WO2019100879A1 - Diaphragme conducteur, haut-parleur et procédé de fabrication d'un diaphragme conducteur - Google Patents

Diaphragme conducteur, haut-parleur et procédé de fabrication d'un diaphragme conducteur Download PDF

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Publication number
WO2019100879A1
WO2019100879A1 PCT/CN2018/110893 CN2018110893W WO2019100879A1 WO 2019100879 A1 WO2019100879 A1 WO 2019100879A1 CN 2018110893 W CN2018110893 W CN 2018110893W WO 2019100879 A1 WO2019100879 A1 WO 2019100879A1
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WO
WIPO (PCT)
Prior art keywords
layer
conductive
voice coil
connection layer
diaphragm
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Application number
PCT/CN2018/110893
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English (en)
Chinese (zh)
Inventor
王素卿
王述强
吴增勋
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歌尔股份有限公司
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Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2019100879A1 publication Critical patent/WO2019100879A1/fr

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00Loudspeakers
    • H04R2400/11Aspects regarding the frame of loudspeaker transducers

Definitions

  • the present invention relates to the field of speaker diaphragms, and more particularly to a method of manufacturing a conductive diaphragm, a speaker, and a conductive diaphragm.
  • the voice coil of the speaker vibration system is connected by leads to the pads of the flexible printed circuit board located on the housing.
  • the voice coil lead wire is long. In order to prevent the voice coil lead from interfering with the peripheral components, the travel path of the voice coil lead must be strictly planned during design, and the voice coil lead wire needs to be operated in line during processing, and the design and processing are both More inconvenient.
  • An object of the present invention is to provide a new technical solution for a conductive diaphragm which can effectively simplify the design and processing of a voice coil lead.
  • a conductive diaphragm is provided.
  • the conductive diaphragm includes a folding ring portion, a fixing portion and a center portion, and a surface of the conductive diaphragm is provided with a conductive layer, a power supply connecting layer and a voice coil lead connecting layer, the power supply connecting layer and the voice coil lead connecting layer Made of a conductive material;
  • At least a portion of the conductive layer is located on the folded portion
  • the power connection layer and the voice coil lead connection layer are located outside the folded ring portion;
  • the power connection layer and the voice coil lead connection layer are both connected to the conductive layer, and the power connection layer and the voice coil lead connection layer are both located on an outer surface of the conductive diaphragm.
  • the power connection layer is located on the fixing portion, and the voice coil lead connection layer is located on the center portion; or
  • the power connection layer is located on the central portion, and the voice coil lead connection layer is located on the fixed portion.
  • the conductive diaphragm includes at least one substrate layer and at least one auxiliary layer;
  • the conductive layer, the power connection layer and the voice coil lead connection layer are all located on the substrate layer;
  • the substrate layer and the auxiliary layer are stacked.
  • the conductive diaphragm further includes at least one adhesive layer
  • the glue layer is positioned between the substrate layer and the auxiliary layer to composite the substrate layer and the auxiliary layer.
  • the conductive layer has a thickness of 2-25 ⁇ m.
  • the power connection layer and the voice coil lead connection layer have a thickness of 10-45 ⁇ m.
  • a speaker is provided.
  • the speaker includes a vibrating voice coil and the conductive diaphragm of the present invention
  • the voice coil lead of the vibrating voice coil is electrically connected to the voice coil lead connection layer.
  • a method of manufacturing a conductive diaphragm is provided.
  • the manufacturing method of the conductive diaphragm includes the following steps:
  • Step S1 forming a conductive layer on the substrate layer by printing a conductive ink
  • Step S2 forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate ;
  • Step S3 forming the diaphragm substrate into a conductive diaphragm, and at least partially conducting the conductive layer on the folded portion of the conductive diaphragm, and the power connection layer and the voice coil lead connecting layer are located outside the folded portion of the conductive diaphragm .
  • step S2 includes:
  • Step S2-1 compounding the substrate layer and the auxiliary layer
  • Step S2-2 forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the composite substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located at the diaphragm base On the outer surface of the material.
  • step S2 includes:
  • Step S2-1 forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer;
  • Step S2-2 combining the substrate layer and the auxiliary layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate.
  • the power connection layer in the step S3 is located on the fixed portion of the conductive diaphragm, and the voice coil lead connection layer is located on the central portion of the conductive diaphragm;
  • the power supply connection layer in step S3 is located on the central portion of the conductive diaphragm, and the voice coil lead connection layer is located on the fixed portion of the conductive diaphragm.
  • the voice coil lead connection layer on the conductive type diaphragm can be connected to the voice coil lead of the vibrating voice coil, and the power supply connection layer of the conductive type diaphragm can be connected to the power supply device, thereby achieving the direction through the conductive layer Vibrating voice coil power supply.
  • the voice coil lead wires of the present disclosure are short, which is advantageous for simplifying the design and processing of the voice coil leads and avoiding the smooth operation of the voice coil leads.
  • the short lead wire of the voice coil is also beneficial to effectively avoid the problem of the broken voice coil lead caused by the vibration of the voice coil of the voice coil, which improves the service life of the speaker.
  • FIG. 1 is a schematic structural view of an embodiment of a conductive diaphragm of the present disclosure.
  • Figure 2 is a partial enlarged view of Figure 1.
  • Fig. 3 is a flow chart showing a method of manufacturing a conductive diaphragm of the present disclosure.
  • the present disclosure provides a conductive diaphragm.
  • the conductive diaphragm 1 of the present disclosure includes a folded portion 14, a fixed portion 15, and a central portion 16.
  • the conductive diaphragm 1 is provided with a conductive layer 11, a power supply connection layer 12, and a voice coil lead connection layer 13.
  • the conductive layer 11 can be formed by printing a conductive ink.
  • Both the power supply connection layer 12 and the voice coil lead connection layer 13 are made of a conductive material.
  • the above conductive material may be, for example, a metal material or a conductive paste or the like.
  • both the power supply connection layer 12 and the voice coil lead connection layer 13 are tin layers, that is, the power supply connection layer 12 and the voice coil lead connection layer 13 are both made of a tin material.
  • the power supply connection layer 12 and the voice coil lead connection layer 13 may be formed by spot welding, coating or electroplating, and may of course be formed in other manners, which is not limited in the present invention.
  • the power supply connection layer 12 and the voice coil lead connection layer 13 may be connected to the conductive layer 11 by being in contact with the edge of the conductive layer 11.
  • the power connection layer 12 and the voice coil lead connection layer 13 may be connected to the conductive layer 11 by being overlaid on the portion of the conductive layer 11.
  • the shape and position of the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 can be set according to actual needs.
  • the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 each have a rectangular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 are respectively in contact with both ends of the conductive layer 11 in the longitudinal direction.
  • the conductive layer 11 has a circular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 have a rectangular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 overlap the edges of the conductive layer 11.
  • At least a portion of the conductive layer 11 is located on the folded portion 14 of the conductive diaphragm 1.
  • the power supply connection layer 12 and the voice coil lead connection layer 13 are located outside the folded portion 14 of the conductive diaphragm 1.
  • the power supply connection layer 12 and the voice coil lead connection layer 13 are located outside the folded portion 14 of the conductive diaphragm 1 to effectively prevent the influence of the soldering operation on the acoustic performance of the conductive diaphragm 1.
  • the power connection layer 12 and the voice coil lead connection layer 13 may both be located on the fixed portion 15 or the central portion 16 of the conductive diaphragm 1, or the power connection layer 12 and the voice coil lead connection layer 13 may be respectively located at the fixing portion 15 And on the center 16th.
  • Both the power supply connection layer 12 and the voice coil lead connection layer 13 are connected to the conductive layer 11, and the power supply connection layer 12 and the voice coil lead connection layer 13 are both located on the outer surface of the conductive type diaphragm 1.
  • the position of the conductive layer 11 can be flexibly set according to actual needs.
  • the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 12 are all located on the outer surface of the conductive diaphragm 1.
  • the conductive layer 11 is located in the conductive diaphragm 1
  • the power connection layer 12 and the voice coil lead connecting layer 12 are located on the outer surface of the conductive diaphragm 1 to ensure that other devices can be connected to the power connection layer 12 and the voice coil lead.
  • Layer 12 is electrically connected.
  • the voice coil lead connecting layer 13 on the conductive diaphragm 1 can be connected to the voice coil lead of the vibrating voice coil, and the power supply connecting layer 12 of the conductive diaphragm 1 can be connected to the power supply device.
  • the connection is made to supply power to the vibrating voice coil through the conductive layer 11.
  • the voice coil lead is connected to the pad on the outer casing, and the distance between the vibrating voice coil of the present disclosure and the conductive diaphragm 1 is close, so that the voice coil lead is routed. Short, it helps to simplify the design and processing of the voice coil leads, and avoids the smooth operation of the voice coil leads.
  • the short lead wire of the voice coil is also beneficial to avoid the problem of the broken voice coil lead caused by the vibration of the voice coil of the voice coil, which improves the service life of the speaker.
  • the power supply connection layer 12 is located on the fixed portion 15 of the conductive diaphragm 1, and the voice coil lead connection layer 13 is located on the central portion 16 of the conductive diaphragm 1.
  • the power supply connection layer 12 is located on the central portion 16 of the conductive diaphragm 1, and the voice coil lead connection layer 13 is located on the fixed portion 15 of the conductive diaphragm 1.
  • the power supply connection layer 12 and the voice coil lead connection layer 13 are located at different portions of the conductive diaphragm 1, which facilitates the convenience of connecting the power supply connection layer 12 and the voice coil lead connection layer 13 to the leads or other components.
  • the conductive diaphragm 1 of the present disclosure may be a single-layer diaphragm, that is, the diaphragm is made of only a single material.
  • the conductive diaphragm 1 may be a composite diaphragm, that is, the diaphragm is made of a plurality of different materials.
  • the conductive diaphragm 1 comprises at least one substrate layer and at least one auxiliary layer.
  • the substrate layer can be formed from materials commonly used in the field of speaker diaphragms.
  • the material of the substrate layer is PEEK (Polyetheretherketone), PAR (polyaryl acrylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS ( Polyphenylene sulfide, polyphenylene sulfide (PEN), PEN (Polyethylene naphthalate two formic acid glycol ester), PET (Polyethylene terephthalate), and the like.
  • the thickness of the substrate layer is optionally from 3 to 15 ⁇ m.
  • the material of the auxiliary layer may be the same as or different from the substrate layer.
  • the auxiliary layer is made of PEEK (Polyetheretherketone), PAR (polyaryl acrylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS (Polyphenylene). Sulfide, polyphenylene sulfide, PEN (Polyethylene naphthalate two formic acid glycol ester), PET (polyethylene terephthalate), and the like.
  • the material of the auxiliary layer is an elastomer material such as TPE (Thermoplastic Elastomer), TPU (Thermoplastic polyurethanes), TPEE (thermoplastic polyester elastomer), or the like.
  • the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 are all located on the substrate layer.
  • the substrate layer and the auxiliary layer are stacked.
  • the power supply connection layer 12 and the voice coil lead connection layer 12 are located on the outer surface of the conductive diaphragm 1;
  • the conductive layer 11 may be located on the outer surface of the conductive diaphragm 1, or the conductive layer 11 is located in the conductive diaphragm 1 in.
  • the conductive diaphragm 1 includes two base layers and an auxiliary layer, and the auxiliary layer is sandwiched between the two base layers, and the conductive layer 11 and the power connection layer 12 may be disposed on the two base layers.
  • the voice coil lead connection layer 13 the conductive diaphragm 1 includes a base material layer and two auxiliary layers, and one base material layer and two auxiliary layers are sequentially disposed.
  • the conductive diaphragm 1 further includes at least one adhesive layer.
  • a glue layer is positioned between the substrate layer and the auxiliary layer to composite the substrate layer and the auxiliary layer.
  • the glue layer functions as an adhesive substrate layer and an auxiliary layer.
  • the material of the glue layer may be acrylic glue or silica gel.
  • the conductive layer 11 has a thickness of 2 to 25 ⁇ m to ensure the conductive effect without affecting the acoustic performance of the conductive diaphragm 1 .
  • the thickness of the power supply connection layer 12 and the voice coil lead connection layer 13 is 10-45 ⁇ m to effectively control the cost while ensuring normal soldering of the layer.
  • the present disclosure also provides a speaker.
  • the speaker diaphragm includes a vibrating voice coil and the conductive diaphragm 1 of the present disclosure.
  • the voice coil lead of the vibrating voice coil is electrically connected to the voice coil lead connecting layer 13.
  • the power connection layer 12 can be connected to the power supply device to supply power to the vibrating voice coil through the conductive layer 11.
  • the distance between the vibrating voice coil of the speaker diaphragm of the present disclosure and the conductive diaphragm 1 is short, so that the wiring of the voice coil lead is short, which is advantageous for simplifying the design and processing of the voice coil lead, and avoiding the smoothing of the voice coil lead. operating.
  • the short lead wire of the voice coil is also beneficial to effectively avoid the problem of the broken voice coil lead caused by the vibration of the voice coil of the voice coil, which improves the service life of the speaker.
  • the present disclosure also provides a method of manufacturing a conductive diaphragm.
  • the conductive diaphragm includes the following steps:
  • Step S1 forming a conductive layer on the substrate layer by printing a conductive ink.
  • the substrate layer may have a single layer structure, or the substrate layer may be a multilayer structure composed of a plurality of structural layers having the same material or different materials.
  • the material of the substrate layer can be flexibly selected according to actual needs.
  • the material of the substrate layer is PEEK (Polyetheretherketone), PAR (polyarylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS (Polyphenylene sulfide, polyphenylene sulfide), PEN (Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate), PET (Polyethylene terephthalate, poly(p-phenylene terephthalate) Ethylene glycolate).
  • PEEK Polyetheretherketone
  • PAR polyarylate
  • PEI Polyetherimide, polyetherimide
  • PI Polyimide, polyimide
  • PPS Polyphenylene sulfide
  • PEN Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate
  • PET Polyethylene terephthalate, poly(p-phenylene terephthalate) Ethylene glycolate
  • the shape of the conductive layer 11 can be set according to actual needs.
  • the conductive layer has a rectangular shape.
  • the conductive layer has a circular shape.
  • the above conductive layer may be, for example, a nano silver paste or the like. Of course, it can also be other materials that can conduct electricity, and the present invention does not limit this.
  • Step S2 forming a power supply connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer obtained in the step S1 to obtain a diaphragm substrate.
  • the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate to ensure that other devices can be electrically connected to the power connection layer and the voice coil lead connection layer.
  • the conductive layer may be on the outer surface of the diaphragm substrate, or the conductive layer may be located in the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate.
  • the power supply connection layer and the voice coil lead connection layer may be formed by spot welding, coating or electroplating, and may of course be formed in other manners, which is not limited in the present invention. Both the power connection layer and the voice coil lead connection layer are connected to the conductive layer.
  • the power connection layer and the voice coil lead connection layer may be connected to the conductive layer by being in contact with the edge of the conductive layer. Alternatively, the power connection layer and the voice coil lead connection layer may be connected to the conductive layer by being overlaid on a portion of the conductive layer.
  • the shape of the power connection layer and the voice coil lead connection layer can be set according to actual needs.
  • the power supply connection layer, the voice coil lead connection layer, and the conductive layer each have a rectangular shape, and the power supply connection layer and the voice coil lead connection layer are respectively in contact with both ends of the conductive layer in the longitudinal direction.
  • the power connection layer and the voice coil lead connection layer have a rectangular shape
  • the conductive layer has a circular shape
  • the power connection layer and the voice coil lead connection layer overlap the edges of the conductive layer.
  • Step S3 forming the diaphragm substrate obtained in step S2 into a conductive diaphragm, and at least partially conducting the conductive layer on the folded portion of the conductive diaphragm, and the power connection layer and the voice coil lead connecting layer are located on the conductive diaphragm Outside the folding ring.
  • the power connection layer and the voice coil lead connection layer are located outside the folded portion of the conductive diaphragm to effectively prevent the influence of the soldering operation on the acoustic performance of the conductive diaphragm.
  • the power connection layer and the voice coil lead connection layer may both be located on the fixed portion or the central portion of the conductive diaphragm, or the power connection layer and the voice coil lead connection layer may be respectively located on the fixed portion and the central portion.
  • the method of manufacturing the conductive diaphragm of the present disclosure is simple in operation and easy to implement.
  • the conductive diaphragm obtained by the manufacturing method of the conductive diaphragm can be connected to the voice coil lead of the vibrating voice coil through the voice coil lead connecting layer, and the conductive diaphragm can be connected to the power supply device through the power supply connection layer, thereby The conductive diaphragm is supplied to the vibrating voice coil through the conductive layer.
  • This conductive diaphragm reduces the routing of the voice coil leads, which simplifies the design and processing of the voice coil leads and avoids the smooth operation of the voice coil leads.
  • the short lead wire of the voice coil is also beneficial to effectively avoid the problem of the broken voice coil lead caused by the vibration of the voice coil lead due to the vibration of the vibrating voice coil, thereby improving the service life of the speaker.
  • step S2 includes:
  • Step S2-1 compounding the substrate layer and the auxiliary layer.
  • Step S2-2 forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the composite substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located at the diaphragm base On the outer surface of the material.
  • the conductive layer may be on the outer surface of the diaphragm substrate, or the conductive layer may be located in the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate.
  • the substrate layer is an intermediate layer of the diaphragm substrate, and an opening for exposing a portion of the conductive layer should be opened on the auxiliary layer to enable the power connection layer and the voice coil lead connection layer Can be connected to the conductive layer.
  • step S2 includes:
  • Step S2-1 forming a power supply connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer.
  • Step S2-2 combining the substrate layer and the auxiliary layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate.
  • the conductive layer in the present disclosure may be on the outer surface of the diaphragm substrate, or the conductive layer may be located in the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate.
  • the substrate layer is an intermediate layer of the diaphragm substrate, and an opening for exposing a portion of the conductive layer should be opened on the auxiliary layer to enable the power connection layer on the substrate layer
  • the voice coil lead connection layer is exposed on the outer surface of the diaphragm substrate.
  • the conductive diaphragm includes two base layers and an auxiliary layer, and the auxiliary layer is sandwiched between the two base layers, and the two base layers may be provided with a conductive layer, a power connection layer, and a voice coil lead. Connection layer.
  • the conductive diaphragm includes a base material layer and two auxiliary layers, and the base material layer is sandwiched between the two auxiliary layers.
  • the substrate layer and the auxiliary layer may be bonded together by a glue layer of a material such as acrylic rubber or silica gel, or may be compounded by hot pressing.
  • the material of the auxiliary layer in the present disclosure may be the same as or different from the material of the substrate layer.
  • the material of the auxiliary layer can be, for example, PEEK (Polyetheretherketone), PAR (polyaryl acrylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS (Polyphenylene). Sulfide, polyphenylene sulfide, PEN (Polyethylene naphthalate two formic acid glycol ester), PET (polyethylene terephthalate), and the like.
  • the material of the auxiliary diaphragm material is an elastomer material such as TPE (Thermoplastic Elastomer), TPU (Thermoplastic polyurethanes), TPEE (thermoplastic polyester elastomer), or the like.
  • the power supply connection layer in step S3 is located on the fixed portion of the conductive diaphragm, and the voice coil lead connection layer is located on the central portion of the conductive diaphragm.
  • the power supply connection layer in the step S3 is located on the central portion of the conductive diaphragm, and the voice coil lead connection layer is located on the fixed portion of the conductive diaphragm.
  • the power connection layer and the voice coil lead connection layer are located at different parts of the conductive diaphragm, which is convenient for improving the connection of the power connection layer and the voice coil lead connection layer with the lead or other components.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

L'invention concerne un diaphragme conducteur, un haut-parleur et un procédé de fabrication du diaphragme conducteur. Le diaphragme conducteur comprend une partie annulaire courbée, une partie de fixation et une partie centrale, et une couche conductrice, une couche de connexion d'alimentation électrique et une couche de connexion de fil de bobine acoustique sont disposées sur le diaphragme conducteur, au moins une partie de la couche conductrice étant située sur la partie annulaire courbée; la couche de connexion d'alimentation électrique et la couche de connexion de fil de bobine acoustique sont situées à l'extérieur de la partie annulaire courbée; et la couche de connexion d'alimentation électrique et la couche de connexion de fil de bobine acoustique sont toutes deux connectées à la couche conductrice, et la couche de connexion d'alimentation électrique et la couche de connexion de fil de bobine acoustique sont toutes deux situées sur une surface externe du diaphragme conducteur. La couche de connexion de fil de bobine acoustique sur le diaphragme conducteur de la présente invention peut être connectée à un fil de bobine acoustique d'une bobine acoustique vibrante. Le fil de bobine acoustique de la présente invention est court dans le câblage, ce qui facilite la simplification de la conception et du traitement du fil de bobine acoustique et élimine une opération de lissage sur le fil de bobine acoustique.
PCT/CN2018/110893 2017-11-22 2018-10-18 Diaphragme conducteur, haut-parleur et procédé de fabrication d'un diaphragme conducteur WO2019100879A1 (fr)

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CN201711172759.8A CN107809705B (zh) 2017-11-22 2017-11-22 一种导电型振膜、扬声器及导电型振膜的制造方法
CN201711172759.8 2017-11-22

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WO2021031496A1 (fr) * 2019-08-19 2021-02-25 歌尔股份有限公司 Film conducteur pour appareil de production de son et appareil de production de son

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CN208638667U (zh) * 2018-08-08 2019-03-22 瑞声科技(新加坡)有限公司 微型发声器件
CN109905825A (zh) * 2019-03-13 2019-06-18 东莞涌韵音膜有限公司 具有悬挂件的振膜及使用该振膜的微型扬声器
CN210986413U (zh) * 2019-08-21 2020-07-10 罗冬梅 振动膜及扬声器
CN110691308A (zh) * 2019-09-29 2020-01-14 歌尔科技有限公司 一种用于发声装置的导电膜以及发声装置
CN110691306A (zh) * 2019-09-29 2020-01-14 歌尔科技有限公司 一种用于发声装置的导电膜以及发声装置
CN110691307A (zh) 2019-09-29 2020-01-14 歌尔科技有限公司 一种用于发声装置的导电膜以及发声装置
CN110784810B (zh) * 2019-09-29 2021-03-30 歌尔科技有限公司 一种用于发声装置的导电膜以及发声装置
CN110620976A (zh) * 2019-09-29 2019-12-27 歌尔科技有限公司 一种用于发声装置的导电膜以及发声装置
CN110708644A (zh) * 2019-09-29 2020-01-17 歌尔科技有限公司 一种用于发声装置的导电膜以及发声装置
CN210641063U (zh) * 2019-11-11 2020-05-29 歌尔科技有限公司 一种用于发声装置的导电振膜及发声装置
CN114302302B (zh) * 2021-12-30 2024-02-02 歌尔股份有限公司 振膜及其制备方法、发声装置、电子设备
CN114286261A (zh) * 2021-12-30 2022-04-05 歌尔股份有限公司 振膜及其制备方法、发声装置、电子设备
CN117998262A (zh) * 2022-11-04 2024-05-07 华为技术有限公司 制造扬声器振膜的方法、扬声器和电子设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101467321B1 (ko) * 2013-06-18 2014-12-01 주식회사 이엠텍 Lds 공법을 이용해 터미널을 형성한 마이크로스피커
CN204929238U (zh) * 2015-08-10 2015-12-30 深圳立讯电声科技有限公司 微型发声器
CN205142512U (zh) * 2015-11-11 2016-04-06 深圳立讯电声科技有限公司 扬声器
CN105872911A (zh) * 2016-05-05 2016-08-17 歌尔声学股份有限公司 一种发声装置的振膜
CN107809705A (zh) * 2017-11-22 2018-03-16 歌尔股份有限公司 一种导电型振膜、扬声器及导电型振膜的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204046803U (zh) * 2014-07-16 2014-12-24 常州美欧电子有限公司 微型发声器
CN204859539U (zh) * 2015-07-24 2015-12-09 歌尔声学股份有限公司 一种硅胶振膜和扬声器模组
CN205566632U (zh) * 2016-01-25 2016-09-07 歌尔声学股份有限公司 扬声器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101467321B1 (ko) * 2013-06-18 2014-12-01 주식회사 이엠텍 Lds 공법을 이용해 터미널을 형성한 마이크로스피커
CN204929238U (zh) * 2015-08-10 2015-12-30 深圳立讯电声科技有限公司 微型发声器
CN205142512U (zh) * 2015-11-11 2016-04-06 深圳立讯电声科技有限公司 扬声器
CN105872911A (zh) * 2016-05-05 2016-08-17 歌尔声学股份有限公司 一种发声装置的振膜
CN107809705A (zh) * 2017-11-22 2018-03-16 歌尔股份有限公司 一种导电型振膜、扬声器及导电型振膜的制造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021031495A1 (fr) * 2019-08-19 2021-02-25 歌尔股份有限公司 Membrane conductrice destinée à être utilisée dans un appareil de production de son et appareil de production de son
WO2021031496A1 (fr) * 2019-08-19 2021-02-25 歌尔股份有限公司 Film conducteur pour appareil de production de son et appareil de production de son

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