KR101673296B1 - Pattern diaphram and method of making the same - Google Patents

Pattern diaphram and method of making the same Download PDF

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Publication number
KR101673296B1
KR101673296B1 KR1020150083444A KR20150083444A KR101673296B1 KR 101673296 B1 KR101673296 B1 KR 101673296B1 KR 1020150083444 A KR1020150083444 A KR 1020150083444A KR 20150083444 A KR20150083444 A KR 20150083444A KR 101673296 B1 KR101673296 B1 KR 101673296B1
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KR
South Korea
Prior art keywords
vibration film
diaphragm
voice coil
conductive pattern
layer
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Application number
KR1020150083444A
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Korean (ko)
Inventor
김정곤
유현영
김준호
Original Assignee
주식회사 비에스이
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Priority to KR1020150083444A priority Critical patent/KR101673296B1/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

The present invention eliminates coil disconnection and application of expensive parts by forming a pattern in the middle of a vibration layer material (2 layer, 3 layer, multi layer) THD) uniformly, and a method of manufacturing the same. A diaphragm of the present invention comprises: a first vibration film having a pad hole for connection with a voice coil and having a damper layer; A second vibration film having a damper layer laminated with a damper layer of the first vibration film; And a conductive pattern embedded between the damper layer of the first vibration film and the damper layer of the second vibration film to transmit an audio signal to the voice coil. The conductive pattern may include a pad portion for connecting a terminal portion for receiving an external signal and a lead wire of the voice coil, and a wiring portion for connecting the terminal portion and the pad portion. The wiring portion may be implemented as a conductive adhesive, And a plurality of vibration films laminated to the second vibration film may be further provided and may be implemented in multiple layers.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern diaphragm,

The present invention relates to a diaphragm for a speaker, and more particularly, to a diaphragm for a speaker, and more particularly, to a diaphragm for a speaker, which is formed by forming a pattern in the middle of a material (2 layers, 3 layers, The present invention relates to a pattern diaphragm and a method of manufacturing the same, which can simplify the speaker manufacturing process and make the characteristics (SPL / THD) uniform.

In general, a speaker is a type in which a driving source vibrates a diaphragm to generate sound, and a dynamic speaker, an electrostatic speaker, and a piezoelectric speaker (film type speaker) are classified according to a driving method of vibrating the diaphragm.

The most widely used dynamic method is also referred to as a moving coil type and basically includes a magnetic circuit composed of a magnet, a plate and a yoke and a magnetic circuit composed of a voice located in a gap of the magnetic circuit A voice coil, and a diaphragm that vibrates according to the motion of the voice coil. When a current flows through the voice coil, the voice coil is moved by the interaction with the magnetic field formed by the magnet. At this time, the vibration plate vibrates according to the movement of the voice coil, thereby generating sound.

Meanwhile, in the manufacturing process of the speaker, the voice coil is attached to the diaphragm to form a diaphragm assembly. The method of fixing the voice coil to the diaphragm is not limited to the linear type shown in Fig. 1, the floating type shown in Fig. 2, There is a suspension system shown in Fig.

1, the voice coil 12 is fixed to the diaphragm 11 and the lead wire 13 of the voice coil is brought into close contact with the diaphragm, It is fixed. The reason why the lead wire 13 is attached to the diaphragm 11 as a bond is that when the speaker is driven, the diaphragm moves up and down. When the lead wire fixed to the diaphragm surface is not in close contact with the diaphragm, This is because noise is generated by

However, in the case of fixing the lead wire to the diaphragm like in the prior art, since all the operations are performed by hand, it is difficult to precisely match the positions of the adhesive surfaces and the amount of the bond application is also uneven and heterogeneous sound is generated due to irregular movement and twisting motion of the diaphragm , There is a problem that it is applied only to a low output product because there is a concern that wire breakage may occur due to a change in characteristics.

In addition, as shown in FIG. 2, the Floating method in which the voice coil 24 is placed on the frame 22 requires expensive voice coil forming equipment, Suspension system is problematic in that the suspension 32 attaching the voice coil 34 is expensive and the price competitiveness is considerably inferior.

KR 10-1515970 B1

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the related art as described above, and it is an object of the present invention to provide a method and apparatus for detecting a disconnection without using an expensive component such as a suspension or an expensive equipment such as a voice coil forming And to provide a pattern diaphragm capable of improving the reliability and uniformizing the characteristics, and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a diaphragm comprising: a first vibration film having a pad hole for connection with a voice coil; A second vibration film laminated with the first vibration film; And a conductive pattern embedded between the first and second vibration films to transmit an audio signal to the voice coil.

According to another aspect of the present invention, there is provided a diaphragm comprising: a first vibration film having a pad hole for connection with a voice coil and having a damper layer; A second vibration film having a damper layer laminated with a damper layer of the first vibration film; And a conductive pattern embedded between the damper layer of the first vibration film and the damper layer of the second vibration film to transmit an audio signal to the voice coil.

The conductive pattern includes a terminal portion for receiving an external signal, a pad portion for connecting the lead wire of the voice coil, and a wiring portion for connecting the terminal portion and the pad portion. The wiring portion is implemented as a conductive adhesive. The pattern diaphragm may further include a plurality of vibration films laminated to the second vibration film, and may be formed in multiple layers.

According to another aspect of the present invention, there is provided a method of manufacturing a vibration film, including: preparing a first vibration film; Drilling a pad hole for connection with the voice coil to the first vibration film; Preparing a conductive pattern of a predetermined shape; Transferring the conductive pattern to the first vibration film; Forming a diaphragm sheet by laminating a first vibration film and a second vibration film on which a conductive pattern is transferred with a conductive pattern sandwiched therebetween; And molding the diaphragm sheet into a dome and an edge to complete the diaphragm.

The first vibrating film and the second vibrating film are formed with a damper layer. The conductive pattern having a predetermined shape is transferred to the damper layer of the first vibrating film, and is then joined to the damper layer of the second vibrating film .

The pattern diaphragm according to the present invention is embedded in the vibration film in which the patterns are laminated so that the wiring pattern except for the connection portion is not exposed to the outside and the risk of disconnection can be reduced and corrosion due to oxidation and the like can be prevented, Even if used, the characteristics can be kept uniform.

Further, the pattern diaphragm according to the present invention can simplify the manufacturing process without using a high-priced part such as a suspension, thereby significantly reducing the manufacturing cost of the speaker.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a conventional linearly-
2 is a schematic view showing a conventional floating type diaphragm assembly,
3 is a schematic view showing a conventional suspension type diaphragm assembly,
4 is a conceptual diagram of a pattern diaphragm according to the present invention,
5 is a flowchart showing a pattern diaphragm manufacturing procedure according to an embodiment of the present invention;
6 is an exploded perspective view showing a pattern diaphragm according to an embodiment of the present invention,
FIG. 7 is a combined view showing a pattern diaphragm according to an embodiment of the present invention,
8 is a cross-sectional view of a patterned diaphragm according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings. The following examples are merely illustrative of the present invention and are not intended to limit the scope of the present invention.

4 is a conceptual diagram of a pattern diaphragm according to the present invention, wherein (a) is an example of a two-layer diaphragm, and (b) is an example of a three-layer diaphragm.

First, the basic concept of the pattern diaphragm according to the present invention is that a conductive pattern 45 for transmitting an audio signal to a voice coil without using an expensive suspension is divided into a first vibration film 41 constituting the diaphragm, And the first vibration film 41 and the second vibration film 42 are joined together after transferring the film between the films 42. [ The shape of the conductive pattern 45 may be variously embodied. The conductive pattern 45 may include a terminal portion for connecting a pad portion for connecting the lead wire of the voice coil and a terminal for receiving a signal from the outside, and a terminal portion for connecting the terminal portion and the pad portion. And a wiring portion. The conductive pattern 45 may be formed of a metal thin film, a conductive adhesive, or the like, and the vibration films 41 and 42 may be formed of a polymer film such as PEEK.

In the case where the conductive pattern 45 is interposed between the laminated films as described above, there is no risk of corrosion or disconnection due to no exposure of the conductive pattern, which not only improves the reliability but also causes the deterioration of characteristics .

4 (a), an embodiment in which the conductive pattern 45 is interposed between the first and second vibrating films 41 and 42, and FIG. 4 an embodiment in which the conductive pattern 45 is embedded between the first vibration film 41 having the damper layer 43 and the second vibration film 42 having the damper layer 43 as shown in FIG. Layer diaphragm. However, in a preferred embodiment of the present invention, the three-layer case will be described in detail as shown in FIG. 4 (b).

5 is a flowchart illustrating a pattern diaphragm manufacturing procedure according to a preferred embodiment of the present invention.

Referring to FIG. 5, after the first vibration film 41 having the damper layer 43 is prepared, the pad portion is perforated in a predetermined shape (S101, S102). A conductive pattern 45 for transmitting an audio signal from the terminal terminal to the voice coil is formed by etching, and then copper, tin or the like is plated (S103, S104). After preparing the second vibration film 42 having the damper layer 43, the terminal portion is cut into a predetermined shape (S105, S106).

The conductive pattern 45 is transferred to the damper layer 43 of the first vibration film 41 and then the first vibration film 41 having the damper layer 43 is sandwiched by the transferred conductive pattern 43. [ And the second vibration film 42 having the damper layer 43 are joined together to complete the diaphragm sheet (S107, S108).

Then, the lapped diaphragm sheet is formed into a diaphragm shape having a dome and an edge shape, and then a pattern diaphragm is formed by tapping the outer periphery (S109, S110).

Thereafter, the voice coil 50 is bonded to the pattern diaphragm 40 (FIG. 6), and the pad 45a of the conductive pattern 45 and the lead wire of the voice coil 50 are bonded.

FIG. 6 is an exploded perspective view of a patterned diaphragm according to an embodiment of the present invention, and FIG. 7 is an assembled view of a patterned diaphragm according to an embodiment of the present invention, wherein (A) is a plan view and (B) is a bottom view. 8 is a cross-sectional view of a patterned diaphragm according to an embodiment of the present invention, wherein (A) is a cross-sectional view taken along line A-A of FIG. 7, and FIG.

6 to 8, a patterned diaphragm 40 according to the present invention includes a damper layer 43 between a first vibrating film 41 and a second vibrating film 42 and a conductive pattern 45 It has a built-in structure. The conductive pattern 45 includes a pad portion 45a for connecting a lead wire of the voice coil 50, a terminal portion 45b for connecting a terminal for receiving a signal from the outside, and a terminal portion 45b, And a wiring portion 45c for connecting the portion 45a.

6 to 8, the first vibration film 41 is formed with a pad hole 41a for connection with the voice coil 50 and has a damper layer 43, and the second vibration film 42 are cut so that the terminal portion 45b of the conductive pattern can be exposed for electrical connection with the terminal (not shown), and the damper layer 43 of the first vibratory film 41, And a damper layer 43 which is made of a metal. The conductive pattern 45 is sandwiched between the damper layer 43 of the first vibrating film and the damper layer 43 of the second vibrating film to transmit an audio signal to the voice coil 50. That is, the pad portion 45a of the conductive pattern is exposed through the pad hole 41a of the first vibrating film 41 to connect the lead wire of the voice coil 50, and the terminal portion 45b of the conductive pattern, The corresponding portion of the second vibration film 42 is cut and exposed.

The audio signal transmitted from the terminal (not shown) to the terminal portion 45b of the conductive pattern is transmitted to the pad portion 45a exposed through the wiring portion 45c embedded between the vibrating films 41 and 42 The lead wire of the voice coil 50 is connected to the pad portion 45a so that an audio signal flows to the voice coil 50. [

The speaker to which the pattern diaphragm 40 of the present invention is applied is connected to a voice coil 50 located in a gap of a magnetic circuit composed of a magnet, a plate and a yoke, The voice coil is moved by the interaction with the magnetic field formed by the magnet. At this time, the pattern diaphragm 40 is vibrated according to the movement of the voice coil 50 to generate sound.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

40: diaphragm 41: first vibration film
42: second vibration film 43: damper layer
45: conductive pattern 45a: pad portion
45b: terminal portion 45c: wiring portion
50: voice coil

Claims (8)

delete A first vibration film having a damper layer on which a pad hole for connection with the voice coil is formed;
A second vibration film having a damper layer laminated with a damper layer of the first vibration film; And
And a conductive pattern embedded between the damper layer of the first vibration film and the damper layer of the second vibration film to transmit an audio signal to the voice coil. The conductive pattern according to claim 2,
A pad portion for connecting a terminal portion for receiving an external signal and a lead wire of the voice coil; and a wiring portion for connecting the terminal portion and the pad portion. The semiconductor device according to claim 3, wherein the wiring portion
Wherein the patterned diaphragm is embodied as a conductive adhesive. 3. The apparatus of claim 2, wherein the pattern diaphragm
And a plurality of vibrating films laminated to the second vibrating film. Preparing a first vibrating film;
Drilling a pad hole for connection with the voice coil to the first vibration film;
Preparing a conductive pattern of a predetermined shape;
Transferring the conductive pattern to the first vibration film;
Forming a diaphragm sheet by laminating a first vibration film and a second vibration film on which a conductive pattern is transferred with a conductive pattern sandwiched therebetween; And
And molding the diaphragm sheet into a dome and an edge to complete the diaphragm. The damper device according to claim 6, wherein the first vibration film and the second vibration film are formed with a damper layer, and after the conductive pattern of a predetermined shape is transferred to the damper layer of the first vibration film, And a second step of forming a patterned diaphragm. delete
KR1020150083444A 2015-06-12 2015-06-12 Pattern diaphram and method of making the same KR101673296B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110809221A (en) * 2019-09-17 2020-02-18 安克创新科技股份有限公司 Vibrating diaphragm and loudspeaker
US11474220B2 (en) * 2017-10-26 2022-10-18 Seiko Epson Corporation Ultrasonic device and ultrasonic measuring apparatus

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11298994A (en) * 1998-04-16 1999-10-29 Kenwood Corp Wiring structure for loudspeaker
JP2007274096A (en) * 2006-03-30 2007-10-18 Yamaha Corp Diaphragm and its production process
KR20140110398A (en) 2013-03-07 2014-09-17 주식회사 비에스이 diaphram assembly with lead pattern and method of making the diaphram assembly
KR200474384Y1 (en) * 2013-03-21 2014-11-04 (주) 모토텍 Wiring member and speaker device having the same
KR20140127432A (en) * 2013-04-24 2014-11-04 주식회사 이엠텍 Suspension for sound transducer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11298994A (en) * 1998-04-16 1999-10-29 Kenwood Corp Wiring structure for loudspeaker
JP2007274096A (en) * 2006-03-30 2007-10-18 Yamaha Corp Diaphragm and its production process
KR20140110398A (en) 2013-03-07 2014-09-17 주식회사 비에스이 diaphram assembly with lead pattern and method of making the diaphram assembly
KR200474384Y1 (en) * 2013-03-21 2014-11-04 (주) 모토텍 Wiring member and speaker device having the same
KR20140127432A (en) * 2013-04-24 2014-11-04 주식회사 이엠텍 Suspension for sound transducer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11474220B2 (en) * 2017-10-26 2022-10-18 Seiko Epson Corporation Ultrasonic device and ultrasonic measuring apparatus
CN110809221A (en) * 2019-09-17 2020-02-18 安克创新科技股份有限公司 Vibrating diaphragm and loudspeaker
CN110809221B (en) * 2019-09-17 2022-02-15 安克创新科技股份有限公司 Vibrating diaphragm and loudspeaker

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