WO2019117178A1 - 3価クロムメッキ液およびこれを用いたクロムメッキ方法 - Google Patents
3価クロムメッキ液およびこれを用いたクロムメッキ方法 Download PDFInfo
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- WO2019117178A1 WO2019117178A1 PCT/JP2018/045593 JP2018045593W WO2019117178A1 WO 2019117178 A1 WO2019117178 A1 WO 2019117178A1 JP 2018045593 W JP2018045593 W JP 2018045593W WO 2019117178 A1 WO2019117178 A1 WO 2019117178A1
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- plating solution
- trivalent chromium
- chromium plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/10—Electroplating: Baths therefor from solutions of chromium characterised by the organic bath constituents used
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
- C25D3/06—Electroplating: Baths therefor from solutions of chromium from solutions of trivalent chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
- C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
Definitions
- the present invention relates to a trivalent chromium plating solution and a chromium plating method using the same.
- Chrome plating is used as a coating film for decoration because it has a silver-white appearance.
- hexavalent chromium was used for this chromium plating, since this hexavalent chromium affects the environment in recent years, its use has been limited, and the technology has shifted to the technique using trivalent chromium. ing.
- this trivalent chromium plating solution has a slow deposition rate and is not practical.
- An object of the present invention is to provide a practical trivalent chromium plating solution having a high deposition rate of plating.
- the present inventors have used carboxylic acids having two or more hydroxy groups and two or more carboxy groups or salts thereof as complexing agents for trivalent chromium ions.
- the trivalent chromium plating solution has a high plating deposition rate and becomes practical by using saccharin or a salt thereof and a compound having an allyl group in combination as a sulfur-containing organic compound. , Completed the present invention.
- the present invention is a trivalent chromium plating solution containing a trivalent chromium compound, a complexing agent, potassium sulfate and ammonium sulfate as a conductive salt, a pH buffer, and a sulfur-containing organic compound
- a complexing agent a carboxylic acid having two or more hydroxy groups and two or more carboxy groups or a salt thereof is used
- the sulfur-containing organic compound saccharin or a salt thereof and a sulfur-containing organic compound having an allyl group are used in combination
- the present invention is a chromium plating method for an object to be plated, characterized in that the object to be plated is electroplated with the above-mentioned trivalent chromium plating solution.
- the present invention is a chromium plated product obtained by electroplating a material to be plated with the above-mentioned trivalent chromium plating solution.
- the trivalent chromium plating solution of the present invention is a plating using trivalent chromium, an appearance similar to that of plating using hexavalent chromium is obtained, moreover, the plating deposition rate is fast and practical It is a thing.
- FIG. 7 is a view showing the position at which the distance around the stick was measured in the Hull cell test of Example 1;
- FIG. 7 is a diagram showing the relationship between the ratio of potassium sulfate and ammonium sulfate contained in the trivalent chromium plating solution and the periphery in the Hull cell test of Example 1. It is a figure which shows the result of having conducted the corrosion resistance test (CASS test).
- the trivalent chromium plating solution of the present invention contains a trivalent chromium compound, a complexing agent, potassium sulfate and ammonium sulfate as a conductive salt, a pH buffer, and a sulfur-containing organic compound.
- Trivalent chromium plating solution As a complexing agent, a carboxylic acid having two or more hydroxy groups and two or more carboxy groups or a salt thereof is used,
- the sulfur-containing organic compound saccharin or a salt thereof and a sulfur-containing organic compound having an allyl group are used in combination.
- the trivalent chromium compound used in the plating solution of the present invention is not particularly limited, and examples thereof include basic chromium sulfate, chromium sulfate, chromium chloride, chromium sulfamate, and chromium acetate, preferably basic chromium sulfate and chromium sulfate. is there. These trivalent chromium compounds may be used alone or in combination of two or more. Although the content of the trivalent chromium compound in the plating solution of the present invention is not particularly limited, it is, for example, 1 to 25 g / L as metal chromium, preferably 5 to 15 g / L.
- the complexing agent used in the plating solution of the present invention is a carboxylic acid having two or more hydroxy groups and two or more carboxy groups or salts thereof.
- the complexing agent include carboxylic acids such as tartaric acid, diammonium tartrate, Rochelle salts, salts of the above carboxylic acids such as sodium tartrate, and the like. These complexing agents may be used alone or in combination of two or more.
- the content of the carboxylic acid or the salt thereof in the plating solution of the present invention is not particularly limited, and is, for example, 5 to 90 g / L, preferably 10 to 60 g / L.
- the hydroxy group in the carboxy group is not counted as a hydroxy group.
- the conductive salts used in the plating solution of the present invention are potassium sulfate and ammonium sulfate.
- the content of potassium sulfate and ammonium sulfate in the plating solution of the present invention is not particularly limited, but it is, for example, 100 to 300 g / L in total, preferably 120 to 240 g / L.
- the mass ratio of potassium sulfate and ammonium sulfate is 0.5 to 60, preferably 1.0 to 30.
- the pH buffer used in the plating solution of the present invention is not particularly limited, and is, for example, boric acid, sodium borate, potassium borate, phosphoric acid, dipotassium hydrogen phosphate, etc., preferably boric acid or sodium borate. . These pH buffers may be used alone or in combination of two or more.
- the content of the pH buffer in the plating solution of the present invention is not particularly limited, but is, for example, 30 to 150 g / L, preferably 50 to 110 g / L.
- the sulfur-containing organic compound used in the plating solution of the present invention is a combination of saccharin or a salt thereof and a sulfur-containing organic compound having an allyl group.
- saccharin or a salt thereof include saccharin, sodium saccharinate and the like.
- sulfur-containing organic compound having an allyl group for example, sodium allylsulfonate, allylthiourea, ammonium 2-methylallylsulfonate, allylisothiacyanate and the like can be mentioned.
- the sulfur-containing organic compounds having these allyl groups may be used alone or in combination of two or more, and sodium allylsulfonate and / or allylthiourea are preferred.
- a preferred combination of these sulfur containing organic compounds is sodium saccharinate and sodium allyl sulfonate.
- the content of the sulfur-containing organic compound in the plating solution of the present invention is not particularly limited, and is, for example, 0.5 to 10 g / L, preferably 2 to 8 g / L.
- the plating solution of the present invention may further contain ascorbic acid, sodium ascorbate, hydrogen peroxide, polyethylene glycol and the like.
- the pH of the plating solution of the present invention is not particularly limited as long as it is acidic, and is preferably, for example, 2 to 4.5, and more preferably 2.5 to 4.0.
- the preparation method of the plating solution of the present invention is not particularly limited.
- a trivalent chromium compound, a complexing agent, a conductive salt, and a pH buffer are added to water at 40 to 50 ° C.
- the compound can be prepared by adding and mixing, and finally adjusting the pH with sulfuric acid, aqueous ammonia and the like.
- the plating solution of the present invention can be plated with chromium on a material to be plated by electroplating the material to be plated with the plating solution of the present invention, as in the conventional chromium plating solution.
- electroplating may be carried out for 1 to 15 minutes at a bath temperature of 30 to 60 ° C., an anode of carbon or iridium oxide, and a cathode current density of 2 to 20 A / dm 2 .
- metals such as iron, stainless steel, and brass, resin, such as ABS and PC / ABS, are mentioned, for example.
- the member to be plated may be treated beforehand with copper plating, nickel plating or the like before being treated with the plating solution of the present invention.
- the chromium plated product thus obtained is a chromium plated product having the same appearance, throwing power and deposition rate as hexavalent chromium is used.
- a carboxylic acid having two or more carboxy groups and having 4 or more carbon atoms or a salt thereof is further used in combination.
- carboxylic acids having two or more carboxy groups and having 4 or more carbon atoms or salts thereof include carboxylic acids such as adipic acid, phthalic acid, pimelic acid, sebacic acid, salts of the above-mentioned carboxylic acids, etc.
- a complexing agent a combination of a carboxylic acid having 2 or more hydroxy groups and 2 or more carboxy groups or a salt thereof and a carboxylic acid having 2 or more carboxy groups and 4 or more carbon atoms or a salt thereof When using it, these two types of complexing agents may be used alone or in combination of two or more.
- the total content of the complexing agent in the plating solution of the present invention is not particularly limited, but for example, it is 5 to 90 g / L in total of all the complexing agents, preferably 10 to 60 g. / L.
- a sulfonic acid having a vinyl group or a salt thereof is further used in combination.
- the sulfonic acid having a vinyl group or a salt thereof include sodium vinylsulfonate, methylvinylsulfonic acid, polyvinylsulfonic acid and the like.
- these three sulfur-containing organic compounds are One or more of each may be combined.
- the content of the sulfur-containing organic compound in the plating solution of the present invention is not particularly limited, and is, for example, 0.5 to 10 g / L in total of all the sulfur-containing organic compounds, preferably 2 to 8 g / L.
- the plating solution of the present invention using the complexing agent as described above and the sulfur-containing organic compound can be prepared by the above-mentioned preparation method.
- the chromium plated product thus obtained has a color tone comparable to that of hexavalent chromium, and has high corrosion resistance and high practicality. Therefore, this chrome-plated product is suitable for use in parts such as cars, motorcycles, water faucet fittings, etc. where corrosion resistance is required.
- the plating solution of the present invention does not contain iron and / or cobalt. Even so, the enthusiasm improves. Further, in the case of a plating solution containing iron or cobalt, there is a tendency that the corrosion resistance is lowered due to the coprecipitation of iron or cobalt in the plating film. Therefore, it is preferable that the plating solution of the present invention does not substantially contain iron and / or cobalt.
- the plating solution of the present invention contains substantially no iron and / or cobalt, it means that iron and / or cobalt is 2 ppm or less, preferably 1 ppm or less, more preferably 0.5 ppm or less.
- the amount of iron and / or cobalt can be analyzed by ICP-MS, atomic absorption spectrometry, or the like.
- the resulting chromium plated product also contains substantially no iron and / or cobalt.
- the chromium plating product of the present invention contains substantially no iron and / or cobalt, it means that iron and / or cobalt is less than 0.5 at%, preferably 0.4 at% or less during chromium plating.
- the amount of iron and / or cobalt can be analyzed by EDS, XPS or the like.
- Example 1 Chrome-plated The components described in Table 1 were dissolved in water to prepare a trivalent chromium plating solution. A Hull cell test was performed using this nickel-plated brass plate for this trivalent chromium plating solution. The conditions for the Hull cell test are a current of 4 A and a plating time of 3 minutes. After plating, the distance at which the plating film was deposited from the left end of the brass plate was measured as shown in FIG. Further, the film thickness of the portion corresponding to the current density 8 ASD of the brass plate was measured by fluorescent X-ray. Furthermore, the external appearance after plating was evaluated by L value, a value, and b value using a color difference meter (made by Konica Minolta Co., Ltd.). The results are also shown in Table 1.
- diammonium tartrate two hydroxy groups and two carboxy groups
- sodium saccharinate and sodium allyl sulfonate as a sulfur-containing organic compound.
- allylthiourea sulfur-containing organic compound having an allyl group
- the appearance is similar to that of hexavalent chromium plating, and the film thickness (precipitation rate) is not used. It turned out that it becomes about twice compared with the case.
- Example 2 Chrome-plated The components described in Table 2 were dissolved in water to prepare a trivalent chromium plating solution. A Hull cell test was performed using this nickel-plated brass plate for this trivalent chromium plating solution. The conditions for the Hull cell test are a current of 4 A and a plating time of 3 minutes. After plating, the distance at which the plating film was deposited from the left end of the brass plate was measured. The results are also shown in Table 2. Also, the relationship between pitch and potassium sulfate / ammonium sulfate is shown in FIG.
- Example 3 Chrome-plated The components described in Table 3 were dissolved in water to prepare a trivalent chromium plating solution.
- a Hull cell test was performed using this nickel-plated brass plate for this trivalent chromium plating solution.
- the conditions for the Hull cell test are a current of 4 A and a plating time of 3 minutes.
- the distance at which the plating film was deposited from the left end of the brass plate was measured as shown in FIG.
- the film thickness of the portion corresponding to the current density 8 ASD of the brass plate was measured by fluorescent X-ray.
- the external appearance after plating was evaluated by L value, a value, and b value using a color difference meter (made by Konica Minolta Co., Ltd.). The results are also shown in Table 3.
- the trivalent chromium plating solution as a complexing agent, a carboxylic acid having two or more hydroxy groups and two or more carboxy groups or a salt thereof and two or more carboxy groups, and having 4 carbon atoms
- a sulfur-containing organic compound a combination of saccharin or a salt thereof, a sulfonic acid having an allyl group or a salt thereof, and a sulfonic acid having a vinyl group or a salt thereof as a sulfur-containing organic compound is used. By using it, it turned out that an external appearance becomes equivalent to hexavalent chromium plating.
- Example 4 CASS exam A trivalent chromium plating solution having the composition 16, 18, 20, 21 described in Table 3 was prepared. Using this trivalent chromium plating solution, a copper plate plated with nickel (2 ⁇ m) was subjected to chromium plating under conditions of a bath temperature of 45 ° C. and a current density of 8 A / dm 2 for 3 minutes to obtain a test piece. The CASS test (JIS H 8502) was performed on this test piece. A photomicrograph of the specimen after 24 hours of CASS test is shown in FIG.
- a sulfur-containing organic compound a combination of saccharin or a salt thereof, a sulfonic acid having an allyl group or a salt thereof, and a sulfonic acid having a vinyl group or a salt thereof as a sulfur-containing organic compound is used. It was found that the corrosion resistance is improved by dispersing the corrosion holes in a small size by using the
- the trivalent chromium plating solution of the present invention can be used in various applications as the plating using hexavalent chromium. That's all
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Abstract
Description
錯化剤として、ヒドロキシ基を2つ以上、カルボキシ基を2つ以上有するカルボン酸またはその塩を用い、
硫黄含有有機化合物として、サッカリンまたはその塩と、アリル基を有する硫黄含有有機化合物を組み合わせて用いる、
ことを特徴とする3価クロムメッキ液である。
錯化剤として、ヒドロキシ基を2つ以上、カルボキシ基を2つ以上有するカルボン酸またはその塩を用い、
硫黄含有有機化合物として、サッカリンまたはその塩と、アリル基を有する硫黄含有有機化合物を組み合わせて用いるものである。
クロムメッキ:
表1に記載の成分を水に溶解して、3価クロムメッキ液を調製した。この3価クロムメッキ液について、ニッケルメッキを施した真鍮板を用いてハルセル試験を行った。ハルセル試験の条件は電流4A、メッキ時間3分である。メッキ後、真鍮板の左端からメッキ被膜が析出している距離を図1のように測定し、これをつきまわりとした。また、真鍮板の電流密度8ASDに該当する箇所の膜厚を蛍光X線で測定した。更に、メッキ後の外観は色彩色差計(コニカミノルタ社製)を用いてL値、a値、b値により評価した。それらの結果も表1に示した。
クロムメッキ:
表2に記載の成分を水に溶解して、3価クロムメッキ液を調製した。この3価クロムメッキ液について、ニッケルメッキを施した真鍮板を用いてハルセル試験を行った。ハルセル試験の条件は電流4A、メッキ時間3分である。メッキ後、真鍮板の左端からメッキ被膜が析出している距離を測定した。その結果も表2に示した。また、つきまわりと硫酸カリウム/硫酸アンモニウムの関係を図2に示した。
クロムメッキ:
表3に記載の成分を水に溶解して、3価クロムメッキ液を調製した。この3価クロムメッキ液について、ニッケルメッキを施した真鍮板を用いてハルセル試験を行った。ハルセル試験の条件は電流4A、メッキ時間3分である。メッキ後、真鍮板の左端からメッキ被膜が析出している距離を図1のように測定し、これをつきまわりとした。また、真鍮板の電流密度8ASDに該当する箇所の膜厚を蛍光X線で測定した。更に、メッキ後の外観は色彩色差計(コニカミノルタ社製)を用いてL値、a値、b値により評価した。それらの結果も表3に示した。
CASS試験:
表3に記載の組成16、18、20、21の組成の3価クロムメッキ液を調製した。この3価クロムメッキ液で、ニッケルメッキ(2μm)を施した銅板に、浴温45℃、電流密度8A/dm2、3分という条件でクロムめっきを行い、試験片を得た。この試験片についてCASS試験(JIS H 8502)を行った。CASS試験24時間後の試験片の顕微鏡写真を図3に示した。
以 上
Claims (11)
- 3価クロム化合物、錯化剤、伝導性塩として硫酸カリウムおよび硫酸アンモニウム、pH緩衝剤、硫黄含有有機化合物を含有する3価クロムメッキ液であって、
錯化剤として、ヒドロキシ基を2つ以上、カルボキシ基を2つ以上有するカルボン酸またはその塩を用い、
硫黄含有有機化合物として、サッカリンまたはその塩と、アリル基を有する硫黄含有有機化合物を組み合わせて用いる、
ことを特徴とする3価クロムメッキ液。 - ヒドロキシ基を2つ以上有するカルボン酸またはその塩が酒石酸ジアンモニウムである請求項1記載の3価クロムメッキ液。
- 硫酸カリウムおよび硫酸アンモニウムの質量比(硫酸カリウム/硫酸アンモニウム)が1.0~30である請求項1または2記載の3価クロムメッキ液。
- アリル基を有する硫黄含有有機化合物がアリルスルホン酸ナトリウムおよび/またはアリルチオ尿素である請求項1~3の何れかに記載の3価クロムメッキ液。
- 錯化剤として、更に、カルボキシ基を2つ以上有し、炭素数が4以上であるカルボン酸またはその塩を用い、硫黄含有有機化合物として、更に、ビニル基を有するスルホン酸またはその塩を用いるものである請求項1~4のいずれかに記載の3価クロムメッキ液。
- カルボキシ基を2つ以上有し、炭素数が4以上であるカルボン酸またはその塩が、フタル酸またはアジピン酸である請求項5記載の3価クロムメッキ液。
- ビニル基を有するスルホン酸またはその塩がビニルスルホン酸ナトリウムである請求項5記載の3価クロムメッキ液。
- 鉄および/またはコバルトを実質的に含有しないものである請求項1~7に記載の3価クロムメッキ液。
- 被メッキ物を、請求項1~8の何れかに記載の3価クロムメッキ液で電気メッキすることを特徴とする被メッキ物へのクロムメッキ方法。
- 被メッキ物を、請求項1~8の何れかに記載の3価クロムメッキ液で電気メッキして得られるクロムメッキ製品。
- クロムめっきが鉄および/またはコバルトを実質的に含有しないものである請求項10記載のクロムメッキ製品。
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CN201880080570.2A CN111465719A (zh) | 2017-12-13 | 2018-12-12 | 三价铬镀液以及使用其的镀铬方法 |
EP18889584.1A EP3725920A4 (en) | 2017-12-13 | 2018-12-12 | TRIVALENT CHROME PLATING SOLUTION AND CHROME PLATING PROCESS USING IT |
US16/770,357 US20210172081A1 (en) | 2017-12-13 | 2018-12-12 | Trivalent chromium plating solution and method for chromium-plating using same |
KR1020207017354A KR20200096239A (ko) | 2017-12-13 | 2018-12-12 | 3 가 크롬 도금액 및 이를 사용한 크롬 도금 방법 |
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WO2021084103A1 (en) | 2019-10-31 | 2021-05-06 | Coventya S.P.A. | Sulfate based, ammonium free trivalent chromium decorative plating process |
EP3859053A1 (en) | 2020-01-31 | 2021-08-04 | COVENTYA S.p.A. | Sulfate based, ammonium free trivalent chromium decorative plating process |
WO2023008406A1 (ja) * | 2021-07-28 | 2023-02-02 | 株式会社Jcu | 白色3価クロムめっき浴およびこれを利用した被めっき物への白色3価クロムめっき方法 |
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CN114875459A (zh) * | 2022-05-10 | 2022-08-09 | 成立航空股份有限公司 | 一种三价铬镀液及黑铬镀层 |
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- 2018-12-12 EP EP18889584.1A patent/EP3725920A4/en not_active Withdrawn
- 2018-12-12 US US16/770,357 patent/US20210172081A1/en not_active Abandoned
- 2018-12-12 KR KR1020207017354A patent/KR20200096239A/ko unknown
- 2018-12-12 JP JP2019559679A patent/JP6951465B2/ja active Active
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2021084103A1 (en) | 2019-10-31 | 2021-05-06 | Coventya S.P.A. | Sulfate based, ammonium free trivalent chromium decorative plating process |
CN114729463A (zh) * | 2019-10-31 | 2022-07-08 | 科文特亚股份公司 | 基于硫酸根的无铵的三价铬装饰性镀覆工艺 |
JP2022551461A (ja) * | 2019-10-31 | 2022-12-09 | コヴェンティア ソチエタ ペル アツィオーニ | 硫酸系、アンモニア不含三価クロム装飾めっきプロセス |
JP7342253B2 (ja) | 2019-10-31 | 2023-09-11 | コヴェンティア ソチエタ ペル アツィオーニ | 硫酸系、アンモニア不含三価クロム装飾めっきプロセス |
CN114729463B (zh) * | 2019-10-31 | 2024-08-27 | 科文特亚有限责任公司 | 基于硫酸根的无铵的三价铬装饰性镀覆工艺 |
EP3859053A1 (en) | 2020-01-31 | 2021-08-04 | COVENTYA S.p.A. | Sulfate based, ammonium free trivalent chromium decorative plating process |
WO2023008406A1 (ja) * | 2021-07-28 | 2023-02-02 | 株式会社Jcu | 白色3価クロムめっき浴およびこれを利用した被めっき物への白色3価クロムめっき方法 |
Also Published As
Publication number | Publication date |
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CN111465719A (zh) | 2020-07-28 |
EP3725920A4 (en) | 2021-04-21 |
EP3725920A1 (en) | 2020-10-21 |
KR20200096239A (ko) | 2020-08-11 |
JP6951465B2 (ja) | 2021-10-20 |
JPWO2019117178A1 (ja) | 2020-12-17 |
US20210172081A1 (en) | 2021-06-10 |
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