WO2019100879A1 - Conductive diaphragm, loudspeaker, and method for manufacturing conductive diaphragm - Google Patents

Conductive diaphragm, loudspeaker, and method for manufacturing conductive diaphragm Download PDF

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Publication number
WO2019100879A1
WO2019100879A1 PCT/CN2018/110893 CN2018110893W WO2019100879A1 WO 2019100879 A1 WO2019100879 A1 WO 2019100879A1 CN 2018110893 W CN2018110893 W CN 2018110893W WO 2019100879 A1 WO2019100879 A1 WO 2019100879A1
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WO
WIPO (PCT)
Prior art keywords
layer
conductive
voice coil
connection layer
diaphragm
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Application number
PCT/CN2018/110893
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French (fr)
Chinese (zh)
Inventor
王素卿
王述强
吴增勋
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歌尔股份有限公司
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Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2019100879A1 publication Critical patent/WO2019100879A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00Loudspeakers
    • H04R2400/11Aspects regarding the frame of loudspeaker transducers

Definitions

  • the present invention relates to the field of speaker diaphragms, and more particularly to a method of manufacturing a conductive diaphragm, a speaker, and a conductive diaphragm.
  • the voice coil of the speaker vibration system is connected by leads to the pads of the flexible printed circuit board located on the housing.
  • the voice coil lead wire is long. In order to prevent the voice coil lead from interfering with the peripheral components, the travel path of the voice coil lead must be strictly planned during design, and the voice coil lead wire needs to be operated in line during processing, and the design and processing are both More inconvenient.
  • An object of the present invention is to provide a new technical solution for a conductive diaphragm which can effectively simplify the design and processing of a voice coil lead.
  • a conductive diaphragm is provided.
  • the conductive diaphragm includes a folding ring portion, a fixing portion and a center portion, and a surface of the conductive diaphragm is provided with a conductive layer, a power supply connecting layer and a voice coil lead connecting layer, the power supply connecting layer and the voice coil lead connecting layer Made of a conductive material;
  • At least a portion of the conductive layer is located on the folded portion
  • the power connection layer and the voice coil lead connection layer are located outside the folded ring portion;
  • the power connection layer and the voice coil lead connection layer are both connected to the conductive layer, and the power connection layer and the voice coil lead connection layer are both located on an outer surface of the conductive diaphragm.
  • the power connection layer is located on the fixing portion, and the voice coil lead connection layer is located on the center portion; or
  • the power connection layer is located on the central portion, and the voice coil lead connection layer is located on the fixed portion.
  • the conductive diaphragm includes at least one substrate layer and at least one auxiliary layer;
  • the conductive layer, the power connection layer and the voice coil lead connection layer are all located on the substrate layer;
  • the substrate layer and the auxiliary layer are stacked.
  • the conductive diaphragm further includes at least one adhesive layer
  • the glue layer is positioned between the substrate layer and the auxiliary layer to composite the substrate layer and the auxiliary layer.
  • the conductive layer has a thickness of 2-25 ⁇ m.
  • the power connection layer and the voice coil lead connection layer have a thickness of 10-45 ⁇ m.
  • a speaker is provided.
  • the speaker includes a vibrating voice coil and the conductive diaphragm of the present invention
  • the voice coil lead of the vibrating voice coil is electrically connected to the voice coil lead connection layer.
  • a method of manufacturing a conductive diaphragm is provided.
  • the manufacturing method of the conductive diaphragm includes the following steps:
  • Step S1 forming a conductive layer on the substrate layer by printing a conductive ink
  • Step S2 forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate ;
  • Step S3 forming the diaphragm substrate into a conductive diaphragm, and at least partially conducting the conductive layer on the folded portion of the conductive diaphragm, and the power connection layer and the voice coil lead connecting layer are located outside the folded portion of the conductive diaphragm .
  • step S2 includes:
  • Step S2-1 compounding the substrate layer and the auxiliary layer
  • Step S2-2 forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the composite substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located at the diaphragm base On the outer surface of the material.
  • step S2 includes:
  • Step S2-1 forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer;
  • Step S2-2 combining the substrate layer and the auxiliary layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate.
  • the power connection layer in the step S3 is located on the fixed portion of the conductive diaphragm, and the voice coil lead connection layer is located on the central portion of the conductive diaphragm;
  • the power supply connection layer in step S3 is located on the central portion of the conductive diaphragm, and the voice coil lead connection layer is located on the fixed portion of the conductive diaphragm.
  • the voice coil lead connection layer on the conductive type diaphragm can be connected to the voice coil lead of the vibrating voice coil, and the power supply connection layer of the conductive type diaphragm can be connected to the power supply device, thereby achieving the direction through the conductive layer Vibrating voice coil power supply.
  • the voice coil lead wires of the present disclosure are short, which is advantageous for simplifying the design and processing of the voice coil leads and avoiding the smooth operation of the voice coil leads.
  • the short lead wire of the voice coil is also beneficial to effectively avoid the problem of the broken voice coil lead caused by the vibration of the voice coil of the voice coil, which improves the service life of the speaker.
  • FIG. 1 is a schematic structural view of an embodiment of a conductive diaphragm of the present disclosure.
  • Figure 2 is a partial enlarged view of Figure 1.
  • Fig. 3 is a flow chart showing a method of manufacturing a conductive diaphragm of the present disclosure.
  • the present disclosure provides a conductive diaphragm.
  • the conductive diaphragm 1 of the present disclosure includes a folded portion 14, a fixed portion 15, and a central portion 16.
  • the conductive diaphragm 1 is provided with a conductive layer 11, a power supply connection layer 12, and a voice coil lead connection layer 13.
  • the conductive layer 11 can be formed by printing a conductive ink.
  • Both the power supply connection layer 12 and the voice coil lead connection layer 13 are made of a conductive material.
  • the above conductive material may be, for example, a metal material or a conductive paste or the like.
  • both the power supply connection layer 12 and the voice coil lead connection layer 13 are tin layers, that is, the power supply connection layer 12 and the voice coil lead connection layer 13 are both made of a tin material.
  • the power supply connection layer 12 and the voice coil lead connection layer 13 may be formed by spot welding, coating or electroplating, and may of course be formed in other manners, which is not limited in the present invention.
  • the power supply connection layer 12 and the voice coil lead connection layer 13 may be connected to the conductive layer 11 by being in contact with the edge of the conductive layer 11.
  • the power connection layer 12 and the voice coil lead connection layer 13 may be connected to the conductive layer 11 by being overlaid on the portion of the conductive layer 11.
  • the shape and position of the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 can be set according to actual needs.
  • the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 each have a rectangular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 are respectively in contact with both ends of the conductive layer 11 in the longitudinal direction.
  • the conductive layer 11 has a circular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 have a rectangular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 overlap the edges of the conductive layer 11.
  • At least a portion of the conductive layer 11 is located on the folded portion 14 of the conductive diaphragm 1.
  • the power supply connection layer 12 and the voice coil lead connection layer 13 are located outside the folded portion 14 of the conductive diaphragm 1.
  • the power supply connection layer 12 and the voice coil lead connection layer 13 are located outside the folded portion 14 of the conductive diaphragm 1 to effectively prevent the influence of the soldering operation on the acoustic performance of the conductive diaphragm 1.
  • the power connection layer 12 and the voice coil lead connection layer 13 may both be located on the fixed portion 15 or the central portion 16 of the conductive diaphragm 1, or the power connection layer 12 and the voice coil lead connection layer 13 may be respectively located at the fixing portion 15 And on the center 16th.
  • Both the power supply connection layer 12 and the voice coil lead connection layer 13 are connected to the conductive layer 11, and the power supply connection layer 12 and the voice coil lead connection layer 13 are both located on the outer surface of the conductive type diaphragm 1.
  • the position of the conductive layer 11 can be flexibly set according to actual needs.
  • the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 12 are all located on the outer surface of the conductive diaphragm 1.
  • the conductive layer 11 is located in the conductive diaphragm 1
  • the power connection layer 12 and the voice coil lead connecting layer 12 are located on the outer surface of the conductive diaphragm 1 to ensure that other devices can be connected to the power connection layer 12 and the voice coil lead.
  • Layer 12 is electrically connected.
  • the voice coil lead connecting layer 13 on the conductive diaphragm 1 can be connected to the voice coil lead of the vibrating voice coil, and the power supply connecting layer 12 of the conductive diaphragm 1 can be connected to the power supply device.
  • the connection is made to supply power to the vibrating voice coil through the conductive layer 11.
  • the voice coil lead is connected to the pad on the outer casing, and the distance between the vibrating voice coil of the present disclosure and the conductive diaphragm 1 is close, so that the voice coil lead is routed. Short, it helps to simplify the design and processing of the voice coil leads, and avoids the smooth operation of the voice coil leads.
  • the short lead wire of the voice coil is also beneficial to avoid the problem of the broken voice coil lead caused by the vibration of the voice coil of the voice coil, which improves the service life of the speaker.
  • the power supply connection layer 12 is located on the fixed portion 15 of the conductive diaphragm 1, and the voice coil lead connection layer 13 is located on the central portion 16 of the conductive diaphragm 1.
  • the power supply connection layer 12 is located on the central portion 16 of the conductive diaphragm 1, and the voice coil lead connection layer 13 is located on the fixed portion 15 of the conductive diaphragm 1.
  • the power supply connection layer 12 and the voice coil lead connection layer 13 are located at different portions of the conductive diaphragm 1, which facilitates the convenience of connecting the power supply connection layer 12 and the voice coil lead connection layer 13 to the leads or other components.
  • the conductive diaphragm 1 of the present disclosure may be a single-layer diaphragm, that is, the diaphragm is made of only a single material.
  • the conductive diaphragm 1 may be a composite diaphragm, that is, the diaphragm is made of a plurality of different materials.
  • the conductive diaphragm 1 comprises at least one substrate layer and at least one auxiliary layer.
  • the substrate layer can be formed from materials commonly used in the field of speaker diaphragms.
  • the material of the substrate layer is PEEK (Polyetheretherketone), PAR (polyaryl acrylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS ( Polyphenylene sulfide, polyphenylene sulfide (PEN), PEN (Polyethylene naphthalate two formic acid glycol ester), PET (Polyethylene terephthalate), and the like.
  • the thickness of the substrate layer is optionally from 3 to 15 ⁇ m.
  • the material of the auxiliary layer may be the same as or different from the substrate layer.
  • the auxiliary layer is made of PEEK (Polyetheretherketone), PAR (polyaryl acrylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS (Polyphenylene). Sulfide, polyphenylene sulfide, PEN (Polyethylene naphthalate two formic acid glycol ester), PET (polyethylene terephthalate), and the like.
  • the material of the auxiliary layer is an elastomer material such as TPE (Thermoplastic Elastomer), TPU (Thermoplastic polyurethanes), TPEE (thermoplastic polyester elastomer), or the like.
  • the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 are all located on the substrate layer.
  • the substrate layer and the auxiliary layer are stacked.
  • the power supply connection layer 12 and the voice coil lead connection layer 12 are located on the outer surface of the conductive diaphragm 1;
  • the conductive layer 11 may be located on the outer surface of the conductive diaphragm 1, or the conductive layer 11 is located in the conductive diaphragm 1 in.
  • the conductive diaphragm 1 includes two base layers and an auxiliary layer, and the auxiliary layer is sandwiched between the two base layers, and the conductive layer 11 and the power connection layer 12 may be disposed on the two base layers.
  • the voice coil lead connection layer 13 the conductive diaphragm 1 includes a base material layer and two auxiliary layers, and one base material layer and two auxiliary layers are sequentially disposed.
  • the conductive diaphragm 1 further includes at least one adhesive layer.
  • a glue layer is positioned between the substrate layer and the auxiliary layer to composite the substrate layer and the auxiliary layer.
  • the glue layer functions as an adhesive substrate layer and an auxiliary layer.
  • the material of the glue layer may be acrylic glue or silica gel.
  • the conductive layer 11 has a thickness of 2 to 25 ⁇ m to ensure the conductive effect without affecting the acoustic performance of the conductive diaphragm 1 .
  • the thickness of the power supply connection layer 12 and the voice coil lead connection layer 13 is 10-45 ⁇ m to effectively control the cost while ensuring normal soldering of the layer.
  • the present disclosure also provides a speaker.
  • the speaker diaphragm includes a vibrating voice coil and the conductive diaphragm 1 of the present disclosure.
  • the voice coil lead of the vibrating voice coil is electrically connected to the voice coil lead connecting layer 13.
  • the power connection layer 12 can be connected to the power supply device to supply power to the vibrating voice coil through the conductive layer 11.
  • the distance between the vibrating voice coil of the speaker diaphragm of the present disclosure and the conductive diaphragm 1 is short, so that the wiring of the voice coil lead is short, which is advantageous for simplifying the design and processing of the voice coil lead, and avoiding the smoothing of the voice coil lead. operating.
  • the short lead wire of the voice coil is also beneficial to effectively avoid the problem of the broken voice coil lead caused by the vibration of the voice coil of the voice coil, which improves the service life of the speaker.
  • the present disclosure also provides a method of manufacturing a conductive diaphragm.
  • the conductive diaphragm includes the following steps:
  • Step S1 forming a conductive layer on the substrate layer by printing a conductive ink.
  • the substrate layer may have a single layer structure, or the substrate layer may be a multilayer structure composed of a plurality of structural layers having the same material or different materials.
  • the material of the substrate layer can be flexibly selected according to actual needs.
  • the material of the substrate layer is PEEK (Polyetheretherketone), PAR (polyarylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS (Polyphenylene sulfide, polyphenylene sulfide), PEN (Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate), PET (Polyethylene terephthalate, poly(p-phenylene terephthalate) Ethylene glycolate).
  • PEEK Polyetheretherketone
  • PAR polyarylate
  • PEI Polyetherimide, polyetherimide
  • PI Polyimide, polyimide
  • PPS Polyphenylene sulfide
  • PEN Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate
  • PET Polyethylene terephthalate, poly(p-phenylene terephthalate) Ethylene glycolate
  • the shape of the conductive layer 11 can be set according to actual needs.
  • the conductive layer has a rectangular shape.
  • the conductive layer has a circular shape.
  • the above conductive layer may be, for example, a nano silver paste or the like. Of course, it can also be other materials that can conduct electricity, and the present invention does not limit this.
  • Step S2 forming a power supply connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer obtained in the step S1 to obtain a diaphragm substrate.
  • the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate to ensure that other devices can be electrically connected to the power connection layer and the voice coil lead connection layer.
  • the conductive layer may be on the outer surface of the diaphragm substrate, or the conductive layer may be located in the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate.
  • the power supply connection layer and the voice coil lead connection layer may be formed by spot welding, coating or electroplating, and may of course be formed in other manners, which is not limited in the present invention. Both the power connection layer and the voice coil lead connection layer are connected to the conductive layer.
  • the power connection layer and the voice coil lead connection layer may be connected to the conductive layer by being in contact with the edge of the conductive layer. Alternatively, the power connection layer and the voice coil lead connection layer may be connected to the conductive layer by being overlaid on a portion of the conductive layer.
  • the shape of the power connection layer and the voice coil lead connection layer can be set according to actual needs.
  • the power supply connection layer, the voice coil lead connection layer, and the conductive layer each have a rectangular shape, and the power supply connection layer and the voice coil lead connection layer are respectively in contact with both ends of the conductive layer in the longitudinal direction.
  • the power connection layer and the voice coil lead connection layer have a rectangular shape
  • the conductive layer has a circular shape
  • the power connection layer and the voice coil lead connection layer overlap the edges of the conductive layer.
  • Step S3 forming the diaphragm substrate obtained in step S2 into a conductive diaphragm, and at least partially conducting the conductive layer on the folded portion of the conductive diaphragm, and the power connection layer and the voice coil lead connecting layer are located on the conductive diaphragm Outside the folding ring.
  • the power connection layer and the voice coil lead connection layer are located outside the folded portion of the conductive diaphragm to effectively prevent the influence of the soldering operation on the acoustic performance of the conductive diaphragm.
  • the power connection layer and the voice coil lead connection layer may both be located on the fixed portion or the central portion of the conductive diaphragm, or the power connection layer and the voice coil lead connection layer may be respectively located on the fixed portion and the central portion.
  • the method of manufacturing the conductive diaphragm of the present disclosure is simple in operation and easy to implement.
  • the conductive diaphragm obtained by the manufacturing method of the conductive diaphragm can be connected to the voice coil lead of the vibrating voice coil through the voice coil lead connecting layer, and the conductive diaphragm can be connected to the power supply device through the power supply connection layer, thereby The conductive diaphragm is supplied to the vibrating voice coil through the conductive layer.
  • This conductive diaphragm reduces the routing of the voice coil leads, which simplifies the design and processing of the voice coil leads and avoids the smooth operation of the voice coil leads.
  • the short lead wire of the voice coil is also beneficial to effectively avoid the problem of the broken voice coil lead caused by the vibration of the voice coil lead due to the vibration of the vibrating voice coil, thereby improving the service life of the speaker.
  • step S2 includes:
  • Step S2-1 compounding the substrate layer and the auxiliary layer.
  • Step S2-2 forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the composite substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located at the diaphragm base On the outer surface of the material.
  • the conductive layer may be on the outer surface of the diaphragm substrate, or the conductive layer may be located in the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate.
  • the substrate layer is an intermediate layer of the diaphragm substrate, and an opening for exposing a portion of the conductive layer should be opened on the auxiliary layer to enable the power connection layer and the voice coil lead connection layer Can be connected to the conductive layer.
  • step S2 includes:
  • Step S2-1 forming a power supply connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer.
  • Step S2-2 combining the substrate layer and the auxiliary layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate.
  • the conductive layer in the present disclosure may be on the outer surface of the diaphragm substrate, or the conductive layer may be located in the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate.
  • the substrate layer is an intermediate layer of the diaphragm substrate, and an opening for exposing a portion of the conductive layer should be opened on the auxiliary layer to enable the power connection layer on the substrate layer
  • the voice coil lead connection layer is exposed on the outer surface of the diaphragm substrate.
  • the conductive diaphragm includes two base layers and an auxiliary layer, and the auxiliary layer is sandwiched between the two base layers, and the two base layers may be provided with a conductive layer, a power connection layer, and a voice coil lead. Connection layer.
  • the conductive diaphragm includes a base material layer and two auxiliary layers, and the base material layer is sandwiched between the two auxiliary layers.
  • the substrate layer and the auxiliary layer may be bonded together by a glue layer of a material such as acrylic rubber or silica gel, or may be compounded by hot pressing.
  • the material of the auxiliary layer in the present disclosure may be the same as or different from the material of the substrate layer.
  • the material of the auxiliary layer can be, for example, PEEK (Polyetheretherketone), PAR (polyaryl acrylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS (Polyphenylene). Sulfide, polyphenylene sulfide, PEN (Polyethylene naphthalate two formic acid glycol ester), PET (polyethylene terephthalate), and the like.
  • the material of the auxiliary diaphragm material is an elastomer material such as TPE (Thermoplastic Elastomer), TPU (Thermoplastic polyurethanes), TPEE (thermoplastic polyester elastomer), or the like.
  • the power supply connection layer in step S3 is located on the fixed portion of the conductive diaphragm, and the voice coil lead connection layer is located on the central portion of the conductive diaphragm.
  • the power supply connection layer in the step S3 is located on the central portion of the conductive diaphragm, and the voice coil lead connection layer is located on the fixed portion of the conductive diaphragm.
  • the power connection layer and the voice coil lead connection layer are located at different parts of the conductive diaphragm, which is convenient for improving the connection of the power connection layer and the voice coil lead connection layer with the lead or other components.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

Disclosed are a conductive diaphragm, a loudspeaker, and a method for manufacturing the conductive diaphragm. The conductive diaphragm comprises a bent annular portion, a fixing portion and a central portion, and a conductive layer, a power supply connecting layer and a voice coil lead connecting layer are provided on the conductive diaphragm, wherein at least a part of the conductive layer is located on the bent annular portion; the power supply connecting layer and the voice coil lead connecting layer are located outside the bent annular portion; and the power supply connecting layer and the voice coil lead connecting layer are both connected to the conductive layer, and the power supply connecting layer and the voice coil lead connecting layer are both located on an outer surface of the conductive diaphragm. The voice coil lead connecting layer on the conductive diaphragm of the present disclosure may be connected to a voice coil lead of a vibrating voice coil. The voice coil lead of the present disclosure is short in wiring, thus facilitating the simplification of design and processing of the voice coil lead and eliminating a smoothing operation on the voice coil lead.

Description

一种导电型振膜、扬声器及导电型振膜的制造方法Conductive diaphragm, speaker and method for manufacturing conductive diaphragm 技术领域Technical field
本发明涉及扬声器振膜领域,更具体地,涉及一种导电型振膜、扬声器及导电型振膜的制造方法。The present invention relates to the field of speaker diaphragms, and more particularly to a method of manufacturing a conductive diaphragm, a speaker, and a conductive diaphragm.
背景技术Background technique
扬声器作为一种用于手机、电视、计算机等电子产品的发声器件,被广泛应用于人们的日常生产和生活中。As a sound-emitting device for electronic products such as mobile phones, televisions, computers, etc., speakers are widely used in people's daily production and life.
扬声器振动系统的音圈通过引线与位于外壳上的柔性印刷电路板的焊盘连接。音圈引线走线长,为了防止音圈引线与周边部件相干涉,设计时需要严格地规划出音圈引线的行走路线,并在加工时需要对音圈引线进行顺线操作,设计和加工均较为不便。The voice coil of the speaker vibration system is connected by leads to the pads of the flexible printed circuit board located on the housing. The voice coil lead wire is long. In order to prevent the voice coil lead from interfering with the peripheral components, the travel path of the voice coil lead must be strictly planned during design, and the voice coil lead wire needs to be operated in line during processing, and the design and processing are both More inconvenient.
因此,简化音圈引线的设计和加工成为本领域亟需解决的技术难题。Therefore, simplifying the design and processing of voice coil leads has become a technical problem that needs to be solved in the field.
发明内容Summary of the invention
本发明的一个目的是提供一种可有效简化音圈引线设计和加工的导电型振膜的新技术方案。SUMMARY OF THE INVENTION An object of the present invention is to provide a new technical solution for a conductive diaphragm which can effectively simplify the design and processing of a voice coil lead.
根据本发明的第一方面,提供了一种导电型振膜。According to a first aspect of the invention, a conductive diaphragm is provided.
该导电型振膜包括折环部、固定部和中心部,导电型振膜的表面上设有导电层、供电连接层和音圈引线连接层,所述供电连接层和所述音圈引线连接层均由导电材料制成;其中,The conductive diaphragm includes a folding ring portion, a fixing portion and a center portion, and a surface of the conductive diaphragm is provided with a conductive layer, a power supply connecting layer and a voice coil lead connecting layer, the power supply connecting layer and the voice coil lead connecting layer Made of a conductive material;
至少部分所述导电层位于所述折环部上;At least a portion of the conductive layer is located on the folded portion;
所述供电连接层和所述音圈引线连接层位于所述折环部外;The power connection layer and the voice coil lead connection layer are located outside the folded ring portion;
所述供电连接层和所述音圈引线连接层均与所述导电层相连接,且所述供电连接层和所述音圈引线连接层均位于所述导电型振膜的外表面 上。The power connection layer and the voice coil lead connection layer are both connected to the conductive layer, and the power connection layer and the voice coil lead connection layer are both located on an outer surface of the conductive diaphragm.
可选地,所述供电连接层位于所述固定部上,所述音圈引线连接层位于所述中心部上;或者,Optionally, the power connection layer is located on the fixing portion, and the voice coil lead connection layer is located on the center portion; or
所述供电连接层位于所述中心部上,所述音圈引线连接层位于所述固定部上。The power connection layer is located on the central portion, and the voice coil lead connection layer is located on the fixed portion.
可选地,所述导电型振膜包括至少一层基材层和至少一层辅助层;Optionally, the conductive diaphragm includes at least one substrate layer and at least one auxiliary layer;
所述导电层、所述供电连接层和所述音圈引线连接层均位于所述基材层上;The conductive layer, the power connection layer and the voice coil lead connection layer are all located on the substrate layer;
所述基材层和所述辅助层层叠设置。The substrate layer and the auxiliary layer are stacked.
可选地,所述导电型振膜还包括至少一层胶层;Optionally, the conductive diaphragm further includes at least one adhesive layer;
所述胶层位于所述基材层和所述辅助层之间,以将所述基材层和所述辅助层复合在一起。The glue layer is positioned between the substrate layer and the auxiliary layer to composite the substrate layer and the auxiliary layer.
可选地,所述导电层的厚度为2-25μm。Optionally, the conductive layer has a thickness of 2-25 μm.
可选地,所述供电连接层和所述音圈引线连接层的厚度为10-45μm。Optionally, the power connection layer and the voice coil lead connection layer have a thickness of 10-45 μm.
根据本发明的第二方面,提供了一种扬声器。According to a second aspect of the invention, a speaker is provided.
该扬声器包括振动音圈和本发明的导电型振膜;The speaker includes a vibrating voice coil and the conductive diaphragm of the present invention;
所述振动音圈的音圈引线与所述音圈引线连接层电连接。The voice coil lead of the vibrating voice coil is electrically connected to the voice coil lead connection layer.
根据本发明的第三方面,提供了一种导电型振膜的制造方法。According to a third aspect of the invention, a method of manufacturing a conductive diaphragm is provided.
该导电型振膜的制造方法包括如下步骤:The manufacturing method of the conductive diaphragm includes the following steps:
步骤S1:通过印刷导电油墨在基材层上形成导电层;Step S1: forming a conductive layer on the substrate layer by printing a conductive ink;
步骤S2:在基材层上形成与导电层连接在一起的供电连接层和音圈引线连接层,得到振膜基材,其中,供电连接层和音圈引线连接层位于振膜基材的外表面上;Step S2: forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate ;
步骤S3:将振膜基材制成导电型振膜,并使得至少部分导电层位于导电型振膜的折环部上,供电连接层和音圈引线连接层位于导电型振膜的折环部外。Step S3: forming the diaphragm substrate into a conductive diaphragm, and at least partially conducting the conductive layer on the folded portion of the conductive diaphragm, and the power connection layer and the voice coil lead connecting layer are located outside the folded portion of the conductive diaphragm .
可选地,所述步骤S2包括:Optionally, the step S2 includes:
步骤S2-1:将基材层和辅助层复合;Step S2-1: compounding the substrate layer and the auxiliary layer;
步骤S2-2:在复合后的基材层上形成与导电层连接在一起的供电连接层和音圈引线连接层,得到振膜基材,其中,供电连接层和音圈引线连接层位于振膜基材的外表面上。Step S2-2: forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the composite substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located at the diaphragm base On the outer surface of the material.
可选地,所述步骤S2包括:Optionally, the step S2 includes:
步骤S2-1:在基材层上形成与导电层连接在一起的供电连接层和音圈引线连接层;Step S2-1: forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer;
步骤S2-2:将基材层和辅助层复合,得到振膜基材,其中,供电连接层和音圈引线连接层位于振膜基材的外表面上。Step S2-2: combining the substrate layer and the auxiliary layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate.
可选地,所述步骤S3中的供电连接层位于导电型振膜的固定部上,音圈引线连接层位于导电型振膜的中心部上;或者,Optionally, the power connection layer in the step S3 is located on the fixed portion of the conductive diaphragm, and the voice coil lead connection layer is located on the central portion of the conductive diaphragm; or
步骤S3中的供电连接层位于导电型振膜的中心部上,音圈引线连接层位于导电型振膜的固定部上。The power supply connection layer in step S3 is located on the central portion of the conductive diaphragm, and the voice coil lead connection layer is located on the fixed portion of the conductive diaphragm.
根据本公开的一个实施例,导电型振膜上的音圈引线连接层可与振动音圈的音圈引线连接,导电型振膜的供电连接层可与供电器件连接,从而通过导电层实现向振动音圈供电。本公开的音圈引线走线短,有利于简化音圈引线的设计和加工,避免对音圈引线进行顺线操作。According to an embodiment of the present disclosure, the voice coil lead connection layer on the conductive type diaphragm can be connected to the voice coil lead of the vibrating voice coil, and the power supply connection layer of the conductive type diaphragm can be connected to the power supply device, thereby achieving the direction through the conductive layer Vibrating voice coil power supply. The voice coil lead wires of the present disclosure are short, which is advantageous for simplifying the design and processing of the voice coil leads and avoiding the smooth operation of the voice coil leads.
此外,音圈引线走线短还有利于有效避免因音圈引线受到振动音圈的振动影响导致的音圈引线断线问题,提高了扬声器的使用寿命。In addition, the short lead wire of the voice coil is also beneficial to effectively avoid the problem of the broken voice coil lead caused by the vibration of the voice coil of the voice coil, which improves the service life of the speaker.
通过以下参照附图对本发明的示例性实施例的详细描述,本发明的其它特征及其优点将会变得清楚。Other features and advantages of the present invention will become apparent from the Detailed Description of the <RTIgt;
附图说明DRAWINGS
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例,并且连同其说明一起用于解释本发明的原理。The accompanying drawings, which are incorporated in FIG
图1为本公开导电型振膜实施例的结构示意图。FIG. 1 is a schematic structural view of an embodiment of a conductive diaphragm of the present disclosure.
图2为图1的局部放大图。Figure 2 is a partial enlarged view of Figure 1.
图3为本公开导电型振膜的制造方法的流程图。Fig. 3 is a flow chart showing a method of manufacturing a conductive diaphragm of the present disclosure.
图中标示如下:The figures are as follows:
导电型振膜-1,导电层-11,供电连接层-12,音圈引线连接层-13,折环部-14,固定部-15,中心部-16。Conductive diaphragm-1, conductive layer-11, power supply connection layer-12, voice coil lead connection layer-13, folding ring portion-14, fixing portion -15, center portion-16.
具体实施方式Detailed ways
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到:除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。Various exemplary embodiments of the present invention will now be described in detail with reference to the drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions and numerical values set forth in the embodiments are not intended to limit the scope of the invention unless otherwise specified.
以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本发明及其应用或使用的任何限制。The following description of the at least one exemplary embodiment is merely illustrative and is in no way
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论,但在适当情况下,技术、方法和设备应当被视为说明书的一部分。Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and devices should be considered as part of the specification.
在这里示出和讨论的所有例子中,任何具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它例子可以具有不同的值。In all of the examples shown and discussed herein, any specific values are to be construed as illustrative only and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。It should be noted that similar reference numerals and letters indicate similar items in the following figures, and therefore, once an item is defined in one figure, it is not required to be further discussed in the subsequent figures.
如图1和图2所示,本公开提供了一种导电型振膜。As shown in FIGS. 1 and 2, the present disclosure provides a conductive diaphragm.
本公开的导电型振膜1包括折环部14、固定部15和中心部16。导电型振膜1的设有导电层11、供电连接层12和音圈引线连接层13。导电层11可通过印刷导电油墨的方式形成。供电连接层12和音圈引线连接层13均由导电材料制成。上述导电材料,例如,可以为金属材料或导电胶等。特别地,供电连接层12和音圈引线连接层13均为锡层,即供电连接层12和音圈引线连接层13均由锡材料制成。供电连接层12和音圈引线连接层13可通过点焊、涂布或电镀的方式形成,当然还可以是其他方式形成,本发明对此不做限制。The conductive diaphragm 1 of the present disclosure includes a folded portion 14, a fixed portion 15, and a central portion 16. The conductive diaphragm 1 is provided with a conductive layer 11, a power supply connection layer 12, and a voice coil lead connection layer 13. The conductive layer 11 can be formed by printing a conductive ink. Both the power supply connection layer 12 and the voice coil lead connection layer 13 are made of a conductive material. The above conductive material may be, for example, a metal material or a conductive paste or the like. In particular, both the power supply connection layer 12 and the voice coil lead connection layer 13 are tin layers, that is, the power supply connection layer 12 and the voice coil lead connection layer 13 are both made of a tin material. The power supply connection layer 12 and the voice coil lead connection layer 13 may be formed by spot welding, coating or electroplating, and may of course be formed in other manners, which is not limited in the present invention.
供电连接层12和音圈引线连接层13可通过与导电层11的边缘相接的方式与导电层11连接在一起。或者,供电连接层12和音圈引线连接层 13可通过覆盖在部分导电层11上的方式与导电层11连接在一起。The power supply connection layer 12 and the voice coil lead connection layer 13 may be connected to the conductive layer 11 by being in contact with the edge of the conductive layer 11. Alternatively, the power connection layer 12 and the voice coil lead connection layer 13 may be connected to the conductive layer 11 by being overlaid on the portion of the conductive layer 11.
导电层11、供电连接层12和音圈引线连接层13的形状和位置可根据实际需求设置。例如,导电层11、供电连接层12和音圈引线连接层13均具有矩形形状,且供电连接层12和音圈引线连接层13分别与导电层11的长度方向的两端相接。又例如,导电层11具有圆形形状,供电连接层12和音圈引线连接层13具有矩形形状,且供电连接层12和音圈引线连接层13与导电层11的边缘搭接。The shape and position of the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 can be set according to actual needs. For example, the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 each have a rectangular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 are respectively in contact with both ends of the conductive layer 11 in the longitudinal direction. For another example, the conductive layer 11 has a circular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 have a rectangular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 overlap the edges of the conductive layer 11.
至少部分导电层11位于导电型振膜1的折环部14上。供电连接层12和音圈引线连接层13位于导电型振膜1的折环部14外。供电连接层12和音圈引线连接层13位于导电型振膜1的折环部14外可有效防止焊接操作对导电型振膜1的声学性能的影响。具体实施时,供电连接层12和音圈引线连接层13可均位于导电型振膜1的固定部15或中心部16上,或者,供电连接层12和音圈引线连接层13可分别位于固定部15和中心部16上。At least a portion of the conductive layer 11 is located on the folded portion 14 of the conductive diaphragm 1. The power supply connection layer 12 and the voice coil lead connection layer 13 are located outside the folded portion 14 of the conductive diaphragm 1. The power supply connection layer 12 and the voice coil lead connection layer 13 are located outside the folded portion 14 of the conductive diaphragm 1 to effectively prevent the influence of the soldering operation on the acoustic performance of the conductive diaphragm 1. In a specific implementation, the power connection layer 12 and the voice coil lead connection layer 13 may both be located on the fixed portion 15 or the central portion 16 of the conductive diaphragm 1, or the power connection layer 12 and the voice coil lead connection layer 13 may be respectively located at the fixing portion 15 And on the center 16th.
供电连接层12和音圈引线连接层13均与导电层11相连接,且供电连接层12和音圈引线连接层13均位于导电型振膜1的外表面上。导电层11的位置可根据实际需求灵活设置。例如,导电层11、供电连接层12和音圈引线连接层12均位于导电型振膜1的外表面上。又例如,导电层11位于导电型振膜1之中,供电连接层12和音圈引线连接层12位于导电型振膜1的外表面上,以保证其它器件可与供电连接层12和音圈引线连接层12电连接。Both the power supply connection layer 12 and the voice coil lead connection layer 13 are connected to the conductive layer 11, and the power supply connection layer 12 and the voice coil lead connection layer 13 are both located on the outer surface of the conductive type diaphragm 1. The position of the conductive layer 11 can be flexibly set according to actual needs. For example, the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 12 are all located on the outer surface of the conductive diaphragm 1. For another example, the conductive layer 11 is located in the conductive diaphragm 1, and the power connection layer 12 and the voice coil lead connecting layer 12 are located on the outer surface of the conductive diaphragm 1 to ensure that other devices can be connected to the power connection layer 12 and the voice coil lead. Layer 12 is electrically connected.
振动音圈与导电型振膜1连接时,导电型振膜1上的音圈引线连接层13可与振动音圈的音圈引线连接,导电型振膜1的供电连接层12可与供电器件连接,从而通过导电层11实现向振动音圈供电。相较于现有技术中的振动音圈通过音圈引线与外壳上的焊盘连接的方式,本公开的振动音圈与导电型振膜1之间的距离近,使得音圈引线的走线短,有利于简化音圈引线的设计和加工,避免对音圈引线进行顺线操作。When the vibrating voice coil is connected to the conductive diaphragm 1, the voice coil lead connecting layer 13 on the conductive diaphragm 1 can be connected to the voice coil lead of the vibrating voice coil, and the power supply connecting layer 12 of the conductive diaphragm 1 can be connected to the power supply device. The connection is made to supply power to the vibrating voice coil through the conductive layer 11. Compared with the vibration coil of the prior art, the voice coil lead is connected to the pad on the outer casing, and the distance between the vibrating voice coil of the present disclosure and the conductive diaphragm 1 is close, so that the voice coil lead is routed. Short, it helps to simplify the design and processing of the voice coil leads, and avoids the smooth operation of the voice coil leads.
此外,音圈引线走线短还有利于有效避免因音圈引线受到振动音圈 的振动影响导致的音圈引线断线问题,提高了扬声器的使用寿命。In addition, the short lead wire of the voice coil is also beneficial to avoid the problem of the broken voice coil lead caused by the vibration of the voice coil of the voice coil, which improves the service life of the speaker.
可选地,供电连接层12位于导电型振膜1的固定部15上,音圈引线连接层13位于导电型振膜1的中心部16上。或者,供电连接层12位于导电型振膜1的中心部16上,音圈引线连接层13位于导电型振膜1的固定部15上。供电连接层12和音圈引线连接层13位于导电型振膜1的不同部位,有利于提高供电连接层12和音圈引线连接层13与引线或其它部件连接的便利性。Alternatively, the power supply connection layer 12 is located on the fixed portion 15 of the conductive diaphragm 1, and the voice coil lead connection layer 13 is located on the central portion 16 of the conductive diaphragm 1. Alternatively, the power supply connection layer 12 is located on the central portion 16 of the conductive diaphragm 1, and the voice coil lead connection layer 13 is located on the fixed portion 15 of the conductive diaphragm 1. The power supply connection layer 12 and the voice coil lead connection layer 13 are located at different portions of the conductive diaphragm 1, which facilitates the convenience of connecting the power supply connection layer 12 and the voice coil lead connection layer 13 to the leads or other components.
本公开的导电型振膜1可为单层型振膜,即振膜仅由单一的材料制成。或者,导电型振膜1可为复合型振膜,即振膜由多种不同的材料制成。可选地,导电型振膜1包括至少一层基材层和至少一层辅助层。基材层可由扬声器振膜领域常用的材料形成。例如,基材层的材质为PEEK(Polyetheretherketone,聚醚醚酮)、PAR(聚芳基酸酯)、PEI(Polyetherimide,聚醚酰亚胺)、PI(Polyimide,聚酰亚胺)、PPS(Polyphenylene sulfide,聚苯硫醚)、PEN(Polyethylene naphthalate two formic acid glycol ester,聚萘二甲酸乙二醇酯)、PET(Polyethylene terephthalate,聚对苯二甲酸乙二醇酯)等。基材层的厚度可选地为3-15μm。辅助层的材质可与基材层的相同或不同。例如,辅助层的材质为PEEK(Polyetheretherketone,聚醚醚酮)、PAR(聚芳基酸酯)、PEI(Polyetherimide,聚醚酰亚胺)、PI(Polyimide,聚酰亚胺)、PPS(Polyphenylene sulfide,聚苯硫醚)、PEN(Polyethylene naphthalate two formic acid glycol ester,聚萘二甲酸乙二醇酯)、PET(Polyethylene terephthalate,聚对苯二甲酸乙二醇酯)等。又例如,辅助层的材质为弹性体材料,如TPE(Thermoplastic Elastomer,热塑性弹性体)、TPU(Thermoplastic polyurethanes,热塑性聚氨酯弹性体橡胶)、TPEE(热塑性聚酯弹性体)等。The conductive diaphragm 1 of the present disclosure may be a single-layer diaphragm, that is, the diaphragm is made of only a single material. Alternatively, the conductive diaphragm 1 may be a composite diaphragm, that is, the diaphragm is made of a plurality of different materials. Optionally, the conductive diaphragm 1 comprises at least one substrate layer and at least one auxiliary layer. The substrate layer can be formed from materials commonly used in the field of speaker diaphragms. For example, the material of the substrate layer is PEEK (Polyetheretherketone), PAR (polyaryl acrylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS ( Polyphenylene sulfide, polyphenylene sulfide (PEN), PEN (Polyethylene naphthalate two formic acid glycol ester), PET (Polyethylene terephthalate), and the like. The thickness of the substrate layer is optionally from 3 to 15 μm. The material of the auxiliary layer may be the same as or different from the substrate layer. For example, the auxiliary layer is made of PEEK (Polyetheretherketone), PAR (polyaryl acrylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS (Polyphenylene). Sulfide, polyphenylene sulfide, PEN (Polyethylene naphthalate two formic acid glycol ester), PET (polyethylene terephthalate), and the like. Further, for example, the material of the auxiliary layer is an elastomer material such as TPE (Thermoplastic Elastomer), TPU (Thermoplastic polyurethanes), TPEE (thermoplastic polyester elastomer), or the like.
导电层11、供电连接层12和音圈引线连接层13均位于基材层上。基材层和辅助层层叠设置。在此,供电连接层12和音圈引线连接层12位于导电型振膜1的外表面上;导电层11可位于导电型振膜1的外表面上, 或者导电层11位于导电型振膜1之中。The conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 are all located on the substrate layer. The substrate layer and the auxiliary layer are stacked. Here, the power supply connection layer 12 and the voice coil lead connection layer 12 are located on the outer surface of the conductive diaphragm 1; the conductive layer 11 may be located on the outer surface of the conductive diaphragm 1, or the conductive layer 11 is located in the conductive diaphragm 1 in.
基材层和辅助层的数量可根据实际需求灵活选择。例如,导电型振膜1包括两层基材层和一层辅助层,辅助层夹设于两层基材层之间,两层基材层上均可设有导电层11、供电连接层12和音圈引线连接层13。又例如,导电型振膜1包括一层基材层和两层辅助层,一层基材层和两层辅助层顺次设置。The number of substrate layers and auxiliary layers can be flexibly selected according to actual needs. For example, the conductive diaphragm 1 includes two base layers and an auxiliary layer, and the auxiliary layer is sandwiched between the two base layers, and the conductive layer 11 and the power connection layer 12 may be disposed on the two base layers. And the voice coil lead connection layer 13. For another example, the conductive diaphragm 1 includes a base material layer and two auxiliary layers, and one base material layer and two auxiliary layers are sequentially disposed.
进一步地,导电型振膜1还包括至少一层胶层。胶层位于基材层和辅助层之间,以将基材层和辅助层复合在一起。胶层可起到胶粘基材层和辅助层的作用。胶层的材质可为丙烯酸胶或硅胶等。Further, the conductive diaphragm 1 further includes at least one adhesive layer. A glue layer is positioned between the substrate layer and the auxiliary layer to composite the substrate layer and the auxiliary layer. The glue layer functions as an adhesive substrate layer and an auxiliary layer. The material of the glue layer may be acrylic glue or silica gel.
导电层11过薄会影响到导电层11的导电效果,导电层11过厚会影响到导电型振膜1的声学性能。可选地,导电层11的厚度为2-25μm,以在保证导电效果的同时不影响导电型振膜1的声学性能。If the conductive layer 11 is too thin, the conductive effect of the conductive layer 11 is affected, and the excessive thickness of the conductive layer 11 affects the acoustic performance of the conductive type diaphragm 1. Alternatively, the conductive layer 11 has a thickness of 2 to 25 μm to ensure the conductive effect without affecting the acoustic performance of the conductive diaphragm 1 .
层过薄会导致层焊穿,层过厚会导致成本增加。供电连接层12和音圈引线连接层13的厚度为10-45μm,以在保证层正常焊接的同时有效控制成本。If the layer is too thin, the layer will be welded through, and if the layer is too thick, the cost will increase. The thickness of the power supply connection layer 12 and the voice coil lead connection layer 13 is 10-45 μm to effectively control the cost while ensuring normal soldering of the layer.
本公开还提供了一种扬声器。The present disclosure also provides a speaker.
该扬声器振膜包括振动音圈和本公开的导电型振膜1。振动音圈的音圈引线与音圈引线连接层13电连接。供电连接层12可与供电器件连接,从而通过导电层11向振动音圈供电。The speaker diaphragm includes a vibrating voice coil and the conductive diaphragm 1 of the present disclosure. The voice coil lead of the vibrating voice coil is electrically connected to the voice coil lead connecting layer 13. The power connection layer 12 can be connected to the power supply device to supply power to the vibrating voice coil through the conductive layer 11.
本公开的扬声器振膜的振动音圈与导电型振膜1之间的距离近,使得音圈引线的走线短,有利于简化音圈引线的设计和加工,避免对音圈引线进行顺线操作。此外,音圈引线走线短还有利于有效避免因音圈引线受到振动音圈的振动影响导致的音圈引线断线问题,提高了扬声器的使用寿命。The distance between the vibrating voice coil of the speaker diaphragm of the present disclosure and the conductive diaphragm 1 is short, so that the wiring of the voice coil lead is short, which is advantageous for simplifying the design and processing of the voice coil lead, and avoiding the smoothing of the voice coil lead. operating. In addition, the short lead wire of the voice coil is also beneficial to effectively avoid the problem of the broken voice coil lead caused by the vibration of the voice coil of the voice coil, which improves the service life of the speaker.
本公开还提供了一种导电型振膜的制造方法。The present disclosure also provides a method of manufacturing a conductive diaphragm.
该导电型振膜包括如下步骤:The conductive diaphragm includes the following steps:
步骤S1:通过印刷导电油墨在基材层上形成导电层。基材层可为单层结构,或者基材层可为由多层材质相同或材质不同的结构层复合而成的 多层结构。基材层的材质可根据实际需求灵活选择,例如,基材层的材质为PEEK(Polyetheretherketone,聚醚醚酮)、PAR(聚芳基酸酯)、PEI(Polyetherimide,聚醚酰亚胺)、PI(Polyimide,聚酰亚胺)、PPS(Polyphenylene sulfide,聚苯硫醚)、PEN(Polyethylene naphthalate two formic acid glycol ester,聚萘二甲酸乙二醇酯)、PET(Polyethylene terephthalate,聚对苯二甲酸乙二醇酯)等。Step S1: forming a conductive layer on the substrate layer by printing a conductive ink. The substrate layer may have a single layer structure, or the substrate layer may be a multilayer structure composed of a plurality of structural layers having the same material or different materials. The material of the substrate layer can be flexibly selected according to actual needs. For example, the material of the substrate layer is PEEK (Polyetheretherketone), PAR (polyarylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS (Polyphenylene sulfide, polyphenylene sulfide), PEN (Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate), PET (Polyethylene terephthalate, poly(p-phenylene terephthalate) Ethylene glycolate).
导电层11的形状可根据实际需求设置。例如,导电层具有矩形形状。又例如,导电层具有圆形形状。上述导电层可例如为纳米银浆等。当然,还可以是其他能够导电的材质,本发明对此不做限制。The shape of the conductive layer 11 can be set according to actual needs. For example, the conductive layer has a rectangular shape. As another example, the conductive layer has a circular shape. The above conductive layer may be, for example, a nano silver paste or the like. Of course, it can also be other materials that can conduct electricity, and the present invention does not limit this.
步骤S2:在步骤S1得到的基材层上形成与导电层连接在一起的供电连接层和音圈引线连接层,得到振膜基材。Step S2: forming a power supply connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer obtained in the step S1 to obtain a diaphragm substrate.
其中,供电连接层和音圈引线连接层位于振膜基材的外表面上,以保证其它器件可与供电连接层和音圈引线连接层电连接。导电层可位于振膜基材的外表面上,或者,导电层可位于振膜基材内而未露出在振膜基材的外表面上。Wherein, the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate to ensure that other devices can be electrically connected to the power connection layer and the voice coil lead connection layer. The conductive layer may be on the outer surface of the diaphragm substrate, or the conductive layer may be located in the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate.
供电连接层和音圈引线连接层可通过点焊、涂布或电镀的方式形成,当然还可以是其他方式形成,本发明对此不做限制。供电连接层和音圈引线连接层均与导电层相连接。供电连接层和音圈引线连接层可通过与导电层的边缘相接的方式与导电层连接在一起。或者,供电连接层和音圈引线连接层可通过覆盖在部分导电层上的方式与导电层连接在一起。The power supply connection layer and the voice coil lead connection layer may be formed by spot welding, coating or electroplating, and may of course be formed in other manners, which is not limited in the present invention. Both the power connection layer and the voice coil lead connection layer are connected to the conductive layer. The power connection layer and the voice coil lead connection layer may be connected to the conductive layer by being in contact with the edge of the conductive layer. Alternatively, the power connection layer and the voice coil lead connection layer may be connected to the conductive layer by being overlaid on a portion of the conductive layer.
供电连接层和音圈引线连接层的形状可根据实际需求设置。例如,供电连接层、音圈引线连接层和导电层均具有矩形形状,且供电连接层和音圈引线连接层分别与导电层的长度方向的两端相接。又例如,供电连接层和音圈引线连接层具有矩形形状,导电层具有圆形形状,且供电连接层和音圈引线连接层与导电层的边缘搭接。The shape of the power connection layer and the voice coil lead connection layer can be set according to actual needs. For example, the power supply connection layer, the voice coil lead connection layer, and the conductive layer each have a rectangular shape, and the power supply connection layer and the voice coil lead connection layer are respectively in contact with both ends of the conductive layer in the longitudinal direction. For another example, the power connection layer and the voice coil lead connection layer have a rectangular shape, the conductive layer has a circular shape, and the power connection layer and the voice coil lead connection layer overlap the edges of the conductive layer.
步骤S3:将步骤S2得到的振膜基材制成导电型振膜,并使得至少部分导电层位于导电型振膜的折环部上,供电连接层和音圈引线连接层位于导电型振膜的折环部外。Step S3: forming the diaphragm substrate obtained in step S2 into a conductive diaphragm, and at least partially conducting the conductive layer on the folded portion of the conductive diaphragm, and the power connection layer and the voice coil lead connecting layer are located on the conductive diaphragm Outside the folding ring.
其中,供电连接层和音圈引线连接层位于导电型振膜的折环部外可有效防止焊接操作对导电型振膜的声学性能的影响。具体实施时,供电连接层和音圈引线连接层可均位于导电型振膜的固定部或中心部上,或者,供电连接层和音圈引线连接层可分别位于固定部和中心部上。Wherein, the power connection layer and the voice coil lead connection layer are located outside the folded portion of the conductive diaphragm to effectively prevent the influence of the soldering operation on the acoustic performance of the conductive diaphragm. In a specific implementation, the power connection layer and the voice coil lead connection layer may both be located on the fixed portion or the central portion of the conductive diaphragm, or the power connection layer and the voice coil lead connection layer may be respectively located on the fixed portion and the central portion.
本公开的导电型振膜的制造方法操作简单,易于实现。通过该导电型振膜的制造方法制得的导电型振膜可通过音圈引线连接层与振动音圈的音圈引线相连接,且导电型振膜可通过供电连接层与供电器件连接,从而通过导电层实现导电型振膜向振动音圈供电。这种导电型振膜可缩短音圈引线的走线,有利于简化音圈引线的设计和加工,避免对音圈引线进行顺线操作。此外,音圈引线走线短还有利于有效避免因音圈引线受到振动音圈的振动影响导致的音圈引线断线问题,从而提高扬声器的使用寿命。The method of manufacturing the conductive diaphragm of the present disclosure is simple in operation and easy to implement. The conductive diaphragm obtained by the manufacturing method of the conductive diaphragm can be connected to the voice coil lead of the vibrating voice coil through the voice coil lead connecting layer, and the conductive diaphragm can be connected to the power supply device through the power supply connection layer, thereby The conductive diaphragm is supplied to the vibrating voice coil through the conductive layer. This conductive diaphragm reduces the routing of the voice coil leads, which simplifies the design and processing of the voice coil leads and avoids the smooth operation of the voice coil leads. In addition, the short lead wire of the voice coil is also beneficial to effectively avoid the problem of the broken voice coil lead caused by the vibration of the voice coil lead due to the vibration of the vibrating voice coil, thereby improving the service life of the speaker.
可选地,步骤S2包括:Optionally, step S2 includes:
步骤S2-1:将基材层和辅助层复合。Step S2-1: compounding the substrate layer and the auxiliary layer.
步骤S2-2:在复合后的基材层上形成与导电层连接在一起的供电连接层和音圈引线连接层,得到振膜基材,其中,供电连接层和音圈引线连接层位于振膜基材的外表面上。Step S2-2: forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the composite substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located at the diaphragm base On the outer surface of the material.
导电层可位于振膜基材的外表面上,或者,导电层可位于振膜基材内而未露出在振膜基材的外表面上。特别地,当导电层位于振膜基材内时,基材层为振膜基材的中间层,辅助层上应当开设有用于露出部分导电层的开口,以使得供电连接层和音圈引线连接层可与导电层连接在一起的。The conductive layer may be on the outer surface of the diaphragm substrate, or the conductive layer may be located in the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate. In particular, when the conductive layer is located in the diaphragm substrate, the substrate layer is an intermediate layer of the diaphragm substrate, and an opening for exposing a portion of the conductive layer should be opened on the auxiliary layer to enable the power connection layer and the voice coil lead connection layer Can be connected to the conductive layer.
或者,步骤S2包括:Alternatively, step S2 includes:
步骤S2-1:在基材层上形成与导电层连接在一起的供电连接层和音圈引线连接层。Step S2-1: forming a power supply connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer.
步骤S2-2:将基材层和辅助层复合,得到振膜基材,其中,供电连接层和音圈引线连接层位于振膜基材的外表面上。Step S2-2: combining the substrate layer and the auxiliary layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate.
本公开中的导电层可位于振膜基材的外表面上,或者,导电层可位于振膜基材内而未露出在振膜基材的外表面上。特别地,当导电层位于振膜基材内时,基材层为振膜基材的中间层,辅助层上应当开设有用于露出 部分导电层的开口,以使得基材层上的供电连接层和音圈引线连接层露出在振膜基材的外表面上。The conductive layer in the present disclosure may be on the outer surface of the diaphragm substrate, or the conductive layer may be located in the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate. In particular, when the conductive layer is located in the diaphragm substrate, the substrate layer is an intermediate layer of the diaphragm substrate, and an opening for exposing a portion of the conductive layer should be opened on the auxiliary layer to enable the power connection layer on the substrate layer The voice coil lead connection layer is exposed on the outer surface of the diaphragm substrate.
基材层和辅助层的数量可根据实际需求灵活选择。例如,导电型振膜包括两层基材层和一层辅助层,辅助层夹设于两层基材层之间,两层基材层上均可设有导电层、供电连接层和音圈引线连接层。又例如,导电型振膜包括一层基材层和两层辅助层,基材层夹设于两层辅助层之间。The number of substrate layers and auxiliary layers can be flexibly selected according to actual needs. For example, the conductive diaphragm includes two base layers and an auxiliary layer, and the auxiliary layer is sandwiched between the two base layers, and the two base layers may be provided with a conductive layer, a power connection layer, and a voice coil lead. Connection layer. For another example, the conductive diaphragm includes a base material layer and two auxiliary layers, and the base material layer is sandwiched between the two auxiliary layers.
基材层和辅助层可通过丙烯酸胶或硅胶等材质的胶层胶粘在一起,或者通过热压的方式复合在一起。The substrate layer and the auxiliary layer may be bonded together by a glue layer of a material such as acrylic rubber or silica gel, or may be compounded by hot pressing.
本公开中的辅助层的材质可与基材层的材质相同或不同。辅助层的材质可例如为PEEK(Polyetheretherketone,聚醚醚酮)、PAR(聚芳基酸酯)、PEI(Polyetherimide,聚醚酰亚胺)、PI(Polyimide,聚酰亚胺)、PPS(Polyphenylene sulfide,聚苯硫醚)、PEN(Polyethylene naphthalate two formic acid glycol ester,聚萘二甲酸乙二醇酯)、PET(Polyethylene terephthalate,聚对苯二甲酸乙二醇酯)等。又例如,辅助振膜料材的材质为弹性体材料,如TPE(Thermoplastic Elastomer,热塑性弹性体)、TPU(Thermoplastic polyurethanes,热塑性聚氨酯弹性体橡胶)、TPEE(热塑性聚酯弹性体)等。可选地,步骤S3中的供电连接层位于导电型振膜的固定部上,音圈引线连接层位于导电型振膜的中心部上。或者,步骤S3中的供电连接层位于导电型振膜的中心部上,音圈引线连接层位于导电型振膜的固定部上。供电连接层和音圈引线连接层位于导电型振膜的不同部位,有利于提高供电连接层和音圈引线连接层与引线或其它部件连接的便利性。The material of the auxiliary layer in the present disclosure may be the same as or different from the material of the substrate layer. The material of the auxiliary layer can be, for example, PEEK (Polyetheretherketone), PAR (polyaryl acrylate), PEI (Polyetherimide, polyetherimide), PI (Polyimide, polyimide), PPS (Polyphenylene). Sulfide, polyphenylene sulfide, PEN (Polyethylene naphthalate two formic acid glycol ester), PET (polyethylene terephthalate), and the like. Further, for example, the material of the auxiliary diaphragm material is an elastomer material such as TPE (Thermoplastic Elastomer), TPU (Thermoplastic polyurethanes), TPEE (thermoplastic polyester elastomer), or the like. Optionally, the power supply connection layer in step S3 is located on the fixed portion of the conductive diaphragm, and the voice coil lead connection layer is located on the central portion of the conductive diaphragm. Alternatively, the power supply connection layer in the step S3 is located on the central portion of the conductive diaphragm, and the voice coil lead connection layer is located on the fixed portion of the conductive diaphragm. The power connection layer and the voice coil lead connection layer are located at different parts of the conductive diaphragm, which is convenient for improving the connection of the power connection layer and the voice coil lead connection layer with the lead or other components.
虽然已经通过例子对本发明的一些特定实施例进行了详细说明,但是本领域的技术人员应该理解,以上例子仅是为了进行说明,而不是为了限制本发明的范围。本领域的技术人员应该理解,可在不脱离本发明的范围和精神的情况下,对以上实施例进行修改。本发明的范围由所附权利要求来限定。While the invention has been described in detail with reference to the preferred embodiments of the present invention, it is understood that It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (11)

  1. 一种导电型振膜,其特征在于,所述导电型振膜包括折环部、固定部和中心部,所述导电型振膜上设有导电层、供电连接层和音圈引线连接层,所述供电连接层和所述音圈引线连接层均由导电材料制成;其中,A conductive type diaphragm comprising a folded ring portion, a fixing portion and a central portion, wherein the conductive type diaphragm is provided with a conductive layer, a power supply connecting layer and a voice coil lead connecting layer, The power connection layer and the voice coil lead connection layer are both made of a conductive material;
    至少部分所述导电层位于所述折环部上;At least a portion of the conductive layer is located on the folded portion;
    所述供电连接层和所述音圈引线连接层位于所述折环部外;The power connection layer and the voice coil lead connection layer are located outside the folded ring portion;
    所述供电连接层和所述音圈引线连接层均与所述导电层相连接,且所述供电连接层和所述音圈引线连接层均位于所述导电型振膜的外表面上。The power connection layer and the voice coil lead connection layer are both connected to the conductive layer, and the power connection layer and the voice coil lead connection layer are both located on an outer surface of the conductive diaphragm.
  2. 根据权利要求1所述的导电型振膜,其特征在于,所述供电连接层位于所述固定部上,所述音圈引线连接层位于所述中心部上;或者,The conductive diaphragm according to claim 1, wherein the power supply connection layer is located on the fixing portion, and the voice coil lead connection layer is located on the center portion; or
    所述供电连接层位于所述中心部上,所述音圈引线连接层位于所述固定部上。The power connection layer is located on the central portion, and the voice coil lead connection layer is located on the fixed portion.
  3. 根据权利要求1所述的导电型振膜,其特征在于,所述导电型振膜包括至少一层基材层和至少一层辅助层;The conductive diaphragm according to claim 1, wherein the conductive diaphragm comprises at least one substrate layer and at least one auxiliary layer;
    所述导电层、所述供电连接层和所述音圈引线连接层均位于所述基材层上;The conductive layer, the power connection layer and the voice coil lead connection layer are all located on the substrate layer;
    所述基材层和所述辅助层层叠设置。The substrate layer and the auxiliary layer are stacked.
  4. 根据权利要求3所述的导电型振膜,其特征在于,所述导电型振膜还包括至少一层胶层;The conductive diaphragm according to claim 3, wherein the conductive diaphragm further comprises at least one adhesive layer;
    所述胶层位于所述基材层和所述辅助层之间,以将所述基材层和所述辅助层复合在一起。The glue layer is positioned between the substrate layer and the auxiliary layer to composite the substrate layer and the auxiliary layer.
  5. 根据权利要求1所述的导电型振膜,其特征在于,所述导电层的 厚度为2-25μm。The conductive diaphragm according to claim 1, wherein the conductive layer has a thickness of 2 to 25 μm.
  6. 根据权利要求1所述的导电型振膜,其特征在于,所述供电连接层和所述音圈引线连接层的厚度为10-45μm。The conductive diaphragm according to claim 1, wherein the power supply connection layer and the voice coil lead connection layer have a thickness of 10 to 45 μm.
  7. 一种扬声器,其特征在于,包括振动音圈和权利要求1至6任一项中所述的导电型振膜;A speaker comprising a vibrating voice coil and the conductive diaphragm according to any one of claims 1 to 6;
    所述振动音圈的音圈引线与所述音圈引线连接层电连接。The voice coil lead of the vibrating voice coil is electrically connected to the voice coil lead connection layer.
  8. 一种导电型振膜的制造方法,其特征在于,包括如下步骤:A method for manufacturing a conductive diaphragm, comprising the steps of:
    步骤S1:通过印刷导电油墨在基材层上形成导电层;Step S1: forming a conductive layer on the substrate layer by printing a conductive ink;
    步骤S2:在基材层上形成与导电层连接在一起的供电连接层和音圈引线连接层,得到振膜基材,其中,供电连接层和音圈引线连接层位于振膜基材的外表面上;Step S2: forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate ;
    步骤S3:将振膜基材制成导电型振膜,并使得至少部分导电层位于导电型振膜的折环部上,供电连接层和音圈引线连接层位于导电型振膜的折环部外。Step S3: forming the diaphragm substrate into a conductive diaphragm, and at least partially conducting the conductive layer on the folded portion of the conductive diaphragm, and the power connection layer and the voice coil lead connecting layer are located outside the folded portion of the conductive diaphragm .
  9. 根据权利要求8所述的导电型振膜的制造方法,其特征在于,所述步骤S2包括:The method of manufacturing a conductive diaphragm according to claim 8, wherein the step S2 comprises:
    步骤S2-1:将基材层和辅助层复合;Step S2-1: compounding the substrate layer and the auxiliary layer;
    步骤S2-2:在复合后的基材层上形成与导电层连接在一起的供电连接层和音圈引线连接层,得到振膜基材,其中,供电连接层和音圈引线连接层位于振膜基材的外表面上。Step S2-2: forming a power connection layer and a voice coil lead connection layer connected to the conductive layer on the composite substrate layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located at the diaphragm base On the outer surface of the material.
  10. 根据权利要求8所述的导电型振膜的制造方法,其特征在于,所述步骤S2包括:The method of manufacturing a conductive diaphragm according to claim 8, wherein the step S2 comprises:
    步骤S2-1:在基材层上形成与导电层连接在一起的供电连接层和音 圈引线连接层;Step S2-1: forming a power connection layer and a voice coil connection layer connected to the conductive layer on the substrate layer;
    步骤S2-2:将基材层和辅助层复合,得到振膜基材,其中,供电连接层和音圈引线连接层位于振膜基材的外表面上。Step S2-2: combining the substrate layer and the auxiliary layer to obtain a diaphragm substrate, wherein the power connection layer and the voice coil lead connection layer are located on the outer surface of the diaphragm substrate.
  11. 根据权利要求8至10任一项中所述的导电型振膜的制造方法,其特征在于,所述步骤S3中的供电连接层位于导电型振膜的固定部上,音圈引线连接层位于导电型振膜的中心部上;或者,The method of manufacturing a conductive diaphragm according to any one of claims 8 to 10, wherein the power supply connection layer in the step S3 is located on a fixed portion of the conductive diaphragm, and the voice coil lead connection layer is located. On the center of the conductive diaphragm; or,
    步骤S3中的供电连接层位于导电型振膜的中心部上,音圈引线连接层位于导电型振膜的固定部上。The power supply connection layer in step S3 is located on the central portion of the conductive diaphragm, and the voice coil lead connection layer is located on the fixed portion of the conductive diaphragm.
PCT/CN2018/110893 2017-11-22 2018-10-18 Conductive diaphragm, loudspeaker, and method for manufacturing conductive diaphragm WO2019100879A1 (en)

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