CN107809705B - Conductive diaphragm, loudspeaker and manufacturing method of conductive diaphragm - Google Patents
Conductive diaphragm, loudspeaker and manufacturing method of conductive diaphragm Download PDFInfo
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- CN107809705B CN107809705B CN201711172759.8A CN201711172759A CN107809705B CN 107809705 B CN107809705 B CN 107809705B CN 201711172759 A CN201711172759 A CN 201711172759A CN 107809705 B CN107809705 B CN 107809705B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
Abstract
The invention discloses a conductive type vibrating diaphragm, a loudspeaker and a manufacturing method of the conductive type vibrating diaphragm. The conductive type vibrating diaphragm comprises a bending ring part, a fixed part and a central part, and a conductive layer, a power supply connecting layer and a voice coil lead connecting layer are arranged on the conductive type vibrating diaphragm; at least part of the conductive layer is positioned on the folded ring part; the power supply connecting layer and the voice coil lead connecting layer are positioned outside the folded ring part; the power supply connecting layer and the voice coil lead connecting layer are connected with the conducting layer, and the power supply connecting layer and the voice coil lead connecting layer are located on the outer surface of the conductive type vibrating diaphragm. The voice coil lead wire connection layer on the conductivity type vibrating diaphragm of this disclosure can be connected with the voice coil lead wire of vibration voice coil loudspeaker voice coil. The voice coil lead wire of this disclosure walks the line weak point, is favorable to simplifying the design and the processing of voice coil lead wire, avoids going forward the line operation to the voice coil lead wire.
Description
Technical Field
The invention relates to the field of loudspeaker diaphragms, in particular to a conductive diaphragm, a loudspeaker and a manufacturing method of the conductive diaphragm.
Background
The loudspeaker is widely applied to daily production and life of people as a sounding device for electronic products such as mobile phones, televisions, computers and the like.
The voice coil of the speaker vibration system is connected to a pad of a flexible printed circuit board on the housing through a lead wire. The voice coil lead wire is long in running line, in order to prevent the voice coil lead wire from interfering with peripheral parts, the running line of the voice coil lead wire needs to be strictly planned during design, the voice coil lead wire needs to be subjected to line following operation during processing, and design and processing are inconvenient.
Therefore, simplifying the design and processing of the voice coil leads becomes a technical problem to be solved in the field.
Disclosure of Invention
One object of the present invention is to provide a new technical solution for a conductive diaphragm that can effectively simplify the design and processing of the lead wires of a voice coil.
According to a first aspect of the present invention, there is provided a conductive type diaphragm.
The conductive diaphragm comprises a bending ring part, a fixed part and a central part, wherein a conductive layer, a power supply connecting layer and a voice coil lead connecting layer are arranged on the surface of the conductive diaphragm, and the power supply connecting layer and the voice coil lead connecting layer are both made of conductive materials; wherein the content of the first and second substances,
at least part of the conductive layer is positioned on the folded ring part;
the power supply connecting layer and the voice coil lead connecting layer are positioned outside the bending ring part;
the power supply connection layer with voice coil loudspeaker voice coil lead connection layer all with the conducting layer is connected, just the power supply connection layer with voice coil loudspeaker voice coil lead connection layer all is located on the surface of conduction type vibrating diaphragm.
Optionally, the power supply connection layer is located on the fixing portion, and the voice coil lead connection layer is located on the central portion; alternatively, the first and second electrodes may be,
the power supply connecting layer is located on the central portion, and the voice coil lead connecting layer is located on the fixing portion.
Optionally, the conductive diaphragm comprises at least one substrate layer and at least one auxiliary layer;
the conducting layer, the power supply connecting layer and the voice coil lead connecting layer are all positioned on the base material layer;
the substrate layer and the auxiliary layer are stacked.
Optionally, the conductive diaphragm further includes at least one glue layer;
the adhesive layer is positioned between the substrate layer and the auxiliary layer so as to compound the substrate layer and the auxiliary layer together.
Optionally, the thickness of the conductive layer is 2-25 μm.
Optionally, the thickness of the power supply connection layer and the voice coil lead connection layer is 10-45 μm.
According to a second aspect of the present invention, a loudspeaker is provided.
The loudspeaker comprises a vibrating voice coil and the conductive vibrating diaphragm;
and the voice coil lead of the vibration voice coil is electrically connected with the voice coil lead connecting layer.
According to a third aspect of the present invention, there is provided a method of manufacturing a conductive type diaphragm.
The manufacturing method of the conductive diaphragm comprises the following steps:
step S1: forming a conductive layer on the base material layer by printing conductive ink;
step S2: forming a power supply connecting layer and a voice coil lead connecting layer which are connected with the conducting layer on the base material layer to obtain the vibrating diaphragm base material, wherein the power supply connecting layer and the voice coil lead connecting layer are positioned on the outer surface of the vibrating diaphragm base material;
step S3: make the vibrating diaphragm substrate into the conduction type vibrating diaphragm to make at least part conducting layer be located the dog-ear portion of conduction type vibrating diaphragm, power supply connecting layer and voice coil lead wire connecting layer are located the dog-ear portion of conduction type vibrating diaphragm outside.
Optionally, the step S2 includes:
step S2-1: compounding the base material layer and the auxiliary layer;
step S2-2: and forming a power supply connecting layer and a voice coil lead connecting layer which are connected with the conducting layer on the compounded substrate layer to obtain the vibrating diaphragm substrate, wherein the power supply connecting layer and the voice coil lead connecting layer are positioned on the outer surface of the vibrating diaphragm substrate.
Optionally, the step S2 includes:
step S2-1: forming a power supply connecting layer and a voice coil lead connecting layer which are connected with the conducting layer on the base material layer;
step S2-2: and compounding the substrate layer and the auxiliary layer to obtain the vibrating diaphragm substrate, wherein the power supply connecting layer and the voice coil lead connecting layer are positioned on the outer surface of the vibrating diaphragm substrate.
Alternatively, the power supply connection layer in step S3 is located on the fixing portion of the conductive type diaphragm, and the voice coil lead connection layer is located on the central portion of the conductive type diaphragm; alternatively, the first and second electrodes may be,
the power supply connection layer in step S3 is located on the center portion of the conductive diaphragm, and the voice coil lead connection layer is located on the fixing portion of the conductive diaphragm.
According to an embodiment of the present disclosure, the voice coil lead connection layer on the conductive type diaphragm may be connected to the voice coil lead of the vibration voice coil, and the power supply connection layer of the conductive type diaphragm may be connected to the power supply device, so as to supply power to the vibration voice coil through the conductive layer. The voice coil lead wire of this disclosure walks the line weak point, is favorable to simplifying the design and the processing of voice coil lead wire, avoids going forward the line operation to the voice coil lead wire.
In addition, the voice coil lead wire is short, so that the problem of wire breakage of the voice coil lead wire caused by the vibration influence of the voice coil caused by the voice coil lead wire is effectively avoided, and the service life of the loudspeaker is prolonged.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of an embodiment of a conductive diaphragm according to the present disclosure.
Fig. 2 is a partially enlarged view of fig. 1.
Fig. 3 is a flowchart illustrating a method for manufacturing a conductive diaphragm according to the present disclosure.
The figures are labeled as follows:
the conductive diaphragm-1, the conductive layer-11, the power supply connecting layer-12, the voice coil lead connecting layer-13, the corrugated ring part-14, the fixing part-15 and the central part-16.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
As shown in fig. 1 and 2, the present disclosure provides a conductive type diaphragm.
The conductive diaphragm 1 of the present disclosure includes a loop part 14, a fixing part 15, and a central part 16. The conductive diaphragm 1 is provided with a conductive layer 11, a power supply connection layer 12, and a coil lead connection layer 13. The conductive layer 11 may be formed by printing conductive ink. The power supply connection layer 12 and the coil lead connection layer 13 are both made of a conductive material. The conductive material may be, for example, a metal material or a conductive paste. Specifically, the power supply connection layer 12 and the voice coil lead connection layer 13 are both tin layers, that is, the power supply connection layer 12 and the voice coil lead connection layer 13 are both made of tin material. The power connection layer 12 and the coil lead connection layer 13 may be formed by spot welding, coating or electroplating, but may be formed in other manners, which is not limited in the present invention.
The power supply connection layer 12 and the voice coil lead connection layer 13 may be connected to the conductive layer 11 by being in contact with the edge of the conductive layer 11. Alternatively, the power supply connection layer 12 and the voice coil lead connection layer 13 may be connected to the conductive layer 11 by covering a part of the conductive layer 11.
The shapes and positions of the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 may be set according to actual requirements. For example, the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 each have a rectangular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 are respectively in contact with both ends of the conductive layer 11 in the longitudinal direction. For another example, the conductive layer 11 has a circular shape, the power supply connection layer 12 and the voice coil lead connection layer 13 have a rectangular shape, and the power supply connection layer 12 and the voice coil lead connection layer 13 overlap with an edge of the conductive layer 11.
At least part of the conductive layer 11 is located on the bending part 14 of the conductive type diaphragm 1. The power supply connection layer 12 and the voice coil lead connection layer 13 are located outside the loop part 14 of the conductive diaphragm 1. The power supply connection layer 12 and the voice coil lead connection layer 13 are located outside the corrugated portion 14 of the conductive diaphragm 1, which can effectively prevent the influence of the welding operation on the acoustic performance of the conductive diaphragm 1. In specific implementation, the power supply connection layer 12 and the voice coil lead connection layer 13 may be both located on the fixing portion 15 or the central portion 16 of the conductive diaphragm 1, or the power supply connection layer 12 and the voice coil lead connection layer 13 may be respectively located on the fixing portion 15 and the central portion 16.
The power supply connection layer 12 and the voice coil lead connection layer 13 are both connected to the conductive layer 11, and the power supply connection layer 12 and the voice coil lead connection layer 13 are both located on the outer surface of the conductive diaphragm 1. The position of the conductive layer 11 can be flexibly set according to actual requirements. For example, the conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 12 are all located on the outer surface of the conductive type diaphragm 1. For another example, the conductive layer 11 is located in the conductive type diaphragm 1, and the power supply connection layer 12 and the voice coil lead connection layer 12 are located on the outer surface of the conductive type diaphragm 1 to ensure that other devices can be electrically connected to the power supply connection layer 12 and the voice coil lead connection layer 12.
When vibration voice coil loudspeaker voice coil and conduction type vibrating diaphragm 1 are connected, voice coil loudspeaker voice coil lead connecting layer 13 on the conduction type vibrating diaphragm 1 can be connected with the voice coil loudspeaker voice coil lead of vibration voice coil loudspeaker voice coil, and power supply connecting layer 12 of conduction type vibrating diaphragm 1 can be connected with the power supply device to realize supplying power to the vibration voice coil loudspeaker voice coil through conducting layer 11. Compare the mode that the vibration voice coil loudspeaker voice coil passes through the pad on voice coil loudspeaker voice coil lead wire and the shell and is connected among the prior art, the distance between this disclosed vibration voice coil loudspeaker voice coil and the conduction type vibrating diaphragm 1 is close for the line of walking of voice coil loudspeaker voice coil lead wire is short, is favorable to simplifying the design and the processing of voice coil loudspeaker voice coil lead wire, avoids going forward the line operation to the voice coil loudspeaker voice coil lead wire.
In addition, the voice coil lead wire is short, so that the problem of wire breakage of the voice coil lead wire caused by the vibration influence of the voice coil caused by the voice coil lead wire is effectively avoided, and the service life of the loudspeaker is prolonged.
Alternatively, the power supply connection layer 12 is located on the fixing portion 15 of the conductivity type diaphragm 1, and the voice coil lead connection layer 13 is located on the center portion 16 of the conductivity type diaphragm 1. Alternatively, the power supply connection layer 12 is located on the center portion 16 of the conductivity type diaphragm 1, and the voice coil lead connection layer 13 is located on the fixing portion 15 of the conductivity type diaphragm 1. The power supply connection layer 12 and the voice coil lead connection layer 13 are located at different positions of the conductive diaphragm 1, which is beneficial to improving the convenience of connecting the power supply connection layer 12 and the voice coil lead connection layer 13 with leads or other components.
The conductive diaphragm 1 of the present disclosure may be a single-layer type diaphragm, that is, the diaphragm is made of only a single material. Alternatively, the conductive diaphragm 1 may be a composite diaphragm, i.e., the diaphragm is made of a plurality of different materials. Alternatively, the conductivity type diaphragm 1 includes at least one substrate layer and at least one auxiliary layer. The substrate layer may be formed of materials commonly used in the loudspeaker diaphragm art. For example, the material of the substrate layer may be PEEK (Polyetheretherketone), PAR (polyarylate), PEI (Polyetherimide), PI (Polyimide), PPS (Polyphenylene sulfide), PEN (Polyethylene naphthalate), PET (Polyethylene terephthalate), or the like. The thickness of the substrate layer may optionally be 3-15 μm. The auxiliary layer may be made of the same material as or different from that of the base layer. For example, the auxiliary layer may be made of PEEK (Polyetheretherketone), PAR (polyarylate), PEI (Polyetherimide), PI (Polyimide), PPS (Polyphenylene sulfide), PEN (Polyethylene naphthalate), PET (Polyethylene terephthalate), and the like. For another example, the auxiliary layer is made of an Elastomer material, such as TPE (Thermoplastic Elastomer), TPU (Thermoplastic polyurethane Elastomer), TPEE (Thermoplastic polyester Elastomer), and the like.
The conductive layer 11, the power supply connection layer 12, and the voice coil lead connection layer 13 are all located on the base material layer. The base material layer and the auxiliary layer are stacked. Here, the power supply connection layer 12 and the voice coil lead connection layer 12 are located on the outer surface of the conductive type diaphragm 1; the conductive layer 11 may be located on the outer surface of the conductive type diaphragm 1, or the conductive layer 11 may be located in the conductive type diaphragm 1.
The number of the base material layer and the auxiliary layer can be flexibly selected according to actual requirements. For example, the conductive diaphragm 1 includes two substrate layers and an auxiliary layer, the auxiliary layer is sandwiched between the two substrate layers, and the two substrate layers may be provided with a conductive layer 11, a power supply connection layer 12, and a voice coil lead connection layer 13. For another example, the conductive diaphragm 1 includes a substrate layer and two auxiliary layers, which are sequentially disposed.
Further, the conductive diaphragm 1 further includes at least one glue layer. The glue layer is positioned between the base material layer and the auxiliary layer so as to compound the base material layer and the auxiliary layer together. The glue layer can function as an adhesive base layer and an auxiliary layer. The material of the adhesive layer can be acrylic adhesive or silica gel and the like.
Too thin a conductive layer 11 may affect the conductive effect of the conductive layer 11, and too thick a conductive layer 11 may affect the acoustic performance of the conductive diaphragm 1. Optionally, the thickness of the conductive layer 11 is 2 to 25 μm so as not to affect the acoustic performance of the conductive type diaphragm 1 while ensuring the conductive effect.
Too thin a layer may result in layer penetration and too thick a layer may result in increased costs. The thickness of the power supply connection layer 12 and the voice coil lead connection layer 13 is 10-45 μm to effectively control the cost while ensuring normal soldering of the layers.
The present disclosure also provides a speaker.
The loudspeaker diaphragm includes a vibrating voice coil and a conductive diaphragm 1 of the present disclosure. The voice coil lead of the vibration voice coil is electrically connected to the voice coil lead connection layer 13. The power supply connection layer 12 may be connected to a power supply device to supply power to the vibration voice coil through the conductive layer 11.
The distance between the vibration voice coil loudspeaker voice coil of this disclosed loudspeaker diaphragm and the conduction type vibrating diaphragm 1 is close for the line of walking of voice coil loudspeaker voice coil lead wire is short, is favorable to simplifying the design and the processing of voice coil loudspeaker voice coil lead wire, avoids going forward the line operation to the voice coil loudspeaker voice coil lead wire. In addition, the voice coil lead wire is short, so that the problem of wire breakage of the voice coil lead wire caused by the vibration influence of the voice coil caused by the voice coil lead wire is effectively avoided, and the service life of the loudspeaker is prolonged.
The disclosure also provides a manufacturing method of the conductive diaphragm.
The conductive diaphragm comprises the following steps:
step S1: the conductive layer is formed on the base material layer by printing a conductive ink. The substrate layer can be a single-layer structure, or the substrate layer can be a multi-layer structure formed by compounding a plurality of structural layers with the same material or different materials. The material of the substrate layer can be flexibly selected according to actual requirements, for example, the material of the substrate layer is PEEK (Polyetheretherketone), PAR (polyarylate), PEI (Polyetherimide), PI (Polyimide), PPS (Polyphenylene sulfide), PEN (Polyethylene terephthalate) or PET (Polyethylene terephthalate).
The shape of the conductive layer 11 can be set according to actual requirements. For example, the conductive layer has a rectangular shape. For another example, the conductive layer has a circular shape. The conductive layer can be, for example, a nano silver paste. Of course, other conductive materials are also possible, and the present invention is not limited thereto.
Step S2: and forming a power supply connecting layer and a voice coil lead connecting layer which are connected with the conducting layer on the base material layer obtained in the step S1 to obtain the vibrating diaphragm base material.
The power supply connecting layer and the voice coil lead connecting layer are located on the outer surface of the diaphragm substrate so as to ensure that other devices can be electrically connected with the power supply connecting layer and the voice coil lead connecting layer. The conductive layer may be located on the outer surface of the diaphragm substrate, or the conductive layer may be located within the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate.
The power connection layer and the voice coil lead connection layer may be formed by spot welding, coating or electroplating, but may be formed in other manners, which is not limited in the present invention. The power supply connecting layer and the voice coil lead connecting layer are connected with the conducting layer. The power supply connection layer and the voice coil lead connection layer may be connected to the conductive layer by being connected to an edge of the conductive layer. Alternatively, the power supply connection layer and the voice coil lead connection layer may be connected to the conductive layer by covering a part of the conductive layer.
The shapes of the power supply connecting layer and the voice coil lead connecting layer can be set according to actual requirements. For example, the power supply connection layer, the voice coil lead connection layer, and the conductive layer each have a rectangular shape, and the power supply connection layer and the voice coil lead connection layer are respectively connected to both ends of the conductive layer in the length direction. For another example, the power supply connection layer and the voice coil lead connection layer have a rectangular shape, the conductive layer has a circular shape, and the power supply connection layer and the voice coil lead connection layer overlap with an edge of the conductive layer.
Step S3: and (4) manufacturing the vibrating diaphragm base material obtained in the step (S2) into a conductive vibrating diaphragm, and enabling at least part of the conductive layer to be located on the folded ring part of the conductive vibrating diaphragm, wherein the power supply connecting layer and the voice coil lead connecting layer are located outside the folded ring part of the conductive vibrating diaphragm.
The power supply connecting layer and the voice coil lead connecting layer are located outside the corrugated ring portion of the conductive diaphragm, and therefore the influence of welding operation on the acoustic performance of the conductive diaphragm can be effectively prevented. In an embodiment, the power supply connection layer and the voice coil lead connection layer may be both located on the fixing portion or the central portion of the conductive diaphragm, or the power supply connection layer and the voice coil lead connection layer may be located on the fixing portion and the central portion, respectively.
The manufacturing method of the conductive diaphragm is simple to operate and easy to realize. The conductive type vibrating diaphragm manufactured by the manufacturing method of the conductive type vibrating diaphragm can be connected with a voice coil lead of a vibrating voice coil through a voice coil lead connecting layer, and the conductive type vibrating diaphragm can be connected with a power supply device through a power supply connecting layer, so that the conductive type vibrating diaphragm is supplied with power to the vibrating voice coil through the conductive layer. The conductive diaphragm can shorten the wiring of the voice coil lead, is beneficial to simplifying the design and the processing of the voice coil lead, and avoids the following operation of the voice coil lead. In addition, the voice coil lead wire is short to be favorable to effectively avoiding the voice coil lead wire broken string problem that leads to because of the voice coil lead wire receives the vibration influence of vibration voice coil loudspeaker voice coil to improve the life of speaker.
Optionally, step S2 includes:
step S2-1: and compounding the base material layer and the auxiliary layer.
Step S2-2: and forming a power supply connecting layer and a voice coil lead connecting layer which are connected with the conducting layer on the compounded substrate layer to obtain the vibrating diaphragm substrate, wherein the power supply connecting layer and the voice coil lead connecting layer are positioned on the outer surface of the vibrating diaphragm substrate.
The conductive layer may be located on the outer surface of the diaphragm substrate, or the conductive layer may be located within the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate. Particularly, when the conducting layer is located in the diaphragm substrate, the substrate layer is an intermediate layer of the diaphragm substrate, and an opening for exposing a part of the conducting layer should be formed on the auxiliary layer, so that the power supply connecting layer and the coil lead connecting layer can be connected with the conducting layer.
Alternatively, step S2 includes:
step S2-1: and forming a power supply connection layer and a voice coil lead connection layer connected with the conductive layer on the base material layer.
Step S2-2: and compounding the substrate layer and the auxiliary layer to obtain the vibrating diaphragm substrate, wherein the power supply connecting layer and the voice coil lead connecting layer are positioned on the outer surface of the vibrating diaphragm substrate.
The conductive layer in this disclosure may be located on the outer surface of the diaphragm substrate, or the conductive layer may be located within the diaphragm substrate without being exposed on the outer surface of the diaphragm substrate. Particularly, when the conducting layer is located in the diaphragm substrate, the substrate layer is an intermediate layer of the diaphragm substrate, and an opening for exposing a part of the conducting layer should be formed in the auxiliary layer, so that the power supply connecting layer and the coil lead connecting layer on the substrate layer are exposed on the outer surface of the diaphragm substrate.
The number of the base material layer and the auxiliary layer can be flexibly selected according to actual requirements. For example, the conductive diaphragm comprises two substrate layers and an auxiliary layer, the auxiliary layer is sandwiched between the two substrate layers, and a conductive layer, a power supply connection layer and a voice coil lead connection layer can be arranged on each of the two substrate layers. For another example, the conductive diaphragm includes a substrate layer and two auxiliary layers, and the substrate layer is sandwiched between the two auxiliary layers.
The substrate layer and the auxiliary layer can be adhered together through an adhesive layer made of acrylic adhesive or silica gel or can be compounded together in a hot pressing mode.
The material of the auxiliary layer in the present disclosure may be the same as or different from the material of the base layer. The auxiliary layer may be made of PEEK (Polyetheretherketone), PAR (polyarylate), PEI (Polyetherimide), PI (Polyimide), PPS (Polyphenylene sulfide), PEN (Polyethylene naphthalate), PET (Polyethylene terephthalate), etc. For another example, the material of the auxiliary diaphragm is an Elastomer material, such as TPE (Thermoplastic Elastomer), TPU (Thermoplastic polyurethane Elastomer), TPEE (Thermoplastic polyester Elastomer), and the like. Alternatively, the power supply connection layer in step S3 is located on the fixing portion of the conductivity type diaphragm, and the voice coil lead connection layer is located on the central portion of the conductivity type diaphragm. Alternatively, the power supply connection layer in step S3 is located on the center portion of the conductivity type diaphragm, and the voice coil lead connection layer is located on the fixing portion of the conductivity type diaphragm. The power supply connecting layer and the voice coil lead connecting layer are positioned at different parts of the conductive type vibrating diaphragm, and convenience in connection of the power supply connecting layer and the voice coil lead connecting layer with leads or other parts is improved.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (8)
1. A conductive diaphragm is characterized by comprising a bending ring part, a fixing part and a central part, wherein a conductive layer, a power supply connecting layer and a voice coil lead connecting layer are arranged on the conductive diaphragm, and the power supply connecting layer and the voice coil lead connecting layer are both made of conductive materials; wherein the content of the first and second substances,
at least part of the conductive layer is positioned on the folded ring part;
the power supply connecting layer and the voice coil lead connecting layer are positioned outside the bending ring part;
the power supply connecting layer and the voice coil lead connecting layer are both connected with the conducting layer and are both positioned on the outer surface of the conductive vibrating diaphragm;
the thickness of the conductive layer is 2-25 μm; the thickness of the power supply connecting layer and the thickness of the voice coil lead connecting layer are 10-45 mu m;
the power supply connecting layer is located on the fixing portion, and the voice coil lead connecting layer is located on the central portion.
2. The conductive diaphragm of claim 1, wherein the conductive diaphragm comprises at least one substrate layer and at least one auxiliary layer;
the conducting layer, the power supply connecting layer and the voice coil lead connecting layer are all positioned on the base material layer;
the substrate layer and the auxiliary layer are stacked.
3. The conductive diaphragm of claim 2, further comprising at least one glue layer;
the adhesive layer is positioned between the substrate layer and the auxiliary layer so as to compound the substrate layer and the auxiliary layer together.
4. A speaker comprising a vibration voice coil and the conductivity type diaphragm described in any one of claims 1 to 3;
and the voice coil lead of the vibration voice coil is electrically connected with the voice coil lead connecting layer.
5. A method for manufacturing a conductive diaphragm, wherein the conductive diaphragm comprises a bending ring part, a fixing part and a central part, the method comprising the steps of:
step S1: forming a conductive layer on the base material layer by printing conductive ink;
step S2: forming a power supply connecting layer and a voice coil lead connecting layer which are connected with the conducting layer on the base material layer to obtain the vibrating diaphragm base material, wherein the power supply connecting layer and the voice coil lead connecting layer are positioned on the outer surface of the vibrating diaphragm base material;
step S3: manufacturing a vibrating diaphragm substrate into a conductive vibrating diaphragm, and enabling at least part of a conductive layer to be located on a bending ring part of the conductive vibrating diaphragm, wherein a power supply connecting layer and a voice coil lead connecting layer are located outside the bending ring part of the conductive vibrating diaphragm;
the thickness of the conductive layer is 2-25 μm; the thickness of the power supply connecting layer and the thickness of the voice coil lead connecting layer are 10-45 mu m;
the power supply connecting layer is located on the fixing portion, and the voice coil lead connecting layer is located on the central portion.
6. The method for manufacturing a conductive diaphragm according to claim 5, wherein the step S2 includes:
step S2-1: compounding the base material layer and the auxiliary layer;
step S2-2: and forming a power supply connecting layer and a voice coil lead connecting layer which are connected with the conducting layer on the compounded substrate layer to obtain the vibrating diaphragm substrate, wherein the power supply connecting layer and the voice coil lead connecting layer are positioned on the outer surface of the vibrating diaphragm substrate.
7. The method for manufacturing a conductive diaphragm according to claim 5, wherein the step S2 includes:
step S2-1: forming a power supply connecting layer and a voice coil lead connecting layer which are connected with the conducting layer on the base material layer;
step S2-2: and compounding the substrate layer and the auxiliary layer to obtain the vibrating diaphragm substrate, wherein the power supply connecting layer and the voice coil lead connecting layer are positioned on the outer surface of the vibrating diaphragm substrate.
8. The method of manufacturing an electroconductive diaphragm according to any one of claims 5 to 7, wherein the power supply connection layer in step S3 is located on a fixing portion of the electroconductive diaphragm, and the voice coil lead connection layer is located on a central portion of the electroconductive diaphragm; alternatively, the first and second electrodes may be,
the power supply connection layer in step S3 is located on the center portion of the conductive diaphragm, and the voice coil lead connection layer is located on the fixing portion of the conductive diaphragm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711172759.8A CN107809705B (en) | 2017-11-22 | 2017-11-22 | Conductive diaphragm, loudspeaker and manufacturing method of conductive diaphragm |
| PCT/CN2018/110893 WO2019100879A1 (en) | 2017-11-22 | 2018-10-18 | Conductive diaphragm, loudspeaker, and method for manufacturing conductive diaphragm |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711172759.8A CN107809705B (en) | 2017-11-22 | 2017-11-22 | Conductive diaphragm, loudspeaker and manufacturing method of conductive diaphragm |
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| CN107809705A CN107809705A (en) | 2018-03-16 |
| CN107809705B true CN107809705B (en) | 2021-05-18 |
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| CN (1) | CN107809705B (en) |
| WO (1) | WO2019100879A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107809705B (en) * | 2017-11-22 | 2021-05-18 | 歌尔股份有限公司 | Conductive diaphragm, loudspeaker and manufacturing method of conductive diaphragm |
| CN208638667U (en) * | 2018-08-08 | 2019-03-22 | 瑞声科技(新加坡)有限公司 | Mini-sound device |
| CN109905825A (en) * | 2019-03-13 | 2019-06-18 | 东莞涌韵音膜有限公司 | Vibrating diaphragm with suspender and the Microspeaker using the vibrating diaphragm |
| CN110545505A (en) * | 2019-08-19 | 2019-12-06 | 歌尔股份有限公司 | A conducting film and sound generating mechanism for sound generating mechanism |
| CN110572746B (en) * | 2019-08-19 | 2021-10-29 | 歌尔股份有限公司 | A conducting film and sound generating mechanism for sound generating mechanism |
| CN210986413U (en) * | 2019-08-21 | 2020-07-10 | 罗冬梅 | Diaphragm and speaker |
| CN110708644A (en) * | 2019-09-29 | 2020-01-17 | 歌尔科技有限公司 | A conducting film and sound generating mechanism for sound generating mechanism |
| CN110691308A (en) * | 2019-09-29 | 2020-01-14 | 歌尔科技有限公司 | A conducting film and sound generating mechanism for sound generating mechanism |
| CN110784810B (en) * | 2019-09-29 | 2021-03-30 | 歌尔科技有限公司 | A conducting film and sound generating mechanism for sound generating mechanism |
| CN110691307A (en) * | 2019-09-29 | 2020-01-14 | 歌尔科技有限公司 | A conducting film and sound generating mechanism for sound generating mechanism |
| CN110691306A (en) * | 2019-09-29 | 2020-01-14 | 歌尔科技有限公司 | A conducting film and sound generating mechanism for sound generating mechanism |
| CN110620976A (en) * | 2019-09-29 | 2019-12-27 | 歌尔科技有限公司 | A conducting film and sound generating mechanism for sound generating mechanism |
| CN210641063U (en) * | 2019-11-11 | 2020-05-29 | 歌尔科技有限公司 | A electrically conductive vibrating diaphragm and sound generating mechanism for sound generating mechanism |
| CN114302302B (en) * | 2021-12-30 | 2024-02-02 | 歌尔股份有限公司 | Vibrating diaphragm, manufacturing method thereof, sound generating device and electronic equipment |
| CN114286261A (en) * | 2021-12-30 | 2022-04-05 | 歌尔股份有限公司 | Vibrating diaphragm and preparation method thereof, sound production device and electronic equipment |
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| CN204046803U (en) * | 2014-07-16 | 2014-12-24 | 常州美欧电子有限公司 | Minitype acoustic generator |
| CN204859539U (en) * | 2015-07-24 | 2015-12-09 | 歌尔声学股份有限公司 | Silica gel vibrating diaphragm and speaker module |
| CN105872911A (en) * | 2016-05-05 | 2016-08-17 | 歌尔声学股份有限公司 | Vibration diaphragm of sound production device |
| CN205566632U (en) * | 2016-01-25 | 2016-09-07 | 歌尔声学股份有限公司 | Loudspeaker |
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| KR101467321B1 (en) * | 2013-06-18 | 2014-12-01 | 주식회사 이엠텍 | Microspeaker with terminal formed by lds process |
| CN204929238U (en) * | 2015-08-10 | 2015-12-30 | 深圳立讯电声科技有限公司 | Miniature sounder |
| CN205142512U (en) * | 2015-11-11 | 2016-04-06 | 深圳立讯电声科技有限公司 | Loudspeaker |
| CN107809705B (en) * | 2017-11-22 | 2021-05-18 | 歌尔股份有限公司 | Conductive diaphragm, loudspeaker and manufacturing method of conductive diaphragm |
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2017
- 2017-11-22 CN CN201711172759.8A patent/CN107809705B/en active Active
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN204046803U (en) * | 2014-07-16 | 2014-12-24 | 常州美欧电子有限公司 | Minitype acoustic generator |
| CN204859539U (en) * | 2015-07-24 | 2015-12-09 | 歌尔声学股份有限公司 | Silica gel vibrating diaphragm and speaker module |
| CN205566632U (en) * | 2016-01-25 | 2016-09-07 | 歌尔声学股份有限公司 | Loudspeaker |
| CN105872911A (en) * | 2016-05-05 | 2016-08-17 | 歌尔声学股份有限公司 | Vibration diaphragm of sound production device |
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| WO2019100879A1 (en) | 2019-05-31 |
| CN107809705A (en) | 2018-03-16 |
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