WO2019104939A1 - Écran d'affichage à del à colle noire et son procédé de traitement - Google Patents

Écran d'affichage à del à colle noire et son procédé de traitement Download PDF

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Publication number
WO2019104939A1
WO2019104939A1 PCT/CN2018/084697 CN2018084697W WO2019104939A1 WO 2019104939 A1 WO2019104939 A1 WO 2019104939A1 CN 2018084697 W CN2018084697 W CN 2018084697W WO 2019104939 A1 WO2019104939 A1 WO 2019104939A1
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WO
WIPO (PCT)
Prior art keywords
black
led light
display screen
led display
circuit board
Prior art date
Application number
PCT/CN2018/084697
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English (en)
Chinese (zh)
Inventor
张峰
蒋科政
Original Assignee
深圳市秀狐科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市秀狐科技有限公司 filed Critical 深圳市秀狐科技有限公司
Publication of WO2019104939A1 publication Critical patent/WO2019104939A1/fr

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes

Definitions

  • the invention relates to the technical field of display screens, in particular to a black plastic LED display screen and a processing method thereof.
  • LED displays have been rapidly developed due to their high brightness, low power consumption, stable performance, etc., and are increasingly used in people's daily lives, for example, in leisure squares, commercial streets, Electronic display screens in hospitals, train stations, concerts, etc.
  • the existing LED display screens generally have LED light-emitting chips mounted on the circuit board, and the LED display lamps are protected by screwing the plastic masks.
  • the plastic masks are arranged according to the matrix arrangement of the LED light-emitting chips to form LED light-emitting chips.
  • the grid structure between the LED light-emitting chips can be protected inside the plastic mask.
  • thousands of LED light-emitting chips arranged in a matrix are arranged on the circuit board to form a background screen, and images can be played.
  • the rib structure of the plastic mask is slightly higher than the height of the LED light-emitting chip, which causes the side light-emitting angle of the LED light-emitting chip to be small, that is, the viewing angle is narrow, and a large number of LED light-emitting chips emit mutual interference, and moiré is generated during display. Phenomenon, affecting the display effect.
  • the front side of the plastic mask serves as the background color of the display screen, and the original color of the plastic mask is sprayed by the machine through the high temperature inkjet method, which is difficult to maintain.
  • the color is the same, especially when the large-area display is spliced, there will be chromatic aberration, so when the LED display is spliced together, there will be a large color inconsistency, which will affect the display effect, and the customer will not accept the product of the display. and service.
  • the process of fixing the plastic panel using screws is complicated, it is difficult to control the quality consistency of the product, and a large amount of manual operation is required.
  • the density of the LED light-emitting chip increases (the LED light-emitting chip becomes smaller, in order to increase the resolution of the entire screen, that is, the pixel becomes smaller and denser), the spacing between the LED light-emitting chips becomes smaller, and the plastic mask is processed more and more. The more difficult it is, the more difficult it is to assemble, which means that the plastic mask does not have the effect of protecting the LED display with small dot spacing.
  • an object of the present invention is to provide a vinyl LED display screen and a processing method thereof, which aim to solve the problem that the LED display screen in the prior art has poor display effect and narrow viewing angle.
  • a vinyl LED display screen comprising a circuit board and an LED light-emitting chip mounted on the surface of the circuit board, wherein the LED light-emitting chip covering the surface of the circuit board further comprises a gap filling of the LED light-emitting chip
  • the black rubber layer is described, and the upper surface of the LED light-emitting chip is flush with the black rubber layer to form a flat surface.
  • the black plastic LED display screen wherein the black rubber layer is formed by low temperature low pressure injection molding.
  • the black plastic LED display screen wherein the black rubber layer is a black hot melt adhesive layer.
  • the black plastic LED display screen wherein adjacent LED light-emitting chips have a center-to-center spacing of 2.0-5.0 mm.
  • a method for processing a black plastic LED display screen comprising:
  • the circuit board with the LED light-emitting chip is placed in the cavity, and the black gel is injected at a low temperature and low pressure on the surface of the circuit board on which the LED light-emitting chip is attached until it is flush with the upper surface of the LED light-emitting chip to form a flat black rubber layer.
  • the method for processing a black plastic LED display screen, wherein the black colloid is a black hot melt adhesive is a black hot melt adhesive.
  • the method for processing a black plastic LED display screen wherein the center spacing of adjacent LED light-emitting chips is 2.0-5.0 mm.
  • the method for processing a black plastic LED display screen wherein the low temperature low pressure injection molding black colloid has a temperature of 180-240 ° C and a pressure of 1.5-40 Bar.
  • the present invention provides a vinyl LED display screen comprising a circuit board and an LED light emitting chip mounted on the surface of the circuit board, and further comprising a black rubber layer covering the surface of the circuit board.
  • the LED light emitting chip is filled with the black rubber layer gap, and the upper surface of the LED light emitting chip is flush with the black rubber layer to form a flat surface.
  • the black plastic LED display screen provided by the invention enables the LED light-emitting chip to be protected by the black rubber layer, thereby ensuring the consistency of the color of the surface after the display screen is spliced, and the black rubber layer is flush with the upper surface of the LED light-emitting chip, thereby expanding the viewing angle of the display screen. And the moiré phenomenon is avoided, and the display effect of the vinyl LED display is improved.
  • the problem that the display effect of the LED display screen in the prior art is poor and the viewing angle is narrow is effectively solved.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a vinyl LED display screen of the present invention.
  • FIG. 2 is a front elevational view of a preferred embodiment of a vinyl LED display of the present invention.
  • Figure 3 is a side elevational view of a preferred embodiment of a vinyl LED display of the present invention.
  • FIG. 4 is a flow chart of a preferred embodiment of a method for processing a black plastic LED display screen of the present invention.
  • the present invention provides a vinyl LED display screen and a processing method thereof.
  • the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
  • FIG. 1 is a schematic structural view of a preferred embodiment of a vinyl LED display screen according to the present invention
  • FIG. 2 is a front view of a preferred embodiment of a black plastic LED display panel according to the present invention
  • the present invention provides a vinyl LED display screen comprising a circuit board 10, an LED light emitting chip 20 and a black glue layer 30; the LED light emitting chip 20 is mounted on the same
  • the surface of the circuit board 10 can be set according to actual needs, and the size of the LED light-emitting chip used, as well as the row-column spacing thereof.
  • the black glue layer 30 of the present invention covers the surface of the circuit board 10 on which the LED light-emitting chip 20 is mounted.
  • the LED light-emitting chip 20 is gap-filled with the black glue layer 30, and the upper surface of the LED light-emitting chip 20 and the black glue
  • the layer 30 is flush and forms a flat surface, that is, the black glue layer 30 covers only the gap between the LED light-emitting chips 20 to increase the light-emitting viewing angle of the LED light-emitting chip 20.
  • the adjacent LED light-emitting chips 20 Adjacent to the center spacing of the LED light-emitting chips 20, a larger pitch display screen can be achieved, and a smaller pitch display screen can be achieved.
  • the adjacent LED light-emitting chips 20 have a center-to-center spacing of 2.0-5.0 mm. That is, the center distance of the LED light-emitting chip 20 which is most suitable for the vinyl LED display of the present invention ranges from 2.0 to 5.0 mm. That is to say, the LED light-emitting chip 20 using the black rubber layer of the invention can achieve a small dot pitch, the pixel is high, and the display picture is clearer.
  • the black adhesive layer 30 is preferably a black hot melt adhesive layer formed on the surface of the circuit board 10 on which the LED light emitting chip 20 has been mounted by low temperature low pressure injection molding, that is, already mounted.
  • a black hot melt adhesive is injected into the gap between the LED light-emitting chips 20 by a low-temperature low-pressure injection molding process to form a black hot melt adhesive layer.
  • the black hot melt adhesive layer forms a flat surface with the upper surface of all the LED light emitting chips 20, and the purpose thereof is to protect the LED light emitting chip 20 from being damaged by external force and to make the light of the LED light emitting chip 20 Normally emitted, that is, the LED light-emitting chip 20 constitutes a pixel on the surface of the black hot melt adhesive layer.
  • the LED display screen protects the LED light-emitting chip 20 from damage by using a plastic mask.
  • the technical defects such as the background technology part of the explanation, the protective effect of the plastic mask will have a negative impact:
  • First, due to the plastic mask The height is slightly higher than the height of the LED light-emitting chip 20, which affects the divergence of light, so that the side light-emitting angle is small, that is, the angle of view is narrow. For example, when watching a concert in the field, the scene usually has a large number of people, watching the LED display screen. At the side angle, the viewer cannot clearly and completely view the LED display screen.
  • the height of the plastic mask is slightly higher than the height of the LED light-emitting chip 20, which brings another problem.
  • the existing LED display is a circuit
  • the original color of the board 10 and the plastic mask is a ground color, generally black (the color of the black color is such that the color of the light of the LED light emitting chip 20 is not changed), Therefore, the machine is sprayed by high-temperature inkjet, and the color is difficult to maintain completely consistent (there is chromatic aberration drift, it is difficult to control its balance), therefore, when several displays are spliced together, the difference is naked It can be seen that the image effect formed by the LED light emitting chip 20 is affected.
  • the plastic mask has the disadvantages of being non-waterproof, not dustproof and not resistant to pressure.
  • the vinyl LED display screen provided by the present invention protects the LED light emitting chip 20 by using the black glue layer 30, and solves the above problems.
  • the black glue layer 30 is completed by low-temperature injection molding, which can control the consistency of the surface color stitching and improve the display effect.
  • the black glue layer 30 and the LED light-emitting chip 20 form a flat surface, and therefore, the light emission of the LED light-emitting chip 20 is not affected, and the light can be emitted from a small angle of the side of the display screen, and the viewing angle becomes large, and the viewing effect is improved. better.
  • the black hot melt adhesive can also be injected into the gap of the LED light emitting chip 20, and the production process has a wider adapting range.
  • the black rubber layer 30 of the present invention is both waterproof, dustproof, and resistant to pressure.
  • the plurality of vinyl LED display screens of the present invention can be seamlessly connected after being spliced, and people can not see that the large screen is composed of several display screens when viewed, that is, the visually complete large screen, therefore , the display is better.
  • the present invention also provides a method for processing a black plastic LED display screen, comprising the following steps:
  • the circuit board 10 on which the LED light-emitting chip 20 is attached is placed in a cavity, and the black gel is injected at a low temperature and low pressure on the surface of the circuit board 10 on which the LED light-emitting chip 20 is attached until it is flush with the upper surface of the LED light-emitting chip 20.
  • step S200 After the step S200, the following steps are further included, after the black glue layer 30 is cooled, the circuit board bottom case is installed.
  • step S100 the LED light-emitting chip 20 is mounted and fixed on the surface of the circuit board 10.
  • the center-to-center spacing of the adjacent LED light-emitting chips 20 on the surface of the circuit board 10 can achieve a large-pitch display screen, and can also be small.
  • the dot pitch display screen, most preferably, the adjacent LED light emitting chip 20 has a center-to-center spacing of 2.0-5.0 mm. That is, the center distance of the LED light-emitting chip 20 which is most suitable for the vinyl LED display of the present invention ranges from 2.0 to 5.0 mm.
  • the pixels are very high and the display is clearer.
  • the black colloid is preferably a black hot melt adhesive
  • the low temperature low pressure injection molded black hot melt adhesive has a temperature of 180-240 ° C and a pressure of 1.5-40 Bar.
  • the most suitable range for low-temperature low-pressure injection of black colloid is 2.0-5.0 mm.
  • the mold used in the present invention is a special large mold. After the circuit board 10 to which the LED light-emitting chip 20 is attached is placed in the cavity, the black hot melt adhesive is introduced through the nine glue inlets until the black hot melt adhesive is filled.
  • the gap of the LED light-emitting chip 20 is preferably 1.7 mm in diameter.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un écran d'affichage à DEL à colle noire et son procédé de traitement. L'écran d'affichage à DEL à colle noire comprend une carte de circuit imprimé (10) et des puces électroluminescentes à DEL (20) montées sur la surface de la carte de circuit imprimé (10), et comprend en outre une couche de colle noire (30) recouvrant la surface de la carte de circuit imprimé (10). Les soudures des puces électroluminescentes à DEL (20) sont remplies avec la couche de colle noire (30), et la surface supérieure des puces électroluminescentes à DEL (20) est alignée avec la couche de colle noire (30) afin de former une surface plate. Selon l'écran d'affichage à DEL à colle noire, les puces électroluminescentes à DEL (20) sont protégées par la couche de colle noire (30), la cohérence de couleur sur la surface de l'écran d'affichage épissé est assurée, la couche de colle noire (30) affleure la surface supérieure des puces électroluminescentes à DEL (20) de telle sorte que l'angle visuel de l'écran d'affichage est étendu, un phénomène de motif de moiré est évité, et l'effet d'affichage de l'écran d'affichage à DEL est amélioré.
PCT/CN2018/084697 2017-11-28 2018-04-26 Écran d'affichage à del à colle noire et son procédé de traitement WO2019104939A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201711217785.8 2017-11-28
CN201711217785.8A CN107657904A (zh) 2017-11-28 2017-11-28 一种黑胶led显示屏及其加工方法

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Publication Number Publication Date
WO2019104939A1 true WO2019104939A1 (fr) 2019-06-06

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107731121A (zh) * 2017-11-28 2018-02-23 深圳市秀狐科技有限公司 一种双层胶led显示屏及其加工方法
CN107657904A (zh) * 2017-11-28 2018-02-02 深圳市秀狐科技有限公司 一种黑胶led显示屏及其加工方法
CN108346381A (zh) * 2018-04-04 2018-07-31 深圳市秀狐科技有限公司 一种led显示屏及其封装方法
CN108943564B (zh) * 2018-06-19 2021-01-12 昆山丘钛微电子科技有限公司 一种注塑方法及摄像模组
CN109616026A (zh) * 2019-01-30 2019-04-12 华域视觉科技(上海)有限公司 改善led静态屏显效果的方法和led显示屏
CN112447897A (zh) * 2019-09-03 2021-03-05 李家铭 具有遮光膜的rgb发光二极管模块
CN111028701B (zh) * 2019-11-29 2022-04-01 熊周成 一种led显示屏
CN111261054A (zh) * 2020-01-21 2020-06-09 惠州中京电子科技有限公司 一种黑基材在led拼接屏产品的应用
CN111446348B (zh) * 2020-04-06 2021-04-13 深圳市洲明科技股份有限公司 一种封装方法和led灯板
CN112968114B (zh) * 2021-02-01 2022-07-12 深圳市华星光电半导体显示技术有限公司 显示面板及其制作方法

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CN203980224U (zh) * 2013-07-16 2014-12-03 朱小龙 一种连体透镜led天花灯密封灯头
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CN207458492U (zh) * 2017-11-28 2018-06-05 深圳市秀狐科技有限公司 一种黑胶led显示屏

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CN204313014U (zh) * 2014-04-26 2015-05-06 王定锋 分切的注塑led标识模组
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Publication number Priority date Publication date Assignee Title
CN101325018A (zh) * 2008-07-01 2008-12-17 深圳市锐拓显示技术有限公司 一种高对比度led显示模组
CN102122463A (zh) * 2011-03-24 2011-07-13 李海涛 一种贴片led显示屏及其制造方法
CN103280164A (zh) * 2013-05-30 2013-09-04 创维光电科技(深圳)有限公司 Led显示屏模组以及led显示屏
CN203980224U (zh) * 2013-07-16 2014-12-03 朱小龙 一种连体透镜led天花灯密封灯头
CN205881365U (zh) * 2016-07-15 2017-01-11 深圳市九晟光电通讯科技有限公司 一种户外显示屏单元板
CN107657904A (zh) * 2017-11-28 2018-02-02 深圳市秀狐科技有限公司 一种黑胶led显示屏及其加工方法
CN207458492U (zh) * 2017-11-28 2018-06-05 深圳市秀狐科技有限公司 一种黑胶led显示屏

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