恒温胆设计成温度范围为常温+5度～300度，精度为：偏差±1度，进一步的，在超导恒温胆的外壁上(也就将本发明用于装载测试模块的盒体水平放置时，恒温平台在超导恒温胆的上壁)，设置有恒温平台，恒温平台用于承载测试电路板，通过恒温平台将热量传导给测试电路板。
本发明大功率电力电子器件性能测试装置各实施例，将加热器和测温控温器放置于内超导恒温胆，构成一个加热装置，能够更好控制大功率电力电子器件测试环境的温度，使得本发明大功率电力电子器件性能测试装置为测试大功率电力电子器件提供一个更可靠的测试环境。
在一个具体的实施例中，图5为本发明大功率电力电子器件性能测试装置中的控气设备与测试模块连接结构示意图，如图5所示，还包括连接工控机的控气设备；盒体的侧壁上还开设有进气孔以及出气孔；
控气设备的出气管穿设于进气孔内，出气管用于连通供气设备与盒体；
控气设备的进气管穿设于出气孔内，进气管用于连通供气设备与盒体。
具体而言，在空气气氛中，对大功率电力电子器件进行高温测试，大功率电力电子器件的管脚或未封装的管芯很容易出现氧化，且可能出现因超高压使空气电离而形成的电弧，如果器件的管脚或未封装的管芯被氧化或出现电弧会影响测试的结果，降低本发明大功率电力电子器件性能测试装置的测试精度，为了避免上述情况，给各个测试模块的盒体内充入惰性气体，通过受控于工控机的控气设备，给盒体内充入惰性气体，例如，N 2(氮气)、Ar(氩气)，其中，控气设备的出气管穿设于进气孔内，出气管用于连通供气设备与盒体，控气设备的进气管穿设于出气孔内，进气管用于连通供气设备与盒体。
本发明大功率电力电子器件性能测试装置各实施例，通过控气设备向各测试模块的盒体内充入惰性气体，防止大功率电力电子器件在高温环境中器件管 脚或者未封装的管芯被氧化，也防止超高压时空气被电离形成的电弧，盒体内充入惰性气体有利于确保本发明大功率电力电子器件性能测试装置测试的精度，更可靠低评估大功率电力电子器件的性能。
在一个具体的实施例中，图6为本发明大功率电力电子器件性能测试装置在一个实施例中的电路结构示意图，如图6所示，测试模块还包括设置于盒体的盒腔内壁上的电源分配板、程控电源；
程控电源分别连接控制电路板、加热器、测温控温器以及检测电路板，通过电源分配板连接工控机。
具体而言，为了更好的管控本发明大功率电力电子器件性能测试装置的电源以及为本发明大功率电力电子器件性能测试装置各个器件分配电源，大功率电力电子器件的性能测试需在一个受严格控制的环境进行，电源的管控和分配是其中很重要的一环，良好的电源管控能够确保维持测试环境恒温，准确地采集大功率电力电子器件的性能数据。
在一个具体的实施例中，图7为本发明大功率电力电子器件性能测试装置中柜体的结构示意图，如图7所示，还包括柜体；工控机和检测模块均设置于柜体内。
具体而言，为了管控本发明大功率电力电子器件性能测试装置，将工控机和各检测模块安装在柜体内，柜体底部带有滚轮的，方便搬移整个柜体。
本发明大功率电力电子器件性能测试系统还提供了一种大功率电力电子器件性能测试系统实施例1，图8本发明大功率电力电子器件性能测试系统实施例1的电路结构示意图，如图8所示，可以包括连接本发明大功率电力电子器件性能测试装置各实施例中所述的大功率电力电子器件性能测试装置的终端设备。
具体而言，本发明大功率电力电子器件性能测试装置通过网络与终端设备连接，通过终端设备来控制对大功率电力电子器件进行性能测试的进程，有利于提高测试效率，例如在以下三个测试场景中：(1)测试人员如果需要开展的测试周期比较长的测试项目，例如样品的可靠性试验时间短则几天，长则半年或更多时间，就可通终端设备定时去查看测试结果，将测试人员从测试中解放出来，提高测试人员时间的利用率；(2)如果测试人员不在实验室(出差或外出开 会)，可通过终端设备(智能移动终端)控制本发明大功率电力电子器件性能测试装置进行测试；(3)如果科研人员在出差或开会中，有新的科研思路或试验方案，立即可通过终端设备控制本发明大功率电力电子器件性能测试装置对科研思路或试验方案进行检验。
需要说明的是，终端设备可以为智能手机、电脑、平板电脑等，终端设备直接通过网络与本发明大功率电力电子器件性能测试装置中工控机连接，通过终端设备向工控机输入测试参数，然后工控机自主地控制本发明大功率电力电子器件性能测试装置对大功率电力电子器件进行的性能测试，终端设备也可控制本发明大功率电力电子器件性能测试装置启动测试、停止测试、中断测试。
本发明大功率电力电子器件性能测试系统各实施例，通过终端设备控制本发明大功率电力电子器件性能测试装置，解放了测试人员，不再需要测试人员时时呆在装置旁，提高测试人员时间的利用率，测试期间测试人员可干其他工作，且测试人员无论在什么地点，都可通过终端设备控制本发明大功率电力电子器件性能测试装置开展测试，大大地提高了测试效率。
在一个具体的实施例中，终端设备选取显示界面展示的参数输入设置按键、试验启动按键、试验中断按键、试验停止按键来获取相应的指令，指令用于指示大功率电力电子器件性能测试装置执行相应的动作。
具体而言，测试人员可通过终端设备查看测试数据，并通过终端设备控制本发明大功率电力电子器件性能测试装置，终端设备的控制程序的UI界面包括参数输入设置按键、试验启动按键、试验启动按键、试验启动按键，通过各按键可实现对应的操作。
本发明终端设备能够通过网络与本发明大功率电力电子器件性能测试装置连接，使得测试人员能够利用本发明中终端设备自如地控制本发明中大功率电力电子器件性能测试装置，提高了测试效率。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细， 但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种大功率电力电子器件性能测试装置，其特征在于，包括工控机以及连接所述工控机的各测试模块；所述测试模块包括控制电路板、加热器、测温控温器以及连接大功率电力电子器件的检测电路板；
    所述工控机连接所述检测电路板，并通过所述控制电路板分别连接所述加热器、所述测温控温器；
    所述工控机通过所述控制电路板向所述测温控温器传输预设温度值；所述测温控温器在测得的测试环境温度达到所述预设温度值时，向所述控制电路板发送反馈指令；所述控制电路板基于所述反馈指令控制所述加热器、将所述测试环境温度维持在所述预设温度值；所述检测电路板将采集到的大功率电力电子器件在所述测试环境温度下的待测试性能数据、传输给所述工控机。
  2. 根据权利要求1所述的大功率电力电子器件性能测试装置，其特征在于，还包括分别与各所述测试模块一一对应的盒体；
    所述测试模块设置于所述盒体围成的区域内。
  3. 根据权利要求2所述的大功率电力电子器件性能测试装置，其特征在于，所述测试模块还包括设置于所述盒体围成的区域内的超导恒温胆；
    所述超导恒温胆用于将所述加热器、所述测温控温器隔离于所述测试环境。
  4. 根据权利要求3所述的大功率电力电子器件性能测试装置，其特征在于，所述测试模块还包括设置于所述超导恒温胆的外壁上的恒温平台；
    所述恒温平台用于承载所述检测电路板。
  5. 根据权利要求2至4任意一项所述的大功率电力电子器件性能测试装置，其特征在于，还包括连接所述工控机的控气设备；所述盒体的侧壁上还开设有进气孔以及出气孔；
    所述控气设备的出气管穿设于所述进气孔内，所述出气管用于连通所述供气设备与所述盒体；
    所述控气设备的进气管穿设于所述出气孔内，所述进气管用于连通所述供气设备与所述盒体。
  6. 根据权利要求5所述的大功率电力电子器件性能测试装置，其特征在于，所述测试模块还包括设置于所述盒体的盒腔内壁上的电源分配板、程控电源；
    所述程控电源分别连接所述控制电路板、所述加热器、所述测温控温器以及所述检测电路板，通过所述电源分配板连接所述工控机。
  7. 根据权利要求6所述的大功率电力电子器件性能测试装置，其特征在于，所述工控机为触摸式工控机。
  8. 根据权利要求6所述的大功率电力电子器件性能测试装置，其特征在于，还包括柜体；所述工控机和所述检测模块均设置于所述柜体内。
  9. 一种大功率电力电子器件性能测试系统，其特征在于，包括连接权利要求1至8任意一项所述的大功率电力电子器件性能测试装置的终端设备。
  10. 根据权利要求9所述的大功率电力电子器件性能测试系统，其特征在于，
    所述终端设备选取显示界面展示的参数输入设置按键、试验启动按键、试验中断按键、试验停止按键来获取相应的指令，所述指令用于指示所述大功率电力电子器件性能测试装置执行相应的动作。
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